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​The demand for electric vehicles is continuously rising in India. Government and charging companies are making continuous efforts to make charging easy for consumers by expanding charging infrastructure and improving charging efficiency. But increasing the number of chargers alone is not sufficient to provide a reliable charging experience.

A new report from the Institute for Energy Economics and Financial Analysis (IEEFA) found that charger reliability, interoperability, charging cost, home-charging challenges and delays in grid connection are rising problems affecting EV charging in India. The report was published on September 16, 2026.

In the early stages of EV adoption, vehicle range was a major focus for manufacturers and consumers. As EV sales and charging infrastructure continue to expand, attention is increasingly turning​to the reliability and accessibility of charging infrastructure. A charging station is useful only when it is operational and available when an EV user needs it.

Network interoperability is another growing concern, as different charging networks may require separate apps, accounts or payment systems, making it less convenient for users to access and pay for charging across different locations. IEEFA has identified charger reliability and interoperability among charging networks as key factors that need to be addressed to improve India’s EV charging experience.

As India’s charging network continues to grow, the next stage of development will therefore depend not only on deploying more chargers but also on improving their reliability, interoperability, affordability and integration with the electricity grid.

The post EV Charging in India: Reliability and Interoperability Emerge as Key Challenges appeared first on ELE Times.

As manufactures and battery material companies are searching for increasing energy density and improve charging performance in electric vehicles, silicon-based anode technology that replace traditional graphite parts with silicon-based materials is gaining momentum in the electric vehicle (EV) battery industry. The advantage of adopting these technologies is that it holds significantly more lithium ions (up to 10 times more lithium per gram than standard graphite) to boost energy storage of an anode without increasing its size.

Although, this technology suffers from big challenges such as silicon undergo tremendous expansion once it absorbs lithium during charging. This expansion can destroy the anode and cause capacity loss over repeated charging cycles. Researchers have come up with the solution of using silicon-carbon composites to overcome this problem. By combining silicon with carbon based materials can accommodate the expansion to preserve the anode stability.

The technology has new completed its testing phase and is new ready to be implement toward large-scale manufacturing. Group14 Technologies, an American battery technology company, in March 2026 announced that its South Korea battery- material plant for silicon batteries has started production of its SCC55 material at the scale needed for EV batteries. The plant can produce up to 2,000 tonnes of silicon battery material per year, which should amount to about 10 GWh of energy-storage capacity annually once production reaches its planned level.

Australia is another major supporting commercialisation of this silicon-adopting material for energy storage. The Australian Renewable Energy Agency (ARENA) announced an award of $45 million to silicon battery technologies to build a commercial scale facility for advanced silicon-carbon battery material.

These developments put silicon-carbon anodes closer to commercialisation. If the manufacturers can overcome the issues of cost, cycle life, expansion and manufacturing scale, then the technology could contribute to higher battery energy density in future EV batteries, while allowing for faster charging.

The post Silicon-Carbon Anodes Move Toward EV-Scale Production for Higher Energy Density appeared first on ELE Times.

With the rise in the implementation of software technologies in Electric vehicles, the transition towards Software-Defined Vehicles (SDVs) is changing how electric vehicles are designed. Technologies in software-defined vehicles such as advanced automotive semiconductors, edge artificial intelligence (AI) and centralised computing are becoming key concepts in designing future transportation vehicles.

During electronica India 2026 held at Bangalore International Exhibition Centre (BIEC), Renesas Electronics showcased technologies related to SDVs, edge AI, EV charging and intelligent mobility. These technologies highlight the growing role of semiconductor-based computing in designing next-generation vehicles. At the event, Renesas demonstrated its newly designed 3nm multi-domain automotive SoC, the R-Car Gen 5 platform, highlighting features such as advanced driver assistance systems (ADAS), digital cockpit technologies and connected-vehicle solutions providing personalised functions and voice interfaces.

The platform combines high-performance automotive computing with AI capabilities and supports software-defined vehicle architectures. Edge Intelligence was another area of interest, where AI processing is being executed with the help of the vehicle’s sensors and systems instead of depending on cloud interface. Renesas demonstrated applications that support AI vision, autonomous and assisted driving for the driver, and embedded intelligence.

Edge AI can result in faster local responses compared to cloud connectivity and reduce the amount of sensor data that needs to be transmitted to external system. As EV architectures shift towards software-defined systems, the use of advanced automotive system-on-chip (SoC) platforms, edge AI, power semiconductors, and software platform will increasingly play an important role in vehicle computing, charging, connectivity, and smart mobility.

The post Software-Defined Vehicles and Edge AI Reshape Next-Generation EV Architecture appeared first on ELE Times.

SEMICON India 2026, the fifth edition of India’s flagship semiconductor conference, concluded on September 19 at Yashobhoomi, New Delhi, highlighting the country’s growing capabilities across the global semiconductor value chain. Held from September 17 to 19 under the theme “Silicon to Systems: Building the Ecosystem,” the three-day event brought together semiconductor companies, policymakers, investors, academia and start-ups.

The event featured more than 600 exhibitors, including around 300 international participants, with representatives from 52 countries and more than 150 speakers. Six country pavilions representing Japan, South Korea, Malaysia, the Netherlands, Singapore and Sweden, along with 12 state pavilions, showcased capabilities across different areas of the semiconductor ecosystem. The event recorded 51,656 registrations and around 40,000 cumulative footfall.

Prime Minister Narendra Modi inaugurated SEMICON India 2026 highlighting India’s progression from policy discussions and project planning to commercial semiconductor production. During the inauguration, the Prime Minister virtually inaugurated commercial production lines at CDIL Semiconductor in Mohali for discrete semiconductor devices and Suchi Semicon in Surat for semiconductor packaging. The two facilities added to India’s operational commercial semiconductor units under the Semicon 1.0 programme.

As a major outcome of SEMICON India 2026, a total of 56 MoUs, announcements and strategic initiatives were announced across areas including semiconductor design, fabrication, advanced packaging, equipment, materials, power electronics, AI, R&D, startups and talent development.

The post SEMICON India 2026 Concludes at Yashobhoomi, Showcasing India’s Growing Semiconductor Ecosystem appeared first on ELE Times.

Due to massive pool of specialised VLSI (Very Large Scale Integration) engineers, large number of Global Capability Centre (GCCs) presence and ongoing government support, India currently accounts for nearly 20% of the world’s semiconductor design workforce. This number highlights the India’s increasing role in global chip design and research. The statement of accounting 20% global workforce in semiconductor design was made by S. Krishnan, the MeitY Secretary on the side-lines of SEMICON India 2026 in New Delhi.

The government is prioritising the development of semiconductor design talent, said S. Krishnan. He said an ongoing programme is focused on training around 85,000 semiconductor design engineers, while skill-development efforts are also being expanded across the semiconductor value chain, with a strong focus on supporting semiconductor manufacturing in India.

The semiconductor design workforce will play an important in strengthening India’s position in the global semiconductor ecosystem. According to government data, India holds 7% of the world’s semiconductor-related Global Capability Centres (GCSs) along with Indian engineers continue to contributing to chip design, fabrication, verification and testing activities.

The government is taking action to move beyond design and improve semiconductor ecosystem by covering fabrication, advanced packaging, assembly and testing, semiconductor equipment and materials, research and development (R&D), and talent development. The recent organised event Semicon 2.0 has an outlay of ₹1,27,500 crore and is structured around six pillars which include design, machine, materials, advanced packaging, additional fabs, research, and talent.

There are different schemes supported by the government body encouraging semiconductor design which include Design Linked Incentive (DLI) Scheme and the Chips to Startup (C2S) Programme. The focus of these programmes is to train around 85,000 semiconductor design engineers. The initiatives are also aimed at strengthening India’s domestic chip-design capabilities and building a stronger semiconductor design ecosystem.

The post India Accounts for 20% of Global Semiconductor Design Workforce, Says MeitY appeared first on ELE Times.

India continues to focus on raising domestic value addition and further deepening domestic manufacturing in electronics industry. Moving beyond large-scale assembly towards deeper manufacturing and stronger local supply chains, S. Krishnan, the Secretary of the Ministry of Electronics and Information Technology (MeitY) made the statement that India is targeting 35-40% domestic value addition in mobile-phone manufacturing, up from the current level of about 22-23%. To achieve this number, different government schemes are giving support such as India Semiconductor Mission (ISM), mobile manufacturing, the Production Linked Incentive (PLI) for electronics hardware and the Electronics Component Manufacturing Scheme (ECMS).

The Electronics Component and Manufacturing Scheme (ECMS) is expected to play a major role by focusing on deep component-level manufacturing rather than basic assembly. Key areas include printed circuit boards, passive components, electrochemical components, subassemblies, camera module, optical transceivers, and critical equipment.

The government aims to wider the development of India’s semiconductor ecosystem by expanding capabilities across components, semiconductor manufacturing and other parts of electronics value chain. ECMS is designed to integrate Indian manufactures with global value chains and ISM supports semiconductor design, fabrication, advanced packaging, equipment and materials.

The 40% target in domestic manufacturing does not means that forty percent of the electronic devices to be made in India. It means if a device is selling in India, then its forty percent value must be manufactured within the country. This target reflect India’s deepen participation in global value chains by moving beyond final assembly, creating a deeper supplier ecosystem, reduce dependence on imported components, and moving towards complete manufacturing location. This will allow Indian factories to source more inputs locally while maintaining competitive cost, quality and scale.

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On 22 September 2026, North Korea said it had tested a new weapon system that it claimed utilised modern defence technology. State media images seem to indicate that North Korea tested an improved Hwasongpho-11Ma short-range ballistic missile capable of carrying a manoeuvrable hypersonic glide vehicle. South Korea’s military identified two missiles fired from the Wonsan area on 20 September, which it said travelled 450 kilometres and 600 kilometres before crashing into the sea.

North Korean reporting gave other performance numbers that could not be checked. A hypersonic glide vehicle is a rocket disseminated missile released from a booster that then glides course toward its target at very high speeds and altitude. Its capability to change course after launch presents a challenge to tracking and destroying it because of the ballistic predictability for defenders.

Latest test indicates progress by Pyongyang in enhancing the lethality and penetrability of its short-range missile arsenal. Such weapons, if employed, are likely meant to saturate regional missile-defence systems through rapid, highly manoeuvrable and possibly erratic flight trajectories. Still, outside analysts are sceptical of North Korea’s claims: briefly achieving hypersonic speed is one thing; sustained hypersonic manoeuvring-especially under realistic operational conditions- is another.

Additional launches will be necessary to determine the missile’s precision, guidance accuracy and ability to defeat existing missile defences. The missile test, however, inevitably heightens South Korea’s, Japan’s and the United States’ urgency to enhance regional tracking and interception capabilities.

The post North Korea Tests New Manoeuvrable Missile System appeared first on ELE Times.

Lockheed Martin won a US Army contract worth up to US$1.2 billion for production of the Increment 2 configuration of the PrSM, or Precision Strike Missile. The contract announced on 21 September 2026 supports the Army’s effort to succeed the legacy Army Tactical Missile System. PrSM is a surface-to-surface precision missile launched from the M142 High Mobility Artillery Rocket System and the tracked M270 Multiple Launch Rocket System.

Its more compact size will enable the two launch pods to carry two PrSM rounds per pod as opposed to one ATACMS missile, which could expand the number of precision weapons available to a firing battery. The missile family is being fielded in subsets (increments) to allow the Army to incrementally add improved systems without replacing the entire missile.

Increment 2 targets increasing the PrSM’s targeting ability, which is necessary to address the US military’s need to engage mobile maritime and land-based threats. This is obviously related to the countries’ operations in the Indo-Pacific, where ground forces are expected to engage enemy ships, air-defence facilities, and command and control facilities at extended distances. Some technical details remain classified.

The award further indicates that the US Army aims to move from limited early production toward establishing a larger manufacturing base. Increased production capacity has become a top priority as recent conflicts have highlighted how rapidly precision-missile stockpiles can be depleted in prolonged campaigns.

The post Lockheed Martin Wins $1.2-Billion US Army PrSM Contract appeared first on ELE Times.

Transistors: 2N2222A. submitted by /u/timofey2585 [link] [comments]

From the research Ive done, they were used as diodes to rectify up to 150 kV with a rating of up to 1A. 24" long by 6" diameter. Thinking of building a base/stand and using LEDs to illuminate them as a lamp/display piece! Used ChatGPT to show what they might look like once finished! submitted by /u/Odd_Performance4703 [link] [comments]

Photonic integrated circuits (PICs) use manufacturing processes developed for the semiconductor industry to miniaturize complex optical functionality onto a chip. PICs offer significant advantages over electronic ICs. Since light travels about 3x faster than electricity, PICs can transmit data with much higher throughput. Propagation losses are also typically much smaller compared to resistance losses in electronic ICs...

💛💙 День захисників і захисниць України в ДПМ ім. Бориса Патона kpi пн, 09/28/2026 - 22:03

Команда КПІ пройшла відбір до програми MInT-Ukraine! kpi пн, 09/28/2026 - 18:40

✍️ Дистанційний режим kpi пн, 09/28/2026 - 17:33

Київські політехніки відпрацювали алгоритми дій у надзвичайних ситуаціях KPI4U-2 пн, 09/28/2026 - 17:28

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced the commercial availability of its new Premium 200mm n-type silicon carbide substrate, expanding its 200mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability...

Fraunhofer Institute for Applied Solid State Physics IAF of Freiburg, Germany has developed a broadband distributed amplifier monolithic microwave integrated circuit (MMIC) chip suitable for use in data centers, measurement systems and sensors. Modern data centers, high-precision measurement systems and high-resolution radar sensors rely on extremely broadband amplifier chips that feature both low noise and high output power...

📣 Engineering Project Sprint 2026 kpi пн, 09/28/2026 - 17:00

A portable LED stick that turns into a persistence-of-vision (PoV) display. Wren Weichman built it to create visual effects during live performances: you spin it by hand, and a camera with a long exposure captures spectacular images and videos. The result is digitally controlled light painting, with a quality far superior to classic manual tools.

The heart of the project is a strip of addressable RGB LEDs mounted along the stick. The LEDs flash rapidly as the user rotates the instrument. Persistence of vision makes the human eye perceive a solid shape, but to capture the effect you need video recording with a long exposure, about a quarter of a second per frame. This way, each shot collects the complete light trail.

LED control and rotation

A Teensy 4.1 manages the LEDs, maintaining the correct refresh rate. The board is powerful enough to drive hundreds of RGB LEDs without dropping frames. Additionally, an IMU monitors the stick’s rotation speed at all times. Thanks to this data, the Teensy adjusts the timing of color changes and brightness, so the image stays stable even when rotation is not uniform.

The typical rotation speed of a desktop PoV display is about 2,000 RPM. A hand-operated stick never reaches a constant speed, so motion detection is essential. The IMU provides real-time measurements, and the Teensy adapts each frame to the instantaneous speed. This approach eliminates distortions and makes the image readable even with irregular movements.

For communication with a smartphone, the project uses an ESP32. The board lets you set LED animation effects from a dedicated app, without rewiring anything. An ESP32 module with a TFT touch display could make effect selection even more convenient, integrating the control directly on the stick. In any case, the Teensy and ESP32 pair covers both processing and connectivity well.

Power and weight balance

The stick is powered by batteries placed at the ends. This choice is not random: the batteries balance the instrument’s weight, making rotation smoother and less tiring. Moreover, the mass distribution helps maintain a stable trajectory during movement, a crucial factor for the quality of the final image.

The project demonstrates how PoV display principles can be adapted to a portable, hand-operated device. The main challenges are variable speed and motion detection. Wren Weichman overcame them with creative techniques, combining powerful hardware and real-time compensation algorithms.

For those who want to experiment with motion sensors, a 3-axis accelerometer with ADXL345 is an excellent starting point. It offers precise measurements and a simple interface to integrate with microcontrollers. Alternatively, a 3-axis accelerometer in Blebrick format mounts easily on breadboards and rapid prototypes.

The LED PoV stick combines electronics, programming, and performance art. It is not just a gadget: it is a concrete example of how to adapt established technologies to a new context. Speed management via IMU is an excellent educational case, as is the use of a powerful microcontroller like the Teensy 4.1 for LED control.

Furthermore, the project opens the door to numerous variations. You can change the number of LEDs, increase resolution, or add synchronized sound effects. The hardware base is solid and modular, so every maker can customize it without rewriting everything from scratch. The project video documents every step in detail.

In summary, this stick proves that persistence of vision works even without motors and fixed supports. Manual skill becomes part of the artwork, and technology compensates for the imperfections of the gesture. A project worth studying, both for the technical skills and for the visual result.

• Teensy 4.1 for controlling addressable RGB LEDs
• IMU for monitoring rotation speed
• ESP32 for smartphone communication
• Batteries at the ends for power and balance

Source: https://youtu.be/GZVfNMVYYRY?si=8xgRLVamI6LgN70d

The post LED PoV Stick: A Portable Display for Live Performances appeared first on Open Electronics.

Take a baseline device, remove a subsequently added protocol and replace it with a function, and…you end up with a bigger-than-expected revision?

As I alluded to in a blog post a week-and-a-half back, I’m nearing the finish line of my teardown series on TP-Link smart plugs. As I mentioned last month, my basic aspiration with this project is to ascertain to what degree (if any) differences in the company’s various smart plug products’ feature sets, broadly between the Kasa and Tapo product lines as well as between products within a given line, are due to hardware variability versus (or in addition to) software-implemented inconsistency.

As such, today’s entry ended up being a deviation from the to-date norm, therefore a pleasant surprise. But I don’t want to ruin it for all of you via a premature reveal, so I’ll keep my cyber-lip zipped for the moment. Here’s the so-far published dissection list:

• TP-Link’s Kasa HS103: A smart plug with solid network connectivity
• TP-Link’s Kasa EP10: If at first it doesn’t connect, buy, buy again
• TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive
• TP-Link’s Tapo P105: A Kasa EP10 clone, or evolutionarily derived?
• TP-Link’s Tapo P125: A smart plug with an Apple HomeKit vibe

Revisiting another last-month comment, again note that hardware changes can be driven not only by evolving feature set requirements but also by phaseout and replacement of building block components inside these devices. To wit, hold that thought.

Unpacking the patient(s)

Today’s dissection victim is TP-Link’s Tapo P115, a two-pack of which set me back $13.77 during a Thanksgiving 2025 Amazon Resale (formerly Warehouse) used-goods promotion.

Like last month’s Tapo P125, it shares a common form factor with the baseline Tapo P105 I took apart in early June.

But as the above “stock” photo highlights, whereas the Tapo P125 had built on the Tapo P105 foundation with added Apple Homekit support, today’s Tapo P115 instead focuses its enhancement energy on energy monitoring and logging specifically. As such, it’s conceptually akin to the prior-gen Kasa EP25, again with energy monitoring, that went “under the knife” back in March.

What, if any, hardware commonality exists between the Kasa EP25 and Tapo P115? As well as, for that matter, between the Tapo P105 and Tapo P115? Let’s find out, as usual starting with some outer box shots, again accompanied by a 0.75′′/19.1 mm diameter U.S. penny for size comparison purposes.

The Amazon Resale-origination identifying sticker added to the bottom panel left unobscured the hardware version, v1.6. TP-Link’s support page indicates that this is the latest-and-greatest revision, with a v1.26 predecessor. Why do I care about such seeming minutia? I’ll remind you of my early-March coverage of the Kasa EP10, wherein I detailed (for the first time, but definitely not the last) version-based functional shortcomings both in an absolute sense and in “smart home”-striving combination with same-name devices containing different-version hardware.

Picking patient

As was the case last month, opening the packaging and perusing the contents revealed evidence of prior-customer access and device removal, leading me to select that same device for analysis (the one on the left, if not already obvious).

Last month’s noted cuteness continues unabated, of course.

And now, finally free from its cardboard captivity, here’s our patient.

Once again, as is the case with the box containing it, the device’s bottom side is the most informative perspective, revealing factoids including the always-helpful FCC ID (2BCGWP110).

Diving inside

Here’s a vendor-supplied conceptual cutaway to whet your appetite for what’s next (regular readers of my teardowns already know how much I love coming across and sharing these).

How closely (or not) does this marketing creation (or abomination?) match what our eyes see when they peruse the actual insides? Let’s find out.

The inside of the back half of the enclosure is, as usual, bland and boring (unless you’re a plastics specialist, I suppose).

The other half, on the other hand…that’s more like it (including an under-penny further peek) for an electrical engineer like you and me.

Much of it is reminiscent of what we’ve seen before. Here’s the top-side view.

Once again, the relay is a Churod A16-V-105DA2F, although in comparison to its Tapo P125 cousin, it’s 90° rotated and downward shifted location-wise on the PCB this time.

Bottom side view next.

Now to the right.

And the left…wait, what’s this?

Silicon and broader software swaps

The Shanghai Belling BL0937 single-phase energy monitoring IC at right is the same as the one previously seen in the Kasa EP25. Below it is yet another five-lead SOT-packaged IC, presumably housing a dual-transistor combo and seen multiple times before, this time labeled as follows:

JWM3J
5G5hG

And in the middle is, once again, a switch alongside an LED. But check out the processor at left! In every other TP-Link smart plug I’ve taken apart so far, it has come from Realtek Semiconductor and is based on an Arm architecture. This time, in contrast, it’s the RISC-V-based Espressif Systems ESP8684.

The very first page of the datasheet clears up another discrepancy I’d noted; seemingly no discrete flash memory device anywhere on the mini-PCB this time. Instead, the documentation tipped me off that there’s “Optional 2 MB or 4 MB flash in the chip’s package”.

All of which leaves me with no shortage of questions, which do not include the contents of the as-usual difficult-to-access PCB underside (as usual, it’s quite bare, as far as I can tell, and FCC certification photos can fill any nagging knowledge gaps for the curious among you out there).

These questions include (but are not limited) to the following:

• Previously, in transitioning from the conventional Tapo HS103 to the energy-monitoring Tapo EP25, TP-Link migrated from a single- to dual-core Realtek Arm-based chip. To what degree, if any, was a similar performance-boost need behind this more significant shift?
• Were, as I alluded to at the beginning, product shortages or more definitive device phaseouts factors in this particular more significant change of supplier and architecture?
• And to what degree, if any, was a desire to shift to a royalty-free, fully open-source processor architecture behind this design decision, keeping in mind the substantial software porting effort that would be required for TP-Link to actualize its aspiration?

I daresay I’m not likely to get any answers from TP-Link if I inquire, so I doubt I’ll even bother. Or from either Espressif Systems or Realtek, for that matter. But I’m guessing at least a one of you out there has a tangible clue as to what’s going on. Tips, either passed on to me anonymously over email or publicly in the comments, are greatly appreciated!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• Tapo or Kasa: Which TP-Link ecosystem best suits ya?
• TP-Link’s Tapo P125: A smart plug with an Apple HomeKit vibe
• TP-Link’s Tapo P105: A Kasa EP10 clone, or evolutionarily derived?
• TP-Link’s Kasa HS103: A smart plug with solid network connectivity
• TP-Link’s Kasa EP25: Energy monitoring for a hoped-for utility bill nose-dive

The post TP-Link’s Tapo P115: Smart plug subtracts Apple, adds energy tracking appeared first on EDN.