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Minimal circuit converts input frequency to a precision current source that also accommodates grounded inputs.

I recently had the opportunity to share a design for frequency to current loop conversion using the versatile (if somewhat ancient) LM29x7 series. Taking shameless advantage of the flexibility of these legacy devices, that minimalist design made do with just nine paltry passive parts.  Figure 1 shows its (nearly painful) simplicity (so simple it almost Hz).

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 In this circuit, the LM2917 needs no added actives to make a frequency to 4-20mA current sink converter.

However, it was pointed out in the comments (thanks, RJ!) that its current sink output may not be compatible with some industrial control and monitoring hardware.  So here comes Figure 2 with a frequently friendlier current source output.

Figure 2 Four frugal extra external parts (bringing the total to 13) convert Figure 1 into a flexible current source that’s useful if the load is grounded.

Converting Figure 1’s converter from current sink to current source begins with tying pin 6 to the +24v rail.  This lets the internal voltage shunt reference Z1 float the internal “ground” reference pin 8 at 16.4v instead of at zero.  R5 provides the necessary bias current (just as it does in Figure 1), and C4 gives us some noise-bypassing insurance.  Adding cascode Q1 completes the conversion.

Although U1’s spec’d linearity and temperature coefficient are good, its initial tolerances aren’t so great. Therefore some post-assembly final calibration is unavoidable, which necessitates R1’s (4mA zero) and R2’s (20mA full-scale 5kHz) tweakability.  If you do the adjustments in the right order (first R1, then R2), they won’t interact, and calibration can be completed in s single pass.

An additional helping of flexibility comes from the fact that, if your application doesn’t need or want a 4mA baseline current, just omit R3.  Then adjust R2 normally for a top end of 20mA.  That’ll give 0-20mA with no other mods required.

References

1. https://www.ti.com/lit/an/sboa574/sboa574.pdf

Stephen Woodward‘s relationship with EDN’s DI column goes back quite a long way. Over 200 submissions have been accepted since his first contribution back in 1974.  They have included best Design Idea of the year in 1974 and 2001.

Related Content

• Painlessly convert Hz to 4-20mA current loop
• 4mA-20mA to 0mA-20mA converter’s current mirror drives grounded load
• Transistor and FVCs make linear anemometer

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Vector Photonics Ltd of the West of Scotland Science Park — which was spun off from the University of Glasgow in 2020, and is pioneering the use of photonic crystal surface-emitting lasers (PCSEL) in secure communications — is heading to Taiwan as part of Innovate UK’s Global Business Innovation Programme (GPIB)...

ASMPT SMT Solutions will exhibit at the first EFX Expo for Electronics Manufacturing in Stuttgart, Germany. From October 6 to 8, 2026, the global technology and market leader for integrated hardware and software solutions for the electronics manufacturing industry will present its latest products and services for intelligent SMT production at Booth 9D52 in Hall 9. The focus will be on innovations around the new SIPLACE V assembly platform, the DEK TQ L stencil printer, and the WORKS Software Suite for connecting and optimizing workflows on the shop floor.

“With its focus on personal interactions and networking, the EFX provides an ideal supplement to the Productronica by creating a new meeting place for electronics manufacturers every two years,” explained Bernhard Fritz, Head of Global Marketing, ASMPT SMT Solutions. “AI applications are currently changing the requirements for electronics manufacturing faster than ever before. The EFX presents an ideal platform for discussing with customers and partners how integrated hardware and software solutions help companies to respond flexibly to these developments and prepare their factories for the future.”

SIPLACE V L: Ready for demanding AI server boards

With the SIPLACE V, ASMPT has developed a new generation of placement machines that enables productivity increases of up to 30 percent under real-life conditions in several key industries while also meeting the rising requirements of modern electronics applications, such as AI server boards. It can handle large and heavy high-performance BGAs, oversized circuit boards and highly miniaturized components down to the 016008M size factor reliably, precisely, and efficiently.

At EFX, ASMPT will demonstrate with the SIPLACE V L how maximum productivity and quality can be combined with outstanding flexibility. With a compact footprint of just 1.5 × 2.4 m, the placement platform processes odd-shaped components (OSCs) up to 55 mm in height. Existing SIPLACE X feeders and even changeover tables from the SIPLACE SX can continue to be used, providing electronics manufacturers with a high level of investment protection. An enhanced Smart Pin Support, increased maximum PCB size and a flexibly interchangeable tray changer further expand application versatility and simplify adaptation to changing production requirements.

Top productivity and quality in solder paste printing

With the DEK TQ L, ASMPT will present its stencil printer for mid-size boards that has been designed from the ground up for productivity, precision and automation. It combines maximum precision (up to ±17.0 µm @ 2 cpk wet-print accuracy) with a core cycle time of only 6.5 seconds. Many automation functions increase the machine’s productivity and process reliability. The understencil cleaning system runs for a whole shift without any user assists, the Dual Access Cover makes it possible to switch out paste cartridges without having to stop the machine, and Automated Paste Transfer can transfer the paste to a new stencil completely on its own. A new mechanism cuts the time required to change squeegees by up to 20 percent. And with the DEK TQ GO, even squeegee and stencil changeovers can be fully automated in the future.

With WORKS Automation, ASMPT will show how printing processes can be automatically optimized even further. The software continuously captures and analyzes process data from the printer and the SPI system, recognizes potential improvements, and helps with intelligent and increasingly AI-supported functions to improve print quality, process stability, and productivity.

Intelligent use of data

With the WORKS Software Suite, ASMPT will showcase its integrated software platform for intelligent SMT manufacturing. It connects machines, processes and production data in real time to create total production transparency.  Based on this information, users can optimize specific workflows, deploy resources more efficiently, and make decisions more quickly. The WORKS applications support all workflows on the shop floor in terms of material management, process optimization along the SMT line, and efficient personnel deployment. Thanks to open interfaces according to industry standards IPC-HERMES-9852 and IPC-CFX, users can easily integrate machines, software solutions and autonomous mobile robots (AMRs) from other manufacturers and build a coordinated manufacturing environment.

 

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During a severe sandstorm, a transport aircraft attempts to land at a remote forward operating location. Visibility is nearly zero, forcing the crew to rely on navigation, communications, and landing-assistance systems. If the aircraft were to lose its GNSS signal, local timing sources would drift. Even a few microseconds of drift could cause these systems to lose synchronization.

This can cause communication disruptions, impacts to radar and ranging systems, higher inertial navigation error, and ultimately reduce the accuracy of information displayed to the pilot. Lives and the mission could be at stake. In this scenario, the fallout would not stem from a hardware failure or cyberattack, but from a small timing error.

Take, for instance, MicroPNT GDO-1000, a GNSS-disciplined oscillator (GNSS-DO) module from VIAVI, a supplier of test and measurement, optical, and position, navigation and timing (PNT) technologies. The module, built for situations mentioned above, features MEMS-based Endura Epoch or Elite X oscillators to deliver microsecond-class, 24-hour holdover in a tiny package.

The Viavi µPNT GDO-1000 module nears atomic-clock timing holdover precision, but with a low size, weight, power and cost (SWAP-C) profile—in a footprint the size of a postage stamp. The solution provides greater flexibility to keep networks synchronized, sensors aligned, and mission systems operating with confidence across air, land, sea, space, and cyber domains—even in extreme environments.

What is a GNSS-DO?

GNSS signals can be vulnerable to jamming or spoofing. Signals can be interrupted in urban or geographic canyons and subject to outages. A GNSS-DO combines a local precision oscillator with timing from GNSS to provide accurate and resilient timing required by modern defense systems. Typically, GNSS-DOs are comprised of the following:

• GNSS receiver
• High-stability local oscillator (crystal, MEMS TCXO or OCXO, or an atomic clock)
• Disciplining algorithm (servo loop)
• 1 pulse per second (PPS) input and a 1 PPS and 10 MHz output

Under normal operating conditions, the GNSS receiver serves as the primary timing reference for the GNSS-DO, providing output signals, such as 1 PPS and 10 MHz synchronized to the GNSS 1 PPS rising edge. During this phase, GNSS-DO continuously learns and characterizes the drift behavior of the local oscillator relative to the GNSS reference.

If GNSS signals become degraded, jammed or denied, GNSS-DO seamlessly transitions to the local oscillator as the timing source. Leveraging this learned behavior, the system actively compensates its outputs to maintain accurate time alignment.

This unique combination of long-term accuracy and short-term stability makes GNSS-DO a critical enabler for military communications, radar systems, electronic defense platforms, sensor fusion networks, and autonomous systems—where precise timing is essential for mission success and operational continuity.

Choosing an oscillator with the right stuff

Drift can be caused by temperature fluctuations, vibration, mechanical stress, power supply variations, and long-term aging effects. Left unchecked, drift accumulates over time, degrading synchronization accuracy and potentially impacting system performance.

The role of GNSS-DO is to continuously correct these errors when a reference signal is available and minimize their impact when it’s not. The better the oscillator’s inherent stability, the longer and more accurately the system can maintain synchronization during a GNSS outage.

This is how the different types of oscillators compare:

• CSACs

Chip-scale atomic clocks (CSACs) offer great stability and the longest holdover performance, making them the benchmark for resilience in GNSS-denied environments. However, these advantages come with trade-offs in size, weight, cost, and procurement lead times that can limit their practicality for many deployed systems.

• Crystal TCXOs and OCXOs

Traditional crystal-based TCXOs and OCXOs provide lower-cost alternatives and are widely used across communications, aerospace, and defense applications. While they can deliver strong timing performance, quartz is very susceptible to shock, vibration and mechanical stress, causing them to crack, break, or severely degrade performance. This makes them less suitable for increasingly rugged and mobile platforms.

• MEMS TCXOs and OCXOs

Micro-electro-mechanical systems (MEMS)-based TCXOs and OCXOs are emerging as a viable solution. They provide robust resistance to vibration, shock, and environmental stress while significantly reducing size and power consumption. In many cases, MEMS OCXOs offer near atomic-level frequency stability over temperature and occupy 75x less volume. This combination enables system designers to achieve precise timing and extended holdover without the SWAP-C penalties.

Figure 1 MEMS OCXOs can outperform the alternatives for SWaP in critical military defense applications. Source: SiTime

About GDO-1000 module

The µPNT GDO-1000 module features dual-frequency L1/L5 GNSS reception with microsecond-class, 24-hour holdover, enabling highly accurate timing even in degraded or contested conditions. “Its holdover performance approaches what customers expect from atomic-class clocks, in a module that fits on a standard M.2 slot and draws approximately half a watt,” said Doug Russell, senior VP and GM for aerospace and defense at VIAVI.

Figure 2 The VIAVI µPNT GDO-1000 module featuring an advanced MEMS oscillator has dual frequency L1/L5 GNSS reception and microsecond-class 24-hour holdover and draws less than half a watt of power. Source: SiTime

Moreover, it integrates directly into modern compute platforms, time appliance cards, and embedded systems without custom mechanical design.

The module performance is enhanced by patented AI and ML algorithms which model and compensate for oscillator behavior across varying environmental conditions. At its core, MEMS oscillators provide improved thermal stability across the full military temperature range compared with traditional quartz OCXOs, while maintaining phase noise and Allan Deviation performance under vibration and shock.

The system also accepts an external 1 PPS input, allowing discipline from M-Code GPS, alternative navigation sources, or other external references without hardware modification. Despite its miniature size, it supports multiple 1 PPS and low-phase-noise 10 MHz coaxial inputs and outputs, providing flexible integration across complex systems.

Modern precision timing solutions such as the advanced OCXO platform and high-performance Super-TCXO architectures are designed to directly address the combined challenges of SWaP constraints and oscillator drift and loss of reference time in GNSS-degraded environments. By improving intrinsic frequency stability, reducing phase noise, and minimizing long-term aging effects, the devices help maintain more accurate local timekeeping when external references are unavailable.

As defense systems evolve from standalone platforms into interconnected networks of sensors, communications systems, and autonomous assets, timing is becoming as fundamental to system design as power and memory management. Precision timing enables everything from PNT to secure communications, sensor fusion, and synchronized operations across distributed missions.

The future belongs to timing solutions that deliver precision, resilience, and performance while minimizing SWaP and system complexity.

Tyler Hohmann is business development director for aerospace and defense at SiTime, where he leads strategy and execution across prime contractors, startups, and sub-system manufacturers to advance precision timing adoption in mission-critical systems. Prior to SiTime, he was VP of sales and marketing and co-founder of Safran Federal Systems.

Related Content

• MEMS Resonators Drive Advanced Timing Solutions
• MEMS timing disrupts quartz in modern automotive
• The top 6 reasons to use silicon MEMS timing solutions
• How to use MEMS OCXOs to overcome timing challenges
• GNSS Receiver Frequency Reference for Successful Satellite Navigation

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Vishay Intertechnology introduced a new series of infrared (IR) receiver modules for IR remote control applications. Featuring a wide modulation frequency acceptance from 30 kHz to 68 kHz, devices in the Vishay Semiconductors TSOP15300 series are designed to receive and demodulate all major remote control codes on the market, enabling a single-component universal remote control solution.

How Do Vishay’s New IR Receivers Simplify Consumer Electronics Design?

Standard IR receivers are typically tuned to one center frequency, limiting compatibility and requiring multiple devices to cover different code sets. With their wide modulation frequency range, the receivers released today overcome this limitation, reducing component counts to lower system costs and save board space.

Designed for consumer electronics such as televisions, audio systems, gaming consoles, soundbars, set-top boxes (STB), video projectors, and more, TSOP15300 series receivers provide immunity against ripple noise and interference from common sources like IR emissions in CFL lamps and LCD televisions, and RF emissions from onboard Wi-Fi antennas. When paired with a 50 mA emitter, the devices offer reliable transmission distances of up to 18 m.

To simplify designs, each receiver integrates a photodetector, preamplifier circuit, and IR filter within a 4-pin Heimdall package. For decoding, their demodulated output signal can be directly connected to a microprocessor. Optimized for short burst codes, TSOP15300 series devices operate over a wide supply voltage range from 2.0 V to 5.5 V, draw a typical supply current of 0.35 mA, and feature a maximum irradiance of 0.2 mW/m² at 45 kHz. They are RoHS-compliant, halogen-free, and Vishay Green.

 

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КПІ ім. Ігоря Сікорського став лауреатом 2026 Friend of IEEE MGA Award kpi ср, 08/05/2026 - 13:01

Nuvoton Technology Corporation announced the launch of the NAU83G60YG stereo smart audio amplifier integrating Klippel Controlled Sound (KCS) nonlinear adaptive speaker control technology developed by Klippel GmbH. The NAU83G60YG is designed for conference speakerphones, smart speakers, professional monitoring speakers, and automotive audio systems. By leveraging advanced nonlinear speaker control technology, the amplifier delivers low distortion, high output power, and ultra low latency audio processing, enabling clearer voice communication and enhanced low-frequency performance for next generation audio applications.

Targeting voice communication devices, compact multimedia speakers and studio monitors

The impressive distortion reduction provided by NAU83G60YG with KCS enables unsurpassed clarity of bidirectional voice communication in conferencing speakers and soundbars. This advantage is strengthened even further by the linearized reference signal from NAU83G60YG that provides best learning conditions for Active Echo Cancellation (AEC) algorithms. It leads to faster and more consistent convergence with less artifacts. Compact multimedia speakers as well as studio monitors profit from additional dynamics (bass and SPL) for a more enjoyable and consistent listening experience.

How Does Nuvoton’s New Smart Amplifier Improve Audio Performance?

“We are excited to collaborate with Klippel on this innovative stereo smart amplifier solution. Compared with traditional smart amplifier designs based on linear models, the NAU83G60YG enables smaller speakers to achieve higher sound quality and maximum output performance. It supports precise speaker protection and real-time speaker diagnostics while significantly simplifying speaker tuning processes. In addition, it enhances barge-in AEC performance and enables low-latency Active Noise Cancellation (ANC) applications for next-generation smart audio systems.” said Walter Tseng, Vice President of Microcontroller Business Group at Nuvoton Technology Corporation.

“The release of the NAU83G60YG today is good news for audio designers. It makes KCS technology accessible in the highly relevant power range of up to 30 W. This is a significant milestone for Klippel GmbH in fulfilling the vision of our founder, Dr. Wolfgang Klippel: providing the entire audio industry with innovative tools that push the boundaries of audio performance. We are grateful for our trusted, long-term cooperation with Nuvoton, whose support has helped bring this achievement to life.” said Benjamin Barth, CEO of Klippel GmbH.

Revolutionizing Audio: KCS (Klippel Controlled Sound) Advantage

Loudspeakers are inherently highly nonlinear and time-varying systems. Signal distortion, thermal effects, instabilities, aging, and environmental conditions have traditionally limited maximum sound pressure levels and overall sound quality.

Compared with conventional amplifiers and smart amplifiers based on linear speaker models, the KCS algorithm offers superior performance with more bass, cleaner sound, and inherent operational stability. Its adaptive nonlinear speaker control technology provides active compensation of speaker distortion, balances operational instabilities, offers superior accuracy of mechanical and thermal protection to avoid overload situations, features automatic adaptive system alignment for unrivaled consistency, and adds voice-coil resting position control for maximum coil travel. These capabilities significantly improve loudspeaker performance and sound quality.

Key Advantages of KCS Technology

• Wider voice-coil excursion capability for greater acoustic output with superior overload protection
• Significant reduction of harmonic and intermodulation distortion for improved sound quality
• Enhanced Acoustic Echo Cancellation (AEC) performance by minimizing loudspeaker distortion and improving barge-in AEC operation under linear and time-invariant acoustic conditions
• Improved voice interaction experience through more accurate wake-word detection for AI-enabled
  smart speakers
• Support for ultra-low-latency audio processing, ideal for high-performance Active Noise
  Cancellation (ANC) systems

NAU83G60YG Stereo Smart Amplifier Specifications

The NAU83G60YG adopts a high-performance Class-D amplifier architecture supporting an operating voltage range from 8V to 24V and reliable operation across an industrial temperature range of -40°C to +85°C. The device integrates IV Sense (current and voltage sensing) ADCs and a high-performance DSP engine. It supports multiple digital audio interfaces, including I²S, PCM, and TDM, while integrating multi-band PEQ, DRC, and low-latency audio processing capabilities for optimized voice performance. The device delivers up to 2 × 30 W into 4 Ω loads and 2 × 20 W into 8 Ω loads with a 24 V supply.

The post Nuvoton Launches NAU83G60YG Next-Generation Smart Amplifier With Klippel KCS for Low-Distortion Audio and Special Benefits for AEC/ANC Systems appeared first on ELE Times.

DigiKey, the global distribution leader of electronic components and automation products, expanded its portfolio by more than 27,000 new stocking products available for fast shipment in Q2 2026. In total, over 373,000 new products were added to the DigiKey system, along with 104 new suppliers across its core business, Marketplace and Fulfilled by DigiKey programs.

What Vice President of Global Business Development at DigiKey said?

“DigiKey’s robust inventory pipeline and in-stock product availability continue to power our record-breaking customer count growth,” said Mike Slater, vice president of global business development for DigiKey. “The ongoing investments in our product line card and industry-leading website provide customers fast access to the latest innovative new products they need to accelerate their designs and projects.”

Which New Suppliers Joined DigiKey’s Portfolio in Q2?

DigiKey’s commitment to expanding in-stock inventory for fast shipment allows engineers, designers, makers and procurement professionals to order prototype quantities for rapid shipping, without placing a special order in factory quantities or waiting for lead or transit time.

New supplier additions in Q2 include:

• Neutrik Group, a global manufacturer of professional interconnect solutions including well-known audio/video products which provide access to reliable audio, video, lighting, data and fiber-optic connectivity.
• LumenRadio, which specializes in wireless control technology designed to replace complex cabling in industrial and commercial systems. Its frequency-agile platform ensures stable, low-latency communication in RF-congested environments and supports applications such as lighting control, building systems and industrial equipment.
• Altelix, which provides weatherproof enclosures and accessories, along with in-house design and manufacturing for customized solutions in industrial and commercial environments.
• AMobile, which delivers industrial mobile computers supporting applications such as logistics, transportation, public safety and warehouse management to enable industrial IoT deployments.

What Are DigiKey’s Latest Product Introductions for Q2 2026?

DigiKey’s consistent inventory expansion is an industry differentiator and provides engineers, designers and makers access to the most innovative new product introductions (NPIs) in their industries. Some of the NPIs added in Q2 2026 include:

• Klein Tools’ insulated hand tools are designed for professionals working on or near energized equipment where safety and reliability are critical.
• ABLIC’s CLEAN-Boost battery-less water leak sensor generates electricity from leaking water to transmit water leak signals wirelessly.
• HARTING’s Han S 450 Plus connectors feature compact, flexible, waterproof housings with integrated unlocking protection, delivering secure, high-power connections for modular battery energy storage systems up to 500 A and 2 kV.
• Knowles’ A series ceramic core inductors deliver industry-standard RF performance across broad inductance ranges in compact packages and are well-suited for demanding industrial, telecom and MRI applications.
• Analog Devices’ ADEMA124 and ADEMA127 precision energy measurement ADCs are tailored for polyphase and split-phase energy systems.
• CIT Relay & Switch IN8 series indicators offer wire or quick-connect terminals with lasting performance and multiple LED and finish options.
• The Lantronix xPico 600 Wi-Fi 6 embedded IoT gateway eliminates the need for an external host MCU, simplifying integration, accelerating timetomarket, and reducing overall system cost.
• Built for demanding electronics, the 3M electrically conductive double-sided tape 9793KW/KT series helps deliver strong bonding, reliable EMI shielding and grounding, plus moisture and dust sealing for lasting performance.

The post DigiKey Adds Over 27,000 New Parts to In-Stock Product Lineup and 104 Suppliers in Q2 2026 appeared first on ELE Times.

Optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan has announced a strategic investment in DenseLight Photonics — an integrated device manufacturer (IDM) of indium phosphide (InP) optical communication components through its Singapore-based operating subsidiary — with a total transaction value of US$34.3m. LITEON will hold about 21% equity ownership in DenseLight and secure one seat on the board...

I found a project (the Loko Air) that uses a LoRa module to relay GPS data back to a central hub. My cat wouldn't like the footprint of the project as is (had an antenna sticking straight up), and I had difficulty buying the project off of Seeed studio anyway. I am a freshly graduated electrical engineer and I had not attempted a schematic since I have graduated. So, with the original project's schematic in hand, I set out to make minor improvements like: Switching the monopole antenna to a dipole antenna. I figured it had next to no ground plane given its size. I also knew-ish that dipoles tended to form a donut radiation pattern and it would do decently. I am not confident in the 'balun' I made but I based it on stuff I found looking around online. I reduced the part count in quantity and variety. I tried to reduce the number of components needed and what remained I also tried using the same as elsewhere when applicable. In general I tried to base a lot of what I did more on the datasheets than the original designer ended up with. I may find out why the hard way later, but it has me going into the PCB level a bit more confident. I don't particularly have the means to test this circuit before I order a PCB, but any feedback is more than welcome. I was mostly looking to find out if I made any major faux pas as far as the schematic is concerned. I would like it to be legible and friendly as I intend to upload it to github when I am complete and confident it at least kind of works. submitted by /u/TumbleDesperado [link] [comments]

So this is my discrete op amp i'm building that is going to act as error amplifier for a linear power supply i'm building, everything is going to be discrete and as low noise as possible by my hands. Why? Becouse I want to be able to say that it truly built it from scratch and to see how clean power i can get out of it. submitted by /u/Whyjustwhydothat [link] [comments]

Silanna of Pinkenba, Brisbane, Australia has unified its operating companies Silanna UV – which provides far-UVC light sources for water quality sensors, gas sensors, disinfection, and HPLC (high-performance liquid chromatography) applications – and Silanna Semiconductor of San Diego, CA, USA – which makes analog-to-digital converters (ADCs) and specialty analog chips - under the single corporate identity of Silanna...

Aehr Test Systems of Fremont, CA, USA — which provides solutions for testing, burning-in and stabilizing semiconductor devices in wafer-level, singulated die, and packaged-part form — has received a follow-on production order from its lead silicon photonics wafer-level burn-in (WLBI) customer for a fully automated FOX-XP multi-wafer production burn-in system, to ship in first-half 2027 to support the continued expansion of its manufacturing capacity for next-generation silicon photonic integrated circuits...

I recently started playing drums with a small group of local hobbyist musicians (nothing extraordinary here guys just playing some covers and struggling to keep zombies by the cranberries at 75 BPM) I’m 36 now I have been playing drums since I was nine, and zombies is one of those songs for everybody speeds up. And it’s not like we’re super professionals. The first metronome I made I plugged into the audio and everybody bitched that it was too loud and hurting their ears. So I made one with lights and a buzzer so we can use it to count off and watch it from across the room. It also serves a HTML page with a metronome swinging back-and-forth to the tempo https://github.com/WillyV3/metronome-2 I started with a much more complicated design using esp32 wroom, 18650 battery and charging module , along with volume pot - but after everything was wired the metronome only faintly worked when I shorted two outgoing data wires. since i was about 10 hours into soldering it and had learned a lot - I decided to pivot, simplify, and get something shipped to bring to band practice. submitted by /u/Willy_V3 [link] [comments]

Front-panel push button controls can conveniently adjust a PCB-mounted internal potentiometer’s resistance.

Digital potentiometers in conjunction with MCUs find common use in analog circuits. The processor can adjust the gain of an amplifier, frequency of an oscillator, time delays, etc. using a digital potentiometer whose resistance is controlled via software. However, plenty of MCU-less applications also exist; in some cases, they implement conventional potentiometers mounted in system front panels for manual resistance control purposes.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Imagine the convenience, however, if two push buttons are alternatively provided in the front panel to increase or decrease the resistance of each potentiometer, which can then be alternatively located on the PCB within the system. Such an approach may, for example, be a welcome capability in audio, high frequency, automotive, and other applications. This is exactly what the circuit shown in Figure 1 does.

Figure 1 Each press of the “INC” (increment) push button increases resistance by one step. Similarly, each “DEC” (decrement) push button press decreases resistance by one step. The power supply and ground pins of the various ICs are not shown in this schematic.

This simple design uses only two ICs to adjust the digital potentiometer, shown here as an example 128-step 10K ohm AD5220BN10 (PDF) and labeled U3. A more complex implementation can include multiple versions of the circuit, each based on a different-value potentiometer, and each separately managed via unique control of the CS, CLK and U/D pins.

U3 pins A and B are resistor ends, and W is the “wiper”. How does the circuit work? When you momentarily push the “INC” (increment) push button, a pulse is generated which sets flipflop U2A. Its Q output is connected to the U/D pin of the digital potentiometer. Hence U3 is set to the “up” tap direction and the wiper advances by one position.

For every subsequent “INC” push button press, the wiper further advances by one step. Similarly, when you momentarily push the “DEC” (decrement) push button, flipflop U2A is reset, causing U3 to subsequently reverse course and adjust resistance in the “down” direction. Additional “INC” push button presses further decrease the wiper, by one step each time.

And how can you test the circuit? Connect U3 pin A1 to a 5V supply and B1 to ground. Now connect a digital voltmeter to wiper W1. If you press the “INC” push button, the voltage should increase, and if you push the “DEC” push button, the voltage will decrease, if the circuit is functioning correctly. The following video shows a simulation of the circuit, complete with my narration.

Jayapal Ramalingam has over three decades of experience in designing electronics systems for power & process industries and is presently a freelance automation consultant.

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• Dpot pseudolog + log lookup table = actual logarithmic gain

The post Push to increase, decrease a digital potentiometer appeared first on EDN.

I opened an old rechargeable emergency light to see how it was designed. It was interesting to see the battery pack, LED arrays, charging board, and wiring all integrated into such a compact enclosure. I thought others here might find the internal layout interesting as well. Any observations about the design are welcome. submitted by /u/Single-Aide-54 [link] [comments]

Radar, communications, and sensing systems increasingly rely on phased array antennas to achieve agile, precise beam steering without mechanical motion. As bandwidths widen to support higher data rates and better resolution, traditional phase-shifter-based architectures reach their limits, particularly due to beam squint and degraded performance at band edges.

True time delay (TTD) techniques, implemented using time delay units (TDUs), address these challenges by providing frequency-independent delay across the array, enabling accurate wideband beamforming in advanced active electronically scanned arrays (AESAs).

Phased array antenna fundamentals: AESA architecture and electronic beam steering

Phased arrays use multiple antenna elements arranged in uniform linear arrays (ULAs) or uniform rectangular arrays (URAs), with each element driven by a controlled phase or time delay. By adjusting these controls, the array forms narrow beams in desired directions and suppresses unwanted directions, eliminating the need for mechanical steering.

In AESA architectures, each element—or small group of elements—typically has its own transmit/receive (T/R) module, enabling multi-beam and multi-frequency operation for radar, satellite links, and advanced wireless systems.

Figure 1 Simplified phased array antenna features multiple elements with controllable phase or time delay, enabling electronic beam steering without mechanical motion. Source: Qorvo

Phased array performance may be summarized by two system-level figures of merit. Equivalent isotropically radiated power (EIRP) is expressed in dBm (referenced to 1 mW) or dBW (referenced to 1 W) and equals transmit power plus antenna gain (in dBi), assuming no cable or connector losses.

Gain-to-noise-temperature ratio (G/T) measures receive sensitivity by comparing antenna gain to system noise temperature; higher G/T values correspond to better detection and signal quality, especially important for satellite and deep-space links.

Wideband beam squint: Why phase shifters fail in high-bandwidth phased arrays

Wider instantaneous bandwidths have benefits: operation over multiple channels or bands, improved range resolution in radar, and higher data rates in communications. However, wideband operation exposes a key limitation of pure phase-shifter-based beamforming: the phase shift needed for a given steering angle depends on frequency, so a single-phase setting at the center frequency does not steer all frequencies to the same angle.

This misalignment creates beam squint, where the main beam moves with frequency across the band. At the center frequency, the beam points at the desired angle, but at the band edges, it becomes under-steered or over-steered, redistributing gain and degrading EIRP and G/T in the intended direction.

Figure 2 Illustration of beam squint in a phased array: a single-phase setting at the center frequency steers the beam correctly at F0, but under‑steers at Fmax and over‑steers at Fmin. Source: Qorvo

Why beam squint occurs for wider-band systems is illustrated in Figure 3. Beam steering using phase shifts per element attempts to ensure that energy at each element in the array arrives at the same phase for coherent summation in the beamforming network. When the beam is steered off-boresight (θ > 0), some energy arrives at one edge of the array before it arrives at the opposite edge; the extra path length is N * d * sin θ, where N is the number of elements across the array, θ is the beam steering angle, and d is the element spacing.

Figure 3 Path‑length difference in an off‑boresight phased array, showing how the extra distance N * d * sin θ at the farthest element translates into a frequency‑dependent phase shift requirement and leads to beam squint when only fixed phase shifters are used. Source: Qorvo

Dividing this longer path length by the wavelength at F0 and multiplying by 360 degrees gives the phase shift that must be applied at the farthest element. At Fmax the wavelength is shorter, so the required phase shift is larger; at Fmin the wavelength is longer, so the required phase shift is smaller, which is why a single phase shift per element at F0 leads to under‑steering at Fmax and over‑steering at Fmin.

In high-gain, narrow-beam arrays, even modest squint can cause large link-budget penalties at the band edges, while lower-gain, wide-beam arrays are more tolerant of the same angular movement.

Whether an array needs true time delay depends on the relationship between beam squint and beamwidth. Smaller arrays with broader beams can often accept the squint induced by phase-only steering, whereas large arrays with narrow beams and wide bandwidths require TTD to maintain beam pointing and gain across the full band. Design factors such as array size, element spacing, scan angle, and center frequency all feed into this assessment, with wide scan angles and high frequencies typically increasing sensitivity to timing errors.

Figure 4 Example gain patterns for the same beam movement in high‑gain, narrow‑beam and low‑gain, wide‑beam antennas, showing how beam squint produces much larger gain loss at the band edges in high‑gain arrays and necessitates the use of true time delay. Source: Qorvo

True time delay vs phase shifters: Performance comparison for wideband arrays

Traditional phase shifters implement a fixed insertion phase at a given frequency, which works well for narrowband systems since phase and delay can be treated interchangeably over a small bandwidth. As bandwidth increases, the frequency dependence of phase shift becomes problematic: the constant phase setting no longer corresponds to the correct time delay across the entire signal spectrum, causing beam squint and waveform distortion.

True time delay elements, by contrast, provide a fixed time delay, so the resulting phase shift increases linearly with frequency. This linear phase slope ensures that signals of all frequencies within the band experience the same effective delay through the array, aligning their phases at the combining point and maintaining beam direction. So, for wideband, high-performance arrays, especially those requiring fine resolution or long range, TTD becomes essential rather than optional.

In practice, many systems adopt hybrid architectures that combine phase shifters and TDUs. Phase shifters can handle fine steering around a nominal direction or serve narrowband modes, while TDUs provide coarse or wideband delay control to prevent squint across the full band. The design challenge is to balance cost, die area, power, and complexity against bandwidth and performance goals, choosing where in the array hierarchy (element, subarray, or tile level) TDUs should be inserted.

Integrating TDUs into AESA tile and subarray architectures

In AESAs, antenna elements are often grouped into modular tiles, each containing beamforming ICs (BFICs), RF front-ends, and other control circuitry. Within each tile, TDUs can provide precise synchronization across elements or subarrays, ensuring that signals combine coherently in the desired direction over wide bandwidths. Typical TDUs offer delay steps in the picosecond range, allowing fine-grained control of beam pointing and compensation for channel-to-channel variations.

Wide instantaneous bandwidth is particularly important for high-resolution radar, where shorter pulse widths improve range resolution but demand larger bandwidth. For example, a ULA operating at a 10 GHz center frequency with a 1.5 GHz signal bandwidth and 16 elements with half-wavelength spacing may be limited to a 60-degree scan range if phase-only steering is used and signal degradation must be held within acceptable bounds. Beyond such limits, true time delay, rather than approximate phase-based delay, is required to preserve beam integrity and resolution across the full spectrum.

Calculating TTD requirements for ULA design

In uniform linear arrays, the delay required at each element can be derived from the desired scan angle, element spacing, and operating frequency. A phase shifter with a given resolution, say a 6-bit device with a least significant bit (LSB) of 5.625 degrees, corresponds to a particular minimum time delay increment at the operating frequency; at 10 GHz, this phase step translates to approximately 1.5 picoseconds of delay. To replace such a phase shifter with a TDU, the delay unit must support at least the same or finer time resolution to maintain equivalent steering granularity.

For arrays with up to 16 elements per side and scan angles up to about 60 degrees, the total required delay at the outer elements can reach around 650 picoseconds. Designers may implement this total delay using cascaded TDUs or a combination of coarse and fine delay stages, distributing the delay across the RF chain to meet both performance and implementation constraints. This approach enables larger or more agile arrays while maintaining precise control of beam pointing over wide frequency ranges.

TDU topologies: Switched lines, ATLs, and LC networks

TDUs can be realized with several circuit topologies, each offering trade-offs in terms of noise, insertion loss, die area, and linearity. Switched delay lines use multiple physical line lengths selected by RF switches to create discrete delay values; they tend to provide low noise and low insertion loss but require more chip area, especially at longer maximum delays.

Artificial transmission lines (ATLs) use synthetic line structures to achieve compact delay implementations, trading size for higher loss and potentially increased noise. LC-based delay networks implement analog delay using lumped inductors and capacitors, offering fine control and tunability but adding design complexity and sensitivity to component tolerances.

Digital delay lines, familiar with digital signal processing, use switched digital paths to provide quantized delays, making them attractive for architectures that need both coarse and fine control and may integrate closely with digital beamformers. Each topology represents a different balance between delay precision, footprint, insertion loss, and linearity, and system-level simulations are typically required to identify the optimal choice for a given application.

Integrating TTD in RFICs: Monolithic microwave circuits for wideband phased arrays

Historically, true time delay could be implemented with coaxial cables, optical fibers, or microstrip and stripline networks, but these approaches often struggle with size, weight, and cost in large, high-frequency arrays. Monolithic microwave integrated crcuits (MMICs) now provide a more practical and scalable solution, integrating delay elements, switches, and equalization within compact RFICs.

Advances in CMOS, GaAs, and MEMS technologies have reduced the size and power consumption of TTD circuits while improving bandwidth and delay resolution.

A typical MMIC-based TDU may combine switched or artificial transmission lines with wideband distributed gain amplifiers and gain-slope equalizers to compensate for frequency-dependent loss and maintain flat group delay across the band. Integration with beamforming ICs and RF front-end modules allows designers to place TTD functionality at the element, subarray, or tile level, trading semiconductor area against array-level performance and flexibility.

Why TTD matters: Wideband array performance and future-proof AESA design

From a system perspective, true time delay provides consistent beam steering across wide frequency ranges, improving signal quality, resolution, and link margin at the band edges. By effectively eliminating beam squint across the operating bandwidth and preserving coherent combining across the array, TTD enhances both EIRP and G/T, directly impacting radar detection performance and communications reliability.

In demanding environments and applications, such as defense radar, satellite payloads, and next-generation wireless backhaul, this can be decisive in meeting performance requirements. Beyond immediate performance gains, TTD also supports future proofing. As bandwidth requirements continue to grow and spectral environments become more complex, architectures that already incorporate wideband-capable TDUs and hybrid TTD/phase-shifter beamforming are better positioned to adapt without wholesale redesign.

For engineers and decision-makers, the key takeaway is that while phase shifters remain suitable for narrowband or cost-sensitive systems, TTD is becoming a critical enabler of competitive, high-performance wideband phased arrays.

David Schnaufer is technical marketing communications manager at Qorvo, where he leverages his extensive technical and strategic experience to develop insightful, thought leadership content. Throughout his career at Qorvo, he has served several roles, including senior manager of strategic marketing and product marketing manager.

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The post TTD for wideband phased array beamforming: Eliminating beam squint in AESA appeared first on EDN.

For second-quarter 2026, AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials at plants in China — has reported record revenue of $47.6m (up 77% on $26.9m last quarter and 164% on $18m a year ago), greatly exceeding the expected $34m...

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ROHM has developed a 2nd Generation terahertz (THz) wave oscillation device using semiconductor elements known as Resonant Tunneling Diodes (RTDs). ROHM is making the device available via the RTD-EVK-G2 Terahertz Wave Device Evaluation Kit, which includes a sample device, cable, and evaluation board. The kit enables companies and research institutions to evaluate THz wave oscillation and detection in a compact development environment.

Occupying the frequency region between radio waves and light, terahertz waves combine the penetrating properties of radio waves with the straight-line propagation of light. Because they exhibit unique absorption characteristics for polymers, moisture, and other substances, they are expected to be used in non-destructive testing without ionizing radiation, medical and healthcare applications, and high-resolution radar sensing. However, conventional terahertz systems require large equipment and high implementation costs, making it difficult for new companies and research institutions to enter the field or pursue commercialization.

Since the late 2000s, ROHM has engaged in joint research with the Institute of Science Tokyo, Osaka University, and many other universities and research institutions to develop THz wave oscillation and detection devices using RTDs. In 2024, ROHM began offering samples of 1st Generation products, achieving substantial downsizing and cost reduction compared with conventional methods.

What’s New?

To address the growing demand for improved signal quality in application development, ROHM has now developed a 2nd Generation terahertz wave oscillation device. The device maintains the same compact 0.5 × 0.5mm chip size as the 1st Generation product while adopting an internal structure that enables higher output power. As a result, output power has been increased to approximately 4 times that of the 1st Generation product, reaching a maximum of 40µW. The higher output power improves the detectability of THz waves after transmission through or reflection from target objects – making the device well suited for applications such as sensing and imaging that require high signal quality.

The device is mounted in the same 4.0 × 4.3mm PLCC package, maintaining the industry’s smallest footprint. This enables evaluation environments to be built even in space-constrained settings. In addition, compared with other THz generation methods, the RTD approach generates less heat and consumes less power. This reduces application development load at both companies and research institutions. Sales of the RTD-EVK-G2 evaluation kit, which includes samples of the 2nd Generation wave oscillation device, are scheduled to begin in August this year at $3,300 per set.

By enabling evaluation at a lower cost than other methods, the kit supports the development of a wide range of applications. This includes non-destructive testing; imaging and sensing in the medical and healthcare sectors; material identification; and moisture detection. ROHM will also continue sales of 1st Generation devices for applications that prioritize low power consumption. For further information, please contact a sales representative or visit the contact page on ROHM’s website. Purchase of the evaluation kit requires signing a non-disclosure agreement (NDA) with ROHM.

Expanding the Possibilities for THz Wave Application

Sharing his views on the development, Professor Safumi Suzuki, Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Integrated Research, Institute of Science Tokyo, said, “Terahertz waves are expected to be applied in a wide range of fields, including non-destructive testing, imaging and sensing, and wireless communications. At the same time, commercialization continues to face major challenges, such as the need for large-scale equipment and high implementation costs. The RTD terahertz wave device, developed through many years of joint research with ROHM is compact, power saving, and does not require cooling. It can also be introduced at low cost, helping companies and research institutions begin terahertz wave research. With the launch of the 2nd Generation device featuring significantly improved oscillation output, I expect development of applications requiring higher signal quality to accelerate.”

“With the launch of RTD-EVK-G2, we expect to make another major step forward toward the practical implementation of terahertz technology. Feedback from users of the 1st Generation device revealed strong demand for higher-output devices. With this 2nd Generation product, we have succeeded in increasing oscillation output to approximately 4 times that of the 1st Generation device while maintaining a compact size, bringing us closer to meeting those needs. Terahertz technology is steadily progressing toward real-world implementation. ROHM will continue working together with customers, partners, universities, research institutions, and government agencies to support the development of terahertz wave applications and contribute to the realization of a sustainable society,” mentioned Ken Nakahara, General Manager of ROHM Research & Development Center, ROHM Co., Ltd.

Going forward, ROHM intends to continue diversifying the possibilities for THz wave application development and contribute to the early commercialization and real-world implementation of terahertz technology. This will help accelerate its deployment across a broad range of industries.

 

 

 

 

The post ROHM’s 2nd-Gen Terahertz Wave Oscillation Device Delivers 4 Times Higher Output Power appeared first on ELE Times.