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WIN Semiconductors Corp of Taoyuan City, Taiwan — which provides pure-play gallium arsenide (GaAs) and gallium nitride (GaN) wafer foundry services for the wireless, infrastructure and networking markets — has added quick-turn semiconductor backend service provider SawStreet LLC of Orlando, FL, USA to its WIN Alliance Partner Program. The partnership complements WIN’s in-house backend processes, giving customers another trusted partner for wafer grinding and thinning, dicing, pick-and-place and die inspection...

Multi-national industrial and energy company METLEN Energy & Metals S.A. of Athens, Greece — which operates the only vertically integrated bauxite, alumina and primary aluminium production unit in the European Union (EU) — has signed a long-term commercial agreement with a major Japanese chemical company for the future supply of gallium, representing up to 16% of METLEN’s total annual gallium production from its production facility in Greece, which is currently under construction...

FREE-WILi 2 is a portable open-hardware multitool that packs an entire embedded hacking lab into a single device. Inside, you’ll find two RP2350B MCUs, an ESP32-C5, a Lattice iCE40UP5K FPGA, and a Raspberry Pi CM0 running Linux. Designed for hardware hackers, penetration testers, and embedded systems developers, it lets you perform wireless testing, hardware debugging, real-time control, and electronic development all in one tool.

The board integrates a range of radios and interfaces that would normally require a desk full of modules. The ESP32-C5 provides dual-band Wi-Fi 6, Bluetooth LE, and 802.15.4. The STM32WLE5JC module handles the SX126x LoRa radio, while the CC1101 covers sub-GHz communication. The ST25R3916B takes care of NFC and RFID, so you can read, clone, or emulate tags. Additionally, the iCE40UP5K FPGA has all its pins exposed and 8 MB of dedicated SRAM for custom logic experiments.

Two RP2350s and a Raspberry Pi CM0 for computing power

At the heart of the system are two Raspberry Pi RP2350B chips. One handles the main controls, while the other is dedicated to managing the 3.5-inch touchscreen display with 480×320 resolution. For heavier tasks, there’s the Raspberry Pi CM0 module with a Broadcom BCM2710A1 SoC, a quad-core Cortex-A53 CPU at 1.0 GHz, 512 MB of LPDDR2 RAM, and 8 or 16 GB of eMMC storage. This module runs a full 64-bit Linux, so you can launch even substantial Python scripts directly on the device.

Connectivity is complete: there are 3 USB host ports, 2 of which run at 12 Mbps connected to the display RP2350 and one at 480 Mbps connected to the CM0. For the lab, you’ll find 13 GPIOs with SPI, I2C, and UART, plus software-selectable I/O voltage. There are also 4 analog inputs from 0 to 5 V with op-amp buffering, PGA, and window comparator, and 2 analog outputs from 0 to approximately 4.84 V at 25 kHz. CAN FD supports up to 8 Mbit/s with a CAN SIC transceiver.

Programmable power supply and voltage glitching

One of the most interesting features for hardware hackers is the programmable 5.5 V / 1.5 A power supply with MOSFET crowbar. This enables voltage glitching, a technique used to test device robustness. The battery is 3000 mAh with USB-aware charging, and sleep current is just 60 µA. The whole thing fits in a 152.4 x 78.9 x 22.3 mm enclosure weighing 290 grams, with 14 gamer buttons for interaction.

The stock firmware exposes a USB CLI, an on-device GUI, and the OneWili API for control from Python, Rust, or C/C++. The device also supports executing code generated by LLMs directly on it, a feature that makes it particularly suited for experimenting with AI applied to hardware. For those who want to dive into code examples and libraries, the project’s code repository is the right starting point.

The FREE-WILi 2 GUI is not just a control panel: it shows the registers of I2C devices and offers graphical controls to interact with connected components. You can also configure the connection to the Claude API to use AI models directly from the device. This makes it a versatile tool for both debugging and rapid prototyping of ideas.

For those working in the embedded world, having all this in a portable device changes the workflow. No more carrying a full test bench: with FREE-WILi 2 you can test radios, read NFC tags, debug over I2C, and even attempt voltage glitching, all from a single instrument. The presence of two separate RP2350s ensures the interface never slows down the main processes.

The board is open-hardware, so you can study the designs and adapt them to your needs. The pre-order price for the Founder Edition is $400, with shipping expected in Q4 2026. If you work with embedded systems, this is an investment that pays off in flexibility and compactness.

Source: https://github.com/freewili/onewili

The post FREE-WILi 2: An Open-Hardware Multitool for Embedded Hacking appeared first on Open Electronics.

Continuity is the first and most basic test performed on a device (chip). It checks the electrical connections between the device under test (DUT) and the automatic test equipment (ATE). Its purpose is to confirm that:

• No device pin is shorted to another pin.
• No device pin is accidentally shorted to power or ground.
• No open circuit exists inside of the device.
• Each device pin has a complete electrical path to the correct test resource inside the ATE.
• The connection between the device and the tester is neither open nor incorrectly connected.

This test is usually performed at the beginning of the test flow. Detecting opens or shorts early confirms that the device is properly connected to the tester and that the test hardware is functioning correctly. A short can also damage the device, especially if it connects a pin to an incorrect voltage, power, or ground. If an open or short is not detected, it can cause incorrect measurements, false test failures, or unreliable results in later tests.

Figure 1 The block diagram shows the required electrical connectivity from the DUT to the corresponding ATE resource through the socket, DIB, and connectors. Source: Author

Before going deeper into continuity testing, it’s important to understand the ESD protection circuit connected to the device pins.

ESD, or electrostatic discharge, is a sudden flow of electrical charge that can damage the internal circuits of a device. To protect the device, many pins include ESD protection diodes. These diodes help direct excessive current away from the sensitive internal circuitry.

A typical input/output pin may have two ESD protection diodes:

• One diode connects the I/O pin to the positive supply voltage, VDD.
• The other diode connects the I/O pin to ground, VSS or GND.

Depending on the design, some pins may have only one protection diode connected to either VDD or GND. Other types of pins, such as power, ground, or special-purpose pins, may use a different protection structure. These ESD diodes are important during continuity testing because they provide a known electrical path between the device pin and the supply or ground pins.

The ATE applies a small voltage or current to the pin and measures the response. The measured response is then compared with the expected behavior of the protection circuit.

This allows the tester to determine whether:

• The pin is properly connected to the tester.
• The device is correctly installed in the socket.
• An open connection exists in the path.
• A pin is shorted to another pin, VDD, or GND.
• The device may be damaged or incorrectly connected.

Therefore, continuity testing does not only check a direct wire connection. It also uses the expected electrical behavior of the device’s ESD protection circuit to verify that the pin and its connection path are functioning correctly.

Figure 2 Here is an illustration of the ESD diode connections for a typical I/O pin. Source: Author

Let us now understand the continuity test using a device pin with two protection diodes, as shown in Figure 2. This test first checks whether the protection diode connected to VDD is functioning correctly (neither open nor shorted), as shown in Figure 3.

Figure 3 The test shows the electrical path of the current between the “resource inside of the ATE” to the VDD diode. Source: Author

The following steps are used to perform the test:

1. Ground all pins except the one under test.
2. Using a parametric measurement unit (PMU), force a small positive current into the pin, typically +100 µA to +500 µA.
3. Apply a +3-V voltage clamp at the same time. This acts as a safety limit, preventing the voltage from climbing too high if the diode isn’t conducting properly (for instance, in an open-circuit condition).
4. While forcing this current, use the PMU to measure the resulting voltage at the pin.

Based on the measured voltage, the test result will fall into one of the following categories.

This method is generally used to test signal pins, such as input and output pins. It’s not normally used for power pins, such as VDD or VSS.

Next, we check whether the protection diode connected to GND is functioning correctly, as shown in Figure 4.

Figure 4 The image shows the electrical path of the current between the “resource inside of the ATE” to the GND diode. Source: Author

We can check the protection diode by following the steps below:

• With pins still grounded, force a small negative current into the pin, typically between -100 µA to -500 µA. This forward-biases the GND diode.
• Apply a – 3 V voltage clamp to prevent the voltage from dropping too far.
• While forcing this current, use the PMU to measure the resulting voltage at the pin.

Based on the measured voltage, the test result will fall into one of the following categories.

The same procedure is repeated sequentially for each applicable device pin until the continuity check is complete. It’s important to note that power pins, such as VDD and GND, are not typically tested using this method. These pins require a different testing approach, which will be discussed separately in a future article.

Keep in mind that each device has its own characteristics, so you may need to experiment to find the test method that works best for your device.

In the upcoming articles, we will build on the fundamentals covered here and take a more practical look at continuity testing. Topics will include:

1. Writing a continuity test method in C++: A step-by-step look at how a continuity test can be implemented in an ATE test program.
2. Reviewing a real continuity test data log: Understanding how to read the test results and interpret pass and fail conditions.
3. Debugging continuity test failures: A practical approach to identifying the possible causes of continuity failures and the steps used to troubleshoot them.

Usman Khan is an analog/mixed-signal test engineer.

Related Content

• Anatomy of ATE PCB Assembly
• Guidelines facilitate load-board design
• Key Design Steps for DUT Areas on ATE PCBs
• 3D TSV Test: ATE challenges and potential solutions
• Modular programmable power supply platform supports ATE

The post Continuity testing in semiconductor ATE: Fundamentals and test methods appeared first on EDN.

Nuvoton Technology will begin providing samples of the KA85010UA, a 26-cell battery monitoring IC equipped with integrated electrochemical impedance spectroscopy (EIS) functionality, in January 2027. The IC uses Nuvoton’s proprietary inductor-based EIS method instead of the conventional resistor method. By using an inductor to store and circulate energy as AC measurement current, the technology significantly reduces energy loss and heat generation during EIS measurements. According to Nuvoton’s evaluation, the method reduces both power loss and PCB temperature rise by approximately 93% compared with the conventional resistor method. This low-power and low-heat operation facilitates the integration of EIS into automotive batteries and energy storage systems. The EIS functionality can support battery degradation diagnosis, state-of-health (SOH) estimation, lifetime prediction, and early detection of cell abnormalities. Nuvoton also provides EIS analysis algorithms and end-to-end implementation support to help customers integrate battery diagnostic functions into their applications.

As vehicle electrification and the adoption of energy storage systems (ESS) continue to expand, batteries have become essential components supporting modern infrastructure, making battery safety more important than ever. In particular, as battery systems increase in capacity and output, there is growing demand for technologies that detect early signs of internal cell short circuits, abnormal heating, and other issues to prevent serious failures and accidents.

Conventional battery systems estimate battery condition by measuring voltage, current, and temperature, but it is difficult to directly capture changes occurring inside the battery. EIS measurements, by contrast, can quantitatively capture changes in internal battery conditions as impedance characteristics and are therefore expected to be used for estimating state of health (SOH) and internal temperature, as well as for early detection of signs of cell abnormalities. Until now, however, EIS assessments have mainly been conducted in laboratory environments using dedicated measurement equipment. Implementing EIS in applications has presented various challenges, including managing heat and noise, controlling measurement timing according to operating conditions, and developing EIS analysis algorithms for the acquired data.

To address these challenges, the Company has developed the KA85010UA, a Gen 6 battery monitoring IC equipped with EIS functionality. The inductor method suppresses heat generation and enables EIS measurements across a wide range of operating states, including operation, charging, and rest. In addition, by providing EIS analysis algorithms that leverage expertise gained through joint verification with automakers and research institutions, we help customers accelerate the realization of battery diagnostic solutions.

Features of New Product:

1. EIS is integrated into the BM-IC, enabling quantification of internal battery conditions Enables degradation diagnosis, lifetime prediction, and early detection of signs of cell abnormalities, contributing to improved safety in vehicles and energy storage systems.

In addition to battery monitoring functions, this product integrates EIS-based impedance measurement into a single chip. EIS is a technique that superimposes an AC current on a battery and calculates impedance from the resulting voltage and current responses. This makes it possible to perform EIS measurements within the system, without the dedicated measurement equipment previously required, enabling continuous monitoring and diagnosis of internal battery conditions.

The impedance characteristics obtained through EIS contain different information about the battery interior depending on the frequency range. The high-frequency range reveals changes in terminals, wiring, and electrolyte; the mid-frequency range reveals changes in the negative electrode; and the low-frequency range reveals changes in the positive electrode and internal reactions. By quantitatively assessing internal battery conditions that are difficult to determine from conventional voltage, current, and temperature measurements alone, EIS can estimate SOH and internal temperature, predict battery lifetime, and provide early detection of signs of cell abnormalities, contributing to improved battery safety in vehicles and energy storage systems.

2. Proprietary inductor method enables low-power-consumption impedance measurement Reduces PCB temperature rise during EIS measurements by approximately 93% compared with conventional methods, facilitating implementation of EIS functionality in automotive and energy storage systems.

EIS measurements require a circuit that applies an AC current to the battery. With conventional resistor methods, several amperes of current flow through a resistor, causing much of the energy to be dissipated as heat. As a result, excessive heat generation and increased power consumption have been key challenges.

This product uses the Company’s proprietary inductor method instead of the conventional resistor method. Two switches (FETs) control the current direction, and energy stored in a coil (inductor) is circulated as AC current to generate the measurement current, significantly reducing energy loss. In the Company’s evaluation, it was confirmed that both power loss and PCB temperature rise could be reduced by approximately 93% compared with the conventional resistor method.

These low-power and low-heat characteristics facilitate implementation of EIS functionality in automotive batteries and energy storage systems. They also enable stable acquisition of EIS measurement data across a wide range of operating states, including operation, charging, and rest, contributing to advanced battery condition monitoring and diagnostics.

3. Provides EIS analysis algorithms and end-to-end support, from setting up the EIS measurement environment to product implementation Shortens the development cycle by supporting rapid implementation of battery diagnostic solutions.

Battery diagnostics using EIS require more than simply acquiring impedance data. To make use of the data, analysis techniques are needed to estimate SOH and internal temperature and to detect cell abnormalities. Commercial implementation also requires an environment for accurate impedance measurements, EIS analysis algorithms tailored to the battery type and application, and software for system implementation.

Drawing on EIS data-analysis expertise gained through verification with automakers and research institutions, the Company provides end-to-end support, from setting up the EIS measurement environment and acquiring and organizing battery data to implementing estimation and abnormality-detection functions and integrating them into applications.

This support allows even customers who are just beginning to use EIS functionality to build battery diagnostic systems more easily, start up their systems sooner, and shorten development cycles.

Applications:

Automotive (EVs), large-scale energy storage systems (ESS), reused-battery diagnostic systems, etc.

Product name:

EIS-equipped Gen 6 battery monitoring IC “KA85010UA”.

Specifications:

Item	Description
Product number	KA85010UA
Maximum number of connected cells	26 cells
Main functions	Cell voltage, current, and temperature measurement; EIS measurement
EIS method	Inductor excitation method; V/I complex calculation using quadrature detection
Voltage measurement accuracy	±2.0 mV (EOL)
Functional safety and quality	ISO 26262 compliant (ASIL-D); AEC-Q100 compliant

The post Nuvoton Introduces 26-Cell EIS Battery Monitoring IC for EV Battery Diagnostics appeared first on ELE Times.

It smells exactly how you’d imagine submitted by /u/jellzey [link] [comments]

As AI data centers scale to support high-power GPU clusters, the industry is shifting toward 800V DC rack power architectures to improve distribution efficiency, increase power density and support next-generation server designs. To help accelerate this transition, power semiconductor firm Navitas Semiconductor Corp of Torrance, CA, USA and Microchip Technology Inc of Chandler, AZ, USA have collaborated on an 800V DC-to-6V DC reference design for AI data-center rack power applications...

Layer <0,1,0,1,0,0,0> segment(01,01). 10kx10k image, zoom in. submitted by /u/protofield [link] [comments]

A retro-arcade clock on a 128×64 RGB LED matrix driven by an ESP32-S3 brings 1980s video game icons to the workbench. Keralots’ project combines fourteen animated clock styles, weather without an API key, and PC performance monitoring in a single desktop device. Configuration happens from the browser, without recompiling the firmware.

The hardware foundation is two Waveshare P2.5 64×64 HUB75E panels, scan 1/32, chained into a single 128×64 pixel canvas. The FM6126A driver requires initialization that the firmware handles automatically at startup. The control board is an ESP32-S3-WROOM-1 (N16R8) devkit, with 8MB of PSRAM and 16MB of flash: enough space for the firmware, GIFs, and custom animations.

Styles, Cycle All, and custom animations

The clock styles cover arcade classics: Mario, Space Invaders, Pac-Man, Snake, Tetris, Asteroids, Dino Runner, and Matrix Rain, plus Weather variants and others. Cycle All mode alternates styles in sequence, with a configurable duration from 5 to 3600 seconds per style. Ambient screensavers and user-uploaded GIFs can also replace the clock, with hourly scheduling.

Storage for animations on the board is 128KiB, within the 4MB of available flash. An empty tested device holds about 23 animation frames. The input limit for GIFs is 8MiB, while the converted .pca file has a maximum of 1.5MiB and up to 360 frames. The command-line tool tools/gif2pca.py, which requires pillow, converts GIFs into the proprietary format.

Power supply and measured consumption

Power comes from a dedicated 10A 5V supply, with a 2200µF, 25V capacitor on the bus. Estimated consumption in use is about 10W, with measurements under 30W in normal conditions. The power connection goes through a USB-C power breakout and an XT60 panel feed, keeping wiring tidy and safe.

PC monitor mode receives metrics over local UDP on port 4210 from a companion app for Windows or Linux. The app sends up to 20 CPU, GPU, RAM, and network metrics, with a default update interval of 3 seconds. When the PC is offline, the clock automatically returns to displaying the time.

The optional weather feature uses Open-Meteo, which requires no account or API key, with updates every 10 minutes. The built-in web interface configures clock style, per-element colors, brightness with scheduled night dimming, timezone with automatic DST, and OTA updates. All code, firmware, and conversion tools are collected in Keralots’ repository.

For those who want to rebuild the project, the documentation includes the wiring diagram for the HUB75E panels and instructions for flashing the firmware. Keralots’ repository is the starting point for downloading the code and utilities. Keralots’ repository contains the full firmware and the companion app.

The component list for the build is as follows:

• ESP32-S3-WROOM-1 (N16R8) devkit
• Waveshare ESP32-S3-Zero
• 2x Waveshare P2.5 64×64 HUB75E panels
• FM6126A driver
• 2200µF, 25V capacitor
• USB-C power breakout
• XT60 panel feed

Choosing an ESP32-S3 with generous PSRAM and flash keeps the project smooth even with complex animations. The combination of P2.5 panels with a 2.5mm pitch offers good pixel density for a desk clock. The result is a device that changes appearance with a click, from minimalist clock to arcade system monitor.

Source: https://github.com/Keralots/AnimatedPixelClock

The post Retro-Arcade Clock on RGB LED Matrix with ESP32-S3 appeared first on Open Electronics.

On a safety module.l took apart to take a look, i have no intention to put it back in production. submitted by /u/PatrikuSan [link] [comments]

Is there actually any AI in the “AI Box”? Highly doubtful. That said, it’s still reasonably durable, along with being platform-nimble. And the price-attractiveness is indisputable.

Sorry, readers. To quote baseball terminology, when it comes to teardowns of Apple CarPlay and Google Android Auto wireless adapters, I’m “0-for-3”. Not when it comes to fundamentally doing them, mind you; here are the two that EDN has published so far:

• Adapter makes Apple CarPlay connectivity wireless
• Adapter makes Google’s wireless Android Auto a reality

And the “combo” conclusion is appearing today. But none of them match the ones I told you I’d dissect at the end of my initial conceptual coverage in January.

Why? Well, as I mentioned at the time, the original CarPlay one I ordered never ended up getting delivered, so I’ll deflect any personal responsibility for that particular change in plans. And as for the Android Auto one, I realized upon further reflection that the device I was planning on disassembling was already obsolete, so I instead went with something more up-to-date and otherwise interesting; that NFC subsystem, for example.

In this case, as I re-read the initial January coverage, I realized that I’m being a bit overly harsh on myself. I’d actually never published a promise to subsequently tear down one of the combo devices (with both Apple CarPlay and Google Android Auto support) I’d gotten working in my wife’s Land Rover, although that was always my “inner voice” intent. Specifically, I’d been targeting the one from VCARLINKPLAY as my patient.

But it’s admittedly difficult for me to destructively disassemble perfectly good (and already setup and ready-to-go) hardware, as anyone who’s seen my editorial celebrations after successful re-assemblies and subsequent donations already realizes. That said, from past experiences with the CarPlay- and Android Auto-only devices, I doubt I’d have similar back-together success this time. So, when I came across a cool-looking alternative on eBay for only $9.98 plus tax, I couldn’t resist.

AI? Really?

This first photo of the outer packaging for the actual product I was shipped will, I think, explain the AI references in the title and subhead, not to mention in this particular section header.

As I recently wrote, regarding a different device I was in the process of dissecting:

Is there something explicitly artificial intelligence-related to this product (and/or the manufacturer, more generally), or is it just one of those cases nowadays where “anything sounds more important if you tack “AI” onto it”?

I think we all already know the answer to that question, right? Anyway, onward with the remaining few meaningful sides of the outer packaging.

As usual with products like this, there’s an FCC logo suggestive of certification printed on the packaging, but no actual certification ID to be found anywhere. Again, sigh.

And now let’s open ‘er up.

A sliver of literature, and a nicely included USB-A to USB-C adapter.

And now, last but definitely not least, our patient, initially complete with protective plastic on both the glass (presumed) top and USB-A plug.

A vented metal (aluminum, again presumed) chassis.

Once again, no FCC certification ID. But at least we now know the product code: Q1AS. Not that it helps us much. Google it and you’ll find devices in multiple shapes, sizes and colors, and in both CarPlay-only, Android Auto-only and combo flavors, the latter suggestive of common hardware differentiated solely via software.

I’m guessing this is for attachment to a keychain? Or a leash, mebbe?

And, wrapping up the overview, let’s ditch the plastic bits.

Diving inside

I’d previously mentioned that I thought the topside was glass, therefore the “reasonably” qualifier alongside “durable” (referencing the otherwise-metal body) in the subhead. Let’s test that hypothesis.

Where have I seen something like this before? Ah yes. Yep, glass.

And we’re in.

That glue you see on both ends of the PCB doesn’t seemingly do much; popping out the circuit board was easy.

Let’s look more closely at the topside first.

A nifty marking pattern atop the largest IC, presumably the application processor, although the absence of any meaningful accompanying info isn’t helpful. Arm-based, presumably. Albeit not definitively.

The other two ICs, both above it, include XTX Technology’s XT25F128F serial NOR flash memory, presumably storing system firmware along with various data bits, and to its right a smaller chip marked as follows, whose identity escapes me (readers?).

B11
3959
2512

At bottom right is a 24-MHz crystal, presumably feeding oscillation to the application processor. And on the right edge is the multi-function LED, whose illumination heads out the top via an integrated light pipe.

Now for the PCB’s other side.

The largest silicon sliver this time is the AIC8800M40, a dual-band Wi-Fi-plus-Bluetooth controller from Shenzhen TrolinkTek Technology. The PCB-embedded antenna is to its left, although reiterating what I’ve said before, I only see one of them and I therefore don’t know how it’s capable of handling both 2.4 GHz and 5 GHz duties.

Also located on this particular piece of PCB real estate are four odd-lead-count packaged devices, three of them (all five-lead) marked “t50KfP1” and the other three-lead one stamped with “ADAA” on top. I’m guessing they’re transistors (duals in the five-lead cases) but again welcome reader suggestions. And once again we find a user-inaccessible SPST switch, in the diagonally opposite corner from the aforementioned antenna. Freakish.

Thus concludes another editorial series. I hope you’ve found it to be as educational and otherwise enjoyable as I have. Closing reader thoughts are as-always welcome in the comments!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• Adapter makes Google’s wireless Android Auto a reality
• Adapter makes Apple CarPlay connectivity wireless
• Apple CarPlay and Google Android Auto: Usage impressions and manufacturer tensions
• Spotify’s Car Thing: “Why does it exist” is the crux of the questioning
• Amazon’s Echo Auto Assistant: Legacy vehicle retrofit-relevant

The post An Apple-plus-Google adapter that’s AI in name only (sigh) appeared first on EDN.

Murata Manufacturing, a Japanese global leader in electronic components and communication modules has begun mass production of the LLD series, the world’s smallest line of three-terminal, low equivalent series inductance (ESL) multilayer ceramic capacitors (MLCC). Measuring just 0201-inch size (0.6 × 0.3 mm), the new products reduce mounting area by approximately 64% compared with Murata’s previous smallest 0402-inch size (1.0 × 0.5 mm), freeing up valuable PCB space in compact devices such as smartphones and wearables.

Today, as the use of powerful ICs is embedded into smartphones and wearables, providing a stable power source is difficult. During high speed operation, the current fluctuates very fast, resulting in fluctuations in voltage to the IC. Reducing this instability to the lowest possible level is critical. Three-terminal capacitors with their four current paths are shorter than two-terminal devices and exhibit a lower ESL than traditional two-terminal components.

At the same time, thinner and smaller electronic devices require efficient use of limited PCB space. However, miniaturizing three-terminal capacitors has been difficult because their internal and external electrode structures are more complex than those of conventional two-terminal types.

Murata overcame this challenge by optimizing the electrode design and advancing its manufacturing processes. The resulting 0201-inch products enable high-density mounting while stabilizing the power supply voltage near ICs, even at high frequencies. This gives designers greater flexibility in component placement and circuit design around ICs, supporting higher performance in space-constrained electronic devices.

Two models are available. LLD033R60G105ME01 has a capacitance of 1 µF, a rated voltage of 4 Vdc, and an operating temperature range of -55 to +85°C. LLD033D80E105ME01 has a capacitance of 1 µF, a rated voltage of 2.5 Vdc, and an operating temperature range of -55 to +105°C.

Murata will continue developing compact, high-performance MLCCs for mobile and wearable devices, contributing to further miniaturization and enhanced performance of electronic equipment.

The post Murata Begins Mass Production of World’s Smallest 0201-Inch Three-Terminal Low-ESL MLCCs appeared first on ELE Times.

​According to General Motors’ official newsroom, General Motors (GM) and LG Energy Solution are collaborating to produce lithium manganese-rich (LMR) battery technology that could reduce the cost of electric vehicles while delivering high energy density. This joint venture is upgrading its Ultium Cells plant in Spring Hill, Tennessee, to produce LMR battery cells for future EV applications.

The manufacturing plant is expected to be completed by 2028 to produce LMR cells that could deliver 33% higher energy density than Lithium Iron Phosphate (LFP) battery cells at a comparable cost. The major components of LMR battery technology contain 35% nickel, 65% manganese, and virtually no cobalt, targeting future GM electric full-size trucks and SUVs. LFP batteries are widely used in electric vehicles because of their low cost and thermal stability, but they require large and heavy battery packs to cover a longer range.

LMR addresses this challenge with higher energy density, allowing manufacturers to build smaller and lighter battery packs while delivering the same amount of power. The chances of adopting this concept are high, as major manufacturers look for alternatives that can balance cost, energy density and performance. The move also highlights the growing focus on developing new technologies at scale using existing manufacturing facilities.

If this concept is successfully commercialized, the rate of adopting this technology for future electric vehicles will depend on several factors such as cycle life, charging performance, thermal management, manufacturing cost, and the amount of production.

The post GM and LG Develop Lithium Manganese-Rich Batteries to Lower EV Costs, Increase Energy Density appeared first on ELE Times.

​Chinese automobile manufacturer Geely launched Geely Smart Charging, an ultra-fast AI-powered charging system on September 23 in Ningbo, China, featuring real-world demonstrations. The new technology introduced by Geely significantly reduces charging time, charging an electric vehicle from 10% to 70% in 4.5 minutes and to 97% in 8 minutes and 40 seconds.

The core components used in building this efficient charging technology include Xingrui PowerMind AI to adjust power dynamically, Fifth-Gen Charging Station (C12) that delivers power up to 2,250 kW (2.25 MW) per connector, Next-Gen Ultra Short Blade Battery that reduces charging heat by 10% and supports ultra-fast charging speed, and Lithium-Ion Pulse Restoration Tech, which uses micro-pulse currents and a 5-point liquid-cooling system to increase battery cycle life by 20%.

The technology combines 2.25 MW of charging power with a high-rate battery designed to store a large amount of electrical power in a very short time interval. The company says this technology is introduced to address a major problem in EV adoption: charging vehicles for long hours compared with traditional refueling.

The company is also incorporating artificial intelligence in this charging solution to monitor battery conditions and dynamically manage parameters such as temperature and charging performance during a charging state. Using artificial intelligence in high power charging solution is aimed at making fast charging more practical while maintaining battery safety.​

The post Geely Launches 4.5-Minute EV Charging Technology With 2.2 MW Power appeared first on ELE Times.

Davisan1001’s project solves a classic problem for anyone working with LED matrices: getting an even, uniform glowing surface, without halos and without seeing the individual pixels. The solution is a 3D printed enclosure for a 64×64 RGB LED matrix, with a mounting point for a Raspberry Pi. The front uses simple materials: a 3D printed grid, baking paper and a sheet of clear plastic.

The grid is the heart of the system. Each cell of the grid lines up with one LED of the matrix and blocks the light that would otherwise spill onto the neighbouring LEDs. This way every light point stays separate from the others and the diffusion happens in a controlled way. The baking paper, placed above the grid, acts as the diffuser: it is thin, easy to handle, flat and even in colour.

3D printing the grid

The grid does not require complex 3D modelling. Davisan1001 exploits the slicer settings: a flat square is printed with a grid infill and zero solid top and bottom layers. The slicer generates the cell structure by itself. The result is a precise grid, with thickness and cell size controlled by the print parameters.

The choice of diffusion materials is not random. Plain white paper blocks too much light, while waxed paper gives poor output and a poor off-axis view. Baking paper, on the other hand, is opaque enough to diffuse the light without blocking it. A sheet of clear plastic completes the assembly, protecting the paper and giving rigidity to the surface.

Materials and assembly

Rebuilding the project takes only a few components. Besides the 64×64 RGB LED matrix and the Raspberry Pi, you need the 3D printed grid, baking paper and a sheet of clear plastic. The printed enclosure includes the mounting point for the Raspberry Pi, so the electronics stay integrated and tidy.

• 64×64 RGB LED matrix
• Raspberry Pi
• 3D printed grid
• Baking paper
• Sheet of clear plastic

The assembly is within anyone’s reach: place the grid over the matrix, then the baking paper and finally the plastic sheet. Everything closes up inside the enclosure. For those who want to dig deeper, the page of Davisan1001’s project collects the files to print and the useful instructions to replicate the diffuser.

The result is an LED panel with a smooth surface and well-defined square pixels. The solution is inexpensive and uses materials that almost everyone has at home. What is more, the technique of the slicer-generated grid can be reused for other LED matrix sizes or for similar projects.

Source: https://www.thingiverse.com/thing:6687509

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India’s Ministry of Defence announced on September 23 that it has entered into a contract with the government-owned enterprise, Bharat Dynamics Limited (BDL), to procure 160 Satellite Smart Anti-Airfield Weapons for the Indian Air Force, worth roughly 811 crores. The contract is a step towards augmenting the Air Force’s precision-strike capabilities and promoting a robust domestic defence production ecosystem. BDL is a state-owned defence company that manufactures guided weapons and other equipment.

BDL Contract Supports Indigenous Air-Launched Weapon Procurement

A satellite-guided weapon uses its positioning information to estimate the location and guide the weapon to programmed points. There are two possibilities depending on the weapon type: some cartridges use inertial navigation combined with satellite information, which means the weapons estimate a displacement between two waypoints based on an internal inertial navigation device. The fusion of the two-navigation mode allows better guidance continuity in a degraded environment. An anti-airfield weapon is designed for an airfield-related target.

Such cartridges need to be suited to the aircraft as well as specific mission planning and release procedures. They must meet preconditions such as accuracy, navigation capabilities, robustness, and compatibility with the launch platform. The statement also mentions that Indian defence manufacturers will be providing the supply of equipment to the armed forces. India has to develop industry and supply chains, along with maintenance skills, with respect to indigenous manufacturing. The timings of manufacturing, milestones, and operationalisation are subject to contractual obligations and the procurement process.

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​The Indian Coast Guard recently announced the interception of a transnational syndicate linked to a seaborne narcotic haul worth about 3,000 crores, in a Ministry of Defence press release dated September 30, 2026. This seaborne drug haul exemplifies a maritime security agency’s effort to combat illicit trafficking in coastal and wider maritime domains. Maritime traffic’s vast ranges of maritime traffic and the immense extent of the maritime domain’s 24×7 tracking and surveillance challenge maritime security agency interdiction efforts.

Coast Guard Operation Highlights Maritime Surveillance and Interdiction

Maritime interdiction often relies on a series of interrelated capabilities. Information gathered from sensitive surveillance networks, shipborne radar and electro-optical sensors, protected communications and data sharing systems enables authorities to develop a picture of activity at sea. This targeted activity can then draw on the deployment of patrol vessels or other assets authorised to stop and search vessels if required.

This operation will be successful if it is possible to share information, encourage watch locations, maintain security over sensitive areas, and make best use of resources. Using fusion techniques, operators can combine information, but a detection still has to be identified and verified before a vessel can be stopped and identified. The seizure of large quantities of drugs can help break up trafficking networks and reduce the impact of the network’s actions, but this is only part of understanding its size and shape.

The post Indian Coast Guard Reports Major Narcotics Seizure in Anti-Smuggling Operation appeared first on ELE Times.

The Indo-ASEAN joint Exercise, AIME-26, has started in Subic Bay, Philippines, as per the Ministry of Defence (MoD). The statement was uploaded on 30 September 2026 by the official website of the Press Information Bureau (PIB), and the exercises represent one of the most significant elements of India’s interaction with ASEAN in the maritime sphere, as they constitute a forum for maritime cooperation. Such exercises facilitate participating navies to operate in close coordination, practice SOPs and conduct liaison at sea.

AIME-2026 Strengthens Regional Maritime Engagement

Maritime operations might include the planned manoeuvres, the communication exercise, the search-and-rescue drill, and other professional exchanges arranged as part of the exercise schedule. These activities allow participating forces to familiarise themselves with each other’s procedures and build the capacity to work together in actual maritime-security operations. Location matters. Numerous commercial shipping lanes exist throughout the Indo-Pacific, with ships from all nations moving along these commercial routes.

Naval ships are also expected to be prepared to respond to maritime security threats, including piracy, smuggling, accidents at sea, and other navigation hazards. Maritime coordination can be achieved without ships. Secure communications, navigation aids, radar, identification methods, operational information sharing, and similar programs all contribute to the awareness picture at sea; while exercises can help service personnel practice using them with partner forces, it should not be assumed that all countries’ equipment and operating procedures align.

The post ASEAN–India Maritime Exercise 2026 Begins in the Philippines appeared first on ELE Times.

India and France are stepping up their partnership in space technology into the realm of satellite production and defence related monitoring, the Financial Express has reported, quoting a $5 million deal between India’s Dhruva Space and France’s Safran Space on the construction of 275 satellites. The report suggests that while India’s space-based surveillance capacity is growing, this particular partnership falls under the Space-Based Surveillance Phase III programme, which is a larger and more ambitious mission to improve monitoring of India’s land and water territories via an expanded satellite fleet.

Dhruva Space–Safran Partnership Highlights Satellite Manufacturing

Distributed satellite constellations allow monitoring many sites on several continents repeatedly to detect changes to land borders, coastlines, and seascape approaches. The spacecraft can be equipped with an optical payload, a radar, or other sensors. Especially with radar imaging, observation can be more independent of clouds or limited sunlight, and distributed constellations can lower reliance on a small number of large spacecrafts.

However, the operational utility of constellations depends on the constellation and orbital designs, including, for example, the ground infrastructure, the revisit time, the sensor capabilities, and the downlink capabilities. The large share of the private sector in the reported agreement indicates an increased importance of private players in India’s space activities, their manufacturing capabilities, specialised components, and also the potential for cross-border collaboration.

The post India–France Space Cooperation Targets Military Surveillance Capabilities appeared first on ELE Times.

JEDEC Solid State Technology Association (which develops standards for the microelectronics industry) has announced the release of ‘JESD264: Silicon Photonics Qualification and Reliability Requirements’, the first industry-wide standard designed to bring consistent qualification and reliability practices to silicon photonics devices. By establishing a common baseline for testing and manufacturing controls, the standard helps to reduce deployment risk and supports broader adoption of silicon photonics in high-speed data-center, telecoms and AI networks...