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Rad-tolerant FPGAs earn QML Class V status
Microchip’s RTG4 FPGAs with lead-free flip-chip bumps have achieved QML Class V qualification, the highest level for space components. This status, designated by the Defense Logistics Agency, ensures exceptional reliability and longevity for critical space missions. QML Class V-qualified products also help customers streamline their design and certification processes.
According to Microchip, the RTG4 radiation-tolerant FPGA with lead-free flip-chip bumps is the first of its kind to gain QML Class V status. Flip-chip bumps are used to connect the silicon die and the package substrate, while the lead-free material extends the longevity of the product. The flip-chip bump is contained within the FPGA package, so converting to these new RTG4 FPGAs has no impact on the user’s design, reflow profile, thermal management, or board assembly process.
With a flash-based fabric, RTG4 FPGAs deliver high density and performance for space applications, consuming significantly less power than equivalent SRAM-based FPGAs. They also exhibit zero configuration upsets in radiation environments, eliminating the need for mitigation measures.
The RTG4 FPGAs are supported by development kits, mechanical samples, and daisy chain packages for board validation and testing. To learn more, click the product page link below.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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SiC diode handles high DC link voltages
With a 2000-V breakdown voltage, Infineon’s IDYH80G200C5A CoolSiC Schottky diode suits systems with DC link voltages up to 1500 V. The Gen 5 silicon carbide (SiC) diode offers current ratings from 10 A to 80 A, making it well-suited for solar and EV charging applications.
The diode comes in a TO-247PLUS-4-HCC package with 14-mm creepage and 5.4-mm clearance, supporting up to 80A. This enables developers to reach higher power levels with half the component count compared to 1200-V solutions. The reduced component count simplifies the overall design and eases the transition from multilevel to two-level topologies.
Infineon’s .XT interconnection technology enhances the Schottky diode’s resistance to humidity, extending system lifetime. According to the company, it also significantly reduces thermal resistance and impedance, improving heat management.
The IDYH80G200C5 CoolSic Schottky diode is available now.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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Low-power MCUs enable capacitive touch sensing
The RX260 and RX261 groups of 32-bit MCUs from Renesas feature a capacitive touch sensing unit with high noise immunity and water resistance. These 64-MHz microcontrollers consume 69 µA/MHz when active, dropping to 1 µA in standby mode. With their low-power operation and touch capabilities, the RX260/RX261 MCUs are well-suited for home appliances, building and factory automation, e-bikes, and smart locks.
Based on an RXv3 CPU core, the devices achieve a CoreMark score of 355 at 64 MHz, up to 2.5 times higher than comparable 64-MHz MCUs. Renesas also reports 25% lower active current and 87% lower standby current than similar MCUs, enabling customers to meet strict energy regulations for home appliances and extend the operating time of battery-powered equipment.
The capacitive touch IP (CTSU2SL), included as an HMI function, offers multi-frequency scanning to reduce false detection due to external noise and an automatic judgement function to detect touch events without CPU activation. QE for Capacitive Touch V4.0.0, a development assistance tool, simplifies the initial settings of the touch user interface and sensitivity tuning.
In addition, RX261 microcontrollers feature RSIP-E11A security IP with built-in AES, ECC, and SHA encryption engines and security management features. They also add full-speed USB and CAN FD interfaces.
Both the RX260 and RX261 groups of MCUs are available now from Renesas and authorized distributors.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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Capacitor lineup expands capacitance-voltage combinations
Vishay’s 299 PHL-4TSI series of snap-in aluminum electrolytic capacitors includes a diverse selection of 350-V, 500-V, 550-V, and 600-V devices. Recent additions significantly broaden the capacitance-voltage combinations available to designers, with a rated capacitance range of 270 µF to 3300 µF.
The 299 PHL-4TSI devices are polarized aluminum electrolytic capacitors with a non-solid electrolyte, suitable for smoothing, filtering, and energy storage in applications such as power supplies and renewable energy converters. Their 4-terminal configuration enhances mechanical stability and ensures keyed polarity. Cylindrical case sizes range from 35×50 mm to 45×100 mm.
The snap-in capacitors feature ripple current ratings ranging from 1.9 A to 7.6 A and operate over a temperature range of -40°C to +105°C. They also provide a useful life of over 5000 hours at +105°C, enhancing end-product longevity.
Samples are available in small quantities from catalog houses. All 299 PHL-4TSI values are currently available in production quantities, with lead times of 18 weeks.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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AC/DC controllers boost efficiency in flyback design
Several series of AC/DC controllers from Nexperia provide lower standby current and higher conversion efficiency for flyback converters. The NEX806xx and NEX808xx are quasi-resonant/multi-mode flyback controllers that operate over a VCC range of 10 V to 83V, while the NEX81801 and NEX81802 are adaptive synchronous rectifier (SR) controllers. These components are suited for applications like power delivery (PD) chargers, adapters, industrial and auxiliary power supplies, wall sockets, and strip sockets.
The ICs work with Nexperia’s NEX52xxx PD controllers and other discrete power devices to create a turnkey flyback converter solution. This setup optimizes current sense voltage levels and PFM mode, reduces standby power, and ensures high efficiency across all load ranges.
The primary side controller directly drives either a silicon MOSFET or a GaN HEMT. Additionally, the SR controller employs an adaptive control method to prevent mis-conduction in switching devices, improving overall system reliability.
All of the devices are available in TSOT23-6 packages with low thermal resistance. To learn more about Nexperia’s AC/DC controller ICs, click here.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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ZF said to be withdrawing from Wolfspeed’s German silicon carbide device fab project
TI adds 200mm GaN power semiconductor production in Japan, quadrupling internal capacity
Samsung exiting mainstream LED market
UWB enables handsfree, secure car access via smartphone
Audi’s Q6 e-Tron, hitting the road in 2024, will sport handsfree secure car access via a smart mobile device and this capability is built around an ultrawideband (UWB) semiconductor device to precisely identify the driver’s location in relation to the car. The car, which only needs a single UWB device to measure distance, can locate a person near a door or tailgate and then respond according to driver preferences.
UWB, a wireless technology that enables extra security capabilities and has already gained traction in smartphones for identification features, adds location sensing to a vehicle key fob to mitigate security challenges like key fob spoofing. In other words, it precisely identifies the location of the driver in relation to the car, allowing the doors to be unlocked only when the driver is near the car.
Source: NXP
Drivers can unlock and start their car handsfree using a digital key on a UWB-enabled smartphone or wearable, which can remain in the driver’s pocket or bag. In addition to handsfree access to cars, UWB can support other use cases such as automated electric vehicle (EV) charging.
Audi Q6 e-tron’s handsfree car entry is powered by NXP’s Trimension NCJ29Dx family of UWB chips that deliver high localization resolution and power optimization for battery-powered devices like key fobs. These USB devices also offer maximum protection against car theft through relay attacks with on-chip support for a wide range of cryptographic operations.
It’s worth mentioning that NXP’s Trimension NCJ29Dx family is part of NXP’s larger portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range microcontroller. And these two devices are also part of Audi’s secure car access platform.
NXP’s Trimension NCJ29Dx devices—compliant with 802.15.4, Car Connectivity Consortium (CCC), and FiRa Consortium standards—have a production win in Audi vehicles, and that cements UWB’s place in real-time, accurate distance measurement between driver and vehicle. Other UWB features besides precise and secure real-time localization could also be in play in upcoming vehicles.
Related Content
- The Future of Automotive Connectivity
- Ceva’s UWB Radar Detects Child Presence in Cars
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- NXP Adds Latest Automotive UWB chip as BMW Drives Digital Key 3.0
- Volkswagen and NXP Show First Car Using UWB To Combat Relay Theft
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Found this on TikTok shop lmao
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EEVblog 1647 - Road Based Energy AGAIN. Rouute vs R-2ENERGY
Learned the hard way Valve offers every part for the Steamdeck except the daughter board. Drop from bed ripped the shoulder button off the board. First bodge went well, though.
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Toray develops high-speed mounting of III-V chips on silicon for silicon photonics
Infineon launches first 2000V SiC Schottky diode
Part 2: How hot is too hot to touch?
First please read this earlier post where I noted how Hydrotherapy equipment for my physical therapy after a foot surgery had “scalding” temperatures set to 120°F (Figure 1).
Figure 1 Hydrotherapy equipment with scalding water temperature is 120oF and beyond.
Then see this more recent post and be prepared for a shock.
The post on Inside Edition describes how a man was killed after being exposed to a water shower where the hot water temperature was 150 degrees Fahrenheit (150°F). This was way, way higher than the scalding threshold of 120°F mentioned in the earlier EDN post.
No mention was made, but I rather suspect, that the man who was killed may have let the hot water run for a while before stepping into the shower to avoid being chilled by cold water and that he did not test the shower water by hand first. Had he checked, he would have avoided the scalding.
John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).
Related articles:
- Understanding circular polarization
- How hot is too hot to touch?
- Misconception revealed: Can a heat sink be too big?
- Goodbye, thermal grease; hello, integral heat sink?
- Non-electronic instrument measures water depth and temperature
- Common-impedance plumbing
- The case of the too-hot laptop
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Understanding circular polarization
An electromagnetic wave or signal traveling from “here” to “there” has an electrostatic field component that we call its E-field and whose direction we assign as the signal’s polarity. Often, the E-field is either vertical or horizontal as developed by a dipole structure or a ground plane antenna, but it can also be rotary which means it can be rotating around the signal’s axis of travel. The conventional terminology for that case however is not the word “rotary”, it is the word “circular”. We thus speak of vertical polarization, horizontal polarization, and circular polarization.
What grammarian made that decision is anyone’s guess, but that’s how things are.
It isn’t hard to create a circularly polarized signal. Please see Figure 1.
Figure 1 Making a circularly polarized signal is achieved by feeding both polarizations at the same time but with a 90o signal phase shift between the two.
A circularly polarized signal has a handedness which is defined from the point of view of the signal’s recipient. If the E-field is rotating clockwise from the recipient’s observation point, the signal is right hand polarized (RHP). If the E-field is rotating counterclockwise from the recipient’s observation point, the signal is left hand polarized (LHP). When I was at Sirius Satellite Radio prior to the merger with XM Radio, I learned that their Sirius satellite signals were LHP.
If you the recipient of an incoming signal point your right-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your right for RHP, the direction of E-field rotation. If you the recipient of an incoming signal point your left-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your left for LHP, the direction of E-field rotation.
Got that?
One advantage of circular polarization is a reduced susceptibility to signal fading over long distances. Various factors can affect the polarization of the traveling signal, and the degree of fading can be different between different degrees of polarization angle. Vertical and horizontal polarizations share this vulnerability.
Circular polarization is less susceptible to signal fading since the polarization most easily propagated is achieved whatever the intervening propagation environment might happen to be. In ham radio, this is a noted advantage of “cubical quad” antennas over multi-element Yagi antennas. Cubical quads deliver circular polarization.
Please see this article.
Where “QSB” stands for signal fading and “DX” stands for long distance communication, we find the following:
John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).
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Capture 16-bit readings of 8 thermistors in less than 1 second for $2
Figure 1 is a cheap and cheerful voltage inverter I offered awhile back in “A simple, accurate, and efficient charge pump voltage inverter for $1”.
Figure 1 The generic and versatile xx4053 provides the basis for a cheap, efficient, and accurate voltage inverter.
Wow the engineering world with your unique design: Design Ideas Submission Guide
Shortly thereafter the idea morphed into an uncomplicated, inexpensive, and fairly fast (1 MHz), low power voltage to frequency converter (VFC): “Voltage inverter design idea transmogrifies into a 1 MHz VFC”. See Figure 2.
Figure 2 Modified voltage inverter becomes power thrifty 1 MHz VFC.
An interesting quirk of the Figure 2 circuit is that, although it is described as a voltage to frequency converter, it could just as accurately be called a current to frequency converter. That’s because input current =Vin/R1 charges C3 making transconductance amplifier Q1, Q2 complete a feedback loop through the charge pump oscillator. The loop continuously adjusts Fpump to balance pump current to be equal and opposite to input current,
Ipump = 5*C2*Fpump = Iin
Fpump = Iin / (5 C2 R1) = Iin / (5*100pF) = 2 kHz/µA
This makes possible some unusually simple and economical sensor interface topologies like the one in Figure 3.
Figure 3 Eight thermistors can share a single excitation resistor.
A typical NTC thermistor’s datasheet (e.g., Molex 2152723605) summarizes its characteristics with four parameters like these from the 2152723605 sheet, shown in parentheses.
To = rated/calibration temperature (25°C = 298.15K) (1)
Ro = resistance at To (10k+/-1%) (2)
b = beta (3892K) (3)
dissipation (self-heating) factor (1.5 mW/°C) (4)
Then thermistor resistance (Rt) as a function of temperature (T) in Kelvin is predicted by:
Rt = Ro exp(b(T-1 – To-1)) (5)
Choosing a value for excitation resistor R1 requires estimating the highest temperature (Tmax) any of the thermistors is expected to be immersed in, and hence the lowest resistance to be read. Then we figure
Rx = Ro exp(b(Tmax-1 – To-1)) (6)
R1 = 10k – Rx (7)
If calculation #7 calls for R1 < 0, then R1 is of course simply omitted. Taking for example Tmax = 100oC and numbers from the 2152723605 datasheet, Rx = 725, R1 = 10000 – 725 = 9275, to which the nearest standard 1% value is 9310.
The addressing of the thermistor to be read is done by output of the connected microcontroller by its three-bit binary U2 address on general purpose output lines GP0-2. A microcontroller internal counter-timer peripheral connected to input CTPin is then enabled to accumulate VFC pulses for 216 µs = 65.536 ms. Call the accumulated 16-bit integer ADC. Then the calculation of acquired temperatures, assuming 2152723605 sheet numbers again, would proceed thusly:
X = ADC/216 = 10k / (R1 + Rt)
X*(R1 + Rt) = 10k
Rt = 10k/X – R1 = 10k/X – 9310
T = (Ln(Rt/Rx)/b + Tmax-1)-1
oK = (Ln(Rt/725))/3892 + 0.002680)-1
oC = K – 273.15
The conversions are inherently radiometric, therefore insensitive to 5-V rail noise and tolerance, and integrating, making them highly noise pickup resistant. Which are not bad features for a two buck ADC.
Multiplexor U2’s error contributions—Ron and Roff—are, respectively, small (~60 ohms) and large (~100 Mohms) enough to not be significant factors.
Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.
Related Content
- A simple, accurate, and efficient charge pump voltage inverter for $1 (in singles)
- Voltage inverter design idea transmogrifies into a 1MHz VFC
- Turn negative regulator “upside-down” to create bipolar supply from single source
- Single supply 200kHz VFC with bipolar differential inputs
- New VFC uses flip-flops as high speed, precision analog switches
- Inexpensive VFC features good linearity and dynamic range
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Celestial AI acquires silicon photonics patent portfolio from Rockley
RVA23 Profile ratification bolsters RISC-V software ecosystem
RVA23 Profile, a major release for the RISC-V software ecosystem, has been ratified, and it’s expected to help accelerate widespread implementation among toolchains and operating systems. Before ratification, it underwent a lengthy development, review, and approval process across numerous working groups. RVA23 Profile has now received the final ratification vote by the RISC-V Board of Directors.
RISC-V has more than 80 technical working groups that collectively advance the RISC-V ISA capabilities. They aim is to address the need for portability across vendors with standard ISA Profiles for applications and systems software.
RVA Profiles—which align implementations of RISC-V 64-bit application processors running rich operating system (OS) stacks from standard binary OS distributions—are crucial for software portability across many hardware implementations and thus help avoid vendor lock-in.
Each Profile specifies which ISA features are mandatory or optional, providing a common target for software developers. Mandatory extensions are assumed to be present, while optional extensions can be discovered at runtime and leveraged by optimized middleware, libraries, and applications.
“Profiles are the foundations of application and systems software portability across RISC-V implementations,” said Andrea Gallo, VP of technology at RISC-V International. “A large software ecosystem is only possible with a standard Profile for software vendors to target and within which multiple suppliers can work together.”
Vector extension and hypervisor extension are key components of the RVA23 Profile. Vector extension, which aims to accelerate math-intensive workloads such as AI/ML, cryptography, and compression/decompression, is critical for better performance in mobile and computing applications. RVA23 is the baseline requirement for the Android RISC-V ABI.
Next, hypervisor extension enables virtualization for enterprise workloads in both on-premises server and cloud computing applications. That, in turn, accelerates the development of RISC-V-based enterprise hardware, operating systems, and software workloads.
An Omdia research forecasts that RISC-V processors will account for almost a quarter of the global market by 2030. Then, there is a statement from Calista Redmond, CEO of RISC-V International, which claims that the RISC-V community has grown tremendously to more than 16,000 engineers worldwide.
The ratification of the RVA23 Profile is expected to aid RISC-V’s community growth as it will enable software vendors to successfully sell their software and services on a wide variety of RISC-V products.
Related Content
- Startups Help RISC-V Reshape Computer Architecture
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- Certifying RISC-V: Industry Moves to Achieve RISC-V Core Quality
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