Збирач потоків

There was a lot I learned, but this was my first serious project in which I went double over budget, went over my deadline and had a lot of fun! It has 8 potentiometers, 4 inverters, 3 integrators, 2 adders, a multiplier and some. In the first image, it is running damped oscillation, which is simulating something like a mass to a spring. Here is the build on my website if anyone is interested https://paranoidrobot.neocities.org/Analogcomputerbuild submitted by /u/Independent_Debt_186 [link] [comments]

How do engineers squeeze all the necessary circuitry (and what is it?) into one of these devices, and do so this inexpensively?

With the demise of analog audio line out, headphone (output-only), and headset (adding mic-in) jacks in modern electronics devices—computers, smartphones, tablets, and the like—alternative methods of connecting analog audio sources and destinations are becoming increasingly common. Bluetooth-based wireless mating is certainly one option:

but the audio peripheral must also be battery-powered (and therefore potentially charge-drained when you try to use it) in this case. And quality can also be hit-and-miss depending on the lossy codec options supported (and selected) at both ends of the connection, not to mention degradation resulting from other spectrum-overlapping broadcasters.

Diminutive wired adapters

The other common option involves instead leveraging the digital audio (plus power, along with other functions) connections that are still present in these devices. Admittedly, the Earstudio ES100 MK2 shown above can alternatively operate this way, too:

but that’s not the prevalent use case for this particular peripheral, which, anyway, is also no longer seemingly available for sale (I’ve got its successor queued up to discuss in the future). Plus, it was bulky and priced at $99; the Apple Lightning-to-3.5mm Headphone Adapter, shown below as usual (as well as with photos that follow) accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

was only $9 when Apple was selling it (when I caught wind of the pending closeout, I bought up not only the one shown above but also a few others before inventory was depleted), not to mention being self-powered over Lightning and delivering remarkably solid audio performance (and squeezing in not only the ADC and DAC but also the necessary MFi certification circuitry).

Now that Apple has transitioned its devices to USB-C, both it and Google, along with others, offer(ed, in Google’s case) diminutive, cost-effective, and performant USB-C-based successors:

I found a two-pack of them on sale for $2.09 the other day, believe it or not:

And my wife even bought me a balanced headphones-supportive USB-C adapter for Christmas!

Size-simplified dissection

That said, with iFixit’s “rough” teardown results as a guide (after seeing how challenging a community member’s experience was, iFixit staff stuck with x-ray analysis for their own coverage), I was loath to tackle the dissection of one of these diminutive devices myself. Instead, today I’ll be showcasing something a “bit” bigger, albeit presumably based on the same fundamental building blocks; Sabrent’s USB to 3.5mm Jack Audio Adapter, which claims to support up-to 24-bit and 96 kHz high-res audio and cost me only $6.98 on Amazon last summer:

As the above stock photo shows, and unlike one of the earlier adapters that merges both headphone and microphone functions on a common connector, this one (akin to a computer sound card, which is its target use case) splits them into two jacks; a stereo one for audio out (96 dB SNR claimed) and a separate one for the mono audio input (90 dB). Plus, the manufacturer conveniently provided a preparatory conceptual cross-section diagram, too:

From past similar experience, however, I’ve learned that such graphics don’t necessarily match reality, so I’m still going to dig inside going to satisfy my curiosity. Some box shots to start:

Open sesame:

Inside is the adapter, safely ensconced by rubberized foam padding:

along with a few snippets of literature:

The one on the left is just the usual legal gobbledygook, in multiple languages:

Here’s our patient, first the body:

Now both ends:

See, two connectors!

Don’t overcomplicate the disassembly

The body is a mix of plastic and aluminum…I didn’t realize at first:

that the latter went all the way around the outside:

No, Brian, there’s no screw holding the chassis pieces together; it’s a single-piece assembly from the start:

Duh:

That’s much easier:

With the front panel now popped off:

the PCB now pushes right out the front, following right behind it. Connectors on top:

And…whaddya know…for a pleasant change, the C-Media CM3271 USB audio controller shown in the earlier conceptual diagram actually matches what’s on the PCB underside!

It’s no longer listed on the supplier’s website, but I still found a datasheet (PDF).

I still don’t know how other USB audio adapter manufacturers squeeze all the necessary electronics into their even more diminutive devices, but I’m also still not confident that I would have gotten the answer to that question if I’d tried (versus simply obliterating the product in the process). I’m happy with this alternative approach and end result, and I hope you are too. Agree or disagree, let me know what you think in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

Related Content

• Portable Bluetooth receiver enhances headphone-jack-deficient smartphones
• An update on music codecs
• Balanced headphones: Can you hear the difference?

The post Probing a USB analog audio adapter appeared first on EDN.

submitted by /u/Lovely_Lex333
[link] [comments]

Just finished my first PA and did a sound check. Used Rod Elliott' P3A schematic but didn't order the PCB's, made my own looking at the component placement he chose. Also did the P33 DC protection and muting circuit from the schematics on his website, also my own PCB design. Ordered a BT module from Aliexpress that worked out great. Did the PCB design in KiCAD and etched the boards. Got screwed on the final transistors, found out they weighed 3 grams less than the originals so ended up ordering other ones from a supplier in Europe. Also the 10.000uF caps were counterfeit and ordered other ones. The toroidal transformer is from Aliexpress from one of those custom order vendors. Had to do an additional source for the BT module to avoid hum/ground loops. Here's how it sounds: https://youtu.be/3uhvbGdac8s?si=9sRjmpB0z5sSqoV8 Had a lot of fun building it. Can't wait for the next project! 😄 submitted by /u/029373763 [link] [comments]

In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted at the start of 2025, with the new year’s advancements driven by the widespread deployment of existing technologies. Industrial sectors, robotics, automotive, consumer electronics and smart homes will all benefit from increased autonomy, underpinned by the specialised silicon platforms and advanced processing that will make this a reality.

The foundation will continue to be semiconductor material innovation. Silicon carbide (SiC), gallium nitride (GaN) and silicon photonics will support increasing demands for efficient power conversion, thermal management, and data transmission. Architectural advances in neural processors, imaging sensors, microcontrollers and microprocessors will enhance the capabilities of autonomous and intelligent systems. Security of these systems will remain in sharp focus. In summary, our view for 2026 is: smarter machines will be built on faster and more secure semiconductor technologies.

1. Edge AI: Everything, everywhere, all at once

Edge AI innovation continues to be the lynchpin connecting these trends. In 2025, we saw the momentum of more AI finding its way to the edge. For 2026, this momentum accelerates, as embedded AI finds its way into almost every category of device and sensor. These edge AI and TinyML-enabled devices will benefit from enhanced awareness and analytical capabilities, in turn enabling them to act more autonomously. We will also see the emergence of more domain- and application-specific AI chips, optimised for workloads in different environments and sectors.

The next evolution of robotics (see below), industrial systems, automobiles, smart home technology, consumer devices, and more will be supported by powerful and energy-efficient AI at the edge. In turn, these will become more active participants and partners in every aspect of our lives.

2. Robots start speaking a different language

Large language models (LLMs) – AI trained on massive text datasets – have been dominant in the AI discussion of recent years. As highlighted last year, these advancements, along with those in neural processing, allowed machines to “think” better.  A new type of model will help turn thinking into action in 2026. New large action models (LAMs), sometimes called vision-language-action (VLA) models, are enabling robots to interpret their surroundings, make decisions, and perform tasks in the physical world, which some are calling “embodied AI”.

LAMs supporting robotic inference will drive the widespread emergence of edge AI-powered cobots working alongside humans, deployments of humanoid robots, and autonomous industrial systems that act independently with advanced sensing and motor control. The combination of enhanced intelligence and dexterity will pave the way for robotics to move from factories into retail, hospitality, and the home.

3. Quantum progress becomes a cyber priority

Last year, we predicted how the ability to use traditional semiconductor technologies would help advance the development of quantum computing. This has been the case, and the coming year will see quantum computers based on FD-SOI processes move from the lab to deployment. However, in 2026, the quantum-related priority for all organisations will relate to one topic: cybersecurity.

Cybercriminals are already preparing to add quantum computing to their armoury through cryptographically-relevant quantum computers (CRQCs). They are harvesting encrypted data today, confident that quantum computing will provide the power to access it in the future, which poses a real and immediate risk to every organisation. Post-quantum cryptography (PQC) provides a solution; PQC algorithm standards are being established and made available to preemptively secure devices and software. The time to act is now.

4. A tipping point for autonomous vehicles?

Self-driving taxis provide the highest profile examples of the progress of autonomous vehicles, underpinned by advances in LiDAR, AI-enabled cameras, and integration with infrastructure. The number of cities around the world allowing the use or trial of so-called “robotaxis”, notably in the US and Asia, grew significantly in 2025, suggesting positive momentum. Challenges remain, with Level 4 autonomy remaining restricted to controlled environments (Level 5 being complete autonomy in any environment) and major manufacturers scaling back timelines to full autonomy.

Consumer confidence is also a barrier to adoption, though studies have shown that acceptance is far higher following use. With the opportunities increasing for consumers to experience the benefits, along with technological enhancements and efficiencies, 2026 should see progress accelerate.

5. Homes become even smarter, better connected and more secure

In 2026, several trends will converge to transform domestic technology. Edge AI, advances in connectivity protocols such as Matter and Thread, and approaches to security adopted from the commercial environment will make our homes smarter, better connected, and more secure.

Improving the collection and sharing of data between domestic devices, along with increased intelligence at the edge, will act as a force multiplier, delivering what analyst Gartner has defined as “ambient intelligence”. Among other benefits, this will allow for the creation of domestic digital twins, a concept we touched on in 2025 as an opportunity in every sector, optimising the efficiency of our homes.

As smart homes become more intelligent and connected, cybersecurity will be an increasing concern. We expect to see principles crossing over from commercial environments to the home, and in particular, best practices such as a Zero Trust approach to security in smart home technologies.

6. The integration of satellite and terrestrial networks

As we predicted in 2025, there has been no slowdown in the desire to launch more satellites into space, and particularly those low Earth orbit (LEO) satellites forming part of the communications mega-constellations. 2026 will see advancements in how these satellites are used to provide truly global connectivity. For communications network operators, the decision between traditional terrestrial networks and the growing mega-constellations of low Earth orbit (LEO) satellite networks is no longer “either/or”, but “both”. Mobile network operators are already integrating LEO networks as backhaul, filling coverage gaps in earth-based networks or to improve connection speeds.

This integrated use of networks will continue in 2026, creating a unified “network of networks” managed by AI and advancing towards goals for seamless global connectivity. The economic and educational benefits to previously unconnected parts of the globe will be huge, with significant additional enhancements to connectivity across worldwide consumer, commercial and industrial sectors.

7. A revolution in imaging

Imaging technology provides the foundation for many of the innovations that allow devices to operate more effectively and efficiently. Yet the central concept of lenses as stacks of curved glass to refract light has remained unchanged for centuries. Metasurface technology shifts this paradigm by recreating optical functions on perfectly flat, ultra-thin layers patterned with nanostructures. Imaging becomes smaller, less costly, and more flexible wherever it is embedded. Imaging improvements will impact every area of life, work, and industry, from more spatially-aware robotics and automobiles, to more secure devices, from enhanced photography to applications that vastly improve power efficiency.

2026 wrapped

Technology rarely moves in straight lines, but the direction is becoming clearer. The trends emerging for 2026 indicate a world shaped by greater autonomy, deeper intelligence, stronger intelligence and more, all shaped by advances in semiconductor technologies. The opportunity for organisations that understand these trajectories early enough is not simply to react but to shape what comes next. The systems designed today will define how people live, work and connect in the years to come.

The future is already taking form; it’s a matter of how boldly we choose to build it.

The post Top Seven Tech Trends in the semiconductor sector for 2026 appeared first on ELE Times.

Світла пам’ять та вічна шана Денису Гордєєву! kpi пн, 02/23/2026 - 12:52

Rohde & Schwarz, in collaboration with Broadcom, is set to display its CMX500 multi-technology multi-channel signalling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The setup at the Rohde & Schwarz booth (5A80) will validate a prototype Wi-Fi 8 device from Broadcom, showcasing physical layer features unique to Wi-Fi 8.

Addressing UHR challenges with the CMX500

As Wi-Fi transitions beyond increasing throughput, the IEEE 802.11bn amendment introduces crucial advancements focused on delivering consistent, high-quality connectivity across a diverse range of dense environments. It is designed to handle the growing number of connected devices and the increasing demands of applications like VR/AR, 8K streaming, and industrial IoT.

Wi-Fi 8 builds upon the foundation of Wi-Fi 7, retaining core physical layer parameters like supported frequencies up to 7.125 GHz, channel bandwidths up to 320 MHz and 4096QAM modulation, as well as Multi-Link-Operation (MLO). However, to achieve its UHR goals, IEEE 802.11bn introduces a suite of innovative PHY and MAC layer technologies that present new testing hurdles. At MWC 2026, visitors can experience how to address key testing challenges associated with Wi-Fi 8 with the enhanced testing capabilities of the CMX500 one-box signalling tester, one of the most versatile mobile device test platforms in the market, which supports many of the demanding features of Wi-Fi 7 and Wi-Fi 8 today.

For example, Wi-Fi 8 uses distributed resource units (dRU) to overcome power spectral density (PSD) limits. With dRU measurement,s users can validate their device’s effectiveness in boosting uplink transmit power and improving connection reliability. Another technology is unequal modulation (UEQM), where throughput is improved in difficult reception scenarios by allowing each MIMO link to use a different modulation scheme. With UEQM analysis, users can assess the ability of the test device to adapt the modulation accurately, using the specified modulation of coding scheme (MCS) combinations. With comprehensive signalling mode tests, covering a broad range of Wi-Fi 8 features, users can perform in-depth analysis of performance characteristics.

Future-ready platform for all cellular and non-cellular standards

The CMX500 is a modular, powerful one-box signalling tester enabling comprehensive multi-technology testing. It covers LTE and NR in SA/NSA modes, NR-NTN, NB-NTN, Direct-to-Cell (D2C/DTC) testing and WLA, N, including Wi‑Fi 7 and Wi‑Fi 8. Consequently, the CMX500 allows R&D engineers of wireless devices to comprehensively test their design’s operation in both cellular and non-cellular standards of the latest generation in a single instrument setup.

Rohde & Schwarz will present the CMX500 one-box signalling tester, validating a Wi-Fi 8 device from Broadcom and other comprehensive test solutions for next-generation WLAN at MWC Barcelona 2026 at the Fira Gran Via in Barcelona, in hall 5, booth 5A80.

The post R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity appeared first on ELE Times.

В КПІ відкрито Тестовий центр Всесвітнього інституту ядерної захищеності kpi пн, 02/23/2026 - 12:17

Esp dap submitted by /u/Historical_Delay_838 [link] [comments]

 Keysight Technologies introduced its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

As interface standards such as USB, DisplayPort, and DDR rapidly evolve and scale in speed and complexity, engineers face tighter margins, higher data rates, and compressed development timelines. These pressures result in longer validation cycles, reduced noise tolerance, and growing lab constraints. The Infiniium XR8 addresses these challenges with a completely new hardware and software architecture optimised for today’s high-speed digital applications and emerging standards, helping engineering teams condense days of testing into hours.

The XR8 integrates newly designed front-end ASIC technology and an integrated ADC and DSP digital engine to preserve signal integrity, improve timing accuracy, and deliver consistent, repeatable measurements across high-speed serial, memory, and mixed-signal designs. These capabilities are essential for debugging and validating today’s high-speed interface, where small impairments in signal quality can directly impact system performance and compliance margins.

A redesigned mechanical architecture further enhances usability by reducing system power consumption, improving thermal efficiency, and minimising acoustic noise with a compact footprint. Engineers can deploy high-performance oscilloscopes in space-constrained labs and dense validation environments while maintaining a stable, low-noise operation.

Powered by Keysight’s new Infiniium 2026 software platform, the XR8 delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. The modern user experience features flexible waveform windows, enhanced visualisation, and productivity tools such as drag‑and‑drop functionality and an integrated SCPI recorder. Optimised multithread processing and memory management enable engineers to fully leverage Keysight’s measurement science, delivering enhanced jitter decomposition, PAM analysis, and advanced equalisation for deeper insight and faster validation.

Together, the new hardware and software architecture enable: 

Maximised test margin and signal integrity

Intrinsic jitter as low as 13 fs rms and noise performance below 130 µV at 8 GHz bandwidth provide exceptional fidelity and preserved compliance margin, enabling confident validation of high-speed interfaces including USB4v2, DisplayPort 2.1, and DDR5. 

Accelerated compliance testing efficiency

A new ADC and DSP digital engine combined with Infiniium 2026 software accelerates acquisition, analysis, and reporting by up to three times, dramatically reducing validation cycles and improving overall test throughput. 

Compact, quiet, and flexible lab deployment

Lower power consumption, enhanced thermal design, and reduced acoustic noise create a smaller, more flexible platform that can be positioned closer to the device under test while supporting comfortable, distraction-free daily engineering workflows.

Jun Chie, Vice President, Keysight Product Management, said: “Our customers are under intense pressure to validate increasingly complex, high-speed designs on compressed schedules. The Infiniium XR8 directly addresses that reality, preserving signal fidelity, accelerating compliance workflows, and reducing lab constraints in a single, streamlined platform. It’s about giving engineers back time, confidence, and productivity when they need it most.”

“As India strengthens its leadership in AI data centres, 5G-Advanced, next-generation computing, and aerospace and defence, signal integrity measurement challenges are becoming increasingly complex,” said Girish Baliga, General Manager, Industry Marketing, Keysight India. “The Infiniium XR8 oscilloscope delivers the precision and performance required to accelerate innovation while ensuring accurate, high-speed validation. As India advances its ‘Make in India’ vision and expands its global R&D footprint, demand for ultra-high-speed digital test solutions continues to grow. The XR8 empowers local engineering teams with the confidence and efficiency needed to bring world-class technologies to market faster.”

The post Keysight launches next-gen Infiniium XR8 Oscilloscopes for faster analysis, clearer insights, and a compact design appeared first on ELE Times.

Surface acoustic wave (SAW) filters may sound exotic, but they are everyday workhorses in wireless front-ends. Compact, cost-effective, and reliable, they shape signals with precision while keeping designs simple.

This quick primer walks through the basics—what they do, why they matter, and how they fit into modern communication systems.

SAW filter fundamentals

SAW filters exploit the piezoelectric effect to convert electrical signals into acoustic waves and back again. At their core, they consist of two interdigital transducers (IDTs) patterned on a piezoelectric substrate. The input IDT launches acoustic waves from the incoming electrical signal, while the output IDT reconverts those waves into an electrical signal.

Together, they form a bidirectional transversal filter. Absorbers are placed at the ends of the substrate to suppress unwanted reflections, ensuring clean signal transmission and stable filter response.

Figure 1 Drawing illustrates the basic architecture of a SAW filter, with input/output IDTs transducing signals across a piezoelectric substrate, while absorbers suppress reflections. Source: Author

Note that the wave produced by the output transducer represents only half of the full signal. Thus, if a 3-dB loss is observed at the output, the combined insertion loss of the input and output transducers amounts to 6 dB.

Each transducer consists of periodic interdigital electrodes connected to two busbars, which link to the electrical source or load. The electrode length governs amplitude, electrode position sets phase, and electrode wavelength defines the operating frequency of the SAW filter.

On a historic note, surface acoustic waves were first described by Lord Rayleigh in 1885 and are therefore often called Rayleigh waves. In his classic paper, Rayleigh predicted their propagation properties, noting that SAWs contain both longitudinal and vertical shear components that couple with the medium at the surface.

Their energy is confined to the substrate surface. Because SAWs are accompanied by electrostatic fields, electroacoustic conversion can be achieved through IDTs. Shaped like crossed fingers, these electrodes launch and receive the waves, forming the basis of modern SAW devices.

At its core, a SAW filter operates by converting electrical energy into acoustic energy on a piezoelectric substrate. This process is driven by two interdigital transducers: the input transducer generates acoustic waves from the incident electrical signal, and the output transducer reconverts them into electrical energy.

Because each transducer launches waves equally in the +X and –X directions, the device functions as a bidirectional transversal filter. Since only half of the launched wave (+X direction) is useful, a 3-dB loss is observed. Taken together, the input and output transducers yield a total insertion loss of 6 dB.

SAW filter applications

Due to their excellent selectivity, low insertion loss, and compact size, SAW filters have become indispensable across modern RF systems. In mobile communication devices such as smartphones, base stations, and repeaters, they suppress interference and maintain clean signal channels.

Wireless LAN and Bluetooth modules rely on them to preserve frequency integrity and reduce crosstalk, while GPS receivers use SAW filters for precise frequency selection that enhances location accuracy. In broadcasting and television tuners, they improve signal quality and selectivity.

Beyond consumer electronics, SAW filters are widely adopted in IoT devices, automotive electronics, and satellite communication systems, where their reliability and small footprint make them a cornerstone of high-performance RF design.

As a familiar practical example, I remember 38.9 MHz SAW filters were a staple in television receivers, serving as intermediate‑frequency (IF) filters in tuner modules. They provided sharp selectivity for separating video and audio signals, ensuring clear picture and sound quality. In fact, paired designs often used a 38.9 MHz SAW filter for the video IF and a companion filter around 33.4 MHz for the audio IF, enabling precise audio separation in PAL/SECAM systems.

Beyond TVs, the same frequency was also used in audio IF stages of broadcast receivers and set‑top boxes, where the compact size and stable response of SAW filters made them a reliable choice for consumer electronics.

Below figure shows a niche and potentially legacy 38.9 MHz SAW filter used in PAL/SECAM television receivers as the video IF filter. In these systems, the filter provides sharp selectivity to isolate the video carrier, while a companion SAW filter at 33.4 MHz is employed for the audio channel.

Figure 2 A 38.9-MHz SAW filter shows its pinout and package design for television receiver applications. Source: Author

Together, this pair enabled precise separation of picture and sound in analog TV tuners, with the compact package and stable frequency response making SAW filters the standard choice in consumer television receivers.

As a quick aside, dual-output SAW filters were also in use at that time, designed to handle both picture and sound carriers simultaneously. The picture IF carrier was set at 38.90 MHz, while the sound IF carrier was offset at 33.4 MHz, reflecting the 5.5 MHz spacing defined in PAL/SECAM systems.

SAW filter practice pointers

This session offers some practical pointers on working with SAW filters, based on their established role in communication and signal-processing systems.

Recall that SAW filters operate on the principle of the piezoelectric effect: an applied voltage induces a mechanical wave on a crystal, while mechanical pressure conversely produces a change in potential difference. When an RF voltage is applied to the input transducers, it generates an acoustic surface wave that travels across the crystal to the output transducer, where it’s reconverted into an electrical signal.

By carefully designing the electrodes—typically comb-shaped with interlocking fingers—engineers can tailor frequency transmission characteristics through precise control of finger size, number, and spacing.

Compared with conventional filters that rely on coils and capacitors, SAW filters are smaller, more affordable, and offer superior long-term stability. They require no tuning and deliver significantly better performance, which explains their widespread adoption in color television sets and video recorders worldwide.

Beyond these, SAW components are also integral to satellite receivers, cordless phones, mobile devices, automotive keyless entry systems, garage door openers, and numerous other applications.

Next, a SAW resonator is a key component in low-cost 433 MHz RF modules. It’s used in the transmitter module as a precise, fixed-frequency oscillator to ensure stable operation at 433.92 MHz within the unlicensed ISM band.

Figure 3 SAW resonator enables a compact, low-cost architecture for 433-MHz RF transmission. Source: Author

Getting into the criteria for choosing a SAW filter, many specifications must be carefully evaluated. Key parameters include the center frequency, bandwidth, insertion loss, and out-of-band rejection, since these directly determine how well the filter isolates the desired signal from interference. Group delay and passband flatness are also critical for maintaining signal integrity, especially in communication systems where timing accuracy affects bit error rates.

Designers must further consider package size, environmental stability, and repeatability, ensuring the filter performs reliably under temperature variations and mechanical stress. Finally, cost, availability, and compliance with regulatory standards often guide the final choice, balancing performance with practical constraints.

Figure 4 A sample datasheet snip highlights the operating conditions and electrical characteristics of a randomly picked 480-MHz SAW filter. Source: ESC Inc.

Side note: The ECS-D480A 480 MHz SAW filter is now obsolete, yet it remains a useful reference for understanding how compact SAW devices were once applied in RF systems. At this frequency, such filters were typically deployed in satellite receiver intermediate-frequency stages, where sharp band-pass selectivity was critical after down-conversion.

They also found roles in wireless communication front-ends and certain measurement instruments, valued for their ability to provide narrowband filtering and suppress adjacent channel interference. Do not panic about this obsolescence—SAW filters are still widely available today from multiple vendors, offered in both thru-hole and, more commonly, SMD form for modern RF and wireless applications.

And, integrated SAW filters enable multi-channel usage within a single radio front-end, allowing several selective paths to be consolidated into one compact device. This integration reduces board space, simplifies design, and supports efficient handling of multiple frequency bands in modern receivers.

There are voltage-controlled SAW oscillators (VCSOs) as well, which add electrical tunability to the otherwise fixed-frequency concept. By applying a control voltage, their oscillation frequency can be shifted, making them valuable in agile radios, test instruments, and wireless platforms that demand dynamic channel agility and adaptive interference suppression.

Moreover, SAW filters operate along the surface of the substrate, making them well-suited for mid-band frequencies and compact designs. Around the early 2000s, bulk acoustic wave (BAW) filters were introduced, driving acoustic waves through the bulk of the material to reach higher operating frequencies and stronger power handling.

In practice, SAW devices remained the mainstay for intermediate-frequency stages and mid-band wireless, while BAW devices gradually took hold in high-frequency front-ends such as LTE, 5G, and Wi-Fi.

Next steps

As it seems, SAW filters carry a distinctive experimental appeal in ham radio, where their sharp selectivity and compact footprint make them ideal for signal-chain exploration—even though their primary role has long been in commercial systems.

Anyway, they are not a casual undertaking for hobbyists: working at these frequencies demands care, proper instrumentation, and patience. Still, salvaged parts from old TV boards and consumer gear can provide a practical gateway into serious tinkering.

While this serves as a quick wrap-up—with more to explore another time—it’s clear that engineers are naturally drawn to SAW filters for their importance in frequency-domain design and their resonance with ham radio practice. Yet curious builders should not hesitate—experiment, learn, and share. The community thrives on grassroots exploration, and your work could well spark the next wave of practical insights.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

Related Content

• SAW-filter lead times stretching
• SAW, BAW and the future of wireless
• TI Claims Breakthrough BAW Technology
• The difference between BAW and SAW filters
• SAW filters and resonators provide cheap and effective frequency control

The post SAW filters made simple: A quick front-end primer appeared first on EDN.

So yeah this is starting to look like a bit of a monster submitted by /u/adkio [link] [comments]

Man that program was fun! Engineering C building ftw! submitted by /u/Yamaben [link] [comments]

In the Astron schematic dated 1987, the violet arrow points to an error in the drawing. It shows the 29 VDC rectified power being routed to the Base connections of Q101 - Q104 series pass transistors. Compare this to the XX-35 series supplies dated 2000. The schematic with the error was found on the internet, but thus far I have not been able to retrace the path to the page of the schematic with the erroneous connections. Here is a link to the Service Manual for the series: Astron RM-35A, RM-35M, RS-35A, RS-35M Service manual submitted by /u/redneckerson_1951 [link] [comments]

I spent few days trying to make z80 cpu based computer clone. As in every good project first step was performing Hello World output to serial for starters. I got completely stuck as I was getting only letter H and nothing else. I rewired chip selection logic several times, replaced RAM chip, scoped everything I could and only then noticed that top power rails are not connected (you can see top rails are not bridged) meaning RAM was never powered in a first place. I feel like a complete moron… submitted by /u/Thick_Swordfish6666 [link] [comments]

Having a particular plan for the power supply (as described in the posts before part 2 - Planning and part 1 - Idea) it's possible to start schematics itself. I use and really enjoy KiCAD - it has everything I need for my skills and projects I create. As the first step with the schematics (see - github.com/condevtion/i2c-pps-hw) I decided mostly to transform the diagram from the previous post to a set of pages and define networks and busses to connect them. You can see a screenshot of the root page in the first picture with the result. The second picture contains everything from the rest of the pages. It's not much for now - the controller's symbol, and a bunch of network and hierarchical labels to enable so called "sheet pins". I made the symbol starting from one for BQ25798 existed in KiCAD's global library. The chip is quite different but it can be easily transformed by majorly editing pins. While the footprint and 3D model can be requested from Ultra Librarian site by like provided on TI page for BQ25758S. All symbols and footprints I usually add to local projects libraries just not to mess with global library. In KiCAD its a bit tricky to create nice, short names for busses. You need to create aliases in "File" > "Schematic Setup" > "Bus Alias Definitions" and then you can use them across all pages of a project. For now I came up with following networks and busses: VIN - positive input voltage. The master switch page should contain an input connector and protection circuit (fuse, TVS diode) after which the network starts. As well is used to power the digital I/O and indication block VINP - positive input voltage after the master switch itself (goes to the input filter) EN - master switch control signal (should be high to turn the switch on and low to turn it OFF) VINN - output of the input filter VOUT - the output voltages bus (contains power stage output and whole device output networks, goes to the output filter) CSIN - the input current sensor bus (goes to ACN and ACP pins of the controller) CSOUT - the output current sensor bus (goes to SRN and SRP pins) I2C - I2C bus itself (connected to SCL and SDA pins) GPIO - groups digital I/O lines: interrupt, power good, status, and chip enable PROG - groups the rest of analog input lines which should be connected to the programming block to set operating mode and limits for the controller Maybe, going through detailed design these will require changes. The next step is to draft every page with actual design probably skipping at first particular values for components. submitted by /u/WeekSpender [link] [comments]

First and foremost what are reflections? Reflections in PCB are like echoes on a road for electrons. Imagine a PCB trace (the thin copper line) is a highway. A signal is a tiny super-fast car zooming down that highway. Now… If the road suddenly changes, the trace gets thinner or wider, it hits a connector or the layer changes, it’s like the car suddenly hit a speed bump or a wall. Instead of all the signal energy moving forward nicely, some of it bounces back. This bounce is a reflection. Why does it happen? Because of impedance mismatch. If the trace impedance (say 50Ω) suddenly meets something that is not 50Ω, the signal doesn't have enough voltage or current to pass through and reflects back. What are the three types of impedances a signal encounters? Source impedance, Characteristic impedance and Load Impedance. Source Impedance (Zₛ) : This is the output resistance of the driver. It's what the signal encounters at the chip pin sending the signal (before it's launched onto the trace). Inside that chip, there’s some internal resistance. That’s the source impedance. Characteristic Impedance ( Z₀): This is the natural impedance of the trace itself. This is NOT resistance like a resistor. It’s the ratio of voltage to current for a wave traveling down the trace. Which is affected by the trace width, thickness, distance to ground plane (return path), dielectric material etc. Load Impedance (Zₗ): This is the input impedance of the receiving device. It’s the chip pin at the other end of the trace. The load decides what happens when the signal arrives. The Golden Rule (No Reflection Condition) Maximum happiness is achieved when: Zₛ = Z₀ = Zₗ What happens when one is higher or lower than the other? Now we’re getting into the “who wins the fight” part of signal integrity. Case 1: Z₀ > Zₛ (Trace impedance is bigger than source impedance) The source is “stronger” (lower resistance) than what the trace expects. When the signal hits the load and reflects back, the reflection at the source will be positive. That means, the returning wave adds to the original signal, we will see overshoot and possible ringing as well. We may see the waveform jump higher than it should before settling. Case 2: Z₀ < Zₛ (Trace impedance is smaller than source impedance) Now the source is “weaker” compared to the trace. When the reflection returns to the source, the reflection at the source becomes negative. We may see undershoot, slower settling and reflected wave subtracting from the signal. The signal may dip below expected levels before stabilizing. Image Credits: Right the first time by Lee Ritchey . Best book I have read on signal integrity and design. submitted by /u/Capital_Football_604 [link] [comments]

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I was trying to identify some IC's recently and found out that ChatGPT is incredibly good at identifying IC parts from their markings with some extra context information. It can require some prodding and trial and error and giving it some hints helps e.g. a description about what you think it does, component footprint, visible marking, the device you found it on. and force it to list number of alternatives. You can also give it a picture and let it find the layout context. Example I was trying to identify the component marked: KP05 5MES. I gave it the picture and the prompt: "" Help me find this component: The packaging has these markings: KP05 5MES It has aSOIC-8 package It is a high speed component that operates in the GHz range. Found on the front end of a GigaWave 6400 Give me a list of possible alternatives. "" One of the suggested components is the MC10EP05 and I could then verify it by looking at the datasheet That's pretty cool submitted by /u/TileSeeker [link] [comments]

submitted by /u/goldensyrupgames [link] [comments]