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КПІшники перемогли на GreenChem Demo Day 2026! KPI4U-2 пн, 09/21/2026 - 16:12

FLo is a wireless macropad that solves a common problem: changing shortcuts without reflashing the firmware. The board, based on the ESP32-C3 Super Mini, sends key sequences over Bluetooth and receives its configuration over USB from a desktop app. You set a shortcut, unplug the cable, and keep using the keyboard wirelessly.

The project, made by shan, uses Bluetooth transport to send keys as an HID keyboard. Macro configuration happens through a serial protocol over USB at 115200 baud. The firmware stores macros in the ESP32’s NVS partition, with keys from m1 to m4 and default values like ‘a’, ‘b’, ‘ctrl+c’, and ‘ctrl+v’. So even after a reboot, the settings stay in place.

The serial protocol and commands

The serial protocol includes commands like HELLO for identification, SET1-SET4 to write macros, PRINT to display them, and TEST to read pin states and the BLE connection. The desktop app identifies the board via the ‘ESP32-C3-READY’ response to the HELLO command, then sends the new macros over USB. In addition, the firmware uses INPUT_PULLUP on all input pins, with the other side of each switch connected to ground, so a press is read as LOW.

Encoder rotation controls system volume, while pressing the encoder and the three buttons triggers the assigned macros. The GPIO pins used are: GPIO 7, 8, and 9 for the buttons, GPIO 5 and 4 for the encoder, GPIO 2 for the encoder button. Estimated assembly time is 3 hours. shan’s repository collects the code and details to rebuild the project.

What you need to build it

To assemble FLo you need a few components: an ESP32-C3 Super Mini board, three tactile buttons, a rotary encoder with a button, a linear switch, a perf board, and wires. The firmware is written with the Arduino IDE, using the ESP32-BLE-Keyboard library and pyserial for the desktop app. The ESP32-C3 Super Mini handles the radio and USB, and is compact enough to fit in a printed case.

Assembly on a perf board requires attention to the connections, but the project is designed to be replicated in a few hours. The buttons go between GPIO pins and ground, with the internal pull-up resistor enabled by the firmware. The encoder connects to two GPIO pins for rotation and a third for the center button.

• 3 tactile buttons for the main macros
• 1 rotary encoder with push for volume and the fourth macro
• 1 ESP32-C3 Super Mini board with radio and USB
• Perf board and wires for the connections

USB configuration separates programming from everyday use: you don’t need to reflash to change a shortcut. Just plug in the cable, open the desktop app, and send the new value with SET1-SET4. The macropad responds immediately and saves everything in NVS, ready for wireless use.

Source: https://github.com/lil-shan/Flo-Macropad

The post FLo: the wireless macropad configured over USB appeared first on Open Electronics.

Silicon carbide (SiC) power semiconductors are increasingly being adopted in high-voltage electric vehicle (EV) powertrains as manufacturers are achieving higher efficiency, faster charging, and improved power density in next-generation EV powertrain designs. And the most recent practical demonstration related to this comes from Japanese semiconductor company ROHM Semiconductor announced that its SiC MOSFETs are being used in BMW’s sixth-generation electric powertrain, named the Neue Klasse.

The electric powertrain of BMW’s Gen6 is based on an 800V architecture to enable faster charging and more efficient high power energy transfer while supporting higher-power charging and powertrain performance of the next-generation powertrain. BMW has designed an electric motor, a new inverter and other powertrain components optimised for the higher-voltage system. The inverter uses SiC semiconductors to improve power-conversion efficiency and is integrated into electric motor housing.

Greater switching efficiency can also allow engineers to increase power density and reduce the size of supporting components in power-conversion systems. Reducing losses during power conversion lowers heat generation, which can ease thermal- management requirements and contribute to improved overall powertrain efficiency.

The use of ROHM’s SiC MOSFETs in BMW’s Gen6 powertrain highlights the growing use of wide-bandgap semiconductors in future EV power electronics because of its switching performance, voltage capability and power-conversion efficiency. As manufacturers adopt higher-voltage platforms, SiC devices are likely to be critical technology for enhancing power-conversion efficiency, thermal management and charging capacity.

The post Why SiC Is Critical to BMW’s Next-Generation 800V EV Powertrain appeared first on ELE Times.

L&T Semiconductor Technologies (LTSCT), has announced its first Silicon Carbide (SiC) product platform at SEMICON India 2026. The company has showcased 40 products designed for EV fast charging, traction inverters, microgrids and solid-state transformers. Among the showcased products, a key highlight was the 1200V SiC MOSFET platform for power-conversion applications.

SiC is increasingly adopted in EV power electronics, because it can switch power electronics at higher temperatures and switching frequencies than comparable silicon power devices, particularly silicon IGBTs. In an EV traction inverter, the power semiconductor switches battery DC power into AC power sent to the motor. Increasing the switching and conduction efficiencies of the power devices can increase the overall conversion efficiency.

Higher switching frequencies can also enable engineers to select smaller passive components which can lower the inverter’s size and weight. Additionally, SiC’s high-temperature operation capability contributes to greater thermal management flexibility due to its material and device characteristics. These advantages are relevant to the high-voltage EV architectures such as 800V systems.

By decreasing energy lost as heat during power conversion, higher inverter efficiencies can increase the driving range per charge depending on the overall vehicle design and operating conditions. The difference in range is ultimately limited by the efficiency of the entire powertrain—including batteries, motors, and thermal-management systems—as well as by overall driving conditions.

LTSCT’s SiC platform represents a significant step in the evolution of India’s expanding power-semiconductor ecosystem, especially as EV manufacturers move towards higher-voltage architectures and faster charging. Alongside the SiC platform, the company has showcased a highly integrated BLDC motor controller that is fully designed in India, further expanding its range from individual semiconductor devices to complete power-electronics solutions.

The post L&T Semiconductor Technologies Unveils 1200V SiC Platform for EV Power Electronics appeared first on ELE Times.

This initial entry in a planned dissection series analyzes the insides of a long distance-capable fiber optic cable networking adapter containing a focused-beam laser.

Last week’s tutorial, the conceptual kickoff to the teardown coverage cadence that begins today, provided what I hoped was a concise but comprehensive tutorial into the diversity of implementation options available with small form-factor pluggable (SFP) modules. Today’s premier patient, as mentioned last week, is a 10 Gbit LX SFP+ module. Specifically, it’s TP-Link’s TL-SM311LS, a member of the company’s business-tailored Omada product line.

Does X mark the multi-cable spot, or not?

Two things particularly interest me in perusing the TL-SM311LS product page. First off, the company refers to it there not as a SFP module but as a “Mini GBIC Module”, using the less common alternative naming convention that I’d noted upfront in last week’s coverage.

Secondly, it’s an “LX” module, with the “L” referencing long range transmission capabilities, specifically in this case specified as up to 20 km (~12.5 miles). The “X” typically references a module that’s usable with both single-mode and multimode cable, albeit at differing max transmission distances and, in both mode cable cases, at a common 1310 nm wavelength. However, TP-Link only documents the SM311LS as usable with 9/125 μm single-mode fiber cable, a seeming characteristic of the alternative “LR” module designator.

I sourced the SM311LS from the Resale (formerly Warehouse) section of Amazon’s website, where it set me back $16.99, versus a $19.99 MSRP. Here’s how it arrived, within a generic cardboard shipping box, and as usual accompanied in the following photos by a 0.75′′/19.1 mm diameter U.S. penny for size comparison purposes.

And here’s our patient, with dimensions of 2.1×0.5×0.5 (55.4×13.7×12.9 mm), after freeing it from its Styrofoam and antistatic bag sarcophagus. Top.

Right side (with “right” referencing its orientation when inserted in a network switch or other gear’s SFP port).

Bottom.

And left side.

The double-sided 20-contact (10 per side) connector is on one end.

The other end begs for a bit more explanation.

Removing the dust cap exposes to view the fiber optic connector mate sites, from two perspectives: first right-side-up and then upside down.

How do you tell which is the transmit one, and which is for data reception? One way is to look at the directions of the two arrows at far left in the earlier top side shot. And what’s with the blue-color lever beyond them? For that, we’ll need to revisit the earlier bottom side shot.

Tab-restrained removal, and internal access

See that tiny tab sticking out of the bottom, to the left of the product label? It’s spring-loaded, temporarily retracting flush with the bottom edge during module insertion and returning to its original position once the module is in place (thereby also locking the module in place). The other means of retracting it, thus enabling module removal, is to move the lever midway through its arc, halfway between the two positions shown in the dust-cap-installed and -removed photos.

And speaking of tabs, did you already notice the tiny ones halfway down both sides in the earlier shots? They’re our pathway inside. Use a small-but-solid “poker” of some sort to pull them back out, and you can then slide the outer chassis away from the interior assembly.

Turning the PCB right-side up again caused the black plastic piece normally covering the fiber optic cable female connectors (and visible in the previous photos) to fall away.

Here’s the underside of the PCB again, standalone and with that plastic piece temporarily back in place.

Now with all supplemental pieces removed, revealing the details of their bottom-pin retraction function operation.

The right side again, this time absent the outer enclosure and other extra bits.

And the left side, upside-down compared to its normal-operation orientation.

One more screw to go.

And the PCB is finally free.

I’ll start with the simple stuff: the SFP and fiber optics connector ends.

Frickin’ laser beams

Potentially obscure reference

Let’s next revisit the PCB underside, now free of its metal surroundings.

The orange-color assemblage at far left is the fiber optic receiver. Below it is the chrome-color laser transmitter. And the ICs to their right? The larger eight-lead one, in a TSOP-1 package, is the GT24C08A-2ZLI, an 8K-bit serial I²C EEPROM from Chinese supplier Giantec Semiconductor. Third-party SFP modules typically use memory such as this to, among other things, “spoof” networking equipment that would normally accept only same-name-brand (translation: expensive) SFP modules.

Remember my last-week comments about how single-mode technology has dramatically dropped in price in recent years, thanks in no small part to the “availability of non-proprietary, widely compatible modules”? Here’s a case study example. And the smaller six-lead IC below and to its right? If I’m right and the PCB mark next to it is “Q1”, then it’s likely a dual-transistor device.

But the “371H” mark on top, which I’m guessing is a date code or lot trace code versus an actual product code, isn’t helpful from an identity-sleuthing standpoint, at least to me. Reader assistance here is as-always appreciated.

I’d wondered, after first seeing all these ICs (and particularly before realizing that the larger one was “only” a nonvolatile memory), why they were on the PCB underside, as I’d assumed they were heat sources. Then I saw the PCB topside for the first time and instantly realized why.

The far more sizeable, albeit sole, device on this side, packaged in a 28-lead QFN and marked “3320C” on the top line, is the Uxfastic UX3320, a G/EPON ONU fiber transceiver developed by another Chinese manufacturer, Xiamen UX High-Speed IC. Presumably, given the lack of other logic anywhere on the PCB, it has integrated SFP interface capabilities.

To that point, and in closing, keep in mind that what we’re looking at today is a conventional (and legacy?) 1 Gbps SFP module. Recall from the “laundry list” in last week’s post that I also have a number of both higher-bitrate SFP and SFP+ modules in my teardown queue, and even a QSFP+ version, along with multimode modules to contrast against this and other single-mode offerings. I don’t know about you, but I’m intrigued to learn not only about each of them in an absolute sense but also relatively speaking, in comparing (including contrasting) them against each other.

With that “teaser” now out there, I’ll close for today. Please let me know your thoughts in the comments!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• SFP: Add-in module delivers diminutive performance, flexibility
• TP-Link MC220L: Media conversion keeps the network well
• The whole-house LAN: Achilles-heel alternatives, tradeoffs, and plans
• Design considerations in high-speed fiber networks

The post SFP: The single-mode module autopsy appeared first on EDN.

​Hyundai Motor India has inaugurated 120 kW DC fast-charging stations at strategic locations in New Delhi. These high-power charging stations are intended to provide faster charging for EV users and can be accessed through the myHyundai app and other charging-management applications. The company’s DC fast-charging solutions in India currently range from 60 kW to 240 kW, offering different charging power levels based on the vehicle’s configuration.

A 120-kW DC fast charger provides significantly higher charging power compared to conventional AC charging systems and can therefore reduce charging time. The actual charging time for an EV battery depends on several factors, including the vehicle’s maximum DC charging capability, battery capacity, state of charge, temperature, and charging curve. The maximum capacity of these inaugurated charging stations is 120 kW, but the EV will only draw power suitable for its charging.

Impact on Grid Demand

Charging a vehicle at higher power also increases instantaneous electricity demand. A 120-kW charger operating at its rated output can deliver up to approximately 120 kW of DC power to an EV, excluding conversion and other system losses. Multiple chargers operating simultaneously at charging stations can creates significant local electricity demand of power supply, requiring suitable transformers, switchgear, cables and grid connections.

Thermal Management Challenges

A high amount of heat generates while charging an Electric Vehicle using high-power DC charging. This heat generates inside the battery, cables and connectors. Effective thermal management is therefore required to maintain charging performance and protect components from the extensive heat generated. This can involve liquid-cooled cables, cooling systems, temperature monitoring, and a​ power-control strategy.

The inauguration of 120 kW charging station represents growing shifts towards faster charging consumer infrastructure in India. The speed of charging an EV will ultimately depend on battery technology, interaction between charger power, vehicle architecture, thermal management and available grid capacity.

The post Hyundai 120 kW DC Fast Charging in Delhi: Enhances EV Charging Time and Thermal Management appeared first on ELE Times.

RAAF has declared initial operational capabilities for the AGM-158C LRASM and AGM-158B JASSM-ER. The AGM-158C LRASM will vastly increase the strike range of Australia against both land and maritime targets in defended environments. LRASM is an air-launched, self-propelled, autonomous anti-ship missile with autonomous target identification capabilities. It is designed to detect and destroy large surface targets at ranges greater than 370 km. It uses sensor and internal processing to find, identify, and attack targets in GPS- and communications-denied environments, and its low-observable features and flying attitude provide a higher probability of survivability against today’s ship-based radars.

JASSM-ER is a long-range stealth cruise missile for land attack missions. The range is listed as “about 900 km (560 mi)” by the RAAF. (The missile allows the launching aircraft to remain outside the range of enemy air defences). Both weapons are being added to the RAAF F/A-18F Super Hornet force, which is firing the weapons in areas such as weapons storage, mission planning, aircraft loading, and targeting. Australia has already employed two LRASM and two JASSM-ER missiles from the Woomera Test Range in Australia and two LRASM from P-8A Poseidon aircraft in RIMPAC 2026, attacking the target.

The two systems also show how modern missile systems leverage advanced precision navigation, sensor-fusion, autonomous processing, and electronic-warfare resistance. Their strategic use also underscores how Australia is turning to long-range deterrence and maritime security in the Indo-Pacific, with aircraft carrying out strikes well outside the range of increasingly capable air-defence systems.

The post Australia Operationalises LRASM and JASSM- ER Strike Missiles appeared first on ELE Times.

Ukraine is experimenting with its own technology capable of intercepting unmanned aerial threats, as the country looks for inexpensive ways to fight back against swarms of attack drones. The Ukrainian president Volodymyr Zelenskyy has claimed that the country has tested out its own system that was able to shoot down a Shahed-type drone, although there is still more work to do to make the technology more reliable. Shahed-family one-way attack drones have been used to devastating effect against cities, energy plants and other infrastructure, and their relatively low price can create an economic deterrent for traditional air defences that destroy the inexpensive drone and thereby deplete an expensive missile.

As yet, no specifics about Ukraine’s new system have been made public, but contemporary drone-interception weapons have all the components listed above. A radar, radio-frequency sensor, acoustic array and electro-optical cameras could detect and classify a target; AI software could identify an enemy drone from a flock of birds or formations of friendly fighters; and a guidance system could send an interceptor from a stand-off position toward the threat. Cheaper interceptor drones are also being designed to work between electronically armed missile defences and advanced sensors, using autonomous navigation, operator-assisted targeting, and onboard vision processing to find a target on approach.

Nonetheless, consistent functioning is another matter. An interceptor must work at night, in bad weather, and be able to fight off electronic jamming and adapt to the evolving tactics of attacking drones. The missile launchers Ukraine has reportedly tested are part of a broader evolution in air defence. In future, air defence will probably consist of a patchwork of guns, missiles, electronic warfare, directed energy, and reusable or disposable interceptors.

The post Ukraine Tests New Interceptor Against Shahed-Type Attack Drones appeared first on ELE Times.

Defender has introduced three variations in its range of military mobility at DVD 2026, the British Army’s leading defence and security exhibition. The new Tactical Mobility Vehicle, Mono-Tactical Mobility Vehicle and Utility Vehicle have been created as the initial variants in a family of military vehicles that is being built through JLR’s Defender Defence Division.

Based on Defender’s dedicated D7x platform architecture, Wolf Series II adopts monocoque construction, negating the need for a traditional body-on-frame setup. JLR claims the approach delivers a more rigid platform, enables higher payloads, and provides a base for adaptation to specific military uses. The architecture is said to deliver a torsional rigidity of 29kNm per degree.

The three variants have been specified according to the UK Ministry of Defence Light Mobility Vehicle tender specifications. Defender expects to be able to supply the platform to NATO defence agencies. In addition to the three variants, other possible configurations include a general-purpose platform, command-and-control vehicle and battlefield ambulance. JLR says the Defender platform has undergone over 62,000 engineering sign-off tests, traversed deserts, snow and ice caps, high altitude environments and extreme off-road conditions.

In addition to military radios, sensors, electronic countermeasures, command and external power systems, the platform could also carry other items depending upon what the customer may want. For readers in India, the programme is more important as JLR is owned by Tata Motors Passenger Vehicles. Wolf Series II shows how a commercially derived platform can be emplaced, electronically configured, and manufactured for today’s needs of tactical operations.

The post Defender Unveils Three Wolf Series II Military Vehicle Variants appeared first on ELE Times.

GM Defence has produced its first lots of missile housing assemblies for Lockheed Martin’s Patriot Advanced Capability-3 (PAC 3) Missile Segment Enhancement (MSE) interceptor, showcasing how its automotive production expertise can accelerate defence manufacturing scale-up. It is understood that the first lots of components were produced just 22 days after the firm signed its manufacturing agreement on 6 August 2026. Items that normally take months to produce were provided to Lockheed Martin on 28 August.

The PAC-3 MSE is the most sophisticated interceptor in the Patriot air-and-missile-defence system. Whereas many missile systems primarily utilize explosive fragmentation for neutralization, PAC-3 MSE utilizes “hit-to-kill” technology by destroying ballistic missiles, cruise missiles and other threats in flight through direct impact. PAC-3 MSE’s operation depends on precise navigation, high-performance control electronics, a strong missile-rocket motor, and nearly real-time communication with the patriot system.

This partnership enables GM Defence to leverage automotive expertise in high-volume production, quality systems, industrial automation and supply-chain management. Lockheed Martin is investing heavily in the production of the PAC-3 MSE, Terminal High Altitude Area Defence System, and other precision-guided missile systems as the global demand for missile-defence systems continues to grow.

The fact that this is happening is in itself important, since many defence companies have long product lead times and often rely on a handful of specialised suppliers. Engaging a major automotive manufacturer in the supply chain might increase production and supply-chain diversity. The undertaking illustrates the value of taking commercial manufacturing of sophisticated military systems more rapidly while maintaining the precise quality needed for missile parts.

The post GM Defence Accelerates PAC-3 MSE Missile Component Production appeared first on ELE Times.

US Air Force has released cutting-edge missile against China. Lockheed Martin has launched the AIM-260 Joint Advanced Tactical Missile (JATM). It’s a new air-to-air missile that helps US fighter jets shoot down ever more technologically advanced rivals in contested airspace. The program has remained very secretive throughout its development, and much remains unknown about the missile.

The AIM-260 is an upgrade for the AIM-120 Advanced Medium Range Air-To-Air Missile (AMRAAM). It will probably have a longer range than the AIM-120, with the ability to target “extremely low observability, highly agile threats.” The missile system is being prepared for integration with future US combat aircraft, including the F-22 Raptor and F-35 Lightning II. The system is expected to be fitted with advanced electronic guidance systems, a data link, and anti-jamming features. This would give the missile the ability to receive updated targeting data after launch and to function in a jamming environment.​

Lockheed has also agreed with the US Department of Defence to ramp up production to increase capacity, bolster the missile supply chain and facilitate multi-layer buying. Australia has also progressed with a plan to buy JATM as part of a proposed weapons package. The AIM-260 is an evolution of how air warfare is conducted, where fighters fight at increasingly great distances without giving away their position. The missile’s development also showcases how important small hardware processors, radar-seeker technology, resilient data links, and electronic-warfare resistance are in new missiles.

The post Lockheed Martin Unveils AIM-260 JATM for Next-Generation Air Combat appeared first on ELE Times.

Hey folks! As I wasn’t satisfied with the current Beyerdynamic Bluetooth offerings I decided to make another Bluetooth mod. This is a little different as it’s “Plug and Play“, looks quite professional and works as good as any other BT headset. I made a custom PCB and some 3D printed parts to make mods easy! Check out the GitHub repository: https://github.com/farbefreak/DT770-BT-Mod for more details. submitted by /u/DangerouslySilly [link] [comments]

In a move aimed at creating a job-ready talent pool for India’s fast-growing electronics and emerging technology sectors, the Electronics Sector Skills Council of India (ESSCI) and the National Institute of Electronics & Information Technology (NIELIT) have signed a Memorandum of Understanding (MoU) to expand industry-aligned skilling in semiconductors and new-age technologies. The partnership will focus on developing and delivering training and certification programmes in areas including the following:

• Semiconductors
• Artificial Intelligence (AI)
• Internet of Things (IoT)
• Drones
• Embedded systems
• Industry 4.0
• Cybersecurity
• Electric vehicle electronics

As a Central Council with industry interfaces, ESSCI aims to strengthen the link between industry demand and the skills being imparted to students, professionals and young jobseekers through this collab. The Council will contribute industry-relevant Standards & Qualifications while supporting alignment with the National Skills Qualification Framework and Skill India requirements.

ESSCI & NIELIT MoU: A Futuristic Skill-development Initiative

Semiconductor and emerging technology skilling will be a major focus. Under the partnership, NIELIT’s virtual laboratories will be leveraged for fresher skilling and upskilling in semiconductors and new-age areas such as AI, IoT and drone technology. The two organisations intend to work towards development of advanced laboratories, Centres of Excellence and industry-oriented training facilities.

The two organisations will jointly develop new courses, certifications and competency frameworks, besides conducting Training of Trainers, Training of Assessors, faculty development programmes, workshops and awareness initiatives. The partnership will further support joint research, workforce studies, knowledge sharing and industry-academia collaboration to identify emerging skill requirements.

Commenting on the development, Madhvendra Singh, CEO, ESSCI, said, “India’s ambitions in electronics and semiconductors require a strong pipeline of skilled professionals who are ready for rapidly changing technologies. This partnership with NIELIT will help us take industry-led skilling deeper, while creating stronger opportunities for learners to gain relevant skills and industry exposure.”

The MoU will also facilitate apprenticeships, internships, industrial visits, placements and other industry engagement opportunities. ESSCI will leverage its industry ecosystem to support participation from companies and other stakeholders in collaborative skill development initiatives.

The post ESSCI, NIELIT Sign MoU to Boost Semiconductor, AI, IoT and Drone Skilling appeared first on ELE Times.

University Minifootball Cup 2026 імені Сергія Журавльова у КПІ ім. Ігоря Сікорського KPI4U-2 пн, 09/21/2026 - 12:25

КПІ та Запорізька політехніка запускають нові спільні ініціативи KPI4U-2 пн, 09/21/2026 - 12:17

NSE-listed Tirupati Forge Limited, a precision engineering and forging company, has received an industrial licence under the Arms Act, 1959 to manufacture empty artillery shells. The licence covers for 105mm, 120mm, 122mm, 125mm, 130mm, 152mm and 155mm artillery shells. For the 155mm artillery shells, the licence includes HE M107, HE L15A1, Extended Range Full Bore (ERFB), ERFB Base Bleed (BB) and ERFB Boat Tail (BT).

Gujarat based Tirupati Forge plans to start commercial production in December 2026 post all trials and approvals. It will have an initial production capacity of 150,000 shells a year.

“This licence allows us to enter a new area of defence manufacturing. We will focus on building production capacity and meeting the quality and safety requirements of the defence sector,” said Hitesh Thummar, Chairman and Managing Director of Tirupati Forge.

The move comes as India is increasing domestic defence production and giving a larger role to private manufacturers. India’s defence production reached ₹1.78 lakh crore in FY2025-26, while defence exports stood at ₹38,424 crore, according to government data.

Tirupati Forge is also looking at technology, manufacturing and supply-chain partnerships with Indian and international companies. These partnerships could support the company as it increases production and explores opportunities in overseas markets, subject to the required approvals.

“Our aim is to build this into a long-term manufacturing business. We will look at domestic requirements as well as international opportunities as we increase our capabilities,” added Thumar.

The company will initially manufacture empty artillery shells. It plans to use its existing engineering and manufacturing capabilities to build the new defence business.

The post Tirupati Forge Secures Licence to Manufacture Artillery Shells in India appeared first on ELE Times.

Gartner, a business and technology research and advisory company, has released its list of the top technology trends in government for 2026. The trends highlight increasing pressure on public sector leaders to transform operations and risk management, strengthen cyber resilience, govern AI at scale and meet rising citizen expectations amid macroeconomic and geopolitical uncertainty.

Dean Lacheca, VP Analyst at Gartner, said, “Government CIOs are operating in one of the most disruptive periods in recent memory. AI is reshaping how governments deliver services; cyber threats are evolving faster than traditional defenses can respond; and agencies are under increasing pressure to achieve more with finite resources. The challenge is no longer identifying technology opportunities, but building organizations that can adapt quickly enough to capitalize on them.”

Government technology leaders should assess how the following trends will influence investments, operating models and service delivery strategies in 2026 and beyond.

Trend 1: Managing the Ripple Effect of Agentic AI

As governments move beyond AI experimentation toward enterprise-scale adoption, AI agents are emerging as a key catalyst for transformation. Agentic AI will increasingly support government operations, enhance citizen experiences, accelerate software development and automate routine decision-making processes.

“The conversation around AI must shift from technology implementation to organizational transformation,” said Lacheca. “Success with agentic AI will depend on modern governance, workforce readiness and the ability to redesign business processes, while creating an adaptable foundation for future innovation.”

Gartner research indicates that many governments are already exploring governance frameworks, digital identities and operational models to support the growing use of AI agents. They must also establish outcome-based AI roadmaps and develop clear metrics to measure value from AI investments.

Trend 2: Cybersecurity Requires an ‘Always Evolving’ Culture

Advances in AI, increasing geopolitical tensions and the emergence of quantum computing are fundamentally changing the cybersecurity landscape. Government organizations must move beyond periodic reviews and compliance-driven approaches toward adaptive, continuously evolving cyber strategies.

“Cybersecurity can no longer be treated as a static function,” said Lacheca. “AI is reducing the time between the discovery of vulnerabilities and their exploitation, while quantum computing is forcing governments to rethink how they protect sensitive information. Resilience, automation and crypto agility must become core components of every cybersecurity strategy.”

Gartner recommends government organizations automate security operations where possible; improve digital supply chain visibility; establish post-quantum cryptography readiness plans; and strengthen governance around data sovereignty and third party risk.

Trend 3: Reimagining Government Technology Service Delivery

Emerging technologies, increasingly digitally literate workforces and demand for new technical skills and capabilities are forcing governments to rethink how technology services are delivered. Future-ready organizations will be built around digital and AI literate workforces. This means technology service delivery will require adaptive operating models and governance structures that enable technology innovation across the organization while maintaining accountability.

“Technology will only ever be a tool or a trigger; transformation is ultimately about people,” said Lacheca. “Government IT areas that maintain their relevance will be the ones that invest in workforce capabilities, redesign how work gets done and build a technology operating model that can evolve as quickly as technology itself.”

According to a Gartner survey of 1,219 CIOs and IT leaders conducted in January 2026, 78% of government respondents anticipate investing in their people to advance their key technology initiatives. Gartner recommends they focus on prioritizing AI literacy, workforce modernization and organizational flexibility to meet growing service demands, while improving operational efficiency.

The post Gartner Reveals Top Government Technology Trends for 2026: AI, Cybersecurity and Digital Transformation appeared first on ELE Times.

Power that looks perfect can still betray you. Hidden distortions in the mains lurk behind flawless root mean square (RMS) readings—waiting to trip up even the best‑designed systems.

You’ve built the device exactly to spec, tested it in the lab, and watched it run flawlessly—only to have it mysteriously reset, flicker, or fail once deployed in the field. The nightmare begins when your trusty digital multimeter (DMM) or scope insists the mains are rock‑solid at nominal RMS, lulling you into false confidence.

In reality, hidden sags, swells, harmonics, and transients are wreaking havoc beneath that “perfect” reading. This is where a power quality analyzer (PQA) steps in—the engineer’s ultimate diagnostic lens for uncovering the real-world anomalies that standard tools simply cannot see.

An oscilloscope is the sprinter—built for speed, capturing fleeting microsecond transients in a narrow time window. It’s invaluable for spotting fast spikes but blind to the bigger picture.

A power quality analyzer (PQA), on the other hand, is the marathon runner—continuously logging over hours or days, aggregating long-term trends, tracking intense inrush currents during equipment startup, and checking compliance against standards like IEEE 519. Where the scope gives you snapshots, the PQA delivers the full story of your mains health.

Scopes give you snapshots, DMMs give you averages, but PQAs give you the truth—continuous visibility into harmonics, sags, swells, and transients that silently sabotage systems. If you want to design for the real world, you need to see the grid as it really is: noisy, imperfect, and unpredictable.

Figure 1 The PQ3198 power quality analyzer kit integrates specialized current clamps and voltage leads to capture and analyze transient grid anomalies. Source: Hioki

The rogue’s gallery of power quality villains

Three hidden villains—harmonics, sags and swells, and transients—quietly sabotage “perfect” power until a PQA exposes them.

• Harmonics – the waveform polluters: Nonlinear loads such as switching supplies, LED drivers, and variable frequency drives (VFDs) gulp current in pulses instead of smooth sine waves. Those pulses spawn integer multiples of the fundamental 50 Hz/60 Hz frequency. To quantify this mess, engineers look beyond total harmonic distortion (THD) to total demand distortion (TDD), preventing misleading percentage readings when equipment runs at light loads. In practice, “Triplen” harmonics—specifically the odd multiples of the third (3rd, 9th, 15th, etc.)—pile up in the neutral conductor, driving overheating, high crest factors, and insulation breakdown that can cripple systems.
• Sags and swells – the voltage rollercoaster: Large inductive loads like motors or HVAC compressors can drag voltage down to 85% of nominal, enough to brown‑out a microcontroller in an instant. On the flip side, when heavy loads shed or phases drift out of balance, the line can swell, stressing insulation and sensitive electronics. These rollercoaster swings slip past a DMM but are tracked relentlessly by a PQA.
• Transients – the semiconductor killers: Lightning strikes, capacitor bank switching, or routine grid events can unleash sub‑microsecond, high‑energy impulses. These spikes punch straight through ESD diodes and input protection, leaving semiconductors scarred or destroyed. A PQA captures these assassins in action, providing the context that scopes alone often miss.

Visual interpretation: The phasor diagram

One of the most practical screens on a PQA is the phasor display—a live map of voltage and current vectors that instantly reveals system health. A balanced three-phase system shows vectors neatly spaced at 120° with equal lengths, but any angular deviation or unequal magnitudes signal phase imbalance, a silent motor killer that drives counter-torque and winding stress.

Equally important is the power factor: the angular gap between voltage and current vectors tells the story of displacement power factor (DPF), with lagging angles exposing inductive loads and leading angles flagging capacitive behaviour. However, because modern switching supplies also introduce distortion power factor via harmonic wave shaping, a PQA is vital to calculate the true power factor—ensuring you aren’t paying penalties for hidden inefficiencies that standard meters completely miss.

Figure 2 A PQA plots three-phase voltage and current relationships on a central phasor diagram to analyze phase angles, magnitudes, and power quality metrics. Source: Neo Messtechnik

Two sidenotes

First, while engineers often use these terms interchangeably when looking at a PQA screen, there is a distinct technical difference: a vector diagram maps static, space-dependent quantities with a magnitude and a fixed directional orientation (like mechanical force or magnetic fields), whereas a phasor diagram is a frozen snapshot of a constantly rotating, time-dependent AC waveform.

Because all three phases in a stable grid spin at the exact same frequency, “stopping the clock” allows the PQA to display their angular relationships cleanly on a 2D plane. In short, all phasors can be mathematically treated and plotted as 2D vectors on a screen, but if it represents a repeating, alternating AC waveform, it’s technically a phasor.

Second, while traditional PQAs capture localized, steady-state anomalies, phasor measurement units (PMUs) provide real-time, wide-area situational awareness across modern power grids. By utilizing GPS time-synchronization, PMUs measure electrical waves across geographically disparate locations simultaneously.

They sample voltage and current waveforms at high speeds—typically 30 to 120 observations per second—to deliver time-stamped synchrophasor data. This precision tracking of phase angles and magnitudes allows grid operators to detect dynamic instabilities, monitor wide-area power oscillations, and prevent wide-scale blackouts in increasingly complex, renewable-heavy distribution networks.

Beyond the basics: Today’s PQA landscape

Modern PQAs go far beyond the fundamentals. They’re now Class A certified under IEC 61000‑4‑30 Edition 3, tuned to detect supraharmonics in the 2–150 kHz band from EV chargers, solar inverters, and LED drivers. They are capable of microsecond‑level transient capture with sampling rates approaching 1 MHz.

A sidenote on supraharmonics – the new phantom: Classic harmonics stop at the 50th or 63rd order, but these higher‑frequency disturbances don’t just stress wiring—they interfere with IoT devices, smart meters, and communication systems, making them a new frontier for power quality monitoring.

Take a real‑world example. During EV charger rollouts in several European cities, utilities discovered that chargers injecting switching noise around 20–25 kHz were confusing smart meters. The supraharmonic interference overlapped with PLC communication bands, causing meters to misreport consumption data and triggering billing errors. PQAs tuned for the 2–150 kHz band exposed the culprit, proving that supraharmonics aren’t just abstract lab phenomena—they can directly disrupt grid intelligence and customer trust.

At the same time, IEEE 519‑2022 has tightened harmonic distortion limits at the point of common coupling, reflecting today’s nonlinear load environment and ensuring compliance reporting is more rigorous than ever. With cloud dashboards, automated reporting, and integration into data centres, renewable systems, and utility grids, PQAs have become essential tools for navigating a world where distributed energy resources make power quality more unpredictable than ever.

Building a DIY power quality analyzer

Building a DIY PQA is an incredibly rewarding, multi-disciplinary challenge that bridges the gap between embedded design, real-time digital signal processing (DSP), and high-voltage safety. To accurately capture complex multi-channel dynamics—such as system unbalance, triplen harmonics, and ground faults—a scratch-built approach demands an agile microcontroller like the dual-core ESP32 sampling at upward of 10 kHz per channel to perform continuous Fast Fourier Transforms (FFTs) up to the 50th harmonic.

While developers looking to deploy high-speed, multi-channel discrete ADCs (such as the ADS131M08) can achieve synchronous sampling across all inputs without phase skew, those wanting to offload the heavy math entirely can leverage a specialized polyphase metering IC like the Analog Devices ADE7880.

ADE7880 utilizes an on-chip, hardware-isolated adaptive real-time monitoring (ARTM) harmonic engine to automatically track fundamental frequency drift and calculate full THD+N over SPI. No matter the architectural route, strict implementation of galvanic isolation via components like the ZMPT101B voltage transformer is non-negotiable to protect downstream hardware, and firmware must be thoroughly vetted using low-voltage AC-AC step-down transformers before introducing the system to live, lethal mains environments.

Figure 3. Simplified block diagram of ADS131M08 reveals a fully integrated, 8-channel signal chain architecture featuring independent PGAs, ΔΣADCs, digital filtering, and dedicated calibration blocks feeding into a centralized control interface. Source: Texas Instruments

Designing for the real world means accepting that the grid is noisy, unpredictable, and far from perfect. Hidden distortions, imbalances, and transients are not exceptions; they’re the rule. A PQA equips engineers to see beyond the illusion of “perfect power” and design systems that survive in the wild.

So, here’s the challenge: What’s the weirdest power‑quality phantom you’ve ever had to hunt down in the field? Share your story in the comments—because every anomaly teaches us something new about resilience.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• Power System Harmonic Analysis using ETAP
• Distortion in power amplifiers: the input stage
• Distortion in power amplifiers: the sources of distortion
• Signal integrity and power integrity analysis in 3D IC design
• Highly integrated approach to power system design in the AI era

The post Unmasking the ghosts in your grid with power quality analyzers appeared first on EDN.

A wireless smart dial replaces keyboard and mouse for repetitive operations: turn it to navigate menus, press it to send commands. Afraz Ali’s project uses an ESP32-C3 SuperMini board, an SH1106 128×64 OLED display, and a KY-040 rotary encoder. The whole thing works as a Bluetooth Low Energy HID controller, so the computer sees it as a wireless keyboard or mouse.

The main input is the KY-040 encoder: turning it scrolls through the menu on the display, pressing it selects the action. The ESP32-C3 then sends the corresponding command via BLE HID. The SH1106 OLED display is connected via I²C at address 0x3C and shows the interface. The encoder uses three GPIOs (CLK, DT, SW) with internal pull-ups configured by the firmware.

Firmware and profiles for each operating system

The firmware includes separate profiles for Auto/Universal, Windows, macOS, Android, and iPhone/iPad. This choice handles BLE HID limitations across different operating systems. Custom text macros and settings are saved persistently using the ESP32 Preferences library. The source code is available in Afraz Ali’s repository, where you’ll find ready-to-upload Arduino sketches.

For programming you need Arduino IDE, the ESP32 Arduino package, the Adafruit GFX library, Adafruit SH110X, HijelHID_BLEKeyboard, NimBLE-Arduino, and Lynx Serial Monitor. The project includes 11 digital GPIOs (PWM) and 4 analog inputs (ADC) on the ESP32-C3 SuperMini board. Afraz Ali’s repository contains all the necessary code.

Power and consumption of the ESP32-C3 board

The ESP32-C3 SuperMini board supports USB or external power from 3.3 V to 6 V. Sleep consumption is about 43 μA, so the device can stay in standby for a long time. Estimated build time is 5 hours, suitable even for those taking their first steps with ESP32 and BLE.

The M274 360-degree encoder module can be used as an alternative to the KY-040 for applications requiring continuous rotation. Both encoders connect directly to the board’s GPIOs. The 128×64 pixel SH1106 OLED display is the component that makes the interface readable and tidy.

Assembly and circuit connections

Assembly is simple: connect the OLED display via I²C at address 0x3C, wire the KY-040 encoder to the three GPIOs, and power the board via USB. The firmware handles the internal pull-ups, so no external resistors are needed. The project is compact and can be enclosed in a small 3D-printed case.

The dial works as a customizable physical control surface. You can assign keyboard shortcuts, multimedia controls, and text macros to each menu item. The device is useful for people working with editing, development, or office automation software.

• ESP32-C3 SuperMini Development Board
• SH1106 128×64 OLED
• KY-040 Rotary Encoder
• M274 360-Degree Rotary Encoder Sensor Brick Module

Afraz Ali’s project is a great starting point for understanding how BLE HID works and how to build a wireless input device. The wireless smart dial is a concrete example of how a small microcontroller can replace traditional peripherals.

Source: https://github.com/afrazali722/ESP32-C3-Smart-Dial-Custom-BLE-Menu-Controller

The post Wireless Smart Dial with ESP32-C3 and BLE HID appeared first on Open Electronics.

The enthusiasm around the Indian semiconductor industry is palpable! While the government and domestic manufacturers have already started demonstrating their commitment through investments and project announcements, global technology suppliers are joining the optimism.

Confirming this positive trend, Teradyne, a leading provider of automated test equipment and advanced robotics, has announced the opening of an office in India focused on supporting semiconductor manufacturing, located in Bengaluru, Karnataka. The new office formalises Teradyne’s growing presence in the country and underscores the company’s long-term commitment to India’s semiconductor and electronics manufacturing industry. As AI drives demand across the full semiconductor supply chain – from wafer to data centre – this announcement will certainly provide a boost to the segment.

“India is at an inflection point in its semiconductor journey and establishing a permanent office in Bengaluru reflects our long-term commitment to this market,” said Greg Smith, President and CEO of Teradyne. “As India accelerates investment in domestic fabrication, packaging, and test capabilities, we intend to be a trusted partner to our customers, our government partners, and the broader ecosystem every step of the way. Establishing a local presence will help us move at the speed this industry demands.”

Teradyne Bets Big on India

The Bengaluru office, located at Vesta Building, Bagmane Cosmos Tech Park, will serve as a local hub for customer engagement, applications support, training, and strategic partnerships, strengthening Teradyne’s ability to support India’s expanding base of chipmakers and electronics manufacturers as the country builds out high-volume manufacturing, packaging, and test capabilities.

The new office will support Teradyne’s broader India strategy, led by Alpa Sood, Country Manager, Teradyne, as the company deepens its presence across the country. The opening comes as India accelerates its semiconductor ambitions under the government’s India Semiconductor Mission, which is driving significant new investment in domestic fabrication and manufacturing infrastructure.

“Teradyne’s decision to establish a permanent office in India is a strong vote of confidence in India’s semiconductor growth story,” said Amitesh Kumar Sinha, chief executive officer of the India Semiconductor Mission, and additional secretary at the Ministry of Electronics and Information Technology. “As India scales its semiconductor fabrication, packaging, and test capabilities, the presence of a global leader such as Teradyne will further strengthen the semiconductor value chain and contribute to the development of a robust semiconductor manufacturing ecosystem in the country.

The post India’s Semiconductor Ecosystem Gets a Boost as Teradyne Opens Office in Bengaluru appeared first on ELE Times.