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The newly introduced AX PRO alarm product line has the Wireless External Wireless Triple Signal Detector and (optional) dedicated camera module. This powerful intruder detection system provides a better image, more precise detection, and a handy modular design – all working to enhance alarm system capabilities for both homeowners and small businesses.

Tapping into the industry trend of using external passive infrared (PIR) detectors for video verification, the detector protects a property with innovative technology for precise detection and video verification.

Wireless Triple Signal Detector innovation reduces false alarms

In these scenarios, false alarms are often triggered by anything from bad weather to leaves or branches to pets. The answer to dealing with these is to be able to identify them and ignore them as ‘non-threats’. As its name suggests, a Wireless Triple Signal Detector uses three sensors: a PIR sensor at the top, a microwave sensor, and another PIR sensor at the bottom. This means that it can detect at various heights, with a 15m and 90° adjustable detection area, more precisely identifying what is actually triggering the alarm.

Patented Independent Floating Threshold (IFT) technology allows the detectors to adjust their thresholds based on the environment infrared and background noise automatically and dynamically. This essentially reduces false alarms caused by background noise interference.

The detector uses digital temperature compensation to automatically adjust the alarm threshold according to environment. This also means it is much more resilient in bad weather conditions, and enables consistent detection throughout.

Any successful security systems is subject to attempts to overcome it. One of these is ‘masking’, where a potential criminal ‘covers’ the sensor(s), for example with a spray. The AX PRO device uses active IR anti-masking – the detector can initiate a mask-processing sequence to check whether it has been masked or not. The ‘operator’ receives an alarm and can act accordingly.

And there’s more

The optional camera module provides GIF verification, allowing the ‘operator’ to see an image of an ‘incident’ for visual verification. The module has a 2.0mm lens with adjustable angle and can provide up to 20 images with VGA/QVGA/QQVGA formats.

Other features include:

• Pet immunity up to 40 kg
• Waterproof to IP65 standard
• Automatic sensitivity
• Easy to install and cost-effective, with no power/network cables needed.

In a market where accurate intruder alerting is exploding and verification is becoming more important, the Wireless Triple Signal Detector can provide an innovative solution in a wide range of scenarios.

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The factories and manufacturing facilities are the hub of core economic and industrial activity helping to create a positive impact on the local economy, employment and manufacturing ecosystem. The security and efficiency are the key concerns for the stakeholders. There are efficient way to manage Factories by implementing security solutions.

Solution Overview

The factory is a synthesis of personnel, assets, equipment, and machinery. Therefore, complicated challenges arise frequently in a factory, such as personnel mobility and fire hazards. Hikvision’s Solution by Scenario for Factories provides more cost-effective ways to guarantee efficient and safe production, and property protection. Secured by our professionally selected products and subsystems, the whole solution can bring more momentum and productivity to factory operation.

The biggest challenge faced in factories and manufacturing facilities is the entry logs of authorized Vehicle entrance and exit. The Vehicle Management data continues to be the perpetual challenge for the Factory Management and Security Personnel.

Manual identity check for drivers and vehicles can be inconvenient and time-consuming, as well as difficult to trace back when looking for specific vehicle records.  In manual identity check there is always a chance for human error.

Solution

To replace manual identity check with Hikvision Automatic Number Plate Recognition (ANPR) Cameras can enhance the security by automation of the Vehicle authorization process. Thus, adding efficiency and security for Vehicle Management via hands-free, drive-through ANPR authentication and easy-to-retrieve records.

Advantages

Secure and efficient vehicle egress

• Hands-free, non-stop, authenticated drive through
• Support for block-list alarm / VIP notification

Operational efficiency boost 

• Easy-to-retrieve records via “fuzzy” license plate match
• Automated alarm push for block-list vehicle and full parking area

Simple, adaptable deployment

• Card and video intercom in one unit
• Adaptable in scenarios with or without attendant booth

Features

• Authenticated vehicle access using ANPR or ID card
• Support for granting access remotely via video intercom
• Vehicle records and parking statistics reports
• LED display of available spaces and other parking info

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Rohde & Schwarz will present its new R&S TSEMF-B2E isotropic antenna for the TS-EMF measurement system at the EMV trade show in Stuttgart. This new antenna covers the frequency range from 700 MHz to 8 GHz and allows simple and precise evaluation of emissions on site – even for new radio services. When combined with Rohde & Schwarz spectrum analyzers, the R&S TS-EMF measurement system detects high‑frequency electromagnetic fields (EMF) in the environment.

When combined with handheld spectrum analyzers, the isotropic antennas of the R&S TS-EMF measurement system support frequency selective measurement of RF emissions. This tried and tested measurement method simplifies EMCE measurements since the isotropic antenna directly measures all directions and polarizations.

Isotropic antennas have only had to cover a frequency range of up to 6 GHz for standard radio services up to now. The new radio services such as Wi-Fi 6E and new 5G bands such as n96, n102, and n104, mean that frequency ranges up to 7.125 GHz have to be covered. The new R&S TSEMF-B2E antenna for the TS-EMF measurement system has a frequency range of 700 MHz to 8 GHz and can now simply measure this range isotropically.

When combined with the R&S FPH or R&S FSH handheld spectrum analyzers, three antennas in the R&S TS-EMF measurement system now cover the entire frequency range from 9 kHz to 8 GHz. The EMF measurement option for these analyzers provides an automated test sequence on site followed by subsequent report creation. These reports help ensure that transmitter systems comply with the applicable limits and furnish proof of conformity for third-parties. Higher frequencies up to 44 GHz can still be measured with a handheld analyzer and handheld directional antennas such as the R&S HE800-PA to support stirring.

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To mitigate SATCOM service degradation, real-time spectrum analysis (RTSA) software from Keysight delivers up to 2 GHz of RTSA bandwidth. Running on the company’s N9042B UXA signal analyzer, the RTSA software allows satellite network operators to monitor satellite signals and interference to ensure the highest quality of service to users.

The RTSA test application enables the N9042B to conduct continuous, gapless capture and analysis of elusive and transient signals via an optical data interface (ODI). Multi-threaded and parallelized RTSA measurement with up to 2 GHz bandwidth minimizes the time gap between processing/rendering and re-capturing signals. This reduces analysis time and improves the probability of intercept, while ODI streaming at up to 2 GHz to RAID storage enables the capture of hours of signal recordings for analysis.

The N9042B signal/spectrum analyzer tests millimeter-wave performance in 5G, satellite, and radar systems. When combined with the V3050A frequency extender for unbanded coverage to 110 GHz, the U9361 receiver calibrator, M9484B VXG signal generator, and PathWave X-Series and PathWave vector signal analysis measurement applications, the N9042B provides 2-GHz real-time spectrum monitoring for satellite communication systems.

N9042B UXA product page

Keysight Technologies 

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Renesas has expanded its RA family of 32-bit MCUs with two entry-level groups based on an Arm Cortex-M33 core with Arm TrustZone technology. The 100-MHz RA4E2 group and 200-MHz RA6E2 group are optimized for power efficiency and offer an easy upgrade path to other members of the RA family.

Along with 40 kbytes of SRAM, the RA4E2 series provides 128 kbytes of flash memory, while the RA6E2 series provides up to 256 kbytes of flash memory. On-chip connectivity options include CAN FD, USB 2.0, QSPI, HDMI CEC, SSI, and I3C. The MCUs also furnish a 12-bit ADC, 12-bit DAC, and PWM timer. Small QFP, QFN, and BGA packages make the microcontrollers suitable for sensing, gaming, wearables, and appliances.

MCUs in the RA4E2 group offer a choice of five different packages ranging from 32 pin to 64 pins as small as 4×4 mm. Active power consumption when executing from flash memory at 100 MHz is 82 µA/MHz. Comprising 10 variants, the RA6E2 MCUs consume 80 µA/MHz in active mode when executing at 200 MHz.

All of the RA4E2 and RA6E2 MCUs are available today. Evaluation kits and prototyping boards are also available for both MCU groups.

RA4E2 product page 

RA6E2 product page

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Diodes’ PAM8906, a driver IC with a built-in synchronous boost converter, is capable of driving a piezoelectric sounder with outputs up to 36 VPP. The driver maintains high sound pressure level (SPL) output, while an auto on/off function prolongs battery-powered operation.

For application flexibility, the PAM8906 operates with either an external pulse-wide modulation (PWM) input or in self-excitation mode. This allows it to be used with a variety of sounders in such devices as smoke alarms, air humidifiers, handheld GPS devices, security alarms, medical devices, and home appliances.

The driver provides a choice of three output voltage variants: 20 VPP, 24 VPP, and 36 VPP. Unlike charge pump-based alternatives, the PAM8906 maintains its output even as battery voltage drops over time. Using a small 0.47-µH inductor, the driver’s boost converter switches at a fixed frequency of 1.8 MHz, with quiescent current of just <1 µA.

The PAM8906 sounder driver comes in a 10-pin MSOP package and costs $0.37 each in lots of 1000 units.

PAM8906 product page

Diodes

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The NCV-RSL15 MCU from onsemi brings Bluetooth 5.2 wireless connectivity, embedded security, and ultra-low power to automotive applications. According to the manufacturer, the NCV-RSL15 is certified by the EEMBC as the industry’s lowest power secure wireless microcontroller. Designed to use as little power as possible, the device features a proprietary smart sense power mode to conserve battery power.

An Arm Cortex−M33 processor core with TrustZone Armv8−M security extensions forms the basis of the NCV-RSL15’s security platform. Arm’s CryptoCell security subsystem provides hardware-based root-of-trust secure boot, user-accessible hardware-accelerated cryptographic algorithms, and firmware-over-the-air updates.

Four low-power modes are available to reduce power consumption, while maintaining system responsiveness. These include sleep, standby, smart sense, and idle. Smart sense mode takes advantage of the low power capability of sleep mode, but allows some digital and analog peripherals to remain active with minimal processor intervention. Power specifications for the NCV-RSL15 include:

• Sleep Mode (GPIO Wakeup) @ 3 V VBAT: 36 nA
• Sleep Mode (Crystal Oscillator, RTC Timer Wakeup) @ 3 V VBAT: 81 nA
• Peak Rx Current 1 Mbps @ 3 V VBAT: 2.7 mA
• Peak Tx Current 0 dBm Output Power @ 3 V VBAT: 4.3 mA

With its rich library of sample code, a software development kit for the NCV-RSL15 provides a springboard for application development. Typical applications for the NCV-RSL15 microcontoller include keyless vehicle access using a fob or smartphone, tire pressure monitoring systems (TPMS), tire monitoring systems (TMS), and seat belt detection.

NCV-RSL15 product page

onsemi

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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A low-power LoRa transceiver from Semtech, the LR1121 provides flexible multiband communication for IoT endpoints anywhere in the world. The device supports terrestrial ISM band communications in the sub-GHz and global 2.4-GHz spectrum, as well as the S-band for satellite connectivity.

The Lora Connect LR1121 is pin-compatible with Semtech LoRa Edge asset management chips, allowing module makers such as Murata to have a single hardware design for a wide range of applications. Murata’s Type 2GT module supports the LoRa Edge LR1110 and LR1120 devices, as well as the LoRa Connect LR1121. This turnkey solution enables lower cost assembly and faster time to market with a pre-certified LR1121 variant readily available.

Likewise, integrated passive devices (IPDs), like those from Johanson Technology, can readily be used alongside the LR1121. Johanson’s IPD replaces a number of RF passives, not only reducing footprint, but also minimizing design iterations and speeding time to market.

Modules and reference designs developed in partnership with Johanson and Murata are ready to launch. The LR1121 LoRa transceiver is available through Semtech’s distributor network. To learn more about the LR1121 LoRa transceiver, click here.

Semtech

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As the benefits of Moore’s Law begin to diminish while design complexity increases, there is a need for cost- and time-efficient solutions that can also provide exceptional performance and functionality while lowering power consumption. That’s why cloud-based electronic design automation (EDA) solutions are gaining popularity among chip designers and the cloud is becoming key for furthering innovation and productivity.

A few of the many advantages cloud technologies can offer chip designers include reduced system maintenance costs, advanced storage, and compute resources, as well as fast ramp-up and flexible pay-as-you-go models that aid not only the peak usage periods, but also during the entire chip design flow. While we continue to see the limits of in-house compute resource availability, the cloud has been proven to provide flexibility to scale design and verification capabilities to ensure better quality, lower cost, and faster time to results.

Figure 1 Cloud computing is emerging as a viable platform for IC design and verification tasks. Source: Synopsys

However, as the journey to the cloud accelerates, designers will need to carefully examine their cloud technologies to achieve optimal results. There are four key factors designers should consider when turning to cloud-based technologies that result in better, faster, and cheaper semiconductors.

1. Data transfer and management

When migrating EDA workloads to the cloud, a key consideration is determining what data is transferred in and out of the cloud. Solutions that reduce data transfer overhead will deliver accelerated time to results and increased productivity.

While there are a variety of models useful for managing both on-premise and cloud environments, the most straightforward model is to migrate the required data to the cloud. In the data management process, the cloud environment must be capable of replicating the on-premise environment, and that starts with determining and cataloging the dependencies for a design.

Cloud data transfer must be swift and resilient to ensure no data is lost when it’s transferred from on-premises storage to the cloud. Cloud storage will need to provide the flexibility to scale in and out based on the requirements of the design and verification tasks.

Storage efficiency is another component that must be considered when designing EDA solutions. Cloud providers also grant flexibility on the type of storage, with cost playing a critical role in the decision-making process for engineering teams. EDA solutions are being engineered to leverage distributed storage, block storage, and in-memory compute that improve the turnaround time while lowering the total cost of ownership.

2. Cloud security

Data security concerns are one of the primary reasons why the semiconductor industry has been slow to adopt cloud technologies. To ensure sensitive data is protected, there must be a robust data governance plan that identifies who is given access to what type of data, accompanied by powerful access and identity management measures.

Cloud infrastructure vendors are experienced in implementing security into their infrastructure, applications, and operations. These providers have been employing the most modern security measures to protect their data centers while delivering their commitment on redundancy and high system uptime. Working closely with cloud security vendors, EDA vendors can adapt their technologies to securely run their workloads while preventing the risk of data leakage.

Above all, chip and system designers should seek EDA vendors that have adapted to cloud environments while offering encryption, troubleshooting tools, and next-generation monitoring capabilities.

Figure 2 Design engineers must ensure that they use cloud platforms offering robust data transport and security capabilities. Source: Synopsys

3. Accessibility and deployment

High-performance computing and NFS-heavy storage define EDA workloads, with a high dependence on system libraries, tools environment, and hardware. Chip designers accustomed to how their EDA flows function on-premises would benefit from the faster turnaround time with on-demand, near real-time provisioning, and a much better consumer-grade user experience when using cloud solutions.

It’s also important for chip designers to consider the investment of time to set up the cloud, from establishing network connectivity to managing their firewall. Additionally, asking questions such as how the design team would access cloud-based tools, how they can best visualize what and how current resources are being utilized, and how much faster certain tasks could be completed are important.

Today, we are also seeing artificial intelligence (AI) emerging as a significant player in the chip design process, which significantly increases the efficiency of both on-premises compute environments and scales compute on-demand in the cloud to enhance power, performance, and area (PPA).

4. Scalability and cloud architecture

The ability to scale compute infrastructure is one of the top reasons why designers are migrating EDA workloads to the cloud. Several compute-intensive tasks are best when they are broken into smaller parts across distributed compute and storage resources—very much a cloud-native approach.

EDA flows are supported by robust scheduling with streamlined storage to adequately manage distributed workloads. Many EDA tools have been re-architected to scale to thousands of cores along with distributed schedulers that can efficiently use these resources. Another advantage of the cloud is the availability of hybrid scaling, allowing workloads on-the-cloud or on-premises, depending on what is needed for the task.

When leveraging cloud technologies, re-architecting EDA solutions is imperative. Similar to how EDA products have welcomed multi-processing and multi-threaded opportunities, EDA solutions must do the same with cloud architecture. As chip designers begin their journey to the cloud, welcoming new technologies like distributed storage, distributed computing, and more will lead to greater innovation.

Arun Venkatachar is VP of AI, Cloud & Central Engineering at Synopsys.

Related Content

• EDA not yet ready for cloud computing
• Automotive deep learning platform shifts to cloud
• How EDA workloads inside the cloud reinvigorate chip design
• Chip design in the cloud? Now you can have pay-as-you go EDA
• Design inside the cloud: From components to boards to EDA tools

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New UiPath Business Automation Platform capability allows data science teams to reduce cost, time, and effort of deploying machine learning models into business processes

UiPath, a leading enterprise automation software company, announced data science teams using Amazon SageMaker, an end-to-end machine learning (ML) service, can now connect to UiPath to quickly and seamlessly connect new ML models into business processes without the need for complex coding and manual effort.

The UiPath Business Automation Platform makes it simple for data scientists, ML engineers, and business analysts to automate deployment pipelines, reducing the cost of experimentation and increasing the pace of innovation.

Amazon SageMaker is a fully managed service from Amazon Web Services (AWS) to prepare data and build, train, and deploy ML models for any use case with fully managed infrastructure, tools, and workflows. By connecting Amazon SageMaker to UiPath, users can:

• Rapidly deploy new ML models into production: connect newly completed ML models into production workflows in minutes, minimizing the time to value for business users; integrate Amazon SageMaker ML models into automation workflows without code; and use UiPath robots to drive workflows and manage end-to-end business processes.
• Optimize the productivity of data science teams: facilitate consistent and accurate workflows that reduce the need for human involvement and free up critical resources for strategic work. With UiPath automation, organizations can greatly lessen the burden on data science teams to deploy the latest ML models to end users. Teams can also improve reliability by decreasing human error while maintaining human oversight to meet governance and compliance standards.
• Increase the speed of ML innovation: enable engineering teams to test their ideas, tackle new challenges, and experiment more frequently with their data. Automation removes the manual effort to code, troubleshoot, and maintain scripts across the breadth of the ML data pipeline and improves the speed and reliability of new model deployment into business processes.

“Tens of thousands of active customers use Amazon SageMaker to train models with billions of parameters and make trillions of predictions per month,” said Ankur Mehrotra, General Manager, Amazon SageMaker at AWS. “With the integration with UiPath, our goal is to help customers accelerate the deployment of their machine learning models cost efficiently and with optimized infrastructure.”

“UiPath’s Amazon SageMaker connector is designed to solve a key pain point by allowing our customers to realize business value from their ML models faster. Data science teams can quickly embed ML models into actual business processes and reduce effort and the time to market,” said Sai Shankar, a Managing Director at Slalom, a purpose-led, global business and technology consulting company. “Working in cooperation with AWS and UiPath helps us deliver AI and ML enabled business process automations for our customers. Our data science and intelligent automation teams are eager to leverage the connector to help our customers operationalize ML models faster and leverage them at scale.”

“Data scientists and data science team leaders are working at the cutting edge, creating powerful new machine learning models to accelerate business performance. At the same time, these professionals are saddled with time-consuming, manual management which slows progress and adds costs,” said Graham Sheldon, Chief Product Officer at UiPath. “By connecting Amazon SageMaker to the UiPath platform, we are helping reduce this complexity with automation. This opens avenues for faster deployment, lower costs, and more opportunities for innovation through machine learning.”

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Within two years since its inception, the leading electric bicycle manufacturer EMotorad has exported more than 52k e-bicycles to more than 18 countries across the globe.

leading manufacturer of electric bicycles EMotorad has recently announced the achievement of another milestone of achieving international profitability. The electric bicycles’ manufacturer has achieved a profit of $2Mn within two years of inception internationally.

This is a significant milestone for the company and reflects its dedication to delivering high-quality, innovative products that meet customers’ needs worldwide. The India based e-bicycles’ manufacturer has exported over 52k electric bicycles in more than 18 countries out of which the USA region has proven to be the top performer.

Delighted with the announcement, Rajib Gangopadhyay, MD & Founder of EMotorad, said, “We are proud to have become the fastest-growing e-bike brand in such a short amount of time. Our target is to become the number one Indian e-bike brand by 2024, and we are well on our way to achieving that goal.”

EMotorad started its first expansion into international market with the UAE and Nepal. The company’s e-bikes were well-received by consumers in these markets, and this success propelled the company to expand into other regions such as Japan, Europe, Australia, and more than 18 other countries. The business growth is highly driven by its ability to provide e-bikes that are both innovative and premium and are available across different price points.

The global e-bike market is projected to register a CAGR of 6.96% between 2023 and 2028. This directs the market’s interest towards India to build its manufacturing backbone. Considering the shift to Indian manufacturing capabilities, EMotorad is receiving tremendous demand from global companies to provide them with high-quality e-bikes that were previously being imported from China.

Despite its success in international markets, EMotorad remains committed to its home market of India. The company continues to invest heavily in the Indian market and has recently launched a range of premium, affordable, and versatile e-bikes designed specifically to meet the needs of Indian consumers.

“We are excited to continue developing new geographies and dominating those markets with our Made in India e-bikes. Our commitment to quality, innovation, and customer satisfaction remains at the heart of everything we do, and we look forward to continued growth and success in the years to come,” he added.

EMotorad’s rapid growth and profitability in the international market is a testament to the company’s unwavering commitment to delivering high-quality, innovative products that meet the needs of customers around the world. As the company continues to expand and develop new markets, it is clear that EMotorad is a force to be reckoned with in the world of electric bikes.

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Infineon Technologies and Apex.AI, a company developing safety-certified software for mobility and autonomous applications, announced to co-develop a platform that significantly expedites software development for automotive customers. The companies have integrated Apex.AI’s software development kit and Infineon’s AURIX TC3X microcontroller to enable faster integration of safety-critical automotive functions into future vehicles.

“The AURIX TC3x is widespread across automotive applications and well known for its reliability, scalable performance and broad customer base,” said Thomas Schneid, Senior Director Software, Partnership & Ecosystem Management from Infineon. “Together with Apex.AI we are now speeding up software development and implementation of microcontrollers to make software-defined vehicles possible. New applications in the car demand new SW Ecosystem components which complement and enhance our existing SW environments”

“The mobility industry is challenged by moving from hardware-centric products to software-defined vehicles. The integration of the Infineon AURIX TC3x microcontroller family, the leading embedded automotive safety controller, with Apex.Grace will significantly accelerate development times and lower deployment costs,” said Dr. Jan Becker, Co-founder and CEO of Apex.AI.

Infineon’s AURIX TC3x is one of the major embedded safety controllers worldwide to obtain ASIL D certification according to the 2018 ISO 26262 standard. ASIL D is the highest level of automotive functional safety. Leading computing platforms for automated driving rely on the microcontroller as their safety host controller as it provides the safety and performance necessary to make automated driving happen. Apex.Grace, formerly known as Apex.OS, is the first complete SDK for software-defined vehicles (SDV) certified to ISO 262626 ASIL D.

Apex.Grace is the go-to choice for efficiently developing application software for software-defined vehicles. Apex.Ida, previously known as Apex.Middleware, provides a complete and integrated solution for intra- and inter-electronic control unit (ECU) communication and communication to the cloud. The two companies demonstrate that the development and integration of embedded safety-critical automotive applications can be significantly accelerated.

Apex.Grace is based on the open-source robot operating system (ROS). While ROS is the industry’s de facto development standard for prototyping for robotics and mobility applications, it does not meet safety and reliability requirements for automotive systems and other safety-critical applications, creating a hurdle for manufacturers. Apex.Grace enables the rapid and efficient transition from ROS-based prototypes to production-ready vehicles and is certified by TÜV Nord to ASIL D, the highest level of automotive functional safety.

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STMicroelectronics’ STM32WBA52 microcontrollers (MCUs) combine Bluetooth LE 5.3 connectivity with ultra-low-power modes, advanced security, and a broad selection of peripherals familiar to STM32 developers. Its arrival eases the next step for IoT device developers seeking to add wireless, cut power, strengthen cyber-protection, and boost processing in the edge. The STM32WBA wireless MCU platform includes ST patented leading-edge technology. Targeted applications comprise smart home, industrial lighting, sensors, electrical switches, gateways, and portable medical devices.

Leveraging ST’s investments in capacity expansion and resiliency, the STM32WBA52 is available now in the mass market and brings proven wireless capabilities from ST’s well-known ultra-low-power STM32WB MCUs. It is boosted by an Arm Cortex-M33 core operating at 100MHz for extra computing power, and with state-of-the-art STM32 peripherals.

The powerful STM32Cube ecosystem simplifies migrating from existing STM32WB and general-purpose STM32 MCUs. It features the STM32CubeWBA MCU package, embedding a certified Bluetooth Low Energy 5.3 protocol stack and builds on existing profiles from the STM32WB series for easy portability. The STM32Cube ecosystem also includes tools such as the STM32CubeMX peripherals configurator and code generator, STM32CubeMonitor-RF radio-performance tester, and STM32Cube.AI desktop and cloud versions for Artificial Intelligence. The extensive ecosystem is proven to accelerate application development and validation. Further, to ease prototyping, a dedicated Nucleo board, NUCLEO-WBA52CG, will be available for the STM32WBA52.

The integrated ultra-low-power radio delivers market-unique RF output power of +10dBm, enabling reliable communication over long distances at data rates up to 2Mbit/s. A deep standby low-power mode with active radio communication drastically reduces overall power and saves battery energy. The STM32WBA MCUs can support up to 20 simultaneous connections.

The boost to cyber-protection comes from the PSA security program based on security isolation, memory protection, tamper protection, and Cortex-M33 featuring the Arm TrustZone architecture. The platform is delivered with a secure software solution based on Trusted Firmware for Arm Cortex-M (TF-M).

TF-M meets the industry-standard PSA Certified security framework, with PSA immutable Root of Trust (RoT) including secure boot and secure firmware update, cryptography, secure storage, and attestation at runtime. Side-channel resistant symmetric and asymmetric cryptographic accelerators are embedded, and key protection is implemented using a hardware unique key (HUK) secure process. With strong resistance to physical attacks, the STM32WBA52 product line targets Arm PSA Certified Level 3 and SESIP3 IoT security standards.

Sharing many energy-saving technologies with the ultra-low-power STM32U5 MCUs, STM32WBA52 MCUs feature ST’s Low Power DMA and flexible power-saving states with fast wakeup times. Together, these features can cut MCU power by up to 90%. There are also state-of-the-art integrated peripherals including a 12-bit ADC for enhanced accuracy with oversampling capability, while error code correction (ECC) on internal Flash and RAM enhances data integrity and safety. Generous 1Mbyte flash memory density provides storage for the user application and protocol stacks.

The STM32WBA52 MCUs will be included in ST’s 10-year product-longevity program, which renews long-term assurances of production every year.

For further information please go to www.st.com/stm32wba

Based on advanced multi-spectral sensor technology combined with state-of-the-art AI models and Bluetooth LE connectivity, Qassay readers are flexible enough to host any type of lateral flow test, ensuring the highest accuracy, sensitivity, and repeatability, supporting assay development partners and lateral flow test strip manufacturers.

Aitor Alapont, CEO of P4Q Electronics, said, “We are on a mission to universalize rapid testing. Thanks to our innovative technology, Qassay enables both qualitative and quantitative diagnostics to be done at home. Using ST STM32WBA52 microcontrollers accelerated our time to market and will allow us to serve the market demand in time.”

Qassay reader has been developed in collaboration with Future Electronics Centre of Excellence (CoE). “The new STM32WBA52 microcontrollers provide wireless connectivity with advanced security as well as a rich set of peripherals. Together with ST’s development tool ecosystem it will allow to succeed on any new development requiring wireless connectivity,” said Etienne Lanoy, Advanced Engineering Group (AEG) senior Director – EMEA, Future Electronics.

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Automotive Steering Mounted Electronics Market Overview

This report contains comprehensive research with in-depth data and contemporary analysis of the Automotive Steering Mounted Electronics market at a global, regional and key country level, covering different sub-segments of the industry.

The automotive industry is set to experience a few structural changes in the near term due to the rapid developments in novel technologies. Artificial intelligence (AI) and machine learning will significantly transform the manufacturing process improving robotic efficiency, accuracy, and consistency.

Level 2 automation including active safety systems and driver assistance is allowing OEMs to add attractive features and bolster revenue growth. However, the full-fledged rollout of level 4 autonomous vehicles is expected to witness further delays for the technology to mature and for consumers to accept.

Automotive Steering Mounted Electronics Market Structure and Strategies of key competitors

Companies operating in the Automotive Steering Mounted Electronics business are strategizing moves to enhance their market share highlighting their USP statements, diversifying product folio, and adding attractive features being a few of the key winning strategies. The report offers detailed profiles of top companies serving the Automotive Steering Mounted Electronics value chain along with their strategies for the near, medium, and long term period.

Automotive Steering Mounted Electronics Market Trends, Growth Opportunities, and Forecast Scenarios to 2030

Lockdowns across the globe in 2020 and continuing restrictions in 2021 disrupted the Automotive Steering Mounted Electronics supply chain, posing challenges for manufacturers in the Automotive Steering Mounted Electronics industry. Intense competition, fluctuating prices, and shifting OEM preferences are expected to be the major challenges for Automotive Steering Mounted Electronics Market during the forecast period.

The fast pace recovery of developing economies leading to increased disposable income will support the Automotive Steering Mounted Electronics market demand between 2021 and 2030.

The Automotive Steering Mounted Electronics research report portrays the latest trends shaping the Automotive Steering Mounted Electronics industry along with key demand drivers and potential challenges anticipated for the market during the outlook period.

Automotive Steering Mounted Electronics Market Analysis by Types, Applications and Regions

The research estimates global Automotive Steering Mounted Electronics market revenues in 2021, considering the Automotive Steering Mounted Electronics market prices, supply, demand, and trade analysis across regions. A detailed market share and penetration of different types, processes, and geographies in the Automotive Steering Mounted Electronics market from 2001 to 2030 is included.

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