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Tata Electronics to Manufacture India’s First Large-Scale Chip Factory
Tata Electronics, a group company under the $103 billion Tata Sons conglomerate, is set to establish the country’s first commercial chip fabrication plant utilising an older technology to focus on a market segment for semiconductor designs from external customers, said an official with knowledge of the project. This would mark the first time the Indian government allocates resources to support establishing a chip making unit. The Tata Group had earlier reported the creation of India’s maiden integrated device manufacturer (IDM) in the country, a unit that designs and produces semiconductor chips in-house.
Tata Electronics Pvt. It will use technology far older than planned to produce India’s first semiconductor wafers, coming from a country with virtually no history of the sophisticated technology, highlighting how much work it will need to do to catch up. The tech unit of the sprawling Tata conglomerate will use 90-nanometer process technology for a large part of its first chip fab, which will be located in Dholera, a city in the western state of Gujarat, according to the sources.
That’s a very mature technology used in low-end industrial applications and cars – one that might even be obsolete in the coming years. It’s a more humble beginning compared with the 28nm node which Tata Sons Pvt., the group’s holding company, said would be the first step of its chipmaking innings in its annual report for the year ended March 2025.
It has been observed that Tata’s public plans could have been aspirational regarding what is realistically possible on the ground in the next couple of years. Tata’s entry into chipmaking involves a partnership with Taiwanese rival Powerchip Semiconductor Manufacturing Corp.
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STM32U3B5/C5 With 2 MB of Flash and HSP, The 1st ULP STM32 to Run AI Without Batteries
The STM32U3B5/C5 are the first STM32U3 devices featuring 2 MB of flash and our new hardware signal processor (HSP). In a nutshell, the HSP is an embedded signal processor that accelerates certain computations, enabling a whole range of industrial and AI applications on our ultra-low-power microcontroller. While the new models retain the near-threshold design that allowed the STM32U3 series to boost efficiency by a factor of four, the HSP opens the way for sensing and machine learning programs that would have been too demanding before. We wrote an accompanying blog post on the new hardware signal processor to help avid readers grasp the performance gains and what it means for the STM32 community.
What’s new? The new STM32U3B5/C5The STM32U3B5/C5 primarily stands out from the other STM32U3 devices thanks to its HSP. It’s also why it carries double the flash memory of previous models and 640 KB of RAM, as we expect developers to need a much greater capacity for larger applications and datasets. The new device also comes with one additional group of interfaces, bringing the total to four SPI and I2C, two I3C and CAN-FD, and five UARTs. There are also five more 16-bit timers, for a total of 10. The only difference between the STM32U3B5 and the STM32U3C5 is that the latter includes a cryptocore to accelerate encryption and decryption operations, as well as offer CCB (see more on that later).
What makes the STM32U3 series special? Ultra-low-power consumption and high energy efficiencyOne number sums up the efficiency of the STM32U3: at 117 Coremark/mW, it breaks the 100 symbolic threshold, literally making it a new benchmark in the industry. Indeed, most of the best devices from the competition hover below 100, and the STM32U5 reached 53.9. This significant jump in energy efficiency is due to our near-threshold design. We dedicated an entire blog article to this region of CMOS transistors that many are trying to utilize, but that has remained mainly in the background until now due to its inherent challenges.
0.65 V minimum and 105ºC maximumIn a nutshell, near-threshold conduction in a CMOS transistor occurs when applying a voltage between the gate and the source near a threshold (VT). In most of the devices used in a microcontroller like the STM32U3, that threshold is 500 mV. The vast majority of near-threshold designs apply a VGS of about 700 mV or more. And since near-threshold conduction is a diffusion current as residual leakage current flows under the gate oxide, the transistor itself experiences strict limitations in its operating voltage and temperatures. Most competing devices don’t go above 85ºC, which is why we don’t usually find these devices in industrial applications.
The STM32U3 is different because, thanks to unique optimization in the lithographic processes and manufacturing, ST can apply a lower voltage of 650 mV. The most direct benefit of a VGS value that’s closer to VT is that it helps lower the VCORE further, meaning that we can reach a minimum of 0.65 V and a typical value of 0.75 V. Additionally, as we are experiencing significantly less leakage current than competing solutions, the STM32U3 supports an operating voltage of up to 3 V and a temperature of 105ºC. It can, therefore, tolerate far harsher environments. Hence, the STM32U3 is unique because it makes near-threshold designs mainstream in most industrial applications.
Adaptive Voltage ScalingAnother issue common in near-threshold designs is die variability. Because the near-threshold region is sensitive to the smallest voltage variations, it affects dies on the same wafer more significantly. That’s why tuning each die to account for changes between them can be time-consuming and costly. To solve this challenge, ST implemented a testing system at the factory level, which automates machine learning on STM32 devices. We call it Adaptive Voltage Scaling. Simply put, our machines test each die, and a machine learning algorithm automatically tweaks various aspects to ensure consistent ultra-low-power consumption.
Versatile peripheral offering without compromising cost efficiencyAnother challenge of near-threshold designs is performance. Indeed, as the VCORE is low, so is the operating frequency. However, that is not the case with the STM32U3, which features a Cortex-M33 running at 96 MHz. Moreover, we ensured that despite its more cost-effective pricing, engineers would still get a lot of peripherals and timers. Indeed, the new device supports two I3C buses, CAN-FD, one octo-SPI interface, and more. It also comes with 16 timers, including two 16-bit ones for motor control applications, and a touch-sensing controller for those working on a UI.
Robust safety and security for sensitive and mission-critical applicationsBesides efficiency and performance, ST also designed the STM32U3 for safety and security. Consequently, the new device offers up to 1 MB of dual bank flash, enabling firmware updates without shutting the system down, which is often a critical consideration in mission-critical applications. The STM32U3 also introduces CCB to securely transmit keys by using independent buses ([patent filed in 2023 and 2024]). And we’ve already updated STM32CubeMX, our initialization tool. After activating the random number generator, users can select “CCB” in the list of cryptographic options and start using the feature. Finally, the STM32U3 can also target PSA L3 and SESIP3 certifications.
What’s nextTo ensure the STM32U3 can reach numerous industrial applications, we are offering eight packages, which is unique for a near-threshold design. We are also releasing a Nucleo board to help developers rapidly design a proof-of-concept or run their tests to witness the ultra-low-power consumption for themselves. SmaXtec, a member of the ST Partner Program specializing in bovine monitoring already shared how,
The post STM32U3B5/C5 With 2 MB of Flash and HSP, The 1st ULP STM32 to Run AI Without Batteries appeared first on ELE Times.
Jilin University achieves record 2DEG mobility for N-polar GaN/AlGaN heterostructures on SiC
NUBURU closes public offering, raising gross proceeds of $38m
India-UK Trade Agreement Opens New Opportunities for Electric Vehicle Industry in India
The effective implementation of India-UK Comprehensive Economic and Trade Agreement (CETA) on July 15, 2026, highlights a significant growth for India’s automotive and electric vehicle (EV) sector. This agreement is a landmark free trade that eliminates custom duties on thousands of products, significantly boosting exports and foreign-investment by encouraging UK companies to invest in India through supply chains and manufacturing facilities. It was introduced by Indian Prime Minister Narendra Modi and UK Prime Minister Sir Keir Stamer, officially signed in July 2025 by both nations with the primary objective of expanding bilateral trade and investment.
The CETA establishes a comprehensive framework for creating new opportunities for Indian EV manufacturers, component suppliers, and battery companies by reducing traffic barriers and improving market access. Indian automakers like Tata Motors, Mahindra, and Maruti Suzuki can export up to 88,000 vehicles to the UK completely duty-free and scale their domestic manufacturing by integrating domestic MSME suppliers deeper into the UK and global EV supply chains.
The UK gains benefits by this agreement through deepened cooperation with India’s expanding clean energy and technology sector. The CETA provides UK businesses with improved access to India’s rapidly growing market and creating opportunities for greater trade and investment. This agreement improves the UK economy by granting tariff cuts on 90% of UK exports to India, lowering costs for UK consumers, and improving market access for British products.
The agreement is fully active and remain operational to its provisions on implementation. The future goal is to double bilateral trade to 100-120 billion by 2030. The current status of this agreement is that it operates alongside the Double Contribution Convention (DCC), a social security pact that saves Indian companies up to $600 million annually by exempting Indian professionals working temporarily in the UK from paying social security contributions in both countries simultaneously.
The post India-UK Trade Agreement Opens New Opportunities for Electric Vehicle Industry in India appeared first on ELE Times.
🤩 КПІ ім. Ігоря Сікорського отримав міжнародні сертифікати відповідності вимогам стандартів ISO 9001:2015 та ISO 21001:2025
🤩 КПІ ім. Ігоря Сікорського отримав міжнародні сертифікати відповідності вимогам стандартів ISO 9001:2015 та ISO 21001:2025, підтвердивши ефективність системи управління якістю та системи менеджменту освітніх організацій.
Made my own seven segment display
| submitted by /u/Less_Measurement2541 [link] [comments] |
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Making PCBs at home
| So I made those PCBs at home. Those are adapters from SOP to DIP so prototyping is easier. Took me like a day [link] [comments] |
NUBURU reports initial Tekne laser dazzler counter-UAS test results under Italian Plan as Golden Power review continues
NUBURU’s premium-priced public offering to fund acquisition of controlling stake in Tekne
A microscopic, hair-like metal filament can take down a billion-dollar satellite
| submitted by /u/1Davide [link] [comments] |
Searches alternatives to aliexpress ( fawk UE tariff )
| I think you already know, but since July 1st a tax of €3 per ARTICLES is now mandatory. (they say it’s by categories but in reality, no) For €30 of electronic components, I have +€50 of taxes. For a person who has started to be interested in electronics recently, it hurts. So I come to try to find alternatives to aliexpress, with similar prices if possible… If the delivery lasts 6 months but there are no taxes I DONT CARE, I need the components at an affordable price. Thanks, and I hope that the aliexpress sellers will quickly find a solution for us [link] [comments] |
DigiKey kinda messed up
| Purchased AD SSM2019 amplifier from DigiKey, only 1 unit. Got 26… :) [link] [comments] |
SemiLEDs’ quarterly revenue bounces back from $1.06m to $9.07m
Indigenous BMD Programme Advances with Successful Multi-Layered Interceptor Trials
The Indian Ballistic Missile Defence (BMD) Programme introduced by Atal Bihari Vajpayee government following the Kargil War was developed by Defence Research and Development Organization (DRDO). It is designed to destroy both high-altitude and low- altitude incoming enemy missiles by employing a two-tier, multi-layered missile defence architecture. The objective of this system is to provide more than one opportunity to destroy an incoming missile before it reaches its target using multiple layers of detection, tracking, command-and-control, and interceptor missiles (or Anti-Ballistic Missiles).
India has successfully enhanced its indigenous missile defence capabilities after DRDO successfully demonstrated a series of flight tests conducted on June 10 and 11, 2026, which reinforce the ability of Ballistic Missile Defence (BMD) system to counter evolving long- range ballistic missile threats. The test comprised three consecutive flight trials of the Phase-2 BMD system in which interceptor missiles successfully detected, tracked, and neutralized the enemy missile attack for testing purposes. The trial also included the maiden flight test of the Naval Anti-Ship Missile Medium Range (NASM-MR), showcasing DRDO’s progress in both air and maritime defence systems.
India’s indigenous BMD architecture is designed for a multi-layered interception strategy where it can destroy enemy hostile missiles by operating at two distinct interception layers — outside the earth’s atmosphere and within Earth’s atmosphere. India is updating its defence system that can handle more complex threats such as hypersonic missiles and Intercontinental Ballistic Missiles (ICBs). The BMD system uses AD-1 and AD-2 which are advanced, high-speed interceptor missiles used to destroy long range threats travelling at extremely high speed and in different weather conditions.
Through these trial tests BMS introduced new defence advance technologies such as latest interceptor designed to address complex flight trajectories, advanced tracking radars to destroy enemy missiles, capabilities of AD-1 interceptor, and improvement in target tracking. As missile technologies continue to evolve, future BMD systems are expected to incorporate artificial intelligence, machine learning, and more capable interceptor technologies.
The post Indigenous BMD Programme Advances with Successful Multi-Layered Interceptor Trials appeared first on ELE Times.
Rohde & Schwarz Supplies Conformance Test Systems to Marquistech for India’s First GCF RTO and PTCRB ATL Lab
Marquistech has selected Rohde & Schwarz to equip its conformance and EMI/EMC test lab in Noida, India, with various systems for GCF and PTCRB certification testing. The investment includes the R&S TS8980FTA-3A RF/RRM full type approval system, the CMX500 radio communication tester for protocol conformance, the R&S TS-LBS positioning test system for location based service testing and the R&S TS9982 and R&S TS9975 EMI/EMC test systems.
With this expanded setup, Marquistech has become the first fully equipped conformance test house in India for both certification programs. The lab, strategically located in the Delhi National Capital Region, is aimed at serving companies in the mobile, IoT and wireless module markets, at a time when India is gaining importance as an export focused electronics manufacturing location.
The newly installed systems from Rohde & Schwarz support legacy 4G as well as advanced 5G features, including non terrestrial networks (NTN) and mission-critical communications (MCX), and lead in numbers of validated test cases covered. Additionally, Rohde & Schwarz has provided regulatory testing capabilities for EMC and EMI at the site to enable abroad range of services offered. This helps the test house minimize costs and reduce reliance on outsourced testing. For customers, it reduces the time to complete a certification campaign.
Marquistech has been active for some time as a GCF field testing RTO. With the expansion of their site in the Delhi National Capital Region, the company has now extended its global operations to conformance testing. This adds a broader local test offering for device makers that need certification support during development and before market entry.
Prashant Jain, VP, Marquistech, said: “Our goal is to provide a globally competitive certification hub for GCF and PTCRB testing, delivering quality, flexibility and faster time-to-market. Together with Rohde & Schwarz, we are helping strengthen the global wireless certification ecosystem.”
The local support structure provided by Rohde & Schwarz was a decisive factor for Marquistech. Rohde & Schwarz operates a major development site nearby with integrated laboratories that cover the wireless product lifecycle for conformance solutions, supported by local engineering and application teams.
The post Rohde & Schwarz Supplies Conformance Test Systems to Marquistech for India’s First GCF RTO and PTCRB ATL Lab appeared first on ELE Times.
Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
As industrial environments become more automated and connected, demand for Power over Ethernet is rising to enable industrial applications by delivering reliable power and data over a single cable, simplifying deployment and scalability. To offer an industrial-grade solution, Microchip Technology (Nasdaq: MCHP) has extended its broad range of single- and multi-port PoE solutions to include its PD-9601GCI Midspan, designed to meet the IEEE 802.3bt standard for industrial applications and their challenging environments.
“In a market where many existing networks don’t fully support PoE’s convenient single-cable deployment models, our industrial-grade PD-9601GCI midspan makes it easier for our customers to power their smart equipment in factories and industrial settings,” said Charlie Forni, corporate vice president of Microchip’s networking and connectivity business unit. “Additionally, our customers have the option to use our midspans as a private label powering option, enabling them to differentiate their products by offering a simpler integrated power solution.”
Microchip’s PD-9601GCI midspan stands out from its existing PC-9601GC single-port indoor PoE midspan because it’s industrial-grade and is designed to reduce the need for complex electrical work and additional power outlets, while delivering up to 90W of power and 10/100/1000 Mbps data rates over a single Ethernet cable.
The device offers features and capabilities that support reliable operation in remote or challenging factory and outdoor locations, minimizing downtime and support issues:
- Sealed, vibration-resistant metal enclosure that is Ingress Protection (IP)-rated: The IP rating is IP30.
- Extended operating temperature: Designed to sustain a temperature range of -40°C to 75°C.
- Extended power input options: Supports dual DC input in the range of 20V-60V.
- Enhanced industrial-grade surge protection: Helps protect against voltage spikes in industrial environments.
- Industrial mounting: Includes DIN rail, wall or panel mount options.
- Compatibility testing with industrial automation devices: Helps reduce integration and reliability issues
for manufacturers.
Midspans are inserted after the network switch where they inject power onto an Ethernet line so it can deliver both power and data. These devices provide a convenient and cost-effective solution to deploy PoE in remote or challenging environments. Bundled with an IoT device, midspans enable manufacturers to offer a plug-and-play solution designed to support power delivery over the network.
The post Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments appeared first on ELE Times.
ReElement awarded $25m from Industrial Base Fund to expand US critical mineral refining capacity
🎓 Адаптаційні курси КПІ для першокурсників
Адаптуйся до університетських програм, підтягни фундаментальні знання та склади свою першу сесію без стресу разом із курсами від Київської політехніки. Почни навчання впевнено! 🚀
📚 Дисципліни курсу:



