Збирач потоків

So I got this thing chirping but I think the little battery powered amp/speaker I’m using is faulty. Super fun though if you have a busted Commodore 64. submitted by /u/shakeycg [link] [comments]

UK-based Oxford Instruments says that it is playing a key role to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by compound semiconductors and optical networking solutions provider Coherent Corp of Saxonburg, PA, USA...

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One of the PFFB (Post-Filter Feedback Technology)-based Class D audio amplifiers showcased in a recent writeup of mine was Fosi Audio’s V3 Mono, which will get sole billing today:

It interestingly (at least to me) originally launched as a Kickstarter project in April 2024:

As the name implies, it’s a monoblock unit, intended to drive only a single speaker, with both single-channel XLR balanced and RCA unbalanced input options.

I own four functional (for now, at least) devices, plus the nonfunctional one whose insides we’ll be seeing today. Why four? It’s not because I plan on driving both front left and right main speakers and a center speaker and subwoofer, or for that matter, the two main transducers plus two surrounds. Instead, it’s for spares, notably ones obtained pre-higher tariffs, and specifically to do with that dead fifth amp.

Design evolution, manufacturing, and reliability issues

Before I go all Debbie Downer on you, I’ll begin with the good news. The V3 Mono is highly reviewer-rated (see, for example, the write-up from my long-time tech compatriot Amir Majidimehr) and has also garnered no shortage of enthusiastic feedback from owners like Tim Bray, who had heard about it from Archimago (here’s part 2). Alas, amidst all that positive press are also a notable number of complaints from folks whose units let the magic smoke escape, sometimes on just the first use, or whose amplifiers had more modest but still annoying issues.

Mis-wired connections

I’ll start with the most innocuous quirk and end with the worst. Initial units were mis-wired from the PCB to the speaker banana plugs (due, I actually suspect, to a fundamental PCB trace layout issue) in such a way that they ended up with inverted-polarity outputs, i.e., signals being 180° out of phase from how they should be.

This wasn’t particularly a problem if all the units in your setup exhibited the issue, because at least then the phase was consistently inverted. However, if one (or some, depending on your setup complexity) of them were in phase and other(s) were out of phase, the inconsistency resulted in a collapsed stereo image and overall decreased volume due to destructive interference between the in- and out-of-phase speakers.

The same goes if you mixed-and-combined out-of-phase V3 Monos with in-phase other devices, whether from other manufacturers or even from Fosi Audio itself. The fix is pretty easy; connect the red speaker wire to the black speaker terminal of the affected V3 Mono instead, and vice versa, to externally reinvert the phase back to how it should be. But from my experience with these units, it’s not possible to discern if a particular device is wired correctly without disassembling it; this guy’s sticker-based methodology, for example, didn’t pan out for me:

As commenter @TheirryG01210 wrote in response to the above video, “A better way to figure out if phase is correct is to check that cables are cross-connected (left solder pads cable goes to the right banana socket and vice versa).”

That’s spot-on advice. Here, for example, is one of my functional units, which has the wires un-crossed, therefore operating in an inverted-output fashion. That said, this approach looks like how it should be wired, right? Therefore, my conjecture that this actually is inherently a PCB layout issue, with wire-swapping the cheaper, easier workaround to the alternative costlier and otherwise more complicated board “turn”.

My photo also matches one of the two in this Audio Science Review discussion thread post:

The other picture in that post shows the wires crossed; it’s not clear to me whether this is something that the owner did post-purchase with a soldering iron or if Fosi Audio revamped units still in its inventory, after discovering the problem and prior to shipping them out:

Conceptually, it matches the from-factory crossed wiring of my other three functional devices, along with today’s teardown victim, although the wire colors are also swapped with my units:

But color doesn’t matter. A crossed-wires configuration is what’s key to a correct-phase output.

The next, more recently introduced issue involves gain-setting inconsistency. Look at the most recent version of the “stock” image for the product on Amazon’s website, for example:

And you’ll see that the two gain-switch options supported for the RCA input (the switch doesn’t affect the XLR input) are 19 dB and 25 dB. That said, the gain options shown in the online user manual are instead 25 dB and 31 dB, which match the original units, including all of mine:

Here’s the key excerpt from an email by Fosi Audio quoted in a relevant Audio Science Review post (bolded emphasis is mine):

We would like to confirm whether your V3 mono gain is the old version or the new version. Since V3mono does not have a volume adjustment knob. It has already obtained a large power output when it is turned on, so we have reduced the gain of 31db to 25db, and 25db to 19db in the new version, which can effectively ensure the stable output of V3mono, safe use and extend the service life.

Loud “pop” sound

Which leads to my last, and the most concerning, issue. After a seemingly random duration of operation, but sometimes just the first use, judging from comments I’ve seen on Audio Science Review, Amazon, Fosi’s online store, and elsewhere, the amplifier emits a loud “pop” and the sound disappears, never to return.

The front panel light still glows, and you can still hear the “click” when the amp initially turns on or transitions out of standby in response to sensing an active input source (or when you transition from one input to another, for that matter), but as for the output…nothing but the sound(s) of silence. This very issue happened with one of the devices I purchased brand new, fortunately, within the return-for-full-refund period.

Several of the other V3 Monos I acquired “open box” off eBay also arrived already DOA. In one particularly mind (and amp)-blowing case, I bought a single-box two-device set. When I opened it up, one of the amps had a piece of blue tape stuck to the top with the word “good” scribbled on it. Yep, the other one was not “good”. 

What the eBay seller explained to me in the process of issuing a ship-back-for-full-refund is that when large retailers get a return, they sometimes just turn around and resell it discounted to eBay sellers like her, apparently without remembering to test it first (or, more cynically, maybe just not caring about its current condition).

A blown-output case study

Today’s victim (1,000+ words in) was another eBay-DOA example. In this case, the seller didn’t ask me to return it prior to issuing a refund, and it therefore became a teardown candidate, hopefully enabling me to discern just where the Achilles’ Heel in this design is.

To Fosi Audio’s credit, by the way, the pace of complaints for this particular issue seems to have slowed down dramatically of late. When I first looked at the customer feedback on Amazon, etc., earlier this year, comments were overwhelmingly negative. Now, revisiting various feedback forums, I see the mix has notably shifted in the positive-percentage direction. That said, my cynical side wonders if Fosi and Amazon might just now be nuking negative posts, but hope springs eternal…

I’ll start with some overview shots of our patient, one of which you’ve already seen, as usual, accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes (the V3 Mono, not including its bulbous suite of external power supply options, has dimensions of 105 x 35 x 142 mm and weighs 480 grams).

Remove the two side screws from the back panel:

And the front panel slides right out:

The “Aesthetic and Practical Dust-Proof Filter Screens” (I’m quoting from Fosi Audio’s website, though I concur that they both look cool and act cooling) also then slide right out if you wish:

Removing two more screws on the bottom:

Now allows for the extraction of the internal assembly (here again, you saw one photo already):

PCB extraction and examination

The front and back halves of the “Sturdy and Durable All-Aluminum Alloy Chassis” are identical (and an aside: pretty snazzy shots, eh?):

Returning to the PCB topside (with still-attached back panel), let’s take a closer look:

One thing I didn’t notice at first is that none of the ICs are PCB-silkscreened as to their type (R for resistor, for example, C for capacitor, L for inductor, U for IC, etc…), far from their specific-device identifying number (R1, C3, L5, U2…). Along the left side, top to bottom, are:

• The three-position switch for on, auto, and off operating modes
• The power status LED
• The two-position XLR-vs-RCA input selector switch, and
• A nifty two-contact spring-loaded switch that’s depressed when the front panel is in place. I suspect, but didn’t test for myself, that it prevents amplifier operation whenever the front panel is removed.

Note, too, the four screw heads in between the two multi-position switches, along with the ribbon cable. Look closely and you’ll realize that the first three items mentioned are actually located on a separate mini-PCB, connected to the main one mechanically via the screws (which, as you’ll see shortly, are actually bolts) and electrically via the ribbon cable.

And in fact, the silkscreen marking on the mini-PCB says (among other things) “SW PCB” (SW meaning switch, I assume) while the main PCB silkscreen in the lower left corner says…drumroll…”MAIN PCB”.

Why Fosi Audio went this multi-PCB route is frankly a mystery to me. Until I noticed the labeled silkscreen markings (admittedly just now, as I was writing this section) I’d thought that perhaps the main board was common to multiple amplifier product proliferations, with the front panel switches, etc. differentiating between them. But given that both boards’ silkscreens also say “Fosi Audio V3 MONO” on them, I can now toss that theory out the window. Readers’ ideas are welcome in the comments!

In the middle of the photo are two 8-pin DIP socketed chips, op-amps in fact, Texas Instruments NE5532P dual low-noise operational amplifiers to be precise.

They’re socketed because, as Fosi Audio promotes on the product page and akin to the two Douk Audio amplifiers I showcased in my prior coverage, too, they’re intended to be user-swappable, analogous to the “tube rolling” done by vacuum tube-based audio equipment enthusiasts.

Numerous (Elna) electrolytic and surface-mount capacitors (along with other SMD passives) dot the landscape, which is dominated by two massive Nichicon 63V/2200μF electrolytic filtering capacitors (explicitly identified as such, along with the Elna ones, by visual and text shout-outs on the V3 Mono product page, believe it or not). And one other, smaller Texas Instruments 8-lead IC (soldered SOP this time) on the bottom toward the right bears mentioning. It’s marked as follows:

N5532
TI41M
A9GG

Its first-line mark similarity to the previously mentioned NE5532P is notable, albeit potentially also coincidental. That said, Google Image search results also imply that it’s indeed another dual low-noise op amp. And it’s not the last of them we’ll see. Speaking of which, let’s next look at the other half of the PCB topside:

There it was at the bottom; another socketed TI NE5532P! Straddling it on either side are Omron G6K-2P-Y relays. At the top are even more relays, this time with functional symbol marks on top to eliminate any identity confusion: another white-color one, this time a Zhejiang HKE HRS3FTH-S-DC24V-A, and below it a dark grey HCP2-S-DC24V-A from the same supplier.

Remember when I mentioned earlier that after one V3 Mono stopped outputting amplified audio, I could still hear relay clicks when I toggled its power and input-select switches? Voila, the click-sound sources.

Those coupling capacitors are another curious component call-out on the V3 Mono product page; they’re apparently sourced from German supplier WIMA. The latter two, on either side of the aforementioned PCB solder pads that end up at the speaker’s banana plug connectors, are grey here but yellow colored at Fosi Audio’s website, so…

To the left of the red coupling caps is a grey metal box with two slits on top and copper-color contents visible through them; hold that thought. And last but not least, along the right edge of the PCB are (top to bottom) the power-input connector, two hefty resistors, the XLR input, and the RC input. The two-wire harness in the lower corner goes to the aforementioned gain switch.

Insufficient thermal protection?

Now for the other side:

That IC at far left was quite a challenge to identify. To the right of an “AB” company logo is the following three-line mark:

TNJB0089A
UMG992
2349

Google searches on the text, either line-by-line or its entirety, were fruitless (at least to me). However, I found a photo of a chip with a matching first-line mark here. About the only thing on that page that I could read was the words “AB137A SOP16”, but that was the clue I needed.

The AB137A, is (more accurately was) from the company Shenzhen Bluetrum Technology, which Internet Archive snapshots suggest changed its name to Shenzhen Zhongke Lanxun Technology at the beginning of this year. The bluetrum.com/product/ab137a.html product page no longer seems to exist, nor does the link from there to the datasheet at bluetrum.com/upload/file/202411/1732257601186423.pdf. But again, thanks to the Internet Archive (the last valid snapshot of the product page that seems to exist there is from last November) I’ve been able to discern the following:

• CPU and Flexible IO
  High-performance 32-bit RISC-V processor Core with DSP instructions
  RISC-V typical speed: 125 MHz
  Program memory: internal 2 Mbit flash
  Internal 60 KB RAM for data and program
  Flexible GPIO pins with programmable pull-up and pull-down resistors
  Support GPIO wakeup or interrupt
• Audio Interface
  High-performance stereo DAC with 95 dB SNR
  High-performance mono ADC with 90 dB SNR
  Support flexible audio EQ adjust
  MIC amplifier input
  Support Sample rate 8, 11.025, 12, 16, 22.05, 32, 44.1, and 48 kHz
  Four-channel Stereo Analog MUX
• Package
  SOP16
• Temperature
  Operating temperature: -40℃ to +85℃
  Storage temperature: -65℃ to +150℃

So, there you have it (at least I think)!

The other half of this side of the PCB is less exciting, unless you’re into blobs of solder (along with, let’s not forget, another glimpse of those hefty resistors), that is:

But it’s what’s in the middle of this side of the PCB, therefore common to both of those PCB pictures, that had me particularly intrigued; you too, I suspect. Remove the two screws whose heads are on the PCB’s other side:

Lift off the plate:

Clean the thermal paste off the top of the IC, and what comes into view is what you’ve probably already suspected: Texas Instruments’ TPA3255, the design’s Class D amplification nexus:

At this point in the write-up, I’m going to offer my conjecture on what happened with this device. The inside of the metal plate, acting as a heatsink, paste-mates with the TPA3255:

while the outside, also thermal paste-augmented, is intended to further transfer the heat to the bottom of the aluminum case via the two screws I removed prior to pulling the PCB out of it:

Key to my theory are the words and phrases “bottom” and “thermal paste”. First off, it’s a bit odd to me that the TPA3255, the design’s obvious primary heat-generation source, is on the bottom of the PCB, given that (duh) heat rises. The tendency would then be for it to “cook” not only itself but also circuitry above it, on the other side of the PCB, although the metal plate-as-heatsink should at least somewhat mitigate this issue or at least spread it out.

This leads to my other observation: there’s scant thermal paste on either side of the plate for heat-transfer purposes, off the IC and ultimately to the outside world, and what exists is pockmarked. I’m therefore guessing that the TPA3255 thermally destroyed itself, and with that, the music died.

Wrapping up

Before I forget, let’s detach that mini-PCB I mentioned earlier. Here are the backside nuts:

And the front-side bolt heads:

Disconnect the ribbon cable:

And you already know what comes next:

Not too exciting, but I’ve gotta be thorough, right?

At this point, it occurred to me that I hadn’t yet taken any main-PCB side shots. Front:

Left side:

The back:

The right side:

And after removing the two screws surrounding the XLR input:

I was able to lift the back panel away, exposing to view even more PCB circuitry:

In closing, remember that “grey box with two slits on top and copper-color contents visible through them” that I mentioned earlier? Had I looked closely enough at the V3 Mono product page before proceeding, I would have already realized what it was (although, in my slight defense, the photo is mis-captioned there):

Then again, I also could have identified it via the photo I included in my previous write-up:

Instead, I proceeded to use my flat-head screwdriver to rip it off the PCB in the process of attempting to more conservatively detach just its “lid”:

As I already suspected from the “copper-color contents visible through the two slits on top”, it’s a dual wirewound inductor:

from Sumida, offering “superior signal purity and noise reduction, elevating the amplifier’s sound performance,” per Fosi Audio’s website.

Crossing through 3,000 words, I’ll wrap up at this point and turn the keyboard over to you for your thoughts in the comments!

—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.

 Related Content

• Class D: Audio amplifier ascendancy
• Audio amplifiers: How much power (and at what tradeoffs) is really required?
• Class D audio power amplifiers: Adding punch to your sound design
• How Class D audio amplifiers work

The post The Fosi Audio V3 Mono: A compelling power amp with a tendency to blow appeared first on EDN.

Artificial intelligence is moving out of the cloud and into the operations that create and deliver products to us every day. Across manufacturing lines, logistics centers, and production facilities, AI at the edge is transforming industrial operations, bringing intelligence directly to the source of data. As the industrial internet of things (IIoT) matures, edge-based AI is no longer an optional enhancement; it’s the foundation for the next generation of productivity, quality, and safety in industrial environments.

This shift is driven by the need for real-time, contextually aware intelligence—systems that can see, hear, and even “feel” their surroundings, analyze sensor data instantly, and make split-second decisions without relying on distant cloud servers. From predictive maintenance and automated inspection to security monitoring and logistics optimization, edge AI is redefining how machines think and act.

Why industrial AI belongs at the edge

Traditional industrial systems rely heavily on centralized processing. Data from machines, sensors, and cameras is transmitted to the cloud for analysis before insights are sent back to the factory floor. While effective in some cases, this model is increasingly impractical and inefficient for modern, latency-sensitive operations.

Implementing at the edge addresses that. Instead of sending vast streams of data off-site, intelligence is brought closer to where data is created, within or around the machine, gateway, or local controller itself. This local processing offers three primary advantages:

• Low latency and real-time decision-making: In production lines, milliseconds matter. Edge-based AI can detect anomalies or safety hazards and trigger corrective actions instantly without waiting for a network round-trip.
• Enhanced security and privacy: Industrial environments often involve proprietary or sensitive operational data. Processing locally minimizes data exposure and vulnerability to network threats.
• Reduced power and connectivity costs: By limiting cloud dependency, edge systems conserve bandwidth and energy, a crucial benefit in large, distributed deployments such as logistics hubs or complex manufacturing centers.

These benefits have sparked a wave of innovation in AI-native embedded systems, designed to deliver high performance, low power consumption, and robust environmental resilience—all within compact, cost-optimized footprints.

Edge-based AI is the foundation for the next generation of productivity, quality, and safety in industrial environments, delivering low latency, real-time decision-making, enhanced security and privacy, and reduced power and connectivity costs. (Source: Adobe AI Generated) Localized intelligence for industrial applications

Edge AI’s success in IIoT is largely based on contextual awareness, which can be defined as the ability to interpret local conditions and act intelligently based on situational data. This requires multimodal sensing and inference across vision, audio, and even haptic inputs. In manufacturing, for example:

• Vision-based inspection systems equipped with local AI can detect surface defects or assembly misalignments in real time, reducing scrap rates and downtime.
• Audio-based diagnostics can identify early signs of mechanical failure by recognizing subtle deviations in sound signatures.
• Touch or vibration sensors help assess machine wear, contributing to predictive maintenance strategies that reduce unplanned outages.

In logistics and security, edge AI cameras provide real-time monitoring, object detection, and identity verification, enabling autonomous access control or safety compliance without constant cloud connectivity. A practical example of this approach is a smart license-plate-recognition system deployed in industrial zones, a compact unit capable of processing high-resolution imagery locally to grant or deny vehicle access in milliseconds.

In all of these scenarios, AI inference happens on-site, reducing latency and power consumption while maintaining operational autonomy even in network-constrained environments.

Low power, low latency, and local learning

Industrial environments are unforgiving. Devices must operate continuously, often in high-temperature or high-vibration conditions, while consuming minimal power. This has made energy-efficient AI accelerators and domain-specific system-on-chips (SoCs) critical to edge computing.

A good example of this trend is the early adoption of the Synaptics Astra SL2610 SoC platform by Grinn, which has already resulted in a production-ready system-on-module (SOM), Grinn AstraSOM-261x, and a single-board computer (SBC). By offering a compact, industrial-grade module with full software support, Grinn enables OEMs to accelerate the design of new edge AI devices and shorten time to market. This approach helps bridge the gap between advanced silicon capabilities and practical system deployment, ensuring that innovations can quickly translate into deployable industrial solutions.

The Grinn–Synaptics collaboration demonstrates how industrial AI systems can now run advanced vision, voice, and sensor fusion models within compact, thermally optimized modules.

These platforms combine:

• Embedded quad-core Arm processors for general compute tasks
• Dedicated neural processing units (NPUs) delivering multi-trillion operations per second for inference
• Comprehensive I/O for camera, sensor, and audio input
• Industrial-grade security

Equally important is support for custom small language models (SLMs) and on-device training capabilities. Industrial environments are unique. Each factory line, conveyor system, or inspection station may generate distinct datasets. Edge devices that can perform localized retraining or fine-tuning on new sensor patterns can adapt faster and maintain high accuracy without cloud retraining cycles.

The Grinn OneBox AI-enabled industrial SBC, designed for embedded edge AI applications, leverages a Grinn AstraSOM compute module and the Synaptics SL1680 processor. (Source: Grinn Global) Emergence of compact multimodal platforms

The recent introduction of next-generation SoCs such as Synaptics’ SL2610 underscores the evolution of edge AI hardware. Built for embedded and industrial systems, these platforms offer integrated NPUs, vision digital-signal processors, and sensor fusion engines that allow devices to perceive multiple inputs simultaneously, such as camera feeds, audio signals, or even environmental readings.

Such capabilities enable richer human-machine interaction in industrial contexts. For instance, a line operator can use voice commands and gestures to control inspection equipment, while the system responds with real-time feedback through both visual indicators and audio prompts.

Because the processing happens on-device, latency is minimal, and the system remains responsive even if external networks are congested. Low-power design and adaptive performance scaling also make these platforms suitable for battery-powered or fanless industrial devices.

From the cloud to the floor: practical examples

Collaborations like the Grinn–Synaptics development have produced compact, power-efficient edge computing modules for industrial and smart city deployments. These modules integrate high-performance neural processing, customized AI implementations, and ruggedized packaging suitable for manufacturing and outdoor environments.

Deployed in use cases such as automated access control and vision-guided robotics, these systems demonstrate how localized AI can replace bulky servers and external GPUs. All inference, from image recognition to object tracking, is performed on a module the size of a matchbox, using only a few watts of power.

The results:

• Reduced latency from hundreds of milliseconds to under 10 ms
• Lower total system cost by eliminating cloud compute dependencies
• Improved reliability in areas with limited connectivity or strict privacy requirements

The same architecture supports multimodal sensing, enabling combined visual, auditory, and contextual awareness—key for applications such as worker safety systems that must recognize both spoken alerts and visual cues in noisy and complex factory environments.

Toward self-learning, sustainable intelligence

The evolution of edge AI is about more than just performance; it’s about autonomy and adaptability. With support for custom, domain-specific SLMs, industrial systems can evolve through continual learning. For example, an inspection model might retrain locally as lighting conditions or material types change, maintaining precision without manual recalibration.

Moreover, the combination of low-power processing and localized AI aligns with growing sustainability goals in industrial operations. Reducing data transmission, cooling needs, and cloud dependencies contributes directly to lower carbon footprints and energy costs, critical as industrial AI deployments scale globally.

Edge AI as the engine of industrial transformation

The rise of AI at the edge marks a turning point for IIoT. By merging context-aware intelligence with efficient, scalable compute, organizations can unlock new levels of operational visibility, flexibility, and resilience.

Edge AI is no longer about supplementing the cloud; it’s about bringing intelligence where it’s most needed, empowering machines and operators alike to act faster, safer, and smarter.

From the shop floor to the supply chain, localized, multimodal, and energy-efficient AI systems are redefining the digital factory. With continued innovation from technology partnerships that blend high-performance silicon with real-world design expertise, the industrial world is moving toward a future where every device is an intelligent, self-aware contributor to production excellence.

The post Edge AI powers the next wave of industrial intelligence appeared first on EDN.

Tokyo-based Shin-Etsu Chemical Co Ltd says that its QST substrate has been adopted for the 300mm gallium nitride (GaN) power device development program at nanoelectronics research center imec of Leuven, Belgium, where sample evaluation is in progress. In the evaluation, a 5µm-thick high-electron-mobility transistor (HEMT) device achieved a record breakdown voltage, for a 300mm QST substrate, of more than 650V...

Tokyo-based Shin-Etsu Chemical Co Ltd says that its QST substrate has been adopted for the 300mm gallium nitride (GaN) power device development program at nanoelectronics research center imec of Leuven, Belgium, where sample evaluation is in progress. In the evaluation, a 5µm-thick high-electron-mobility transistor (HEMT) device achieved a record breakdown voltage, for a 300mm QST substrate, of more than 650V...

submitted by /u/NIDNHU [link] [comments]

The post Microchip Technology Unveils Model Context Protocol (MCP) Server to Power AI-Driven Product Data Access appeared first on ELE Times.

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has expanded its family of 1200V Gen3 SiC MOSFETs, launching five SOT-227 modules that offer RDSon values of 7.4mΩ, 14.5mΩ and 34mΩ. The firm’s GCMS modules, which feature Schottky barrier diodes (SBDs), have lower switching losses at high temperature, especially compared to non-SBDs GCMX modules...

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has expanded its family of 1200V Gen3 SiC MOSFETs, launching five SOT-227 modules that offer RDSon values of 7.4mΩ, 14.5mΩ and 34mΩ. The firm’s GCMS modules, which feature Schottky barrier diodes (SBDs), have lower switching losses at high temperature, especially compared to non-SBDs GCMX modules...

Пам'яті Мулика Андрія Олександровича kpi пн, 11/17/2025 - 10:34

Відзнака "За заслуги перед КПІ ім. Ігоря Сікорського". Від КПІ з вдячністю та повагою kpi пн, 11/17/2025 - 10:00

Like in nature, development tools for embedded systems form “ecosystems.” Some ecosystems are very self-contained, with little overlap on others, while other ecosystems are very open and broad with support for everything but the kitchen sink. Moreover, developers and engineers have strong opinions (to put it mildly) about this subject.

So, we developed a greenhouse that sustains multiple ecosystems; the greenhouse demo we built shows multiple microcontrollers (MCUs) and their associated ecosystems working together.

The greenhouse demo

The greenhouse demo is a simplified version of a greenhouse controller. The core premise of this implementation is to intelligently open/close the roof to allow rainwater into the greenhouse. This is implemented using a motorized canvas tarp mechanism. The canvas tarp was created from old promotional canvas tote bags and sewn into the required shape.

The mechanical guides and lead screw for the roof are repurposed from a 3D printer with a stepper motor drive. An evaluation board is used as a rain sensor. Finally, a user interface panel enables a manual override of the automatic (rain) controls.

Figure 1 The greenhouse demo is mounted on a tradeshow wedge. Source: Microchip

It’s implemented as four function blocks:

1. A user interface, capacitive touch controller with the PIC32CM GC Curiosity Pro (EA36K74A) in VS Code
2. A smart stepper motor controller reference design built on the AVR EB family of MCUs in MPLAB Code Configurator Melody
3. A main application processor with SAM E54 on the Xplained Pro development kit (ATSAME54-XPRO), running Zephyr RTOS
4. A liquid detector using the MTCH9010 evaluation kit

The greenhouse demo outlined in in this article is based on a retractable roof developed by Microchip’s application engineering team in Romania. This reference design is implemented in a slightly different fashion to the greenhouse, with the smart stepper motor controller interfacing directly with the MTCH9010 evaluation board to control the roof position. This configuration is ideal for applications where the application processor does not need to be aware of the current state of the roof.

Figure 2 This retractable roof demo was developed by a design team in Romania. Source: Microchip

User interface controller

Since the control panel for this greenhouse normally would be in an area where water should be expected, it was important to take this into account when designing the user interface. Capacitive touch panels are attractive as they have no moving parts and can be sealed under a panel easily. However, capacitive touch can be vulnerable to false triggers from water.

To minimize these effects, an MCU with an enhanced peripheral touch controller (PTC) was used to contain the effects of any moisture present. Development of the capacitive touch interface was aided with MPLAB Harmony and the capacitive touch libraries, which greatly reduce the difficulty in developing touch applications.

The user interface for this demo is composed of a PIC32CM GC Curiosity Pro (EA36K74A) development kit connected to a QT7 XPlained Pro Extension (ATQT7-XPRO) kit to provide a (capacitive) slider and two touch buttons.

Figure 3 The QT7 Xplained extension kit comes with self-capacitance slider and two self-capacitance buttons alongside 8 LEDs to enable button state and slider position feedback. Source: Microchip

The two buttons allow the user to fully open or close the tarp, while the slider enables partial open or closed configurations. When the user interface is idle for 30 seconds or more, the demo switches back to the MTCH9010 rain sensor to automatically determine whether the tarp should be opened or closed.

Smart stepper motor controller

The smart stepper motor controller is a reference design that utilizes the AVR EB family of MCUs to generate the waveforms required to perform stepping/half-stepping/microstepping of a stepper motor. By having the MCU generate the waveforms, the motor can behave independently, rather than requiring logic or interaction from the main application processor(s) elsewhere in the system. This is useful for signals such as limit switches, mechanical stops, quadrature encoders, or other signals to monitor.

Figure 4 Smart stepper motor reference design uses core independent peripherals (CIPs) inside the MCUs to microstep a bipolar winding stepper motor. Source: Microchip

The MCU receives commands from the application processor and executes them to move the tarp to a specified location. One of the nice things about this being a “smart” stepper motor controller is that the functionality can be adjusted in software. For instance, if analog signals or limit switches are added, the firmware can be modified to account for these signals.

While the PCB attached to the motor is custom, this function block can be replicated with the multi-phase power board (EV35Z86A), the AVR EB Curiosity Nano adapter (EV88N31A) and the AVR EB Curiosity Nano (EV73J36A).

Application processor and other ecosystems

The application processor in this demo is a SAM E54 MCU that runs Zephyr real-time operating system (RTOS). One of the biggest advantages of Zephyr over other RTOSes and toolchains is the way that the application programming interface (API) is kept uniform with clean divisions between the vendor-specific code and the abstracted, higher-level APIs. This allows developers to write code that works across multiple MCUs with minimal headaches.

Zephyr also has robust networking support and an ever-expanding list of capabilities that make it a must-have for complex applications. Zephyr is open source (Apache 2.0 licensing) with a very active user base and support for multiple different programming tools such as—but not limited to—OpenOCD, Segger J-Link and gdb.

Beyond the ecosystems used directly in the greenhouse demo, there are several other options. Some of the more popular examples include IAR Embedded Workbench, Arm Keil, MikroE’s Necto Studio and SEGGER Embedded Studio. These tools are premium offerings with advanced features and high-quality support to match.

For instance, I recently had an issue with booting Zephyr on an MCU where I could not access the usual debuggers and printf was not an option. I used SEGGER Ozone with a J-Link+ to troubleshoot this complex issue. Ozone is a special debug environment that eschews the usual IDE tabs to provide the developer with more specialized windows and screens.

In my case, the issue occurred where the MCU would start up correctly from the debugger, but not from a cold start. After some troubleshooting and testing, I eventually determined one of the faults was a RAM initialization error in my code. I patched the issue with a tiny piece of startup assembly that ran before the main kernel started up. The snippet of assembly that I wrote is attached below for anyone interested.

The moral of the story is that development environments offer unique advantages. An example of this is IAR adding support for Zephyr to its IDE solution. In many ways, the choice of what ecosystem to develop in is up to personal preference.

There isn’t really a wrong answer, if it does what you need to make your design work. The greenhouse demo embodies this by showing multiple ecosystems and toolchains working together in a single system.

Robert Perkel is an application engineer at Microchip Technology. In this role, he develops technical content such as application notes, contributed articles, and design videos. He is also responsible for analyzing use-cases of peripherals and the development of code examples and demonstrations. Perkel is a graduate of Virginia Tech where he earned a Bachelor of Science degree in Computer Engineering.

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The post The ecosystem view around an embedded system development appeared first on EDN.

the one on the left is the switched-mode power supply its much smaller and lighter, this one can output twice as much current as the linear power supply on the right submitted by /u/BlacksmithFar7794 [link] [comments]

submitted by /u/pushpendra766 [link] [comments]

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Made by a high school robotics team in MN submitted by /u/edinapieceofcake [link] [comments]

submitted by /u/1Davide
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Good news for Keithley 2000 / 2015 / 2016 / 2010 DMM owners with dim displays. This is a drop-in LED display conversion kit that replaces the original dim VFD. submitted by /u/dimmog [link] [comments]