Microelectronics world news

iWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM). The SoM incorporates NXP’s  powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor.

NXP’s i.MX 93 SoC is the first in the industry to integrate the Arm Ethos-U65 microNPU and the first in the i.MX Family to integrate the scalable Arm Cortex-A55 core features the latest Armv8-A architecture extensions with dedicated instructions to accelerate machine learning (ML).

Key features of iW-RainboW-G50M

• NXP i.MX 9352 SoC
  • 2 × Cortex-A55 + 1 × Cortex-M33
  • NPU up to 0.5 TOPS
• 2GB LPDDR4X RAM & 8GB eMMC Flash
• 2-Lane MIPI-CSI and 4-Lane MIPI-DSI Interface
• 2 x RGMII, 2 x CAN-FD, 1 x LVDS
• 1 x USB 2.0 OTG, 4 x USB 4.0 Host
• Wi-Fi 6 & Bluetooth 5.2 Connectivity
• Size-L Form Factor: 45mm x 45mm
• Solderable LGA Package in OSM v1.1 Standard
• 662 Contacts

The System on Module is built on a 45mm x 45mm OSM Size-L standard with the provision for 662 contacts, offering the highest pin-to-area ratio across SoM standards. With the ability to directly solder the SoM onto the carrier card, the SoM ensures high levels of robustness and is ideal for products prone to vibrations.

The SoM supports the MIPI-CSI camera interface to leverage the integrated NPU while supporting a 4-lane MIPI-DSI with 1080p60 resolution for 2D graphics processing through a high-efficiency pixel pipeline. The availability of high-speed interfaces such as USB 2.0, Gbit ethernet, and CAN-FD makes the SoM ideal for industrial and automotive market segments.

Building on the ML capabilities of NXP’s i.MX 93 applications processor, the SoM can be adopted by product companies as a powerful building block for machine vision, AIoT, Smart City, Industrial automation, and other ML-related applications.

“With billions of devices connected worldwide and the rise of AI on the edge, it is crucial to ensure safety, energy efficiency, and compute power,” said Immanuel Rathinam, Vice President – System on Modules at iWave.” NXP’s i.MX 93 OSM System on Module enables a new generation of intelligent devices across industrial, IoT, and automotive applications and speeds up time to market with reduced risk and complexity.”

“The i.MX 93 applications processors deliver a strong combination of performance and power optimization to accelerate processing and machine learning at the edge,” said Justin Mortimer Senior Director Secure Connected Edge at NXP Semiconductors. “ïWave’s iW-Rainbow-G50 SOM, by utilizing the new OSM standard, ensures our latest processing technology is both accessible and applicable to a wider range of embedded applications.“

The i.MX 93-based System on Module is also integrated on a carrier board, which is positioned as a Single Board Computer and also doubles up as an evaluation kit. The production-ready Single Board Computer is built on a Pico-ITX form factor and integrates across various AI and ML applications. Software companies can concentrate on their core competencies, such as AI and machine learning algorithms and software, and enable them on the Single Board Computer.

Key Features of the Single Board Computer

• NXP i.MX 9352 SoC
• 2GB LPDDR4X RAM, 16GB eMMC
• Dual Gigabit Ethernet
• Dual USB 2.0 Host & USB 2.0 OTG
• Micro SD Slot and M.2 Connector Key B
• MIPI CSI Camera Connector
• MIPI DSI Display Connector
• LVDS Display Connector
• RS232 and CAN header
• 5 mm Audio In/Out through I2S Codec
• Wi-Fi 6 and Bluetooth 5.2 Module
• GNSS Receiver module
• Line In / Out Speaker Header

The System on Module and Single Board Computer are go-to-market and production ready, with all documentation, necessary software drivers, and BSP available for customers. iWave maintains a product longevity program and ensures the availability of the modules for 10+ years.

The post iWave launches iW-Rainbow-G50M: The NXP Semiconductors i.MX 93 SoC-Based System on Module powering energy efficient edge computing appeared first on ELE Times.

At APEC 2023, Infineon Technologies announced the company is joining forces with Infinitum, creator of the sustainable, breakthrough air core motor. In this technology collaboration, Infineon will provide silicon carbide (SiC) CoolSiC MOSFETs and other key semiconductor components that greatly contribute to the Infinitum motor system’s precise motor control, optimal power and energy savings.

The Infinitum Aircore EC motor for commercial and industrial applications will be showcased at Infineon’s booth #932 at APEC 2023 in Orlando, Florida, 19 to 23 March. The motor uses Infinitum’s patented air-core motor design, which replaces heavy iron used in traditional motors with a lightweight, printed circuit board (PCB). The company’s award-winning motors are 50 percent smaller and lighter, ten percent more efficient and use 66 percent less copper than traditional motors.

“Infineon is a leading provider of silicon carbide chips and embedded technologies that can greatly contribute to Infinitum motor system’s value-added features from an energy, carbon footprint and performance standpoint,” said Rick Tewell, President of Infinitum. “We are excited to team with Infineon on our continued collaboration. The company helps us bring innovative new breakthroughs to our customers in the industrial sector.”

“Infineon and Infinitum are two companies with the same mission to drive decarbonization, with greater efficiency in motor control and less waste in hardware for industrial applications,” said Michael Williams, Director of Product Marketing, Industrial Power Control Division, Infineon Technologies. “We are excited to team with Infinitum, a company that delivers award-winning motor control systems with hardware motor design that has been taken to a whole new level. With our proven SiC and semiconductor technologies, we are helping Infinitum deliver more precise motor control for better power and energy savings.”

As an industry leader in SiC chips, Infineon provides power switching in this arena of voltages at 650 V and above for a wide range of applications that operate in harsh environments. The company has more than two decades of SiC experience. Infineon’s CoolSiC semiconductors also offer added value to customers like Infinitum by providing better efficiency, size and cost compared to silicon-based solutions.

Infineon will also be showcasing its broad product portfolio of advanced silicon and wide bandgap materials at booth #932 at APEC 2023 in Orlando, Florida, 19 to 23 March. More information is available at www.infineon.com/apec.

The post Infineon teams with Infinitum to drive decarbonization; showcases Infinitum’s breakthrough, sustainable air core motor drive at APEC 2023 appeared first on ELE Times.

First a scholar and later an astronaut, Resnik was a crew member on Discovery and lost her life in the Challenger disaster.

Japan’s ROHM says that its silicon carbide (SiC) MOSFETs and SiC Schottky barrier diode (SBD) are being adopted by precision power analog company Apex Microtechnology of Tucson, AZ, USA (a part of HEICO Corp’s Electronics Technologies Group) for a new line of power modules. The product family currently includes the three-phase SA310 module, suitable for driving high-voltage BLDC motors, as well as two half-bridge devices SA110 and SA111, suitable for a wide range of high-voltage applications...

ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has extended its edge-emiting laser diode portfolio by introducing a compact surface-mount device with a small aperture size. The SPL S1L90H_3 offers improved performance at long range and easier optical integration in light detection & ranging (LiDAR) and long-distance industrial ranging applications...

At the Applied Power Electronics Conference & Exposition (APEC 2023) in Orlando, Florida (19-23 March), discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc of Malvern, PA, USA is showcasing its portfolio of power management solutions addressing the latest trends in power electronics — from energy harvesting, electric vehicle (EV) powertrains, and mass commercialization to efficient and effective power electronics for power tools and switching regulators that shorten the iterative design cycle...

Silanna Semiconductor of San Diego, CA, USA, which makes AC/DC and DC/DC power converter ICs, has expanded its family of fast charger reference designs with its first 100W multi-port offering. Built around its CO2 Smart Power AC/DC controllers and high-frequency DC/DC converters, the RD-16 integrates a front-end PFC converter stage and provides a high-power-density, ultra-efficient, production-ready solution for multi-port 100W USB-PD applications delivering currents up to 5A...

Infineon Technologies AG of Munich, Germany is joining forces with Infinitum of Round Rock, TX, USA, creator of the sustainable air-core motor. Infineon will provide silicon carbide CoolSiC MOSFETs and other key semiconductor components that contribute to the Infinitum motor system’s precise motor control, optimal power and energy savings...

I thought to share with you this chip I desoldered from an old Creative sound card from the nineties. It's a YMF262, and can be considered a piece of history in electronic sound synthesis for music. Made by Yamaha in 1994 it's an Operator type L, shortened in OPL, and this is an OPL3, the latest version of this series before it was superseeded by the ESFM technology. For those who are no longer young like me this is a remainder of how music sounded from the computers of the era. In this Wikipedia page there is the whole history plus some sample sounds: https://en.wikipedia.org/wiki/Yamaha_OPL The chip I desoldered is likely still working, even though I have no projects to use it besides taking a nice picture of it. ​ https://preview.redd.it/p1jj54jllyoa1.jpg?width=902&format=pjpg&auto=webp&s=5cc4e9ea4b4f0f17bb95360888e8066b2df355c3 submitted by /u/ClaudioHG [link] [comments]

submitted by /u/LostResort_ [link] [comments]

KAUST researchers created a metal when stacking blue phosphorous, which effectively eliminated the contact issues of 2D semiconductors—a promising discovery for future transistors.

The MOSFET in Figure 1 is used as both a heater and a temperature sensor in a thermostatic circuit.

Figure 1 Circuit diagram for using a MOSFET as a thermostatic heater.

The circuit can be used as a tiny thermostat for some biological structures in a Petri dish (typical set temperature is from 30॰C to 50॰C); other uses may include plastic cutting/welding, thermostating of electronic components, and even soft soldering since the maximal working temperature for Si MOSFETs is around 175॰C and, for silicon carbide (SiC), MOSFETs can be far larger.  

To function properly in this circuit, the MOSFET Q1 should have a so-called “parasitic” diode within the MOSFET structure (its cathode is connected to the drain of the nFET). Almost all power MOSFETs have this diode within them (in any case you can check its existence in the datasheet). The circuit uses this diode as a temperature sensor (the temperature coefficient is about −2 mV/°C for silicon).

During the negative half-wave of the input AC, while the MOSFET Q1 is OFF, the negative voltage on the “parasitic” diode charges the capacitor C1 through the Schottky diode D3; as a matter of fact, these components create an envelope detector. (This part of the circuit can also be interpreted as an S/H circuit.)

The thing is, the typical direct voltage on a “parasitic” Si diode is 0.3V to 0.5V higher than the Schottky’s one, hence the maximal negative voltage on C1 may be about -0.3V to -0.5V. Resistors R6 and R7 are part of the envelope detector; they also make a level shift of this negative value to a positive one, making it appropriate for the TL431. To make this possible, the voltage regulator on LM317 provides a positive voltage for this level shift.  

The set temperature of the circuit can be changed simply by changing the output voltage of the regulator (varying the values of R8 or R9).

The main role of the resistor R1 is to limit any transient currents to the values which are safe for both MOSFET Q1 and diode D2.  Nevertheless, if the application allows, this role can be used broaden to some of the circuit’s functionality: R1 can be used as one more heating spot. You should remember however, this spot will have no thermal sensor inside, so a regulation in its vicinity may be far more crude.  

During the following positive half-wave, the negative voltage saved on C1 makes the TL431 determine whether the MOSFET Q1 has to be ON or OFF.

When Q1 is ON, the circuit on the pnp transistor Q3 maintains the drain voltage of Q1 very close to the voltage on R4. This is because both the MOSFET Q1 and the transistor Q3 constitute a negative-feedback amplifier, which determines the operating point of Q1 by the ratio of the values R3 and R4.

As shown in Figure 1, the MOSFET Q1 with resistor R1—on the one hand—and resistors R3, R4—on the other hand—make up a bridge circuit, which restores its equilibrium if the drain voltage is ~equal to or close to the base voltage of Q3.

  Playing with R3/R4 ratio will allow you to change the ratio of the heat dissipated by Q1 and R1.

When R3 = R4, the electrical powers dissipated on Q1 and R1 are equal; in general R1 can be used as additional heater for a larger object, when Q1 alone can’t provide sufficient heating.  

In any case, have in mind the maximal ratings of Q1, D2 and R1.

These relations between time constants should be observed:

(R6+R7)*C1 >> T/2 >> R1*C1,

where T stands for period of input AC.      

When using the heater for a critical application at high temperatures, caution should be observed since some SiC MOSFETS can be unreliable [1].

Note: since the minimal voltage on TL431 is about 0.9V to 1V, the minimal gate threshold voltage of Q1 (at the maximal working temperatures!) should be higher than this value.  

—Peter Demchenko studied math at the University of Vilnius and has worked in software development.

Related Content

• Measure junction temperature using the MOSFET body diode on a PG pin
• Use a transistor as a heater
• Inverted MOSFET helps 555 oscillator ignore power supply and temp variations
• Transistor ∆VBE-based oscillator measures absolute temperature
• A safe adjustable regulator

Reference

1. Lelis, Aivars J., et al. “High-Temperature Reliability of SiC Power MOSFETs.” Materials Science Forum, vol. 679–680, Trans Tech Publications, Ltd., Mar. 2011, pp. 599–602. Crossref, doi:10.4028/www.scientific.net/msf.679-680.599.

The post Using a MOSFET as a thermostatic heater appeared first on EDN.

ASMPT Ltd, the leading global supplier of integrated hardware and software solutions for the manufacture of semiconductors and electronics has been profitable ever since listing in Hong Kong in 1989 and it has successfully grown its business organically and inorganically for more than 40 years. It recently announced its full year 2022 results, achieving its second highest ever revenue and bookings in spite of a challenging macroeconomic environment and an industry downcycle. The Group is pleased to announce significant developments in its leadership team that will help it further strengthen the strategic implementation of its corporate goals and vision.

“As a truly global company with a unique, broad portfolio and technology leadership in many areas, ASMPT must continue adapting in order to continue growing and thriving,” said Robin Ng, Group CEO. “We are continually reviewing and adjusting our plans, bearing in mind our global footprint and the ongoing dynamic macroeconomic environment we are operating in. We are strengthening key areas such as corporate strategy, digitalization, sustainability, and company culture, which are foundational for our future, allowing ASMPT’s SMT Solutions and Semiconductor Solutions to embark on a path to develop an integrated organization that will best serve its customers and partners needs, while enabling it to continue growing and competing well.”

Global Leadership Team – Guenter Lauber, EVP & Chief Strategy and Digitalization Officer

With more than 25 years in the business, Guenter Lauber, an Executive Vice President, has been the CEO of the Group’s SMT Solutions Segment since its inception, successfully growing it to become one of ASMPT’s key businesses and the clear leader in the SMT market, while deepening its technology footprint in key industries such as automotive, EMS and industrial. The SMT Segment also reported its highest ever annual revenue for the year 2022 recently.

Guenter Lauber took on two additional portfolios in 2018. As ASMPT Chief Strategy Officer and Chief Digitalization Officer he has been coordinating key strategic growth and cost optimization initiatives, major corporate projects such as digitalization, strategic investment decisions, and driven ASMPT’s change and transformation work, including ESG and sustainability. His visionary and strategic leadership has been instrumental to ASMPT´s continued success.

Looking forward, Guenter Lauber will focus even more on the growth and progress of ASMPT’s strategy and digitalization journey, which includes developing a leading market position in software solutions for the semiconductor and electronics industry. In this regard, Guenter Lauber will pass the baton as CEO of the SMT solutions segment to Josef Ernst, a Senior Vice President and SMT COO, with effect from 1 May 2023. Guenter Lauber will continue to serve as Chairman of the SMT Board to provide continuity and guidance to the SMT management team as needed.

“In my focused global roles, I will help bring our ‘One ASMPT’ culture to life in order to drive our success in key areas such as our business and people strategy, digitalization, ESG and sustainability, including DEI,” said Guenter Lauber. “I am convinced that, beyond the right strategy, it is the company culture that will underpin the success of ASMPT. My vision is for all members of ASMPT – whether Business Units, Regions, Departments or individual employees – to be empowered, motivated, and armed with the right tools and resources, to make decisions and take actions that are best for the company, and by doing so, help to make our strategies a reality.”

SMT Segment Leadership – Josef Ernst, SVP & CEO, SMT Solutions Segment, ASMPT

Josef Ernst will take over from Guenter Lauber as CEO for the SMT Solutions Segment after two years as Segment COO. A Senior Vice President of ASMPT, Josef Ernst has extensive experience across the company in various global management roles and deep industry knowledge of the SMT business. Josef Ernst began his career with the company in Quality Management-Technical Analysis before moving on to work in SCM, where he was instrumental in setting up the Group’s SMT factory in Singapore. He then headed the segment’s global R&D organization for about eight years before taking on the role of head of the Global SMT Solutions CRM organization, where he spent 4 years, before taking on the Segment COO role.

Josef Ernst’s excellent management skills, his extensive hands-on SMT expertise, his knowledge of the SMT market, and his customer-focused approach make him ideally suited to lead the SMT Solutions Segment to maintain its technology and innovation leadership in the SMT market.

“The success of our customers is always my top priority; their success is our success,” said Josef Ernst, CEO, SMT Solutions Segment, ASMPT. “The electronics market and our world of the ‘new normal’ in general demand a lot of openness and cooperation from us as colleagues, fellow market players, and partners. It is my goal to lead teams of experts across the world to success, efficiently and effectively with a focus on individual customer and strategic long-term market requirements. What counts for us is quality paired with innovation speed based on a focused approach. That’s what I stand for.”

Guenter Lauber, EVP & Chief Strategy and Digitalization Officer, ASMPT	Josef Ernst, SVP & CEO, SMT Solutions Segment, ASMPT

 

The post ASMPT announces key global and SMT leadership changes to prepare it for the future appeared first on ELE Times.

Union Minister of State for Electronics and IT Rajeev Chandrasekhar said the government has set the target to increase electronics manufacturing capability to Rs 24 lakh crore by 2025-26.

Centre targets Rs 24 lakh cr electronics manufacturing capacity by 2026: Union Minister Rajeev Chandrasekhar

Addressing a gathering of students in Bengaluru as part of the ‘New India for Young India Initiative’, the minister said that young Indians are driving the country’s progress in India’s ‘Techade’.

The IT Minister said that the government’s initiative to increase electronics manufacturing will help create over 10 lakh jobs in the country.

“There are more than 90,000 startups, including 110 unicorns, in which Young Indians are playing a big part,” he said.

He informed that 15 lakh young Indians from Karnataka will be given training in industry-relevant future-ready skills.

Recently, the Centre approved another tranche of production-linked incentive (PLI) scheme worth Rs 765 crore for large-scale electronics manufacturing, including Apple iPhone chip maker Wistron.

The post Centre targets Rs 24 lakh cr electronics manufacturing capacity by 2026: Union Minister Rajeev Chandrasekhar appeared first on ELE Times.

There is no skilled talent available to handle chip manufacturing plants in India, and there will be a requirement of 10,000-13,000 human resources to meet industry requirements by 2027, a Meity official said, citing an internal report.

While speaking at a panel discussion on Electronics Sector Skill Council foundation day, Ministry of Electronics and IT Scientist ‘E’ Prashant Kumar said that India has a big pool of semiconductor design engineers, but to handle semiconductor plants, talents will initially come from overseas, and gradually resources will be developed in the country.

“For semiconductor manufacturing, other than Strategic Works, SCL etc, we do not have skilled manpower readily available in India. There will be around 10,000-13,000 kinds of requirements for semiconductor manufacturing,” he said citing the task force report.

He later said the manpower to handle the wafer fab (semiconductor manufacturing plant) will initially come from outside, and then the companies will be engaged in creating skilled resources locally to meet the estimated requirement of a 10,000-13,000 talent pool by 2027.

Kumar said that under the Chips-to-Startup programme, the government is targeting to create over 85,000 skilled manpower by 2027 and provide expensive state-of-the-art chip designing EDA (Electronics Design Automation) tools to 120 organisations, including colleges, startups and public institutions, to give hands-on experience to students.

At the event, the Electronics Sector Skills Council of India (ESSCI) launched the Electronics Olympiad in association with state-owned CSC E-governance Services that will engage students in schools, colleges and higher education institutions for competition in electronics projects.

The post India lacks talent for chip manufacturing; requires 10-13k resources by 2027: Meity official appeared first on ELE Times.

High-density power modules enable acute surveillance networks leveraging AI to deter crime

The concept of automated policing began as a science fiction concept years ago, but today it is real and impactful. The sophistication of robot-powered security is actually even more interesting if you spend a few minutes talking to Stacy Stephens, the co-founder and chief client officer of Knightscope, Inc.

Launched in 2013, the Mountain View, CA, public safety technology services company was the first in the world to deploy mobile, fully autonomous security robots (ASRs) in public spaces such as malls, parking lots and neighborhood parks. The Knightscope vision was to find a more effective means of deterring crime while minimizing risk to law enforcement officers.

Knightscope’s mobile robots are completely autonomous, using a system of LIDAR, GPS, sonar, IMUs, 4K cameras and high-fidelity audio. The robot has five sensor types—similar to humans but with far greater acuity.

Knightscope as a leading public safety tech company rather than a robotics organization with expertise in a fusion of robotics, self-driving technology, vehicle electrification and artificial intelligence. Combined, they yield an agile platform upon which numerous types of sensing capabilities and other technologies can be integrated to provide actionable intelligence.

Delivering superior ASR surveillance capability

ASRs are equipped to scan for known threats, allowing companies to reduce workplace violence by recognizing terminated employees or those who have been issued criminal trespass warnings. ASRs also provide parking lot security by using exception monitoring to ID the license plates of cars that don’t belong on site. With their audio feature, ASRs provide two-way communication, allowing the robots to act as a public address system with broadcast capability. This enables them to engage with perpetrators to de-escalate hostile situations.

“The ASR’s ‘talk-down’ feature takes the danger off the human and puts it on the robot,” Stephens said. “Robots are a nondescript object that allow a conversation to take place without having a person in front of a hostile suspect that could unintentionally escalate the situation. They also lower operating overhead,” Stephens added. “ASRs never get sick, and they don’t take vacation.”

Infusing technology to drive ASR autonomy

Knightscope’s mobile robots are completely autonomous, using a system of LIDAR, GPS, sonar, IMUs, 4K cameras and high-fidelity audio. The robot has five sensor types (similar to humans) to manage its surroundings. In most cases, the robot’s senses are more acute than a public safety officer’s.

In all, 21 LIDAR lasers map the surrounding area every 25 milliseconds. That data is used to create a 3D map of the area around the robot out to a 100-meter radius, which enables the ASR to “see” its environment. Additionally, sonar sensors provide proximity sensing that allows the robot to tell when something is physically close. GPS is included as a tertiary input for internal navigation and helps track the machine if someone were to attempt to move or steal the robot.

Odometry sensors calculate wheel rotation to indicate if the robot is moving or tracking left or right. Finally, an inertial measurement unit, or IMU, provides six-degrees-of-freedom spatial awareness to determine if the robot is upright or tilted, which could signal it has become stuck or immobilized.

Power efficiency is paramount for ASRs

The intense level of computing, communications and sensing places a tremendous burden the ASRs’ power delivery networks. They must be compact and have high efficiency. Because the ASRs have no airflow or venting, Knightscope went hunting for a pure conduction-cooled solution that could use the aluminum skin as a heat sink. The company adopted a Vicor DC-DC converter module (DCM3623) because its unique ChiP packaging was thermally adept and very small. The DCM’s power density also helped with routing the wiring and cable assembly and increased battery efficiency, performance and runtime.

On the electrical side, the robot required isolation from all of the different power rails. Because there are so many sensors with different EMI signatures, the Vicor DCM helped minimize EMI and noise interference.

“The more we’re able to reduce the burden on the battery, the longer runtime we will get,” Stephens said. “So, power’s always, always going to be a consideration. And, ultimately, all of this will help us achieve our vision for the company, which is that when an architect sits down to plan a commercial development or a mixed-use space, we’re part of the security check list along with smoke detectors and fire suppression systems.”

A typical mobile robotics application powers a variety of loads ranging from computers to motor drives and cameras. Knightscope powers LIDAR, GPS, sonar, IMUs, 4K cameras and high-fidelity audio and uses Vicor high-density power modules to power these loads. Knightscope sought power that was compact and highly efficient because the ASRs have no airflow or venting. They needed a pure conduction-cooled solution that could use the aluminum skin as a heat sink.

The post Knightscope’s Autonomous Security Robots delivers breakthrough detection technology for public safety appeared first on ELE Times.

ASMPT is pleased to announce developments in its Semiconductor Solutions (SEMI) Segment leadership team that will help it to be prepared for further growth. The Group sees the SEMI Segment’s focus on developing an even more integrated organization that can best serve the needs of its customers and partners, while enabling it to continue growing and competing well. Beginning in mid-2022, this essentially involved combining all its CRM, PLM and SCM activities under one business entity to enable end-to-end business ownership, with dedicated Marketing & Sales, Product Development and Supply-Chain Management functions.

Semi Segment Leadership Enhancements

Leadership enhancements are a key part of this integration, including the appointments of Isaac Law, SVP and MD, China Manufacturing Operations, to an additional role as SEMI Segment COO; and the appointment of Justin Tham, Senior Director for Investor Relations, to a VP and SEMI Segment CFO role.

Crucially, the two existing CEOs for the various SEMI Business Groups (BGs) and its subsidiaries have been designated Co-CEOs for the entire SEMI Segment. They are jointly responsible for managing an integrated, global SEMI team in addition to their ongoing responsibilities as CEOs of their respective BGs.

Lim Choon Khoon (CK Lim), Senior Vice President; Co-CEO, Semiconductor Solutions Segment; CEO, ICD & CIS Business Units

CK Lim began his career with US semiconductor companies before joining the Group in Malaysia, with positions in Hong Kong and Singapore. His previous responsibilities included equipment product marketing and sales, key account management and leading advanced packaging initiatives. As Co-CEO, his portfolio covers mainstream ICD, Advanced Packaging, Consumer & Automotive CIS, as well as the NEXX, AEi and ALSI business units.

“The evolution of the SEMI organization in tandem with the whole of ASMPT is an ongoing process,” said CK Lim. “To me, it enables us to serve our customers even better by enhancing the way we work with them, and the way we support and develop our broad portfolio suite. With an improved business focus, Joe and I firmly believe an integrated SEMI team structure and leadership is making an impact.”

Poh Tson Cheong, Joseph (Joe Poh), Senior Vice President; Co-CEO, Semiconductor Solutions Segment; CEO, Opto & Display Business Unit

Joe Poh joined the Group as a Service Engineer and during his career with the Group, has held various positions in its IC, CIS, SMT Solutions and Opto businesses. Joe Poh’s wide exposure to the electronics supply chain has enabled him to develop extensive customer contacts and a deep understanding of market needs. As Co-CEO, his portfolio covers optoelectronics, LEDs, as well as Silicon Photonics with the AMICRA business unit.

“We have made good progress,” said Joe Poh. “We are laser focused on presenting a compelling SEMI organization to our customers and partners that not only boosts operational efficiency but will turbocharge new product development and new business development capabilities. CK and I look forward to tapping the synergies and power of the entire ASMPT organization, including deeper integration with our SMT segment.”

Lim Choon Khoon (CK Lim) is a Senior Vice President, Co-CEO of the Semiconductor Solutions Segment, and CEO of the Segment’s ICD & CIS Business Units, ASMPT Source: ASMPT	Poh Tson Cheong, Joseph (Joe Poh) is a Senior Vice President and Co-CEO of the Semiconductor Solutions Segment, and CEO of the Opto & Display Business Unit, ASMPT   Source: ASMPT

 

The post ASMPT announces key SEMI Solutions Segment leadership changes to prepare it for the future appeared first on ELE Times.

The newly introduced AX PRO alarm product line has the Wireless External Wireless Triple Signal Detector and (optional) dedicated camera module. This powerful intruder detection system provides a better image, more precise detection, and a handy modular design – all working to enhance alarm system capabilities for both homeowners and small businesses.

Tapping into the industry trend of using external passive infrared (PIR) detectors for video verification, the detector protects a property with innovative technology for precise detection and video verification.

Wireless Triple Signal Detector innovation reduces false alarms

In these scenarios, false alarms are often triggered by anything from bad weather to leaves or branches to pets. The answer to dealing with these is to be able to identify them and ignore them as ‘non-threats’. As its name suggests, a Wireless Triple Signal Detector uses three sensors: a PIR sensor at the top, a microwave sensor, and another PIR sensor at the bottom. This means that it can detect at various heights, with a 15m and 90° adjustable detection area, more precisely identifying what is actually triggering the alarm.

Patented Independent Floating Threshold (IFT) technology allows the detectors to adjust their thresholds based on the environment infrared and background noise automatically and dynamically. This essentially reduces false alarms caused by background noise interference.

The detector uses digital temperature compensation to automatically adjust the alarm threshold according to environment. This also means it is much more resilient in bad weather conditions, and enables consistent detection throughout.

Any successful security systems is subject to attempts to overcome it. One of these is ‘masking’, where a potential criminal ‘covers’ the sensor(s), for example with a spray. The AX PRO device uses active IR anti-masking – the detector can initiate a mask-processing sequence to check whether it has been masked or not. The ‘operator’ receives an alarm and can act accordingly.

And there’s more

The optional camera module provides GIF verification, allowing the ‘operator’ to see an image of an ‘incident’ for visual verification. The module has a 2.0mm lens with adjustable angle and can provide up to 20 images with VGA/QVGA/QQVGA formats.

Other features include:

• Pet immunity up to 40 kg
• Waterproof to IP65 standard
• Automatic sensitivity
• Easy to install and cost-effective, with no power/network cables needed.

In a market where accurate intruder alerting is exploding and verification is becoming more important, the Wireless Triple Signal Detector can provide an innovative solution in a wide range of scenarios.

The post New innovative Hikvision AX PRO Wireless Triple Signal Detector takes false alarm reduction to a new level appeared first on ELE Times.

The factories and manufacturing facilities are the hub of core economic and industrial activity helping to create a positive impact on the local economy, employment and manufacturing ecosystem. The security and efficiency are the key concerns for the stakeholders. There are efficient way to manage Factories by implementing security solutions.

Solution Overview

The factory is a synthesis of personnel, assets, equipment, and machinery. Therefore, complicated challenges arise frequently in a factory, such as personnel mobility and fire hazards. Hikvision’s Solution by Scenario for Factories provides more cost-effective ways to guarantee efficient and safe production, and property protection. Secured by our professionally selected products and subsystems, the whole solution can bring more momentum and productivity to factory operation.

Vehicle Management

The biggest challenge faced in factories and manufacturing facilities is the entry logs of authorized Vehicle entrance and exit. The Vehicle Management data continues to be the perpetual challenge for the Factory Management and Security Personnel.

Challenges

Manual identity check for drivers and vehicles can be inconvenient and time-consuming, as well as difficult to trace back when looking for specific vehicle records.  In manual identity check there is always a chance for human error.

Solution

To replace manual identity check with Hikvision Automatic Number Plate Recognition (ANPR) Cameras can enhance the security by automation of the Vehicle authorization process. Thus, adding efficiency and security for Vehicle Management via hands-free, drive-through ANPR authentication and easy-to-retrieve records.

Advantages

Secure and efficient vehicle egress

• Hands-free, non-stop, authenticated drive through
• Support for block-list alarm / VIP notification

Operational efficiency boost 

• Easy-to-retrieve records via “fuzzy” license plate match
• Automated alarm push for block-list vehicle and full parking area

Simple, adaptable deployment

• Card and video intercom in one unit
• Adaptable in scenarios with or without attendant booth

Features

• Authenticated vehicle access using ANPR or ID card
• Support for granting access remotely via video intercom
• Vehicle records and parking statistics reports
• LED display of available spaces and other parking info

The post Hikvision Solution Ensures Secure Vehicle Management for Factories and Manufacturing Facilities appeared first on ELE Times.