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The Defence Research and Development Organisation (DRDO) has put EW (Electronic Warfare), digital twins and mission critical systems as the focus for its NETRA-2026 national seminar held in Bengaluru. As representatives from Armed Forces, DRDO, ISRO and industry and academia met on August 11 and 12 to deliberate over future battlespace-enabling technologies, emerging technologies like EW and RF systems, AI, next-gen radar, FPGA design, digital engineering, modelling and simulation took centre stage for discussion. These technologies are finding an increasing inter-relationship in present-day combat platforms where dominion of the electromagnetic spectrum is crucial in determining operational capability of not just sensors and communication, but also weapon systems.

In fact, electronic warfare, or EW, is playing an increasingly important role in a way in military activities since warfighting is getting to lean more and more towards combatting with and around networked systems, radar, and the use of wireless signals. EW includes the capability of using EM-spectrum visibility and analysis (EVS/A) and threat awareness, together with such capabilities as electromagnetic countermeasures (ECM). Providing digital models and mission-critical design can thus demonstrate how complicated networks can be tested without their being produced.

NETRA-2026 clearly indicates the DRDO’s emphasis on establishing technological building blocks to prepare for a network centric, AI-enabled and electronically contested battle scenario where informational and electromagnetic advantages are as significant as conventional firepower.

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India’s Electronics Component Manufacturing Scheme (ECMS) has green lighted the setting up of 31 new projects with a proposed investment of Rs 7,877 crore – taking it one step closer to increasing India’s footprint in electronic goods production and cutting import dependence. New sanctions reported on August 17, 2026. The new proposals are expected to drive production worth over Rs 82,243 crore and create nearly 10,000 direct jobs spread across ten Indian states.

The development is extremely beneficial to India’s defence electronics ecosystem. This includes the defence, radar, avionics, surveillance, electronic warfare, communications and unmanned systems sectors where indigenous and secure supply of components would add to the robustness of their systems.

The latest projects cover a broad range of components, including capital goods, camera and display modules, connectors, anode materials, enclosures, antennas, rare-earth permanent magnets, speakers and microphones, and metallised films for capacitors and coils. These components can support multiple high-technology industries, including defence, telecommunications, automotive, industrial electronics and aerospace.

The recently issued approvals for ECMS can hence be viewed both as a defence electronics manufacturing policy as well as a nascent strategic industry-capacity development program. With rising India defence production and exports, a deeper electronics supply chain would help India realise its ambitions of becoming a manufacturing and innovation hub by design.

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Indrajaal Autonomous Defence Systems and Sigma Advanced Systems have received government orders totalling around Rs 155 Crore for Indrajaal Ranger, a mobile drone patrolling vehicle for use at the border, in urban areas, and other places to tackle threats that need quick and agile response. This moves the counter-unmanned aerial system (C-UAS) away from static security measures at military bases. The companies stated that around 145 Crore of the current orders would be used for border security, while another order of Rs 10 Crore will be used for VVIP protection and other security scenarios.

The Indrajaal Ranger drone is a mobile counter-drone system capable of detecting and fighting unmanned aerial threats. Indrajaal Ranger is mobile and can function in multiple terrain sand condition, making its induction in this era a necessary step, as drones are becoming increasingly ubiquitous. Mobile platforms help security personnel to effectively deploy anti-drone solutions wherever needed, such as for guarding the borders, VVIP corridors, critical infrastructures and cities, unlike a stationary counter-drone facility.

The development also underscores the rising influence of Indian private sector enterprises in the country’s counter-UAS landscape, with the new order poised to accelerate the adoption of mobile counter-drone technology from exploratory defence platforms to broad operational use to improve both detection and reaction time to low-altitude threats.

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India’s Ministry of Defence signed a contract worth Rs 1,943 Crore with General Atomic Aeronautical Systems Inc. Of the US for leasing of two unmanned remote piloted aircraft systems (remotely piloted aircraft) or drones- the MQ-9B Sea Guardian High-Altitude Long-Endurance (HALE)- for Indian Navy on July 17, 2026, for 30 months. The purchase marks a boost to India’s maritime surveillance capabilities.

The long-endurance unmanned aerial vehicle MQ-9B Sea Guardian is suited to sustained ISR operations, and its endurance and sensor load would allow it to monitor large areas of the ocean and help with India’s maritime domain awareness needs. The leased platforms will give the Navy added airborne surveillance capability without the need to purchase permanent platforms immediately. They also arrive at an interesting time, with India pushing the observation of the Ocean area, where long-range UAVs would allow constant monitoring.

The lease also comes against the backdrop of India’s wider use of the MQ-9B technology and systems. Previously in 2024 itself, India has separately contracted for 31 MQ-9B Sky/Sea Guardian RPAS for its military operations. This further leasing underlines India’s increased use of HALE unmanned systems for routine sea-based surveillance, intelligence gathering, and strategic assessment.

The post India Seals Rs 1,943 Crore Deal With General Atomics for Two MQ-9B Sea Guardian Drones appeared first on ELE Times.

​With EV manufacturers aiming to boost the vehicle’s travel range, fast-charging capabilities, and powertrain efficiency, semiconductor technology is becoming an important part to the development of electric vehicles. Bosch’s third-generation silicon carbide (SiC) semiconductors, developed to enhance the efficiency and performance of EV power electronics, is an achievement in India’s electric-mobility ecosystem. Sample chips are currently shipping to global automakers for testing, with full commercial market availability targeted for 2027.

20% Higher Performance

Bosch’s third-generation Silicon Carbide (SiC) chips support advanced dual-channel trench architecture, a specialised transistor design that improves current transmission efficiency and the overall system power-conversion efficiency by lowering down the resistance and loss during device switching. The chips are designed to meet the demanding power-efficiency and performance requirements of modern electric vehicles.

This technology offers around 20% more performance than the previous generation of chips. According to Bosch, its SiC technology should help to boost the driving range, battery utilisation and reduce the overall cost of ownership to owners of EV vehicles.

Silicon carbide technology can reduce power loss for the energy conversion process and thus can increase the power efficiency. The reduction of loss can also decrease the generation of heat inside the inverter, lowering the system’s cooling requirements.​

Supporting India’s EV Ecosystem

The introduction is particularly relevant as Indian automakers and component suppliers increasingly localise EV technologies and develop higher-efficiency powertrains. Advanced semiconductor devices such as SiC MOSFETs can play a key role in this transition by improving inverter performance without requiring proportionally larger battery packs.

The post Bosch’s Third-Generation SiC Chips for India Set to Boost EV Efficiency and Driving Range appeared first on ELE Times.

​Mahindra & Mahindra has introduced its latest BE 6 SPORTEQ electric SUV in India, bringing a new set of AI features and connected technology that works efficiently with its software-powered EV. Launched on August 15, the new series represents an effort to introduce advanced AI features with upgradable software rather than relying on conventional hardware improvements.

To provide an immersive experience, Mahindra has introduced a new feature named TEQ_Talk for the BE 6 SPORTEQ. It’s a conversational AI assistant developed in collaboration with Google Cloud using Gemini technology. According to Mahindra, it integrates 17 specialised AI agents and offers over 100 functions for vehicle controls, navigation, music, applications etc. Through this, drivers can talk to their car like a real person instead of being confined to a specific set of voice commands.

Another area of emphasis is the BE 6’s software-defined vehicle architecture. Mahindra claims that the vehicle will continue to improve after sale through software. From January 2027, further SPORTEQ features will be launched in phases, with access subject to the specific model and variant.

Software plays a part beyond infotainment. In the new BE 6 SPORTEQ, for example, are Drift Mode and Acceleration Boost that can modify performance and handling, and the Digital Car Key. For example, Drift Mode and Acceleration Boost that can modify performance and handling and Digital Car Key. These enable owners to unlock and access vehicles with their smartphones and similar devices.​

The BE 6 SPORTEQ represents an extension of a bigger trend in the Indian EV market – technology areas, beyond batteries and the powertrain, such as artificial intelligence, cloud connectivity, OTA and software-define architectures (SDAs), are gaining more consumer attention and opening new avenues to deliver continually enhanced features over the automobile’s usage life to customers and car manufacturers.

The post Mahindra BE 6 SPORTEQ Brings AI and Software- Defined Technology to India’s EV Market appeared first on ELE Times.

As a long-time analog-component and circuit “practitioner,” I view the schematic diagram as the starting point for almost any discussion of a design. It shows the signa flow, the primary ICs, other necessary but often underappreciated passive and active devices, the connectors, power source and distribution tree, and much more.

I sat down with the late circuit genius and prolific EDN contributor Jim Williams many years ago. See “This 30-ppm scale proves that analog designs aren’t dead yet” for just one of the many circuits he devised and explained in his articles published at EDN. As I sat down with him, he literally sketched out and talked through a clever yet conscientious design in real time; it was a master class in circuit explanation and exposition.

But lately I’ve been wondering to what extent we still need these schematics. In the era before large-scale analog ICs, a schematic was not only a diagram of what connected to what, but also a debug and troubleshooting guide. You could follow the signal flow from stage to stage, and separate the stages if needed, to see if a stage’s output corresponded correctly to its input.

A classic six-transistor AM-radio schematic makes this very clear (Figure 1).

Figure 1 This classic six-transistor AM radio has no processor, and its schematic diagram shows a linear signal flow from left to right, with RF stage/local oscillator, IF amplifiers, audio-stage driver, and audio power amplifier. Source: All American Five Radio

Things have changed; that’s for sure. Many electronic circuits now consist of a central processor, often with integrated analog I/O, plus perhaps a specialized network or other processor IC, along with connections to I/O including switches, displays, indicators, and similar. In other words, what we really need is an interconnection wiring diagram rather than a stylized schematic.

Consider a representative analog measurement function for an optical module for heart rate and blood oxygen (SpO2) measurement. Early units used a handful of individual devices, starting with the LED and its driver, going across to the phototransistor and its preamp, and then the rest of the signal chain that captured, conditioned, and digitized the output to show the relevant reading.

Now, the needed functions are largely integrated into a single IC such as the Analog Devices MAXM86161A, which includes the LED drivers, photodetector amplifier, analog and analog/digital functions, optical cancellation circuity, and I2C interface (Figure 2). All that’s missing is the user display, LED and photodetector, a soft on/off switch, and battery, plus a few capacitors and pullup resistors.

Figure 2 The MAXM86161A IC provides electro-optics for heart rate and blood oxygen monitoring, incorporating electrical and optical-friendly features. Source: Analog Devices

So, a product schematic diagram consists primarily of connections to that IC (Figure 3).

Figure 3 A highly integrated, tightly focused IC such as the MAXM86161A does not need many I/O connections. Source: Analog Devices

For this modest medical device, a hybrid block diagram/partial schematic is actually more informative, as it shows smaller-scale ICs with an independent processor (Figure 4).

Figure 4 A blend of conventional schematic diagram and high-level block diagram provides insight into system functionality and overall circuit action. Source: Microchip Technology

In many cases, the wiring diagram rather than the formal schematic is often of more use. When my microwave oven died, I opened the front panel out of curiosity and found both of those diagrams tucked inside (an unexpected but pleasant surprise). The below schematic (top) doesn’t really show what the wiring diagram clearly does (bottom). The innards are really a “mystery” control module with lots of connectors for keypad, display, safety interlock switches (lots of those), thermal overload switches and, of course, the magnetron tube that makes it all possible.

 

Figure 5 You can be the judge of which is more useful: the schematic diagram (top) or the wiring diagram (bottom) of this consumer microwave oven. Source: GE Appliances

Making it right

A good schematic tells the story of a design and shows how the different functional blocks relate to each other. For a not-so-good example, consider the one of Figure 6, also a heart rate and SpO2 monitor. It may have all the facts, but it certainly doesn’t tell the story at all.

Figure 6 This schematic of a heart rate and SpO2 monitor may be correct, but it’s hard to say; even if it is, it’s not very useful. Source: ResearchGate

It seems unnecessary to restate the obvious, but the guidelines for a good analog-centric schematic are simple. I have seen schematics from students which miss these points:

• Have signal flow from left-to-right to the extent possible.
• Use meaningful net names such as GND, SPI_CLK, SENSOR_OUT; designation such as Net_25 mean little. Even the circuit’s creator won’t remember these a few months later.
• Group components by function, such as power, processor, sensors, and interfaces. My personal peeve is when all the bypass and bulk capacitors—and there can be dozens—are clustered in one corner of the schematic connected between the power rail and ground, without any indication of which IC a particular capacitor is supporting. That may be electrically correct, but it’s terrible in terms of the story, and useless for the inevitable debug and troubleshooting process.

But wait…there’s a counter to the story

On one side, the increasing use of large-scale analog-centric ICs with 40, 50, or more contacts is changing the function of the schematic diagram. Does this mean that conventional schematics are going the way of the six-transistor radio?

That was my fear, but then I realized I was only looking at the situation through one end of the telescope, so to speak. If today and the future are all about highly integrated, multifunction analog-centric ICs, why do vendors collectively release hundreds of single-function analog ICs every year (and that’s doesn’t include the countless power discrete devices, controllers, and management devices)?

Three examples show the reality. There’s the Analog Devices ADG2712 quad SPST switch (top), the Texas Instruments LVx886 zero-drift, low-noise op amp with multiplexer-friendly inputs (middle), or the STMicroelectronics TSC1801 current-sense amplifier (bottom) shown in Figure 7.

Figure 7 Despite the trend towards much highly integrated analog ICs, vendors still introduce many small, single-function ones such as this quad SPST switch, specialized low-drift op amp, and current-sense amplifier. Source: Analog Devices, Texas Instruments, and STMicroelectronics

Each one of these implements a basic function that is essential yet would be difficult, if not impossible, to implement with the needed performance in a larger multifunction IC. In most cases, doing so would require excessive compromise in one or more parameters such as leakage, bias current, on resistance, drift, and stability. It’s a long list. By offering single-function analog ICs, the compromises related to process, design, packaging, and cost are minimized or at least easier to manage.

Of course, once you have a circuit with these components, you’re going to need a real, story-telling, signal-flow schematic. So maybe I am too worried.

What are your thoughts about the future of schematic diagrams? Will it fade away, morph somewhat, become an entirely new technical entity? Or will it remain pretty much as-is?

Bill Schweber is a degreed senior EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features. Prior to becoming an author and editor, he spent his entire hands-on career on the analog side by working on power supplies, sensors, signal conditioning, and wired and wireless communication links. His work experience includes many years at Analog Devices in applications and marketing.

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The post Do we still need schematic diagrams for analog circuits? appeared first on EDN.

ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for electronics manufacturing, will present its latest solutions for the intelligent factory at Productronica India in Bengaluru from September 16 to 18, 2026. The highlight at Booth H4.E11 will be the launch of the new SIPLACE V placement platform in India. Visitors can also experience a live demonstration of large BGA placement for AI server applications on the SIPLACE SX, complemented by the highly precise DEK TQ printer. Software solutions for monitoring, managing and optimizing SMT production are another focus of the presentation.

Up to 30% more real performance

Developed from the ground up, the SIPLACE V combines significantly higher real performance with flexibility, process excellence and long-term investment protection. A new machine architecture with a highly rigid frame, efficient linear drives and high-resolution measurement systems enables higher acceleration and shorter non-productive movements. Under real production conditions, the platform achieves performance gains of up to 30 percent in key electronics manufacturing sectors. At Productronica India, ASMPT will demonstrate the SIPLACE V at a benchmark placement rate of more than 52,000 components per hour. Single- and dual-lane configurations, Smart Pin Support and compatibility with existing SIPLACE X feeders give manufacturers considerable flexibility in configuring the platform. High-resolution vision systems, individual component inspection and closed-loop sensor technology help ensure consistently high process quality even at high placement speeds. Also on display is the SIPLACE Measuring Feeder, which measures electrical component properties before placement.

Ready for AI server boards

A second live demonstration addresses one of the major challenges facing electronics manufacturers: the production of AI server boards. These combine extremely high component densities with increasingly large and heavy processor BGAs. Component dimensions of up to 150 × 150 millimeters and weights of more than 500 grams are no longer unusual. The SIPLACE SX at the booth will demonstrate the placement of large BGAs for AI server applications. The proven platform can be equipped with the TWIN VHF placement head for large and heavy processor BGAs, while its heavy-duty conveyor handles boards weighing up to ten kilograms. SIPLACE Smart Pin Support automatically positions support pins to prevent large boards from bending during placement. The DEK TQ printer complements the AI server presentation with solder paste printing for large-format boards.

Intelligent data use increases yield and performance

“We boost your intelligent factory” is ASMPT’s key message at Productronica India – and the presentation extends well beyond hardware. The WORKS Software Suite demonstrates how software can make production processes more transparent, support operators in their daily work, and help manufacturers make better use of production data. Real-time production KPIs make deviations and trends visible at an early stage. Combined with data from SPI and AOI systems, AI-based analysis helps identify the causes of printing and placement process deviations, automatically optimizes the printing process, and provides concrete recommendations for improving the placement process.

Additionally ASMPT will showcase its Factory Solutions, with SMT Analytics demonstrating how intelligent data use can help increase yield and performance. Another highlight is the latest version of Virtual Assist, ASMPT’s AI-based expert system for onboarding, service and maintenance. Its enhanced AI chat function now enables a continuous dialogue, allowing users to ask follow-up questions and refine their queries. A new image-based spare-parts recognition function also identifies likely matches from a smartphone photo of a disassembled part. ASMPT will also present its new Customer Portal at the booth.

“With the launch of the SIPLACE V in India, our live demonstration production of AI server boards and our latest software solutions, we are showing how advanced hardware, software and intelligent data use work together in future-ready electronics manufacturing,” says Mr Neeraj Bhardwaj, General Manager for India, Bangladesh & Sri Lanka at ASMPT SMT Solutions India. “Electronics manufacturers need more performance and flexibility, but they also need to make better use of their production data and automate processes where it makes sense. That is exactly what we want to demonstrate at Productronica India.”

The post SIPLACE V Makes its India Debut appeared first on ELE Times.

NoMIS Power Corp of Albany, NY, USA — which was spun off from State University of New York Polytechnic Institute (SUNY Poly) in 2020, and develops silicon carbide (SiC) technologies for medium- and high-voltage power conversion — has demonstrated its first 6.5kV large-die SiC MOSFET. The device was measured at over 8kV blocking, 90mΩ on-resistance, and 55A drain current. The result extends NoMIS Power’s proven planar SiC device technology from its established 3.3kV devices into the high-voltage class, and establishes a clear, demonstrated path toward the company’s forthcoming 10kV MOSFETs and 20kV SiC IGBTs...

Space Forge Inc (which, as a branch of Space Forge Ltd of Cardiff, Wales, UK, operates from Florida’s Space Coast, using space as a unique laboratory environment to manufacture semiconductor materials that cannot be made on Earth) has signed a master research agreement with The Texas A&M University System, which sets the framework for a research collaboration and marks a first step towards Space Forge establishing its initial semiconductor materials manufacturing and processing capability in the USA...

Space Forge Inc (which, as a branch of Space Forge Ltd of Cardiff, Wales, UK, operates from Florida’s Space Coast, using space as a unique laboratory environment to manufacture semiconductor materials that cannot be made on Earth) has signed a master research agreement with The Texas A&M University System, which sets the framework for a research collaboration and marks a first step towards Space Forge establishing its initial semiconductor materials manufacturing and processing capability in the USA...

SweGaN AB of Linköping, Sweden — which designs, develops and manufactures custom gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers, based on proprietary growth technology — has closed a US$14m Series B round of financing led by Swedish investor Thisbe AB (part of the Wallenberg Investments ecosystem), Copenhagen-based venture capital firm North Ventures and existing shareholders. This brings total funding to US$41m...

SweGaN AB of Linköping, Sweden — which designs, develops and manufactures custom gallium nitride on silicon carbide (GaN-on-SiC) epitaxial wafers, based on proprietary growth technology — has closed a US$14m Series B round of financing led by Swedish investor Thisbe AB (part of the Wallenberg Investments ecosystem), Copenhagen-based venture capital firm North Ventures and existing shareholders. This brings total funding to US$41m...

💸 Державні гранти на навчання: як першокурсникам-контрактникам КПІ отримати фінансову підтримку KPI4U-2 пн, 08/17/2026 - 16:52

Reliance Industries and British aerospace and defence company Rolls-Royce have announced their strategic intent to partner on the design, development, manufacturing and delivery of a sovereign indigenous combat engine for India’s Advanced Medium Combat Aircraft (AMCA) programme. The announcement was made on August 14, 2026, marking a significant development in India’s efforts to build advanced aerospace and defence capabilities domestically.

Under the proposed collaboration Rolls-Royce’s expertise in Aerospace propulsion and gas-turbine technology would be teamed with Reliance’s industrial and manufacturing capabilities in India. In addition, the two parties propose to examine the feasibility of setting up a specialized Aerospace Gas Turbine Complex.

The combat engine is one of the most technically challenging elements of a modern fighter aircraft. Developing such an engine requires expertise in areas including high-temperature materials, compressors, turbines, combustion systems, cooling technologies, digital engine controls and advanced manufacturing.

Developing indigenous propulsion for the AMCA program can ease India’s future dependence on the international engine suppliers. It will strengthen the in-country capacity in India’s aerospace supply chain and contribute significantly to India’s long-term objectives of Atmanirbhar Bharat and defense-indigenization programs.

The partnership represents a potential shift from simply manufacturing or assembling imported propulsion systems toward co-development and indigenous technology creation. If successfully implemented, the initiative could strengthen India’s capabilities in high-thrust aircraft engines, create specialised aerospace manufacturing opportunities and support the development of domestic intellectual property.

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Bluetooth and Wi-Fi combine to untether smartphone-to-car connections…this time with a Google, versus Apple, angle.

Last month, I took apart a third-party adapter that aspires to augment Apple’s CarPlay interface with wireless connectivity between iPhone and vehicle.

This time, I’ll be disassembling the other adapter I’d mentioned at the end of late January’s initial conceptual coverage, in this case intended to wirelessly bridge between a car and an Android-based handset using Google’s Android Auto protocol.

But once again, the originally planned hardware target of my dissection attention isn’t what you’ll actually be seeing today. Initially, I’d planned on taking apart the v1 AAWireless unit, which I’d bought several years back in its original Indiegogo crowdfunding form.

But then I remembered that AAWireless had notably iterated the hardware (and associated software) design in-between that initial version and what ended up going into full production where it was sold and stocked not only by the manufacturer but also retailers like Amazon. AAWireless has already moved on to its second-generation product, in fact.

Supplier switcheroo, part 2

I didn’t want to further limit the project’s relevance by focusing on the rarer premier version of the first-generation offering (which put the company on the map, mind you, but still…). Instead, today you’ll be seeing the insides of this adapter (model BY969C).

It came from a company named “Vnilrgle” (believe it or not, and despite the user manual variously alternatively mentioning “TERUNSOIU”, or maybe that’s “TERUNSOIL”, as the supplier) and cost me a whopping $9.99 plus tax (with free shipping) from Woot in late February (versus listing for $48.87 on Amazon as I write this). Here are more stock shots to whet your appetite.

As you may have already noticed from one of them, this adapter model was of particular interest to me because of its low price, its quality construction (belying the $10 I paid for it), and its integration of NFC functionality, which aspires to simplify the initial setup process.

I’ll start out with shrinkwrap-inclusive front and back shots, as-usual accompanied by a 0.75′′ (19.1 mm) diameter U.S. penny for size comparison purposes, and revealing additional labeling.

The shrinkwrap-clinging stickers are absent from the now-clear-plastic-less backside photo that follows.

Time to open ‘er up.

Some literature bits (here’s an online version of the user manual).

And an optional-use double-sided sticker for, as I also said last month, adhering the wireless adapter to the vehicle interior.

As with its Apple CarPlay-supportive predecessor, this one includes a USB-A-to-USB-C adapter.

And here is today’s patient standalone, viewed from top.

Bottom.

Cable-entry point.

And cable connector-end perspectives.

Sh-sh-sh-shattered

(Obligatory admittedly-obscure-to-at-least-some section header reference)

Now to get inside. You’ve likely already noticed the gap between the silver-color circumference of the device body and the clear flat regions, both of which I’d assumed were made of plastic (for NFC reception reasons). My attempts to insert a spudger were unsuccessful, however.

So, I stuck the device in my vise (see what I did there?) in preparation for an attempted hacksaw-cut of one side. Oops.

I guess that’s glass, not plastic. And I won’t be using this device post-teardown. Onward.

Now for the other side, with tap-assistance from a ball peen hammer.

See those four screws? Not anymore, you don’t.

And with them removed, we have achieved liftoff.

An “Ultra” foundation for the fortunate

Let’s look first at the PCB underside (based on a device orientation assumption that places the product logo on the NFC antenna “top” side, with the marking minutia on the “bottom” side).

At left in the three-area-dominant IC row is the system processor. I mentioned last month, generally speaking about the wireless Android Auto and/or CarPlay product category, that “these are commonly Arm-based”. Judging from the markings on top of this one, there’s no doubt as to whose CPU core(s) is/are inside.

I’d even go so far to guess Cortex-A7 in generation. But who makes it? A search on “BU2025021” brought up bupkis. And the only reference I found to an “A7 Ultra” was associated with this Vanzen dual Android Auto-plus-CarPlay wireless adapter.

Although…”Cotex”?

Anyhow, to its right is the presumed serial-interface (therefore eight-lead package) firmware storage NOR flash memory, from GigaDevice and marked as follows.

AP2133
5F1GQ5UEY1H
UG5131

“1G” is suggestive of a 1 Gbit capacity, but I can’t find a direct reference to the IC anywhere online; reader assistance is welcomed! GigaDevice also makes Arm-based SoCs, by the way, so the company also acting as the source for the “A7 Ultra” wouldn’t be a complete surprise to me.

If you’re wondering (assuming my guess is correct) why 128 Mbytes of storage is necessary to implement a seemingly elementary device like this, my answer is two-fold albeit related.

• It doesn’t just handle Android Audio protocol and USB-to-wireless bridge functions
• And that capacity isn’t solely devoted to code

Turns out there’s also a web server (and pages) running inside the device, used for firmware-update and broader technical support-outreach functions, as this user manual page documents.

In fairness, circling back for a moment, the CarPlay adapter I took apart last month offers similar capabilities. I finally dug up an online version of the user manual for it; here’s the relevant page.

What’s the frequency, Kenneth?

(Another obligatory admittedly-obscure-to-at-least-some section header reference)

Finally, at far right is the wireless communications subsystem, based on the AIC8800DC40 controller from AICSemi, a company previously unknown to me, and surrounded by embedded Wi-Fi and Bluetooth antennae. Once again referencing last month’s writeup, I’d written the following.

Two wireless broadcast links are necessary: 2.4 GHz Bluetooth for initial setup, and Wi-Fi for ongoing streaming. The latter is usually based on the 5 GHz band for higher transfer bandwidth, since range isn’t a concern in a diminutive vehicle interior.

But in that teardown, I’d only found one antenna, suggestive of Bluetooth-plus-Wi-Fi shared usage, therefore 2.4 GHz-only system functionality. And this time, a datasheet I found online for the AIC8800DC40 suggests that it has 2.4 GHz-only Wi-Fi capabilities, even though the device documentation makes the following claims.

Wi-Fi Bluetooth module frequency:
Bluetooth 2.4 GHz, Wi-Fi 2.4-5.8 GHz

So… In search of clarity, I went looking for an FCC ID, which I hoped would lead me to definitive certification documentation. Believe it or not, nowhere related to last month’s patient—packaging, literature, or device itself—had I been able to find an FCC ID reference, or even a product name that might indirectly point me to my desired certification-data prize. Here’s what Google AI Assistant rightly said in response to my search query on “WOLIOS carplay adapter FCC ID”.

The WOLIOS wireless CarPlay adapter does not have an official, dedicated FCC ID registration tied directly to the “WOLIOS” brand name. Budget-friendly online resellers like WOLIOS often rebrand generic white-label factory units (such as common smart dongles) that may display general CE/FCC compliance claims or use an unverified label rather than maintaining an authentic, searchable filing in the FCC ID Database.

Alrighty, then. This time I at last had a valid model code, BY969C. With it, I tracked down the FCC ID (2A5XO-BY969D), which as it turned out covered a variety of products with different model numbers, physical appearances and both Android Auto and CarPlay support, suggestive of common hardware differentiated via firmware. And yes, both 2.4 and 5.8 GHz beacon support.

Speaking of antennae, and in closing, let’s now flip the PCB over to its topside and more closely check out that NFC subsystem.

Sequentially detaching the antenna from the PCB, both from connector and adhesive perspectives, and then peeling off its accoutrements, results in the following image sequence.

Note the LED that shines through the NFC antenna center “hole” and out the top of the device.

And now to dispense with the foam (at least most of it) between the double-sided sticker and antenna itself.

A Google search on the “BY969-LS-V01-NFC-HXW” product code stamped on top of the NFC antenna was of no help whatsoever. Alas. Unless, that is, I’m mistaken and it’s actually a Textured Johnny Collar Sweater Polo from Original Penguin by Munsingwear, sold by (but sold out at, as I type this) J. Crew Factory stores.

With that final bit of silliness out of the way, I’ll wrap up for today. Sound off in the comments with your thoughts on Rolling Stones or R.E.M. songs, men’s sweaters or anything else discussed in this piece!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

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What’s New?

Ather Energy, one of India’s leading electric two-wheeler manufacturers, announced the introduction of its new Ather 450X Overtones Series in Nepal, expanding its product portfolio in the company’s earliest international market. Alongside the new 450X Overtones, Ather is also taking its latest technology and ride experiences to the market, with Magic Twist, Infinite Cruise and Voice on Ather, now available on the 450 Series in Nepal.

What Senior Employee of Ather Company said?

Speaking on the occasion, Ravneet Singh Phokela, Chief Business Officer, Ather Energy Limited, said: “Since we entered Nepal in 2023, we’ve seen a strong response to Ather, and that’s translated into incredible growth for us in the market. We’ve significantly expanded our footprint, built out our retail, service and charging network, and grown the portfolio from the 450 to include Rizta. The 450X Overtones Series further strengthens that portfolio, bringing a fresh take on the 450, giving customers more choice while carrying forward some of the latest technologies shaping the Ather experience today. We’re looking to build on that momentum, and Nepal remains a market we’re committed to growing steadily over the long term.”

Ather entered Nepal in November 2023 with the 450 Series, marking its first international market. Since then, the company has built out its presence across the country through 14 experience centres and 31 fast charging points via its national distributor, Vaidya Energy Pvt. Ltd. In 2025, Ather added the Rizta to its portfolio in Nepal, bringing a family-focused offering centred around comfort and convenience. The introduction of the 450X Overtones now further expands the 450 Series offering in the market.

The new 450X Overtones brings a fresh design treatment to the 450, with a tone-on-tone finish across three colourways: Still White, Space Grey and Lunar Grey. Different textures and finishes across the scooter accentuate its form while retaining the distinctive design and performance-focused character of the 450 Series.

Alongside the new design, the 450 Series in Nepal now features technologies such as Magic Twist, Infinite Cruise, as well as Voice on Ather, which was recently rolled out in India. Magic Twist allows riders to decelerate by twisting the throttle backwards, using regenerative braking to slow the scooter while recovering energy. Infinite Cruise helps maintain a consistent speed with reduced throttle input, while Voice on Ather, powered by AtherStack 7.0, enables riders using a compatible Bluetooth headset or smart helmet to use voice commands for functions such as navigation, locating charging stations, and controlling supported scooter settings.

Ather has continued to build out its presence in international markets. In Sri Lanka, the company now operates 42 experience centres. This sits alongside a network of 715 experience centres in India, as the company continues to scale its presence market by market.

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India’s electric vehicle industry is rapidly emerging as a significant force in the global automotive market, with electric car exports reportedly reaching approximately $369 million in Q1 2026. This development signals a new phase for India’s EV sector, positioning domestic manufacturing increasingly for international markets.

Sharing his optimism regarding the e-mobility segment in India, Dr. Rajeev Mishra, President, IFEVA (International Federation of Electric Vehicle Association), said, “Make in India is now evolving into Made in India, made for the World.” He highlighted the growing potential of India as a global electric mobility manufacturing and export hub.

India as a Global EV Powerhouse

Dr. Mishra emphasised that India’s EV ambition should go far beyond increasing domestic EV sales. “India must transition from being an EV-consuming market to becoming a Global EV Manufacturing, Technology, Innovation and Export Hub. Our objective should be to build Indian EVs not only for India, but for the world.”

India’s next phase of growth, according to him, must focus on EV manufacturing, batteries, power electronics, components, charging infrastructure, testing and certification, R&D, software, skill development and global supply-chain integration. He further stressed the importance of collaboration between government, industry, MSMEs, startups, academia, research institutions, investors and international technology partners to build a globally competitive EV ecosystem.

“$1 billion quarterly EV exports should be the next milestone,” Dr. Mishra averred, calling for a clear national ambition of taking India’s quarterly electric vehicle exports towards $1 billion. He said achieving this target would require stronger localisation, world-class quality standards, technology innovation, competitive financing, robust testing infrastructure, global certifications and strategic international partnerships.

Europe Emerging as a Key Opportunity

Europe is becoming an important destination for Indian electric vehicles, driven by stringent emission regulations, the transition towards clean mobility and increasing demand for cost-effective and technologically capable EVs. India’s expanding manufacturing ecosystem, competitive production capabilities and growing localisation of EV components are strengthening its position in the international market.

Three Forces Driving India’s EV Export Momentum

Government Manufacturing Support: Policy initiatives and manufacturing incentives are helping strengthen India’s EV and advanced battery ecosystem while encouraging investment and localisation.

Atmanirbhar Bharat: Expanding domestic manufacturing and supply chains creates a stronger foundation for Indian and global automotive companies to manufacture in India and serve international markets.

Global EV Transition: As countries accelerate the shift towards electric mobility and diversify global supply chains, India has an opportunity to emerge as a major “China+1” manufacturing destination.

EVs Can Become a New Engine of India’s Growth

The growth of electric mobility can generate opportunities across manufacturing, engineering, electronics, batteries, software, charging infrastructure, logistics and associated services, while strengthening India’s foreign-exchange earnings and global industrial footprint. Dr. Mishra said the EV revolution can become an important pillar of India’s broader journey towards Viksit Bharat 2047, strengthening both economic and energy security.

Dr. Mishra reiterated IFEVA’s commitment to creating stronger platforms for industry collaboration, policy dialogue, technology exchange, skill development, investment facilitation and global partnerships in electric mobility. “The opportunity before India is not merely to manufacture more electric vehicles. The real opportunity is to make India one of the world’s most trusted destinations for electric mobility innovation, manufacturing and exports.”

The post India Must Target $1 Billion in Quarterly EV Exports: IFEVA President appeared first on ELE Times.

Following a “reality check” in 2024–2025, when sales of hybrid electric vehicles gained ground and battery-electric vehicles growth slowed temporarily, the xEV industry is regaining momentum, notes Yole Group in its report ‘Automotive Powertrain and Electrification 2026 – Focus on Power Electronics’. The market research firm estimates that xEV production is growing at a double-digit compound annual growth rate (CAGR) during 2025–2031 to about 70% of global light vehicle production, with battery-electric vehicles (BEVs) alone accounting for 33 million units. In turn, the xEV power device market is growing at a 14% CAGR to $14.5bn by 2031...