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“eMemory’s enhanced OTP products complement Cadence’s Securyzr Root of Trust within the Cadence Chiplet Framework. As a leading provider of non-volatile memory technologies, the combination of eMemory technology and Cadence’s security subsystem results in a Physical AI Chiplet platform delivering secure storage and long-lifecycle key management, reinforcing the strong hardware foundation provided by Cadence for die-to-die security and safety in advanced chiplet designs.”

The post Cadence to deliver pre-validated chiplet solutions to Accelerate Chiplet Time to Market appeared first on ELE Times.

• Secure firmware authentication: firmware code is digitally signed and authenticated by NVIDIA, helping to maintain platform integrity.
• Root of Trust for system boot: cryptographic verification of the firmware using Elliptic Curve Cryptography (ECC-P384) public key technology. This establishes the root of trust for the entire laptop, which is critical because the EC is the first device to power on and authorise secure system boot.
• Advanced power management: handles battery charging, alerts and system power state transitions to optimise energy efficiency.
• System control: oversees key scan and keypad operations for reliable user input.
• New host interface support: implements packet command format processing unique to the NVIDIA DGX interface, advancing beyond traditional byte-level data transfers.
• Value-added integration: incorporates Electromagnetic Interference (EMI) and Static Random-Access Memory (SRAM) interfaces to improve overall system performance.

The post Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers appeared first on ELE Times.

Infineon Technologies AG and HL Klemove aim to strengthen their strategic collaboration in automotive technologies. Their partnership aims to combine Infineon’s semiconductor expertise and system understanding with HL Klemove’s capabilities in advanced autonomous driving systems to accelerate innovation in vehicle electronic architecture for the Software-Defined Vehicle (SDV) era and advance autonomous driving technologies.

This collaboration reflects the shared commitment of both companies to delivering safe and efficient connected mobility solutions. By optimising resources and accelerating proof of concept development, the partners aim to bring innovative technologies to market faster. Together, they plan to build the foundation for future key projects with high-performance, highly reliable autonomous driving solutions that combine Infineon’s semiconductor expertise and HL Klemove’s system integration capabilities.

Under the MoU, the two companies will cooperate in key areas, including:

• Next-generation Zonal Control Units: The companies will jointly develop zone controller applications using Infineon’s microcontrollers and power semiconductors. HL Klemove will lead application development, while Infineon provides semiconductor technology support. Through prototype development, the collaboration aims to strengthen competitiveness in SDV electronic architecture.
• Next-generation Radar Technologies: HL Klemove will leverage Infineon’s radar semiconductor solutions to develop high-resolution and short-range satellite radar, preparing for commercialisation through proof of concept. Additionally, the companies will work on high-resolution imaging radar to achieve next-generation radar technologies capable of precise object recognition.
• Vehicle Ethernet-based ADAS and Camera Solutions: The partners will cooperate on developing front camera modules and an ADAS parking control unit using Infineon’s Ethernet technology. HL Klemove will handle system and product development, while Infineon provides Ethernet semiconductor and networking technology to enable high-speed, highly reliable in-vehicle network solutions.

“Based on our holistic product portfolio, deep system understanding and application know-how, Infineon aims to empower the automotive industry to accelerate time-to-market of software-defined vehicles,” said Peter Schaefer, Executive Vice President and CSO Automotive of Infineon. “Our collaboration with HL Klemove combines Infineon’s technology leadership with HL Klemove’s system expertise to deliver safer and smarter mobility solutions.”

Yoon-Haeng Lee, CEO of HL Klemove, said, “This collaboration marks an important milestone in realising the next-generation electronic architecture required for the software-defined vehicle era. By combining HL Klemove’s system architecture and integration capabilities with Infineon’s semiconductor technology, we will accelerate innovation in key areas such as next-generation zonal controllers, vehicle Ethernet-based ADAS systems, and high-resolution radar.”

The post Infineon and HL Klemove collaborate to advance innovation for SDVs appeared first on ELE Times.

Rohde & Schwarz, a world leader in AI-based millimetre wave screening technology, announced today it has won a multi-million dollar award from TSA to supply its QPS201 AIT security scanners to passenger security screening checkpoints at selected Soccer World Cup 2026 host city airports.

“We are thrilled to receive this award to deliver QPS201’s high-volume and passenger-friendly on-person security screening technology to modernize checkpoints at the airports of cities hosting the matches,” said Frank Dunn, CEO of Rohde & Schwarz USA, Inc. “TSA’s continued investment in the QPS will also further expand Rohde & Schwarz’s economic impact as we grow and create jobs at our facilities in Maryland and Texas.”

“We are proud that TSA is investing in modernising security checkpoints at the Soccer World Cup 2026 host city airports with our high-performance QPS201 technology platform,” said Andreas Haegele, Vice President of Microwave Imaging. “Rohde & Schwarz is deeply committed to our partnership with TSA. We will continue to develop and deliver innovative and effective on-person screening solutions to make airport security more efficient and convenient in the upcoming mega decade of travel, including the Soccer World Cup, America’s 250th Anniversary and the Olympic Games.”

The QPS201 achieved TSA qualification in 2022, approving it for use in US passenger security screening checkpoints and has achieved certification to the TSA and European Civil Aviation Conference (ECAC) highest standards. There are more than 100 R&S QPS201 scanners deployed in US airports already, and more than 2,000 systems deployed in airports worldwide. The QPS201 uses safe millimetre wave radio frequency technology to rapidly and accurately screen passengers for concealed threats. The system requires only milliseconds per scan, and its open design and hands-down scan pose make security screening easy and accessible for travellers.

The post TSA to deploy Rohde & Schwarz QPS201 security scanners at airport checkpoints, ahead of Soccer World Cup, 2026 appeared first on ELE Times.

Ambarella’s CV7 SoC leverages the CVflow computer vision architecture to bring 8K image processing and advanced AI inference to the edge. It supports simultaneous processing of multiple video streams at up to 8K at 60 Hz, making it well suited for a wide range of consumer and industrial AI perception applications, as well as multi-stream automotive systems—particularly those running CNNs and transformer-based networks.

Built on a 4-nm process, the CV7 delivers low power consumption, reducing thermal management requirements and extending battery life. Compared to its predecessor, it consumes 20% less power while integrating a quad-core Arm Cortex-A73 CPU that doubles general-purpose processing performance. A 64-bit DRAM interface further improves memory bandwidth.

The highly integrated CV7 SoC includes a third-generation CVflow AI accelerator, delivering more than 2.5× the AI performance of the previous CV5 SoC. It also integrates an image signal processor and hardware-accelerated video encoding for H.264, H.265, and MJPEG formats.

CV7 SoC samples are now available, along with a CNN toolkit for porting neural networks developed using Caffe, TensorFlow, PyTorch, and ONNX frameworks.

CV7 product page 

Ambarella

The post Vision SoC powers 8K multi-stream AI appeared first on EDN.

NXP has introduced the S32N7 super-integration processor series for centralized vehicle computing across propulsion, vehicle dynamics, body, gateway, and safety domains. The 5-nm series replaces distributed electronic control units with a single processing hub at the vehicle core, providing a foundation for software-defined vehicles.

By consolidating software and data, the S32N7 simplifies vehicle architectures and reduces system complexity, lowering total cost of ownership by up to 20% through fewer hardware modules and more efficient wiring, electronics, and software integration. The processors are designed to meet automotive safety, security, and real-time requirements.

With 32 compatible variants, the S32N7 series provides a scalable platform for AI-enabled vehicle functions. Its high-performance data backbone supports future AI upgrades without re-architecting the vehicle, enabling long-term software development and differentiation across vehicle platforms.

Bosch is the first company to deploy the S32N7 in its vehicle integration platform. Together, NXP and Bosch have co-developed reference designs, safety frameworks, hardware integration guidelines, and an expert enablement program for early adopters.

The S32N79, the superset of the series, is sampling now.

S32N7 series product page

NXP Semiconductors 

The post Processors centralize vehicle intelligence appeared first on EDN.

According to Infineon, the AIROC ACW741x family of tri-radio SoCs features the first 20-MHz Wi-Fi 7 device designed for IoT applications. The device also integrates Bluetooth LE 6.0 with channel sounding, IEEE 802.15.4 Thread connectivity, and support for the Matter ecosystem—all in a compact QFN package.

Wi-Fi 7’s support for 20-MHz channel widths represents a meaningful expansion beyond conventional high-speed applications, especially for IoT devices. This enables lower power consumption, smaller form factors, and more reliable connectivity across a wider range of devices.

“With the recent extension of Wi-Fi Certified 7 capabilities to 20 MHz-only devices, Wi-Fi Alliance will deliver the benefits of Wi-Fi 7 for new device categories, enabling the next wave of IoT innovation across smart home, industrial, and healthcare settings,” said Kevin Robinson, CEO, Wi-Fi Alliance. The introduction of 20-MHz Wi-Fi 7 IoT solutions, such as those being introduced by Infineon, will unlock widespread Wi-Fi 7 adoption across the IoT market.”

The ACW741x supports Wi-Fi 7 multi-link operation (MLO), which enhances link reliability through adaptive band switching to reduce congestion and interference. By maintaining concurrent connections across 2.4-GHz, 5-GHz, and 6-GHz bands, Wi-Fi 7 multi-link for IoT provides a more consistent, always-connected experience for devices such as security cameras, video doorbells, alarm systems, medical equipment, and HVAC systems.

Integrated wireless sensing capabilities give smart IoT devices greater contextual awareness and allow them to share intelligence with other devices on the same network. Compared with other IoT Wi-Fi products, the ACW741x delivers up to 15× lower standby power consumption, extending battery life.

The ACW741x family is sampling now, along with hardware and software development kits.

ACW741x product page 

Infineon Technologies 

The post SoC unlocks 20-MHz Wi-Fi 7 for smart IoT appeared first on EDN.

The Keysight AI Software Integrity Builder enables rigorous validation and lifecycle maintenance of AI-enabled systems to ensure trustworthiness. As AI development grows in complexity, the software delivers transparent, adaptable, and data-driven assurance tailored for safety-critical applications, including automotive systems.

The decision-making behavior of AI models, especially deep neural networks, is difficult to interpret, complicating the identification of dataset limitations and model failure modes. Regulatory frameworks, including ISO/PAS 8800 for automotive AI and the EU AI Act, require demonstrable explainability and validation without defining clear implementation methods.

AI Software Integrity Builder delivers a unified, lifecycle-based framework that provides regulatory evidence and supports continuous AI model improvement. Unlike fragmented toolchains, it integrates dataset analysis, model validation, real-world inference testing, and continuous monitoring. This enables validation of both learned behavior and operational performance for high-risk applications such as autonomous driving.

To learn more about the Keysight AI Software Integrity Builder (AX1000A) and request a quote, visit the product page linked below.

AX1000A product page

Keysight Technologies  

The post Software proves AI behavior in high-risk systems appeared first on EDN.

Two transmissive sensors from Vishay—the single-channel VT171P and dual-channel VT172U—feature a dome height that is 42% greater than that of previous-generation industrial devices. Housed in a 5.5×4×5.7 mm surface-mount package, the sensors increase mechanical design flexibility and provide additional vertical headroom for large code wheels in turn-and-push configurations.

The VT171P integrates an infrared emitter and phototransistor detector for motion and speed sensing, while the VT172U adds a second phototransistor to also enable direction detection. Both sensors operate at a wavelength of 950 nm and deliver a typical output current of 1.5 mA, with typical rise and fall times of 14 µs and 21 µs, respectively. They feature a 3-mm gap width and 0.3-mm apertures.

With a moisture sensitivity level (MSL) of 1, the VT171P and VT172U offer unlimited floor life. The sensors are suited for latches, simple encoders, and switches in industrial, consumer, telecommunication, and healthcare applications.

Samples and production quantities are available now, with lead times of 10 weeks.

VT171P product page 

VT172U product page 

Vishay Intertechnology 

The post Transmissive sensors increase vertical headroom appeared first on EDN.

This engineer could have just stuck with the Gateway 2000-branded, Altec Lansing-designed powered speaker set long plugged into his laptop’s headphone jack. But where’s the fun in that?

Having editorially teased my recent home office audio system upgrade several times now, beginning back in mid-August and repeatedly accompanied by promises to share full details “soon”, I figured I’d better get to writing “now” before I ended up with a reader riot on my hands. Let’s start with the “stack” to the right of my laptop, a photo of which I’ve shared before:

At the bottom is a Schiit Modi Multibit 1 DAC, my teardown of which was published just last month:

Above it is Schiit’s first-generation Loki Mini four-band equalizer (versus the second-generation Loki Mini+ successor shown below, which looks identical from the outside save for altered verbiage on the back panel sticker). I decided to include it versus relying solely on software EQ since I intended to use the setup to listen to more than just computer-based audio sources.

Above it is a passive (unpowered) switch, the Schiit Sys, that enables me to select between two inputs prior to routing the audio to the Rekkr power amplifier set connected to the speakers:

And at the very top is a Schiit Vali 2++ (PDF) tube-based headphone amplifier, identical to the Vali 2+ precursor (introduced in 2000 and shown below) save for a supply constraint-compelled transition to a different tube family:

And the rack? It’s a stacked combo of two (to give me the necessary number of shelves) Topping Acrylic Racks, available both directly from the China-based manufacturer (mind the tariffs!) and from retailers such as Apos in the United States. A little pricey ($39 each), but it makes me smile every time I look at it, which is priceless…or at least that’s how I rationalized the purchase!

As you’ve likely already noticed, this setup uses mainstream unbalanced (i.e., single-ended) RCA cabling. To detail the inter-device connections, let’s start with the device at the end of the chain, the Sys switch. I didn’t initially include it in the stack but then realized I didn’t want to have to turn on the Vali 2++ each time I wanted to listen to music over the speakers (whenever the headphone jack isn’t in use, the Vali 2++ passes input audio directly through to its back panel outputs), given that tubes have limited operating life and replacements are challenging at best to source. As such, while one Sys input set comes from the Vali 2++, the other is directly sourced from the analog “headphone jack” audio output built into my docking station, which is tethered to the laptop (an Intel-based 2020 13” Apple MacBook Pro) over a Thunderbolt 3 connection:

Headphone outputs have passably comparable power specs to the line-level outputs that would normally connect to the Sys switch inputs (and from there to an audio power amplifier’s inputs), with two key qualifiers:

• They’re intended to drive comparatively low-impedance headphones, not high-impedance audio inputs, and
• Given that they integrate a modest audio amplifier circuit, you need to be restrained in your use of the volume setting controlling that audio amplifier to avoid overdriving whatever non-headphone input set they’re connected to in this alternative case.

The only other downside is that since the Sys is at the end of the chain, audio sourced from the docking station’s headphone jack also bypasses the Loki Mini’s hardware EQ facilities, although since it’s always computer-originated in this particular situation, software-based tone controls such those built into Rogue Amoeba’s SoundSource utility for Macs or the open-source Equalizer EPO for Windows systems can provide a passable substitute.

Speaking of EQ, and working backwards in the chain, the Vali 2++ audio inputs are connected to the Loki Mini equalizer outputs, and the Loki Mini inputs are connected to the Modi Multibit 1 DAC outputs. And what of the DAC’s inputs? There are three available possibilities, one of which (optical S/PDIF) is currently unused.

It’s a shame that Apple phased out integrated optical S/PDIF output facilities after 2016; otherwise, I’d use them to tether the DAC to the 2018 Intel-based Apple Mac mini to the right of this stack. Unsurprisingly to you, likely, the USB input is also connected to the laptop, again via the Thunderbolt 3 docking station intermediary (albeit digitally this time). And what about the DAC’s coaxial (RCA) digital input? I’ll save that for part two next time.

Now, let’s look to the left of the laptop:

You’ve actually already seen one of the three members of this particular stack a couple of times before, albeit in a dustier and generally more disorganized fashion:

It’s now tidied up with an even pricier ($219) multi-shelf (and aluminum-based this time) rack, the Topping SR2 (here again are manufacturer and retail-partner links):

As before, the headphone amplifier is still the Drop + THX AAA 789:

But I’ve subsequently swapped out Topping’s D10 Balanced DAC:

for a Drop + Grace Design Standard DAC Balanced to assemble a Drop-branded duo:

The Topping D10 Balanced DAC is back in storage for now; I plan to eventually pair it with a S.M.S.L. SO200 THX AAA-888 Balanced Headphone Amplifier (yes, it really is slanted in shape):

And yes, I realize how abundantly blessed I am to have access to all this audio tech toy excess!

As you’ve likely already ascertained from the images (and if not that, the “Balanced” portion of the second product’s name), this particular setup instead leverages balanced interconnect, both XLR- and TRS-implemented. As such, I couldn’t merge another Schiit Loki Mini or Mini+ equalizer into the mix. Instead, I went with the balanced, six-band Schiit Lokius bigger sibling:

The Lokius EQ sits between the DAC and the headphone amplifier. The DAC’s USB input can connect to one of several nearby computers. On the one hand, this is convenient because the DAC is self-powered by that same USB connection. On the other, I’ve noticed that it sometimes picks up audible albeit low-level interference from the USB outputs of my Microsoft Surface Pro 7+ laptop (that said, no such similar issues exist with my Apple M2 Pro Mac Studio).

And what of the DAC’s optical S/PDIF input? Again, you’ll need to wait until next time for the reveal. Finally, in this case, the headphone amplifier doesn’t have pass-through outputs for direct connection to a stereo power amplifier (or, in this case, monoblock pair), so I’m instead (again, sparingly) leveraging its unbalanced headphone output.

So far, we’ve covered the two stacks’ details. But what does each’s remaining S/PDIF DAC input connect to? And to what do they connect on the output end, and how? Stay tuned for part 2 to come next for the answers to these questions, along with other coverage topics. And until then, please share your so-far thoughts with your fellow readers and me in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

Related Content

• Class D: Audio amplifier ascendancy
• A holiday shopping guide for engineers: 2025 edition
• The Schiit Modi Multibit: A little wiggling ensures this DAC won’t quit
• Audio amplifiers: How much power (and at what tradeoffs) is really required?

The post Sonic excellence: Music (and other audio sources) in the office, part 1 appeared first on EDN.

Fluentgrid Ltd., a leading provider of utility digitalisation platforms and advanced grid management solutions, announced its joining the Wirepas ecosystem and completing full integration of its Head-End System (HES) with the Wirepas Certified platform.

This milestone allows utilities and AMI service providers to seamlessly deploy Wirepas-based networks using Fluentgrid’s proven HES, enabling scalable, multi-vendor smart electricity metering rollouts with assured data reliability and secure, standards-aligned performance. Fluentgrid has already initiated its first pilots on the integrated platform, with early results confirming strong interoperability and field readiness. The integration reinforces both companies’ commitment to supporting India’s RDSS program by ensuring solutions that directly address the needs of utilities and the realities of large-scale deployment.

“Fluentgrid has always been committed to providing utilities with open, flexible and future-
proof digital infrastructure,” said Vipresh Gannamani, Director, Fluentgrid. “By integrating our Head-End System with the Wirepas Certified platform, we are expanding the choice and
interoperability available to our customers. This collaboration ensures that utilities can adopt large-scale mesh deployments with confidence, supported by a robust, field-tested ecosystem, aligned with the national goal of enabling the RDSS vision.”

Wirepas CEO Teppo Hemiä commented:
“Fluentgrid’s integration brings tremendous value to the Wirepas ecosystem in India. A strong and interoperable Head-End System is essential for the scale the market demands. Their completed integration and ongoing pilots are proof of real progress towards open, multi-vendor smart metering architectures, and fully in line with our focus on supporting utilities and helping India achieve the ambitions of the RDSS program.”

The combined capabilities of Fluentgrid’s HES and the Wirepas Certified platform provide
utilities, AMISPs and system integrators with an ultra-resilient, infinitely scalable solution that accelerates deployment timelines while maintaining full transparency and interoperability across the value chain.

The post Fluentgrid Completes Wirepas Certified HES Integration, Joining The Growing Ecosystem For Smart Electricity Metering appeared first on ELE Times.

Cadence, a global leader in electronic system design, celebrated 20 years in Pune as a core research and development hub. This milestone marks two decades of sustained investment and innovation in the region. Established in 2006 by Tensilica, now part of Cadence, this anniversary marks the company’s early belief in Pune’s technology and engineering ecosystem during a period when few multinational technology companies operated there.

Starting with a five-member team, Cadence now employs over 300 employees in Pune and continues to scale its talent base. The Pune centre is a key part of the Silicon Solutions Group. Teams here develop highly complex digital signal processing (DSP) IP, AI accelerators, DDR, and mixed-signal IP for leading semiconductor and electronics companies worldwide. These technologies enable critical applications across consumer electronics, data centres, and automotive markets.

“As we celebrate 20 years in Pune, we take pride in the world-class IP teams here, who collaborate with our global teams to deliver products used by customers worldwide,” said Boyd Phelps, Senior Vice President and General Manager, Silicon Solutions Group at Cadence. “The continued growth of our Pune site emphasises Cadence’s confidence in the region’s talent and our ongoing commitment to investing in people, capabilities, and infrastructure across India.”

As it enters its third decade in Pune, the company remains dedicated to advancing cutting-edge silicon IP and nurturing local talent. Cadence actively partners with MeitY, AICTE, IITs, and over 400 universities to build a strong chip-design talent pipeline. It also supports startups through initiatives like Chips to Startup (C2S). Through advanced EDA tools and India-led innovations in AI-driven and chiplet-based design, Cadence is helping advance India’s semiconductor mission while accelerating global innovation.

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