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STM32WBA6 2.4-GHz wireless MCUs from ST offer increased memory and digital system interfaces for high-end applications in smart home, health, factory, and agriculture. Based on an energy-efficient Arm Cortex-M33 core running up to 100 MHz, the devices provide up to twice the flash and RAM of the previous STM32WBA5 series for application code and data storage.

Giulia Fagiani

With up to 2 MB of flash and 512 KB of RAM on-chip, the STM32WBA6 MCUs are able to support more advanced applications. Digital peripherals include high-speed USB, three SPI ports, four I2C ports, three USARTs, and one LPUART. By integrating the processing core, peripherals, and wireless subsystems, the MCUs streamline designs and reduce assembly size.

The STM32WBA6 wireless subsystem supports Bluetooth LE, Zigbee, Thread, and Matter, enabling concurrent communication across multiple protocols. It also enhances performance, with sensitivity increased to -100 dBm for more reliable connectivity up to the maximum specified range.

The STM32WBA6 wireless MCUs are in production and available now, priced from $2.50 each in lots of 10,000 units.

STM32WBA6 product page 

STMicroelectronics

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Rohm Semiconductor introduced the GNP2070TD-Z, a 650-V enhancement-mode GaN HEMT in a TO-leadless (TOLL) package. With dimensions of 11.68×9.9×2.4 mm, this compact package enhances heat dissipation, supports high current, and enables strong switching performance.

The GNP2070TD-Z integrates second-generation GaN-on-Si technology, achieving an RDS(on) of 70 mΩ and a Qg of 5.2 nC. With a VDS of 650 V and an IDS of 27 A, the transistor is well-suited for power supplies, AC adapters, PV inverters, and energy storage systems.

For this launch, ROHM has outsourced package manufacturing to ATX Semiconductor, with TSMC handling front-end processes and ATX managing back-end processes. ROHM also plans to collaborate with ATX on automotive-grade GaN devices.

The EcoGaN HEMTs will be available starting in March from DigiKey, Mouser, and Farnell.

GNP2070TD-Z product page

Rohm Semiconductor

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Marvell Technology has demonstrated its first 2-nm silicon IP, enhancing the performance and efficiency of AI and cloud infrastructure. Built on TSMC’s 2-nm process, the working silicon is a key component of Marvell’s platform for developing next-generation custom AI accelerators, CPUs, and switches.

The company’s strategy focuses on developing a comprehensive semiconductor IP portfolio, including electrical and optical SerDes, die-to-die interconnects for 2D and 3D devices, advanced packaging technologies, silicon photonics, custom HBM compute architecture, on-chip SRAM, SoC fabrics, and compute fabric interfaces like PCIe Gen 7.

Additionally, the portfolio includes high-speed 3D I/O for vertically stacking die inside chiplets. This simultaneous bidirectional I/O operates at speeds up to 6.4 Gbps. By shifting from conventional unidirectional I/O to bidirectional I/O, designers can double the bandwidth and/or reduce the number of connections by 50%.

“Our longstanding collaboration with TSMC plays a pivotal role in helping Marvell develop complex silicon solutions with industry-leading performance, transistor density, and efficiency,” said Sandeep Bharathi, chief development officer at Marvell.

Marvell Technology

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Arm’s edge AI platform features the Cortex-A320 CPU and Ethos-U85 NPU, enabling on-device execution of models exceeding 1 billion parameters. The Armv9 platform enhances efficiency, performance, and security for IoT, while unlocking new edge AI applications through support for both large and small language models.

Built on the Armv9 architecture, the Cortex-A320 delivers 10× higher ML performance and 30% better scalar performance than its predecessor, the Cortex-A35. It also achieves an 8× ML performance gain over the Cortex-M85-based platform launched last year. Additionally, Armv9.2 offers advanced security features like pointer authentication, branch target identification, and memory tagging extension.

The Cortex-A320 pairs with the Ethos-U85 AI accelerator, which supports transformer-based models at the edge and scales from 128 to 2048 MAC units. To streamline edge AI development, Arm’s Kleidi for IoT compute libraries enhance AI an ML performance on Arm-based CPUs with seamless ML framework integration. For example, Kleidi boosts Cortex-A320 performance by up to 70% when running Microsoft’s Tiny Stories dataset on Llama.cpp.

To learn more about the Armv9 edge AI platform, click on the product page links below.

Cortex-A320 product page

Ethos-U85 product page

Kleidi product page

Arm

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Infineon’s PSOC 4 series microcontrollers now integrate capacitive, inductive, and liquid level sensing in a single device. The PSOC 4000T, powered by a 32-bit, 48-MHz Arm Cortex-M0+ processor, combines CAPSENSE capacitive sensing with Multi-Sense inductive sensing and non-invasive, non-contact liquid sensing.

Infineon says Multi-Sense inductive sensing offers greater noise immunity and durability than existing methods. Its differential, ratio-metric architecture supports new HMI and sensing applications, including touch-over-metal, force touch, and proximity sensing.

The PSOC 4000T’s liquid sensing uses an AI/ML-based algorithm that Infineon says is more cost-effective and accurate than mechanical sensors and standard capacitive solutions. It resists environmental factors like temperature and humidity and detects liquid levels with up to 10-bit resolution. It also rejects foam and residue and operates across varying air gaps between the sensor and container.

The fifth-generation CAPSENSE technology enables hover touch sensing, allowing interaction without direct button contact. Its always-on capability reduces power consumption by 10× while delivering 10× higher signal-to-noise ratio than Infineon’s previous devices.

The PSOC 4000T with CAPSENSE and Multi-Sense is available now. A second device, the PSOC 4100T Plus, offering more memory and I/Os, will gain Multi-Sense support in 2Q 2025.

PSOC 4000T product page

Infineon Technologies

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Новий партнер у сфері науки kpi чт, 03/06/2025 - 21:35

Luminus Devices Inc of Sunnyvale, CA, USA — which designs and makes LEDs and solid-state technology (SST) light sources for illumination markets — has released its Generation 2 warm dimming COB (chip on board) LEDs, engineered to deliver an lighting that mimics the warm glow of traditional incandescent and halogen sources while offering the efficiency and reliability of LED technology...

Професорка ФММ Ольга Вовк отримала премію Президента України kpi чт, 03/06/2025 - 16:41

Another week, another suite of press release-only-announced products. With the exception of the yearly (and mid-year) in-person WWDC, will we ever see Apple do another live event?

I digress. Some of what Apple’s rolled out (so far…it’s only Wednesday night as I write these words) this week was accurately prognosticated at the end of my last-week coverage. Some of it was near-spot-on forecasted, albeit with an unexpected (and still baffling, a day later) twist. And two of the system unveilings were a complete surprise, at least from a timing standpoint. At all the new system’s cores were processor updates (core…processor…get it?). And speaking of which, there’s a new one of those, as well. In chronological order, starting with Tuesday’s news…

The iPad Air(s)

Apple had migrated the iPad Air tablet from the M1 to the M2 SoC less than a year ago, at the same time expanding the product suite to include both 11” and 13” form factors. So when Tim Cook teased that “There’s something in the Air” on Monday, M3-based iPad Airs were not what I expected. But…whatevah… By the way, careful perusers of the press release might have already noticed that all the performance-improvement claims mentioned there were versus the 2022 M1-based model, not last year’s M2. That selective emphasis wasn’t an accident, folks.

And of course, there’s a new accompanying keyboard; heaven forbid Apple forego any available opportunity for obsolescence-by-design forced updates to its devoted customer base, yes? Sigh.

The iPad

 

This one didn’t even justify a press release of its own; instead, Apple tacked a paragraph and photo onto the end of the iPad Air announcement. Predictably, there were performance-improvement claims in that paragraph, and once again Apple jumped two product generations in making them, comparing against the September 2021 9th-generation A13 Bionic-based iPad versus the year-later (but still 2.5 years old) 10th-generation offering running the A14 Bionic SoC. And the doubled-up internal storage is nice. But here’s the surprising-to-me (and pretty much everyone else whose coverage I read) twist; the new 11th-gen iPad is based on the A16 SoC.

“What’s the big deal, Dipert?” you might understandably be asking at this point. The big deal is that the A16 is not Apple Intelligence-compatible. On the one hand, I get it; the iPad is the lowest-priced offering in Apple’s tablet portfolio, so to maintain shareholder-friendly profit margins, the bill-of-materials cost must be similarly suppressed. But given how increasingly fiscal-reliant Apple is on the services segment of its business, I’m still shocked that Apple didn’t instead put the A17 Pro, already found in the latest iPad mini, into the new iPad too, along with enough RAM to enable AI capabilities. Maybe the company just wants to upsell everyone to the iPad Air and Pro instead? If so, I’ve got an intentionally terse response: “good luck with that”.

The MacBook Air(s)

This is what everyone thought Tim Cook was alluding to with Monday’s “There’s something in the Air” tease, in-advance suggested by dwindling inventory of existing M3-based products. And one day later than the iPad Air, they belatedly got their wish. That said, with the exception of a new sky blue scheme (No more Space Gray? You gotta be kidding me!), all the changes are on the inside. The M4 SoC (this time exclusively with a 10-core CPU, albeit in both 8-and-10-core GPU variants) is more energy-efficient than its M3 forebear; we’ve already discussed this. But Apple was even more comparison-silly this time, benchmarking against the three-generations-old (and more than four years old) M1 MacBook Air, as well as even more geriatric x86-based variants (Really, Apple? Isn’t it time to stop kicking Intel?). About the most notable thing I can say, aside from the price cut, is that akin to its M4 Mac mini sibling, the M4 MacBook Air now supports up to two external displays in addition to the integrated LCD, without any software-based (therefore CPU-burdening) DisplayLink hacks. Oh, and the front camera is improved. Yay.

The Mac Studio

Speaking of the Mac mini, let’s close by mentioning its bigger (albeit not biggest) brother, the Mac Studio. Until earlier today (again, as I write these words on Wednesday evening) the most powerful Mac Studios, introduced at the 2023 WWDC, were based on M2 SoC variants: the 12 CPU core and 30-or-38 GPU core M2 Max; and dual-die (interposer-connected) 24 CPU core and 60-or-76 GPU core M2 Ultra. They were follow-ups to 2022’s M1 Max (an example of which I own) and M1 Ultra premiere Mac Studio products. So, we were clearly (over)due for next-gen offerings. But, although the M1 versions were introduced in March, M2 successors arrived the following June. So, I’d placed my bets on the (likely June) 2025 WWDC for the next-gen launch timing.

Shows you how much (or accurately, little) I know…Apple instead decided on a 2022-era early-March re-do this time. And skipping past the M3 Max, the new “lower-end” (I chuckle to even type those words, and you’ll see why in second) version of the Mac Studio is based on the 14-or-16 CPU core, 32-or-40 GPU core, and 16 neural processing core M4 Max SoC also found in the latest high-end MacBook Pros.

The M3 Ultra SoC

But, at least for now (and maybe never?) there’s no M4 Ultra processor. Instead, Apple revisited the M3 architecture to come up with the M3 Ultra, its latest high-end SoC for the Mac Studio family. It holds 28-or-32 CPU cores, 60-or-80 GPU cores, and 32 neural processing cores, all prior-gen. I’m guessing the target market will still be satisfied with the available “muscle”, in spite of the generational back-step. And it’s more than just an interposer-connected dual-die M3 Max pairing. It also upgrades Thunderbolt capabilities to v5, previously found only on higher-end M4 SoC variants, and the max RAM to 512 GBytes (the M3 Max only supports 128 GBytes max…see what I did there?).

Maybe we’ll see a next-gen Mac Pro at WWDC, then? And maybe it (or if not, which of its other product line siblings) will be the first system implementation of the next-gen M5 SoC? Stand by. Until then, let me know your thoughts on this week’s announcements in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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Japan-based ROHM Co Ltd says that its EcoGaN series of 650V GaN HEMTs in the TOLL package has been adopted by Murata Manufacturing Group subsidiary Murata Power Solutions (a Japan-based supplier of electronic components, batteries and power supplies) for AI server power supplies that will enter mass production this year. ROHM says that integrating its GaN HEMTs (which combine low-loss operation with high-speed switching performance) in Murata’s 5.5kW AI server power supply unit achieves greater efficiency and miniaturization...

📰 Газета "Київський політехнік" № 9-10 за 2025 (.pdf) Інформація КП чт, 03/06/2025 - 14:58