Microelectronics world news

submitted by /u/average_engineer862 [link] [comments]

Japan-based ROHM Co Ltd says that its EcoGaN series of 650V GaN HEMTs in the TOLL package has been adopted by Murata Manufacturing Group subsidiary Murata Power Solutions (a Japan-based supplier of electronic components, batteries and power supplies) for AI server power supplies that will enter mass production this year. ROHM says that integrating its GaN HEMTs (which combine low-loss operation with high-speed switching performance) in Murata’s 5.5kW AI server power supply unit achieves greater efficiency and miniaturization...

The post Global manufacturers welcome smart manufacturing and PCB technology platform linking Southeast Asian industrial supply chain appeared first on ELE Times.

The United States has been making significant strides in renewable energy, with solar power emerging as a key player in the clean energy transition. Over the past decade, massive solar farms have been established across the country, contributing significantly to the national grid. These solar power plants not only generate sustainable electricity but also help reduce carbon emissions and promote energy independence. Below is an in-depth look at the top 10 largest solar power plants in the USA, detailing their capacity, location, and impact.

1. Copper Mountain Solar Facility

• Location: Nevada
• Capacity: 802 MW (AC)

The Copper Mountain Solar Facility in Nevada is one of the largest photovoltaic (PV) solar plants in the United States. Developed in five phases, this project has continually expanded since its inception. Its large-scale capacity supplies clean energy to thousands of homes while reducing reliance on fossil fuels. The facility showcases how solar energy can be scaled up efficiently to integrate with the national electricity grid.

2. Gemini Solar Project

• Location: Nevada
• Capacity: 690 MW (AC)

The Gemini Solar Project is one of the most ambitious solar power projects in the U.S. In addition to its impressive solar power generation, it includes 380 MW of battery storage, ensuring stable energy supply even during periods of low sunlight. This hybrid solar-plus-storage system demonstrates the future of renewable energy, where energy storage plays a crucial role in grid stability and efficiency.

3. Edwards Sanborn Solar and Energy Storage Project

• Location: California
• Capacity: 864 MW (Solar) + 3,320 MWh (Battery Storage)

Located in California, the Edwards Sanborn Solar and Energy Storage Project is a groundbreaking renewable energy initiative. This facility integrates large-scale solar power generation with one of the largest battery storage capacities in the country. The battery component ensures that excess solar energy generated during the day is stored and used when needed, making it a game-changer in the renewable energy sector.

4. Lumina I and II Solar Project

• Location: Texas
• Capacity: 828 MW

Texas is rapidly becoming a leader in solar power, and the Lumina I and II Solar Project is a testament to that growth. Expected to be completed by 2024, these twin solar farms will add 828 MW of clean energy to the state’s power grid. Texas’ solar expansion highlights how renewable energy can complement traditional power sources, especially in a state known for its oil and gas industry.

5. Mount Signal Solar

• Location: California
• Capacity: 794 MW

The Mount Signal Solar project, also known as the Imperial Valley Solar Project, has been built in multiple phases since 2014. This massive solar farm is located in the sun-drenched Imperial Valley of California, where it harnesses abundant sunlight to generate clean electricity. The project has played a critical role in California’s transition towards 100% clean energy goals.

6. Solar Star I & II

• Location: California
• Capacity: 747 MW

When it was completed in 2015, Solar Star I & II was the largest solar power plant in the world, with a capacity of 579 MW (AC). It set new benchmarks for utility-scale solar installations and inspired the development of even larger projects. Spread across 13 square kilometers, this solar farm utilizes advanced photovoltaic technology to efficiently convert sunlight into electricity.

7. Topaz Solar Farm

• Location: California
• Capacity: 550 MW (AC)

The Topaz Solar Farm is another key solar project in California, operational since 2014. One of the pioneering utility-scale solar projects, it consists of over 9 million thin-film photovoltaic panels. This farm has been instrumental in proving the economic and environmental feasibility of large-scale solar projects in the United States.

8. Desert Sunlight Solar Farm

• Location: California
• Capacity: 550 MW (AC)

Commissioned in 2014, the Desert Sunlight Solar Farm is one of the largest solar projects in the world. It spans 3,800 acres in the Mojave Desert and consists of over 8 million solar panels. This farm contributes significantly to California’s ambitious renewable energy targets, reducing carbon emissions and supporting a cleaner energy future.

9. Ivanpah Solar Electric Generating System

• Location: California
• Capacity: 392 MW

Unlike traditional photovoltaic solar farms, the Ivanpah Solar Electric Generating System uses solar thermal technology. It employs mirrors (heliostats) to focus sunlight onto central towers, generating steam to power turbines. This innovative approach allows the plant to produce electricity even when sunlight is not directly available, making it one of the most advanced solar plants in the country.

10. Agua Caliente Solar Project

• Location: Arizona
• Capacity: 290 MW

The Agua Caliente Solar Project in Arizona is notable for utilizing thin-film cadmium telluride (CdTe) solar panels, which offer cost-effective and high-efficiency energy production. The plant generates over 626 GWh of clean energy annually, powering thousands of homes and reducing dependence on conventional power sources.

The Future of Solar Energy in the USA

The U.S. solar industry continues to grow, with large-scale projects like these playing a crucial role in the transition towards clean and renewable energy. These power plants not only contribute to reducing greenhouse gas emissions but also help in creating jobs, boosting energy security, and promoting technological advancements in solar power and battery storage.

With increasing investments in solar farms and energy storage, the United States is well on its way to achieving a sustainable and carbon-free energy future.

The post Top 10 Solar Power Plants in the USA appeared first on ELE Times.

Agriculture in India has witnessed a technological revolution, with drones playing a pivotal role in modernizing farming practices. These unmanned aerial vehicles (UAVs) assist in tasks such as crop monitoring, precision spraying, and data analysis, leading to increased efficiency and sustainability. Here are ten prominent agriculture drone companies in India contributing to this transformation:

1. Garuda Aerospace

Based in Chennai, Garuda Aerospace specializes in drone solutions for various sectors, including agriculture. Their drones are designed for precision spraying, crop health monitoring, and surveillance, aiming to enhance productivity and reduce manual labor in farming.

2. IoTechWorld Avigation

IoTechWorld Avigation, headquartered in Gurugram, offers innovative agricultural drones like the Agribot. This multi-rotary drone is India’s first DGCA-approved agriculture drone, used for spraying, broadcasting, and assessing soil and crop health.

3. Throttle Aerospace Systems

Bangalore-based Throttle Aerospace Systems manufactures UAVs for various applications, including agriculture. Their drones assist in land mapping, surveillance, cargo delivery, inspection, and disaster management, providing versatile solutions for the farming sector.

4. Aarav Unmanned Systems (AUS)

AUS, located in Bangalore, offers drone-based solutions for mining, urban planning, and agriculture. Their drones facilitate precision agriculture by providing high-resolution aerial imagery for crop health monitoring and yield estimation.

5. Dhaksha Unmanned Systems

Chennai-based Dhaksha Unmanned Systems provides drones for agriculture, surveillance, and logistics. Their agricultural drones are equipped with intelligent spraying systems and real-time data analysis capabilities, enhancing farming efficiency.

6. ideaForge

Headquartered in Mumbai, ideaForge is a leading manufacturer of UAVs for defense, homeland security, and industrial applications, including agriculture. Their drones offer high endurance and are used for large-scale mapping and surveillance in farming.

7. General Aeronautics

Bangalore-based General Aeronautics offers the Krishak series drones for agricultural purposes. Known for their durability and efficient spraying systems, these drones are compatible with various attachments, allowing multi-functional use in diverse agricultural settings.

8. Paras Aerospace

Paras Aerospace, located in Bangalore, specializes in user-friendly and affordable drones for agriculture. Their Paras Agricopter series is designed for precision spraying and crop monitoring, aiming to optimize resource utilization and increase yields.

9. Johnnette Technologies

Based in Noida, Johnnette Technologies offers agricultural drone services, including crop health monitoring, precision spraying, and remote sensing. Their drones are designed to optimize agrochemical applications, reducing wastage and maximizing crop yields.

10. Asteria Aerospace

Bangalore-based Asteria Aerospace provides drone-based solutions for various sectors, including agriculture. Their drones are used for crop monitoring, field mapping, and surveillance, aiding farmers in making data-driven decisions.

 

These companies are at the forefront of integrating drone technology into Indian agriculture, offering solutions that enhance productivity, efficiency, and sustainability. As the industry continues to evolve, these innovations are expected to play a crucial role in meeting the growing demands of modern farming.

The post Top 10 Agriculture Drone Companies in India appeared first on ELE Times.

k-Space Associates Inc of Dexter, MI, USA — which was founded in 1992 and produces thin-film metrology instrumentation and software for research and manufacturing of microelectronic, optoelectronic and photovoltaic devices — has introduced kSA RHEED-Sim as its new reflection high-energy electron diffraction (RHEED) simulation software. Suitable for both researchers and students, simulation possibilities range from basic simulated RHEED patterns of common structures to complex patterns produced by reconstructions or complex surfaces, and even dynamic simulations with changing phenomena...

A new design platform streamlines electronics system development from component selection to software development by integrating hardware, software, and lifecycle data into a single digital environment. Renesas 365 is built around Altium 365, a design suite that provides seamless access to component sources and intelligence while connecting all stakeholders throughout the creation process.

Embedded system developers often struggle due to manual component searches, fragmented documentation, and siloed design teams. Renesas 365 addresses these challenges by connecting Altium’s cloud-connected system design platform with Renesas’ components for embedded compute, connectivity, analog, and power applications.

Renesas 365, built around Altium’s system design platform, streamlines development from component selection to lifecycle management. Source: Renesas

Renesas CEO Hidetoshi Shibata calls it a first-of-its-kind solution. “It’s the next step in the digital transformation of electronics, bridging the gap between silicon and system development.” Renesas has joined hands with the company it acquired last year to redefine how electronics systems are designed, developed, and sustained—from silicon selection to full system realization—in a connected world.

Here is how Renesas 365 works in five steps.

1. Silicon: Renesas 365 will ensure that every silicon component is application-ready, optimized for software-defined products, and seamlessly integrated with the broader system.
2. Discover: This part powered by Altium enables engineers to find components as well as complete solutions from Renesas’ portfolio for faster and more accurate system design.
3. Develop: Altium powers this part to provide a cloud-based development environment to ensure real-time collaboration across hardware, software, and mechanical teams.
4. Lifecycle: Also powered by Altium, this part establishes persistent digital traceability to facilitate over-the-air (OTA) updates and ensure compliance and security from concept to deployment.
5. Software: This part provides developers with artificial intelligence (AI)-ready development tools to ensure that the software is optimized for their applications.

The final part of Renesas 365 offerings demonstrates how a unified software framework covering low- to high-compute performance can help developers create software-defined systems. For instance, these development tools enable real-time, low-power AI inference at the edge. They can also track compliance and automate OTA updates to ensure secure lifecycle management.

This cloud-connected system design platform can aid developers in everything from component selection to embedded software development to OTA updates. Meanwhile, it ensures that existing workflows remain uninterrupted and supports everything from custom AI models to advanced real-time operating system (RTOS) implementations.

Renesas will demonstrate this system design platform live at embedded world 2025, which will be held from 11 to 13 March in Nuremberg, Germany. The company’s booth 5-371 will be dedicated to presentations and interactive demonstrations of the Renesas 365 solution.

Related Content

• PCB design basics
• PCB Design Considerations and Tools
• PCB Design Basics: Example design flow
• Renesas acquires Altium as part of its digitalization strategy
• What does Renesas’ acquisition of PCB toolmaker Altium mean?

The post This is how an electronic system design platform works appeared first on EDN.

submitted by /u/BlownUpCapacitor [link] [comments]

It’s remarkable how many switching regulator chips use the same basic two-resistor network for output voltage programming. Figure 1 illustrates this feature in a typical (buck type) regulator. See R1 and R2 where:

Vout = Vsense(R1/R2 + 1) = 0.8v(11.5 + 1) = 10v

Figure 1 A typical regulator output programming network with a basic two-resistor network for output voltage programming.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Quantitatively, the Vsense feedback node voltage varies from type to type and recommended values for R1 can vary too, but the topology doesn’t. Most conform faithfully to Figure 1. This defacto uniformity is useful if your application needs digital control of Vout via PWM. 

Figure 2 shows the simplistic three-component solution it makes possible where:

Vout = Vsense(R1/(R2 + R3/DF) + 1) = 0.8v to 10v as DF = 0 to 1

All that’s required to add PWM control to Figure 1 is to split R2 into two equal halves, connect filter cap Cf to the middle of the pair, and add PWM switch Q1 in series with its ground end.

Figure 2 Simple circuit for regulator programming with PWM where Vout ranges from 0.8 V to 10 V as the duty factor (DF) goes from 0 to 1.

The Cf capacitance required for 1-lsb PWM ripple attenuation is 2(N-2)Tpwm/R2, where N is number of PWM bits and Tpwm is the PWM period. Since Cf will never see more than perhaps a volt, its voltage rating isn’t much of an issue.

A cool feature of this simple topology is that, unlike many other schemes for digital power supply control, only the regulator’s internal voltage reference matters to regulation accuracy. Precision is therefore independent of external voltage sources, e.g. logic rails. This is a good thing because, for example, the tempco of the TPS54332’s reference is only 15 ppm/oC.

Figure 3 graphs Vout versus the PWM DF for the Figure 2 circuit where the X-axis is DF, the Y-axis is Vout and,

Vout = Vsense(R1/(R2 + R3/DF) + 1)
Vout(min) = Vsense
Vout(max) = Vsense(R1/(R2 + R3) + 1)
R1/(R2 + R3) = Vout(max)/Vsense – 1

Figure 3 Graph showing Vout versus the Figure 2 PWM DF.

Figure 4 plots the inverse function with DF vs Vout where,

DF = R3/(R1/(Vout/Vsense – 1) – R2)

The nonlinearity of DF versus Vout does incur the cost of a bit of software complexity (two subtractions and three divisions) to do the conversion. But since it buys substantial circuitry simplification, it seems a reasonable (maybe zero) cost. Or, if the necessary memory is available, a lookup table is another (simple!) possibility.

 Figure 4 DF versus Vout; the non-linearity necessitates a bit of software complexity to perform the conversion.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• Add one resistor to allow DAC control of switching regulator output
• Improve thermal airflow sensor PSRR with just two resistors
• Add one resistor to give bipolar LM555 oscillator a 50:50 duty cycle
• Peculiar precision full-wave rectifier needs no matched resistors

The post Three discretes suffice to interface PWM to switching regulators appeared first on EDN.

According to the new market & technology report ‘Status of the Compound Semiconductor Device Industry’ from market analyst firm Yole Group, the compound semiconductor device market is growing rapidly at a compound annual growth rate (CAGR) of nearly 13% from 2024 to about $25bn by 2030, outpacing the broader semiconductor market...

Left one is bought from Mouser for about 6$ each and the right one was less than 1$ from Alibaba. Right one couldnt handle 200V drain to source. While its rated for 600V. I know they are not the same part but watch out for culprits when buying mosfets. I read some legit suppliers got fake ICs back when there was silicon shortage. submitted by /u/Real-Entrepreneur-31 [link] [comments]

Reflow soldering is a widely used technique in electronics manufacturing for assembling surface-mount devices (SMDs) onto printed circuit boards (PCBs). This method involves applying solder paste to the board, placing components on top of it, and then heating the assembly in a controlled manner to melt and solidify the solder. The process ensures strong and reliable solder joints, making it a preferred method for mass production in the electronics industry.

Unlike wave soldering, which is typically used for through-hole components, reflow soldering is designed for SMDs, allowing for higher component density and miniaturization of electronic circuits. The precision and efficiency of reflow soldering make it ideal for modern electronic manufacturing, where consistency and high reliability are critical.

How Reflow Soldering Works

The reflow soldering process consists of several carefully controlled stages to ensure optimal soldering results. Each stage plays a crucial role in preventing defects such as solder bridging, tombstoning, or incomplete solder joints. The main steps include:

1. Solder Paste Application

The process begins with the application of solder paste, a mixture of powdered solder alloy and flux, onto the PCB. This is typically done using a stencil and a squeegee to ensure uniform deposition. The accuracy of solder paste application is critical as it determines the quality of the solder joints.

2. Component Placement

Once the solder paste is applied, surface-mount components are carefully placed on the PCB using automated pick-and-place machines. These machines use vision systems to precisely position components, ensuring alignment with the solder paste deposits.

3. Preheating Stage

The assembled board is then gradually heated in a reflow oven. The preheating stage raises the temperature of the PCB and components at a controlled rate to prevent thermal shock. This phase also activates the flux in the solder paste, which removes oxidation and improves wetting.

4. Thermal Soaking

After preheating, the PCB enters a thermal soaking phase where the temperature is maintained at a specific range to ensure uniform heat distribution. This helps in stabilizing the components and further activating the flux.

5. Reflow Zone (Peak Temperature Stage)

In this stage, the temperature reaches its peak, typically between 220°C and 250°C, depending on the solder alloy used. This is the critical moment where the solder paste melts, creating reliable electrical and mechanical connections between the components and the PCB.

6. Cooling Phase

Once the solder has melted and formed solid connections, the PCB is gradually cooled in a controlled manner. Controlled cooling prevents thermal stress and ensures the formation of strong, defect-free solder joints.

Reflow Soldering Uses & Applications

Reflow soldering is widely used in various industries, primarily in the manufacturing of electronic devices. Some key applications include:

• Consumer Electronics: Smartphones, laptops, tablets, and gaming consoles all rely on reflow soldering to ensure compact and efficient circuit assemblies.
• Automotive Electronics: Modern vehicles contain complex electronic systems, including engine control units (ECUs), infotainment systems, and safety sensors, all of which use SMD technology and reflow soldering.
• Medical Devices: High-precision medical equipment, such as diagnostic devices and portable health monitors, require reliable soldering for seamless functionality.
• Industrial Electronics: Industrial automation, control systems, and robotics benefit from reflow soldering due to its ability to create robust and durable electronic circuits.
• Aerospace & Defense: High-reliability electronics for satellites, avionics, and defense applications depend on precise and high-quality soldering techniques like reflow soldering.

Advantages of Reflow Soldering

Reflow soldering offers several advantages that make it the preferred method for assembling SMD components:

• High Precision: Automated solder paste application and component placement result in accurate soldering with minimal defects.
• Consistency and Reliability: Controlled heating profiles ensure strong and uniform solder joints, reducing the chances of failure.
• Mass Production Efficiency: The process is highly automated and scalable, making it suitable for high-volume manufacturing.
• Compatibility with Small Components: Reflow soldering supports miniaturized electronics, enabling the development of compact and lightweight devices.
• Improved Aesthetic and Functionality: Unlike wave soldering, reflow soldering does not leave excess solder, resulting in cleaner circuit boards with better electrical performance.

Disadvantages of Reflow Soldering

Despite its benefits, reflow soldering also has some limitations:

• Complex Equipment Requirements: Reflow ovens and pick-and-place machines are expensive, making the initial setup costly for small manufacturers.
• Component Sensitivity: Some temperature-sensitive components may get damaged if exposed to high temperatures during the reflow process.
• Risk of Defects: Issues such as tombstoning (where small components lift on one side) or solder bridging (where excess solder creates unintended connections) can occur if process parameters are not optimized.
• Limited Use for Through-Hole Components: While hybrid techniques exist, reflow soldering is primarily designed for surface-mount devices, requiring additional methods for through-hole components.

Conclusion

Reflow soldering is a highly efficient and precise method for assembling surface-mount components on PCBs. With applications ranging from consumer electronics to aerospace, it remains a crucial technique in modern electronic manufacturing. While the process requires careful temperature control and specialized equipment, its benefits in terms of reliability, efficiency, and scalability make it indispensable. As technology advances, improvements in solder paste formulations and reflow oven designs continue to enhance the effectiveness of reflow soldering, ensuring its relevance in the ever-evolving electronics industry.

The post Understanding Reflow Soldering: Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

submitted by /u/nkaysss [link] [comments]

Altum RF of Eindhoven, The Netherlands (which designs RF, microwave and millimeter-wave semiconductors) has expanded the scope of its ISO 9001:2015 registration for its quality management system. In addition to its headquarters in Eindhoven, Altum RF’s design center in Sydney, Australia, has now also achieved ISO 9001 certification, underscoring the company’s commitment to “delivering high-quality, reliable and high-performance semiconductor products while maintaining excellence across design, development, manufacturing and sales processes”...

India’s 3D printing industry has experienced significant growth, with numerous companies emerging as key players in the field. Here’s an overview of the top 10 3D printer manufacturers in India as of 2025:

1. Divide By Zero Technologies

Established in 2013 and based in Maharashtra, Divide By Zero Technologies is a prominent 3D printer manufacturer catering to small and medium enterprises. The company aims to make 3D printing affordable and reliable, providing solutions to renowned clients such as Samsung, L’Oreal, GE Healthcare, Godrej, and Mahindra. Their product lineup includes models like Accucraft i250+, Aion 500 MK2, Aeqon 400 V3, and Alpha 500. Notably, their patented Advanced Fusion Plastic Modeling (AFPM) technology ensures consistent quality through intuitive automation.

2. Make3D

Founded in 2014 in Gujarat, Make3D specializes in manufacturing 3D printers and scanners. Their Pratham series caters to both hobbyists and industrial users, featuring models like Pratham Mini and Pratham 6.0. They also offer the Eka Star DLP Printer and EinScan Pro 2X scanner. Committed to enhancing the accessibility of additive manufacturing, Make3D provides products known for quality and durability, alongside educational courses on 3D printing.

3. Mekuva Technologies (POD3D)

Based in Hyderabad and established in 2021, Mekuva Technologies offers a range of 3D printers, including the AKAR series (300 Pro, 600 Basic, 200 Desktop, and 200 Pro). Beyond manufacturing, they provide services like 3D design, printing, scanning, CNC machining, sheet metal operations, and injection molding, serving as a comprehensive solution provider for various industries. Their printers are compatible with materials such as PLA, ABS, and carbon fiber.

4. IMIK Technologies

Operating since 2007 in Tamil Nadu, IMIK Technologies supplies a wide range of 3D printers, including their own FDM printer, IMIK 3DP, and models from brands like Creality, Flashforge, and Ultimaker. They cater to sectors such as defense, textiles, robotics, agriculture, and medicine, offering products suitable for educational, industrial, and personal use. Additionally, they provide 3D prototyping services.

5. Printlay

Established in 2015 in Tamil Nadu, Printlay specializes in 3D printing and scanning services. They assist clients from prototyping to end-use parts production, ensuring precision and accuracy. Their services extend to CNC machining and injection molding, catering to diverse industries with a reputation for quick turnaround times and quality service.

6. A3DXYZ

Founded in 2018 in Maharashtra, A3DXYZ offers 3D printing services, including FDM printing, stereolithography, CAD modeling, digital light processing, and vacuum casting. They serve industries such as architecture, aerospace, healthcare, and medicine, and have introduced the A3DXYZ DS200 3D printer, known for its robust design and high-quality output.

7. Boson Machines

Based in Maharashtra and established in 2017, Boson Machines is a leading 3D printing manufacturer utilizing technologies like FDM, SLA, and SLS. They offer services such as part production, injection molding, and CNC machining, providing comprehensive solutions from design to production.

8. 3Ding

Operating since 2013 in Tamil Nadu, 3Ding supplies a variety of 3D printers, PCB printers, printing materials, and scanners. They distribute products from brands like 3D Systems, Fab X, Voltera, Formlabs, and Creality, and offer rental options. Their services include 3D design, printing, and scanning, along with workshops and training programs. They have branches in Chennai, Bangalore, Hyderabad, and Mumbai.

9. Precious 3D

Established in 2017 in Tamil Nadu, Precious 3D offers 3D design, printing, CNC machining, and injection molding services. They utilize technologies like SLS, FDM, DLP, and Polyjet, serving industries such as automotive and healthcare. Their clientele includes brands like Renault, Ford, Verizon, and Nippon Paint, and they provide consultation services for material selection.

10. Imaginarium

Based in Mumbai, Imaginarium stands as India’s largest 3D printing and rapid prototyping company. They offer design validation, prototyping, batch production, and various techniques such as SLA (Stereolithography), SLS (Selective Laser Sintering), VC (Vacuum Casting), CNC machining, injection molding, and scanning. Serving industries such as jewelry, automotive, and healthcare, Imaginarium utilizes 20 industrial 3D printers and 140 different materials, making them a key player in the field.

 

These companies exemplify the rapid advancement and diversification of India’s 3D printing industry, offering a wide range of products and services to meet the evolving needs of various sectors.

The post Top 10 3D Printer Manufacturers in India appeared first on ELE Times.

submitted by /u/No_Pilot_1974 [link] [comments]

Japan-based ROHM Co Ltd has developed the GNP2070TD-Z 650V GaN HEMTs in the TOLL (TO-LeadLess) package. Featuring a compact design with excellent heat dissipation, high current capacity and superior switching performance, the TOLL package is increasingly being adopted in applications that require high power handling, particularly inside industrial equipment and automotive systems. For this launch, package manufacturing has been contracted to outsourced semiconductor assembly & test (OSAT) provider ATX Semiconductor (Weihai) Co Ltd in Shandong Province, China...

The need for intelligent interconnect solutions has become critical as the scale, complexity, and customizability of today’s systems-on-chip (SoC) continue to increase. Traditional network-on-chip (NoC) technologies have played a vital role in addressing connectivity and data movement challenges, but the growing intricacy of designs necessitates a more advanced approach. Especially, when high-end SoC designs are surpassing the human ability to create NoCs without smart assistance.

The key drivers for this demand can be summarized as follows:

• Application-specific requirements: Many industries and applications, such as automotive, Internet of Things (IoT), consumer electronics, artificial intelligence (AI), and machine learning (ML), require highly specialized hardware tailored to unique workloads, such as real-time processing, low latency, or energy efficiency. Off-the-shelf chips often fall short of providing the precise blend of performance, power, and cost-efficiency these applications need.
• Cost and performance optimization: Custom SoCs allow companies to integrate multiple functions into a single chip, reducing system complexity, power consumption, and overall costs. With advanced process nodes, custom SoCs can achieve higher levels of performance tailored to the application, offering a competitive edge.
• Miniaturization and integration: Devices in areas like wearables, medical implants, and IoT sensors demand miniaturized solutions. Custom SoCs consolidate functionality onto a single chip, reducing size and weight.
• Data-centric and AI workloads: AI and ML require processing architectures optimized for parallel computation and real-time inferencing. Custom SoCs can incorporate specialized processing units, like neural network accelerators or high-bandwidth memory interfaces, to handle these demanding tasks.

The market now demands a next-level approach, one that leverages AI and ML to optimize performance, reduce development time, and ensure efficient data movement across the entire system. Today’s high-end SoC designs are necessitating smarter, automated solutions to address evolving industry needs.

The solution is the introduction of a new type of smart NoC interconnect IP that can leverage smart heuristics using ML and AI technology to dramatically speed up the creation and increase the quality of efficient, high-performance SoC designs.

Today’s NoC technologies

Each IP in an SoC has one or more interfaces, each with its own width and frequency. A major challenge is the variety of standard interfaces and protocols, such as AXI, AHB, and APB, used across the industry. Adding to this complexity, SoCs often integrate IPs from multiple vendors, each with different interface requirements.

NoC technology helps manage this complexity by assigning a network interface unit (NIU) to each IP interface. For initiator IPs, the NIU packetizes and serializes data for the NoC. For target IPs, it de-packetizes and de-serializes incoming data.

Packets contain source and destination addresses, and NoC switches direct them to their targets. These switches have multiple ports, allowing several packets to move through the network at once. Buffers and pipeline stages further support data flow.

Without automation, designers often add extra switches, buffers, or pipeline stages as a precaution. However, too many switches waste area and power, excessive buffering increases latency and power use, and undersized buffers can cause congestion. Overusing pipeline stages also adds delay and consumes more power and silicon.

Existing NoC interconnect solutions provide tools for manual optimization, such as selecting topology and fine-tuning settings. However, they still struggle to keep pace with the growing complexity of modern SoCs.

Figure 1 SoC design complexity which has surpassed manual human capabilities, calls for smart NoC automation. Source: Arteris

Smart NoC IP

The typical number of IPs in one of today’s high-end SoCs ranges from 50 to 500+, the typical number of transistors in each of these IPs ranges from 1 million to 1+ billion, and the typical number of transistors on an SoC ranges from 1 billion to 100+ billion. Furthermore, modern SoCs may comprise between 5 to 50+ subsystems, all requiring seamless internal and subsystem-to-subsystem communication and data movement.

The result of all this is that today’s high-end SoC designs are surpassing human ability to create their NoCs without smart assistance. The solution is the introduction of a new type of advanced NoC IP, such as FlexGen smart NoC IP from Arteris. The advanced IP can leverage smart heuristics using ML technology to dramatically speed up the creation and increase the quality of efficient, high-performance SoC designs. A high-level overview of the smart NoC IP flow is illustrated in Figure 2.

Figure 2 A high-level overview of the FlexGen shows how smart NoC IP flow works. Source: Arteris

Designers start by using an intuitive interface to capture the high-level specifications for the SoC (Figure 2a). These include the socket specifications, such as the widths and frequencies of each interface. They also cover connectivity requirements, defining which initiator IPs need to communicate with which target IPs and any available floorplan information.

The designers can also specify objectives at any point in the form of traffic classes and assign performance goals like bandwidths and latencies to different data pathways (Figure 2b).

FlexGen’s ML heuristics determine optimal NoC topologies, employing different topologies for different areas of the SoC. The IP automatically generates the smart NoC architecture, including switches, buffers, and pipeline stages. The tool minimizes wire lengths and reduces latencies while adhering to user-defined constraints and performance goals (Figure 2c). Eventually, the system IP can be used to export everything for use with physical synthesis (Figure 2d).

NoC with smart assistant

The rapid increase in SoC complexity has exceeded the capabilities of traditional NoC design methodologies, making it difficult for engineers to design these networks without smart assistance. This has driven the demand for more advanced solutions.

Take the case of FlexGen, a smart NoC IP from Arteris, which addresses these challenges by leveraging intelligent ML heuristics to automate and optimize the NoC generation process. The advanced IP delivers expert-level results 10x faster than traditional NoC flows. It reduces wire lengths by up to 30%, minimizes latencies typically by 10% or more, and improves PPA metrics.

Streamlining NoC development accelerates time to market and enhances engineering productivity.

Andy Nightingale, VP of product management and marketing at Arteris, has over 37 years of experience in the high-tech industry, including 23 years in various engineering and product management positions at Arm.

 

Related Content

• SoC Interconnect: Don’t DIY!
• What is the future for Network-on-Chip?
• SoC design: When is a network-on-chip (NoC) not enough
• Network-on-chip (NoC) interconnect topologies explained
• Why verification matters in network-on-chip (NoC) design

The post How AI is changing the game for high-performance SoC designs appeared first on EDN.

In an era where artificial intelligence (AI) is rapidly transforming edge computing, STMicroelectronics is leading the charge with its groundbreaking STM32N6 series, featuring the Neural-ART Accelerator. This next-generation microcontroller delivers 600 times more AI performance than previous STM32 MCUs, redefining real-time AI processing for embedded systems.

Sridhar Ethiraj, Technical Marketing – General Purpose MCU at STMicroelectronics India

In this exclusive interview, Rashi Bajpai from ELE Times sits down with Sridhar Ethiraj, Technical Marketing – General Purpose MCU at STMicroelectronics India, to explore the technological breakthroughs behind the STM32N6. We discuss the challenges of integrating high-performance AI with ultra-low power consumption, the real-world impact of AI-accelerated MCUs in industries like automotive, healthcare, and smart devices, and how ST’s Edge AI Suite is simplifying AI deployment for developers worldwide.

 

 

 

With industry giants like LG, Lenovo, and Alps Alpine already leveraging the STM32N6, this conversation unveils how AI-powered microcontrollers are shaping the future of intelligent embedded systems.

Excerpts:

STMicroelectronics has introduced the STM32N6 MCU with the Neural-ART Accelerator, delivering 600 times more machine-learning performance than previous high-end STM32 MCUs. What key challenges did ST overcome to integrate such advanced AI capabilities into a microcontroller while maintaining power efficiency?

Ans: STMicroelectronics faced several key challenges while integrating the Neural-ART Accelerator into the STM32N6 MCU. The need for high computing power for advanced AI features clashed with power efficiency goals was a major hurdle. ST tackled this by creating its own neural processing unit (NPU) to handle most AI tasks while keeping power use low. Making the system work with different AI frameworks and models also proved tough, but ST fixed this by supporting common frameworks like TensorFlow Keras, and the ONNX ecosystem. ST also had to tweak the hardware to run neural networks for computer vision and audio in real-time. This meant building a computer vision pipeline and special image processing abilities. In the end, all this work resulted in the STM32N6 MCU, which offers 600 times better machine-learning performance than earlier top-end STM32 MCUs, while still being very power-efficient.

With AI inference moving to the edge, how does the STM32N6 differentiate itself from other AI-enabled MCUs in terms of performance, memory, and AI software support?

Ans: The STM32N6 series redefines AI-enabled microcontrollers with its Neural-ART Accelerator, a custom neural processing unit (NPU) delivering up to 600 GOPS for real-time neural network inference. Built on the Arm Cortex-M55 core running at 800 MHz, it leverages Arm Helium vector processing to enhance DSP performance. With 4.2 MB of built-in RAM and high-speed external memory interfaces, it excels in AI and graphics-intensive applications. Backed by a comprehensive AI software ecosystem—including STM32Cube.AI, ST Edge AI Developer Cloud, and the STM32 model zoo—it simplifies model optimization and deployment. This seamless blend of hardware acceleration and software support makes the STM32N6 a powerful and scalable solution for edge AI workloads.

 

The STM32N6 has been tested and adopted by industry leaders like LG, Lenovo, and Alps Alpine. Can you share some real-world applications where this MCU is making a significant impact?

Ans: The STM32N6 MCU is driving innovation across multiple industries. In automotive, it powers advanced driver assistance systems (ADAS) by enabling real-time processing of camera and sensor inputs for collision avoidance and lane-keeping. In smart home technology, companies like LG and Lenovo use it in security cameras and smart doorbells, leveraging its AI capabilities for motion detection and facial recognition. In healthcare, it enhances medical devices by accurately processing patient data for diagnostics and continuous monitoring. These real-world applications highlight how the STM32N6 delivers high-performance AI processing, improving safety, efficiency, and user experience across industries.

AI at the edge is evolving rapidly, particularly in vision, audio processing, and sensor-based analytics. How does ST’s Edge AI Suite support developers in optimizing AI models for the STM32N6, and what industries stand to benefit the most from this innovation?

Ans: Through three main tools in the Edge AI Suite from ST, developers gain complete functionality to improve AI models for the STM32N6 platform: STM32Cube.AI and ST Edge AI Developer Cloud and STM32 model zoo. The tools in this platform optimize AI model deployment on the Neural-ART Accelerator of STM32N6 while supporting the entire process from data preparation to code generation. The STM32N6 has the potential to revolutionize multiple sectors including automotive production, automotive components and consumer electronics together with healthcare and industrial automation markets. The STM32N6 allows advanced driver assistance systems (ADAS) in automotive applications as it provides healthcare products with real-time data analysis capabilities. Through their suite developers can build effective edge AI solutions which operate throughout numerous applications.

Looking ahead, how does STMicroelectronics envision the future of AI-accelerated microcontrollers, and what role will the STM32N6 series play in shaping next-generation embedded systems?

Ans: STMicroelectronics envisions a future where AI-accelerated microcontrollers like the STM32N6 series play a pivotal role in edge computing, enabling smarter, more efficient, and autonomous embedded systems. The STM32N6, with its Neural-ART Accelerator, is designed to handle complex AI tasks such as computer vision and audio processing with exceptional efficiency. Its energy-optimized AI processing will drive advancements across automotive, healthcare, consumer electronics, and industrial automation, enabling real-time data analysis, improved user experiences, and enhanced operational efficiency. As AI at the edge continues to evolve, the STM32N6 series will be instrumental in shaping intelligent, responsive, and secure next-generation embedded systems.

Sources:

STMicroelectronics to boost AI at the edge with new NPU-accelerated STM32 microcontrollers – ST News

STM32N6 series – STMicroelectronics

Data brief – STM32N6-AI – Artificial intelligence (AI) ecosystem for STM32N6 high-performance microcontroller with Neural-ART Accelerator

STM32N6-AI – AI software ecosystem for STM32N6 with Neural-ART accelerator – STMicroelectronics

Microcontrollers-stm32n6-series-overview.pdf

The post STMicroelectronics enables unmatched edge AI performance on MCU with STM32N6 appeared first on ELE Times.