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Keysight’s new 170/250 GHz frequency extenders and calibration kit enable differential broadband testing for next-gen semiconductors and AI-era networks.

With the addition of 32-GHz, 43.5-GHz, and 54-GHz models, the R&S ZNB3000 series of vector network analyzers (VNAs) now covers a wider range of applications. The midrange family combines precision and speed in a scalable platform, extending RF component testing to satellite Ka and V bands and high-speed interconnects for AI data centers.

Beyond satellite and data center applications, the ZNB3000 also enables RF testing for 5G, 6G, and Wi-Fi. This makes it well-suited for both production environments and research labs working on next-generation technologies.

The ZNB3000 offers strong RF performance with up to 150-dB dynamic range and less than 0.0015-dB RMS trace noise. It also provides fast sweep cycle times of 11.8 ms (1601 points, 1 MHz to 26.5 GHz) and high output power of 11 dBm at 26.5 GHz. A 9-kHz start frequency enables precise time-domain analysis for signal integrity and high-speed testing.

Flexible frequency upgrades allow customers to start with a base unit and expand the maximum frequency later. ZNB3000 VNAs operating at the new frequencies will be available by the end of 2025.

ZNB3000 product page

Rohde & Schwarz 

The post R&S expands VNA lineup to 54 GHz appeared first on EDN.

Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal design lowers on-resistance. Package enhancements cut thermal resistance by roughly 15% and reduce inductance by about 50% compared with standard TO-247 devices. Rohm reports a 2.3× increase in power density in a half-bridge configuration, enabling the same conversion capability in nearly half the volume.

The 750-V and 1200-V devices target industrial power systems such as PV inverters, UPS units, and semiconductor relays, and are offered in half-bridge and common-source configurations. While two-level inverters remain standard, demand is growing for multi-level circuits—including three-level NPC, three-level T-NPC, and five-level ANPC—to support higher voltages. These advanced topologies often require custom designs with standard SiC packages due to the complexity of combining half-bridge and common-source configurations.

Rohm addresses this challenge with standardized 2-in-1 modules supporting both topologies, providing greater flexibility for NPC circuits and DC/DC converters. This approach reduces component count and board space, enabling more compact designs compared with discrete solutions.

Devices in the 750-V SC740xxDT series and 1200-V SCZ40xxKTx series are available now in OEM quantities. Samples of AEC-Q101 qualified products are scheduled to begin in October 2025.

Rohm Semiconductor 

The post 2-in-1 SiC module raises power density appeared first on EDN.

Parade Technologies’ PS8780 four-lane bidirectional linear redriver restores high-speed signals for active cables, laptops, and PCs. It supports USB4v2 Gen 4, Thunderbolt 5, and DisplayPort 2.1 Alt Mode, and is pin-compatible with the PS8778 Gen 3 redriver.

The redriver delivers USB4v2 at up to 2×40 Gbps symmetric or 120 Gbps asymmetric, TBT5 at 2×41.25 Gbps, and DP 2.1 UHBR20. It provides full USB4, USB 3.2, and DP 2.1a power management, including Advanced Link Power Management (ALPM). Its low-power design and Modern Standby support extend battery life in mobile devices and reduce energy use in active cables.

The PS8780 extends USB4v2 signals beyond the typical 1-m (3.3-ft) passive cable limit while maintaining full performance. When paired with a USB4v2 retimer between the SoC (USB4v2 router) and the USB-C/USB4 connector, it also lengthens system PCB traces. Operating from a 1.8 V supply, the device consumes 297 mW at 40 Gbps and just 0.5 mW in standby. Its compact 28-pin, 2.8×4.4 mm QFN package suits space-constrained designs.

The PS8780 redriver is now sampling.

PS8780 product page 

Parade Technologies 

The post Redriver strengthens USB4v2 and DP 2.1a signals appeared first on EDN.

Featuring 2.5-kV capacitive isolation, the Littelfuse IX3407B gate driver improves signal integrity and safety in motor drives, inverters, and industrial power supplies. The single-channel, galvanically isolated driver provides low propagation delay, high common-mode transient immunity, and enhanced thermal stability across switching frequencies and temperatures.

The IX3407B gate driver delivers up to 7 A peak source and sink current through separate output pins. Typical turn-on and turn-off times are 154 ns and 162 ns, respectively, with rise and fall times of 10 ns. It achieves 150-kV/µs common-mode transient immunity at 700 V.

Input supply voltage ranges from 3.1 V to 17 V, while the driver-side supply operates from 13 V to 35 V. TTL/CMOS logic compatibility with 3.3-V thresholds and input voltage tolerance up to VCC support a wide range of control logic devices. Active shutdown and undervoltage lockout safeguard against fault conditions.

The IX3407B is offered in a wide-body SOIC-8 package. Samples are available through Littelfuse authorized distributors.

IX3407B product page 

Littelfuse 

The post Gate driver boosts reliability in high-power designs appeared first on EDN.

The SRF3225TAP series of common-mode chip inductors from Bourns delivers reliable EMI suppression and noise filtering for automotive systems. Meeting AEC-Q200 reliability standards, these devices provide impedance values of 500 Ω and 1000 Ω at 100 MHz, with rated currents of 2 A and 1.5 A, respectively.

Designed with a shielded construction to minimize radiation, the inductors operate across a wide temperature range of -55°C to +150°C. They feature low 0.1-Ω DC resistance and are rated for 80 VDC, all in a compact 3.2×2.5×2.2-mm package that conserves board space.

These features make the SRF3225TAP series well-suited for protecting sensitive electronics, enhancing signal integrity, and improving reliability in noise filters and DC power lines across automotive, consumer, and industrial applications.

SRF3225TAP common-mode chip inductors are available now through Bourns’ authorized distribution partners.

SRF3225TAP product page  

Bourns

The post Chip inductors broaden automotive magnetics portfolio appeared first on EDN.

A Planet Analog article, “2N3904: Why use a 60-year-old transistor?” by Bill Schweber, inspired some interest in this old transistor and how it’s commonly used, and if any uncommon uses might exist. Here’s one we played around with.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The Linear Technology Application Note 47-D: “High Speed Amplifier Techniques” by Jim Williams offers an interesting side road to usual transistor use, where a typical fast pulse transistor is utilized in avalanche collector-to-emitter breakdown Vbceo to create sub-nanosecond pulses. The 2N3904 will work in this configuration, but requires a high voltage (>100 V) like the pulse transistor to reach the Vbeco breakdown, and produces a slower pulse, being a slower GP transistor.

A while back, I had measured the reverse breakdown of the 2N3904 base-emitter junction and noted the small area of negative resistance where the junction current reduces as applied reverse voltage increases (Figure 1).

Figure 1 Measurement of the reverse breakdown of the 2N3904’s base-emitter junction, showing a small area of negative resistance.

This base-emitter breakdown is much lower than the collector-emitter breakdown and might serve as a lower voltage version of the avalanche pulse generation method described in App Note 47-D.

A simple circuit was created with the 2N3904 emitter connected by a 100-kΩ resistor to a variable supply set to ~14 VDC. A shunt capacitance of 10 nF from the emitter to ground and a 50-Ω resistor from the collector to ground. Just two resistors, a capacitor, and the 2N3904 are all that’s required to create a simple relaxation oscillator (actually, the 50-Ω resistor isn’t required).

Figure 2 shows the result with the DSO AC-coupled blue trace, the relaxation voltage at the transistor emitter, and the DC-coupled magenta trace, the voltage across the 50-Ω resistor from the collector to ground (remember the NPN is upside down or inverted!).

Figure 2 Waveforms of the simple relaxation oscillator circuit with the AC-coupled blue trace and DC-coupled magenta trace.

The pulse across the 50-Ω resistor in Figure 3 shows the avalanche current in more detail, where this current is ~ 2 V peak across the 50-Ω resistor, or ~40 mA peak. This isn’t fast, however, the 2N3904 is a general-purpose (GP) transistor that is not intended for speed.

Figure 3 Avalanche current shown in more detail on the DSO, showing a ~40 mA peak.

Utilizing faster transistors such as the 2N2369 should produce narrower pulses with faster rise times. Whether these produce faster rise times and narrower pulse widths than in the collector-emitter avalanche breakdown method from App Note 47-D remains an experiment waiting for those interested. Intuition indicates the “normal” avalanche collector-emitter mode will be faster, though!

Anyway, I hope folks find this simple and unusual use of these old standby 2N3904 transistors interesting, I certainly did!!

Michael A Wyatt is a life member with IEEE and has continued to enjoy electronics ever since his childhood. Mike has a long career spanning Honeywell, Northrop Grumman, Insyte/ITT/Exelis/Harris, ViaSat, and retiring (semi) with Wyatt Labs. During his career, he accumulated 32 US Patents and, in the past, published a few EDN Articles, including Best Idea of the Year in 1989.

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The post Unusual 2N3904 transistor circuit appeared first on EDN.

Xerion Advanced Battery Corp of Kettering, OH, USA, which develops and manufactures next-generation battery components and critical minerals, is expanding its critical minerals refinement portfolio after recently demonstrating the capability to refine gallium. Xerion aims to develop the process on a commercial scale to support military and commercial applications, including the production and maintenance of critical defense platforms, as well as semiconductors. To demonstrate the feasibility of this technology, Xerion has been awarded Phase I funding from the US Defense Logistics Agency (DLA) under the small business innovation research (SBIR) program...

Infineon Technologies AG of Munich, Germany and ROHM Co Ltd of Kyoto, Japan have signed a memorandum of understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems and AI data centers. Specifically, the partners aim to enable each other as second sources of selected packages for SiC power devices, which should increase design and procurement flexibility for customers. In the future, customers will be able to source devices with compatible housings from both Infineon and ROHM. The collaboration should ensure seamless compatibility and interchangeability to match specific customer needs...

📰 Газета "Київський політехнік" № 33-34 за 2025 (.pdf) Інформація КП чт, 09/25/2025 - 15:00

“The Semicon India program has brought new energy to the ecosystem, signaling the government’s commitment to building a resilient and self-sufficient semiconductor value chain,” says Jose Lok, Product Category Director, Semiconductors, element14, in an exclusive interaction with the ELE Times under its exclusive series ‘Powering the Chip Chain.’ As India wrapped up its largest electronics and semiconductors carnival this month, we grabbed the hot seat to discuss some very pertinent issues with Jose, representing element14, a consistent feature of Global 500 Fortune companies, with its resounding presence across 140 countries, with over 125 company locations.

Reflecting on India’s journey in electronics and semiconductors, he says, “India’s semiconductor landscape is going through a remarkable transformation.” Underlining the impact of schemes like Semicon India, PLI, and DLI, he highlights the momentum contributed by these schemes to the wholesome electronics and semiconductor ecosystem of India. This is further coupled by India’s growing influence over the global supply chain as demand peaks back home across sectors like automotive, IoT, and industrial automation.

Making Access Easier and Efficient

In the interaction, Jose touched upon the critical challenges faced by the design engineers in developing new products. He says, “Engineers often face long lead times, difficulty sourcing small quantities for prototypes, and a lack of visibility into real-time inventory,” as he underlines the pain points.

He further adds that the company has made its business in India largely by addressing these pain points and making it easier for engineers in prototyping and R&D, including its intuitive e-commerce platform and an inventory of over 950,000 products from 2,000 leading suppliers.

Emerging Opportunities

Further adding to the impact of the government schemes, he says, “The increased momentum has translated into increased demand from OEMs and design houses. It’s also creating new opportunities for companies like ours to support emerging players with the right components, kits, and engineering resources.” Further, adding to the same, he emphasizes the visibility and structure offered by these to enable distributors like element14 to work more closely with the Indian engineers and also align their plans accordingly.

element14’s India Plans

Talking about the company’s India plans, he says, “For element14, India is a strategic growth market. It represents not just an opportunity to expand but to partner with a new generation of engineers and innovators.” He also sounds quite optimistic when it comes to India’s role in the global supply chain of semiconductors, as he underlines the growing demand for components across the globe in segments like automotive, IoT, and industrial automation.

Challenges in the Indian Landscape

Every company faces one or the other challenge when it comes to scaling in a given nation under certain circumstances. For element14, these remain to be infrastructure variability, diverse needs, and timely last-mile delivery, specifically in the remote areas. He says, “Strategically, the pace of policy execution and the need for talent development in chip design and testing are areas that will require continued focus.”

Find the Part-01 at “Exclusive Feature: “We’re Using AI to Help Us Make Better, Faster, and More Accurate Decisions,” says DigiKey’s Ken Paxton”

Changing Roles

Reflecting on how the nation’s stride in electronics manufacturing impacts the distributors, he says, “The expectation from distributors has shifted beyond just availability.” The distributors are today expected to provide better technical support, along with alternative prototyping options, and also better credit terms, enabling an end-to-end partnership in the product development cycle.

As Jose puts it, “As India moves toward becoming a global electronics hub, distributors must grow into enablers of speed, reliability, and innovation.”

As India’s semiconductor ambitions gather pace, element14 is positioning itself as more than a distributor. “Our focus in India and across Asia is clear. We want to support innovation in a truly end-to-end way, from the early stages of design all the way to mass production and beyond,” says Jose. At its core, he adds, the company’s goal is “to be a reliable partner for innovation, one that grows with our customers and helps them build what’s next.”

India’s semiconductor ambitions are backed by initiatives like the ₹76,000 crore ISM and the ₹1,000 crore DLI scheme, which focuses on fostering a strong design ecosystem. A critical part of this effort is ensuring design engineers get timely access to quality components. To highlight how distributors are enabling this, we present our exclusive series — “Powering the Chip Chain” — featuring conversations with key industry players.

 

The post The Semicon India program has brought new energy to the ecosystem: Jose Lok, element14 appeared first on ELE Times.

The semiconductor industry is entering a new phase where artificial intelligence is taking on some of the most complex aspects of chip development. With design cycles growing more challenging due to advanced system-on-chip (SoC) requirements, AI-driven design automation tools are proving to be a game-changer bringing higher productivity, improved performance, and faster time to market.

Rising in Complexity in SoC Development

Modern (SoC) has multiple functions integrated, making them huge optimization targets for power, performance, and area (PPA). Mock manual iterative style often cannot efficiently address design rule checks (DRCs), timing closure, and multi-block optimizations. That has created an ever-increasing demand for intelligent design solutions that can handle scaling design.

Productivity Gains Through AI-Optimized Workflows

According to industry evaluation reports, AI-enabled chip design platforms have shown transformative improvements. These reports demonstrate productivity improvements, speeding up design completion from more than five to thirty times over and reducing design rule checks (DRCs) by as much as 70%. Performances outcomes have also improved significantly, highlighting how AI can streamline bottlenecks that previously slowed down development.

Accelerating Time to Market

Products must be delivered on time in very demanding markets like display drivers, imaging solutions, and advanced electronics. This makes automated design optimization allow the engineering teams to focus on innovation rather than repetitive fine-tuning, ensuring that smarter, quicker, and more cost-efficient solutions reach the market.

AI for Competitive Edge

By implementing intelligent design automation, not only do companies improve their operations-oriented efficiency, but they also boost their actual competitive thrust. The concurrent multiple-block optimization of large (SoC) is turning into the strategic differentiator in markets where performance and speed to market define success.

Looking Ahead

AI-driven chip design automation has already gone beyond being a laboratory experiment it is fast becoming an orthodoxy in modern semiconductor engineering. The early adopters, foremost of them being Himax with Cadence’s Cerebrus Intelligent Chip Explorer, demonstrated astonishing gain in productivity and design quality. As more semiconductor companies embrace similar AI-driven platforms, the industry is poised to unlock new levels of creativity, reduce development costs, and accelerate the path to next-generation chips.

(This article has been adapted and modified from content on Cadence.)

The post AI-Driven Design Automation Boosts Semiconductor Productivity appeared first on ELE Times.

Largest-ever edition in Bengaluru underscores India’s journey to becoming a global electronics manufacturing hub

• Featured 50,194 visitors, unprecedented international participation of 6000+ brands from 50+ countries
• Targeted international pavilions and 2,000+ structured business matchmaking sessions transformed potential into partnerships with measurable commercial outcomes.
• Conferences bridged policy, manufacturing, and innovation divides, creating actionable pathways to India’s technological leadership rather than theoretical aspirations.

Electronica India and Productronica India 2025, held at the Bangalore International Exhibition Centre (BIEC), concluded three days of significant business engagement, industry discourse, and technological exploration. The trade fairs, featuring over 6000+ global brands from more than 50 countries and attracting 50,194 trade professionals, reinforced India’s expanding role within the global electronics manufacturing landscape.

Organised by Messe Muenchen India, these co-located trade fairs continue to serve as a strategic meeting point for the entire electronics manufacturing value chain, encompassing design, components, assembly, automation, embedded systems, and quality assurance. While established global entities leveraged the platform to consolidate their regional footprint, Indian manufacturers, Electronics Manufacturing Services (EMS) providers, and material suppliers actively showcased advanced capabilities, often with a view toward securing international export partnerships.

Government representation, including senior leadership from Karnataka – Shri. Rahul Sharanappa Sankanur, IAS, Managing Director, Managing Director Karnataka Innovation and Technology Society (KITS), Smt. Gunjan Krishna, IAS, Commissioner, Industries and Commerce Department, Government of Karnataka and Dr. Darez Ahamed, IAS- Managing Director, Guidance Tamil Nadu affirmed ongoing state-level commitments to cultivating electronics manufacturing hubs. Concurrently, dedicated international pavilions from Japan, Taiwan, and Germany were prominent, solidifying the show’s reputation as a key gateway for international enterprises seeking to engage with India’s dynamic ecosystem.

The facilitated Buyer-Seller Forum proved highly effective, recording over 2,000 structured meetings. Sourcing teams from key sectors such as automotive, industrial automation, and consumer electronics–including leading companies such as Samsung, Spark Minda, and Jio platforms–engaged directly with component manufacturers and solutions providers. Discussions primarily revolved around optimizing lead times, establishing local inventory, implementing cost engineering strategies, and fostering supplier development – all critical aspects for global supply chain resilience.

With Rohit Sharma as the face for electronica India and productronica India 2025, the platform also expanded its reach beyond the immediate industry community. His association helped connect the event’s core message to a wider and increasingly tech-aware audience, highlighting the growing societal relevance of electronics manufacturing in India.

Exhibitor Testimonials

Exhibitors consistently reported high-quality interactions. Sanjay Kumar, Managing Director from Kyocera Asia Pacific India Pvt. Ltd an electronica India exhibitor, said, “The scale and focus here in Bengaluru this year was truly impressive. The international pavilions provided direct access to component suppliers we would typically need to visit multiple regional shows to engage with.”

For process-focused technology providers, the utility was clear Gaurav Mehta, President – Business Development from Kaynes Technology India Ltd, an exhibitor at productronica India, stated, “For a process-driven technology company like ours, productronica India gave us access to the right mix of automation buyers and R&D teams. What impressed us was not just the quantity of inquiries but their technical specificity—Indian manufacturers are now discussing Industry 4.0 integration parameters and machine learning capabilities, not merely basic automation. We received interests from across verticals like defence & aerospace, IT/IOT, Healthcare, Automotive. Semiconductor, bare PCBs, Industrial and Consumer segments.

Buyer Testimonials

Mr. Gurdeep Singh, General Manager – Strategic Sourcing Group, Samsung India Electronics Pvt Ltd – “This exhibition brilliantly showcased the immense potential for localized electronics component sourcing in India. We were particularly impressed with the focus on nurturing growing Indian manufacturing capabilities and the opportunity to identify several promising new sourcing partners. A truly invaluable experience for anyone in the industry!”

Mr. Sushil Kumar, General Manager – Procurement and Sourcing, Jio Platform Limited. – “What stood out was the access to both established names and emerging startups under one roof. This juxtaposition is invaluable—we were able to benchmark mature solutions against emerging supply chain scenarios and witness India emerging as a key global manufacturing destination.”

Mr. Prakash Palanisamy, DGM – Group Corporate Electronics Sourcing, Spark Minda Group – “We attend shows globally, but the scale and focus here in Bengaluru this year were truly impressive. The international pavilions provided direct access to component suppliers we would typically need to visit multiple regional shows to engage with.”

Beyond the exhibition floor, the 2025 edition integrated a robust schedule of supporting programs designed to foster deeper technical and strategic discussions. These included the India Semiconductor Conclave, focusing on policy and design ecosystems, and the CEO Forum, addressing procurement and MSME component strategies. A strong highlight this year was the eFuture Conference, which brought together experts to discuss emerging technologies and future roadmaps for the electronics industry. Additional sessions like the eMobility Conference, the Innovation Forum, and a Live Podcast Zone further enhanced the event’s value proposition by providing diverse perspectives and real-time insights from technologists and decision-makers.

Industry leaders underscored the event’s significance. Rajoo Goel, Secretary General of ELCINA, remarked, “This edition reflects the growing depth of the Indian electronics industry. India’s electronics sector is no longer merely an assembly hub but a burgeoning ecosystem demonstrating sophisticated capabilities across the value chain. The “substantive and targeted” nature of the discussions indicates a higher level of technical readiness and business acumen among domestic participants, making them increasingly attractive partners for international collaborations that seek specialized expertise beyond basic manufacturing.”

Dr. Reinhard Pfeiffer, CEO of Messe München GmbH, offered a global perspective: “India is no longer an emerging destination—it is becoming a critical node in the global electronics supply chain. India now plays an indispensable role not just in production volumes but also in strategic design, supply chain resilience, and technological innovation. Both of these trade fairs provide a tangible showcase, allowing international stakeholders to directly gauge India’s advancements, fostering confidence and catalysing direct foreign investment and partnerships”

Bhupinder Singh, President IMEA, Messe München and CEO, Messe Muenchen India, concluded, “The 2025 edition of electronica India and productronica India has cemented the industry’s trust in these platforms and their intent to catalyse the next phase of electronics manufacturing in India. The “trust” placed in the platform reflects its proven ability to consistently deliver valuable cross-border interactions, solidifying its role as a premier facilitator for the next, more advanced phase of electronics manufacturing in India, characterized by deeper international integration and technological collaboration.”

Starting 2026, electronica India and productronica India will transition to a bi-annual format taking place both in Greater Noida (April) and Bengaluru (September). This strategic shift aims to provide more frequent market access points and better align with evolving regional business cycles, reflecting the accelerated pace of India’s electronics sector.

The post India’s Powerplay in Electronics Commands Global Attention at electronica India and productronica India 2025 appeared first on ELE Times.

Filtronic plc of Sedgefield and Leeds, UK — which designs and manufactures RF and millimeter-wave (mmWave) transmit & receive components and subsystems — is launching the latest development in solid-state power amplifiers (SSPAs) operating in the V-band. The Cerus V is being showcased alongside its Cerus W solid-state power amplifiers at European Microwave Week (EuMW 2025) in Utrecht, the Netherlands (21–26 September)...

Author: Mr. Saleem Ahmed, Officiating Head, ESSCI

When you hold your smartphone, drive your car, or even switch on your smart TV, there’s an invisible heartbeat inside, semiconductors. These tiny chips power satellites in orbit, fighter jets in the skies, and the AI algorithms reshaping our lives. For years, India has depended on importing these critical components, an Achilles’ heel for a country that aspires to be a global tech leader. But the tide is turning. With billion-dollar investments, government incentives, and, most importantly, a young pool of engineers, India is poised to script a new chapter: becoming a semiconductor innovation powerhouse.

Yet, there’s a catch. Money can build fabs and policy can set direction, but without the right skills, the vision will remain half-written. The future of India’s semiconductor journey will not just be about silicon, it will be about skills.

The Opportunity Before India

The global semiconductor industry is racing towards a trillion-dollar valuation by 2030. India’s own market is expected to touch $64 billion by 2026, nearly three times its 2019 size of $22.7 billion, according to Counterpoint Research and the India Electronics & Semiconductor Association (IESA). At the same time, the Electronics Sector Skills Council of India (ESSCI) projects the industry will employ 1.70 lakh professionals by 2025 and create another 1.03 lakh jobs by 2030. These are not routine jobs, they’re high-paying, future-facing roles that will place young Indians at the cutting edge of global innovation.

India already has an edge: it is home to nearly 20% of the world’s chip design engineers. Leading companies have set up design and R&D centers in Bengaluru, Hyderabad, and Noida. The recent unveiling of a 3nm semiconductor chip designed in India showcased the sheer technical capability of our engineers and the strategic importance of Indian design centers to the global industry.

By August 2025, the Union Cabinet of India had approved a total of ten semiconductor projects under the India Semiconductor Mission (ISM), amounting to cumulative investments of approximately ₹1.6 lakh crore (around $18.2 billion) across six states. These projects cover a range of technologies and partners, including advanced fabs, packaging, and silicon carbide-based compound semiconductors.

Why Skilling is the Decisive Factor

Despite this progress, the semiconductor value chain is highly talent-intensive. The design and IP creation phase, where the most economic value resides, requires deep expertise in VLSI (Very-Large-Scale Integration), electronic design automation (EDA) tools, and system-on-chip (SoC) architecture.

Currently, India produces tens of thousands of electronics graduates every year, but only a fraction are industry-ready. The gap lies in practical exposure, specialized training, and familiarity with real-world tools. For India to move beyond being a service center and emerge as a global innovation leader, a sharper focus on semiconductor design and VLSI roles is essential.

Equally critical is the manufacturing side of semiconductors, which demands not just technical know-how but also safety and operational excellence. Specialized programs such as Industrial Safety for Semiconductor Manufacturing – Hazchem and Electrical Safety in Semiconductor Facilities are vital to prepare a workforce capable of managing the highly sensitive and hazardous environments of fabrication plants. By strengthening both design expertise and manufacturing readiness, India can build a holistic talent pipeline for the semiconductor ecosystem.

Role of ESSCI: Building the Skills Bridge

This is where ESSCI plays a transformative role. Recognizing the talent gap, ESSCI has developed 32 NSQF-aligned qualifications spanning the entire semiconductor ecosystem, from chip design to  advanced packaging, cleanroom operations to safety protocols.

The courses are designed to cater to:

• Engineering graduates looking to specialize,
• Diploma and ITI students preparing to enter the workforce, and
• Professionals seeking to upskill or switch domains.

Some of the most critical roles where demand is already soaring include:

• VLSI Design Engineers – Designing advanced digital and analog circuits at nanoscale.
• Physical Design Engineers – Specializing in floor-planning, power optimization, and timing.
• Verification Engineers – Ensuring chips are error-free before fabrication.
• Analog & Mixed-Signal Designers – Vital for sensors, RF communication, and power management.
• Wafer Processing and Packaging Engineers – Especially relevant as fabs emerge in India.

Each of these roles commands global relevance and premium salaries, but only if the workforce is trained at world-class standards. The full range of programs is available on ESSCI’s website, offering aspirants a structured path to join the semiconductor workforce. Beyond curriculum design, ESSCI collaborates with industry leaders ensuring that Indian talent is benchmarked against international standards.

Why This Matters for Young Engineers

For India’s youth, the semiconductor wave represents more than jobs, it represents a chance to lead global technological change. Whether in AI, electric vehicles, 5G, space technology, or IoT, semiconductors are at the heart of every emerging sector.

A career in this industry offers:

• High-paying roles with global exposure,
• Opportunities to work on frontier technologies, and
• The satisfaction of contributing to national self-reliance and global leadership.

Conclusion:

India’s semiconductor journey has moved from dream to execution. Fabs are being built, policies are in place, and global players are betting big on India. But without a deeply skilled workforce, the dream of becoming a global semiconductor hub risks falling short.

The responsibility now lies with all stakeholders, universities, industry, government, and skill councils like ESSCI, to align efforts and ensure our engineers are not just employable, but world-class innovators.

For young Indians, the message is simple: this is your moment. Equip yourself with the right skills, embrace the semiconductor revolution, and help India design not just chips, but its future.

Because if we skill right, India won’t just participate in semiconductor innovation, it will lead it

The post India Can Lead in Semiconductor Innovation, If We Skill Right appeared first on ELE Times.

Hi :3 Some time ago i was trying to help friends with getting a BCI board for their project, but plans were changed and i made a new fully custom board based on ADS1299 (2 of them, 16 channels) and ESP32-C3. I hope they will use it one day, we just decided to post it :3 Board is open source, i’ve designed the entire pcb myself, as well as firmware and then BrainFlow integration and a python testing GUI (i have no idea how to add mor pictures here :3). You can order it from JLCPCB (project files are provided) if you want and it will be relatively cheap, and crazy cheap if you order like 10 or 20 — price goes down super fast. On esp side i’ve implemented sinc3 equalizer (7-tap FIR), DC removal and notch filters (50/60, 100/120 Hz). You can toggle them in real time independently. DC has several cutoff frequencies you can choose from also on the go. If you change sampling frequency filters will adapt of course (i made LUTs inside up to 4000 Hz) I was trying to make sure board works as fast as it can and as stable as possible. I was doing a lot of optimizations here and there (embedded coders feel free to trash me, i will be only happy), but board can run all filters on all 16 channels and sustain 4000 Hz at max — all of that over Wi-Fi and UDP. So, i have no idea if ADS1299 is dead already or maybe no one needs it or whatever, but if you’re interested — you can check git or ask here or whatever else. It just took me a ton of time to make it and i wasn’t even checking what other people do too much. We’ve checked freeEEG, then OpenBCI, then i thought maybe i can just make 16 channels and since then went into silent mode getting crushed under piles of datasheets and design guidelines. I just want to share the board and not sure how to stay under this reddit guidelines, i hope it’s ok. So, whatever it goes, check git or text me — i will be happy to yap about signal processing and pcb design and share more details if anyone interested. https://github.com/nikki-uwu/Meower submitted by /u/Meow-Corp [link] [comments]

Modern cars are fast becoming connected, software-driven systems with all the trappings of a mobile data center. Automotive Ethernet forms the core of this transformation, providing the required speed, scalability, and security to build next-generation vehicles. From zonal architectures to software-defined platforms, the Ethernet enables the driving experience to become safer, smarter, and more connected.

Shaping Vehicle Architecture

The industry is shifting towards zonal architectures, with centralized processors managing multiple zones within a vehicle. The numerous benefits include reduced complexity, cost reduction, and enhanced efficiencies. By 2030, it is expected that half of new vehicles would incorporate zonal systems, thereby underscoring Ethernet’s role as the backbone of automotive design.

Why Automotive Ethernet Is Important

With over a decade of leadership and ports in the hundreds of millions deployed already, ethernet has made its way into becoming the de facto standard for in-vehicle networking. Listed below are the reasons:

• speed, secure-data transmission
• low power
• standards-based reliability
• scalability for future applications

The ecosystem is continuously growing, from PHY technology that stretches twisted pair connections to switches and MCUs that empower advanced networking.

Unlocking Next-Gen Capabilities

Automotive Ethernet is the data backbone fostering innovation through development in the following areas:

• Assisted driving & safety: ADAS and LIDAR-powered systems for intelligent navigation.
• Cloud connectivity: Fast, secure data transfer between vehicles and the cloud.
• Software-defined platforms: Supporting OTA updates and feature rollouts.
• Predictive maintenance: Real-time diagnostics and personalization.

Open Standards for Interoperability

Automotive connectivity depends heavily on open standards that guarantee interoperability from platform to platform. Collaborations with global standards bodies such as IEEE are further enhancing Ethernet to provide:

• Higher data rates
• Lower power consumption
• Lower emission of noise

Ethernet technologies, well-proven in enterprise data center applications, are now being modified for automotive applications to deliver the same level of security and performance.

Looking Ahead

Ethernet will continue to provide the data backbone propelling the transformation of automobiles into sophisticated, software-defined platforms. Vehicles will become safer, more intelligent, and constantly better thanks to ongoing technological advancements.

Broadcom is assisting automakers all over the world in embracing this change and influencing the direction of connected mobility with its extensive experience and leadership in Automotive Ethernet.

(This article has been adapted and modified from content on Broadcom.)

The post Reinventing In-Vehicle Connectivity: Driving the Future with Automotive Ethernet appeared first on ELE Times.

Reducing Switching Losses and Increasing Efficiency, Devices Combine Low Qrr Down to 105 nC With VF Down to 1.45 V and Low Junction Capacitance and Recovery Time

Vishay Intertechnology, Inc. expanded its Gen 7 platform of 1200 V FRED Pt Hyperfast rectifiers with four new devices in the eSMP series SlimSMA HV (DO-221AC) package. Optimized for industrial and automotive applications, the 1 A and 2 A rectifiers not only offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices in their class, but also provide the lowest junction capacitance and recovery time.

The Vishay Semiconductors rectifiers released, include the VS-E7JX0112-M3 and VS-E7JX0212-M3, and AEC-Q101 qualified VS-E7JX0112HM3 and VS-E7JX0212HM3. To reduce switching losses and increase efficiency, the devices combine fast recovery times down to 45 ns with Qrr down to 105 nC typical, forward voltage drop down to 1.45 V, and junction capacitance down to 2.5 pF. The robust rectifiers offer non-repetitive peak surge current up to 21 A in a compact package measuring 2.6 mm by 5.2 mm with a low 0.95 mm profile, compared to 2.3 mm for the competing SMA package with a similar footprint. Combined with a minimum 3.2 mm creepage distance and molding compound with a comparative tracking index (CTI) ≥ 600 (Material Group I), the devices reduce component counts and lower BOM costs based on IEC 60664-1 requirements for high voltage applications.

The VS-E7JX0112-M3, VS-E7JX0112HM3, VS-E7JX0212-M3, and VS-E7JX0212HM3 will serve as clamp, snubber, and freewheeling diodes in flyback auxiliary power supplies and high frequency rectifiers for bootstrap driver functionality, while providing desaturation protection for the latest fast switching IGBTs and high voltage Si / SiC MOSFETs. Typical applications for the devices include industrial drives and tools, on-board chargers and motors for electric vehicles (EV), energy generation and storage systems, and Ćuk converters and industrial LED SEPIC circuitry.

The rectifiers feature a planar structure and platinum doped lifetime control that guarantee system reliability and robustness without compromising on performance, while their optimized stored charge and low recovery current minimize switching losses and reduce power dissipation. RoHS-compliant and halogen-free, the devices feature a Moisture Sensitivity Level of 1 in accordance with J-STD-020 and offer high temperature operation to +175 °C.

The post Vishay Intertechnology Releases New 1 A and 2 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers in SlimSMA HV (DO-221AC) Package appeared first on ELE Times.

Micro-Star International Co., Ltd. (MSI), a global leading vendor for computer hardware, has selected Anritsu’s signal integrity evaluation solution, Signal Quality Analyzer-R MP1900A and Vector Network Analyzer MS46524B, for high-speed digital interfaces, including the PCI Express (PCIe) standard.

The rapid proliferation of AI and IoT technologies has driven a significant increase in data transmission volumes. As a result, high-speed digital interfaces such as PCIe, USB, and DisplayPort, widely used in servers, data centers, and consumer products, are required to support even greater speeds and capacities. Faced with this, MSI has risen to the challenge of adapting to next-generation interface standards in its server and motherboard development, ensuring digital signal quality and improving development efficiency.

To achieve this, MSI selected Anritsu’s MP1900A and MS46524B. Utilizing both products, MSI established a comprehensive environment for evaluating the digital signal quality in terms of the time domain (such as the bit error rate), as well as the frequency domain (such as S-parameters). This enabled MSI to verify the signal quality of its high-speed digital interfaces and devices when installed in systems, while also enhancing its development efficiency.

Anritsu will continue to strongly support customers in solving challenges and driving technological innovation in the high-speed digital market through the provision of cutting-edge measurement technologies and comprehensive testing solutions.

The post MSI Adopts Anritsu’s High-Speed Interface Evaluation Solution appeared first on ELE Times.

The paradox of test equipment design is that it must be more advanced than the devices it tests. We spoke with Tektronix in person to gain insights on this unique technical challenge.