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Metallium Ltd of Subiaco, Western Australia, says that its subsidiary Flash Metals Texas Inc of Houston, TX, USA has completed Phase I of its Small Business Innovation Research (SBIR) contract with the US Department of War (DoW) through the Defense Logistics Agency (DLA)...

Відкрито меморіальну дошку на честь Володимира Бойка kpi ср, 04/08/2026 - 11:14

Аспірант НН ІМЗ Роман Педань: "Працювати з новим завжди цікаво" Інформація КП ср, 04/08/2026 - 09:28

Творчий сад Юрія Богомола Інформація КП ср, 04/08/2026 - 09:00

10eur keyboard from aliexpress, they really wanted to keep the pcb one layer submitted by /u/csln0 [link] [comments]

I’ve always been interested in sensors and their related electronics. These devices are the interface between the real, physical world and the telemechanical systems that make use of their outputs. It’s also fascinating how many basic sensor approaches have been devised and enhanced for basic parameters such as temperature, pressure, distance, light intensity, and more.

Now we are entering a new phase where advances in materials—especially metamaterials, often aided by lasers—are creating breakthrough in sensors that could not be envisioned or implemented just a few years ago.

In short, a metamaterial is an engineered, 2D structure composed of subwavelength-scale elements that precisely control electromagnetic waves, such as light or microwaves, at an interface. The metasurface is an ultra-thin resonant element with special physical properties.

It’s typically composed of sub-wavelength structures (meta-elements) arranged in a 2D plane, enabling control over the propagation and scattering of electromagnetic waves at sub-wavelength scale by adjusting the phase, amplitude, or polarization of the incident waves

A good example of such an innovation is seen in the thermally based photon-detector project at Duke University, where researchers have demonstrated the fastest pyroelectric photodetector to date. It works by absorbing heat generated by incoming light and can capture light from wavelengths across the electromagnetic spectrum. The ultrathin device requires no external power, operates at room temperature, and can be readily integrated into on-chip applications.

Conventional semiconductor photodetectors work by initiating electron flow when struck by visible light. In contrast, the pyroelectric detector approach (also called a thermal detector) generates electric signals when it’s heated up after absorbing light.

Pyroelectric detectors have been in use for decades due to their wideband characteristic, unlike semiconductor sensors that tend to be narrowband devices (which is not necessarily a bad thing, of course). However, these pyroelectric devices are not as responsive as solid-state devices, since they are relatively bulky and have larger thermal mass.

Although using a thermal scheme is normally slow compared to using photons to stimulate electrical current, it does not have to be that way. In the Duke approach, the metasurface-enabled pyroelectric photodetectors are fabricated by layering a well-established nanogap cavity metasurface structure on top of a pyroelectric thin film (Figure 1).

Figure 1 Schematic representation of metasurface-enabled photodetectors illustrating key dimensions (a) with SEM image of the metasurface absorber (b). The red area represents the metasurface array. Finite element simulations of a single plasmonic nanostructure showing a cross-section of the pyroelectric layer 30 ps after resonant excitation of the metasurface (c).

The metallic metasurface consists of an array of nanoscale silver square prisms (90 nm × 90 nm × 35 nm) separated from a gold film by a thin (10 nm) dielectric layer of Al2O3 (aluminum oxide or alumina).

When light strikes the surface of a nanocube, it excites the silver’s electrons, trapping the light’s energy through a phenomenon known as plasmonics (the interaction between electromagnetic radiation such as light and conduction electrons at metallic-dielectric interfaces), but only at a specific frequency controlled by the nanocubes’ sizes and spacings.

In the latest iteration, the light-absorbing metasurface is circular rather than rectangular to maximize its exposure while minimizing the distance the signal must travel. This phenomenon is so efficient at trapping light and absorbing its energy that it only requires an extremely thin layer of pyroelectric material beneath it to create an electric signal.

Measuring the performance is another challenge. So, they devised an innovative arrangement with two distributed-feedback lasers that “brightened” when their frequencies became close to the same as the device’s operating speed.

The nearly perfect, spectrally selective absorption of the metasurface, which initiates the photodetector response, is shown by white light reflectivity spectra (Figure 2).

Figure 2 White light reflectance spectrum of a detector is shown with a 1.3 × 10−3 mm2 active area of 40 μm diameter (a). Photocurrent responsivity spectra of the detector shown in (a) measured upon pulsed 100 nW light excitation as compared to that of a detector in which a gold film rather than a metasurface layer acts as an absorber (b). Photocurrent measured for the device presented in a) and b) upon pulsed 783 nm excitation at the indicated power with the beam size maintained to consistently have a diameter 5 μm smaller than that of the device (c).

The gold mirror alone efficiently reflects near-infrared light, while the metasurface exhibits a relative decrease (>95%) in reflectivity centered at 790 nm. The resonance wavelength is determined by the size of the Ag nanostructures and the thickness of the Al2O3 dielectric layer, as it allows the possibility of photodetectors that are spectrally selective across the visible and infrared portions of the spectrum.

The team found that their new thermal photodetector operates at record-breaking 3-dB bandwidth of 2.8 GHz, which corresponds to a rise time of just 125 picoseconds. Also important, these ultrafast speeds were achieved while maintaining competitive responsivities and noise equivalent power (NEP) as low as 96 pW/√Hz.

This is just one of the many innovative applications in the RF and optical worlds which leverage metamaterials and metasurfaces. Among many other uses, these materials enable new ways to manage and channel electromagnetic energy at these wavelengths, often to create sensors of extraordinary accuracy and precision.

The full details of this work by the Duke University team are in their paper “Metasurface-Enhanced Thermal Photodetector Operating at Gigahertz Frequencies” published in Advanced Functional Materials. While that posted paper is behind a paywall, the Duke team has thoughtfully posted an open-source version at their departmental website here.

Have you seen or used any sensors based on metamaterials or metasurfaces? What sensing challenges would you tackle if you had the needed meta resources?

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The post Metasurface enables supersensitive, superfast thermal-based photodetector appeared first on EDN.

Serial communication remains the backbone of electronic communication in the automotive sector. The cost-effective LIN bus with master-slave architecture and the fast multi-host fieldbus CAN-FD (Controller Area Network) have become established in this field. The great advantage and efficiency of the applications lies in the combination of both bus systems. GÖPEL electronic has now introduced an extension for the SCANFLEX Multi Port Bus I/O Module 9305 for these interfaces, which makes the functional diversity of the SCANFLEX system available for automotive interfaces in production testing.

With the new BAC module for CAN-FD/LIN, these interfaces can now be tested for functionality during production. The Bus Access Cable (BAC) is connected to one of the five slots of the SCANFLEX Multi Port Bus I/O Module 9305 and thus connected to the SCANFLEX system. This enables access to the complex test functions of the SCANFLEX boundary scan controller. The controller then takes over the simultaneous generation and dynamic distribution of the vectors and control sequences to the interfaces.

SCANFLEX is a modular JTAG/boundary scan controller. Based on state-of-the-art multi-core processors and FPGAs, it allows users to execute test and programming technologies from Embedded JTAG Solutions. Its multifunctional architecture enables these technologies to be combined flexibly and with high performance on a single platform. SCANFLEX II has eight independent, truly parallel test access ports (TAP) for up to 100MHz. This enables the synchronized execution of embedded test, debug, and programming operations via boundary scan (IEEE1149.x), processor emulation, chip integrated instruments, or the embedded diagnostics method.

About GÖPEL electronic
GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with 240 employees.

The post Boundary scan in combination with automotive applications for CAN-FD and LIN bus appeared first on ELE Times.

As explained in the E series Wikipedia page: “The E series is a system of preferred numbers (also called preferred values) derived for use in electronic components. It consists of the E3, E6, E12, E24, E48, E96, and E192 series, where the number after the ‘E’ designates the quantity of logarithmic value ‘steps’ per decade. Although it is theoretically possible to produce components of any value, in practice, the need for inventory simplification has led the industry to settle on the E series for  resistors, capacitors, inductors, and zener diodes.”

Wow the engineering world with your unique design: Design Ideas Submission Guide

It’s convenient at times to have a desktop calculator that accepts a computed value x and returns the standard, commercially available value closest to it for a specified E series. Here, “closest” means that candidate value for which the absolute value of the computed error (candidate/x – 1) is the smallest.

The following GitHub link:

• https://github.com/Christopherrpaul/E-series-Calculator

hosts the files needed to create the desktop icon, which calls the application, both of which are shown in Figure 1. It also contains a README file, which details how to install the files on a Windows PC, and a User Manual.

Figure 1 The desktop icon that calls the application, which is also shown. The E3 series has been selected, and a computed value of 56 has been entered. The closest E3 series value of 47 is apparent, along with the calculated error of the selected candidate.

Selecting a different series will automatically calculate and present the nearest value and its error for that series. Pressing the <Enter> key in the Enter Value box will clear the entry so that a new one can be checked. The Enter Value numeric sequence may be followed by an exponent (e6, E-2, etc.). A single alpha character (for instance, M, k, n, or others) also may be appended. Neither is necessary, but the format of the Nearest E value will always follow that of the Enter value.

Although not needed often, this is convenient to have around with the touch of a Desktop icon. Move it elsewhere if the Desktop is not your preferred location.

Christopher Paul has worked in various engineering positions in the communications industry for over 40 years.

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The post A convenient desktop-accessible calculator of E-series component values appeared first on EDN.

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) visible laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology for quantum, defence and biotech markets — has entered a AUS$1.3m strategic collaboration with a “Fortune 500 global mass-capacity data storage leader”...

Конференція Tech360: Policy Meets Technology kpi вт, 04/07/2026 - 12:37

Почесною відзнакою Вченої ради університету нагороджено Олександра Мохунька kpi вт, 04/07/2026 - 12:23

ACM Research Inc of Fremont, CA, USA — which develops and manufactures processing equipment for semiconductor device and wafer- and panel-level packaging (WLP) applications — has announced a new branding and organization of its product portfolio into a unified, process-based structure, referred to as the ACM Planetary Family...

IVWorks Co Ltd of Daejeon, South Korea – which was founded in 2011 and manufactures 100–200mm gallium nitride (GaN) epitaxial wafers for RF & power electronics applications – is accelerating its expansion into the GaN semiconductor market through its proprietary reGaN technology while continuing to expand its core epiwafer business across multiple advanced device platforms. Leveraging its epitaxy expertise, the firm is positioning itself as a solution provider for next-generation RF and power semiconductor applications, including aluminium nitride (AlN) high-electron-mobility transistors (HEMTs) on silicon carbide (SiC), GaN HEMT on silicon, and vertical GaN epiwafers...

Someone's gonna start a fire building one of these. submitted by /u/ThomasTTEe2 [link] [comments]

🏓 Спортивні секції для студентів kpi пн, 04/06/2026 - 21:51

it will be used to control 5 motors from a raspberry pi as well as sense a voltage drop across the resistor for current sensing and motor stall detection using an arduino nano as an ADC. It will be used to actuate fingers in a prosthetic hand for a uni project! less submitted by /u/Z3temis [link] [comments]

It may not support the latest-and-greatest cellular data tech. But in a pinch, it’ll cost-effectively still do the Internet-access trick.

In one of last month’s posts, covering cellular hotspots for maintaining broadband connectivity when premises power goes down, as well as when you’re on the road, I wrote:

Last January I’d purchased on sale from Amazon two NETGEAR LM1200 cellular broadband modems, one for teardown-to-come and the other for precisely the scenario—premises power-loss connectivity backup—that I experienced in mid-December. They aren’t as-is usable [unless you only need to have one wired-connected device online, that is], requiring tether to a router. But I have plenty of those in inventory. And had we stuck around the home more than one night I probably would have pressed the modem-plus-router combo into service, fueled by a portable power unit. But another limitation, bandwidth, was the same one that already soured me on the Surface Pro X’s integrated modem (along in the ones in my Intel-based Surface Pros, for that matter). The LM1200 “only” supports 4G LTE, which is likely why I bought them (on closeout, I suspect) for only $19.99 each a year-plus back, versus the original $49.99 MSRP.

Today, I’ll be actualizing my year-plus back teardown aspiration, as usual beginning with some outer box shots…as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Flip up the top flap:

and the first things you’ll see are our patient, underneath two slips of paper (also found here in PDF form, along with a fuller user manual). Below them:

are two cables, one for power and the other for data connectivity, along with a power adapter:

Last things first; the AC-to-DC adapter, with a USB-A output (with only notable sides shown):

and the two cables:

Now for our patient:

TS-9 connectors (plus other interesting things, such as the nano SIM slot) ‘round back, the same as with the high-end NETGEAR MR6110 cellular hotspot I showcased a month back:

and as before intended for tethering the cellular modem to an optional external antenna:

Onward:

Note the passive ventilation abundance underneath; a curious choice, given that heat rises, not sinks (and don’t get me started on the confusion inherent to the term “heatsink”), but better than nothing, I guess:

A closeup of the label reveals, among other things, the all-important FCC ID (PY320300503):

60 FCC certification record entry results. That’s a new record, at least for me!

Rubberized feet tend to hide (albeit not always, mind you) screw heads, providing pathways inside:

The typical presence pans out once again in this instance:

And we’re in. The top and bottom chassis pieces both detach:

leaving behind the PCB, along with chassis remnants around the periphery:

which also separate straightaway, this time with no additional screws to mess with:

Let’s start with the top of the PCB:

Dominating the landscape is a Quectel EC25-AF PCIe LTE Cat 4 module, rotated 180° in this photo so you can discern the topside printing right-side-up:

Below it are the four status LEDs whose illumination ends up shining out the holes at the top of the device. And above it are two Youth Electronics GS12401C LAN transformers, one each for the cellular modem’s LAN and WAN ports.

Next, those two long-and-skinny shiny metal pieces, one on each side of the PCB:

They’re, you’ve probably already guessed, the 4G cellular antennae.

Now for the other (bottom) side of the PCB:

Faraday Cages. Regular readers already know what comes next:

Nothing terribly exciting here, that is unless you’re an RF engineer:

How about the larger one?

Another 4R7 (4.7 microhenry) inductor. Plus, a Qualcomm Atheros QCA8334 four-port Gbit Ethernet switch IC, only two ports’ worth of resources which are presumably in use (for the aforementioned LAN and WAN backside ports). And scattered about the remainder of this PCB side’s real estate are clusters of test points, passives, discretes and other diminutive doodads.

And there we are! After this writeup is published and I answer any lingering reader questions, I’ll pop the Faraday Cage tops back on, reassemble the surrounding chassis and see if it still works. And speaking of questions, please do sound off with your thoughts in the comments!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN Magazine.

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• The Microsoft Surface Pro X: Windows without the x(86)
• Surface Pro upgrade offers more memory plus LTE connectivity

The post Netgear’s LM1200: A 4G LTE modem, modestly funded appeared first on EDN.

🎉 День відкритих дверей КПІ Open Day kpi пн, 04/06/2026 - 10:22

КПІ поглиблює співпрацю з ENSTA KPI4U-2 пн, 04/06/2026 - 10:00

submitted by /u/antthatisverycool [link] [comments]