Новини світу мікро- та наноелектроніки

Joseph Carew | Comsol

HVAC systems do more than provide the smooth, chilled air that flows when the temperature outside rises. Within these systems, air moves through filters to ensure high air quality. With clean air at stake, modeling and simulation can be used to gain an in-depth understanding of the physics behind the behavior of air as it moves through a filter…

The filters within HVAC systems rely on a material (often fiberglass or cotton folds) capable of straining the air and catching particulates like dust, pollen, and bacteria. These materials impact the flow of the air, catching the unwanted particulates while simultaneously allowing the filtered air to flow through. Modeling these devices and the turbulent flow they induce allows for determining the effectiveness of different materials when they are used for filters, helping designers to narrow down the material options before investing in real-life, experimental versions.

In this blog post, we will look at a common air filter geometry (shown below) as our example.

Modeling this air filter begins with the CFD Module, an add-on product to the COMSOL Multiphysics® software, which enables users to create Reynolds-averaged Navier–Stokes (RANS) turbulence models in open and porous domains. In this example, the air filter is modeled as a highly porous domain with 90% of the material occupied by cylindrical pores with a diameter of .1 mm. The support of the air filter is represented by a frame with no-slip walls. For this example, we employed the Turbulent Flow, k-ω interface because of its accuracy for models with many walls, including no-slip walls. (An in-depth look at the model setup can be found in the model documentation, which can be accessed via the button at the end of this blog post.)

Solving the model allows for visualizing the change in turbulence, velocity, and pressure as air moves toward, through, and past the filter. The computation begins with the air moving toward the filter (purple in the image below). When the air passes through the filter, the interstitial velocity increases (although the porous-averaged velocity remains constant), resulting in an increase in turbulence kinetic energy. Additionally, there is an abrupt pressure drop due to the increase in velocity and the increased friction and pressure losses, which stem from the high number of wall surfaces. As for the behavior of the air as it moves away from the filter, the frame of the filter prevents the air from moving freely, instead causing downstream wakes of air.

The visualization of the air moving through the filter can be used to conclude whether or not the filter will remove contaminants from the air. To confirm this conclusion, the solution can be evaluated with different slice plots. One of the slice plots for this example indicates that the velocity of the air is most impacted by the porous air filter and the frame and that it homogenizes through the wake region. A slice plot measuring the turbulence kinetic energy shows that the turbulence kinetic energy peaks noticeably within the filter and attains typical values on the no-slip walls.

In general, the model points to a pressure drop and a dramatic increase in turbulence within the filter, creating perturbations in velocity perpendicular to the main direction of the flow thus also increasing the probability of the particles to collide with the pore walls and stay there. In other words, the increase in turbulence provides the mixing required for filtering out the unwanted particulates, which otherwise would flow through the pores undisturbed.

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Rob Greer, Vice President and General Manager, Enterprise Security Group, Broadcom

It is clear, there is no let-up in cyberattacks, so the timing could not be better for Broadcom to bring Carbon Black and Symantec together. These engineering-first, innovation-centric brands are both committed to delivering proven cybersecurity solutions and support built to meet the unique and highly complex challenges of the largest and most heavily regulated enterprise customers and partners. Broadcom will make significant investments in both brands, and continue to offer both portfolios under the Enterprise Security Group business unit. Our joint mission is to help secure the world’s largest and most advanced enterprises.

Symantec’s portfolio, with some of the best security technology and research in the world, concentrates on data and network protection, while Carbon Black’s complimentary portfolio specializes in both endpoint detection and response (EDR) and application control. Bringing both network and data telemetry to Carbon Black will enable greater visibility and control for our joint customers. Under the new Enterprise Security Group, customers will continue to receive the best service with more dedicated resources and focused support than ever before. What can you expect in the near-term? Let’s take a closer look at innovation, customers, and partners.

Broadcom’s financial stability empowers Symantec and Carbon Black product portfolios to innovate at a massive scale. Our customers will benefit from access to an enhanced enterprise-grade portfolio and leading technological advancements, with unparalleled service and support.

Initially, we will invest in R&D to improve – and extend the life — of the products our customers are using both on-prem and across hybrid clouds. We also are excited about the complementary nature of both sets of technologies and the combined value they will provide our customers, opening up more choices. For example, Symantec has a data center security product to protect traditional workloads in the data center. Carbon Black has a complementary solution. With access to these two technology sets, defenders will be even better equipped to protect their infrastructures.

On the talent side, we will be making significant investments in engineering. Carbon Black is known for its outstanding, customer-centric engineering capabilities, and we are committed to investing in Carbon Black’s incredible franchise and putting the best talent in the best roles. For example, both Carbon Black and Symantec have existing engineering sites in India. While we see the opportunity to converge them, we do not expect to make headcount reductions in those sites. In fact, we plan to make more investments in India. In addition, we will continue to invest in support and R&D for both brands, retaining key technical and product leaders to ensure continued success today and in the future.

Symantec and Carbon Black product portfolios will continue to operate in their current states for the immediate future. Our customers can expect to gain access to an extensive and robust enterprise-class portfolio supported by top-tier security experts, intelligence, and continued innovation, all backed by the financial stability of Broadcom.

Looking ahead, we will explore innovative new ways to deliver solutions to our customers. This will involve intensely focusing on the technologies that provide the most value to our customers and partners and invest more resources in those areas so our customers realize even greater value and ROI.

At Broadcom, we take a very focused go-to-market approach. As Hock Tan, our CEO, says, “We do what we do best.” By focusing on our core strengths and not trying to be all things to everyone, we open big opportunities for our partners to step in, fill gaps, and profit from them. The addition of the Carbon Black portfolio provides a great opportunity for our partners to drive more revenue, win more customers, and grow. Broadcom will provide the necessary training, support and other resources to ensure our partners’ success with Carbon Black solutions. For examples of our breakthrough approach to building a highly scalable, close-to-the-customer partner ecosystem, look no further than our Global Cybersecurity Aggregator Program (GSAP) and the Expert Advantage Partner Program. Partners in these programs deliver high-value services to customers of all sizes – including our largest enterprise accounts.

Over the next few weeks, we will be sharing more details about how today’s announcement will further benefit our customers and partners. In the meantime, we encourage you to visit our online resources to access additional information. As ransomware attacks and other cybersecurity threats continue to rise, you can be rest assured that Carbon Black and Symantec together will provide the mission-critical technologies to defend the most complex, highly regulated organizations.

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element14 will be the only distributor to offer this kit for sale at Embedded World 2024.

element14 has announced the availability of Gateworks’ latest Wi-Fi 6 Development Kit – GW11048-5-A.

Gateworks will showcase its cutting-edge technology kit during the Embedded World 2024 exhibition in Nuremberg, Germany, from the 9th to 11th April. element14 has been chosen as the exclusive distributor of the kit, making it the only place where customers can purchase it during the event.

The Wi-Fi 6 Development Kit is designed to facilitate the validation of the Silex SX-SDMAX and SX-PCEAX Wi-Fi 6 radios, providing developers with a seamless out-of-the-box evaluation experience. It delivers ruggedized wireless connectivity for a diverse range of industrial applications, from remote real-time monitoring to predictive maintenance and enhanced logistics.

This latest innovation comes with a pre-loaded Linux system and all the necessary accessories to get started quickly.

Key features include:

• Supports Silex SX-SDMAX and SX-PCEAX Wi-Fi 6 radios (radios not included)
• Includes Venice GW7200 Single Board Computer (SBC) with pre-loaded Linux drivers
• Onboard NXP i.MX8M Mini processor (1.6 GHz quad-core)
• 8GB eMMC flash storage and 1GB LPDDR4 DRAM
• Two Gigabit Ethernet ports and two Mini-PCIe expansion slots
• Multiple connectivity options including MicroSD, Nano SIM, I2C, SPI, and serial ports
• Real-time clock, voltage and temperature monitoring
• Wide input voltage range (8 to 60VDC) with PoE support
• Operates in temperatures ranging from -40°C to +85°C

“We are thrilled to provide Gateworks’ WI-FI 6 development kit to our customers. This cutting-edge technology is a game-changer for those seeking to develop and deploy IoT applications and systems. We look forward to seeing its capabilities showcased at the exhibition and support our customers with all their development needs”, said Romain Soreau, Head of Single Board Computing at element14.

In addition to the Wi-Fi 6 Development Kit, element14 also offers Gateworks Corporation’s complete line of products for industrial applications.

Gateworks will be highlighting their line of railway solutions at Embedded World, aimed at enhancing the efficiency and safety of rail yards, such as rugged Gateworks Single Board Computers (SBCs) combined with a variety of wireless options such as high-precision GNSS Mini-PCIe cards. These solutions enable capabilities such as centimetre-level accuracy in tracking and monitoring critical data, streamlined yard operations and enhanced customer service for rail operators.

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Courtesy: Avnet

When a doctor tells you to get a CT scan, they’re calling on a powerful medical imaging technology for insights only otherwise possible through invasive procedures.

Computed tomography (CT) exploits the penetrating nature of X-rays. A standard X-ray shines a 2D beam of high-energy photons through the subject. How these photons are detected has changed over the years. It was once just photographic film, but today it is more likely to be a digital detector.

Since bone, muscle and fat each absorb X-rays differently, the image captured is effectively the shadow cast by the mix of tissues in the body. Rather than create an image directly from the photons detected, computed tomography processes that captured data to synthesize an image.

In CT scanning, a source illuminates the subject using a fan-shaped beam of X-rays that are picked up by an arc-shaped array of digital detectors. The source and the detector are mounted on a circular gantry, which rotates around the patient, taking scans from multiple angles.

The resulting scans are not directly interpretable as an image. The scans are combined in a computer, creating a more detailed 2D “slice” through the body. Many CT scanners also coordinate the movement of the patient with the gantry’s rotation, creating a sequence of slices through the body that can be processed into a 3D image.

CT scans can render more detail about internal structures than ordinary X-rays and can present that data in augmented 2D or 3D, making it easier to interpret. They are also relatively fast, which makes them useful for providing insights about injuries to the head, spine, chest, abdomen and pelvis.

The ability to post-process CT images means that they can provide a useful basis for detecting tumors and cancers, their size, location, and how they have spread. They can also reveal internal bleeding and the spread of infection as well as enable doctors to visualize blood vessels, aneurysms and blockages throughout the body.

CT imaging can be used to reduce the invasiveness of some procedures. The ability to differentiate diseased tissue helps surgeons avoid removing healthy tissue unnecessarily. Similarly, the 3D detail possible with CT imaging can provide a useful basis for planning procedures such as biopsies, surgery, implants, and radiation treatment.

The technique can reveal the detailed health of bones and joints, making it easier to understand wear or disease and to diagnose fractures. CT scans can also help track the progress of disease and reveal the effectiveness of treatments such as chemotherapy.

There are challenges associated with CT scanning. They usually involve greater exposure to ionizing radiation than is common with standard X-rays. Patients may also react badly to the contrast agents used to improve the CT scan’s effectiveness.

Developers of CT scanners work with two forms of constraints. The first is the paramount nature of combining innovation with patient safety when using ionizing radiation. The second is the tension that can bring for patients and care providers. The availability of new technologies and capabilities must always be met with the best judgment and a conservative attitude.

There are technical trade-offs in CT design too. Perhaps the most important of these is between image quality and radiation dose levels. Higher doses may improve image clarity at the cost of greater exposure. Technologies such as iterative image reconstruction and denoising algorithms based on machine-learning techniques can now replicate some of the image-quality gains of high-dose scans at lower doses.

Trade-offs also exist between the speed of scanning and image resolution. Faster scanning reduces artifacts introduced by patient movements but can result in lower spatial resolutions. Scanning more slowly can deliver higher resolution if the patient is still for long enough.

Designers also need to decide which market niche they want to address. For example, designing a scanner with a large field of view makes it easier to scan large body parts, but requires larger, more expensive detector arrays. Other trade-offs may have to be made between scanner flexibility and specialization, hardware quality and maintenance costs, and software capabilities and reliability.

There are also financial considerations over initial cost and long-term upgradability. Buying a CT scanner means a large upfront outlay and substantial operating costs. Buyers may be prepared to choose a scanner engineered to evolve, rather than a lower-cost machine with a more limited useful lifetime.

Despite the constraints and trade-offs outlined above, there are many avenues for innovation in CT design. Each detector usually has a scintillator, which emits visible light when it is hit with X-rays, mounted over a digitizing photodetector circuit. A basic CT scanner will have one arc of these detectors, but more sophisticated variants will have multiple arcs so that they can sample multiple “slices” simultaneously. There may be as many as 256 arcs.

To support the high number of detectors, semiconductor companies are engineering 128-channel analog-to-digital converters (ADCs). These ADCs can be mounted in modules to produce 256-channel capabilities. The chips have low-power, low-noise, low-input-current integrators. Simultaneous sample-and-hold circuits ensure that all samples are taken at once. Some ADCs targeting medical applications offer resolutions of up to 24 bits.

Different beam energies can reveal different things about the subject they are illuminating. Radiologists can adjust the beam strength used in the scan to pick out specific details. This is called the spectral CT technique.

Another approach is to use a dual-layer detector, with the top layer absorbing the lower-energy X-ray photons and a lower layer absorbing the higher-energy photons. This technique can reveal more about how the X-rays have been affected by their passage through the subject material.

A further innovation involves single-photon capture detection, in which a semiconductor device is used to directly count each X-ray photon. This gives scope for lower-dose CT imaging, since it does away with potential photon losses in the scintillation process of conventional detectors. It also makes it possible to measure the arrival energy of every photon, again giving greater insights into how it has been affected by passing through the patient.

In dual-source CTs, two source/detector array pairs are mounted on the rotating gantry ring at 90 degrees to each other. This arrangement gives good coverage of the patient while minimizing interference between the sources.

The two sources can run at different energies, which brings the advantages of spectral CT discussed above. They can also acquire a whole slice image more quickly than a single-source scanner, which gives them greater temporal resolution for imaging moving features such as a beating heart. This in turn reduces motion artefacts in the final scan. Faster scans may also be more acceptable to some patients.

High-resolution CT scanners produce very thin slices of less than 1 mm. They use more, smaller detectors, to achieve higher spatial resolutions than standard scanners. The extra resolution makes it easier to detect and characterize small features accurately.

Such scanners usually have sophisticated image-reconstruction algorithms to enhance image quality and detail, which is particularly important for visualizing fine structures and edges. They can also have features such as enhanced X-ray beam management. These techniques give higher contrast images than standard scanners.

CT scanners are enormously valuable for producing insights into patient health without the need for invasive procedures. Their developers can call on rapidly evolving technologies, such as detector electronics and machine-learning techniques, to provide enormous scope for innovation. Responsibility for patient safety means the adoption of new technologies can feel slow.

Fortunately, designers can make a real difference here by exploring the systemic trade-offs involved in the development of novel CT scanners to produce capabilities that are engineered to encourage rapid uptake. For example, designing a detector sampling and digitization circuit with a lower noise floor will enable higher-resolution scans at the same beam energy, or similar resolutions at lower doses.

An FPGA accelerator board may be used to speed up image-processing algorithms, increasing the scanner’s throughput and so cutting the cost of individual scans. Or perhaps there’s a better way to manage power use in the scanner, extending its reliability and so cutting its operating costs.

Avnet recognizes the holistic challenge of developing medical imaging products and has the resources to help OEMs address them.

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With embedded security considered to be a vital aspect in the deployment of Internet of Things (IoT) applications, Infineon Technologies AG has announced that its new PSOC Edge E8x MCU product family has been designed to meet the highest certification level provided by the Platform Security Architecture (PSA) Certified program, a framework for embedded security. The PSA Certified Level 4 device certification is targeted by implementing an on-chip, hardware-isolated enclave that provides secured boot, key storage and crypto operations in all PSOC Edge E8x devices.

“By aspiring to achieve this robust embedded security certification, IoT designers for edge applications such as wearables and smart home applications can be confident their products can achieve highest levels of security,” said Erik Wood, Senior Director Product Security for IoT, Computer and Wireless business, Infineon Technologies. “Integrating hardware security on the MCU also unlocks new edge computing markets such as printers and payment terminals that previously required discrete security chips. As a security leader, we are committed to enabling designers to reach the highest level of security for all applications.”

PSA Certified is a security framework established by Arm and industry partners in 2019. It provides both design guidelines and independent security evaluations through third-party labs intended to assure that all connected devices are built upon a Root of Trust. PSA Certified certifications achieved by an MCU extend through the value chain, allowing device builders and application providers to reuse that certification as they deploy products in the field.

“Connected device security is critical to scaling IoT deployments, and something that Arm and its ecosystem is committed to continuing to drive through initiatives like PSA Certified,” said David Maidment, Senior Director, Secure Devices Ecosystem at Arm. “We applaud Infineon’s ongoing commitment to robust device security by striving to achieve PSA Certified Level 4 iSE/SE for its new family of MCUs.”

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Sometimes, the tech buzzwords of the moment are used so freely when speaking to colleagues and customers and read daily in articles, on social media, and even in the mainstream news. Although terms such as AI, gen AI, edge computing, digital twins, IoT, and sustainability are familiar, their practical implementation is challenging. The challenges and obstacles are numerous and, at times, unique to specific use cases or organizations and depend on the maturity of the emerging technology.

Consider digital twins as an example; what are they, and what is all the hype surrounding them? The definition used by the Digital Twin Consortium describes a virtual representation of real-world entities and processes synchronized at a specified frequency and fidelity with the capability of transforming business by accelerating holistic understanding, optimal decision-making, and effective action. Digital twins use real-time and historical data to represent the past and present and simulate predicted futures. Furthermore, digital twins are motivated by outcomes, tailored use cases, powered by integration, built on data, guided by domain knowledge, and implemented in IT/OT systems.

Suppose we take a manufacturing plant as an example. Whether the equipment used is of new generation or legacy and has fixed function, general-purpose devices, or a combination, one thing is for sure: an overwhelming amount of data is produced. The data is a modern-day goldmine if extracted, processed, aggregated, and verified. Data allows digital twins to thrive, and its integrity is one of the most critical aspects of the technology. It is what helps ensure consistent, accurate, reliable results. In the future, IT and OT resources and infrastructure will need to converge further to standardize, transform, and apply data insights in manufacturing settings.

The accuracy of the data allows us to rapidly create physically precise, virtual 3D models and replicate real-world environments, from the factory floor to stores and cities.

Digital twins can be used to recreate the factory itself, allowing organizations to monitor and make changes in the digital environment to verify the impact of results before making changes on the factory floor. Manufacturers can also create an exact digital replica of their product and carry out true-to-world testing, allowing them to find and correct issues or errors and make optimizations before moving into production. Furthermore, digital twins create predictive models based on data points and their historical changes. They are measuring conditions against historical patterns and trends to identify anomalous behaviour, such as production line bottlenecks or potential safety and security breaches, right down to granular details, such as the temperature and vibration of a single appliance.

Considering today’s level of technological maturity, digital twins provide a range of benefits, including:

• Heightened visibility and transparency into assets and environments
• Reducing costs, time, and effort in changing production workflows
• Reducing material waste and delivering energy and other utility savings
• Sustainability
• Efficient acceleration of production times
• Reduced errors and issue resolution in pre-production phase
• Employing machine learning models that can understand and act in real-world situations.

Digital twins generally require purpose-built software on IoT edge servers that draw real-time data from sensors, appliances, and cameras. However, in most cases, organizations can start with their existing infrastructure and layer analytic tools to leverage the data already generated by installed equipment. Incrementally adding compute resources will help improve the accuracy of the digital twin over time. These considerations depend on what the organization is trying to achieve and its long-term goals. Technology is a strategic investment, so organizations should work with a reliable collaborator to plan for new use cases from infrastructure, resource, and security aspects.

The skill sets needed to leverage modern technology have evolved, and the workforce needs to evolve with that to obtain optimal results.

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In the automotive industry, embedded AI is becoming increasingly important for safety-critical real-time applications. However, this also creates new requirements and standards that must be considered during the complete product lifecycle. Infineon Technologies addresses these new requirements with the AURIX TC4x microcontroller (MCU) family, which meets the AI-specific safety requirements to achieve SAFE AI compliance, as proposed by the Fraunhofer Institute for Cognitive Systems IKS. The MCUs, with their ASIL-D compliant AI accelerator (PPU), provide an innovative platform for developing embedded AI-based use cases and automotive applications such as motor control, battery management systems, vehicle motion control and siren detection.

The SAFE AI framework based on ISO PAS 8800 and current state-of-the-art AI regulations is an evaluation methodology developed by Fraunhofer IKS that assesses the trustworthiness of AI in terms of robustness, data utility, operational design domain (ODD) and environmental conditions. The functional safety measures of the AURIX TC4x family thus provide mechanisms for compliance with AI regulations and standards at the application level. By using the AURIX TC4x family, car manufacturers can assess the safety and reliability of AI solutions and identify potential vulnerabilities during system development and operation. For safety-critical real-time applications, the use of AI models like neural networks increases accuracy and provides additional safety in conjunction with the existing physical sensor.

“The integration of safe and reliable AI functionality into automotive microcontroller families is essential to further improve vehicle performance, safety, and comfort,” said Thomas Boehm, Senior Vice President Microcontroller at Infineon. “We are therefore very proud that our AURIX TC4x microcontroller has successfully passed the SAFE AI assessment by the Fraunhofer Institute for Cognitive Intelligence. This underlines our position as one of the leading innovation drivers in the industry.”

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Low-Cost Devices Target Consumer Electronics, Small Appliances, Industrial System Control and Building Automation

• Core: 32MHz Arm Cortex-M23
• Memory: Up to 64KB integrated Code Flash memory and 12KB SRAM
• Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
• Communications Peripherals: 3 UARTs, 1 Async UART, 3 Simplified SPIs, 1 IIC, 3 Simplified IICs
• Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, immutable storage, CRC calculator, register write protection
• Security: Unique ID, TRNG, Flash read protection
• Packages: 16-, 24- and 32-lead QFNs, 20-pin LSSOP, 32-pin LQFP

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Industry-low 160nA current consumption improves power savings in consumer and industrial equipment

ROHM has developed a linear operational amplifier (op amp) – LMR1901YG-M – featuring the lowest* current consumption in the industry. This makes it ideal for amplifying sensor signals used to detect and measure temperature, flow rate, gas concentration, and other parameters in applications powered by internal sources (i.e. batteries).

In recent years, advanced control has been in increasing demand for various applications in consumer and industrial electronics. Therefore, there is an increasing need for accurate sensing of parameters relevant to the application – such as temperature, humidity, vibration, pressure, and flow rate. Op amps whose main function is to amplify sensor signals for subsequent detection and/or analog-to-digital conversion, is a crucial component in the signal chain – greatly affecting both accuracy and power consumption. ROHM is developing op amps that satisfy the dual need for high accuracy and low current consumption. By further refining the circuit design based on original Nano Energy technology, ROHM is now able to offer an op amp that delivers the lowest current consumption on the market.

The LMR1901YG-M leverages original ultra-low power technology that thoroughly suppresses current increase caused by temperature and voltage changes to reduce current consumption to just 160nA (Typ.) – approximately 38% lower than that of general low power op amps. This not only extends the life of applications powered by internal batteries like electronic shelf labels, but also contributes to longer operating times for smartphones and other devices equipped with rechargeable batteries. At the same time, this low current consumption does not change over the temperature range of -40°C to +105°C – allowing stable low-power operation, even in environments where external temperatures fluctuate, including fire alarms and environmental sensors.

Other performance enhancements include 45% reduction of input offset voltage to just 0.55mV (Max. Ta=25°C) over general low-current op amps while a maximum input offset voltage temperature drift of 7V/°C is guaranteed. This enables high-accuracy amplification of sensor signals. Capable of operating from 1.7V to 5.5V supply voltage and offering rail-to-rail input/output, LMR1901YG-M is suitable for a wide variety of applications in the industrial equipment and consumer markets. ROHM’s new op-amp also complies with the automotive reliability standard AEC-Q100 – ensuring stable operation even under harsh conditions such as vehicle cabins without compromising functionality.

In addition to various technical documents necessary for circuit design and SPICE models for simulation (available free of charge on ROHM’s website), the LMR1901YG-M can be used with ROHM Solution Simulator to speed up time to market.

Going forward, ROHM will continue to pursue further power savings in op-amps using proprietary ultra-low power technology. On top, ROHM aims to improve the performance of op-amp lineups by reducing noise and offset – increasing power savings and expanding the power supply voltage range while contributing to solving social issues through higher accuracy application control.

Product Lineup

Application Examples

• Consumer applications: smartphones, smartwatches, wearables, fire alarms, motion sensors, etc.
• Industrial equipment: electronic shelf labels (ESL), handheld measurement instruments, data loggers, environmental sensors for IoT, etc.
• Automotive systems: anti-theft sensors, drive recorders, etc.

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STMicroelectronics’ ST25R100 near-field communication (NFC) reader delivers a unique combination of advanced features, robust communication, and affordability, raising the value of contactless interaction in high-volume consumer and industrial products.

Combining its high performance and reliability with low power consumption, the 4mm x 4mm ST25R100 supports powerful contactless use cases. The tiny outline simplifies integration in products such as printers, power tools, gaming terminals, home appliances, medical devices, and access controls.

“Contactless is a great way for all sorts of products to interact for purposes such as recognizing genuine accessories, ordering consumables, and monitoring usage,” said Sylvain Fidelis, Multi-market Business Line Manager at STMicroelectronics. “Bringing an outstanding performance-to-cost ratio, with the added advantage of fast development using our software ecosystem, the ST25R100 delivers an affordable and easily embedded solution to our customers.”

Supporting advanced controls for signal quality and power management, the ST25R100 ensures strong and reliable wireless connections even in space-constrained devices that allow only a tiny antenna. Additionally, the ST25R100 features a new and enhanced low-power card detection (LPCD). This greatly extends the detection range compared to state-of-the-art devices, to ensure a user-friendly experience.

The ST25R100 integrates an advanced analog front end (AFE) and a data-framing system that supports standard NFC specifications, NFC-A/B (ISO 14443A/B, up to 106kb/s) and NFC-V (ISO 15693, up to 53kbit/s) to read cards.

The reader has a wide power-supply and peripheral-I/O voltage range from 2.7V to 5.5V. Multiple operating modes assist power management by allowing the device current to be reduced to as little as 1µA for longer runtime in battery-powered applications. There is also a reset mode that draws just 0.1µA.

The ST25R100 is sampling now, in a compact 4mm x 4mm 24-pin TQFN package that allows small devices to provide contactless card experiences. Pricing starts from $1.82 for orders of 1000 pieces.

ST will showcase the ST25R100 reader’s capabilities in practical demonstrations at Embedded World 2024 in Nuremberg, Germany, April 9-11, booth 148, Hall 4A.

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Author: Giusy Gambino, Marcello Vecchio, Filippo Scrimizzi, STMicroelectronics, Catania, Italy

When developing distributed intelligence for smart power switches in automotive power management systems, it is crucial to ensure that the protection mechanisms are truly intelligent. This is especially critical in scenarios involving multi-channel drivers as even minor asymmetries or unexpected load conditions can impact protection effectiveness.

In automotive environments, smart drivers play a crucial role in managing and distributing power from the car’s battery to various components like ECUs, motors, lights, and sensors. These multi-channel drivers control different electrical loads, such as resistive, inductive, and capacitive actuators, in parallel. It is crucial to maintain a balanced current flow across all channels for the drivers to function correctly and ensure the vehicle operates effectively and efficiently. Any minor asymmetries in the layout that cause current focalization through specific metal paths as well as unexpected situations like damaged or faulty loads and improper wiring can cause high current density in small areas. This leads to overheating of the integrated circuits and heat focalization with hot spots, ultimately resulting in component failure and damage.

Although thermal simulations and preventive measures are implemented, verifying and validating the implementation of intelligent protection mechanisms is crucial to identify potential issues that can delay timely intervention.

Thermal Sensing in Smart Switches

Balanced current flow is essential for high-side drivers to effectively manage heat, as they are required to handle significant amounts of current in very small and compact packages. They are often located in enclosed areas with poor ventilation and thermal dissipation, making heat management even more crucial.

Therefore, intelligent performance should rely on embedded thermal diagnostics based on sensing and protection mechanisms which monitor the driver’s temperature and take action when it exceeds predefined thresholds. Temperature sensing is quite a difficult task as it is strongly affected by the uniformity of the current flow in the different sections of the driver across all channels to achieve accurate temperature readings.

Unexpected high current density areas or short-circuit conditions are a significant concern as they can cause unpredictable heat concentration through diffused hot spots which produce sudden temperature increases in a very short period of time. These conditions can lead to overheating and component failure, which can be dangerous and costly to repair.

To prevent damage caused by thermal stress, the protection circuit is designed to limit the current and keep the power MOSFET within the safe operating area (SOA) until the thermal shutdown is triggered, which turns off the driver. However, this type of protection can cause physical stress on the surface of the power device. The current limit needs to be set high to meet inrush requirements and process tolerances, resulting in a fast thermal rise on the die’s surface when driving into a short load. This sudden temperature fluctuation can create significant thermal gradients across the die’s surface, leading to thermo-mechanical stress that can affect the device’s reliability.

The VIPower M0-9 high-side drivers have addressed this issue by integrating two temperature sensors in the cold and hot zones, respectively (as shown in Fig. 1).

The temperature sensors are implemented using polysilicon diodes thanks to their linear temperature coefficient across operating temperatures. The cold sensor is positioned in the cold zone of the driver near the controller, while the hot sensor is placed in the power stage area, which is the hottest zone in the driver.

Using this double-sensor technique enables the driver’s temperature increase to be limited since the thermal protection is triggered when the lowest temperature value between the over-temperature threshold and a dynamic temperature level between the sensors is reached. Once removed the overtemperature fault, the smart switch can be reactivated when the temperature decreases to a fixed value.

This significantly helps to reduce thermal fatigue in terms of thermo-mechanical stress on the switch, which can accumulate over time and lead to degradation and reduced reliability.

Thermal Mapping

Along with simulation and prevention procedures, infrared (IR) thermography is a valuable technique to obtain detailed thermal maps of the driver, which provide a comprehensive understanding of the heat distribution within the integrated circuit, highlighting any potential hazard.

To assess the effectiveness of intelligent protections in harsh automotive applications, the heat distribution within the driver has to be analyzed under challenging short-circuit conditions with two different scenarios:

• Terminal Short-Circuit (TSC);
• Load Short-Circuit (LSC).

The terminal short-circuit condition occurs when a low resistance connection between the terminals of a component or device is present, as shown in Fig. 2.

On the other hand, a load short-circuit condition arises when there is an inductive path between the load and the power source, leading to a sudden surge in current flow (Fig. 3).

The following test conditions are considered:

• Tamb = 25 °C
• Vbat = 14 V
• Ton = 1 ms for mapping
• Ton = 300 ms for temperature acquisition of thermal sensors and hot spots
• TSC condition: RSUPPLY = 10 mΩ, RSHORT = 10 mΩ
• LSC condition: RSUPPLY = 10 mΩ, LSHORT = 5 µH, RSHORT = 100 mΩ

where  Tamb is the ambient temperature

Vbat the DC battery voltage

Ton the time duration of the short-circuit event

RSUPPLY the resistance of the battery

                RSHORT the short-circuit resistance

LSHORT the short-circuit inductance.

In order to generate a temperature map, the IR camera sensor is utilized to capture the infrared emissions at each location, which are then converted into temperature values. To ensure the conversion accuracy from specific colors to defined temperature values, a calibration process is essential. This process involves comparing the different colors obtained from the sensor with known temperature values, which can be obtained through specific thermal sensitive parameters and their trend versus temperature increase. By analyzing these parameters, the calibration process can ensure that the temperature map accurately reflects the temperature distribution in the area being scanned.

To calibrate the IR camera sensor, the forward voltage (VF) of the MOSFET’s body drain diode is chosen due to its linear dependence on temperature. However, a pre-calibration of the diode is necessary to accurately determine its temperature coefficient. This is achieved by measuring the VF voltage at a constant forward current (IF) while varying the temperature from 25°C to 100°C. To prevent any temperature rise caused by the current and its associated power dissipation, the IF value is selected within the range of 10mA to 20mA.

The VF values collected at different temperatures can be used to perform a linear interpolation and mathematical fitting to obtain the temperature coefficient of the diode, as shown in Fig. 4.

Calculations are made through the following equation (1):

Dt =     DVF /K                         (1)

where:

Dt is the temperature variation;

DVF the forward voltage variation;

K is the temperature coefficient of the diode.

The temperature map is created by acquiring each temperature point through an IR camera sensor at 1ms intervals. Once all the die points are acquired (which takes around 3000 seconds), a specialized software generates the map, which depicts the temperature of each point based on the minimum spatial resolution of the IR sensor. By overlaying the thermal map onto the row silicon die picture, it is possible to identify the hottest points in the active area and determine their coordinates while the current flows through the device.

As an example, the thermal maps for the dual-channel VND9012AJ smart switch are depicted in Fig. 5 under TSC conditions.

The graphical representation of temperature distribution across the driver’s channels, depicted through varying colors within the temperature range of 25°C to 150°C, serves as a crucial aid in detecting any regions experiencing excessive heat and ensuring the driver’s safe temperature operation. The provision of thermal maps for each channel under diverse operating conditions enables the tests to authenticate the driver’s reliable functioning without surpassing its maximum temperature threshold.

In order to locate the hot spots and monitor the temperature evolution for both hot and cold sensors, and subsequently validate the efficacy of the thermal shutdown mechanism, a longer short-circuit duration of 300ms is taken into account.

The temperature variations observed in VND9012AJ while undergoing TSC are displayed in Fig. 6.

The graph indicates the presence of hot spots in both channels of VND9012AJ as detected by the hot sensors, and the maximum temperature of these hot spots is in the range of 150 °C.

The thermal maps for VND9012AJ under LSC conditions are presented in Fig. 7.

The temperature variations observed in VND9012AJ while undergoing LSC are displayed in Fig. 8.

Both conditions trigger the thermal protection mechanism, causing the current to be limited to a safe level.

Conclusions

Valuable insights into the design and operation of the smart switch have been obtained through experimental results, particularly regarding current distribution and thermal protection mechanisms. It is essential to maintain a well-balanced behaviour of all channels to create an intelligent driver that improves safety and reliability in automotive systems. The use of IR thermography enables a precise and comprehensive analysis of temperature distribution, which enhances the smart switch’s thermal sensing and protection system. In demanding automotive environments, swift activation of these protections is crucial to detect overheating and prevent any potential harm to the device or system.

References

[1]  P. Meckler and F. Gerdinand, “High-speed thermography of fast dynamic processes on electronic switching devices”, 26th International Conference on Electrical Contacts (ICEC 2012), 2012.

[2]  X. Zhou and T. Schoepf, “Detection and formation process of overheated electrical joints due to faulty connections”, 26th International Conference on Electrical Contacts (ICEC 2012), 2012.

[3]  T. Israel, M. Gatzsche, S. Schlegel, S. Großmann, T. Kufner, G. Freudiger, “The impact of short circuits on contact elements in high power applications”, IEEE Holm Conference on Electrical Contacts, 2017.

[4]  Y. Lozanov, “Assessment of the technical condition of electric contact joints using thermography”, 17th Conference on Electrical Machines, Drives and Power Systems (ELMA), 2021.

[5]  M. Bonarrigo, G. Gambino, F. Scrimizzi, “Intelligent power switches augment vehicle performance and comfort”, Power Electronics News, Oct. 10, 2023.

The post Balancing Currents for Optimal Performance in Automotive Smart Drivers appeared first on ELE Times.

Despite massive, large-scale integration being ubiquitous in contemporary electronic design, discrete MOSFETs in the classic CMOS totem pole topology are still sometimes indispensable. This makes tips and tricks for driving them efficiently with logic level signals likewise useful, because it can be a “bit” tricky, especially if other than standard logic voltage levels are involved. 

If (happily) they are not, we have Figure 1.

Figure 1 The simplest case of logic signal totem pole drive—direct connection works if V++ <= VL.

Wow the engineering world with your unique design: Design Ideas Submission Guide

In the lucky circumstance that the totem FET source pins are connected to positive and negative rails that match the logic levels, a simple direct connection (a wire) will suffice. All that’s needed for success then is that:

1. The FET ON/OFF gate-source voltage level lies within the logic signal excursion, and
2. The logic signal source has sufficient drive to cope with the paralleled FET input capacitances.

Item 2 is particularly important, because it affects the archenemy of totem pole efficiency, cross-conduction. 

It often happens that, during the transition between Q1-conducting and Q2-not to the opposite state, there will be an interval of overlap when both transistors conduct. This is “cross-conduction”, and it wastes power, sometimes a lot. The longer its duration, the greater the waste. The duration of cross-conduction depends on the time required for the logic signal to complete the 0/1 or 1/0 transition, which depends on how long it takes to charge and discharge the respective gate input capacitances. The cross-conduction gremlin is somewhat mitigated by the fact the capacitance that delays one FET’s turn-off also delays its complementary partner’s turn-on, but speed is still vital.

Now suppose Q1’s V++ source voltage is higher than VL. What now? Figure 2 shows a simple solution: AC coupling.

Figure 2 AC coupling can solve the problem of positive rail voltage mismatch if the control signal runs continuously.

Of course, this simple fix will only work if the logic signal can be relied upon to always have an AC component. That is to say, if only its duty cycle is never 0% (always OFF) nor 100% (always ON): 0% < DC < 100%. C1 should have at least an order of magnitude greater capacitance than Q1’s gate capacitance (e.g., 1 nF). While D1 can usually be an ordinary junction diode (e.g., 1N4148), a Schottky type can be a better choice if a few extra hundreds of mV of gate drive are needed.

AC coupling can also come to the rescue if the totem’s negative rail is below ground, as shown in Figure 3. The same DC limitation applying, of course.

Figure 3 Ditto for AC coupling and negative rail mismatch, too.

So, what to do if DC doesn’t obey the rules, and we can’t rely on a simple diode to define signal levels? See Figure 4.

Figure 4 “Grounded” gate Q3 maintains C1 charge when logic signal stops.

Small-signal transistor Q3’s configuration as a common-gate, non-inverting high-speed amplifier transfers necessary steady-state current to Q1. Choose R2 to be a low enough resistance to source Q2’s maximum expected source-to-gate leakage current (R2 = 10k will typically be a very conservative choice), then R1 = R2(V++/VL – 1).

And of course, as illustrated in Figure 5, the same trick works for a negative totem rail.

Figure 5 Grounded gate Q4 shifts logic signal to negative rail referred C2 and Q2.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

Related Content

• Power Tips #108: Current sensing considerations in a bridgeless totem pole PFC
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• Power Tips #115: How GaN switch integration enables low THD and high efficiency in PFC
• The NE555 current spike

The post Driving CMOS totem poles with logic signals, AC coupling, and grounded gates appeared first on EDN.

Rohde & Schwarz, the technology leader inaugurates a state-of-the-art facility in New Delhi, as part of the company’s long-term vision for India. Rohde & Schwarz, is making significant strides in India with recent expansions and strategic initiatives, from fortifying its facilities to venturing direct entry into Defence projects. With a global to-local approach, Rohde & Schwarz emphasises increasing local value additions by production, Research & Development, Application Development, customization for India-specific needs, and system integration, all well fitting into the ‘Make in India’ initiative.

Rohde & Schwarz India, the Indian subsidiary of the German-based, global technology company Rohde & Schwarz, celebrated the grand opening of its new facility located at Mohan Cooperative Industrial Estate, in New Delhi.

While inaugurating the new facility, Dr. Alexander Orellano, Executive Vice President, Technology Systems of Rohde & Schwarz, said: “We are proud to expand our presence in New Delhi. The new facility marks a significant step forward in the company’s commitment to enhancing local production, software development, system integration, and assembly in line with the Indian government’s objective of ‘Make in India’. For Rohde & Schwarz, India is not merely a growth market but a vital component of our global strategy”.

Yatish Mohan, Managing Director of Rohde & Schwarz India, expressed his pride in the company’s contribution to India’s defense, aviation, and surveillance capabilities, stating, “As a leading ecosystem partner in the Indian technology industry, Rohde & Schwarz India is proud to contribute to the nation’s defense, aviation, and surveillance capabilities. Our focus on innovation, collaboration, and local value addition underscores our commitment to driving positive change and shaping the future of India’s technological landscape. The new facility aims to further enhance these capabilities and serve as a center of competence for surveillance solutions”.

Rohde & Schwarz India has been a pivotal ecosystem partner in India’s technology industry, catering to critical sectors such as defense, civil aviation, and surveillance. The company plays a significant role in providing cutting-edge technological solutions and services to key sectors like defense, civil aviation, surveillance, and more. Highlighting Rohde & Schwarz India’s successful implementations, such as the deployment of state-of-the-art Milli Meter Wave Full Body Scanners at Bengaluru airport, the company has been at the forefront of innovation in defense and aviation, developing advanced systems and solutions tailored to the unique requirements of these sectors.

The post Rohde & Schwarz expands footprint in India by opening a futuristic facility in Delhi appeared first on ELE Times.

The writing process has undergone a significant transformation in the age of artificial intelligence (AI). Students and professionals now have access to many AI-powered tools and services designed to assist them with their writing tasks, including essays. Two prominent options are AI essay writing tools and traditional essay writing services. In this article, we’ll delve into the merits and drawbacks of each approach, helping you make an informed decision on which path to pursue.

AI essay writing tools are software applications that leverage advanced natural language processing (NLP) and machine learning algorithms to generate original content based on user inputs. These tools have become increasingly sophisticated, capable of producing coherent and well-structured essays on a wide range of topics.

1. Cost-effective: Many AI essay writing tools offer affordable subscription plans or one-time purchase options, making them a budget-friendly choice compared to traditional essay writing services.

2. Convenience: With AI essay writing tools, users can generate content conveniently without adhering to strict deadlines or waiting for a human writer’s availability.

3. Learning Opportunity: By interacting with these tools, users can gain insights into effective writing techniques, structure, and argumentation, potentially enhancing their writing skills.

4. Plagiarism-free: AI essay writing tools generate original content, reducing the risk of plagiarism, which is a common concern with traditional essay writing services.

1. Quality Variability: The quality of the output produced by AI essay writing tools can vary, depending on the sophistication of the underlying algorithms and the user’s input.

2. Limited Customization: While AI tools can generate well-structured essays, they may struggle to capture nuanced writing styles or incorporate specific perspectives or viewpoints.

3. Ethical Considerations: There is an ongoing debate surrounding the ethical implications of using AI-generated content, particularly in academic settings, where original thought and critical thinking are highly valued.

4. Lack of Original Ideas and Creativity: AI essay writing tools are primarily designed to generate content based on existing data and patterns. They may struggle to produce truly original ideas, insights, or creative expressions that are essential for high-quality academic or professional writing.

Essay writing services provide a more traditional approach. Human writers with expertise in various subjects are hired to craft custom essays based on clients’ requirements.

1. Personalized Approach: Human writers can tailor essays to specific requirements, writing styles, and academic levels, ensuring a high degree of customization.

2. Subject Matter Expertise: Essay writing services often employ writers with specialized knowledge in various academic disciplines, ensuring a deep understanding of the subject matter.

3. Quality Assurance: Reputable essay writing services typically have quality control measures in place, such as proofreading and editing processes, to ensure the delivery of high-quality work.

4. Confidentiality: Many essay writing services prioritize client confidentiality, protecting the privacy of their customers.

1. Cost: Essay writing services can be more expensive than AI essay writing tools, especially for longer or more complex assignments.

2. Plagiarism Risks: While reputable services strive to deliver original work, there is always a risk of plagiarism, particularly with less scrupulous providers.

3. Turnaround Time: Depending on the complexity of the assignment and the writer’s workload, there may be delays in receiving the completed essay, potentially causing missed deadlines.

4. Lack of Learning Opportunities: By outsourcing the writing process entirely, students may miss opportunities to develop their writing skills and critical thinking abilities.

While both AI essay writing tools and essay writing services have their strengths and weaknesses, a balanced approach that combines the two can offer the best of both worlds. One such example is the use of an AI checker for essays. These tools can help identify potential AI-generated content, allowing human writers to review and refine the output, ensuring originality and adherence to academic standards.

Ultimately, the choice between AI essay writing tools and essay writing services depends on your needs, budget, and ethical considerations. AI essay writing tools offer convenience and affordability, while essay writing services provide personalized attention and subject matter expertise. By understanding the pros and cons of each approach, you can make an informed decision that aligns with your goals and priorities, whether it’s academic success, professional development, or personal growth.

The post Comparing AI Essay Writing Tools & Essay Writing Services: Which is the Better Choice? appeared first on Electronics Lovers ~ Technology We Love.

Infineon Technologies AG continued to expand its leading market position in automotive semiconductors in 2023. According to the latest research by TechInsights[1], the global automotive semiconductor market grew by 16.5 per cent in 2023, reaching a new record size of US$69.2 billion. Infineon’s overall market share increased by one percentage point, from nearly 13 per cent in 2022 to about 14 per cent in 2023, solidifying the company’s position as the global leader in the automotive semiconductor market. Infineon’s semiconductors are essential in serving all automotive key applications like driver assist and safety systems, powertrain and battery management, comfort, infotainment and security.

According to TechInsights, Infineon has increased its market share in all regions and remained market leader in South Korea and China. In addition, Infineon has made significant gains in the Japanese automotive semiconductor market. Infineon has strengthened its strong European presence as the second-largest player, as well as its top-three position in North America.

“We are very proud that we have expanded our position as the leading automotive semiconductor supplier. This great success is based on our product innovation and system competence that add value to our customers’ solutions,” said Peter Schiefer, President of the Automotive Division at Infineon. “We also see this achievement as motivation, since our automotive semiconductors are the basis for the future of mobility, making cars clean, safe and smart.”

“Infineon maintained the top spot in the TechInsights automotive semiconductor 2023 vendor market share rankings with nearly 14 per cent market share,” said Asif Anwar, Executive Director of Automotive End Market Research at TechInsights. “The company’s automotive semiconductor revenues grew over 26 per cent year-on-year, allowing the company to stretch its lead over its second and third place rivals by four percentage points.”

Global number one in automotive microcontrollers

A major driver of Infineon’s performance was strong automotive microcontroller (MCU) sales. For the first time, Infineon has reached the world’s number one position in this market. The company’s sales in the automotive microcontroller segment increased by nearly 44 per cent compared to 2022, resulting in a 2023 market share of about 29 per cent worldwide.

Microcontrollers are key components in the automotive industry, controlling and monitoring a wide variety of systems in the automobile such as electric powertrain, electric-electronic (E/E) architecture, advanced driver assistance systems (ADAS) and automated driving, radar and chassis. Infineon’s AURIX flagship microcontroller family and the TRAVEO microcontroller family are the main contributors to this success, driving the transition in the automotive industry towards autonomous, connected and electrified vehicles. The families combine power and performance enhancements with the latest trends in the fields of virtualization, AI-based modeling, functional safety, cybersecurity and network functions. They are paving the way for new E/E architectures as well as the next generation of software-defined vehicles.

[1] TechInsights: Automotive Semiconductor Vendor Market Shares. April 2024

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