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Created this pcb to learn how to drive SRM. submitted by /u/LlamaZookeeper [link] [comments]

Versatile 1.6 Terabit Ethernet platform in portable bench top or rack mount solutions, with application support for validating silicon chips to network equipment performance

Keysight Technologies Inc.announced the Interconnect Test System, an advanced software solution, and the Interconnect and Network Performance Tester 1600GE hardware traffic emulator it runs on. This cohesive solution validates AI infrastructure, network components, and data center interconnects from 200GE to 1600GE, expanding on the capabilities of the recently announced Interconnect and Network Performance Tester 800GE bench top. The ITS software runs on both the 800GE and 1600GE Interconnect and Network Performance Tester platforms.

For decades, validating network interconnect performance required a manual, time-consuming process with limited or no automation and needed advanced programming skills to write scripts. That process also lacked a centralized system to organize and store interconnect data and reports, making tracking and replicating tests and configurations difficult. With the increasing diversity and scale of AI and data center interconnects, these traditional test methods cannot accurately predict and measure the reliability of today’s complex production networks.

The new Interconnect and Network Performance Tester 1600GE, with ITS software, delivers a holistic system that can organize, store, and use data intelligently to automate interconnect validation in high-speed Ethernet networks and AI data centers. Benefits of the solution include:

• Adaptable and versatile high-speed Ethernet platform – The INPT-1600GE platform is lightweight and office quiet, supporting high power consumption optical receivers up to 40 watts. Available as a portable bench top unit or rack mount chassis, both models support 1x1600GE, 2x800GE, 4x400GE, and 8x200GE to validate a broad range of Ethernet devices and interconnects that use 212Gb/s electrical lane interfaces. The bench top model has a built-in handle for easy movement inside or outside the lab. The INPT-1600GE assesses the reliability, stability, and interoperability of silicon chips, optical transceivers, active cables, and networking equipment at speeds from 200GE to 1600GE PAM4 for layers 1 through 3 on any port.
• Redefines interconnect data storage and organization – The ITS software includes a first-of-its-kind, US patent pending Interconnect Library (IL) that introduces a new way to organize, retrieve, and use interconnect data, including Common Management Interface Specification (CMIS) data. CMIS standardizes how high-speed interconnects are programmed and how the data is retrieved and used in networking systems. This cutting-edge library organizes all data and creates a comprehensive record that can be used to create and execute new tests. Once a record is created, it is automatically added to the IL self-serve database, where users can retrieve, reuse, edit, and update records. This dramatically increases productivity and accelerates the creation of automated test suites without advanced programming.
• Optimize interconnect validation efficiency – The browser-based ITS software includes a robust and fast graphical user interface (GUI) that allows multiple users to simultaneously run or schedule tests using the application’s advanced multi-user test scheduler. Using this tool increases test case throughput, allowing more tests to run unattended by a greater number of users.
• Automated report generator – Allows users to report on all the data from the IL records, including test results and CMIS data that includes PASS/FAIL information. This helps streamline the development process for interconnects and can also be used for manufacturing test applications using automated reports.

Khushrow Machhi, Senior Director of Marketing, Physical Layer Products Division at Broadcom, said: “As the industry moves toward 1.6T networking, ensuring signal integrity and error correction at these unprecedented speeds is critical. Broadcom is excited to collaborate with Keysight in developing cutting-edge testing solutions that address the challenges of higher modulation schemes, SerDes advancements, and forward error correction. Our combined expertise will help accelerate the deployment of 1.6T technology, paving the way for the future of high-speed data centers and AI-driven infrastructure.”

Andy Moorwood, Vice President, Hardware Engineering, Network Test & Security Solutions, Keysight, said: “Keysight’s ITS software is the industry’s first comprehensive solution for validating performance in high-speed Ethernet and AI data center interconnects. It helps reduce device failures and drastically reduces the time needed to characterize various interconnects. Moving from a manual and tedious process to one that enables faster, more accurate test suite automation without complex programming significantly boosts productivity.”

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “Keysight is working with the majority of global standards bodies and manufacturers of silicon chips, optical and copper interconnects using 224Gb/s electrical lane interfaces to accelerate development of the ecosystem for 800GE and 1.6T AI network infrastructures. Our 1.6T and 800GE hardware platforms, combined with the ITS software, enable critical interconnect performance evaluations and tremendous gains in testbed productivity. This equips our customers with the tools they need to deploy highly stable and reliable solutions into their networks.”

emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

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RAA278830 LVDS Solution Adds ISO 26262 Compliance to Renesas’ Industry-Leading Video Diagnostic Capabilities

Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems, and electronic mirrors.

As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road.

Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.

Key Features of the RAA278830

• Dual Open-LDI Input/Output
• ISO 26262 Functional Safety ASIL B rating

CRCs, parity, BIST, and redundancy

safety mechanisms implemented throughout the entire data path

• Video Diagnostic Capabilities

Input/Output monitoring of video timing, signal integrity, and content

Flickering, flashing, occlusion, and glare detection

• Spread Spectrum for lower system level EMI profile
• Image enhancement engine for superior image quality
• Dual host interface: I2C & SPI (configurable)
• SPI-Flash based OSD as well as an embedded font based OSD

SPI boot capability (boot from SPI Flash, no MCU needed)

Supports multi-bank for fail-safe OTA updates

• Space-efficient 72SCQFN, 10mm x 10mm
• AEC-Q100 Grade 2 qualified

“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”

 

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Modules range in power levels from 750W up to 2kW, with a top power density of 5kW/in3

New Vicor DCM3717 and DCM3735 DC-DC power modules support the growing trend of 48V-centric power delivery networks that provide greater power system efficiency, power density and lower weight versus 12V based PDNs. The DCM products are non-isolated, regulated DC-DC converters, operating from a 40 – 60V input to generate a regulated output adjustable from 10V to 12.5V. The DCM3717 family is available in two power ranges, 750W and 1kW, and the DCM3735 is a 2kW device. These new DCM products can be paralleled to rapidly scale system power levels.

With industry-leading power density at 5kW/in3, these new DCM products enable power system designers to deploy high-performance 48V power delivery networks for legacy 12V loads and achieve significant size, weight and efficiency benefits. The 5.2mm low-profile surface-mount package is thermally adept, easing thermal management system design.

The DCM3717S60E13G5TN1 (750W) and DCM3717S60D13K0TN1 (1000W) are available (size: 36.7 x 17.3 x 5.2mm), and the DCM3735S60D13L0TN1 (2000W / size: 36.7 x 35.4 x 5.2mm) will be available later this year.

Enabling easy conversion from high voltage to 12V via a 48V hub

Power delivery networks are making a decisive shift from 12V to 48V architectures to take advantage of higher efficiency. The benefits of using 48V have been illustrated in high-performance computing, automotive and in many other applications. However, seizing this opportunity presents many power system design challenges for legacy systems that have been optimized around 12V architectures for decades. Vicor, the leader in 48V DC-DC power conversion, is easing the transition with a 48V-centric power module approach to power systems design and, as with other 48V power modules, this new family of non-isolated DCM products can be used in conjunction with the Vicor BCM high-voltage fixed-ratio bus converter family that converts from high voltage (800V and 400V) to 48V. Once a 48V bus is established, Vicor DCM products can efficiently convert from 48V to a regulated 12V.

Industrial applications are transitioning to 48V PDNs

Growth applications, such as battery formation and test and semiconductor automated test equipment, aspire to rapidly transition to 48V PDNs to gain a competitive advantage but are hindered by existing investments in 12V power conversion. Some BFT implementations, for example, have been optimized to convert 12V to the battery cell load and cannot be readily re-engineered for 48V. The DCM3717/3735 products enable BFT systems engineers to preserve their existing investment by bridging 48V and 12V to create a high-performance 48V PDN.

The Vicor broad ecosystem of 48V centric power modules enables easy scalability and unprecedented flexibility when converting from high voltage to point-of-load for a wide variety of applications.

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New analog products from TI accurately measure currents and voltages with the highest resolution, enabling robots to perform detailed and complex tasks

Texas Instruments introduced the industry’s first functionally isolated modulators, helping designers achieve more precise motor control in compact robot designs. The new AMC0106M05, AMC0136 and AMC0106M25 isolated modulators enable increased precision and higher resolution of 12 to 14 effective number of bits for accurate and reliable phase current sensing and DC voltage sensing measurements. Offered in a small leadless package, the new products in TI’s isolated analog-to-digital converter portfolio help designers achieve smooth torque operation and fine motor control, while decreasing size and cost in low-voltage (<60V) robotics designs.

Why it matters

Engineers today are challenged to design smarter robots to perform more detailed tasks. The galvanically isolated modulators enable robotics engineers to achieve precise motor control and system protection in smaller, more sophisticated designs. This precision makes it possible for robots to complete a variety of complex tasks, such as threading a needle or handling small nuts and bolts. In addition, the small size of the new modulators—measuring just 3.5mm x 2.7mm—requires 50% less board space than competing reinforced isolation solutions. With this decrease in size, designers have more space to incorporate additional features that support precise control and reliable operation in compact robot applications.

“These modulators from TI enable designers to increase robotics accuracy and productivity in new use cases and smaller form factors, from the factory floor to the operating room,” said Karthik Vasanth, vice president and general manager of Data Converters and Clocks at TI. “For example, where humanoid robots could previously only complete simple tasks, our new functionally isolated modulators now allow them to carry out more dexterous and precise jobs.”

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R&S has expanded its EPL series of test receivers to cover EMI measurements from 5 kHz to 7.125 GHz, offering flexible configuration options. Depending on the setup, these receivers can be used in development, certification preparation, and final testing to ensure compliance with EMI standards.

Alongside the previously launched EPL1000, which covers 5 kHz to 30 MHz, the new EPL1001 and EPL1007 operate up to 1 GHz and 7.125 GHz, respectively. Basic versions include EMI bandwidths (CISPR 16-1-1, DO-160, and MIL-STD-461) and detectors (CISPR 16-1-1), RF input protection, and automatic attenuation in 1-dB steps.

An optional preselection function improves the measurement of broadband signals and short pulses, while the preamplifier included in the preselection option enables the measurement of small signals. Adding the EPL1-B1611 option upgrades the receiver to full CISPR 16-1-1 compliance, enabling the certification of the equipment under test.

Time domain scan captures entire CISPR bands A or B in a single shot and measures above CISPR band B in 20-MHz steps, saving test time and improving emission detection. Additional options like real-time spectrogram, IF analysis, and a signal generator reduce the need for extra equipment, while battery or DC power operation enables testing in various environments.

The EPL1001 and EPL1007 EMI test receivers can be ordered in Q2 2025.

EPL series product page

Rohde & Schwarz 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The Renesas DA14533 Bluetooth LE SoC offers power management features to reduce power consumption in automotive systems. AEC-Q100 Grade 2 qualified, it operates from -40°C to +105°C and is suitable for applications such as tire pressure monitoring, keyless entry, wireless sensors, and battery management systems.

Along with an Arm Cortex-M0+ MCU, the DA14533 combines a 2.4-GHz radio transceiver, memory, peripherals, and security functions in a 22-pin wettable-flank, fine-pitch QFN package that is just 3.5×3.5 mm. Its software stack is qualified to Bluetooth Core 5.3 and includes the latest security features, enabling developers to jumpstart their projects.

An integrated DC/DC buck controller adjusts the DA14533’s output voltage to match system requirements. Active power consumption is 3.1 mA during transmission and 2.5 mA during reception, dropping to 500 nA in hibernation mode. These features help extend the operational life of small-capacity battery-powered systems.

The DA14533 is available now, supported by the Bluetooth Low Energy SoC Development Kit Pro.

DA14533 product page

Renesas Electronics

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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ST’s EVLSERVO1, a turnkey reference platform for servo motor control, enables sensorless or sensored field-oriented control (FOC) with one, two, or three shunts. It drives three-phase brushless motors up to 2 kW with the provided heatsink or 3 kW with an external fan.

The reference design features the STSPIN32G4 three-phase motor controller with an embedded STM32G4 MCU, enabling advanced position and torque control algorithms, as well as six-step control modes. It pairs with a three-phase power stage optimized for nominal bus voltages from 24 V to 48 V. The power stage, stacked with the STSPIN32G4 to maximize power density, includes six pairs of paralleled MOSFETs with low RDS(ON) of 3.2 mΩ.

With a compact 50×80×60-mm form factor, the EVLSERVO1 enables designers to develop and prototype motor control applications such as industrial and home automation, home appliances, servo drives, e-bikes, and service robots. Additionally, ST offers the X-CUBE-MCSDK for easy configuration of motor control firmware parameters.

The EVLSERVO1 reference design is available now from the eSTore and ST distributors for $168.

EVLSERVO1 product page 

STMicroelectronics

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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High-sensitivity InSb Hall elements from Diodes detect rotation speed and current across a broad range of applications, even in weak magnetic fields. The AHE300 sensor supports Hall output voltage (VH) classifications C through G, ranging from 168 mV to 370 mV. The AHE10x sensors support VH classifications C through H, with output voltages from 168 mV to 415 mV.

These Hall elements are well-suited for mobile phone and laptop opening detection, joystick control, and magnetic encoding. They are also used in current measurements with clamp-type overhead wire ammeters, as well as for position detection in brushless motors and wheel rotation speed monitoring.

Additionally, the devices enable contactless commutation, speed measurements, and angular position sensing in consumer appliances, office equipment, and industrial systems. The sensors’ low offset voltage (5 mV to 7 mV) ensures the high resolution required for accurate detection in these applications.

The AHE300 operates from -40°C to +110°C in a SIP-4 package and costs $0.18 each in 500-piece quantities. AHE10x devices cover a wider -40°C to +125°C range, making them suitable for harsh thermal environments. They come in SOT23-4 packages with various height options and cost $0.10 each in 3,000-piece quantities.

AHE300 product page

AHE10x product page

Diodes

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The first in a new line of immersion temperature sensors, the B58101A0851A000 from TDK is designed specifically for EV powertrain cooling. Compact and lightweight (<11 g), this fully sealed NTC thermistor provides fast, precise temperature measurement in oil-cooled systems.

Oil cooling is emerging as the preferred method for EV drivetrain thermal management, offering superior performance over conventional water-glycol systems. By directly cooling motors and inverters, it enhances efficiency, extends component lifespan, and supports higher power densities—key for next-gen EVs.

The B58101A0851A000 sensor has a thermal time constant of <4 s (τ63%) in water and maintains accuracy within ±1 K from -40°C to ≤125°C. It operates up to +150°C and withstands system pressures up to 10 bar. With a nominal resistance of 5 kΩ at 25°C and a tolerance of ±1%, the device ensures reliable performance across a wide range of conditions.

Designed for durability, the immersion temperature sensor resists ZF EcoFluid E gear oil used in electric drive systems. Its resistance-temperature curve is customizable, and it adapts to various installation positions, cooling fluids, and mounting configurations.

The B58101A0851A000 sensor is available now from DigiKey and Mouser Electronics.

B58101A0851A000 product page

TDK

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Flexible integrated circuit (FlexIC) designer and manufacturer Pragmatic Semiconductor Ltd of Cambridge, UK has launched its latest radio frequency identification (RFID) near-field communication (NFC) product line. NFC Connect is claimed to unlock seamless, item-level intelligence for mass-market products that are traditionally constrained by cost, supply chain and sustainability challenges...

During a visit to Newport Wafer Fab in South Wales — the UK’s largest semiconductor facility — a day after giving her Spring Statement (promising a “new era of security and national renewal” to kickstart economic growth, protect working people and keep Britain safe), the UK Government’s Chancellor of the Exchequer Rachel Reeves has welcomed the intention of discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc of Malvern, PA, USA to invest £250m in boosting production at its subsidiary Vishay Newport Ltd as part of plans to develop large-scale compound semiconductor manufacturing in the UK, specifically of silicon carbide devices...

In this look at transmission line theory, we will assume an RG-58 type of coaxial cable which has a characteristic impedance of 50 Ω. Where we let C stand for the capacitance per unit length, 30 pF per foot in this case, the characteristic impedance Zo = sqrt(L/C) where L is the inductance per unit length. This gives L = Zo²×C = 75 nH per foot.

We make a very simplistic MultiSim SPICE model of the transmission line being driven by a 50-Ω source impedance of the left in the Figure 1 with a load resistance whose value we are going to set to several different values, to 10,000 Ω, to 50 Ω, and then to 5 Ω while we examine the effects of each as a study of time domain reflectometry (TDR).

Figure 1 TDR result from a MultiSim SPICE model of a transmission line driven by a 50-Ω source impedance (R1) and where load resistance, R2, is set 10,000 Ω.

In Figure 1, using a square wave signal source, we see the signal takes 16.5 ns to make its way down the transmission line to arrive at R2. During that time, the signal input end at V1 and R1 presents an input impedance of 50 Ω, the cable’s characteristic impedance Zo.

Since the R2 value does not match Zo, energy transfer into R2 is incomplete and some of the arriving energy gets reflected back toward the left again. When that reflection reaches R1 in another 16.5 ns—a total transit time of 33 ns—the impedance presented to the V1 and R1 pair jumps up and we see the input voltage at the left end of the transmission line jump up too.

The propagation velocity and the velocity factor of the transmission line are calculable from the transit times are nearly two-thirds the speed of light in free space, just as in the published data for this cable.

In Figure 2, when we have R2 at 50 Ω, there is a match to Zo and no energy gets reflected back again. When we have R2 at only 5 Ω, we have a mismatch to Zo again and a reflection back toward the left, but the impedance at the left end drops instead of rising.

Figure 2 TDR Results for load R2 = 50 Ω, showing a match with no energy reflected back, and for R2 = 5 Ω showing a mismatch and energy reflected back.

Of course, this SPICE model is very crude in that each LC pair represents one foot of cable length. A more finely grained model with many more LC pairs per unit length would yield better waveform results than we’ve shown here.

For the sake of illustrating these principles though, I beg your forgiveness.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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• Six tips for better TDR measurements
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• TDR: taking the pulse of signal integrity
• Measure propagation delays using time-domain reflectometry

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After an internal and external search by its board of directors, Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has appointed Robert Feurle as CEO, effective 1 May. He succeeds Thomas Werner, who is serving as interim executive chairman and will return as chairman of the board following the transition...

Compound Semiconductor Applications (CSA) Catapult is part of a consortium that is one of the winners of the Quantum Missions pilot competition, securing a share of £12m of funding from government agency Innovate UK. The collaboration brings together Vector Photonics Ltd (spun off from Scotland’s University of Glasgow in 2020), Sheffield University spin-off Phlux Technology —which designs and manufactures 1550nm avalanche photodiode (APD) infrared sensors — and the University of Bristol, alongside the Catapult’s expertise...

Superjunction Device Enables High Power Ratings and Density While Lowering Conduction and Switching Losses to Increase Efficiency

Vishay Intertechnology, Inc. introduced a new Gen 4.5 650 V E Series power MOSFET that delivers high efficiency and power density for telecom, industrial, and computing applications. Compared to previous-generation devices, the Vishay Siliconix n-channel slashes on-resistance by 48.2 % while offering a 65.4 % lower resistance times gate charge, a key figure of merit (FOM) for 650 V MOSFETs used in power conversion applications.

Vishay offers a broad line of MOSFET technologies that support all stages of the power conversion process, from high voltage inputs to the low voltage outputs required to power the latest high tech equipment. With the SiHK050N65E and other devices in the Gen 4.5 650 V E Series family, the company is addressing the need for efficiency and power density improvements in two of the first stages of the power system architecture — power factor correction (PFC) and subsequent DC/DC converter blocks. Typical applications will include servers, edge computing, and super computers; UPS; high intensity discharge (HID) lamps and fluorescent ballast lighting; telecom SMPS; solar inverters; welding equipment; induction heating; motor drives; and battery chargers.Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHK050N65E’s low typical on-resistance of 0.048 Ω at 10 V results in a higher power rating for applications > 6 kW. With 50 V of additional breakdown voltage, the 650 V device addresses 200 VAC to 277 VAC input voltages and the Open Compute Project’s Open Rack V3 (ORV3) standards. In addition, the MOSFET offers ultra low gate charge down to 78 nC. The resulting FOM of 3.74 Ω*nC translates into reduced conduction and switching losses to save energy and increase efficiency. This allows the device to address the specific titanium efficiency requirements in server power supplies or reach 96 % peak efficiency.

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New hardware integrates closely with convenient, graphical development environment

Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. Now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication, the new board lets users quickly evaluate sensors and confidently handle demanding projects.

Engineers unveiled the STEVAL-MKI109D during a live tech lab, showing how to simply plug in a sensor module, connect a PC, and start analyzing data in ST MEMS Studio. Using this all-in-one graphical environment, developers can visualize the sensor output, quickly fine-tune settings, configure features, and exercise the AI capabilities of ST sensors with a machine-learning core (MLC) and intelligent sensor processing unit (ISPU) inside. The tool provides advanced functions including power monitoring and supply voltage management that help optimize energy consumption and debugging.

ST’s MEMS portfolio contains inertial sensors, pressure sensors, biosensors, and digital and analog microphones offering many choices of speed, accuracy, full-scale range, and package style in industrial, consumer, and automotive grades. Extremely compact and robust, they are suited to diverse applications including consumer products, smartphones, wearables, smart-home devices, industrial sensing, safety equipment, healthcare, environmental monitoring, and many more. Automotive-grade devices target applications including navigation support, advanced driver assistance, and automated driving.

An evaluation module is available for each sensor type, mounted on a convenient DIL24 card with headers, ready to connect to the STEVAL-MKI109D board. Additional plug-and-play accessories are available, including biosensor electrodes and remote-sensing extension cables to quickly evaluate sensors when building proof-of-concept models and developing prototypes.

The STM32H5 MCU at the heart of the new board has the latest high-performing and efficient Arm Cortex-M33 core with extensive peripherals that enable faster, more convenient development. Customers’ sensor projects can target any of the over 1400 microcontrollers and microprocessors in the STM32 family. The MLC, finite-state machine (FSM), and ISPU embedded in select MEMS devices help optimize application performance and power consumption for superior functionality, responsiveness, and battery runtime.

The STEVAL-MKI109D board is available from distributors and the eSTore, from $105. ST MEMS Studio is ready to download now at www.st.com/mems-studio and is supported with automatic upgrades to ensure users always have the latest software and firmware.

For further information please visit: www.st.com/mems-studio

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The robust, low-power solutions from Microchip Technology meet stringent automotive standards for reliability in harsh conditions

Microchip Technology’s PolarFire System on Chip (SoC) FPGAs have earned the Automotive Electronics Council (AEC)-Q100 qualification. The AEC-Q standards are a guideline for integrated circuits, using stress tests to measure the reliability of electronic components in vehicles. AEC-Q100 qualified devices have gone through rigorous testing to demonstrate they can withstand extreme conditions in automotive applications.

The PolarFire SoC FPGA has been qualified for automotive Grade 1 temperatures, -40°C to 125°C. PolarFire SoC FPGAs feature an embedded 64-bit, quad-core RISC-V architecture capable of running Linux and real-time operating systems (RTOS), with mid-range density programmable logic of up to 500K logic elements (LE). The SoC FPGA is designed for complex applications that demand low-power, high-performance, exceptional reliability and an extended operating temperature range. Devices with the same density and package have scalable assurance and share pin-package compatibility across temperature grades, making it appropriate for automotive use as well as aerospace and military applications.

The SoC FPGAs incorporate embedded security and safety features to protect physical, device, design and data integrity. The SoCs are designed with single event upset (SEU) immunity, which enhances reliability and helps mitigate the risk of data corruption and system failures in demanding environments.

“Achieving the AEC-Q100 qualification for our PolarFire SoC FPGAs validates that our technology can perform under the most challenging conditions and underscores our commitment to delivering robust solutions to meet the stringent demands of the automotive industry,” said Bruce Weyer, Corporate Vice President of Microchip’s FPGA business unit. “Our low-power design and RISC-V cores empower automotive engineers to create advanced, reliable and energy-efficient solutions for next-generation automotive systems.”

PolarFire FPGAs and SoCs deliver power and thermal efficiency, eliminating the need for active cooling while ensuring high integration, defense-grade security and reliability. With high levels of scalability, they maintain performance across varying temperature conditions and meet stringent demands of mission-critical environments.

Development Tools

PolarFire SoCs are supported by Microchip’s Libero SoC Design Suite, SmartHLS, VectorBlox and Microchip’s Mi-V ecosystem of partner platforms for rapid RISC-V application development.  Additionally, a wide variety of Microchip and partner intellectual property (IP) cores are available to accelerate time-to-market. Libero SoC Design Suite is TÜV Rheinland-certified for functional safety, meeting ISO 26262 ASIL D standards for automotive applications. Compatible development boards are also available.

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The Evolving Ecosystem of Mobile Manufacturing in India

The Indian mobile manufacturing landscape represents a remarkable narrative of technological transformation, economic strategy, and industrial innovation. What was once a predominantly import-driven market has metamorphosed into a robust domestic production powerhouse, driven by a confluence of governmental initiatives, technological investments, and strategic corporate vision.

Xiaomi India: A Manufacturing Paradigm Shift

Xiaomi’s journey in India epitomizes the potential of localized manufacturing. Their production facilities in Chennai and Noida are not merely assembly lines but sophisticated technological ecosystems that represent the cutting edge of mobile manufacturing. The company has systematically invested in creating a comprehensive manufacturing infrastructure that goes beyond simple assembly.

The technological sophistication of Xiaomi’s manufacturing approach is evident in their deployment of advanced Surface Mount Technology (SMT) lines. These highly automated production systems enable precision component placement, ensuring consistent quality and minimizing human error. Robotic assembly processes have been integrated to enhance production efficiency, allowing for rapid scaling and maintaining stringent quality standards.

Moreover, Xiaomi’s local sourcing strategy has been instrumental in creating a robust domestic supply chain. By strategically partnering with local component manufacturers and investing in local ecosystem development, they have not just reduced production costs but also contributed to developing India’s electronics manufacturing capabilities.

Samsung: A Global Manufacturing Powerhouse in India

Samsung’s manufacturing complex in Noida represents more than just a production facility – it is a testament to advanced manufacturing capabilities. The facility stands as one of the world’s largest mobile phone factories, embodying cutting-edge technological integration and precision engineering.

The company’s approach transcends traditional manufacturing paradigms. Advanced Printed Circuit Board (PCB) manufacturing techniques, coupled with comprehensive quality assurance protocols, ensure that every device meets global standards. Their laboratories represent technological sanctuaries where each component undergoes rigorous testing, examining everything from thermal performance to electromagnetic compatibility.

Samsung’s integrated design and production workflows demonstrate a holistic approach to mobile manufacturing. By seamlessly connecting research, design, and production departments, they create an ecosystem that rapidly translates technological innovations into market-ready products.

Emerging Players: Realme and the New Manufacturing Paradigm

Realme represents the new generation of mobile manufacturers – agile, technology-driven, and deeply committed to localization. Their manufacturing facilities in Greater Noida are not just production centers but innovation laboratories that embrace modern manufacturing philosophies.

Lean manufacturing principles guide their production strategy, allowing for maximum efficiency and minimal waste. Modular production designs enable rapid prototyping and quick adaptation to market demands. This approach allows Realme to maintain a competitive edge in a rapidly evolving market, responding swiftly to technological trends and consumer preferences.

Oppo and Vivo: Synchronized Manufacturing Excellence

The sister companies Oppo and Vivo have developed a synchronized manufacturing ecosystem that exemplifies technological sophistication. Their facilities in Greater Noida and Noida are equipped with state-of-the-art automated optical inspection systems, ensuring that every device meets exacting quality standards.

Their manufacturing approach integrates advanced thermal and durability testing, recognizing that modern smartphones must withstand diverse environmental conditions. Comprehensive supply chain integration ensures that each component is not just sourced but meticulously validated.

Apple’s Strategic Manufacturing Presence

Though not an Indian company, Apple’s manufacturing strategy through Foxconn and Wistron represents a significant milestone in India’s mobile manufacturing journey. The facilities in Chennai and Bengaluru showcase precision engineering workflows that align with global high-end smartphone production standards.

Technological Horizons and Future Trajectories

The Indian mobile manufacturing ecosystem is poised at an exciting technological frontier. Emerging trends point towards deeper 5G component localization, advanced semiconductor integration, and AI-driven manufacturing optimization. Sustainability is becoming a critical consideration, with manufacturers exploring eco-friendly production technologies.

Government’s Transformative Role

The Production Linked Incentive (PLI) scheme has been the catalyst that transformed potential into reality. By creating a supportive policy environment, the government has not just attracted investments but fundamentally reshaped India’s technological manufacturing landscape.

Conclusion: A Global Manufacturing Destination

India’s mobile manufacturing journey is a narrative of technological ambition, strategic vision, and relentless innovation. From being a consumer market to emerging as a global manufacturing hub, the transformation is profound and promising.

The road ahead is illuminated by continuous technological advancement, strategic investments, and an unwavering commitment to excellence.

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