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HENSOLDT of Taufkirchen near Munich, Germany (which develops sensor solutions, electronics and software for the air, land, sea, cyber and space domains) has signed a long-term supply agreement with United Monolithic Semiconductors GmbH (UMS, which designs and produces RF and millimeter-wave components and ICs at its facilities in Villebon sur Yvette, France and Ulm, Germany). By 2030, UMS will supply a total of 900,000 gallium nitride components for HENSOLDT radars...

The University of Warwick has secured new funding to boost the UK’s ability to test the reliability of advanced semiconductors used in electric vehicles, renewable energy, and other critical technologies...

Партнерство із юридичною компанією «Мережа Права» kpi пт, 03/20/2026 - 10:12

The UK Semiconductor Centre (UKSC) has welcomed a new £6.6m investment from the UK Government Department for Science, Innovation and Technology (DSIT) to bolster the county’e core strengths in semiconductor innovation...

Blue Moon Metals Inc of Toronto, ON, Canada has agreed to acquire the Gage Project in Washington County, Southern Utah, USA, from a subsidiary of Liberty Gold Corp in exchange for 420,935 common shares of Blue Moon and a 2.0% net smelter return royalty (NSR) on certain concessions...

The post Microchip Announces New BZPACK mSiC Power Modules with HV-H3TRB Reliability Standards appeared first on ELE Times.

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Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has released its Phase 18 Reliability Report, providing new insights into eGaN device reliability. ..

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has entered into separate, privately negotiated subscription agreements with investors pursuant to which it will place (i) $379m of its 3.5% convertible 1.5 lien senior secured notes due 2031 and (ii) 3,250,030 shares of common stock at a purchase price of $18.458 per share, and pre-funded warrants to purchase up to 2,000,000 shares of common stock at a price of $18.448 per pre-funded warrant. The issuance and sale of the notes, shares and fre-Funded warrants is expected to settle on 26 March, subject to customary closing conditions. Funds managed by new and existing investors participated in these private placements...

A DC/DC power delivery board from Navitas Semiconductor enables direct conversion from 800 V to 6 V in a single stage. Showcased at NVIDIA GTC 2026, the design eliminates the conventional 48-V intermediate bus converter stage within compute server trays, simplifying power delivery for NVIDIA AI infrastructure.

Using GaNFast power ICs, the board reaches 96.5% peak efficiency at full load with 1-MHz switching and a power density of 2.1 kW/in³. The primary side integrates sixteen 650-V GaNFast FETs in DFN 8×8 packages with dual-side cooling in a stacked full-bridge topology, while center-tapped outputs use 25-V silicon MOSFETs. High-frequency switching enables smaller passives and planar magnetics, increasing power density.

The Navitas power delivery board is about 20% thinner than a mobile phone. Its ultra-low profile allows close placement to the GPU board, minimizing loop inductance to improve transient response and power distribution efficiency.

For more information, contact a Navitas representative or email info@navitassemi.com. A timeline for availability was not provided at the time of this announcement.

Navitas Semiconductor 

The post Single-stage design removes 48-V bus in servers appeared first on EDN.

The ST64UWB family of ultra-wideband SoCs from ST provides increased range and processing capability for automotive applications. Backward compatible with IEEE 802.15.4z, the chips also support the emerging IEEE 802.15.4ab UWB standard, enabling device localization and tracking at distances of several hundred meters. Target use cases include hands-free digital keys and high-accuracy vehicle localization.

Enhancements such as multi-millisecond ranging (MMS) and narrow-band assistance (NBA) provide greater operating range and improve link robustness, particularly for devices carried in bags or rear pockets. These features also facilitate close-range direction finding for more accurate interpretation of user position and movement. In addition, IEEE 802.15.4ab strengthens radar mode for more reliable in-vehicle child presence detection.

The ST64UWAB-A100 and ST64UWB-A500 are built on an 18-nm FD-SOI process, increasing link budget by nearly 3 dB versus bulk technologies and boosting range by up to ~50% beyond IEEE 802.15.4ab. Both devices integrate an Arm Cortex-M85 core, while the ST64UWB-A500 adds AI acceleration and DSP capabilities for edge AI-based radar applications. A third device, the ST64UWB-C100, expands the lineup to cover industrial and consumer applications.

The devices are now sampling to leading Tier 1 suppliers and OEMs.

ST64UWB product page 

STMicroelectronics

The post UWB SoCs extend ranging and radar performance appeared first on EDN.

Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters, hyperscale data centers, and cloud infrastructure. Compliant with CEI‑224G‑Linear and LPO‑MSA, they support half-retimed (LRO), linear pluggable (LPO), next‑gen (XPO), near‑packaged (NPO), and co‑packaged (CPO) optics.

The 224G TIA family—GN1834L, GN1834DL, and GN1838DL—offers quad- and octal-channel architectures with flexible layouts. On-chip equalization, high linearity, and low noise boost signal integrity for LPO and next-generation linear optics.

The 224G Mach-Zehnder Modulator (MZM) drivers—quad GN1877 and octal GN1887—support SiPho, InP MZM, and TFLN optical transmitters with tunable gain and output swing. A CEI‑224G‑Linear host-side equalizer covers a wide range of host interfaces, from compact NPO/CPO to varied LRO/LPO/XPO trace lengths.

Both the TIA and driver series integrate real-time link monitoring and telemetry, enabling proactive diagnostics to reduce link flapping and improve network reliability.

The GN1834L, GN1834DL, and GN1887 are available now; GN1838DL and GN1877 are expected in April 2026.

For more information, visit Semtech’s optical page.

Semtech

The post 224G ICs optimize signal integrity in linear optics appeared first on EDN.

AOS has introduced two MOSFETs—the 25‑V AONC40212 and 80‑V AONC68816—in 3.3×3.3‑mm source-down DFN packages with double-side cooling. This packaging supports high power density in DC/DC intermediate bus converters and meets the strict thermal demands of AI servers and data centers.

The MOSFETs use an optimized top-clip design on the exposed drain, enabling double-sided thermal transfer to remove heat efficiently. Compared with single-sided devices, this approach reduces thermal stress and heat buildup. The large top clip achieves a low maximum thermal resistance of 0.9 °C/W, enhancing thermal performance in demanding applications.

The AONC40202 and AONC68816 MOSFETs support continuous drain currents of 405 A and 119 A, respectively, at 25 °C, with pulsed currents up to 644 A and 476 A. The devices have maximum on-resistances of 0.7 mΩ for the 25-V part and 4.7 mΩ for the 80-V part, while maintaining junction temperatures up to 175 °C. Bottom-side thermal resistance is 1.1 °C/W for both devices.

Available now with a lead time of 14–16 weeks, the AONC40202 and AONC68816 cost $1.85 and $1.95 each in lots of 1000 units.

Alpha & Omega Semiconductor 

The post Double-side cooled MOSFETs reduce server heat appeared first on EDN.

Infineon’s XDPE1E multiphase PWM buck controllers and TDA49720/12/06 PMBus POL buck regulators streamline voltage regulation in AI data centers, helping customers boost compute performance per rack. With digital control and telemetry-enabled point-of-load regulation, these devices reduce design cycles and accelerate platform bring-up.

Designed for multiprocessor AI platforms and advanced VR inductor topologies, the XDPE1E3G6A and XDPE1E496A digital 3- and 4-loop buck controllers feature configurable phase allocation and fully programmable phase firing order. They support multiple protocols, including PMBus, AVSBus, SVID, and SVI3, ensuring compatibility across processor ecosystems. Digital control features and integrated tools help manage dynamic AI loads, reduce bench time, and improve system robustness.

The TDA49720/12/06 integrated POL buck regulators deliver 6-A, 12-A, and 20-A outputs in 3×3 mm and 3×3.5 mm packages. PMBus telemetry enables reliability monitoring and system optimization, while a proprietary valley current mode constant-on-time control ensures fast transient response, cycle-by-cycle current limiting, and all-MLCC output capacitance compatibility.

More information can be found on Infineon’s digital multiphase controller page and POL voltage regulator page. A timeline for availability was not provided at the time of this announcement.

Infineon Technologies 

The post Buck ICs improve AI data center power appeared first on EDN.

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has partnered with US government relations, corporate advisory and public affairs firm Michael Best Strategies to enhance engagement with key decision makers within the Department of War (DoW) and Department of Energy (DoE)...

A cellular data service upgrade prompts new (to this engineer, at least) hardware acquisitions: three models’ worth, four total devices. Smart or superfluous? Read on and decide for yourselves.

When our power went down on December 17, our broadband WAN connection and LAN still remained up for several hours, thanks to our sizeable UPS battery set fueling essential network gear, along with the NUT-controlled auto-shutdown of the multiple power-hungry HDD-based NASs also UPS-tethered. But eventually, the batteries were depleted, Comcast-supplied Ethernet and Wi-Fi both dropped, and we needed to turn to other Internet-access options.

My wife has unlimited data on her Verizon 5G cellular phone account, along with hotspot support (the latter capped at 200 GB max per month, but which my legacy unlimited AT&T 4G LTE cellular phone plan completely lacks). And her service plan is also shared among multiple devices, including several iPads. So that was one option.

AT&T longevity (and stinginess)

I’ve also long (since November 2009, I realized in perusing my email archive while writing this) had a dedicated AT&T data plan, with the associated SIM nowadays normally (at least until recently, that is) plugged into my archaic Microsoft Surface Pro X hybrid tablet/computer:

This plan, originally $29.99/month, increased by $5/month beginning in February 2016. More recently, another change arrived. My original DataConnect plan was 4G LTE-based and unlimited from a data usage standpoint. But in March 2023, AT&T converted me to a 5G successor plan, with the second month of service free and $20/month off the normal $55/month price beyond that point (both perks per my legacy customer status). That said, it was no longer unlimited; the base rate included only 50 GBytes of data use per month. Sufficient in a pinch, although not for ongoing daily usage; we average well beyond a half TByte of aggregate data payload per month on Comcast.

When the network went down, I therefore also grabbed and booted up the Surface Pro X, figuring that I’d spread out the household data usage across the multiple cellular services we were already paying for. To my surprise and dismay, however, the usual cellular data connection option in Windows 11’s network settings was missing. And when I dove into Device Manager, I learned why; “This device cannot start”, whatever that meant:

Microsoft strikes again

I tried uninstalling the relevant driver, then rebooting so that Windows would auto-reinstall it. I also tried searching for an updated version of the driver. No dice; nothing I tried worked. I was pissed, turning to Reddit to vent and seek other suggestions. What I’d already learned there was that the Windows 11 2H25 update had dropped support for legacy Arm processors, including the SQ1 (a Microsoft-branded Qualcomm Snapdragon 8cx SC8180X) and, I assumed along with it, the chipset’s integrated X24 LTE modem. And, because I’d installed Windows 11 2H25 in mid-October and it was already mid-December, I was beyond the 10-day rollback deadline.

More recently though, and on a hunch, I plugged back in the SIM, rechecked the computer’s “Network & Internet” screen and noticed that the cellular data option had magically returned, which a revisit of Device Manager confirmed:

I have no clue what caused it to resurrect, far from what had led to its (temporary, it turns out) demise in the first place. And, by the way, after further pondering I now suspect that the now-shorter list of supported Arm processors and chipsets in Windows 11 2H25 only affects fresh installations, not upgrades of existing activated builds. It’s all for naught, however; I’ve already moved on. For any of you who wondered what I’d been doing with the SIM before I temporarily “plugged it back in” to the computer, as I intentionally teased a paragraph earlier, read on for the solution to the mystery.

Standalone hotspots: still relevant

I’ve dabbled with mobile cellular hotspots before, owned by others. And truth be told, I didn’t have to buy one this time. Last January I’d purchased on sale from Amazon two NETGEAR LM1200 cellular broadband modems, one for teardown-to-come and the other for precisely the scenario—premises power-loss connectivity backup—that I experienced in mid-December. They aren’t as-is usable, requiring tether to a router. But I have plenty of those in inventory. And had we stuck around the home more than one night I probably would have pressed the modem-plus-router combo into service, fueled by a portable power unit.

But another limitation, bandwidth, was the same one that already soured me on the Surface Pro X’s integrated modem (along in the ones in my Intel-based Surface Pros, for that matter). The LM1200 “only” supports 4G LTE, which is likely why I bought them (on closeout, I suspect) for only $19.99 each a year-plus back, versus the original $49.99 MSRP. As you’ll soon see, I used a similar “buy a generation-or-few old” stratagem with the mobile hotspots! 4G LTE support was sufficient when that’s all my AT&T service supported (and the unlimited per-month allocation was a nice bonus). But once AT&T upgraded me to 5G…well, you know what they say about shiny new objects… Truth be told, I actually bought three mobile hotspots, for reasons I’ll discuss in the following sections.

The NETGEAR Nighthawk M6 MR6110

I’ll start with the highest-end device, Netgear’s MR6110 (PDF), the entry-level member of the company’s Nighthawk M6 family. Versus its higher-end Nighthawk M6 siblings (this Mobile Internet Resource Center writeup provides a comprehensive comparison), not to mention Nighthawk M7-family successors, it:

• Is carrier-locked to AT&T, and doesn’t support a sufficient diversity of frequency bands (presumably due to firmware versus silicon limitations) to deliver robust support for other cellular carriers, anyway
• Is sub-6 GHz only from a spectrum standpoint, not additionally comprehending mmWave support (which, interestingly, NETGEAR dropped entirely in its Nighthawk M7 generation devices) and
• Supports only Wi-Fi 6, not more advanced protocols

Then again, it only cost me $84.99 plus tax gently used from a legitimate eBay seller (just as I’ve mentioned before with cellular phones, you need to be careful when buying preowned goods to ensure that you haven’t acquired a device whose IMEI has already been banned by the associated cellular carrier). I also sprung for a $24.99 two-year extended warranty. And in case you’re wondering what behind the gray square “doors” at both ends of the front panel in the above stock photo, they’re TS-9 connectors that mate up with NETGEAR’s model 6000451 omnidirectional MIMO antenna, a gently used example of which I bought for $24 off eBay:

I live in a rural region outside of (and above) Golden, Colorado, with trailing-edge cellular technology deployed and spotty coverage for all carriers. To wit, using the NETGEAR MR6110’s internal antenna, I was only able to tune in LTE service…what’s the point, since I’ve already got the NETGEAR LM1200 modem-plus-router combo? But connect the external antenna, tether my laptop to the MR6110 over USB-C, and:

Huzzah! Consider me sold!

The Franklin A50 (model RG2102)

Next up…or down, depending on your perspective…is another AT&T-partner piece of hardware, Franklin’s A50. No integrated Ethernet, although you can still wired-tether to a single device over USB-C, and to an Ethernet-based router via a USB-C-to-Ethernet adapter plus a Cat5e cable. And “only” support for 20 concurrent devices, versus the NETGEAR MR6110’s 32. But user reviews rave about its battery life. It touts diverse 5G band support, and is claimed carrier-unlockable via services such as Cellcorner and Unlocklocks. That’d be convenient in case, for example, I ever wanted to switch my service to Google Fi, a T-Mobile MVNO (mobile virtual network operator). And it only set me back $34 (plus tax) used on eBay. How could I refuse?

The Franklin T9 (model RT717)

This last, lowest-end one—two of them, actually—I bought solely for experimentation purposes, both hacking and teardown. No integrated Ethernet, again. No 5G support this time, either; it only comprehends LTE. And as you can tell from the photo, this time it’s out-of-box locked to T-Mobile. But believe it or not, it’s (unofficially, again) user-unlockable for use with other carriers, not to mention user-hackable to both tweak its default settings and expand its overall feature set. Check out the following example links (in Google search results priority order) for more information:

• Rooting and Unlocking the T-Mobile T9 (Franklin Wireless R717)
• Stefan Todorovic’s Franklin Unlocking Tool
• SIM Unlock a Franklin T9 Hotspot
• T-Mobile Franklin T9 Hacking (complete with teardown photos)
• kernelcon – tmobile test drive hotspot hackery
• Franklin T9 aka R717 Hotspot Thread

And did I mention that each complete kit, in brand new condition this time, cost me only $13.98 plus tax (with free shipping!) on eBay? Once again, how could I resist?

More to come

As you’ve hopefully already noticed from the two photos I shared earlier, I’m already happily exploring the NETGEAR MR6110, with the other two devices to follow in short order. I’ve also already invested in carrying cases for all three, plus inexpensive spare batteries for both the MR6110 and Franklin A50 (each Franklin T9 kit came with one, so I’m set here), since all three hotspots’ portable power cells are easily user-accessible for swap-out purposes. Stay tuned for more coverage to come in the coming months. And for now, I as-always welcome your thoughts in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

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The post Cellular hotspots: Multi-option evaluation thoughts appeared first on EDN.

In booth 1637 at SATShow Week in the Walter E. Washington Convention Center in Washington DC (24–26 March), MACOM Technology Solutions Inc of Lowell, MA, USA is showcasing its latest RF and optoelectronics solutions for satellite communications (SATCOM) that can enable higher frequency bands, improved power efficiency and more scalable architectures, which are critical to next-generation satellite networks...

One hundred fifty billion units of SST SuperFlash technology that Mythic is licensing have been shipped to date. SuperFlash technology is the de facto eNVM solution for a broad spectrum of industries, including industrial, automotive, consumer, and computing, for critical data and code storage, and is licensed by all of the top 10 semiconductor foundries worldwide.

“Mythic is pioneering innovative solutions in AI inference processing and AI sensor fusion for industrial, automotive and data centre applications, effectively overcoming current AI power limitations,” said Mark Reiten, vice president of Microchip’s Edge AI business unit. “As the core memory technology for Mythic’s next-generation products, memBrain delivers significant power efficiency and high performance for both edge and data centre applications.”

The memBrain cell features:

• Up to 8 data bits per bitcell (8 bpc) storage
• Single-digit nanoamp (nA) bitcell read current
• 10-year data retention at operating temperature
• 100,000 endurance cycles
• Full state machine control of the 8 bpc multi-state write operation
• Single-cycle multiply-and-accumulate operations for aCIM

“Mythic selected SST after an industry-wide search of eNVM technologies and determined the memBrain cell technology best enabled us to achieve the ultra-low-power and high performance required by our customers,” said Dr Taner Ozcelik, Mythic’s chief executive officer. “Additionally, the wide foundry availability of its industry-proven SuperFlash technology, coupled with the outstanding support of the SST engineering team, has been invaluable during our product development cycle.”

SST’s memBrain technology has been developed and deployed in 40 nm and 28 nm foundry processes using production-ready SuperFlash memory. 22 nm memBrain development is planned to extend the technology roadmap. Designed to provide reliable, high-performance and low-power non-volatile storage directly on the chip, SuperFlash memory is widely used in applications that require fast access times, high endurance and data retention without the need for external memory components.

The post Mythic and Microchip Partner to Redefine AI Processing with Next-Gen Analogue Compute-in-Memory Technology. appeared first on ELE Times.

🐣 Запрошуємо на виставку "Темарі: Розмаїття барв"! kpi чт, 03/19/2026 - 11:38

Перемога КПІшників у Säkerhets-SM CTF 2026! kpi чт, 03/19/2026 - 11:27