Новини світу мікро- та наноелектроніки
MCUs pair Cortex-23 core with ReRAM
Nuvoton’s M2L32 MCUs are powered by a 72-MHz Arm Cortex-M23 processor core with up to 512 kbytes of resistive random-access memory (ReRAM). This nonvolatile memory delivers fast read/write speeds and endures significantly more program/erase cycles than flash memory. Additionally, ReRAM consumes less power than both DRAM and flash.
Aimed at sustainable embedded computing, the M2L32 series of microcontrollers offers three low-power modes: normal shutdown, standby shutdown, and deep shutdown. Typical current consumption is just 60 µA/MHz in operating mode, dropping to 0.5 µA in deep shutdown mode.
M2L32 MCUs can be used for motor control, battery management, industrial automation, and PC peripheral devices. These MCUs independently handle peripheral data acquisition and process data through low-power serial interfaces without CPU intervention.
Along with 64 kbytes to 512 kbytes of ReRAM, the M2L31 series provides 40 kbytes to 168 kbytes of SRAM and a rich set of communication interfaces and peripherals. Devices are offered in a variety of package types and sizes, including WLCSP, QFN, and LQFP.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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Image sensors enrich smartphone photography
Three ISOCELL image sensors from Samsung bridge the gap between smartphone main and secondary cameras for enhanced imaging across all angles. The ISOCELL HP9 is the industry’s first 200-Mpixel telephoto sensor for smartphones, according to Samsung, while the ISOCELL GNJ and ISOCELL JN5 are 50-Mpixel sensors.
The ISOCELL HP9 features 200 million 0.56-µm pixels in a 1/1.4-in. optical format. A highly refractive material applied to the microlens allows the HP9 to accurately direct light to the corresponding RGB color filter. The result is more vivid color reproduction and improved focus, with 12% better light sensitivity (based on SNR10) and 10% improved autofocus contrast compared to its predecessor. HP9 also includes 2x or 4x in-sensor zoom modes, enabling up to 12x zoom when paired with a 3x zoom telephoto module.
Leveraging dual-pixel technology with an in-sensor zoom function, the ISOCELL GNJ delivers 50 million 1.0-μm pixels in a 1/1.57-in. optical format. An upgraded material for deep trench isolation minimizes crosstalk between adjacent pixels, allowing the sensor to capture more detailed and precise images. The GNJ sensor boasts low power consumption, achieving a 29% improvement in preview mode and a 34% improvement in 4K video mode at 60 frames/s.
The ISOCELL JN5 has a resolution of 50 million 0.64-μm pixels in a 1/2.76-in. optical format. It can be used across main and sub cameras, including wide-angle, ultra-wide-angle, front, and telephoto, ensuring a consistent camera experience from various angles.
Follow the product page links below to learn more about each ISOCELL image sensor.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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SONY color camera module, 700 TV Lines
Color camera module equipped with a 1/3″ CCD sensor and SONY DSP, ideal for achieving high-quality images. The f3.6 mm lens provides a wide field of view, perfect for various applications. The camera boasts an extremely high resolution of 700 TV lines, ensuring highly detailed images. With a sensitivity of 0.1 Lux, it can operate […]
The post SONY color camera module, 700 TV Lines appeared first on Open Electronics. The author is Boris Landoni
European wafer developer pays BluGlass US$1.28m for transfer of IP developed under contract
Technolifepro
Microchip Releases Its 2023 Sustainability Report Highlighting Its Environmental Stewardship and Social Impact
One of Microchip’s Guiding Values is “Professional Ethics and Social Responsibility Are Practiced,” which means that the company manages its business and treats its customers, employees, shareholders, investors, suppliers, channel partners, community and government in a manner that exemplifies honesty, ethics and integrity. To demonstrate its commitment to this value and to provide transparency to its employees, customers and all other stakeholders, Microchip Technology has released its 2023 Sustainability Report which details its environmental and social impact programs.
Microchip’s Environmental, Social and Governance (ESG) projects are aligned with its business objectives and are implemented to catalyze positive change throughout its value chain via strategic initiatives, strong collaboration with partners and ambitious goals. The company consistently invests in its global workforce and endeavors to drive economic growth, while preserving natural resources and paving the way for a sustainable tomorrow for future generations.
“Our vision to be the leading supplier of smart, connected and secure embedded control and processing solutions includes a corporate commitment to acting in an ethical and responsible way. This permeates what we do, from day-to-day operations to ethical global supply chains to investing and developing new technologies and products to ensure a more sustainable world,” said Ganesh Moorthy, president and CEO of Microchip. “We have a dedicated Sustainability Megatrend team that is focused on empowering innovation for our customers through a wide range of products and solutions that help reduce power consumption, increase efficiency and reduce waste.”
The company’s 2023 Sustainability Report outlines its ESG efforts and progress across five tenets, referred to as Microchip’s 360° Sustainability Approach. The five tenets include: Our Company, Our Planet, Our Supply Chain, Our Products and Our People.
“To protect our planet, we seek innovative and meaningful ways to improve our environmental impact in four essential areas: greenhouse gas emissions, energy efficiency, water management and waste diversion,” said Ewa Rickey, associate director of Microchip’s ESG program. “Our 2023 Sustainability Report demonstrates our dedication to being a good corporate citizen, not only in the communities where we operate but around the world.”
- Microchip’s reaffirmation of its ambitious target to achieve a 50% reduction in Scope 1 and 2 Greenhouse Gas (GHG) Emissions by 2030 and to be Net Zero by 2040
- The completed construction of a cutting-edge 3.8 MW floating solar farm at Microchip’s Thailand facility, accompanied by signing a 20-year Power Purchase Agreement (PPA) to source 16% of its electricity needs from this solar farm to affirm the company’s commitment to sustainable energy practices
- The ongoing application of Microchip’s Supply Chain Management Approach, which is used to assess the practices and ethics of supply chain partners to ensure transparency and minimize risk
- An overview of Microchip’s many initiatives aimed at fostering a diverse and inclusive workplace, with a particular focus on employee well-being and professional development
- The company’s community involvement initiatives such as charitable donations and employee volunteer hours, as well as its focus on STEM education and support for the FIRST® Robotics program
- Microchip’s recognition by numerous third-party publications and organizations that included ratings as one of “America’s Most Responsible Companies” by Newsweek and a “World’s Top Female-Friendly Companies” by Forbes/Statista
In line with the company’s Guiding Value, “Continuous Improvement is Essential,” Microchip proactively pursues new avenues to further reduce its environmental impact, enhance its social contributions and strengthen its governance practices. Through its Sustainability Megatrend team, the company prioritizes developing innovative solutions and products that can contribute to sustainability ecosystems such as energy generation, E-Mobility, sustainable homes and cities. To learn more, visit Microchip’s Sustainability Solutions website.
To read Microchip’s 2023 Sustainability Report and to learn more about its ESG initiatives, visit the Corporate Responsibility website.
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STMicroelectronics reveals ST BrightSense image sensor ecosystem for advanced camera performance everywhere
Enables quicker and smarter designs of compact power-efficient products for factory automation, robotics, AR/VR, and medical applications
STMicroelectronics has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and consumer applications ensure superior camera performance by designing-in ST BrightSense image sensors. By sampling all pixels simultaneously, unlike a conventional rolling shutter, global-shutter sensors can capture images of fast-moving objects without distortion and significantly reduce power when coupled to a lighting system.
ST BrightSense CMOS global-shutter sensors implement advanced backside-illuminated pixel technology, manufactured at ST’s own foundry in France, ensuring high image sharpness to capture fine details such as in barcode reading. Their high sensitivity enhances low-light performance and permits fast image capture, enhancing responses such as obstacle avoidance in mobile robots and face recognition in personal electronics. The sensors’ advanced 3D-stacked construction allows an extremely small die area, easing integration anywhere space is limited especially in the final optical module, while enriching the products with advanced on-chip image processing for auto-exposure, correction, and calibration. Their MIPI-CSI-2 interface makes them ideal for embedded vision and edge AI devices.
Historically only offered to qualified customers, ST’s cutting-edge sensor technologies are now available in a wide variety of markets through the ST BrightSense portfolio, highlighting industrial-grade products and 10-year longevity commitment. Widespread access to these sensors, whose qualities are proven with over one billion units shipped on market, now lets developers bring high-performance machine vision to applications that face strict size and power constraints and challenging operating conditions. These include factory automation, scanning, domestic and industrial robots, VR/AR equipment, traffic monitoring, and medical devices.
ST’s new mass-market offering includes evaluation camera modules that integrate image sensor, lens holder, lens, and plug-and-play flex connector to enable instant integration of the image sensors. The modules offer a selection of tiny form factors down to 5mm2, various lens options to suit different application requirements, and a plug-and-play connector that allows easy swapping. A series of hardware kits helps developers integrate the sensors with various desktop and embedded computing platforms. Complementary software tools are available for free download on ST’s website, such as a PC-based GUI and Linux drivers that assist integration with popular processing platforms including STM32MP2 microprocessors.
The ST BrightSense global-shutter family currently comprises the VD55G0, VD55G1, and VD56G3 monochrome sensors with resolution from 0.38Mpixel to 1.5Mpixel, as well as the colour VD66GY with 1.5Mpixel. The sensors, along with their evaluation camera modules, and development boards are in production now. Contact your ST sales office or local distributor contact for pricing options and sample requests.
Webinar on demand (upon free registration) can be accessed here.
For more information, visit www.st.com/brightsense
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Forge Nano launches TEPHRA 200mm single-wafer ALD cluster tool
Infineon and Swoboda cooperate to develop high-performance current sensors for electromobility
Infineon Technologies AG and Swoboda jointly develop and market high-performance current sensor modules for automotive applications. The partnership combines the best-in-class current sensor ICs from Infineon with Swoboda’s expertise in the development and industrialization of sensor modules to address the fast-growing market of sensing solutions for hybrid and electric vehicles. The collaborative high-performance current measurement solutions accelerate time-to-market for high-volume applications such as traction inverters and battery management systems, but also for other key automotive applications.
The first of these products, the Swoboda CSM510HP2, features a fully encapsulated current sensor module with significantly reduced footprint without compromising performance. It is based on the Infineon TLE4973 coreless current sensor IC and allows high precision sensing with a total error below 2 percent. The module is specifically designed for seamless integration with the HybridPACK
Drive G2, Infineon’s automotive power module for traction inverters in electric vehicles. This eliminates the need for separate external current sensors and thereby enables the most compact traction inverters in the market.
“This new generation of current sensors sets new standards in regards of simplified system integration”, said Klaus Lebherz, Head of Business Development at Swoboda. “Infineon’s latest sensor technology and our injection molding know how turned out to be a perfect match”.
“The market demands high performance, compact and easy to integrate current sensing solutions” said Andrea Monterastelli, Head of Automotive Magnetic Sensors Product Group at Infineon Technologies. “The seamless fit into Infineon`s HybridPack Drive G2 offers the most compact solution for hybrid and electric vehicles, enabled by our best-in-class current sensor ICs and Swoboda’s expertise.”
Infineon and Swoboda are currently developing additional current sensing solutions to serve any kind of power devices. Other target applications include inverter DC link and high voltage battery management among others.
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Sneak diodes and their impact on your designs
Semiconductor companies don’t always highlight the inner details of certain products. One insidious issue is the presence of sneak diodes which is a nasty issue that has been discussed before regarding a D/A converter, but now let’s look at another example of getting into trouble.
The following sketch is a low frequency clock oscillator that uses an op-amp. Typically, I would choose a type TL082 for this purpose. Also, just as a side note, this kind of oscillator was a key part of many of the high voltage power supplies made by Bertan High Voltage when I was employed there.
Figure 1 Low frequency clock oscillator that depends on the ability of U1 to accept large differential voltages between its input pins.
This circuit depends on the ability of U1 to accept large differential voltages between its input pins. Nominally, the junction of R1, R2 and R3 will step between Vcc/3 and 2*Vcc/3 and the top of C1 will swing back and forth between those two voltage levels along a time constant set by R4*C1.
The TL082 (Figure 2) is well suited to this purpose because there is nothing connected between its two input pins to restrict the differential input voltage from reaching the limits that I’ve just described.
Figure 2 The TL082 op-amp that is well-suited for the low frequency clock oscillator described in Figure 1.
However, not every op-amp has this property. As an example, please consider the Analog Devices OP184/284/84 op-amps in Figure 3.
Figure 3 The OP184/284/484 op-amps where the maximum possible differential voltage is limited by QL1 and QL2, these two act as paralleled back-to-back diodes.
The maximum possible differential voltage is limited by QL1 and QL2 which act as paralleled, back-to-back diodes. Those diodes limit the maximum differential input voltage. In linear service, these diodes being there probably wouldn’t matter, but the oscillator of Figure 1 is not a linear circuit.
Two SPICE simulations demonstrate the impact this diode difference has on the oscillator (Figure 4).
Figure 4 A comparison of the TL082 op-amp (U1) and the OP184/284/484 op-amps, showing the effect the diodes have on the oscillator.
The oscillation frequency with the two diodes present is almost an octave higher with those diodes than it would be without them.
The TL082 is by no means the only op-amp suitable for service in this kind of oscillator circuit, but not every op-amp is suitable for it. Non-linear circuits other than this kind of oscillator might be affected in some way as well.
Just be certain of your particular case(s).
John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).
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Industry-Leading Portfolio of PXI Digital I/O Modules Deliver Enhanced Density, Voltage, and Current Capability
Pickering Interfaces, a leader in modular signal switching and simulation products for electronic test and verification, has introduced four new industrial digital I/O families for PXI- and LXI-based systems. These additions enhance Pickering’s industrial digital input and output modules range, offering higher density, expanded voltage and current ranges, and programmable logic levels in PXI and PXIe form factors. With these new modules, Pickering now holds the industry’s largest and most comprehensive portfolio of PXI and PXIe digital I/O modules.
Digital input and output modules are crucial in automated test systems for operating external devices or interfacing with external logic. Digital inputs test signal voltage levels, while digital outputs can act as a current source, sink, or both. These industrial digital I/O modules are suitable for acquiring signals from digital sensors, and communicating with industrial devices like PLCs, and driving relays, solenoids, and lamps.
“At Pickering Interfaces, we’re committed to providing the largest and most capable catalogue of industrial digital I/O products in the industry,” said Paul Bovingdon, Pickering’s Technical Engineering Manager. “These new modules reflect our commitment to meeting the evolving needs of our customers.”
High-Density Digital Output Modules (Model 40/42-412A)
These high-channel-count output modules expand the existing 40-412 PXI range, adding a PXIe option (model 42-412A). This family offers up to 64 output channels (with 16, 32, 48, or 64 output channel variants), featuring an external maximum output voltage range of 50V and 0.5A low-side or high-side driving capability.
High-Density Digital Input Module with Dual Programmable Thresholds (Model 40/42-414)
The new 40-414 (PXI) and 42-414 (PXIe) digital input modules offer high channel count, high input voltage capability, and dual programmable threshold settings per bank. Independent banks of eight channels allow for multiple voltage level detection across the module. Dual thresholds enable convenient status determination of digital signals by comparing each input voltage to two programmable threshold levels, useful in functional test applications, often replacing the need for a DMM. Available variants include 32, 64, 96, or 128 input channels with maximum threshold voltages of 50V, 100V, 200V, or 300V. These modules effectively determine the state of industrial digital signals in automotive, aerospace, and rail applications, reducing external signal conditioning circuits and minimizing test system complexity and footprint.
Semi-Dynamic Digital I/O Module (Model 40/42-419)
The 40-419 (PXI) and 42-419 (PXIe) digital I/O modules provide 16 to 64 I/O channels with up to a 60V range via external supply or four built-in voltage rail selections (+3.3V, +5V, +12V, or +24V), and up to 300mA current output capability. They also offer I/O direction selection for each port/channel, with each port of eight channels being set as inputs or outputs together, or individual channels within a port being set as input or output. The module provides semi-dynamic 8-bit pattern acquisition and generation using on-board memory.
Relay Driver Module (Model 40/42-411A)
This update to the existing model 40-411 includes PXIe options, offering variants with 16 to 64 low-side outputs, 60V, 1A relay driving capability, and three options for on-board relay voltage supply (plus a mixed voltage option) for low-power applications. The 40-411A (PXI) and 42-411A (PXIe) models are designed to drive external relays from a PXI or PXIe system or Pickering Interfaces’ LXI modular chassis.
Models 40/42-411A, 412A, and 419 feature built-in protection systems, including over-current detection and over-voltage clamp or thermal overload. These modules can drive relay coils without flyback diodes or prevent relay coil current from flowing back into the chassis backplane using an isolation barrier. They offer flexibility with external or internal supply options and high-side or low-side driving capability to meet various load capacity requirements.
The modules’ front panels use a 78-pin D-type connector for models 40/42-411A and 412A or a 160-pin DIN 41612 for models 40/42-414 and 419, supported by a range of connector accessories.
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Vintage RS Components Catalogue
 | Found this vintage RS Components Catalogue at work. Less than 90 pages for whole catalogue. [link] [comments] |
Luminus adds SFT-03X RGB LED chipset to projection product portfolio
Peculiar precision full-wave rectifier needs no matched resistors
A classic analog application is the precision active full-wave rectifier. Many different implementations exist of this theme, each with its own supposed advantages. However, one circuit element needed by (almost) all active full-wave rectifier designs is an inverter with matched resistors to set its gain to an accurate -1.0. In such topologies, symmetry of rectification relies upon and can be no better than the accuracy of this resistor match. For an example, see a well known (veritable classic!) design in Figure 1 with op-amp U1b acting as the inverter and R1 and R2 as its matched gainset resistors. Unless R1 = R2, rectifier output for negative Vin excursions are (very) unlikely to equal output for positive Vin excursions.
Figure 1 Conventional precision rectifier design with R1 and R2 matched symmetry-resistors.
For positive Vin inputs, D1 turns off and D2 conducts, establishing non-inverting unity gain for the circuit that’s unaffected by resistor values: Vout/Vin = +1.
For negative inputs, D1 conducts, D2 turns off and U1b becomes an inverter with gain Vout/Vin = –R2/R1 = -1 only if R2 = R1. Otherwise, not, creating poor rectification symmetry.
Figure 2 shows another (less conventional) design. But unconventional or not, here are Q2 and Q3 acting as the inverter and matched gainset symmetry-resistors R1 and R2 performing just as in Figure 1.
Figure 2 Unconventional rectifier with discrete circuit inverter still uses symmetry-setting resistors: R1 and R2.
But now, just to break the monotony, regard Figure 3. Note the (shocking) absence of matched resistors. Here’s how this nonconformist works.
Figure 3 Unconventional precision rectifier design without matched symmetry-resistors.
Q1 and Q2 provide simple cross-over compensation to cancel the Vbe drops of Q3 and Q4. Consequently, negative Vin excursions are inverted by A1 and output by Q4 to filter R3C3. Meanwhile, positive Vin excursions turn Q3 on, causing C2 to integrate their time and current product: charge. The accumulated charge is stored as voltage on C2 which is added to subsequent opposite polarity half-cycles with Q3 and Q4 acting as a simple full-wave charge pump. The net result:
Vout = Avg(Abs(Vin)) R3 / R2 / R1.
Accurate rectification symmetry is therefore inherent as long as transistor Vbe’s match reasonably well which, being the same type and operating in similar contexts, they will.
Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.
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The post Peculiar precision full-wave rectifier needs no matched resistors appeared first on EDN.
My AC motor control project
 | submitted by /u/gubbkuuk [link] [comments] |
Altair eying a place in EDA’s shifting landscape
The EDA industry is known for the trio—Cadence, Siemens EDA and Synopsys—that dominates it and how these companies turned into giants by acquiring smaller EDA outfits. Now, another EDA player is on the horizon, taking a similar path of serial acquisitions to attain design automation software glory.
Altair, a supplier of simulation and data analytics solutions, is cutting deals to expand its EDA footprint in several design automation areas. It has just announced that it will acquire Metrics Design Automation, a Canadian company built on a simulation-as-a-service (SaaS) business model for semiconductor simulation and design verification.
Figure 1 Merging simulation with workload and workflow optimization technology could bolster design verification tools. Source: Altair
The cloud-based business model has the potential to make high-caliber EDA tools much more affordable and accessible at a time when IC design verification has high licensing costs and may require hundreds and sometimes thousands of seats to run a single-chip simulation. Moreover, these EDA tools run on desktop machines and are not typically cloud-native or cloud-enabled.
Altair plans to combine its silicon debug tools with Metrics’ digital simulator, DSim, to offer simulation and debug capabilities as a desktop app, on company servers, or in the cloud. This will allow design engineers to pay only for what they use. DSim will be available through Altair One, Altair’s cloud gateway, where it will also be available for desktop download.
The combined solution will support Verilog and VHDL RTL for digital circuits in ASICs and FPGAs. Metrics is led by Joe Costello, an EDA industry veteran credited with turning Cadence Design Systems into a billion-dollar firm.
A plethora of EDA deals
Earlier this year, Altair named EDA Expert a channel partner for distributing its HyperWorks design and simulation platform within France. EDA Expert, founded in 2012 and headquartered in Arcueil, France, provides technical expertise and training to help manufacturers define suitable solutions for designing and manufacturing electronic systems and analyzing electronic boards.
Then, in June 2022, Altair announced acquisition of Concept Engineering, a supplier of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. Concept Engineering’s software would be integrated into Altair’s Electronic System Design suite and available via Altair Units.
Concept Engineering’s reactive visualization technology would help organizations accelerate their designs that have specific design architecture requirements as well as rigorous service needs. Next, its design debug solutions covered register transfer level (RTL), gate, and transistor design abstractions for both analog and digital disciplines.
Figure 2 Concept Engineering’s automatic schematic generation and visualization software components help developers create high-performance debugging cockpits, shorten software tool development cycles, lower software development and maintenance costs, and increase the product quality of EDA tools. Source: Altair
Finally, in September 2017, Altair announced that it would buy Runtime Design Automation, a Santa Clara, California-based company specializing in scalable solutions for high-performance computing (HPC). Runtime primarily served design engineers leveraging EDA tools to design CPUs, GPUs, and system-on-chips (SoCs).
Carving an EDA niche?
Altair calls itself a computational intelligence specialist, but its technology roadmap is increasingly converging and colliding with EDA tool offerings. It’s steadily accumulating EDA solutions in its technology arsenal to claim a stake in the EDA industry, which is now being transformed by artificial intelligence (AI) and cloud computing technologies.
Moreover, HPC, which Altair calls its forte, is taking center-stage in the semiconductor realm. So, the Troy, Michigan-based company might be aiming to carve out an EDA niche in this burgeoning market.
Still, Altair is nowhere near the EDA’s big three: Cadence, Siemens EDA and Synopsys. So, will Altair continue the acquisition spree and eventually challenge the dominance of the EDA trio? Or will it become an acquisition target over time due to its strengths in HPC, cloud, and AI? We at EDN will closely watch the developments in the acquisition sphere of the EDA industry.
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Resurrecting an inkjet printer, and dissecting a deceased cartridge
I purchased my Epson Artisan 730 color inkjet all-in-one (printer, copier, and scanner):
in September 2012, coincident with a move to Colorado (my even older Artisan 800 is still in occasional use by my wife). Speaking of “occasional use”, I’ve also used mine only sporadically, given that the monochrome outputs of the Brother laser multifunction printers in both of our offices work fine for most purposes and are significantly less expensive to operate on a per-page basis. Truth be told, mine probably still had its original ink cartridges installed when I recently tried to use it to print out a “batteries inside” notice, which needed to be bright red in color, to be taped to the outside of a package I was preparing to ship. And unsurprisingly, therefore, the result wasn’t as desired; the printer spat out a completely blank sheet of paper.
The inkjet cartridges, it turns out, were dried up inside (and/or empty; the software driver’s built-in diagnostics routine can’t differentiate between the two possible states). But when I replaced the cartridges with fresh ones:
the printer still spat out blank sheets of paper. That’s because, I eventually realized, the flexible multi-tube-harness that transports the ink from the cartridges to the print heads was also clogged by desiccated ink remnants (full disclosure: the following photo was snapped after the completion of the procedure described in the next couple of paragraphs):
Replacement harnesses weren’t available, my research indicated, and it also suggested that attempts to disassemble the printer were highly likely to lead to its demise. Determined to do everything possible to prevent this otherwise perfectly good device from ending up at the landfill, I kept plugging away with Google searches and eventually came across this video:
I went with this cleaning solution, and it took several fluid applications, each time followed by a few hours’ wait and then head clean and nozzle check operation attempts, but the Artisan 730 is thankfully back in business. I was left with the aforementioned “dead” inkjet cartridges:
which piqued my curiosity; how did they work, actually? And how did Epson and its competitors, such as long-disdained HP, both determine a particular cartridge’s remaining-ink level and attempt to prevent printer owners from using less expensive third-party alternatives? I decided to take one apart, randomly grabbing the light magenta one as my chosen victim:
Conceptually, here’s a how-it-works video I found that Wired Magazine did about a decade ago:
It’s not directly relevant here because, as I earlier noted, the print heads aren’t built into the cartridges; instead, they’re on the other end of the now-unclogged flexible tubing. But I still found the video interesting. And here’s a how-they-work (both in an absolute sense and vs thermal alternatives) Epson tech brief that I came across, which may also be of interest to you.
Also, in the earlier rubber-banded-stack photos, you might have noticed that the black ink cartridge has a “98” moniker while the others are “99”. Epson sells two versions of each cartridge color variant; “98s” have higher ink capacity than the less expensive “99” ones. A typical six-color bundle sold at retail combines a high-capacity black “98” (since monochrome printing is more common than full color, per my earlier mentioned Brother laser case study example) with standard capacity “99” variants of the others (more expensive all-“98” bundles are also available, obviously, as my earlier photos of the replacement cartridges indicate).
With that background info out of the way, let’s dive in. The cartridge enclosure construction is pretty beefy, understandably so due to the obvious desire to prevent leaks, and is further bolstered by a nearly impenetrable (for reasons that will soon be visibly obvious) sticker on one side:
That said, the seam around the install-orientation hole, whose purpose will be obvious once you see what the bay looks like absent cartridges (note the mounting pins toward the bottom):
and is on the opposite end from the same-side ink nozzle, looks promising:
And we’re inside. Behind that tough black plastic cover is, I suspect, the ink reservoir:
But for now, this electrical engineer’s top priority is checking out that multi-contact mini-PCB:
This side we’ve already seen in its installed state:
but the underside is now first-time exposed to view, too:
I’m guessing that under that opaque epoxy blob is the authentication chip (more likely, die). But if you look closely at the earlier mini-PCB-less shot, you’ll note that there’s still more “guts” to go below. Let’s get the broader plastic end assembly off next:
Whatever this is, I assume it modulates (and measures?) the amount of ink in the “tank” and flowing through the nozzle. Specific ideas, readers? A piezo something-or-other, mebbe?
And here are some views of what’s driving it (along with the earlier-seen mini-PCB, of course):
With no further meaningful progress seemingly possible here, I returned my disassembly attention to the sticker side, aided by a box cutter and focusing on the circular-pattern section you might have noticed in previous photos:
Hmmm. It appears that I’ve found the “port” used to fill the cartridge with ink on the assembly line. And it also appears that the cartridge still has at least some viable ink inside:
The light magenta dribble eventually petered out:
And after tediously piece-by-piece ripping off the recalcitrant black plastic sheet you saw earlier covering the other side, here’s what I found inside:
The ink-input port is the circular section in the upper left. Why there are so many chambers inside…
And the output nozzle extends downward in the lower left area. I’ll conclude with a few more shots of both it and the “flow-control faucet” for it from both sides:
And wrap up with this no more revealing, but far more messy, alternative teardown clip I found:
Those preparatory gloves, paper towel and newspaper sure were a wise move! 
Let me know your thoughts on what I uncovered, along with what’s still to be identified, in the comments.
—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.
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my MPPT solar charge controller
 | My current design on a MPPT solar charge controller i am designing for fun. A standard buck MPPT has issues with current feedback with no solar power, so i thought why not add a boost stage, now i can charge batteries at super low light levels, and no current from the battery through the panel at night. decided on a 555 timer charge pump to get around the duty cycle limit of high side nmos bootstrap gate drivers. This will eventually have a 12 or 15v supply for gate drivers and 555, and be able to accept battery and solar panel voltages up to around 60v [link] [comments] |
GlobalFoundries acquires Tagore’s GaN IP portfolio
The Evolution from Industry 4.0 to Industry 5.0
The manufacturing industry has always been at the forefront of technological innovations. From the advent of the steam engine in the 1700s to the invention of the assembly line by Henry Ford, manufacturing has been one of society’s greatest drivers of change.
Today, the manufacturing industry is once again experiencing a series of unprecedented changes.
The proliferation of robotics, advanced sensors, device connectivity, and advanced analytics has led to modern Industry 4.0 manufacturing. Now, the field is poised for yet another change, with a transition into the world of Industry 5.0.
This blog discusses the differences between Industry 4.0 and Industry 5.0, the challenges facing the evolution from Industry 4.0 to Industry 5.0, and some ways to make the transition as seamless as possible.
Industry 4.0 Versus Industry 5.0At present, most modern factories are classified as “Industry 4.0,” and are commonly referred to as “Smart Factories.”
Industry 4.0 is marked by a significant shift toward a more interconnected and intelligent manufacturing environment, leveraging advancements such as the Internet of Things (IoT), artificial intelligence (AI), cloud computing, and edge computing. This era introduces the capability to gather, analyze, and use vast amounts of data in real time, which enhances decision-making processes, predictive maintenance, and overall operational efficiency. Ultimately, the result is a comprehensive advancement over Industry 3.0 to create more agile, efficient, and responsive manufacturing systems. However, Industry 4.0 remains focused mainly on the manufacturing side of things, answering questions about how to make more products faster, more consistently, of better quality, and at lower cost.
Industry 5.0 expands the technological advancements of Industry 4.0 and augments them by considering human factors. It seeks to redefine roles within manufacturing and beyond—encompassing supply chains and entire operational landscapes—to create a more cohesive, adaptive, human-centric, and sustainable industrial environment.
This paradigm shift moves beyond viewing machines as mere tools for productivity and advocates for a collaborative synergy in which technology enhances human capabilities, creativity, and decision-making processes. The fundamental aim is to achieve a balanced symbiosis between advanced technological systems and the unique insights and values humans bring to the table, ensuring that industrial progress supports both efficiency and the well-being of society at-large. Within this industrial revolution, a significant focus lies on fostering seamless communication and interactions between humans and machines.
Drivers of the EvolutionWhile the differences between Industry 4.0 and Industry 5.0 are clear and defined, understanding the larger societal and geopolitical factors driving this evolution is essential.
One major driver of Industry 5.0 is resilience in the face of global challenges.
Starting in 2020, the COVID-19 pandemic and subsequent disruptions exposed vulnerabilities within global manufacturing networks. In the face of these challenges, Industry 5.0 emphasizes resilience and flexibility, aiming to build systems that can adapt and recover from unforeseen events more efficiently.
In a similar vein, the COVID-19 pandemic heightened consciousness surrounding worker health and safety. Industry 5.0 seeks to leverage the technological advancements of Industry 4.0—namely, sensors and vision systems—to mitigate risks, create safer work environments, and minimize accidents.
Naturally, another significant driver of this evolution is the demand for more innovative, sustainable, and reliable products that can reach the market faster. But how will Industry 5.0 enable these changes?
Industry 5.0 will leverage the integration of digital twins with generative AI, which simplifies the prototyping of new concepts. This integration accelerates the development process and enhances the quality of the final product by allowing for the evaluation of multiple design options in terms of cost, performance, quality, and durability before a product reaches the market. Furthermore, Industry 5.0 has a major focus on sustainability, with products designed to be more recyclable and less polluting. Thus, driven by technological advancements and changing consumer demands, Industry 5.0 holds the promise of delivering innovative, high-quality, and sustainable products more efficiently.
Hurdles for the EvolutionDespite the clear benefits and reasons for moving toward Industry 5.0, the evolution is not without its challenges. Paradoxically, the still ongoing adoption of Industry 4.0 is a major hurdle to adopting Industry 5.0.
Between the advent of Industry 3.0 and the emergence of Industry 4.0, nearly four decades elapsed. Remarkably, in just one decade, we transitioned from Industry 4.0 to the dawn of Industry 5.0, a testament to the rapid pace of technological advancement and its transformative impact on manufacturing and production.
Consequently, now we are witnessing an overlap in which many companies are still in proof-of-concept evaluations of Industry 4.0 while others are leveraging Industry 5.0 already. Currently, while large corporations have made substantial investments in Industry 4.0, the adoption rate among smaller manufacturing sites and processes through full-scale digitalization projects remains relatively low.
Major barriers to adopting of Industry 4.0 technologies include the high capital expenditures needed to purchase new equipment, as well as new skill sets and expertise, along with a lack of trust in modern paradigms such as cloud computing and reliance on data security. Until the industry at large fully embraces Industry 4.0, Industry 5.0 will take some time to reach widespread adoption.
Another challenge of adopting Industry 5.0 is that it represents an inherently different mindset and approach to manufacturing.
Unlike previous evolutions (e.g., Industry 3.0 to Industry 4.0), the Industry 4.0 to Industry 5.0 evolution is not so much a challenge of technological advancement but more so a challenge of mindset advancement. Integrating new digitalization projects requires strong alignment all the way from the chief executive officer to the operator to the manufacturing floor. The organization needs to have a clear vision of what its version of Industry 5.0 will look like and then deploy this idea at all levels. This calls for new processes and ways of operating, including more delegation from the operators to those on the floor.
ConclusionLike the many industrial revolutions in human history, modern manufacturing is currently on the precipice of another remarkable evolution. The transition from Industry 4.0 to Industry 5.0 marks a significant change in the manufacturing world.
Achieving this transition requires an industry-wide mindset shift in how our factories operate, how workers interact with machinery, and how the whole ecosystem can converge. Once this happens, we can enter the era of Industry 5.0, enabling greater sustainability and resilience, increased worker safety, and a more robust supply chain.
The post The Evolution from Industry 4.0 to Industry 5.0 appeared first on ELE Times.
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