Microelectronics world news

Metcal, a leader in benchtop soldering and fume extraction systems, announces the release of their new BVX-250 Fume Extraction System. The 2-port portable fume extractor offers HEPA filtration of 99.97% efficiency with a significant performance increase over previous models.  The system also offers new innovations for changing the filters, exhausting the air, and communicating with the operator, improving ease of use and the user experience.

The BVX-250 has a new patented front-facing main filter and simple-to-use pre-filter drawer,  which allow the user to change the filters quickly and easily, without having to remove the top or manipulate the arms of the system. Each filter can now be changed in less than 30 seconds, a major improvement over comparable systems on the market.

The BVX-250 also offers a patented removable 360˚-rotating exhaust diverter which allows users to configure the exhaust direction away from the operator or install the unit directly into ventilation systems.  “Since these systems are positioned in many different locations, allowing the exhaust to be customized offers a much-improved user experience,” said Can La, Product Director of Metcal.

With the release of the BVX-250, Metcal has improved communication between the fume extractor and the operator.  New features, such as a large LED status ring, and the ability to directly connect the fume extractor to Metcal CV and GT soldering systems, allow for easy-to-view filter notifications from either the fume extractor or the soldering system.

Features and Benefits

• Easy 30-Second Filter Changes
• LED Status Ring
• 2x the Suction of Previous Models
• 99.97% Efficiency HEPA 13 Filter
• Optional Deep Bed Gas Filter (FG-BVX250, sold separately)
• Quiet Operation
• Three Power Levels
• 360-degree Rotating/Removable Air Diverter
• Communicates with Metcal CV & GT Series Soldering Systems
• New Circular & Rectangular Nozzles with Nozzle Filters are available
• Compatible with previous BVX & Omniflex Arms and Hoses
• Small Footprint for Under or On the Benchtop
• Remote Switch Included

HCT 910 Hot Air Rework System

Rework is a necessary part of any soldering operation. Whether machines or humans are assembling the printed circuit boards, inconsistencies happen. When a component is misplaced, misaligned, improperly soldered, or needs to be replaced, typically a soldering iron will be the tool of choice. But for many operators and applications, a solid hot air tool provides additional rework capabilities.

Some of the main concerns for hot air tools is the perceived lack of process control, slower productivity, and safety with hot air. So, how can we alleviate these worries? With the right rework system. Rework situations vary, so it is essential your hot air tool includes precise and simple temperature and flow rate control.

Many hot air systems on the market are not intuitive to use. The menu structures are confusing, the displays are limited, and they are simply not plug-in-play. A system that is not intuitive for the operator is a system that is going to regularly bog down throughput.

When comparing systems, be sure to investigate exactly how the hot air unit operates. Most system manufacturers have demos and how-to videos on YouTube. Watch them to see exactly how each unit is configured. You may be surprised by how few are user-friendly.

Designed with ease of use in mind, Metcal’s new HCT-910 Hot Air Rework System features a new “on-the-fly” manual mode, which allows for fast temperature and airflow adjustments with a single knob (Figure 1). Easily toggle between temperature settings and air flow rate, turn the knob to the desired setting, and push the knob to set.

Enhance Operator Safety with Clear System Status Indicators

KEY FEATURES:

• Status indicator lights on the hand-piece
• Easy to configure and monitor
• Intuitive user interface with convenient presets and admin lockout
• Accurate temperature, up to 600 °C (1112 °F)
• Fast time-to-temperature
• Airflow from 5 – 120 l/m (4.24 cfm)
• Tool-less nozzle/bayonet design
• Replaceable heater

ADDITIONAL FEATURES:

• Clearly designed digital screen for temperature and flow rate display
• System presets and password-protected admin mode
• Multi-language (English, Spanish, German, French, Chinese)
• Hand-piece holder mountable on either side of the unit

For HCT-910 Hot Air Rework System technical data, user guide, how-to videos, and more, go to Metcal.com.

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In this article, we learn about core saturation and why it should be avoided in most applications. We then examine how different ways of defining permeability can help us predict the saturation flux density of a magnetic core.

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TDK developed the new material for its rechargeable solid-state battery, supporting an energy density of 1,000 Wh/L—100 times more energy density than TDK’s current production variants.

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Thermo Fisher Scientific has launched a state-of-the-art in-line metrology solution for battery manufacturing, providing unmatched electrode mass loading measurement and coating quality assurance. The  LInspector Edge In-line Mass Profilometer is designed to revolutionize electrode coating QA by measuring 100% of a coated electrode in real time, without scanning or moving parts. This advanced tool simultaneously gathers spatial information and coating weight data, providing full-width basis weight and profile uniformity analysis with unprecedented precision. It captures data at full production speeds, producing high-resolution images rather than spot measurements typical of conventional gauges. This results in 1000 times more coating profile weight data, enabling the detection of non-uniformities that other technologies might miss. This innovation offers battery manufacturers an exceptional foundation for accurate process control and the highest levels of quality and performance assurance.

Key Features

• 100% Electrode Mass Loading Inspection: The LInspector Edge In-line Mass Profilometer allows for real-time inspection of 100% of the coated electrode at high production speeds, providing 1000 times more mass loading uniformity data than traditional scanning gauges. This data helps detect small defects early in the process, enabling effective remedial actions that reduce scrap rates, decrease time to market, and improve overall product performance.
• Advanced Process Control: Electrode coating weight and profile uniformity are critical for maintaining the quality and safety of lithium-ion batteries. The LInspector Edge delivers a complete coating profile every 3 millimeters, offering the fastest measurement feedback for quicker, better-informed, and more accurate control decisions. This capability enhances process efficiency, reduces scrap, and increases throughput during start-up and product transitions.

Application Areas

• Research and Development: For battery R&D, achieving precise electrode coating weight targets is essential for optimal performance and safety. The LInspector Edge provides comprehensive data on electrode coating uniformity, aiding in the optimization of coating materials and equipment controls, which in turn enhances process development, quality, and yield.
• Pilot Scale Manufacturing: In pilot scale production, understanding mass loading distribution is critical for improving product quality and performance. The LInspector Edge accelerates development and improves yields by offering real-time, detailed data on 100% of the coated electrode, facilitating the scale-up of next-generation materials and higher-performance batteries.
• Mass Production: As demand for lithium-ion batteries rises, the challenge is to increase throughput while reducing scrap. The LInspector Edge ensures coating uniformity and faster defect detection, providing comprehensive traceability and high-resolution data for optimized production yield and quality assurance.

Complete Traceability for Quality Assurance

Ensuring the quality of battery components throughout the manufacturing process is vital. The LInspector Edge enables complete traceability by providing high-resolution images and data on coating uniformity for the entire production run. This visibility allows manufacturers to identify and address production issues proactively, optimizing the manufacturing process for maximum efficiency.

Empowering Software

The Thermo Scientific LInspector Edge Pro Software enhances the functionality of the LInspector Edge In-line Mass Profilometer by offering real-time mass loading data analysis, high-resolution heat map displays, and comprehensive profile visualizations. Its user-friendly interface allows operators to control the analyzer and process data effectively, making quick adjustments to improve product uniformity and detect defects early.

The software features include:

• Real-Time Mass Loading Data Analysis: Displays multiple visualizations representing the mass loading levels of the entire electrode surface, allowing for quick process adjustments and improved product uniformity.
• High-Resolution Heat Map: Offers a graphical representation of mass loading results, enabling operators to quickly identify areas of concern and adjust the color scale to highlight specific features in the electrode coating.
• CD and MD Profile Displays: Provide detailed cross-section uniformity data and trend graphs for monitoring changes in average weight over time and analyzing key areas of the coating.
• Stripe Profile Display: Gives an overview of each stripe in real-time, highlighting defective areas and displaying key statistics to facilitate faster process control decisions.

By integrating the LInspector Edge In-line Mass Profilometer and LInspector Edge Pro Software, battery manufacturers can achieve higher levels of quality, efficiency, and confidence in their electrode coatings, ensuring the production of safe and reliable batteries.

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HP has introduced significant advancements to its HP Metal Jet and HP Jet Fusion 3D Printing printers, aimed at enhancing capabilities, introducing new materials, and forging strategic partnerships to propel additive manufacturing forward. The latest improvements to the HP Metal Jet S100 Printing Solution include an expanded build height of up to 170 mm, facilitating the production of larger parts and increasing the volume of parts per build cycle. This innovation leverages Metal Injection Molding (MIM) powders to achieve economies of scale, thereby reducing operational and material costs for large-scale production compared to other 3D printing technologies. With enhanced operational efficiency in printing process times, the HP Metal Jet S100 Printing Solution continues to advance towards achieving optimal industrial Overall Equipment Effectiveness (OEE).

In conjunction with the Rapid + TCT show, HP has announced several enhancements:

• Enhanced Capabilities: The HP Metal Jet S100 Printing Solution now supports increased build height and cost-effective production with new materials such as IndoMIM M2 Tool Steel and Osprey 316L.
• Launch of HP Metal Jet Production Service: This new service platform includes an adoption centre in the US and a global network of contract manufacturers, aiming to democratize 3D metal printing by addressing common barriers such as cost, time, and complexity.
• Strategic Software Updates and Partnerships: HP has bolstered its HP 3D Process Development software by incorporating advanced features such as Multi-level build. Collaborations with industry pioneers including Autodesk, Altair, CoreTechnologie, and Dyndrite have further enriched the integration of cutting-edge design and production tools. The partnership also includes the launch of the HP 3D Texture Visualizer by Leopoly, enhancing the visualization and application of digital textures on CAD geometry in real-time.

Moreover, HP has extended its material capabilities and introduced a new print mode for the HP Jet Fusion 5600 Series 3D Printing Solution. This includes compatibility with HP 3D High Reusability (HR) PA 12 W, HP 3D HR PA 12 S enabled by Arkema, and BASF Ultrasint TPU01 materials, alongside the newly introduced ESD print mode to address specific customer needs and expand production capabilities. These advancements aim to significantly reduce Total Cost of Ownership (TCO) through efficient material usage and enhanced service programs, catering to a diverse range of industrial sectors.

HP’s collaboration with Indo-MIM and Sandvik has resulted in the introduction of new materials like IndoMIM M2 Tool Steel and Sandvik’s Osprey 316L. These materials are designed for applications requiring high-strength mold inserts, cutting tools, improved corrosion resistance, and enhanced processability in industries such as medical, automotive, and industrial manufacturing. Rigorous qualification processes ensure their reliability and accessibility for additive manufacturing applications.

To further support accessibility and adoption, HP has launched the HP Metal Jet Production Service, accessible via a dedicated website. This service offers comprehensive production services, allowing customers to submit queries, request sample parts, and seamlessly transition from prototype to production. The Metal Jet Adoption Center in Corvallis, Oregon, provides end-to-end application qualifications, including benchmarking, sample part testing, and process optimization, supported by HP’s global network of Contract Manufacturers.

In addition to material advancements, HP has strengthened its strategic relationships with leading software companies. Collaborations with Autodesk, Altair, CoreTechnologie, and Dyndrite aim to integrate advanced design and production tools, enhance material information accessibility, and facilitate seamless workflows between design and production processes. These partnerships empower customers to realize innovative applications and streamline additive manufacturing operations.

For HP’s polymer and metal printing customers, the collaboration with Dyndrite supports the entire HP 3D printing ecosystem, enabling users to utilize Dyndrite build manager software for creating and submitting print jobs. HP’s Multi-level build feature within the process development allows for precise adjustment of printing parameters across multiple levels within a single build, enhancing flexibility and control.

Furthermore, HP has introduced the HP 3D Texture Visualizer, developed by Leopoly, to enhance the design process by visualizing digital 3D textures on CAD geometry in real-time. This tool supports the import of custom textures and enables users to adjust parameters like scaling, depth, and resolution to achieve desired visual effects, expanding creative possibilities in 3D design and production.

 

In conclusion, HP’s advancements in both metal and polymer 3D printing platforms, coupled with strategic partnerships and software innovations, underscore its commitment to driving additive manufacturing forward. These developments aim to enhance production efficiency, reduce costs, and broaden application possibilities across diverse industries, positioning HP as a leader in the evolving landscape of additive manufacturing technologies.

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In the realm of next-generation Edge AI computing, FPGAs play a pivotal role by offering engineers a blend of low power consumption, scalable performance, and unmatched flexibility. These attributes provide high-performance options that cater to the evolving landscape of AI designs.

Lattice Semiconductor’s MachX05-NX exemplifies this trend, integrating robust security and I/O capabilities crucial for managing and controlling Edge AI applications effectively. As the adoption of next-generation AI at the Edge accelerates across modern enterprises, investments in generative AI are projected to soar from $16 billion in 2023 to over $143 billion within the next three years, highlighting Edge AI’s pivotal role in future automation strategies.

For developers navigating this dynamic landscape, the demand for agile solutions is intensifying, driven by the need for enhanced efficiency in Edge AI computing. FPGAs emerge as a solution of choice, empowering system designers to streamline development cycles and deploy AI models swiftly across diverse applications—from smart homes and factories to intelligent automotive environments.

Ultra-Low Power and Scalable Performance

Efficient power management is critical for always-on Edge AI devices, where FPGAs deliver high performance with minimal power consumption compared to conventional processors. Their reconfigurable architecture and parallel processing capabilities enable real-time AI inference with low latency and energy efficiency. Unlike traditional CPUs, which process data in batches, FPGAs handle multiple data streams simultaneously, enhancing their suitability for smart cameras and sensor-driven applications that demand rapid data analysis.

In autonomous vehicles, for instance, FPGAs bolster situational awareness by accelerating AI computations for tasks such as object detection and path planning, crucial for real-time decision-making.

Enhanced Flexibility and Programmability

Flexibility and programmability are indispensable for Edge AI applications in the fast-evolving AI landscape. FPGAs offer unparalleled flexibility, allowing devices to be retrofitted or modified post-deployment to align with evolving performance needs, safety requirements, and system upgrades. This capability enhances operational agility and safeguards against customer dissatisfaction and regulatory risks.

Unlike fixed-function processors, FPGAs can be tailored to perform specific AI tasks, optimizing performance for both individual tasks and overall application efficiency. This adaptability makes them an ideal choice for developers seeking to fine-tune hardware to meet the precise demands of Edge AI applications.

Robust Security and Privacy

FPGAs significantly bolster cyber resilience and data privacy in Edge AI environments. By integrating FPGAs into Edge AI infrastructure, developers enhance data security through built-in features like encryption and authentication, mitigating potential cyber risks. Processing data locally on FPGAs reduces the need for extensive data transmission to the cloud, minimizing exposure to security vulnerabilities associated with cloud-based data exchanges.

Moreover, FPGAs serve as hardware roots of trust (HRoT), ensuring data integrity and bolstering overall system security. This inherent security, coupled with their adaptive nature, positions FPGAs as a robust security engine for diverse Edge AI applications, safeguarding sensitive information against unauthorized access.

Driving Innovation in Edge AI

The coexistence of FPGAs and Edge AI computing is catalyzing a new wave of innovation. As Edge AI applications evolve to demand faster processing and greater complexity, FPGAs are poised to lead the charge. Their combination of flexibility, efficiency, and security makes them a preferred choice for developers shaping the future of intelligent Edge devices.

FPGAs are not merely keeping pace with the growth of Edge AI—they are pivotal enablers of its expansion. Looking ahead, their unique capabilities will empower developers to create resilient, high-performance Edge AI solutions that redefine interactions with our increasingly interconnected world.

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Gallium nitride-on-silicon (GaN-on-Si) power solutions firm Innoscience of Suzhou, China notes that it has defeated the entirety of US Patent No. 8,404,508 of Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA in the initial determination at the US International Trade Commission (ITC). No violation was found on claim 1 (the only asserted claim) of the ’508 patent, Innoscience asserts...

VNT is excited to announce the launch of India’s first 98% efficient rectifier, a revolutionary advancement in the telecom industry. This breakthrough reinforces VNT’s leadership in developing sustainable and energy-efficient solutions.

The new Green DC Ultra High Efficiency 98% Rectifier operates with a voltage range of 85-305 VAC and can withstand temperatures range up to 75 degrees Celsius and humidity levels up to 95%. This innovation is a significant step towards achieving net-zero targets, offering unmatched efficiency, the fastest return on investment, reduced heating, and adaptability to various environmental and electrical conditions.

Telecom operators, who consume 1-2% of the world’s total electricity annually, must reduce carbon emissions from energy usage to meet net-zero goals.

Dr. Vikas Almadi, Chairman & Managing Director, and Mr. Rahul Sharma, CEO of VNT, highlighted at the launch: “In 2021, VNT set a new benchmark with its 97% efficient rectifier, surpassing the market standard of 95%. This innovation allowed telecom operators to optimize electricity usage and significantly cut energy costs. Now, with the 98% efficient rectifier, VNT is pushing efficiency even further.”

Investing in VNT’s 98% efficient rectifier provides a swift route to achieving net-zero targets while offering substantial long-term energy savings. VNT invites telecom companies to embrace this cutting-edge technology and lead the charge towards a more sustainable and connected future.

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• Joins new consortium focused on integrating artificial intelligence advancing into wireless communications technology to enhance radio access networks

• Brings measurement science expertise to artificial intelligence research areas such as improving spectral efficiency and optimizing radio access network performance

Keysight Technologies, Inc. (NYSE: KEYS) has joined the AI-RAN Alliance to advance the use of artificial intelligence (AI) technology and innovations in radio access networks (RAN). Established in early 2024, the alliance is a collaborative initiative bringing together technology, industry, and academic institutions to integrate AI into cellular technology to enhance RAN performance and mobile network capabilities.

AI is a powerful tool with the potential to revolutionize wireless communications networks. The natural complexity of its architectures and operations make RAN an ideal application for AI in order to drive more optimal, reliable, and efficient mobile networks. In response to this opportunity, the AI-RAN Alliance wants to find ways to enhance mobile network efficiency, reduce power consumption, and retrofit existing infrastructure that will unlock new economic opportunities, facilitated by 5G and 6G. The alliance will do this with RAN-related AI research in the areas of improving spectral efficiency, using architectures more effectively, generating new AI-driven revenue opportunities, and deploying AI at the network edge to offer new services and increase operational efficiency.

Keysight understands the transformative power of AI and the role it will play in shaping the way future communications systems will be built and need to be tested. The company is active in a variety of early research projects ranging from optimizing wireless performance to advancing AI learning in wireless communications testing. Keysight is also part of NIST’s AI Safety Consortium and is engaged in multiple standards and research initiatives related to the nascent field of validation of AI systems.

Ardavan Tehrani, Samsung Research, AI-RAN Alliance Board Director, said: “The AI-RAN Alliance is excited to welcome Keysight as a new member. As the wireless industry matures from AI model development to deployment, there is a need for rigorous testing of these models to ensure consistent and expected performance and reliability of AI models. The domain knowledge Keysight brings in these areas will help further the alliance’s mission of bringing AI technology to the RAN.”

Giampaolo Tardioli, Vice President, 6G and Next Generation Technology at Keysight, said: “With our deep expertise in simulation, modeling, and measurement science, Keysight will provide valuable solutions to accelerate the deployment of AI in the RAN and to improve accuracy and trustworthiness of the models of AI in the RAN. Joining the AI-RAN Alliance is a natural choice and another proof point of Keysight’s commitment in enabling innovation across the communication and computing industries. We look forward to collaborating with the other alliance members to help fully realize the potential of AI for wireless systems.”

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Just when Nvidia is prepping its Blackwell GPUs to utilize HBM3e memory modules, the JEDEC Solid State Technology Association has announced that the next version, HBM4, is near completion. HBM3e, an enhanced variant of the existing HBM3 memory, tops out at 9.8 Gbps, but HBM4 is likely to reach the double-digit 10+ Gbps speed.

HBM4, also an evolutionary step beyond the current HBM3 standard, further enhances data processing rates while maintaining essential features such as higher bandwidth, lower power consumption, and increased capacity per die and/or stack. Its features and capabilities are critical in applications that require efficient handling of large datasets and complex calculations, including generative artificial intelligence (AI), high-performance computing (HPC), high-end graphics cards, and servers.

For a start, HBM4 comes with a larger physical footprint as it introduces a doubled channel count per stack compared to HBM3. It also features different configurations that require various interposers to accommodate the differing footprints. Next, it will specify 24-Gb and 32-Gb layers with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks.

There are media reports about JEDEC having eased memory configurations by reducing thickness of HBM4 to 775 µm for 12-layer, 16-layer HBM4 due to rising complexity at higher thickness levels. However, while HBM manufacturers like Micron, SK hynix, and Samsung were poised to use hybrid bonding technology, the HBM4 design committee is reportedly of the view that hybrid bonding would increase pricing. That, in turn, will make HBM4-powered AI processors more expensive.

Hybrid bonding enables memory chip designers to add more stacks compactly without the need for through-silicon-via (TSV), which uses filler bumps to connect multiple stacks. However, with a thickness of 775 µm, hybrid bonding may not be needed for the HBM4 form factor.

For compatibility, the new spec will ensure that a single controller can work with both HBM3 and HBM4 if needed. The designers of the HBM4 spec have also reached an initial agreement on speed bins up to 6.4 Gbps with discussion ongoing for higher frequencies.

Related Content

• SK Hynix Speeds HBM Roadmap as AI Demand Soars
• HBM memory chips: The unsung hero of the AI revolution
• SK Hynix Boosting HBM Output with $14.6 Billion Investment
• A sneak peek at HBM cold war between Samsung and SK hynix
• High-bandwidth memory (HBM) options for demanding compute

The post How will HBM4 impact the AI-centric memory landscape? appeared first on EDN.

Absolute EMS, an electronics contract manufacturer, has partnered with Ventiva, a leading company in active cooling solutions for electronic devices, to build their revolutionary Ionic Cooling Engine (ICE). ICE is a cutting-edge cooling technology that promises to redefine thermal management in electronics. This collaboration highlights Absolute EMS’s capabilities in precision manufacturing and their commitment to providing exceptional customer service, while showcasing Ventiva’s innovative technology.

Established in 1996 and headquartered in Santa Clara, CA, Absolute EMS has built a reputation as a trusted provider of turnkey contract manufacturing services. Specializing in the entire lifecycle of product development—from New Product Introduction (NPI) to end-of-life—Absolute EMS ensures the highest quality and precision in every product. Their state-of-the-art facility offers touchless manufacturing, automated first article inspection, and in-line inspection capabilities such as 3D Solder Paste Inspection, (SPI), AOI and X-ray technology, upholding stringent standards of excellence. “The product that Ventiva is bringing to market is a leading-edge product that will change the industry,” stated Doug Dow, COO at Absolute EMS.  “We’re proud to create top tier manufacturing processes      to support their success. Our commitment to our customer relationships, excellence and innovation enables us to meet the rigorous demands of this advanced technology.”

Absolute EMS’s certifications, including ISO 13485:2016, AS9100 Rev D, and ISO 9001:2015, demonstrate their dedication to high reliability manufacturing. Their expertise spans various industries such as medical, military, industrial, networking, and engineering, providing customized quality reporting, device history record keeping, and traceability to the component level.

Ventiva, based in Silicon Valley, is known for its groundbreaking Ionic Cooling Engine (ICE®) technology. Developed over a 12-year period, ICE represents a quantum leap in thermal management by moving air without moving parts, noise, or vibration. Utilizing electrohydrodynamic (EHD) flow, ICE generates a potent “solid-state” cooling force suitable for up to 30-Watts Thermal Design Power (TDP) systems.

“Our technology addresses the limitations of conventional cooling solutions in laptops, handheld devices and other high-performance electronics. ICE provides a silent, ultra-compact, and vibration-free alternative for the AI enabled world,” explained Tim Lester, COO at Ventiva.

The partnership between Absolute EMS and Ventiva is a testament to the synergy between advanced manufacturing capabilities and cutting-edge technology. Absolute EMS’ role in manufacturing Ventiva’s ICE technology involves not only creating the electronics board that powers the device but also producing the unique blower component—a task requiring exceptional precision and flexibility.

“We chose Absolute EMS for their flexibility and willingness to help us in a new category where nobody has manufacturing experience,” added Lester. “Their support has been crucial in speeding up our production iterations and ensuring high-quality outputs.”

As the demand for more efficient, silent, and compact cooling solutions grows, the collaboration between Absolute EMS and Ventiva is poised to make significant impacts in the electronics industry. Ventiva’s ICE technology is set to replace traditional fans in various applications, starting with laptops and eventually extending to handheld devices, VR headsets, and more.

“We are excited about the potential of ICE technology and the role it will play in future electronic devices,” added Doug Dow. “Our partnership with Ventiva exemplifies our commitment to supporting innovative technologies and helping our customers succeed in competitive markets.”

The collaboration between Absolute EMS and Ventiva showcases the best of both worlds: advanced manufacturing capabilities and groundbreaking thermal management technology. Together, they are set to revolutionize the way electronic devices are cooled, paving the way for quieter, more efficient, and more compact electronics.

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New technology ecosystem is also launched as Microchip collaborates with over a dozen system and software partners to accelerate PIC64-HPSC adoption

The world has changed dramatically in the two decades since the debut of what was then considered a trail-blazing space-grade processor used in NASA missions such as the comet-chasing Deep Impact spacecraft and Mars Curiosity rover vehicle. A report released by the World Economic Forum estimated that the space hardware and the space service industry is set to grow at a CAGR of 7% from 2023’s $330 billion dollars to $755 billion dollars by 2035. To support a diverse and growing global space market with a rapidly expanding variety of computational needs, including more autonomous applications, Microchip Technology has launched the first devices in its planned family of PIC64 High-Performance Spaceflight Computing (PIC64-HPSC) microprocessors (MPUs).

Unlike previous spaceflight computing solutions, the radiation- and fault-tolerant PIC64-HPSC MPUs, which Microchip is delivering to NASA and the broader defense and commercial aerospace industry, integrate widely adopted RISC-V CPUs augmented with vector-processing instruction extensions to support Artificial Intelligence/Machine Learning (AI/ML) applications. The MPUs also feature a suite of features and industry-standard interfaces and protocols not previously available for space applications. A growing ecosystem of partners is being assembled to expedite the development of integrated system-level solutions. This ecosystem features Single-Board Computers (SBCs), space-grade companion components and a network of open-source and commercial software partners.

“This is a giant leap forward in the advancement and modernization of the space avionics and payload technology ecosystem,” said Maher Fahmi, corporate vice president, Microchip Technology’s communications business unit. “The PIC64-HPSC family is a testament to Microchip’s longstanding spaceflight heritage and our commitment to providing solutions built on industry-leading technologies and a total systems approach to accelerate our customers’ development process.”

The Radiation-Hardened (RH) PIC64-HPSC RH is designed to give autonomous missions the local processing power to execute real-time tasks such as rover hazard avoidance on the Moon’s surface, while also enabling long-duration, deep-space missions like Mars expeditions requiring extremely low-power consumption while withstanding harsh space conditions. For the commercial space sector, the Radiation-Tolerant (RT) PIC64-HPSC RT is designed to meet the needs of Low Earth Orbit (LEO) constellations where system providers must prioritize low cost over longevity, while also providing the high fault tolerance that is vital for round-the-clock service reliability and the cybersecurity of space assets.

PIC64-HPSC MPUs offer a variety of capabilities, many of which were not previously available for space computing applications, including:

• Space-grade 64-bit MPU architecture: Includes eight SiFive RISC-V X280 64-bit CPU cores supporting virtualization and real-time operation, with vector extensions that can deliver up to 2 TOPS (int8) or 1 TFLOPS (bfloat16) of vector performance for implementing AI/ML processing for autonomous missions.
• High-speed network connectivity: Includes a 240 Gbps Time Sensitive Networking (TSN) Ethernet switch for 10 GbE connectivity. Also supports scalable and extensible PCIe Gen 3 and Compute Express Link (CXL) 2.0 with x4 or x8 configurations and includes RMAP-compatible SpaceWire ports with internal routers.
• Low-latency data transfers: Includes Remote Direct Memory Access (RDMA) over Converged Ethernet (RoCEv2) hardware accelerators to facilitate low-latency data transfers from remote sensors without burdening compute performance, which maximizes compute capabilities by bringing data close to the CPU.
• Platform-level defense-grade security: Implements defense-in-depth security with support for post-quantum cryptography and anti-tamper features.
• High fault-tolerance capabilities: Supports Dual-Core Lockstep (DCLS) operation, WorldGuard hardware architecture for end-to-end partitioning and isolation, and an on-board system controller for fault monitoring and mitigation.
• Flexible power tuning: Includes dynamic controls to balance the computational demands required by the multiple phases of space missions with tailored activation of functions and interfaces.

“Microchip’s PIC64-HPSC family replaces the purpose-built, obsolescence-prone solutions of the past with a high-performance and scalable space-grade compute processor platform supported by the company’s vibrant and growing development ecosystem,” said Kevin Kinsella, Architect – System Security Engineering with Northrop Grumman. “This innovative and forward-looking architecture integrates the best of the past 40-plus years of processing technology advances. By uniquely addressing the three critical areas of reliability, safety and security, we fully expect the PIC64-HPSC to see widespread adoption in air, land and sea applications.”

In 2022, NASA selected Microchip to develop a High-Performance Spaceflight Computing processor that could provide at least 100 times the computational capacity of current spaceflight computers. This key capability would advance future space missions, from planetary exploration to lunar and Mars surface missions. The PIC64-HPSC is the result of that partnership. Representatives from NASA, Microchip and industry leaders like Northrop Grumman will share insights about the HPSC technology and ecosystem at the IEEE Space Compute Conference 2024, July 15–19 in Mountain View, California:

• Conference Keynote – Dr. Prasun Desai, Deputy Associate Administrator, Space Technology Mission Directorate, NASA: Dr. Desai will speak about the agency’s strategy for advanced computing and investment in HPSC technology.
• HPSC Workshop, “HPSC: Redefine What’s Possible for the Future of Space Computing”: Prasun Desai will join Microchip and JPL speakers to provide an overview of HPSC program and platform. Invited aerospace industry partner Kevin Kinsella from Northrop Grumman will also share insights on the significance of HPSC for spaceflight computing. A Q&A session will follow.

Microchip’s inaugural PIC64-HPSC MPUs were launched in tandem with the company’s PIC64GX MPUs that enable intelligent edge designs in the industrial, automotive, communications, IoT, aerospace and defense segments. With the launch of its PIC64GX MPU family, Microchip has become the only embedded solutions provider actively developing a full spectrum of 8-, 16-, 32- and 64-bit solutions.

Microchip has a broad portfolio of solutions designed for the aerospace and defense market including processing with Radiation-Tolerant (RT) and Radiation-Hardened (RH) MCUs, FPGAs and Ethernet PHYs, power devices, RF products, timing, as well as discrete components from bare die to system modules. Additionally, Microchip offers a wide range of components on the Quality Products List (QPL) to better serve its customers.

Comprehensive Ecosystem

Microchip’s new PIC64-HPSC MPUs will be supported by a comprehensive space-grade ecosystem and innovation engine that encompasses flight-capable, industry-standard SBCs, a community of open-source and commercial software partners and the implementation of common commercial standards to help streamline and accelerate the development of system-level integrated solutions. Early members in the ecosystem include: SiFive, Moog, IDEAS-TEK, Ibeos, 3D PLUS, Micropac, Wind River, Linux Foundation, RTEMS, Xen, Lauterbach, Entrust and many more. For information visit Microchip’s PIC64-HPSC MPU ecosystem partners webpage.

Microchip will also offer a comprehensive PIC64-HPSC evaluation platform that incorporates the MPU, an expansion card and a variety of peripheral daughter cards.

Pricing and Availability

PIC64-HPSC samples will be available to Microchip’s early access partners in 2025. For additional information, please contact a Microchip sales representative.

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Siemens’ new software can provide more insights into chip failure modes.

The new current sensors integrate more features, reducing the need for external components.

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ST’s hardware kits, evaluation camera modules, and software ease development with its BrightSense global-shutter image sensors. The sensors feature a 3D-stacked construction, which results in a very small die area. This allows for integration in space-limited applications, especially within the final optical module. Additionally, their MIPI-CSI-2 interface makes them well-suited for embedded vision and edge AI devices, including industrial robots, AR/VR equipment, traffic monitoring, and medical devices.

Evaluation camera modules integrate a BrightSense image sensor, lens holder, lens, and plug-and-play flex connector that allows easy swapping of sensors. The modules offer a choice of lens options and come in sizes as small as 5 mm2. Also joining this image sensor ecosystem are hardware kits that enable developers to integrate the sensors with various desktop and embedded computing platforms.

Complementary software tools, available for free download on ST’s website, include a PC-based GUI and Linux drivers. These tools facilitate integration with common processing platforms, such as STM32MP microprocessors.

The BrightSense global-shutter family comprises the VD55G0, VD55G1, and VD56G3 monochrome sensors (0.38 Mpixel to 1.5 Mpixel), as well as the color VD66GY (1.5 Mpixel). Their high sensitivity enhances low-light performance and permits fast image capture without distortion.

BrightSense image sensors and supporting development tools are in production now.

STMicroelectronics

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Allegro’s two new magnetic current sensors enhance system efficiency and protection compared to discrete shunt-based current sensing circuits. The ACS37220 measures current up to 200 A, while the ACS37041 measures current up to 30 A. Both Hall effect sensors are designed for applications with isolation voltage requirements below 100 V. Additionally, the ACS37041 is anticipated to be the industry’s smallest leaded magnetic current sensor.

Existing shunt solutions need multiple components, occupy significant board space, and often require extra PCB layers and heatsinks to maintain thermal performance, adding weight, size, and design complexity. The ACS37220 and ACS37041 address these challenges by providing a smaller footprint, higher efficiency, and simpler integration.

The current sensors integrate the functions of a shunt resistor, shunt amplifier, and other passive components into a single, compact package. Housed in a 4×4-mm QFN package, the ACS37220 has low internal conductor resistance of 0.1 mΩ, ensuring minimal power loss and enabling it to withstand high inrush currents. The ACS37041, with a higher conductor resistance of >1 mΩ, fits into a compact 5-pin SOT23-W package.

The ACS37220 current sensor is available now through Allegro’s distributor network. Engineering samples of the ACS37041 pre-release sensor are available upon request.

ACS37220 product page 

ACS37041 product page 

Allegro Microsystems 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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