Microelectronics world news

“AI is definitely one technology that is developing very fast. And power management is the second big area”, says Gagan Bansal, President-Sales & Marketing, TDK, in an exclusive conversation with the ELE Times.  As the Indian electronic manufacturing industry aims to reach a worth of $300 billion by the end of 2026, the industry not only has to boost manufacturing but also innovative manufacturing to cater to the growing demands.

He navigated from providing to a wide spectrum in the electronic manufacturing market to the research and development for more innovative technology to meet the demands of tomorrow. Also offering a peek into TDK’s strategy to face global uncertainties ,along with promising technology that TDK is working on.

Moving from Traditional to Innovative Technology

Tracing TDK’s journey from creating the famous magnetic cassette tapes to batteries and now advanced technology with ADAS and XEV applications in radars and sensors, Gagan Bansal provides an introductory brief into TDK’s capabilities.

He further introduces TDK’s innovative product line, not only for the industrial sector but also for automotive and daily requirements, wherein he underlines TDK’s major mainstay in business as the market moves from ICE vehicles to EVs with nearly 60-70% electronics involved in it.

Apart from the automotive industry, he also mentions a product developed by TDK, which is the noise-cancellation in spatial atmosphere, simply said: noise cancellation without headphones. At this point, he specifically touches the combination of MEMS-based microphone, piezo-listen speaker, and digital signal processing involved in the product.

Incorporation of AI into TDK

“A lot of our sensor products are now related to AI software,” Gagan Bansal responded to the question on the

integration of AI. Recognizing the growing role of AI, he revealed that TDK has taken multiple steps for its inclusion by providing mission-critical components in terms of inductive components and electrolytic capacitors for various AI server applications.

He also recalled that many of their innovative technologies are incorporated with AI, namely the AR-VR technology and smart sensors for spatial noise cancellation and detection of head movement. He further added that their global company, TDK Sensor EI (Edge Intelligence), overlays software for artificial intelligence at the edge of the device, above the existing sensing devices; a growing demand in upcoming technology.

TDK in India

“Electronics manufacturing in India, on a penetration level, is relatively low as compared to the developed part of the world,” as he underlined the low penetration into the Indian market as compared to the developed part of the world, he recognized India as a place full of scale and scope.

To give an idea of TDK’s extensive presence in India, he says, “So we have a localization drive and we are very proud that in our existing units, more than 50% of the inputs are sourced locally over a period of time.” With six operational plants in India, TDK has also invested in four early-stage deep tech ventures into the fields of industrial IoT, agritech, EV charging, and EV bikes, making India the cornerstone in its global strategy.

TDK’s vision for the next half of the decade

Talking about the future of technology and innovation, he underlines the pace at which AI is developing while also sharing concerns around its power consumption and the indispensable need to develop power-efficient alternatives. Stepping into its feet, a bit more in this area, TDK has already begun working on developing an analogue memory product, called spin Memristor, inspired by the functioning of the human brain.

Comparing the human brain to digital memory, he highlighted how, despite being bigger in size, the human brain consumes comparatively less energy in contrast to a digital memory system. Their new product, Spin Memristor, based on the spintronics technology of an electron, aims to store data in an analogue format, which can be used in AI servers to consume less energy.

Concluding his conversation, Gagan Bansal says,” India is a formidable force to reckon with. It is a part of our global strategy as part of TDK, and it will remain to be so.” He also pitches TDK as a technology-ready company for the business to be with in furthering their ambitions and products on a global stage.

The post Exclusive Insights: “With Spin Memristor, we’re bringing the brain’s analog intelligence to modern memory technology,” says TDK’s Gagan Bansal. appeared first on ELE Times.

Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has introduced its expanded Wi-Fi 7 portfolio, with new front-end modules (FEMs) and bulk acoustic wave (BAW) filters designed to enhance range and coverage across 2.4GHz, 5GHz, and 6GHz bands...

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — is developing power converters to accelerate the adoption of 800VDC distribution systems for the next generation of AI data centers...

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has reaffirmed that it remains in full compliance with NYSE American regulatory disclosure requirements. This follows the resolution of a technical communication timing issue, related to the coordination of press release dissemination...

Raj Gawera has been appointed as chief operating officer (COO) of the UK Semiconductor Centre, leading its early mobilization and engagement as it builds plans to champion the UK semiconductor sector on the global stage...

The development of communication networks has entered a revolutionary phase. As 5G continues to mature and 6G research gains momentum, the world stands at the cusp of a hyper-connected era driven by real-time intelligence, automation, and pervasive connectivity.

From autonomous mobility and telemedicine to smart manufacturing and immersive AR/VR, the success of these innovation rests on one invisible foundation trustworthy mobile network performance.

Behind this dependability lies mobile network testing the unseen but critical layer ensuring that every connection performs seamlessly.

This diagram shows how data flows through a telecom network—from user devices to access technologies like Small Cells and Massive MIMO, through transport layers like fiber and edge data centers, into a cloud-based core network, and finally through testing layers using mmWave, cybersecurity, AI, and digital twins to ensure performance and reliability.

The Technology Behind Network Testing

• With mmWave, massive MIMO, network slicing, and Open RAN shaping 5G architecture, testing has become a complex science demanding unprecedented accuracy, flexibility, and speed.
• Today’s testing solutions are evolving with AI-powered analytics, cloud-based digital twins, and cybersecurity validation frameworks, enabling operators, equipment manufacturers, and researchers to ensure reliability across both physical and virtualized networks.
• As the world transitions toward 6G featuring terahertz (THz) frequencies, AI-native architectures, and intelligent automation network testing will remain the quiet enabler that keeps our connected future secure and scalable.

Innovations Powering Modern Network Testing

1. Predictive Analytics Powered by AI

Machine learning is reshaping network validation by predicting faults before they affect service. AI models analyze vast datasets from live networks to predict congestion, optimize routing, and reduce downtime, turning testing from reactive to proactive.

2. Cloud-Based Simulation & Digital Twins

Digital twins now simulate entire networks in the cloud from traffic behavior to mobility and interference patterns. This reduces field testing costs while improving accuracy, enabling virtual prototyping of real-world networks.

3. Open RAN & Massive MIMO Validation

Open RAN drives multi-vendor interoperability but demands strict conformance testing for timing, synchronization, and RF performance between distributed and radio units. Testing tools ensure each vendor’s hardware performs harmoniously in shared environments.

4. Cybersecurity & Resilience Testing

With 5G serving critical industries, penetration testing, vulnerability scanning, and cyberattack emulation are essential to preserve network integrity. The shift toward zero-trust architectures is also reshaping validation methodologies.

Industry Insights:

Some of the most significant advancements in mobile network testing are being led by industry pioneers like Anritsu and Keysight Technologies. Their innovative tools and forward-thinking approaches are not only addressing current 5G challenges but also laying the groundwork for the 6G era.

Anritsu Insight:

“5G came with big promises and bigger testing challenges,” says Madhukar Tripathi, Associate Director – Marketing & Business Development, Anritsu India.

“Technologies like mmWave, URLLC, and network slicing push testing boundaries. At Anritsu, our platforms like the MT8000A Radio Communication Test Set, Shockline VNA, and Network Master Pro MT1000A are enabling operators and manufacturers to validate performance at every stage — from R&D to deployment.”

Synchronization and interoperability are key challenges in Open RAN, where timing precision determines network reliability. “Our MT1000A and MS2850A test solutions perform PTP/SyncE and RF conformance tests to ensure accurate timing across multi-vendor O-RAN environments,” he adds.

AI-powered analytics further help in predictive fault detection. “By integrating data-driven insights into our instruments, we make spectrum analysis more intelligent — transforming network testing from a reactive process to a predictive one.”

 “Synchronization is key for Open RAN. Test platforms emulate and measure time errors with atomic clock precision, ensuring reliable multi-vendor timing.”

Also advancing 6G research, collaborating globally on FR3 (7–24 GHz) and sub-THz frequencies. Tools like the VectorStar broadband VNA and Scenario Edit Environment Kit (SEEK) automate multi-domain testing, preparing networks for future intelligent connectivity.

— Madhukar Tripathi, Anritsu India

Keysight Insights:

“The transition from simulation to digital twinning is redefining how networks are designed and optimized,” says Mombasawala Mohmedsaeed, CTO, Keysight Technologies India.

With RaySim and EXata, Keysight provides an end-to-end digital twin ecosystem to model base stations, channels, and user equipment under realistic mobility and interference conditions. “Tools allow operators to virtually replicate entire cities or rural regions and optimize networks for energy efficiency and coverage before physical deployment.”

For Non-Terrestrial Networks (NTNs), tools like Propsim and UE Sim emulate satellite-based communications to ensure seamless coverage.

On the security front, Keysight’s CyPerf, BreakPoint, and Threat Simulator emulate real-world cyberattacks to test network resilience. The Software Bill of Materials (SBOM) and Riscure solutions add another layer by tracing vulnerabilities within semiconductor and IoT ecosystems.

“Performance validation alone isn’t enough anymore — continuous cybersecurity testing is critical to protect mission-critical networks,” Mohmedsaeed emphasizes.

“Digital twins and cybersecurity intelligence are twin pillars of modern network assurance.”

— Mombasawala Mohmedsaeed, Keysight Technologies India

The Road Ahead: Testing Beyond 5G

The future of network testing will revolve around network slicing, private 5G, and 6G prototyping. Ultra-low latency, massive device connectivity, and AI-native architectures will demand test automation, real-time data visualization, and cross-domain validation.

Furthermore, the convergence of terrestrial and satellite networks will require innovative methods to ensure reliability and performance even in remote and harsh environments.

As the digital horizon expands toward 6G, the invisible precision of network testing will be what keeps the hyper-connected world running flawlessly. Every autonomous car that drives safely, every remote surgery that succeeds, and every virtual experience that feels real will owe its reliability to the unseen rigor of testing.

In the race to the future, innovation may set the pace but precision testing ensures the world never loses connection.

The post Building Reliable 5G and 6G Networks Through Mobile Network Testing appeared first on ELE Times.

Author: STMicroelectronics

Smartphones have become some of the most ubiquitous devices in modern history. For most of us, the smartphone is an indispensable tool not only to communicate, but to manage our lives – work, personal relationships, travel, shopping, entertainment, photography, and video creation. In short, smartphones have become a hub for life. 

 The touchscreen was transformational in the smartphone’s adoption and use. But in the future, the smartphone is set to become a platform for immersive experiences. And when aligned to innovations that will extend battery life and even see smartphones harvesting their own energy, along with new ways to stay constantly connected, their usefulness will only increase.  

 A powerful processor in your pocket

Smartphones have become incredibly powerful processing devices. Indeed, in comparison to the most powerful supercomputers of the 1980s, today’s smartphones can process information more than 5,000 times faster. 

In some ways, however, the way that we interact with our smartphones has progressed least since their arrival. For many people, the touchscreen remains the primary – if not only – way that they access and view the interactive services and rich experiences provided by their smartphone. The coming years will see that transformed and, with it, the idea of what a smartphone is. 

A reduced reliance on the smartphone display as the principal way to interact with the device and receive information fundamentally changes the role of the smartphone. As a powerful computing device in its own right, but also connected to cloud-based computing resources, the smartphone potentially becomes a platform for delivering immersive experiences and valuable services to the user in numerous new ways.  

New models for smartphone interaction

Voice assistants have become one of the first steps into a new world of accessing services via our smartphones. Whether issuing voice commands and queries directly into the device or having these relayed via connected headphones and earbuds, consumers are realising the convenience of voice and audio interaction. An additional benefit, of course, is that the smartphone itself can remain in a pocket or bag, out of harm’s way. 

Eyeglasses featuring augmented reality (AR) display technology are an ideal solution. These can visually display directions in the user’s eyeline, while also overlaying other useful or interesting information. With more information and experiences layered over the real world, discovering a new city will be more rewarding than ever before, with less potential for a misstep along the way. 

Artificial intelligence (AI) will also enable proactive and predictive services that help us manage our daily lives. For example, by understanding the current traffic conditions, AI might bring an alert for your next meeting across town 30 minutes earlier. With the alert appearing on your smartwatch, more efficient travel could be proposed, with directions to the closest public transport appearing in your eyeglasses’ AR display. 

Gesture recognition and haptic feedback

Gesture recognition is emerging as another way to interact with services provided by smartphones. Less obvious that either using a touchscreen or voice, subtle gestures to make or answer calls or respond to messages will be quick and convenient methods of interaction. Who knows, you might well respond to the latest message received with an actual thumbs up, rather than having to find and type the emoji itself.  

We might be on the cusp of a whole new vocabulary of gestures as commands. Google is one company looking at how devices can be controlled by natural human gestures, many of which we use subconsciously. Other advances in hardware, such as the latest generation of Time-of-Flight (ToF) sensors, will support more accurate detection of gestures in and around smartphones. 

Haptic feedback is the use of vibrations or sensations to enrich the experience of using a device. At a basic level, most of us already experience haptic feedback in our smartphone use. Vibrations rather than a ringtone to signify an incoming call is a simple example, but the nature and application of haptic feedback is rapidly evolving. 

Imagine shopping online and being able to ‘feel’ different types of fabric through haptic feedback via your smartphone’s screen. Subtle vibrations from different parts of smart eyeglasses could be used to enrich visual experiences or help with directions. Research is even looking at ultrasound and “mid-air” haptics, where the sensation of physical touch is created in the air. Such haptic feedback could augment gesture control or enhance touchless interfaces. 

The potential for neural interfaces

Though still in its early stages, the idea of interacting with devices merely by thinking is becoming more real. Various non-invasive neural interfaces are in development.  

Electroencephalography (EEG) sensors placed on the head via headsets, or potentially even embedded in hats and headbands, are a direct way to tap into the brain’s activity. Neural wristbands detect signals from nerves connecting the brain to an individual’s hands, whereby just thinking about a gesture or action could act as a command.  

So-called “silent speech” interfaces detect subtle changes in expression or movements in the vocal chords, where simply mouthing words would be detected as accurately as voice. Data from wearables such as smartwatches, rings, and earbuds could identify cognitive load and emotional state, triggering proactive alerts, suggestions, or experiences to help alleviate issues.  

Projecting further into the future, neural interfaces and advanced haptic feedback could be combined to create a new world of deeply immersive experiences, all powered by the not-so-humble smartphone. 

Always connected

Of course, this vision of the smartphone as a platform for new services and experiences relies on an almost constant connection to cloud-based computing resources. Fortunately, alongside the innovations in smartphone interface technologies, we’re seeing continued development of technologies that ensure we remain connected, wherever we are. 

As we recently highlighted, the need to connect the world of increasingly intelligent “things” – not only smartphones, but billions of sensors, machines, and consumer products – is being supported by innovation in communications technology. This includes further evolution of established infrastructure, with 6G telecommunications networks arriving in the coming years, but also the significant expansion of satellite-based communications networks.  

When the smartphone arrived, it was exactly that: a phone with additional capabilities. We can all appreciate how far it has moved beyond that simple description, and over a relatively short period of time. While we might need a new name for the device, we certainly need to change our understanding of what this powerful pocket processing device represents.

New ways to interact with our smartphones, innovation in the delivery of seamless immersive experiences, universal connection, and improved battery life and self-charging will see them become the primary digital platform for every aspect of our lives.

• Discover our Time-of-Flight sensors

The post Beyond the Screen: envisioning a giant leap forward for smartphones from physical objects to immersive experiences appeared first on ELE Times.

The new SoCs bring multi-core performance, PSA Level 4 security, and certified Matter platforms to accelerate smart home development.

submitted by /u/Electro-nut [link] [comments]

Learn how integrated battery monitoring and motor control in outdoor power equipment designs ensure safety, extend battery life, and simplify development with high-voltage integration.

The UK Semiconductor Centre has moved into its next phase of mobilization with the announcement of its newly formed Interim Steering Group...

Hello everyone! Thank you for the incredible support on my first post. For my next project, I built a heart-shaped circuit with 15 LEDs on a zero PCB, designed to have a beautiful fading glow powered by a capacitor bank. I started by simulating everything in Tinkercad to get my component list, which proved to be a lifesaver. The build had its challenges, from getting the heart shape symmetrical to using mismatched capacitors to create the power bank. However, the biggest villain of this project was my 25W soldering iron—it just wasn't hot enough, making soldering a complete disaster. After a desperate Amazon order, a new 60W iron saved the day and made finishing the project a buttery-smooth experience! I'm incredibly proud of what I created. For a future version, I'm thinking of adding a USB-C port for power and finding a way to make the LED glow last much longer. Let me know what you think! submitted by /u/armtech_897 [link] [comments]

Infineon Technologies AG of Munich, Germany says that it is supporting the 800V direct current (VDC) power architecture announced by NVIDIA of Santa Clara, CA, USA at Computex 2025 for AI infrastructure...

Covering bandwidths from 100 MHz to 1 GHz, R&S MXO 3 oscilloscopes capture up to 4.5 million waveforms/s with 99% real-time visibility. According to R&S, the 4- and 8-channel models deliver responsive, precise performance in a space-saving form factor at a more accessible price point.

The MXO 3 offers hardware-accelerated zone triggering at up to 600,000 events/s, 50,000 FFTs/s, and 600,000 math operations/s, with a minimum trigger re-arm time of just 21 ns. It resolves small signal changes alongside larger ones with 12-bit vertical resolution at all sample rates, enhanced 18-bit HD mode, 125 Mpoints of standard memory, and a maximum sample rate of 5 Gsamples/s.

Both the 4- and 8-channel scopes come in a portable 5U design, weighing only about 4 kg, and fit easily on benches, even crowded ones. Each includes an 11.6-in. full-HD display with a capacitive touchscreen and intuitive user interface. VESA mounting compatibility allows additional flexibility in engineering environments.

Prices for the MXO3 oscilloscopes start at just over $6000.

MXO 3 product page

Rohde & Schwarz 

The post Fast, compact scopes reveal subtle signal shifts appeared first on EDN.

Three magnet-free inductive position sensors from Renesas provide a cost-effective alternative to magnetic and optical encoders. With different coil architectures, the ICs address a wide range of applications in robotics, medical devices, smart buildings, home appliances, and motor control.

The dual-coil RAA2P3226 uses a Vernier architecture to deliver up to 19-bit resolution and 0.01° absolute accuracy, providing true power-on position feedback for precision robotic joints. The single-coil RAA2P3200 prioritizes high-speed, low-latency operation for motor commutation in e-bikes and cobots, with built-in protection for robust industrial use. Also using single-coil sensing, the RAA2P4200 offers a compact, cost-efficient option for low-speed applications such as service robots, power tools, and medical devices.

All three sensors share a common inductive sensing core that enables accurate, contactless position measurement in harsh industrial environments. Each device supports rotary on-axis, off-axis, arc, and linear configurations, and includes automatic gain control to compensate for air-gap variations. A 16-point linearization feature enhances accuracy.

The sensors are now in volume production, supported by a web-based design tool that automates coil layout, simulation, and tuning.

RAA2P3226 product page 

RAA2P3200 product page 

RAA2P4200 product page 

Renesas Electronics 

The post Inductive sensors broaden motion-control options appeared first on EDN.

GaN and SiC power semiconductors from AOS support NVIDIA’s 800-VDC power architecture for next-gen AI infrastructure, enabling data centers to deploy megawatt-scale racks for rapidly growing workloads. Moving from conventional 54-V distribution to 800 VDC reduces conversion steps, boosting efficiency, cutting copper use, and improving reliability.

The company’s wide-bandgap semiconductors are well-suited for the power conversion stages in AI factory 800‑VDC architectures. Key device roles include:

• High-Voltage Conversion: SiC devices (Gen3 AOM020V120X3, topside-cooled AOGT020V120X2Q) handle high voltages with low losses, supporting power sidecars or single-step conversion from 13.8 kV AC to 800 VDC. This simplifies the power chain and improves efficiency.
• High-Density DC/DC Conversion: 650-V GaN FETs (AOGT035V65GA1) and 100-V GaN FETs (AOFG018V10GA1) convert 800 VDC to GPU voltages at high frequency. Smaller, lighter converters free rack space for compute resources and enhance cooling.
• Packaging Flexibility: 80-V and 100-V stacked-die MOSFETs (AOPL68801) and 100-V GaN FETs share a common footprint, letting designers balance cost and efficiency in secondary LLC stages and 54-V to 12- V bus converters. Stacked-die packages boost secondary-side power density.

AOS power technologies help realize the advantages of 800‑VDC architectures, with up to 5% higher efficiency and 45% less copper. They also reduce maintenance and cooling costs.

Alpha & Omega Semiconductor

The post AOS devices power 800-VDC AI racks appeared first on EDN.

Keysight’s AE6980T Optical Automotive Ethernet Transmitter Test Software qualifies optical transmitters in next-gen nGBASE-AU PHYs for IEEE 802.3cz compliance. The standard defines optical automotive Ethernet (2.5–50 Gbps) over multimode fiber, providing low-latency, EMI-resistant links with high bandwidth, and lighter cabling. Keysight’s platform helps enable faster, more reliable in-vehicle networks for software-defined and autonomous vehicles.

Paired with Keysight’s DCA-M sampling oscilloscope and FlexDCA software, the AE6980T offers Transmitter Distortion Figure of Merit (TDFOM) and TDFOM-assisted measurements, essential for evaluating optical signal quality. Device debugging is simplified through detailed margin and eye-quality evaluations. The compliance application also automates complex test setups and generates HTML reports showing how devices pass or fail against defined limits.

AE6980T software provides full compliance with IEEE 802.3cz-2023, Amendment 7, and Open Alliance TC7 test house specifications. It currently supports 10-Gbps data rates, with 25 Gbps planned for the future.

For more information about Keysight in-vehicle network test solutions and their automotive use cases, visit Streamline In-Vehicle Networking.

AE6980T product page 

Keysight Technologies 

The post Optical Tx tests ensure robust in-vehicle networks appeared first on EDN.

Two half-bridge GaN gate drivers from ST integrate a bootstrap diode and linear regulators to generate high- and low-side 6-V gate signals. The STDRIVEG210 and STDRIVEG211 target systems powered from industrial or telecom bus voltages, 72-V battery systems, and 110-V AC line-powered equipment.

The high-side driver of each device withstands rail voltages up to 220 V and is easily supplied through the embedded bootstrap diode. Separate gate-drive paths can sink 2.4 A and source 1.0 A, ensuring fast switching transitions and straightforward dV/dt tuning. Both devices provider short propagation delay with 10-ns matching for low dead-time operation.

ST’s gate drivers support a broad range of power-conversion applications, including power supplies, chargers, solar systems, lighting, and USB-C sources. The STDRIVEG210 works with both resonant and hard-switching topologies, offering a 300-ns startup time that minimizes wake-up delays in burst-mode operation. The STDRIVEG211 adds overcurrent detection and smart shutdown functions for motor drives in tools, e-bikes, pumps, servos, and class-D audio systems.

Now in production, the STDRIVEG210 and STDRIVEG211 come in 5×4-mm, 18-pin QFN packages. Prices start at $1.22 each in quantities of 1000 units. Evaluation boards are also available.

STDRIVEG210 product page 

STDRIVEG211 product page 

STMicroelectronics

The post Gate drivers tackle 220-V GaN designs appeared first on EDN.

STMicroelectronics of Geneva, Switzerland has unveiled a complete prototype of its new power delivery system as it develops new chip designs supporting the 800VDC power architecture announced by NVIDIA of Santa Clara, CA, USA for next-generation AI data centers...