Microelectronics world news

Wideband amplifier meets sub-6 GHz requirements

EDN Network - Fri, 09/06/2024 - 17:30

A wideband RF power amplifier module from Elite RF covers signals from 20 MHz to 6 GHz, delivering a maximum output power of 20 W. Elite RF can also combine these 20-watt amplifiers to create higher-power systems, such as 100-watt models, enabling signal transmission over greater distances.

This wideband amplifier is particularly effective in counter-drone systems, addressing growing security and privacy concerns related to drones’ increasing presence across industries. The amplifier supports key communication frequencies in the ISM band, including 433 MHz, 915 MHz, 2.45 GHz, and 5.8 GHz.

The amplifier module features a compact and rugged design for seamless integration into existing systems. With this new addition to its product line of RF amplifiers, which spans frequencies up to 40 GHz, Elite RF aims to provide one-stop power amplifier solutions to RF system integrators.

For more information or to request a price quote, contact sales@eliterf.com.

Elite RF

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Wireless combo module targets embedded devices

EDN Network - Fri, 09/06/2024 - 17:30

KAGA FEI’s WKI611AA1 Wi-Fi 6 and Bluetooth 5.4 combo module simplifies the development of low-power embedded devices. With a built-in antenna and multiple certifications, it reduces antenna development time and certification costs for applications such as industrial automation, IoT gateways, surveillance cameras, and smart home appliances.

The WKI611AA1 module employs NXP Semiconductor’s IW-611, a highly integrated dual-band 2.4/5-GHz 1×1 Wi-Fi 6 and Bluetooth/Bluetooth Low Energy 5.4 chip. Its Wi-Fi subsystem includes a Wi-Fi MAC, baseband, and direct-conversion radio with an integrated power amplifier, low-noise amplifier, and transmit/receive switch, eliminating the need for an external RF front-end module. The chip’s independent Bluetooth subsystem supports Bluetooth profiles.

Dedicated CPUs and memories for both the Wi-Fi and Bluetooth subsystems enable real-time, independent protocol processing. Interfaces to external host processors include SDIO 3.0 for Wi-Fi and UART for Bluetooth.

The WKI611AA1 module comes in an LGA surface-mount package that is 25.0×15.7×2.1 mm. It operates from a 3.3-V/1.8V power supply over a temperature range of -40°C to +85°C. Certifications for the combo module include Radio Law MIC (Japan), FCC (USA), and ISED (Canada).

The WKI611AA1 wireless combo module will be available for sampling in December 2024, with mass production slated to begin in May 2025.

WKI611AA1 product page

KAGA FEI

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PCIe 4.0 SSD optimizes system performance

EDN Network - Fri, 09/06/2024 - 17:30

Powered by a Gen 4×4 NVMe controller, the NV3 PCIe 4.0 SSD from Kingston Digital delivers sequential read and write speeds of up to 6000 MB/s and 5000 MB/s, respectively. The drive offers storage capacities of 500 GB, 1 TB, 2 TB, and 4 TB in a compact single-sided M.2 22×80×2.3-mm form factor.

The NV3 solid-state drive provides high-speed performance for tasks ranging from editing to gaming. Its low power consumption and heat generation boost overall system efficiency. The drive’s compact form factor makes it well-suited for thin laptops and small PCs, integrating seamlessly via M.2 connectors.

Endurance of the NV3 SSDs ranges from 160 TBW for the 500-GB model to 1280 TBW for the 4-TB model. Operating over a temperature range of 0°C to 70°C, the drives also feature an MTBF of 2,000,000 hours.

NV3 drives include a 1-year subscription to Acronis True Image software for disk cloning, along with Kingston SSD Manager for monitoring drive health, tracking disk usage, updating firmware, and securely erasing data.

SSD models with 500-GB, 1-TB, and 2-TB storage capacities are available now, with the 4-TB model launching in Q4 2024.

NV3 product page

Kingston Digital

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14-bit scopes boost resolution for general use

EDN Network - Fri, 09/06/2024 - 17:30

The InfiniiVision HD series oscilloscopes from Keysight employ a 14-bit ADC, offering four times the vertical resolution of 12-bit scopes. With a noise floor of 50 µV RMS, they also reduce noise by half compared to other general-purpose scopes.

 

Covering bandwidths between 200 MHz and 1 GHz, the HD3 series enables engineers to detect even the smallest signal anomalies. Its 14-bit resolution, low noise floor, and update rate of 1.3 million waveforms/s ensure fast and precise debugging across all measurements.

The oscilloscopes provide two or four analog channels, along with 16 digital channels. A deep memory of up to 100 million points captures longer time spans at the full sample rate of 3.2 Gsamples/s, enhancing measurement and analysis results. Additionally, the HD3 series introduces Fault Hunter software, which automatically analyzes signal characteristics based on user-definable criteria.

Prices for the InfiniiVision HD3 series start at $8323 for a 2-channel oscilloscope and $9187 for a 4-channel model.

InfiniiVision HD3 product page

Keysight Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Interconnect underdogs steering chiplet design bandwagon

EDN Network - Fri, 09/06/2024 - 14:33

The chiplets movement is gaining steam, and it’s apparent from how this multi-die silicon premise is dominating the program of the AI Hardware and Edge AI Summit to be held in San Jose, California from 10 to 12 September 2024. The annual summit focuses on deep tech and machine learning ecosystems to explore advancements in artificial intelligence (AI) infrastructure and edge deployments.

At the event, Alphawave Semi’s CTO Tony Chan Carusone will deliver a speech on chiplets and connectivity while showing how AI has emerged as the primary catalyst for the rise of chiplet ecosystems. “The push for custom AI hardware is rapidly evolving, and I will examine how chiplets deliver the flexibility required to create energy-efficient systems-in-package designs that balance cost, power, and performance without starting from scratch,” he said while talking about his presentation at the event.

Figure 1 Chiplets have played a vital role in creating silicon solutions for AI, and that’s extending to 6G communication, data center networking, and high-performance computing (HPC). Source: Alphawave Semi

At the summit, Alphawave Semi will showcase an advanced HBM3 sub-system designed for AI workloads as well as AresCORE, a 3-nm 24-Gbps UCI integrated with TSMC CoWoS advanced packaging. There will also be a live demonstration of die-to-die (D2D) traffic at 24 Gbps per lane.

LG’s chiplet design

Another chiplets-related announcement involves leading consumer electronics manufacturer LG Electronics, which has created a system-in-package (SiP) encompassing chiplets with processors, DDR memory interfaces, AI accelerators, and D2D interconnect. Blue Cheetah Analog Design provided its BlueLynx D2D interconnect subsystem IP for this chiplet-based design.

Figure 2 Chiplet designs demand versatile interconnect solutions that minimize die-to-die latency and support a variety of packaging requirements. Source: Blue Cheetah

BlueLynx D2D interconnect provides customizable physical (PHY) and link layer chiplet interfaces and supports both Universal Chiplet Interconnect Express (UCIe) and Bunch of Wires (BoW) standards. Moreover, the PHY IP solutions can be integrated with on-die buses using popular standards such as AMBA, CHI, AXI, and ACE.

The D2D interconnect IP is available for 16 nm, 12 nm, 7 nm, 6 nm, 5 nm, and 4 nm process nodes and works on multiple fabs. It also facilitates both standard and advanced packaging while supporting multiple bump pitches, metal stacks, and orientations.

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Roborock uses hybrid Time-of-Flight system by Infineon and pmdtechnologies for sweeping and mopping robots

ELE Times - Fri, 09/06/2024 - 14:22

Roborock, a global leader in intelligent home robotics, has launched the intelligent sweeping and mopping all-in-one robot Roborock Qrevo Slim at IFA 2024 in Berlin, equipped with an innovative 3D camera module for navigation and obstacle avoidance using the REAL3 Time-of-Flight (ToF) imager by Infineon Technologies. The technology allows to reduce size and increase reliability. Compared to the body height of traditional sweeping and mopping robots of around 100 mm, the overall height of the Roborock Qrevo Slim is only 82 mm, allowing it to pass through lower and narrower spaces while providing high reliability.

“The integration of our REAL3 ToF into Roborock’s cleaning robot is a great example of how Infineon technology is used to accelerate product innovation in the smart home sector,” said Andreas Kopetz, Vice President Ambient Sensing at Infineon. “Our hybrid ToF solution targets a rapidly growing consumer robotic market, enabling customers to develop unique robot designs while reducing system costs and complexity.”

Roborock Qrevo Slim

Roborock has teamed up with Infineon, pmdtechnologies and OMS to develop a next generation robot solution that uses hybrid Time-of-Flight (hToF) to replace the traditional laser distance scanner (LDS) module and obstacle avoidance module. hToF is a combination of Infineon’s REAL3 ToF imager, a dual infra-red illumination sources and pmd’s processing technology to provide a powerful solution for consumer-grade robots. It supports simultaneous localization and map building (SLAM), obstacle avoidance and cliff detection functions in one camera module manufactured by OMS.

“At pmd, we are proud to have played a leading role in the development and optimization of the hybrid Time-of-Flight (hToF) system that powers Roborock’s latest innovation. By contributing our advanced 3D pixels, our expertise in infra-red illumination, and our processing technology into the hToF module, we’ve been able to create a highly efficient, compact solution that significantly enhances navigation and obstacle avoidance capabilities,” said Jochen Penne, Managing Director at pmdtechnologies ag.

The high-resolution depth and vision data is perfectly suited for robust obstacle avoidance algorithms while the open-source SLAM algorithm based on hToF depth data generates high-precision maps, ensuring accurate and reliable navigation. In addition, hToF is working in darkness and strong sunlight. It is computationally efficient and streamlined, requiring e.g. only one Cortex A55 processor core for depth processing and SLAM computation tasks out of eight available cores.

Roborock has pioneered the mass production of LDS technology since 2016 and is promoting it as the standard configuration for sweeping robots. The company is the first to use the hybrid Time-of-Flight system in their new generation of sweeping robots.

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The Demand and Challenges of Electronic Components in the EV Era

ELE Times - Fri, 09/06/2024 - 12:12

As the global demand for sustainable transportation solutions grows, the electric vehicle (EV) market is undergoing unprecedented expansion. Particularly in India, a government-led EV revolution is rapidly transforming this vast market, with electronic components playing a critical role in this change, providing essential technology support for the new generation of electric vehicles.

Current Status and Prospects of the EV Market

The global electric vehicle market is at a crucial turning point, driven by government policies and technological advancements, with adoption rates rising swiftly. Policies in Europe, China, and the USA, along with increased consumer awareness, have continuously matured these regions’ markets. The International Energy Agency (IEA) predicts that global electric vehicle sales will grow exponentially in the next decade, with market shares expected to rise from 15% in 2023 to 40% in 2030 and surpass 50% by 2035.

In India, the government’s “FAME India” (Faster Adoption and Manufacturing of Hybrid and Electric Vehicles) scheme has set clear targets to accelerate the adoption and production of hybrid and electric vehicles through fiscal incentives and manufacturing support. In 2023, India’s EV sales hit a historical high, particularly in the cost-effective and versatile two-wheeler and three-wheeler segments.

The rapid market growth in India is being propelled by advancements in EV technology, such as reduced battery costs and increased range, as well as by the expansion of charging infrastructure. The government plans to extend charging facilities to more cities and public areas by 2025 to meet growing demand.

Demand for Electronic Components in Electric Vehicles
  • Power electronics systems: including inverters, DC-DC converters, and motor controllers, are the heart of electric vehicles.
  • Battery Management Systems (BMS): Given India’s significant temperature variations, BMS must adapt to extreme climates to ensure battery safety and efficiency.
  • On-board infotainment and autonomous driving components: As India’s middle class demands more high-tech vehicles, advanced driver-assistance systems (ADAS) and on-board infotainment systems have become standard in new models.
Technical Challenges for Electronic Components
  • High voltage and temperature resistance: India’s hot climate demands that electronic components can operate under more extreme conditions.
  • Reliability and longevity: In India’s variable roads and climatic conditions, the durability and reliability of components are incredibly crucial.
  • Miniaturization and integration: As technology advances, particularly in space-constrained two-wheelers and three-wheelers, the demand for miniaturization and integration grows.
Comprehensive Solutions

As the world’s leading electronic components distributor, WIN SOURCE has integrated over a million components from more than 3,000 manufacturers. The company’s comprehensive supply chain solutions include global sourcing, obsolete management, cost control, shortage management, alternative solutions, and excess inventory management. Whether facing part shortages, obsolescence, or regular demands, WIN SOURCE is equipped to meet the needs of clients from the EV industry to other high-demand sectors.

With modern warehouses established in Singapore, Hong Kong, Shenzhen, and the Philippines, WIN SOURCE has enhanced its logistics efficiency by 30%, speeding up its response to global markets. The company has also established offices in key global markets, including the USA, Canada, Brazil, the UK, Italy, Germany, Singapore, India, the Philippines, Japan, and South Korea, enabling it to rapidly meet customer needs and solidify its market position. Additionally, the recent opening of a new office in Bangalore, India, further strengthens WIN SOURCE’s global service network and optimizes its local market service capabilities, ensuring that global orders are processed quickly and accurately.

WIN SOURCE will participate in Electronica India 2024, held from September 11 to 13 at the India Expo Centre in Greater Noida, at booth H9.C75. At this event, the company will showcase its extensive product line and innovative solutions, applicable to a wide range of industries beyond just electric vehicles. WIN SOURCE warmly invites all industry colleagues, partners, and experts to visit their booth to discuss collaboration opportunities and exchange the latest insights on market dynamics and technological advancements. This exhibition will demonstrate WIN SOURCE’s ongoing innovation and adaptability in meeting market challenges and seizing industry opportunities, ensuring that clients receive the best quality product selections and services. Additionally, the company’s expert technical team will be available on-site to provide customized consultation services to assist clients with product selection and supply chain management challenges.

Conclusion

As technology continues to advance and the market expands, the development of electronic components will continue to play a pivotal role in supporting the EV revolution. Particularly in India, the market’s unique demands have spurred numerous innovative technologies, which are expected to be promoted and applied globally. The rapid development of India’s EV market presents unprecedented opportunities and challenges for the electronic components industry. Through continuous innovation and collaboration, the electronic components industry can effectively address these challenges and drive the future development of EV technology in India and globally.

Reprinted from WIN SOURCE ELECTRONIC-NEWS

© 2024 Win Source Electronics. All rights reserved. This content is protected by copyright and may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of Win Source Electronics.

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resonant flyback high voltage generator (not a zvs driver)

Reddit:Electronics - Fri, 09/06/2024 - 06:44
resonant flyback high voltage generator (not a zvs driver)

https://preview.redd.it/9qvdcn9024nd1.png?width=916&format=png&auto=webp&s=b2c185a945c4fd1e0479470f0633da8c0736bfb4

https://preview.redd.it/iqnzem9024nd1.png?width=736&format=png&auto=webp&s=a937b5f14b0fed90f2948330231a54c90ee4afa9

https://preview.redd.it/oxz16n9024nd1.png?width=4032&format=png&auto=webp&s=21c21f4dcce7fcea6ba0fec3afdead8116a902ca

https://preview.redd.it/678fgq9024nd1.png?width=3147&format=png&auto=webp&s=ddd474f5da27afb6066bb10b54e00e2e9f040640

https://preview.redd.it/i6c9ao9024nd1.png?width=4032&format=png&auto=webp&s=629da5bf2d5ac506c845bc73a58855d0500a0dcf

I recently made a high voltage generator that can either output around 20kv at 5mA if I use the resonant capacitor, or around 70kv at 0.4mA if I don’t use the resonant capacitor. The higher current mode, with the capacitor (image 1) creates a hot arc, whereas the lower current mode, without the capacitor, (image 2) can create much higher output voltages. I give the circuit 24V, constant current limited to 7.5A (the constant current part is very important, without the capacitor, it has to run at constant current 7.5 amps)

It uses a center tapped coil (5+5) turns on the core of the flyback and 2 MOSFETS (IRFP250N’s). The power side of the circuit (image 3) is very similar to the ZVS driver, although the rest is completely different. This uses a 555 timer to produce a square wave signal, which goes into 2 mosfet cascode drive circuits to drive the MOSFETS. The first cascade drive is fed directly by the signal coming out of the 555 timer, but the 2nd cascade drive is fed with an inverted version of the 555 output (using a BJT). That way, the second mosfet is completely inverted with the first. Using a resonant capacitor will make it extremely efficient, and give out relatively high currents, making a hot arc (image 1). This also makes it operate at ZVS, which makes its waveform practically pretty similar to the ZVS driver, although the huge difference is that this one is not self tuning/resonating, so it doesn’t rely on the resonant capacitor. Removing the resonant capacitor replaces the nice sine wave with inductive spikes. These inductive spikes, even though they only last for less than 1 microsecond, are around 1500V volts, so they can induce a super high voltage (but low current) on the output of the CRT flyback.

The actual build is shown in images 4 and 5.

submitted by /u/irf3205
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Researchers seek to revolutionize neurological disease treatment through intelligent biocomputing

News Medical Microelectronics - Fri, 09/06/2024 - 04:30
With newly awarded funding from the National Science Foundation, researchers at the University of California, Irvine and the Keck School of Medicine of USC will seek to revolutionize the treatment of neurological diseases through intelligent biocomputing.

Fuse failures

EDN Network - Thu, 09/05/2024 - 16:27

Fuses placed in series with the path of some current flow are protective of excessive current flow taking place in that current path. Although fuses are rated for clearing in terms of “I²t” where “I” is in amperes and “t” is time, my personal view is that such ratings are of dubious value from a protective calculation standpoint. To me, a fuse is either a “fast blow” device or a “slow blow” device at whatever amperage applies and which type of fuse to select isn’t always cut and dried, straight forward, or unambiguously obvious.

Some fuses contain their innards inside of glass which allows you to see the current carrying element and some do not. Where glass lets you see that element, actual fuse blowouts can be instructive in terms of the overload condition that led to that blowout and can perhaps lead you to reselecting that fuse’s rating or to fixing some other problem.

Figure 1 An intact fuse and two blown fuses: one from a moderate current overload and one from a massive current overload.

The middle case in the above figure is a fuse that is probably underrated for whatever application it has been serving. Using a somewhat higher I²t device might be a good idea.

However, the lower case shows a fuse that got hit with a blast of overload current that was way, way, way beyond reason and something elsewhere in the system in which this fuse played a role had just plain better be corrected.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices

ELE Times - Thu, 09/05/2024 - 14:29

ROHM and United Automotive Electronic Systems Co., Ltd., (UAES), a leading Tier 1 automotive supplier in China, have recently entered into a long-term supply agreement for SiC power devices.

Since 2015, ROHM and UAES have been collaborating and carrying out detailed technical exchanges on automotive applications utilizing SiC power devices. This partnership deepened in 2020 with the establishment of the SiC Joint Research Institute at the UAES headquarters in Shanghai, China. And in 2021 ROHM’s advanced SiC power devices and peripheral components were highly evaluated by UAES, resulting in ROHM being selected as a preferred supplier.

The close long-standing technical partnership has led to the production and adoption of numerous automotive products equipped with ROHM SiCs, such as onboard chargers and inverters for electric vehicles. SiC power devices play a crucial role in enhancing the efficiency and performance of a variety of systems, contributing to extending the cruising range and reducing battery size.

This long-term supply agreement ensures UAES sufficient access to SiC power devices to meet the growing demand for SiC-based inverter modules, which have been supplied to customers since November 2023. Going forward, both companies will deepen their collaboration, contributing to technological innovation in the automotive sector by accelerating the development of cutting-edge SiC power solutions for EVs.

Guo Xiaolu, Deputy General Manager, United Automotive Electronic Systems Co., Ltd.

‘The growing popularity of electric vehicles in the Chinese market has made the adoption and integration of power semiconductors like SiC increasingly important. ROHM, a world-renowned semiconductor manufacturer, is a pioneer and market leader in SiC power devices. Since 2015 we have been actively engaged in technical exchanges and highly value ROHM’s proposed solutions encompassing devices and peripheral components. Choosing ROHM as our long-term supplier of SiC chips guarantees a stable supply for future mass production. We appreciate ROHM’s past efforts and look forward to building a long-term collaborative relationship, with this agreement serving as a new starting point.’

Tsuguki Noma, Corporate Officer and Director of the Power Device Business Unit, ROHM

‘We are very pleased to have signed a long-term supply agreement with UAES, a valued partner with whom we have built a strong cooperative relationship over the years. As a leading Tier 1 manufacturer in China, UAES is at the forefront of advanced application development. To meet the need for SiC power devices that improve efficiency in the rapidly expanding electric vehicle market, ROHM has established a leading development and manufacturing system within the SiC industry. We believe that by working together, both companies can provide cutting-edge, high performance, high quality automotive applications. Moving forward, we will continue to drive technological innovation in electric vehicles together with UAES by offering power solutions centered on SiC.’

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Kore.ai Launches XO Automation, Contact Center AI Availability in AWS Marketplace

ELE Times - Thu, 09/05/2024 - 14:11

Kore.ai, a leader in enterprise conversational and generative AI platform technology, announced today that two of its products, Kore.ai XO Automation and Kore.ai Contact Center AI are now available in AWS Marketplace, a curated digital catalog that customers can use to find, buy, deploy, and manage third-party software, data, and services to build solutions and run their businesses.

XO Automation AI brings the power of LLM and Generative AI technology with a no-code interface to help enterprises design, build, train, test, deploy, and manage AI Chatbots for automating customer interactions across 40+ voice and digital channels. It enables omnichannel, multi-lingual experiences with support for more than 130+ languages.

Advanced RAG (Retrieval Augmented Generation) capabilities for generative answers, multiengine NLU powered by LLMs, and Responsible AI with guardrails allow enterprises to deploy highly secure and scalable generative AI and conversational AI capabilities to enhance customer experience, employee engagement, and operational efficiency.

Kore.ai’s Contact Center AI enhances customer service by deriving insights from conversations, automating tasks, and enabling contact centers to provide personalized, efficient experiences that ultimately increase overall customer satisfaction. Integrated with the Kore.ai Experience Optimization (XO) Platform, Contact Center AI enhances customer experiences by automating up to 80% of interactions, reducing wait times, and increasing efficiency. It features Agent AI, offering agents real-time advice, automated interaction summaries, coaching, and guided interactions through AI-guided playbooks.

AWS customers will now have access to Kore.ai XO Automation AI and Kore.ai Contact Center AI directly within the AWS Marketplace. Kore.ai provides AWS customers with the ability to streamline the purchase and management of XO Automation AI and Contact Center AI within their AWS Marketplace account. Both these solutions enable businesses to optimize customer service experiences, for which Kore.ai is recognized as a leader by leading analyst firms Gartner, Forrester, and G2, a peer-to-peer review platform.

“The world is fast moving toward an AI-first framework, and we want to provide the best advanced AI-powered solutions to every AWS customer through this initiative,” said Kore.ai CEO and Founder Raj Koneru. “Kore.ai enables businesses to put AI to work safely, responsibly, and at scale through its open architecture and generative and conversational AI platforms to achieve desired business outcomes. We envision our technology, along with the power of AWS, helping enterprises achieve transformative results.”

Kore.ai XO Automation and Contact Center AI are now generally available in the AWS Marketplace. For more information on Kore.ai XO Automation and Kore.ai Contact Center AI, please visit Kore.ai.

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Keysight Introduces Advanced 14-bit Precision Oscilloscope for General Applications

ELE Times - Thu, 09/05/2024 - 13:18
  • 14-bit analog-to-digital converter (ADC) oscilloscope delivers four times the signal resolution and half the noise floor of other general-purpose oscilloscopes
  • Instrument built from the ground up with a custom application-specific integrated circuit and a deep memory architecture to deliver fast, accurate measurements
  • Delivers the precision and accuracy needed to identify the smallest and most infrequent signal glitches during design debugging to accelerate time to market

Keysight Technologies, Inc. introduces the InfiniiVision HD3 Series, a 14-bit analog-to-digital converter (ADC) oscilloscope, delivering four times the signal resolution and half the noise floor of other general-purpose oscilloscopes. Newly designed and built from the ground up with a custom application-specific integrated circuit (ASIC) and deep memory architecture, the HD3 Series enables engineers to quickly detect and fix signal issues in a variety of applications.

Device and component designs are becoming more complex, using signals that are increasingly smaller. To ensure product quality and maximize product yields, engineers must troubleshoot designs by tracing multiple signals at once to identify the smallest signal errors that indicate design flaws and hardware defects. Engineers need an oscilloscope that can measure the smallest and most infrequent signal glitches beyond the noise to correct product issues.

The new Keysight HD3 Series oscilloscope meets this challenge by giving digital designers and engineers the highest vertical resolution through a 14-bit ADC and a 50 µVRMS low noise floor that can detect the smallest signal anomalies. Covering bandwidths between 200 MHz and 1 GHz, the HD3 Series accelerates digital debugging and time to market with:

  • Unparalleled precision – Delivers 14-bit ADC resolution and low noise floor in combination with an uncompromised 1.3 M waveforms / second update rate for all measurements, enabling quick and accurate debugging.
  • Built on new technology – Features a custom-built ASIC that gives engineers higher sample rates and memory under typical testing conditions, an uncompromised waveform update rate, high vertical resolution, and hardware-based functions such as mask, zone, and serial decode.
  • Deep memory – Captures longer time spans at full sample rate for better measurement / analysis results.
  • All-new interface – Offers an all-new user interface enabling versatile functionality, including full ADC and vertical resolution on every channel, several bandwidth limiting options, HD mode support, and custom measurement thresholds.
  • Full test automation – Introduces automatic fault hunter software for general debugging, which analyzes glitches, slow edges, and runts while engineers complete other tasks. Engineers can also automate measurements with a large selection of serial bus protocols and application software.
  • Instant software upgrades – Provides immediate bandwidth, memory, and feature upgrades through software licensing, enabling designers to purchase options they need now and upgrade as their designs evolve in the future without having to return the instrument to the factory.

Robert Saponas, Vice President and General Manager, Keysight Digital Photonics Center of Excellence, said: “Recognizing the need of engineers for quick and precise measurements for a variety of applications, we built the InfiniiVision HD3 from the ground up to deliver an exceptionally precise general use oscilloscope. With a custom ASIC, 14-bit ADC, and half the noise floor, the HD3 Series oscilloscope delivers the precision and accuracy needed to identify the smallest and most infrequent signal glitches during design debugging to accelerate time to market.”

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Ultrafast digitizers used to identify neutrinos in huge international project

ELE Times - Thu, 09/05/2024 - 13:01

ADC cards by Spectrum Instrumentation used for largest liquid-neutrino-detector of mankind

Until recently, neutrino particles were thought to have no mass but now the theory is that they actually have mass with a very tiny value as well as coming in three different ‘flavours’ which they can switch back and forth. Often called ghost particles, studying them is very difficult as they typically pass through most normal matter unimpeded and undetected, so specialist detectors have to be built to hunt for them. The latest one is called JUNO, located 750m below ground in Jiangmen, China, and it is made possible by 17 different countries with 730 scientists working in 74 Universities and national laboratories, that have joined forces on this 400-million-euro project. To develop the core part of the detector, the liquid scintillator, ultrafast digitizer cards by Spectrum Instrumentation are used.

JUNO is precisely positioned between eight existing nuclear reactors that provide a source of neutrinos for study.  At its heart is a gigantic, highly transparent, acrylic sphere with an inner diameter of 34.5 m, filled with 20,000 tons of a specially developed oil-like substance. This liquid scintillator creates photons when a neutrino interacts with it, and it is encased in a large 35,000 tons water pool. The photons are detected by an array of ca. 45,000 photo multiplier tubes (PMTs) that surround the sphere. The teams at the Technical University of Munich (TUM) and at the Johannes Gutenberg University in Mainz are using M4i.2212 digitizer cards by Spectrum Instrumentation in their high-precision, lab-scale experiments to characterize the liquid scintillators, which require advanced data acquisition. When the JUNO detector is commissioned at the end of 2024, it will be the largest, liquid neutrino detector built by mankind. The detector will drastically enhance our knowledge about interactions and properties of these elusive ghost particles.

Neutrino detection

The central acrylic sphere contains the liquid scintillator surrounded by a layer of water. Both have to be ultra-pure as the smallest amount of contamination could contain a radioactive material. During construction, workers had to wear two pairs of gloves as even the sweat from a fingerprint could contaminate and ruin the entire project. The detector sits in a specially dug space that is 750 m below ground to shield it from ambient radiation.

When a neutrino interacts with the liquid scintillator (LS), it deposits the energy of the interaction with the molecules of this substance. The enormous light output of the LS (typically > 10.000 Photons / MeV) ensures a precise determination of the deposited energy. It would be highly beneficial if the direction of the incident neutrino could also be reconstructed. Here, the faint but directional Cherenkov light from neutrino’s initial passage through the water is paired to give physicists this information.

The aim of the current development of liquid scintillators in Munich and Mainz is to separate the fast but faint Cherenkov light from the dominant scintillation light in order to enable simultaneous energy and directional reconstruction. Therefore, the team under Dr. Hans Steiger constructed several, precision, table-top experiments with enhanced light-collection capabilities and time-resolution.

Pic2_Light-emmission-diagram_(web)Typical light emission kinematics for a slow liquid scintillation mixture. The Cherenkov light (red line) in form of a sharp peak in time is followed by the slower scintillation light decay (green line).

“We chose the digitizer cards from Spectrum as they provide us with state-of-the-art performance but, unlike rival offerings, they are not expensive or custom creations,” said Dr. Hans Steiger, who is leading the project. “Spectrum’s modular approach means that we could specify exactly what we needed the cards to do so we were not having any compromises or wasting money on unwanted features. I love the fact that they are a standard PCIe product so that we can expand the system on a standard computer chassis as we received more funds. As a university taking part in major long-term international projects, we need to have reliable parts and Spectrum’s five-year warranty gives us peace of mind.”

JUNO results also push astronomy research

Beyond the work on event reconstruction, the team contribute a calibration project to JUNO. This characterizes the detector material using radioactive gamma and neutron sources where the energy and incident direction are pre-determined. “Our characterizations of the liquid scintillators are only possible because of the ultrafast digitizer cards that enable us to work with timeframes that are measured in picoseconds. Also, the dynamic range of 5V is much better than rivals that are typically 1V which means they can easily manage the 3V pulses in our PMTs that we encounter,” Meishu Lu, a PhD student in the TUM group pointed out. And Manuel Böhles working in Mainz added, “Spectrum has been really supportive in helping us working out the best solutions for our project and helping resolve any issues that we encounter with a phone call directly with one of their engineers. It’s great that they are committed to supporting fundamental research in many universities such as ours.”

Pic3_Spectrum-digitizer_(web)The M4i.2212-x8 PCIe digitizer by Spectrum Instrumentation with 1.25 GS/s sampling speed on 4 channels.

The diagram shows the first pulse from the Cherenkov radiation followed by the scintillation signal that gives the energy information. This happens in less than two nanoseconds. By combining this information, the type of particle can be determined and where it came from. This could be from one of the Chinese reactors, the sun, the heart of the earth or deep space. “We have never been able to know exactly where a neutrino was coming from in scintillation detectors before, so this opens up whole new areas of research,” explained Dr. Steiger. “If, for example, a dying star, or so-called supernova, emits large amounts of neutrinos in the sky, we are now able not only to see the neutrinos but also reconstruct with high precision, the point in the sky, where this explosion took place. Effectively we now have a telescope to look into these different neutrino sources to better understand the processes. By detecting light over the entire spectrum, gravitational waves and now also neutrinos with high statistics, energy resolution and directionality start a new era of multi-messenger astronomy.”

The post Ultrafast digitizers used to identify neutrinos in huge international project appeared first on ELE Times.

u-blox and Wireless Logic Ltd announce strategic collaboration to offer IoT connectivity services and eSIM solutions

ELE Times - Thu, 09/05/2024 - 12:20

u-blox, a global provider of leading positioning and wireless communication technologies and services, and Wireless Logic Ltd, Europe’s leading IoT connectivity platform provider, are pleased to announce a strategic partnership aimed at enhancing the capabilities of IoT devices through Wireless Logic’s IoT network, Conexa, and u-blox’s advanced cellular modules.

This collaboration will empower businesses and developers by providing seamless, robust, and scalable connectivity solutions, addressing the growing demand for reliable IoT deployments across various industries, including automotive, industrial, healthcare, and smart cities.

Key highlights of the collaboration:
  • Enhanced IoT connectivity: By integrating Wireless Logic’s industry-leading IoT connectivity network, Conexa, into select u-blox cellular modules, customers will benefit from superior network reliability, extensive global coverage, and the flexibility to switch between multiple mobile networks via eSIM without the need for physical SIM card changes.
  • Scalability and flexibility: The combined offering will guarantee unparalleled scalability and flexibility, making it easier for businesses to deploy IoT solutions at scale. The ability to manage and monitor connectivity through Wireless Logic’s intuitive platform will provide users with greater control and visibility over their IoT deployments.
  • Accelerated time-to-market: The combination of Wireless Logic’s connectivity services with u-blox’s cellular modules will streamline the development process for IoT devices, reducing time-to-market and enabling faster deployment of innovative solutions.
Executive quotes:

Martin Leach, Head of u-blox Cellular Business Unit, stated, “We are excited to partner with Wireless Logic to offer their IoT connectivity services with our cellular modules. Their market leading eSIM solutions and technical expertise aligns with our commitment to delivering state-of-the-art products that meet the evolving needs of our customers. By combining our technologies, we are enhancing the value proposition for IoT deployments, providing unmatched connectivity, security, and flexibility.”

John Dillon, Managing Director of Product and Marketing of Wireless Logic Ltd, commented, “This partnership with u-blox marks a significant milestone in our mission to simplify IoT connectivity. As experts in cellular connectivity, we are well-equipped to support u-blox’s global customers with all their cellular needs. By combining our connectivity services with u-blox’s high-performance cellular modules, we are enabling businesses to deploy IoT solutions more efficiently and cost-effectively. We look forward to seeing the innovative devices and applications that our combined offering will create.”

The post u-blox and Wireless Logic Ltd announce strategic collaboration to offer IoT connectivity services and eSIM solutions appeared first on ELE Times.

Applied Ventures and ITIC-Taiwan join Wise-integration’s Series B funding round

Semiconductor today - Thu, 09/05/2024 - 12:16
Fabless company Wise-integration of Hyeres, France — which was spun off from CEA-Leti in 2020 and designs and develops gallium nitride (GaN) integrated circuits and digital-control technologies for power supplies — says that the investment fund Applied Ventures-ITIC Innovation Fund (AVITIC) has joined its Series B funding round...

NUBURU partners with Ohio State’s CDME to showcase blue lasers in additive manufacturing

Semiconductor today - Thu, 09/05/2024 - 10:45
NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — has announced a partnership with the Center for Design and Manufacturing Excellence (CDME) at Ohio State University in Columbus, Ohio. The firm received a purchase order for its BlueScan solution, which includes a BL-250 laser, scanner and optics. This technology will be installed within a powder bed fusion system at CDME’s development lab...

Navitas Gen-3 Fast SiC MOSFETs in D2PAK-7L and TOLL surface-mount packages

Semiconductor today - Wed, 09/04/2024 - 19:09
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has released a portfolio of third-generation automotive-qualified SiC MOSFETs in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages...

Brute force mitigation of PWM Vdd and ground “saturation” errors

EDN Network - Wed, 09/04/2024 - 17:33

An excerpt from Christopher Paul’s “Parsing PWM (DAC) performance: Part 1—Mitigating errors”:

 “I was surprised to discover that when an output of a popular µP I’ve been using is configured to be a constant logic low or high and is loaded only by a 10 MΩ-input digital multimeter, the voltage levels are in some cases more than 100 mV from supply voltage VDD and ground…Let’s call this saturation errors.”

Wow the engineering world with your unique design: Design Ideas Submission Guide

The accuracy of PWM DACs depends on several factors, but none is more important than their analog switching elements’ ability to reliably and precisely output zero and reference voltage levels in response to the corresponding digital states. Sometimes however, as Christopher Paul observes in the cited design idea (Part 1 of a 4-part series), they don’t. The mechanism behind these deviations isn’t entirely clear, but if they could be reliably eradicated, the impact on PWM performance would have to be positive. Figure 1 suggests a (literally) brute-force fix.

Figure 1 U1 is a multi-pole (e.g., 74AC04 hex inverter) PMW switch where op-amp A1 forces switch zero state to accurately track 0 = zero volts, op-amp A2 does the job for 1 = Vdd.

U1 pin 5’s connection to pin 14 drives pin 6 to logic 0, sensed by A1 pin 6. A1 pin 7’s connection to U1 pin 7 forces the pin 6 voltage to exactly zero volts, and thereby forces any U1 output to the same accurate zero level when the associated switch is at logic 0.

Similarly, U1 pin 13’s connection to pin 7 drives pin 12 to logic 1, sensed by A2 pin 2. A2 pin 1’s connection to U1 pin 14 forces the pin 12 voltage to exactly Vdd, and thereby forces any U1 output to the same accurate Vref level when the associated switch is at logic 1.

Thus, any extant “saturation errors” are forced to zero, regardless of the details of where they’re actually coming from.

Vdd will typically be c.a. 5.00V. And V+ and V- can come from a single 5-V supply via any of a number of discrete or monolithic rail boost circuits. Figure 2 is one practical possibility.

Figure 2 A practical source for V+ and V- set R1 and R2 = 200k for ∆ = 1volt.

The Figure 2 circuit was originally described in “Efficient digitally regulated bipolar voltage rail booster”.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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