Новини світу мікро- та наноелектроніки

A little Christmas tree present in the making

Reddit:Electronics - Sun, 12/24/2023 - 07:39
A little Christmas tree present in the making

I used a XIAO ESP32S3 controller board, 9 LEDs and 9 resistors and some wiring and soldering. It’s going to be a broach for my “gorlfriend”.

3D printing is next.

submitted by /u/SignificantManner197
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Can u spot whats wrong 😅

Reddit:Electronics - Sat, 12/23/2023 - 20:48
Can u spot whats wrong 😅

Ordered from ali and ye 🤣 it has been 15 days since i got it and now i actually started looking at it.

submitted by /u/valzzu
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Weekly discussion, complaint, and rant thread

Reddit:Electronics - Sat, 12/23/2023 - 18:00

Open to anything, including discussions, complaints, and rants.

Sub rules do not apply, so don't bother reporting incivility, off-topic, or spam.

Reddit-wide rules do apply.

To see the newest posts, sort the comments by "new" (instead of "best" or "top").

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Global Environmental Technology Market: Driving Innovation for a Sustainable Future

ELE Times - Sat, 12/23/2023 - 12:08

The environmental technology sector is experiencing a surge in growth and innovation as the world grapples with pressing ecological challenges. Also known as clean or green technology, these advancements aim to address the harmful impacts of technology on the environment and resource consumption. Increased awareness of ecological concerns, climate fluctuations, resource depletion, pollution, and habitat degradation has driven the demand for technological solutions to mitigate these issues.

Government regulations and global initiatives further propel the adoption of environmental technology to meet environmental standards and emissions targets. Notably, the United Nations Environment Program (UNEP) and the Massive Earth Foundation launched the Low Carbon Earth (LCE) 2023 Climate Technology Accelerator in July 2023 to support startups combating climate change.

According to a recent report by Allied Market Research, the global environmental technology market is expected to grow at a significant CAGR of 5.1% in the coming years.

Development of Environmental Technology:

Renewable Energy:

Environmental technologies like renewable energy harness naturally restored resources like sunlight, wind, and waves to generate clean electricity. This includes advancements in windmills, water turbines, and solar panels.

Smart Technology:

Smart home technology integrates sensors and IoT devices to optimize energy efficiency and meet users’ needs. This technology, facilitated by IoT connectivity, is a key component in the vision of future energy-efficient “smart cities.”

Electric Vehicles:

Electric vehicles, propelled by electric motors and rechargeable batteries, play a crucial role in reducing air pollution and greenhouse gas emissions. Government incentives are driving the adoption of electric vehicles globally.

India’s Environmental Technology Sector:

India has identified environmental technology as a top industrial sector for future growth. The country’s environmental technology market ranks sixth globally and is a leader in air pollution control and wastewater management. Initiatives like India’s Sustainable Development Goals (SDG) Index and the National Drinking Water Program highlight the focus on sustainable development.

In conclusion, the global environmental technology market is rapidly expanding, offering immense opportunities for innovation and growth. With a heightened emphasis on sustainability, this market will remain a key focus for investment and development, paving the way for a more environmentally conscious future.

The post Global Environmental Technology Market: Driving Innovation for a Sustainable Future appeared first on ELE Times.

AI assistant for hardware design gets a vision upgrade

EDN Network - Fri, 12/22/2023 - 15:35

Copilot, an AI-based hardware design assistant that understands a project context automatically, now has a vision version, and that makes it the first multi-modal AI tool for hardware design. According to Flux, a startup based in San Francisco, that will facilitate access to powerful new use cases and open up a world of new possibilities in hardware design workflow.

Flux Copilot, conversational AI that lives in a project, streamlines tedious tasks, conducts design reviews, and makes hardware teams more productive. With Copilot Vision, engineers can input a block diagram to the AI tool and watch it recommend suitable parts by intelligently parsing the diagram into functional sections.

Figure 1 Users can input a block diagram and get recommendations on suitable components. Source: Flux

How Copilot Vision works

In hardware design, a lot of thinking is visual and requires context, as design engineers commonly rely on visual resources such as block diagrams, charts, and drawings. However, these resources can be hard to interpret and separate from the actual design.

Take the case of an engineer working on a project based on an existing block diagram. That calls for turning that block diagram into a working circuit, selecting the right components, and connecting them correctly. As a result, engineers must read through datasheets and application notes, which can often get confusing, time-consuming, and hard to keep track of.

Here, Copilot’s latest upgrade incorporates images as a more natural way to communicate ideas and integrate those resources into a design. Engineers can provide Copilot with an image as a file upload, and Copilot will instantly understand what they are trying to build. Next, engineers can ask questions, learn, and get design reviews in entirely new and more effective ways.

Figure 2 Copilot’s vision capability enables engineers to compare schematic diagram against a block diagram and catch discrepancies. Source: Flux

Besides part recommendations, Copilot can help ensure design quality by comparing schematic diagram against a block diagram. Its analysis catches discrepancies like missing elements in a design and offers suggestions for improvement.

Moreover, when engineers are ambivalent about how to interpret a chart on a datasheet, they can provide Copilot with an image of the chart and ask in-depth questions. Copilot Vision will interpret input and explain any aspect of the chart and how it relates to hardware design needs.

Figure 3 Copilot is capable of chart interpretation and dimensional analysis. Source: Flux

Design engineers are often overwhelmed by all the information and dimensions when looking at the part drawings. Here, engineers can provide an image to Copilot and ask any question about part dimensions. The AI assistant will interpret and correlate them to real component footprints, even making educated guesses about component types based on project context.

The biggest Copilot upgrade

Copilot, built around the concept of agile hardware development, aims to facilitate every step of the hardware development process from initial brainstorming all the way through production. With the launch of the vision upgrade, design engineers not only can chat with Copilot, they can also see what they are working on.

Flux calls it the biggest upgrade to Copilot yet. The company welcomes user feedback on what works well, what could be better, and what other modes of interaction users would want to build into Copilot. The feedback can be shared through Flux’s Slack community.

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Rohde & Schwarz verifies NXP’s next generation automotive radar sensor reference design for extremely short object distances

ELE Times - Fri, 12/22/2023 - 13:37

The radar target simulator R&S RTS, Rohde & Schwarz’s game-changing solution of automotive radar, in particular its ability to electronically simulate very close-range objects, has been used to verify the performance of NXP® Semiconductors’ next-generation radar sensor reference design. This collaboration enables the automotive industry to take another step forward in the development of automotive radar, the principal technology that enables advanced driver assistance systems (ADAS) and autonomous driving features.

Engineers from both companies conducted a comprehensive series of tests to verify the new sensor reference design which is based on NXP’s 28 nm RFCMOS radar one-chip SoC (SAF85xx). The R&S RTS radar test system combines the R&S AREG800 automotive radar echo generator with the R&S QAT100 antenna mmW frontend, offering unique short-distance object simulation capabilities as well as superior RF performance and advanced signal processing with many advanced functions. This enables realistic tests of next-generation automotive radar applications and brings the automotive industry’s vision of fully autonomous driving one step closer.

NXP’s next-generation automotive radar sensor reference design is enabled by the industry’s first 28 nm RFCMOS radar one-chip SoC family leveraging the R&S RTS radar test system. The radar sensor reference design can be used for short, medium and long-range radar applications to serve challenging NCAP (NCAP: New Car Assessment Program) safety requirements as well as comfort functions like highway pilot or urban pilot for the fast-growing segment of L2+ and L3 vehicles.

The R&S RTS is the only test system suitable for the complete characterization of radar sensors and radar echo generation with object distances down to the airgap value of the radar under test. It combines the R&S AREG800A automotive radar echo generator as a backend and the R&S QAT100 antenna array or the R&S AREG8-81S as a frontend. The technically superior test solution is suitable for the whole automotive radar lifecycle including development lab, hardware-in-the-loop (HIL), vehicle-in-the-loop (VIL), validation and production application requirements. The solution is also fully scalable and can emulate the most complex traffic scenarios for advanced driver assistance systems.

Adi Baumann, Senior Director ADAS R&D, at NXP Semiconductors says: “We have been collaborating closely and successfully with Rohde & Schwarz for many years on the verification of our automotive radar sensor reference designs. Rohde & Schwarz’ cutting-edge automotive radar test systems allow us high-quality and highly efficient validation of our automotive radar products and prove the outstanding performance of our radar one-chip. The level of experience, quality and support that Rohde & Schwarz provides to NXP is making a difference.”

Gerald Tietscher, Vice President of Signal Generators, Power Supplies and Meters from Rohde & Schwarz says: “We are grateful for the collaboration with NXP to accelerate the deployment of advanced automotive radar sensors based on 28 nm automotive radar chips. They serve ever more challenging NCAP safety requirements and will help enable new safety applications. Our experience in automotive radar testing allows us to provide a best-in-class test solution for this radar sensor design based on the industry’s first 28 nm RFCMOS one-chip radar SoC.”

NXP will present the latest developments for radar including the automotive radar sensor reference design at CES 2024 trade show in Las Vegas from January 9 to 12, 2024, at booth CP18.

The post Rohde & Schwarz verifies NXP’s next generation automotive radar sensor reference design for extremely short object distances appeared first on ELE Times.

KPIT Technologies Unveils Sodium-ion Battery Technology to Address Import Dependency

ELE Times - Fri, 12/22/2023 - 13:15

KPIT Technologies has developed the Sodium-ion battery technology that not only promises to address import dependency on core battery materials but also opens up various applications across different sectors.

The use cases for electric vehicles, particularly two and three-wheelers, as well as commercial vehicles, highlight the potential for Sodium-ion batteries to contribute to the growth of the electric mobility sector. Additionally, its applications in stationary deployments, such as UPS backups and grid storage, suggest versatility and the ability to cater to a range of energy storage needs.

This development comes from a fruitful collaboration between KPIT Technologies and the Indian Institute of Science Education and Research (IISER), Pune, and underscores the importance of industry-academia partnerships in advancing technological solutions. The contributions of the IISER Pune team in material synthesis, characterization, and battery testing showcase the collaborative effort required to bring such innovative technologies to fruition.

“Sustainability is at the heart of KPIT’s vision. We are working on multiple technologies to reimagine mobility and accelerate the push towards cleaner transportation. As the electric mobility ecosystem matured, we were cognizant of having alternate battery technologies and localizing the storage value chain. Our Sodium-ion battery technology, completely reliant on Earth’s abundant raw materials, is another testament to KPIT’s commitment towards the sustainable mobility ecosystem. We look forward to partnering with manufacturing companies to commercialize this technology globally,” said Ravi Pandit, Co-founder and Chairman of KPIT Technologies.

The post KPIT Technologies Unveils Sodium-ion Battery Technology to Address Import Dependency appeared first on ELE Times.

Foxconn Applies to Set Up a Semiconductor Fab in India

ELE Times - Fri, 12/22/2023 - 12:27

Foxconn, the Taiwanese electronics manufacturing services company, has applied to establish a semiconductor fabrication unit (fab) in India. This information was shared by Rajeev Chandrasekhar, the Minister of State for Electronics and IT, in a written reply to Lok Sabha (the lower house of India’s Parliament). The application has been made under the “modified scheme for setting up semiconductor fabs in India.”

The development comes after Foxconn exited a joint venture with Vedanta Group to set up a chip plant in India.

The Indian government has been taking measures to boost electronics manufacturing in the country, with a particular focus on semiconductors. These measures include incentivizing large investments in electronic goods and appliances and promoting exports to enhance the electronics manufacturing ecosystem in India.

The post Foxconn Applies to Set Up a Semiconductor Fab in India appeared first on ELE Times.

Unlocking the World of RFID Chips: A Comprehensive Exploration

ELE Times - Fri, 12/22/2023 - 11:51

Radio-frequency identification (RFID) chips represent a silent revolution in technology, revolutionizing how we interact with the world in the age of digital innovation. Let’s examine RFID chips in more detail, including their definition, types, functions, applications, technology, and many benefits they offer to different businesses.

Definition of RFID Chip:

Using electromagnetic fields, RFID technology uses tags attached to items to identify and track them automatically. RFID stands for Radio-Frequency Identification. The RFID chip, a tiny electronic device that stores and transmits data wirelessly via radio waves, is the brains behind this technology. RFID chips essentially function as digital fingerprints, making it possible to track and identify objects without direct line-of-sight scanning.

Types of RFID Chip:

There are several varieties of RFID chips, each made to meet a particular purpose. Active RFID and Passive RFID are the two main kinds.

  1. Active RFID Chips: Active RFID chips can broadcast signals over greater distances when they are powered by a battery, giving them an expanded range. Real-time location systems (RTLS), automobiles, and high-value asset tracking are all frequent uses for these devices.
  2. Passive RFID Chips: Passive RFID chips depend on the energy from the RFID reader’s signal to send data because they lack an internal power supply. They are frequently utilized in retail, access control, and inventory management. They are also reasonably priced and appropriate for short-range applications.

How RFID Chips Work:

RFID chips work on a straightforward but efficient principle. The RFID chip’s antenna collects radio waves emitted by an RFID reader and processes the signal to create a little electric current that activates the chip. The reader receives the chip’s unique identifier or data after that, enabling prompt and precise identification. Because this procedure takes place in a few milliseconds, RFID technology is incredibly effective.

Applications of RFID Chips:

RFID technology is highly versatile and has revolutionized operations and enhanced efficiency in a variety of sectors.

  1. Retail: RFID chips improve the whole shopping experience, decrease stockouts, and expedite inventory management.
  2. Logistics and Supply Chain: RFID makes it possible to trace shipments in real time, which minimizes errors, minimizes losses, and improves supply chain efficiency.
  3. Healthcare: In healthcare settings, RFID chips improve patient safety, track medical equipment, and simplify inventory management.
  4. Access Control: Access cards and key fobs for safe access to buildings and restricted areas frequently employ RFID technology.
  5. Automotive: RFID chips are used in toll collecting, keyless access, and vehicle tracking.

RFID Chip Technology:

The combination of radio frequency and data storage capabilities is the basis of RFID chip technology. The chips’ read ranges and capacities vary depending on whether they are passive, semi-passive, or active. The development of incredibly tiny, robust RFID chips appropriate for a wide range of applications is the result of miniaturization advancements.

RFID Chip Advantages:

The adoption of RFID technology brings forth numerous advantages:

  1. Efficiency: Obtaining data quickly and automatically increases operational effectiveness.
  2. Accuracy: Lower manual mistake rates improve the tracking and identification data accuracy.
  3. Cost-Effective: RFID reduces labour costs and operating expenses by streamlining procedures.
  4. Real-Time Tracking: Provides real-time visibility into assets, inventory, and personnel.
  5. Versatility: Applicable to a large number of use cases and industries.

In conclusion, RFID chips, which provide a smooth and effective way of tracking and identifying, are a revolutionary force in the digital world. The advantages and applications of RFID chips are anticipated to increase as technology develops, further establishing their status as a fundamental component of the modern era.

The post Unlocking the World of RFID Chips: A Comprehensive Exploration appeared first on ELE Times.

India Establishes Itself as a Premier Hub for Global Capability Centers

ELE Times - Fri, 12/22/2023 - 11:19

Global Capability Centers (GCCs) mark as an excellent forum and a stimulator in catalysing innovation and development and binding the best talent together. 

There is no denying that India’s technology pool has spread leaps and bounds in the last decade. India is spearheading research, development, and innovation on a global front with over 1580 GCCs operating (as of FY 2023) with a market size of $46 billion, rising at a CAGR of 11.4%, encompassing the finest leadership roles across sections like engineering, operations, management, etc.

Looking precisely, India’s vibrant start-up ecosystem, highly competitive and digitally skilled talent pool, evolving workplace culture, strong service-oriented community, and crucial and active digital transformation initiatives taken by the government have all added to the authenticity and relevance of the business, thus attracting expansion of GCCs across the country. Reported, at least 20% of the Forbes 2000 global companies have set up their GCCs in India till 2023.

As per reports, 20k+ global leadership roles will be housed in India by 2030, with over 36% of them based in Bengaluru, followed by NCR, Mumbai, and Pune. The percentage of women in global roles in India is expected to rise to 30%. In terms of industries, 50% of the leadership roles are from the software and internet, followed by FMCG, and retail, Banking, Financial Services, and Insurance (BFSI), telecom and Networking, and electrical and electronics verticals.

Rohit Jetly, Head of Shared Services and India Site Head, at Fidelity International

Rohit Jetly, Head of Shared Services and India Site Head, at Fidelity International, sheds some light on the trends following the expansion of GCCs in India and what more needs to be done in the coming year.

“2023 was an important year for India’s Global Capability Centres (GCCs), characterized by trends that highlight India’s crucial position in the global business arena. The surge in GCCs, which are projected to reach 2,000 in India over the next 3-4 years, reflects how organizations are harnessing India’s talent pool more in terms of depth of skill and the volume of innovation that can unfold from here, with substantial focus on areas like AI, analytics, digital, blockchain and cloud. This reaffirms the confidence global corporations place in India as a hub for advanced capabilities and underscores the nation’s position as a global leader in technology. The shift is further accentuated by the talent’s (especially engineers’ and technologists’), clear preference for working in GCCs and product firms, over traditional IT services firms.

In 2024, the outlook for GCCs seems promising and I expect them to play a pivotal role in shaping the future, albeit we take steps to consolidate our position in the rapidly changing world. Our leadership talent needs to be in tune with evolving and unmet customer needs and be ingenious enough to create solutions to meet their needs. They should be able to reimagine how they move through the value chain and improve the value arbitrage we provide. They also need to start thinking more creatively about improving our productivity as a collective. To deliver on our promise, our talent needs to excel, both from a skills perspective as well as from a cultural integration perspective and be more hands-on and connected to the business and customer outcomes they are serving.

At Fidelity International, India continues to be a place of strategic importance for over two decades now, having built strong customer-centric capability in the country, delivering work across engineering & technology, finance, digital, general counsel, data and analytics, cyber security etc. to name a few. More than 40% of our global talent is based in India and we have recently announced our operations in Bangalore, that will bolster our strategic presence in the country. We have thoughtfully crafted our approach to build a sustainable business, and to leverage India as a talent hotspot as well as a resilience location for our clients globally.”

The projections are vital, and so is the responsibility. India has cemented itself as the centre of excellence, and, while the stakes are soaring, we predict India will outperform in pulling global headquarters to manage end-to-end solutions from the country.

The post India Establishes Itself as a Premier Hub for Global Capability Centers appeared first on ELE Times.

Rohde & Schwarz and VIAVI jointly verify Analog Devices’ leading O-RU reference design at i14y Lab PlugFest Fall 2023

ELE Times - Fri, 12/22/2023 - 11:10

At the recent O-RAN ALLIANCE Global PlugFest Fall 2023, hosted at the i14y Lab in Berlin – supported by Deutsche Telekom and EANTC and i14y consortium partners, Rohde & Schwarz and VIAVI Solutions have presented their integrated solution for conformance testing of O-RAN Radio Units (O-RUs). With their joint test solution, which combines both companies’ industry-leading capabilities, they verified Analog Devices’ innovative 8T8R ORU reference design according to both O-RAN and 3GPP pre-conformance specifications.

Network disaggregation requires interoperability between Open RAN network equipment provided by different vendors. O-RAN radio units (O-RUs) need to conform with both 3GPP standards and O-RAN specifications. Fronthaul conformance tests as defined by the O-RAN ALLIANCE verify the proper behavior of fronthaul interfaces and ensure that the ORU designs are interoperable with the O-RAN distributed unit (O-DU).

Rohde & Schwarz and VIAVI Solutions are both leading in wireless communication testing and active in specifications development in the O-RAN ALLIANCE and 3GPP. Together they have developed an O-RAN conformance test solution supporting several Open Testing and Integration Centers (OTIC).

O-RAN ALLIANCE Global PlugFests are periodic events organized and co-sponsored by O-RAN ALLIANCE to enable efficient progress of the O-RAN ecosystem through well-organized testing and integration. Vendors and providers come together to test, evaluate and verify their products and solutions. The O-RAN ALLIANCE Global PlugFest Fall 2023 was held in 16 labs across eight countries. One of these events was hosted at the i14y Lab in Berlin – supported by Deutsche Telekom and EANTC and i14y consortium partners. There, technology vendors like Analog Devices, Inc. (ADI) had the opportunity to verify the conformance of their platforms with test and measurement solutions from Rohde & Schwarz and VIAVI Solutions amongst others.

To address multiple application scenarios, ADI has developed a particularly flexible ORU reference design. The ADI Kerberos ORU (ADRV9040-RD-RUMB) 8T8R ORU reference design and development kit supports time division duplex (TDD) as well as frequency division duplex (FDD) modes up-to eight carriers (8CC) for all FR1 bands from 600 MHz up to 6 GHz. In addition, it includes a complete O-RAN Split 7.2 x both for 4G and 5G NR standards.

The setup used at the O-RAN PlugFest at the i14y Lab to validate ADI’s Kerberos ORU consisted of the following test solutions:
  •  The R&S SMM100A vector signal generator and R&S FSVA3000 signal and spectrum analyzer from Rohde & Schwarz emulated a real-world radio environment by generating, capturing and analyzing RF signals. For in-depth debugging R&S VSE vector signal explorer analysis software was used allowing to access detailed measurement results.
  • The TM500 ORU Tester from VIAVI Solutions has implemented the O-DU side of the M-plane and C/U-plane functionality which was necessary for the configuration of the interface with the ORU and to exchange I/Q data over the Open Fronthaul.
  • The ORU Test Manager application from VIAVI has provided a single point of control for the integrated system and has ensured a seamless, fully automated user experience throughout the test setup.

At the i14y Lab PlugFest, this test platform evaluated various facets of the ADI ORU including its behavior, adherence to protocol standards, and compatibility with O-RAN ALLIANCE guidelines. This included the control and user plane (CU-Plane) for both FDD and TDD modes of operation. In addition, the setup supported test cases from 3GPP TS 38.141-1 Base Stations (BS) conducted conformance transceiver testing. The tests were executed under following conditions:

  • TDD: RF: 1×100 MHz CC; SCS: 30 kHz; Frequency band: DL/UL@3.8GHz
  • FDD: RF: 1×20 MHz CC; SCS: 15 kHz; Frequency band: DL 2.64203GHz and UL: 5.52203 GHz

Rohde & Schwarz helps to drive development, deployment and operation of Open RAN networks with its wide portfolio ranging from mobile network infrastructure equipment verification through conformance to mobile network testing and benchmarking.

Alexander Pabst, Vice President of Market Segment Wireless Communications at Rohde & Schwarz, says: “Open RAN is having its moment now. Large O-RAN deployments are planned in several regions all around the world. Open RAN pioneers like ADI require sophisticated ORU test solutions to verify the conformance and interoperability of their designs in a disaggregated multi-vendor network. The i14y Lab in Berlin is a fruitful collaboration space for testing, harmonizing and validating Open RAN solutions and we are proud to be a consortium partner of i14y Lab.”

Stephen Hire, Vice President of Wireless Marketing at VIAVI, says: “For network operators to gain confidence to deploy O-RAN equipment widely, they need to confirm that there are no interoperability issues, and that the performance of the radios is as good or better than traditional solutions. We are proud to have had the opportunity to work with our partners Rohde & Schwarz and i14y Lab to help verify the capabilities of the ADI reference design to enable them to achieve an important milestone in the commercialization of O-RAN technology”.

The post Rohde & Schwarz and VIAVI jointly verify Analog Devices’ leading O-RU reference design at i14y Lab PlugFest Fall 2023 appeared first on ELE Times.

Made a 555 timer playground circuit

Reddit:Electronics - Fri, 12/22/2023 - 11:02
Made a 555 timer playground circuit


A while ago, one of the very first electronic projects I did to get my feet wet in my new hobby, was to design and build a 555 timer "playground" that allows setting different modes.

As a software guy, I'm used to "playground" sort of projects and I thought I'd do the same with this project, albeit in hardware.

Sharing here since perhaps beginners in this space might find it interesting/educational/useful.

It was a fun little project and I enjoyed creating it, including the PCB layout and 3D printed case.

Build schematics and write-up

Show and tell on YouTube

submitted by /u/Artful3000
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Seika Machinery Rolls Out Fully Automatic Sawa Ecobrid Stencil Cleaner and Sayaka CT23S Tabletop Router

ELE Times - Fri, 12/22/2023 - 09:58

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce the introduction of two new products: the new Sawa Ecobrid fully automatic stencil cleaner and the Sayaka CT23S tabletop router.

Sawa Ecobrid Fully Automatic Stencil Cleaner:

The fully automatic Sawa Ecobrid is a state-of-the-art fully stencil cleaner designed to revolutionize the cleaning process in electronic assembly. This innovative system brings efficiency and precision to stencil cleaning, ensuring optimal performance for surface mount technology (SMT) processes.

Key Features:
  • Fully automatic operation streamlines the cleaning process.
  • Advanced cleaning technology for optimal stencil performance.
  • User-friendly interface for seamless operation and control.
  • Eco-friendly design with a focus on resource efficiency.
  • Enhances overall productivity in electronic assembly.

Watch the demonstration video of the Sawa Ecobrid at SMTA Guadalajara: Sawa Ecobrid Video

Sayaka CT23S Tabletop Router:

Seika Machinery introduces the Sayaka CT23S, a versatile and efficient table top router designed to meet the diverse needs of electronic assembly. With its compact design and advanced features, the CT23S offers precision and speed in the processing of various materials.

Key Features:
  • Compact and space-saving design for tabletop use.
  • High-speed and precision routing for diverse applications.
  • User-friendly interface for easy setup and operation.
  • Ideal for the prototyping and small-scale production of PCBs.
  • Enhances flexibility in electronic assembly processes.

Witness the capabilities of the Sayaka CT23S in action at SMTA Guadalajara: Sayaka CT23S Video

The post Seika Machinery Rolls Out Fully Automatic Sawa Ecobrid Stencil Cleaner and Sayaka CT23S Tabletop Router appeared first on ELE Times.

Anritsu, in Collaboration with Sony Semiconductor Israel Validates Industry First Non-Terrestrial Network (NTN) NB-IoT testcase in CAG76

ELE Times - Fri, 12/22/2023 - 09:38

Anritsu Corporation is pleased to announce that the first NTN NB-IoT Protocol Conformance Tests for have been validated on the 5G NR Mobile Device Test Platform ME7834NR powered by the Sony Semiconductor Israel (Sony)’s Altair device

NTN NB-IoT is a key IoT feature that useful in cases where the devices need to be deployed in remote regions without terrestrial cell network coverage. This is especially useful for asset tracking in maritime, logistics, mining, automotive and other areas.

“3GPP Release 17 which is described as the next stage for 5G and LTE, NTN enables new use cases and monetization opportunities for vertical industry segments,” said Kameda Keiji, General Manager of Mobile Solutions Division at Anritsu Corporation. “We are proud that our collaboration with Sony enables us to help the industry validate the new features quickly to market and enable certifications in GCF/PTCRB to bring certified devices to enable new applications.”

The conformance tests are defined by 3GPP in TS 36.523-1 corresponding to core requirements in TS 36.331 and have been submitted to 3GPP Radio Access Network Working Group 5 (RAN WG5) by Anritsu.

“We are thrilled about our partnership with Anritsu,” said Christophe Flechelle, GM France & System Engineering Director at Sony Semiconductor Israel. “By establishing a certification program for NTN, we’re paving the way for faster integration of crucial satellite technologies into tracking devices and wearables. This collaboration marks a significant step towards technological advancement and widespread adoption in the industry.”

Product Outline 5G NR Mobile Device Test Platform ME7834NR

The 5G NR Mobile Device Test Platform ME7834NR is registered with both the GCF and PTCRB as Test Platform 251.

The ME7834NR is a test platform for 3GPP-based Protocol Conformance Test (PCT) and Carrier Acceptance Testing (CAT) of mobile devices incorporating Multiple Radio Access Technologies. It supports 5G NR in both Standalone and Non-Standalone in addition to LTE, LTE-Advanced, LTE-A Pro, W-CDMA and now NTN. When combined with Anritsu’s OTA RF chamber MA8171A and RF converters, the ME7834NR covers the sub-6 GHz and millimeter wave (mmWave) 5G NR frequency bands.

The post Anritsu, in Collaboration with Sony Semiconductor Israel Validates Industry First Non-Terrestrial Network (NTN) NB-IoT testcase in CAG76 appeared first on ELE Times.

AAEON Breaks Ground with COM-R2KC6: Introducing AMD Ryzen Embedded R2000 Series Processors in a Compact Powerhouse for Embedded Computing

ELE Times - Fri, 12/22/2023 - 08:56

In a strategic move to elevate its COM Express portfolio, AAEON has officially launched the COM-R2KC6, marking a milestone as the first model to integrate AMD Ryzen Embedded R2000 Series Processors. This innovative board, available in SKUs with CPUs ranging from 15W to 45W, delivers exceptional performance with up to 4 cores and 8 threads – all while maintaining cost-efficiency.

Setting itself apart from its counterparts in AAEON’s COM Express Module range, the COM-R2KC6 stands out with its ability to support four simultaneous 4K displays through one eDP and three DDI connectors. This unique feature empowers users to unleash the full potential of the integrated AMD Radeon Vega 8 Graphics, while additional GPU support is made available through the board’s PEG [x4] slot.

Despite its compact 95mm x 95mm form factor, the COM-R2KC6 doesn’t compromise on connectivity. The board boasts an array of interfaces, including a LAN port supporting either Intel I226-LM or Intel I226-IT running at 2.5GbE, eight USB 2.0, two USB 3.2 running at 10Gbps, and one USB 3.2 at 5Gbps. Serial communication needs are met with an 8-bit GPIO, 2-Wire UART, and SMBus.

Flexibility is a key feature of the COM-R2KC6, accommodating up to 32GB of DDR4 system memory through dual SODIMM slots. For storage, the board supports dual SATA SSDs at 6Gb/s, and its functional versatility is further enhanced by up to six PCIe Gen 3 slots, providing users with a myriad of expansion options to tailor the board to their specific project needs. Additionally, LPC expansion via the COM-R2KC6’s carrier board introduces additional serial I/O functions, expanding the board’s application potential. AAEON’s latest release represents a significant leap in embedded computing technology, promising enhanced performance and versatility for a wide range of applications.

The post AAEON Breaks Ground with COM-R2KC6: Introducing AMD Ryzen Embedded R2000 Series Processors in a Compact Powerhouse for Embedded Computing appeared first on ELE Times.

Semiconductors on the Rise: IDC Forecasts a Resilient 20% Growth in 2024, Fueled by AI and Automotive Innovation

ELE Times - Fri, 12/22/2023 - 08:24

In a pivotal turn of events, the global semiconductor market is set to stage a robust comeback in 2024, with analysts from the renowned global market intelligence firm IDC predicting an impressive annual growth rate of 20%. Despite facing challenges, the semiconductor industry is gearing up for a transformative year, driven by escalating demand for artificial intelligence (AI) and high-performance computing (HPC).

Galen Zeng, Senior Research Manager for Semiconductor Research at IDC Asia/Pacific, highlighted that the strict control of supply and output by memory manufacturers has triggered price increases since November. The surge in demand for AI applications across various sectors is expected to be a key driver in revitalizing the semiconductor sales market in 2024. Zeng confidently asserted, “The semiconductor supply chain, encompassing design, manufacturing, packaging, and testing, will bid farewell to the downturn in 2023.”

IDC forecasts eight pivotal trends for the semiconductor market in 2024, laying the foundation for a promising recovery:

  1. Semiconductor Sales Market to Bounce Back: Anticipating a revival, IDC projects the semiconductor sales market to surge with a remarkable 20% annual growth rate in 2024.
  2. ADAS & Infotainment Fuel Automotive Semiconductor Growth: The automotive semiconductor market is set to thrive, with Advanced Driver Assistance Systems (ADAS) and infotainment driving the industry forward.
  3. Semiconductor AI Applications Expand: Artificial Intelligence is set to become more integrated into personal devices, such as smartphones, PCs, and wearables, fostering innovation and stimulating semiconductor demand.
  4. IC Design Growth in Asia-Pacific: Despite a sluggish 2023, IC design companies in the Asia-Pacific region are expected to rebound, with a projected 14% annual growth in 2024.
  5. Foundry Industry Sees Demand Rebound: The foundry industry, impacted by weak demand in 2023, is expected to recover in 2024, fueled by increased demand for consumer electronics and AI.
  6. China’s Production Capacity Expansion: China’s active expansion in production capacity, coupled with intensified price competition, poses challenges to non-Chinese foundries.
  7. 2.5/3D Packaging Market Surges: Advanced packaging technologies, crucial for meeting evolving chip requirements, are set to grow at a CAGR of 22% from 2023 to 2028.
  8. CoWoS Supply Chain Expansion Boosts AI Chip Supply: The CoWoS packaging technology, vital for AI chips, is expected to witness a 130% capacity increase by the second half of 2024, strengthening the AI chip supply chain.

The semiconductor industry is primed for a dynamic 2024, with technological advancements, increased demand, and strategic collaborations paving the way for a substantial recovery and growth.

The post Semiconductors on the Rise: IDC Forecasts a Resilient 20% Growth in 2024, Fueled by AI and Automotive Innovation appeared first on ELE Times.


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