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By Jessy Cavazos, 6G Solutions Expert

As the world prepares for the next leap in wireless technology, India is shaping a bold and inclusive vision for 6G, one that goes beyond speed and latency to address real-world challenges. In a recent interview, Mohmedsaeed Mombasawala, Keysight’s General Manager for Industry Solutions in India, and a key contributor to 6G research efforts in India, shared insights into how the country is approaching 6G with a unique blend of pragmatism, innovation, and social impact.

Representational Image

A Use-Case First Philosophy

India’s 6G strategy is fundamentally use-case driven, a departure from traditional infrastructure-first rollouts. Rather than focusing solely on technical specifications or spectrum availability, the country is prioritizing solutions that address societal needs, especially in sectors like agriculture, healthcare, and logistics.

This approach is particularly relevant for India’s vast and diverse population, where connectivity gaps persist in rural and remote areas. Mombasawala emphasized that 6G must be more than a technological upgrade: it must be a platform for transformation.

“We’re not just building networks. We’re building solutions for farmers, doctors, and supply chain operators,” he explained.

By anchoring 6G development in real-world applications, India aims to ensure that the technology delivers tangible benefits to communities that have historically been underserved by previous generations of wireless infrastructure.

AI-Native Networks: Intelligence at the Core

One of the most exciting aspects of India’s 6G vision is the emphasis on AI-native radio access networks (RAN). In this model, artificial intelligence isn’t just a tool, it’s a foundational design element. AI will be embedded throughout the network, enabling dynamic spectrum allocation, predictive maintenance, and real-time optimization of resources.

This shift reflects India’s strength in software and data science, positioning the country to play a key role in intelligent network design. It also aligns with global trends toward more autonomous and adaptive systems, where networks can learn, evolve, and respond to changing conditions without human intervention.

“AI will be central to how we manage, scale, and secure 6G networks,” Mombasawala noted. “It’s not just about efficiency, it’s about enabling new capabilities.”

Spectrum Strategy: Balancing Reach and Performance

While many countries are exploring high-frequency bands for ultra-fast data rates, India is taking a pragmatic approach to spectrum. The focus is on frequency range 3 (FR3) bands, which offer a balance between performance and coverage. These midband frequencies are well-suited for India’s geographic and demographic diversity, allowing for a broader reach without the need for dense infrastructure.

This strategy reflects a deep understanding of India’s connectivity landscape, where rural access remains a critical challenge. By prioritizing spectrum that supports ubiquitous coverage, India is ensuring that 6G can serve both urban innovation hubs and remote villages.

Collaborative R&D and Global Engagement

India’s 6G efforts are deeply collaborative, involving academia, startups, industry leaders, and government agencies. Mombasawala highlighted the importance of cross-sector partnerships in driving innovation and ensuring that 6G solutions are both technically robust and socially relevant.

At the same time, India is actively participating in global standardization efforts, contributing to international dialogues while tailoring its approach to local needs. This dual strategy—global alignment with local customization—is key to building a 6G ecosystem that is both interoperable and inclusive.

A Blueprint for Inclusive Innovation

India’s vision for 6G offers a compelling blueprint for countries seeking to balance technology innovation with social impact. By focusing on use cases, AI-native design, and inclusive spectrum planning, India is not just preparing for 6G; it’s redefining what 6G can be.

This approach challenges the notion that next-generation technology must be exclusive or elite. Instead, it positions 6G as a tool for empowerment, capable of transforming lives and industries across the socioeconomic spectrum.

“We want 6G to be a catalyst for change,” Mombasawala concluded. “Not just in how we connect, but in how we live, work, and grow.”

The post India’s Vision for 6G: Use-Case Driven Innovation and AI-Enabled Networks appeared first on ELE Times.

ROHM and Tata Electronics announced their strategic partnership for semiconductor manufacturing in India for both the Indian and global markets. The partnership aims to leverage the expertise and ecosystem of both companies in order to expand business opportunities for both ROHM and Tata Electronics, thereby further strengthening the relationship between the semiconductor industries of Japan and India.

As an initial focus, ROHM and Tata Electronics will establish a manufacturing framework for power semiconductors in India by combining ROHM’s leading device technologies with the advanced backend technologies of Tata Electronics. In addition, by integrating the sales channels and networks, the partnership will create new business opportunities in the Indian market and deliver higher-value solutions to a wide range of customers.

As the first step in this collaboration, Tata Electronics will assemble and test ROHM’s India-designed automotive-grade Nch 100V, 300A Si MOSFET in a TOLL package, targeting mass production shipments by next year. The companies will also explore co-development of high-value packaging technologies in the future. Both companies will combine efforts to market the products manufactured through this collaboration.

The partnership embodies the Government of India’s “Make in India” vision, as well as the philosophy of “Designed in India, Manufactured in India.” The ROHM–TATA partnership marks an important step toward delivering value to customers in the Indian market by building an ecosystem that includes design, development, and manufacturing – all within India. The partnership enhances Domestic Value Addition and enables a stable supply of products optimised for the Indian market.

Discussing the partnership, Dr Randhir Thakur, CEO & MD, Tata Electronics, said, “Tata Electronics is deeply committed to pioneering a thriving semiconductor industry in India. We are excited to partner with ROHM, a global leader in semiconductor solutions. With a strong legacy of quality and reliability across products for a broad range of markets, ROHM brings deep domain expertise to this partnership. Through our semiconductor assembly and test facilities, Tata Electronics will deliver advanced chip packaging services to support ROHM in creating products tailored for Indian and global markets. This partnership will go a long way in bringing in trust and resilience in the global semiconductor supply chain while also expanding our respective business opportunities.”

Dr. Kazuhide Ino, Member of the Board, Managing Executive Officer, ROHM Co., Ltd., said, “We are delighted to collaborate with Tata Electronics, a leading Indian corporate group with advanced packaging capabilities. Through this partnership, we aim to expand our lineup of packaged products manufactured in India and help build a sustainable, region-based supply chain network. We are confident that this collaboration will enable us to meet the growing demand from Indian customers seeking domestically produced semiconductors. We also envision supplying jointly manufactured products to the global market.”

The post Innovation led through ROHM & Tata Electronics’ Strategic Partnership in Semicon Business appeared first on ELE Times.

Courtesy: Sandhya Arun, Chief Technology Officer, Wipro Limited

2025 marked a pivotal year of foundational shifts for the global IT industry, as enterprises transitioned from experimentation to the meaningful adoption of AI. Generative AI and automation have become mainstream, and early agent-led models have begun influencing how decisions are made across the enterprise, always with human oversight at the core.

As we look ahead to 2026, the focus will decisively shift to AI systems operating at scale, embedded within critical business workflows. We will see the rise of collaborative AI, and importantly, this evolution elevates the role of people, from execution to orchestration, where human judgment, governance, and strategic intent remain paramount. Ultimately, success will depend on talent readiness and continuous skilling.

Enterprises are increasingly prepared for large-scale deployment, while regulators worldwide are shaping frameworks that balance innovation with responsibility. Together, these forces are ushering in a world of intelligent, autonomous, and mission-oriented systems – reshaping how businesses operate and how humans and machines coexist.

Here are seven technology trends that will define 2026.

1. Agentic AI will actuate the autonomous enterprise 

Enterprises are moving from isolated agentic AI experiments to pragmatic, enterprise-wide strategies focused on measurable business outcomes. By 2026, networks of collaborating AI agents will manage complex workflows across IT, HR, finance, marketing, sales, legal, procurement, operations, supply chains, customer engagement, and commerce. As AI gains autonomy, the human role evolves toward strategic direction, governance, and human-centric steering.

2. Embodied AI will unlock the physical economy

AI will increasingly be embedded in robots, vehicles, machines, and intelligent devices, evolving from standalone units into connected ecosystems integrated through an “AI mesh”. With enhanced spatial awareness and autonomy, embodied AI will drive adoption across healthcare, manufacturing, energy, utilities, mobility, and logistics, improving safety, efficiency, and human experience in complex or hazardous environments.

3. Digital Twin and AI will transform operations

The combination of Digital Twins (DTs) and AI will enable intelligent virtual models that continuously simulate, predict, and optimize physical assets and processes through real-world simulations. These AI-enabled DTs will support preventive maintenance, real-time monitoring, product design, testing, and resource optimization, helping organizations become more agile, resilient, and data-driven.

4. Domain-Native AI will drive deep vertical mastery

We will see a growing shift towards specialized, “industry or domain-native” models rather than broad, general-purpose ones. These models will be trained on industry-specific datasets and built with contextual intelligence such as ontology, risk controls, safety and regulatory requirements – embedded into the solution from the start. Smaller, focused models will deliver deeper expertise and better accuracy in specific areas, while also being more cost-effective and less resource-intensive.

5. Programmable money will become the new economic engine

Distributed Ledger Technologies are moving from pilots to real-world use, enabling transparent and immutable record keeping without central control. With growing regulatory clarity and the rise of CBDCs, decentralized finance will become more enterprise-ready, supporting use cases such as tokenized bonds, autonomous lending, and always-on settlement. Stablecoins and asset tokenization will further accelerate faster, more efficient finance across cross-border payments, supply chains, and digital asset management.

6. Quantum Technology will mark the birth of new era

Breakthroughs in quantum computing are opening up new possibilities for solving problems that are too complex for traditional systems. Early use cases are emerging across pharma and life sciences, financial services, and materials science, with technology-forward enterprises already experimenting through Quantum Computing as a Service. At the same time, quantum advances pose risks to existing encryption standards, accelerating the shift towards quantum-safe algorithms and Post Quantum Cryptography (PQC).

7. Workforce readiness will be a C-Suite survival metric

Workforce readiness is critical to unlocking value from frontier technologies. High-potential talent will be defined by continuous learning, practical application of new skills, sound judgment, and initiative. Organizations that foster a culture of learning, collaboration, and effective human–machine collaboration will gain a clear advantage, with change management becoming a core leadership responsibility as advanced technologies scale.

These trends point to a future where humans and machines operate as integrated systems, reshaping business models, value creation, and the nature of work itself. Enterprises that invest in people, embed governance into innovation, and reimagine their operating DNA will be best positioned to thrive in an AI-first world.

The post Technology trends reshaping operations of enterprises in 2026 appeared first on ELE Times.

I’ll open with the project’s biggest criticism from everyone around me: yes this thing does require working SIM, which means money, which means the project has a recurring cost component. It was built at the launch of Pacific Bell Mobile Services (PBMS) later Pacific Bell Wireless (PBW), Cingular and AT&T – the first GSM network on the west. As soon as I got the phone, texting immediately caught my eye. The project receives SMS commands and flips GPIOs to control a 24v Patlte tower via Opto22 – like those you see on a factory floor machines. Simple commands are texted to the phone number of the SIM inside the Wavecom module: yellow on/off, red on/off… and it replies with “done”. Now the Arduino context: the board is an early Futurelec ET-JRAVR with AT90S2313, firmware upload with PonyProg. Code you ask: Notepad and GNU GCC – hassle galore, however imagine the Star Wars-like magic of texting on your Nokia 3310; hitting send and in few seconds the tower lights up! Forget the dot-com crash; and S&P carnage. Just look at that cute little 1.9GHz GSM antenna (the only GSM band at the time), got it at Weird Stuff Warehouse. And yes, I was a big fan (still am) of Opto22; I have boxes with hundreds of modules; love them yellow, white, black and red! submitted by /u/bubba198 [link] [comments]

3D printing is such a fascinating field of technology, so a couple months ago, I decided to take a deep dive and learn how they actually work! This took me to one of my very first PCB projects, a small, cheap, 3D printer motherboard. While it's not the most cutting edge board, I learned a lot and I fully documented my process designing it (https://github.com/KaiPereira/Cheetah-MX4-Mini/blob/master/J...), so other people can learn from my mistakes! It runs off of an STM32H743 MCU, has 4 TMC stepsticks with UART/SPI configurations, sensorless/endstop homing, thermistor and fan ports, parallel, serial and TFT display connectors, bed and heater outputs and USB-C/SD Card printing, all in a small 80x90mm form factor with support for Marlin and Klipper! Because it's smaller and cheaper than a typical motherboard, you can use it for smaller/more affordable printers, and other people can also reference the journal if they're making their own board! If I were to make a V2, I would probably clean up the traces/layout of the PCB, pay more attention to trace size, stitching and fills, BOM optimize even further, and add another motor driver or two to the board. I also should've payed a bit more attention to how much current I would be drawing, and also the voltage ratings, because some of the parts are under-rated for the power. I just got it running after a bit of bodging and I plan on using it to create a foldup printer I can bring to hackathons across the world! The project is fully open source, and journaled, so if you'd like to check it out it's on GitHub (https://github.com/KaiPereira/Cheetah-MX4-Mini)! I absolutely loved making this project and I'd love to hear what you guys would want to see in a V2! submitted by /u/KaiPereira [link] [comments]

This is a project that's been in the works for a while, I had been trying to find more compact and portable compute options for various projects and eventually settled on making my own carrier PCB for the CM5 which fullfills my needs. It's fully opensource so please do check it out! https://github.com/azlan-works/Argo https://oshwlab.com/azlan777/argo submitted by /u/AmountOk3836 [link] [comments]

When I tested this board I thought that I had designed it wrong, so I cut 19 traces (in the upper left corner) and rerouted them with patch wires. But it turned out that it was right from the beginning so I had to re-solder the newly added wires to restore the original configuration. A lot of soldering just to uglify the board... Carpenters have this rule "Measure twice, cut once.", maybe electronics engineers should have something similar like "Test twice, don't patch" ;-) submitted by /u/matseng [link] [comments]

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WARNING! High voltage AC and DC on hot side of this circuit. Do NOT attempt to build any SMPS if you are a beginner. You need at least simple LCR meter and high-voltage oscilloscope probe for tuning. Caution is advised! One of two higher power supplies that I need for my projects, this one is largest made by me. Transformer is a custom made also at home. Circuit and transformer design schematics in gallery. submitted by /u/ZaznaczonyKK [link] [comments]

Introducing Open-Schematics: largest public hardware schematic dataset, paired with images. submitted by /u/themoonbender [link] [comments]

Aerospace, Defense & security firm Leonardo S.p.A. of Rome, Italy has announced a major step forward in the development and implementation of the Michelangelo Dome advanced integrated defence system technology enablers, signing a contract with Italy-based TELEDIFE (Direzione Informatica Telematica e Tecnologie Avanzate) for the development and delivery of four next-generation radars, designed to counter long-range ballistic threats (3000km)...

Omnivision’s OP03021 liquid crystal on silicon (LCOS) panel integrates the display array, driver, and memory into a low-power, single-chip design. The full-color microdisplay delivers a resolution of 1632×1536 pixels at 90 Hz in a compact 0.26-in. optical format, enabling smart glasses to achieve higher resolution and a wider field of view.

The microdisplay features a 3.0-µm pixel pitch and operates with a 90-Hz field-sequential input using a MIPI C-PHY trio interface. Panel dimensions are just 7.986×25.3×2.116 mm, saving board space in wearables such as augmented reality (AR), extended reality (XR), and mixed-reality (MR) smart glasses and head-mounted displays.

The OP03021 is offered in a compact 30-pin FPCA package. Samples are available now, with mass production scheduled to begin in the first half of 2026. For more information, contact a sales representative here.

OP03021 product page

Omnivision

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Voyant has announced the Helium family of fully solid-state 4D FMCW LiDAR sensors and modules for simultaneous depth and velocity measurement. Based on a proprietary silicon photonic chip, the platform provides scalable sensing and high-resolution point-cloud data.

Helium employs a dense 2D photonic focal plane array with integrated 2D on-chip beam steering, enabling fully electronic scanning. A 2D array of surface emitters implements FMCW operation in a compact, solid-state architecture with no moving parts.

Key advantages of Helium include:

• Configurable planar array resolution: 12,000–100,000 pixels
• FMCW operation with per-pixel radial velocity measurement
• Software-defined LiDAR enabling adaptive scan patterns and regions of interest
• Ultra-compact form factor: <150 g mass, <50 cm³ volume

Helium sensors and modules will be available in multiple resolution and range configurations, supporting FoVs ranging from up to 180° wide to narrow long-range optics.

Voyant is offering early access to Helium for collaborators to explore custom chip resolutions, FoVs, module configurations, multi-sensor fusion, and software-defined scanning. To participate or request more information, contact earlyaccess@voyantphotonics.com.

Helium product page 

Voyant Photonics

The post FMCW LiDAR delivers 4D point clouds appeared first on EDN.

Diodes has expanded its series of automotive-compliant bipolar transistors with 12 NPN and PNP devices designed to achieve ultra-low VCE(sat). With a saturation voltage of just 17 mV at 1 A and on-resistance as low as 12 mΩ, the DXTN/P 78Q and 80Q series minimize conduction losses by up to 50% versus previous generations, enabling cooler operation and easier thermal management.

The transistors feature collector-emitter voltage ratings (BVCEO) of 30 V, 60 V, and 100 V, and can handle continuous currents up to 10 A (20 A peak), making them suitable for 12‑V, 24‑V, and 48‑V automotive systems. They can be used for gate driving MOSFETs and IGBTs, power line and load switching, low-dropout voltage regulation, DC/DC conversion, and driving motors, solenoids, relays, and actuators.

Rated for continuous operation up to +175°C and offering high ESD robustness (HBM 4 kV, CDM 1 kV), the devices ensure reliable performance in harsh automotive environments. Housed in a compact 3.3×3.3-mm PowerDI3333-8 package, they reduce PCB footprint by up to 75% versus SOT223, while a large underside heatsink delivers low thermal resistance of 4.2°C/W.

The DXTN/P 78Q series is priced from $0.19 to $0.21, while the DXTN/P 80Q series is priced from $0.20 to $0.22, both in 6000-piece quantities. Access product pages and datasheets here.

Diodes

The post Bipolar transistors cut conduction voltage appeared first on EDN.

Samsung Electro-Mechanics’ CL32C333JIV1PN# high-voltage MLCC is designed for use in CLLC resonant converters targeting xEV applications such as BEVs and PHEVs. The capacitor provides 33 nF at 1000 V in a compact 1210 (3.2×2.5 mm) package, leveraging a C0G dielectric for high stability.

Maintaining capacitance across –55°C to +125°C with minimal sensitivity to temperature and bias, the device is well suited for high-frequency resonant tanks where electrical consistency directly impacts efficiency and control margin. The surface-mount capacitor enables power electronics designers to reduce component count and footprint in high-voltage CLLC resonant converter designs without compromising reliability.

Alongside the CL32C333JIV1PN#, the company offers two additional 1210-size C0G capacitors. The CL32C103JXV3PN# provides 10 nF at 1250 V, while the CL32C223JIV3PN# provides 22 nF at 1000 V. All three devices are manufactured using proprietary fine-particle ceramic and electrode materials, combined with precision stacking processes, and are optimized for EV charging systems.

The CL32C333JIV1PN#, CL32C103JXV3PN#, and CL32C223JIV3PN# are now in mass production.

Samsung Electro-Mechanics 

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Nordic Semiconductor’s nRF9151 SMA Development Kit (DK) helps engineers build cellular IoT, DECT NR+, and non-terrestrial network (NTN) applications. The kit’s onboard nRF9152 SiP module now features updated modem firmware that enables direct-to-satellite IoT connectivity, adding support for NB-IoT NTN in 3GPP Release 17. The firmware also supports terrestrial LTE-M and NB-IoT networks, along with GNSS.

By replacing internal antennas with SMA connectors, the development board allows direct connection to lab equipment or external antennas for precise RF characterization, power measurements, and field testing. Based on an Arduino Uno–compatible form factor, the board features four user-programmable LEDs, four user-programmable buttons, a Segger J-Link OB debugger, a UART interface via a VCOM port, and a USB connection for debugging, programming, and power.

To accelerate prototyping, the DK includes Taoglas antennas for LTE, NTN, and NR+, along with a Kyocera GNSS antenna. It also provides IoT SIM cards and trial data, enabling immediate terrestrial and satellite connectivity through Deutsche Telekom, Onomondo, and Monogoto.

The nRF9151 SMA DK is available now from Nordic’s distribution partners, including DigiKey, Braemac, and Rutronik. The alpha modem firmware can be downloaded free of charge from the product page linked below.

nRF9151 SMA DK product page 

Nordic Semiconductor 

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Lumileds of Eindhoven, The Netherlands says that its Versat 2016 is designed to address the necessary illumination specifications, reduce the engineering complexity and support the economic requirements for the growing segment of animated, personalized car-body lighting. With LUXEON Versat 2016 singular optical elements, backlit optical surfaces and 3D illuminated structures can all be successfully addressed, ushering in the expansion of car illumination beyond traditional signaling into styling and communication lighting...

Electronics design engineers spend substantial effort on schematics, simulation, and layout. Yet, a component’s long-term success also depends on how well its physical form aligns with downstream mechanical manufacturing processes.

When mechanical design for manufacturing (DFM) is treated as an afterthought, teams can face tooling changes, line stoppages, and field failures that consume the budget and schedule. Building mechanical constraints into design decisions from the outset helps ensure that a concept can transition smoothly from prototype to production without surprises.

The evolving electronic prototyping landscape

Traditional rigid breadboards and perfboards still have value, but they often fall short when a device must conform to curved housings of wearable formats. Engineers who prototype only on flat, rigid platforms may validate electrical behavior while missing mechanical interactions such as strain, connector access, and housing interface.

Scientists are responding with prototype approaches that behave more like the eventual product. For example, MIT researchers, who developed the flexible breadboard called FlexBoard, tested the material by bending it 1,000 times and found it to be fully functional even after repeated deformation.

This bidirectional flexibility allowed the platform to wrap around curved surfaces. It also gave designers a more realistic way to evaluate electronics for wearables, robotics and embedded sensing, where hardware rarely follows a simple planar shape. As these flexible platforms mature, they encourage engineers to think of mechanical behavior not as a late-stage limitation but as a design parameter from the very first version.

Integrating mechanical processes in design

Once a prototype proves the concept, the conversation quickly shifts toward how each part will be manufactured at scale. At this stage, the schematic on paper must reconcile with press stroke limits, tool access, wall thickness, and fixturing. Designing components with specific processes in mind reduces the risk of discovering later that geometry cannot be produced within the budget or timeline.

Precision metal stamping

Metal stamping remains a core process for electrical contacts, terminals, EMI shields, and mini brackets. It excels when parts repeat across high volumes and require consistent form and dimensional control.

A key example is progressive stamping, in which a coil of metal advances through a die set, where multiple stations perform operations in rapid sequence. It strings steps together, so finished features emerge with high repeatability and narrow dimensional spread, making the process suitable for high-volume component manufacturing.

Early collaboration with stamping specialists is beneficial. Material thickness, bend radii, burr direction, and grain orientation all influence tool design and reliability. Features such as stress-relief notches or coined contact areas can often be integrated into the strip layout with little marginal cost once they are considered before the tool is built.

CNC machining

CNC machining often becomes the preferred option where only a few pieces are necessary or shapes are more complicated. It supports complex 3D forms, small production runs, and late-stage changes with fewer up-front tooling costs compared to stamping.

Machined aluminum or copper heatsinks, custom connector housings, and precision mounting blocks are common examples. Designers who plan for machining will benefit from consistent wall thicknesses, accessible tool paths, and tolerances that fit the machine’s capability.

Advanced materials for component durability

The manufacturing method is only part of the process. The base material choice can determine whether a design survives thermal cycles, vibrations, and electrostatic exposure over years of service. Recent work in advanced and responsive materials provides design teams with additional tools to manage these threats. Self-healing polymers and composites are notable examples.

Some of these materials incorporate conductive fillers that redirect electrostatic charge. By steering current away from a single microscopic region, the structure avoids excessive local stress and preserves its functionality for a longer period. For applications such as wearables and portable electronics, this behavior can support longer service intervals and a greater perceived quality.

Engineers are also evaluating high-temperature polymers, filled elastomers, and nanoengineered coatings for use in flexible and stretchable electronics. Each material brings trade-offs in cost, process compatibility, recyclability, and performance. Considering those alongside mechanical processes and board layout helps establish a coherent path from prototype through volume production.

The next generation of electronic products demands a perspective that merges circuit behavior with how parts will be formed, assembled, and protected in real-world environments. Flexible prototyping platforms, process-aware designs for stamping and machining, and careful selection of advanced materials all contribute to this mindset.

When mechanical manufacturing is considered from the get-go, design teams position their work to run reliably on production lines and in the hands of end users.

Ellie Gabel is a freelance writer and associate editor at Revolutionized.

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