Microelectronics world news

Available With C0G (NP0) and X7R Dielectrics, Devices Feature Voltages to 3000 VDC and Capacitance From 1.5 pF to 100 nF in Seven Case Sizes From 1206 to 2225

Vishay Intertechnology, Inc. today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high voltage commercial applications. Offered in seven case sizes ranging from 1206 to 2225, VJ….W1HV High Voltage MLCC Commercial Series devices extend the capacitance values of the company’s existing high voltage MLCCs with the ultra stable C0G (NP0) dielectric and are also available with the X7R dielectric for even higher capacitance.

The devices released today are manufactured in a base metal electrode (BME) system with a dry sheet technology process to reduce costs for a wide range of high voltage applications. The MLCCs will be used as input filtering, output filtering, and snubber capacitors for alternative and conventional energy generation, distribution, metering, management, and storage; industrial automation, motor drives, power tools, and welding equipment; consumer appliances; telecom mobile and fixed infrastructure; and medical instrumentation.

VJ….W1HV High Voltage MLCC Commercial Series devices with the C0G (NP0) dielectric offer high voltages to 3000 VDC, capacitance values from 1.5 pF to 82 nF, and a temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from -55 °C to +125 °C. X7R devices provide capacitance from 100 pF to 100 nF, voltages to 2000 VDC, and TCC of ± 15 % from -55 °C to +125 °C.

The MLCCs feature a nickel barrier with 100 % tin terminations and are available with polymer terminations for additional protection against board flexure damage. The devices are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

Dielectric	Case code	Maximum voltage (V)	Capacitance
			Minimum	Maximum
C0G (NP0)	1206	3000	1.5 pF	10 nF
	1210	3000	10 pF	10 nF
	1808	3000	2.2 pF	3.3 nF
	1812	3000	10 pF	22 nF
	1825	3000	10 pF	39 nF
	2220	2000	10 pF	47 nF
	2225	2000	10 pF	82 nF
X7R	1206	2000	100 pF	1.2 nF
	1210	2000	100 pF	1.2 nF
	1808	2000	150 pF	1.8 nF
	1812	2000	270 pF	1.8 nF
	1825	1000	1.0 nF	100 nF
	2220	1000	1.0 nF	1.8 nF
	2225	1000	1.0 nF	1.8 nF

Samples and production quantities of the VJ….W1HV High Voltage MLCC Commercial Series devices are available now, with lead times of 18 weeks.

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The quantum low-density parity check (QLDPC) codes, the “holy grail” of quantum error correction research and development for 30 years, have a breakthrough, according to the Vancouver-based Photonic Inc. These codes use fewer quantum bits (qubits) than traditional surface code approaches. The company’s chief quantum officer, Stephanie Simmons, sat with EE Times to explain how this low-overhead error correction technology works to realize the promised exponential speedups in quantum computing.

Read the full story at EDN’s sister publication EE Times.

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The post The QLDPC code breakthrough in quantum error correction appeared first on EDN.

A game-changing, ₹501 Cr (INR) startup disrupting the $800 billion global energy storage market

The energy storage industry in India has witnessed a game-changing moment with the official launch of Cellvest Energy Private Ltd., a next-generation energy startup that is redefining businesses access to battery storage solutions. The high-profile event, held at Conrad Hotel, Bangalore, brought together industry leaders, policymakers, and Global energy experts to discuss the future of sustainable power.

With a market valuation of ₹501 Cr, Cellvest is addressing some of the most pressing challenges in the energy sector, including high capital costs, short battery lifespans, and limited access to cutting-edge storage technology. Unlike traditional models that require businesses to make heavy upfront investments, Cellvest is pioneering a flexible financing model, offering options to rent, lease-to-own, or purchase battery solutions outright, making sustainable energy more accessible than ever before.

“The energy transition cannot happen if storage remains financially out of reach for businesses. At Cellvest, we are eliminating this barrier by providing companies with a smarter way to adopt green energy—through financing models that fit their needs, whether it’s rental, lease-to-own, or purchase,” said Vijay Kallat, Managing Director of Cellvest Energy Private Ltd. “Our solutions are designed to be affordable, scalable, and long-lasting, ensuring that businesses never have to compromise on sustainability due to cost.”

During the launch event, Cellvest’s leadership team spoke about the next-generation battery technology, which lasts up to five times longer than conventional storage solutions, and can be deployed at an ultra-affordable USD 10-15 per kW. The company also shared insights into its global expansion strategy, highlighting partnerships and its commitment to scaling operations globally.

“For too long, businesses have had to choose between sustainability and affordability. With Cellvest, they no longer have to make that choice. By combining best-in-class battery technology with innovative financing, we are making clean energy solutions viable for industries of all sizes,” added Krishnadeep Menon, Director of Cellvest Energy Private Ltd.

The event concluded with the agreement between Cellvest Energy and Cellex Battery Systems reinforcing Cellvest’s position as a disruptor in the $800 billion global energy storage market. The company is now actively working on projects with industries across the globe further strengthening its vision of making sustainable power truly accessible for all.

The post Cellvest Energy: Powering a Global Green Energy Revolution with Next-Gen Battery Solutions & Fin-Tech Innovation appeared first on ELE Times.

u-blox, a leading global supplier of GNSS modules, and Rohde & Schwarz have successfully validated u- blox’s latest automotive GNSS module in accordance with the recently published Chinese GB/T test requirement for automotive on-board GNSS positioning systems using an automated R&S SMBV100B based GNSS simulator solution. This cutting-edge solution will be demonstrated at Mobile World Congress 2025 in Barcelona.

GNSS (Global Navigation Satellite System) plays an increasingly important role in the automotive industry to enable new infotainment and autonomous driving applications. To ensure the required quality of on-board automotive GNSS systems, the Chinese National Automotive Standardization Technical Committee created the “requirements and test methods for on-board positioning system” guidelines. Rohde & Schwarz is proud to have contributed to the drafting of the standard. These requirements were released on November 28, 2024 with an “implementation date“ of June 2025. While the test specification is currently only recommended, it is expected to become mandatory within the upcoming Chinese eCall standard.

The automotive GNSS standard requires on-board positioning systems to pass a range of requirements such for tracking sensitivity, acquisition sensitivity, time to first fix, location accuracy and velocity accuracy, in different multi-constellation and BeiDou-only modes. The standard also defines special events such as week number rollover tests, leap second handling, radio frequency interference and unexpected pseudo range errors to test the overall robustness of the positioning system. In order to pass the test cases, the GNSS receiver must be able to process signals from two frequency bands simultaneously.

Many of the tests cannot be performed in a real-world environment with live GNSS signals since they are difficult to implement, time-consuming, costly and impossible to reproduce. This is where the Rohde & Schwarz solution becomes essential. These tests can be performed with R&S SMBV100B GNSS simulator in the lab under controlled and repeatable conditions. It provides advanced simulation capabilities for configuring realistic and complex, yet repeatable GNSS scenarios that can be run under controlled conditions. Together with the R&S CMWrun sequencer software, a R&S NGC101 power supply and the R&S SMBVB-K364 software option, the R&S SMBV100B becomes an automated test solution executing the test sequence and providing a pass/fail result as well as test reports. The test solution is of special interest to GNSS silicon suppliers, GNSS module providers, Tier1 developers of Telematic Control Units (T-Box in China) and infotainment systems certification companies and vehicle OEMs selling to the Chinese market.

For the automotive ecosystem to validate compliance to this new test specification in an automated, standards-compliant, repeatable and timely manner, cooperation between suppliers in this industry becomes increasingly important. To this effect Rohde & Schwarz is pleased to co-operate with u-blox. Gerald Tietscher, Vice President Signal Generators remarked: “We are delighted to collaborate with u-blox to enable the automotive positioning ecosystem with a robust, standard compliance and automated solution to validate their products against the emerging Chinese GNSS standard.”

This partnership enabled pre-compliance tests across the u-blox portfolio of automotive GNSS receivers, including the ZED-F9L and ZED-F9K, as well as the upcoming u-blox 20 product family. Andreas Thiel, Head of Business Units, and Co-founder at u-blox AG, remarked: “We are pleased that Rohde & Schwarz selected u-blox and our EVK-F9DR as reference kit to showcase this new automated test solution. With R&S advanced testing tools, automotive companies targeting the Chinese market can seamlessly validate their u- blox-based on-board positioning systems against GB/T 45068 and other standards.”

The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.

The post Rohde & Schwarz and u-blox validate module compliance with the new Chinese GNSS automotive specification GB/T 45086.1-2024 appeared first on ELE Times.

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Penn State University aims to enhance its R&D capabilities in next-generation semiconductor technology thanks to $4.3m in infrastructure funding and in-kind support through its membership of the Midwest Microelectronics Consortium (MMEC), of which Penn State is a charter member...

Mining firm Nimy Resources Ltd of Perth, Western Australia says that it is on track to establish a maiden JORC (Australasian Joint Ore Reserves Committee) resource at its Western Australia gallium discovery after raising $1.15m from professional and otherwise exempt investors...

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How much needless stuff is designed into modern products? How much do we suffer when we’re trying to use software products sometimes described as “bloatware”? What was the origin of the term “bells and whistles” as an attribute of products that are overly complex?

Back in 1940, a then-new drawbridge was opened for service along the Belt Parkway in Brooklyn, NY. It was called the Mill Basin Bridge.

That structure has since been replaced by a higher bridge with enough vertical clearance above the underlying waterway so that boat traffic can pass in and out unimpeded, but back then, the roadway of that 1940 bridge had to be repeatedly raised and lowered as boat traffic came and went underneath. Figure 1 is a screenshot of a roadway section in its up position.

Figure 1 A roadway section of the Mill Basin Bridge in the up position where the attendant must deploy two large steel barriers that stop traffic so that they can raise the roadway.

There was an observation tower at that bridge in which a bridge attendant would be stationed. It was his job to get that roadway raised and lowered when needed and to halt automobile traffic when the roadway was up. Part of his task was to operate two huge steel barriers that would cross the roadway in both directions when the roadway was impassable. Those barriers were multi-ton behemoths designed to ensure that no car was ever going to traverse a raised roadbed and fall into the water below.

One day, as a water vessel needed to get by, the attendant activated those huge barriers to go into position, but as he did so, he spotted a speeding motorist coming along who was not going to be able to stop in time before crashing into the barrier ahead. The attendant reversed the barrier control motors but because it looked like the barrier would not be out of the way in time, he left his post in the tower and tried to physically push that barrier by hand away from the car’s path. He did not succeed, the oncoming car crashed into the barrier and that attendant was killed.

My father was one of the emergency crew who responded to that disaster. He told me all about it the following day. Dad was the foreman of that part of the NYC Department of Bridges which serviced that bridge. There had been many other incidents of this ilk as well involving those same barriers and when they occurred, our house telephone would ring at any time of day or night and my father would have to go off to work as a result.

Years later, those steel barriers were removed and replaced with slender wooden crossing gates painted with red and white stripes. Those stripes could be seen by oncoming motorists from quite far away so no car ever went up a raised roadbed. Yes, the painted gates may have been now and then smithereened, but no repeat of the above tragedy ever took place, at least so far as I was ever told.

The overdesign aspect of all this is that those immense steel barriers were not only unnecessary, they were a danger in their own right. Putting them in was a major cost item with negative impact (no pun intended) on the drawbridge’s operating history.

Those barriers were a tragic example of overdesign.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Overdesign appeared first on EDN.

Clas-SiC Wafer Fab Ltd of Lochgelly, Fife, Scotland — which was founded in 2017 and the UK’s only commercial wafer fabrication facility dedicated to silicon carbide (SiC) — has secured a £12m inward investment from Archean Chemical Industries of Chennai, India. In return for the equity investment, Archean will gain representation on Clas-SiC’s board of directors, with Ranjit Pendurthi appointed as a director...

Silanna UV of Brisbane, Australia – which provides far-UVC light sources for water quality sensors, gas sensors, disinfection, and HPLC (high-performance liquid chromatography) applications – has launched the NozzleShield UV water dispenser disinfection application. The technology uses 235nm-wavelength UV-C LEDs to rapidly disinfect water dispensers, effectively eliminating bacteria and virus buildup. This ensures that water dispensers remain free from harmful bacteria, benefiting companies aiming to enhance their product features...

India’s 3D printing industry has experienced significant growth, driven by advancements in additive manufacturing and a surge in demand across various sectors. This article highlights ten leading startups that are at the forefront of this transformation, offering innovative solutions that enhance efficiency and productivity.

1. Imaginarium

Based in Mumbai, Imaginarium stands as India’s largest 3D printing and rapid prototyping company. Serving industries such as jewelry, automotive, and healthcare, they offer a comprehensive suite of services, including design validation, prototyping, and batch production. Their state-of-the-art infrastructure and technical expertise make them a preferred partner for businesses seeking innovative solutions.

2. Divide By Zero Technologies

Located in Maharashtra, Divide By Zero Technologies is a leading 3D printer manufacturer catering to small and medium enterprises in India. They aim to make 3D printers an affordable and reliable choice for professionals and businesses that otherwise may not have access to them. Their product lineup includes models like Accucraft i250+, Aion 500 MK2, Aeqon 400 V3, and Alpha 500. The company’s patented Advanced Fusion Plastic Modeling (AFPM) technology ensures consistent quality and efficiency, making their printers suitable for various industrial applications.

3. Mekuva Technologies (POD3D)

Based in Hyderabad, Mekuva Technologies specializes in manufacturing efficient and affordable 3D printers for the manufacturing and product development sectors. Their AKAR series printers, including models like AKAR 300 Pro and AKAR 600 Basic, cater to diverse industrial needs. Beyond manufacturing, they offer professional 3D design, printing, and scanning services, as well as conventional manufacturing services like CNC machining, sheet metal operations, and injection moulding. Their commitment to research and development positions them as a one-stop solution for additive manufacturing.

4. IMIK Technologies

Operating from Tamil Nadu, IMIK Technologies is a 3D printing supplier established in 2007. They offer a range of products, including 3D printers, 3D scanners, embedded automation solutions, and prototyping services. Their offerings cater to various fields such as defense, textile, robotics, agriculture, and medicine, providing solutions suitable for educational, industrial, and personal use. Their team of experts also assists in developing 3D prototypes, ensuring clients receive tailored solutions for their specific needs.

5. Printlay

Located in Tamil Nadu, Printlay is a 3D printing service provider established in 2015. They specialize in offering 3D printing and scanning services, catering to various industries and individual enthusiasts. Their expertise ensures high-quality outputs, making them a reliable partner for prototyping and production needs.

6. Make3D

Make3D is a prominent 3D printing company in India, offering a range of 3D printers, filaments, and crash courses. Their Pratham series 3D printers are designed to cater to hobbyists, educational institutions, and professionals, providing accessible and reliable 3D printing solutions.

7. Fabheads Automation

Fabheads Automation is an innovative startup specializing in composite 3D printing technology. They focus on manufacturing continuous fiber 3D printers and components, catering to industries like aerospace, automotive, and defense. Their advanced technology enables the production of high-strength, lightweight components, positioning them as pioneers in composite additive manufacturing.

8. Exobot Dynamics

Exobot Dynamics is a cutting-edge startup focusing on the development of advanced 3D printing technologies and materials. They provide innovative solutions for rapid prototyping and custom manufacturing, serving various industries with their state-of-the-art 3D printing services.

9. Ekak Innovations

Ekak Innovations is a forward-thinking company specializing in 3D printing and design services. They offer customized solutions for product development, prototyping, and small-scale manufacturing, utilizing advanced 3D printing technologies to meet the unique needs of their clients.

10. Axio Electronics

Axio Electronics is a dynamic startup providing comprehensive 3D printing services, including design, prototyping, and production. They cater to a wide range of industries, delivering high-quality 3D printed components and assemblies, and are known for their commitment to innovation and customer satisfaction.

These ten startups exemplify India’s dynamic and rapidly evolving 3D printing landscape. Through continuous innovation and a commitment to addressing industry-specific challenges, they are contributing significantly to the advancement of additive manufacturing, both within the country and on the global stage.

The post Top 10 3D Printing Startups in India appeared first on ELE Times.

India’s industrial robotics sector is undergoing a rapid transformation, fueled by advancements in automation, artificial intelligence, and Industry 5.0 technologies. As manufacturing, logistics, and warehousing industries increasingly adopt robotic solutions to improve efficiency and precision, the demand for cutting-edge robotics companies has surged. From collaborative robots (cobots) designed for human-robot interaction to autonomous mobile robots (AMRs) optimizing supply chains, Indian robotics firms are at the forefront of innovation.

This article highlights ten of the top industrial robotics companies in India, each making significant contributions to automation, smart manufacturing, and intelligent robotics.

1. Addverb Technologies

Headquartered in Noida, Addverb Technologies specializes in automation solutions for warehouses and distribution centers. Their product portfolio includes autonomous mobile robots, sorting systems, and the recently introduced collaborative robot, ‘Syncro,’ designed to assist small and medium-sized enterprises (SMEs) in automating tasks. Addverb’s commitment to innovation has positioned them as a key player in the global robotics landscape.

2. CynLr (Cybernetics Laboratory)

Based in Bengaluru, CynLr focuses on developing visual object intelligence platforms that enable industrial robotic arms to perceive, understand, and manipulate objects in unstructured environments. Their technology enhances the adaptability of robots in complex tasks, making automation more versatile and efficient.

3. DiFACTO Robotics and Automation

Operating from Bengaluru, DiFACTO Robotics offers comprehensive engineering services related to robotics and automation. Their expertise spans offline programming, robot simulation, and the design of automation systems. They provide solutions for various applications, including automotive body-in-white (BIW) weld lines and robotic systems for sealing and material handling.

4. Genrobotics

Genrobotics is renowned for addressing critical social challenges through robotics. They developed the ‘Bandicoot’ robot, designed for cleaning sewer lines, thereby eliminating the hazardous practice of manual scavenging. This innovation has significantly improved sanitation and safety standards in India.

5. GreyOrange

With a focus on warehouse automation, GreyOrange offers AI-driven robotic systems that optimize order fulfillment processes. Their solutions, including autonomous mobile robots and sortation systems, are widely adopted in e-commerce and logistics sectors to enhance operational efficiency.

6. Gridbots Technologies

Ahmedabad-based Gridbots specializes in high-performance robotic systems equipped with advanced sensors and imaging technologies. Their robots are utilized for inspection, maintenance, and surveillance tasks across industries such as oil and gas, power, and infrastructure, ensuring precision and safety in operations.

7. Hi-Tech Robotics Systemz (Novus Flow)

Hi-Tech Robotics Systemz, now operating as Novus Flow, is a leader in autonomous mobile robots (AMRs) for material transportation and warehouse automation. Their solutions are designed to streamline logistics and reduce dependency on manual labor, thereby increasing productivity.

8. Systemantics

Systemantics focuses on developing intelligent robotic solutions for industrial automation. Their ‘ASYSTR’ series of collaborative robots (cobots) are designed to work alongside humans, handling tasks such as pick-and-place operations, machine tending, and assembly line automation. These cobots enhance manufacturing efficiency and flexibility.

9. TAL Manufacturing Solutions

A subsidiary of Tata Motors, TAL Manufacturing Solutions specializes in industrial robots for applications in automotive, aerospace, and general manufacturing. Their robotic solutions are engineered to improve precision, quality, and productivity in production processes.

10. Wipro PARI Robotics

Wipro PARI Robotics, a collaboration between Wipro Ltd and Precision Automation and Robotics India (PARI), offers robotic automation solutions across various industries. Their expertise includes designing and implementing robotic systems that enhance operational efficiency and meet diverse industrial needs.

These ten companies exemplify India’s dynamic and rapidly evolving industrial robotics landscape. Through continuous innovation and a commitment to addressing industry-specific challenges, they are contributing significantly to the advancement of automation and robotics, both within the country and on the global stage

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Multi Line Assist simplifies the THT assembly process and recognises assembly errors in real time

Despite automation, the assembly of PCBs with components is still partly manual work. Small batches and customised board designs require manual skills, especially for THT components. In order to be able to work quickly and error-free, GOEPEL electronic has developed the Multi Line Assist, an AOI module that guides the operator through the assembly process and checks whether the work was carried out correctly after each assembly. The fully automated workstation guides the operator step by step through the placement process. For this purpose, placement information is projected directly into the operator’s field of vision on the placement table. After each individual placement, the result is checked in real time, errors are recognised immediately and can be corrected in good time before soldering. The integrated PILOT software recognises and reports deviations during placement and indicates the error to the operator via a projected marking directly on the assembly.

The Multi Line Assist is equipped with a powerful AOI module with a 47 megapixel image capture unit and a flexible LED lighting system. This guarantees the highest image quality and detail resolution with an inspection area of up to 660 mm x 450 mm. Three resolution variants with three different image field sizes are available. The camera module is able to safely and reliably check the presence, position and colour of THT components. In addition, labelled or lasered 2D codes or barcodes can be read and texts recognised. The combination of a guided placement process and live inspection after each placement ensures professional THT assembly quality. An inspection speed of up to 800 cm²/s is achieved. The entire PCB can be inspected with a single ‘snap’.

A powerful laser projector has been integrated into the Multi Line Assist for guided placement assistance. This makes it possible to intuitively support the manual process by displaying placement information (chute/box, position, component type) directly in the operator’s field of vision. This prevents placement errors and achieves reproducible results, even with a large variety of products. In addition to displaying information during the placement process, detected errors are displayed directly on the assembly by laser. This is an advantage if there is a large variety of products or if new or changing personnel often need to be trained. During inspection, the Multi Line Assist checks quality factors such as the presence of components, correct positioning of components and connectors, polarity, labelling (OCR), position and defect detection and completeness.

A foot switch is used to start a new inspection or repeat the final inspection for maximum ease of use in the assembly process. Multi Line Assist can also be integrated into familiar, existing assembly tables as an integration module. As an option, GOEPEL electronic also offers a height-adjustable placement table with PCB or product carrier holder and integrated Multi Line Assist module. Multi Line Assist can be integrated into existing MES systems and traceability solutions for seamless traceability and logging of the test process.

Multi Line Assist is part of the new Multi Line product family from GOEPEL electronic. With these systems, the manufacturer provides a platform of inspection systems that support the entire production process. In addition to the modular hardware, the Multi Line series is characterised by standardised, powerful operating and evaluation software for all applications and across all devices. This reduces training and programming costs, enabling flexible and optimised employee scheduling.

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Aeluma Inc of Goleta, CA, USA – which uses compound semiconductor materials on large-diameter substrates to develop technologies for mobile, automotive, AI, defense & aerospace, communication and quantum computing – has appointed finance executive Mike Byron to its board of directors...

Murata and Rohde & Schwarz have developed the world’s first Voice over Narrowband Non-Terrestrial Network (NB-NTN) testbed. To be presented at Mobile World Congress 2025 in Barcelona, this innovative demonstration marks a significant leap in 3GPP based satellite connectivity. The resulting push-to-talk like application will enhance safety and communication capabilities in areas without terrestrial network access.

Murata and Rohde & Schwarz have collaborated to introduce the world’s first testbed for Voice over Narrowband Non-Terrestrial Network (NB-NTN), presented at Mobile World Congress 2025 in Barcelona. With this demonstration, the two companies set a new standard for satellite-based communications, paving the way for voice capabilities even in the most bandwidth-constrained environments.

The innovative testbed utilizes the CMW500 wideband radio communication tester from Rohde & Schwarz as a GEO/GSO satellite eNB emulator, along with Murata’s Type1SC Cat.M1/NB-IoT/NB-NTN module featuring the Sony’s Altair Chip ALT1250. It also employs a VoIP client application developed by Rohde & Schwarz, which uses codecs that operate at ultra-low bitrates. This technology addresses critical communication needs where traditional networks are inadequate. The demonstrator opens the door for push-to-talk-like NB-NTN applications, making it particularly suitable for emergency situations, disaster response, remote areas, and maritime operations.

With the rapid adoption of NB-NTN chipsets in smartphones, wearables, and automotive systems, this technology significantly enhances ubiquitous connectivity solutions. The demonstration highlights the potential of enhanced Narrowband NTN service with push-to-talk voice in addition to emergency SOS, and SMS. The partnership between Murata and Rohde & Schwarz reflects their joint commitment to advancing NTN related use cases.

Visitors to MWC 2025 can experience this milestone demonstration live at the Murata booth 5D66 in hall 5 of the Fira Gran Via in Barcelona from March 3 to 6, 2025. For further information, please contact your local Murata sales representative or go to https://www.murata.com.

The post Murata and Rohde & Schwarz present the world’s first Voice over Narrowband NTN testbed at MWC Barcelona 2025 appeared first on ELE Times.

Finally took the plunge and started to solder NOT, AND, and OR gates onto perfboard. Breadboarded an XOR this evening which I got working without frying anything too! Used 2N7000s for all of these (please don’t attack me for forgetting gate resistors). I’m super excited to start expanding into more complex projects soon!.. submitted by /u/Diligent_Ad282 [link] [comments]

Introduction

Among all power factor correction (PFC) topologies, totem-pole bridgeless PFC provides the best efficiency; therefore, it is widely used in servers and data centers. However, closing the current control loop of a continuous conduction mode (CCM) totem-pole bridgeless PFC is not as straightforward as it is for a traditional PFC. A traditional PFC operating in CCM employs an average current-mode controller [1], as shown in Figure 1, where VREF is the voltage-loop reference, VOUT is the sensed PFC output voltage, Gv is the voltage loop, VIN is the sensed PFC input voltage, IREF is the current-loop reference, IIN is the sensed PFC inductor current, GI is current loop, and d is the duty ratio of pulse-width modulation (PWM). Since the bridge rectifier is used in a traditional PFC, all these values are positive, and current feedback signal IIN is the rectified input current signal.

Figure 1 Average current-mode controller for PFC where all the parameters listed have positive values and IIN is the rectified input current signal. Source: Texas Instruments

New feedback signal

Since the inductor current in the totem-pole bridgeless PFC is bidirectional, the current-sense method used in traditional PFC will not work. Instead, you will need a bidirectional current sensor such as Hall-effect sensor to sense the bidirectional inductor current and provide a feedback signal to the control loop.

The output of the Hall-effect sensor will not 100% match the sensed current, though. For example, if the sensed current is a sine wave, then the output of the Hall-effect sensor is a sine wave with a DC offset, as shown in Figure 2. Thus, you can’t use it as the feedback signal in the current-mode controller shown in Figure 1, and you will have to modify the controller to accommodate this new feedback signal. In this power tip, I’ll describe three ways to close the current control loop with this new feedback signal.

Figure 2 Totem-pole bridgeless PFC and its current-sense signal showing that the Hall-effect sensor output will not 100% match the sensed current. Source: Texas Instruments

Method 1: Controllers without a negative loop reference

Some digital controllers, such as the UCD3138 from Texas Instruments (TI), use a hardware state machine to implement the control loop; therefore, all of the input signals to the state machine must be greater or equal to zero. In such cases, follow these steps to close the current control loop:

1. Sense the AC line and AC neutral voltage through two analog-to-digital-converters (ADCs) separately.
2. Use firmware to rectify the sensed VAC signal, as shown in Equation 1 and Figure 3.

Figure 3 Using the firmware shown in Equation 1 to rectify the sensed input voltage VAC. Source: Texas Instruments

3. Calculate the sinusoidal reference, VSINE, using the same method as when calculating IREF in traditional PFC, as shown in Equation 2 and Figure 4.

Figure 4 Calculating a sinusoidal reference (VSINE) using the same method as when calculating IREF in traditional PFC. Source: Texas Instruments

4. Use a Hall-effect sensor output as the current feedback signal IIN directly (Equation 3).

5. During the positive AC cycle, if you compare the shape of VSINE and the Hall-effect sensor output, they have the same shape. The only difference is the DC offset. Use Equation 4 to calculate the current-loop reference, IREF.

6. The control loop has standard negative feedback control. Use Equation 5 to calculate the error that goes to the control loop:

7. During the negative AC cycle, if you compare the shape of VSINE and the Hall-effect sensor output, the difference is not only the DC offset; their shapes are opposite as well. Use Equation 6 to calculate the current-loop reference, IREF.

8. During the negative AC cycle, the higher the inductor current, the lower the value of the Hall-effect sensor output. The control loop needs to change from negative feedback to positive feedback. Use Equation 7 to calculate the error going to the control loop.

Method 2: A pure firmware-based controller

For a pure firmware-based digital controller such as the TI C2000 microcontroller, the control loop is implemented with firmware, which means that the internal calculation parameters can be positive or negative. In such cases, follow these steps to close the current control loop:

1. Sense the AC line and AC neutral voltage through two ADCs. Then use the line voltage to subtract the neutral voltage to obtain VIN, as shown in Equation 8 and Figure 5.

Figure 5 Calculating VIN after using the line voltage to subtract the neutral voltage. Source: Texas Instruments

2. Calculate the sinusoidal current-loop reference, IREF, using the same method as in traditional PFC, as shown in Equation 9 and Figure 6.

Figure 6 Calculating IREF using the same method as the traditional PFC. Source: Texas Instruments

3. If you compare the shape of IREF and the Hall-effect sensor output, they have the same shape; the only difference is the DC offset. Use Equation 10 to calculate the input current feedback signal, IIN. Figure 7 shows the waveform.

Figure 7 The waveform of the Hall sensor output and DC offset to calculate IIN. Source: Texas Instruments

4. During the positive AC cycle, the control loop has standard negative feedback control. Use Equation 11 to calculate the error going to the control loop:

5. During the negative AC cycle, the higher the inductor current, the lower the value of the Hall-effect sensor output; thus, the control loop needs to change from negative feedback to positive feedback. Use Equation 12 to calculate the error going to the control loop.

Method 3: Duty-ratio feedforward control

Total harmonic distortion (THD) requirements are becoming stricter, especially in server and data-center applications. Reducing THD necessitates pushing the control-loop bandwidth higher and higher. High bandwidths reduce phase margins, resulting in loop instability. The limited PFC switching frequency also prevents bandwidths from going very high. To solve this problem, you can add a precalculated duty cycle to the control loop to generate PWM; this is called duty-ratio feedforward control (dFF) [2], [3].

For a boost topology operating in CCM mode, Equation 13 calculates dFF as:

This duty-ratio pattern effectively produces a voltage across the switch whose average over a switching cycle is equal to the rectified input voltage. A regular current-loop compensator changes the duty ratio around this calculated duty-ratio pattern. Since the impedance of the boost inductor at the line frequency is very low, a small variation in the duty ratio produces enough voltage across the inductor to generate the required sinusoidal current waveform so that the current-loop compensator does not need to have a high bandwidth.

Figure 8 depicts the resulting control scheme. Adding the calculated dFF to the traditional average current-mode control output, dI, results in the final duty ratio, d, used to generate the PWM waveform to control PFC.

Figure 8 Duty-ratio feedforward control for PFC where adding the calculated dFF to the traditional average current-mode control output, dI, results in the final duty ratio, d, used to generate the PWM waveform to control PFC. Source: Texas Instruments

To leverage the advantages of dFF in a totem-pole bridgeless PFC, follow these steps to close the current loop:

1. Follow steps 1, 2, 3, 4 and 5 from Method 2.
2. Calculate dFF, as shown in Equation 14. Since VIN is a sine wave and its value is negative in a negative AC cycle, use its absolute value for the calculation.

3. Use Equation 15 to add dFF to the GI output, dI, and obtain the final d.

You can also use dFF control for a hardware state machine-based controller; for details, see reference [2].

Closing the current loop

Closing the current loop of a totem-pole bridgeless PFC is not as straightforward as in a traditional PFC; it may also vary from controller to controller. This power tip can help you eliminate the confusion around control-loop implementations in a totem-pole bridgeless PFC, and choose the appropriate method for your design.

Bosheng Sun is a systems engineer in Texas Instruments, focusing on developing digital controlled high-performance AC/DC solutions for server and industry applications. Bosheng received an M.S. degree from Cleveland State University in 2003, and a B.S degree from Tsinghua University in Beijing in 1995, both in Electrical Engineering. He holds 5 US patents.

Related Content

• Power Tips #108: Current sensing considerations in a bridgeless totem pole PFC
• A comparison of interleaved boost and totem-pole PFC topologies
• Power Tips #116: How to reduce THD of a PFC
• Power Tips #132: A low-cost and high-accuracy e-meter solution

References

1. Dixon, Lloyd. “High Power Factor Preregulator for Off-Line Power Supplies.” Texas Instruments Power Supply Design Seminar SEM600, literature No. SLUP087, 1988.
2. Sun, Bosheng. “Duty Ratio Feedforward Control of Digitally Controlled PFC.” Power Systems Design, Dec. 3, 2014.
3. Van de Sype, David M., Koen De Gussemé, Alex P.M. Van den Bossche, and Jan A. Melkebeek. “Duty-Ratio Feedforward for Digitally Controlled Boost PFC Converters.” Published in IEEE Transactions on Industrial Electronics 52, no. 1 (February 2005): pp. 108-115.

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