Збирач потоків

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company focused on non-kinetic effects and directed-energy technologies, electronic warfare and defense mobility programs, software-orchestrated defense systems and advanced manufacturing) has announced initial results from a laser dazzler counter-UAS test campaign conducted at the facilities of Tekne S.p.A. in Italy...

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company focused on non-kinetic effects and directed-energy technologies, electronic warfare and defense mobility programs, software-orchestrated defense systems and advanced manufacturing) has announced a proposed best-efforts public offering of up to $38m of its securities...

submitted by /u/1Davide [link] [comments]

I think you already know, but since July 1st a tax of €3 per ARTICLES is now mandatory. (they say it’s by categories but in reality, no) For €30 of electronic components, I have +€50 of taxes. For a person who has started to be interested in electronics recently, it hurts. So I come to try to find alternatives to aliexpress, with similar prices if possible… If the delivery lasts 6 months but there are no taxes I DONT CARE, I need the components at an affordable price. Thanks, and I hope that the aliexpress sellers will quickly find a solution for us submitted by /u/gluat [link] [comments]

Purchased AD SSM2019 amplifier from DigiKey, only 1 unit. Got 26… :) submitted by /u/daduka1999 [link] [comments]

For its fiscal third-quarter 2026 (to end-May), LED chip and component maker SemiLEDs Corp of Hsinchu, Taiwan has reported revenue of $9.07m, up from $1.06m last quarter, due to the increase of buy-sell purchase orders of equipment...

The Indian Ballistic Missile Defence (BMD) Programme introduced by Atal Bihari Vajpayee government following the Kargil War was developed by Defence Research and Development Organization (DRDO). It is designed to destroy both high-altitude and low- altitude incoming enemy missiles by employing a two-tier, multi-layered missile defence architecture. The objective of this system is to provide more than one opportunity to destroy an incoming missile before it reaches its target using multiple layers of detection, tracking, command-and-control, and interceptor missiles (or Anti-Ballistic Missiles).

India has successfully enhanced its indigenous missile defence capabilities after DRDO successfully demonstrated a series of flight tests conducted on June 10 and 11, 2026, which reinforce the ability of Ballistic Missile Defence (BMD) system to counter evolving long- range ballistic missile threats. The test comprised three consecutive flight trials of the Phase-2 BMD system in which interceptor missiles successfully detected, tracked, and neutralized the enemy missile attack for testing purposes. The trial also included the maiden flight test of the Naval Anti-Ship Missile Medium Range (NASM-MR), showcasing DRDO’s progress in both air and maritime defence systems.

India’s indigenous BMD architecture is designed for a multi-layered interception strategy where it can destroy enemy hostile missiles by operating at two distinct interception layers — outside the earth’s atmosphere and within Earth’s atmosphere. India is updating its defence system that can handle more complex threats such as hypersonic missiles and Intercontinental Ballistic Missiles (ICBs). The BMD system uses AD-1 and AD-2 which are advanced, high-speed interceptor missiles used to destroy long range threats travelling at extremely high speed and in different weather conditions.

Through these trial tests BMS introduced new defence advance technologies such as latest interceptor designed to address complex flight trajectories, advanced tracking radars to destroy enemy missiles, capabilities of AD-1 interceptor, and improvement in target tracking. As missile technologies continue to evolve, future BMD systems are expected to incorporate artificial intelligence, machine learning, and more capable interceptor technologies.

The post Indigenous BMD Programme Advances with Successful Multi-Layered Interceptor Trials appeared first on ELE Times.

Marquistech has selected Rohde & Schwarz to equip its conformance and EMI/EMC test lab in Noida, India, with various systems for GCF and PTCRB certification testing. The investment includes the R&S TS8980FTA-3A RF/RRM full type approval system, the CMX500 radio communication tester for protocol conformance, the R&S TS-LBS positioning test system for location based service testing and the R&S TS9982 and R&S TS9975 EMI/EMC test systems.

With this expanded setup, Marquistech has become the first fully equipped conformance test house in India for both certification programs. The lab, strategically located in the Delhi National Capital Region, is aimed at serving companies in the mobile, IoT and wireless module markets, at a time when India is gaining importance as an export focused electronics manufacturing location.

The newly installed systems from Rohde & Schwarz support legacy 4G as well as advanced 5G features, including non terrestrial networks (NTN) and mission-critical communications (MCX), and lead in numbers of validated test cases covered. Additionally, Rohde & Schwarz has provided regulatory testing capabilities for EMC and EMI at the site to enable abroad range of services offered. This helps the test house minimize costs and reduce reliance on outsourced testing. For customers, it reduces the time to complete a certification campaign.

Marquistech has been active for some time as a GCF field testing RTO. With the expansion of their site in the Delhi National Capital Region, the company has now extended its global operations to conformance testing. This adds a broader local test offering for device makers that need certification support during development and before market entry.

Prashant Jain, VP, Marquistech, said: “Our goal is to provide a globally competitive certification hub for GCF and PTCRB testing, delivering quality, flexibility and faster time-to-market. Together with Rohde & Schwarz, we are helping strengthen the global wireless certification ecosystem.”

The local support structure provided by Rohde & Schwarz was a decisive factor for Marquistech. Rohde & Schwarz operates a major development site nearby with integrated laboratories that cover the wireless product lifecycle for conformance solutions, supported by local engineering and application teams.

The post Rohde & Schwarz Supplies Conformance Test Systems to Marquistech for India’s First GCF RTO and PTCRB ATL Lab appeared first on ELE Times.

As industrial environments become more automated and connected, demand for Power over Ethernet is rising to enable industrial applications by delivering reliable power and data over a single cable, simplifying deployment and scalability. To offer an industrial-grade solution, Microchip Technology (Nasdaq: MCHP) has extended its broad range of single- and multi-port PoE solutions to include its PD-9601GCI Midspan, designed to meet the IEEE 802.3bt standard for industrial applications and their challenging environments.

“In a market where many existing networks don’t fully support PoE’s convenient single-cable deployment models, our industrial-grade PD-9601GCI midspan makes it easier for our customers to power their smart equipment in factories and industrial settings,” said Charlie Forni, corporate vice president of Microchip’s networking and connectivity business unit. “Additionally, our customers have the option to use our midspans as a private label powering option, enabling them to differentiate their products by offering a simpler integrated power solution.”

Microchip’s PD-9601GCI midspan stands out from its existing PC-9601GC single-port indoor PoE midspan because it’s industrial-grade and is designed to reduce the need for complex electrical work and additional power outlets, while delivering up to 90W of power and 10/100/1000 Mbps data rates over a single Ethernet cable.

The device offers features and capabilities that support reliable operation in remote or challenging factory and outdoor locations, minimizing downtime and support issues:

• Sealed, vibration-resistant metal enclosure that is Ingress Protection (IP)-rated: The IP rating is IP30.
• Extended operating temperature: Designed to sustain a temperature range of -40°C to 75°C.
• Extended power input options: Supports dual DC input in the range of 20V-60V.
• Enhanced industrial-grade surge protection: Helps protect against voltage spikes in industrial environments.
• Industrial mounting: Includes DIN rail, wall or panel mount options.
• Compatibility testing with industrial automation devices: Helps reduce integration and reliability issues
  for manufacturers.

Midspans are inserted after the network switch where they inject power onto an Ethernet line so it can deliver both power and data. These devices provide a convenient and cost-effective solution to deploy PoE in remote or challenging environments. Bundled with an IoT device, midspans enable manufacturers to offer a plug-and-play solution designed to support power delivery over the network.

 

 

The post Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments appeared first on ELE Times.

The US Department of War’s Economic Defense Unit (EDU), in partnership with the Office of the Under Secretary of War for Acquisition and Sustainment (OUSW(A&S)), has awarded $25m through the Industrial Base Fund to American Resources Corp to expand capacity at the Marion Advanced Technology Center refining campus in Indiana of its affiliated minority holding ReElement Technologies Corp (a refiner of rare-earth elements and other defense-critical minerals)...

🎓 Адаптаційні курси КПІ для першокурсників kpi пт, 07/17/2026 - 10:00

submitted by /u/aacmckay [link] [comments]

Don't ask me, ts is on another whole level of abstract submitted by /u/andrew_is_myname [link] [comments]

Договір про співпрацю із Полтавським державним аграрним університетом kpi чт, 07/16/2026 - 18:45

🔗 Проєкт положення про систему забезпечення академічної доброчесності в Національному технічному університеті України «Київський політехнічний інститут імені Ігоря Сікорського» kpi чт, 07/16/2026 - 17:49

Following a non-binding preliminary memorandum of terms (PMT) signed in December 2024, Germany-based tier-1 automotive supplier Bosch has announced a definitive agreement with the Trump Administration for up to $225m in direct funding from the US Department of Commerce’s CHIPS Program Office to support the up to $2bn that Bosch is investing to transform its fabrication plant in Roseville, California — acquired as silicon-based application-specific integrated circuit (ASIC) foundry TSI Semiconductors in August 2023 — for the production and testing of silicon carbide (SiC) semiconductors. The Roseville facility has nearly 40 years of experience in the production of semiconductors for automotive and industrial applications, which it will now apply to the production of SiC chips...

USB-C will be 22 years old next month, from a published-specification standpoint. Yet it’s still rife with implementation imperfections. Why? Start with the words “published specification”.

One of the many upsides to my now-dual roles as both contributing and associate editor at EDN is deeper-than-prior insight into what topics, and what content pieces focused on those topics, perform particularly well from various website metrics standpoints. This includes my own stuff, of course; I’m not going to share how it does, either in an absolute sense or relative to my colleagues’ contributions, and I’ll also leave you to decide for yourselves whether that silence is driven by humility, embarrassment, or some combination of the two

I begin with this background information by means of introducing one particular piece of EDN content whose enduring stellar performance I will share with you. Week after week, I’m amazed to repeatedly see the article USB Pinout, Wiring and How It Works perpetually parked at the upper stratum of the site traffic spectrum. What’s particularly mind-blowing to me is that the article’s original publication date was January 26, 2010. Clearly, USB is a topic of enduring interest to you, our treasured readership, for oft-obvious reasons!

The latest generation

The date of this article’s initial appearance in EDN is intriguing for another reason; it arrived 4.5 years ahead of the publication of the version 1.0 specification for USB Type‑C, aka USB-C, and therefore doesn’t include mention of this latest generation of the standard. USB-C usage has subsequently become pervasive, courtesy of factors such as its two-fold rotational (and broader two-end) connector symmetry, in combination with higher data bandwidth (extended beyond USB 3.0, introduced in prior USB connector form factors) and higher power (Power Delivery, i.e., USB-PD, building on a proprietary Qualcomm Quick Charge foundation) transfer capabilities.

Yours truly, for example, has crafted three USB-C-focused pieces in recent years (along with innumerable other more minor mentions), the first one focused on the technology, including its generational development history, and the latter two sharing my personal (underwhelming, to be precise) experiences with it:

• USB: Deciphering the signaling, connector, and power delivery differences
• USB Power Delivery: incompatibility-derived foibles and failures
• USB 3: How did it end up being so messy?

And speaking of popular writeups, my cohort Bill Schweber followed up my USB-PD piece with his own technology treatise:

• USB-C and Power Delivery: Too much of a good thing?

We’re now more than two decades beyond that initial publication date for USB Type‑C Specification 1.0, and I’d love to be able to say that all (or even most) initial implementation warts have been effectively mitigated at this point. I’d love to be able to say that…but I’d be lying if I did. All three of my earlier noted USB-C advancements—connector symmetry, data bandwidth, and power carriage—will unfortunately be demonstrated as enduringly imperfect in the following paragraphs, in fact. Without further ado…

Identity indecision

Let’s start with the fundamentals. Does a particular USB-C cable carry only power? Or power plus data? How much power? And at what peak data transfer rate, if any? Sadly, the answer to these few elementary questions is often consistently unsatisfying, along the lines of “Duh…I dunno. Plug it in, test it and find out for yourself. Then stick an info label on it so you don’t forget.”

Take, for example, this cable:

which came bundled with an inexpensive computer docking station I recently acquired, specifically to test out (and then tear down) its touted DisplayLink capabilities:

By means of association with the specs of its docking station companion, I can make the following cable feature set assumptions:

• Power-plus-data support
• 100W peak power carriage
• 5 Mbps peak data transfer rate

So, if I only use it with the docking station going forward, I’ll inherently likely know what it can (and can’t) do. But what if the dock dies or the cable more broadly get separated and tossed in a drawer with others? It’s unmarked in its entirety, thereby providing no visual notification of its capabilities (and limitations). This unfortunately quite common anonymity rationalizes the recent unveil of the open-source, albeit MacOS-only (and Apple Silicon-only) from a compiled-code standpoint, WhatCable utility, for example:

And even if I was able to retain the original packaging and documentation associated with the cable, those info supplements might still not suffice. Take this cable, which I’d purchased as part of a six-pack from Woot in March 2022 for $17.97, as illustration of the concept:

The cable itself is again a blank slate, specification-wise. And although in this case the connectors are embossed, they’re still meaningfully information-deficient:

What about the box? It’s of little-to-no assistance, either. The front panel claims that it’s “USB 2.0”, which infers (at least to folks with sufficient technical “chops” to decode the terminology, a scant sliver of the overall consumer community, and still not definitively) that it also supports power-plus-data, albeit the latter only rudimentarily, with a 480 Mbps transfer rate.

And what about power carriage? For that we need to turn to the back panel of the box:

Note the “5V⎓3A” terminology at the top, which translates to a 15W peak power spec. That multiplicative exercise outcome stands in stark contrast to the product page, which states that the cable is 60W-capable (therefore explaining the four-plus-year old scribble from yours truly that you’ll see in the picture). I’ve never encountered a 15W USB-C to USB-C cable, in fact, only 60W ones (along with higher-power variants such as 100W, 140W and 240W), although plenty of 15W USB-A (the current-limiting connector) to USB-C cables alternatively exist.

When I reported the discrepancy to Woot after receiving the initial six-cable (three-box) shipment, customer support told me to keep ‘em and sent me free replacements, whose packaging was labeled in exactly the same (incorrect) way. Eventually, I got a full refund and ended up with 12 gratis, albeit power carriage-dubious, cables for my trouble. In revisiting the product page just now while writing this section, I noticed that Woot eventually appended a correction (albeit, the engineer in me is compelled to point out, using the “=” symbol instead of the correct “⎓”…current and voltage being completely different things, don’cha know):

Please note the Amazon Basics box might state “5V=3A”. This is just a standard industry specification for USB-C cables. HOWEVER, these cables do support charging up to 60W (20V=3A) if paired with a charging brick capable of supporting 60W charging and a device capable of receiving 60W charging.

Beware the upside down

This last case study for today also originated in a several-year-old personal experience. As USB-C approached critical marketplace mass, peripheral equipment (mass storage devices, headsets and other audio equipment, etc.) increasingly shipped by default with integrated USB-C connectors versus USB-A with predecessor gear variants. Sometimes, the manufacturer also bundled a USB-C to USB-A adapter for connection to legacy computers and the like, albeit with tradeoffs such as:

• 5 Mbps (USB 3.0) peak transfer speeds, and
• Negation of USB-PD support that might be minimally beneficial, if not functionally flat-out necessary, since only USB-C includes the necessary communication channel (CC) signals for initial protocol handshaking. Strictly speaking, per the USB-PD specification, modulation on the USB-A-supported Vbus and Vgnd signals could also be used for this purpose, but real-life adoption of this alternative technique is scant-to-nonexistent.

Other times, however, to save a few bill-of-materials cents (not to mention avoiding additional expensive technical support sessions), the peripheral manufacturer would dispense with the backwards-compatible adapter, requiring the customer to as-needed alternatively purchase it standalone. So it was that I picked up a set of two inexpensive ($8.09 total) XAOSUN USB-C female to USB-A male adapters from Amazon, since at the time (and, to a lesser degree, even today), the majority of the computers in my stable met the “legacy” (USB-C-less) criteria:

Good news: they support up-to-10 Mbps peak transfer rates, versus the nominal 5 Mbps speed spec’d for others’ adapters. Bad news: this happens only when the peripheral connector is inserted in one of USB-C’s two possible orientations. In the other (also unmarked) orientation, the adapter will pass through data at only USB 2-compatible 480 Mbps peak speeds:

Please note that this USB-C to USB Adapter only supports single-sided 10Gbps high-speed transmission. The Type-C female port allows you to switch between USB 3.1 speed and USB 2.0 speed with a simple flip of the Type C plug. Now you can enjoy unparalleled transmission quality from your devices!

The manufacturer classifies this explanation under an “Easy to Use” category on the Amazon product page listing. I profoundly disagree. Again, as a “techie” I have awareness from past experience of how 10 Mbps (or even 5 Mbps, for that matter) speeds should be perceived by a user, so if things are proceeding slower than expected, I’ll instinctively realize that I need to:

• Cancel the current in-process operation
• Disconnect the peripheral
• Flip the connector by 180° and re-insert, and
• Restart the operation

Conversely, even fundamentally knowing that there’s a problem, far from remembering what’s causing it and how to recover from it, is well beyond the capabilities of the average consumer.

And stepping back, why is this even happening? The answer’s in the “single-sided 10 Gbps” phrasing. As discussed at length in Reddit threads (for example) such as the following:

• What does “single-sided” 10Gbps mean in this adapter?
• Any reliable USB-C (female) to USB-A (male) adapters yet?

this limitation is fundamentally driven by cost-reduction moves made by the manufacturer, specifically in passively routing only one set of SuperSpeed differential source pins to the USB-A destination. Routing both sets of source pins, thereby enabling SuperSpeed operation in both possible USB-C orientations, necessitates active circuitry such as Via Labs’ VL160 or a successor or competitor.

Certification vs compliance

Why do situations like the ones described in this writeup, along with those in prior USB-C coverage from me (reminder: listed at the beginning of this piece, as well as the end), occur at all? Isn’t this something that the USB-IF (Implementers Forum) should be dealing with? The answer to this question lies in the differentiation between “compliance” and “certification”. Although USB-IF encourages compliance (via member workshops, testing by independent labs and other means) to “provide reasonable measures of acceptability”, the organization’s specifications are freely published and available for download and implementation by everyone.

Strictly speaking, manufacturers (and products from those companies) are allowed to license and use the USB-IF logo set only if they’ve successfully passed compliance testing. But by now we’ve all likely come across companies that stick the FCC logo on devices and their packaging even though it’s highly unlikely that those products have even applied for FCC certification, far from achieving it (with an omitted FCC certification ID one obvious tip-off). USB logos are presumably also being used in a similarly cavalier manner.

Retailers can also put pressure to bear on suppliers; some require proof of USB-IF compliance determination before they’re willing to stock a particular product (not to mention a broader manufacturer full product suite), for example. And an excessive return rate can also be effective in compelling a retailer to drop a product, not to mention the company that developed it. Still, at the end of the day this fundamentally remains a caveat emptor situation for consumers.

I’ve got one more notable USB-C-related implementation-challenge situation to discuss, but after just passing through 2,000 words, I’m going to save it for next week’s part-two post. Until then, I welcome your thoughts in the comments on anything I’ve so far discussed!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• USB Pinout, Wiring and How It Works
• USB: Deciphering the signaling, connector, and power delivery differences
• USB Power Delivery: incompatibility-derived foibles and failures
• USB 3: How did it end up being so messy?
• USB-C and Power Delivery: Too much of a good thing?

The post USB-C’s lingering incompatibilities and other complexities, part 1: Direct-connect complications appeared first on EDN.

Texas Instruments (TI) India today announced the conclusion of its fifth
edition of the Women in Semiconductors and Hardware (WiSH) program, TI India’s flagship initiative to
inspire, mentor, and accelerate the careers of women engineering students in semiconductors, hardware,
and embedded systems. During the program, participants engage in hands-on experiments, technical
simulations, lab visits and engineering projects that expose them to real-world semiconductor applications
and product development workflows.

Since its inception five years ago, the program has empowered 685 women engineering students through
mentorship by TI engineers and facilitated more than 300 internship opportunities, helping create a
sustained pipeline of female talent into one of the world’s fastest-growing technology sectors. Building on
the momentum of previous editions, the 2026 WiSH program recorded a 33% increase in registrations,
close to 2,600 applications last year, reflecting growing aspiration among women students across India to
pursue semiconductor careers.

“At Texas Instruments, we believe early exposure to industry and mentorship can play an important role
in shaping future engineers. While women account for 43% of STEM graduates in India, one of the
highest rates globally, they continue to be underrepresented in technical roles,” said Arbab Kausar, HR
director, Texas Instruments India. “Over the past five years, the WiSH program has helped women
engineering students gain practical skills in semiconductor and hardware engineering while building their
technical capabilities. The significant increase in registrations this year is encouraging and reflects the
growing interest in semiconductor careers among female engineering students across India.”

While the program’s core architecture remains consistent, the 2026 cohort has been meaningfully
strengthened. Pre-work learning modules and streamlined sessions significantly expanded the time
participants spent on hands-on problem-solving, brainstorming, and collaborative design thinking.
Students continue to engage with TI mentors, former WiSH participants, interns, and early-career
engineers, gaining practical insights into what a career in semiconductor engineering truly looks like.

“The WiSH program gave me an opportunity to learn directly from experienced hardware engineers and
gain valuable insights into the semiconductor industry,” said Ashmita Das, who joined TI India as a
digital intern after participating in the WiSH program. “Returning to TI as a summer intern feels like a
dream come true and marks the beginning of an exciting new chapter in my journey. Deepening my
technical expertise while gaining first-hand experience of working with teams that collaborate, innovate,
and drive impactful engineering solutions has been incredibly rewarding.”

Through WiSH and its broader talent development initiatives, TI India continues to invest in
strengthening the long-term growth of India’s semiconductor ecosystem by nurturing the next generation
of women engineers.

 

The post Texas Instruments India reports 33% rise in women seeking semiconductor career exposure through its WiSH program appeared first on ELE Times.

While accelerating towards manufacturing modern semiconductor technologies,
India has achieved another milestone by reducing the Basic Custom Duty (BCD) to 0%
on 85 categories of electronics components and manufacturing equipment by issuing
three official notifications through the Finance Ministry and the Central Board of
Indirect Taxes and Customs (CBIC). This policy removes the previous 5% to 7.5%
import taxes to make it cheaper to manufacture electronics inside the country. It also
simplifies supply chains by lowering landed costs, which boosts local component
sourcing and accelerates the country’s ambition of becoming a global electronics and
manufacturing hub.

The duty exemption primarily covers components, machinery, and equipment that
are not manufactured in sufficient quantities within India but are essential for the
production of smartphones, laptops, consumer electronics, telecom equipment,
industrial electronics, automotive electronics, and semiconductor-related products.
This elimination of costs on import duties in semiconductor manufacturing lowers
production costs, making electronics cheaper to build, and attracting global
investments by lowering their global supply chain expenses.

Industry experts believe that reduction in import duty will practically benefit
manufacturers by directly lowering production costs. Manufacturing electronic
products that rely on advanced electronic components, precision manufacturing
equipment, semiconductor materials, and testing systems that are currently
unavailable or produced only in limited quantities will be able to source these critical
inputs at lower costs.

Combined with ongoing investments under the India Semiconductor Mission, PLI
schemes, and expanding semiconductor manufacturing projects, the cost-cutting of
import duties is expected to strengthen India’s position as a preferred destination for
electronics production and innovation. As the semiconductor market grows, the
zero-duty policy on electronics input is expected to improve export competitiveness
and the development of a resilient semiconductor ecosystem, supporting India’s
emergence as a key player in the global semiconductor industry.

The post India Cuts Duty to 0% on 85 Electronics Categories, Leading Global Manufacturers to Invest in India appeared first on ELE Times.

The Ministry of Electronics and Information Technology (MeitY) with Drone
Federation of India, has introduced NIDAR 2.0 (2026-27) under the SwaYaan initiative to
build indigenous drones and flight controllers powered by India’s homegrown VEGA
processor. This innovation reduces reliance on foreign chips, strengthen the
domestic drone and electronics manufacturing ecosystem. This initiative aims to
accelerate the development of next-generation unmanned aerial system (UAS) by
encouraging startups, researchers, and industry to build drones using domestically
manufactured electronic components.

NIDAR 2.0 stands for National Innovation Challenge for Drone Application and
Research that aligns with government’s vision of Atmanirbhar Bharat, the India
Semiconductor Mission (ISM), and the Designed Linked Incentive (DLI) Scheme. The
goal of this hackathon is to provide a valuable opportunity for students and working
professionals to build flight controller and autopilot hardware powered by India’s
indigenous VEGA microchip.

According to MeitY release, NIDAR 2.0 offers a prize pool of more than 65 lakh that
not only promote innovation but also supports startups, nurtures young talents, and
accelerate the development of domestic drones and semiconductor technologies
through incubation, technical mentorship, and industry collaboration.

Launching the challenge, MeitY Secretary S Krishnan said, “NIDAR 2.0 takes our
students from just flying drones to building the drone’s brain. When the drone’s
brain runs on India’s own VEGA processor, we are not just training engineers. We are
laying the foundation of a self-reliant drone industry.”

The primary focus of this hackathon is to build autonomous swarm drones capable of
locating survivors and delivering medical supplies in disaster-hit areas without an
external communication network, and developing GPS-denied drones for indoor
industrial inspection. By collaborating as a coordinated fleet, swarm drones can
rapidly survey large areas, identify victims using onboard sensors and AI-based image
processing, and optimizing search-and-rescue operations without relying on constant
human intervention.

The post NIDAR 2.0: MeitY Boosts Indigenous Drone Innovation with India’s homegrown chips appeared first on ELE Times.