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DigiKey, a global leader in the distribution of electronic components and automation products, will present new innovative products and successful projects at its booth N.01 during Maker Faire Rome, from 23 to 25 October 2026. DigiKey is a Gold partner of the event, which brings together hundreds of makers from around the world to share their projects with the public.

“DigiKey’s presence at Maker Faire Rome 2026 reflects our commitment to providing makers, students, teachers and professional engineers with accessible technologies, technical training and hands-on innovation,” said Kevin Walseth, Senior Manager, Technical Marketing for DigiKey. “The event lets us connect directly with attendees, showcase supplier technologies in real applications and strengthen relationships within the maker community.”

Demos and more at the DigiKey booth

DigiKey experts will present new and successful products and projects, such as:

• Sparkfun’s XRP, an experiential robotics platform designed to make learning robotics accessible to everyone
• An XRP robot controlled through a home automation assistant
• AgXRP, a modular kit for agricultural automation designed to combine robotics, sensors and real farming technologies
• Adafruit’s NeoTrellis, a PCB with an elastomer button kit and full-color NeoPixel support
• Arduino’s UNO Q, a microcontroller and single-board computer development board, and VENTUNO Q, an edge AI computer
• Synaptics’ Coralboard, an edge AI board based on Synaptics’ Astra compute technology and Google’s Coral NPU
• DFRobot’s LattePanda and UNIHIKER single-board computers, and HUSKYLENS 2, an AI vision sensor
• A virtual sand demo using an LED matrix and Adafruit’s Matrix Portal
• A self-balancing robot from M5Stack
• Kitronik will have its Mai-Z robots on display, along with a soccer pitch where attendees can face off playing robot soccer

Visitors who stop by the DigiKey booth will also have the chance to take home a DigiKey bag and other DigiKey-branded gadgets.

Now in its fourteenth edition, Maker Faire Rome is an event that facilitates and tells the story of technological innovation in a simple and accessible way, connecting companies, universities, people and ideas. Over the past 13 years, the event has attracted almost 900,000 visitors and has showcased more than 8,000 projects.

For more information about the DigiKey maker community, visit the Maker.io page on the DigiKey website.

The post DigiKey at Maker Faire Rome 2026: robotics, edge AI and makers appeared first on Open Electronics.

Літній відпочинок з Профкомом КПІ 2026 Інформація КП вт, 10/20/2026 - 10:00

Інна Трус. Як зберегти воду, обладнання і довкілля Інформація КП вт, 10/20/2026 - 00:00

У кампусі КПІ — зелене поповнення KPI4U-2 пн, 10/19/2026 - 22:48

I’ve been splice soldering for years but this is my very first attempt at PCB soldering. Everything works as it should so that’s good. submitted by /u/jcass86 [link] [comments]

Marktech Optoelectronics Inc of Latham, NY, USA and its device manufacturing partner Optrans have expanded their portfolio of four-channel indium gallium arsenide (InGaAs) PIN photodiodes for optical systems requiring both infrared detection and positional information. Combining conventional 1.7µm-cut-off and extended 2.6µm-cut-off InGaAs technologies, the portfolio gives optical system designers more options for laser alignment, beam tracking, optical feedback, and analytical instrumentation...

Відзнака на конгресі Optica Laser Congress and Exhibition 2026 KPI4U-2 пн, 10/19/2026 - 17:39

Мистецтво бути тут і зараз: майстер-клас із приготування традиційного японського чаю KPI4U-2 пн, 10/19/2026 - 17:13

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that its preliminary results for third-quarter 2026 show that order intake, operating result (EBIT) and EBIT margin significantly exceed current market expectations...

Mouser Electronics, an authorised global distributor of electronic components and industrial automation products, offers a broad selection of solutions from Bourns, a leading manufacturer of automotive sensors, circuit protection solutions, and magnetic and resistive products for markets such as industrial, automotive, telecommunications, computing and consumer electronics. Mouser currently lists more than 21,000 Bourns components, with over 50,000 parts available to order. Over the past 15 years Mouser has received eight Global Distributor of the Year awards from Bourns, along with two European Distributor of the Year awards.

MAG-3002584 high-power inductor

Available from Mouser, the MAG-3002584 high-power inductor offers an inductance of 87 µH for high-frequency power factor correction (PFC) applications and inverters in high-voltage three-phase power systems. The inductor features low DC resistance (DCR) and a saturation current of 42 A, enabling high-efficiency, high-power-density operation for applications such as data centers, servers, on-board chargers, string inverters and fast charging stations.

Bourns modular high-power contacts

Bourns modular high-power contacts deliver current ratings up to 8 A per contact, making them ideal for applications that require greater power delivery. Available in the 75AB, 76AA and 78AD series, these contacts feature compact footprints, self-centering capability, pick-and-place compatibility and a minimum life of 50,000 cycles. Typical applications include industrial automation, medical equipment, portable communication devices, eMobility systems and portable consumer electronics.

HCTSM110304HAL transformer

The HCTSM110304HAL transformer is designed to meet the stringent isolation requirements of power conversion systems. The transformer’s high clearance and creepage design helps designers develop reliable, high-efficiency power solutions while supporting the strict safety requirements of modern industrial and power electronics applications.

CSS4C-1216 current sense resistors

CSS4C-1216 current sense resistors provide accurate current measurements in a compact package optimised for high-power designs. Featuring low resistance values and robust thermal performance, these resistors help improve energy efficiency and measurement accuracy in applications such as power supplies, battery management systems, motor drives and industrial controls.

A broad selection of Bourns products

These are just a few examples of the Bourns products available from Mouser. To learn more about the full selection, visit the Mouser website. For more Mouser news and the latest product news, visit the Mouser website.

As an authorised global distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser customers can count on 100% genuine, certified products, fully traceable from each of its manufacturer partners. To accelerate customer designs, the Mouser website hosts an extensive library of technical resources, including a Technical Resource Center, along with product datasheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other useful information.

The post Mouser Distributes Bourns Power Solutions for Power Electronics appeared first on Open Electronics.

Hey ya! Soooo i made this digicam using an esp32cam, ov5640 5mp cam module, and it has a 1.3" tft display that shows live view. the cam is fully open sourced, you can find it on my github. (hey be sure to leave a star if you can!) so y'all can build it yourselves, although you will have to do some soldering. github: https://github.com/Bogey1309/PocketCam-Classique i havent put it in a case yet- i do have the cad for it however, if any of you want to make it, you can put it in the case too. unfortunately it does not take videos. but the photos look really y2k in my opinion. (see the last 5th and 6th images) also; i do not earn anything from this- just clarifying. its fully open sourced and i wanted to share this with y'all. submitted by /u/DaSnowGuy1309 [link] [comments]

​AVL and VisIC Technologies are partnering companies that share the vision of upgrading and commercialising high efficiency gallium nitride (GaN) traction inverters. The partnership recently demonstrated advanced research related to traction inverters by integrating gallium nitride (GaN)-based power modules into an electric vehicle reflecting a move that advances high-efficiency power electronics for electric vehicles (EVs).

The test was conducted at AVL’s facilities in Germany where VisIC’s D³GaN technology was integrated into an AVL vehicle demonstrator platform. The development has moved from laboratory testing into a complete vehicle environment.

GaN Technology Targets Lower Inverter Losses

The conducted test trial assembles a GaN technology-based inverter with a high-speed electric axle, advanced power electronics and vehicle control systems. The traction inverter transforms the DC power from an EV’s battery into AC for use in the electric motor. Its efficiency determines the amount of energy taken from the battery that the reaches the motor. This newly announced technology significantly reduces switching and conduction losses, thereby lowering overall inverter losses.

The project also involves NXP Semiconductors for dri​ver electronics, system integration, and performance support. NXP supplies specialized driver ICs for proper control of D³GaN technology at high frequencies. Reducing the inverter’s power losses improves thermal management and supports a more compact powertrain design.

Potential Benefits for Future EVs

Integrating an inverter into a vehicle allows the partnership to evaluate performance metrics under a complete development environment including the electric drivetrain, and their interaction with the motor and vehicle control systems. The companies reported that GaN-technology-based inverter achieved 99.67% efficiency at a switching frequency of 10 kHz and over 99.8% at 5 kHz.

The post AVL and VisIC Advance GaN-Based EV Inverters to Improve EV Powertrain Efficiency appeared first on ELE Times.

A dissimilar laser technology versus the single-mode sibling trades off operating range for cost, at least theoretically. But it’s still faster than the LED-based predecessor.

Last month’s premiere small form-factor pluggable (SFP) module teardown of a single-mode optical transceiver showcased either a Fabry-Perot– or distributed-feedback-(DFB) based semiconductor diode laser operating at 1310 nm.

I’m not sufficiently versed in the technology to visually differentiate between the two—knowledgeable reader insights are welcomed—but I know enough to know that today’s 850 nm multimode optical module uses neither of them.

Requoting my previously published tutorial on SFPs and their siblings:

SFP modules most commonly run at the following wavelengths (all are center frequencies):

• 850 nm (“multimode”)
• 1300 nm (“multimode”)/1310 nm (“single-mode”)
• 1550 nm (“single-mode”)

The distinction between multimode and single-mode fiber optics is important to comprehend and keep in mind, as the two technologies are not interchangeable (although some modules will work with both associated cable material types).

Multimode was historically much less expensive to implement, at the trade-off of lower usable transmission distance. It features a comparatively larger cable core (50 to 62.5 microns) that lets multiple light signals travel down different paths at the same time, and it usually uses lower-cost LEDs or vertical-cavity surface-emitting lasers (VCSELs).

Single-mode features a comparatively tiny core (about 8 to 10 microns), which allows only a single ray of light to pass straight through without bouncing off the edges, and it uses focused lasers as a light source. Its historical cost disadvantage versus “multimode” has more recently decreased, due in part to the availability of non-proprietary, widely compatible modules. And as noted earlier, it generally specifies much longer usable transmission distances.

Different emitter, same dim red glow

The “uses lower-cost LEDs or vertical-cavity surface-emitting lasers (VCSELs)” excerpt from the above is strictly accurate, although in the modern era it’s half-obsolete. Near-infrared LEDs were indeed leveraged with early sub-Gbit 850 nm SFP modules.

However, as a helpful reference I came across notes, “their maximum rate of about 622 Mb/s meant that they could not support 1 Gb/s or higher transmission.” Therefore, I expect to find an 850 nm VCSEL transmitter inside today’s teardown victim, along with a spectrally tuned variant of the earlier 1310-nm receiver.

I first visually confirmed the 850 nm spectrum association by plugging the module into a SFP cage-inclusive multi-port switch in a dark room and (quickly!) discerning the light coming out of the module’s transmit connector.

You might ask why it’s perceptible (and smartphone camera-capturable) at all, given that the human visual spectrum range extends only to around a 750 nm wavelength (corresponding to a ~400 THz frequency). To answer that question, I’ll refer you to another excerpt from my earlier requote: “all are center frequencies”. Even though 850 nm (~3.5 THz) itself may be beyond the range of human visual perception, the transmitter’s bell curve(-ish) output profile seemingly still has a modicum of signal strength at the visual wavelength end of its overall distribution.

Today’s patient, another SFP module (versus higher-speed SFP+), was bundled with a media converter I’ll keep as a spare for potential future lightning-strike galvanic isolation purposes.

Initial perspectives

I’ll as-usual start with some overview shots, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes.

Top.

This time accompanied by a close-up of the embossed transmit and receive direction arrows also mentioned in last month’s teardown (and more generally found in all optical modules I’ve seen).

Right side (as before, with “right” referencing its orientation when inserted in a network switch or other gear’s SFP port).

Bottom (as was the case last time, note the retractable retaining pin).

And left side.

The SFP connector end, from both right-side-up and upside-down module perspectives.

Same goes for the optical fiber connector end, first with the dust cap still in place.

And now post-dust cap removal.

Dissection time

As before, bending back on the side tab you might have noticed earlier (if not, please go back and see), holding the outer and inner enclosure pieces together, is our pathway to the insides. There are two tabs, one on each side, although only the left side one was initially depressed.

As usual, the multiple hinge and associated pieces, conceptually similar to those we saw last month, fell out as the enclosure halves separated.

And there we are.

One screw is all that keeps the PCB attached to the metal assembly surrounding it.

Free at last.

Here’s the bottom of the PCB.

The optical receiver module is on top at the left edge, visually similar to the one found in last month’s single-mode SFP module albeit tuned for a different incoming signal wavelength, with the 850 nm VCSEL-based transmitter below it and conversely looking very different than its 1310 nm laser predecessor shown in the following comparison photo.

Now for the PCB topside of today’s patient.

The ordering is (obviously) reversed in this case; transmitter at top left and receiver below it. And what of the two ICs on this side? Let’s take a closer look.

The larger of the two has the following four-line topside mark; see also my notes in brackets.

1138142
780KF VJ [The second character might instead be the letter O]
PHL [There’s another three-digit code to the right, but it’s obscured by the yellow paint. In a photo I found online, it’s “141” but seemingly not in this case; I think that the first character is “B”]
e4 [This seems to be a company logo, given that it’s surrounded by a circle. Next to it is, judging from other photos I’ve seen, the two-character code “ES”, albeit again yellow paint-obscured]

A Google search on the phrase “1138142 IC” suggests that STMicroelectronics is the supplier but doesn’t reveal anything about the chip’s function. Reader insights are welcomed!

The smaller IC is marked as follows; again, note my comments in brackets.

532R
B809 [As before, the third character here may instead be the letter “O”]

As before with the single-mode module, I’m assuming this is an EEPROM storing data such as the module’s serial number, vendor name, compatibility codes, and calibration data.

In closing, the SFP interface and LC (Lucent Connector) ends of the PCB are visually identical to the ones found in last month’s module, so I’ve decided to spare you the photo redundancy. See last month’s teardown images for representations of how these ones also look. And as always, please share your thoughts on what I’ve found today in the comments!

—Brian Dipert is the associate editor, as well as a contributing editor, at EDN.

Related Content

• SFP: The single-mode module autopsy
• SFP: Add-in module delivers diminutive performance and flexibility
• TP-Link MC220L: Media conversion keeps the network well
• The whole-house LAN: Achilles-heel alternatives, tradeoffs, and plans
• Design considerations in high-speed fiber networks

The post SFP: The multimode module autopsy appeared first on EDN.

Hillcrest Energy Technologies, a Canadian clean technology company specializing in manufacturing high-performance power conversion devices and digital control systems, has reported a major development towards a zero-voltage switching (ZVS) inverter. The company has reduced motor-terminal voltage overshoot by more than 90% compared to a conventional hard-switched silicon carbide (SiC) inverter.

Reducing motor-terminal voltage overshoot extends motor’s insulation life, reduces electromagnetic interference (EMI), decreases motor heating, and enables safe deployment of fast-switching, high-efficiency power devices. The detailed findings of the research were presented at the IEEE Energy Conversion Congress and Expo (ECCE 2026). The event was held from October 4 to 8, 2026, in Vancouver, BC, Canada.

ZVS Technology Addresses Motor Insulation Stress

The primary role of the traction inverter is to convert direct current (DC) from the battery into controlled, multi-phase alternating current (AC) to drive the electric motor. Traditional SiC semiconductors enable fast switching operations resulting in voltage spikes between the inverter, connecting wires, and motor. These voltage spikes put additional stress on the motor’s insulation system and increase the risk of premature failure.

Hillcrest’s ZVS technology addresses this challenge by using a smart method for switching the electric current on and off. It allows switching operations between semiconductor devices when the voltage across them is close to zero. This approach slows voltage transitions and reduces overshoot without depending on additional filtering components which add to the system’s volume, cost, and power losses.

This technology could help EV manufacturers to deal with the problem of motor insulation reliability and electromagnetic interference instead of relying on large-sized filtering solutions. The final validation of these results will be seen when the technology moves towards the development phase and yields a positive impact on the vehicle’s long-term reliability.

The post New ZVS Inverter Technology Cuts EV Motor Voltage Overshoot by Over 90% appeared first on ELE Times.

Архітектура Києва: Як "Будинок з котами" пов'язаний з КПІ Інформація КП пн, 10/19/2026 - 14:51

​With the rising demands of electric vehicles, researchers are continuously working in this domain to make future mobility more practical for electric vehicle (EV) users. To make future mobility more convenient, researchers have introduced an advanced all-solid-state lithium-sulfur battery. This charging solution addresses two major challenges in modern EV infrastructure: long charging periods and limited cycle life.

Many government agencies and companies across the globe are working to commercialize solid-state lithium-sulphur battery designs because they provide high energy density, better safety, reduced dependence on rare-earth metals, and long shelf-life by eliminating the shuttle effect.

Redox Mediator Improves Battery Reaction Kinetics

All-solid-state lithium-sulfur batteries are being explored as an alternative to lithium-ion batteries, offering higher specific energy and lower material cost. However, the solid-state reaction hinders the development of all-solid-state lithium-sulfur batteries due to slow reaction kinetics, which can reduce charging speed and cycling stability.

To overcome this problem, the research team designed a positive electrode with a unique nano-eutectic material of sulfur and iodine arranged in an amorphous network. The iodine serves as a redox mediator, which allows electrons to transfer easily and enhances the sulfur reactions. The electrode’s electrochemical activity is further improved by growing the material within mesoporous carbon.

In lab tests, the battery delivered 851.9 mAh (milliamp-hours per gram) of sulfur and iodine when charged at a rate of 10C, and 474.7 mAh/g at 24C. According to the researchers’ report, electrode showed 9,000 cycles over nine months at 2C and 2,800 cycles at 0.5C over 17 months. These results demonstrate promising cycling stability under the tested conditions.

The post Researchers Develop Solid-State Lithium-Sulfur Battery Design for Faster Charging and Longer Life appeared first on ELE Times.

DRDO has successfully carried out a flight trial of the indigenous High-Altitude Platforms (HAPS). HAPS is a long endurance unmanned aircraft designed as an aerial platform to be used as a surveillance system in the stratosphere. The platform has been developed by ADRDE, Agra, which is an agency of the DRDO.

In the course of the experimental flight, the platform attained an altitude of about 21 kilometres above mean sea level and was maintained at a level of 20 kilometres for more than 30 minutes before being ordered to descend. The vehicle was recovered and analysed, and its flight-performance data were obtained. Instrumental and control systems onboard included an inertial measurement unit, GPS receiver, onboard cameras, and an altitude-control system. Video and other vehicle data were sent back to a ground control station during the trial.

HAPS vehicles are meant to fly at substantially higher altitudes than aircraft that are currently flying today. They may be capable of watching a large area for an extended period of time. They could eventually be used in a variety of surveillance, comms, and monitoring roles. The trial was also conducted in collaboration with the Indian Air Force, CEMILAC, the Directorate General of Civil Aviation, the Airport Authority of India, and other agencies. The flight achieved a significant milestone in the development, though tests are still needed to confirm endurance, payload capacity, and operational viability.

The post DRDO Tests Indigenous High-Altitude Platform for Long-Endurance Surveillance appeared first on ELE Times.

Lockheed Martin has announced a new and improved missile for the missile defence force known as PAC-3 Edge for the US Army Future Interceptor programme. It is aimed at enhancing military capability to protect against increasingly sophisticated missile threats such as hypersonic missiles. The PAC-3 Edge is based on technology developed for the combat-proven PAC-3 Missile Segment Enhancement (MSE), including a new seeker, enhanced flight control technology, and a Northrop Grumman-designed multi-pulse solid rocket motor.

Lockheed Martin has announced a new and improved missile for the missile defence force known as PAC-3 Edge for the US Army Future Interceptor programme. It is aimed at enhancing military capability to protect against increasingly sophisticated missile threats such as hypersonic missiles. The PAC-3 Edge is based on technology developed for the combat-proven PAC-3 Missile Segment Enhancement (MSE), including a new seeker, enhanced flight control technology, and a Northrop Grumman-designed multi-pulse solid rocket motor. defence as forces encounter a more complex array of threats. But PAC-3 Edge is still a development program rather than an operational system in the field.

Lockheed Martin said development and testing would start in 2027, and the missile would enter service in 2031. PAC-3 Edge is a prime example of how manufacturers are already moving legacy interceptor technology forward in the areas of sensors, propulsion, and flight control. Its future utility will be contingent on test results, integration, and procurement.

The post Lockheed Martin Introduces PAC-3 Edge Interceptor for Advanced Missile Threats appeared first on ELE Times.

US-based defence technology firm Anduril Industrial has announced its new family of missiles, Steelfin, a high-speed, configurable surface-to-air missile developed to counter a variety of aerial threats, such as hypersonic vehicles, cruise missiles, and ballistic missiles. The system employs a common two-stage design. Its first-stage booster can be tailored to vary range, performance, and launch parameters. Its second-stage interceptor consists of a common baseline airframe, avionics, software, and flight-control architecture for each variant.

The modular design aims to lessen the incidence of having to redesign the whole missile in the event of a change of operational requirement. Identical parts and production methods could be used to help bring about efficiencies in the manufacturing process and help to achieve economies of scale. Anduril says Steelfin is capable of being integrated with existing land- and sea-based launch infrastructure, such as the Mk 41 Vertical Launch System, and interoperates with current battle-management systems. Ballistic testing with surrogate air vehicles has been conducted, and flight tests will start in 2027.

The move also comes as the armed forces search for cheaper counter-drone tactics to deal with swarms of enemy aircraft that don’t max out the available expensive interceptors. Layered air defence, defensive and offensive protection of the armed forces and the military facilities, ships from the attack of various missile-type ballistics. Steelfin embodies the trend towards modular missile architectures and scalable defence manufacturing. Its actual ability, cost, and effectiveness will have to be proved through additional trials.

The post Anduril Unveils Steelfin Interceptor Missile Family for Layered Air Defence appeared first on ELE Times.

India’s Defence Research and Development Organisation (DRDO) has demonstrated the capacity of a Quantum Key Distribution (QKD) platform on the live network of Proof and Experimental Establishment at Chandipur, Odisha. The trial is aimed at developing cutting-edge technology to safeguard high-value information from growing cyber threats.

Quantum Key Distribution (QKD) uses properties of quantum physics to generate encryption keys. QKD can involve the use of physical objects, such as photons, which have the ability to detect some form of tampering when quantum signals are used to distribute those keys. It has the potential to be part of a high-security communications network.

In the trial, the platform was launched on a live network in a defence test-range environment. The trial was important because a real operational network faced a number of practical issues such as equipment integration, transmission conditions and communication reliability. QKD does not itself encrypt all transmitted information. It enables the creation of secure keys with which to encrypt data, provided that suitable encryption systems are used. In addition, secure end points, management, authentication, and measures to prevent attacks on the system are needed.

Use Cases: Strategic military command network and communications, strategic military research establishments, and other facilities of strategic importance.

The successful demonstration has created more interest in quantum-secured communications in India. Additional testing and integration of the systems will be necessary to ascertain the role this technology will play in defence networks.

The post DRDO Successfully Tests Quantum Key Distribution for Secure Defence Communications appeared first on ELE Times.