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If the Consumer Electronics Show (CES) is a benchmark for what’s next in the electronic component industry, you’ll find that artificial intelligence permeates across all industries, from consumer electronics and wearables to automotive and robotics. Many chipmakers are placing big bets on edge AI as a key growth area along with robotics and IoT.

Here’s a sampling of the latest devices and technologies launched at CES 2026, covering AI advances for automotive, robotics, and wearables applications.

AI SoCs, chiplets, and development

Ambarella Inc. announced its CV7 edge AI vision system-on-chip (SoC), optimized for a wide range of AI perception applications, such as advanced AI-based 8K consumer products (action and 360° cameras), multi-imager enterprise security cameras, robotics (aerial drones), industrial automation, and high-performance video conferencing devices. The 4-nm SoC provides simultaneous multi-stream video and advanced on-device edge AI processing while consuming very low power.

The CV7 may also be used for multi-stream automotive designs, particularly for those running convolutional neural networks (CNNs) and transformer-based networks at the edge, such as AI vision gateways and hubs in fleet video telematics, 360° surround-view and video-recording applications, and passive advanced driver-assistance systems (ADAS).

Compared with its predecessor, the CV7 consumes 20% less power, thanks in part to Samsung’s 4-nm process technology, which is Ambarella’s first on this node, the company said. It incorporates Ambarella’s proprietary AI accelerator, image-signal processor (ISP), and video encoding, together with Arm cores, I/Os, and other functions for an efficient AI vision SoC.

The high AI performance is powered by Ambarella’s proprietary, third-generation CVflow AI accelerator, with more than 2.5× AI performance over the previous-generation CV5 SoC. This allows the CV7 to support a combination of CNNs and transformer networks, running in tandem.

In addition, the CV7 provides higher-performance ISP, including high dynamic range (HDR), dewarping for fisheye cameras, and 3D motion-compensated temporal filtering with better image quality than its predecessor, thanks to both traditional ISP techniques and AI enhancements. It provides high image quality in low light, down to 0.01 lux, as well as improved HDR for video and images.

Other upgrades include its hardware-accelerated video encoding (H.264, H.265, MJPEG), which boosts encode performance by 2× over the CV5 and its on-chip general-purpose processing upgrade to a quad-core Arm Cortex-A73, offering 2× higher CPU performance over the previous SoC. It also provides a 64-bit DRAM interface, delivering a significant improvement in available DRAM bandwidth compared with the CV5, Ambarella said. CV7 SoC samples are available now.

Ambiq Micro Inc. delivers the industry’s first ultra-low-power neural processing unit (NPU) built on its Subthreshold Power Optimized Technology (SPOT) platform. It is designed for real-time, always-on AI at the edge.

Delivering both performance and low power consumption, the SPOT-optimized NPU is claimed as the first to leverage sub- and near-threshold voltage operation for AI acceleration to deliver leading power efficiency for complex edge AI workloads. It leverages the Arm Ethos-U85 NPU, which supports sparsity and on-the-fly decompression, enabling compute-intensive workloads directly on-device, with 200 GOPS of on-device AI performance.

It also incorporates SPOT-based ultra-wide-range dynamic voltage and frequency scaling that enables operation at lower voltage and lower power than previously possible, Ambiq said, making room in the power budget for higher levels of intelligence.

Ambiq said the Atomiq SoC enables a new class of high-performance, battery-powered devices that were previously impractical due to power and thermal constraints. One example is smart cameras and security for always-on, high-resolution object recognition and tracking without frequent recharging or active cooling.

For development, Ambiq offers the Helia AI platform, together with its AI development kits and the modular neuralSPOT software development kit.

Ambiq’s Atomiq SoC (Source: Ambiq Micro Inc.)

On the development side, Cadence Design Systems Inc. and its IP partners are delivering pre-validated chiplets, targeting physical AI, data center, and high-performance computing (HPC) applications. Cadence announced at CES a partner ecosystem to deliver pre-validated chiplet solutions, based on the Cadence physical AI chiplet platform. Initial IP partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, as well as silicon analytics partner proteanTecs.

The new chiplet spec-to-packaged parts ecosystem is designed to reduce engineering complexity and accelerate time to market for developing chiplets. To help reduce risk, Cadence is also collaborating with Samsung Foundry to build out a silicon prototype demonstration of the Cadence physical AI chiplet platform. This includes pre-integrated partner IP on the Samsung Foundry SF5A process.

Extending its close collaboration with Arm, Cadence will use Arm’s advanced Zena Compute Subsystem and other essential IP for the physical AI chiplet platform and chiplet framework. The solutions will meet edge AI processing requirements for automobiles, robotics, and drones, as well as standards-based I/O and memory chiplets for data center, cloud, and HPC applications.

These chiplet architectures are standards-compliant for broad interoperability across the chiplet ecosystem, including the Arm Chiplet System Architecture and future OCP Foundational Chiplet System Architecture. Cadence’s Universal Chiplet Interconnect Express (UCIe) IP provides industry-standard die-to-die connectivity, with a protocol IP portfolio that enables fast integration of interfaces such as LPDDR6/5X, DDR5-MRDIMM, PCI Express 7.0, and HBM4.

Cadence’s physical AI chiplet platform (Source: Cadence Design Systems Inc.)

NXP Semiconductors N.V. launched its eIQ Agentic AI Framework at CES 2026, which simplifies agentic AI development and deployment for both expert and novice device makers. It is one of the first solutions to enable agentic AI development at the edge, according to the company. The framework works together with NXP’s secure edge AI hardware to help simplify agentic AI development and deployment for autonomous AI systems at the edge and eliminate development bottlenecks with deterministic real-time decision-making and multi-model coordination.

Offering low latency and built-in security, the eIQ Agentic AI Framework is designed for real-time, multi-model agentic workloads, including applications in robotics, industrial control, smart buildings, and transportation. A few examples cited include instantly controlling factory equipment to mitigate safety risks, alerting medical staff to urgent conditions, updating patient data in real time, and autonomously adjusting HVAC systems, without cloud connectivity.

For expert developers, they can integrate sophisticated, multi-agent workflows into existing toolchains, while novice developers can quickly build functional edge-native agentic systems without deep technical experience.

The framework integrates hardware-aware model preparation and automated tuning workflows. It enables developers to run multiple models in parallel, including vision, audio, time series, and control, while maintaining deterministic performance in constrained environments, NXP said. Workloads are distributed across CPU, NPU, and integrated accelerators using an intelligent scheduling engine.

The eIQ Agentic AI Framework supports the i.MX 8 and i.MX 9 families of application processors and Ara discrete NPUs. It aligns with open agentic standards, including Agent to Agent and Model Context Protocol.

NXP has also introduced its eIQ AI Hub, a cloud-based developer platform that gives users access to edge AI development tools for faster prototyping. Developers can deploy on cloud-connected hardware boards but still have the option for on-premise deployments.

NXP’s Agentic AI framework (Source: NXP Semiconductors N.V.) Sensing solutions

Bosch Sensortec launched its BMI5 motion sensor platform at CES 2026, targeting high-precision performance for a range of applications, including immersive XR systems, advanced robotics, and wearables. The new generation of inertial sensors—BMI560, BMI563, and BMI570—is built on the same hardware and is adapted through intelligent software.

Based on Bosch’s latest MEMS architecture, these inertial sensors, housed in an LGA package, claim ultra-low noise and exceptional vibration robustness. They offer twice the full-scale range of the previous generation. Key specifications include a latency of less than 0.5 ms, combined with a time increment of approximately 0.6 µs, and a timing resolution of 1 ns, which can deliver responsive motion tracking in highly dynamic environments.

The sensors also leverage a programmable edge AI classification engine that supports always-on functionality by analyzing motion patterns directly on the sensor. This reduces system power consumption and accelerates customer-specific use cases, the company said.

The BMI560, optimized for XR headsets and glasses, delivers low noise, low latency, and precise time synchronization. Its advanced OIS+ performance helps capture high-quality footage even in dynamic environments for smartphones and action cameras.

Targeting robotics and XR controllers, the BMI563 offers an extended full-scale range with the platform’s vibration robustness. It supports simultaneous localization and mapping, high dynamic XR motion tracking, and motion-based automatic scene tagging in action cameras.

The BMI570, optimized for wearables and hearables, delivers activity tracking, advanced gesture recognition, and accurate head-orientation data for spatial audio. Thanks to its robustness, it is suited for next-generation wearables and hearables.

Samples are now available for direct customers. High-volume production is expected to start in the third quarter of 2026.

Bosch also announced the BMI423 inertial measurement unit (IMU) at CES. The BMI423 IMU offers an extended measurement range of ±32 g (accelerometer) and ±4,000 dps (gyroscope), which enable precise tracking of fast, dynamic motion, making it suited for wearables, hearables, and robotics applications.

The BMI423 delivers low current consumption of 25 µA for always-on, acceleration-based applications in small devices. Other key specifications include low noise levels of 5.5 mdps/√Hz (gyro) and 90 µg/√Hz (≤ 8 g) or 120 µg/√Hz (≥ 16 g) (accelerometer), along with several interface options including I3C, I2C, and serial peripheral interface (SPI).

For wearables and hearables, the BMI423 integrates voice activity detection based on bone-conduction sensing, which helps save power while enhancing privacy, Bosch said. The sensor detects when a user is speaking and activates the microphone only when required. Other on-board functions include wrist-gesture recognition, multi-tap detection, and step counting, allowing the main processor to remain in sleep mode until needed and extending battery life in compact devices such as smartwatches, earbuds, and fitness bands.

The BMI423 is housed in a compact, 2.5 × 3 × 0.8-mm3 LGA package for space-constrained devices. The BMI423 will be available through Bosch Sensortec’s distribution partners starting in the third quarter of 2026.

Bosch Sensortec’s BMI563 IMU for robotics (Source: Bosch Sensortec)

Also targeting hearables and wearables, TDK Corp. launched a suite of InvenSense SmartMotion custom sensing solutions for true wireless stereo (TWS) earbuds, AI glasses, augmented-reality eyewear, smartwatches, fitness bands, and other IoT devices. The three newest IMUs are based on TDK’s latest ultra-low-power, high-performance ICM-456xx family that offers edge intelligence for consumer devices at the highest motion-tracking accuracy, according to the company.

Instead of relying on central processors, SmartMotion on-chip software enables computational processing related to motion tracking to be offloaded to the motion sensor itself so that intelligence decisions may be made locally, which allows other parts of the system to remain in low-power mode, TDK said. In addition, the sensor fusion algorithm and machine-learning capability are reported to deliver seamless motion sensing with minimum software effort by the customer.

The SmartMotion solutions, based on the ICM-456xx family of six-axis IMUs, include the SmartMotion ICM-45606 for TWS applications including earbuds, headphones, and other hearable products; the SmartMotion ICM-45687 for wearable and IoT technology; and the SmartMotion for Smart Glasses ICM-45685, which now enables new features, including sensing whether users are putting glasses on or taking glasses off (wear detection) and vocal vibration detection for identifying the source of the speech through its on-chip sensor fusion algorithms. The ICM-45685 also enables high-precision head-orientation tracking, optical/electronic image stabilization, intuitive UI control, posture recognition, and real-time translation.

TDK’s SmartMotion ICM-45685 (Source: TDK Corp.)

TDK also announced a new group company, TDK AIsight, to address technologies needed for AI glasses. The company will focus on the development of custom chips, cameras, and AI algorithms enabling end-to-end system solutions. This includes combining software technologies such as eye intent/tracking and multiple TDK technologies, such as sensors, batteries, and passive components.

As part of the launch, TDK AIsight introduced the SED0112 microprocessor for AI glasses. The next-generation, ultra-low-power digital-signal processor (DSP) platform integrates a microcontroller (MCU), state machine, and hardware CNN engine. The built-in hardware CNN architecture is optimized for eye intent. The MCU features ultra-low-power DSP processing, eyeGenI sensors, and connection to a host processor.

The SED0112, housed in a 4.6 × 4.6-mm package, supports the TDK AIsight eyeGI software and multiple vision sensors at different resolutions. Commercial samples are available now.

SDV devices and development

Infineon Technologies AG and Flex launched their Zone Controller Development Kit. The modular design for zone control units (ZCUs) is aimed at accelerating the development of software-defined-vehicle (SDV)-ready electrical/electronic architectures. Delivering a scalable solution, the development kit combines about 30 unique building blocks.

With the building block approach, developers can right-size their designs for different implementations while preserving feature headroom for future models, the company said. The design platform enables over 50 power distribution, 40 connectivity, and 10 load control channels for evaluation and early application development. A dual MCU plug-on module is available for high-end ZCU implementations that need high I/O density and computational power.

The development kit enables all essential zone control functions, including I2t (ampere-squared seconds), overcurrent protection, overvoltage protection, capacitive load switching, reverse-polarity protection, secure data routing with hardware accelerators, A/B swap for over-the-air software updates, and cybersecurity. The pre-validated hardware combines automotive semiconductor components from Infineon, including AURIX MCUs, OPTIREG power supply, PROFET and SPOC smart power switches, and MOTIX motor control solutions with Flex’s design, integration, and industrialization expertise. Pre-orders for the Zone Controller Development Kit are open now.

Infineon and Flex’s Zone Controller Development Kit (Source: Infineon Technologies AG)

Infineon also announced a deeper collaboration with HL Klemove to advance technologies in vehicle electronic architectures for SDVs and autonomous driving. This strategic partnership will leverage Infineon’s semiconductor and system expertise with HL Klemove’s capabilities in advanced autonomous-driving systems.

The three key areas of collaboration are ZCUs, vehicle Ethernet-based ADAS and camera solutions, and radar technologies.

The companies will jointly develop zone controller applications using Infineon’s MCUs and power semiconductors, with HL Klemove as the lead in application development. Enabling high-speed in-vehicle network solutions, the partnership will also develop front camera modules and ADAS parking control units, leveraging Infineon’s Ethernet technology, while HL Klemove handles system and product development.

Lastly, HL Klemove will use Infineon’s radar semiconductor solutions to develop high-resolution and short-range satellite radar. They will also develop high-resolution imaging radar for precise object recognition.

NXP introduced its S32N7 super-integration processor series, designed to centralize core vehicle functions, including propulsion, vehicle dynamics, body, gateway, and safety domains. Targeting SDVs, the S32N7 series, with access to core vehicle data and high compute performance, becomes the central AI control point.

Enabling scalable hardware and software across models and brands, the S32N7 simplifies vehicle architectures and reduces total cost of ownership by as much as 20%, according to NXP, by eliminating dozens of hardware modules and delivering enhanced efficiencies in wiring, electronics, and software.

NXP said that by centralizing intelligence, automakers can scale intelligent features, such as personalized driving, predictive maintenance, and virtual sensors. In addition, the high-performance data backbone on the S32N7 series provides a future-proof path for upgrading to the latest AI silicon without re-architecting the vehicle.

The S32N7 series, part of NXP’s S32 automotive processing platform, offers 32 compatible variants that provide application and real-time compute with high-performance networking, hardware isolation technology, AI, and data acceleration on an SoC. They also meet the strict timing, safety, and security requirements of the vehicle core.

Bosch announced that it is the first to deploy the S32N7 in its vehicle integration platform. NXP and Bosch have co-developed reference designs, safety frameworks, hardware integration, and an expert enablement program.

The S32N79, the superset of the series, is sampling now with customers.

NXP’s S32N7 super-integration processor series (Source: NXP Semiconductors N.V.)

Texas Instruments Inc. (TI) expanded its automotive portfolio for ADAS and SDVs with a range of automotive semiconductors and development resources for automotive safety and autonomy across vehicle models. The devices include the scalable TDA5 HPC SoC family, which offers power- and safety-optimized processing and edge AI; the single-chip AWR2188 8 × 8 4D imaging radar transceiver, designed to simplify high-resolution radar systems; and the DP83TD555J-Q1 10BASE-T1S Ethernet physical layer (PHY).

The TDA5 SoC family offers edge AI acceleration from 10 TOPS to 1,200 TOPS, with power efficiency beyond 24 TOPS/W. This scalability is enabled by its chiplet-ready design with UCIe interface technology, TI said, enabling designers to implement different feature sets.

The TDA5 SoCs provide up to 12× the AI computing of previous generations with similar power consumption, thanks to the integration of TI’s C7 NPU, eliminating the need for thermal solutions. This performance supports billions of parameters within language models and transformer networks, which increases in-vehicle intelligence while maintaining cross-domain functionality, the company said. It also features the latest Arm Cortex-A720AE cores, enabling the integration of more safety, security, and computing applications.

Supporting up to SAE Level 3 vehicle autonomy, the TDA5 SoCs target cross-domain fusion of ADAS, in-vehicle infotainment, and gateway systems within a single chip and help automakers meet ASIL-D safety standards without external components.

TI is partnering with Synopsys to provide a virtual development kit for TDA5 SoCs. The digital-twin capabilities help engineers accelerate time to market for their SDVs by up to 12 months, TI said.

The AWR2188 4D imaging radar transceiver integrates eight transmitters and eight receivers into a single launch-on-package chip for both satellite and edge architectures. This integration simplifies higher-resolution radar systems because 8 × 8 configurations do not require cascading, TI said, while scaling up to higher channel counts requires fewer devices.

The AWR2188 offers enhanced analog-to-digital converter data processing and a radar chirp signal slope engine, both supporting 30% faster performance than currently available solutions, according to the company. It supports advanced radar use cases such as detecting lost cargo, distinguishing between closely positioned vehicles, and identifying objects in HDR scenarios. The transceiver can detect objects with greater accuracy at distances greater than 350 meters.

With Ethernet an enabler of SDVs and higher levels of autonomy, the DP83TD555J-Q1 10BASE-T1S Ethernet SPI PHY with an integrated media access controller offers nanosecond time synchronization, as well as high reliability and Power over Data Line capabilities. This brings high-performance Ethernet to vehicle edge nodes and reduces cable design complexity and costs, TI said.

The TDA54 software development kit is now available on TI.com. Samples of the TDA54-Q1 SoC, the first device in the family, will be sampling to select automotive customers by the end of 2026. Pre-production quantities of the AWR2188 transceiver, AWR2188 evaluation module, DP83TD555J-Q1 10BASE-T1S Ethernet PHY, and evaluation module are now available on request at TI.com.

Robotics: processors and modules

Qualcomm Technologies Inc. introduced a next-generation robotics comprehensive-stack architecture that integrates hardware, software, and compound AI. As part of the launch, Qualcomm also introduced its latest, high-performance robotics processor, the Dragonwing IQ10 Series, for industrial autonomous mobile robots and advanced full-sized humanoids.

The Dragonwing industrial processor roadmap supports a range of general-purpose robotics form factors, including humanoid robots from Booster, VinMotion, and other global robotics providers. This architecture supports advanced-perception, motion planning with end-to-end AI models such as VLAs and VMAs. These features enable generalized manipulation capabilities and human-robot interaction.

Qualcomm’s general-purpose robotics architecture with the Dragonwing IQ10 combines heterogeneous edge computing, edge AI, mixed-criticality systems, software, machine-learning operations, and an AI data flywheel, along with a partner ecosystem and a suite of developer tools. This portfolio enables robots to reason and adapt to the spatial and temporal environments intelligently, Qualcomm said, and is optimized to scale across various form factors with industrial-grade reliability.

Qualcomm’s growing partner ecosystem for its robotics platforms includes Advantech, APLUX, AutoCore, Booster, Figure, Kuka Robotics, Robotec.ai, and VinMotion.

Qualcomm’s Dragonwing IQ10 industrial processor (Source: Qualcomm Technologies Inc.)

Quectel Wireless Solutions released its SH602HA-AP smart robotic computing module. Based on the D-Robotics Sunrise 5 (X5M) chip platform and with an integrated Ubuntu operating system, the module features up to 10 TOPS of brain-processing-unit computing power. The robotic computing modules target demanding robotic workloads, supporting advanced large-scale models such as Transformer, Bird’s-Eye View, and Occupancy.

The module works seamlessly with Quectel’s independent LTE Cat 1, LTE Cat 4, 5G, Wi-Fi 6, and GNSS modules, offering expanded connectivity options and a broader range of robotics use cases. These include smart displays, express lockers, electricity equipment, industrial control terminals, and smart home appliances.

The module, measuring 40.5 × 40.5 × 2.9 mm, operates over the –25°C to 85°C temperature range. It supplies a default memory of 4 GB plus 32 GB and numerous memory options. It supports data input and fusion processing for multiple sensors, including LiDAR, structured light, time-of-flight, and voice, meeting the AI and vision requirements in robotic applications.

The module supports 4k video at 60 fps with video encoding and decoding, binocular depth processing, AI and visual simultaneous localization and mapping, speech recognition, 3D point-cloud computing, and other mainstream robot perception algorithms. It provides Bluetooth, DSI, RGMII, USB 3.0, USB 2.0, SDIO, QSPI, seven UART, seven I2C, and two I2S interfaces.

The module integrates easily with additional Quectel modules, such as the KG200Z LoRa and the FCS950 Wi-Fi and Bluetooth module for more connectivity options.

Quectel’s SH602HA-AP smart robotic computing module (Source: Quectel Wireless Solutions)

The post CES 2026: AI, automotive, and robotics dominate appeared first on EDN.

У КПІ ім. Ігоря Сікорського працюють пункти незламності kpi пт, 01/23/2026 - 17:30

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has secured operating control of Italy-based Orbit S.r.l., a revenue-generating Software-as-a-Service (SaaS) company focused on digitalizing operational resilience, risk intelligence, and mission-critical decision support via its Orbit Open Platform. NUBURU says that the transaction strengthens its security offering capabilities and advances its multi-vertical growth strategy through the addition of a scalable, software-driven operating business...

Hey everyone, I’ve been working on a standalone ECU project for the last couple of years, and I’ve finally got the first proper PCB made and assembled. The ECU side of this is already proven, I’ve been running it on engines for a while using smaller boards hand wired setups (single-cylinder and a four-cylinder). This PCB isn’t me starting from scratch or hoping the logic works, it’s the next step: turning something that already works into a solid, repeatable platform that’s stable, easier to test properly, and easier to keep iterating. The whole idea is a practical ECU built around an ESP32 that I can keep improving without the usual expensive locked-down ecosystem. It’s aimed at bikes and small engines, and the firmware is already doing the real ECU stuff (fuel and ignition control, crank/cam sync, 16x16 maps, launch/ALS logic, telemetry, etc). This board is basically where it stops being a rats nest of wiring and starts becoming an actual unit. the board itself is pretty simple. There’s nothing exotic going on hardware wise, it’s mostly just a clean way to break out signals and do the boring but important bits like input conditioning, ADC, drivers, and power. Honestly 99% of the complexity in this project has been the code and the engine logic. The PCB is mainly about turning that proven setup into a proper platform. (Also for those wondering underside is ground fill between traces) Hardware-wise it’s an ESP32-S3 Mini, an external ADC (MCP3008) for the analog stuff like TPS/MAP/O2, a 74HC14 for cleaning up crank/cam inputs, low-side injector drivers (IRLB3034) with flyback diodes, and a TC4427 driving the ignition outputs. The spark outputs can be jumpered for 5V or 12V depending what you’re trying to trigger, and there’s basic 12V protection plus an onboard 5V rail for sensors/modules. Also, I know an ESP is kind of a cursed MCU choice for an ECU if you look at it purely from a “hardware timers everywhere” perspective. It’s not the obvious route. The sensible/normal choice (and what most platforms use) is STM / STM-based stuff because you’ve got a ridiculous amount of hardware timers and it makes a lot of ECU timing problems feel easy. With the ESP32 you end up having to get creative, sharing limited hardware timer resources with software layers and scheduling, and that’s where a lot of the complexity has come from on my side. But the reason I went ESP is the surrounding ecosystem: the dash connects wirelessly, the power distribution unit connects wirelessly, the tuning app is wireless, telemetry is easy, and it’s all stuff the ESP platform is just good at. So yeah, if anyone’s wondering why I chose the ESP route and made my life harder, that’s basically why. Long term I want this to be an open-source project where people can add whatever features they want, and the ESP ecosystem (and how widely supported it is) makes that way more realistic. This first revision is intentionally big and through hole heavy. That’s on purpose, it’s way easier to probe, rework, and debug when everything isn’t tiny and packed tight. Rev 1 is always where you find the dumb mistakes, and I’d rather find them on a board that’s friendly to work on before I shrink it down and move to SMD later. So far I’ve been going through it section by section and it’s been behaving way better than I expected for a first spin. Bench testing is still continuing though, mainly power stability, noise/EMI behavior, sensor scaling, crank/cam conditioning, and verifying injector and ignition outputs under more realistic conditions. Once I’ve shaken out whatever issues show up, I’ll do a revision 2 to clean up what I find, and after that the plan is to shrink it down and move to SMD so it becomes a smaller, cleaner “real ECU module” style board instead of a big debug-friendly prototype. submitted by /u/Budgetboost [link] [comments]

An onboard charger converts power between the power grid and electric vehicles or hybrid electric vehicles. Traditional systems use two stages of power conversion: a boost converter to implement unity power factor, and an isolated DC/DC converter to charge the batteries with isolation. Obviously, these two stages require additional components that decrease power density and increase costs.

Matrix converters use a single stage of conversion without a boost inductor and bulky electrolytic capacitors. When using bidirectional gallium nitride (GaN) power switches, the converters further reduce component count and increase power density.

Comparing two-stage power converters with single-stage matrix converters

A two-stage power converter, as shown in Figure 1, requires a boost inductor (LB) and a DC-link electrolytic capacitor (CB), as well as four metal-oxide semiconductors (MOSFETs) for totem-pole power factor correction (PFC). 

Figure 1 Two-stage power converter diagram with LB, CB, and four MOSFETs for totem-pole PFC. Source: Texas Instruments

A single-stage matrix converter, as shown in Figure 2, does not require a boost inductor nor a DC-link capacitor but does require bidirectional switches (S11 and S12). Connecting common drains or common sources of two individual MOSFETs forms the bidirectional switches. Alternatively, when adopting bidirectional GaN devices in matrix converters, the number of switches decreases. Table 1 compares the two types of converters.

Figure 2 Single-stage matrix converter diagram that does not require LB or CB, but necessitates the use of two bidirectional switches: S11 and S12 . Source: Texas Instruments 

	Two-stage power converter (totem pole power factor correction plus DC/DC)	Single-stage matrix converter
Boost inductor	Yes	No
DC-link electrolytic capacitor	Yes	No
Fast unidirectional switches	10	4
Bidirectional switches	0	4
Slow switches	2	0
Electromagnetic interference filter	Smaller	Larger
Input/output ripple current	Smaller	Larger
Power density	Lower	Higher
Power efficiency	Lower	Higher
Control algorithm	Simple	Complicated

Table 1 A two-stage AC/DC and single-stage matrix converter comparison. Source: Texas Instruments

Single-stage matrix converter topologies

There are three major topologies applied to EV onboard charger applications.

Topology No. 1: The LLC topology

Figure 3 shows the inductor-inductor-capacitor (LLC) topology. The LLC converter regulates current or voltage by modulating switching frequencies. Lr and Cr form a resonant tank to shape the resonant current. Selecting the proper control algorithms will achieve a unity power factor.

With a three-phase AC input, the voltage ripple on the primary side is much smaller compared to a single-phase AC input. Therefore, the LLC topology is more suitable for three-phase applications. LLC converters operate at a higher frequency and realize a wider range of zero voltage switching (ZVS) than other topologies.

Figure 3 An LLC-based matrix converter with a three-phase AC input. Source: Texas Instruments

Topology No. 2: The DAB topology

Figure 4 shows a dual active bridge (DAB)-based matrix converter. The DAB topology can apply to a three-phase or single-phase AC input. Controlling the inductor current will realize unity power factor naturally. The goal of a control algorithm is to realize a wide ZVS range to reduce switching losses, reduce root-mean-square (RMS) current to reduce conduction losses, and achieve low current total harmonic distortion and unity power factor.

Triple-phase shift is necessary to achieve these goals, including primary-side internal phase shift, secondary-side internal phase shift, and external phase shift between the primary side and secondary side. Additionally, modulating the switching frequency will extend the ZVS range.

Figure 4 A DAB-based matrix converter with a single-phase AC input. Source: Texas Instruments

Topology No. 3: The SR-based topology

Figure 5 shows a series resonant (SR) matrix converter. The resonant tank formed by Lr and Cr shapes the transformer current to reduce turnoff current and turnoff losses. Meanwhile, the reactive power is reduced, as are conduction and switching losses. Compared to the LLC topology, the switching frequency of SR matrix converters is fixed, but higher than the resonant frequency.

Figure 5 An SR-based matrix converter with a single-phase AC input. Source: Texas Instruments

The control algorithm of single-stage matrix converters

In an LLC topology-based onboard charger with a three-phase AC input, switching frequency modulation regulates the charging current or voltage and uses space vector control based on grid polarity. The voltage ripple applied to the resonant tank is small. The resonant tank determines gain variations and affects the converter’s operation.

A DAB or SR DAB-based onboard charger usually adopts triple-phase shift (TPS) control to naturally achieve unity power factor, a wide ZVS range, and low RMS current. Optimizing switching frequencies further reduces both conduction and switching losses.

Figure 6 illustrates pulse width modulation (PWM) waveforms of TPS control of matrix converters for a half AC cycle (for example, Vac > 0). Figure 4 shows where PWMs connect to the power switches: d1 denotes the internal phase shift between PWM1A and PWM4A, d2 denotes the internal phase shift between PWM5A and PWM6A, and d3 denotes the external phase shift between the middle point of d1 and d2. PWM1B and PWM4B are gate drives for the second pair of bidirectional switches.

Figure 6 TPS PWM waveforms for a single-stage matrix converter for a half AC cycle. Source: Texas Instruments

Regardless of the topology selected, matrix converters require bidirectional switches, formed by connecting two GaN or silicon carbide (SiC) switches with a common drain or common source. Bidirectional GaN switches are emerging devices, integrating two GaN devices with common drains and providing bidirectional control with a single device.

Matrix converters

Matrix converters use single-stage power conversion to achieve a unity power factor and DC/DC power conversion. They provide two major advantages in onboard charger applications:

• High power density through the use of single-stage conversion, while eliminating large boost inductors and bulky DC-link electrolytic capacitors.
• High power efficiency through reduced switching and conduction losses, and a single power-conversion stage.

There are still many challenges to overcome to expand the use of single-stage matrix converters to other applications. High ripple current is a concern for batteries that require a low ripple charging current. Matrix converters are also more susceptible to surge conditions given the lack of DC-link capacitors. Overall, however, matrix converters are gaining popularity, especially with the emergence of wide-band-gap switches and advanced control algorithms.

Sean Xu currently works as a system engineer in Texas Instruments’ Power Design Services team to develop power solutions using advanced technologies for automotive applications. Previously, he was a system and application engineer working on digital control solutions for enterprise, data center, and telecom power. He earned a Ph.D. degree from North Dakota State University and a Master’s degree from Beijing University of Technology, respectively.

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The post Power Tips #149: Boosting EV charger efficiency and density with single-stage matrix converters appeared first on EDN.

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has commented on the commercial progress, industry partnerships and solar PV efficiency improvements it achieved in 2025, as the leadership team looks ahead to continued corporate growth in 2026...

An AI-enabled electronic components procurement tool claims to boost OEM productivity by leveraging a software platform that negotiates prices, tracks spending, and monitors savings in real time. It takes your bill-of-materials (BOM) and uploads it to the system while leveraging AI agents to discover form-fit-function compatible parts and more.

ChipHub, founded in 2023, is a components procurement tool that aims to optimize operations and savings for OEMs by addressing the supply chain issues at the system level.

Figure 1 A lack of control on component pricing, availability, and spending matrices makes the supply chain operations challenging. Source: ChipHub

A standard components procurement tool

Envision a procurement platform empowering OEMs to directly engage with suppliers, enhancing control over annual expenditures ranging from millions to billions of dollars. Such a platform streamlines interactions with suppliers, fostering efficient negotiations and monitoring of cost-saving metrics.

A tool that, at a very high level, enables OEMs to negotiate commercial terms directly with suppliers, all on the platform with no emails and spreadsheets. It can support millions of SKUs and thousands of suppliers with four fundamental procurement premises.

1. A scalable platform that facilitates supplier negotiations.
2. It offers risk reduction because the component supplier knows who the end customer is.
3. It employs generative AI to allow technical teams to evaluate devices or specs while extracting information from the datasheet and performing cross-part analysis.
4. It provides record-keeping features to monitor savings for procurement staff.

Enter ChipHub, an AI-driven procurement tool tailored for hardware OEMs. Its agentic system leverages Model Context Protocol (MCP) to enable collaboration between multiple AI agents and humans to deliver the information supply chain professionals need. Features like this help reform component sourcing by offering time and cost efficiencies irrespective of the OEM’s scale.

Next, ChipHub offers the unified marketplace framework (UMF), which helps procurement teams across diverse sectors such as data centers, computing, networking, storage, power, consumer goods, industrial, and automotive. Users can implement UMF in a single day and start monitoring their spending and savings in real time.

Figure 2 The procurement tool enables OEMs to negotiate commercial terms directly with component suppliers and do it right on the platform. Source: ChipHub

Users such as procurement managers use the platform to search specific parts, and the system conducts cross-part analysis to find compatible options, including real-time pricing and inventory data from various ecosystem partners. So, they don’t have to spend hours manually searching for data and building comparison matrices.

The platform uses a system of multiple AI agents, with human oversight, to navigate the supply chain and provide insights into part availability and sourcing options. “We don’t house any parts; we are just enabling supply-based management,” said Aftab Farooqi, founder and CEO of ChipHub.

Do I really know my supply chain? According to Farooqi, that’s the fundamental question for procurement managers. “If they don’t have control and visibility of their supply chain, they could be vulnerable,” he added. He also acknowledged that ChipHub isn’t a solution for all OEMs.

“They could keep doing things the way they are doing,” Farooqi said. “But they can still subscribe to this platform and have it as a validation tool.” For example, OEMs can cross-check the signal integrity analysis of a particular component.

Farooqi added that the platform can also be used by contract manufacturers (CMs) as a key tool for risk reduction because it enables spend tracking and collaboration features on the platform.

Related Content

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• Semiconductor Supply Chain: The Role of Lean & Muda
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• Europe’s Semiconductor Supply Chain Unleashes the Power of Diamond

The post Procurement tool aims to bolster semiconductor supply chain appeared first on EDN.

So I got one of those reflex games for Christmas the toy ones, and it was really fun but way too easy. So decided to make my own after seeing the real ones were over $1000!! Almost all the parts used was shit i had laying around like a old Amazon basics fan base and some scrap pvc so don't judge how it looks or my shitty choice to use a small j box. Also id of done almost everything different if I did it over it was just a prototype but this thing sure is fun as shit and I had a decent time figuring out how to make it all work!! submitted by /u/badtxv [link] [comments]

submitted by /u/MetallSimon [link] [comments]

КПІ — серед провідних університетів світу в предметних рейтингах Times Higher Education 2026 kpi чт, 01/22/2026 - 20:19

submitted by /u/Careful-Rich9823 [link] [comments]

Investment in scale up, manufacturing and supply chains, could lead to significant growth and acceleration for UK companies developing photonic integrated circuits (PICs), according to a new report ‘Unlocking the Future with Photonic Integrated Circuits’ by the UK’s Compound Semiconductor Applications (CSA) Catapult (a not-for-profit center of excellence established by Innovate UK in 2018, specializing in the measurement, characterization, integration and validation of compound semiconductor technology spanning power electronics, advanced packaging, radio frequency and microwave, and photonics applications)...

Microchip Technology has expanded its PolarFire FPGA–based smart embedded video ecosystem to enable low-power, high-bandwidth video connectivity. The offering consists of integrated development stacks that combine hardware evaluation kits, development tools, IP cores, and reference designs to deliver complete video pipelines for medical, industrial, and robotic vision applications. The latest additions include Serial Digital Interface (SDI) receive and transmit IP cores and a quad CoaXPress (CXP) bridge kit.

The ecosystem supports SMPTE-compliant SDI video transport at 1.5G, 3G, 6G, and 12G, along with HDMI-to-SDI and SDI-to-HDMI bridging for 4K and 8K video formats. PolarFire FPGAs enable direct SLVS-EC (up to 5 Gbps per lane) and CoaXPress 2.0 (up to 12.5 Gbps per lane) bridging without third-party IP. The nonvolatile, low-power architecture supports compact, fanless system designs with integrated hardware-based security features.

Native support for Sony SLVS-EC sensors provides an upgrade path for designs impacted by component discontinuations. Development is supported through Microchip’s Libero Design Suite and SmartHLS tools to simplify design workflows and reduce development time.

The following links provide additional information on PolarFire smart embedded vision, the CoaXPress bridge kit, and FPGA solution stacks.

Microchip Technology 

The post PolarFire FPGA ecosystem targets embedded imaging appeared first on EDN.

Infineon’s EZ-USB FX2G3 USB 2.0 peripheral controllers provide DMA data transfers from LVCMOS inputs to USB outputs at speeds of up to 480 Mbps. Designed for USB Hi-Speed host systems, the devices also support Full-Speed (12 Mbps) and Low-Speed (1.5 Mbps) operation.

Built on the company’s MXS40-LP platform, EZ-USB FX2G3 controllers integrate up to six serial communication blocks (SCBs), a crypto accelerator supporting AES, DES, SHA, and RSA algorithms for enhanced security, and a high-bandwidth data subsystem with up to 1024 KB of SRAM for USB data buffering. Additional on-chip memory includes up to 512 KB of flash, 128 KB of SRAM, and 128 KB of ROM.

The family includes four variants, ranging from basic to advanced, all featuring a 100-MHz Arm Cortex-M0+ CPU, while the top-end device adds a 150-MHz Cortex-M4F. The peripheral I/O subsystem accommodates QSPI configurable in single, dual, quad, dual-quad, and octal modes. SCBs can be configured as I2C, UART, or SPI interfaces. The devices provide up to 32 configurable USB endpoints, making them suitable for a wide range of consumer, industrial, and healthcare applications.

EZ-USB FX2G3 controllers are now available in 104-pin, 8×8-mm LGA packages.

EZ-USB FX2G3 product page

Infineon Technologies  

The post Controllers accelerate USB 2.0 throughput appeared first on EDN.

Diodes’ API772x RobustISO series of dual-channel digital isolators protects sensitive components in high-voltage systems. The devices provide reliable, robust isolation for digital control and communication signals in industrial automation, power systems, and data center power supplies.

Comprising six variants, the API772x series meets reinforced and basic isolation requirements across various standards, including VDE, UL, and CQC. The parts have a 5-kVRMS isolation rating for 1 minute per UL 1577 and an 8-kVPK rating per DIN EN IEC 60747-17 (VDE 0884-17). Maximum surge isolation voltage is 12.8 kVPK. According to Diodes’ isolation reliability calculations, the devices achieve a predicted operational lifetime exceeding 40 years, based on a capacitive isolation barrier more than 25 µm thick.

RobustISO digital isolators support a range of transmission protocols at data rates up to 100 Mbps. They feature a minimum common-mode transient immunity of 150 kV/µs, ensuring reliable signal transmission in noisy environments. Operating from a 2.5-V to 5.5-V supply, the devices typically draw 2.1 mA per channel at 100 Mbps. The series offers flexible digital channel-direction configurations and default output levels to accommodate diverse design requirements.

Prices for the API772x devices start at $0.46 each in lots of 1000 units.

RobustISO API772x product page

Diodes

The post Digital isolators enhance signal integrity appeared first on EDN.

A 100-V, 200-A MOSFET from Rohm, the RS7P200BM achieves a wide safe operating area (SOA) in a compact DFN5060-8S (5×6-mm) package. The device safely handles inrush current and overload conditions, ensuring stable operation in hot-swap circuits for AI servers using 48-V power supplies.

The RS7P200BM features RDS(on) of 4.0 mΩ (VGS = 10 V, Ta = 25 °C) while maintaining a wide SOA—7.5 A for a 10‑ms pulse width and 25 A for 1 ms at VDS = 48 V. This combination of low on-resistance and wide SOA, typically a trade-off, helps suppress heat generation. As a result, server power supply efficiency improves, while cooling requirements and overall electricity costs are reduced.

Housed in a DFN5060-8S package, the RS7P200BM enables higher-density mounting than the previous DFN8080-8S design. It is now available in production quantities through online distributors including DigiKey and Mouser.

RS7P200BM product page 

Rohm Semiconductor 

The post MOSFET ensures reliable AI server power appeared first on EDN.

The Tronics AXO315T1 MEMS accelerometer from TDK is designed for oil and gas downhole navigation in extreme environments. It features a ±14‑g input range and a 24‑bit digital SPI interface for measurement-while-drilling (MWD) applications exposed to temperatures up to 175°C.

Powered by a unique closed-loop architecture, this single-axis device achieves a tenfold improvement in vibration rejection compared with conventional open-loop MEMS accelerometers. It offers vibration rejection of 20 µg/g², noise density of 10 µg/√Hz, and a bias residual error of 1.7 mg over a temperature range of –30 °C to +175 °C.

The AXO315T1 provides a cost-effective, digital, and low-SWaP alternative to quartz accelerometers for inclination measurement in directional drilling tools. It is rated for more than 1000 hours of operation at 175°C and is housed in a hermetically sealed, ceramic surface-mount package.

AXO315T1 sensors and evaluation boards are available for sampling and customer trials.

AXO315T1 product page

TDK Tronics 

The post Sensor drives accurate downhole drilling appeared first on EDN.

How does a wiggling groove on a rotating record transform into two-channel sonic excellence? It all starts with the turntable cartridge, mated to one of several possible needle types.

Mid-last year, I confessed that I’d headed back down the analog “vinyl” record rabbit hole after several decades of sole dedication to various digital audio media sources (physical, download and streamed). All three turntables now in my possession employ moving magnet cartridge technology; here’s what I wrote back in July in comparing it against the moving coil alternative:

Two main cartridge options exist: moving magnet and higher-end moving coil. They work similarly, at least in concept: in conjunction with the paired stylus, they transform physical info encoded onto a record via groove variations into electrical signals for eventual reproduction over headphones or a set of speakers. Differences between the two types reflect construction sequence variance of the cartridge’s two primary subsystems—the magnets and coils—and are reflected (additionally influenced by other factors such as cantilever constituent material and design) not only in perceived output quality but also in other cartridge characteristics such as output signal strength and ruggedness.

Miny-but-mighty magnets

And here’s more on moving magnet cartridges from Audio-Technica’s website:

Audio-Technica brand moving magnet-type cartridges carry a pair of small, permanent magnets on their stylus assembly’s cantilever. The cantilever is the tiny suspended “arm” that extends at an angle away from the cartridge body. The cantilever holds the diamond tip that traces the record groove on one end and transfers the vibrations from the tip to the other end where the magnets are located. These tiny magnets are positioned between two sets of fixed coils of wire located inside the cartridge body via pole pieces that extend outward from the coils. This arrangement forms the electromagnetic generator.

The magnets are the heaviest part of the moving assembly, but by mounting the magnets near the fulcrum, or pivot point, of the assembly the amount of mass the stylus is required to move is minimized, allowing it to respond quickly and accurately to the motion created by the record groove. In addition to enhancing response, the low effective tip mass reduces the force applied to the delicate record groove, reducing the possibility of groove wall wear and damage. The moving magnet-type cartridge produces moderate to high output levels, works easily into standard phono inputs on a stereo amplifier or receiver and has a user-replaceable stylus assembly. These cartridges have a robust design, making them an excellent choice for demanding applications such as live DJ, radio broadcasts and archiving.

The associated photo is unfortunately low-res and otherwise blurry:

Here’s a larger, clearer one, which I’d found within a tutorial published by retailer Crutchfield:

Inexpensively assuaging curiosity

Ever since I started dabbling with vinyl again, I’d been curious to take a moving magnet cartridge apart and see what was inside. I got my chance when I found a brand new one, complete with a conical stylus, on sale for $18.04 on eBay. It’s the AT3600L, the standalone version of the cartridge that comes pre-integrated with my Audio-Technica AT-LP60XBT turntable’s tonearm:

Here are some “stock” images of the AT3600L mated to the standard ATN3600LC conical stylus (with the protective plastic sleeve still over the needle):

This next set of shots accompanied the eBay post which had caught my eye (and wallet):

And, last but not least, here are some snaps of our dissection patient, first bagged as initially received:

then unbagged but still encased, and as usual (as well as with photos that follow) accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

along with mounting hardware at the bottom:

and finally, free from plastic captivity:

Conical closups and elliptical unpredictability

Next, let’s pop off the stylus and take a gander at its conical needle tip:

along with the cantilever and pivot assembly:

If you’ve already read my July coverage, you know that I’d also picked up an easily swappable:

elliptical stylus, the Pfanstiehl 4211-DE, which promised enhanced sonic quality:

but ended up being notably less tolerant than its conical sibling of any groove defects. Some of this functional variance, I noted back in July, is inherent to the needles’ structural deviations:

Because conical styli only ride partway down in the record groove, they supposedly don’t capture all the available fidelity potential with pristine records. But that same characteristic turns out to be a good thing with non-pristine records, for which all manner of gunk has accumulated over time in the bottom of the groove. By riding above the dross, the conical needle head doesn’t suffer from its deleterious effects.

But, as it turns out, the Pfanstiehl 4211-DE itself was also partly to “blame”. It reportedly works best with turntables based on the standalone AT3600L cartridge, whose tracking force and antiskating settings are both user-adjustable and lighter than those needed (non-adjustable, as well) with the fully integrated AT-LP60XBT turntable.

I resold the barely used Pfanstiehl 4211-DE on eBay and went with Audio-Technica’s (modestly) more pricey ATN3600LE elliptical stylus instead, which explicitly documented its compatibility with the AT-LP60 turntable series and indeed worked notably better with my setup:

Back to the ATN3600LC conical stylus. Two interior views showcase the magnets called out in the earlier concept image:

And here’s where they mate with the cartridge itself (with associated coils presumably inside, to be seen shortly):

Cartridge dissection

Next, let’s remove the screw that holds the top black plastic mounting assembly in place:

One more look at the connections at the back, with markings now visible:

And now, let’s peel away the metal casing, focusing attention on the top-side seam:

With that, the insides come right out:

That was a fun and informative, not to mention inexpensive, project that satisfied my curiosity. I hope it did the same for you. Sounds off with your thoughts in the comments, please!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

Related Content

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• Mega-cool USB-based turntable
• Assessing vinyl’s resurrection: Differentiation, optimization, and demand maximization

The post Peeking inside a moving magnet phono cartridge and stylii appeared first on EDN.

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