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Rohde & Schwarz is set to revolutionize the field of signal and spectrum analysis with the launch of the FSWX signal and spectrum analyzer, an innovative instrument designed to overcome the limitations of current measurement methods.

Rohde & Schwarz introduced the brand-new FSWX signal and spectrum analyzer, the first multichannel signal and spectrum analyzer with multiple input ports, unlocking new possibilities in signal analysis. It is also the first instrument of its kind with a cutting-edge internal multi-path architecture enabling a novel cross-correlation feature. Combined with its low phase noise for high signal purity, its spurious-free dynamic range and its outstanding residual EVM, the FSWX delivers an RF performance like no other signal and spectrum analyzer in the market.

The instrument’s wide internal bandwidth of 8 GHz allows for comprehensive analysis even of complex waveforms and modulation schemes. Combined with a high measurement speed and analysis tools tailored to the user’s needs, the FSWX brings new levels of performance and precision to signal analysis for modern RF applications – from active RF components testing to state-of-the-art automotive radar testing to complex airborne radar scenarios and satellite test in A&D applications to the latest test challenges in WLAN and cellular technologies like 5G and beyond.

Michael Fischlein, Vice President Spectrum & Network Analyzers, EMC & Antenna Test at Rohde & Schwarz, is thrilled to introduce the new FSWX: “Our team has truly re-imagined signal and spectrum analysis technology with our new FSWX. They have come up with an innovative architecture and design to empower our customers to tackle complex measurement scenarios in the evolving landscape of wireless communications and radar technology that were previously unattainable. In other words, the FSWX makes measuring the impossible, possible.” The instrument’s innovative design features include multiple input ports, cross-correlation capabilities, advanced filter banks and broadband ADCs.

Multiple input ports

The multichannel FSWX offers the ability to measure multiple signal sources simultaneously, regardless of whether they operate at the same or different frequencies. With synchronous input ports, each featuring 4 GHz analysis bandwidth, users can seamlessly analyze the interactions between diverse signals. This opens up a multitude of new measurement scenarios, for instance, phase-coherent measurements of antenna arrays used in beamforming for wireless communications as well as in airborne and automotive radar sensors.

Multi-path architecture and cross-correlation

Its advanced internal multi-path architecture allows for the cross-correlation mode, a novel feature of the FSWX. A single signal input is internally split into two independent signal paths, each equipped with its own local oscillator and ADC. With this innovative design, advanced cross-correlation algorithms can be applied in the digital backend, effectively removing the inherent noise of the measurement instrument. This feature reveals spurs not easily seen without cross-correlation. It is especially helpful when, for instance, measuring Error Vector Magnitude (EVM), a critical factor in mobile communications. The added wideband noise of traditional signal and spectrum analyzers limits the accuracy and dynamic of EVM measurements. With the cross-correlation feature, however, the FSWX provides an unobstructed view of the DUT for precise EVM analysis.

The internal multi-path architecture also offers advanced triggering options. For example, users can apply an IF or RF power trigger at distinct frequencies, as the multi-path design allows for independent frequency settings for each receive path behind the splitter. This way, the FSWX can easily reveal effects between two RF signals.

Advanced filter banks and broadband ADCs

Traditionally, for preselection in the microwave range, spectrum analyzers rely on YIG filters. Since they are known for their challenging frequency response, YIG filters need to be bypassed for wideband signal analysis. The FSWX, however, employs broadband ADCs in conjunction with filter banks that span the entire operating frequency range, allowing for pre-selected signal analysis while eliminating the need for YIG filters. The filter banks provide high precision, optimizing instrument settings for specific applications and significantly reducing the risk of unwanted signal images contaminating results. For users requiring narrowband applications, a YIG filter can still be added optionally.

Innovative firmware applications

The FSWX also provides innovative firmware applications such as the CrossACT (Cross Application Control and Triggering) firmware feature. It synchronizes various measurements across different input channels, allowing for simultaneous analysis with multiple tools. This capability simplifies comparisons, such as determining whether the higher harmonics of a radar signal directly impact the EVM performance of a 5G signal.

The Linux-based operating system of the FSWX provides a high level of security and long-term support, essential features for users in security-sensitive environments. This robust operating system ensures reliability and stability, making the FSWX an ideal choice for demanding applications.

The post New FSWX signal and spectrum analyzer with novel architecture overcomes limits of today’s analysis methods appeared first on ELE Times.

Порядок організації та функціонування внутрішнього контролю в Національному технічному університеті України «Київський політехнічний інститут імені Ігоря Сікорського» kpi пт, 06/13/2025 - 11:59

Author: Mr. Saleem Ahmed, Officiating Head, ESSCI

In the next ten years, India will witness a tectonic shift in its technological landscape, one that will decisively shape the nation’s economic destiny and global standing. At the heart of this transformation lies the semiconductor industry, often referred to as the “new oil” in the global economy. For Indian engineers, the semiconductor revolution isn’t just a story of factories and chips—it’s a gateway to high-value, future-ready careers that promise innovation, growth, and national impact.

With multiple large-scale semiconductor fabrication and assembly projects underway, and policy support at an all-time high, semiconductor jobs are rapidly becoming the next big thing for engineering talent in India. And at the forefront of this workforce transformation stands the Electronics Sector Skills Council of India (ESSCI)—tasked with equipping the Indian workforce for this high-tech future.

A Nation on the Verge of a Chip Revolution

India’s dependence on imported chips—used in everything from mobile phones to fighter jets—has long been a strategic vulnerability. But that reality is now changing. Recently Union Cabinet’s approved  approved a new semiconductor plant in Uttar Pradesh’s Jewar to be jointly set up by HCL Group and Foxconn. The newly approved facility will come up at an investment of Rs 3,700 crore.

This is the sixth unit approved under the India Semiconductor Mission, with five semiconductor facilities in advanced stages of construction. Three of these units—by Micron Technologies, Kaynes Technologies and a combination of CG Power-Renesas Electronics and Star Microelectronics—are based in Sanand, Gujarat. The Tata Group is building one semiconductor facility in Dholera, Gujarat and another in Assam.

These developments are backed by the Government of India’s India Semiconductor Mission (ISM), a ₹76,000 crore policy initiative that provides incentives for design, manufacturing, and packaging of semiconductor chips.

This growing ecosystem will need a massive talent pool—and that’s where India’s engineers come in.

Why Semiconductors Are a Game-Changer for Engineers

Semiconductors power almost every modern device—from smartphones and laptops to electric vehicles, smart appliances, 5G infrastructure, defense systems, and even satellites. As the world shifts toward AI, IoT, and smart mobility, the demand for chips is set to explode. According to recent estimates, India’s semiconductor market will triple in size—from US$22.7 billion in 2019 to over US$80 billion by 2028.

This explosion is not just about demand—it’s about job creation.

According to ESSCI’s analysis, the semiconductor industry is set to witness a dramatic rise in employment demand. The sector, which is projected to employ 1.70 lakh individuals by 2025, is expected to rise to 1.87 lakh in 2026, and add a total of 1.03 lakh new jobs by 2030. This includes roles in chip design, fabrication, testing, quality control, equipment maintenance, and advanced manufacturing processes.

The rapid expansion of this sector has created an urgent need for a highly skilled workforce. ESSCI is committed to bridging the skill gap through targeted training programs, collaborating with industry and academia to equip young professionals with expertise in chip design, fabrication, and advanced packaging. These initiatives will empower the next generation to drive India’s semiconductor revolution.

Such roles are not only high-paying but also globally portable, offering Indian engineers access to both domestic and international job markets.

The Many Doors Semiconductor Jobs Open

The semiconductor industry is uniquely interdisciplinary, requiring expertise in electronics, mechanical, chemical, computer science, materials engineering, and more. Here’s a breakdown of the top career tracks Indian engineers can pursue:

1. Design Engineers

Design engineers work on creating the architecture and layout of chips. They use Electronic Design Automation (EDA) tools to ensure chips are efficient, reliable, and ready for fabrication.

2. Process Engineers

These engineers fine-tune the manufacturing process, often working in cleanroom environments. They handle wafer processing, lithography, etching, doping, and deposition.

3. Packaging and Testing Experts

Once chips are fabricated, they need to be tested, assembled, and packaged. Engineers in this field ensure performance and durability under various operating conditions.

4. R&D Scientists

Research roles offer cutting-edge work in developing new semiconductor materials like gallium nitride or silicon carbide, and technologies like FinFET or EUV lithography.

5. Equipment and Maintenance Technicians

Fabrication units run on precision equipment that needs constant monitoring and maintenance—critical work for mechanical and electronics engineers.

6. Quality and Safety Officers

Given the strict standards in chip manufacturing, QA engineers ensure compliance, while safety experts handle protocols in chemical and electrical hazards.

Enter ESSCI: Building the Backbone of India’s Semiconductor Workforce

With this exponential growth comes the challenge of creating a skilled and job-ready workforce. The Electronics Sector Skills Council of India (ESSCI), under the aegis of the Ministry of Skill Development and Entrepreneurship, plays a crucial role in bridging this gap.

ESSCI has already developed 25 NSQF-aligned qualifications for semiconductor design, packaging, and manufacturing. These qualifications are designed to cater to:

• Engineering graduates seeking specialization
• Diploma and ITI students entering the job market
• Working professionals seeking upskilling or domain switch

ESSCI offers focused a range of qualifications covering the complete value chain of the semiconductor industry. Short Term courses such as VLSI Design Engineer, concentrating on designing SOC-module functions using software, Embedded Full Stack Engineer, IoT Hardware Analyst are some of the top courses offered for pursuing engineering graduates to gain the knowledge of EDA Tools and system design. ESSCI also provides qualifications for Wafer Back Grinding Engineer and Wafer Dicing Engineer, specialising in wafer manufacturing tasks which can be taught to ITI / Diploma students. ESSCI also has foundation / upskilling courses in the field of Nano Science & Advance Nano Science which is also in great demand. Also, there are some basic courses on the Industrial Safety – Electrical & Hazchem which are very crucial & important for the industrial safety requirements.

Career Opportunities in Semiconductor Technology:

As the semiconductor industry evolves in response to these mega trends, it creates exciting career opportunities for professionals across the value chain – designing, fabrication and packaging. From semiconductor design and manufacturing to research and development, there is a growing demand for skilled professionals who can innovate and drive technological advancements in the industry.

The sector is expected to see more than 800,000 to 1 million job openings over the next five years, says staffing company Randstad. The government recently approved $15 billion worth of investments into the sector including from the Tata group. India’s burgeoning semiconductor sector is facing a surge in demand for talent, fuelled by new investments and the government’s ambitious plan to transform the country into a chip manufacturing hub.

1. Semiconductor Design Engineer:Semiconductor design engineers play a crucial role in developing the architecture and circuitry of semiconductor chips. They utilize tools like Electronic Design Automation (EDA) software and simulation tools to design and optimize chip layouts for performance, power efficiency, and manufacturability.
2. Process Engineer:Process engineers are responsible for developing and optimizing semiconductor manufacturing processes. They work closely with equipment vendors and manufacturing teams to ensure the smooth operation of semiconductor fabrication facilities, improve yield rates, and reduce production costs.
3. Research Scientist:Research scientists in the semiconductor industry focus on exploring new materials, devices, and technologies to push the boundaries of semiconductor innovation. They conduct experiments, analyze data, and collaborate with cross-functional teams to develop next-generation semiconductor solutions.
4. Material Engineers:Material engineers in the semiconductor industry are pivotal in researching, selecting, and optimizing the materials used in semiconductor device fabrication. Their expertise spans a wide range of materials, including silicon, gallium arsenide, and various compound semiconductors. Material engineers work closely with semiconductor design teams to ensure that the chosen materials meet the performance requirements of the intended applications while also considering factors such as cost, scalability, and reliability. Additionally, they play a crucial role in developing new materials and processes to push the boundaries of semiconductor technology, enabling advancements in areas such as miniaturization, power efficiency, and functionality.
5. Product Marketing Manager:Product marketing managers play a vital role in bringing semiconductor products to market. They conduct market research, develop marketing strategies, and collaborate with sales teams to promote semiconductor products and drive revenue growth.
6. Quality Assurance Engineer:Quality assurance engineers ensure that semiconductor products meet the highest standards of quality and reliability. They develop and implement test plans, conduct performance testing, and analyze data to identify and address any issues or defects in semiconductor products.
7. Packaging experts:Packaging experts in the semiconductor industry are instrumental in developing and implementing packaging solutions that safeguard semiconductor chips. Their role entails meticulous selection of packaging materials, designing efficient packaging structures to ensure protection against environmental factors and mechanical stresses, and optimizing designs for thermal management and electrical performance. They collaborate closely with design and manufacturing teams to ensure that packaging solutions meet stringent industry standards while balancing factors such as cost-effectiveness and manufacturability.
8. Clean room specialists:They play a pivotal role in maintaining the pristine conditions necessary for semiconductor fabrication processes. They are responsible for meticulously managing and monitoring cleanroom environments to prevent contamination that could compromise the quality and reliability of semiconductor devices. Clean room specialists enforce strict cleanliness protocols, perform regular inspections, and oversee cleaning procedures to ensure compliance with industry standards and regulations. Their expertise ensures that semiconductor manufacturing facilities operate in controlled environments conducive to high-quality production.
9. Machine maintenance technicians:They are essential for sustaining the operational efficiency and reliability of semiconductor manufacturing equipment. Their responsibilities include conducting routine maintenance tasks, performing diagnostics, troubleshooting equipment issues, and executing repairs as needed to minimize downtime and optimize production throughput. Machine maintenance technicians also play a crucial role in implementing preventive maintenance schedules, identifying opportunities for equipment upgrades or optimizations, and ensuring compliance with safety regulations and operational standards. Their expertise contributes to the overall efficiency and longevity of semiconductor manufacturing operations.
10. Safety protocol checkers:These people are integral to maintaining a safe and secure work environment within semiconductor manufacturing facilities. They are responsible for enforcing safety regulations, conducting regular inspections to identify potential hazards, and implementing corrective measures to mitigate risks and prevent accidents. Safety protocol checkers also play a vital role in developing and implementing safety training programs, conducting safety audits, and promoting a culture of safety awareness among employees. Their diligence and vigilance help to safeguard the well-being of personnel, protect semiconductor manufacturing equipment, and maintain the integrity of semiconductor processes.

Career Opportunities Across the Ecosystem

• Global Semiconductor Giants: Intel, Micron, AMD, Qualcomm, NXP
• Indian Startups & Design Houses: Saankhya Labs, Steradian Semiconductors, Signalchip
• Manufacturing Units: Tata Group, Vedanta-Foxconn, ISMC
• Government & Defense: DRDO, ISRO, SCL (Semiconductor Lab)
• Academia & R&D: IITs, IIITs, National Labs

India’s Policy Ecosystem: Creating the Right Conditions

India’s semiconductor journey isn’t just market-driven—it’s backed by clear, consistent policy action:

• Production Linked Incentive (PLI) Scheme to support manufacturers.
• Design Linked Incentive (DLI) Scheme for fabless startups and institutions.
• Modernization of the Semiconductor Laboratory (SCL) in Mohali into a full-fledged fab.
• State-level incentives, like Odisha’s offer of 25% subsidy on capex for fabs and 20% for fabless companies.

Moreover, global giants like Applied Materials, Lam Research, and Samsung Semiconductor India Research (SSIR) are expanding operations in India—indicating long-term confidence in India’s talent and policy framework.

A Strategic Moment for Indian Youth

The rise of India’s semiconductor sector presents a rare, perhaps once-in-a-generation, opportunity. Engineers who upskill today can become:

• The designers of India’s next chip
• The technicians behind India’s first fab line
• The entrepreneurs launching fabless startups
• The leaders driving India’s tech sovereignty

At a time when countries are scrambling to secure chip supply chains, India is carving a unique place for itself—not just as a consumer but as a creator. But this vision hinges on talent.

That’s why engineers—especially young graduates and final-year students—must look seriously at semiconductors. With government support, ESSCI’s training programs, and private sector momentum, the time to act is now.

Conclusion: From Potential to Powerhouse

India is no longer at the sidelines of the global chip race. With strong policy, infrastructure investment, and a strategic location, it is emerging as a serious contender. But no chip factory can run without engineers. The success of India’s semiconductor mission will ultimately depend on its people—its skilled, driven, and future-ready engineers.

The post Why Semiconductor Jobs Are the Next Big Thing for Indian Engineers appeared first on ELE Times.

Power semiconductor technology firm ROHM says that it is one of the key silicon providers supporting NVIDIA’s new 800V High-Voltage Direct Current (HVDC) architecture. This marks a pivotal shift in data-center design, enabling megawatt-scale AI factories that are more efficient, scalable, and sustainable...

So I am working on my first ee project for a school competition which is a custom macro pad keyboard. I am also going after the building in public trend and making videos on it to keep me honest. I kinda messed up and didn’t order the stencil plate and had to pay more to order it. Looking forward to building this out ! I am planning to use a hot plate for the chips on this. submitted by /u/noamankhalil [link] [comments]

Altum RF’s MMIC amplifiers are now part of Quantic’s plug-and-play X-MWblocks, enabling seamless integration into RF designs. The modular format streamlines design, evaluation, prototyping, and production for rapid RF and microwave system assembly.

The initial offering includes five of Altum RF’s low-noise and driver amplifiers: ARF1200Q2, ARF1201Q2, ARF1202Q2, ARF1203Q2, and ARF1205Q2. These devices cover frequency bands from 13 GHz to 43.5 GHz, with noise figures as low as 1.6 dB. Additional Altum RF MMICs will join the X-MWblocks platform in the coming months.

Quantic X-Microwave offers a catalog of over 6000 RF components for configuring modules, assemblies, and subassemblies. Find Altum RF products here.

Quantic X-Microwave 

Altum RF

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Expanding Qorvo’s GaN-on-SiC SATCOM portfolio, the QPA1722 K-band power amplifier improves Low Earth Orbit (LEO) satellite performance. Qorvo reports the amplifier delivers three times the instantaneous bandwidth and 10% higher efficiency than comparable devices, all within a 38% smaller footprint. These enhancements enable higher data throughput and support more compact, efficient satellite payload designs.

The QPA1722 operates from 17.7 GHz to 20.2 GHz, delivering up to 10 W (40 dBm) saturated and 6 W (37 dBm) linear output power. It provides more than 1 GHz of instantaneous bandwidth to support high data-rate applications, with 36% efficiency for improved power handling and thermal performance. Additional specifications include 26 dB small-signal gain, 35% power-added efficiency, and –25 dBc third-order intermodulation distortion.

Housed in a 6.0×5.0×1.64-mm surface-mount package, the QPA1722 is fully matched to 50 Ω with DC-grounded input and output ports. On-chip blocking capacitors follow the DC grounds at both ports.

The QPA1722 power amplifier is sampling now, with volume production planned for fall 2025. Evaluation kits are available upon request.

QPA1722 product page 

Qorvo

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Anritsu has added a simultaneous sweep feature to its ShockLine MS46131A 1-port vector network analyzer (VNA), which operates up to 43.5 GHz. The capability supports parallel 1-port S-parameter measurements across up to four MS46131A units.

Simultaneous sweep enables coordinated triggering through an external signal, aligning the start of sweeps across multiple VNAs. Each unit can be configured independently with different start and stop frequencies, IF bandwidths, and point counts while performing synchronized sweeps.

Well-suited for multi-band, multi-configuration test environments, the MS46131A supports synchronized antenna characterization for LTE and Wi-Fi 7, sub-6 GHz and mmWave 5G (FR2 and FR3), and phased array validation. Remote operation is enabled via SCPI commands over uniquely assigned TCP port numbers, allowing full automation and integration into distributed test systems.

The simultaneous sweep feature is available with software version 2025.4.1 and supported on all MS46131A VNAs.

MS46131A product page 

Anritsu

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Powered by an eGaN FET, EPC’s EPC9196 is a 25-A RMS, 3-phase BLDC inverter optimized for 96-V to 150-V battery systems. The reference design targets medium-voltage motor drives, including steering in AGVs, traction in compact autonomous vehicles, and robotic joints.

The EPC9196 is built around the EPC2304, a 200-V, 3.5- mΩ (typical) eGaN FET in a thermally enhanced QFN package. This device enables high-efficiency operation with a peak phase current of 35 A and switching frequencies up to 150 kHz. GaN technology reduces switching losses and dead time, enabling smoother, quieter motor operation even at high PWM frequencies.

Featuring a wide input voltage range from 30 V to 170 V, the EPC9196 integrates gate drivers, housekeeping power, current and voltage sensing, overcurrent protection, and thermal monitoring. The reference design provides dv/dt control below 10 V/ns and supports both sensor-less and encoder-based control configurations. It is compatible with motor drive controller platforms from Microchip, ST, TI, and Renesas.

EPC9196 reference design boards cost $812.50 each and are available from DigiKey. The EPC2304 eGaN FET sells for $3.68 each in reels of 3,000 units.

EPC9196 product page

Efficient Power Conversion 

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Renesas offers one of the first microcontroller families to support USB-C Revision 2.4 with its RA2L2 group of low-power Arm Cortex-M23 MCUs. The updated USB Type-C cable and connector specification lowers voltage detection thresholds to 0.613  V for 1.5 -A sources and 1.165  V for 3.0-A sources, enhancing compatibility with newer USB-C cables and devices.

Low-power operation makes the RA2L2 MCUs well-suited for portable devices such as USB data loggers, charging cases, barcode readers, and PC peripherals like gaming mice and keyboards. These entry-level MCUs consume just 87.5 µA/MHz in active mode, dropping to 250 nA in software standby. An independent UART clock enables wake-up from standby when receiving data from Wi-Fi or Bluetooth LE modules.

In addition to USB-C cable and connector detection up to 15 W (5 V/3A) and USB Full-Speed support, the MCUs offer a low-power UART, I3C, SSI, and CAN interfaces for design flexibility. The 48-MHz Cortex-M23 core is paired with up to 128 KB of code flash, 4 KB of data flash, and 16 KB of SRAM.

RA2L2 microcontrollers are now available. Samples and evaluation kits can be ordered from the Renesas website and authorized distributors.

RA2L2 product page

Renesas Electronics 

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The 300 is just an approximation. It might be more, but probably not less. submitted by /u/PhoenixfischTheFish [link] [comments]

Have you ever heard the idiom “ripping off the band-aid? With thanks to Wiktionary for the definition, it means:

To perform a painful or unpleasant but necessary action quickly so as to minimize the pain or fear associated with it.

That’s not what Apple’s doing right now with the end stages of its Intel-to-Apple Silicon transition, which kicked off five years ago (fifteen years, ironically, after its previous announced transition to x86 CPUs, two decades ago). And although I’m (mostly) grateful for it on a personal level, I’m also annoyed by what’s seemingly the company’s latest (but definitely not the first, and probably also not the last) example of “obsolescence by (software, in this case) design”.

Nearing the end of the line for Intel

Upcoming MacOS “Tahoe” 26, publicly unveiled at this week’s Worldwide Developer Conference (WWDC) and scheduled for a “gold” release later this year (September or October, judging from recent history), still supports legacy Intel-based systems, but only four model/variant combos. That’s right; four (and in those few cases still absent any Apple Intelligence AI capabilities):

• MacBook Pro (16-inch, 2019)
• MacBook Pro (13-inch, 2020, Four Thunderbolt 3 ports)
• iMac (27-inch, 2020)
• Mac Pro (2019)

My wife owns the first one on the list, courtesy of a Christmas present from yours truly last year. I’m typing these words on the second one. The other two are the “end of the line” models of the Intel-based iMac and Mac Pro series, both of which subsequently also switched to Apple Silicon-based varieties. Not included, long-time readers may have already noticed, is my storage capacity-constrained 2018 Mac mini; its M2 Pro successor is already sitting on a shelf downstairs in storage, awaiting its turn in the spotlight (that said, I’ll probably cling to my 2018 model longer than I should in conjunction with OpenCore Legacy Patcher, even if only motivated by hacker curiosity and because I’m so fond of the no-longer-offered Space Gray color scheme…).

But let’s go back to the second (also my) system in the previous bullet list. Did it also seem strange to you that Apple specifically referenced the model with “Four Thunderbolt 3 ports”? That’s because Apple also sold a 2020 model year variant with two Thunderbolt 3 ports. If you compare the specs of the two options, you’ll see that there’s at least some tech rationalization for the supported-or-not differentiation; the two-port model is based on a 8th-generation “Coffee Lake” Intel Core i5 8257U SoC, while my four-port model totes a 10th-generation “Ice Lake” Core i5 1038NG7. That said, they both support the same foundation x86 instruction set, right? And the integrated graphics is Intel Iris Plus in generation for both, too. So…

A one-year delay in sentencing for (some of) the Dipert family system stable aside, the endgame verdict for Intel on Apple is now coming into clear view. Apple confirmed that “Tahoe” is x86’s last hurrah; MacOS will be Arm-only beginning with next year’s (2026) spin. The subsequent 2028 edition will also drop Rosetta 2 dynamic software-translation support, so any x86-only coded apps will no longer run. And given these moves, along with Apple’s longstanding tradition of supporting not only the current but also prior two major O/S generations, it would make no sense for any developer to bother continuing to make and support “Universal” versions of apps (dual-coded for both x86 and Arm) once “Tahoe” drops off the support list in 2028…if they even wait that long, that is, considering that the predominant percentage of legacy Intel systems will be incapable of running a supported MacOS variant way before then. This forecast echoes what played out last time, when PowerPC was phased out in favor of x86.

The Liquid Glass interface

The other key announcement at the pre-recorded 1.5-hour keynote that kicked off this week:

which Apple itself condensed down to a 2 minute summary (draw your own “sizzle vs steak” conclusions per my recent comments on Microsoft and Google’s full and abridged equivalents):

involves the Liquid Glass UI revamp which, after conceptually originating with the two-years-back Vision Pro headset, now spans the broader product line. Translucency, rounded corners and expanded color vibrancy are its hallmarks; Apple even did a standalone video on it:

It looks…OK, I guess. On the Vision Pro, the translucency makes total sense, because UI elements need to be not only spatially arranged with respect to each other but also in front of the real-life scene behind them (and in front of the user), reproduced for the eyes by front-facing cameras and embedded micro-OLEDs. But for phones, tablets, watches, and the like…again, it’s OK, I guess. I’m not trying to minimize the value of periodic visual-experience refreshes, mind you; it’s the same underlying motivation behind re-painting houses and the rooms inside them. It just feels not only derivative, given the Vision Pro heritage, but also reactionary, considering that Google announced its own UI refresh less than a month ago (Android 16 is apropos downloading to my Pixels as I type these words, in fact), and Samsung had unveiled its own in January (six months later than originally promised, but I digress).

The iPad (finally?) grows up

There is, however, one aspect of Apple’s UI revamp that I’m very excited about, but which ironically has little (but not nothing) to do with Liquid Glass. For many years now, iPads (particularly the high-end Pro variants) have offered substantial hardware potential, largely untapped by the platform’s unrealized software capabilities. Specifically, I’m talking about Apple’s ham-fisted Split View and Slide Over schemes for (supposedly) unlocking multitasking. Frankly, the only times I ever used either of them were accidental, and my only reaction was to (struggle to figure out how to) undo whatever UI abominations I’d unintentionally activated.

Well, they’re both gone as of later this year. In their place is proper MacOS-like windowing, with menu bars, user customizable window locations and sizes, and the like. Hallelujah. Reiterating a point I’ve made before (although software imperfections blunted its at-the-time reality), Apple will need to be careful to not cannibalize its computer sales by tablet sales going forward. That said, as I’ve also previously noted, if you’re going to get cannibalized, it might as well be by yourself, not to mention that tablets offer Apple more competitive isolation than do computers.

Deep learning (local) model developer access

Apple also this week announced that it was opening up developer access to its devices’ locally housed deep learning inference models for use by third-party applications. Near term, I’d frankly be more enthusiastic about this move if the models themselves were better. That said, given that we’re talking about “walled garden” Apple here, they’re the only game in town, so I guess something’s better than nothing. And longer term, Apple now clearly realizes it’s behind its competitors in the AI race and is revamping its management and dev teams in response (not to mention dissing its competitors in the presumed hope of slowing down the overall market until it can catch up), so circumstances will likely improve tangibly here, in fairly short order.

Too much…too little…just right?

By the way, I’m sure many of you have already noticed the across-the-board naming revamp of the various operating systems to a consistent “dominant model year” approach…i.e. although the new versions will likely all roll out later this year, they’ll be majority-in-use in 2026. Whatever (in all seriousness, the numerical disparity between, for example, current-gen iOS 18, MacOS 15 and WatchOS 11 likely resulted in at least some amount of consumer confusion).

Broadly speaking, while I’m not trying to sound like Goldilocks with the header title of this concluding section of my 2025 WWDC coverage, I am feeling a bit of whiplash. Last year, Apple’s event was bloated with unrelenting AI hype (therefore my title “jab”), much of which still hasn’t achieved even a semblance of implementation reality even a year later (to developer and pundit dismay alike). This year, it felt like the pendulum swung (too far?) in the opposite direction, with excessive attention being drawn to minutia such as newly added gestures for AirPods earbuds and the Apple Watch (not that I can even remember the existing ones!), and no matter that the AI-powered real-time language translation facilities are welcome (albeit predictable).

Maybe next year (and, dare I hope, in future years as well) Apple will navigate to the “middle way” between these extremes. Until then, I welcome your thoughts on this year’s event and associated announcements in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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• The 2024 WWDC: AI stands for Apple Intelligence, you see…
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• Apple’s 2022 WWDC: Generational evolution and dramatic obsolescence
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Tokyo-based Mitsubishi Electric Corporation says it has developed a compact 7GHz band gallium nitride (GaN) power amplifier module (PAM) with record-breaking power efficiency of 41%. The performance was verified in a demonstration using 5G-Advanced communication signals...

Global smartphone production reached 289 million units in Q1 2025, says market research firm TrendForce. Compared to Q1 2024, the figures represent a 3% decline. However, in China, sales in Q1 were boosted by an ongoing consumer subsidy program...

Факультет інформатики та обчислювальної техніки відкриває дистанційну форму навчання: нові можливості для сучасних студентів kpi чт, 06/12/2025 - 13:19

Imec of Leuven, Belgium has unveiled a gallium nitride (GaN) MOSHEMT (metal-oxide-semiconductor high-electron-mobility transistor) on silicon (Si) that achieves both record efficiency and output power for an enhancement-mode (E-mode) device operating at low supply voltage. In parallel, the firm also demonstrated a record-low contact resistance of 0.024Ω·mm, which is essential to further boost output power in future designs. Imec says that the results mark a crucial step toward integrating GaN technology into next-gen mobile devices, particularly those targeting the 6G FR3 band between 7 and 24GHz. The results are being presented at the 2025 Symposium on VLSI Technology and Circuits in Kyoto, Japan, June 8-12...

Відкрита наука для ЗВО: КПІ ім. Ігоря Сікорського презентував інституційний інструментарій на семінарі в Любляні kpi чт, 06/12/2025 - 12:23

Anritsu expands its signal generator product line with the introduction of the EcoSyn Lite Microwave Synthesizer Module that delivers outstanding phase noise, ultra-fast switching speed and compact size. EcoSyn Lite compliments Anritsu’s high performance RubidiumTM bench top signal generators to address a wide range of signal generator applications.

EcoSyn Lite covers 10 MHz to 20 GHz frequency range and delivers +18 dBm output power. Housed in a portable, compact 4 inch x 4 inch x 0.8 inch form factor ideal for use in space constrained applications which require instrumentation grade CW signal source.

Instrument Class Phase Noise in Module Form Factor

EcoSyn Lite features best in class phase noise performance of -126 dBc/Hz (typical) at 10 GHz and 10 kHz offset, that compares favorably with some of the bench top signal generators in the market today. With its robust output power of up to +18 dBm it is ideal as LO for up/down converters in RF/Microwave transceivers. These transceivers increasingly use complex and high order modulation signals which require LOs with low phase noise for up/down conversion. EcoSyn Lite’s superior non-harmonic spurious of -60 dBc delivers very low jitter and can be used as a clock source for Gbit ADC/DAC testing and in high-speed optical systems.

Ultra-fast Frequency Switching Speed

EcoSyn Lite has ultra-fast frequency switching time of less than 50 µs in Triggered list mode. In ATE (Automatic Test Equipment) application, fast frequency switching speed saves testing time. Shorter test times translate to higher test throughput thus achieving less test cost. Ultra-fast switching time and small form factor makes EcoSyn Lite ideal in ATE rack applications.

Switching speed can also be critical in radar cross section (RCS) measurements necessary to establish radar signatures for known targets, such as aircraft, ships, and missiles. These signatures are created through measurements at thousands of frequencies. Because of the total numbers of measurements that must be made, EcoSyn’s ultra fast switching time can save considerable measurement time. Testing an antenna also requires large amounts of data at multiple frequencies. EcoSyn Lite’s ultra-fast switching speed can save a lot of testing time.

Efficient, compact and Easy to Automate

EcoSyn Lite synthesizer modules are housed in portable, compact 4 in x 4 in x 0.8 in form factor which enables them to be used in space constrained applications which require instrumentation grade CW signal source. It supports USB and SPI interfaces for remote control and is powered using a +12 VDC source.

EcoSyn Lite supports standard SCPI and QuickSyn native commands which make developing scripts to remotely control and automate very easy and user friendly.

The post Anritsu Introduces EcoSyn Lite MG36021A Microwave Synthesizer Module Outstanding Phase Noise, Ultra-fast Switching Speed and Compact Size appeared first on ELE Times.

The Central government has introduced major reforms to Special Economic Zone (SEZ) Rules to push India’s aspirations in semiconductor and electronics manufacturing, with the aim of drawing global investments and minimizing procedural bottlenecks for high-tech sectors. The Ministry of Commerce & Industry said that these measures are going to change India’s industrial policy scenario where SEZs shall henceforth be more accessible and investment-friendly.

Major Policy Changes to SEZ Norms

Amendment on Rule 5 of the SEZ Rules, 2006, is among the landmark reforms, which includes the minimum land size to be established for a semiconductor or electronic component-specific SEZ being curtailed from 50 hectares to just 10. This is expected to benefit the smaller yet highly potential players and thus fast-track building advanced manufacturing hubs.

Another important change is Rule 7, which gives more latitude in acquiring and using land. There will no longer be an encumbrance-free clause attached to mortgaging or leasing land to federal or state government agencies. This will ease a significant regulatory hurdle faced by developers and investors.

In Rule 53, a new method to compute Net Foreign Exchange (NFE) has been introduced so as to include goods being received or supplied free of cost, if such valuation is carried out as per the customs valuation norms. This will align India’s SEZ policy with global best practices and allow easier trade reporting by SEZ units.

On the other hand, Rule 18 has been amended to enable the sale of goods from SEZs into the Domestic Tariff Area (DTA) on payment of the applicable duties. This upgrade will offer enhanced flexibility to the SEZ manufacturers, as well as improve viability of commercial operations by extending market access across the country.

Focus on Capital-Intensive, Long-Gestation Sectors

These strategic reforms notified by the Department of Commerce on June 3, 2025, will be targeted toward industries with higher capital investment needs and long development time frames-such as semiconductor fabrication and advanced electronics.

By minimizing the compliance cover and raising operational flexibility, the government would like to induce global majors and homegrown innovators to invest in the evolving high-tech landscape in India.

The policy shift would also aid job creation, particularly in areas, that are highly skilled. Amongst the jobs created would be those requiring skills in chip design, fabrication engineering and electronics system manufacturing.

Early Gains: Two Major SEZ Projects Approved

In a speedy follow-up to the announcement, the Board of Approval for SEZs has cleared two proposals of major import intended to create the desired impact of the reform:

• Micron Semiconductor Technology India Pvt Ltd would construct a semiconductor LRD of SEZ at Sanand, Gujarat, 37.64 hectares in extent, with an investment commitment of ₹13,000 crore. This unit would become one of the biggest nodes in the Indian-chip making landscape.
• The Hubballi Durable Goods Cluster Pvt Ltd, promoted by Aequs Group, would set up an electronics components SEZ at Dharwad, Karnataka, spread over an area of 11.55 hectares, with an investment of about ₹100 crore.

Such approvals speak of the desire of the government to swiftly translate the policy into action and brand India as reliable partner in the global semiconductor value chain.

Strengthening India’s Global Competitiveness

Due to the soaring worldwide demand for semiconductors and electronics as digital transformation and geopolitical realignments take place, India positions itself, almost by way of strategy, as an option for manufacturing. The new SEZ framework enhances ease of doing business and gives credence to India’s claim to become a self-reliant, technology-driven economy.

These are the steps towards building a strong semiconductor ecosystem, one offering innovativeness, resilience and global relevance.

The post Centre Unveils SEZ Reforms to Boost Semiconductor and Electronics Manufacturing appeared first on ELE Times.