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The 3D Printing Industry in India: Growth, Opportunities, and Challenges

ELE Times - Wed, 03/12/2025 - 13:27

The 3D printing industry in India has witnessed remarkable growth over the past decade, evolving from a niche technology to a significant player in the manufacturing ecosystem. As of 2023, India’s 3D printing market was valued at approximately USD 61.4 million and is projected to reach USD 314.0 million by 2030, reflecting a compound annual growth rate (CAGR) of 26.3%. This rapid expansion indicates the increasing adoption of additive manufacturing across various industries, fueled by advancements in technology, governmental initiatives, and rising awareness of its economic and environmental benefits.

Government Initiatives and Policy Support

Recognizing the transformative potential of 3D printing, the Government of India has introduced a national strategy aimed at fostering a robust additive manufacturing ecosystem. This strategy seeks to establish India as a global hub for design, development, and deployment of 3D printing technologies. Among the key objectives of this initiative is the promotion of 100 new startups in the 3D printing sector by 2025, alongside the development of 50 new technologies to enhance additive manufacturing capabilities. Additionally, the government aims to create approximately 100,000 new jobs and facilitate the production of 500 new products using 3D printing technology. These policies not only support innovation and investment but also encourage the integration of 3D printing into mainstream manufacturing processes.

Industrial Applications of 3D Printing in India

3D printing technology is being adopted across multiple sectors in India, revolutionizing traditional manufacturing methods. In healthcare, 3D printing is used for creating patient-specific implants, prosthetics, and anatomical models. These innovations enhance surgical precision and patient outcomes while reducing medical costs. The automotive industry benefits from 3D printing through rapid prototyping, tooling, and lightweight component production, which reduces production cycles and improves vehicle efficiency.

In aerospace, the use of additive manufacturing allows for the creation of complex, lightweight parts that meet stringent performance standards, leading to improved fuel efficiency and reduced emissions. Similarly, the jewelry industry leverages 3D printing to produce intricate designs with high precision, enabling mass customization and reduced production time. Furthermore, construction firms in India are experimenting with 3D printing to build affordable housing units, addressing the demand for sustainable and cost-effective infrastructure solutions.

Market Growth and Driving Factors

The Indian 3D printing market is experiencing substantial growth, driven by several key factors. Technological advancements have significantly improved printing speed, material compatibility, and efficiency, making 3D printing more accessible to businesses of all sizes. Additionally, cost efficiency plays a crucial role in the widespread adoption of additive manufacturing, as it minimizes material wastage and accelerates production timelines, leading to substantial cost savings for industries such as automotive, healthcare, and consumer goods.

Another driving force behind the growth of 3D printing in India is the increasing demand for customization. Consumers today prefer personalized products, whether in the form of customized medical implants, unique jewellery designs, or tailored industrial components. The ability of 3D printing to deliver high levels of customization at scale makes it an attractive solution for businesses looking to differentiate themselves in competitive markets.

According to market research, India’s 3D printing sector is expected to grow at a CAGR of 20-25% in the coming years. The growing need for faster, cost-effective, and tailor-made solutions across industries will further propel this expansion.

Entrepreneurial Opportunities in 3D Printing

The rapid expansion of 3D printing in India presents numerous business opportunities for entrepreneurs and investors. One of the most promising avenues is offering 3D design services, where businesses can provide 3D modelling and customization solutions for industries such as architecture, healthcare, and manufacturing. Another lucrative opportunity is establishing 3D printing service bureaus, which provide on-demand printing for sectors including education, consumer goods, and automotive.

Educational workshops and training programs are also in high demand as the adoption of 3D printing grows. Conducting certified courses on 3D modelling, printing technologies, and post-processing techniques can help bridge the skill gap in the industry. Furthermore, businesses can develop and sell unique 3D-printed products, ranging from customized home decor to industrial-grade machinery components, taking advantage of the versatility and precision of additive manufacturing.

Challenges in the Indian 3D Printing Industry

Despite its promising future, the 3D printing industry in India faces several challenges. High initial investment costs pose a barrier to entry for many startups and small-scale manufacturers. Advanced 3D printers and high-quality printing materials are expensive, limiting access to the technology for businesses operating on tight budgets.

Another significant challenge is the lack of a skilled workforce. Operating 3D printers, understanding additive manufacturing processes, and mastering post-processing techniques require specialized skills, which are currently in short supply. To address this issue, government and private institutions must invest in training and educational initiatives that equip professionals with the necessary expertise.

Additionally, the absence of standardized regulations and quality control measures in the industry creates uncertainties for businesses looking to adopt 3D printing. Establishing industry-wide standards and certification protocols will be crucial in ensuring product reliability and consumer trust.

Future Outlook of 3D Printing in India

Looking ahead, 3D printing is set to revolutionize manufacturing processes in India. With continuous advancements in material science, software development, and automation, 3D printing will become an integral part of the supply chain for industries such as healthcare, automotive, aerospace, and consumer electronics. Additionally, government initiatives, coupled with increased private sector investment, will further accelerate the adoption of additive manufacturing.

As businesses, educational institutions, and policymakers work together to address current challenges, the 3D printing sector will continue to thrive, contributing significantly to India’s industrial growth, job creation, and technological innovation. The next decade promises exciting developments in additive manufacturing, solidifying India’s position as a global leader in 3D printing technology.

In conclusion, while challenges remain, the opportunities in the Indian 3D printing industry far outweigh the obstacles. With strategic investments, skill development initiatives, and supportive government policies, 3D printing will play a pivotal role in India’s transition towards a more innovative, sustainable, and competitive manufacturing ecosystem.

The post The 3D Printing Industry in India: Growth, Opportunities, and Challenges appeared first on ELE Times.

Teradyne to acquire photonic integrated circuit test firm Quantifi

Semiconductor today - Wed, 03/12/2025 - 13:00
Automated test solutions provider Teradyne Inc of North Reading, MA, USA has entered into a definitive agreement to acquire privately held Quantifi Photonics Ltd of Auckland, New Zealand, which provides test solutions for scalable and cost-effective high-volume manufacturing of photonic integrated circuits (PICs), co-packaged optics and pluggable optics. The acquisition is expected to close in second-quarter 2025, subject to customary closing conditions and regulatory approval...

Top 10 Agriculture Drone Manufacturers in India

ELE Times - Wed, 03/12/2025 - 12:59

The integration of drone technology into agriculture has revolutionized farming practices in India, offering precision, efficiency, and sustainability. Agricultural drones assist in tasks such as crop monitoring, spraying, and mapping, enabling farmers to optimize resources and enhance yields. Several Indian companies have emerged as leaders in this domain, providing innovative drone solutions tailored to the unique challenges of Indian agriculture. Here are the top 10 agricultural drone manufacturers in India:

  1. ideaForge

Founded in 2007, ideaForge is a pioneer in the Indian UAV industry, known for its rugged and reliable drones. Their drones are equipped with advanced sensors and imaging capabilities, facilitating tasks like crop health monitoring and field mapping. The company’s emphasis on indigenous design and manufacturing ensures that their drones are well-suited for Indian agricultural conditions.

  1. Asteria Aerospace

Asteria Aerospace specializes in end-to-end drone solutions for various sectors, including agriculture. Their drones offer high-resolution aerial imagery and data analytics, aiding farmers in precision agriculture practices. By providing insights into crop health, soil conditions, and irrigation needs, Asteria’s drones enable informed decision-making.

  1. Garuda Aerospace

Garuda Aerospace focuses on creating low-cost, efficient drone solutions for agricultural applications. Their drones are used for pesticide spraying, crop monitoring, and soil analysis. By automating these processes, Garuda Aerospace helps reduce labour costs and increase operational efficiency for farmers.

  1. Skylark Drones

Skylark Drones offers comprehensive drone-based solutions for agriculture, including surveying, mapping, and analytics. Their platforms provide actionable insights into crop health and field variability, enabling precision farming. By leveraging their technology, farmers can optimize input usage and improve crop yields.

  1. Johnnette Technologies

Johnnette Technologies designs and manufactures drones specifically for agricultural applications. Their UAVs assist in crop health monitoring, precision spraying, and aerial seeding. The company’s focus on innovation ensures that their drones are equipped with the latest technology to meet the evolving needs of farmers.

  1. Dhaksha Unmanned Systems

Dhaksha Unmanned Systems provides drones tailored for agricultural spraying and monitoring. Their solutions help reduce the manual effort involved in pesticide application and ensure uniform spraying, leading to better pest and disease control.

  1. General Aeronautics

General Aeronautics offers drone solutions for precision agriculture, including crop health monitoring and targeted spraying. Their drones are designed to operate in diverse agricultural landscapes, providing farmers with accurate data to make informed decisions.

  1. Thanos Technologies

Thanos Technologies specializes in developing drones for agricultural applications such as crop monitoring and spraying. Their UAVs are equipped with advanced sensors that help assess crop health and optimize input usage, thereby enhancing productivity.

  1. Rucha Yantra

Rucha Yantra’s AGROJET-16 is an agricultural drone designed for spraying applications. The drone aims to improve the efficiency and effectiveness of pesticide application, reducing the reliance on manual labor and ensuring precise coverage.

  1. Paras Aerospace

Paras Aerospace provides drone solutions for agriculture, focusing on crop health analysis and precision spraying. Their drones are designed to assist farmers in monitoring large fields and applying inputs accurately, leading to better resource management.

Impact of Agricultural Drones on Indian Farming

The adoption of drones in Indian agriculture has led to significant improvements in various aspects:

  • Precision Agriculture: Drones enable precise monitoring of crop health, soil conditions, and irrigation needs. This precision allows farmers to apply fertilizers and pesticides only where necessary, reducing costs and environmental impact.
  • Resource Optimization: By providing detailed aerial imagery and data analytics, drones help in the efficient use of resources such as water, seeds, and agrochemicals. This optimization leads to increased productivity and sustainability.
  • Labour Efficiency: Drones automate labour-intensive tasks like spraying and monitoring, addressing labour shortages and reducing the physical strain on farmers.
  • Data-Driven Decisions: The data collected by drones empowers farmers to make informed decisions regarding crop management, leading to better yields and profitability.
Challenges and the Road Ahead

While the benefits are substantial, several challenges hinder the widespread adoption of drones in Indian agriculture:

  • Cost: The initial investment in drone technology can be prohibitive for small-scale farmers.
  • Regulatory Hurdles: Navigating the regulatory landscape for drone operations requires awareness and compliance, which can be daunting for individual farmers.
  • Technical Expertise: Operating and maintaining drones necessitates technical skills that many farmers may lack.

To overcome these challenges, collaborative efforts between the government, private sector, and educational institutions are essential. Subsidies, training programs, and awareness campaigns can play a pivotal role in making drone technology accessible to all farmers.

Conclusion

The integration of drones into Indian agriculture signifies a transformative shift towards modernization and efficiency. Companies like ideaForge, Asteria Aerospace, and Garuda Aerospace are at the forefront of this revolution, developing innovative solutions that cater to the unique needs of Indian farmers. As technology becomes more accessible and affordable, the widespread adoption of agricultural drones is poised to enhance productivity, sustainability, and profitability in India’s farming sector.

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How to tackle DRAM’s power conundrum

EDN Network - Wed, 03/12/2025 - 11:41

While DRAM designers strive for incremental improvements in performance, power, bit density, and capacity with each successive node, AI-driven data centers are putting a lot of pressure on memory makers to make further advances in power efficiency. Gary Hilson provides a sneak peek of how Micron—one of the three big DRAM producers—is reducing power consumption by employing high-K metal gate CMOS technology paired with design optimizations.

Read the full story at EDN’s sister publication, EE Times.

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A pitch-linear VCO, part 2: taking it further

EDN Network - Tue, 03/11/2025 - 15:58

Editor’s Note: This DI is a two-part series.

Part 1 shows how to make an oscillator with a pitch that is proportional to a control voltage.

Part 2 shows how to modify the circuit for use with higher supply voltages, implement it using discrete parts, and modify it to closely approximate a sine wave.

In Part 1, we saw how to make an oscillator whose pitch, as opposed to frequency, can be made proportional to a control voltage. In this second part, we’ll look at some alternative ways of arranging things for other possible applications.

Wow the engineering world with your unique design: Design Ideas Submission Guide

To start with, Figure 1 shows a revised version of the basic circuit, built with B-series CMOS to allow rail voltages of up to 18 or 20 V rather than the nominal 5 V of the original.

Figure 1 A variant on Part 1’s Figure 2, allowing operation with a supply of up to 20 V.

Apart from U2’s change from a 74HC74 to a CD/HEF4013B, the main difference is in U1. With a 12 V rail, TL062/072/082s and even LM358s and MC1458s all worked well, as did an LM393 comparator with an output pull-up resistor. The control voltage’s span increases with supply voltage, but remains at ~±20% of Vs. Note that because we’re only sensing within that central portion, the restricted input ranges of those devices was not a problem.

Something that was a problem, even with the original 5-V MCP6002, was a frequent inability to begin oscillating. Unlike the 74HC74, a 4013 has active-high R and S inputs, so U1a’s polarity must be flipped. It tends to start up with its output high, which effectively locks U2a into an all-1s condition, forcing Q1 permanently on. That explains the need for R5/C5/Q2. If (when!) the sticky condition occurs, Q2 will turn on, shorting C2 so that Q1 can turn off and oscillation commence. A reverse diode across R5 proved unnecessary at the low frequencies involved.

This could also be built using the extra constant-current sink, shown in Part 1’s Figure 4, but then U1 would need to have rail-to-rail inputs.

A version that lacks any logic

This is an extension of the first version that I tried, which was built without logic ICs. It’s neat and works, but U1a could only output pulses, which needed stretching to be useful. (Using a flip-flop guaranteed the duty cycle, while the spare section, used as a monostable, generated much better-defined reset pulses.) The circuit shown in Figure 2 works around this and can be built for pretty much any rail voltage you choose, as long as U1 and the MOSFETS are chosen appropriately.

Figure 2 This all-discrete version (apart from the op-amps) uses a second section to produce an output having a duty cycle close to 50%.

U1b’s circuitry is a duplicate of U1a’s but with half the time-constant. It’s reset in the same way and its control voltage is the same, so its output pulses have half the width of a full cycle, giving a square wave (or nearly so). Ideally, Q1 and Q3 should be matched, with C3 exactly half of C1 rather than the practical 47n shown. R7 is only necessary if the rail voltage exceeds the gate-source limits for Q1/3. (ZVP3306As are rated at 20 V max.)

Purity comes from overclocking a twisted ring

The final variation—see Figure 3—goes back to using logic and has a reasonably sinusoidal output, should you need that.

Figure 3 Here the oscillator runs 16 times faster than the output frequency. Dividing the pulse rate down using a twisted-ring counter with resistors on its 8 outputs gives a stepped approximation to a sine wave.

The oscillator itself runs at 16 times the output frequency. The pulse-generating monostable multivibrator (MSMV) now uses a pair of cross-coupled gates, and not only feeds Q1 but also clocks an 8-bit shift register (implemented here as two 4-bit ones), whose final output is inverted and fed back to its D input. That’s known as a twisted-ring or Johnson counter and is a sort of digital Möbius band. As the signal is shifted past each Q output, it has 8 high bits followed by 8 low ones, repeated indefinitely. U2c not only performs the inversion but also delivers a brief, solid high to U3a’s D input at start-up to initialize the register.

U2 and U3 are shown as high-voltage CMOS parts to allow for operation at much more than 5 V. Again, U1 would then need changing, perhaps to a rail-to-rail input (RRI) part if the extra current source is added. 74HC132s and 74HC4015s (or ’HC164s) work fine at ~5 V.

The Q outputs feed a common point through resistors selected to give an output which, though stepped, is close to a sine wave, as Figure 4 should make clear. R4 sets the output level and C4 provides some filtering. (Different sets of resistors can give different tone colors. For example, if they are all equal, the output (if stepped) will be a good triangle wave.)

Figure 4 Waveforms illustrating the operation of Figure 3’s circuit when it’s delivering ~500 Hz.

The steps correspond to the 15th and 17th harmonics, which, though somewhat filtered by C4/R4, are still at ~-45 dB. To reduce them, add a simple two-pole Sallen–Key filter, like that in Figure 5, which also shows the filtered spectrum for an output of around 500 Hz.

Figure 5 A suitable output filter for adding to Figure 3, and the resulting spectrum.

The 2nd and 3rd harmonics are still at around -60 dB, but the others are now well below -70 dB, so we can claim around -57 dB or 0.16% THD, which will be worse at 250 Hz and better at 2 kHz. This approach won’t work too well if you want the full 4–5-octave span (extra current sink) unless the filter is made tunable: perhaps a couple of resistive opto-isolators combined with R14/15, driven by another voltage-controlled current source?

All that is interesting, but rather pointless. After all, the main purpose of this design idea was to make useful audible tones, not precision sine waves, which sound boring anyway. But a secondary purpose should be to push things as far as possible, while having fun experimenting!

A musical coda

Given a pitch-linear tone source, it seemed silly not to try make some kind of musical thingy using a tappable linear resistance. A couple of feet, or about 10kΩ’s-worth, of Teledeltos chart paper (which I always knew would come in handy, as the saying goes) wrapped round a length of plastic pipe with a smooth, shiny croc clip for the tap or slider (plus a 330k pull-down) worked quite well, allowing tunes to be picked out as on a Stylophone or an air guitar. Electro-punk lives! Though it’s not so much “Eat your heart out, Jimi Hendrix” as “Get those earplugs in”.

Nick Cornford built his first crystal set at 10, and since then has designed professional audio equipment, many datacomm products, and technical security kit. He has at last retired. Mostly. Sort of.

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Top 10 Bomber Jets in the World: The Ultimate Aerial Dominators

ELE Times - Tue, 03/11/2025 - 14:25

Bomber jets play a crucial role in modern warfare, offering strategic deterrence, precision strike capabilities, and unparalleled aerial dominance. With advancements in stealth technology, electronic warfare, and long-range missile systems, the world’s leading air forces operate some of the most advanced bomber aircraft ever built. This article highlights the top 10 bomber jets based on speed, payload capacity, stealth, and combat effectiveness.

  1. Northrop Grumman B-21 Raider (USA)

Overview:

The B-21 Raider is the newest strategic stealth bomber under development for the U.S. Air Force. Designed to replace the B-2 Spirit, it is expected to be the backbone of America’s bomber fleet.

Key Features:

  • Stealth Technology: Advanced radar-evading capabilities
  • Payload Capacity: Estimated 15,000-20,000 kg
  • Range: Over 9,000 km
  • Multi-role Capabilities: Can carry nuclear and conventional weapons
  • AI and Network-Centric Warfare Integration
  1. Northrop Grumman B-2 Spirit (USA)

Overview:

The B-2 Spirit is the world’s first operational stealth bomber, designed for deep penetration missions in heavily defended airspace.

Key Features:

  • Radar Absorbent Materials: Minimizes radar cross-section
  • Payload Capacity: 23,000 kg
  • Range: 11,000 km without refueling
  • Precision Strike Capability: Advanced targeting systems
  1. Tupolev Tu-160M (Russia)

Overview:

Known as the “White Swan,” the Tu-160M is the fastest and heaviest supersonic bomber in the world. The modernized Tu-160M variant features new avionics and weapons systems.

Key Features:

  • Speed: Mach 2.05
  • Payload Capacity: 40,000 kg
  • Range: 12,300 km
  • Modernization: Equipped with new digital avionics and hypersonic missile capabilities
  1. Rockwell B-1B Lancer (USA)

Overview:

The B-1B Lancer is a variable-sweep wing bomber designed for supersonic speeds and low-altitude penetration.

Key Features:

  • Speed: Mach 1.25
  • Payload Capacity: 34,000 kg
  • Range: 9,400 km
  • Electronic Warfare Suite: Advanced countermeasures for survival in contested airspace
  1. Xian H-20 (China)

Overview:

China’s upcoming H-20 stealth bomber aims to rival the B-2 Spirit, with cutting-edge stealth technology and long-range capabilities.

Key Features:

  • Stealth Design: Similar to B-2 and B-21
  • Range: Estimated 8,500 km
  • Payload Capacity: Expected 20,000-25,000 kg
  • Strategic Nuclear and Conventional Strike Capabilities
  1. Tupolev Tu-95MS (Russia)

Overview:

Nicknamed the “Bear,” the Tu-95MS is a long-range, turboprop-powered strategic bomber known for its efficiency and extended operational life.

Key Features:

  • Speed: 925 km/h (Mach 0.8)
  • Range: 15,000 km with aerial refueling
  • Payload Capacity: 15,000 kg
  • Nuclear Cruise Missile Delivery Platform
  1. Sukhoi Su-34 Fullback (Russia)

Overview:

The Su-34 is a tactical bomber with significant air-to-ground strike capabilities, often referred to as a “fighter-bomber.”

Key Features:

  • Speed: Mach 1.8
  • Payload Capacity: 12,000 kg
  • Range: 4,500 km
  • Maneuverability: Fighter-like agility with bomber-level strike power
  1. Boeing B-52H Stratofortress (USA)

Overview:

The legendary B-52H remains in service for over 70 years, known for its endurance and heavy payload capacity.

Key Features:

  • Speed: Mach 0.85
  • Range: 14,000 km without refueling
  • Payload Capacity: 31,500 kg
  • Versatility: Capable of carrying nuclear and conventional weapons
  1. Dassault Mirage 2000D (France)

Overview:

A French multirole fighter-bomber, the Mirage 2000D specializes in precision strike missions.

Key Features:

  • Speed: Mach 2.2
  • Payload Capacity: 9,000 kg
  • Range: 3,300 km
  • Advanced Targeting Systems: Precision-guided munitions capabilities
  1. Shenyang JH-7 Flying Leopard (China)

Overview:

A Chinese fighter-bomber designed for ground attack and anti-ship missions.

Key Features:

  • Speed: Mach 1.75
  • Payload Capacity: 9,000 kg
  • Range: 3,900 km
  • Naval Strike Capability: Equipped with anti-ship missiles
Conclusion

The evolution of bomber jets reflects the technological advancements in stealth, speed, payload capacity, and mission versatility. The upcoming B-21 Raider, China’s H-20, and modernized versions of legacy bombers continue to push the boundaries of aerial warfare. As nations invest in next-generation air combat capabilities, these bomber jets remain the backbone of strategic deterrence and global power projection.

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Security by Design in Electronics: A Proactive Approach to Cybersecurity

ELE Times - Tue, 03/11/2025 - 14:19

With the increasing integration of electronics in critical applications such as automotive, healthcare, industrial automation, and consumer devices, security concerns have become paramount. “Security by Design” is a proactive approach that ensures cybersecurity is embedded into electronic systems from the conceptual stage rather than being patched later. This article explores the latest industry trends, best practices, and challenges in implementing Security by Design in electronics.

Why Security by Design Matters

Traditional security models often rely on reactive measures, addressing vulnerabilities only after they are exploited. This approach is no longer sufficient as cyber threats become more sophisticated and widespread. Security by Design ensures that electronic systems are built with security features ingrained, reducing risks and enhancing resilience.

  • Reduced Attack Surface: By incorporating security measures from the design phase, the potential vulnerabilities are minimized, making it harder for attackers to exploit weaknesses in hardware and software.
  • Regulatory Compliance: Various industries are enforcing strict cybersecurity regulations, including ISO/SAE 21434 for automotive cybersecurity and IEC 62443 for industrial control systems, necessitating security integration at every development stage.
  • Cost Efficiency: Fixing security flaws after deployment is significantly more expensive than incorporating security at the design level. Security by Design minimizes costly recalls, patching, and reputation damage.
  • Enhanced Trust and Reliability: As users become more security-conscious, products that incorporate robust cybersecurity measures build higher trust and long-term adoption.
Key Principles of Security by Design
  1. Hardware Root of Trust (RoT)

A secure foundation starts with hardware. Modern electronic devices incorporate Root of Trust (RoT) mechanisms to provide immutable trust anchors. These security elements ensure that the device only executes authenticated firmware and software components.

  • Secure Boot: This process ensures that only digitally signed and verified firmware is executed, preventing boot-level malware injections. Secure Boot is implemented using cryptographic techniques such as RSA-2048 or ECC-based signing.
  • Trusted Platform Module (TPM): TPM chips provide a secure vault for cryptographic keys, ensuring that sensitive credentials, digital certificates, and passwords are protected against tampering or extraction.
  • Physical Unclonable Functions (PUF): PUF technology leverages the inherent variations in silicon manufacturing to generate unique, unclonable cryptographic identities for devices, making hardware-level authentication robust.
  1. Secure Firmware Development

Firmware is the bridge between hardware and software, making it a prime target for attackers. Implementing security best practices in firmware development mitigates risks.

  • Secure Coding Standards: Adopting standards such as MISRA C (automotive) and CERT C (embedded systems) reduces common vulnerabilities like buffer overflows and memory corruption.
  • Firmware Signing and Authentication: Digitally signed firmware ensures that unauthorized modifications or tampered firmware are rejected by the device, maintaining integrity.
  • Over-the-Air (OTA) Secure Updates: Secure update mechanisms use cryptographic verification (e.g., ECDSA signatures) to prevent rollback attacks and unauthorized firmware injections.
  1. Zero Trust Architecture (ZTA)

Zero Trust is a cybersecurity model that assumes no implicit trust within a system and requires continuous verification.

  • Continuous Authentication: Devices and users must authenticate at every stage, employing multi-factor authentication (MFA) and cryptographic validation.
  • Micro-Segmentation: Network segmentation isolates sensitive components from untrusted environments, limiting the potential spread of malware and unauthorized access.
  • Real-Time Anomaly Detection: AI-powered security analytics continuously monitor system behavior to detect deviations from normal operation, triggering alerts for potential breaches.
  1. End-to-End Encryption

Data security is crucial in modern electronics, especially for IoT and cloud-connected devices. Encryption ensures confidentiality and integrity in data transmission and storage.

  • TLS 1.3 for Secure Communication: This cryptographic protocol eliminates weak encryption algorithms, enforcing strong cipher suites for protecting data-in-transit.
  • AES-256 Encryption for Data-at-Rest: Sensitive device information is protected using hardware-based encryption modules to mitigate unauthorized data extraction.
  • Quantum-Safe Cryptography: With quantum computing on the horizon, post-quantum cryptographic algorithms like CRYSTALS-Kyber and CRYSTALS-Dilithium are being integrated into security frameworks to future-proof devices.
  1. Supply Chain Security

A secure product is only as strong as its weakest component. Supply chain attacks have increased, necessitating rigorous vetting of components and firmware sources.

  • Supplier Security Audits: Regular assessment of component suppliers ensures that they adhere to security best practices.
  • Secure Hardware Provenance: Implementing blockchain-based tracking of hardware components provides verifiable authenticity and prevents counterfeiting.
  • Regular Risk Assessments: Threat modeling of supply chain processes ensures early detection of vulnerabilities and risk mitigation strategies.
Industry Trends in Security by Design
  1. Automotive Security

The rise of software-defined vehicles (SDVs) and autonomous driving has made automotive security a top priority. OEMs are adopting standards like ISO/SAE 21434 and UNECE WP.29 to enforce cybersecurity in connected vehicles.

  • Intrusion Detection and Prevention Systems (IDPS): These systems actively monitor in-vehicle networks for anomalous activities and unauthorized access attempts.
  • Secure CAN Bus Communication: Implementing MACsec encryption protects automotive communication from malicious interference and spoofing.
  • AI-Powered Anomaly Detection: Machine learning algorithms analyze driving patterns and vehicle behaviors to detect cybersecurity threats.
  1. Industrial IoT (IIoT) Security

Industry 4.0 has led to an increased attack surface for industrial control systems, necessitating strong security measures.

  • Secure OT-IT Convergence: Segregating operational technology (OT) from traditional IT networks prevents industrial cyber-espionage and ransomware attacks.
  • Firmware Integrity Attestation: Hardware-level security checks validate firmware integrity before execution to prevent tampering.
  • AI-Driven Predictive Threat Analytics: AI models analyze historical attack data to predict and prevent cyber threats before they occur.
  1. Chip-Level Security Advancements

Semiconductor companies are embedding advanced security features into SoCs and microcontrollers to enhance device security.

  • Arm TrustZone & RISC-V PMP: These security architectures enable hardware isolation for secure execution environments.
  • Intel SGX & AMD SEV: Secure enclave technologies protect sensitive computations from OS-level threats.
  • Post-Quantum Cryptographic Accelerators: Hardware-integrated PQC support ensures future resilience against quantum computing threats.
Challenges in Implementing Security by Design
  • Balancing Security and Performance: Stronger security measures often introduce computational overhead. Leveraging cryptographic hardware accelerators helps maintain efficiency.
  • Cost Constraints: Security implementations can increase development costs. However, long-term savings from preventing security breaches outweigh initial expenses.
  • Evolving Threat Landscape: Cyber threats constantly evolve, requiring continuous security updates and patching. AI-driven security analytics improve proactive threat detection.
  • Compliance and Regulatory Challenges: Adhering to global security standards requires robust security frameworks, structured security testing, and lifecycle management strategies.
Future of Security by Design in Electronics
  1. AI-Driven Security

AI is transforming cybersecurity by enabling real-time anomaly detection and automated threat mitigation.

  • Adaptive Authentication: AI models analyze user behavior to detect suspicious access attempts.
  • Behavioral Anomaly Detection: ML algorithms detect deviations from normal device operations to identify cyber threats.
  • Automated Security Patch Deployment: AI-driven updates help close vulnerabilities without manual intervention.
  1. Blockchain for IoT Security

Blockchain enhances trust and traceability in device security frameworks.

  • Decentralized Identity Management: Prevents unauthorized device authentication.
  • Secure Firmware Provenance Tracking: Ensures software authenticity and tamper-proof updates.
  • Tamper-Proof Transaction Logs: Protects against log manipulation and fraud.
Conclusion

Security by Design is no longer optional—it is imperative for safeguarding electronic systems in an era of increasing cyber threats. As cyberattacks grow in complexity, integrating security from the outset ensures resilience, regulatory compliance, and trustworthiness. Future trends like AI-driven security, quantum-resistant cryptography, and blockchain-based trust mechanisms will further strengthen the security landscape, making it crucial for industries to adopt proactive cybersecurity strategies today.

The post Security by Design in Electronics: A Proactive Approach to Cybersecurity appeared first on ELE Times.

Get ready for three days of luminous odyssey with LED Expo Mumbai

ELE Times - Tue, 03/11/2025 - 13:13

Combining the comfort of automation, customisation, intelligence and energy efficiency – the lighting industry is erupting with various innovations. Organised by Messe Frankfurt Trade Fairs India, LED Expo Mumbai is India’s only dedicated platform covering everything light. With 200+ exhibitors featuring about 6,000+ products, the upcoming edition of LED Expo Mumbai will be held from 3 – 5 April 2025 at the Bombay Exhibition Centre, Mumbai, organised by Messe Frankfurt Trade Fairs India.

LED Expo Mumbai will present a unique amalgamation of LED lighting solutions that not only serves the lighting industry but also delves deep into relatively new concepts such as smart lights, LEDs for design and décor, LEDs for atmospheric lighting and wellness, and problem-solving innovations such as biomimicry in lighting applications. The upcoming edition has registered growth from the electrical segment with 20+ exhibitors.

Crucial industry highlights surfaced from an exhibitor survey conducted with those participating in the upcoming edition, highlighted the following:

  • Architectural projects and commercial buildings have shown a greater adoption of smart lighting and automation products. However, the story changes in tier-2 and tier-3 cities where the adoption of such products is on a slower pace. Common hindrances like supply chain, power outages, etc., are challenging the large-scale adoption.
  • Exhibitors also pointed out that many components are sourced internationally.
  • To make the LED lighting industry self-reliant, government schemes are encouraging the localisation of components and high-quality production of LED products. India’s LED lighting industry is growing steadily with key initiatives like the Smart Cities Mission and the growing demand for housing in India.
  • It is also active in installing solar-based LED lights under the rural electrification programme, especially in the northeast

Expressing his thoughts, Mr Raj Manek, Executive Director of Messe Frankfurt Asia Holdings Ltd, stated: “The Indian infrastructure landscape has witnessed remarkable growth, opening new avenues for the LED lighting industry. Beyond illumination, LED technology is revolutionising with applications such as beautification projects, indoor and outdoor decoration, wellness, street lighting and public places lighting, amongst many others. LED lights – apart from being energy efficient are becoming more brighter, keeping down the energy

consumption. I am happy to share that the LED and the lighting industry will once again unite at LED Expo Mumbai 2025 to present the innovations for the future towards which India is advancing. Over the years, we have also observed a significant rise in participation from the electrical segment, further strengthening the ecosystem.”

During the show, curated knowledge sessions will bring industry experts on the dais sharing insights from their experience in the segment.

3 April 2025 | Panel Discussion

  • CXO Power Panel – Balancing Design, Innovation and Manufacturing Excellence in the Lighting Industry” by Women In Lighting, India

4 April 2025 |Technical Workshops

  • Acoustic Lights” by Silence Acoustics
  • Biomimicry Designs & their Impact on the environment” by Studio Black Canvas
  • Intelligent LED Power Supplies: Importance of safety standards and energy saving! Achieve the 2050 net-zero carbon emission target through energy conservation
  • Panel Discussionin collaboration with Indian Society of Landscape Architecture (ISOLA)

Some growing applications in India’s LED lighting industry are landscape lighting in infrastructure projects and floodlights in stadiums. These are predicted to drive the growth of the luminaires segment. As India plans to a rapid transformation with large-scale public projects. A recent report by Mordor Intelligence pointed out that the industrial and warehouse segment dominates the Indian LED lighting industry, with nearly 58% of the total indoor LED lighting market share in 2024. It also states that automotive headlights have emerged as the dominant segment in India’s automotive utility LED lighting market accounting approximately 35% market share in 2024.

The event has garnered support from the prestigious industry bodies and associations including: Brihanmumbai Electric Supply and Transport (BEST), Energy Efficiency Services Limited (EESL) – a unit of the Ministry of Power, Maharashtra Energy Development Agency (MEDA) – a Government of Maharashtra Institute, Ministry of Electronics and Information Technology (MeitY), The Electric Merchants Association (EMA) and Women in Lighting India (WIL).

The upcoming event promises to display an engaging showcase of lighting solutions that are the future of connected lighting solutions, sensor-based lighting, energy-efficient lighting, landscape lighting, decorative and architectural lights and much more, influencing the professionals thoughtfully using lighting and LED products regularly. Prestigious brands like Aastha LED, Demak Italy, Power Plazzo, Network INC, Tektroniks, JN Lighting LLP (Tinge) and Zylos, among others are set to unveil their latest innovations. With this, LED Expo Mumbai will continue to elevate the experience of the exhibitors and visitors offering a dynamic marketplace for industry dialogues and future-ready solutions.

LED Expo Mumbai is a part of Messe Frankfurt’s Light + Building Technology fair portfolio, which is headlined by the biennial Light + Building event in Frankfurt, Germany.

The post Get ready for three days of luminous odyssey with LED Expo Mumbai appeared first on ELE Times.

Renesas Extends Mid-Class AI Processor Line-Up with RZ/V2N Integrating DRP-AI Accelerator for Smart Factories and Intelligent Cities of Tomorrow

ELE Times - Tue, 03/11/2025 - 12:47

Realizing Advanced Endpoint Vision AI While Reducing System Size and Cost with a Power-Efficient MPU that Eliminates the Need for Cooling Fans

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today expanded its RZ/V Series of microprocessors (MPUs) with a new device that targets the high-volume vision AI market. Similar to its high-end device, the RZ/V2H, the new RZ/V2N MPU comes with Renesas’ proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, boasting 10 TOPS/W (Tera Operations Per Second Per Watt) power efficiency and an AI inference performance of up to 15 TOPS through its advanced pruning (Note 1) technology. With the latest addition of the RZ/V2N, the RZ/V series has now expanded to cover a full range of markets, from the low-end RZ/V2L (0.5TOPS) to the high-end RZ/V2H (up to 80 TOPS).
The new MPU is significantly smaller than the RZ/V2H, with its package area measuring only 15 mm square, reducing the area required for mounting by 38%. Inheriting the advanced features of the RZ/V series, the RZ/V2N combines high AI performance with low power consumption. These optimized features suppress heat generation, eliminating the need for additional cooling fans and reducing the size and cost of embedded systems. Developers can easily implement vision AI in a wide range of applications, from AI cameras for traffic and congestion analysis in commercial facilities, industrial cameras for visual inspection on production lines, to driver monitoring systems for behavior analysis.
Renesas will showcase a live demonstration of the RZ/V2N at embedded world 2025 in Nuremberg, Germany, March 11-13, 2025, at the Renesas booth, Hall 1 Stand 234 (1-234).
Double-angle image processing with two cameras
Similar to the RZ/V2H, the new RZ/V2N is equipped with four best-in-class Arm® Cortex®-A55 CPU cores and a single Cortex-M33 core, coupled with a high-quality image signal processor (ISP), Arm Mali-C55. The RZ/V2N also has two channels of MIPI camera interfaces, which allow two cameras to be connected to capture double-angle images. The two-camera system significantly improves spatial recognition performance compared to a single camera system and enables more precise human motion line analysis and fall detection. Furthermore, the dual-camera system captures images from different locations, allowing a single chip to count cars in a parking lot and recognize license plates efficiently.
“Since launching the RZ/V2H last year to target next-generation robotics requiring vision AI and real-time control, we have received tremendous interest in using the Renesas DRP-AI accelerator,” said Daryl Khoo, VP of Embedded Processing at Renesas. “With the addition of the RZ/V2N, sharing the same lineage as the RZ/V2H, we are extending our reach to address mid-range applications, particularly endpoint vision AI that does not need to be realized with power hungry designs. I am excited that our customers will be able to select the best AI MPU from Renesas that meets their system and budget requirements.”
“Vision AI applications across markets including smart city, enterprise and industrial are broad and varied, but all demand sustained performance and efficient processing,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “Renesas’ new RZ/V2N MPU leverages the leading-edge capabilities of the Arm compute platform to deliver against the performance and efficiency needs of next generation vision AI use cases.”
Comprehensive development environment
The RZ/V2N will be available with the Renesas evaluation board kit and a software development environment, along with various AI applications covering more than 50 use cases that are provided in the AI Applications and AI SDK (GitHub). The SDK assists users without in-depth AI knowledge to quickly evaluate and develop AI applications, shortening time to market. Additionally, partner companies will provide a SOM (system-on-module) board, SBC (single board computers), camera modules, and other products that incorporate the Renesas RZ/V2N. This reduces hardware design work, allowing developers to focus on AI application development and bring their products to market rapidly.
AI Camera Solution Winning Combination
Renesas has developed the AI Camera Solution, which targets a variety of applications, including factories, public facilities, and commercial facilities. This solution consists of the RZ/V2N, power management IC, and real-time clock IC, and can be used as a reference for AI camera systems. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.
Availability 
The RZ/V2N will be available from Renesas and its authorized distributors starting March 19. For more information, please visit: https://www.renesas.com/rzv2n

The post Renesas Extends Mid-Class AI Processor Line-Up with RZ/V2N Integrating DRP-AI Accelerator for Smart Factories and Intelligent Cities of Tomorrow appeared first on ELE Times.

BluGlass boosts single-mode GaN laser chip output by 67% to record 1250mW

Semiconductor today - Tue, 03/11/2025 - 12:20
BluGlass Ltd of Silverwater, Australia has reported what is reckoned to be record single-spatial-mode power of 1250mW from a single gallium nitride (GaN) laser chip, an increase of more than 67% from the prior 750mW (reported as recently as January, at Photonics West 2025, demonstrating the rapid growth of the firm’s technology capabilities)...

Nichia wins German patent infringement lawsuits concerning Dominant LEDs

Semiconductor today - Tue, 03/11/2025 - 12:06
On 13 and 21 January, respectively, the Munich District Court of Germany ruled in favor of Nichia Corp of Tokushima, Japan — the world’s largest gallium nitride (GaN)-based light-emitting diode/laser diode (LED/LD) manufacturer and inventor of high-brightness blue and white LEDs — in two patent infringement lawsuits and issued two acknowledgment judgments in relation to Nichia’s claims for patent infringement by certain automotive LED products of Malaysia-based LED manufacturer Dominant Opto Technologies Sdn Bhd...

How controllers tackle storage challenges in AI security cameras

EDN Network - Tue, 03/11/2025 - 09:08

Visual security systems have evolved enormously since the days of infrared motion detectors and laser tripwires. Today, high-definition cameras stream video into local vision-processing systems. These AI-enabled surveillance cameras detect motion, isolate and identify objects, capture faces, expressions, and gestures, and may even infer the intent of people in their field of view. They record interesting videos and forward any significant events to a central security console.

Integrating AI capabilities transforms security cameras into intelligent tools to detect threats and enhance surveillance proactively. Intent inference, for example, allows security cameras to quickly predict suspicious behavior patterns in crowds, retail stores, and industrial facilities. Case in point: AI-enabled cameras can detect unattended packages, license plates, and people in real time and report them to security personnel.

According to a report from Grandview Research, due to the evolving use of AI technology and growing security concerns, the market for AI-enabled security cameras is projected to grow at a CAGR of over 18% between 2024 and 2032. This CAGR would propel the market from $7.55 billion in 2023 to $34.2 billion in 2032.

 

The need for compute power

Increasing sophistication demands growing computing power. While that antique motion sensor needed little more than a capacitor and a diode, real-time object and facial detection require a digital signal processor (DSP). Advanced inferences such as expression or gesture recognition need edge AI: compact, low-power neural-network accelerators.

Inferring intent may be a job for a small-language model with tens or hundreds of millions of parameters, demanding a significantly more powerful inference engine. Less obviously, this growth in functionality has profound implications for the security camera’s local non-volatile storage subsystem. Storage, capacity, performance, reliability, and security have all become essential issues.

Storage’s new role

In most embedded systems, the storage subsystem’s role is simple. It provides a non-volatile place to keep code and parameters. When the embedded system is initialized, the information is transferred to DRAM. In this use model, reading happens only on initialization and is not particularly speed sensitive. Writing occurs only when parameters are changed or code is updated and is, again, not performance sensitive.

The use case for advanced security cameras is entirely different. The storage subsystem will hold voluminous code for various tasks, the massive parameter files for neural network models, and the continuously streaming compressed video from the camera.

To manage energy consumption, designers may shut down some processors and much of the DRAM until the camera detects motion. This means the system will load code and parameter files on demand—in a hurry—just as it begins to stream video into storage. So, both latency and transfer rate are essential.

In some vast neural network models, the storage subsystem may also have to hold working data, such as the intermediate values stored in the network’s layers or parameters for layers not currently being processed. This will result in data being paged in and out of storage and parameters being loaded during execution—a very different use model from static code storage.

Storage meeting new needs

Except in scale, the storage use model in these advanced security cameras resembles less a typical embedded-system model than what goes on in an AI-tuned data center. This difference will impose new demands on the camera’s storage subsystem hardware and firmware.

The primary needs are increased capacity and speed. This responsibility falls first upon the NAND flash chips themselves. Storage designers use the latest multi-level and quad-level, stacked-cell NAND technology to get the capacity for these applications. And, of course, they choose chips with the highest speeds and lowest latencies.

However, fast NAND flash chips with terabit capacity can only meet the needs of security-camera applications if the storage controller can exploit their speed and capacity and provide the complex management and error correction these advanced chips require.

Let’s look at the storage controller, then. The controller must support the read-and-write data rates the NAND chips can sustain. And it must handle the vast address spaces of these chips. But that is just the beginning.

Storage controller’s tasks

Error correction in NAND flash technology is vital. Soft error rates and the deterioration of the chips over time make it necessary to have powerful error correction code (ECC) algorithms to recover data reliably. Just how important, however, is application dependency? A wrong pixel or two in a recorded video may be inconsequential. Neural network models can be remarkably tolerant of minor errors.

But a bad bit in executable code can turn off a camera and force a reboot. A wrong most significant bit (MSB) in a parameter at a critical point in a neural network model, especially for small-language models, can result in an incorrect inference. So, a mission-critical security camera needs powerful, end-to-end error correction. The data arriving at the system DRAM must be precisely what was initially sent to the storage subsystem.

This requirement becomes particularly interesting for advanced NAND flash chips. Each type of chip—each vendor’s process, number of logic levels per cell, and number of cells in a stack—will have its error syndromes. Ideally, the controller’s ECC algorithms will be designed for the specific NAND chips.

Aging is another issue—flash cells wear out with continued reading and writing. However, as we have seen, security cameras may almost continuously read and write storage during the camera’s lifetime. That is the worst use case for ultra-dense flash chips.

To make matters more complex, cameras are often mounted in inaccessible locations and frequently concealed, so frequent service is expensive and sometimes counterproductive (Figure 1). The video they record may be vital for safety or law-enforcement authorities long after it is recorded, so degradation over time would be a problem.

Figure 1 Managing flash cell endurance is an essential issue since cameras are often mounted in inaccessible locations. Source: Silicon Motion

The controller’s ability to distribute wear evenly across the chips, scrub the memory for errors, and apply redundant array of independent disks (RAID)-like techniques to correct the mistakes translates into system reliability and lower total cost of ownership.

To counter these threats, the storage controller must be forearmed. Provisions should be made for fast checkpoint capture, read/write locking of the flash array, and a quick, secure erase facility in case of power loss or physical damage. To blunt cyberattacks, the storage subsystem must have a secure boot process, access control, and encryption.

A design example

To appreciate the level of detail involved in this storage application, we can focus on just one feature: the hybrid zone. Some cells in a multi-level or quad-level NAND storage can store only a single bit of data instead of two or four bits. The cells used as single level are called hybrid zones. They will have significantly shorter read and write latencies than if they were being used to store multiple bits per cell.

The storage controller can use this feature in many ways. It can store code here for fast loading, such as boot code. It can store parameters for a neural network model that must be paged into DRAM on demand. For security, the controller can use a hybrid zone to isolate sensitive data from the access method used in the rest of the storage array. Or the controller can reserve a hybrid zone for a fast dump of DRAM contents in case of system failure.

Figure 2 Here is how the FerriSSD controller offers a hybrid zone, the unique capability of partitioning a single NAND die into separate single-level cells (SLC) and multi-level cells/3D triple-level cells (MLC/TLC zones). Source: Silicon Motion

The hybrid zone’s flexibility ultimately supports diverse storage needs in multi-functional security systems, from high-speed data access for real-time applications such as authentic access to secure storage for critical archived footage.

Selecting storage for security cameras

Advanced AI security cameras require a robust storage solution for mission-critical AI video surveillance applications. Below is an example of how a storage controller delivers enterprise-grade data integrity and reliability using ECC technology.

Figure 3 This is how a storage controller optimizes the choice of ECC algorithms. Source: Silicon Motion

The storage needs of advanced security cameras go far beyond the simple code and parameter storage of simple embedded systems. They increasingly resemble the requirements in cloud storage systems and require SSD controllers with error correction, reliability, and security features.

This similarity also places great importance on the controller vendor’s experience—in power-conscious edge environments, high-end AI cloud environments, and intimate relationships with NAND flash vendors.

Lancelot Hu is director of product marketing for embedded and automotive storage at Silicon Motion.

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The post How controllers tackle storage challenges in AI security cameras appeared first on EDN.

MACOM demos RF and optical products at SATELLITE 2025

Semiconductor today - Mon, 03/10/2025 - 20:52
MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) is showcasing its latest satellite communications products in booth 1333 at SATELLITE 2025 in the Walter E. Washington Convention Center, Washington DC, USA (11–13 March)...

CGD’s Combo ICeGaN combines ICeGaN HEMT ICs and IGBTs in parallel

Semiconductor today - Mon, 03/10/2025 - 20:40
Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has revealed more details about a solution that will enable it to address electric vehicle (EV) powertrain applications over 100kW (a market worth over $10bn) with its ICeGaN gallium nitride technology. Combo ICeGaN combines smart ICeGaN HEMT ICs and IGBTs (insulated-gate bipolar transistors) in the same module or IPM, maximizing efficiency and offering a cost-effective alternative to expensive silicon carbide (SiC) solutions...

I put together another Freeform Nixie Clock

Reddit:Electronics - Mon, 03/10/2025 - 18:58
I put together another Freeform Nixie Clock

So, I tried to free form a similar clock I free formed earlier this year, except it includes the hours, minutes, and seconds. I wanted to see if I could possibly improve my free forming builds compared with the first clock I built, but honestly, it still came out ugly to me.

At any rate, I kinda like the scraggly look of Freeform/dead bug electronics assembly. I'll never be as good as Mohit Bhoite, Eirik Brandal, etc. However, I noticed that building stuff like this is calming to me. It's difficult and stressful, although I find that when my job is pissing me off, I spent 15 minutes working on this clock to calm me down.

The awesome part was after I assembled everything onto the base, I decided to just power it up and see if it worked. At first, I set my power supply to 12v and limited the current to 100mA. It powered up and hit the 100mA limit. I slowly increased the current, and when I hit 250mA, all the nixies counted down from 9 to 0, then counted up from 0 to 9, and displayed the time. Sort of. I had to 'reset' the DS1302 RTC, installed the button cell battery, and cycled the power...and it just worked. I set the time, and there it was, a working nixie Freeform clock! At first I was excited, then thought, "but now I have nothing to troubleshoot..."

Where do I go from here? I don't know; I may be seriously thinking about free forming Keith Bayern's design, a discreet component nixie clock. That kit contains over 1,000 components, but it might be doable and pretty impressive

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