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Spectrik of Eindhoven, The Netherlands is taking further steps in developing photonic gas sensors for agricultural applications by partnering with Eindhoven-based VTEC Lasers and Sensors B.V...

As part of its ongoing initiatives to optimize its manufacturing footprint, materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA is to sell its epitaxial fabrication facility in Champaign, Illinois...

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched its 2x400G-FR4 Lite optical transceiver, a silicon photonics-based module optimized for AI-driven data centers and high-speed Ethernet networks. Designed for high volume deployments, the transceiver delivers 500m reach while significantly reducing power consumption. It complements the firm’s existing 800G-DR8 transceiver (also built with silicon photonics technology) with a wavelength-multiplexed variant that is more fiber-efficient than the DR8...

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched its 793nm pump laser diode, setting what is said to be a new industry standard with 28W of power and 97% polarization purity. The product offers what is claimed to be unmatched performance and cost efficiency, unlocking new possibilities for applications in the rapidly growing thulium fiber laser market...

Bridgelux Inc of Fremont, CA, USA (a vertically integrated developer and manufacturer of solid-state light sources for lighting applications) has expanded its chip-on-board (COB) product line by launching two inaugural DriveLux series of light engine products. By seamlessly integrating COB technology with an advanced driver, DriveLux is compact, with a replaceable design, what is claimed to be exceptional CRI90 efficacy, and versatile mounting options for large, selectable optical lenses in various sizes and beam angles...

Multi-national industrial and energy company METLEN Energy & Metals S.A. of Athens, Greece — which operates the only vertically integrated bauxite, alumina and primary aluminium production unit in the European Union (EU) with privately owned port facilities — says that its flagship investment in gallium production at the historic Aluminium of Greece industrial unit has been officially recognized as a Strategic Project by the European Commission under the Critical Raw Materials Act (CRMA)...

submitted by /u/DifficultyWhich7483 [link] [comments]

PCIe, the most successful interconnect technology for more than 25 years, is entering a new phase of complexity with the adoption of PCIe 6.0, which is now largely driving artificial intelligence (AI) workloads. Gary Hilson talks to senior managers at Broadcom and Astera Labs to understand issues related to PCIe 6.0 system design, interoperability and performance testing. These issues are critical in PCIe 6.0 deployment in advanced AI data centers.

Read the full story at EDN’s sister publication, EE Times.

Related Content

• PCIe 7.0 To Double Data Rate – Again
• Gen 4 PCIe Switch for ADAS Applications
• Advanced workloads drive PCIe 6.0 adoption
• AI Data Centers Need Huge Power-Backup Systems
• Solving PCIe Latency with Retimers and Elastic Buffers

The post A closer look at PCIe 6.0 interoperability, performance testing appeared first on EDN.

Skorpios Technologies Inc of Albuquerque, NM, USA (which provides integrated silicon photonics products and silicon nanostructures based on its proprietary Tru-SiPh wafer-scale heterogeneous integration platform) has appointed Gunter Reiss as chief revenue officer to accelerate global expansion across AI infrastructure, hyperscalers, optical networking, quantum computing, LiDAR, aerospace, and advanced foundry services...

LM317 fans will recognize Figure 1 as the traditional LM317 constant current source topology. It closely regulates Iout = Vadj/Rs by forcing the OUTPUT pin to be Vadj = 1.25 V positive relative to the ADJ pin. Thus, Iout = Vadj/Rs to a very good approximation. Master chip chef Bob Pease cooked it up to be so!

Figure 1 Classic LM317 constant current source,
Iout = Vadj/Rs + Iadj ≃ Vadj/Rs = 1.25/Rs.

Wow the engineering world with your unique design: Design Ideas Submission Guide

In usual practice, Iout >> Iadj, the latter being specified at 50 µA typical, 100 µA max. This simplifies the math by making the Iadj bias current safely ignorable without letting accuracy take a hit. It’s worked great for 50 years but it has an obvious downside. the way you program Iout is by changing Rs.

Figure 2 shows a new(er) topology with a different (more agile) method for making Iout programmable.

Figure 2 A novel LM317 topology enables control of amps of Iout with just milliamps of Ic,
Iout = (Vadj – (Ic – Iadj)Rc)/Rs – Ic + Iadj ≃ (Vadj – (Ic – Iadj)Rc)/Rs. 

Typically, Rc > 100Rs, making Figure 2 able to control up to 1.5 A of Iout with just milliamps of Ic. Of course, now it may no longer be good enough to just ignore Iadj. 

Figure 3 shows the idea fleshed out into a complete PWM controlled 15 V, 1 A, grounded-load current source that includes Iadj compensation. Here’s how it works.

Figure 3 The 1-A, 15-V, PWM-programmed grounded-load current source with a novel LM317 topology. The asterisked resistors are 1% or better and Rs = 1.25 Ω.

The 5-Vpp PWM input has a frequency (Fpwm) assumed to be 10 kHz or thereabouts. If it doesn’t, scale C1 appropriately with:

C1 = 22µF*10kHz/Fpwm

The resulting PWM switching of Q2 creates a variable resistance averaged by C1 to Rc(1 + 1/Df) where Df = the 0 to 1 PWM duty factor.  Thus a (0 to 2.5v)/2Rc = 3.11 mA Ic current = 2.5v/Rc(1 + 1/Df) flows into Z1’s summing point.

Z1 servos the V1 gate drive of Q1 to hold its source at an accurate 2.5-V reference for the PWM conversion and to level shift Ic to track U1’s ADJ pin. Also summed with Ic is Iadj bias compensation (2.5v/51k = 50µA) provided by R1.

The unsightly stack of six 1N4001’s is needed to provide bias for Q1 to work into. I freely admit that it’s not very pretty. Hopefully the novelty of Figure 2 makes up for it! 

Note that accuracy and linearity mostly depend only on the match of the Rc resistors and the precision of the Z1 and U1 internal references. It’s a happy coincidence that the 2:1 ratio of the TL431’s 2.5-V versus the LM317’s 1.25 V permits the convenient use of three identical Rc resistors.

If Rs = 1.25 Ω, then Iout(max) = 1 A and Iout versus Df is as plotted in Figure 4.

Figure 4 Iout versus Df where Df (x-axis) is the PWM duty factor and Iout (y-axis) is Vadj/1.25 = 1 A full-scale = 1 – 2/(1 + 1/Df).

 Df versus Iout is plotted in Figure 5.

Figure 5 Df versus Iout where Iout (x-axis) is 1 A full-scale and Df (y-axis) = 1/(2/(1 – Iout) – 1).

Note that U1 might be called upon to dissipate as much as:

• 20 W if Rs = 1.25 Ω and Iout(max) = 1 A
• 30 W if Rs = 0.83 Ω and Iout(max) = 1.5A

Moral of the story: don’t be skimpy on the heatsink! Also note that Rs should be rated for a wattage of at least 1.252/Rs.

Then there’s the consideration of power up/down transients. When the system is first switched on and C1 is sitting discharged, and the controller will have about 4 to 8 milliseconds to initialize the PWM logic to 1.0 before C1 can charge enough to allow U1 to come on and start sourcing current. Don’t forget this detail during software development! On power-down, Q3 kicks in when +5 V drops below ~2 V. This saturates Q1 and forces Iout to zero to protect the load as well as discharging C1 in preparation for the next power-up.

In closing, thanks go (again) to savvy reader Ashutosh for his suggestion that the Figure 2 topology might deserve a focused DI of its own, and (likewise again) to editor Aalyia for the fertile DI environment she has created that makes this kind of teamwork, well, workable!

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

Related Content

• 1 A, 20 V PWM DAC current source with tracking preregulator
• Classic 3-leg adjustable regulators have a shunt mode? Who knew?
• LM317 smooths but doesn’t regulate
• PWM power DAC incorporates an LM317
• Power Zener using the LM317
• Use an LM317 as 0 to 3V adjustable regulator

The post PWM-programmed LM317 constant current source appeared first on EDN.

Firmware is open source though. A small (52x30) PCB to forward USB HID reports over BLE. Plus additional buttons and a rotary encoder. submitted by /u/No_Pilot_1974 [link] [comments]

submitted by /u/1Davide [link] [comments]

Analog/mixed-signal and specialty foundry X-FAB Silicon Foundries SE of Tessenderlo, Belgium, independent pure-play indium phosphide (InP) integrated photonics foundry SMART Photonics of Eindhoven, The Netherlands, and Epiphany Design of Enschede, The Netherlands (a fabless photonic design house specialized in hybrid and heterogeneous photonics) are collaborating to develop a new heterogeneous photonics integration platform that combines the strengths of InP and silicon-on-insulator (SOI) technologies, enabling multi-terabit data rates for datacom and telecom applications...

What is Gold Soldering?

Gold soldering is a sophisticated metallurgical joining technique that represents the pinnacle of precision manufacturing processes. Unlike conventional soldering methods, this specialized technique involves creating permanent, high-integrity connections between gold or gold-alloy components with exceptional precision and reliability. The process goes beyond simple mechanical joining, instead creating a deep metallurgical bond that ensures optimal electrical, thermal, and structural performance.

How Gold Soldering Works

The scientific principles underlying gold soldering are complex and multifaceted. At its core, the process involves creating an atomic-level bond between gold surfaces using a carefully selected filler material with a strategically lower melting point. The metallurgical interaction is not merely a surface-level connection but a profound interdiffusion of metal atoms that creates a seamless, integrated joint.

The fundamental mechanism begins with the careful preparation of surfaces, where even microscopic contaminants can compromise the entire soldering process. As the filler material is heated, it transitions from a solid to a liquid state, simultaneously wetting the gold surfaces and creating a capillary action that draws the molten material between the components. During this process, atomic diffusion occurs, where the atoms of the filler material intermingle with the gold surfaces, creating a bond that is often stronger and more reliable than the original base materials.

Gold Soldering Process

Surface Preparation: The Critical First Step

Surface preparation is arguably the most crucial phase of gold soldering. This stage requires meticulous attention to detail and advanced cleaning techniques. Professionals employ a combination of chemical and mechanical methods to eliminate any potential contaminants. Specialized solvents are used to remove organic residues, while precise chemical etching or plasma cleaning techniques eliminate oxide layers and microscopic impurities.

The goal is to create an absolutely pristine surface that allows for maximum metallurgical interaction. Even a thin layer of oxidation or a microscopic particle can prevent proper bonding, leading to weak joints or complete soldering failure. Advanced cleaning techniques may include ultrasonic cleaning, chemical degreasing, and high-precision surface treatments that can remove contaminants at the atomic level.

Material Selection: A Delicate Science

Selecting the appropriate materials is a complex process that requires deep understanding of metallurgical properties. The gold alloy composition must be carefully matched with an appropriate filler material that can create a reliable bond while maintaining the desired mechanical and electrical properties. Factors such as melting point, thermal expansion coefficient, and chemical compatibility are meticulously evaluated.

Different applications demand different material characteristics. For instance, electronics may require a filler material that provides optimal electrical conductivity, while medical devices might prioritize biocompatibility and corrosion resistance. This selection process often involves extensive material testing and simulation to ensure optimal performance under various operational conditions.

Uses & Applications

Electronics Industry: Pushing Technological Boundaries

In the electronics industry, gold soldering is nothing short of revolutionary. Semiconductor packaging relies on this technique to create microscopic connections that form the backbone of advanced electronic devices. Hybrid microelectronics, which combine different types of electronic components, depend entirely on the precision and reliability of gold soldering techniques.

Modern smartphones, advanced medical imaging equipment, and cutting-edge aerospace technologies all benefit from gold soldering’s ability to create miniaturized, high-performance connections. The technique allows for the integration of components at nanoscale levels, enabling technological advancements that were previously impossible.

Medical and Aerospace Applications: Reliability in Extreme Conditions

In medical and aerospace domains, gold soldering’s reliability becomes paramount. Implantable medical devices require connections that can withstand the human body’s complex chemical environment, while aerospace components must endure extreme temperature variations and intense radiation.

The ability to create stable, corrosion-resistant joints makes gold soldering indispensable in these critical fields. Precision surgical instruments, satellite communication systems, and advanced sensor technologies all rely on the unique properties that gold soldering provides.

Advantages and Challenges

Gold soldering offers remarkable advantages, including exceptional conductivity, corrosion resistance, and the ability to create extremely precise connections. However, these benefits come with significant challenges. The process is inherently expensive, requiring specialized equipment and highly trained professionals.

The narrow temperature window for optimal soldering demands extraordinary skill and precision. A deviation of mere degrees can compromise the entire soldering process, making it a technique that requires continuous training and technological investment.

Conclusion

Gold soldering represents more than just a joining technique—it is a sophisticated technology that pushes the boundaries of what is possible in manufacturing. As technological demands become increasingly complex, the importance of this precise metallurgical process will only continue to grow.

Professionals in electronics, medical technology, aerospace, and advanced manufacturing must continually invest in understanding and mastering these intricate soldering techniques to drive technological innovation forward.

 

The post Understanding Gold Soldering: Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

Acacia Communications Inc of Maynard, MA, USA (now part of Cisco) — which develops and manufactures high-speed coherent optical interconnect products — has expanded its client optics components portfolio with new products that leverage its proven digital signal processing (DSP) and silicon photonics expertise in coherent optics. Specifically, the firm is introducing a 3nm Kibo 1.6T PAM4 DSP and a family of 200G-per-lane optical engine products that can deliver a solution with the power efficiency required for the most demanding AI workloads...

Deposition equipment maker Aixtron SE in Herzogenrath, near Aachen, Germany is a partner in the research project GraFunkL (Graphene as a functional layer in UVC LEDs) for the use of novel UVC LEDs, which are to be used, among other things, against multi-resistant hospital pathogens...

Photonic application-specific integrated circuit (PASIC) chip design and manufacturing company OpenLight of Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers) has completed Telcordia GR-468 qualification for all active components in its photonic design kit (PDK) based on Tower Semiconductor’s PH18DA process...

submitted by /u/ryleymcc [link] [comments]

Fully TTL driven Nixie clock I have been buildng recently. It have 6x IN-14 and 2x IN-19V Nixie tubes. Clock pulse is taken from mains frequency by optocoupler and devided by 7490 cunters. It can be set for 50Hz o 60Hz. There will be an option to choose beside Mains CLK, Crystal CLK and External CLK. There is also output to drive other clocks as "slave". Later on I will add "Day of the week" display. submitted by /u/Papa_Tronik [link] [comments]

Power semiconductor product supplier Diodes Inc of Plano, TX, USA has introduced its first series of indium antimonide (InSb) Hall-element sensors for rotation speed detection and current measurement in consumer applications such as laptops, mobile phones, joysticks, and in motors found in various home appliances. In industrial applications, they are designed for use in position encoders and commutation of brushless motors and fans. The development of these devices addresses the market demand for greater availability of high-sensitivity InSb Hall sensors in industry-standard 4-pin SOT23-4 and SIP-4 packages...