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Toshiba Corp of Kawasaki, Japan has signed a memorandum of understanding (MoU) to start discussions regarding a business integration of the semiconductor business of its subsidiary Toshiba Electronic Devices & Storage Corp (TDSC), the semiconductor business of ROHM Co Ltd, and the power device business of Mitsubishi Electric Corp. The MoU was signed with Japan Industrial Partners Inc (JIP), TBJ Holdings Corp (TBJH), ROHM, and Mitsubishi Electric...

I have a brass annealer project and thought that it will be easy to make with protoboard. it was not, at least not for me. The welder tip was too large and there are bad joints everywhere. well, if it works🤷 submitted by /u/rcplaner [link] [comments]

How easy is it to analyze and optimize how much power the device connected to a smart plug is drawing? The answer depends in part on which hardware and firmware version you’re running.

Next up in my ongoing TP-Link smart home device ecosystem series of hands-on evaluations and teardowns:

• Tapo or Kasa: Which TP-Link ecosystem best suits ya?
• TP-Link’s Kasa HS103: A smart plug with solid network connectivity
• TP-Link’s Kasa EP10: If at first it doesn’t connect, buy, buy again

is the EP25 smart plug, which builds on the EP10 foundation with two feature set additions: Apple HomeKit (and Siri, for that matter) support, along with energy monitoring capabilities.

I bought a two-pack (with an associated “P2” product name suffix) from Amazon’s Resale (formerly Warehouse) sub-site for $13.29 plus tax during a 30%-off promotion last November. They also come in an “EP25P4” four-pack version. I’ll start with some stock photos:

An uncertain lineage

Although I’ve identified the EP25 as the enhanced sibling of the EP10, particularly referencing the naming-format commonality, those of you who’ve already analyzed the above graphic with device dimensions (not to mention the side switch location) might understandably be confused. Doesn’t it look more like the earlier, beefier, HS103? Indeed, it does. Here it is below the EP10:

And now underneath the HS103:

Perhaps the larger chassis was necessary to fit the additional feature-implementing circuitry? There’s one way to find out for sure; take it apart. So, let’s start, as usual with some box shots, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

This isn’t what the box backside originally looked like, actually:

When it arrived, there was a barcode-inclusive sticker stuck to it, as is typical with products that cycle back through the Amazon Resale sub-site after initial sale-then-customer return:

But stuck to it was something I’d not experienced before: another sticker, with a smaller black rectangle near its center:

I had a sneaking suspicion that I’d find a RFID or other tracking tag on the other side. I was right:

Continuing around the outer package sides:

Packaging assault

Judging from the already-severed clear tape on the bottom of the box, in contrast to the still-intact tape holding the top flap in place, I assumed the original owner got inside through the bottom-end pathway:

Yup. I don’t know what surprises me more (and I’ve also seen it plenty of times before): how brutishly some folks mangle the various packaging piece(s) to get to the device(s) inside, or that they still have the impudence to return the goods for refund afterwards. Now to cut the top’s transparent tape and try out the alternative entry path:

At least the original owner was thoughtful enough to put the sliver of quick-install literature back in the box prior to returning. Although, on second thought, he or she probably never even got to it before sending everything back. There was also this, reflective of its Apple protocol-friendliness:

You also may have already noticed in the earlier bottom-view open-box shot that one of the devices inside was still encased by a protective translucent sleeve, while that of the other device was missing. I went with the latter as my teardown victim, operating under the theory that its still-plastic-covered sibling was unused and therefore most likely to still be functional for future hands-on evaluation coverage purposes. Here’s our patient:

Monitoring implementation variability

This last shot of the underside of the device:

Specifically, this closeup of the specs, including the all-important FCC ID (2AXJ4KP125M):

is as good a time as any to explain the background to my “The answer depends in part on which hardware and firmware version you’re running” comment in this post’s subtitle. Note the following lines of prose on the product support pages for the EP25P2 and EP25P4:

Vx.0=Vx.6/Vx.8 (eg:V1.0=V1.6/V1.8)
Vx.x0=Vx.x6/Vx.x8 (eg:V1.20=V1.26/V1.28)
Vx.30=Vx.32 (eg:V3.30=V3.32)

I’d mentioned in the prior teardown in this series that TP-Link tends to cycle through numerous hardware revisions throughout a product’s life, with each hardware iteration accompanied by multiple firmware versions, and the cadence combination resulting in inconsistent functionality (said another way: bugs). The EP25 is no exception to this general rule. That said, “inconsistent functionality” seemingly is particularly notable in this product case (grammatical tweaks by yours truly):

On Amazon, I bought a 2-unit box set of the EP25P2 (“Hardware 2.6” in the Kasa app), and a 4-unit box of the EP25P4 (“Hardware 1.0” in the Kasa app). They market them as the exact same product, but the EP25P2 has much better energy and power consumption data and graphs, and a cost tool. The other just has a crude power read out. It seems like something they should’ve been clear about, and like something they could fix in the app software. I’m annoyed they did this and will return the EP25P4.

FWIW, looking back both at the device bottom closeup and the earlier bottom box shot, I’m guessing “US/2.6” references hardware v2.6. Again: . Curiously, the four-pack (EP25P4) support page lists three hardware versions (V1.60, V1.80 and V2.60), albeit not the V1.0 h/w mentioned in the earlier Reddit post…and the two-pack (EP25P2) page mentions only V2.60.

Unto the breach, dear friends

Time to delve inside. The case-disassembly methodology was unsurprisingly identical to that for the earlier HS103, so in the interest of brevity I’ll spare you another iteration of the full image suite of steps. See the earlier teardown for ‘em; here’s today’s teardown subset. One upside this second time around: no blood loss by yours truly!

As before, I ‘spect this is the assembly subset that you’re all most interested in:

once again based on (among other things) a Hongfa HF32FV-16 relay (the tan rectangular “box” at far right). Multiple products, along with multiple hardware versions for each, may evolve in a general sense, but some things stay the same…

Detailing the “smarts”

And specifically, here’s the “action” end:

From this side, the embedded antenna is visible; the PCB is otherwise bare:

You can see the antenna from the other side, too, plus a more broadly interesting presentation:

The PCB “lay of the land” is reminiscent of that inside February’s HS103, including the respective switch and LED locations:

This time, however, the prior design’s Realtek RTL8710 has been upgraded to the dual-core RTL8720 (PDF), whose beefier processing “chops” are presumably helpful for implementing the added energy monitoring and HomeKit protocol capabilities, as well as with expanded internal RAM and (optional integrated) flash memory. In this particular design, however, the flash memory is external, taking the form of an Eon Silicon Solution EN25Q32B 32 Mbit SPI serial device. It’s in the upper right corner of the PCB, next to the LED and occupying one of the IC sites you might have already noticed was unpopulated in the HS103 implementation. The other previously unpopulated IC site, below the EN25QH32B, now houses a Shanghei Belling BL0937 (PDF) single-phase energy monitoring IC. Eureka!

Tying up loose ends

As with its TP-Link (but not more amenable Amazon) smart plug predecessors, I was unable to wedge the EP25’s PCB away from the rear half of its enclosure, so there’ll be no circuit board backside photos for you…from me, at least. Alternatively, you can always check out the ones published by the FCC. If you do, you may walk away amazed (as I was) by the total area dominance by multiple large globs of solder.

In closing, I thought I’d share a somewhat related video I found while doing my research. It’s a review of the HS110, the energy monitoring variant of TP-Link’s original HS100 smart plug that I tore down nine years back:

As those Virginia Slims commercials used to say, “You’ve come a long way.” And with that, I’ll turn it over to you for your thoughts in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

Related Content

• Tapo or Kasa: Which TP-Link ecosystem best suits ya?
• TP-Link’s Kasa HS103: A smart plug with solid network connectivity
• TP-Link’s Kasa EP10: If at first it doesn’t connect, buy, buy again

The post TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive appeared first on EDN.

NXP’s TEF8388 RF CMOS automotive radar transceiver supports Level 2+ and Level 3 ADAS, with a roadmap toward higher levels of automation. Operating in the 76- to 81-GHz FMCW radar band, it provides 8 transmitters and 8 receivers (8T8R), scalable to 32T32R configurations for both entry-level and high-performance systems. Paired with NXP radar processors, it forms an imaging radar platform that addresses diverse performance, cost, and regulatory requirements across global markets.

The TEF8388 delivers strong RF performance—14 dBm Pout and 12 dB NF—while keeping power consumption comparable to less integrated 3T4R devices. An on-chip M7 core provides flexible chirp programming, calibration, and functional safety management.

Occupying a 16×16-mm footprint, the TEF8388 uses an optimized pin layout and strategic launcher placement to enhance channel isolation and signal quality. It meets AEC-Q100 and ISO 26262 SEooC ASIL B requirements and operates over a junction temperature range of –40 °C to +150 °C.

Development support for lead customers is available now. Mass-market support will follow later in 2026. 

TEF8388 product page 

NXP Semiconductors 

The post Radar transceiver scales for automated driving appeared first on EDN.

A half-wave LLC (HWLLC) platform from Renesas includes four controller ICs rated for up to 500 W for high-speed chargers. The HWLLC AC/DC converter topology scales from 100 W to 500 W, enabling chargers for power tools, e-bikes, and other appliances without the size, heat, and efficiency penalties of legacy topologies.

Combined in a 240-W USB EPR power adapter design, the HWLLC approach achieves a power density of 3 W/cm³ and 96.5% peak efficiency—described as the industry’s highest power density. The 500-W envelope broadens application range, while USB-C EPR capability enables a move beyond 100-W charging.

At the heart of the lineup is the RRW11011, an AC/DC primary-side digital controller with interleaved PFC and HWLLC operation. It delivers a wide 5-V to 48-V output for USB 3.1/3.2 EPR and other variable-load charging systems. The boost PFC stage minimizes ripple, total harmonic distortion, and EMI, while digital two-stage control enhances efficiency and reduces audible noise.

The platform also includes the RRW30120 USB PD 3.2 EPR controller with secondary-side regulation, the RRW40120 600-V half-bridge gate driver optimized for SuperGaN FETs and MOSFETs, and the RRW43110 synchronous rectifier controller.

The RRW11011, RRW30120, RRW40120, and RRW43110 are now in production, and samples are available for evaluation.

Renesas Electronics 

The post HWLLC topology pushes fast charging to 500 W appeared first on EDN.

QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. Two of the series’ six devices offer an RDS(on) of just 1 mΩ and achieve a power density of 240 W/in.3 in a 62×152-mm package. The modules are available with or without a parallel Schottky barrier diode to further reduce switching losses in high-temperature environments.

QSiC Dual3 is designed to replace silicon IGBT modules with minimal redesign, reducing both size and weight while maintaining efficiency. All SiC MOSFET die are screened using wafer-level gate-oxide burn-in tests exceeding 1350 V. The modules also feature low junction-to-case thermal resistance, enabling the use of smaller, lighter heatsinks.

The Dual3 lineup includes the following part numbers:

Rated for junction temperatures from −40°C to +175°C, the QSiC modules are also suited for grid converters in energy storage systems, industrial motor drives, uninterruptible power supplies, and EV applications.

Learn more about the QSiC Dual3 modules here.

SemiQ

The post SiC modules raise power density for AI servers appeared first on EDN.

The SAM9X75D5M from Microchip is a hybrid SiP for automotive HMI applications, integrating an 800‑MHz ARM926EJ‑S 32‑bit processor with 512 Mbits of DDR2 SDRAM. The package also includes a 24‑bit LCD controller supporting displays up to 10 in. with XGA resolution (1024×768), simplifying high-performance graphical interfaces.

This hybrid SiP combines MPU-class processing with high-density memory in a single package, reducing PCB complexity while maintaining MCU-style development workflows. For automotive and e-mobility HMIs, it offers real-time OS support and flexible display and camera interfaces, including MIPI DSI, LVDS, RGB, MIPI CSI, and 12-bit parallel I/F.

AEC-Q100 Grade 2 qualified, the SAM9X75D5M provides CAN FD, USB, and Gigabit Ethernet connectivity with Time-Sensitive Networking (TSN) capability. It also integrates 2D graphics, audio, and advanced security functions.

The device comes in a 243‑ball BGA package (part number SAM9X75D5M‑V/4TBVAO) and is priced at $9.12 each in 5000‑unit quantities. Variants with 1 Gbit and 2 Gbits of memory are now sampling.

SAM9X75D5M product page 

Microchip Technology 

The post Automotive HMI SiP packs MPU and DDR2 memory appeared first on EDN.

Semtech’s TDS5311P circuit protection device delivers near-constant clamping voltage for 48-V USB PD EPR applications. A member of the SurgeSwitch family, it protects a single voltage bus or data line operating at up to 53 V in devices and systems requiring industrial-grade reliability.

Unlike conventional TVS diodes, the TDS5311P uses a surge-rated FET as the main electrical overstress (EOS) protection element. It maintains a nearly constant clamping voltage from the first microsecond of a surge event through the maximum rated current across the full −40°C to +125°C industrial temperature range.

The TDS5311P is rated for transient current up to 24 A (8/20 µs) and peak pulse power of 1512 W (8/20 µs). It meets the IEC 61000-4-5 industrial surge standard of ±1 kV (RS = 42 Ω, CS = 0.5 µF), as well as IEC 61000-4-2 ESD withstand levels of ±20 kV (contact) and ±25 kV (air). Typical clamping voltage is 60 V at 24 A (8/20 µs).

Housed in a 2.0×2.0-mm, 6-pin DFN package, the TDS5311P conserves PCB area compared with SMAJ and SMAB packages. Supplied on tape and reel in 3000-unit quantities, the device costs $0.38256 each ($1147.68 per reel).

TDS5311P product page 

Semtech

The post FET-based clamp protects 48-V USB PD EPR lines appeared first on EDN.

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers.

The post The system architect’s sketchbook: Inside the simulation appeared first on EDN.

In a significant move to fortify India’s position as a global electronics hub, the Ministry of Electronics and IT (Meity) has approved 29 new applications under its flagship component manufacturing scheme.

The announcement, made on Monday by IT Secretary S. Krishnan, marks a substantial expansion of the nation’s industrial capacity. The newly sanctioned projects represent a cumulative investment of ₹7,104 crore, signalling robust private sector confidence in the government’s “Make in India” initiatives.

Economic Impact and Job Creation

The scale of the approved projects is expected to ripple through the domestic economy. According to Secretary Krishnan, the fresh wave of investment is projected to:

• Generate 14,246 new jobs directly within the electronics manufacturing segment.

• Yield a production value of ₹84,515 crore, significantly reducing reliance on imported sub-assemblies and parts.

Strengthening the Supply Chain

This latest round of approvals brings the total number of sanctioned projects under the Meity scheme to 75. By focusing specifically on components—the building blocks of smartphones, computers, and automotive electronics—the government aims to move beyond simple assembly and build a more resilient, end-to-end domestic ecosystem.

“The approval of these 29 applications underscores our commitment to deepening the electronics value chain in India,” a senior official noted, highlighting that the move is a strategic step toward the country’s goal of reaching a $300 billion electronics production target by 2026.

The scheme continues to be a cornerstone of India’s strategy to compete with regional manufacturing giants, providing the necessary fiscal support to offset the high costs of setting up sophisticated component units.

The post India Boosts Tech Manufacturing: Government Approves 29 New Electronics Component Projects Worth ₹7,100 Crore appeared first on ELE Times.

Формування компетенцій у сфері адитивного виробництва: досвід міжнародного співробітництва у проєкті ADMiRE Інформація КП пн, 03/30/2026 - 15:17

The EXPRESS program, a five-year, £10.4m UK Engineering and Physical Sciences Research Council (EPSRC)-funded project led by the University of Warwick and University of Southampton, is to support the development of next-generation transistor and optoelectronic devices...

STMicroelectronics has announced the expansion of its 800 VDC power conversion portfolio with two new advanced architectures: 800 VDC to 12V and 800 VDC to 6V. Developed according to the NVIDIA 800 VDC reference design, these new power conversion stages complement the previously introduced 800 VDC to 50V solution. The rapidly emerging 800 VDC data centre architecture enables higher energy efficiency, reduces power losses, and supports more scalable, high compute density infrastructure for hyperscalers and AI compute.

“As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors,” said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office at STMicroelectronics. “With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures.”

A complete 800 VDC ecosystem for the different AI server form factors

The expansion to 12V and 6V output stages reflects the industry move toward different server architectures requiring different power delivery topologies depending on GPU generation, server height, form factor, and thermal envelope for large-scale training clusters, inference farms, and high-density AI infrastructures. The 50V, 12V, and 6V intermediate DC buses will all coexist in AI data centres depending on rack density, GPU configuration, and cooling strategy.

The new 800 VDC to 12V converter enables high-efficiency distribution from rack-level power shelves directly to the voltage domains that feed advanced AI accelerators.

The new 800 VDC to 6V path allows OEMs to reduce the number of conversion stages and move the 6V bus closer to the GPU. This reduces copper usage, minimises resistive losses, and improves transient performance, a critical differentiator for large-scale training clusters.

Back in October 2025, STMicroelectronics introduced a fully integrated prototype power‑delivery system showcasing a compact GaN‑based LLC converter operating directly from 800 V at 1 MHz with over 98% efficiency and exceptional power density in a smartphone‑sized footprint exceeding 2,600 W/in³ at 50 V.

The three solutions combine ST technologies across power semiconductors (silicon, SiC, GaN), analogue and mixed-signal, and microcontrollers.

Technical highlights of the new 12V and 6V architectures

Direct 800 VDC to 12V high-efficiency conversion:

• Eliminates the traditional 54V intermediate stage, reducing conversion steps and system-level losses.
• Enables higher rack-level efficiency, lower copper usage, and simplified integration for future GPU generations.
• Includes a newly developed high-density power delivery board (PDB) achieving efficiency targets exceeding the sum of the previous two-stage conversion paths.

800 VDC to 6V architecture for GPU-nearing conversion:

• Is designed for system builders who require power stages closer to the GPU, minimising IR drop and improving response under fast load transients.
• Completes the topology portfolio for servers with ultra-dense GPU configurations.

The post STMicroelectronics expands 800 VDC AI datacenter power conversion portfolio with new 12V and 6V architectures in collaboration with NVIDIA appeared first on ELE Times.

In a written reply, Minister of State for Commerce & Industry, Jitin Prasada, informed the Rajya Sabha that incentives worth Rs. 15,554 crores have been provided under the large-scale electronics manufacturing & IT hardware 2.0 schemes. Additionally, a sum of Rs. 2,377.56 crore has been disbursed under the automobiles & auto components sector.

Prasad further highlighted that the PLI schemes have attracted investments worth more than Rs. 2.16 lakh crore so far. Until now, the government has rolled out the PLI scheme for 14 sectors with the aim of strengthening domestic manufacturing and boosting exports.

Providing a sectoral breakdown of funding, the minister informed that Rs 6,022 crore has been disbursed for the pharmaceutical sector, Rs 1,859 crore for telecommunications, and Rs 2,163 crore for food products. Other allocations include Rs 55 crore for bulk drugs, Rs 157 crore for medical devices, Rs 281 crore for white goods, Rs 93 crore for drones, Rs 81 crore for IT hardware, Rs 55 crore for textiles, and Rs 132 crore for speciality steel.

No incentives have been disbursed so far for high-efficiency solar PV modules and advanced chemistry cell (ACC) battery schemes, he added.

Commenting on the dynamics of West Asia and the Gulf countries, the minister highlighted their importance as key markets for Indian agricultural exports. The region, including UAE, Saudi Arabia, Oman, Kuwait, Qatar, Bahrain, as well as Iran, Iraq and Yemen, accounted for exports worth USD 10.68 billion in 2024-25, nearly 20.5 per cent of India’s total agri exports.

These exports span a wide range of products, including cereals, animal products, fruits and vegetables, spices and processed foods sourced from across the country.

Prasada said the government is closely monitoring the evolving geopolitical situation in West Asia and its impact on trade, shipping routes and logistics. Exporters have reported challenges such as higher freight rates, war-risk surcharges, container shortages, shipment delays and port congestion.

By: Shreya Bansal, Sub-Editor

The post Geopolitical Shifts in West Asia: India Tracks Impact on Vital Shipping & Logistics Corridors appeared first on ELE Times.

In the world of audio, silence is often as valuable as sound. Whether it is the low rumble of an airplane cabin, the drone of traffic, or the hiss of background noise in a recording, unwanted audio can compromise clarity and comfort.

Active noise control (ANC) offers a sophisticated solution: instead of merely blocking noise, it uses microphones, processors, and speakers to generate an equal and opposite signal that cancels interference in real time.

This marriage of acoustics and digital signal processing has transformed how we experience music, communication, and quiet itself, making ANC one of the most elegant applications of engineering in audio systems.

 

Active noise control vs. active noise cancellation

Before the dive, it’s good to note that active noise control (ANC) is the overarching engineering principle—using sound to counter sound—while active noise cancellation is its most familiar audio application, seen in headphones, earbuds, and car cabins.

This distinction matters because it shows how a fundamental control concept translates into everyday listening, making the science behind ANC directly relevant to how we experience clarity and comfort in audio systems.

Noise management: Isolation, reduction, and cancellation

To effectively manage sound, it’s important to distinguish between passive isolation, active noise reduction (ANR), and active noise cancellation (ANC), as these terms are often conflated in consumer marketing. Passive noise isolation provides the foundation, using physical barriers like dense ear-cup foam and high-quality seals to block sound waves from entering the ear canal, making it effective against a broad spectrum of high-frequency noises.

Beyond this physical barrier, active noise reduction (ANR) and active noise cancellation (ANC) represent the same advanced technology; the former term being more common in aviation and industrial sectors, and the latter in consumer retail. Both utilize integrated microphones and digital signal processing to sample environmental noise and generate a precise “anti-noise” signal in real time.

By applying the principle of destructive interference—creating an inverted wave that effectively neutralizes the original sound—these active systems are uniquely capable of erasing steady, low-frequency sounds that passive methods struggle to mitigate.

Nature’s ANC: How treefrogs and other animals tune out the world

Nature is the original engineer when it comes to acoustics, and while you will not find animals with electronic hardware, some species have evolved ingenious biological mechanisms that function on the exact same principle as active noise cancellation (ANC).

The most striking example is found in certain species of treefrogs, which face the daunting challenge of picking out a specific mate’s call amidst a deafening swamp-wide chorus. To solve this, they possess an internal connection between their eardrums that passes through their lungs; this allows the lungs to act as an acoustic filter, creating a phase-cancellation effect that effectively “mutes” the frequencies of competing species while amplifying the call of their own.

Beyond this direct analogue to ANC, many animals utilize other strategies to combat environmental noise, such as the “Lombard effect,” where birds and primates actively adjust the pitch or volume of their vocalizations to cut through ambient chaos, or the “jamming avoidance response” seen in electric fish, which shift their pulse frequencies to prevent signal interference. Ultimately, while these animals are not wearing headsets, evolution has mastered the art of filtering out the noise to focus on what matters most.

And as a historic note, ADI’s SSM2000 was a pivotal audio IC that revolutionized noise reduction through its patented HUSH “single-ended” technology.

Unlike traditional systems that required complex pre-encoding, SSM2000 could adaptively and dynamically strip away hiss and background noise from any audio source on the fly. By integrating a sophisticated dynamic filter and downward expander into a single, cost-effective package, it became the industry standard for enhancing signal clarity in 1990s consumer electronics—ranging from car stereos to early PC sound cards—offering a clever, hardware-based solution for high-fidelity sound that paved the way for modern signal processing.

Figure 1 From the 1990’s SSM2000 to today’s DSP-driven architectures, engineers leverage biological noise-suppression mechanisms to deliver precision audio clarity. Source: Author

Inside active noise cancellation systems

Active noise cancellation (ANC) works by detecting and analyzing incoming sound patterns, then generating an opposing “anti-noise” signal to neutralize them. This process significantly reduces the level of background noise you hear. ANC is especially effective against steady, low-frequency sounds such as ceiling fans or engine hums. While it’s most commonly found in stereo headsets that cover both ears, some mono headsets also incorporate ANC technology to enhance noise management.

Figure 2 Sketch demonstrates the core principle of ANC. Source Author

In essence, ANC works by generating an anti-noise waveform that mirrors the shape and frequency of the unwanted sound. This waveform is produced at a phase angle of exactly 180° opposite to the noise, so when both signals meet at the target area, they effectively cancel each other out.

ANC systems can be implemented through different hardware configurations:

• Feed-forward ANC: A microphone is positioned on the outside of the earphone to capture external noise before it reaches the ear.
• Feed-back ANC: A microphone is placed inside the earphone, monitoring the sound that actually enters the ear canal and canceling it in real time.
• Hybrid ANC: This combines both feed-forward and feed-back methods, offering more precise and adaptive noise reduction across a wider range of frequencies. That is, two microphones are used to form a closed-loop design. The reference microphone forecasts incoming external noise, while the error microphone audits the sound inside the ear canal. This dual setup enables the system to cancel noise effectively and avoid feedback issues.

Beyond hardware design, ANC relies on adaptive cancellation. This technique uses one or more microphones to continuously detect external noise and dynamically adjust the anti-noise waveform in real time to suit changing environments.

While some specialized industrial noise-control systems use a ‘synthesis method’—where the noise pattern is sampled and a known waveform is generated to counteract it—modern consumer headphones rely almost exclusively on adaptive, real-time processing to handle the unpredictable and constantly changing noise of the real world.

Broadband vs. narrowband noise cancellation

In the field of active noise control engineering, the terms broadband and narrowband carry meanings that differ from their use in telecommunications. Broadband ANC refers to systems designed to reduce unpredictable, wide-frequency environmental noise such as traffic, crowd chatter, or wind.

Because this type of noise is random, the system requires a coherent reference signal to generate an effective anti-noise waveform. By measuring the primary noise upstream, the digital controller can model the phase and magnitude of the disturbance in real time, allowing correlated noise to be canceled downstream at the loudspeaker.

Narrowband ANC, on the other hand, is tailored to periodic noise generated by rotational machinery, such as engines or fans. Instead of relying solely on an acoustic input microphone to capture the noise mid-propagation, the system uses a non-acoustic reference—such as a tachometer signal—to determine the fundamental rotational frequency.

Since repetitive noise occurs at predictable harmonics of this frequency, the control system can model these components with high precision. This approach is particularly effective in vehicle cabins, where it suppresses specific engine-related vibrations without interfering with speech, radio performance, or essential warning signals.

Modern ANC implementations often combine these strategies, resulting in adaptive broadband feedforward control, which utilizes acoustic sensors, and adaptive narrowband feedforward control, which employs non-acoustic sensors like accelerometers or tachometers.

Figure 3 A simple graphic depicts destructive interference as anti-noise combines with unwanted noise to reduce residual noise. Source: Author

Balancing promise and pitfalls: The realities of ANC

So, while active noise cancellation promises remarkable benefits—quieting the hum of engines, reducing fatigue during long journeys, and sharpening the clarity of music or speech—it also comes with challenges that beginners should appreciate. ANC systems excel at steady, low-frequency sounds but falter when faced with sudden or irregular noise.

Engineers must carefully tune parameters such as the damping ratio, which governs system stability, and the phase response, which determines how precisely the inverted signal cancels the original. Too much damping can make the system sluggish, while too little risks instability or even amplifying certain frequencies.

Latency in signal processing, microphone placement, and the physical limits of speakers all add complexity. Understanding these trade-offs is vital, because ANC is not about achieving perfect silence; it’s about learning how physics and signal processing collaborate to reduce chaos in real-world conditions.

Silence from chaos: The beginner’s journey into active noise cancellation

Active noise cancellation is one of those technologies that feels almost magical, yet it’s rooted in a principle simple enough for beginners to explore. Imagine sitting in a room filled with the steady hum of a fan or the drone of traffic outside and then hearing that noise dissolve because of a circuit you built yourself. That is the essence of ANC—capturing unwanted sound, inverting its waveform, and blending it back so the disturbance cancels itself out.

For those new to the field, the journey does not require professional acoustic labs or high-end industrial equipment; a pair of microphones, a set of speakers, and basic signal processing components are sufficient to begin. However, it is important to be clear: designing a functional ANC system from scratch is one of the most formidable challenges a hobbyist can undertake. It demands more than just coding skills; it requires a deep understanding of wave physics, precise timing, and acoustic dynamics.

The complexity of this task lies in the “latency budget”—the critical window of time the system has to process external noise and generate an inverse wave before it reaches the ear. If the processing takes too long, the waves will not align properly, failing to achieve destructive interference.

Fortunately, the barrier to entry has lowered. Modern, high-speed microcontrollers and dedicated DSP hardware now allow hobbyists to implement adaptive filters that were once exclusive to expensive, industrial-grade equipment. Chips from major players like Analog Devices and ams OSRAM bring ANC within reach of hobbyists, offering playful possibilities for makers eager to experiment with noise cancellation and advanced audio signal-processing projects.

As an introductory analog experiment, serious hobbyists can explore active noise cancellation by setting up a microphone to capture ambient noise, inverting that signal via an active phase-inverter, and summing it back into the audio path to create destructive interference. While this approach lacks the adaptive processing of digital systems, it provides a masterclass in phase alignment, group delay, and the iterative challenge of balancing amplitude in real-world signal paths.

Well, the first time you hear noise dissolve because of your own project, you realize it’s not just about electronics, it is about discovering how human ingenuity can carve silence out of chaos. That is the real inspiration of ANC for beginners: a hands-on path into the power of sound, silence, and imagination, now made more accessible than ever by today’s tools.

Ready to explore? Begin your first ANC experiment today and discover how you can turn noise into silence with your own hands.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

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• Active noise cancellation: Trends, concepts, and technical challenges

The post Active noise control: Engineering silence in audio systems appeared first on EDN.

Amid growing cybersecurity risks in the industry, 63SATS Cybertech has renewed its strategic title partnership with CyberSec India Expo 2026 for the second consecutive year, strengthening efforts to advance India’s rapidly evolving cybersecurity ecosystem.

The expo, scheduled for April 23–24, 2026, at the Bombay Exhibition Centre, Mumbai, will bring together CISOs, CIOs, CTOs, DPOs, policymakers, security leaders, enterprise decision-makers, and technology providers to examine emerging risks, regulatory developments, and advanced defence strategies shaping the digital economy.

As organisations navigate increasing exposure to sophisticated cyber threats and stricter compliance requirements, the platform is expected to facilitate focused discussions on securing critical infrastructure, digital public systems, and enterprise environments. It will also serve as a meeting ground for solution providers and end users to exchange practical insights and explore scalable security frameworks.

Through this renewed association, 63SATS will contribute its expertise across security operations, threat intelligence, and risk mitigation, while engaging with industry stakeholders on addressing current and emerging cybersecurity challenges.

Mr Taher Patrawala, Managing Director, Media Fusion, said, “As digital adoption accelerates across sectors, with India’s digital economy projected to reach $1 trillion by 2030 and over 900 million internet users driving unprecedented data exchange, cybersecurity is becoming central to sustaining trust and business continuity. Our continued engagement with 63SATS strengthens the platform’s ability to bring together expertise, real-world perspectives, and solution-driven discussions that are critical to navigating today’s increasingly complex threat landscape.”

Mr Neehar Pathare, Managing Director, CEO & CIO, 63SATS Cybertech added, “As India advances into a new era of digital governance with the rollout of the Digital Personal Data Protection framework, organisations are being held to significantly higher standards of accountability and compliance. In this environment, cybersecurity is no longer just a technical function but a critical pillar of risk management and business resilience. Our continued partnership with CyberSec India Expo reflects our commitment to driving industry-wide alignment with evolving regulatory mandates, while fostering meaningful conversations around building secure, compliant, and future-ready digital ecosystems.”

With increasing regulatory oversight, growing digital adoption, and heightened exposure to cyber risks, the partnership signals a broader industry shift toward integrated, ecosystem-led approaches to cybersecurity. CyberSec India Expo 2026 is positioned to serve as a critical convergence point for aligning strategy, technology, and policy in response to these challenges.

The post 63SATS Cybertech Reaffirms Strategic Partnership with CyberSec India Expo 2026 to Advance India’s Cyber Defence Ecosystem appeared first on ELE Times.

It displays the numbers like this one https://www.amazon.com.mx/Tech-Tools-Palabras-Muestra-Pulgadas/dp/B01H5RPQAO Made it just using logic gates, the design with the segmented counters is used only for simulation (because proteus doesn't like simulating the other one), and those two images without them shows the components that the PCB should have in order to work correctly irl. You can set and reset the time and also it can reset the leds. submitted by /u/Dull-Comb-3586 [link] [comments]

Back in 1961 this book showed up at my school library. I was 10 years old in the 5th grade. I was the only student that ever checked this book out of the school library. This started a career that spanned decades in electronic engineering! Thanks for looking! submitted by /u/W0CBF [link] [comments]

The Ansys simulations aren't that trustworthy, I was running into some Fidelity relates issues + Student License Limitations, in the end by hacking stuff a bit I Managed to get a good run, the FETs hit 60-63 °C while the Rsense turned into a mess (forgot to configure local Fidelity for it) The FETs are Infineon SMD FETs BSC010N04LSATMA1, chose them due to extremely low Rds (1m OHM) and max Vds of 40V (forgot the current rating, it's definitely high 40s though) This is designed to handle a 20A Steady Current. OCD set to 1.4 Sec i the config. And a switch to Change the BMS between hibernate and active state. submitted by /u/The_Digital_Quill [link] [comments]

I low key don't know shit about electronics. I found a old Samsung camera of my parents but the charger was missing. I had this charging module over because I wanted to power an esp32 with a battery (never did something with it). And I looked at the battery and it said 3,8v (4,2v) on the outside and this module was for 3,7v batteries which also charge up to 4,2v, so I thought close enough. I needed a metal that was easy to bend and wouldn't scratch the shit out of the contacts and that I could push a little so it would make contact. Solder was my first thought so all the wiring is solder. It's quite annoying to solder solder but in the end it worked and charged the battery and the camera works. submitted by /u/Tee-Der-Schwarz-Ist [link] [comments]