Новини світу мікро- та наноелектроніки

This beast is almost impossible to carry by one person. Aside from the normal frequency counter stuff, there is a full CPU inside built on descrete ICs. Extracted boards on the last photo are arithmetic logic unit and RAM. submitted by /u/AltCtrlGraphene [link] [comments]

First project I've done on my own with no tutorial to follow. Using an L293D to drive 4 5v pumps and controlling them with 4 capacitive soil moisture probes. Working pretty good so far! submitted by /u/Immediate-Court-6894 [link] [comments]

Mirrored a symbol in the schematic for better readability, got a phonecall, forgot to mirror the signals too when I continued. Did this botch so I can continue writing the firmware whilst waiting for the fixed board to arrive. So, how is your "Revision A" going? submitted by /u/DolfinButcher [link] [comments]

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Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems. The two sides aim at promoting the development of green energy. Infineon will provide FOXESS with its CoolSiC MOSFETs 1200 V, which will be used with EiceDRIVER gate drivers for industrial energy storage applications. At the same time, FOXESS’ string PV inverters will use Infineon’s IGBT7 H7 1200 V power semiconductor devices.

The global market for photovoltaic energy storage systems (PV-ES) has grown at a high speed in the last years. As competition in the PV-ES market accelerates, improving power density has become key to success, and how to improve efficiency and power density for energy storage applications has attracted much attention. Infineon’s CoolSiC MOSFET 1200 V and IGBT7 H7 1200 V series power semiconductor devices adopt the latest semiconductor technologies and design concepts that are tailored to industrial applications.

Mr. Yu Daihui, Senior Vice President and Head of Industrial & Infrastructure of Infineon Technologies Greater China said, “As an industry leader in power semiconductors, we are proud to work closely with FOXESS. We will continue to drive decarbonization by enabling higher power density and more reliable systems for PV-ES applications.”

Mr. Zhu Jingcheng, Chairman of FOXESS, said, “Thanks to the support of Infineon’s advanced components, FOXESS’ products have been significantly improved in terms of reliability and efficiency. This has been an important driving force for FOXESS’ growth. Infineon’s technical support and product quality have not only strengthened our competitiveness, but also expanded our presence in the market. We are confident about the future and look forward to further cooperation with Infineon to jointly promote the development of the industry and create greater value for our customers.”

With a high power density, Infineon’s CoolSiC MOSFETs 1200 V can reduce losses by 50 percent and provide ~2 percent additional energy without increasing the battery size, which is especially beneficial for high-performance, lightweight, and compact energy storage solutions. FOXESS’ H3PRO 15 kW-30 kW energy storage series uses Infineon’s CoolSiC MOSFETs 1200 V for all models. Thanks to Infineon’s excellent performance, the H3PRO series has achieved an efficiency of up to 98.1 percent and excellent EMC performance; with superior performance and reliability, the H3PRO series has seen rapid sales growth in the global market.

Infineon’s TRENCHSTOP IGBT7 H7 650 V / 1200 V series has lower losses and helps improve the overall efficiency and power density of inverters. In high-power inverter projects, high-current mold packaged discrete devices with current handling capability above 100 A can reduce the number of IGBTs in parallel and replace the IGBT module solution, further improving system reliability and reducing costs; in addition, the H7 series has become an industry benchmark for its high-quality performance and greater resistance to humidity. At present, FOXESS’ main industrial and commercial model, the R Series 75-110 kW, redefines the overall design of the 100 kW model by using IGBT7 H7 series discretes, and the efficiency of the whole machine can reach up to 98.6 percent. Thanks to the low power loss and high power density of the IGBT7 H7 series in discrete packages, technical problems such as current sharing in the paralleling process can be simplified and optimized.

Every power device needs a driver, and the right driver can make the design a lot easier. Infineon offers more than 500 EiceDRIVER gate drivers with typical output currents of 0.1 A~18 A and comprehensive protection functions including fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault reporting, shutdown, and overcurrent protection, suitable for all power devices including CoolSiC and IGBTs.

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Microchip introduces configurable family of companion driver boards using its Hybrid Power Drive modules available in silicon carbide (SiC) or silicon (Si) technology

The aviation industry’s requirements for the latest, most efficient and lowest-emission aircraft is propelled by an overarching goal towards sustainability and decarbonization. To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow. To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology (Nasdaq: MCHP) today announces a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.

The new integrated actuation power solution maintains the same footprint regardless of the power output. The companion gate driver boards are designed to be integrated with Microchip’s HPD modules to provide an all-in-one motor drive solution for the electrification of systems such as flight controls, braking and landing gear. Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.

“We developed the companion gate driver boards to be used with our existing HPD modules to bring to market a plug-and-play power solution for MEA,” said Leon Gross, vice president of Microchip’s discrete product group. “With this solution, customers no longer need to design and develop their own drive circuitry, which can reduce design time, resources and cost.”

These high-reliability devices are tested to conditions outlined in DO-160, “Environmental Conditions and Test Procedures for Airborne Equipment.” There are multiple protection features including shoot-through detection, short circuit protection, desaturation protection, Under Voltage Lock Out (UVLO) and active miller clamping.

The gate driver boards are designed to be driven with external PWM signals based on Low Voltage Differential Signaling (LVDS) compliant with TIA/EIA-644 for low Electromagnetic Interference (EMI) and good noise immunity. The gate driver board provides differential outputs for telemetry signals like DC bus current, phase current and solenoid current by taking feedback from shunts present in the HPD module and DC bus voltage. It also provides direct output of two PT1000 temperature sensors available in the HPD power module.

The companion gate driver boards are low-weight, low-profile and compact solutions to optimize size and power efficiency of actuation systems. The gate drivers are designed to operate throughout the temperature range of −55°C to +110°C, which is critical for aviation applications that are often exposed to harsh environments.

The isolated companion gate driver boards only require a single 15V DC input for the control and drive circuit; all additional voltages needed are generated on the card. This significantly reduces the number of system components and simplifies system cabling.

Microchip provides comprehensive solutions for MEA by integrating power products with FPGAs, microcontrollers, security, memory and timing. Microchip’s solutions are designed to help customers speed up their development, reduce costs and get to market faster.

Support and Resources

The companion gate driver boards are supported with detailed data sheets and device models.

Pricing and Availability

The companion gate driver boards and accompanying HPD modules are available in production quantities. For additional information, contact a Microchip sales representative.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: http://www.flickr.com/photos/microchiptechnology/53415024168/sizes/l

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SMD Devices Provide High Luminous Intensity to 2300 mcd, Offer Wavelengths of 525 nm and 465 nm for Heart Rate Monitoring and Smoke Detection

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package. Measuring 2.2 mm by 1.3 mm by 1.4 mm, the Vishay Semiconductors VLMB2332T1U2-08 and VLMTG2332ABCA-08 utilize the latest ultrabright InGaN chip technology to achieve typical luminous intensity of 440 mcd and 2300 mcd, respectively, which is up to four times higher than previous-generation solutions in PLCC-2 packages.

With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments. Typical applications will include medical light treatment; signal lights for agricultural equipment and energy generation systems; indicators and backlighting for office, entertainment, and telecommunications equipment; LCD switches; and symbols for general use.

In addition, with a typical wavelength of 525 nm at 20 mA, the VLMTG2332ABCA-08 is ideal for heart rate monitoring applications in fitness trackers and other devices that rely on variations in green light absorption. Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.

The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast. The devices offer a ± 60° angle of half-intensity, a wide viewing angle of 120° for homogenous illumination and backlighting, and forward voltage of 2.9 V typical. The VLMB2332T1U2-08 and VLMTG2332ABCA-08 are categorized, per packaging unit, for luminous intensity and color.

RoHS-compliant, halogen-free, and Vishay Green, the LEDs are available in 8 mm tape, offer an ESD-withstand voltage up to 2 kV in accordance with JESD22-A114-B, and are compatible with preconditioning according to JEDEC Level 2a, IR reflow soldering according to J-STD-020, and automatic placement equipment.

Device Specification Table: 

Part number		VLMB2332T1U2-08	VLMTG2332ABCA-08
Color		Blue	True green
Luminous intensity (mcd) at 20 mA	Min.	280	1400
	Typ.	440	2300
	Max.	710	3550
Wavelength (nm) at 20 mA	Min.	458	515
	Typ.	465	525
	Max.	472	541
Forward voltage (V) at 20 mA	Min.	2.6
	Typ.	2.9
	Max.	3.4
Technology		InGaN / sapphire

Samples and production quantities of the VLMB2332T1U2-08 and VLMTG2332ABCA-08 are available now, with lead times of 12 weeks.

The post Vishay Intertechnology Blue and True Green LEDs in MiniLED Package Deliver High Brightness in a Small Size appeared first on ELE Times.

Hey guys, trying to fix my buddy's Rock Band guitar because they go for like 500 on ebay. So there are two AAs in the battery holder, both are tested good at 1.5 volts. With the batteries installed, between the contact circled in red and both pins in the connector circled in blue, I get +1.5v. I would assume I should have +1.5v on one and -1.5v on the other. I also have 0v across the pins circled in yellow, and I would think I should have 3v. Does it sound like there's a short in the battery holder, or am I missing something here? submitted by /u/jgollsneid [link] [comments]

Microchip has combined gate driver boards with its Hybrid Power Drive (HPD) modules to ease the aviation industry’s transition to electric actuation systems. Configured with silicon or silicon carbide switches, the HPD modules cover a range of 5 kVA to 20 kVA and maintain the same footprint regardless of the power output.

These integrated actuation power bundles provide a plug-and-play motor drive solution for the electrification of such systems as flight controls, braking, and landing gear. Power components are designed to scale based on application requirements. They can be used to create actuation systems for drones, small planes, electric vertical take-off and landing aircraft, More Electric Aircraft (MEA), and all-electric aircraft.

Gate driver boards are driven with external PWM signals. They provide differential outputs for telemetry signals like DC bus current, phase current, and solenoid current by taking feedback from shunts in the HPD modules and DC bus voltage. The isolated boards operate over a temperature range of -55°C to +110°C and require a single 15-VDC input for the control and drive circuit. Additional required voltages can be generated on the card.

The gate driver boards and accompanying HPD modules are available now in production quantities. To learn more about these integrated actuation power components, click here.

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The AOZ1377DI current-limiting switch from Alpha & Omega improves USB-C safety by providing a maximum load current of 7 A at up to 23 V. In addition to programmable current limiting, the switch offers true reverse current blocking, which prevents unwanted reverse current from flowing from VOUT to VIN.

Useful for both sink and source applications, the AOZ13771DI has an input operating voltage range of 3.4 V to 23 V. Both VIN and VOUT terminals are rated at an absolute maximum of 28 V. Integrated back-to-back N-channel MOSFETs provide a typical on-resistance of 19 mΩ and a high safe operating area. In addition, an internal soft-start circuit controls inrush current from high capacitive loads, and an external capacitor can adjust the slew rate.

The protection switch comes in two variants. The AOZ1377DI-01 automatically restarts once fault conditions are cleared. The AOZ1377DI-02 latches the power switch off, and the enable-input pin must be reset to restart the device.

The AOZ1377DI-01 and AOZ1377DI-02 switches cost $1.356 in lots of 1000 units. They are available in production quantities with a lead time of 16 weeks

AOZ1377DI datasheet

Alpha & Omega Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Microcontrollers in the GD32F5 series from GigaDevice are equipped with 7.5 Mbytes of on-chip flash and 1 Mbyte of SRAM, both supporting ECC verification. Up to 2 Mbytes of code flash can be configured for zero-wait-state operation, improving processing speed and efficiency. A maximum of 2 Mbytes of memory is also available for read-while-write OTA updating. Additionally, the MCUs accommodate a variety of external memories.

The GD32F5 series of MCUs is based on an Arm Cortex-M33 processor. This 32-bit core operates at up to 200 MHz and delivers a performance rating of 3.31 CoreMark/MHz. An integrated 12-bit successive approximation ADC module can sample analog signals from 16 external channels and 2 internal channels, plus the battery voltage channel. MCUs also feature two DACs and multiple timers. Connectivity resources include UART/USART, I2C, SPI, I2S, SDIO, USB, CAN-FD, and Ethernet.

A set of built-in system security features offers protection for both firmware and device private data, as well as service execution assurance. The general-purpose MCUs operate with a supply voltage of 1.71 V to 3.6 V and have 5-V tolerant I/Os. The lineup comprises 10 variants in a choice of packages, including BGA and LQFP.

GD32F5 series product page 

GigaDevice

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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AMD has rolled out the Ryzen Pro 8040, a series of advanced x86 processors with built-in AI for business laptops and mobile workstations. By leveraging the CPU, GPU, and dedicated on-chip neural processing unit (NPU), the Ryzen AI-enabled processors are able to provide more dedicated AI processing power than previous generations.

According to AMD, these devices are capable of delivering up to 16 dedicated NPU TOPS, or trillions of operations per second, and up to 39 total system TOPS. The premier model in the Ryzen Pro 8040 lineup is the Ryzen 9 Pro 8945H. This powerful processor is outfitted with 8 cores, 16 threads, 24 Mbytes of cache, and a Radeon 780M GPU.

Ryzen Pro technology gives IT managers access to enterprise-grade manageability, as well as chip-to-cloud security. Further, PCs powered by the Ryzen Pro 8040 series will be among the first to incorporate Wi-Fi 7 connectivity.

Along with the Ryzen Pro 8040 series, AMD also announced the Ryzen Pro 8000 series of AI-powered desktop processors. Like their mobile counterparts, these desktop processors are built on a 4-nm FinFET process and feature the same Zen 4 architecture.

Both the Ryzen Pro 8040 mobile series and Ryzen Pro 8000 desktop series are expected to be available in PCs from OEM partners, including HP and Lenovo, starting in Q2 2024.

Ryzen Pro mobile product page 

Ryzen Pro desktop product page 

Advanced Micro Devices 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Aluminum electrolytic capacitors in the SNA and SNL series from Kyocera AVX come in insulated cases with snap-in terminals that ease installation. The devices provide high reliability and high CV performance for use in a wide range of commercial and industrial applications requiring operation at temperatures of up to 105°C.

Well-suited for use in solar inverters, frequency converters, and power supplies, the SNA series of capacitors offers rated DC voltages of 250 V, 420 V, and 450 V. Capacitance values extend from 82 µF to 1500 µF with ±20% tolerance. The devices exhibit an endurance of 3000 hours at 105°C and come in 24 case sizes spanning 22×25 mm to 35×50 mm.

SNL series capacitors provide rated DC voltages of 160 V, 200 V, 250 V, 350 V, 400 V, 450 V, 500 V, and 550 V. Capacitance values range from 68 µF to 2200 µF with ±20% tolerance. SNL capacitors also exhibit an endurance of 3000 hours at 105°C. They are available in 36 case sizes ranging from 22×20 mm to 35×60 mm.

Lead time for the SNA and SNL series of snap-in aluminum electrolytic capacitors is 20 to 24 weeks. The parts are shipped in bulk packaging.

SNA series product page 

SNL series product page 

Kyocera AVX 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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• Cadence’s new dynamic duo offers more than 2X increased capacity and is 1.5X faster than the previous generation, enabling the rapid development of advanced chips for generative AI, mobile, automotive, hyperscale and LLM applications
• Palladium Z3 emulator features a new custom Cadence emulation processor that delivers the fastest, most predictable compile and comprehensive pre-silicon hardware debug
• Protium X3 prototyping offers the fastest bring-up times for pre-silicon software validation of billion-gate designs
• Seamlessly integrated flow with unified compiler and common virtual and physical interfaces offers rapid design migration and testing from emulation to prototyping

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Palladium® Z3 Emulation and Protium X3 FPGA Prototyping systems, a revolutionary digital twin platform that builds on the success of the industry-leading Palladium Z2 and Protium X2 systems to tackle escalating system and semiconductor design complexity, and to accelerate the development timeline for the most advanced SoCs. Palladium and Protium systems have long been trusted by market-shaping AI, automotive, hyperscale, networking and mobile chip companies to deliver the highest throughput pre-silicon hardware debug and pre-silicon software validation. Targeted at the industry’s largest multi-billion-gate designs, the new Palladium Z3 and Protium X3 systems set a new standard of excellence, providing customers with more than a 2X increase in capacity and a 1.5X performance increase compared to previous-generation systems, enabling faster design bring-up and shortening overall time to market.

“As generational drivers accelerate the need for system and semiconductor innovation, our customers are facing increasing challenges to power the most advanced applications,” said Paul Cunningham, senior vice president and general manager of the System Verification Group at Cadence. “The third generation Palladium and Protium dynamic duo systems are core components of the Cadence Verification Suite and seamlessly interface with the Verisium AI-driven Verification Platform. The Cadence verification full flow offers our customers the highest verification throughput needed to deliver their hardware innovations to market faster and to support the rapid development of new technologies, such as generative AI.”

The Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance. The systems are powered by the NVIDIA BlueField DPU and NVIDIA Quantum InfiniBand networking platforms and maintain congruency when transitioning between the two systems and transitioning from virtual to physical interfaces and vice versa. The Palladium Z3 system accelerates hardware verification, and through functional and interface congruency, models can be quickly brought up onto the Protium X3 system for accelerated software validation.

“The supercharged Palladium Z3 and Protium X3 are built to deliver fast pre-silicon verification and validation of the largest and most complex devices,” said Dhiraj Goswami, corporate vice president, Hardware System Verification R&D at Cadence. “Our innovative custom silicon and system architecture, combined with revolutionary modular compile and debug capabilities enabling multiple turns per day, continues to push the envelope to meet our customers’ needs, allowing them to solve the world’s toughest challenges and enable their next generation of innovations to become a reality.”

“Building efficient, high-performance AI platforms requires sophisticated infrastructure and integration across a full stack of optimized systems and software,” said Scot Schultz, senior director, Networking at NVIDIA. “Accelerated by NVIDIA networking, the next-generation Cadence Palladium and Protium systems push the boundaries of capacity and performance to help enable a new era of generative AI computing.”

With the Palladium Z3 system’s new domain-specific apps, users have access to the most complete offering for managing increasing system and semiconductor design complexity, improving system-level accuracy, and accelerating low-power verification. The domain-specific apps include the industry’s first 4-State Emulation App, the Real Number Modeling App, and the Dynamic Power Analysis App.

“As SoCs become more complex, scalable validation and verification tools that enable massive software testing before tapeout are more critical than ever,” said Tran Nguyen, senior director of design services, Arm. “The latest hardware verification platforms and tools from Cadence are sparking innovation in Arm IP design for AI, automotive, and data center applications, and we look forward to how this will benefit our mutual customers.”

“Delivering on leadership computing products requires AMD to bring together a multitude of pre-silicon solutions and techniques to meet the scale of the verification challenge,” said Alex Starr, Corporate Fellow, AMD. “Cadence Palladium Z3 and Protium X3 systems add to our capabilities between emulation and enterprise prototyping to improve design productivity and meet time-to-market goals. Our collaboration with Cadence also incorporates the AMD Versal Premium VP1902 adaptive SoC within the Protium X3 system as well as AMD EPYC processor-based host servers qualified for both the Palladium Z3 and Protium X3 systems to enable high capacity with next-level performance and scalability.”

The Palladium Z3 and Protium X3 systems are part of the broader Cadence Verification Suite and support the company’s Intelligent System Design strategy, enabling SoC design excellence. The systems have been deployed at select customers, with general availability expected in Q3 2024. For more information on the new Palladium Z3 and Protium X3 systems, please visit www.cadence.com/go/dynamicduo3.

The post Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins appeared first on ELE Times.

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Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has won the German Innovation Award...

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that in Q3 and Q4/2023 Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — placed multiple-tool orders to utilize its G10-SiC chemical vapor deposition (CVD) system to help further ramp up production for 200mm (8-inch) SiC epitaxial wafers...

Virtual Forest of Bengaluru, India (an electronics design company specializing in motor control and human interface technologies for consumer appliances, fluid movement and mobility) has adopted the GaNFast power integrated circuits (IC) technology of gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA for a zero-emission, 3hp (2250W) solar-powered irrigation pump...

• On track to become carbon neutral on scope 1 and 2, and partially scope 3, by 2027 with global sourcing of electricity from renewable energy growing to 71% in 2023, from 62% in 2022
• 87% of employees would recommend ST as a great place to work
• 12.2% of net revenues (US$2.1 billion) invested in R&D to support innovation

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today releases its annual sustainability report, which provides insight into its 2023 performance related to priority environmental, social and governance (ESG) factors that support long-term value creation for all its stakeholders and sustainable growth for its business.

“Sustainability is at the heart of our value proposition, driving benefits for our company, customers, and society. We’re proud of our progress on innovation, resilience, employee engagement and the advancement towards our ambitious goal of becoming carbon neutral on scope 1 and 2, and partially on scope 3, by 2027,” said Jean-Marc Chery, President and CEO, STMicroelectronics. “Together with our partners and empowered employees, we’re accelerating sustainable transformation in technology and beyond.”

ESG highlights during 2023 include:

• A 45% decrease in GHG emissions for scopes 1 and 2 since 2018 in absolute terms (vs a 40% decrease in 2022).
• An increased sourcing of electricity coming from renewable sources to 71% (from 62% in 2022) and the signing of a significant power purchase agreement (PPA) in Italy to produce 250GWh renewable energy per year (3.75 TWh over 15 years) starting in 2024.
• The reuse, recovery, or recycling of 96% of the Company’s waste (1% higher than in 2022).
• A- scores for CDP water security and climate change.
• 12.2% of net revenues (US$2.1 billion) invested in R&D to support innovation.
• Involved in 195 active R&D partnerships worldwide.
• More than 610 STEM (Science, Technology, Engineering, and Mathematics) events and initiatives (a 35% increase on 2022) reaching over 100,000 students and teachers globally.
• 87% of employees would recommend ST as a great place to work, 4% higher than in 2021 (when we last had a full survey).
• In 2023, the company established a strong focus on setting up voluntary, employee-led Employee Resource Groups (ERGs) to promote inclusion in the workplace. WISE (Women Inspiring Supporting and Empowering), the first ERG for women, has grown fast, with some 1,400+ members in 60 locations.

In 2023, ST maintained a strong presence in major sustainability indices such as the Dow Jones Sustainability indices, FTSE4Good, EuroNext VIGEO Europe 120, CAC 40 ESG, MIB ESG, ISS ESG Corporate ratings, Bloomberg Gender Equality Index, and received an MSCI ESG Rating of AAA.

The 27th annual report contains highlights and details of ST’s sustainability performance in 2023 and presents the Company’s ambitions and longer-term goals in alignment with both the United Nations Global Compact Ten Principles and Sustainable Development Goals and the Science Based Targets initiative (SBTi). It is aligned with Global Reporting Standards (GRI), Sustainability Accounting Standards Boards (SASB), and Task Force on Climate-Related Financial Disclosures (TCFD). A third party has verified this report.

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