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The ST SafeSense VD56GA 1.1-Mpixel automotive image sensor enables infrared in-cabin sensing for driver and occupant monitoring applications. Based on ST’s DeepNIR BSI pixel architecture, the sensor delivers 35% higher modulation transfer function (MTF) and nearly 60% higher quantum efficiency (QE) than the previous generation. The higher MTF and infrared sensitivity result in sharper images, while the sensor’s small CSP allows discreet in-cabin camera designs for space-constrained installations.

With 2.43×2.43-µm pixels, the global-shutter sensor’s 1.1-Mpixel architecture achieves virtual 2-Mpixel performance. According to ST, the VDA56GA can reduce overall camera-module costs through lower-cost optics, simplified infrared illumination, and less demanding optical filtering. Embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing, eliminate the need for external image processing. Together, these features can help designers deploy driver and occupant monitoring across a broader range of vehicle models.

The sensor is undergoing AEC-Q100 Grade 2 qualification, with a −40°C to +125°C operating junction-temperature range. It is compliant with ISO 26262 for ASIL B system integration and ISO/SAE 21434 for automotive cybersecurity.

Samples are available now. Pricing information and sample requests are available from local ST sales offices.

VD56GA product page 

STMicroelectronics

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Vishay’s XFD11KxxCA flat-clamping transient voltage suppression (TVS) devices provide 11 kW of peak pulse power dissipation at 10/1000 µs. Offered in surface-mount DO-218AC packages, the bidirectional devices maintain a low clamping ratio (VC/VBR) close to 1.0, supporting high power density.

The XFD11KxxCA series comprises 15 devices, each available in commercial and AEC-Q101 qualified grades. They have clamping voltages of 40.6 V to 104.0 V, breakdown voltages from 36.7 V to 104 V, and standoff voltages from 33 V to 85 V, making them suitable for 12-V, 24-V, and 48-V automotive powertrains. At the same standoff voltage, they have lower clamping voltage than conventional TVS products in DO-218 packages and deliver approximately 1.6 times higher peak pulse current, up to 207.1 A at 10/1000 µs.

Additional key specifications include an 8/20-µs surge capability of up to 2140 A and maximum leakage current of 10 µA at the standoff voltage (VWM) to minimize power loss. The series’ low, stable clamping and breakdown voltages over a wide temperature range of -55°C to +175°C allow the use of lower-voltage downstream components, reducing voltage overshoot and enabling smaller design guard bands.

Samples and production quantities of the XFD11KxxCA series are available now, with lead times of 12 weeks.

XFD11KxxCA product page

Vishay Intertechnology

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Singular Photonics’ Litavis is a CMOS single-photon avalanche diode (SPAD) image sensor with integrated digital photon processing on-chip and in-pixel. By processing photon events directly on-chip, it reduces the volume of raw data that must be transferred and processed externally.  According to the company, Litavis enables scalable real-time imaging systems with lower latency and improved power efficiency.

The 3D-stacked, back-side-illuminated (BSI) sensor captures spatial and temporal information while extracting scene information such as depth and event characteristics. Its software-configurable architecture combines photon-counting imaging, programmable time gating, and photon timing within a scalable SPAD array. Litavis supports intensity, timing, and histogramming modes concurrently, allowing users to dynamically adjust sensor parameters in software without requiring a new hardware design.

Litavis provides continuous 256×256-pixel photon-counting imaging under low-light conditions and simultaneously generates time-stamped photon events across a 64×64-macropixel timing grid. It delivers 47% photon detection efficiency (PDE) at 785 nm, 37-ps timing resolution, and 4.3-ns dead time, with a 100% fill factor enabled by microlenses.

The SPAD-based sensor targets applications including machine vision, physical AI, robotics, depth sensing, and scientific imaging. A timeline for sensor availability was not provided at the time of this announcement.

Litavis product page  

Singular Photonics  

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Anti-surge chip resistors in Rohm’s SDR01 series deliver a rated power of 0.33 W in the 0402 (1005 metric) package. The devices save board space and lower component count by replacing larger-size resistors in automotive, industrial, and AI server applications that require increased mounting density.

With optimized resistive element and electrode designs, the SDR01 series achieves a high rated power in the 0402 size while maintaining the reliability expected of high anti-surge chip resistors. The devices maintain their 0.33-W rating at terminal temperatures up to 125°C, making them suitable for demanding thermal environments.

Qualified to AEC-Q200, the chip resistors operate over a temperature range of -55°C to +155°C. The SDR01MZPF has a resistance tolerance of ±1% and a resistance range of 1 Ω to 2.2 MΩ, with a TCR of ±100 ppm/°C from 10 Ω to 2.2 MΩ. The corresponding ratings for the SDR01MZPJ are ±5%, 1 Ω to 10 MΩ, and a TCR of ±200 ppm/°C from 10 Ω to 10 MΩ, respectively.

The SDR01 series is now in mass production.

Rohm Semiconductor 

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Renesas offers the RZ/G3L and RZ/G3SE series of 64-bit general-purpose microprocessors for consumer and industrial HMI and IoT edge systems. Expanding the company’s RZ/G portfolio, the pin-compatible MPUs allow developers to reuse a PCB design for multiple products.

Targeting HMI devices that require rich graphics and video capabilities, the RZ/G3L integrates a GPU for 3D graphics rendering and an H.264 video codec. The RZ/G3SE targets edge devices with basic display requirements, such as EV chargers and industrial gateways with status indicators and configuration screens.

Both series use dual or quad Arm Cortex-A55 cores running at 1.2 GHz and a Cortex-M33 coprocessor at 200 MHz. The MPUs can reduce standby power to 1 mW in deep standby mode and support fast Linux wakeup for always-connected applications. High-speed interfaces, including PCIe, TSN-capable Gigabit Ethernet, and USB, enable application-specific connectivity options such as 5G and Wi-Fi 6 modules.

The RZ/G3L and RZ/G3SE MPUs are available now in 14-mm², 400-pin LFBGA and 17-mm², 368-pin LFBGA packages.

RZ/G3L product page

RZ/G3SE product page

Renesas Electronics

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Hello, This is my first project in electronics. The concept is that one of 8 Leds will fade in/out at random and that the ornament will have a usable life of approximately 20 days with a fresh CR-2032 battery. So far it has more than exceeded that limit, it's on a 2 month streak though the light has diminished. I have the project files and code on my github here: https://github.com/AvariCe-git/Christmas_Ornaments, if anyone wants to take a look or make some for themselves. For the code I used the platformio plugin for vscodium. Forgive the solder blobs on the battery terminals, my soldering iron sucks. submitted by /u/Menacing_Mosquito [link] [comments]

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company) says that its shares have resumed trading on the NYSE American exchange. Executive chairman & co-CEO Alessandro Zamboni has consequently issued a letter to shareholders, outlining the following points...

Mouser Electronics has expanded its stock of Nordic Semiconductor products with development and evaluation kits for the nRF54L15 and nRF54LM20 Bluetooth Low Energy SoCs, the nRF9151 cellular IoT system-in-package, and the nPM2100 power management IC. Mouser has distributed Nordic products since 2011.

nRF54L15 development kit

The nRF54L15 DK is an evaluation and prototyping platform for the nRF54L Series of Bluetooth Low Energy (BLE) wireless SoCs. It supports the full BLE feature set as well as other common communication protocols, and is intended for applications such as Industrial IoT (IIoT), augmented and virtual reality (AR/VR), asset tracking, and smart home products.

nRF54LM20 development kit

The nRF54LM20 DK supports application development for the nRF54LM20A and nRF54LM20B wireless SoCs. It is a low-cost, single-board kit that gives access to all SoC features, backed by the software examples, modules, and libraries in the nRF Connect SDK.

Both SoCs support Bluetooth LE, Bluetooth Mesh, Matter, Aliro, Thread, Zigbee, and proprietary 2.4 GHz protocols (up to 4 Mbps), plus High-Speed USB. The nRF54LM20B also integrates an Axon neural processing unit (NPU) that accelerates edge AI workloads such as health, biometric and activity monitoring, voice control, audio classification, and low-fidelity vision.

nRF9151 SMA development kit

The nRF9151 SMA DK is designed for in-depth evaluation of the nRF9151 LTE-M/NB-IoT system-in-package (SiP), which also supports DECT NR+ and GNSS. Its SMA connectors allow direct connection to lab instruments for conducted measurements, or to external antennas for field testing. A beta modem firmware adds support for NB-IoT NTN (satellite communication).

The kit includes antennas from Taoglas (cellular/NTN) and Kyocera (GNSS), and IoT SIM cards from Deutsche Telekom, Onomondo, and Monogoto.

nPM2100 evaluation kit

The nPM2100 EK allows no-code configuration of the nPM2100 PMIC, which is designed for low-power devices running on non-rechargeable (primary) batteries. The PMIC includes a boost regulator with automatic pass-through mode, allowing batteries to be used down to their functional end point.

With the EK connected to a PC, all PMIC settings can be configured and exported as code for direct integration into the host microcontroller application. The kit comes with six interchangeable battery holders covering a wide range of primary cell configurations.

Availability

The kits are available from Mouser. The Nordic Semiconductor products stocked by Mouser are listed on the Nordic Semiconductor manufacturer page.

The post Mouser stocks Nordic nRF54L, nRF9151, and nPM2100 development kits appeared first on Open Electronics.

ROHM has developed a fourth generation of 650 V IGBTs for automotive electric compressors and HV heaters, and for inverters in industrial equipment. The devices reach a collector-emitter saturation voltage of VCE(sat) = 1.55 V, which ROHM reports as the lowest conduction loss among 650 V automotive devices*, while offering high short-circuit tolerance and qualification to the AEC-Q101 automotive reliability standard (Fig. 1).

Application context

As electric vehicles move to higher voltages, SiC devices are increasingly used in high-power applications such as traction inverters. 650 V IGBTs, meanwhile, remain widely used as switching devices in lower-power auxiliary systems, including automotive electric compressors and HV heaters. Silicon IGBTs are also common in industrial equipment, particularly in motors and compressors, and demand is expected to keep growing.

These applications call for energy savings and smaller equipment, and therefore for power devices with higher reliability, smaller size, and higher efficiency. Heater and inverter circuits in particular need enough short-circuit tolerance to withstand a fault for the time required to detect and interrupt the overcurrent.

Device design

ROHM revised the device structure, including the manufacturing process and the edge termination structure, to combine low loss with high short-circuit tolerance while meeting higher voltage requirements. The new structure increases current density and reduces both conduction and switching losses. Despite the trade-off between lower loss and short-circuit tolerance, the devices guarantee a short-circuit withstand time of 7 µs at Tj = 25 °C.

Lineup and availability

The lineup includes 12 products in the TO-247N package, the RGAxxTS65HR and RGAxxTS65EHR, and 10 bare-die products, the SG83xxWN series. ROHM is also developing 12 products in the TO-247-4L package, the RGAxxTR65HR/RGAxxTR65EHR series.

All packaged devices share a collector-emitter voltage of 650 V, a short-circuit withstand time of 7 µs at Tj = 25 °C, an operating junction temperature of -40 °C to +175 °C, and AEC-Q101 qualification. The -HR versions have no built-in diode; the -EHR versions integrate a fast recovery diode. The TO-247N package measures 16.0 × 21.0 × 5.0 mm, the TO-247-4L 16.0 × 23.45 × 5.0 mm.

TO-247N (available)TO-247-4L (under development)IC (TC = 100 °C)VCE(sat) typ.

RGA60TS65HR / RGA60TS65EHR	RGA60TR65HR / RGA60TR65EHR	35 A	1.55 V
RGA80TS65HR / RGA80TS65EHR	RGA80TR65HR / RGA80TR65EHR	44 A	1.55 V
RGA00TS65HR / RGA00TS65EHR	RGA00TR65HR / RGA00TR65EHR	52 A	1.55 V
RGAX2TS65HR / RGAX2TS65EHR	RGAX2TR65HR / RGAX2TR65EHR	62 A	1.55 V
RGAX5TS65HR / RGAX5TS65EHR	RGAX5TR65HR / RGAX5TR65EHR	74 A	1.60 V
RGAY0TS65HR / RGAY0TS65EHR	RGAY0TR65HR / RGAY0TR65EHR	88 A	1.65 V

Packaged 650 V IGBTs: -HR without diode, -EHR with built-in fast recovery diode.

The bare-die devices are rated at 650 V with a typical VCE(sat) of 1.55 V and a short-circuit withstand time of 7 µs; all chips are 75 µm thick.

Bare dieIC (TC = 100 °C)Chip size X × Y (mm)

SG8351WN	20 A	3.08 × 3.08
SG8352WN	25 A	3.10 × 3.48
SG8353WN	30 A	3.52 × 3.52
SG8359WN	40 A	3.74 × 4.10
SG8355WN	50 A	4.20 × 4.39
SG8356WN	60 A	3.90 × 5.48
SG8358WN	75 A	4.50 × 5.70
SG8357WN	100 A	5.70 × 5.70
SG8360WN*	150 A	6.82 × 6.82
SG8361WN*	200 A	7.75 × 7.75

* Under development.

The TO-247N products and some of the bare-die products are available now, and the TO-247N parts are sold through online distributors including DigiKey and Farnell. ROHM plans to add more products in the same packages and to develop compact surface-mount IGBTs in the TO-263L package and in top-side cooled (TSC) packages.

Applications

• Automotive electric compressors
• Automotive HV heaters (PTC heaters, coolant heaters)
• Inverters for industrial equipment

Design support

ROHM’s website provides SPICE models that reproduce the electrical characteristics of the devices in simulation, PLECS models for circuit simulation, and other circuit design material. More information is available on the field-stop trench IGBT product page.

EcoIGBT is ROHM’s IGBT brand for devices and modules aimed at high-voltage power applications. EcoIGBT is a trademark or registered trademark of ROHM Co., Ltd.

*ROHM research, August 2026.

The post ROHM fourth-generation 650 V IGBTs with 1.55 V VCE(sat) and AEC-Q101 appeared first on Open Electronics.

Cambium Networks has introduced cnMaestro MarketApps Hub, an open marketplace of web apps built to extend cnMaestro, the company’s centralized network management system. The hub turns a Cambium ONE network into an application platform: network operators, MSPs, site managers, and end users can run the workflows they need, and anyone able to call the cnMaestro APIs can develop and publish apps. According to Cambium, AI coding tools and an AI-ready development platform make it possible to build custom apps in hours or days.

An open marketplace with defined responsibilities

MarketApps Hub extends Cambium’s existing MarketApps framework into a governed app ecosystem, with a public catalog, a developer SDK, single sign-on (SSO), app hosting, and platform-level security. It is built on the public cnMaestro APIs and on a developer experience designed for AI coding agents. Apps are hosted and secured on the platform, and can be written by anyone from Cambium engineers to the customers who operate the network every day.

Bruce Miller, VP of Enterprise Marketing at Cambium Networks, said that AI has turned domain experts into developers, and that a purpose-built app that once took an engineering team a quarter to build can now be created in hours or days. In his view, the hub gives these developers a marketplace and gives customers functions tailored to their vertical market and workflow.

Five app classes

Every app in MarketApps Hub belongs to one of five classes, which tell customers where it comes from and how it is supported:

• Certified: production-grade apps developed, tested, hosted, and fully supported by Cambium.
• Labs: the fast track. Apps are released quickly and shaped by customer feedback, and those that prove themselves move to Certified.
• Partner: apps developed and supported by Cambium partners.
• Community: open contributions from the developer community.
• Private: apps exclusive to a single customer account, with that customer’s data and network.

Apps can move up to a higher class as adoption shows demand, so a community idea can become a Certified app or a native cnMaestro feature.

Development and distribution

Cambium’s position is that AI has made writing apps easier, and that the harder part is now hosting, securing, and distributing them to the right audience with adequate support. MarketApps Hub addresses this with platform hosting, SSO, a public catalog, and controlled distribution through the five app classes.

The MarketApps developer platform is designed for AI coding agents. A quick-start guide provides boilerplate code, an SDK, and a live cnMaestro development environment with a single command, and a single pull request publishes an app globally.

Because apps are delivered as plain web applications that run on mobile devices or in any browser, they can serve users outside the network team, such as a resident configuring personal Wi-Fi, a site manager overseeing a location, or a technician installing equipment, without requiring a cnMaestro account.

The post Cambium Networks launches MarketApps Hub, an app marketplace for cnMaestro appeared first on Open Electronics.

Mouser Electronics has launched a digital resource center dedicated to consumer technology. It collects material on emerging technologies, reference designs, and implementation guidelines for engineers developing connected consumer products.

Design topics

As consumer devices become more portable, intelligent, and interconnected, designers have to provide seamless connectivity and adaptive user experiences. The resource center covers several of these design priorities:

• USB Type-C® charging and power management systems, which enable faster charging and simpler connectivity
• AI-based ambient systems built on sensors and contextual processing, which make devices more adaptive and responsive
• Physical buttons, which are seeing renewed interest for tactile, distraction-free interaction, while touch and voice interfaces continue to spread

Content

The center was curated by Mouser’s technical team and its manufacturer partners, and includes articles, blogs, eBooks, and new products for consumer technology design. It also features the latest episode of Mouser’s Empowering Innovation Together (EIT) series, Engineering AI for Daily Life, which looks at emerging AI technologies and their practical uses in consumer products, including voice assistants, AI-based travel planning tools, and wearables that provide more detailed health information.

Featured products

The new consumer-oriented products stocked by Mouser include:

• STMicroelectronics LSM6DSV320X: a 6-axis inertial measurement unit (IMU) that combines an accelerometer and a gyroscope in a compact, low-power package. It integrates activity tracking, gesture recognition, and context detection, and targets wearables, AR/VR systems, and smart devices.
• Molex Premo-Flex SlimStack jumpers: flexible flat cable (FFC) and flexible printed circuit (FPC) jumpers that provide high-density, flexible interconnects for compact, lightweight consumer electronics. Their thin profile helps optimize the internal layout of smartphones, tablets, wearables, and portable devices, and simplifies wiring in tight spaces while preserving signal integrity.
• Littelfuse SC3402-02ETG: an ESD protection diode that protects sensitive consumer electronics from electrostatic discharge and transient voltage events. It is designed for high-speed interfaces and compact applications, and its small footprint suits mobile devices, wearables, and other space-constrained equipment.
• TE Connectivity 0.8 mm low-profile IDC connector system: compact, high-density board-to-board and wire-to-board connections for consumer electronics. The low profile helps reduce device thickness while carrying data and power, and the system is designed for automated assembly.

The post Mouser opens a consumer technology resource center appeared first on Open Electronics.

Taoglas, a supplier of antennas and RF solutions, has completed the acquisition of Wireless Instruments Sp. z o.o. (“QuWireless”), a company that designs antennas and antenna-enclosure systems for wireless communication devices. The deal extends Taoglas’s capabilities in outdoor and industrial connectivity, where demand for rugged solutions for harsh environments is growing.

Router inside the antenna enclosure

Based in Poland, QuWireless develops integrated “all-in-one” products in which the router is installed directly inside the antenna enclosure. Enclosures are available for all major brands of industrial routers: the installer inserts and secures the router in the enclosure, leaving a single unit to mount.

With significantly less RF cabling, this type of installation can also improve signal strength and reliability in settings such as:

• industrial sites
• telecom network infrastructure
• smart grids
• transport systems
• building rooftops
• remote locations and areas with limited network coverage

Combined portfolio

Taoglas says that adding QuWireless’s antenna and enclosure expertise to its own RF and antenna design, engineering, global testing, and certification capabilities will shorten development cycles and make field performance more predictable. The combined portfolio covers a wider range of supported devices, frequency bands, and form factors.

The acquisition comes as demand for wireless connectivity in outdoor, industrial, and remote environments grows with the expansion of 5G, private networks, and IoT deployments.

“Much of the challenge today isn’t just RF performance; it’s getting reliable, robust connectivity deployed quickly, with controlled installation costs, especially outdoors,” said Dermot O’Shea, CEO of Taoglas. “Their antenna enclosures remove much of that complexity and significantly reduce installation time.”

Deal terms

QuWireless will operate as “QuWireless, a Taoglas company”, and its product portfolio will initially continue under the QuWireless brand. The team will remain in Poland as a center of excellence for antenna-enclosure design, working with Taoglas’s global engineering teams.

According to Michal Gorzad, CEO of QuWireless, joining Taoglas will allow the company to bring its designs to a much wider market and integrate them with a broader range of RF technologies.

Financial terms of the transaction were not disclosed.

The post Taoglas acquires QuWireless, maker of outdoor antenna enclosures appeared first on Open Electronics.

Mouser Electronics now stocks the ESP32-P4X-EYE, a vision development kit from Espressif Systems designed for camera-based applications such as smart surveillance cameras, detection with vision models, and edge computing in IoT systems.

A development kit shaped like a small camera

The ESP32-P4X-EYE comes in a mini digital camera form factor: a compact camera-style enclosure houses the camera module, with a 1.54-inch SPI LCD on the back, a digital microphone, a rotary encoder, and a push button. The kit is intended for real-time image processing in AI, edge computing, human-machine interface (HMI), and camera applications.

With the camera, display, microphone, and microSD card on board, the kit can monitor its surroundings in real time and collect image and audio data.

Main features

• SoC: Espressif ESP32-P4 with a 400 MHz dual-core RISC-V processor
• Memory: support for up to 32 MB of PSRAM
• Interfaces: USB 2.0, MIPI-CSI/DSI, and several other peripherals
• Video: H.264 encoder
• Display: 1.54-inch SPI LCD on the back of the enclosure
• Audio: digital microphone
• Controls: rotary encoder and push button
• Storage: microSD card
• Wireless: ESP32-C6-MINI-1 module with Wi-Fi, IEEE 802.15.4, and Bluetooth LE

Wireless module

Wireless communication is handled by Espressif’s ESP32-C6-MINI-1 module, which supports Wi-Fi, IEEE 802.15.4, and Bluetooth LE and is designed for applications including smart home, industrial automation, healthcare, and consumer electronics. The module has an on-board PCB antenna.

Developers can also connect external peripherals to the ESP32-P4X-EYE using jumper wires.

The post Mouser now stocks Espressif ESP32-P4X-EYE vision development kit appeared first on Open Electronics.

Inspired by PocketPD, I created a pocket-sized programmable power supply built on the USB Power Delivery (PD) standard and the USB Programmable Power Supply (PPS) feature. The main goal was to learn new skills while working on something that can be useful in the future. Key features: Single firmware supports AP33772 and AP33772S PD sink ICs Support for fixed PDO and PPS profiles Operating voltage range: 3.3V to 21V Output current up to 5A (charger and cable dependent) User-switchable output Programmable current limit: 250mA/Step with AP33772S 100mA/Step with AP33772 Programmable condtant voltage: 100mV/Step with AP33772S 20mV/Step with AP33772 Short-circuit protection Input/output TVS protection OVP, OCP and OTP 3D printed case More details: Project logs Github repo submitted by /u/denikty [link] [comments]

Vertiv, a critical digital infrastructure company, plans to expand its manufacturing and testing operations in Ireland and the North West. The company cites growing global demand for infrastructure supporting artificial intelligence (AI), colocation, and hyperscale data center deployments.

Planning application in Letterkenny

Vertiv will submit a planning application to Donegal County Council for an additional 7,000 m² at its Letterkenny site, supporting the planned creation of up to 300 new jobs in the region.

The company’s existing presence in Ireland and the North West includes manufacturing facilities in Letterkenny, Burnfoot, and Campsie (Derry), a Central Procurement Office in Limerick, and a sales and service office in Dublin. Vertiv is currently hiring at these locations to support ongoing organic growth.

Hiring and technical scope

Since the beginning of 2026, Vertiv has added more than 500 employees at its local sites and continues to recruit for engineering and operations roles. According to the company, the new staff will increase production capacity and expand its technical expertise in power, cooling, and industrialized infrastructure solutions, supporting faster deployment of AI, data center, and critical industrial infrastructure worldwide.

“As demand for critical digital infrastructure continues to rise, we are supporting customers as they deploy AI and data center capacity around the world,” said Paul Ryan, president of Vertiv in Europe, Middle East and Africa (EMEA).

Government support

The proposed project is supported by the Irish Government through IDA Ireland. Taoiseach Micheál Martin described the decision as good news for the region and for Ireland, while Peter Burke TD, Minister for Enterprise, Tourism and Employment, said the project underlines the role of the Irish facilities in Vertiv’s global manufacturing network.

Michael Lohan, CEO of IDA Ireland, pointed to the expansion as an example of global companies growing high-value operations from regional locations in Ireland.

The post Vertiv plans 7,000 m² expansion at Letterkenny with up to 300 new jobs appeared first on Open Electronics.

In a case study, Yokogawa describes how Integrated Optics, a Lithuanian manufacturer of lasers and photonics products, uses the AQ6373E optical spectrum analyzer to characterize its ultra-compact visible lasers during development and in production.

Visible lasers are used where spectral quality, stability, and repeatability matter: microscopy, spectroscopy, flow cytometry, quantum technologies, and LiDAR. In these applications even low-level unwanted spectral components can affect measurement accuracy and system performance, so accurate spectral characterization is needed throughout development and manufacturing.

MatchBox laser platform

Integrated Optics builds ultra-compact laser sources for scientific and industrial customers. Its MatchBox platform is a configurable family of continuous-wave, multi-wavelength, and pulsed lasers designed for integration, combining optics, control electronics, and thermal stabilization in a matchbox-sized housing.

The challenge: detecting weak spectral modes

A key problem for the company is detecting weak spectral modes and other low-level components close to the main laser line. Although much weaker than the dominant emission peak, these components can indicate unwanted laser behavior or reduced spectral purity. For both product development and production quality control, Integrated Optics needed an optical spectrum analyzer with wide wavelength coverage, high wavelength resolution, good sensitivity, and good close-in dynamic range, together with fast and repeatable measurements.

The AQ6373E optical spectrum analyzer

The company chose the Yokogawa AQ6373E optical spectrum analyzer, which covers wavelengths from 350 nm to 1200 nm. The instrument is used in single-mode laser production, spectral filtering, component characterization, quality checks, and new product development. Its close-in dynamic range of about 60 dB lets engineers separate weak spectral modes from the dominant laser peak and assess spectral purity, and so verify that each laser meets the requirements of its scientific or industrial application.

The analyzer’s sensitivity also allows measurements at relatively low optical input levels, which simplifies test setups in production. Because Integrated Optics’ lasers include control electronics and thermal stabilization, precise spectral calibration is needed to maintain performance and stability over a wide temperature range. The AQ6373E’s connectivity options support automated calibration and validation workflows, and its wavelength range lets the company use a single instrument platform across its portfolio of visible and near-infrared lasers.

The customer’s view

Evaldas Pebreza, CEO of Integrated Optics, describes the AQ6373E as a telecom-grade instrument whose performance suits laboratory laser measurements: the company gets the reliability typical of telecom equipment together with the resolution and sensitivity needed to characterize more demanding laser sources.

Results

With the AQ6373E, Integrated Optics performs fast, accurate, and repeatable measurements, identifies weak spectral components, verifies spectral purity, and evaluates new laser designs. The main benefit for the company is greater confidence that each laser meets customer requirements, both in production quality control and in the development of compact laser sources for medical, scientific, industrial, and quantum applications.

The full Integrated Optics case study is available from Yokogawa.

The post Yokogawa AQ6373E validates Integrated Optics’ ultra-compact visible lasers appeared first on Open Electronics.

SentinelOne has expanded its collaboration with Amazon Web Services (AWS) to provide unified AI governance for customers using Amazon Bedrock. The new integration combines SentinelOne’s AI runtime security with Amazon Bedrock AgentCore, so security teams can monitor, manage, and mitigate AI-related risks from a single platform. The stated aim is to narrow the gap between how fast companies deploy AI agents and how fast security teams can protect them.

The AI governance problem

As organizations deploy more AI agents, security teams need to see what those agents do, which data and applications they access, and whether that activity complies with governance requirements. In June 2026, SentinelOne and AWS addressed the first part of this problem with an integration between SentinelOne’s Prompt Security and Amazon Bedrock AgentCore, which added runtime protection to the Amazon Bedrock AgentCore gateway.

From guardrails to governance

The new integration goes beyond runtime guardrails and adds a governance layer for enterprise AI, with four functions:

• AI usage governance: visibility into how AI is used across the organization, both sanctioned and unsanctioned.
• Policy enforcement: real-time enforcement of AI usage policies on AWS and in multi-cloud environments.
• Threat detection: detection and root cause analysis of AI-related security risks.
• Automated remediation: automatic correction of misconfigurations and non-compliant AI code.

The governance layer connects Prompt Security, Singularity Cloud Security, and Singularity AI SIEM in a single platform on Amazon Bedrock, including AgentCore, with machine-speed policy enforcement, threat detection, and autonomous response across the customer’s AI environment.

SentinelOne’s view

According to Melissa K. Smith, SVP, Global Strategic Partnerships and Initiatives at SentinelOne, security teams want real-time visibility into what their AI agents are doing. The integration provides that visibility inside the workflows customers already run on AWS, so that security teams get answers immediately instead of reconstructing them afterwards.

Availability

The integration extends SentinelOne’s Prompt Security and Singularity AI Runtime offerings for companies building on AWS, and strengthens the partnership with AWS, including distribution through AWS Marketplace and joint commercial initiatives. Prompt Security, Singularity Hyperautomation, and SentinelOne AI SIEM are already available on AWS Marketplace. Full availability of the unified AI governance system is expected at AWS re:Invent 2026, at the end of November.

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TDK Corporation has introduced the TDK-Lambda DDSM series, programmable isolated DC-DC converters rated at 120 W and 240 W with wide input and output voltage ranges. The converters can be controlled and monitored remotely in real time via Modbus over USB, using the PowerCMC control and monitoring center. A digital display shows device settings, system alarms, and status information, and the unit can also be operated manually with three buttons on the front panel.

A wide conversion ratio

The DDSM series was designed for a wide conversion ratio. Typical uses include improving voltage stability over long cable runs, stepping up the voltage to support a system load, providing an independent isolated voltage for Power over Ethernet (PoE) requirements, and powering loads that need special operating voltages. Because the input and output ranges are wide, one model can replace several part numbers in stock.

Input, output, and efficiency

The converters accept a nominal input of 12 V to 48 V (10.8 V to 52.8 V maximum range) and deliver a nominal output of 5 V to 55 V (4.7 V to 57 V maximum range). Efficiency under standard conditions is up to 93.0%, which reduces internal heat losses and saves energy in standby. Rated output current is 5 A for the 120 W model and 10 A for the 240 W model. A 24 V/1 A DC-OK signal is accessible from the front panel. The DDSM measures 40.0 mm wide, 116.6 mm deep, and 115.0 mm high, and weighs 500 g.

Safety and EMC approvals

Safety certification covers IEC/EN/UL/CSA 61010-1, 61010-2-201, and IEC/EN/UL/CSA 62368-1 (Ed. 3). The series is CE and UKCA marked under the EU Low Voltage, EMC, and RoHS Directives and UK regulations. The models meet EN 55032 Class B for radiated and conducted emissions and EN 61000-6 for immunity.

Applications

• Factory automation
• General industrial automation
• Semiconductor manufacturing
• Renewable energy generation
• Telecommunications
• Test and measurement

Key features

• Wide input and output ranges
• High efficiency and low standby losses
• Digital control and monitoring
• Front-panel display and programming

Specifications ParameterValue

Series	DDSM
Input voltage range	10.8-52.8 Vdc
Output voltage	4.7-57 Vdc
Maximum output power	120 W or 240 W
Efficiency	Up to 93.0%
Isolation	Input to output: 2200 Vdc
Dimensions (W × D × H)	40.0 × 116.6 × 115.0 mm
Safety certifications	IEC/EN/UL/CSA 62368-1 (Ed. 3), IEC/EN/UL/CSA 61010-1, 61010-2-201

More information is available on the TDK-Lambda DDSM series page.

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As FPGA manufacturing migrates to smaller geometries, the process change has delivered extraordinary gains in density, speed, and power efficiency. However, these gains have come at a cost in terms of single event upset (SEU) sensitivity.

Starting in the mid-1990s, the FPGA industry began experiencing a more noticeable rate of SEU sensitivity in 2D planar transistor architectures. Smaller process geometries require less capacitance to store a given state, so a lower amount of energy can disrupt the stored state. Sensitivity increased proportionally to the geometry shrink.

Moving to tri-gate 3D FinFET geometries at 22 nm helped reduce SEU sensitivity compared to 2D planar, but as tri-gate geometry reduces, SEU sensitivity will continue to increase. A bit flip used to require a direct, high-energy particle strike; now even lower-energy neutrons, alpha particles from packaging materials, or even secondary particles generated within the device substrate itself can trigger bit flips.

The result is an unavoidable increase in SEU susceptibility in FPGAs as process nodes scale smaller and FPGAs are deployed in more applications. Part 1 of this mini-series examines SEU radiation particles and related SEU challenges for FPGA applications that require robustness and predictability in ground-based and terrestrial applications.

Radiation particle types and SEU

A variety of particle types can interact with an FPGA and negatively impact system functionality. These particles differ in mass, charge, and energy strength, and interact with the semiconductor material through distinct physical mechanisms. The following discussion focuses on four particle types that lead to SEUs in FPGAs: heavy ions, protons, neutrons, and alpha particles.

1. Heavy ions

Heavy ions, which are caused by galactic cosmic rays and solar flares, are the most potent SEU-inducing particles for space and high-altitude environments. To a lesser degree they can impact ground-based systems. These particles have a heavy nucleus, high linear energy transfer (LET) values, and a positive charge.

When heavy ions traverse through the silicon substrate, they deposit large amounts of charge in their path, generating free electrons and holes that can disrupt a memory cell’s stored charge. A memory cell is constructed with transistors, and if the accumulated charge added by the heavy ion exceeds the minimum charge required by a cell’s transistor, the memory cell state can switch, resulting in a bit flip. In other words, heavy ions cause bit flips through direct ionization.

Figure 1 Heavy ion striking a planar transistor result in ionization along its path, depositing charge and potentially impacting the transistor state. Source: Efinix

Figure 2 Junction current is induced from charge collection and diffusion over time. Source: Efinix

2. Protons

Protons are a secondary radiation particle caused by cosmic rays and solar flares but are weaker than heavy ions. When cosmic rays hit the earth’s atmosphere, they cause nuclear interactions that produce protons. Proton particles have a lighter nucleus, lower linear energy transfer (LET), and are positively charged.

Although the LET is lower, protons can cause indirect ionization via nuclear reactions with semiconductor material. When protons collide with semiconductor material, they can cause a higher LET secondary ion (known as a recoil ion), which can have enough energy to cause a bit flip.

Protons are abundant in the inner and outer Van Allen radiation belts. The stronger inner belt resides 370 – 620 miles above the earth’s surface. Protons are not considered a significant concern for SEU in ground-based systems.

Figure 3 Proton particle striking silicon substrate shows spallation and generates a recoil ion, which has ionization along its path depositing charge, potentially impacting the transistor state. Source: Efinix

3. Neutrons

Neutrons are another secondary radiation particle created by cosmic rays. Like protons, neutrons are created when cosmic rays hit the earth’s atmosphere and cause nuclear interaction. Compared to protons, neutrons are slightly heavier, have a higher LET, and are neutral in charge.

Neutrons also collide with semiconductor material causing secondary high LET recoil ions, which carry a strong enough charge to cause an SEU. Neutrons have also a higher penetration value and can pass through common building materials like concrete.

At commercial aviation altitudes, the number of neutrons in the atmosphere is approximately 300 times higher than at sea level. Although ground-based systems are not as exposed, neutron-induced soft error rates are still a growing concern for data centers and industrial systems operating high-density FPGA arrays.

Figure 4 Neutron particle striking silicon substrate shows spallation and generates a recoil ion, which has ionization along its path depositing charge, potentially impacting the transistor state. Source: Efinix

4. Alpha particles

Alpha particles are a terrestrial particle caused by trace radioactive element decay in silicon packaging materials. Packaging materials contain uranium and thorium in chip packaging and solder bumps. When the trace radioactive element decays, it produces helium nuclei alpha particles.

Alpha particles have a light nucleus, high LET compared to neutrons and protons, and are positively charged. They have a very low penetration value. However, because the packaging materials are very close to the silicon substrate and because of their higher LET, alpha particles can cause SEUs in FPGAs.

Alpha particles in packaging were the original source of DRAM soft errors found in 1978. Since then, manufacturing improvements for packaging materials have helped reduce the probability of high LET alpha particles due to radioactive decay.

Figure 5 Alpha particle emitted from radioactive decay in the package and depositing a charge along its path can impact the transistor state. Source: Efinix

SEU challenges in FPGA architectures

An SEU event can impact several resources within the FPGA architecture, including configuration RAM (CRAM), look-up tables (LUTs), routing, registers, and embedded memory (block RAM). However, a bit flip may or may not impact the design’s functionality.

• In unused resources, a bit flip will not affect the functionality.
• In resources used for non-critical functions (like test circuits, image/video signal processing, or audio data), a bit flip may not impact the design significantly.
• A bit flip in mission-critical systems, like flight control, defense systems, medical systems and energy grid systems, can have serious consequences.

The following subsections describe how SEUs impact the most vulnerable FPGA resources: CRAM, routing, LUTs, registers, embedded memories, and the broader design functionality that depends on their correct operation.

Configuration RAM (CRAM)

From an architecture perspective, SEUs in FPGA CRAM have the most negative consequences. Unlike a processor or ASIC, where logic behavior is fixed in silicon, an FPGA’s function, including routing connections, logic functions, and I/O standard settings, is defined by the CRAM contents. When the FPGA powers up, the CRAM is programmed with a specific bitstream for a specific application.

The function is expected to remain constant. The CRAM controls settings related to routing, LUTs, and configuration of hard IP like transceivers and DDR controllers that are now a part of most FPGA architectures. CRAM SEUs are persistent compared to data path storage elements and can go undetected without built-in detection circuits.

Routing

FPGA routing connects logic, embedded memory, set/resets, and I/O to and from the programmable fabric. A high percentage of the CRAM is dedicated to routing.

A flipped routing bit could lead to a disconnect on a signal path, set/reset path, or clocking path where clock trees are more flexible via configuration of the FPGA. In addition to disconnects, a routing upset could unintentionally merge two independent signal nets, resulting in driver contention, illegal voltage logic levels, and logic corruption.

LUTs

LUTs are an FPGA’s fundamental logic primitive, each implementing an arbitrary Boolean function of four to six inputs. The truth table values are stored in CRAM. Compared to routing, a lower percentage of the CRAM is dedicated to programming the LUTs.

An SEU in CRAM that impacts an LUT alters the truth table and can result in unanticipated results for a specific input state. For example, in a 4-input LUT, inputs of 1010 may be configured to output a 1. An LUT bit flip at address 1010 results in an output of 0, which could be a similar result for another combination of inputs, resulting in a missed condition or trigger, or incorrect control state calculation.

An unexpected bit flip can result in logic that enables an external I/O tri-state, or changes a voltage setting, drive strength, or termination, resulting in external I/O conflicts, poor signal integrity, and potential damage to other board components.

Registers

Registers are fundamental elements within FPGA architecture. They can be used as up/down counters, store control states, store status, and pipeline or buffer data. Registers do not have a persistent state if they are clocked and are not loaded from CRAM. Therefore, a register bit flip can be benign if it’s buffering non-critical data.

The corrupted data may make its way downstream and have no consequences. Incoming correct data to the register is then loaded on the next clock cycle. However, a bit flip in a state machine could put the state machine into an unknown state, freezing the design’s functionality or triggering an unintended action. A status register bit flip could trigger a similarly unwanted action.

Embedded memory (block RAM)

Block RAM is like a register in terms of SEU impact. A bit flip may not persist, depending on the functionality (look-up table, data buffering, or soft processor memory). Block RAM is not loaded from CRAM but can be initialized when you program the FPGA with a bitstream. If not initialized, the block RAM contents are 0 after the FPGA enters user mode.

Block RAM stores values that the design actively reads, writes, and depends upon during normal operation. The consequences of a bit flip depend on the block RAM use. For example, a bit flip can propagate downstream in video, image, or audio buffering applications without harm.

However, a bit flip within a stored soft processor program may have consequences like a control register where the executing software may branch to an unexpected area of code. A bit flip in block RAM that stores DSP coefficients can lead to a computational error that manifests itself as inaccurate results for an AI LLM or persistent unwanted noise in a filter.

SEU impact on FPGA functionality

The cumulative effect of uncorrected SEUs across CRAM, routing, LUTs, registers, and block RAM is a gradual and silent degradation of the design’s integrity. A single SEU could lead to a hard failure immediately but usually it will be unambiguous. Accumulated SEU failures follow a probabilistic profile.

The first upset may be functionally insignificant, the second may alter behavior in a rarely exercised path, and the third may corrupt a critical state register in a way that cascades into a system-level failure. This accumulation without detection or a means to correct it can result in increasing failure probability over time.

Mik Ichiba is principal field applications engineer at Efinix. He is a seasoned semiconductor and embedded systems professional with more than 30 years of experience spanning hardware architecture, PCB design, ASIC development, FPGA architecture, and system-level engineering. Throughout his career, Mik has worked across the hardware design lifecycle, helping organizations translate complex technical requirements into practical, high-performance solutions.

Editor’s Note

This is Part 1 of the mini-series about SEU challenges in FPGA architectures. Part 2 will cover SEU detection, recovery, and validation for FPGA applications that require robustness and predictability in ground-based and terrestrial applications.

Related Content

• Using FPGAs in mission-critical systems
• Rethinking the Logic-Routing Tradeoff in FPGAs
• Understanding Single Event Effects (SEEs) in FPGAs
• Enhancing robust SEU mitigation with 28-nm FPGAs
• Learn about SEU Immunity in Terrestrial FPGA Applications

The post FPGA architecture: Radiation particle types and single event upsets (SEUs) appeared first on EDN.

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