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National, 24th April 2026: As data centers and 5G networks become the backbone of AI-driven innovation and digital transformation, the need for precise, resilient timing solutions has never been more critical. Timing is not just a technical requirement, but rather a strategic enabler for high-performance, scalable infrastructure. Microchip Technology (Nasdaq: MCHP) today announces its MD-990-0011-B family of plug-in timing modules, delivering turnkey, high-precision synchronization for data center servers and 5G virtualized Radio Access Networks (vRAN).

Developed in collaboration with Intel, the MD-990-0011-B timing module is designed for seamless compatibility with Intel® Xeon® 6 SoC-powered server platforms, supporting both OEMs and ODMs in building future-ready systems. By leveraging Intel’s foundational vRAN architecture, the module enables robust, low-latency time synchronization, which is essential for distributed AI workloads and real-time applications.

Engineered for the reliability and scalability required by cloud infrastructure, virtualization, and high-availability deployments, the MD-990-0011-B supports automatic source selection and locking across Global Navigation Satellite Systems (GNSS), Synchronous Ethernet (SyncE), and Precision Time Protocol (PTP). This flexibility supports continuous, accurate timing even as network demands evolve.

“Timing is the invisible force that guides the world’s most transformative technologies. With the MD-990-0011-B timing modules, Microchip enables designers to address timing requirements proactively, whether at the outset or during upgrades,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit. “Our plug-in solution eliminates the complexity of custom timing circuits, providing integration and reliability, accelerating innovation and reducing time-to-market for data centers and 5G networks.”

“Microchip’s MD-990-0011-B Timing Module aligns with Intel’s commitment to enable next-generation infrastructure by providing scalable, high-performance platforms that are ready for the demands of 5G, AI and cloud computing,” said Mike Merluzzi, GM of radio access networks at Intel Corporation. “By simplifying timing integration and enhancing reliability on Intel Xeon 6 SoC-powered platforms, we’re helping customers accelerate innovation and deployment.”

Delivering exceptional precision in time and frequency accuracy, along with robust holdover capabilities, the MD-990-0011-B timing modules are available in two variants. The MD-990-0011-BC01 offers 8 hours of holdover performance, while the MD-990-0011-BA01 offers 4 hours of holdover performance. These timing modules consolidate several of Microchip’s advanced technologies into a single, highly integrated solution. Key components include:

• Synchronous Ethernet (SyncE) Synthesizer (ZL80132B): Features two independent Digital Phase-Locked Loop (DPLL) channels for flexible and resilient synchronization
• Oven Controlled Crystal Oscillators (OCXOs, OX-22x): Engineered to provide up to 8 hours of holdover, ensuring stable timing during GNSS outages or network disruptions
• MCP9808 Temperature Sensor supporting enhanced environmental monitoring, 24LC024 EEPROM implementing board configuration, and VC-820 for low jitter performance

• Application image: www.flickr.com/photos/microchiptechnology/55091198450/sizes/l

The post New Plug-In Timing Module Delivers Precise, Reliable Synchronization for Data Centers and 5G Networks to Meet the Demands of AI and Next-Generation Connectivity appeared first on ELE Times.

As industrial environments rapidly evolve with the integration of operational technology (OT) and information technology (IT), the demand for seamless connectivity and reliable power delivery has never been higher. The proliferation of smart devices, such as sensors, controllers, cameras and robotic arms, has made data indispensable to modern factories and process industries.

To meet the increased demand, more industrial IoT (IIoT) device manufacturers are turning to Power over Ethernet (PoE) as a preferred solution, leveraging its unique ability to deliver both power and data over a single cable. This convergence is enabling smarter, more flexible and efficient industrial operations, while simplifying deployment and maintenance for end users.

Figure 1 Industrial environments are increasingly integrating operational and information technologies. Source: Microchip

What’s Power over Ethernet (PoE)?

Power over Ethernet (PoE) is a technology that allows electrical power and data to be transmitted simultaneously over standard Ethernet cabling. It was first introduced by PowerDsine in 1998; the company was later acquired by Microchip Technology. The Institute of Electrical and Electronic Engineers (IEEE) introduced the first IEEE 802.3af standard in 2003.

PoE was initially developed to power devices like IP phones and wireless access points without the need for separate power supplies. Since then, PoE standards have evolved to include IEEE 802.3 af/at/bt supporting higher power levels and a broader range of devices, making it a cornerstone technology for modern networking encompassing industrial automation and IIoT deployments.

Why IIoT manufacturers are turning to PoE

For IIoT device manufacturers, PoE offers a host of compelling benefits. PoE simplifies deployment by combining power and data in a single cable, eliminating the need for separate electrical wiring and reducing installation complexity and cost. It enables flexible placement of devices, allowing installation in remote, hard-to-reach, or hazardous locations where traditional power sources may be unavailable or cost-prohibitive.

PoE also supports unified network architecture, streamlining network design and making it easier to scale and adapt to changing operational needs. Reliability and compliance are enhanced, as standards-based PoE delivers safe, low-voltage DC power, supporting regulatory compliance and minimizing electrical hazards.

Additionally, offering PoE-powered devices can provide manufacturers with a competitive advantage in a crowded market by delivering a more convenient, integrated solution to customers.

Overcoming PoE deployment challenges in industrial settings

Despite its advantages, deploying PoE in industrial environments is not without challenges. One of the primary obstacles is the limited availability of PoE-enabled network infrastructure. Many existing industrial networks lack PoE switches, and even when available, these switches may not provide sufficient power on every port to support all connected devices.

The cost and complexity of upgrading network infrastructure can be prohibitive, especially in legacy facilities. Other challenges include limited access to power, as not all areas of a factory or plant have easy access to network cabling or power outlets, making device placement difficult. The high cost of power delivery can also be a concern, as retrofitting facilities to support PoE can be expensive and disruptive.

Compatibility concerns must be addressed to ensure that PoE-powered devices work seamlessly with existing network equipment, avoiding downtime and support issues. Finally, scalability is a challenge, as the number of connected devices grows, so does the demand for reliable, scalable power solutions.

Introducing PoE midspans: Supplementing network power

To address the challenge of limited PoE-enabled infrastructure, many industrial facilities are turning to PoE midspans, also known as injectors, to supplement network power where it does not exist. A PoE injector is a device that sits between an Ethernet port that is not supplying PoE and the powered device, injecting power into the Ethernet cable so that both data and power are delivered to the endpoint.

This approach allows manufacturers and customers to deploy PoE-powered IIoT devices without the need to replace existing switches or overhaul network architecture, making it a cost-effective and scalable solution for expanding PoE coverage in industrial environments.

Figure 2 PoE midspans inject power into the Ethernet cable. Source: Microchip

PoE industrial injectors vs. standard indoor injectors

While standard indoor PoE injectors are suitable for office or commercial settings, industrial environments demand more robust solutions. PoE industrial injectors are specifically designed to withstand the harsh conditions often found in factories, processing plants, and outdoor installations.

These injectors feature ruggedized construction, enabling reliable operation in environments with extreme temperatures, humidity, dust, and vibration. They support an extended temperature range, ensuring consistent performance in both hot and cold conditions.

Enhanced safety and compliance are also critical, as industrial injectors meet stringent safety and regulatory standards, providing low-voltage, standards-compliant DC power that minimizes electrical hazards. Industrial PoE injectors support higher power levels—such as IEEE 802.3bt up to 90 W—to accommodate demanding devices and are designed with robust surge protection, which is essential in industrial environments where electrical surges from machinery or harsh conditions are more common.

Flexible mounting options, such as DIN rail, wall, or rack installations, accommodate diverse deployment scenarios. Reliability and longevity are ensured through components and enclosures designed for continuous operation, providing long-term durability and minimal maintenance. These features are essential for maintaining uptime, safety, and performance in industrial settings, where environmental challenges and operational demands are far greater than in typical office environments.

Figure 3 Here is a visual comparison between standard indoor midspan (above) and industrial midspan (below). Source: Microchip

What to look for in a PoE solution provider

For IIoT device manufacturers and customers deploying PoE-powered devices, selecting the right PoE solution provider is critical. Proven compatibility is essential; the provider’s injectors should be tested and validated for seamless operation with a wide range of industrial devices, reducing the risk of downtime and support issues.

Flexible power options are important, with support for various power levels and device types to meet diverse application needs. Reliability and compliance should be prioritized, ensuring solutions meet industry standards for safety and performance, supporting regulatory requirements and minimizing risk.

Ease of installation is also key, with plug-and-play solutions that leverage existing Ethernet cabling to simplify deployment and reduce installation time. Rugged design is necessary for industrial-grade injectors, offering robust construction and extended temperature ranges for reliable operation in challenging environments.

Finally, strong technical support and post-sale service from the provider can help resolve compatibility issues and ensure long-term satisfaction. By prioritizing these features, manufacturers and customers can ensure successful, scalable, and reliable PoE deployments in industrial environments, unlocking the full potential of smart IIoT devices.

Alan Jay Zwiren is senior marketing manager of Microchip Technology’s Networking and Connectivity Business Unit.

Special Section: Smart Factory

• Rethinking machine vision in industrial automation

The post Smart factory: The rise of PoE in industrial environments appeared first on EDN.

Cirrus Logic has launched the CS82L4x series of analog front-end (AFE) chips for CIS and CCD sensors in scanners and industrial imaging platforms. Based on a redesigned SAR ADC architecture, the devices are said to offer faster scan times and enhanced efficiency, while an integrated RGB LED driver reduces design complexity.

The CS82L41, CS82L44, and CS82L46 provide one, four, and six channels, respectively, with a conversion rate of 24 Msamples/s per channel. With 16-bit resolution, the AFE ICs convert LED reflections from scanned objects into accurate digital representations. Per-channel signal conditioning includes reset level clamping, correlated double sampling, and programmable polarity, gain, and offset adjustment.

Operating from a 3.3-V supply, the CS82L4x series provides a scalable platform for multi-lens and multichannel scanning architectures across a range of imaging systems. The CS82L41 features an SPI control interface with CMOS output. The CS82L44 and CS82L46 offer SPI or I²C control interfaces, CMOS or LVDS outputs, and integrated sensor timing generation. All devices operate over a temperature range of −40°C to +85°C and come in QFN packages.

Samples are available now from Cirrus.

CS82L41 product page

CS82L44 product page

CS82L46 product page

Cirrus Logic 

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Power inductors in Vishay’s IHLP1212-EZ-1Z series come in low-profile 1212-size packages suited for space-constrained commercial applications. With a 3×3-mm footprint and profile options of 1.2 mm, 1.5 mm, and 2.0 mm, their electrical performance is comparable to larger devices.

The series includes 24 devices with typical DC resistance from 8.6 mΩ to 50.4 mΩ and inductance values from 0.22 µH to 3.3 µH. Rated saturation current reaches 14.3 A, while heating current extends to 11.1 A. Operating over a temperature range of −55°C to +125°C, the inductors are designed to handle high transient spikes without saturation.

IHLP1212-EZ-1Z inductors feature a powdered iron body that completely encapsulates the windings, eliminating air gaps and providing magnetic shielding to reduce crosstalk with nearby components. Their composite construction also offers strong resistance to thermal shock, moisture, and mechanical stress.

Designed for low-profile DC/DC converters, the inductors enable energy storage, noise suppression, and filtering across industrial, consumer, telecom, and medical applications. Samples and production quantities are available with lead times of 10 weeks.

IHLP1212-EZ-1Z product page

Vishay Intertechnology 

The post Compact inductors meet tight layout demands appeared first on EDN.

A software option for Rohde & Schwarz vector signal generators supports Pulsar signal simulation testing in production settings. Pulsar is Xona Space Systems’ planned LEO satellite constellation for high-precision positioning, navigation, and timing (PNT) services. R&S SMBV100B and SMW200A generators equipped with the software allow engineers and manufacturers to test receiver compatibility as the constellation enters scaled deployment.

“Pulsar is designed to upgrade the global navigation infrastructure while remaining compatible with GNSS devices already in use today,” said Bryan Chan, co-founder and VP of strategy at Xona Space Systems. “Test and measurement solutions play an important role in enabling device manufacturers to evaluate compatibility as new signals become available. Rohde & Schwarz brings deep expertise in precision signal generation that helps make this possible.”

The SMBV100B and SMW200A vector signal generators will soon join Pulsar’s verified ecosystem program, which recognizes devices and test systems validated for compatibility with Pulsar signals.

Rohde & Schwarz 

The post Signal generators enable Pulsar signal testing appeared first on EDN.

Intel has introduced its Core Series 3 mobile processors targeting budget laptops and essential edge devices. Built on the same 18A process node as the Core Ultra Series 3 platform, they are described as the first “hybrid AI-ready” Core series processors, supporting AI workloads up to 40 TOPS at the platform level.

The processor lineup includes seven variants, one without an NPU. Compared with five-year-old PCs, Core Series 3 delivers up to 47% higher single-thread performance and 2.8× higher GPU-based AI performance, based on Intel’s internal benchmarks. Beyond laptops, it brings these gains to edge deployments such as robotics, smart buildings, POS terminals, and smart metering.

According to Intel, Core Series 3 is designed for all-day battery life, with up to 64% lower processor power consumption. The devices support high-speed connectivity, including up to two Thunderbolt 4 ports, Wi-Fi 7 (R2), and Bluetooth 6. They also support up to 48 GB of LPDDR5X memory at 7467 MT/s or up to 64 GB of DDR5 memory at 6400 MT/s.

Core Series 3-based consumer and commercial systems will be available from OEM partners starting April 2026, with edge systems following in Q2 2026. An in-depth overview of Core Series 3 is available here. 

Core Series 3 product page 

Intel

The post Core Series 3 scales AI to entry PCs, edge appeared first on EDN.

Anker Innovations has developed an AI audio chip for earbuds, called Thus, that uses NOR flash memory for compute-in-memory (CIM) processing. This approach supports several million model parameters across multiple workloads and delivers up to 150× more AI computing power for environmental noise cancellation compared with Anker’s previous flagship earphones.

NOR flash-based CIM reduces the required silicon footprint to about one-sixth that of SRAM-based alternatives, making it better suited for highly constrained consumer devices. Anker will integrate Thus into its upcoming Soundcore true wireless earbuds. The company also plans to bring neural-network AI to additional consumer devices, including mobile accessories and IoT devices.

The AI processor’s first disclosed feature, Clear Calls, improves voice clarity on calls by isolating the speaker’s voice from background noise. Unlike conventional environmental noise cancellation, which can struggle in loud environments, it uses an on-device neural network supported by eight MEMS microphones and two bone conduction sensors to separate speech from ambient sound. The result is clearer calls in challenging environments such as airports, bars, and busy streets.

Full product details will be announced at Anker Day on May 21, 2026, in New York.

Anker Innovations

The post Anker brings on-device AI to earbuds appeared first on EDN.

Circuits such as the design described here implement useful tools for a diversity of calibration and testing applications.

A two-wire loop current generator is a useful tool for the testing, calibration and commissioning of current-to-pressure (I/P) converters connected with control valves, actuators, etc. in process industries. Such product can also help calibrate the analog input modules of distributed control systems (DCSs) and programmable logic controllers (PLCs) by simulating process signals.

Wow the engineering world with your unique design: Design Ideas Submission Guide

In these and other applications, it is advantageous to generate a loop current which is linearly variable for precisely setting the desired current. A Design Idea published in EDN’s December 10, 2025 issue, although compact and otherwise excellent, does not support linearly variable current, since the output current relationship is Io=1.24/R1. R1 is adjusted to vary the output current, but since it is in the denominator of the equation, the resultant current variation is not linear.

Figure 1 describes a circuit where the variation of loop current is linear. Here, the loop current is directly proportional to the voltage set by potentiometer RV1. Moreover, this current can service a source or sink load up to 500 ohms without need for recalibration. These two requirements are essential for a loop current generator in process industries.

Figure 1 With this linearly adjustable two-wire current source, RV1 is adjusted to set the current, and either LOAD1 (source) or LOAD2 (sink) can be connected.

How does the circuit work? First connect a 24V DC supply, a DC ammeter and a load resistor—say, 200 ohms—at the source or sink side. In field applications, this portion is built into the I/P converter, DCS or PLC.

Two currents exist at pin 3 of U1A :

• I span=Vset/R5
• Through R4=(Io*R6)/(R4+R6)

The first current minus the second current = 0, as U1A is an operational amplifier.

Io is the loop current. Hence Vset/R5= (Io*R6)/(R4+R6). After rearranging, Io= (Vset/R5) * (1+R4/R6). Substituting the values, R4/R6= 99. Hence, Io= (Vset/R5)*100.

Thus, Io is directly proportional to Vset which is adjustable linearly by RV1. A multiturn potentiometer selected for RV1 will enable smooth and precise adjustment.

Other comments, in closing:

• U3 generates 5V DC.
• Q1 and U1A adjust the loop current Io proportional to Vset.
• R1 and Q2 set the current limit for Io at approximately 30 mA for safety reasons.
• The loop current is settable from 0.5 mA to 23.5 mA, which is sufficient for this application.
• For different current settings, select R3, R2 and R5 as per the equation given earlier for Io.
• And Q1 requires a heat sink.

Jayapal Ramalingam has over three decades of experience in designing electronics systems for power & process industries and is presently a freelance automation consultant.

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The post Linearly variable two-wire loop current generator appeared first on EDN.

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers.

The post The system architect’s sketchbook: The pickleball protocol appeared first on EDN.

The traditional ASIC design model—focusing on relatively stable standards and well-defined functions—is now under pressure. That’s partly because AI workloads are highly diverse, compute-intensive, and tightly coupled to software behavior and system context. Consequently, ASICs, besides being application-specific, are now increasingly becoming system-specific.

Take the case of a custom chip for LLM inference, where the prefill and decode stages are now running on separate chips. So, there are two ASICs instead of one: the compute-intensive part of the application (prefill) and the memory-bandwidth-limited part of the application (decode). That shows how ASICs are increasingly becoming modular and disaggregated with cross-domain collaboration spanning architecture, packaging, and manufacturing.

Read the full article at EDN’s sister publication, EE Times.

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