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Auto EV Bharat 2026 Announces Its 5th Signature Edition with Next-Gen Tech Focus and Global Pavilions

New Delhi – The countdown has officially begun for Auto EV Bharat 2026, South Asia’s defining exhibition on future mobility and electric vehicle technologies. Celebrating its monumental 5th Signature Edition, the event will be held from December 9 to 11, 2026, at the KTPO Convention Centre, Whitefield, Bengaluru.

Auto EV Bharat 2026 brings together the entire automotive technology ecosystem under one roof. The 2026 edition scales new heights by bringing together global stakeholders, automotive manufacturers, OEMs, Tier-1 suppliers, and R&D trailblazers from 9 participating countries. A prime highlight of this year’s international floor plan includes exclusive country pavilions from Italy and China. Engage in cross-border technological collaborations, joint ventures, and direct sourcing of world-class automotive solutions beyond boundaries!

Spotlight on 2026: Next-Gen Mobility & Core Technologies

Vehicles are transitioning rapidly from mechanical systems to smart, software-driven computing nodes. Keeping this paradigm shift in mind, Auto EV Bharat 2026 intends to put a sharp, engineering-first lens on the frontier pillars shaping the future of transportation:

• ADAS 2+ & Level 3 Systems: Showcasing advanced driver-assistance sensor fusion, LiDAR/radar modules, and autonomous driving architectures designed for complex real-world driving conditions.
• Software-Defined Vehicles (SDVs): Highlighting the shift toward centralized vehicle architectures, real-time operating systems, over-the-air (OTA) update frameworks, and advanced development tools.
• Automotive Semiconductors: Addressing the massive surge of chip integration in modern vehicles, focusing on power management ICs, microcontrollers, and localized semiconductor supply chains.
• Automotive AI: Exploring machine learning applications for predictive maintenance, cabin monitoring, intelligent energy management, and autonomous navigation algorithms.
• SiC & GaN Power Electronics: Featuring high-efficiency Silicon Carbide (SiC) and Gallium Nitride (GaN) devices that drive lighter, faster-charging, and thermally resilient inverters and on-board chargers.
• Battery Intelligence: Unveiling smart Battery Management Systems (BMS), cell-to-pack innovations, next-gen chemistry monitoring, and comprehensive end-to-end battery testing infrastructure.

Concurrent Event: Auto EV Tech-Vision Summit 2026

And there’s more! Running concurrently with the exhibition is the Auto EV Tech-Vision Summit, a power-packed two-day conference dedicated to solving critical R&D and design challenges. The summit will feature expert-led keynotes, panel discussions, and interactive technical sessions addressing vehicle architecture, charging ecosystems, and commercial scalability. It serves as a vital knowledge-sharing platform for working design and product engineers, embedded systems developers, and industry leaders.

Quick Event Facts:

• Event: Auto EV Bharat 2026 (5th Signature Edition)
• Dates: December 9–11, 2026
• Concurrent Conference: Auto EV Tech-Vision Summit (2 Days)
• Venue: KTPO Convention Centre, Whitefield, Bengaluru, India
• Official Website: www.autoevbharat.com, www.techvisionsummit.com

The post South Asia’s Premier Exhibition for Future Mobility Technologies appeared first on ELE Times.

Every embedded project eventually needs to address similar challenges around how much storage should be allocated to the operating system, how much should be reserved for applications, how much capacity should be allocated for system and diagnostic logs, and whether there is enough space for future software updates.

These decisions are usually made early in development, long before the first product reaches the field.

For years, that approach served the embedded industry well. Software changed relatively slowly after deployment, applications performed clearly defined functions, and storage requirements were stable enough that engineers could make sensible decisions upfront and rarely revisit them.

Today, many teams are discovering those decisions don’t last nearly as long as they used to. Products that once received only occasional firmware updates now continue evolving throughout operational lifetimes that often exceed 15 years. The hardware stays the same, but the software keeps changing.

Moving beyond static partitions

Static storage partitioning solved an important engineering problem. Applications were isolated from one another, storage behaviour was predictable, and engineers knew exactly where critical software and data would reside. In embedded systems, that level of determinism remains valuable. Today, the challenge is that software-defined systems rarely evolve evenly.

One application may barely change throughout the life of a product. Another may double in size over several software releases. At the same time, logging requirements increase, configuration data expands, and new AI models arrive years after the original storage layout was designed.

Eventually, the symptoms become familiar. One partition starts running out of space while another still has capacity that will probably never be used. Software teams spend time optimizing storage layouts instead of developing new functionality. Hardware that still has usable flash becomes constrained because it cannot be used where it’s needed most.

Why overprovisioning isn’t a long-term answer

One obvious response is to reserve more storage during development. Many embedded platforms already include generous safety margins for exactly this reason. If engineers don’t know which applications are likely to grow over the next decade, the safest option is often to allocate additional storage to all of them. That approach reduces immediate risk, but it also leaves flash capacity permanently tied to assumptions that may never prove correct.

As software-defined products become more complex, and flash prices continue to rise, this strategy becomes increasingly difficult to justify. Industry analysts have reported significant increases in NAND and NOR flash prices over the past year, meaning every additional gigabyte contributes to higher hardware costs. As a result, overprovisioning has become a bill-of-materials (BoM) consideration.

The impact of software updates

Over-the-air (OTA) updates illustrate the problem particularly well. Reliable update strategies require storage for downloading, validating, and, if necessary, rolling back software when something goes wrong. Traditional A/B partitioning addresses this by maintaining duplicate software images so that the previous version remains available until the update has been verified. This means significant amounts of flash remain reserved for situations that occur only during the update process.

A/B partitioning remains a proven and widely adopted approach because it provides a straightforward and reliable rollback mechanism if an update fails. The trade-off is that maintaining two complete software images requires a significant amount of flash to remain reserved for the update process.

As software-defined systems become more capable, that approach can increase storage requirements, enlarge software downloads, and add to the cost and complexity of deploying updates across connected devices. With flash prices continuing to rise, many engineering teams are beginning to question whether permanently reserving that capacity remains the right trade-off for every platform.

Looking at storage differently

Rather than treating storage as a collection of permanently assigned partitions, more engineers are beginning to view it as a managed system resource. This is where the concept of a dynamic data layer becomes useful.

One of the challenges it addresses is static storage allocation. Instead of permanently assigning flash to individual applications, storage can be managed as a shared resource. Applications remain isolated through mechanisms such as subvolumes, while quotas define how much storage individual workloads may consume and reservations ensure critical functions always retain guaranteed capacity.

This allows storage to adapt as software evolves. Capacity that would otherwise remain stranded in one partition can be made available elsewhere, improving utilization without sacrificing isolation or predictability.

Rethinking OTA architectures

The data layer also creates opportunities to rethink how over-the-air updates are managed. Traditional A/B partitioning remains a robust and widely adopted approach because it provides a straightforward rollback mechanism if an update fails. However, maintaining duplicate software images permanently reserves a significant amount of flash capacity.

Snapshot-based approaches provide an alternative. Rather than storing two complete software images, the file system tracks changes at the block level so only modified data needs to be written during an update.

The pre-update snapshot provides a reliable rollback point while reducing storage overhead, download size, and update effort. As flash prices continue rising, more engineering teams are evaluating these techniques as another way to improve storage efficiency without compromising reliability.

Flexibility still requires discipline

Dynamic storage management doesn’t remove the engineering constraints embedded systems have always depended on. Deterministic behavior remains essential as critical applications still require guaranteed resources. Functional safety, reliability, and predictable recovery mechanisms continue driving architectural decisions.

The objective isn’t to make storage dynamic for its own sake but to recognize that software is no longer static in the way it was when many of today’s storage architectures were originally conceived. As systems continue to evolve throughout their operational lifetime, storage management must evolve with it.

A different role for the data layer

Storage has traditionally been viewed as supporting infrastructure. Once the partition layout was complete, attention naturally shifted to processors, applications, and communications.

Software-defined systems are changing that perspective. The data layer is becoming a more active part of system architecture because it influences how efficiently software can evolve throughout the life of a product. It affects update strategies, application growth, storage utilization, and long-term maintainability just as much as raw flash capacity.

Instead of asking whether today’s applications fit into today’s partition layout, engineers are beginning to ask whether the storage architecture itself is capable of supporting software that hasn’t yet been written. While the answer will differ from one platform to another, what seems increasingly clear is that storage can no longer be designed around the assumption that software remains static after deployment.

Embedded systems have entered an era of continuous software evolution, and the architectures beneath them need to evolve for the same reality.

Sami Kassimäki is product manager at Tuxera.

Related Content

• Embedded Basics
• 8 pillars of embedded software
• 7 tips for optimizing embedded software
• Embedded systems: The marketplace in 2028
• Can Agentic AI Solve the Embedded Software Problem?

The post Why software-defined systems require a dynamic data layer appeared first on EDN.

NUBURU Inc of Centennial, CO, USA (a dual-use defense & security integrated platform company) says that the Italian Government has authorized the proposed acquisition by NUBURU Defense LLC of a 70% controlling interest in Tekne S.p.A. under Italy’s Golden Power framework...

Uviquity of Raleigh, NC, USA – a venture-backed start-up founded in 2022 that is pioneering integrated photonics, developing photonic integrated circuits (PICs) on a proprietary aluminium nitride (AlN) platform for quantum and ultraviolet applications – says that Dr Vincent D. (Chuck) Mattera Jr, founder & CEO of Avalanche Thinking Inc and former chair & CEO of Coherent Corp, has joined it as a strategic advisor as it scales its AlN photonics platform and accelerates commercialization...

PRAMA showcased innovative Defence Security Solutions at 15th Strategic Electronics Summit (SES), an exhibition and conference on Defence, Aerospace, Drones and Security, held from 23rd -24th July 2026. It was Organized by the Electronic Industries Association of India (ELCINA), the premier defense and aerospace event took place at the Bangalore International Exhibition Centre (BIEC) in Bengaluru. The event brought together innovators, manufacturers, system integrators and startups on the same platform.

PRAMA management representative said, “The Indian security market is growing to a mature level to address the key requirements of Defence and Aerospace sectors. We find SES-2026 event, a highly valuable exhibition platform to connect with the key stakeholders and ecosystem partners. We showcased the latest products and solutions in this expo. We appreciate ELCINA’s proactive role in organizing ‘SES-2026’ to spur innovation and engagement with key industry stakeholders.”

He further elaborated, “PRAMA, being India’s premier indigenous security brand holds, great significance. The spectacular growth that India security industry has achieved, PRAMA’s evolution as a leading security brand is the manifestation of Indian spirit and ingenuity. We are taking indigenous manufacturing to the next level. We are here to offer best-in-class products with cutting edge technologies that can deliver solutions as per the Defence requirements.”

The beautifully designed spacious PRAMA booth was center of attraction for the industry specific visitors. PRAMA booth showcased the latest products and defence sector’s solutions, including Ai based Perimeter Defence Solutions, Access control and attendance monitoring solutions, Advanced Driver Assistant System (ADAS) & Driver Behaviour Ananlysis (DBA) Solutions, Mobile Security System and many more.

PRAMA booth displayed the latest video security products, including Ai Solution. PRAMA’s AiSense technology, powered by advanced AI Algorithms, takes surveillance to the next level. This technology intelligently distinguishes people and vehicles from other moving objects, reducing false alarm caused by animals or environmental factors. With AiSense Technology one can focus on the real threats, optimize resources and build on an intelligent security system. The Strategic Electronics Summit (SES)-2026 is a unique event platform created by the ELCINA). The two-day event helped to create awareness about the latest IT and Security trends. The event was attended by the key defence and aerospace professionals, Government officials and key stakeholders from the electronics Industry.

 

 

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As generative AI and high-performance computing (HPC) continue to drive the evolution of cloud infrastructure, data centers are rapidly adopting more efficient and scalable architectures. At OCP APAC Summit 2026, Nuvoton Technology will showcase its advanced silicon solutions for the next-generation cloud, featuring innovations in high-speed connectivity, system management, power management, and environmental monitoring.

Nuvoton’s comprehensive portfolio helps customers enhance system performance, reliability, and energy efficiency, accelerating the development of next-generation cloud and AI infrastructure within the OCP ecosystem.

Enabling the Next-Generation Cloud with Integrated and Secure Server Management

Nuvoton’s Arbel NPCM8mnx SiP integrates the BMC subsystem into a single package, reducing board space by up to 70% and simplifying and accelerating AI server system design and cloud platform deployment. With post-quantum cryptography (PQC) support and an open architecture, it delivers high performance, security, and scalability for the OCP ecosystem.

Advancing the OCP Ecosystem: Building a Secure and Efficient Management Architecture for Next-Generation Platforms

The NPCM5mnx Satellite Management Controller (SMC) is designed for AI servers, GPU accelerators, and Open Compute platforms. Featuring an ARM Cortex-M7 core, Caliptra 2.1 Root of Trust, and post-quantum cryptography (PQC), it supports multi-node servers and OCP Streaming Boot to enhance platform security, management efficiency, and scalability.

Enabling High-Voltage Battery Backup Units (BBUs) for Mission-Critical AI Servers

Designed for AI server BBUs and large-scale energy storage systems, Nuvoton’s battery monitoring ICs support daisy-chain communication with up to 55 devices, simplifying 400V/800V BBU designs. By reducing component count and minimizing board space, they enhance system efficiency and reliability in high-voltage environments. In addition, A dedicated transportation and storage mode with ultra-low shutdown current helps extend battery storage duration and reduce operational costs.

Strengthening Platform Trust with Device Authentication, Firmware Management, and Quantum-Ready Security

The NuMicro M2354 microcontroller integrates TrustZone, Secure Boot, and DICE architecture to establish a device-unique trusted identity. With SPDM responder, PLDM Firmware Device, and post-quantum cryptography (PQC) implementation, the M2354 helps enable trusted device verification, standardized firmware management, and long-term security resilience for next generation server and IoT platforms.

Intelligent System Management for Efficient and Reliable Cloud Infrastructure

Nuvoton’s system management portfolio combines ultra-low-power temperature sensing, smart fan control, and I²C connectivity management to optimize data center operations. These solutions improve system reliability, energy efficiency, and thermal management while simplifying platform design for next-generation cloud infrastructure.

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Infineon Technologies is partnering with MediaTek to enable an advanced AI-driven in-cabin experience in future vehicles. MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1. This turns the Infineon device into an approved and easily adoptable memory option for automotive OEMs, Tier-1 suppliers, and design partners developing the next generation of smart cockpit systems.

“Automotive memory is a strategic enabler of innovation as software-defined vehicles depend on high-performance Systems on-Chip (SoCs), increasingly complex firmware, and large data stores,” said Rainer Hoehler, Senior Vice President Memory Solutions at Infineon Technologies. “Cutting-edge digital cockpits and over-the-air update capabilities are driving the demand for higher density NOR flash. With the qualification by MediaTek, customers can now easily integrate Infineon’s 512 Mb NOR Flash as a future‐ready memory solution for smart cockpits.”

“Infineon’s automotive-grade NOR Flash delivers the performance, reliability, and functional safety features required for our premium and high-end Dimensity Auto Cockpit platform C-X1,” said Mike Chang, MediaTek Vice President and Auto Business General Manager. “Its high-density design enables the advanced AI and user-experience capabilities that will be essential in next-generation software-defined vehicles. Building on our long-standing collaboration, we leverage Infineon’s industry leadership to deliver a reliable backbone for the evolving software-defined ecosystem.”

Infineon’s 512 Mb QSPI NOR Flash memory stores the firmware and boot code required to facilitate AI-driven features at the SoC level, such as voice assistants, driver monitoring, travel vlog generation, environmental perception, and personalized audio-visual recommendations. By supporting Safe and Secure Boot, it also provides critical redundancy for enhanced safety. Built on Infineon’s MirrorBit technology, it offers a robust interface, broad compatibility with leading Automotive SoCs, AEC Q100 qualification, and operating temperature support up to +125 °C.

 

 

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Bridge Data Centres (BDC), a Singapore-headquartered hyperscale data centre provider, and Morong Electric, an electrical manufacturing specialist, have launched PowerCore 5.0, the world’s first fully prefabricated power module designed for high density AI data centres.

Built for high-density AI workloads on accelerated deployment timelines, the module complies with the technical standards of BDC’s proprietary i-Power Cube, its power system designed for high-performance computing. It integrates seamlessly with the Bridge Omni Platform, BDC’s modular intelligent infrastructure platform for the AI era. PowerCore 5.0 combines BDC’s global hyperscale delivery experience with Morong Electric’s end-to-end electrical manufacturing expertise.

Rapid AI advancement has driven rack power densities from 10kW to more than 100kW, placing stringent new demands on mission-critical power infrastructure. Traditional delivery models, which rely on fragmented procurement and on-site system integration, struggle to cater to the rigorous requirements of AI-optimised data centres. Drawing on BDC’s global campus delivery footprint and Morong Electric’s electrical engineering expertise, PowerCore 5.0 addresses these challenges through four core design attributes: factory pre-integration, standardised global transport, parallel construction and maintenance without downtime.

Factory pre-integration

Each unit integrates transformers, power distribution, uninterruptible power supply (UPS), cooling, fire suppression and monitoring systems into a single module, fully assembled and tested off-site. Site teams need only complete the final cable connections on delivery, removing the quality inconsistencies that accompany conventional field construction.

Standardised global transport

Built on a standard 40ft ISO container frame, the module integrates seamlessly with global shipping networks, eliminating oversized freight premiums, dedicated transport and protracted customs delays that hinder cross-border deployments. Purpose-engineered for BDC’s core markets, it complies with local climatic benchmarks and industrial standards to enable dependable global rollout.

Shortened delivery timelines by more than 50%

On-site civil works and factory prefabrication proceed simultaneously, shortening total delivery timelines by more than 50% compared with conventional build methods. Large campuses can deploy units on a bi-weekly cadence, matching the rapid scaling and flexible capacity expansion that AI demands.

Maintenance without downtime

In an industry first, core components including UPS units, transformers and precision cooling are mounted on slide-out rails. Technicians can withdraw and service individual units without interrupting power to the data centre, keeping high-density compute clusters running around the clock.

Mr Zhang Binghua, Chief Technology Officer of BDC, said, “The AI infrastructure sector is scaling at an unprecedented rate, and operators now require higher power density, faster hardware refreshes and maximum uptime. This shift requires us to rethink how power systems are designed and deployed. PowerCore 5.0 raises the bar on system integration, cross-climate operation, delivery speed and intelligent operations and maintenance. It will enable standardised, low-carbon compute deployments across the globe and provide the stable power foundation to support the continued growth of the global AI ecosystem.”

Mr Zhang Kai, Chairman of Morong Electric, said, “AI hardware now evolves on a monthly cycle, and traditional on-site system integration can no longer keep pace with the operational needs of modern AI data centres. Prefabricated power modules clear the delivery bottlenecks holding back compute infrastructure expansion. This launch marks a critical milestone in our strategic partnership, and we will continue to co-develop high-performance, integrated power solutions that meet global market standards and regional compliance requirements.”

BDC and Morong Electric will continue to develop prefabricated power modules engineered for ultra-high-density compute and cross-border regulatory alignment. Both companies aim to advance industry-wide technical standardisation and the collaborative development of compute infrastructure. Their low-carbon, modular power solutions will support the sustainable and scalable growth of AI operations across international markets.

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The shelf is a 24 V tunable white strip driven by an off the shelf controller. At full brightness it made a high pitched wine. Dimmed to a usable level, it got even worse! Scoping the original controller’s output showed it drives the LEDs with a 2 kHz H-bridge waveform, and dimming inserts 0 V dwell that pumps energy into the harmonics right where your ear is most sensitive. A mic 5 cm away confirmed it, a harmonic comb spaced at 1999 Hz, with the 4 kHz member 16 dB louder when dimmed. The replacement is an STM32 driving a three level H-bridge at 25 kHz through a proper gate driver, BLE control, on a 4 layer board sized to drop into the original enclosure. Every harmonic now lands above the audible band. Current draw came out the same as the original, so the silence was basically free. It also remembers brightness and colour through power cuts, the F303 has no EEPROM so state gets debounced into a flash page. Full writeup with the scope captures, audio FFTs and design files: https://github.com/AShadyPCB/led-shelf-controller submitted by /u/ek_spoon [link] [comments]

I like to read about research innovations even if most of them don’t represent in an advance that can be commercialized or even leveraged to boost technology in general. Sometimes, the work that the team has done demonstrates innovation, discusses ways they addressed and hopefully resolved problems, and even gives insight into areas where there are remaining barriers to overcome.

That’s the case with a research paper I came across on use of paper as a substrate of passive electronic components and interconnects. In the work, “High-Density Papertronics via Laser-Written Hydrophilicity on Hydrophobic Parchment Paper” published at ACS Applied Materials & Interfaces, researchers discuss the long path they have taken to develop their latest effort in paper electronics—dubbed “papertronics”—with the use of standard parchment paper as a substrate for passive electronic elements.

This project builds heavily on other work the team has done under Professor Seokheun “Sean” Choi of the Department of Electrical and Computer Engineering at Binghamton University’s Thomas J. Watson College of Engineering and Applied Science (New York State). They have investigated the use of paper to create fully biodegradable circuit elements such as batteries, sensors, and other components.

The papertronic devices are intended to be low cost, environmentally friendly, and suitable for applications such as single-use medical patches that power using sweat, water, or even saliva as their working fluid. While paper-based electronics of various types are being investigated in many labs, this group has done a significant amount of leading-edge work in this area with a lengthy track record.

Their previous attempts to build passive circuit elements used chromatography paper as a substrate; this paper is a specialized, high-purity cellulose material widely used as the stationary phase to separate mixtures of chemical substances, inks, or plant pigments via capillary action. Unlike everyday normal paper, which contains fillers and sizing agents that interfere with fluid movement, chromatography paper has a consistent texture, controlled thickness, and predictable capillary action, vital for accurate laboratory results.

That approach proved the concept but revealed a stubborn limitation: the wax barriers used to define circuit features blurred and spread when heated, limiting the smallest achievable features to about a millimeter. That kept circuits large—on the scale of tens of centimeters—and prevented the kind of compact, tightly packed designs needed for practical applications.

Rethinking the problem

Their new approach required a radical shift. Instead of hydrophilic chromatography paper, they switched to hydrophobic parchment paper, and using a laser to selectively create hydrophilic channels rather than wax to create hydrophobic barriers, the team inverted the entire fabrication paradigm (Figure 1).

Figure 1 By targeting the parchment paper with a laser, Professor Choi and his team removed the silicone coating to expose water-absorbing cellulose fibers. The channels then act as microscopic highways that guide water-based conductive inks to form electronic circuits. Source: Binghamton University

Note that parchment paper—also called “baking paper”—is a heat-resistant, silicone-coated paper used in cooking and baking as a non-stick, greaseproof surface; you can buy it at almost any supermarket as well as from cooking-supply sources. But there’s some potential for verbal confusion here; the research team is using silicone-based paper as the substrate rather than more-familiar “silicon.” Silicone, of course, is a synthetic rubber-like substance made by combining silicon with oxygen, carbon, and hydrogen.

They developed hybrid paperfluidic-electronic techniques that exploit parchment paper’s capillary action to wick functional materials into predefined regions, yielding components such as resistors, capacitors, inductors, and interconnects (Figure 2).

Figure 2 Conceptual illustration of wax-printed versus laser-induced papertronics. In row (a), wax-printed papertronics on hydrophilic cellulose paper highlights the multiple fabrication steps required for hydrophilic pattern formation via single-sided wax printing and thermal penetration (i) and hydrophilic patterning via asymmetric double-sided wax printing and thermal penetration (ii). In row (b), molten-wax spreading during thermal penetration inherently blurs feature boundaries and limits the achievable resolution. Laser-induced papertronics on hydrophobic parchment paper demonstrates a simplified, low-temperature fabrication workflow that enables direct hydrophilic patterning without wax spreading or high-temperature processing (i) and the realization of high-density papertronic circuits with narrow hydrophilic channels and tightly spaced insulating regions (ii). Source: ACS Publications

The result is circuit features as small as 250 micrometers wide with 300-micrometer spacing—a twofold to threefold improvement over the best wax-based methods, and small enough to fit complete filter circuits into a footprint measured in millimeters rather than centimeters.

The differences due to the inverted thinking are clear: with chromatography paper, they were fighting against molten wax spreading through the paper. With their laser approach and parchment paper, the pattern is defined by the laser spot size and stays exactly where they put it. There is no spreading, no blurring, and no uncertainty.

Critically, all of the functional inks used in the work are water-based and free of toxic metals or organic solvents. The circuits are biodegradable, breaking down in soil within weeks, and can be incinerated to ash in seconds if rapid disposal is needed. For applications that require longer operational lifetimes, a thin silicone encapsulation layer protects the devices from humidity and mechanical damage without affecting their electrical performance.

Fabrication technique

As a first step, they used Fourier-transform infrared (FTIR) spectroscopy to determine the chemical composition of the pristine parchment paper, the surface modifications induced by laser treatment, and the effect of “ink” deposition. Laser irradiation induces pronounced photothermal and photochemical modifications to the parchment paper surface, which they assessed as well.

They then used laser modification to convert selected regions into ink-guiding hydrophilic microchannels. The localized laser-induced heating modifies the surface chemistry and microstructure without requiring additional chemical coatings, fillers, or high-temperature treatments.

Using a 50-watt CO2 laser, the laser power and scan speed were systematically tuned to optimize local heating and patterning of silicone-coated parchment paper. It took a significant amount of trial and error to find the optimum power and speed pairing. With a high-power and low-scan speed, the laser overheated the substrate, burning through the hydrophilic cellulose layer and cutting the paper. At low power and high speed, the silicone coating was only partially removed or not removed at all, thus preventing proper penetration of the functional materials.

Critically, these laser-defined hydrophilic features exhibit no lateral spreading, enabling minimum feature sizes and spacings that approach the theoretical resolution limit of the optical system. This strategy enables unprecedented high-density patterning, robust pattern reproducibility, and device-scale miniaturization for a significant leap beyond what is achievable with wax printing or traditional paperfluidic techniques.

For ink used to define conductive traces and electronic components, they used poly (3,4-ethylenedioxythiophene)-poly (styrenesulfonate), known as PEDOT:PSS, with controllable viscosity and density. For many reasons, PEDOT:PSS is widely used in research projects. Using these formulations resulted in limited lateral spreading on the order of micrometers within 3D cellulose fiber network.

Then there’s performance

They constructed printed resistors, interdigitated capacitors, low-loss interconnects, and integrated low- and high-pass RC filters within a single paper layer, exhibiting predictable, tunable electrical behavior consistent with circuit theory. The conductive lines have a width of ∼250 μm and a line spacing of ∼300 μm, corresponding to a PCB pitch of ∼550 μm.

The team demonstrated the platform’s versatility by fabricating a complete set of electronic components on paper: resistors whose resistance can be tuned over three orders of magnitude simply by adjusting the ink formulation; interconnects with sheet resistance as low as approximately one ohm per square, rivaling rigid electronic systems; capacitors tunable from microfarads to millifarads; and fully functional low-pass and high-pass RC filters whose frequency response closely matches theoretical predictions.

For example, the resistor values were independently controlled through three parameters: ink concentration, dimethyl sulfoxide (DMSO) content, and resistive line length. The laser-defined hydrophilic channels acted as deterministic templates that confined conductive inks, while the surrounding silicone-coated parchment remained hydrophobic and electrically insulating. This spatial confinement decoupled electrical tuning from uncontrolled ink spreading and penetration, enabling predictable and reproducible resistor geometries.

Note that DMSO is a poor electrical conductor on its own because it’s a molecular liquid without free ions or electrons. However, when ionic compounds like salts or acids are dissolved in it, it acts as a polar aprotic solvent that readily dissociates those ions, allowing the resulting solution to conduct electricity.

The laser-defined hydrophilic channels act as templates that confine conductive inks, while the surrounding silicone-coated parchment remains hydrophobic and electrically insulating. This confinement decouples electrical tuning from uncontrolled ink spreading and penetration, enabling predictable and reproducible resistor geometries.

Overall, the resistance of the paper-based resistors can be continuously tuned over a broad range from approximately tens of ohms to several kilohms (Figure 3).

Figure 3 For paper-based resistors, schematic illustrates how laser-defined paper resistors are tuned by three independent parameters: ink concentration, DMSO addition, and resistor geometry (a). Optical microscopy image (i) and SEM image of the A–A′ cross-section of a representative resistor (ii) show that PEDOT:PSS is precisely confined within the laser-treated hydrophilic region and surrounded by untreated hydrophobic parchment paper (b). Measured resistance of resistors is fabricated with varying ink volumes, where PEDOT:PSS was systematically diluted with deionized water to concentrations of 100%, 75%, and 50%, plotted as a function of resistor length (c). Resistance as a function of DMSO concentration in the PEDOT:PSS matrix is shown with weight percentages ranging from 2% to 20%, plotted as a function of resistor length (d). Data in (c) and (d) represent mean ± standard error from at least 10 independent measurements per data point. Solid lines are least-squares linear fits. Source: ACS Publications

For capacitors, conductive PEDOT:PSS electrodes were precisely patterned into interdigitated fingers using laser-induced hydrophilic channels, while the surrounding silicone-coated parchment remains hydrophobic and electrically insulating. The capacitance increases monotonically with the number of interdigitated fingers, reflecting the enlarged effective electrode surface area and reduced ionic diffusion distance inherent to the interdigitated geometry.

They achieved capacitance values spanning from the low microfarad regime to over 1.2 millifarads (Figure 4). The ability to modulate capacitance over nearly three orders of magnitude using only electrolyte composition and electrode geometry demonstrated the exceptional tunability of this capacitor platform.

Figure 4 For paper-based capacitors, schematic illustrates a laser-defined interdigitated capacitor fabricated on hydrophobic parchment paper (a). Optical microscopy image (i) and SEM image of the A–A′ cross-section of a representative capacitor (ii) show that conductive PEDOT:PSS ink is precisely confined within the laser-treated hydrophilic regions to form interdigitated electrode fingers, while the surrounding parchment paper remains hydrophobic and electrically insulating (b). Measured capacitance of capacitors fabricated with varying H3PO4 concentrations in the PVA gel electrolyte is plotted as a function of electrode finger number (c). Galvanostatic charge–discharge (GCD) curves are measured at a constant current of 2 μA after different numbers of charge–discharge cycles (d). Capacitance retention as a function of cycling number demonstrates the cycling stability of the paper-based capacitor (e). Source: ACS Publications

Interconnects and filters

The capillary scheme was also used to create interconnects, leading to what can be considered as “integrated circuits”. To demonstrate circuit-level integration, they fabricated first-order low-pass and high-pass RC filters.

All of the hydrophilic regions were defined in a single laser step, and components were sequentially deposited using paper stencils. The first-order low-pass RC filter composed of a series resistor and a shunt capacitor (Figure 5).

Figure 5 For paper-based RC filters fabricated on parchment paper, part A shows a low-pass RC filter: schematic illustration (a), circuit diagram (b), and photograph of the low-pass filter fabricated on parchment paper (c). Frequency-dependent gain plots for low-pass filters with different resistance values (46 Ω, 95 Ω, and 150 Ω) demonstrate low-pass cutoff behavior (d). Part B shows a high-pass RC filter: schematic illustration (a), circuit diagram (b), and photograph of the high-pass filter fabricated on parchment paper (c). Frequency-dependent gain plots for high-pass filters with different resistance values (15 Ω, 46 Ω, and 95 Ω) demonstrate high-pass cutoff behavior (d). Source: ACS Publications

Since the resistor, capacitor electrodes, and interconnects required different ink formulations and additives, each printing step is performed using a dedicated paper stencil. Despite this, the overall process remains low-temperature and highly reproducible.

They also assessed environmental aspects and biodegradability. Although parchment paper incorporates a thin silicone coating to give it hydrophobicity, the substrate is predominantly cellulose-based with the silicone layer accounting for only a minor fraction of the total material volume (typically <2 μm in thickness).

As a result, degradation is governed primarily by the underlying cellulose fiber network. The silicone coating, while more persistent in natural environments, is widely recognized as biocompatible and chemically inert, and its limited mass minimizes its environmental burden.

But no transistors, at least not yet

The team’s paper is quite detailed with respect to the underlying materials science, elemental physics and chemistry, and other considerations. They also acknowledge a significant shortcoming; thus far, no active devices such as transistors.

I applaud their willingness to switch from one type of paper and fabrication to a very different scheme when the first approach reached a dead end. It takes an open mind to start over and re-assess what is working and what is not.

Based on their track record with various embodiments of papertronic devices, I wouldn’t be surprised if they get the needed funding to further pursue their work toward papertronic transistors using what they have learned thus far. That would certainly be impressive.

Bill Schweber is a degreed senior EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features. Prior to becoming an author and editor, he spent his entire hands-on career on the analog side by working on power supplies, sensors, signal conditioning, and wired and wireless communication links. His work experience includes many years at Analog Devices in applications and marketing.

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Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — and AI power solutions provider LITEON Technology Corp of Hsinchu, Taiwan have announced a strategic partnership and the qualification of Wolfspeed’s silicon carbide technology for deployment within LITEON’s 800VDC power sidecar and compute rack PSU platforms. These platforms are designed to support next-generation AI data centers for leading hyperscale customers, with the potential for broader adoption across multiple cloud service provider (CSP) platforms and future deployments...

Today’s fun SMD soldering rework under the microscope. Tossed the penny in there for scale 🤓 submitted by /u/JennSNH [link] [comments]

Attempted prohibitions of foreign-sourced products based solely on theoretical claims, absent irrefutable supportive factual evidence, only invites domestic-supplier favoritism accusations.

Last year I went on a “bit” of a(nother) drone-buying binge. Following up on the first-generation DJI Mavic Air I’d bought in mid-2021.

And the two DJI Mini 3 Pro drones (once again, accompanied by an abundance of accessories) I’d acquired in mid-2024.

I got two more gently-used drone gear sets from Lensrentals in 2025; the computer vision-based collision avoidance surround-enhanced and LiDAR-augmented Mini 4 Pro.

Followed by a first-person view (FPV) “cinewhoop” drone, the first-generation DJI Avata.

And in-between those two acquisitions, chronologically speaking, was the first-generation DJI Neo I bought from Amazon in a three-battery kit configuration.

What was behind this seeming conspicuous consumption behavior? Curiosity, for one thing; FPV operation, for example, was something that had captured my interest ever since I first saw the famous “Right Up our Alley” video more than a half-decade ago.

An essentially autonomous (albeit optionally still traditionally controllable) drone with a starting price just slightly more than $100 was also intriguing, both personally and professionally.

And I’ve already mentioned the feature set enhancements the Mini 4 Pro offers over its Mini 3 Pro precursor, which were insufficient temptation in 2024 but which I succumbed to a year later once I came across a sufficiently discounted like-new version.

Heavy is the hand that holds the crown

That all said, scarcity fears were admittedly also a factor, driven by seemingly inevitable pending government regulation-driven bans on DJI drones, along with other image capture-capable devices from the company, such as vlogging and action cameras. Back in mid-2024, the U.S. House of Representatives had passed legislation introduced a year-plus earlier, which banned further sales of drones from DJI and other suppliers deemed too friendly to the Chinese Communist Party, despite a longstanding absence of any tangible (public, at least) evidence supportive of this stance.

Although, subsequently introduced in the U.S. Senate, it was never voted on, therefore not becoming a law. But that outcome was a false solace; U.S. Customs began blocking imports of DJI drones and other products that same October.

By mid-2025, U.S. retailer inventories of existing DJI devices had notably evaporated. And the company didn’t even bother formally introducing newer drones such as the Mavic 4 Pro, Mini 5 Pro, Neo 2, Avata 360 and Lito 1/X1 in the United States. That all said, as it turns out, the final ruling from the U.S. Federal Communications Committee (FCC), announced two days before Christmas 2025 (believe it or not), admittedly wasn’t as egregious as initially feared (although a further retroactive-recall carve-out remains in place).

Imports of future-announced drones, including future generations of existing drone lines, were prohibited. But existing drones were once again green-lit for shipment and sale, including ongoing firmware updates (for at least a few more years) and broader usage (subject to existing FAA regulations) for products already in customer hands. Which is why you can now find the Mavic 4 Pro, Mini 5 Pro, Neo 2, and Avata 360 for sale at some U.S. retailers.

But only some. Notably, DJI not only subsequently sued the FCC but doesn’t include its latest products on the U.S. version of its online store. Even legacy drones remain unavailable; they’re “out of stock”.

Equally disruptive, the company won’t honor warranty claims coming from U.S. residents for products purchased through third parties. And speaking of which, some large U.S. retailers, such as Amazon (but not others such as Adorama and B&H Photo Video, interestingly), are continuing to decline to inventory and sell the latest DJI drones themselves, although they’ll act as marketplaces and shippers for others.

Meanwhile, DJI is reportedly rebranding its products as coming from “shell” companies to dodge restrictions (at least temporarily). You can still buy anything you want, including supposed banned newer drones such as the Lito 1 and X1, from outside-U.S. sellers via eBay, Mercari, and other online marketplaces. And if you know anyone in Canada or Mexico, or briefly pop across the border or more broadly travel internationally yourself, you can also get your unconstrained DJI “fix” that way. So how much of a ban on new drones is it, really?

What happened to free markets?

Am I suggesting that the U.S. government’s actions are completely misguided? Not at all. Obviously, the People’s Republic of China is a leading adversary, with a vested interest in collecting any and all surveillance information, whether audio, visual, and/or otherwise. And ironically, effective May 1, 2026, China itself has banned all drone sales and rentals in Beijing, the capital, along with restrictions on the broader storage of drones and drone components within the city. So, for one of its leading companies to complain about sales and usage restrictions elsewhere in the world is a “bit” of a “doth protest too much” situation, methinks.

That said, as I’ve mentioned previously, DJI’s longstanding greater-than-90% market share in consumer drones also can’t (or at least shouldn’t) be overlooked, as it reflects both the sizeable installed base and ongoing customer preference. Notable, as well, is the fact that other drone companies such as Skydio have already withdrawn from the broad market, focusing solely on enterprise opportunities going forward.

So, even if the U.S. government had hoped to use a DJI ban to boost the fortunes of alternative domestic suppliers, that supply doesn’t currently exist. And regarding the security angle, while I get it (though I’d still welcome indisputable proof of it) for gear that can directly live-stream audio and images using DJI’s own applications, I remain baffled as to why such bans extend to devices that aren’t directly Internet-connectable, especially those (such as gimbals) with no native multimedia data-capture capabilities.

Anyway, it’s not just consumers like me that’ll be affected. Here, off the top of my head and in no particular order save for how they streamed out of my noggin, are examples of business and civic entities already making notable use of drones, with broader near-term expansion planned.

• Restaurants and chains
• Food-and-other delivery services
• Law enforcement, including border patrol
• Fire spotters and fighters
• Ranchers and farmers
• Medical facilities
• Utility companies
• Filmmakers
• Researchers of all sorts
• Musicians and other performers

To wit, here’s just one recent case study from just a few miles to the east of me:

Are many of them currently using DJI-branded equipment? You bet. Can at least some of them switch to non-DJI drones in the future, assuming sufficient supply exists? I suppose. But at what cost? Not insignificant. And can all, or even many, afford the incremental investment? Doubtful.

Thereby likely explaining, at least in part, why what was initially seen as a planned full-stop ban ended up scaled back to a going-forward prohibition…but still…consider, for example, repair and replacement-parts availability impacts, along with aforementioned warranty-coverage issues.

Other conceptually similar, more recent actions by various U.S. government entities involve restrictions on routers and cellular hotspots, along with some (but not all) connected vehicles, solar inverters and robots of all sorts…but this writeup is already running long, so I’ll save those for another day. For now, I welcome reader perspectives in the comments on the issues I’ve raised here!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

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​India’s electric vehicle (EV) sector is expected to become one of the country’s largest employment generators by 2030, with the potential to create between 30 million and 40 million jobs over the next five years. The rapid expansion of the EV ecosystem is poised to create significant job opportunities in manufacturing (automotive and components, battery assembly and cells), software and IT, infrastructure development, and services for EVs towards sustainable mobility.

According to industry predictions, 10-15% of these jobs will be direct employment opportunities with roles including vehicle production, cell manufacturing, electronics and components, R&D, engineering, quality control and charging infrastructure deployment. The remaining 85-90% of jobs would be indirect across the broader EV ecosystem such as manufacturing components, supply chains, maintenance and repair, retail and finance, logistics, and recycling.

This predicted job creation is seen as a natural consequence of India’s rising investments in electric mobility, spurred by schemes like the PM E-DRIVE Scheme, the Production Linked Incentive (PLI) programmes for the automobile and advanced chemistry cell (ACC) battery sector, and the broader focus on domestic manufacturing under the Atmanirbhar Bharat initiative.

As a result, domestic and international manufacturers are increasing their production facilities and scaling up operations across the country.​ As India progressively transitions to clean mobility, the EV industry is all set to become one of the country’s most significant drivers of economic growth, technology advancement and creation of sustainable employment.

The post India’s EV Industry Projected to Create Nearly 40M Jobs by 2030 appeared first on ELE Times.

​The Indian Ministry of Defence issued a Request for Information (RFI) for 2,715 logistics drones to accelerate last-mile supply capabilities for soldiers deployed in high-altitude and remote areas like the Siachen Glacier, where transporting goods normally becomes difficult due to extreme weather conditions. The RFI intends to evaluate Indian capabilities in drone technology, production capacity and vendors’ ability to comply with the Army’s operational requirements.

If the procurement moves forward, it would be one of the Indian Army’s largest intended procurements in the logistics drone category and the drones could aid supply operations up to an altitude of 20,000 ft. The procurement is also expected to significantly support India’s expanding defence drone market. Consistent with the government’s Atmanirbhar Bharat (self reliance) policy, the Army has steadily relied on native technologies for surveillance, logistics, counter-drone technologies, and loitering munitions. The RFI is expected to attract a large number of drone manufacturers once the programme progresses to the next procurement stage.

Besides boosting operational performance, introducing logistics drones should reduce the pressure on helicopters, which are commonly used for supplying heavy lifts, but drones can execute missions at lower operational costs and reduce the risk of operating within a dangerous mountain environment.

The introduction of 2,715 logistics drones planned is yet another major step towards the Indian Army’​s ambition of revolutionising battlefield sustainment through unmanned systems. The programme is bound to enhance battle effectiveness in the most challenging military operations, boost the indigenous defence drone industry, and support India’s long-term self reliance in cutting edge military technologies.​

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Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that a global leader in optical and photonic technologies has selected its LUMINA+ metal-organic chemical vapor deposition (MOCVD) system to fabricate indium phosphide (InP) lasers for innovative communication solutions in the datacom industry. The firm adds that its LUMINA+ system has now been adopted across all major applications in the arsenide and phosphide (As/P) epitaxial space, including the fast-growing InP laser market...

For its fiscal third-quarter 2026 (ended 3 July), Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has reported revenue of $934.8m, down 1% on $943.7m last quarter and 3.1% on $965m a year ago, but above the mid-point of the $900–950m guidance range...

DigiKey, the global distribution leader of electronic components and automation products, is hosting a webinar with Shawn Hymel: “Train a balance bot with reinforcement learning,” scheduled for Thursday, Aug. 13, 2026, at 10 a.m. CDT. The free 90 minute virtual event will be a hands-on robotics and AI workshop that will teach attendees how to get started in the growing field of reinforcement learning (RL).

Reinforcement learning is a powerful domain within machine learning that teaches agents to make decisions by interacting with an environment and maximizing a reward signal. It can enable robots to learn complex behaviors like balancing, walking and recovering from falls entirely in simulation before ever touching real hardware.

During the workshop, Hymel will guide attendees through training a self-balancing robot using RL and deploying it on real hardware. Attendees will learn to:

• Import a 3D model of the M5Stack Bala-C into the MuJoCo physics simulator
• Train a neural network policy using a multi-phase PPO curriculum
• Deploy the trained actor network to an ESP32 microcontroller using Arduino
• Understand the sim-to-real pipeline, a foundational skill for applying modern AI
  techniques to physical robotics

“Reinforcement learning has quickly become an exciting tool across a wide range of modern applications,” said David Sandys, senior director of technical enablement & engagement for DigiKey. “It’s a complex and growing field, and knowing where to begin can be tricky. That’s why we’re thankful to partner with Shawn Hymel to help bring this educational workshop to our customers and community to share how to get started, and why it’s beneficial to gain this knowledge.”

“Almost every major robotics lab has turned to reinforcement learning to build robust, AI-powered control and decision-making for their robots, from quadrupeds to bipeds,” says Hymel, expert instructor and content creator. “However, RL remains hard to approach. Training a policy can take millions of simulation steps, and getting the reward function right is as much art as science. This webinar will help lower the barrier to entry for anyone who wants to build their own robots with RL.”

Anyone who would like to follow along with the webinar is encouraged to have either the M5Stack Bala-C Balance Bot or the M5Stack Bala2 Fire Self-Balancing Robot. If you can’t attend the live webinar, you’re still encouraged to register, and the recording will be sent to all registrants following the event. Everyone is welcome to register for free.

DigiKey has also debuted the first of a six-part educational YouTube series in partnership with Hymel, designed to help engineers, hobbyists and students get started with robotics and RL. The full series will walk viewers through training a robot using modern RL techniques, from simulation to hardware deployment. By the end of the series, viewers will have a working remote-controlled balance bot that learned its own control policy, entirely through trial and error in simulation. Viewers can also follow the full write-up of the tutorial on DigiKey’s Maker.io site.

This webinar and video series furthers DigiKey’s commitment to providing helpful resources and education for engineers, designers, makers and students. For more information about other resources and educational content, please visit DigiKey.com.

The post DigiKey and Engineering Influencer Shawn Hymel to Host Webinar and Video Series on Reinforcement Learning with Balance Bots appeared first on ELE Times.

Montage Technology has introduced the M88MX6852, a CXL 3.2 Memory eXpander Controller (MXC) chip for AI infrastructure and data center applications. The device has entered trial production and has been integrated into next-generation CXL products developed by memory module manufacturers including Samsung and SK hynix.  It is also designed for interoperability with Intel Xeon and AMD EPYC server platforms.

By converting host CXL memory requests into DDR commands in real time, the M88MX6852 manages data exchange between the host processor and DDR5 memory. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, enabling memory expansion, sharing, pooling, and tiering.

The M88MX6852 integrates a CXL controller, dual DDR5-8000 controllers, two RISC-V processor subsystems, and an on-chip PVT sensor. Its CXL controller complies with the CXL 3.2 specification, including CXL.mem and CXL.io protocols, as well as CXL 1.1 and CXL 2.0. Based on a PCIe 6.2 interface, it achieves data rates up to 64 GT/s over eight lanes.

Montage Technology provides an SDK along with analysis and testing tools to support product development, system validation, and production ramp.

M88MX6852 product page

Montage Technology 

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