Збирач потоків

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CVD Equipment Corp (CVDE) of Central Islip, NY, USA (a designer and maker of chemical vapor deposition, thermal processing, physical vapor transport, gas and chemical delivery control systems, and other equipment and process solutions for developing and manufacturing materials and coatings) has announced a restructuring plan and leadership transition, following a thorough evaluation of strategic alternatives for its CVD equipment business by its board of directors...

Доповідь ректора КПІ ім. Ігоря Сікорського Анатолія Мельниченка на сесії професорсько-викладацького складу 2026 Інформація КП пт, 09/11/2026 - 17:00

Hey guys! I got into electronics and computers during the pandemic, but could not continue it further due to school work (and being a broke 14yo lol). Finally 6 years later I managed to save up and get myself some components to put something together that felt like an actual project. I will be happy to get any feedback! Github link for details submitted by /u/OjasZ [link] [comments]

Reporting the results of its Flight-1 ‘Mission Asimov’, Washington DC-based Besxar (which is developing the manufacturing of advanced semiconductor materials in space) says that, on 5 July, two of its ‘Clipper-class’ canisters flew from Space Launch Complex 40 (SLC-40) at Cape Canaveral Space Force Station in Florida aboard a SpaceX Falcon 9 first-stage booster and were recovered intact after the booster returned to land...

Goldilocks and the Three Bears (and their porridge, beds and chairs) have got nothing on this high voltage design challenge.

Sometimes a client gets into areas of technology that go way over my head, but I manage to pick up a snippet here or there. This is one such case.

The requirement was to create an electron beam for which the beam energy would be precisely known. The measurement technique is diagrammed as follows (Figure 1).

Figure 1 Fairy tales and their application to electron beam energy (if-necessary reference)

Two curved metal channels were arranged in a circular path through which the electron beam was to be directed. Equal but opposite polarity high voltages would be applied as shown. When an electron source was aimed into one end of this structure, the path of that beam, i.e., the beam’s radius of curvature, would vary as a function of the applied high voltages.

By dint of equations that left me in the dust, when the high voltages and beam energy were a proper match, the electron beam would emerge at the output end where it would go on to serve its intended purpose. The beam’s radius of curvature under the electrostatic field would be just right, and the beam energy would be precisely known. If there was a mismatch, the electron beam would impinge instead on one metal plate or the other and not appear at the output.

The high voltage and voltage precision requirements for this thing were quite demanding. The dual power supply we made for this setup went from zero to 25 kV on each side and had a room temperature versus voltage temperature coefficient on the order of 1 ppm per °C.

Happily, it worked very well.

John Dunn is an electronics consultant and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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📰 Газета "Київський політехнік" № 29-30 за 2026 (.pdf) Інформація КП пт, 09/11/2026 - 13:56

As systems grow, the knowledge needed to safely change them becomes harder to retrieve quickly, even when the design itself is sound. Models increasingly encode not just algorithms, but also assumptions, trade-offs, and system-level intent that accumulate over time. As ownership changes hands, understanding that intent becomes the bottleneck.

Consider a common engineering handoff: you are new to an existing project and are asked to update the braking system to support a heavier vehicle variant. The system works. The architecture looks intentional. But you were not part of the original design decisions, and before touching anything, you need to understand what is safe to change and why.

Compared to reading thousands of lines of code, being given a model offers a clear advantage. It exposes structure, makes data flow visible, and captures behavior in a form engineers can reason more quickly. For years, this has been a core strength of model-based design.

However, this advantage is now under pressure. Today’s software-defined systems are larger, more interconnected, and built across distributed teams, suppliers, and release cycles. Even with a well-structured model, engineers still need to reconstruct why signals flow a certain way, which subsystems own specific behaviors, which parameters are safe to modify, and where hidden constraints exist.

So, when that context is hard to recover, teams slow down. Review cycles expand. The risk of validation failures or schedule delays increases. This is not because the design is wrong, but because its underlying rationale is difficult to access quickly. Over time, this becomes an engineering scalability problem: critical knowledge lives inside the design but becomes harder to retrieve as systems grow more complex.

The challenge is no longer simply one of scalability, but of how engineers recover that context quickly enough to make the right change. This is the gap that shows up most clearly in engineering handoffs.

Walkthrough: Recover context in the ABS braking model

To see how this challenge appears in practice, consider an anti-lock braking system (ABS) model. The system runs, but the engineer has been asked to update the braking system to support a heavier vehicle variant. Before making that change, engineers first need to understand where the wheel-speed behavior lives and how it interacts with the rest of the design.

Figure 1 ABS demo regulating wheel slip (Desired Relative Slip) via a bang-bang controller (Controller) drives vehicle/brake dynamics (Vehicle Dynamics) with visualization (Visualization). Source: MathWorks

This opens sldemo_absbrake, a model that simulates vehicle dynamics under braking with a bang-bang controller. The example is small enough to follow end to end, but it raises the same questions that appears in production handoffs: What are the major pieces? Where does the behaviour live? Which blocks should be inspected before changing it?

Get the big picture

Start by building a system-level understanding of the model. Before inspecting individual blocks, click “Simulink Copilot Chat” on the “Simulation” tab of the toolstrip, and type: Give me an overview of this model.

Simulink Copilot returns a structured breakdown of the four top-level subsystems (Controller, Vehicle Dynamics, Visualization, and More Info), the high-level signal flow from slip reference to controller to braking dynamics to visualization, and the control strategy: bang-bang control on the slip error. Every block name in the response is a clickable hyperlink, so the explanation remains tied to the model canvas rather than floating apart from it.

Figure 2 Simulink Copilot generates a grounded overview of the open model, with hyperlinks to each subsystem and block. Source: MathWorks

Instead of digging through the model block by block, a working mental map is established. The model’s behaviour, major connections, and the part of the design worth inspecting before making a change are now clear.

Drill into a subsystem

The overview points to “Vehicle Dynamics” as the subsystem that handles braking physics. If a change could affect wheel motion, stopping distance, or slip, that is the area to drill down next. Instead of opening the subsystem and reading every block manually, right-click the “Vehicle Dynamics” block on the canvas and choose “Explain with Simulink Copilot” in the Simulink context menu.

Figure 3 Right-click any block and choose “Explain with Simulink Copilot” for a contextual explanation without typing a prompt. Source: MathWorks

Simulink Copilot generates a contextual explanation of the subsystem: its purpose, its inputs and outputs, and the internal structure that connects tire forces, brake pressure, wheel speed, vehicle speed, and relative slip. This is not a generic block description. It explains how Vehicle Dynamics is connected to this specific design, which is the context needed before deciding what to modify.

Find where a feature lives

Now suppose the design change requires extending or reviewing the wheel-speed calculation. There is no longer a need to start at the top of the model or guess which subsystem owns that behaviour. Ask the question directly: What components handle wheel-speed calculation?

Figure 4 Simulink Copilot identifies the specific blocks that implement wheel-speed calculation, each hyperlinked for one-click navigation. Source: MathWorks

Simulink Copilot returns the specific blocks involved, including sldemo_wheelspeed_absbrake, the integrator that computes wheel angular velocity, and the gain block that converts angular velocity to wheel speed. Each result is hyperlinked to a model element, enabling navigation from a design question to the implementation detail.

What this looks like in practice

Generate an overview, drill down into subsystems, and perform a targeted search: this becomes a repeatable three-step pattern for working with an inherited Simulink model. Start broad enough to understand the architecture, narrow the conversation around the subsystem that owns the behaviour, and then ask targeted questions that lead to the blocks that may need modification.

From there, follow-up questions can move from orientation to change impact:

• How does the bang-bang control strategy work within the context of this model?
• What outputs are visualized during simulation, and how do they reflect braking performance?
• What adjustments can be made to controller parameters to enhance braking response time?

Each response references the model itself: block names, signal paths, subsystem boundaries, and parameter values. The conversation builds on itself, so by the time the first edit is made, the process is no longer based on a disconnected search result. Instead, it provides a model-specific explanation of what the design does, how the relevant pieces fit together, and why they matter to the requested change.

Tips for better handoff questions

• Be specific about scope. “Explain the braking control logic” works better than “explain this model” once the relevant part of the inherited design has been identified.
• State the goal, not just the question. “I need to extend the wheel-speed calculation” gives Simulink Copilot context to focus on the behaviour that is changing.
• Reference blocks by name when possible. “Explain the Sum block labelled slip_error” is more useful than “explain the Sum block” because it anchors the question in the design.
• Use Deeper Insights for questions that require sophisticated reasoning. Reserve the more thorough analysis for decisions about design intent, subsystem responsibilities, or change impact.

Now return to the engineer at the start: you inherited a model, and you were asked to update the braking system to support a heavier vehicle variant, and the risk was not that the model lacked structure. The risk was acting before understanding the intent behind that structure.

A grounded conversation changes that first hour. The architecture can be mapped, the subsystem that owns the behaviour can be inspected, and the relevant blocks can be identified before making the change. That does not replace engineering judgment or validation, but it provides a faster, more defensible way to inform decisions for the next design change.

Amal Jayarajan Phillai is a product manager at MathWorks.

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У КПІ ім. Ігоря Сікорського створено унікальну дослідницьку інфраструктуру TRIUMPH! kpi пт, 09/11/2026 - 12:21

India’s premier video security brand PRAMA showcased advanced security products and smart security solutions for the MSME sector at the first edition of Bharatiya Vyapar Mahotsav (BVM) from August 12-15, 2026 at Bharat Mandapam, New Delhi. At the exhibition, traders, MSMEs, manufacturers, innovators, businesses and other industry stakeholders came together to showcase their products, services, and solutions. The inaugural event was attended by Union Minister for Commerce & Industry Piyush Goyal, Minister of State for Commerce and Industry Jitin Prasada and former Union Minister Smriti Irani along with leaders and representatives from Confederation of All India Traders (CAIT), Swadeshi Jagran Manch and other organisations.

PRAMA management representative said, “The Bharatiya Vyapar Mahostav is a great platform for Pan India Trade bodies and entrepreneurs of MSME sector. The Indian security market is poised for a new growth phase due to the exponential growth of Micro, Small and Medium Enterprises (MSME) sector. MSME sector is the backbone of India’s economy. We are glad to serve the needs of India’s Medium and Small enterprises. We find Bharatiya Vyapar Mahotsav (BVM) event, a highly valuable exhibition platform to connect with the key stakeholders and ecosystem partners. We showcased the latest products and solutions in this expo. We appreciate CAIT’s proactive role in organizing Bharatiya Vyapar Mahotsav event to spur innovation and engagement with key industry stakeholders.”

He further elaborated, “PRAMA, being India’s premier indigenous security brand holds, great significance. The spectacular growth that India security industry has achieved, PRAMA’s evolution as a leading security brand is the manifestation of Indian spirit and ingenuity. We are taking indigenous manufacturing to the next level. We are here to offer best-in-class products with cutting edge technologies that can deliver solutions as per the MSME Sector’s evolving requirements as per the business cases and application scenarios.”

The elaborately designed spacious PRAMA booth was center of attraction for the trade and industry specific visitors. PRAMA booth showcased the latest products and MSME sector’s solutions, including Ai technology, Interactive Display Panel, Perimeter and Defence Solution, Ranginview IP Series with Built-in MiC, Safe City Solution, Transportation Solution, Mobile enforcement Solution, Networking and Transmission and many more.

PRAMA booth displayed the latest video security products, including Ai Solution. PRAMA’s AiSense technology, powered by advanced AI Algorithms, takes surveillance to the next level. This technology intelligently distinguishes people and vehicles from other moving objects, reducing false alarm caused by animals or environmental factors. With AiSense Technology one can focus on the real threats, optimize resources and build on an intelligent security system. The AI Sense Technology can be very helpful in the various application scenarios in the retail segment for the MSME sector.

PRAMA’s Interactive Display Panel (IDP) was displayed at the booth, it is an all-in-one large display panel which integrates features of a computer, whiteboard, and projector, all in one device, making it a versatile tool for education, corporate training and business video conferencing scenarios. It is a great communication and training tool for the MSME sector.

PRAMA’s booth showcased Safe City Solution, which provides sound, stable and reliable public security. It features a suite of advanced technologies and security subsystems to safeguard industries, centralise operations, and integrate security platforms. These integrated technologies enable rapid and effective responses to security needs and events.

Bharatiya Vyapar Mahotsav (BVM) 2026 is India’s largest Make-In-India multi-sectoral trade expo, designed to bring together India’s diverse business ecosystem under one roof, connecting traders, MSMEs, manufacturers, industry leaders, institutions, and policymakers from across the country. The mega event was organized by Confederation of All India Traders (CAIT) & ITPO.

The Bharatiya Vyapar Mahotsav (BVM), 2026 was a four day event, which was successfully concluded. The event helped to create awareness about the latest innovations and products in the myriad trade segments. The discussions and deliberations were done with various key stakeholders on the core trade and MSME issues. The event was attended by the key trade and business professionals, Government officials and key stakeholders from the Trade and MSME sectors.

The post PRAMA Showcases Smart Security Solutions for MSMEs at Bharatiya Vyapar Mahotsav 2026 appeared first on ELE Times.

Midsummer AB of Järfälla, near Stockholm, Sweden and Indonesian technology industrial company PT Metalogika Rekayasa Sistem have signed a binding investment and industrialization framework agreement for the establishment of a manufacturing platform in Indonesia for Midsummer’s lightweight, flexible copper indium gallium diselenide (CIGS) thin-film solar cell and photovoltaic module technology...

GSAS Micro Systems inaugurated its new manufacturing and expanded R&D facility in Doddaballapur, Bengaluru Rural, marking a significant step in the company’s journey from embedded engineering and technology integration toward a stronger in-house product development and manufacturing footprint in Karnataka.

Located in the Doddaballapur 3rd Phase Industrial Area, the new facility brings GSAS’s product development, engineering, manufacturing and project activities together under one roof. It will serve as a working hub for hardware manufacturing, assembly, integration, quality testing, R&D and new-product development.

The expansion comes as Karnataka continues to strengthen its electronics and semiconductor ecosystem, building on its established capabilities in electronic design and semiconductor R&D. According to the Karnataka Digital Economy Mission (KDEM), the state contributes 10% of India’s electronics output and nearly 40% of the country’s electronic design output. Karnataka also accounts for more than 22% of India’s electronics exports and hosts more than 100 fabless semiconductor design companies.

For GSAS, the Doddaballapur facility is both a business milestone and the culmination of a much older ambition. The company’s founder has carried the vision of building a dedicated electronics manufacturing base since the 1990s. Bringing that ambition to life in Karnataka gives the company a permanent home for developing and building more of its own products while expanding the engineering infrastructure available for customer-specific programmes.

“This is a deeply personal milestone for me. I have wanted to build a dedicated electronics manufacturing home since the 1990s. Karnataka gave our generation of electronics entrepreneurs the engineering talent, industry networks and ecosystem to build companies here. With this facility, we now have a place where our team can take more ideas from engineering and R&D into real products and manufacturing. For us, this is not the end of a dream; it is the foundation for what GSAS wants to build next.” said Satya Gopalam, Chairman and Managing Director , GSAS Micro Systems.

“Our engineering work has been moving deeper into the FPGA space, with vision AI and edge AI projects, board bring-up support for automotive programmes, and PCBA test automation. This new 12,000 square foot facility gives that work a manufacturing home: we will build the new Genesis series here, essentially embedded development kits and FPGA development kits, manufactured and assembled on site, alongside test automation and integration work for the automotive, aerospace and satellite space. We have been working towards this for the last few years, and I am proud to see it finally established. If you are curious, reach out; we are happy to give you a tour of the facility.” said Anvesh Gopalam, Executive Director , GSAS Micro Systems.

The post GSAS Micro Systems Expands Manufacturing and R&D Operations with New Doddaballapur Facility appeared first on ELE Times.

Col Sandeep Rao (Retd) is a veteran Indian Army Artillery officer with more than two decades of military service. His career includes experience in combat operations, counter-terrorism and high-altitude operations along the Line of Control. An alumnus of the National Defence Academy and Don Bosco High School, Matunga, Mumbai, he brings military leadership and field experience to his role as Advisor at Tirupati Forge.

Within India’s defence acquisition framework, Col Rao served as programme coordinator for the country’s first indigenously designed and developed 155 mm advanced artillery gun system, managing requirement formulation, trials, and execution. His domain expertise includes artillery platforms, counter-UAS systems, defence robotics, ammunition manufacturing, and Defence Acquisition Procedure (DAP 2020) implementation.

Following his military service, Col Rao acts as a strategic advisor to defence manufacturers, technology enterprises, and investment platforms. He guides companies on market positioning, technology transfer, and institutional procurement pathways while advising defence-tech start-ups on investor readiness and government acquisition. As a technology scout and strategy consultant, he collaborates across the Ministry of Defence, DRDO, and industry channels to bridge operational military requirements with commercial delivery and advance defence indigenisation.

The post Col Sandeep Rao (Retd): From Indian Army Artillery to Defence Industry Leadership appeared first on ELE Times.

Microchip Technology and Marelli have announced a new display connectivity solution that uses ASA Motion Link (ASA-ML), an open standard for automotive video connectivity. The solution enables graphics and video generated by a vehicle’s central computer to be streamed directly to in-vehicle displays. The demonstrator can help automakers simplify display architectures, optimise system costs and increase sourcing flexibility as they move toward software-defined vehicles (SDVs).

ASA Motion Link is an open standard for automotive video connectivity and SerDes (serializer-deserializer) communication, defined by the Automotive SerDes Alliance (ASA), a global consortium of vehicle makers, Tier 1 suppliers and semiconductor companies. By enabling secure, high-speed video and graphics transmission across products from multiple technology providers, the standard supports greater compatibility across the automotive ecosystem and provides a scalable alternative to proprietary video transmission technologies. As a founding member of ASA, Microchip is advancing the automotive industry’s transition from proprietary connectivity technologies to open, interoperable standards, and has demonstrated broad interoperability with its camera solutions and is now extending those solutions to enable display connectivity.

As vehicle architectures evolve toward centralized computing and software-defined vehicles (SDVs), vehicle makers are looking for connectivity solutions that can support growing performance demands while reducing complexity, controlling costs and enabling scalable vehicle electronics architectures. In the joint demonstrator solution, graphics and video content generated by the vehicle’s central computer is processed and transmitted through Microchip’s VS7000 ASA-ML chipset over a high-speed standardized link.

Marelli pioneers the display-side integration of the technology by enabling the configuration and optimization of the ASA ML deserializer to decode standardized video streams directly at the display. This ensures accurate reception, synchronization and delivery of centrally generated content, including camera feeds, navigation maps, infotainment graphics and vehicle control interfaces, while enabling simplified display-side electronic architectures.

“The transition to software-defined vehicles is driving demand for more open, flexible and scalable electronic architectures,” said Kelei Shen, president of Marelli’s electronics business. “As an integrator within the automotive ecosystem, Marelli brings together best-in-class technologies from multiple partners to deliver complete solutions for vehicle makers. This collaboration highlights how open standards can accelerate innovation while providing interoperability needed for the next generation of vehicle architectures.”

“Open standards play a critical role in accelerating innovation by reducing dependency on proprietary technologies,” said Kevin So, vice president of Microchip’s communications business unit. “Our collaboration with Marelli demonstrates how ASA Motion Link provides automotive manufacturers with a secure, interoperable and scalable connectivity solution that simplifies integration across the ecosystem.”

Technology Highlights

• Open interoperability enabling seamless connectivity between cockpit systems and displays from multiple technology providers.
• Greater supplier flexibility thanks to open protocol specifications supported across the automotive ecosystem.
• Integrated security with link-layer authentication and encryption embedded in the communication channel.
• Robust data transmission with lossless communication and high immunity to electromagnetic noise.
• Scalable performance supporting data rates up to 16 Gbps to address a range of display requirements.
• Optimized efficiency enabled by embedded Time Division Duplex (TDD) functionality and simplified Forward Error Correction (FEC), contributing to lower power consumption.
• Path to increasingly Ethernet-centric vehicle architectures.

The collaboration demonstrates how open-standard connectivity supports in-vehicle networking and electronics by enabling secure communication between centralized computing systems and displays. It also reflects Marelli’s broader commitment to adopting open standards that help simplify development, optimize system costs, and promote a more open automotive ecosystem.

The post Microchip and Marelli Develop Open-Standard Display Connectivity Solution for Software-Defined Vehicles appeared first on ELE Times.

London is set to be the venue for European Microwave Week (EuMW) 2026, bringing together professionals working across RF, microwave, wireless and radar engineering.

In relation to this the European Microwave Exhibition is being held in Excel London, the event scheduled to take place between October 6 and 8, 2026. Within Booth B10, Rohde & Schwarz will present a range of their most recent test and measurement solutions, aimed at RF & Microwave component, wireless, radar & satellite system developers and will enable them to respond to demands in areas such as EW (electronic warfare) and EMSO (electromagnetic spectrum operations) with more challenging frequency environments.

Markus Lörner, Application Segment Manager RF & Microwave Components at Rohde & Schwarz, says: “Our EuMW 2026 motto, ‘Progress needs proof,’ reflects what many engineers are facing today: when DUTs push beyond the limits of conventional methods, innovation slows down. At the show, we will demonstrate how our advanced test solutions support customers across RF and microwave components, satellite and radar systems, phased-array antennas and emerging 6G sensing applications. As R&D moves toward higher frequencies, more integrated designs and increasingly demanding spectrum environments, precise and reliable measurement becomes a key enabler of progress.”

From EW and EMSO scenarios to advanced high-frequency characterization

A highlight at the Rohde & Schwarz booth is the FSWX signal and spectrum analyser, displayed in a radar and electronic warfare (EW) test scenario within the context of electromagnetic spectrum operations (EMSO), focused on DRFM-based jammers. In this setup, an R&S SMW200A vector signal generator simulates radar signals, while the FSWX uses its multi channel architecture to analyse jammer input and output signals simultaneously for a comprehensive assessment of deceptive signal behaviour. The new, fully integrated R&S FSWX-KM700 pulse analysis option measures both channels in parallel and provides detailed insight into pulsed radar parameters, differences between the channels and the parameter trends over time.

In a second demonstration, Rohde & Schwarz will show how its high-frequency test capabilities can be extended into the E-band and beyond, up to 110 GHz, to characterise challenging high-frequency components. The demonstration combines the fully calibrated R&S FE110ST external frontend with the R&S SFI100A wideband IF vector signal generator, enabling wideband signal generation and testing for demanding high-frequency applications. The setup can support the testing of satellite components for new payload and link-generation applications, while helping engineers accurately characterise the RF behaviour of the device under test (DUT).

Advanced testing for low-noise sources and high-power RF frontends

Rohde & Schwarz will also showcase the enhanced R&S FSWP phase noise analyser and VCO tester platform for advanced component characterization. With support for residual and absolute phase noise measurements up to 56 GHz and further improved internal reference, R&S FSWP-B62, the solution offers high flexibility for testing synthesizers, OCXOs, DROs, VCOs and two-port components such as amplifiers. New options for integrating external signal sources as local oscillators can dramatically accelerate measurements, in some cases by up to a factor of 1,000, making the R&S FSWP well suited for the development of low-noise signal sources for radar, satellite, base station and high-speed digital applications.

Rohde & Schwarz will also present the new R&S SAM200 system amplifier for high-power test applications in the Ka- and V band up to 53 GHz. In radar, satellite link and backhaul applications, RF frontends must deliver higher power levels so signals can travel farther and cover larger distances. Designed to support validation of these components, the amplifier extends test setups with higher signal power while maintaining precise and reliable level control. At EuMW, Rohde & Schwarz will showcase the R&S SAM200 in two demonstrations: one characterizing a high-power Ka-band amplifier with the R&S ZNA vector network analyser in a fully integrated and calibrated test setup, and another highlighting the amplifier’s linearity in a wideband modulated test scenario with the R&S SMW200A vector signal generator and the FSW signal and spectrum analyser.

Scalable test for SATCOM and phased-array systems

At EuMW, Rohde & Schwarz will also highlight the R&S ZNB3000 vector network analyzer for measurement applications in satellite communications, Earth observation and radio astronomy. Its wide dynamic range and low trace noise provide the sensitivity required for demanding antenna characterization and radar measurements. For higher-frequency applications, optional millimeter wave converters extend coverage up to 330 GHz, including bands used by microwave and millimeter wave radiometers. Together, these capabilities make the R&S ZNB3000 a versatile and cost-effective solution for a broad range of measurement needs in the satellite and space sectors.

Micro-Doppler emulation for emerging sensing use cases

With the AREG800A radar target generator, Rohde & Schwarz will showcase new test capabilities addressing use cases like 6G integrated sensing and communication (ISAC). As 6G networks evolve beyond data connectivity toward environmental awareness, ISAC is emerging as a key technology for detecting and classifying objects using mobile infrastructure. In addition to emulating distance, speed and radar cross section (RCS), the solution can also generate micro-Doppler signatures, enabling more realistic test scenarios for applications such as drone detection and supporting the development of advanced sensing capabilities.

Rohde & Schwarz at EuMW 2026

Visitors will find Rohde & Schwarz at booth B10 at Excel London from October 6 to 8, 2026, where they can learn how next-generation test solutions support engineers from component characterization to system-level validation across radar, satellite, wireless and aerospace and defense applications. In addition, experts from the company will contribute to the EuMW 2026 with presentations and workshops as part of the European Microwave Conference (EuMC) as well as the European Radar Conference (EuRAD).

The post Rohde & Schwarz Showcases Advanced RF and Microwave Test Solutions at EuMW 2026 in London appeared first on ELE Times.

So this is circuit main consist of short circuit under and over voltage protection and ideal diode using mosfet Amongst which short circuit and ls ideal diode condition But ov uv condition failed due to my back to back mosfet architecture and false trigger at the gates It failed But for someone who’s fresher with 3month experience i would consider this as a fair try:) submitted by /u/Worldly-Cream-5550 [link] [comments]

Couldn't find any documentation, so I made my own! The cathode line took 1-3V across the thin wires in the display, and the metal grid along with the phosphorous layer both were hooked up to the 12V+ end while the cathode was hooked up to 12V- I eventually plan on driving it with a teensy 4.0 and a bit more logic to drive the 4-bit ULN2803 interface. In case anybody ever has to work with one of these I'm going to leave some of these SEO terms: VFD 6-LT-09 Echo-6 94V-I PWB-AGN 2161317-007 VFD-7-Segment (kHz/MHz) ULN2803 submitted by /u/chknboy [link] [comments]

The "slayer exciter" circuit is the classic introduction to SSTCs. I really wanted a version with just one coil because once you eliminate the loosely coupled resonant transformer, you end up with a greatly simplified design. It basically drives a series resonant circuit through a RF choke, using a coupling capacitor as feedback. I'm not the first to think of that but there was always something or other that I didn't like about other people's designs so this version might be my own :) I encourage you to try it, let me know if you can get the thing to at least light a neon bulb or something. My tiny axial inductors aren't handling the power well 🔥 And btw component values are "for demonstration only", do not assume they're optimal! submitted by /u/Lily_1225 [link] [comments]

Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — has secured an additional $150m in funding, bringing its total primary capital raised in 2026 to $650m. Separately, it discloses that Wiwynn made a strategic investment earlier this year. Wiwynn, a cloud IT and infrastructure provider for data centers, joins a growing group of strategic backers that includes Alchip, AMD, Intel, MediaTek, and NVIDIA...

The Optical Internetworking Forum (OIF) has issued the Implementation Agreement (IA) for 1600ZR Coherent Interfaces, defining an interoperable 1.6T coherent line interface and frame format for single-span, amplified, point-to-point dense wavelength division multiplexing (DWDM) links up to 120km...