Новини світу мікро- та наноелектроніки

Rail transportation plays a crucial role in many modern transportation networks. It’s essential to ensure that rail transportation is safe and efficient, which requires constant improvements. The integration of industrial computers in railway applications has been a significant development contributing to railway safety through the railway detection system, passenger convenience through passenger information display systems (PIDS), and personal safety through in-car surveillance. Cincoze’s latest addition to the Rugged Computing – DIAMOND product line, the efficient and compact DX-1200 embedded industrial computer, is an excellent choice for these railway computing applications due to its high efficiency, stable operation, wide temperature support, expandability, and rich I/O.

Railway detection systems that use real-time monitoring to detect situations and events, ensuring safe and smooth operations. It provides the driver with control suggestions and relays data to the Operation Control Center (OCC) for vehicle scheduling, equipment monitoring, and fault handling. The DX-1200 provides the required performance, graphics processing, and data transmission for these tasks with a 12th gen Intel® Alder Lake-S processor that has efficient cores for multi-tasking and performance cores for complex data analysis. The DX-1200 supports up to 64GB of DDR5 4800MHz memory, with ECC error correction technology that detects and corrects errors in real time, ensuring stability and reliability. It also includes the UHD 770 graphics chip with Intel® Xe architecture for powerful graphics processing, providing high-res images and visual data analysis. Various I/O interfaces, including 10GbE LAN or USB 3.2, provide high-speed data delivery.

The two primary in-car applications are the Passenger Information Display System (PIDS) and the surveillance system. PIDS connects with the control center to gather real-time train arrival and departure information, train numbers, operation status, and other useful information. The in-car surveillance system uses highly accurate cameras and sensors to monitor the environment, ensuring a safe and comfortable ride for passengers. The DX-1200 supports up to 8x 1Gbps LAN with optional PoE, providing data transmission and power through a single cable, reducing the complexity of wiring. Optional M12 connectors (A-coded and X-coded) are also available to meet the requirements of railway computing applications. Wireless connectivity is covered by DX-1200’s 1x M.2 Key E slot and 2x Mini PCIe slots that support add-on cards for WiFi, GNSS, 4G, and Bluetooth.

Safety is the top priority in rail transportation. The DX-1200 has passed EU EN 50121-3-2 (railway EMC) and EN 45545-2 fire protection standards, providing evidence of its safety in rail transportation. In addition to safety, it boasts a robust design, including wide temperature (-40 – 70°C) and wide voltage (9 – 48 VDC) support, and overvoltage, overcurrent and ESD protection. The DX-1200 has passed the US military specification MIL-STD-810G, showing excellent performance in withstanding shock and vibration in the railway environment.

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ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5’’ (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60Hz, dual 2.5G LAN, and dual storages with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

The NUC BOX-N97 Mini PC is compact in size, measuring 117.5 x 110.0 x 47.85mm (L x W x H) with fanned barebone design, offering a rich selection of I/Os and expansion slots for streamlined versatility. Based on Intel Processors N97 (Alder Lake-N), it guarantees CPU and graphics performance. For Ethernet connectivity, the NUC BOX-N97 provides dual 2.5 Gigabit LAN, and one M.2 (Key E, 2230) bundled with AMD RZ608 Wi-Fi 6E Module for wireless connection, plus diverse I/Os, including five USB 3.2 Gen2 (two Type C and three Type A), one audio and microphone jack. The NUC BOX-N97 also provides excellent visual capabilities, supporting triple-display with HDMI 2.0b and DP 1.4a (through Type-C) up to 4096×2160@60Hz. The system offers dual storages with one M.2 (Key M, 2242/2260/2280), one SATA 3.0, and supports one 260-pin SO-DIMM DDR4 3200MHz up to 16GB. In addition, the NUC BOX-N97 comes with a 19V/65W power adaptor and VESA mounting bracket for space-saving installation, with TPM 2.0 onboard for enhanced security. The NUC BOX-N97 is the choice designed to meet the advancement of your needs in home entertainment, office productivity, business, and embedded applications.

The fanless iBOX-N97, based on Intel Processors N97 (Alder Lake-N), is conveniently sized with aluminum housing, measuring 135 x 110 x 44.5mm (L x W x H). The Series supports a single 260-pin SO-DIMM DDR4 3200MHz up to 16GB of memory. For high-speed connectivity, the Series features dual Realtek 2.5 Gigabit LAN, plus one M.2 (Key E, 2230) slot with PCIex1 and USB 2.0. It offers a total of six USB3.2 Gen 2 ports (two Type C and four Type A), as well as dual storages with M.2 (Key M, 2242/2260/2280) and SATA 3.0. Additionally, the iBOX-N97 provides an enhanced visual experience with support for triple-display through two HDMI 2.0b and two DP 1.4a (from Type C), with a maximum resolution of up to 4096×2160@60Hz. The Series is equipped with various mounting options, including VESA mount, wall mount, and DIN rail to offer flexibility for diverse applications. Other key features also include 19V/65W power adaptor, and TPM 2.0 onboard for enhanced cybersecurity. These features combine to create the all-inclusive option suitable for embedded, industrial, and edge computing utilizations.

Additional releases based on the Intel Processors N97 (Alder Lake-N) also include the Motherboard Series, encompassing various form factors, including the NUC-N97, Pico-ITX (SOM-P104), the SBC 3.5 inch models (SBC-260 and SBC-261), and Mini-ITX models (IMB-1005, IMB-1006, IMB-1007). These models offer enhanced performance in both DDR4 and DDR5 configurations, and feature support for diverse industrial-centric I/Os and expandability.

The NUC-N97, adhering to NUC form factor specifications with measuring 4.09 x 4.02 inch is designed for advanced computing capabilities with expanded I/Os and expansions, including two 2.5 Gigabit LAN for solid connectivity, one M.2 (Key E, 2230) for Wi-Fi, six USB 3.2 Gen2, two USB 2.0, and one COM. Great visuals are provided with support of triple-display over HDMI 2.0b and DP 1.4a (from Type C), holding maximum resolutions up to 4096×2160@60Hz. Moreover, dual storages include one M.2 (Key M, 2242/2260/2280), and one SATA 3.0 for SSD with one 260-pin SO-DIMM DDR4 3200MHz up to 16GB of memory.

Additional motherboards that support DDR4 3200 MHz memory and triple-display, including IMB-1005 and IMB-1006, featuring dual 2.5G LAN, while SBC-260 supports one 2.5G and one 1G LAN ports. The DDR5 4800MHz configurations include models like SOM-P104, which comes with 2.5 Gigabit LAN, as well as SBC-261 and IMB-1007 both featuring dual 1 Gigabit LAN, all supporting triple displays. The newly releases products are equipped with Intel Processor N97 (Alder Lake-N), offering improved graphics capability, breakthrough memory up to DDR5, and rich I/O features to improve the customer’s experience over prior generation, fulfilling the demands of various IoT edge applications.

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Four senior executives at the French semiconductor outfit Ommic SAS are currently under investigation for sharing confidential technology with entities in China and Russia while skirting sanctions and export controls. Two French and two Chinese citizens working at the company have been placed under formal investigation since March this year after the allegation surfaced in the French newspaper Le Parisien.

The French industry minister Roland Lescure said that when the government warns about the risk of industrial espionage, it’s not like playing James Bond. Ommic’s technology portfolio includes gallium nitride (GaN) semiconductors, widely used in defense and aerospace electronics for their ability to operate on high voltages and sustain high temperatures.

Ommic, located in Limeil-Brévannes, France, 20 km outside Paris, has around 100 employees, and it focuses on metal organic chemical vapor deposition (MOCVD) epitaxial growth, wafer processing and fabrication, and monolithic microwave integrated circuits (MMICs) specializing in gallium arsenide (GaAs) and GaN semiconductors.

Le Parisien, which first reported on the case, also discovered that a Beijing-based Chinese businessman with ties to China’s defense industry had bought 94% of Ommic’s shares via a French-based investment fund in 2018. French authorities have stripped the majority stake of this Chinese investor while temporarily placing the company under state control before its sale to Macom.

The Lowell, Massachusetts-based chip company, which designs and manufactures RF, microwave, analog and mixed-signal, and optical semiconductors, paid $42.5 million to acquire Ommic in May 2023. “We look forward to building upon the existing team’s expertise in material science, semiconductor wafer processing and millimeter-wave MMIC design,” said Macom’s president and CEO Stephen G. Daly.

According to news reports, investigators have uncovered nearly $13 million worth of suspected technology exports. Here, the company’s French manager is suspected of personally delivering chips to Russian clients. Moreover, semiconductors products are suspected to be exported to armament manufacturers in China with the help of forged paperwork.

The semiconductor technology restrictions and export controls have taken a new turn with this Bloomberg news report about the transfer of French technology to China, especially when it’s about Ommic’s wafer processing technology. Semiconductor wafer processing and emerging technologies like GaN materials are critical to China’s ambitions of cultivating a robust chip industry.

Related Content

• China Struggles to Crack Chip Manufacturing
• EU Imposes Restrictions on Chip Exports to Russia
• U.S. Ban on Huawei Seen Widening China Chip War
• Commerce Adds Limits on Exports of Chip Tech to China
• U.S. Chip Sanctions ‘Put Temporary Checkmate on China’

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Asahi Kasei has begun licensing of technology for the design and manufacture of lithium-ion capacitors (LiCs) based on its proprietary lithium pre-doping technology1. The novel proprietary doping method enables LiCs to be manufactured at lower cost with generally available materials and equipment which are used for manufacturing lithium-ion batteries (LiBs), while enabling the design and manufacture of LiCs with increased capacity and improved input/output performance.

The licensing includes not only Asahi Kasei’s intellectual property related to LiC technology, but also technical expertise such as cell design and manufacturing with pilot equipment.  By licensing its technology, Asahi Kasei expects to support licensees around the world to significantly reduce LiC development times and achieve low-cost LiC manufacture utilizing existing equipment.

Demand for energy storage devices is forecasted to continue rising due to the spread of electric mobility and increased use of renewable energy.  The LiC is a next-generation energy storage device that uses the same material as an electric double layer capacitor (EDLC) for the cathode and the same material used as a LiB for the anode.  As LiCs have higher input/output characteristics than LiBs, they are suited to fields where instantaneous power is needed, and can be quickly recharged.  Also featuring long cycle life and high safety, LiCs are expected to be used in mobility applications such as electric trams and buses which charge at each stop instead of using power from overhead lines.

In the growing field of energy storage systems (ESS) for renewable energy such as solar and wind, it is possible to extend the service life of LiBs by using LiCs in conjunction to reduce the LiB charge/discharge load.  This is expected to reduce both running costs and environmental impact through less frequent replacement of LiBs, generating less waste.

The conventional LiC manufacturing process requires expensive materials for pre-doping, such as perforated foil and lithium metal foil.  Furthermore, as lithium metal is highly reactive and hazardous, additional costs are incurred to maintain a safe working environment.

Asahi Kasei developed a low-cost pre-doping method using inexpensive lithium carbonate as the source of lithium ions, eliminating the need for expensive materials such as perforated foil and lithium metal foil.  With this novel doping method, lithium carbonate is included in the cathode and pre-doping is performed at initial charging, when nearly all of the lithium carbonate decomposes, and lithium ions transfer to the anode.  This not only allows the manufacture of LiCs using materials and equipment similar to those used in the manufacture of LiBs, but also enables capacity and input/output performance to be raised by a factor of 1.3 or more (compared to Asahi Kasei’s conventional LiCs).

Asahi Kasei has already licensed this technology, and will continue offering it to other licensees in order to support further adoption and application development of the LiC as a next-generation energy storage device which contributes to the world’s sustainability.

1 Lithium ions are pre-doped in the anode, keeping the anode potential lower than the electrolytic solution potential, allowing a larger energy density due to improved withstand voltage and increased capacitance of the capacitor itself compared to conventional EDLC.

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Within the average large enterprise, sensitive data is being shared to generative AI apps every hour of the working day

Netskope, a leader in Secure Access Service Edge (SASE), today unveiled new research showing that for every 10,000 enterprise users, an enterprise organization is experiencing approximately 183 incidents of sensitive data being posted to the app per month. Source code accounts for the largest share of sensitive data being exposed.

The findings are part of Cloud & Threat Report: AI Apps in the Enterprise, Netskope Threat Labs’ first comprehensive analysis of AI usage in the enterprise and the security risks at play. Based on data from millions of enterprise users globally, Netskope found that generative AI app usage is growing rapidly, up 22.5% over the past two months, amplifying the chances of  users exposing sensitive data.

Netskope found that organizations with 10,000 users or more use an average of 5 AI apps daily, with ChatGPT seeing more than 8 times as many daily active users as any other generative AI app. At the current growth rate, the number of users accessing AI apps is expected to double within the next seven months.

Over the past two months, the fastest growing AI app was Google Bard, currently adding users at a rate of 7.1% per week, compared to 1.6% for ChatGPT. At current rates, Google Bard is not poised to catch up to ChatGPT for over a year, though the generative AI app space is expected to evolve significantly before then, with many more apps in development.

Netskope found that source code is posted to ChatGPT more than any other type of sensitive data, at a rate of 158 incidents per 10,000 users per month. Other sensitive data being shared in ChatGPT includes regulated data- including financial and healthcare data, personally identifiable information – along with intellectual property excluding source code, and, most concerningly, passwords and keys, usually embedded in source code.

“It is inevitable that some users will upload proprietary source code or text containing sensitive data to AI tools that promise to help with programming or writing,” said Ray Canzanese, Threat Research Director, Netskope Threat Labs. “Therefore, it is imperative for organizations to place controls around AI to prevent sensitive data leaks. Controls that empower users to reap the benefits of AI, streamlining operations and improving efficiency, while mitigating the risks are the ultimate goal. The most effective controls that we see are a combination of DLP and interactive user coaching.”

Netskope Threat Labs is currently tracking ChatGPT proxies and more than 1,000 malicious URLs and domains from opportunistic attackers seeking to capitalize on the AI hype, including multiple phishing campaigns, malware distribution campaigns, and spam and fraud websites.

Blocking access to AI related content and AI applications is a short term solution to mitigate risk, but comes at the expense of the potential benefits AI apps offer to supplement corporate innovation and employee productivity. Netskope’s data shows that in financial services and healthcare – both highly regulated industries – nearly 1 in 5 organizations have implemented a blanket ban on employee use of ChatGPT, while in the technology sector, only 1 in 20 organizations have done likewise.

“As security leaders, we cannot simply decide to ban applications without impacting on user experience and productivity,” said James Robinson, Deputy Chief Information Security Officer at Netskope. “Organizations should focus on evolving their workforce awareness and data policies to meet the needs of employees using AI products productively. There is a good path to safe enablement of generative AI with the right tools and the right mindset.”

In order for organizations to enable the safe adoption of AI apps, they must center their approach on identifying permissible apps and implementing controls that empower users to use them to their fullest potential, while safeguarding the organization from risks. Such an approach should include domain filtering, URL filtering, and content inspection to protect against attacks. Other steps to safeguard data and securely use AI tools include:

• Block access to apps that do not serve any legitimate business purpose or that pose a disproportionate risk to the organization.
• Employ user coaching to remind users of company policy surrounding the use of AI apps.
• Use modern data loss prevention (DLP) technologies to detect posts containing potentially sensitive information.

In conjunction with the report, Netskope announced new solution offerings from SkopeAI, the Netskope suite of artificial intelligence and machine learning (AI/ML) innovations. SkopeAI leverages the power of AI/ML to conquer the limitations of complex legacy tools and provide protection using AI-speed techniques not found in other SASE products.

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First in industry to launch 8-high 24GB HBM3 Gen2 with bandwidth over 1.2TB/s and superior power efficiency enabled by advanced 1β process node

Micron Technology, Inc. (Nasdaq: MU), today announced it has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s, which is up to a 50% improvement over currently shipping HBM3 solutions. With a 2.5 times performance per watt improvement over previous generations, Micron’s HBM3 Gen2 offering sets new records for the critical artificial intelligence (AI) data center metrics of performance, capacity and power efficiency. These Micron improvements reduce training times of large language models like GPT-4 and beyond, deliver efficient infrastructure use for AI inference and provide superior total cost of ownership (TCO).

The foundation of Micron’s high-bandwidth memory (HBM) solution is Micron’s industry-leading 1β (1-beta) DRAM process node, which allows a 24Gb DRAM die to be assembled into an 8- high cube within an industry-standard package dimension. Moreover, Micron’s 12-high stack with 36GB capacity will begin sampling in the first quarter of calendar 2024. Micron provides 50% more capacity for a given stack height compared to existing competitive solutions. Micron’s HBM3 Gen2 performance-to-power ratio and pin speed improvements are critical for managing the extreme power demands of today’s AI data centers. The improved power efficiency is possible because of Micron advancements such as doubling of the through-silicon vias (TSVs) over competitive HBM3 offerings, thermal impedance reduction through a five-time increase in metal density, and an energy-efficient data path design.

Micron, a proven leader in memory for 2.5D/3D-stacking and advanced packaging technologies, is proud to be a partner in TSMC’s 3DFabric Alliance and to help shape the future of semiconductor and system innovations. As part of the HBM3 Gen2 product development effort, the collaboration between Micron and TSMC lays the foundation for a smooth introduction and integration in compute systems for AI and HPC design applications. TSMC has received samples of Micron’s HBM3 Gen2 memory and is working closely with Micron for further evaluation and tests that will benefit customers’ innovation for the next-generation HPC application.

The Micron HBM3 Gen2 solution addresses increasing demands in the world of generative AI for multimodal, multitrillion-parameter AI models. With 24GB of capacity per cube and more than 9.2Gb/s of pin speed, the training time for large language models is reduced by more than 30% and results in lower TCO. Additionally, the Micron offering unlocks a significant increase in queries per day, enabling trained models to be used more efficiently. Micron HBM3 Gen2 memory’s best-in-class performance per watt drives tangible cost savings for modern AI data centers. For an installation of 10 million GPUs, every five watts of power savings per HBM cube is estimated to save operational expenses of up to $550 million over five years.

“Micron’s HBM3 Gen2 technology was developed with a focus on unleashing superior AI and high-performance computing solutions for our customers and the industry,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “One important criterion for us has been the ease of integrating our HBM3 Gen2 product into our customers’ platforms. A fully programmable Memory Built-In Self Test (MBIST) that can run at the full specification pin speed positions us for improved testing capability with our customers, creates more efficient collaboration and delivers a faster time to market.”

“At the core of generative AI is accelerated computing, which benefits from HBM high bandwidth with energy efficiency,” said Ian Buck, vice president of Hyperscale and HPC Computing at NVIDIA. “We have a long history of collaborating with Micron across a wide range of products and are eager to be working with them on HBM3 Gen2 to supercharge AI innovation.”

Micron developed this breakthrough product by leveraging its global engineering organization, with design and process development in the United States, memory fabrication in Japan and advanced packaging in Taiwan. Today’s announcement is another milestone in Micron’s technology leadership in the industry. Micron previously announced its 1α (1-alpha) 24Gb monolithic DRAM die-based 96GB DDR5 modules for capacity-hungry server solutions and today introduced the1β 24Gb die-based 24GB HBM3 offering. In the first half of calendar 2024, the company plans to make available its 1β 32Gb monolithic DRAM die-based 128GB DDR5 modules. These offerings demonstrate Micron’s leading-edge technology innovations for AI servers.

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The advent of 5G is poised to revolutionize industrial automation, propelling it to unprecedented levels. This next generation of cellular communications technology will significantly enhance the trend of integrating a factory’s operational technology (OT). It encompasses its machinery, control systems, power infrastructure, and local and remote control software – with its information technology (IT) systems, including the communication network, enterprise resource planning (ERP) system, cloud services, and more.

Sakshi Jain, Sr. Sub Editor-ELE Times had an opportunity to interact with Ludger Boeggering, Senior Principal Segment Manager EMEA Energy & Automation, u-blox.  He talked about the industrial automation that will become more intricate and robust with the implementation of 5G technology. Excerpts.

Ludger Boeggering: From a technology point of view and according to 3GPP, the difference lies in the control logic. In the case of a non-standalone (NSA) 5G network, a 4G/LTE infrastructure is necessary to control the communication. While a standalone (SA) 5G network, on the other hand, is pure 5G implementation. From a user’s point of view, this means that implementation of a private 5G network (Non-Public Network, or NPN) based on SA is significantly leaner and costs less effort. From an application point of view, it is to be expected that an SA network will enable higher availability and reliability, as well as lower turnaround-time, especially in the context of NPNs.

Ludger Boeggering: Since 5G is by definition an umbrella term for a wide range of technologies (eMBB, uRLLC, eMTC and RedCap), it will also enable a wide range of applications. To name just a few, predictive maintenance, environmental monitoring, service and configuration, connected tools as well as safe connected worker benefit from functions defined in eMTC and RedCap. eMTC is already available with LTE-M and NB-IoT and is being consistently developed further by 3GPP.

Furthermore, applications such as industrial assembly solutions, process automation control, human machine interface (HMI) and aiding via augmented reality, but also factory logistics, mobile robotics, cobots and AGV will benefit from the capabilities of RedCap and uRLLC. Above all, the focus here is on reliable response times with sufficient bandwidth and cost-efficient products.

The technology will be used across all relevant industry verticals in the coming years, for example manufacturing (machine, aerospace, automotive, semiconductors), chemical and petrochemical, pharmaceutical, oil and gas, energy and utilities, water and waste water treatment. This is certainly due to the technology itself, but also to the regulatory framework and the dedicated use of spectrum.

Ludger Boeggering: We first need to take the different characteristics of 5G into account.

In use cases that require high reliability and availability, low latency plays an important role. 5G offers by design significantly lower latency and higher availability compared to previous generations of mobile networks.

5G technology enables network slicing, which creates virtual networks tailored to specific applications or services. This allows industrial automation to have dedicated slices that are optimized for their specific needs and it also ensures high reliability and performance.

Edge computing will grow in importance in the future. 5G networks can use edge computing, which brings data processing closer to the devices and sensors. This reduces the time and energy required to transmit data to remote data centers, resulting in faster response times and improved performance in industrial automation processes.

And, last but not least, 5G supports mMTC, which allows a large number of devices to be connected simultaneously. In industrial automation, this means that numerous sensors, actuators and devices can be connected within the same network, improving overall efficiency in terms of utilisation and investment.

Ludger Boeggering: The technology itself has little impact on these parameters. What matters is the implementation as a whole system. 5G allows secure communication environments to be created with an allocated frequency spectrum. Solutions based on wireless technologies are also much easier and more flexible to integrate into an industrial environment. This means that process data can be collected and analyzed in a more targeted manner. With these possibilities, one can create a digital twin and/or ensure a reliable status monitoring, which allows for preventive actions to be taken at any time. With smart use of this technology, processes can then be reliably executed and clever-as-a-service models can be built. This reduces downtime to a necessary minimum, avoids misproduction, and ensures that employees and materials are allocated in a targeted manner.

Ludger Boeggering: 5G is another building block for mastering the challenges of implementing digitalization. Essentially, it helps to implement automation faster and promotes the desire for more flexibility. Key elements are availability and reliability

Ludger Boeggering: Basically, I would first like to stress out that technology always follows the use case problem. The strengths of 5G also lie in its weaknesses – for example, time-critical applications in the milli- or even micro-second range will continue to be cable-based. No one will seriously spend the effort and costs today to build a corresponding 5G solution.

Even in the future, we will continue to find a variety of technologies in the industrial automation environment. One-size-fits-all does not exist.

If you still want to benefit from the advantages of flexibility and an independent, secure, campus-like area coverage, you will have to create a corresponding infrastructure, which entails an initial investment.

In the first described challenge of 5G technology use in industrial automation, one must manage expectations. More solutions will appear in the future to build the infrastructure, which will also allow small-scale deployments.

In addition, as many use cases as possible should use the same infrastructure to maximize user benefits. Network infrastructure must be designed to take these different requirements into account, and vendors must provide appropriate equipment.

Furthermore, a key aspect of implementing 5G in the automation environment is end-to-end traceability. The operator or integrator of a 5G-based solution must always be able to analyze every part of the communication infrastructure in order to quickly identify errors and restore operation.

Ludger Boeggering: This is a very broad question, and I would try to answer it more from a use case perspective. Let’s take as examples use cases such as predictive maintenance or environmental monitoring, where the focus is on deep penetration, high subscriber numbers and easy-to-use existing infrastructure. This mainly involves the use of the traditional spectrum bands of the public network providers.

In other use cases, such as process automation control and aiding via augmented reality, availability and reliability are paramount. This is where the strengths of private networks, including data security, come into full play. The spectrum available for such installations is in the mid-GHz range between 3.xx and 4.xx GHz, and the relevant licences for individual spectrums have been issued by regulatory authorities for a number of years on comparatively attractive terms for local use.

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A subsidiary of Foxconn, the prominent Taiwanese electronics manufacturing giant, is reportedly considering a significant investment of up to $200 million to establish an electronic components plant in Chennai, Tamil Nadu. According to Reports, Foxconn Industrial Internet (FII) CEO Brand Cheng and other company representatives recently met with Tamil Nadu Chief Minister MK Stalin and government officials to discuss the potential investment in the southern state.

FII has presented a plan to state officials outlining an initial investment of $180 million to $200 million for the facility, with the aim of completing the plant by 2024 and considering further investments thereafter. However, a final decision on the matter is yet to be made.

Foxconn Industrial Internet is known for manufacturing communication, mobile network, and cloud computing equipment. Additionally, Foxconn already has an extensive campus near Chennai where it assembles Apple’s iPhones.

Apart from Tamil Nadu, the Karnataka state government in south India has also engaged in discussions with FII, where the company expressed commitment to invest $1.07 billion for another new plant.

Furthermore, Foxconn is exploring opportunities in India’s semiconductor sector and is in talks with the Gujarat state government for potential entry into this area. On the occasion of the Semicon India 2023 event in Gandhinagar on July 28, Prime Minister Narendra Modi and Foxconn Chairman Young Liu are scheduled to be present. India aims to establish itself as a semiconductor manufacturing hub, with the local market’s value projected to reach $80 billion by 2028, four times its current size of $23 billion.

In the past, the Indian government announced a $10 billion scheme to promote domestic chip manufacturing, attracting interest from companies like Foxconn and local conglomerate Vedanta Ltd. However, none of these proposals has materialized thus far. It’s worth noting that Foxconn recently backed out of a $19.5 billion chips joint venture with Vedanta, citing delays in the project’s progress. The company now plans to apply separately for setting up a semiconductor unit in India.

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A software package for the R&S BBA300 RF amplifier allows users to set the bias point and high power output via a straightforward web GUI. The BBA300-PK1 software option provides access to the amplifier’s extensive parameter sets for use in a variety of applications, from EMI immunity and RF component testing to medical and scientific particle accelerators.

Models in the BBA300 series of broadband amplifiers offer continuous frequency ranges from 380 MHz to 6 GHz at up to 300 W of output power. Units support amplitude, frequency, phase, pulse, and complex OFDM modulation.

The BBA300-PK1 software introduces two tools for optimizing the output signal to meet a wide range of test requirements. The first tool allows bias point adjustment between Class A and Class B. Shifting to Class AB enables pulsed signals to be reproduced accurately at high power, while improving efficiency.

The second tool offers a high power mode that provides high maximum power with a well-matched RF path, while VSWR mode furnishes rated power with high tolerance to load mismatches. VSWR mode is useful in EMC applications because it maintains rated power up to a VSWR of 6:1 before the amplifier gradually reduces its rated power to 50% for self-protection in the event of an open or short circuit.

For more information on the BBA300 broadband amplifier, as well as the BBA300-PK1 software option, use the link to the product page below.

BBA300 product page

Rohde & Schwarz

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Keysight’s N9912C handheld RF analyzer is customizable with over 20 downloadable software applications and license-key activated frequency and bandwidth options. Operating at up to 10 GHz, the instrument can be configured with vector network analyzer (VNA), cable and antenna tester (CAT), and spectrum analyzer (SA) functions. Mix and match VNA, CAT, and SA options with the desired maximum frequency to get precisely the capabilities you need in a single field device.

The N9912C, part of the company’s FieldFox lineup, performs spectrum and network analysis down to 3 kHz and up to 10 GHz to test and troubleshoot a wide range of high-frequency and wireless applications. It allows the capture of elusive signals with a gap-free, real-time bandwidth of up to 40 MHz and measures all four S-parameters simultaneously with a 115-dB range. In addition, the N9912C can be used to perform over-the-air measurements for 5G NR and LTE. The analyzer uses GPS/GNSS for geolocation and timestamping.

The battery-operated analyzer weighs 3.4 kg (7.4 lb) and comes with a rechargeable Li-ion battery, AC/DC adapter, power cord, and carrying case. Request a price quote using the link to the product page below.

N9912C product page

Keysight Technologies 

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Anritsu has expanded the functions of its MS9740B optical spectrum analyzer for testing pulsed laser diode chips during production. The measurement function was added to meet the increased production of high-power laser diode (LD) chips, driven by higher communication bit rates and longer LiDAR detection ranges.

By eliminating the need for a trigger signal, the MS9740B analyzer accelerates the optical spectrum evaluation of LD chips. The expanded capability of the MS9740B also ensures measurement reproducibility of ±1.4 dB for side-mode suppression ratio (SMSR). Low SMSR variation improves LD chip yield and production efficiency. 

Intended for production environments, the MS9740B optical spectrum analyzer provides a high dynamic range of up to 70 dB (±1 nm from peak wavelength) and fast sweep speeds of <0.2 s over a wavelength range of 600 nm to 1750 nm. Anritsu says that the MS9740B reduces measurement times by as much as half compared to the previous model.

MS9740B product page

Anritsu

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With compute power of up to 48 TOPS, Quectel’s SG885G-WF Android smart module satisfies high-performance industrial and consumer IoT applications. The module is powered by a Qualcomm QCS8550 SoC with built-in octa-core Kryo CPU, Adreno 740 GPU, Adreno 8550 VPU, and Hexagon DSP. It also supports Wi-Fi 7, Bluetooth 5.3, and 2×2 Wi-Fi MIMO for enhanced IoT connectivity.

The SG885-WF module provides robust video capabilities to ensure smooth and high-quality video processing. Video encoding at 4K and 8K resolution is handled at a rate of 120 fps and 30 fps, respectively. Video decoding at the same 4K and 8K resolution is performed at 240 fps and 60 fps, respectively.

Running under the Android operating system, the SG885G-WF is well-suited for a wide range of IoT and M2M applications, such as videoconferencing systems, live streaming devices, edge computing, robots, drones, and AR/VR. It packs 12 Gbytes of LPDDR5X and 256 Gbytes of flash memory. Onboard interfaces include LCM, camera, PCIe, UART, USB, I2C, and SPI.

The SG885G-WF Android smart module comes in a 49×51×4.25-mm LGA package and is sold through Quectel’s distributor network.

SG885G-WF product page

Quectel Wireless Solutions 

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A reference design from Renesas pairs its radiation-hardened components for power management with AMD’s space-grade Versal XQRVC1902 adaptive SoC. Developed in collaboration with AMD, the ISLVERSALDEMO2Z reference design provides all the power rails required by the Versal device, including a low 0.80-V core voltage supply that can source up to 140 A.

As core voltages decrease and currents increase for FPGAs and ASICs, it has become more difficult to meet the stringent power requirements of these devices to ensure that they operate error-free. This is especially critical in space missions where power availability is limited and systems are exposed to extreme temperatures and radiation for an extended period of time.

The demo board’s ICs support a wide range of power rails for next-generation space avionics systems that require tight voltage tolerances, high current, and efficient power conversion, while withstanding the harsh environment of space. All of the power management devices have been tested and verified to withstand exposure to high levels of radiation and come in small-footprint packages. These Intersil-brand components include the ISL73847SEH dual-output PWM controller, the ISL73041SEH and ISL71441M GaN FET half-bridge drivers, and the ISL73007SEH POL regulator.

All products are available now, and the ISLVERSALDEMO2Z reference design is available on request in limited quantities. Contact the sales team or visit the Renesas website.

ISLVERSALDEMO2Z product page

Renesas Electronics

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Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is an authorized global distributor for Silicon Labs, a leading manufacturer of secure, intelligent wireless technology. Since 2006, Mouser’s partnership with Silicon Labs has supported the product development process for Mouser customers throughout the world in Internet of Things (IoT), lighting, and AI/ML applications.

Mouser, the authorized global distributor with the newest semiconductors and electronic components, now stocks more than 1,250 different parts from Silicon Labs, as well as 6,805 part numbers available to order. Silicon Labs products include the EFR32BG24 Bluetooth wireless system-on-chip (SoC) devices. Designed for wireless connectivity using Bluetooth Low Energy and Bluetooth Mesh, these SoCs allow IoT designers to create smart, energy-efficient solutions quickly. The EFR32BG24 SoCs also boast a wide range of security features, protecting product designs from remote and local cyberattacks. These wireless SoCs offer low current consumption, an AI/ML hardware accelerator and a high-performance 2.4 GHz RF. The devices support a range of smart home applications, including sensors, door locks, smart plugs, and portable medical devices.

The EFR32MG24 Series 2 multiprotocol wireless SoCs from Silicon Labs deliver ideal mesh wireless IoT connectivity using Matter, OpenThread, and Zigbee protocols. The multiprotocol SoCs feature an Arm Cortex-M33 core with a maximum operating frequency of 78 MHz, as well as up to 1.5 Mbytes of Flash and 256 Kbytes of RAM. The EFR32MG24 SoCs also feature an AI/ML hardware accelerator, providing reliable performance for predictive maintenance and glass break and wake-word detection.

The Silicon Labs Pro Kit for Amazon Sidewalk is pre-programmed with Amazon Sidewalk firmware and pre-registered on AWS, making it an ideal choice for quickly and easily developing Amazon Sidewalk devices. The Amazon Sidewalk kit features BLE, FSK and CSS capabilities, allowing designers to focus on innovation rather than testing and integration. Amazon Sidewalk creates shared wireless networks, connecting IoT devices beyond the smart home throughout the neighborhood and city.

The BT122-DK4315B Bluetooth LE module development kit, available to order, provides a demonstration and development platform for the BT122 wireless module, also available to order. The kit includes a BT122-DK4315B board with two push buttons, two LEDs, a temperature sensor, and a Si7021 relative humidity sensor. The board features a J-Link debugger with a high-speed UART to USB bridge. A mini-simplicity connector allows for current consumption measurements and breakout pads are provided for all the module pins.

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CUI Devices’ Motion & Control Group announced the introduction of a new rotary potentiometer series offering single or dual gang models as well as dual gang options with an on-off switch. The PTN16 series is housed in a 16.5 mm package with shaft lengths of 15, 20, 25, or 30 mm and D-cut or knurled shaft styles. Ideal for control inputs for electronic circuits and audio control applications, the PTN16 models feature resistance ratings from 1 to 2000 kΩ, a rotational life of 10,000 cycles, and a variety of terminal configurations.

These 16.5 mm rotary potentiometers carry linear, logarithmic, and reverse logarithmic tapers, a 0.125 W power rating, and a 300-degree mechanical angle. The PTN16 series further features through hole mounting, center detent options, and an operating temperature range from -10 to 75°C.

The PTN16 models are available immediately with prices starting at $0.97 per unit at 300 pieces through distribution.

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The Two-wheeler suspension system market is anticipated to expand its roots at an average CAGR of 4.9% between 2023 and 2033. The market is expected to have a market share of US$ 2.61 Billion by 2033 while it is likely to be valued at US$ 1.65 Billion in 2023.

The rising traffic on the road, high vehicle population, and technological advancements are anticipated to flourish the market performance during the forecast period. Furthermore, the advanced facilities setting up their feet in emerging economies are also gaining high revenue through vehicle export.

The better mileage, convenience, comfort, fast mobilization, and easy handling make two-wheelers the first choice. The affordable prices of these vehicles and their suspension help the market thrive its way.

Electric two-wheelers are getting popular among customers due to their low emissions; government subsidies and affordability, which in turn, help the market grow.

Collaboration between brands and automotive parts companies is also increasing the sales of two-wheeler suspension systems. Furthermore, the vital focus on smooth trails is also reshaping the market dynamics.

The presence of OEM retailers and repairing facilities and third-party companies together provide a long list of options for consumers.

• The United States market leads the two-wheeler suspension system market in terms of market share in North America. This region is expected to hold a market share of 4.8% by 2023. The growth in this region is attributed to increased traffic, people getting aware of sustainable ways of transport, high affordability, and brands.
• Germany’s two-wheeler suspension system market is another significant market in the Europe region. The market holds a market share of 2.1% in 2023. The growth is attributed to the collaboration between automotive brands and part manufacturers along with the government working on electric two-wheelers.
• China two wheeler suspension system market thrives at a CAGR of 5.4% during the forecast period. The growth is attributed to the big two-wheeler vehicle population, average per capita income, and high traffic.
• The telescopic front suspension system leads the component type segment as it holds a market share of 40.6% in 2023. The growth is attributed to the high response and enhanced shock control.
• Based on the vehicle type, the motorcycle segment leads as it holds a significant global share of 58.2% in 2023.

The key vendors work on key elements like reliability, high safety, comfort, and long shelf life. Furthermore, the electric vehicle suspension is being designed differently. Key competitors merge, acquire, and collaborate with other companies to increase their supply chain and distribution channel.

Showa Corporation, Gabriel India Limited, KYB Corporation, Duro Shox Pvt Ltd, BMW Group, WP AG, Nitron Racing Shocks, Marzocchi Moto, Öhlins Racing, K-Tech Suspension Limited, Progressive Suspension, Inc., TFX Suspension Technology, BITUBO S.r.l., ZF Friedrichshafen AG, Diamond International Pvt. Ltd., Ridon Auto Parts Co., Badve Engineering Group, Zedling Suspension.

• BMW Group with its BMW Motorrad has introduced the suspensions with optimal on all road experience. These suspensions involve a duolever, single-sided swing arm, telelever, dynamic ESA, WAD spring element, and USD fork.

Duro Shox Pvt Ltd has launched their two & three-wheeler shock absorber with attractive design and effective spring control.

The post Two Wheeler Suspension System Market is Projected to Grow at a CAGR of 4.9%, Totaling US$ 2.61 Billion during the forecast period of 2023 to 2033 | Future Market Insights, Inc. appeared first on ELE Times.

The global automotive door hinges market is expected to accumulate a valuation of US$ 4.6 billion in 2023 and is projected to reach US$ 7.9 billion by 2033, trailing a CAGR of 5.5% during the forecast period.

The rising popularity of sport utility vehicles and passenger cars is a significant factor driving the demand for Automotive Door Hinges in the market. Additionally, the adoption of mass production techniques and advanced technologies like artificial intelligence and machine learning is further propelling the automobile industry, consequently contributing to the growth of the Automotive Door Hinges market.

The increasing emphasis on driver and passenger safety is driving the demand for efficient Automotive Door Hinges systems. Moreover, technological advancements in the automotive sector have resulted in a surge in the demand for advanced tailgate hinges and bonnet hinges, which address vehicle safety and security concerns. These factors play a significant role in propelling the market for automotive door hinge systems.

Increasing urbanization and industrialization, coupled with the expanding working population’s demand for private commuting, is anticipated to drive the automotive hinges on market growth. Furthermore, the development of infrastructure on a global scale is likely to fuel the demand for commercial vehicles, which in turn may influence the demand for automotive hinges.

Government investments in public roadways transportation are expected to drive the automotive hinges market. Additionally, the introduction of electric-operated hinges is likely to boost the demand for automotive hinges on a global scale. The growing trend of customized vintage cars also presents significant opportunities for the automotive hinges market.

• The United States automotive door hinges market is expected to grow with a CAGR of 5.3% during the forecast period.
• The market in China is expected to grow with a CAGR of 5.7% during the forecast period.
• By sales channel, aftermarket is projected to grow with a significant CAGR of 5.9% during the forecast period.
• By material, the steel segment is expected to grow with a CAGR of 6% throughout the forecast period.

“The introduction of electrically operated hinges and the rising popularity of sports utility vehicles is expected to drive market growth during the forecast period”- comments an FMI Analyst

The automotive door hinges market is highly competitive, with several key industry players investing heavily in the production of these services.

The key industry players are Dura Automotive LLC, Magna International Inc., Aisin Seiki Co. Ltd., DEE Emm Giken, ER Wagner, Midlake Products & Mfg. Company Inc., Pinnet Industrie, Monroe Hinge, Gestamp Group, Multimac Inc., Brano Group, Rell Precision Manufacturing Inc., The Paneloc Corporation, and Saint Gobain.

Key market players are leveraging organic growth strategies like acquisition, mergers, tie-ups, and collaboration to bolster their product portfolio. This is expected to propel the global automotive door hinges market.

• In January 2022, Dura Automotive Systems marked a significant milestone with the official inauguration of its advanced manufacturing facility in Muscle Shoals, Alabama.
• In August 2021, Dura Automotive Systems announced its collaboration with ALMAC Co, LTD through a joint venture agreement. The partnership aims to manufacture automotive-grade aluminum extrusions and components that will contribute to enhancing the performance of lightweight and electric vehicle modules.
• In April 2022, AISIN Group incorporated the SUV-style Battery Electric Vehicle (BEV) called “bZ4X” into its product lineup. This vehicle represents the first model of Toyota’s bZ Series.

In May 2019, Magna International introduced the Comfort+TM door latch hinge, a solution aimed at addressing concerns related to car door opening and closing while enhancing cabin quietness. This innovative Automotive Door Hinge reduces the effort required to operate the door and ensures a smooth and consistent feel during operation.

The post The rising popularity of sport utility vehicles and passenger cars is a significant factor driving the demand for Automotive Door Hinges in the market and reaching the market valuation of 7.9 Bn 2033 | Future Market Insights appeared first on ELE Times.