Microelectronics world news

Silanna UV of Brisbane, Australia – which provides far-UVC light sources for water quality sensors, gas sensors, disinfection, and HPLC (high-performance liquid chromatography) applications – is launching a new 235nm Quad High-Power far-UVC LED at the International Congress on Far-UVC Science and Technology 2024 (ICFUST) at the University of St Andrews in Scotland, UK (19–21 June). As a sponsor of the event, Silanna UV is showcasing its latest deep-UVC and far-UVC LED innovations...

The micro-LED chip market is rising at a compound annual growth rate (CAGR) of 84% from just $27m in 2023 to $579m by 2028, forecasts TrendForce’s ‘2024 Micro LED Market Trend and Cost Analysis Report’...

The micro-LED chip market is rising at a compound annual growth rate (CAGR) of 84% from just $27m in 2023 to $579m by 2028, forecasts TrendForce’s ‘2024 Micro LED Market Trend and Cost Analysis Report’...

The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts. With the introduction of the Thin-TOLL 8×8 and TOLT packages, Infineon Technologies AG is actively accelerating and supporting these trends. They enable a maximum utilization of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account. The company is now expanding its portfolio of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8×8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances.

The Thin-TOLL package has a form factor of 8×8 mm and offers the best-in-class Thermal Cycling on Board (TCoB) capability on the market. The TOLT package is a top-side cooled (TSC) enclosure with a similar form factor to TOLL. Both package types offer developers several benefits: Using them in AI and server power supply units (PSU), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8×8 package allows for a minimization of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling. In addition, TOLT devices complete Infineon’s top-side cooled CoolSiC industrial portfolio, namely CoolSiC 750 V in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package.

Availability

The CoolSiC MOSFETs 650 V G2 in ThinTOLL 8×8 and TOLT are now available in RDS(on) from 20, 40, 50 and 60 mΩ. Additionally, the TOLT variant is also available with an RDS(on) of 15 mΩ. The product family will be expanded by a more granular portfolio by the end of 2024. More information is available at www.infineon.com/coolsic-gen2. Infineon will showcase the CoolSiC MOSFET 650 V Generation 2 at the PCIM in Nuremberg.

Infineon at the PCIM Europe 2024

PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2024 show highlights is available at www.infineon.com/pcim.

The post New industrial CoolSiC MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density appeared first on ELE Times.

Test Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, today announced a collaboration with NVIDIA and leading Taiwanese electronics manufacturers to accelerate the deployment of AI-driven technologies for smart factories.

The collaboration will integrate the cutting-edge NVIDIA Metropolis for Factories workflow into Test Research, Inc. (TRI)’s portfolio to leverage advanced AI capabilities to optimize manufacturing processes through enhanced automation and defect detection. By combining TRI’s domain expertise in test and inspection with NVIDIA’s AI software stack and computing capabilities, TRI aims to empower manufacturers with intelligent solutions that drive operational efficiencies and unlock new levels of productivity for the electronics manufacturing industry. And looking forward TRI plans to leverage NVIDIA NIM to further increase performance and throughput.

“We are thrilled to collaborate with NVIDIA to deliver innovative, future-proof solutions to our customers in the electronics manufacturing industry,” said Jim Lin, Vice President of Test Research Inc. “With NVIDIA Metropolis for Factories, TRI is poised to help drive the adoption of AI in smart factories, empowering manufacturers to embrace the technologies of tomorrow and stay ahead of the curve.”

NVIDIA Metropolis for Factories is a workflow that simplifies the development, deployment, and scaling of AI-enabled visual inspection applications from edge to cloud. It supports data labeling, computer-vision model training, and model integration, and enables industrial technology companies and manufacturers to develop, deploy, and manage customized quality-control systems. It allows TRI to develop incredibly accurate inspection applications, such as for automated optical inspection (AOI). Metropolis for Factories is helping manufacturers increase production line throughput, reduce costs, and improve production quality.

TRI AI Defect Detection

Thanks to TRI’s AI verification advancements, the detection rate of components has improved significantly, the AI detection accuracy for general chip defects now exceeds 99%. Specific improvements include a detection rate of over 95% for components such as OSC, MLD, SOD, SOT23, RNET, and CNET. X-ray void detection with AI implementation improves the first pass yield rate (FPY) from 85% to 98%. For complex components like the Paladin connector, AI classification reduces the false case rate from approximately 25,000 ppm to around 3,000 ppm, an 88% improvement. Detection improvements are also present in the OCR (optical character recognition) algorithms, and traditional methods achieve 89% accuracy, while AI deep learning OCR reaches a 99.58% detection rate.

TRI AI Smart Programming

TRI AI Smart Programming facilitates predictive decision-making similar to that of an expert or experienced operator, reducing programming time, downtime, and operator training. Traditional programming of 718 components would take around 60 minutes; AI programming reduces this to just 9 minutes, an 85% improvement.

TRI AI Verify Host

The AI Verify Host is a smart repair station that reduces the need for manual re-inspection and lowers operational costs, powered by the Metropolis for Factories workflow. Typically, repair station operators have lower performance and training is not cost-effective. The AI-powered repair station can continuously operate efficiently, outperforming operators while lowering false calls and providing real-time data analytics of the inspection status.

TRI AI Station

Inspection programming is often limited to the operator’s knowledge. TRI AI Station addresses this by performing AI-powered inspections with existing AI models, optimizing the process, increasing efficiency, and lowering operational costs for the experienced workforce. The AI Station supports multiple AOIs and smart scheduling, reducing AI hardware costs and improving resource management.

TRI AI Training Tool

TRI AI Training Tool is a user-friendly interface that generates AI models from existing inspection data. The tool includes a built-in AI labeling tool and supports classification, segmentation, OCR, detection tools, continued training, heat maps, and more.

TRI will harness NVIDIA Triton Inference Server software and the NVIDIA TensorRT software development kit to further speed up AI inferencing of cutting-edge AI-powered solutions for test and inspection, and smart factories for the electronics manufacturing industry. These AI-driven capabilities will enable manufacturers to readily adopt and benefit from innovative AI-powered solutions.

The post TRI to Drive AI Innovation in Smart Factories, in Collaboration with NVIDIA appeared first on ELE Times.

Accessory device to Microchip’s TimeProvider 4100 grandmaster scales up to 200 fully redundant T1, E1 or CC synchronization outputs

Critical infrastructure communication networks require highly accurate and resilient synchronization and timing, but over time these systems age out and must be migrated to a more modern architecture. Microchip Technology announces the new TimeProvider XT Extension System, a fan-out shelf used with redundant TimeProvider 4100 grandmasters to migrate legacy BITS/SSU equipment to a modular and resilient architecture. The TimeProvider XT provides operators with a clear path to replace existing SONET/SDH frequency synchronization equipment while adding timing and phase, which is essential for 5G networks.

As an accessory device to Microchip’s widely deployed TimeProvider 4100 grandmaster, each TimeProvider XT shelf is configured with two distribution modules and two plug-in modules to provide 40 fully redundant and individually programmable outputs with synchronization designed to meet ITU-T G.823 for wander and jitter control. Operators can connect up to five XT shelves to scale up to 200 fully redundant T1/E1/CC communication outputs. All configuration, status monitoring and alarm reporting are done via the TimeProvider 4100 grandmaster. This new solution allows operators to consolidate their critical frequency, timing and phase requirements onto a single modern platform, saving maintenance and service costs.

“With the new TimeProvider XT Extension, network operators can take advantage of state-of-the-art technology that is reliable, scalable and flexible to either overlay or replace their SONET/SDH synchronization systems,” said Randy Brudzinski, vice president of Microchip’s frequency and time systems business unit. “The XT solution is an attractive investment for network operators because it is more than just a replacement for legacy BITS/SSU equipment; it also adds PRTC functionality, delivering frequency, time and phase for next-generation networks.”

This solution is compatible with DCD, SSU 2000, TSG-3800 and TimeHub systems’ wire-wrap and output panels, so that network elements do not have to be rewired. This can save network operators significant deployment time and resources while reducing costs. The TimeProvider XT has a Composite Clock (CC) input which allows for live in-service CC phase cutovers, which are typically performed during maintenance windows to ensure that the synchronization in a network is maintained. The TimeProvider XT system requires the TimeProvider 4100 grandmaster to be running the latest version 2.4 firmware.

The TimeProvider XT Extension system is the newest product to join Microchip’s extensive portfolio of clock and timing systems, which ranges from small plug-in timing server cards to multi-rack national and time scale systems.  As a primary contributor to the world’s time, Microchip’s timing solutions are trusted, reliable and resilient. For more information, visit Microchip’s Timing and Synchronization website.

Development Tools

The TimeProvider XT Extension is supported by TimePictra Management Software, a web-based tool to manage and monitor synchronization architectures.

The post Introducing the TimeProvider XT Extension System for Migrating to a Modern Synchronization and Timing Systems Architecture appeared first on ELE Times.

• New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy
• Projected 5 billion euros multi-year investment program including 2 billion euros support provided by the State of Italy in the framework of the EU Chips Act
• Catania Silicon Carbide Campus realizes ST’s plan for fully vertically integrated SiC capabilities from R&D to manufacturing, from substrate to module, on one site, enabling automotive and industrial customers in their shift to electrification and higher energy efficiency.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces a new high-volume 200mm silicon carbide (“SiC”) manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST’s Silicon Carbide Campus, realizing the Company’s vision of a fully vertically integrated manufacturing facility for the mass production of SiC on one site. The creation of the new Silicon Carbide Campus is a key milestone to support customers for SiC devices across automotive, industrial and cloud infrastructure applications, as they transition to electrification and seek higher efficiency.

“The fully integrated capabilities unlocked by the Silicon Carbide Campus in Catania will contribute significantly to ST’s SiC technology leadership for automotive and industrial customers through the next decades,” said Jean-Marc Chery, President and Chief Executive Officer of STMicroelectronics. “The scale and synergies offered by this project will enable us to better innovate with high-volume manufacturing capacity, to the benefit of our European and global customers as they transition to electrification and seek more energy efficient solutions to meet their decarbonization goals.”

The Silicon Carbide Campus will serve as the center of ST’s global SiC ecosystem, integrating all steps in the production flow, including SiC substrate development, epitaxial growth processes, 200mm front-end wafer fabrication and module back-end assembly, as well as process R&D, product design, advanced R&D labs for dies, power systems and modules, and full packaging capabilities. This will achieve a first of a kind in Europe for the mass production of 200mm SiC wafers with each step of the process – substrate, epitaxy & front-end, and back-end – using 200 mm technologies for enhanced yields and performances.

The new facility is targeted to start production in 2026 and to ramp to full capacity by 2033, with up to 15,000 wafers per week at full build-out. The total investment is expected to be around five billion euros, with a support of around two billion euros provided by the State of Italy within the framework of the EU Chips Act. Sustainable practices are integral to the design, development, and operation of the Silicon Carbide Campus to ensure the responsible consumption of resources including water and power.

Additional information
Silicon Carbide (“SiC”) is a key compound material (and technology) consisting of silicon and carbon that offers several advantages over conventional silicon for power applications. The wide bandgap of SiC and its intrinsic characteristics – better thermal conductivity, higher switching speed, low dissipation – make it particularly suitable for the manufacturing of high-voltage power devices (notably above 1,200V). SiC power devices, in the form of SiC MOSFET sold as bare die and full SiC modules, are especially useful in electric vehicles, fast-charging infrastructure, renewable energies and various industrial applications including datacenters, as they offer higher electric currents and lower leakage than traditional silicon semiconductors, increasing energy efficiency. SiC chips are however more difficult and more costly to manufacture than silicon chips with many challenges to overcome in the industrialization of the manufacturing process.

ST’s leadership in SiC is the result of 25 years of focus and commitment in R&D with a large portfolio of key patents. Catania has long been an important site for innovation for ST as the home of the largest SiC R&D and manufacturing operations, successfully contributing to the development of new solutions for producing more and better SiC devices. With an established ecosystem on power electronics, including a long-term, successful collaboration between ST and the University of Catania and the CNR (Italian National Research Council), as well as a large network of suppliers, this investment will strengthen Catania’s role as a global competence center for SiC technology and for further growth opportunities.

ST currently manufactures its flagship high-volume SiC products on two 150-millimeter wafer lines in Catania (Italy) and Ang Mo Kio (Singapore). A third hub is a joint venture with Sanan Optoelectronics, with a 200-millimeter facility under construction in Chongqing (China), dedicated to ST to serve the Chinese market. ST’s wafer production facilities are supported by automotive-qualified, high-volume assembly and test operations in Bouskoura (Morocco) and Shenzhen (China). SiC substrate R&D and industrialization is undertaken in Norrköping (Sweden) and Catania, where ST’s SiC substrates manufacturing facility is ramping up production and most of ST’s SiC product R&D and design staff are based.

The post STMicroelectronics to build the world’s first fully integrated silicon carbide facility in Italy appeared first on ELE Times.

Teensy 4.0 microcontroller reads manifold absolute pressure and crankshaft position and actuates fuel injector. Fuel injector is driven by a TI LM1949 in conjunction with a Darlington pair. System is installed on a Predator 212 small engine, which was originally carbureted. submitted by /u/buffarlos [link] [comments]

In this roundup, we spotlight new processors from Analog Devices, Texas Instruments, and WCH that meet embedded computing requirements across industries.

The board of directors of materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has appointed Jim Anderson, an established industry executive with a proven track record of driving innovation and leading business transformations, as CEO. Anderson also joins the board. He succeeds Dr Vincent D. (Chuck) Mattera Jr, who is retiring as chair & CEO...

The new device helps to ensure linearity and high performance in 5G signal chains.

AlixLabs AB of Stockholm, Sweden — which was spun off from Lund University in 2019 and has developed Atomic Layer Etching (ALE) Pitch Splitting technology (APS) — has been granted SEK2.5m (equivalent to about €220,000) by Sweden’s innovation agency Vinnova, for continuous R&D of its semiconductor products, starting September 2024 through August 2026. The funding is part of a SEK4m (about €350,000) grant from the strategic innovation program Electronic Components and Systems and its Research and Innovation Projects 2024, with SEK1.5m going to Halmstad University...

I know its not super interesting, but I always had a lot of those cheap and small 6mm potentiometers, shown in the pictures, lying around in my lab. They get the job done, but they dont fit into a breadboard very well, so I decided to create an Upgrade for them using my 3D Printer and soldered Dupont Wires to them. It makes it just so much more convenient for prototyping with my arduino. I uploaded the files on printables: https://www.printables.com/de/model/900579-6mm-potentiometer-based-rotary-controller maybe some of you that have a 3D Printer and the same potentiometers will find them helpful. submitted by /u/g3rm4ndude [link] [comments]

submitted by /u/DenkJu [link] [comments]

Infineon Technologies AG of Munich, Germany is expanding its portfolio of CoolSiC MOSFET discretes 650V by introducing two new product families housed in the Thin-TOLL 8x8 and TOLT packages, enabling maximum utilization of the PCB mainboard and daughter cards while also taking the system’s thermal requirements and space restrictions into account...

Back at the beginning of last year, EDN published my dissection of a yellow-color ADATA UV128 16 GByte USB flash drive that for unknown reasons had died on me:

At the time, I also showed you its blue-tint 8 GByte sibling:

which, again at the time, I noted was still working. Well, it’s still working…at least with Windows-based computers, that is. With MacOS, on the other hand, although it still shows up in System Information when inserted in a USB Type A system connector (either directly or via a USB-C translation adapter intermediary):

it doesn’t “mount” in either Finder or Disk Utility, no matter how I have it formatted (FAT32 or exFAT). This has me wishing that I still had the remnants of last year’s yellow 16 GByte ADATA drive in hand, too, because I now wonder if the same O/S fickleness had applied to it!

Nevertheless, I thought I’d take this one apart, too, to see if there’s any obvious reason why it’s (O/S-selectively) no longer working. I’ll as usual begin with some overview shots, accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes (the UV128 has dimensions of 2.3” x 0.8 x 0.4”/60 x 20 x 9mm and a weight of 0.4oz/10g):

Regarding the prior images’ sometimes-visible USB connector, note that while ADATA’s website is quick to trumpet the product’s USB 3.x interface capabilities:

USB 3.2 High-Speed Transmission Interface

Now there is no reason to shy away from the higher cost of the USB 3.2 Gen 1 interface. The UV128 USB flash drive brings the convenience and speed of premium USB drives to budget-minded consumers.

Only read performance (“Up to 100 MB/s”) is specified. Initially, post-teardown, I was planning on just writing the following:

“Suffice it to say that, at least from my anecdotal (i.e., non-analytical) experience, although the interface transfer rate may have been 5 Gbps peak, the media transfer rate seemingly wasn’t, at least for writes.”

However, I then remembered that I had a copy of Blackmagic Disk Speed Test on my Windows system (for which, remember, the USB flash drive was—at least pre-teardown—still recognized). On a hunch, I plugged the bare PCB into the computer…the USB flash drive still worked!

Here are the benchmark results:

Like I said, the media transfer rate isn’t 5 Gbps (or even close to it), especially for writes and even for reads.

Then there’s this:

Starting from January 1, 2019, the warranty period for the UV128 is changed to 5 years; For UV128s purchased before (inclusive) December 31, 2018, the warranty period remains unchanged.

What exactly was the warranty period prior to January 1, 2019? Who knows. I’d bought three of these devices from Newegg in mid-July 2016 promo-priced at $3 each (the 16 GByte siblings were purchased from the same retailer 11 months later via a $5.33-per promotion).

Onward. Let’s get the two halves of the case apart:

As was the case last time, the internal assembly then popped right out of the remaining case top half:

A bit more blue plastic left to remove:

The now-revealed pad- and passive-dominant PCB topside (with orientation relative to where the slider “button” is located on the flash drive’s case):

is unsurprisingly reminiscent of the one seen earlier in its 16 GByte sibling:

As for the bottom side of this 8 GByte drive:

in comparison to the earlier 16 GByte counterpart:

I’m once again unable to identify the manufacturer and product details of the flash memory used in the design, which has the following markings:

60074882
5301486066

However, I can ID the media controller, which is different than the one we saw last time. The 16 GByte USB flash drive had used Silicon Motion’s SM3267. This time, conversely, it’s the IS917 from Innostor Technology. My Google research on the IS917 reveals one possible root cause for its incompatibility with MacOS, within an Amazon review titled “WARNING be very careful on non-Windows devices” which details multiple examples of unrecoverable media errors resulting from reformat attempts on both MacOS and Linux. Unfortunately, the flash memory storage device associated with this review no longer exists on Amazon, so I can’t tell if it was the UV128 (or another ADATA product, for that matter) or something from a different manufacturer.

Since USB Mass Storage specifications are standardized nowadays, I struggle to understand how there could be such significant variances from one operating system’s implementation of those specifications to another’s. On the other hand, given that this USB flash drive, and therefore the controller inside it, dates from around a decade ago (here’s an IS917 spec sheet with a 2013 copyright, for example), perhaps there’s a never-fixed firmware or silicon bug in the IS917 that non-Windows operating systems expose (there’s no firmware update available for download on ADATA’s support site), in spite of the product’s claimed longstanding, extensive O/S support?

Windows Vista, 7, 8, 8.1, 10, 11, Mac OS X 10.6 or later, Linux kernel 2.6 or later, with no device driver needed

Reader ideas are welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• A deep dive inside a USB flash drive
• Memory cards: Specifications and (more) deceptions
• USB activation dongles: Counterfeit woes
• Fundamentals of solid-state memory technologies in consumer electronics – Part 4: Flash memory format specifications and characteristics

The post An O/S-fussy USB flash drive appeared first on EDN.

The world faces serious environmental concerns that require immediate attention and progressive solutions. The human civilization is at a crossroads where every decision will either make or break us. Taking corrective measures by making eco-friendly choices and adopting sustainable ways and technologies to operate is crucial.

Environmental conservation and protection are vital aspects of the world today, and the global scientific community is working on solutions to address the escalating climate crisis. There is a growing focus on sustainable transportation, with increased investments in electric mobility.

The electric vehicle (EV) segment in the automotive industry is on the rise in India, accounting for approximately 5% of total vehicle sales. Startups are playing a crucial role in developing and enhancing EV infrastructure, and it is projected that by 2030, EVs could make up more than 40% of India’s automotive market. India’s journey with EVs has just begun, and the country’s ambitious decarbonization target by 2030 necessitates more rigorous action towards building sustainable value chains across its industrial ecosystem.

As the world prepares to celebrate World Environment Day on June 5, 2024, leveraging technology and science to address the climate crisis and related issues should remain our top priority.

Industry Speaks:

ELE Times spoke with technology leaders on the impact of EVs on climate change and the importance of World Environment Day from an EV industry perspective.

Manjula Girish, Business Head EV Charging and Photovoltaic Inverter Division, Delta Electronics India says-

“EVs are a transformative force in the fight against climate change. By significantly reducing greenhouse gas emissions compared to traditional combustion engines, EVs play a critical role in mitigating global warming. At Delta Electronics India, we are committed to advancing EV technology and infrastructure, contributing to a cleaner, more sustainable future. Our innovations in EV charging solutions are designed to support widespread adoption of electric mobility, further reducing our carbon footprint and fostering a healthier planet.

World Environment Day serves as a critical platform for the EV industry to showcase its commitment to a sustainable future. As the mission of EV industry synchronizes with the mission of World Environment day attributing to sustainability, emission reduction and the climate change It’s a day to celebrate the progress we’ve made in electrifying transportation and highlight the positive impact EVs can have on our planet. At Delta Electronics India, we see World Environment Day as an opportunity to raise awareness, inspire action, and accelerate the transition towards cleaner Transportation solutions.”

Akash Gupta, Co-Founder & CEO of Zypp Electric, says-

“EVs have a transformative impact on climate change, and Zypp Electric is leading this charge in India. As the country’s premier tech-enabled EV-as-a-Service platform, we are committed to achieving zero emissions and creating a carbon-free India. Our ecosystem of IoT and AI-enabled electric scooters, combined with strategically placed battery swapping stations, ensures efficient, low-maintenance, and high-performance last-mile delivery. This sustainable model not only lowers delivery costs but also significantly reduces urban pollution. With over 20,000 EVs and delivery pilots, we deliver packages in a manner that is both eco-friendly and cost-effective. By replacing traditional fuel-based vehicles, we are cutting down on greenhouse gas emissions and making cities cleaner and healthier. Through our innovative solutions, Zypp Electric is playing a crucial role in mitigating climate change and driving a greener future.

At Zypp Electric, World Environment Day isn’t just a celebration – it’s a call to action for the EV industry.  Transportation is a major source of pollution, and EVs are the key to a cleaner future. This day highlights the urgency of tackling climate change.  For the EV industry, it’s a chance to showcase the transformative power of electric mobility. We can raise awareness about the environmental benefits of EVs – reduced emissions, cleaner air, and quieter cities.

World Environment Day also unites stakeholders – policymakers, businesses, and citizens.  It’s an opportunity to collaborate on building a robust EV ecosystem – from charging infrastructure to battery recycling. We are proud to be at the forefront of this revolution.  Our sustainable last-mile delivery solutions demonstrate the positive impact EVs can have.  On World Environment Day, let’s reiterate our commitment to a greener future, one electric mile at a time.”

Hyder Khan CEO of Godawari Electric Motors, says-

“The transition to EVs plays a pivotal role in mitigating climate change. EVs produce zero tailpipe emissions, drastically reducing air pollutants compared to traditional internal combustion engine vehicles. This shift is crucial in decreasing the levels of greenhouse gases, primarily carbon dioxide, which are major contributors to global warming. Additionally, EVs align with renewable energy sources, further amplifying their positive environmental impact. When powered by electricity from renewable sources like wind, solar, and hydro, EVs can achieve near-zero emissions throughout their lifecycle. This integration supports global efforts to transition towards a more sustainable energy ecosystem.

At Godawari Electric Motors, we are committed to driving this transformation by producing efficient and affordable electric 2-wheelers and 3-wheelers. Our goal is to provide eco-friendly transportation options that contribute to cleaner air and a healthier planet, while also addressing the mobility needs of a growing population. Together, we can pave the way for a greener, more sustainable future. World Environment Day holds significant importance for the electric vehicle (EV) industry. It serves as a global platform to highlight the urgent need for sustainable practices and environmental stewardship, aligning perfectly with the core values and mission of the EV industry. This day emphasizes the critical role that EVs play in reducing greenhouse gas emissions, combating air pollution, and mitigating climate change. For companies like us (Godawari Electric Motors), World Environment Day is an opportunity to showcase our commitment to creating a greener future through innovative electric mobility solutions. It allows us to engage with consumers, policymakers, and stakeholders to raise awareness about the environmental benefits of EVs, such as reduced carbon footprints and decreased reliance on fossil fuels. Moreover, this day provides a platform to discuss advancements in EV technology, share success stories, and promote the adoption of electric Vehicles. By highlighting our efforts and the positive impact of EVs on the environment, we can inspire collective action towards a more sustainable and eco-friendly transportation landscape.”

Dinesh Arjun, Cofounder and CEO, Raptee, says

“Electric vehicles (EVs) significantly reduce greenhouse gas emissions compared to conventional vehicles, directly addressing climate change. India’s long-term low-carbon development strategy underscores the need for an integrated, efficient, and inclusive transport system to achieve net zero by 2070. Given that transportation is the fastest-growing major contributor to global climate change, accounting for 23% of energy-related carbon dioxide emissions, World Environment Day is vital for the EV industry as it offers a promising solution. By replacing internal combustion engines with electric motors, EVs help decrease reliance on fossil fuels and minimize harmful emissions.  It also highlights the urgent need for sustainable practices and raises awareness about the environmental benefits of electric vehicles. This day emphasizes the role of EVs in reducing greenhouse gas emissions and combating climate change, fostering collaboration, innovation, and public engagement to drive the transition towards a sustainable future”.

The post India’s Promising EV Market is Lending Hope for an Efficient Eco-friendly Order in the Country appeared first on ELE Times.

This is a custom coil tester for the "buzz" coils found on Model T fords. (I added an image to the gallery of the coils) The basic functionality is, supply a voltage (between 6 and 30 volts) for a 3ms burst and monitor the current for when it peaks, the time from applying the voltage to when the current drops off is the "time to fire". The coil can then be adjusted in line with specifications. These PCBs can also measure input voltage and capacitance of the coils. The MCU is a TSSOP20 STM32F042 and a ACS712 is used for current sensing. This setup has been validated using Arduino based PCBs for quite a while, this is an evolution of that to make use of an STM32 (mainly for a personal project) Notes : - yes I need to clean the flux (I ran out of alcohol cleaning solution, and nowhere local stocks any) - yes the fuse has been bypassed (as soon as I get one I'll install it) submitted by /u/BuzzBumbleBee [link] [comments]

This project covers two fascinating and useful circuit design techniques—the Burton Transform and Dualling—that allow us to transform a passive network into an active network while building an audio noise filter.

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