Новини світу мікро- та наноелектроніки

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Introduction

A single-stage isolated converter, such as a bidirectional capacitor-inductor-inductor-inductor-capacitor (CLLLC), is a popular converter type in energy storage systems (ESSs) to save system costs and improve power density. The gain curve of an CLLLC is flatter, however, when the switching frequency (fs) is higher than the series resonant frequency (fr) the gain curve will be undesirably flat. The parasitic capacitance of the transformer and MOSFETs would also significantly impact the converter gain [1], which will lead the converter’s output voltage out of regulation. In this power tip, I will introduce a CLLLC control algorithm and a synchronous rectifier (SR) control method to eliminate this nonlinearity, using a 3.6-kW prototype converter to verify the performance. Figure 1 is a block diagram of a residential ESS.

Figure 1 Residential ESS block diagram with bidirectional power factor correction (PFC)/inverter, bidirectional DC/DC converter, and maximum power point tracking (MPPT). Source: Texas Instruments

Design considerations in the control stage

Figure 2 shows the circuit topology of the full-bridge CLLLC resonant converter with the parasitic capacitors. This topology consists of a symmetric resonant tank and full-bridge structure.

Figure 2 The circuit topology of the full-bridge CLLLC converter with parasitic capacitors. Source: Texas Instruments

Figure 3 shows the ideal gain curve of the CLLLC. Similar to an LLC converter, variable frequency control is a popular control scheme for a CLLLC resonant converter.

Figure 3 An ideal CLLLC gain curve that uses variable frequency control. Source: Texas Instruments

As mentioned earlier, the gain curve is flat when fs exceeds fr. Moreover, with the power level increasing, the converter needs to parallel more FETs on the battery side to handle more current, which means that the output capacitance (Coss) on the output full-bridge FETs will be extremely large. Considering the parasitic parameters of transformer interwinding capacitance and Coss, the non-monotonic gain curve at high frequency is serious, which corresponds to a light-load condition, as shown in Figure 4.

Figure 4 The CLLLC gain curve considering parasitic parameters such as the transformer interwinding capacitance and Coss. Source: Texas Instruments

In this case, frequency control is useless. Hiccup mode is a popular method for addressing CLLLC resonant converter nonmonotonic features, but this method is not suitable in battery applications because the converter needs to deliver high current when the battery voltage is low. Pulse-width modulation (PWM) and phase-shift control could resolve this issue, but PWM control will make the transistors work at a hard-switching state, which decreases efficiency and limits the operational frequency. Therefore, phase-shift control is a better choice.

Control logic

Figure 5 shows the frequency and phase-shift mixed-control scheme diagram. The battery voltage is low during startup, so the converter needs to soft start with low charging current to limit the high current spike and prolong the battery life. It is a limited effect to soft start from a high frequency if the resonant inductor value or frequency is not high enough. When the battery charges to near full capacity, it will trickle charge with a small current and maintain a constant voltage. Both cases correspond to a light-load condition for the converter. At light load, the output voltage tends to rise because of the parasitic capacitance and could eventually go out of regulation based on previous analysis; phase-shift control can help regulate the output voltage in this state. The controller’s calculation result decides whether the converter needs to enter phase-shift mode or not.

Figure 5 The control scheme in different charge states. Note, the battery voltage is low during startup, so the converter needs to soft start with low charging current to limit the high current spike and prolong the battery life. Source: Texas Instruments

Figure 6 shows the modulation switch between frequency and phase shift. When the load decreases, the frequency will increase to regulate the output voltage. If the calculated maximum frequency is higher than the setting value, the converter will enter phase-shift modulation; then when the load increases, the phase-shift angle will decrease in order to regulate the output voltage. The converter will enter frequency mode again when the phase-shift angle decreases to zero.

Figure 6 The control scheme between frequency and phase-shift modes. When the load decreases and the phase-shift angle is zero, the frequency will increase to regulate the output voltage (frequency mode). If the maximum frequency is higher than the setting value, the phase shift angle decreases to regulate output voltage (phase shift mode). Source: Texas Instruments

Problems caused by parasitic capacitance

The MOSFETs’ Coss also has this effect under phase-shift mode; the tank current will oscillate with these capacitors, as shown in Figure 7.

Figure 7 The tank current waveforms under phase-shift mode in open loop. Source: Texas Instruments

Figure 8 plots a gain comparison of a CLLLC converter with and without considering MOSFET Coss. According to the figure, there will be fluctuation in the gain curve. In this case, the controller may adjust the phase-shift angle to the wrong direction under closed-loop control, resulting in a large current spike.

Figure 8 The gain curve under phase-shift mode with and without COSS. Source: Texas Instruments

Solution for the gain problem

To eliminate the non-monotonic of gain, employing SR control as shown in Figure 9 could resolve this issue. Turning on either two upper or two lower SR switches at the same time during the tank current oscillation period will temporarily short the transformer’s secondary-side winding, such that Coss will not involve the resonant.

Figure 9 Proposed SR control scheme to eliminate the non-monotonic of gain. Source: Texas Instruments

Figure 10 shows the test result; there is no oscillation compared to Figure 8. For more detailed analysis and test results, see reference [2].

Figure 10 Gain curve under phase-shift mode using the proposed control scheme (grey line). Source: Texas Instruments

Experimental results

A prototype [3] uses this control scheme to verify the performance. Figure 11 shows the soft-start waveform and Figure 12 shows the tank current waveforms under phase-shift mode with the proposed control scheme.

Figure 11 The phase-shift soft start with 750 W of output power. Source: Texas Instruments

Figure 12 The tank current waveforms under phase-shift mode with the proposed scheme. Source: Texas Instruments

Figure 13 and Figure 14 show the frequency/phase-shift modulation switch test. From the test waveforms, the startup current is limited within 28 A with 750 W of output power. There is no oscillation in the tank current and the converter could change the modulation smoothly in different working conditions.

Figure 13 The phase-shift and frequency modulation switch: frequency mode with a 5-A load. Source: Texas Instruments

Figure 14 The phase-shift and frequency modulation switch: phase-shift mode with a 1-A load. Source: Texas Instruments

 Conclusion

The proposed frequency and phase-shift mixed-control scheme limits the inrush current during the startup stage and makes the gain linear at a light load condition. The converter could switch between frequency modulation and phase shift modulation smoothly. Besides, phase-shift control also introduces the non-monotonic gain issue and makes the current oscillate in the designs that have large COSS. The proposed SR control method can help solve the current oscillation issue and makes the gain monotonic.

Guangzhi Cui is a System Engineer at Texas Instruments, where he is responsible for developing power supply design. Guangzhi earned his M.S. degree in Electrical Engineering from Hong Kong University of Science and Technology in 2016; and his B.S. degree of Engineering from Hunan University in 2014.

 

Related Content

• Power Tips #102: CLLLC vs. DAB for EV onboard chargers
• Power Tips #92: High-frequency resonant converter design considerations, Part 2
• Power Tips #134: Don’t switch the hard way; achieve ZVS with a PWM full bridge
• Power Tips #117: Measure your LLC resonant tank before testing at full operating conditions
• Power Tips #97: Shape an LLC-SRC gain curve to meet battery charger needs
• Power Tips #94: How an upside-down buck offers a topology alternative to the non-isolated flyback

 References

1. Lee, Byoung-Hee, Moon-Young Kim, Chong-Eun Kim, Ki-Bum Park, and Gun-Woo Moon, “Analysis of LLC Resonant Converter Considering Effects of Parasitic Components.” Published in INTELEC 2009 – 31st International Telecommunications Energy Conference, Incheon, Korea (South), Oct. 18-22, 2009, pp. 1-6.
2. Tai, Will, Guangzhi Cui, and Sheng-Yang Yu, “Gain Optimization Control Method for CLLLC Resonant Converters Under Phase Shift Mode.” Published in PCIM Europe 2024; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nürnberg, Germany, June 11-13, 2024, pp. 2513-2518.
3. Cui, Guangzhi. n.d. “3.6kW Bidirectional CLLLC Resonant Converter Reference Design.” Tex as Instruments reference design No. PMP41042. Accessed Nov. 6, 2024.

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Aeluma Inc of Goleta, CA, USA – which uses compound semiconductor materials on large-diameter substrates to develop technologies for mobile, automotive, AI, defense & aerospace, communication and quantum computing – has been awarded a contract by the US National Aeronautics and Space Administration (NASA) to develop quantum dot photonic integrated circuits (PICs) on silicon. The technology targets next-generation space and aerospace applications, enabling capabilities such as free-space laser communication, autonomous navigation, and precision sensing...

I got bored and made a bench power supply to power my magic spinny and my blinkys. submitted by /u/JollyCompetition5272 [link] [comments]

A motion controller with even more possibilities: With the new MC 3602 B and MC 3606 B motion controllers, the selection and commissioning of drive systems is now even simpler. With the compact MC 3602/06 B, DC-motors, brushless DC-motors and linear motors can be operated with the typical position encoders as servo drive in accordance with CiA 402. Also new is the support of stepper motors with encoder as servo or without encoder in open-loop operation. The products “speak” EtherCAT, CANopen, RS232 and USB.

The new MC 3602 B variant is equipped with up to 2 A continuous output current for smaller motors and the MC 3606 B variant has up to 6 A continuous output current for medium-sized motors which simplifies work for engineers. For applications in which more than one motor technology is used, just one motor controller and a GUI are needed. The free FAULHABER “Motion Manager 7” software is available for installation and commissioning. With this, the drive is running in just a few steps. All main operating modes of the CiA 402 servo drive are offered. Integration is performed via CANopen or RS232, and for commissioning, primarily the USB interface is used. Additionally, an optional EtherCAT module enables cycle times as short as 1 ms. In conclusion, the motion controllers can also be operated without central control in stand-alone mode.

Everything from a single source

In combination with FAULHABER motors, the MC 3602 B and MC 3606 B deliver a sophisticated drive system with extensive protective functions. The products were developed for the operation of motors with ironless winding and offer high dynamics here. Standard motors – such as NEMA stepper motors – can likewise easily be operated with the MC 3602/06 B. They thereby represent a solid basis for a range of applications. Regardless of whether the application uses a stepper motor in open-loop or closed-loop operation, or in combination with brushless, linear or DC servomotors, the MC 3602/06 B provides a solution for nearly every requirement – in industrial automation or in laboratory automation, robotics, semiconductor processing or in use with measurement systems.

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NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech’s commitment to continuous process enhancement and operational excellence.

The wire bond pull test is a critical method used to assess the quality and integrity of wire bonds in microelectronics. Leveraging extensive historical data and its exceptional process yield rate, NEOTech’s manufacturing engineers developed a robust random sampling methodology that ensures testing efficiency without compromising quality. The new sampling plan has dramatically reduced average testing time from 2.5 hours per assembly to approximately 1 hour per assembly.

This innovative process is fully compliant with the stringent requirements of MIL-PRF-38534 and MIL-STD-883, ensuring that NEOTech meets the highest quality and reliability standards. The process has been implemented on mission-critical, high-frequency RF assemblies — products recognized in the industry as highly complex and challenging to manufacture. NEOTech’s success in achieving these advancements demonstrates its expertise in addressing the rigorous demands of such sophisticated microelectronics applications.

“Achieving greater than 99.99% production yields is a remarkable milestone,” said Daniel De Haro, General Manager of the NEOTech Chatsworth site. “But our team didn’t stop there. They went above and beyond to implement innovative sampling techniques and streamline testing processes to significantly improve production cycle times. I’m incredibly proud of our engineers, technicians, and manufacturing teams for their dedication to excellence and their commitment to setting new benchmarks in microelectronics manufacturing.”

The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures. These efforts ensured that the NEOTech team could maintain its exceptional yield rates while increasing throughput and efficiency for its customers’ microelectronics circuit assemblies.

At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high-reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics.

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I think this ceramic disk has gone bad, the dark line is much clearer in real life than in the photo too submitted by /u/the_potato_of_doom [link] [comments]

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Keysight’s EDA 2025 software leverages AI, ML, and Python integrations to reduce design time for complex RF and chiplet products. The tool suite enhances data manipulation, integration, and control of advanced simulators, enabling seamless workflows across multiple tools.

AI-optimized workflows allow engineers to move from simulation to verification and compliance with greater confidence. The software simulates fast digital interconnects using end-to-end component models and standards-compliant measurements, creating an accurate digital twin for complex electronic designs.

According to Keysight, the core benefits of the EDA 2025 software portfolio include:

• RF circuit design: Accelerate RF design with open, automatable workflows, Python integration, and multi-domain simulation. The Python toolkit consolidates load pull data into unified datasets for AI/ML model training.
• High-speed digital design: Create precise digital twins for complex standard-specific SerDes designs, including UCIe chiplets, memory, USB, and PCIe, with the Advanced Design System (ADS) 2025 release.
• Device modeling and characterization: Reduce model re-centering time by 10X through AI/ML capabilities in the IC-CAP 2025 release, while Python integrations streamline and automate the modeling process.

Learn more about Keysight EDA 2025 at the virtual launch event on December 3, 2024. To register, click here.

EDA software product page

Keysight Technologies

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Siemens is integrating its embedded automotive software with Infineon’s AURIX TC4x MCUs to enable advanced features in software-defined vehicles (SDVs). This collaboration supports OEMs in achieving production readiness for next-generation SDV capabilities.

Siemens’ Capital Embedded AR Classic software, based on AUTOSAR Classic Release R20-11, leverages an AUTOSAR-compliant architecture to enable the multicore, functional safety, and cybersecurity features of the AURIX TC4x. This pre-validated, feature-rich software simplifies OEMs’ homologation processes for functional safety and cybersecurity compliance.

The AURIX TC4x microcontrollers from Infineon play a critical role in automotive systems, managing functions like electric powertrain, battery management, ADAS, radar, and chassis. They combine enhanced power and performance with advances in virtualization, AI-based modeling, functional safety, cybersecurity, and networking, enabling next-gen E/E architectures and software-defined vehicles.

To learn more about Siemens’ AUTOSAR embedded software development capabilities, click here.

Siemens Digital Industries Software

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The GR716B radiation-hardened microcontroller from Frontgrade Gaisler handles multiple tasks over extended periods in space. This energy-efficient MCU is well-suited for supervision, monitoring, and control in satellite applications, adapting to various space systems with a broad range of standard interfaces, architectural features, and integrated analog functions.

Powered by a LEON3 SPARC V8 processor running at up to 100 MHz, the GR716B ensures deterministic software execution with multiple non-intrusive buses, fixed interrupt latency, and a cache-less architecture. Two real-time accelerators offload demanding tasks from the LEON3 and have access to tightly coupled memory for instructions and data. The MCU also includes 192 KiB of on-chip RAM and fault-tolerant memory controllers for off-chip memory access.

The GR716B offers robust radiation resilience, with a total ionizing dose (TID) tolerance of up to 100 krads and single event latch-up (SEL) immunity of >118 MeV·cm²/mg. Its I/O interfaces include a SpaceWire router, Ethernet, MIL-STD-1553B, CAN, PacketWire, programmable PWM, SPI with SPI-for-Space protocols, UART, I2C, and GPIO. Integrated analog functions feature radiation-hardened cores such as DAC, ADC, comparator, voltage reference, PLL, and all active components for a crystal oscillator.

Engineering models of the GR716B MCU are now available to alpha customers for integration into new missions.

GR716B product page

Frontgrade Gaisler 

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Sycamore, a full-range, all-silicon near-field micro speaker from xMEMs, is 1/7th the size and 1/3rd the thickness of conventional dynamic drivers. Coming in at just 8.41×9×1.13 mm and weighing only 150 mg, this tiny MEMS speaker delivers full-range sound while enabling thinner, lighter designs for open wireless stereo (OWS) earbuds, smartwatches, AR/VR headsets, and other mobile electronics.

Unlike the company’s Cypress micro speaker, designed for occluded in-ear ANC earbuds, Sycamore targets open-air listening devices. Its solid-state design and IP58 rating ensure durability and sweat resistance for active users.

With a first-order low-frequency roll-off, Sycamore matches the mid-bass performance of legacy drivers while extending sub-bass by up to 11 dB. It also extends high-frequency performance by up to 15 dB above 5 kHz, making it a strong near-field micro speaker or high-frequency tweeter alternative for laptops, automotive applications, and portable Bluetooth speakers.

xMEMS plans to sample the Sycamore micro speaker in Q1 2025, with mass production set for October 2025.

Sycamore product page

xMEMS Labs

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Renesas is sampling a trio of interface ICs for second-generation DDR5 multiplexed rank dual in-line memory modules (MRDIMMs). This complete memory interface chipset includes the RRG50120 multiplexed registered clock driver (MRCD), RRG51020 multiplexed data buffer (MDB), and RRG53220 power management integrated circuit (PMIC).

Gen 2 DDR5 MRDIMMs address the growing memory bandwidth demands of artificial intelligence, high-performance computing, and other data center applications. They deliver operating speeds of up to 10,000 MT/s, with future iterations targeting 12,800 MT/s.

The second-generation RRG50120 MRCD buffers the command/address bus, chip selects, and clocks between the host controller and DRAMs in MRDIMMs. It reduces power consumption by 45% compared to the first generation, improving heat management in high-speed systems. The Gen 2 RRG51020 MDB buffers data between the host CPU and DRAMs. Both the MRCD and MDB support speeds up to 12.8 Gbps. Optimized for high-current, low-voltage operation, the RRG53220 PMIC provides reliable electrical-over-stress protection and enhanced power efficiency.

Production availability of the RRG50120 MRCD, RRG51020 MDB, and RRG53220 PMIC is expected in the first half of 2025. To learn more about Renesas DDR5 products, click here.

Renesas Electronics 

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As I conceptually discussed last May, following up with a teardown nearly a year later (and earlier this year), master flash units mated to cameras’ hot shoes are often also capable of, whether via IR or various RF schemes, also controlling slave illumination devices located elsewhere in a studio or other picture-shooting location.

But what if you don’t want to restrict yourself from a lighting-setup standpoint to connecting at least one flash unit directly to your image-capture device for resultant full-frontal illumination of your subject? Extension cords can get you a foot or so away while retaining the full-featured physical tether, for example:

That said, an even more flexible approach mates the camera to a dedicated-function transmitter (also commonly referred to as a “trigger”), with all lighting sources in the setup controlled by it and subsequently acting as slaves. This approach is equally beneficial if you do desire full-frontal illumination of your subject but your main flash unit isn’t sufficiently “intelligent”, since such transmitters are typically camera-cognizant (thereby handling the “intelligence” themselves) and support “dumb” hot shoe and cable sync options to a close-proximity flash, too.

Today’s teardown victim, from Godox, is one such example. The means by which I came into possession of it is admittedly atypical. Reiterating what I wrote in my Godox V1 flash unit teardown from earlier this year:

As regular readers already know, “for parts only” discount-priced eBay postings, suggestive of devices that are (for one reason or another) no longer functional, are often fruitful teardown candidates as supplements to products that have died on me personally.

The patient this time is another example of this longstanding “dumpster diving” tendency…or at least I thought it was going to be. Back in March, well-known used imaging equipment retailer KEH held one of its periodic “inventory reduction” sales, this one offering 15% off a subset of its warehouse stock. One of the things that caught my eye was a “Godox X1T-F TTL Wireless Flash Trigger Transmitter for Fujifilm” in “as-is” condition for $3.65 before discount, $3.10 after:

“1” in the product code means first-generation, “T” stands for “transmitter” (or “trigger”), “F” means that it’s intended for use with Fujifilm cameras…and “as-is”, paraphrasing KEH, basically means that best-case it’s cosmetically beat up and worst-case it doesn’t work at all. And indeed, when it arrived, that’s what the sticker attached to the bag containing the transmitter indicated:

What was inside the bag, however, was something much better, a second-generation Godox X2T-F in pristine cosmetic condition (the Canon version of the X2T is shown in the following “stock” photo):

seemingly fully functional, to boot:

I don’t own any Fujifilm cameras, which wasn’t a problem given my original teardown-only plan for the as-is X1T device, and which also precludes me from definitively determining this X2T’s functional-or-not status. However, given that it seems to be fine, I’m going to do my utmost to do no permanent damage to it during my my disassembly, so that I can subsequently put it back together and donation-pass it on, where it’ll hopefully find good use for some time to come. To wit, I’ll restrain myself from any “extreme” dissection that might be permanently maiming.

To begin, here are some overview shots, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes. Front: in the upper right is the autofocus-assist lamp:

Right side: the USB-C connector is used for firmware updates, and the 3.5-mm sync jack can be settings-configured either as an input (as a transmitter-triggering alternative to the “intelligent” hot shoe at the bottom) or an output (as a tethered alternative to alternatively firing a “slave” flash device either wirelessly or via the “dumb” hot shoe at the top):

Back:

Left side: the switch on the left is for overall unit power control, while the one on the right enables or disables the AF-assist lamp:

Top: note first the “dumb” hot shoe to, as mentioned earlier, control a separate “slave” flash unit. Also note the Bluetooth logo; as with the earlier-dissected V1 flash unit, this transmitter not only controls other Godox (or rebranded Adorama) equipment via the proprietary 2.4 GHz wireless X protocol but also optionally supports itself being configured and controlled by a Bluetooth-tethered smartphone or tablet in conjunction with a Godox (or Adorama) app:

And finally, the bottom, with its comparatively “intelligent” hot shoe for mating with a (Fujifilm, in this particular case) camera:

Time to dive in. In prior pictures, you may have already noticed three (now removed) screws’ visible heads:

one at the bottom:

and one on each side:

Extracting them unfortunately didn’t get me very far, though:

And a scrape-away of the left-side QC sticker didn’t reveal any more screw heads underneath:

so next, I looked inside the underside battery compartment:

Ah yes, there we are. Two more screw heads:

That’s more like it:

First, here’s a closeup of the left half of the previous photo, revealing the inside (and underside) of the top half of the device:

And, jumping ahead in time, another perspective after disconnecting the two-wire tether between the “dumb” hot shoe and the system PCB that controls it (the lens in front of the AF-assist beam also detached from the device bottom-half in the process):

About that two-wire tether: remember my earlier discussed differentiation between “smart” and “dumb” hot shoes? I’ll confess at this point that I sorted this all out retroactively, after initially being momentarily baffled as to why there were only two wires (switched power and ground) coming out of the topside hot shoe…

A brief rewind-in-time now to the right half of the earlier overview shot, first still tethered:

And now standalone:

Along with three side-view perspectives:

Unsurprisingly, there’s a lot of component commonality between this design and that of the previously detailed Godox V1 flash. They’re both based on the same main system controller, for example, the APM32F072VBT6 (PDF), from a Chinese company called Geehy Semiconductor, integrating an Arm Cortex-M0+ running at 48 MHz along with 128 Kbytes of flash memory and 16 Kbytes of RAM. It’s in the upper left corner of the PCB, adorned with a pink ink dot, if you haven’t already noticed it (but given its comparative size, you probably already did).

You probably also already noticed the two identical-looking PCB-embedded antennae at the bottom. Above the one to the right is the same multi-component (and more general PCB) layout as that found in the V1: Texas Instruments’ CC2500 low-power 2.4 GHz RF transceiver and TI’s CC2592 front-end RF IC, so per proximity I’m guessing that this one handles Bluetooth connectivity. By the process of elimination, then, I’ll also hazard a deduction that the other antenna, to its left, implements Godox’ X wireless protocol in conjunction with whatever circuitry is inside the silver module with which it shares a common mini-PCB.

And did you also notice the three additional screw heads? You know what comes next, right?

Disconnect one more two-wire harness, this one going to the AF-assist beam subsystem:

Push through the case openings one side’s worth of battery terminals:

(the other side’s terminals are permanently attached the case, not connected to the PCB):

And voila:

Here’s an overview of the now-exposed main PCB backside, with battery terminals in the upper left, the two aforementioned left-side switches at bottom left, the USB-C and sync connectors at bottom right and ribbon cables (which, as previously discussed, along with the one connected to the other side of the main PCB, I’m not going to chance disconnecting) along the lower edge and leading elsewhere:

We’re now looking toward the inside of the bottom of the device, where both of those thinner ribbon cables end up. At left is the underside of the “smart” hot shoe, while at right is the control dial you may have noticed in earlier overview shots:

Wrapping things up, here’s the backside of the device, mated to ribbon cables for the display (the wider one at left) and control buttons (the narrower one at left):

And now, first taking a deep breath for calming confidence, I retraced my prior disassembly steps in reverse. Aside from a brief moment of panic when I thought I’d lost a screw (which ended up just being stuck in the recesses of the matching-color case), the process went smoothly. And, after taking another deep breath, popping two AAs in and flipping the power switch on, this is what I saw:

I seem to have successfully resurrected it, again to the limits of my no-Fujitsu-camera testing abilities. Yay! Sound off with your thoughts in the comments.

 —Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Multi-source vs proprietary: more “illuminating” case studies
• The Godox V1 camera flash: Well-“rounded” with multiple-identity panache
• Putting an APC UPS out of its (and my) misery
• Disassembling the Echo Studio, Amazon’s Apple HomePod foe

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Following the completion of due diligence, the US Department of Commerce has confirmed the award (proposed in February) of up to $1.5bn in direct funding through the US CHIPS and Science Act to New York-headquartered GlobalFoundries (GF, the only US-based pure-play foundry with a global manufacturing footprint including facilities in the USA, Europe and Singapore)...

US Geological Survey (USGS) researchers have developed a new model to assess how disruptions of critical mineral supplies may affect the US economy. Using the model, the researchers estimate that there could be a $3.4bn decrease in US gross domestic product (GDP) if China implements a total ban on exports of gallium and germanium...

The US Department of Energy’s (DOE’s) Critical Materials Innovation Hub (CMI Hub) has announced up to $10m in federal funding to accelerate the early-stage technology R&D necessary to reduce material criticality for energy innovations requiring critical materials – rare-earth elements, gallium, and copper...

Modern, decentralized, and zonal power distribution architectures require dependable solutions. With PROFET Wire Guard, Infineon Technologies AG provides developers with advanced wire protection for modern power distribution. Compared to conventional fuses, the product family can emulate the stress characteristics of the wires much more accurately with an integrated and precise I²t wire protection curve, which can be selected from six implemented curves depending on the application requirements. Combined with other features, the integrated I²t wire protection accuracy enables wire harness optimization when replacing mechanical relays and fuses.

The five PROFET Wire Guard devices come in the proven TSDSO-14 and TSDSO-24 packages. They offer full pin-to-pin compatibility within the family and high compatibility with PROFET +2 12V devices and are targeting currents of up to 27 A. To expand the current capabilities up to 36A, the product line-up will be further extended with an additional device coming in Q4 2025. The devices have a capacitive load switching (CLS) mode implemented to charge capacitive loads. An adjustable overcurrent detection threshold supports fast fault isolation from the power supply. The integrated automatic idle mode reduces current consumption during parking to typically 50 µA, while the output stage remains fully switched on. Built-in sequential diagnosis provides accurate application data across five addresses on a single pin, enabling application integrity testing for functional safety requirements and further wire harness optimization during facelifts based on the analysis of the wire protection status during vehicle operation. The devices have been developed and are released as ISO 26262:2018 Safety Element out of context for safety requirements up to ASIL D.

To support the design-in process, the product family is integrated into the Infineon Automotive Power Explorer, which is available in the Infineon Developer Center. This simulation tool supports, for example, the evaluation of the system protection capability of PROFET Wire Guard devices with a given wire and load profile. It also calculates the correct resistance values for the adjustable overcurrent detection threshold as well as the selection of the integrated I²t wire protection curves. The tool is also capable to calculate parameters like kILIS accuracy or power dissipation for the whole product family.

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