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🖼️ Конкурс "Таланти - КПІ" 2025 - обирайте переможців!!! kpi пн, 04/21/2025 - 13:44

Designed for extreme environments and conditions, radiation-hardened MOSFETs are available from 100 Krad to 300 Krad Total Ionizing Dose

The JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications. Microchip Technology announced the completion of its family of radiation-hardened power MOSFETs to the MIL-PRF-19500/746 slash-sheet specification and the achievement of JANSF qualification for its JANSF2N8587U3, 100V N-channel MOSFET to 300 Krad (Si) Total Ionizing Dose (TID).

Microchip’s JANS series of rad-hard power devices are available in voltage ranges from 100–250V to 100 Krad (Si) TID, with the family expanding to higher Radiation Hardness Assurance levels, starting with the JANSF2N7587U3 at 300 Krad (Si) TID. The JANS RH MOSFET die is available in multiple package options including a plastic package using the MIL-qualified JANSR die, providing a cost-effective power device for New Space and Low Earth Orbit (LEO) applications. The ceramic package is hermetically sealed and developed for total dose and Single-Event-Environments.

The devices are designed to meet the MIL-PRF19500/746 standard with enhanced performance, making them excellent options for applications that demand high-reliability components capable of withstanding the harsh environments of space and extending the reliability of power circuitry.

“Meeting the stringent specifications required for rad-hard MOSFETs is extremely challenging, and Microchip is pleased to achieve this development milestone by leveraging its proprietary rad-hard by design process and technology,” said Leon Gross, corporate vice president of Microchip’s discrete products group. “Our advanced technology provides our aerospace and defense customers with highly reliable and cost-effective solutions that meet the growing demand of the market and their applications.”

The JANSF and JANSR RH power MOSFETs serve as the primary switching elements in power conversion circuits, including point-of-load converters, DC-DC converters, motor drives and controls, and general-purpose switching. With low RDS(ON) and a low total gate charge, these power MOSFETs offer improved energy efficiency, reduced heat generation and enhanced switching performance when compared to similar devices on the market.

The post Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability appeared first on ELE Times.

Major industries such as electric vehicles (EVs), Internet of Things (IoT), aeronautics, and railways have strict, well-established processes to ensure they can maintain high safety standards throughout their operations. This level of precision, compliance, and enforcement is particularly important for safety-critical industries such as avionics, energy, space and defense, where high emphasis is placed on the development and validation of embedded software that contemporary and newly developed vehicles and vessels rely on to ensure operational safety.

It’s rare for a software glitch on its own to cause a catastrophic event. However, as embedded software systems become more complex, so too does the onus on developers to make sure their software is able to operate within that complexity bug-free.

That’s because the increasing interconnectivity between multiple information systems has transformed the critical domains like medical devices, infrastructure, transportation, and nuclear engineering. Then there are issues like asset security, risk management, and security architecture that require safe and secure operation of equipment and systems. This necessity for safety is not only acute from operational safety perspectives, but also in terms of cybersecurity.

However, despite the application of rigorous testing processes and procedures that are already in place, subtle bugs are still missed by testing techniques that don’t provide full coverage and don’t embed themselves deeply within operational environments. They are unacceptable errors that cannot be allowed to remain undetected and potentially metastasize but finding them and rooting them out is still a major challenge for most.

While the software driving embedded compute systems becomes more complex and, therefore, more vulnerable, increasingly strict safety regulations designed to protect human lives are coming into force, which means that software development teams need to devise innovative solutions that enable them to proactively address safety and security issues. They should also be able to do so quickly to respond to demand without compromising test result integrity.

This need is particularly significant among critical software companies who depend heavily on traditional testing methods. Even when following highly focused, tried and true testing processes, there are for many software development engineers a nagging concern that a bug could have slipped through undetected.

That’s because they sometimes do, which leaves many quality assurance and product managers, especially in critical industries, to lose sleep over whether they have done enough to ensure software safety.

One major software supplier in the aerospace industry recently faced such a dilemma when it approached TrustInSoft with a problem.

A customer of the software supplier had discovered an undetected bug in one of several software modules that had been supplied to them, and the software was already fully operational. Once informed of the issue and being directed to resolve it, the supplier needed months to locate, understand, and ultimately rectify the bug, resulting in substantial costs for bug detection and software reengineering. The situation also had a negative impact on the supplier’s reputation and its business relationships with other customers.

That’s when they realized they needed a better, more conclusive way to ward off such incursions and do so confidently.

As a first step, the software supplier consulted TrustInSoft to see if it’s possible to confirm that the bug that had taken the software supplier months to identify was not only truly gone, but that no others were lurking undetected.

In just a few days, analysis revealed several previously undiscovered bugs in addition to what had caused the initial alarm. Each of these subtle bugs would have been extremely difficult, if not impossible, to detect using conventional methods, which is most likely why they were missed.

TrustInSoft Analyzer’s use of formal methods gives developers definitive proof that their source code is free from memory-safety issues, runtime errors, and security vulnerabilities. The analyzer’s technology is based on rigorously specified mathematical models that verify a software’s properties and behaviors against precisely defined specifications. It can, as a result, identify every potential security vulnerability within the source code.

The integration of formal methods enables users to conduct truly exhaustive analyses. What that means in practice is that complex formal method analysis techniques can be applied to—and keep pace with—increasingly sophisticated software packages. For many organizations, this intensive verification and validation process is now a requirement for safety and security-critical software development teams.

A significant advantage of formal method tools over traditional static analysis tools for both enterprise and open-source testing is the ability to efficiently perform the equivalent of billions of tests in a single run, which is unprecedented in conventional testing environments.

Critical industries provide essential services that have direct importance to our lives. But any defects in the software code at the heart of many of those industries can pose serious risks to human safety. TrustInSoft Analyzer’s ability to mathematically guarantee the absence of bugs in critical software is therefore essential to establish and maintain operational safety before it’s too late.

Caroline Guillaume is CEO of TrustInSoft.

 

 

Related Content

• Embedded Software Testing Basics
• Don’t Let Assumptions Wreck Your Code
• Software Testing Needs More Automation
• 5 Software Testing Challenges (and How to Avoid Them)
• Performance-Regression Pitfalls Every Project Should Avoid

The post How software testing guarantees the absence of bugs appeared first on EDN.

Microscopic image with $11 usb microscope submitted by /u/The_1King1 [link] [comments]

Nabbed a huge lot of parts at an estate auction. some fun transformers in there. gonna use some for my ghostbusters cosplay build. Still got lots of tubes to sort out submitted by /u/shittyretrocomps [link] [comments]

Found this interesting bit of kit at a thrift store. It's an 80s electronic bathroom scale. Measures weight by moving a piece of steel, wrapped in aluminum through a big inductor. Like a reverse solenoid. That then goes into a board with a TL081 and a CD4050 to generate an 11.68KHz square wave at rest (display reading 0.0lb/KG. When weight is put on the scale (or i move the metal under in the solenoid) the frequency of the square wave drops, and the display counts up. To a max of 136KG/300lb. This is confirmed by connecting my function generator to the white (signal wire) going to the 3 oin DIN and watching the display increase as I turn down the frequency. submitted by /u/aspie_electrician [link] [comments]

Tinkering around with an N555 and a handful of 4017 ic.s. simple Led chaser idea. N555 triggers the 1st 4017. This one controls 2 4017s wich at there turn controls the 10 4017s powering 10 leds each. Creating a chaser effect. Eventually the outputs wil control up to 10 leds per output. Still far from completed. Stil need to figure out how to get the rainbow leds to change colors. As the 4017 is on/of. And the leds are operating between 3 and 3.2volts for changing. What started ad a simple old-school project is now starting to get complicated 🤔 submitted by /u/MBB-M [link] [comments]

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I took apart quite a few microwaves over a year or so and i never saw a plastic HV fuse in them yet so i thought it would be good to share. These HV fuses are esentially built using the same principles of operation: during overcurrent the thin thin wire melts and the spring retracts completely (like, totaly completely back) as soon as that wire melts enough. That quick spring retraction helps to quench the arc as fast as possible. Rated for fast blow 700 mA at 5 kV if you cant read it. submitted by /u/Lovrinjo1 [link] [comments]

Ripped of the trace when pulling out the transistor that was in there so had to get cteative using solder as the new trace.... ugly but it will do the work. submitted by /u/Whyjustwhydothat [link] [comments]

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I’ve been working on a modular IoT platform called Genesis, and wanted to share a fun offshoot of it — a single-port, battery-powered version I’m calling the “Pillar.” The port on top accepts various plug-in modules, since they all follow a mostly consistent pinout. The interface includes: 2x GPIO 1x ADC I2C, UART, and SPI It’s just one port, so it’s more of a fun side experiment — but it still supports a decent range of modules. Could be handy for throwing on a relay, sensor, or even a tiny display for field testing. Runs on a Li-Ion battery and has built-in charging via USB-C. submitted by /u/Polia31 [link] [comments]

Blue LED for ‘good’ (<600ppm), green LED for ‘average’ (<1000ppm) and red LED for ‘poor’ (>1000ppm). The board will also print the CO2 values, as they change, on the RTTViewer. submitted by /u/bleuio [link] [comments]

❤️ 3-місячний курс англійської для іноземців - це твій шанс опанувати мову! kpi пт, 04/18/2025 - 16:24

At the end of last year, the global software-defined vehicle (SDV) market size was valued at $49.3 billion. With a compound annual growth rate exceeding 25%, the industry is set to skyrocket over the next decade. But this anticipated growth hinges on automakers addressing fundamental architectural and organizational barriers. To me, 2025 will be a pivotal year for SDVs, provided the industry focuses on overcoming these challenges rather than chasing incremental enhancements.

Moving beyond the in-cabin experience

In recent years, innovations in the realm of SDVs have primarily focused on enhancing passenger experience with infotainment systems, high-resolution touchscreens, voice-controlled car assistance, and personalization features ranging from seat positions to climate control, and even customizable options based on individual profiles.

While enhancements of these sorts have elevated the in-cabin experience to essentially replicate that of a smartphone, the next frontier in the automotive revolution lies in reimagining the very architecture of vehicles.

To truly advance the future of SDVs, I believe OEMs must partner with technology companies to architect configurable systems that enable SDV features to be unlocked on demand, unified infrastructures that optimize efficiency, and the integration of software and hardware teams at organizations. Together, these changes signal a fundamental redefinition of what it means to build and operate a vehicle in the era of software-driven mobility.

1. Cost of sluggish software updates 

The entire transition to SDVs was built on the premise that OEMs could continuously improve their products, deploy new features, and offer better user experience throughout the vehicle’s lifecycle, all without having to upgrade the hardware. This has created a new business model of automakers depending on software as a service to drive revenue streams. Companies like Apple have shelved plans to build a car, instead opting to control digital content within vehicles with Apple CarPlay. As automakers rely on users purchasing software to generate revenue, the frequency of software updates has risen. However, these updates introduce a new set of challenges to both vehicles and their drivers.

When over-the-air updates are slow or poorly executed, it can cause delayed functionality in other areas of the vehicle by rendering certain features unavailable until the software update is complete. Lacking specific features can have significant implications for a user’s convenience but also surfaces safety concerns. In other instances, drivers could experience downtime where the vehicle is unusable while updates are installed, as the process may require the car to remain parked and powered off.

Rapid reconfiguration of SDV software

Modern users will soon ditch their car manufacturers who continue to deliver slow over-the-air updates that impair the use of their car, as seamless and convenient functionality remains a priority. To stay competitive, OEMs need to upgrade their vehicle architectures with configurable platforms to grant users access to features on the fly without friction.

Advanced semiconductor solutions will play a critical role in this transformation, by facilitating the seamless integration of sophisticated electronic systems like advanced driver-assistance systems (ADAS) and in-vehicle entertainment platforms. These technological advancements are essential for delivering enhanced functionality and connected experiences that define next-generation SDVs.

To support this shift, cutting-edge semiconductor technologies such as fully-depleted silicon-on-insulator (FD-SOI) and Fin field-effect transistor (FinFET) with magnetoresistive random access memory (MRAM) are emerging as key enablers. These innovations enable the rapid reconfiguration of SDVs, significantly reducing update times and minimizing disruption for drivers. High-speed, low-power non-volatile memory (NVM) further accelerates this progress, facilitating feature updates in a fraction of the time required by traditional flash memory. Cars that evolve as fast as smartphones, giving users access to new features instantly and painlessly, will enhance customer loyalty and open up new revenue streams for automakers, Figure 1.

Figure 1 Cars that evolve as fast as smartphones using key semiconductor technologies such as FD-SOI, FinFET, and MRAM will give users access to new features instantly and painlessly. Source: Getty Images

2. Inefficiencies of distinct automotive domains

The present design of automotive architecture also lends itself to challenges, as today’s vehicles are built around a central architecture that is split into distinct domains: motion control, ADAS, and entertainment. These domains function independently, each with their own control unit.

This current domain-based system has led to inefficiencies across the board. With domains housed in separate infrastructures, there are increased costs, weight, and energy consumption associated with computing. Especially as OEMs increasingly integrate new software and AI into the systems of SDVs, the domain architecture of cars presents the following challenges:

• Different software modules must run on the same hardware without interference.
• Software portability across different hardware in automotive systems is often limited.
• AI is the least hardware-agnostic component in automotive applications, complicating integration without close collaboration between hardware and software systems.

The inefficiencies of domain-based systems will continue to be amplified as SDVs become more sophisticated, with an increasing reliance on AI, connectivity, and real-time data processing, highlighting the need for upgrades to the architecture.

Optimizing a centralized architecture

OEMs are already trending toward a more unified hardware structure by moving from distinct silos to an optimized central architecture under a single house, and I anticipate a stronger shift toward this trend in the coming years. By sharing infrastructure like cooling systems, power supplies, and communication networks, this shift is accompanied by greater efficiency, both lowering costs and improving performance.

As we look to the future, the next logical step in automotive innovation will be to merge domains into a single system-on-chip (SoC) to easily port software between engines, reducing R&D costs and driving further innovation. In addition, chiplet technology ensures the functional safety of automotive systems by maintaining freedom of interference, while also enabling the integration of various AI engines into SDVs, paving the way for more agile innovation without overhauling entire vehicles (Figure 2).

Figure 2 Merge multiple domains into a singular, central SoC is key to realizing SDVs. This architectural shift inherently relies upon chiplet technology to ensure the functional safety of automotive systems. Source: Getty Images

3. The reorganization companies must face

Many of these software and hardware architectural challenges stem from the current organization of companies in the industry. Historically, automotive companies have operated in silos, with hardware and software development functioning as distinct, and often disconnected entities. This legacy approach is increasingly incompatible with the demands of SDVs.

Bringing software to the forefront

Moving forward, automakers must shift their focus from being hardware-centric manufacturers to becoming software-first innovators. Similar to technology companies, automakers must adopt new business models that allow for continuous improvement and rapid iteration. This involves restructuring organizations to promote cross-functional collaboration, bringing traditionally isolated departments together to ensure seamless integration between hardware and software components.

While restructuring any business requires significant effort, this transformation will also reap meaningful benefits. By prioritizing software first, automakers will be able to deliver vehicles with scalable, future-proofed architectures while also keeping customers satisfied as seamless over-the-air updates remain a defining factor of the SDV experience.

Semiconductors: The future of SDV architecture

The SDV revolution stands at a crossroads; while the in-cabin experience has made leaps in advancements, the architecture of vehicles must evolve to meet future consumer demands. Semiconductors will play an essential role in the future of SDV architecture, enabling seamless software updates without disruption, centralizing domains to maximize efficiency, and driving synergy between software and hardware teams.

Sudipto Bose, Senior Director of Automotive Business Unit, GlobalFoundries.

Related Content

• CES 2025: Wirelessly upgrading SDVs
• CES 2025: Moving toward software-defined vehicles
• Software-defined vehicle (SDV): A technology to watch in 2025
• Will open-source software come to SDV rescue?

The post Architectural opportunities propel software-defined vehicles forward appeared first on EDN.

Соціально важливий проєкт ФММ та Познанської політехніки kpi пт, 04/18/2025 - 13:49

Machine vision systems are becoming increasingly common across multiple industries. Manufacturers use them to streamline quality control, self-driving vehicles implement them to navigate, and robots rely on them to work safely alongside humans. Amid these rising use cases, design engineers must focus on the importance of reliable and cost-effective optical technologies.

While artificial intelligence (AI) algorithms may take most of the spotlight in machine vision, optical systems providing the data these models analyze are crucial, too. Therefore, by designing better camera and sensor arrays, design engineers can foster optimal machine vision on several fronts.

Optical systems are central to machine vision accuracy before the underlying AI model starts working. These algorithms are only effective when they have sufficient relevant data for training, and this data requires cameras to capture it.

Some organizations have turned to using AI-generated synthetic data in training, but this is not a perfect solution. These images may contain errors and hallucinations, hindering the model’s accuracy. Consequently, they often require real-world information to complement them, which must come from high-quality sources.

Developing high-resolution camera technologies with large dynamic ranges gives AI teams the tools necessary to capture detailed images of real-world objects. As a result, it becomes easier to train more reliable machine vision models.

Expanding machine vision applications

Machine vision algorithms need high-definition visual inputs during deployment. Even the most accurate model can produce inconsistent results if the images it analyzes aren’t clear or consistent enough.

External factors like lighting can limit measurement accuracy, so designers must pay attention to these considerations in their optical systems, not just the cameras themselves. Sufficient light from the right angles to minimize shadows and sensors to adjust the focus accordingly can impact reliability.

Next, video data and still images are not the only optical inputs to consider in a machine vision system. Design engineers can also explore a variety of technologies to complement conventional visual data.

For instance, lidar is an increasingly popular choice. More than half of all new cars today come with at least one radar sensor to enable functions like lane departure warnings. So, lidar is following a similar trajectory as self-driving features grow.

Complementing a camera with lidar sensors can provide these machine vision systems with a broader range of data. More input diversity makes errors less likely, especially when operating conditions may vary. Laser measurements and infrared cameras could likewise expand the roles machine vision serves.

The demand for high-quality inputs means the optical technologies in a machine vision system are often some of its most expensive components. By focusing on developing lower-cost solutions that maintain acceptable quality levels, designers can make them more accessible.

It’s worth noting that advances in camera technology have already brought the cost of such a solution from $1 million to $100,000 on the high end. Further innovation could have a similar effect.

Machine vision needs reliable optical technologies

AI is only as accurate as its input data. So, machine vision needs advanced optical technologies to reach its full potential. Design engineers hoping to capitalize on this field should focus on optical components to push the industry forward.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

Related Content

• What Is Machine Vision All About?
• Know Your Machine Vision Components
• Video Cameras and Machine Vision: A Technology Overview
• How Advancements in Machine Vision Propel Factory Revolution
• Machine Vision Approach Addresses Limitations of Standard 3D Sensing Technologies

The post Why optical technologies matter in machine vision systems appeared first on EDN.

President Donald Trump’s administration has dramatically escalated trade tensions by imposing heavy new tariffs on Chinese goods, some of which are as high as 245%. The rising economic and geopolitical competition between the United States and China is the driving force behind this audacious move, which marks a new chapter in Trump’s “America First Trade Policy.”

Late Tuesday, the White House released a fact sheet outlining how these penalties are a direct response to China’s recent actions. By imposing export restrictions on crucial raw minerals like gallium, germanium, and antimony as well as rare earth magnets and six heavy rare earth elements—items essential to the semiconductor, aerospace, and defense industries—Beijing has been showing off its power.

This strong reaction is a result of the U.S.’s perception that China is using its supply chain dominance as a weapon. “China now faces up to a 245% tariff on imports to the United States because of its retaliatory actions,” the White House stated.

Karoline Leavitt, the press secretary for the White House, added that although President Trump is amenable to a trade agreement with China, he is waiting for Beijing to initiate this increasingly heated tariff spat.

What’s Hard Hit: A More Detailed Look at Tariffs

Needles and syringes: 245%

Lithium-ion batteries: 173%

Seafood: 170%

Wool sweaters: 169%

Plastic dishes: 159%

Toasters: 150%.

Electric vehicles: 148%

Toys, dolls, and puzzles: 145%

Vitamin C: 145%

Car wheels: 73%

Semiconductors: 70%

Metal furniture: 70%

Car door hinges: 67%

Laptops: 20%

Children’s books: 0%

These tariffs have enormous knock-on effects that affect everything from clothing to electronics and medical equipment.

Examining the Specifics:

Devices and Cell Phones

According to the U.S. Commerce Department, electronics, including TVs and mechanical appliances, account for 46.4% of all imports from China in 2022, including smartphones and accessories. More over 80% of the $52 billion worth of cellphones imported into the United States in 2024 came from China. These were initially subject to 145% taxes, but new customs regulations exempted phones and laptops from a reciprocal 125% levy. They are nevertheless forced to pay a 20% total tariff, which builds up over time (0% base + 20% fentanyl-related penalty).

Furniture, Clothes, and Toys

China is a major supplier of consumer products, furniture, and textiles, accounting for more than 50% of toys, furniture, and almost 30% of U.S. textile imports. Up until now, items like tricycles and plush animals were duty-free, which kept costs down. Toys are no longer a deal, though, because to a new 145% tax (0% base + 20% fentanyl penalty + 125% reciprocal). Wool sweaters and other clothing are now subject to a staggering 168.5% total tax (16% base + 7.5% pre-2025 + 20% penalty + 125% reciprocal), which significantly raises the cost of wardrobes.

Conclusion: Companies will have to assess their supply chains to ascertain the damage as these tariffs are not universal; they vary by product, material, and exclusions. EV makers, electronic companies, and energy storage companies that rely on Chinese suppliers will suffer from the 173% tariff on lithium-ion batteries. What about the 70% semiconductor duty? For American computer companies already dealing with chip shortages, that presents even another challenge.

It’s a complicated problem, and if businesses pass it on, the true cost may end up on customers. The United States and China are currently engaged in a high-stake game of chess.

The post Trump’s Trade Bombshell: Tariffs on China Hit 245% appeared first on ELE Times.

Цифрова освіта як спільний вектор kpi пт, 04/18/2025 - 11:51