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In consideration of the escalating global tensions and the growing importance of technology as a strategic measure, it is imperative for India to effectively harness both its geopolitical flexibility and technological aspirations in order to influence the forthcoming narrative, rather than merely adapting to it.

The upcoming power shifts will pivot on technological innovations rather than traditional trade agreements or territorial disputes. The future dynamics will be shaped by advancements in semiconductor chips, software code, and cybersecurity measures and more.

The convergence of the world’s two largest elements of influence – geopolitics and technology, is increasingly significant. The U.S.-China rivalry has evolved far beyond issues like tariffs or Taiwan; it now revolves around determining the dominant force in areas such as AI, semiconductors, quantum technology, and space exploration. Each action taken, whether it’s an export ban, a satellite launch, or the implementation of data regulations, serves as a strategic geopolitical statement in this high-stakes competition.

In the contemporary global landscape, there exists a new form of conflict often referred to as the digital cold war. A significant event that unfolded in 2024 was the United States’ decision to prohibit the use of Chinese connected car technology. This action led to a retaliatory move from China, where they openly released their artificial intelligence models to contest the prevailing Western supremacy in the field. It is crucial to note that the battlefield in this modern era of conflict is not defined by physical borders but by the intricate interplay of algorithms and technological advancements.

Tech is no longer just an industry; it has evolved into essential infrastructure that plays a critical role in shaping various aspects of our lives. India’s Digital Public Infrastructure (DPI), encompassing services ranging from Aadhaar to UPI, has transcended national boundaries to become a significant soft power export.

Despite India’s $10 billion incentive scheme successfully attracting major players in the semiconductor industry like Micron, AMD, and Tower Semiconductor, the establishment of fabs remains a time-intensive endeavor. However, India can strategically focus on dominating chip design, intellectual property (IP) creation, and nurturing talent.

Cybersecurity is a pressing concern in India. Emerging threats such as AI-powered malware, ransomware, and supply chain attacks are on the rise.

Geopolitics has evolved beyond traditional diplomacy into a realm where data plays a crucial role. India’s implementation of data localisation laws, its approach towards cross-border data flows, and its emphasis on developing indigenous cloud infrastructure demonstrate strategic moves with geopolitical implications. The underlying premise is clear: whoever controls the data also controls the narrative.

India’s presence in space is gaining momentum, evident through increasing commercial launches by the Indian Space Research Organisation (ISRO). India’s progression must advance from being a mere launchpad to assuming a leadership role in the space domain.

The field of quantum computing represents another frontier where India is making significant strides. The National Quantum Mission, initiated in 2023 with funding amounting to ₹6,000 crore, targets the development of 50–100 qubit systems by 2026.

India is currently making its point very clear. The pathway involves becoming a tech leader that no more relies on Western platforms and Chinese hardware. India chooses to assert itself as a tech powerhouse by developing its own systems, influencing global standards, and sharing its expertise in digital governance.

Moreover, India is no more a mere geopolitical pawn, reacting to external changes, rather it is emerging as a significant player that actively shapes international regulations. These two key tools are now at India’s disposal – geopolitics and technology.

Devendra Kumar
Editor

The post Tech Diplomacy: India’s Strategic Power Play in the Global Arena appeared first on ELE Times.

Learn how “right-sized” machine learning enables edge devices to make critical decisions locally, improving reliability and reducing reliance on cloud connectivity in remote, volatile environments.

As LED systems are increasingly used in automotive applications, Melexis develops a highly configurable, code-free LIN LED driver that simplifies the development of dynamic RGB-LED automotive ambient lighting applications. In addition to reducing development time, the MLX80124 also eliminates the need for embedded software development expertise, Melexis said.

“This is a new level of product for Melexis. With its built-in functionality and full configurability, this IC offers engineers a radically simpler way to create automotive ambient lighting systems—without writing any code,” said Michael Bender, product line director, Melexis, in a statement. “As the world’s first code-free LIN RGB LED driver, the MLX80124 represents a major shift in how automotive lighting electronics are developed. It dramatically shortens design cycles while maintaining all the robustness and functionality expected by OEMs and tier 1s.”

(Source: Melexis)

The MLX80124 smart LIN RGB ambient light controller features an intuitive graphical user interface that engineers use to access configurable parameters without writing or compiling code. It features high-voltage output drivers, each offering configurable current sources up to 60 mA to support RGB ambient lighting configurations. It is fully qualified to AEC-Q100 and compliant with ISO 26262 up to ASIL B for automotive-grade ambient lighting systems, providing full lighting functionality.

The LIN LED driver delivers precise, LED-agnostic RGB color mixing with temperature compensation. Engineers only need to input the correct optical data for their selected LED.

Other features include a suite of diagnostic features, including open/short detection and supply monitoring. The operating temperature range is -40°C to 125°C.

The MLX80124 LIN LED driver, developed using advanced bipolar-CMOS-DMOS technology, is housed in a compact SOIC-8 package and features pin-to-pin compatibility with other Melexis drivers such as the MLX81124 or MLX81123. It is available now.

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Infineon Technologies AG launches two new secured prepaid tags for closed-loop gift cards, reducing the risk of tampering. These new solutions join Infineon’s secured EMV prepaid tag for open-loop gift cards.

(Source: Infineon Technologies AG)

The U.S. Federal Trade Commission reported losses of $212 million for gift or reload cards in 2024. The new secured prepaid tags target closed-loop gift cards, which are processed in retailer-specific or closed-loop environments, and replace the need for visible codes, barcodes, or magnetic stripes with a secured chip using cryptographic mechanisms.

The chips can be accessed using near-field communication (NFC) devices by using a consumer’s phone authenticated with the necessary data, allowing both retailers and consumers to tap the gift card for activation, check the balance, and redeem assets, Infineon said.

Infineon’s secured EMV prepaid tag solution helps mitigate fraud issues for open-loop gift cards by enabling tap-and-pay at any point-of-sale merchant device or retail outlet processed via payment networks.

Infineon’s first partner in the gift card industry is Karta Gift Card Ltd. The company provides support of AES encryption protocols and processing capabilities, offering cryptographic validation to avoid gift card cloning, skimming, and replay attacks, Infineon said.

Infineon’s prepaid tag solutions for gift cards are available today. The new solutions are fully compatible with existing manufacturing infrastructures for smart cards and paper tickets, and the secured EMV prepaid tag solution is fully EMV compatible, supporting the latest approved Visa and MasterCard applets.

The post Secured prepaid tags improve gift card security appeared first on EDN.

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) modules that can be integrated into consumer products, off-grid applications and aerospace applications – has announced a strategic partnership with Defiant Space Corp, an emerging space company focused on scalable solutions for the defense and national security market...

Renesas has added three magnet-free inductive position sensor ICs and a web-based coil design tool, offering a cleaner alternative to magnetic and optical encoders.

Renesas RA8M2 and RA8D2 MCUs integrate dual CPU cores—a 1-GHz Arm Cortex-M85 and an optional 250-MHz Cortex-M33—delivering over 7300 CoreMark points. RA8M2 devices suit general-purpose use, while RA8D2 MCUs target high-end graphics and HMI applications.

Both groups employ Arm’s Helium vector extension to accelerate DSP and machine-learning workloads. They provide up to 1 MB of MRAM and 2 MB of SRAM, including 256 KB TCM for the Cortex-M85 and 128 KB TCM for the Cortex-M33. The lower-power Cortex-M33 can act as a housekeeping MCU, handling system tasks while the high-performance Cortex-M85 remains in sleep mode, waking only as needed for compute-intensive operations.

With advanced graphics and imaging capabilities, the RA8D2 drives high-resolution TFT-LCDs for rich HMI designs. Its graphics controller supports up to 1280×800 displays via RGB or 2-lane MIPI DSI interfaces, aided by a 2D drawing engine that offloads rendering from the CPU. Camera and audio interfaces include 16-bit CEU and MIPI CSI-2 for vision AI, plus I²S and PDM inputs for voice-enabled applications.

The RA8M2 and RA8D2 MCUs are available now, supported by the Renesas Flexible Software Package for application development.

RA8M2 product page

RA8D2 product page

Renesas Electronics 

The post 1-GHz MCUs add dual-core flexibility appeared first on EDN.

With 10-MHz bandwidth and 50-ns response time, Allegro’s ACS37100 XtremeSense tunneling magnetoresistance (TMR) current sensor enables precise current measurement. It is designed for power-conversion systems using fast-switching GaN and SiC FETs, including EV chargers, solar string inverters, and server power supplies.

At sub-MHz frequencies, conventional magnetic sensors often lack the speed and accuracy needed for stable control and protection loops. The ACS37100 overcomes these limits with its high bandwidth and fast response, providing the high-fidelity current feedback essential for high-speed switching control.

Using XtremeSense TMR technology, the ACS37100 maintains a low noise level of 26 mA RMS across the full DC to 10‑MHz bandwidth, with ±2% sensitivity error over temperature. A voltage reference output supports differential routing in noisy environments, while a fault output provides an adjustable threshold for fast open-drain overcurrent detection.

The device provides reinforced isolation capable of withstanding 5 kV for 60 s (UL 62368‑1) and a basic working voltage of 1097 V. AEC‑Q100 Grade 0 qualification ensures operation over a -40 °C to +150 °C range. Its SOICW‑16 package offers 1.2 mΩ conductor resistance and 8 mm creepage and clearance.

Samples and evaluation boards are available to aid development.

ACS37100 product page

Allegro MicroSystems 

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Manufactured on a GaAs process, the QPA9510 RF power amplifier from Qorvo covers a frequency range of 100 MHz to 1 GHz. It delivers +35 dBm P1dB output and up to 34 dB gain, with on-chip analog gain control over a 70 dB range.

The QPA9510 serves as the final RF amplifier in GSM handsets for the 900‑MHz band and is also suited for FM and UHF applications. It can be tuned across any sub-band within its operating range and achieves 55% efficiency, extending battery life in portable radios and IoT devices. The amplifier operates from a single +2.8 V to +3.6 V supply.

When paired with Qorvo’s low-noise amplifiers, digital step attenuators, and RF switches, the QPA9510 enables complete RF front-end designs for efficient transmit and receive chains in linear communication systems. Housed in a compact 3×3 mm QFN package, it also features a pin-compatible design for reuse across product families.

The QPA9510 and evaluation board are now available through Qorvo’s authorized distributors and on Qorvo.com.

QPA9510 product page

Qorvo

The post RF amplifier powers GSM, FM, and UHF devices appeared first on EDN.

The Microchip PIC32-BZ6 family of wireless MCUs enables multiprotocol product development with advanced connectivity and scalability. These highly integrated devices support Bluetooth Low Energy, Thread, Matter, and proprietary protocols for smart home, automotive, industrial automation, and wireless motor control applications.

Replacing multichip solutions, the single-chip PIC32-BZ6 platform combines wired and wireless connectivity with a range of peripherals and ample memory. Analog peripherals support motor control, while touch and graphics capabilities enable rich user interfaces.

Qualified to Bluetooth Core Specification 6.0, the MCUs also support 802.15.4-based protocols and proprietary mesh networking. Interfaces for wired connectivity include two CAN-FD ports, a 10/100-Mbps Ethernet MAC, and a USB 2.0 full-speed transceiver.

PIC32-BZ6 MCUs are powered by a 128‑MHz Arm Cortex-M4Fcore and offer 2 MB of flash and 512 KB of RAM. A capacitive voltage divider supports up to 18 touch channels, while 12‑bit ADCs, 7‑bit DAC, comparators, PWMs, and QEI simplify motor control.

The PIC32-BZ6 platform currently includes a SoC and an RF-certified module, priced at $3.73 and $5.84 each, respectively, in quantities of 10,000 units.

PIC32-BZ6 product page 

Microchip Technology 

The post MCU platform powers wired and wireless apps appeared first on EDN.

Fitted with MEMS switches, two fault insertion units (FIUs) from Pickering simulate common faults in MultiGBASE-T1 communication links. The single-slot 40-205 (PXI) and 42-205 (PXIe) modules target automotive hardware-in-the-loop simulation, enabling design verification of networking components such as ADAS controllers at data rates up to 10 Gbps.

Both PXI and PXIe modules provide 4 or 8 channels of impedance-matched, two-wire signal paths that support communication protocols from legacy 10BASE-T1 to the 10GBASE-T1 automotive Ethernet standard. The FIUs help verify safe and consistent controller operation under a range of connectivity faults, including open and short circuits.

Leveraging MEMS technology, the signal channels deliver low insertion loss and VSWR, along with stable RF performance beyond 6 GHz. Fast 50-µs switching boosts test throughput, while the 3-billion-cycle lifetime ensures durability. Each channel handles up to 0.5 A and 100 V between wire pairs, and the 1.6-A fault buses allow multiple channels to share the same fault condition.

The 8-channel 40-205 (PXI) and 42-205 (PXIe) FIU modules are priced at $10,995 each.

40/42-205 product page 

Pickering Interfaces 

The post MEMS tech speeds automotive Ethernet fault tests appeared first on EDN.

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) modules that can be integrated into consumer products, off-grid applications and aerospace applications – has delivered test samples of its thin-film PV technology to both an ocean monitoring technology company (a developer of autonomous underwater vehicles capable of reaching anywhere in the ocean with a high degree of speed, endurance and sensing) and a space power lasing company (focused on advancing space and defense technologies). ..

Recently, we’ve seen Design Ideas for programmable current sources with improved accuracy using the LM3x7 series of three-legged regulators. These designs also take advantage of those classic devices’ built-in anti-overheating features. 

Some are very good, like “Improve the accuracy of programmable LM317 and LM337-based power sources.”

Others perhaps not so much…“Cross-connect complementary current sources to reduce self-heating error”…

All of them, however, had to accommodate the LM3x7 family’s need for about 5-V of supply voltage headroom when used this way. That is the voltage drawn from the supply that can never be delivered to the load. It therefore creates significant inefficiency in power utilization. It might have been picky of me, but I couldn’t resist wondering what could be done to improve (reduce) the loss.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Current source without overtemperature protection

Figure 1 shows what I started with: A simple, straightforward, accurate, 0 to 1 A current source programmed with 0 to 2.5 V. It needs only about 1.25 V of headroom, consisting mostly of the drop of current sense resistor R1 (plus a modicum more from the Ron of Q1), thus fixing the problem I started out to solve.

Figure 1 An improved efficiency precision current source has no overtemperature protection. With no protection, if the Q1 heatsink is inadequate, high power or ambient temperature might destroy it.

But sadly, in fixing one problem, I created another. 

The same elimination of LM3x7s that reduced the headroom requirement also eliminated overtemperature protection. Without a substantial external heatsink, the Si7489DP FET is rated for only ~6 W at 25 °C. If power dissipation, ambient temperature, or both happen to go higher, there’s now nothing to prevent Q1 from being cooked.

Current source with overtemperature protection

So now I wondered what might be done about that. Figure 2 shows what said wondering (wandering?) inspired.

Figure 2 External junction temperature protection for the Q1 pass transistor. Since Q1’s internal junction temperature can’t be directly measured, it must be inferred from power dissipation, junction to ambient thermal resistance, and ambient temperature. If it tops 150 oC, A1d stops the show. 

What was needed was an external version of the now missing LM3x7’s internal junction overtemperature cutoff. Of course, the challenge with implementing an external junction temperature limiter is that internal transistor junctions are a second cousin to the classic Schrodinger’s cat.

Well, maybe not exactly. Unlike the famous quantum kitty, whose temperature (whether body or room) is theoretically unknowable. Junction temperature, while difficult to directly observe, might at least be calculated. 

And in fact, this is what the right-hand half of Figure 2 does. 

The necessary junction temp math is:

Tj = (Ij Vj)/Sja + Ta 

Where:

Tj	Junction temperature
Ij	Amperage through the junction
Vj	Voltage across the junction
Sja	Thermal conductivity (watts/degree) from junction to ambient from Q1 datasheet
Ta	Ambient temperature

The analog arithmetic

Figure 2’s circuitry performs analog arithmetic by relying on the nifty 17th-century invention of John Napier for multiplication and division: adding and subtracting logarithms. Here’s how the Figure 2 circuitry divides (and multiplies!) up the work.

Q3’s Vbe is the logarithm of the Q1 current programming signal sensed via R6. Meanwhile, Q4’s Vbe logs the voltage across Q1 monitored by Q8 and R6. 

Q3 and Q4 are connected in series, so their log voltages sum. About 400 years ago (now that’s really legacy technology!) Napier showed that adding logs is equivalent to multiplication. So, the sum of Vbe’s becomes the IjVj product term in the Tj math.

The IjVj signal is applied to A1c’s non-inverting input, which then subtracts Q5’s Vbe present on the inverting input. Because subtracting logs equates to division (thanks again, Johnny!), if R8 is properly scaled, this division provides the Sja normalization term for Rja. The quotient yields the log of junction temperature rise above ambient..

The antilog transistor Q6’s collector current, in concert with the R9/R10 network (at long last!) converts A1c’s output to a 2 mV/oC junction temperature signal. That’s summed by A1d with Q7’s ambient temperature signal.

When the sum bumps against Q1’s 150 °C safety limit, A1d’s output ramps positive, overriding the programmed source current to a safe value.

Which you might say is the cat’s meow. 

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

Related Content

• Cross connect complementary current sources to reduce self-heating error
• Improve the accuracy of programmable LM317 and LM337-based power sources
• Calculator or Slide Rule?
• Special day for physicists’ cats
• Is that a banana in your pocket (or are you just glad to see me)?

The post Programmable current source with overtemperature shutoff appeared first on EDN.

Zoom is a display tool that expands the view of the selected waveform. The source trace can be expanded horizontally and vertically for detailed visual analysis or further processing. Each zoom trace can have its own horizontal and vertical scale setting, enabling views of the source trace using multiple horizontal and vertical scales. All digital oscilloscopes offer zoom functionality.

Zoom is important because oscilloscopes can acquire gigasamples of data per acquisition, with a vertical resolution of 12 or more bits. This data must be displayed on a screen with a resolution of approximately 1920 x 1080 pixels. If a full acquisition is displayed, the data has to be compacted to fit on the screen. Expanding the data with a zoom trace so that it fits within the screen resolution allows a view of all the acquired data.

Zoom demo

Zoom can be invoked from this oscilloscope’s front panel using the Zoom button. It can also be evoked interactively by touching the touchscreen and dragging the resulting box over the area to be expanded. Zoom traces can also be controlled from the Zoom Trace dialog boxes (Figure 1).

Figure 1 An example of several zoom instances used to analyze a remote keyless entry system waveform. The Zoom dialog box is used to control each zoom trace. Source: Art Pini

The source waveform from a remote keyless entry (RKE) system appears as trace M1 in the top grid. The waveform comprises an amplitude-modulated RF carrier. The modulation encodes the commands to lock a car door. Zoom is used to expand the fifth pulse in the acquired waveform horizontally. Note that the zoomed area is highlighted by increased intensity on the source trace. The expanded version appears in trace Z1 (second down from the top). The Z1 trace is controlled using the Z1 zoom dialog box at the bottom of the display.

The trace’s horizontal and vertical scale and offset can be adjusted interactively while observing the effects on the screen. The trace annotation box for the Z1 trace shows the vertical and horizontal scaling for the zoom trace. Trace Z1 has a horizontal scale of 150 microseconds per division, compared to the 5 milliseconds per division scale of the M1 source trace, representing an expansion of thirty-three times.

The zoom trace reveals variations in the RF carrier amplitude at the start and end of the burst. These keying transitions affect the generation of spurious signals that can interfere with other RF services. The zoom trace Z2 expands the view of the trailing edge of the first zoom trace and displays it in detail in the third grid from the top. Here, we have an example of Zoom on Zoom.

The analysis continues by demodulating the signal in Z2 by low-pass filtering the absolute value of the waveform. The demodulated signal can be measured to obtain the signal amplitude’s slew rate and the decaying amplitude’s time constant. This is an example of a math operation on Zoom. The math trace F1 performs demodulation; the result is displayed in the bottom grid. This example used two zooms, each with a different horizontal scale.

Horizontal and vertical scale factors

Zoom, in the oscilloscope used for this article, can be applied to any waveform, acquired signals, math, memory, or even other zoom traces. Zoom traces are waveforms like any other. They can be expanded further using another zoom trace, allowing the same signal to be viewed with multiple horizontal or vertical scale factors.

Math operators can be applied, allowing arithmetic, filtering, or FFTs to be performed on them. The number of available zoom traces generally matches the number of acquisition traces; however, all non-acquisition traces, like math or memory traces, have zoom functionality in this family of oscilloscopes.

Figure 2 provides an example of zoom being used to expand a signal vertically.

Figure 2 The echo in an ultrasonic range finder signal is expanded vertically to see the details of a double signal return. Source: Art Pini

A double echo in an ultrasonic range finder is zoomed vertically to see the detail of the waveform that is not easily discerned on the acquired waveform. The vertical resolution of this waveform is twelve bits or 4096 levels. At least a four-to-one vertical zoom is required to render the full resolution on a display with 1080-pixel vertical resolution. A ten-to-one vertical expansion shows the echo at 5 mV per division, providing a detailed view of the waveform structure.

Multi-Zoom

Some applications use multiple zoom traces with the same expansion factor for comparison purposes. Consider the measurement of an I2C data signal and clock signals shown in Figure 3.

Figure 3 Using time-locked multi-zoom to verify the timing between an I2C data and its associated clock signal. Source: Art Pini

The signal in the top grid is an I2C data signal. The grid immediately below that is the associated I2C clock. These waveforms are expanded synchronously using a feature called multi-zoom. Multi-zoom locks the selected zoom traces together. This feature allows common horizontal control of all zoom traces. They can be expanded or contracted synchronously, locked in time, or offset by a user-defined time offset.

In the example, the zoom traces Z1 and Z2 are the expansions of the data and clock signal, respectively. They are locked in time with no offset. The expanded view makes it easier to see the relative timing of the signals. So, the start condition, where the data signal is forced to a low state, followed by the clock signal being forced low, is easy to discern. The zoom traces incorporate the address field of the I2C packet. The expanded view afforded by the zoom displays is useful in evaluating physical layer issues like signal levels, period, with, transition times, and timing.

The multi-zoom feature also includes an auto-scroll mode to automatically scan through the entire waveform at a user-set rate (Figure 4).

Figure 4 The zoom auto-scroll controls allow automatic scrolling of the zoom horizontal location of the zoom trace to scan through long records. Source: Art Pini

Automatic scrolling is very helpful when moving narrow zoom windows through very long acquisitions that might require an extreme number of turns of a knob. It offers two scan rates and the ability to jump to the extreme values.

Comparing waveform segments

Zoom displays can help compare waveforms. For instance, an acquired I2C data signal contains multiple data packets; Zoom can be used to display these packets on the same expanded timescale for comparison (Figure 5).

Figure 5 Using zoom traces to separate and compare I2C data packets on the same expanded time scale. Source: Art Pini

Packets 1, 2, and 4 from the acquired I2C data bus acquisition are separated and compared using three zoom traces with the same scale factors but with different offsets. It is easy to see the difference in the length of packet 2; the data content of the three packets differs in the last half millisecond of the waveforms.

Using Zoom to window signals

Zoom can select, or window, specific regions of an acquired signal for further processing. This allows the examination of selected parts of a signal separately. Consider analyzing an RKE system that uses frequency shift keying (FSK) to encode commands (Figure 6).

Figure 6 Using zoom traces to isolate the one and zero state frequencies in an RKE system using FSK modulation. Source: Art Pini

The trace in the upper left grid represents 10 ms of a 260-ms-long RKE command. The RKE fob uses FSK to encode the digital one and zero states. The trace below the acquired trace shows that the demodulated FSK data is an NRZ serial signal. The upper-right grid shows the FFT of the acquired RKE signal. The signal has a frequency-modulated 434-MHz carrier. The FFT shows two peaks characteristic of frequency hopping, one corresponding to the frequency of the one state and the other to the frequency corresponding to the zero state.  

Zoom can be used to separate the parts of the acquired signal corresponding to the signal’s 0 and 1 states. Zoom trace Z1 (third grid down on the left) shows the part of the RKE signal matching the zero state shown in the demodulated signal. The duration of the zoom trace is adjusted to fit within the duration of the digital state.

Similarly, the zoom trace Z2 (bottom left) has been used to select the part of the signal in the one-state. The intensified segments on the acquired waveform correspond to the selected regions. FFTs of the zoom traces show that each digital state contributes a specific frequency to the signal.

Measurement parameters identify the zero frequency as 433.888 MHz and the one state as 433.964 MHz. The magnitude of the frequency shift between the two digital states is determined by taking the difference between the two measured frequencies, which is 76 kHz. Zoom has separated the frequencies associated with each digital state.

Note that the FFT’s frequency resolution is proportional to its input’s record length and that the zoom traces are shorter than the acquired waveform and thus will have poorer resolution. This does not matter in this example, where the goal is to determine the frequencies of the two digital states.

Expanding waveforms with zoom

Zoom is a useful tool for studying and analyzing acquired waveforms by providing an expanded view of the signal vertically or horizontally. These traces provide enhanced visual acuity, allowing the instrument’s full amplitude and time resolution to be displayed on the screen. They also select specific parts of a signal, allowing for the analysis of only those portions of the signal that are of interest.

Arthur Pini is a technical support specialist and electrical engineer with over 50 years of experience in electronics test and measurement.

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• Oscilloscope special acquisition modes
• Closing the gaps in your digital oscilloscope waveforms
• Basic oscilloscope operation

The post Using an oscilloscope’s zoom functions appeared first on EDN.

📰 Газета "Київський політехнік" № 37-38 за 2025 (.pdf) Інформація КП чт, 10/23/2025 - 15:44

AquiSense Inc of Erlanger, KY, USA (which designs and makes UV-C LED water disinfection systems) says that its Pearl Aqua Kilo full-scale UV-C LED product has been awarded NSF/ANSI/CAN 61-2024 certification and completed the validation process required by the US Environmental Protection Agency (EPA) UV Disinfection Guidance Manual (UVDGM), providing water utilities and industrial users with a new, highly effective tool for protecting public health...

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In light of the soft market environment and negative FX effects, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany is adjusting its forecast for 2025...

Kyocera AVX releases the KGP Series of commercial-grade stacked capacitors targeting high-frequency applications in the industrial and downhole oil and gas industries. The new stacked MLCCs deliver higher capacitance values in the same mounting area as traditional capacitors to support miniaturization.

(Source: Kyocera AVX)

These stacked capacitors are manufactured without lead or cadmium to support sustainability and ease standards compliance. They also provide low equivalent series resistance (ESR) and inductance (ESL), minimizing noise and optimizing performance, and feature metal lead frames that reliably suppress thermal and mechanical stress for greater stability and durability. Applications extend throughout the industrial, alternative energy, and downhole oil and gas industries, and include power supplies, DC/DC converters, control circuits, high-voltage coupling, and DC blocking.

The KGP Series stacked MLCCs, in C0G, X7R, and X7T dielectrics, are available in five EIA case sizes (1210, 1812, 1825, 2220, and 2225) with two stack sizes (maximum thicknesses spanning 3.40 to 6.95 mm), and “J” or “L” leads. Key specs include operating voltages ranging from 50 V to 1,500 V, capacitance values ranging from 10 nF to 47 µF ±10% or 20% tolerance, and an operating temperature range from -55°C to 125°C.

The stacked MLCCs with C0G and X7R dielectrics are available in all five EIA case sizes with the full range of rated voltage values and capacitance values up to 220 nF and 47µF, respectively. MLCCs with X7T dielectrics are available in three EIA case sizes (1210, 1812, and 2220) with three rated voltages (250 V, 450 V, and 630 V), and capacitance values up to 4.7 μF.

These ceramic capacitors are tested for a range of factors to ensure performance in challenging high-frequency applications. These include visual characteristics, capacitance values, dissipation factor, temperature coefficient, insulation resistance, dielectric strength, temperature cycling, steady state and load humidity, high temperature load, termination strength, bending, vibration resistance, and soldering heat resistance. They are RoHS compliant and packaged for automated placement on tape and reel in quantities of 500–1,500. 

The post Stacked MLCCs support miniaturization appeared first on EDN.

Silicon Labs launches its Simplicity Ecosystem, a suite of modular software tools that are designed to simplify embedded IoT development. The Simplicity Ecosystem centers around Simplicity Studio 6 with the upcoming Simplicity AI SDK framework, available in 2026. The ecosystem brings together installation, configuration, debugging, and analysis into a single developer-first environment.

“The Simplicity Ecosystem represents a major step in making intelligent, context-aware development a reality,” said Manish Kothari, senior vice president of software development, Silicon Labs, in a statement. “By integrating AI into every layer of our tools, we will give developers a platform that learns, adapts, and accelerates innovation across the entire IoT lifecycle.”

The new Simplicity Ecosystem extends that legacy of the Simplicity Studio, available for more than a decade, by breaking the toolchain into modular, interoperable components. These components fit seamlessly into modern workflows, whether they are GUI-based or automated, and can work independently or as part of the ecosystem.

The Simplicity AI SDK will allow developers to chat with their code through new AI-powered integrations. (Source: Silicon Labs)

The core tools include the Simplicity installer for on-demand installation of SDKs, examples, and tools; VS code and CLI integration; device manager for a unified interface for identifying, managing, and programming Silicon Labs hardware; Simplicity commander, a command-line for programming, debugging, and security configuration; a network analyzer protocol-aware tracing tool for wireless traffic, with real-time visibility into packet exchanges across Bluetooth LE, Zigbee, Thread, and Matter networks; and the energy profiler real-time measurement tool that correlates energy consumption directly to code execution. It also includes a full suite of configuration, control/debug, and analysis tools for all wireless technologies.

The software tools ecosystem supports Silicon Labs Series 2 and Series 3 devices and major IoT standards, including Bluetooth LE, Zigbee, Thread, Matter, Wi-Fi, Wi-SUN, and Z-Wave.

The Simplicity AI SDK  framework will enable an AI-augmented workflow, supporting engineers  by acting as a collaborator that interprets code, surfaces insights, and assists with tasks across the lifecycle from project setup to field debugging. It combines context awareness and intelligent automation to accelerate development.

The first release will integrate with VS code to let developers “chat with their code,” marking a shift toward AI-assisted design, Silicon Labs said. It can explain functions, trace errors, and suggest improvements in real time, using an understanding of project context and Silicon Labs SDKs.

Dynamic context engineering is at the heart of Simplicity AI SDK, the company added, giving AI agents the right data at the right time to understand project structure, interpret documentation, and provide contextual support without manual lookup.

The Simplicity AI SDK will be available in 2026, beginning with developer feedback and beta testing. You can join the Simplicity AI SDK early access waitlist. Future updates will extend these capabilities across Silicon Labs’ tools, enabling adaptive debugging, optimization, and application generation. Simplicity Studio 6 is available now for download.

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