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Designer’s guide: Radar, LiDAR, and cameras advance ADAS
Advances in autonomous driving and advanced driver-assistance systems (ADAS) now enable vehicles to understand their surroundings in real time, a complex process based on the concepts of perception and sensor fusion.
Perception refers to the ability to detect and classify objects, recognize traffic signs, track pedestrians, and map the road. However, every type of sensor has its own physical limitations. Sensor fusion is the technology that bridges this gap by intelligently combining data from sensors using advanced algorithms.
In this article, we will explore how perception and sensor fusion are driving evolution and innovations in the three main categories of automotive sensors: radar, LiDAR, and cameras. We also highlight several radar, LiDAR, and camera products with advanced features to improve ADAS imaging and perception.
Radar performs in harsh environments
Automotive radar offers excellent performance in tough conditions, such as fog, rain, and darkness, where cameras and LiDAR are less effective. The introduction of 4D imaging radar has added elevation (height) to the standard range, velocity, and azimuth outputs. 4D radar can thus generate dense point clouds that were once available only with LiDAR. According to MarketsandMarkets, the 4D imaging radar market was valued at $390 million in 2025 and is expected to grow to $1.2 billion by 2030, at a compound annual growth rate of 25.2%.
Hirain Technologies has developed the LRR615, a long-range imaging radar built around Arbe Robotics Ltd.’s 4D imaging radar chipset solution. The radar system is the first to be equipped with a high-density waveguide antenna. This feature provides improved image clarity, detection sensitivity, and signal integrity.
Designed to be cost-effective and manufacturable on a large scale, the LRR615 can be paired with cameras in autonomous-driving systems, providing an alternative to LiDAR. After integrating, calibrating, and validating the device, Hirain is setting up the manufacturing process to achieve an annual production of 10,000 units.
Arbe’s chipset (Figure 1) is a multichip architecture that integrates three proprietary, automotive-grade integrated circuits that process ultra-high-resolution data. The chipset can process real-time data from 2,304 virtual channels, achieve 3-Tbits/s equivalent processing throughput, and provide over 10,000 detections at 20 fps.
Arbe’s chipset is based on GlobalFoundries’ (GF’s) proprietary 22FDX process technology. This platform, specifically addressing automotive radar, integrates RF, analog, and digital processing blocks on the same die. This reduces system costs and accelerates time to market. According to GF, using its technology, Arbe is the first in the industry to create a real-time, 4D image of the surrounding environment, achieving a 1° resolution.
Figure 1: Arbe’s automotive-grade chipset integrates a safety processor, security, dual-core DSP, and application processor. (Source: Arbe Robotics Ltd.)
Another relevant application of automotive radar is in-cabin monitoring. An example is Texas Instruments Inc.’s AWRL6844, a 57- to 64-GHz mmWave radar sensor designed for occupancy monitoring, including seat-belt reminder systems, child-presence detection, and intrusion detection (Figure 2).
The AWRL6844 is a low-power device integrating four transmitters and four receivers. This high-resolution sensing data is processed by specific AI algorithms running on a customizable, on-chip hardware accelerator and DSP. This single-chip solution improves detection accuracy, reduces processing time, and enables a safer driving environment.
Figure 2: The TI AWRL684x mmWave sensor device employs FMCW radar technology to support multiple in-cabin applications. (Source: Texas Instruments Inc.)
Infineon Technologies AG offers a similar product, the XENSIV BGT60ATR24AIP 57.7- to 62.4-GHz radar sensor based on FMCW technology. Available in a compact, 8 × 8-mm2 package with antenna-in-package technology, the device features ultra‑low power consumption, high precision, and advanced sensing, making it suitable for contactless, high-accuracy in‑cabin monitoring.
LiDAR advances with better perception and identification
MicroVision Inc., a company specializing in advanced perception solutions that recently acquired the assets from Luminar Technologies, introduced its Tri-LiDAR architecture. This solution integrates two MOVIA S short-range sensors (placed on the front corners) with one forward-facing HALO long-range LiDAR, delivering continuous, 360° environmental coverage (Figure 3).
The company’s software platform performs the real-time fusion of the data coming from all the sensors and generates a single, high-fidelity point cloud. This enables accurate object detection, classification, and tracking, delivering a real-time perception system.
According to the company, Tri-LiDAR provides three main benefits: a reduction in the power consumption of each sensor, a reduction in the packaging of each sensor, and a cost reduction of the system.
Figure 3: Top view of the MicroVision Tri-LiDAR system (Source: MicroVision Inc.)
Aeva Inc., a company specializing in sensing and perception systems, has licensed Cadence Tensilica Vision DSP IP to support the signal-processing tasks of its 4D LiDAR systems.
Tensilica Vision DSPs’ low-power architecture and Tensilica Instruction Extension language make Tensilica DSPs suited for applications in which real-time signal processing, low latency, and high efficiency are mandatory. According to Aeva, the flexibility and performance of Cadence’s Vision DSP technology will improve the perception and scalability of its solutions, addressing automotive and industrial applications.
Hesai Technology, a company specializing in 3D perception, announced the Picasso 6D Full-Color LiDAR SPAD-SoC, a solution that natively captures 3D spatial geometry (X, Y, Z) and 3D color data (R, G, B) on a single chip, eliminating the need for fusion of separate camera and LiDAR data.
By performing the sensor data fusion directly at the silicon level (the single-photon avalanche-diode SoC), the Picasso chip produces high-resolution, colorized point clouds simultaneously, allowing for better identification of objects such as traffic lights, lane markings, and construction zones. Hesai’s ETX LiDAR, upgraded to support up to 4,320 channels, will integrate this technology and will be available in the second half of 2026.
Lumotive, a company specializing in programmable optical semiconductors, has introduced a solid-state LiDAR platform that combines its commercially available LM10 Light Control Metasurface (LCM) with the ADS6311 Hawk sensor from Adaps Photonics.
The solution (Figure 4) delivers a 180° horizontal field of view and operates at 30 fps, eliminating blind spots, improving the tracking of fast-moving objects, and reducing the number of sensors required. Lumotive’s LCM technology electronically steers light at semiconductor speed, without encountering the limitations associated with mechanical scanners and fixed-channel VCSEL arrays. In addition to 180° horizontal coverage, the sensor offers up to 140° vertical coverage, configurable through software to optimize range, resolution, and frame rate.
Figure 4: The architecture of Lumotive’s solid-state LiDAR system doubles the frame rate typically achieved by many direct ToF LiDAR systems while extending sensing distances to as much as 50 meters. (Source: Lumotive)
Cameras shift to 8-MP sensors
Cameras are rapidly migrating to 8-MP sensors, representing the new baseline for ADAS front and side cameras. The higher resolution directly increases the detection range at highway speeds, enabling confident object classification at distances that 2-MP and 5-MP sensors cannot reliably achieve.
Omnivision introduced the OX08D20 8‑MP CMOS automotive image sensor based on its proprietary TheiaCel technology. The device is an improved version of the OX08D10 sensor for exterior cameras widely used in ADAS and autonomous-driving systems.
The OX08D20 image sensor features a 60-fps frame rate, 2× higher than its predecessor, OX08D10, enabling dual-use cameras. With 60 fps, the video flows more smoothly. This allows car manufacturers to save money, space, and wiring by using one camera to handle both background autonomous-driving tasks and real-time visual displays for the driver. The sensor also supports the latest cybersecurity standard MIPI CSE 2.0 (Camera Service Extensions v2.0) developed by the MIPI Alliance.
Omnivision’s TheiaCel technology has been designed to capture high-quality images even in extreme lighting conditions. It achieves high dynamic range (HDR) using a single exposure. In this way, the LED flicker experienced in traditional HDR sensors is eliminated.
Sony Semiconductor Solutions introduced the IMX828, the industry’s first 8-MP CMOS image sensor for automotive cameras featuring a built-in MIPI A-PHY transmission interface. Traditional automotive camera systems require externally mounted serializer chips to transfer data safely to the vehicle’s electronic control unit. By embedding the MIPI A-PHY interface directly into the sensor, Sony eliminates the need for this additional hardware.
This feature enables a reduction in board size and module power consumption and limits heat generation. The chip also integrates a proprietary error-handling circuit that resists external noise disruptions.
NXP Semiconductors’ 4K MIPI CMOS camera module (IMX-OS08A20) is a high-performance development tool for consumer, industrial, and automotive vision systems. It is built on OmniVision’s 8-MP OS08A20 sensor and adopts PureCel and Nyxel technologies to capture 4K Ultra-HD video at 60 fps.
The development kit includes the 8-MP sensor module, a MINI-SAS interface cable, and an adapter board. It is designed to plug directly into the NXP i.MX 8M Plus Evaluation Kit. The module’s high-resolution performance makes it well-suited for automotive in-cabin applications, such as driver-monitoring systems and occupant-monitoring systems.
The post Designer’s guide: Radar, LiDAR, and cameras advance ADAS appeared first on EDN.
Automotive LEDs and drivers: Balancing performance with style

LED manufacturers continue to enhance their LED designs for automotive lighting, enabling greater differentiation in the car’s exterior and interior illumination as well as improving safety features. Many of the latest developments focus on several key areas: smaller form factors for space-constrained and sleeker designs, improved thermal performance, and flexible color control.
LED driver developments go hand in hand with these advances to support these next-generation LEDs, focusing on advancements in packaging, heat dissipation, and simpler designs for easier integration and space savings.
Here is a selection of LED and LED drivers introduced over the past year, targeting automotive exterior and interior lighting applications. They focus on a range of improvements that deliver smaller form factors, greater heat dissipation, higher system efficiency, enhanced light output, and precise color control.
Automotive LED innovations such as compact, high-luminance designs enable sleeker lighting systems while maintaining uniform, energy-efficient light output. (Source: Adobe Stock)
Some of the latest automotive LED designs address the demand for sleek front lighting. One example is ams Osram’s OSLON Compact RM for next-generation slim headlamp systems. It addresses design aesthetics in automotive lighting with its high luminance, compact form factor, homogeneous light, and color appearance, allowing for the creation of signature lighting elements for brand identity, the company said.
The Compact LED is a 0.5-mm2 rectangular high-current chip, housed in a compact ceramic package. The small size enables optical systems with heights as low as 10 mm, enabling ultra-slim headlamp designs that were previously difficult to achieve, according to ams Osram. The two-pad package design supports solder stability on aluminum boards, suiting it for a variety of automotive lighting applications.
The LED delivers improved optical efficacy through its adapted light-emitting area (LEA) of 0.6 × 0.9 mm with an aspect ratio of 1:1.5. It features high luminance and uniform light output, free from dark zones, while maintaining high energy efficiency, a key factor for EVs.
The OSLON Compact RM for advanced front-lighting applications targets three light functions: low beam, static high beam, and adaptive driving beam (ADB) LED matrix systems. Thanks to its rectangular LEA, vertically oriented within the package, the OSLON Compact RM enables precise pixel-to-pixel alignment and provides a greater vertical light spread in ADB systems. At a driving current of 1 A, it claims an impressive luminance of 209 Mnits, which ensures maximum optical performance even with small lens components, according to the company.
Ams Osram’s OSLON Compact RM (Source: ams Osram)
Ams Osram also enhanced its offerings for automotive interior applications with the launch of its OSIRE E3030 RGB LED with significantly enhanced light output. Aimed at next-generation ambient lighting solutions, the RGB LED pairs a high light output in the 0.5-W range with precisely controllable color variety, meeting both function and aesthetic requirements.
Depending on the selected color location, the OSIRE E3030 delivers typical luminous emissions for red and blue, ranging from 22.4 to 40 lumens or from 7.1 to 14 lumens at a binning current of 200 mA, and from 28 to 50 lumens for green at a binning current of 150 mA. It offers a wide range of available wavelengths for an expanded color gamut and individually addressable color channels for greater flexibility in terms of color selection and color mixing.
The OSIRE E3030 measures 3 × 3 × 0.6 mm, suiting it for applications with space constraints. In addition, the delta arrangement of the LED chips ensures exceptional color-over-angle performance, according to the company.
The OSIRE E3030 is also resistant to vibration and temperature fluctuations, meeting automotive standards. It is AEC-Q102-qualified.
Ams Osram’s OSIRE E3030 RGB LED (Source: ams Osram)
Also claiming ultra-small footprints and profiles, Lumileds has introduced two LED series—the LUXEON Versat 2016 and the LUXEON Altilon SMD-A—targeting a variety of automotive lighting applications.
The LUXEON Versat 2016 automotive LED is an AEC-Q-qualified LED portfolio with a broad color and performance range, measuring 2.0 × 1.6 mm with a z-height of only 0.52 mm. The LED not only offers standard direct and phosphor-converted colors but also LED-emission spectral tuning to match transmission characteristics of foils as used in car-body and grille illumination for superior color control, Lumileds said.
Targeting animated, personalized car-body lighting, the LUXEON Versat 2016 delivers features such as singular optical elements, backlit optical surfaces, and 3D illuminated structures for car illumination beyond traditional signaling into styling and communication lighting, the company said. The automotive LED can also be used in daytime running lights (DRLs), turn, stop, tail, and side-marker applications.
Lumileds also introduced the LUXEON Altilon SMD-A LED, claimed as the thinnest single-chip addressable LED, targeting high-performance automotive forward lighting. It has a z-height of only 433 µm, which allows for optical structures to be designed with greater accuracy and efficacy. This means the optics can be designed closer to the LED, which improves optical efficiency.
The advanced package is said to increase luminance, thermal capabilities, and robustness for demanding front fog, low/high beam, and ADB.
In addition, the small edges of the LUXEON Altilon SMD-A improve contrast, measuring 1:247, and produce a sharp, natural cutoff. Lumileds said reducing the gap between LEAs to 70 µm and achieving the optimal die-to-phosphor size increases luminance for further cost-performance improvements. The series is available in four configurations: 1×2, 1×3, 1×4, and 1×5.
Lumileds’ Altilon SMD-A LEDs (Source: Lumileds Holding B.V.)
For aftermarket automotive lighting applications, Cree LED, a Penguin Solutions brand, introduced the XLamp XE-B LEDs in an ultra-compact package for directional lighting applications. This latest XLamp Element LED extends the family into a smaller form factor, measuring 0.9 × 1.4 mm, while delivering high intensity in optical systems, whether used individually or in arrays, according to the company.
Claiming new levels of performance from an extremely small light source, the automotive LED delivers up to 60% higher intensity than existing LEDs with a larger, 1 × 1-mm light-emitting surface. While it is optimized for directional lighting applications that benefit from multi-color LED designs and suited for indoor directional lighting, architectural lighting, and entertainment lighting, it also targets aftermarket automotive lighting, in which compact size, high intensity, and precise color control are all key requirements.
The XE-B LED series is built on Cree’s advanced Element platform, enabling the smallest possible distance between the LED chip and the package edge, which allows tighter spacing, improved optical control, and seamless integration with secondary optics. It also features a large, electrically isolated thermal pad that supports advanced printed-circuit-board (PCB) designs, delivering a direct thermal path to the heat sink for excellent heat dissipation and long operating lifetimes, even at maximum current, the company said.
The XE-B LEDs enable precise and consistent color mixing with a consistent 1-A maximum current across all colors and a uniform package design. It offers 17 colors plus a full range of white options.
Cree LED’s XLamp XE-B LEDs (Source: Cree LED)
Targeting improved safety, aesthetics, and personalization, Diodes Inc. offers the automotive-compliant AL5958Q matrix LED driver with a 48-channel constant-current source, capable of up to 32 scans. Suited for automotive dynamic lighting, the device targets narrow-pixel mini- and micro-LED displays, which require multiple RGB LEDs to produce animated, dynamic lighting with data and information. Applications include central information displays, cluster displays, head-up displays, grill and emblem lights, body LED panels, interior lights, and rear lights.
The AL5958Q features built-in intelligent matrix display command functions that reduce the processing overhead on the local microcontroller (MCU). Key functions include automatic black-frame insertion to mitigate blurs caused by scanning switches, reduction of last-scan- and next-scan-line ghost images to eliminate ghosting from parasitic capacitors, and suppression of short-LED caterpillars.
Other features include open-LED fail lines and staggered current output delay to minimize inrush current, as well as grayscale enhancement (also known as low-brightness uniformity compensation), a grayscale clock watchdog timer, and sleep mode for power savings.
Differentiated features include the integrated 16 N-MOSFETs, allowing support of both static and dynamic systems, and multiplex-pulse-density modulation technology that enhances the refresh rate of dynamic scanning systems without increasing the frequency of the grayscale clock. This mitigates electromagnetic interference (EMI) due to high clock frequencies, Diodes said.
The AL5958Q also features high, 16-bit resolution dimming, coupled with its RGB support, for highly precise brightness control and color mixing. The current output for each color group can be configured either through three external current-sensing resistors or by programming three 6-bit global current control registers.
The device also offers advanced diagnostic features and protection mechanisms for monitoring capabilities. These include error flag registers applied to LED open/short to read out each channel using open/short detection, undervoltage lockout (UVLO) protection, and a watchdog timer.
The AL5958Q is supplied in a wettable W-QFN9090-76/SWP (Type A1) package and operates in a –40°C to 125°C ambient temperature range. Multiple AL5958Q devices can be daisy-chained without limitation. Diodes also offers a standard compliance version, the AL5958, for industrial and commercial applications.
Diodes Inc.’s AL5958Q matrix LED driver (Source: Diodes Inc.)
Lumissil Microsystems recently introduced the IS32FL3776 matrix LED driver for software-defined exterior lighting module applications. Enabling a combination of expressive and thermally efficient exterior lighting, these systems use matrix LED patterns to communicate vehicle intent, safety status, and driver-assistance cues, as well as brand identity.
The IS32FL3776, housed in a QFN-60 package, supports compact, individually addressable LED designs used in RGB mini-LED displays, full-width front-light strips, grille lamps, automated-driving-system marker lamps, and other vehicle lighting functions.
The IS32FL3776 integrates 36 constant-current sink channels and six scanning supply-switch controls to support a 36 × 6 matrix of up to 216 individually addressable LEDs. The dense matrix architecture targets large, intelligent signal display (ISD) lighting surfaces with fewer external components.
For high-quality animations, the IS32FL3776 features high-resolution, high-frequency, dithered pulse-width-modulation (PWM) control for fine brightness adjustment and a reduction in visible flicker and camera banding. Other features that help maintain uniform, artifact-free illumination across dense LED arrays include integrated current adjustment, matrix de-ghosting, low-headroom operation, and synchronized scanning.
This LED driver offers high-speed SPI and LumiBus UART interfaces that allow multiple driver ICs or distributed lamp PCBs to operate in synchronization for large-area displays and coordinated lighting animations.
The IS32FL3776 packs features for improved system efficiency and thermal performance. DCFB adaptive control is used to optimize the LED supply rail while maintaining only the headroom needed for proper current regulation, and an internal ADC and FBO feedback pin works with an external DC/DC converter to reduce driver power dissipation in large or high-brightness matrix displays.
It also supports external PMOS operation for additional thermal optimization, which moves high-side switching dissipation outside the IC package into external FETs and PCB copper, Lumissil said.
Other features include spread-spectrum PWM clocking, phase-delay control, and staged switching to help reduce supply ripple, EMI emissions, and audible-noise risk in high-brightness or high-duty-cycle ISD lighting applications; and diagnostic, protection, and communication-integrity features including LED open/short detection, ADC-based monitoring, overcurrent protection, UVLO protection, thermal shutdown, and CRC error detection.
Lumissil Microsystems’ IS32FL3776 matrix LED driver (Source: Lumissil Microsystems)
Lumissil addresses 48-V automotive systems with the introduction of the IS32LT3962 dual-channel LED controller. By using the IS32LT3962, as automotive lighting shifts from 12-V to 48-V systems, lighting designers can achieve improved power efficiency, reduced thermal stress, and lower wiring harness cost and weight, according to the company.
The IS32LT3962 drives two independent high-voltage LED strings for automotive applications such as high-/low-beam headlights, DRLs, and turn signals and enables lamp driver modules to support two functions (e.g., high beam and low beam) with a single IC to reduce space. The dual-output channel enables independent channel brightness control, with combined analog and internal/external PWM dimming for more compact lighting solutions.
The LED controller supports a wide, 5-V to 80-V input/output range for 24-V to 48-V battery systems and delivers flexibility with buck, buck-boost, SEPIC, or boost topologies on each channel. Other features include dual analog dimming pins to enable LED binning and thermal current roll-off using an external NTC, programmable undervoltage current reduction, and spread-spectrum operation combined with 180° phase shifting to help reduce system-level EMI.
The IS32LT3962 is housed in a compact WFQFN-32 package with an exposed pad for enhanced thermal dissipation. The operating temperature range is –40°C to 125°C Automotive Temperature Grade 1.
Lumissil Microsystems’ IS32LT3962 LED controller (Source: Lumissil Microsystems)
Melexis recently announced the launch of the MLX81119, an 18-channel LIN RGB LED controller with an integrated DC/DC converter. This LED controller is designed to simplify and optimize automotive lighting systems.
The MLX81119, housed in a 5 × 5-mm QFN32 package, is powered by Melexis’s 16-bit MCU, with an integrated memory subsystem that includes 32 KB of flash, 13.5 KB of ROM, and 4 KB of RAM to support the application, LED calibration coefficients, and additional system data. It is designed to reduce power dissipation, external components, and space requirements in dense vehicle applications such as door panels, dashboards, and charge port lighting by generating the LED supply voltage locally on the chip.
Simplifying the external power stage, the LED controller operates with as few as two capacitors and a single inductor, eliminating the need for a separate DC/DC controller and associated passives. This design reduces component count and PCB area for more compact lighting modules and easier integration in space-constrained locations.
In conventional architectures, supplying LEDs via external DC/DC converters increases heat generation, component count, and layout complexity, making it harder to meet physical, efficiency, and thermal constraints as automakers increase lighting deployments to meet growing requirements for new functionality, personalization, and brand differentiation, according to Melexis.
The 18-channel MLX81119 addresses these challenges by integrating a 1-A DC/DC converter that generates an optimized local LED supply voltage, programmable between 2.5 V and 6 V. This means the LED controller does not dissipate excess voltage as heat. It dynamically adapts the LED supply to the active color mix and operating conditions to reduce power losses and thermal stress, according to the company, which is not achievable with fixed external DC/DC converter solutions.
The MLX81119 features 18 low-side current sources configurable up to 60 mA and independent 16-bit PWM control. It supports up to six RGB LEDs per device, enabling smooth color transitions and advanced lighting animations, and provides built-in direct and indirect temperature sensing that allows active compensation across all channels, so color points remain stable over the full automotive temperature range.
The MLX81119 integrates a complete LIN system, including transceiver and protocol handler, fully compliant with LIN 2.x and SAE J2602. Developed according to ISO 26262, the device supports up to ASIL-B implementations.
Melexis’s MLX81119 LIN RGB LED controller (Source: Melexis)
Novosense Microelectronics has expanded its portfolio of high-performance LED driver ICs for exterior and interior lighting with several new series. These devices feature high-side and low-side linear drivers, as well as integrated MCU solutions for RGB/RGBW ambient control, and deliver precise current regulation, advanced diagnostics, and robust thermal management for safer, more energy-efficient, and customizable lighting systems.
The lineup includes the NSL21912/16/24 12-, 16-, and 24-channel high-side linear LED drivers, NSL23716x 16-channel low-side linear LED driver, NSL2163x linear LED driver with thermal balancing, and NSUC1500 ambient lighting driver system-on-chip.
The NSL21912/16/24 series devices are automotive high-side LED drivers that deliver 100 mA per channel with 12-bit PWM dimming. They support automatic thermal sharing via VS shunt resistors for higher thermal performance. Other features include configurable LED fault detection, integrated E2PROM for fail-safe functions, a UART interface up to 2 Mbits/s, and optional ASIL-B functional-safety support.
The NSL23716x 16-channel automotive low-side LED driver delivers 100 mA per channel and 12-bit independent PWM dimming. It integrates programmable thermal derating, LED open-/short-circuit detection, and overheat protection with automatic shutdown. It also incorporates built-in OTP memory that supports fail-safe safety functions, and an optional CAN PHY interface eliminates the need for an external transceiver, simplifying design and improving system reliability.
The NSL2163x three-channel automotive linear LED driver provides up to 200 mA per channel and operates directly from a 5-V to 40-V battery supply. The device supports thermal sharing via external shunt resistors and integrates LED open-/short-circuit detection with thermal shutdown for enhanced system reliability. It offers an optional, low-power EN-pin version.
The highly integrated NSUC1500 IC for ambient lighting integrates an Arm Cortex-M3 core and four-channel high-precision current-mode LED drivers. The device provides 16-bit independent PWM dimming and 6-bit analog dimming capabilities. It enables more accurate dimming and color-mixing control while compensating for lumen depreciation, Novosense said. The NSUC1500 is compliant with the AEC-Q100 Grade 1 and CISPR 25 Class 5 EMC standards.
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Наносупутник PolyITAN-1 КПІ ім. Ігоря Сікорського встановив рекорд за тривалістю польоту в космосі
30 липня в КПІ ім. Ігоря Сікорського офіційно встановили та зареєстрували рекорд України в номінації «Найтриваліший політ українського наносупутника в космосі». До Книги рекордів України внесено університетський наносупутник PolyITAN-1, який уже понад 12 років успішно працює на навколоземній орбіті. Досягнення зафіксував експерт Національного реєстру рекордів України Віталій Зорін.
EEVblog 1762 - Logitech Keyboard vs Food: GROSS TEARDOWN!
Power Tips #155: How to choose the best topology for isolated energy storage systems

With the increasing popularity of renewable energy and electric vehicles, the large-scale application of bidirectional isolated DC/DC converters is growing. This article will focus on energy storage systems (ESSs), with an overview of the isolated bidirectional topologies used in ESSs.
Figure 1 shows a typical residential ESS. A unidirectional DC/DC converter, also known as a maximum power-point tracker, converts the energy generated by solar panels and then feeds that energy to a high-voltage DC bus. An inverter may transfer this energy to the electric grid, or the energy may be stored in the battery system, where a bidirectional DC/DC converter charges and discharges the battery.

Figure 1 This block diagram shows the constituent pieces of a residential ESS system. Source: Texas Instruments
Because of safety considerations, residential ESSs use low-voltage batteries, such as 48V. Therefore, the DC/DC converter must provide galvanic isolation between the high-voltage DC bus and the battery. Because the DC bus and battery vary from the voltage ranges shown in Figure 1, one of the design priorities for the converter is to have a wide voltage-adjustment range.
The traditional solution is usually an open-loop inductor-inductor-capacitor (LLC) and a closed-loop buck/boost converter. The benefit of this solution is that it is easy to control and has a wide voltage-adjustment range, but a two-stage converter results in lower total system efficiency and higher costs.
To optimize the performance of the bidirectional DC/DC converter, a one-stage solution is preferable. Compared to a two-stage solution, a one-stage solution has higher efficiency and lower costs, but it also needs a more complex control scheme to achieve high performance. The most popular one-stage solutions are LLC, capacitor-inductor-inductor-inductor-capacitor (CLLLC), dual active bridge (DAB) and series resonant DAB (SR-DAB).
As shown in Figure 2, an LLC resonant converter can achieve very low switching losses. When operating near or below the resonant frequency, the LLC can achieve zero voltage switching (ZVS) on active bridges and zero current switching on rectifier bridges. When operating above the resonant frequency, an LLC can only achieve ZVS on active bridges.

Figure 2 A LLC resonant converter, shown in this schematic, can achieve very low switching losses. Source: Texas Instruments
Since this converter soft switches during turnon and turnoff, the electromagnetic interference emissions are comparatively low to other converters without soft switching. But designers generally only use the LLC resonant converter for unidirectional power transfer. It is not good for wide-gain-range applications such as ESSs because the voltage gain curve is flat when the switching frequency is higher than the resonant frequency, as shown in Figure 3.

Figure 3 This LLC voltage gain curve is flat when the switching frequency is higher than the resonant frequency. Source: Texas Instruments
Adding resonant elements on the secondary side of the transformer will form a bidirectional CLLLC resonant converter. As shown in Figure 4, the converter resonance network is symmetrical and proportional to the transformer’s turns ratio, so this converter maintains the resonance law and functionalities, such as soft-switching features in both forward and reverse operation.

Figure 4 A bidirectional CLLLC, shown in this schematic, is symmetrical and proportional to the transformer’s turns ratio. Source: Texas Instruments
A major advantage of this topology is the ability to provide symmetrical bidirectional power transfer. The effect of the secondary resonant tank may cause the voltage gain curve to have multiple crests, however, as shown in Figure 5. Similar to an LLC converter, a CLLLC also has a narrow voltage adjustment range and consists of five resonant elements, which increases the size and cost of the system, while the additional inductor also introduces additional losses.

Figure 5 The effect of the secondary resonant tank, shown in this gain curve of a CLLLC, may cause the voltage gain curve to have multiple crests. Source: Texas Instruments
Figure 6 shows the basic DAB topology, which consists of a full bridge with active switches on both the primary and secondary sides. The main advantages of the DAB converter are its inherent bidirectional capability, faster dynamic response, and wider voltage-adjusted range compared to the LLC and CLLLC topologies.

Figure 6 The basic DAB topology, shown in this schematic, consists of a full bridge with active switches on both the primary and secondary sides. Source: Texas Instruments
Through the most basic single-phase-shift (SPS) control, it is possible to adjust the polarity and magnitude of the phase-shift angle between the primary and secondary bridges, thereby controlling the magnitude and direction of its transmission power. The peak current of transistors and the circulating current are large with SPS control, however, which results in high turnoff losses as well as circulation losses.
ZVS is also difficult to achieve at light loads. With advanced modulation schemes such as triple-phase shift, a DAB converter can theoretically achieve ZVS over the entire operating range and could optimize high peak current and circulating current, but will require significantly more complex system analysis.
Inserting a series resonant tank into the DAB converter forms an SR-DAB, as shown in Figure 7. Similar to a series resonant converter, an SR-DAB needs to operate above the resonant frequency in order to ensure that the converter is in the inductive region, which is a necessary condition to realize ZVS. Given the resonance features of the circuit, the inductor current of an SR-DAB is almost sinusoidal, which could have a smaller turnoff current and root-mean-square inductor current compared to a traditional DAB.

Figure 7 Inserting a series resonant tank into the DAB converter forms an SR-DAB, as shown in this schematic. Source: Texas Instruments
Table 1 summarizes the primary features of the four isolated bidirectional DC/DC topologies.
|
|
LLC |
CLLLC |
DAB |
SR-DAB |
|
Voltage adjustment range |
Narrow |
Narrow |
Wide |
Wide |
|
Transient response |
Slow |
Slow |
Fast |
Fast: phase shift plus fixed frequency |
|
ZVS range |
Wide (full-range ZVS) |
Wide (full-range ZVS) |
Narrow (no ZVS at light loads) |
Medium |
|
Turnoff current |
Low |
Low |
High (with SPS) |
Medium (with SPS) |
|
Control complexity |
Moderate |
Moderate |
Simple (SPS) Complex (TPS) |
Simple (SPS) |
Table 1 This table summarizes various DC/DC topologies.
All four topologies provide isolation and bidirectional power transfer functions; however, DAB and SR-DAB are more suitable for ESS applications given their wide voltage-adjustment range and faster dynamic response. In addition, an SR-DAB has a lower turnoff current and a wider ZVS range compared to a DAB, with higher efficiency than a DAB as well.
For more details about the DAB topology, see the Texas Instruments Power Supply Design Seminar paper, “Dual Active Bridge Topology Overview.”

Guangzhi Cui is a power systems engineer at Texas Instruments. In this role, he handles industrial power system design and provides semiconductor power system solutions and customer technical support.
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The post Power Tips #155: How to choose the best topology for isolated energy storage systems appeared first on EDN.
Electronics Development Fund Backs 128 Start-ups with $139.23 Million in Investments
India Electronics Development Fund (EDF) strengthened the country’s deep-tech ecosystem with an accumulated investment of Rs 1,335.77 crore (approx. $139.23 million) supporting 128 start-ups and tech enterprises. This milestone further demonstrates the government’s commitment to developing Indian capabilities in innovation across electronics, semiconductors, nanoelectronics, and IT. This development reiterates their aim to foster an indigenous self-reliant ecosystem that can eventually enable the creation of a globally competitive technology economy leveraging high innovation, leading edge technology, high-quality human talent to create differentiated technology solutions.
The Electronics Development Fund (EDF) set up by the Ministry of Electronics and Information Technology (MeitY) in February 2016 is an Umbrella-Fund of Funds concept. In this model, the EDF invests into other professionally managed venture capital and angel investment funds, called “Daughter Funds.” These Daughter Funds invest into the high- growth potential start ups that build future technologies. As of September 30, 2025, a sum of 257.77 crore of direct equity in eight Daughter Funds by EDF and additional 1,335.77 crore capital invested by Daughter Funds in total of 128 start-ups/ ventures were catalysed in India.
The electronics development fund manages eight SEBI regulated Daughter Funds like Unicorn India Ventures Trust, Aaruha Technology Fund-I, Endiya Seed Co-creation Fund, Karsemven Fund, pi Ventures Fund I, YourNest India VC Fund II, Ventureast Proactive Fund-II and Exfinity Technology Fund Series II. The daughter venture funds pick out startups that can use cutting edge technologies and have high commercial viability.
Having invested in 128 start-ups spanning various frontier technologies, the Electronics Development Fund has become a significant lever for nurturing deep-tech innovation in the country. Over the coming years, the programme will play an even larger role in scaling the nation’s electronics ecosystem, create high-skill, high-value jobs, and advance India’s vision to lead the world in areas like electronics design, semiconductor technologies, and next generation digital innovations.
The post Electronics Development Fund Backs 128 Start-ups with $139.23 Million in Investments appeared first on ELE Times.
Active filters: Design tips and tricks

Filters are circuits comprising resistors, inductors and capacitors that pass certain frequency bands and attenuate others. Active filters use operational amplifiers (op amps) with resistors and capacitors, whereas passive filters do not include an amplifier.
Active filters have an advantage over passive filters in that they can have gain. The gain factor in an active filter enables higher-order filters as well as a wider range of filter-response characteristics. For example, a band-pass filter with a narrow bandwidth would be challenging to implement with only passive components given the limited gain of passive filters.
The amplifier also allows the filter to drive a load impedance without affecting the filter response, whereas the passive filter response generally changes significantly with loading. Finally, a passive filter may require an inductor, which may add cost and PCB space, compared to an active filter that only requires the amplifier, resistors, and capacitors.
Generally, you can design active filters with simple software programs such as Filter Design Tool. This tool designs an active filter based on your filter specifications, type, response, and topology. The final output for the software tool is a schematic with all the necessary component values. Filter Design Tool does assume that the op amp is ideal, however, and its response can change when using a practical op amp.
This article covers the most common active filter nonidealities, with recommendations on how to mitigate the problem.
Gain-bandwidth limitations
As mentioned previously, the purpose of an active filter is to pass one range of frequencies (pass band) while attenuating another range of frequencies (stop band). The ability of an amplifier to achieve this goal depends heavily on the gain-bandwidth product specification. When using an op amp with insufficient gain bandwidth in an active filter, the stop-band attenuation will not match the expected ideal filter response; specifically, the gain will stop rolling off and will begin to increase rather than decrease.
Figure 1 shows the simulated gain response of a Sallen-Key active filter using three different op-amp models with gain bandwidths ranging from 1.2 MHz to 11 MHz. The term Sallen-Key describes the topology or the specific connections of circuit components. Here, Filter Design Tool recommends a minimum gain bandwidth of 7.1 MHz, so op amps like OPA170 and OPA340 don’t meet that requirement but OPA140 does.

Figure 1 Sallen-Key low-pass filter response is shown for different gain-bandwidth op amps. Source: Texas Instruments
The attenuation in the stop band should continue to roll off at –40dB/decade; however, once the amplifier reaches its gain-bandwidth limit, it stops attenuating. The larger the gain-bandwidth of the op amp, the better the stop-band attenuation.
The figure above showed the effects of insufficient gain bandwidth on a Sallen-Key topology. The Sallen-Key topology is a noninverting type of active filter, while the multiple-feedback topology is an inverting type of active filter. The multiple-feedback topology band-stop attenuation is better than the Sallen-Key topology for low-gain-bandwidth designs.
Figure 2 shows the multiple-feedback response for the same three op amps used in the Sallen-Key example. The multiple-feedback response continues to roll off even after the frequency exceeds the gain-bandwidth limitation of the op amp. For the multiple-feedback circuit, the rolloff transitions from 40dB/decade to 20dB/decade when reaching the bandwidth limitation.

Figure 2 Multiple-feedback low-pass filter response is shown for different gain-bandwidth op amps. Source: Texas Instruments
To summarize, it’s important for active filters to follow the gain-bandwidth limitation given by the filter design software. A higher gain bandwidth will improve the stop-band attenuation, so depending on the range of frequencies that you need to reject, it may be necessary to choose a gain bandwidth 10 or 100 times the recommended minimum.
In cases where it’s not practical to choose an amplifier with a high gain bandwidth, use the multiple-feedback topology because its response is less dependent on gain bandwidth than the Sallen-Key topology.
Source impedance effects
All signal sources have a finite output impedance. A signal source can be commercial test equipment, an amplifier output, or an analog sensor. The output impedance of test equipment or amplifiers is generally very low, while the output impedance of a sensor can be high. Sources with low output impedance will have a minimal effect on filter response.
Conversely, a signal source such as a bridge sensor can have a high output impedance, which may significantly affect the filter response. As with the gain-bandwidth limitations, some filter topologies will be more sensitive to source impedance than others.
Figure 3 compares and contrasts the impact of source impedance on the Sallen-Key and multiple-feedback topologies. In this case, Sallen-Key is much less sensitive to source impedance than multiple feedback. The example plots the response for a 250 Ω, 500 Ω and 1,000 Ω source impedance. The multiple-feedback topology gain is significantly affected by the source impedance, but the effect on the Sallen-Key topology is minimal.

Figure 3 Source-impedance effect on response is displayed for the Sallen-Key and multiple-feedback topologies. Source: Texas Instruments
Component tolerance
Resistor tolerance will affect the cutoff frequencies and gain of active filters. For a low- or high-pass filter, a small shift in the cutoff frequency will not be a significant problem for most applications. For example, if a low-pass filter has an ideal cutoff frequency of 1 kHz but the component tolerance sets the actual frequency to 1.1 kHz, that will not be an issue for most applications.
Band-pass and band-stop filters, conversely, often have very precise bandwidth and center frequency requirements. For example, if a band-stop filter is designed to attenuate a 60-Hz signal, then the center frequency of the stop band should be very close to 60 Hz in order to properly attenuate the 60-Hz signal.
Figure 4 illustrates how component tolerance can affect the center frequency of a band-pass filter. The filter has a center frequency of 1 kHz and a bandwidth of 100 Hz. The circuit was tested using Monte Carlo analysis with good and poor component tolerance (good tolerance: RTOL = 0.1%, CTOL = 1%; poor tolerance: RTOL = 1%, CTOL = 5%). Monte Carlo analysis randomizes the component values according to the assigned tolerance for a set number of runs.

Figure 4 Here is a view of component tolerance impact on band-pass center frequency. Source: Texas Instruments
In this example, you can see much better control of the band-pass center frequency for the more precise (good) tolerance case. For the poor tolerance case, the center frequency is between 932 Hz and 1.106 kHz. The goal of this filter is to pass 1 kHz and reject all other frequencies. For many of the poor-tolerance Monte Carlo runs, a 1-kHz signal would be significantly attenuated because of the shifted center frequency.
The problem with component tolerance is most significant on band-pass and band-stop filters. There are two ways to avoid tolerance issues for these filters. The obvious approach to minimize the error is to choose resistors and capacitors with good tolerance. Generally, precision resistors of 0.1% are easy to find and not that expensive compared to the amplifier cost.
For capacitors, the C0G or film type have the best tolerance, temperature coefficient, and distortion. Unfortunately, these capacitors can be expensive, and the best tolerance is typically 1%. Furthermore, the maximum capacitance for C0G capacitors is generally 100 nF.
Another approach to minimizing the effect of component tolerance is to widen the bandwidth of the filter. The example shown in Figure 4 uses a 100-Hz bandwidth. Running the same example with a 400-Hz bandwidth would show that both the poor and good tolerance cases would pass the 1-kHz center frequency. However, the disadvantage of increasing the bandwidth is that the stop-band attenuation would not be as effective for the wide-bandwidth case.
Noise gain in active filters
All amplifiers and resistors generate noise because of the random motion of electrons inside the resistors and the semiconductor material. It’s possible to calculate this noise mathematically based on the circuit components.
The noise for an op amp is defined as a noise signal source on the noninverting input of the op amp. The gain seen by the noise signal source is called the noise gain. For active filters, the noise gain and noise bandwidth can be significantly different than the signal gain and bandwidth of the filter.
Figure 5 illustrates a multiple-feedback low-pass filter signal gain and noise-gain response. The top schematic shows the signal gain of the filter, while the bottom schematic shows the noise-gain configuration. To simulate noise gain, you simply add a signal source to the noninverting input and short out other voltage sources.

Figure 5 See the noise gain vs. signal gain for a multiple-feedback low-pass filter. Source: Texas Instruments
Comparing the noise gain and signal gain on the Bode plot shows that the noise gain has a much wider and higher frequency response than the signal gain. Sometimes engineers conducting noise analysis of filters assume that the filter transfer function will limit the noise and are surprised that the noise is higher than expected.
This unexpected increase in noise is because the op amp’s intrinsic noise source is located at the noninverting input and not at the signal input. Thus, the increase in noise gain and noise bandwidth causes an increase in output noise that engineers often overlook because they are considering signal gain and not the noise gain.
As the above figure shows, a low-pass active filter has a higher and wider frequency noise gain than the signal gain. This effect is even more significant on band-pass and band-stop filters. Figure 6 compares the noise gain and signal gain of a band-pass filter with a 100-Hz bandwidth. In this case the noise gain is about 46dB (200 V/V) higher than the signal gain.

Figure 6 Noise gain vs. signal gain is shown for a band-pass filter. Source: Texas Instruments
This high noise gain will significantly boost the op-amp noise. But engineers who analyze the circuit by just looking at the signal gain may not expect the higher output noise because of the noise gain.
One way to reduce the impact of noise gain for band-pass and band-stop filters is to increase the filter bandwidth. This is counterintuitive because noise is usually larger for wide-bandwidth circuits. However, for bandpass filters, the noise gain is higher for narrow-bandwidth filters and lower for wide-bandwidth filters. Figure 7 shows how noise gain is higher for the narrow-bandwidth filter.

Figure 7 Noise gain vs. noise bandwidth is shown for band-pass filters. Source: Texas Instruments
Resources for active filters
Fully understanding active filters is a deep and relatively complex subject. You can use Filter Design Tool to design active filters, because this tool and other filter design tools generally assume ideal op-amp characteristics, but the best practice is to confirm your design using a SPICE simulator.
Art Kay is an application engineer in the precision amplifiers team at Texas Instruments. He specializes in support of low noise data acquisition systems and has published a book on intrinsic noise analysis. He also co-published a useful summary of analog engineering relationships and a companion software tool.
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- Signal Chain Basics #43: Active Filters
- Software Tool Aids Design of Active Filters
- Designing RC active filters with standard-component values
- Free program designs and analyzes passive and active filters
The post Active filters: Design tips and tricks appeared first on EDN.
4bits computer : from breadboard to PCB
| Hi everyone! After building and testing my whole 4 bits computer architecture on breadboards, I moved to custom PCB modules, and here is the result! The goal remains the same: keep the architecture simple, modular, and easy to understand, with each part working independently or together as a complete system. The project is divided into 5 independent modules connected by a 4-bit bus Clock module (4-bit counter), ALU + registers module + two 4-bit registers with an ALU capable of performing addition, subtraction, and equality comparison, Instruction register module, Display module and Manual programming module. The idea is to follow a simple RISC philosophy: minimal instructions, simple hardware blocks, and a design where every signal can be observed and understood. After the breadboard prototype phase, these PCB modules make the system cleaner, i'm very proud!! [link] [comments] |
Розширення партнерства із закладами вищої освіти Пакистану
🇵🇰 КПІ ім. Ігоря Сікорського відвідав Надзвичайний і Повноважний Посол Ісламської Республіки Пакистан в Україні Канвар Аднан Ахмед Хан.
Qorvo grows quarterly margin, despite revenue falling by 2.9%
Free form circuit fun
| New to hobby electronics. Total tourist. Decided to try my hand at free form circuit design. This is pretty sloppy. But hope to clean up designs as I go, add some elegance. Super fun creative process though, to think about a circuit design in 3D essentially. Simple 555 ic flashing lights circuit but designed as a spider crawling up a tree. Again, not aesthetically pleasing yet. But the circuit works and it was a lot of fun to put together. [link] [comments] |
ams OSRAM extends CEO Aldo Kamper’s term through September 2031
Spent my final year building an FPGA chip that runs real-time object detection
| Just finished my final year engineering project: a custom hardware accelerator that runs YOLOv8n (an object detection AI model) directly on an FPGA, in real time. Instead of running the AI model in software on a CPU/GPU, this is custom digital logic (written in Verilog) that does the computation directly, faster and more power-efficient for edge devices like drones or embedded cameras. Some highlights:
If anyone's into FPGAs, embedded AI, or just wants to see what a final year project like this looks like under the hood: https://github.com/waseemnabi08/yolov8n-cnn-accelerator-fpga [link] [comments] |
Why autonomous agriculture needs inertial navigation

Agriculture has become one of the fastest-growing applications for autonomous systems. Self-driving tractors, robotic sprayers, autonomous mowers, and unmanned aerial vehicles (UAVs) are helping growers address labor shortages while improving productivity and reducing operating costs.
Much of this progress has been enabled by satellite navigation. GPS, often combined with real-time kinematic (RTK) corrections, provides the centimeter-level positioning needed for planting, spraying, harvesting, and mapping. In open fields, these systems perform remarkably well.
However, not every agricultural environment offers an unobstructed view of the sky.
As autonomy expands into orchards, vineyards, and other crop operations, satellite navigation alone becomes increasingly unreliable. Dense tree canopies can block and attenuate GPS signals; branches and leaves create multipath reflections; and satellite visibility changes continuously as vehicles move through the rows. The result is inconsistent positioning precisely where autonomous machines must operate with the greatest precision.
For engineers developing autonomous agricultural equipment, maintaining accurate localization during periods of degraded GPS has become one of the industry’s most significant technical challenges.
The hidden challenge of tree canopiesUnlike row crops, orchards present a constantly changing navigation environment.
Vehicles repeatedly transition between open sky and dense canopy. GPS receivers may temporarily lose satellites or receive reflected signals instead of direct ones while traversing through the canopy. Even when the receiver maintains a position fix, accuracy can deteriorate significantly.
These errors quickly affect autonomous operation.
A tractor may slowly drift toward an adjacent row. A sprayer can apply chemicals outside the intended area or miss sections entirely. A robotic mower may require operator intervention after losing its planned trajectory. For UAVs performing inspection or precision spraying missions, degraded positioning can reduce mapping accuracy, compromise flight stability, and result in uneven or incomplete spray coverage.
Because these interruptions occur frequently—but not continuously—they are particularly difficult to manage. Autonomous systems must seamlessly maintain localization while GPS quality fluctuates throughout the mission.
Why sensor fusion mattersModern autonomous platforms rarely depend on GPS alone. Instead, they combine information from multiple sensors, including cameras, LiDAR, radar, wheel odometry, and inertial measurement units (IMUs). Software continuously fuses these measurements into a single estimate of the vehicle’s position and orientation.
Among these sensors, the IMU plays a unique role because it measures motion directly. Accelerometers measure linear acceleration while gyroscopes measure angular rotation, allowing the navigation system to estimate vehicle movement regardless of external infrastructure.
When GPS becomes unreliable, the inertial system effectively bridges the gap until the satellite signal and positioning recover. The quality of that bridge, however, depends almost entirely on the quality of the inertial sensors themselves.
Not all IMUs perform the sameMost commercial agricultural equipment relies on microelectromechanical systems (MEMS)-based IMUs because they are compact and relatively inexpensive. These sensors work well for many applications but are very sensitive to temperature, vibration, and electromagnetic interference (EMI). They also do not work under various environments and gradually accumulate bias errors that grow over time.
During a brief GPS interruption, the accumulated error may be negligible.
During longer outages beneath dense tree canopy, however, heading errors begin translating directly into position errors. As the vehicle continues moving, localization drift increases until GPS becomes available again.
Historically, engineers solved this problem using fiber optic gyroscopes (FOGs) or ring laser gyroscopes. While highly accurate and insensitive to temperature, vibration, and EMI, FOG-based solutions are generally too large, expensive, and power-hungry for widespread deployment into commercial and agricultural applications.
Recent advances in silicon photonics are beginning to change that tradeoff by making optical gyroscope technology available in much smaller and more practical form factors.
Optical navigation moves into agricultureOne example is Anello Photonics’ silicon photonic optical gyroscope (SiPhOG), which integrates optical gyroscope technology using silicon photonics manufacturing techniques. The technology delivers significantly improved heading stability compared with conventional MEMS-only solutions while remaining compact enough for commercial autonomous platforms.
SiPhOG technology, integrated into the Anello Ground INS system, delivers improved heading stability while meeting the size requirements of autonomous platforms. (Source: Anello Photonics)
Rather than replacing GPS, systems such as the Anello Ground INS combine optical inertial sensing with dual RTK-capable GNSS receivers and advanced sensor fusion. The inertial system maintains accurate motion estimates while GPS measurements fluctuate, allowing navigation performance to remain stable through temporary signal degradation.
The value of this approach becomes especially apparent in orchards.
In field testing conducted in a commercial walnut orchard near Fresno, California, an autonomous ground vehicle equipped with the Anello Ground INS operated beneath dense tree canopy, where satellite visibility was significantly reduced. While a conventional GPS-based navigation solution drifted often by more than 5 meters during the passage through the canopy, the Anello Ground INS maintained sub-half-meter positioning throughout the test.
Although performance always depends on operating conditions and vehicle integration, the demonstration illustrates how improving inertial heading directly improves overall localization when GPS quality deteriorates.
Performance of autonomous ground vehicle navigating beneath dense walnut orchard canopy using the Anello Ground INS. (Source: Anello Photonics)
Ground vehicles are not the only agricultural platforms facing degraded GPS. UAVs performing crop scouting, precision spraying, multispectral imaging, and field mapping frequently operate at low altitude near trees, where satellite visibility can also become inconsistent. For these applications, high-quality inertial sensing contributes not only to navigation accuracy but also to flight stability.
For example, the Anello X3 IMU applies the same SiPhOG technology in a compact IMU designed for UAVs and other autonomous aerial systems. By providing more stable inertial measurements during temporary GPS degradation, the X3 supports reliable flight control and more consistent navigation in challenging agricultural environments. Learn more about the benefits of inertial technology for precision agriculture here.
Looking beyond GPSAgricultural autonomy will continue to rely on GNSS, and RTK will remain an essential component of precision farming. However, as autonomous machines move beyond open fields into orchards, vineyards, forests, and other GPS-challenged environments, satellite positioning alone is no longer sufficient.
The future of autonomous agriculture will depend on resilient sensor fusion architectures that combine GNSS with increasingly capable inertial technologies. Advances in integrated silicon photonics, enabling new, small, integrated optical gyroscopes, are making navigation performance once reserved for high-end aerospace systems accessible to the commercial agricultural market.
While GPS has transformed precision agriculture, the next leap forward will be driven by technologies that enable autonomous machines to operate reliably when satellite signals are degraded or unavailable. As resilient inertial navigation becomes an integral part of modern sensor fusion architectures, autonomous tractors, robotic implements, and UAVs will deliver greater accuracy, reliability, and operational confidence, bringing agriculture one step closer to true, all-condition autonomy.
The post Why autonomous agriculture needs inertial navigation appeared first on EDN.
Vexlum establishes London lab and appoints Stefan Truppe as managing director of Vexlum UK
Optimize hi-rel designs with rugged, flexible interconnects

As OEMs in high-reliability industries, including automotive, industrial, and military/aerospace, move to next-generation designs, they are looking for interconnects that not only offer high reliability and ruggedness but also greater design flexibility and miniaturization. The availability of more product options and easier integration and installation are also key requirements.
The combination of greater flexibility and miniaturization is delivering space and cost savings across rugged designs while supporting next-generation systems, such as vehicle platforms that are packing more and more electronic components into space-constrained devices.
Here is a selection of connectors and cable assemblies introduced over the past year that meet the right balance of features for these application trends. These include software-defined vehicles (SDVs) and zonal electronic/electrical (E/E) architectures; next-generation military/aerospace systems and unmanned aerial vehicles (UAVs); and industrial automation systems that need greater flexibility and adaptability.
Automotive connectors and cablesMolex recently expanded its HSAutoLink interconnect portfolio with the launch of the HSAutoLink G, comprised of terminals, connectors, PCB headers, and cables. It joins the existing rugged, high-speed HSAutoLink, HSAutoLink II, and HSAutoLink C families.
The connector system provides multi-gigabit Ethernet connections of up to 25 Gbits/s in a compact, USCAR-compatible interface, making it suited to address rising bandwidth demands driven by advanced driver-assistance systems (ADAS), radar, LiDAR, zonal architecture, immersive displays, and central compute modules.
By extending support with Ethernet connections up to 25 Gbits/s, these interconnects can meet the high bandwidth requirements in SDVs and autonomous mobility platforms, Molex said.
Fitting within existing USCAR Ethernet interfaces, the HSAutoLink G enables future-proof product designs that reduce space and weight in compact modules while streamlining system integration and upgrades. Key features include advanced electromagnetic-interference (EMI) shielding and controlled differential impedance to maintain signal integrity for high-speed communications in dense environments. This helps prevent signal failures, validation delays, and costly design changes, the company said.
Other features include an anti-stubbing design that protects the contacts during the mating process to reduce the risk of mis-mating, as well as the addition of multiple, uniform ground-contact points to enhance EMI suppression for higher reliability.
Molex’s HSAutoLink G automotive Ethernet connector system (Source: Molex)
As automakers shift to SDVs and zonal E/E architectures, TE Connectivity (TE) has introduced a portfolio of interconnects for automotive electronic control units (ECUs). The Inside Device Connectivity portfolio is designed to support the next generation of vehicle platforms. The purpose-built portfolio includes board-to-board, wire-to-board, flex-to-board, and wire-to-wire connector solutions for compact, high-performance applications.
The Inside Device Connectivity portfolio is tailored to the specific needs of SDVs, enabling scalable and standardized connector configurations while reducing weight, packaging space, and integration complexity, TE said.
At the same time, these interconnects are optimized for EMI-sensitive and vibration-intensive environments with high misalignment tolerance and ruggedness against vibration, contamination, temperature shifts, and humidity. Other features include current capacity up to 45 A for wire-to-board and up to 18 A for board-to-board; a pitch of 0.4 mm to 10.16 mm with up to 180 pins; and crimp, IDC, and mass terminations.
These connectors target different application areas in an SDV, including ECUs, power conversion (on-board charger inverters and DC/DC converters), battery systems (battery, cell module controller, and battery management system), high-performance computers, ADAS (radar and LiDAR), and black-box systems (such as lighting).
TE’s Inside Device Connectivity portfolio (Source: TE Connectivity)
Samtec Inc. recently expanded its SMPM cable-to-board precision RF connector family with small-form-factor threaded cable-to-board-mated sets, targeting high-vibration environments. Suited for applications such as military, aerospace, and communication applications, the connector assemblies feature a threaded SMPM MIL-STD-348 interface with a retractable threaded coupling nut.
High-vibration environments can exceed the retention capabilities of traditional push-on RF interconnects, Samtec explained, requiring a more secure and robust connection.
The threaded SMPM cable-to-board-mated connector sets—including the RF047-A and RF086 millimeter-wave, low-loss cable assembly families handling up to 67 GHz, as well as the SMPMT threaded, SMPM millimeter-wave board-mount plugs available up to 60 GHz—are designed with enhanced mechanical strength. They feature full detent or smooth bore for varying retention forces and offer mixed technology board termination, which provides resistance to mechanical stress and supports high frequency.
The RF047-A is a 0.047-inch, low-loss, flexible microwave cable assembly (29 AWG) with an extremely small bend radius of 3.18 mm. The RF086 is a 0.086-inch, low-loss, flexible cable (23 AWG) with a bend radius of 8.9 mm. Both operate up to 125°C. A variety of end options are available for application-specific customization.
These precision RF connectors are available from stock. The RF047-A cable assembly and SMPMT threaded plugs are part of the Samtec Reserve program with one-day shipment.
Samtec’s threaded SMPM cable-to-board-mated connector sets (Source: Samtec Inc.)
For avionics and UAVs, Times Microwave Systems launched its Levitate cable assembly line for both military and commercial RF systems. Designed for efficiency, weight savings, and electrical performance, these ultra-lightweight cable assemblies with minimal loss are suited for avionics applications across UAV Groups 1 through 5.
Times Microwave Systems claims that the Levitate assemblies provide the lightest weight per unit of loss available on the market today, enabling engineers to reduce overall system mass without compromising RF performance. They cover a range of airborne applications, including flight control, communications, and surveillance.
Providing a balance between cost, performance, and availability, the Levitate cable assembly is available in multiple sizes, including the LVT047, LVT086, LVT141, LVT157, and LVT196. All assemblies are engineered for dual use in military and commercial RF systems. The flexible construction of the LVT047, LVT086, and LVT141 assemblies is suited for in-the-box applications, and the ultra-lightweight LVT157 and LVT196 support critical RF runs connecting antennas to LRUs.
Times Microwave Systems’ Levitate cable assembly line (Source: Times Microwave Systems)
Aimed at delivering greater design flexibility and simplicity, binder USA LP, a subsidiary of binder Group, recently announced a new generation of hybrid connectors for industrial automation. The B23 series combines power supply and shielded data transmission in one compact connector and enables Ethernet transmission rates of up to 100 Mbits/s.
The B23 connector is built for one-cable-automation concepts, addressing key market requirements that call for a reduced cabling effort and increased data rates in industrial systems. This simplifies integration and system architectures.
The hybrid connector reduces cabling effort by enabling power and communication via a single interface, which also reduces installation times and potential sources of error, binder said. One example cited is drive technology, in which servo motors and drive systems can be connected with just one cable. It can also be used in modular machine and plant architectures, as well as robotics and flexible manufacturing systems.
The B23 connector also targets the trend toward decentralized automation that requires rugged, pluggable connections and a high degree of protection. Key specs include power transmission up to 28 A at up to 630 V and shielded Ethernet/EtherCAT (according to Cat 5) data transmission up to 100 Mbits/s. Other features include a bayonet quick-locking system for secure connections, screw-clamp termination for field use, and IEC 61076-2-118 standardization.
Meeting both field and device integration requirements, the B23 is available in a field-attachable version and as a panel-mount connector for device installation. Versions with single-wire termination and THT contacts are available.
Binder’s B23 connector (Source: binder USA LP)
Hirose Electric Co. Ltd. expanded its high-density BGA mezzanine connector portfolio with a COM-HPC standard-compatible version that supports PCIe Gen5 (32 GT/s), Gen6 (64 GT/s PAM4), and 100-Gb Ethernet (4 × 25 Gb). The IT18 Series can be used in industrial automation, medical imaging, and T&M equipment.
The BGA mezzanine connector features an ultra-high-density pin count of 400 positions in a 0.635-mm pitch, delivering high-speed transmission in a low profile. Stacking heights include 5 mm and 10 mm. It also features high crosstalk suppression, including far-end-crosstalk cancellation technology.
The open-field design (open pin-field grid array) of the connector is adaptable to various layouts, allowing for greater flexibility across different applications. Because pins are not locked into a fixed pattern, customers can route signals, grounds, and power to improve density and performance, which also helps with signal-integrity optimization, Hirose said.
Featuring a rugged design, the IT18 Series connector uses a metal cap to reduce warpage and protect contacts from flux. The cap minimizes reflow defects by suppressing deformation during heating and protecting against foreign particles in the environment, the company said. Other key features include a large guide to ensure proper mating and retention tabs that prevent cracks in solder balls.
Hirose’s IT18 Series BGA mezzanine connector (Source: Hirose Electric Co. Ltd.)
The post Optimize hi-rel designs with rugged, flexible interconnects appeared first on EDN.
Unsung software and services heroes ease our days

Full-featured, high-priced products address many users’ needs. But free and low-cost options, sometimes for augmentation purposes, other times operating standalone, also have their place.
As regular readers may already have noticed, I regularly embed FCC certification IDs in my teardowns and other writeups, complete with links to the associated FCC website pages for additional documentation, images, and other information on the products I’m discussing. Long ago, so far in the past that I no longer remember where and when, I came across someone else (iFixit, mebbe?) who was using shortcut URLs of the following format instead of fuller URLs:
http://www.fcc.io/INSERT_FCC_CERTIFICATION_ID
You can tell how old the service is by the fact that it still works using the non-secure version of HTTP. In fact, for a long time, my potentially faulty recollection is that the “https” version of the URL didn’t work at all, although I just checked and it’s now supported, too.
I long assumed this shortcut interstitial URL service was run by the FCC itself. However, motivated by curiosity one day, I entered http://www.fcc.io standalone in my web browser. Here’s what I found on the home page:
FCC.io
What?
A simple search and URL shortener for FCC ID queries.
Why?
I can never find the search form on the FCC site, so fcc.io should be easy enough to remember. Fcc.io provides a way to share FCC ID searches with other people via links, email, IRC, or IM.
How?
The URL scheme is simple:
- https://fcc.io/”FCC ID”
Try these:
To-do
Other search suggestions?
Email to dominicgs@gmail.com
Disclaimer
Neither this site, nor its author, are affiliated with the FCC in any way.
Running on GitHub pages
Good for you, dominicdgs@gmail.com (who appears to be Dominic Spill, formerly “next door” to me in Evergreen, CO per his Github page and now with Apple in Cupertino, CA per LinkedIn)!


Another example, which I briefly introduced recently, are the open source FreeFileSync and related RealTimeSync utilities developed by the FreeFileSync project, and supporting Linux, MacOS and Windows systems alike. The ability to automatically backup or sync (the latter both uni- and bi-directionally) the contents of one or multiple directories to another storage device (a USB-C tethered RAID 1 external HDD array, in my case) became critical to my workflow when I added associate editor duties to my longstanding contributing editor relationship with EDN. The two-utility package has worked without a hitch in the two-plus months (as I write this) since I’ve installed them, and I anticipate further non-drama functionality in the future, too.

Per these and other examples to come, this post will therefore be a to-developer “love letter” regarding software packages and services that have become essential to me, and for personal and/or professional reasons. As you continue reading, think about what similar examples you can derive from your own life. You’ll have an opportunity to share them with us, too, at the end.
Enhanced text editors
MacOS comes bundled with the TextEdit graphical text editor, with others (Nano and Vim) also accessible via the Terminal command line. And if a beefier word processor is what you’re looking for, there’s always the also-gratis Pages. So why on earth would I pay $59.99 (new) or $29.99 (previous-version upgrade) for Bare Bones Software’s BBEdit? Check out this list of features. Or see what fellow fan John Gruber has to say about it, notably in a 30-year retrospective summary published four-plus years ago.
From my standpoint, the ability to automatically re-open one-to-multiple tabs’ worth of content, regardless of whether it’s/they’ve been saved recently (or at all, for that matter), after program shutdowns and restarts and even full operating system reboots, and as long as I haven’t manually closed a tab, is by itself worth the price tag. It’s “saved my bacon” on innumerable occasions.
If you’d like a free “taste” of the full-featured version, a 30-day evaluation time period is supported. And “Free Mode”, the successor to the original freeware TextWrangler software from the same company, will extend the gratis party to eternity if you don’t need access to any of the program’s paid-only capabilities.

What about Windows? Here the seemingly most common enhancement to the bundled graphical Notepad and command line Microsoft Edit editors is Notepad++ (Github link), which is free and open source (not to mention 20+ years old!). Its primary developer is Don Ho; another set of developers led by Andrey Letov recently ported it to MacOS while initially retaining the original name (and notably, without getting Ho’s permission first) and was subsequently compelled by both legal threats and broader community outrage to rename it to Nextpad++ (again, Github link).
And Linux? The already-bundled text editors are generally more robust in this case, befitting this operating system’s comparative “power user” community, but a diversity of add-on options unsurprisingly also exists. Linux users out there, I welcome your suggestions in the comments!
Networked TV services

Windows 7 reached End of Life (EOL) and officially lost extended support on January 14, 2020. Windows 8.1 followed it out the door on January 10, 2023. With them went official support for Media Center, a Microsoft-developed digital video recorder and media player application that first appeared within a special-purpose Windows XP edition in 2005.
I’ve been running various versions of Media Center since the very beginning, initially to ingest broadcast television coming over NTSC and (later) ATSC antenna feeds, later transitioning to cable television feeds in conjunction with a networked CableCARD receiver, and for subsequent display on televisions in conjunction with both Xbox game consoles and standalone Media Center Extender devices.
And I’ve continued doing so even though, as previously noted, the operating system foundations are no longer supported, not to mention the fact that the service’s built-in electronic program guide was discontinued on January 14, 2020. How? The alternative program guide data I’m tapping into is SchedulesDirect, a non-profit “community” (with, as far as know, exactly one active developer employee) and a $35 yearly membership fee.
And how do I get the SchedulesDirect-sourced data into Media Center? That’s where EPG123 (GitHub link), another one-person development project, comes in. Gary An has worked tirelessly for the past decade-plus (ever since Microsoft switched from Zap2it to Rovi as its guide data provider, even prior to shutting down its EPG service entirely) to create and maintain EPG123, fixing bugs, responding to SchedulesDirect service evolutions, and the like.
He’s also a regular support presence on the community forum at The Green Button website. And while he’s happy to accept donations, he doesn’t charge a penny for his software. Bless you, Gary!
An essential email add-on
Mozilla’s Thunderbird has been my personal email client of choice for nearing two decades now (just as the organization’s Firefox browser is for web access…and SeaMonkey is for HTML editing…), and I access email via POP3 so that I can exclusively retain an archive locally. So, you can probably imagine how voluminous my Thunderbird database is at this point. Everything’s (fairly) neatly organized into per-topic folders, mind you, but there are probably thousands of them at this point, in a multi-email account (plus RSS) and multi-level nested arrangement.
That’s why I heavily rely on an add-on called Nostalgy (GitHub link), which enables me to move (or copy) incoming emails from my inbox to a desired target folder, and more broadly from any source folder to another, using only convenient keystrokes. Why Nostalgy hasn’t been adopted by and natively included in Thunderbird by this point is baffling to me, both because of its inherent benefits and because the constant changes to the email client’s database structure and other factors make maintaining it a headache for a third-party developer alternative.
Speaking of which, the add-on was originally developed and maintained by Alain Frisch. Source code maintenance and enhancement duties were later taken up by Klaus Buecher, who renamed it Nostalgy++. It’s an oft-thankless task, as I gather from the commentary that accompanies both new-release notes and periodic requests for donations. But to that point, and as with EPG123, fiscal compensation is voluntary, not obligatory. Long may you continue to code, Klaus, and thank you for your software service!
Squashing a longstanding File Explorer bug


This last one’s a doozy. For decades now, through innumerable version updates small and large alike, Windows has proven itself incapable of permanently retaining user-requested changes to File Manager settings, either folder-specific or all-encompassing, and related to both file sorting and content display strategies.
I might, for example (and regularly do, in fact) tell it that I no longer want it to cluster together chronologically similar groups of files within a folder, instead displaying them solely in a basic alphabetized list format, and to more globally revise this particular setting. Or to tone down the displayed thumbnail size in image-related folders.
The requested changes “stick”…as long as I don’t move to a different folder, that is. Maybe, in fact, they remain as I’d previously requested the next time (or, pushing my luck, few times) I return to that folder. But usually, they immediately revert to defaults. And my random likelihood of ongoing settings-change-sticking success is even less if I quit and then re-open File Explorer, not to mention after a system reboot. Sooner or later, Microsoft insists that its default way is best.
Back in March, the company finally publicly acknowledged the problem (along with plenty of others) and promised that remedies were on the way. I’ll believe it when I see it. And I’m not going to wait. I’d already found, and happily am still using, an independently developed “fix” for these and other File Explorer quirks called WinSetView:
WinSetView provides an easy way to set Windows File Explorer default folder views. For example, if you want Details view, with a particular selection of column headings enabled across all folders, then WinSetView will do that for you.
For more details, please see the extended summary.
WinSetView is open source. It’s inobtrusive, either running portably or fully installed. It does what it promises, nothing more or less, and changes are easily reversible. And it’s free. Kudos to you, developers LesFerch and Thysbelon. You’ve enabled me to (arguably) cling to my sanity.
Now it’s your turnThese are all just examples, apparently particularly notable ones, because they’ve risen to the top of the list brainstormed and assembled in, and subsequently coming out of, my noggin. I’m confident that the catalog as it currently exists isn’t comprehensive, for me (I may think of and add one-to-a-few more entries before this piece is published, in fact) and certainly more globally. Which is where you come in.
What software and services, specifically focused in function and freeware-or-low cost, have you come across that help simplify your life? Share your thoughts in the comments, please, for both your own resultant fame and others’ consideration, adoption and benefit. Thanks!
—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.
Related Content
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The post Unsung software and services heroes ease our days appeared first on EDN.
India Accelerates Core EV Technology Investments to Strengthen Domestic Manufacturing Ecosystem
India is stepping up investments in key EV technologies. The South Asian country is speeding up its investments in key electric vehicle (EV) technologies while planning to boost a self-dependent and globally relevant EV manufacturing ecosystem. Driven by various central government initiatives, state government programs, and private sector investments, India attracted commitments for around US$25.6 billion worth of investments across battery manufacturing, advanced battery chemistries, powertrains, charging infrastructure, and technologies for battery and electric powertrains. These investments will help scale up domestic manufacturing and reduce dependence on imported components.
The Government of India launched multiple schemes to boost domestic manufacturing of the Electric Vehicles (EV) ecosystem through production-linked Incentive (PLI) Schemes for Advanced Chemistry Cell (ACC) and battery storage, as well as the PM E-Drive program to promote charging. The PM E-Drive program aims to promote charging for automobiles and auto components. Along with manufacturers both domestically and overseas, these schemes lead to localization of EVs’ key technologies.
One of the most prominent contributors to the cost of EVs has become battery cells. To cut down on battery imports, the Indian government has focused on indigenous manufacturing in the segment, providing support to the players setting up giga-scale manufacturing units of advanced chemistry cells (ACCs). Battery makers in India are actively pushing next-gen battery chemistries for their EVs, such as lithium iron phosphate (LFP) and nickel-magnesium-cobalt (NMC), and are even exploring future products like solid-state batteries that offer greater energy density, improved safety, and rapid charging capabilities. chemistries for their EVs, such as lithium iron phosphate (LFP), nickel magnesium Cobalt (NMC), and even for other future products like solid-state batteries that offer more power per space (energy density), safety, along with rapid charging possibilities.
The increasing investment in core EV technologies has the potential for far-reaching economic benefits, creating widespread opportunities for engineers, manufacturing plant workers, software and hardware professionals, quality testers and logistics and maintenance staff, as battery makers and electronics Producers and charging companies build upon their manufacturing bases. Furthermore, locating High-value manufacturing locally would allow us to decrease reliance on EV component imports and contribute positively towards our trade balance as we export electric vehicles and their associated automotive electronics.
The post India Accelerates Core EV Technology Investments to Strengthen Domestic Manufacturing Ecosystem appeared first on ELE Times.
Fast and Flexible Test Device for Safety and Functional Testing of Battery Cells
High-voltage batteries for e-mobility have become highly complex systems consisting of numerous components. The market for these batteries is becoming increasingly dynamic, and technologies are constantly evolving: innovative battery cells with new chemical compositions are being introduced. Automotive suppliers and manufacturers therefore require a tailored and flexible testing strategy for battery cell quality assurance, both in development and in production. Only in this way can suppliers compete in the market with more powerful batteries, higher levels of automation, and optimized workflows.
To address these challenges, GÖPEL electronic has developed a high-performance and quickly configurable battery cell tester that features a modular design and high flexibility. This allows for the quick and transparent determination of quality, charging efficiency, and reliability in up to five battery cells simultaneously. The tester complements the product portfolio, which includes, among other things, GÖPEL electronic’s EOL battery test system, which performs comprehensive test routines for the entire battery pack.
The new battery cell tester covers standard safety tests that evaluate the condition of the cells: The OCV (Open Circuit Voltage) value indicates the voltage of a battery without a load (open circuit) and serves as an indicator of its state of charge. For the ACIR (Alternating Current Internal Resistance) measurement, the tester uses a test method to determine the internal resistance of the battery cells. This internal resistance under alternating current provides information about the performance, state of aging, and quality of the battery cell.
The main advantage of the new, smaller tester from GÖPEL electronic lies in its fast and reproducible test results: By interfacing with automated equipment, highly efficient batch testing can be performed in a matter of seconds. This is ideal, for example, for incoming inspection or cell grouping.
The post Fast and Flexible Test Device for Safety and Functional Testing of Battery Cells appeared first on ELE Times.
Ather Energy Rolls Out Pothole+ Alerts, Built on Connected Fleet Intelligence
Ather Energy has started rolling out Pothole+ Alerts for customers with Gen 2 and above scooters, including the Ather 450 Apex, 450X and Rizta Z. The feature leverages data generated by Ather’s connected scooter fleet to warn riders about potholes, broken road sections, uneven surfaces and speed breakers ahead while navigating. It also goes a step further, suggesting the smoothest route before a ride begins, beyond just the fastest one.
Announcing the rollout on X, Ather Co-founder and CEO Tarun Mehta said the feature had been nearly nine years in the making. “The challenge was never the idea. It was the data,” Mehta wrote. He explained that building the feature required a large connected fleet travelling the same roads over time, allowing Ather to generate the scale of fleet intelligence needed to accurately identify road conditions.
Every Ather scooter comes equipped with onboard compute and connectivity, enabling the company to continuously gather real-world riding data and deliver new capabilities through over-the-air software updates. According to Mehta, Pothole+ Alerts represents one of the first large-scale applications of this connected ecosystem, transforming millions of kilometres of ride data into a feature that benefits riders every day.
Integrated into the scooter’s navigation experience, Pothole+ Alerts provides advance notifications for potholes, broken road sections, uneven surfaces and speed breakers. Alerts are displayed on the dashboard and can also be delivered through the scooter’s speakers, the Ather Halo smart helmet or any compatible Bluetooth headset.
The rollout reflects Ather’s continued focus on building connected features powered by real-world riding data. Mehta added that Pothole+ Alerts is just the beginning, with the company planning to build more rider experiences on top of its growing road intelligence dataset.
The post Ather Energy Rolls Out Pothole+ Alerts, Built on Connected Fleet Intelligence appeared first on ELE Times.



