Новини світу мікро- та наноелектроніки

Quectel Wireless Solutions, a global IoT solutions provider, and Rohde & Schwarz have successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules. For the test, the R&S CMX500 wideband radio communication tester has been used. The test setup will be shown at the Mobile World Congress 2024.

eCall, the automatic emergency call system for vehicles sold within the European Union, was introduced in 2015 and has been a mandatory requirement for all new cars in the EU since 2018. eCall systems currently make use of 2G/3G circuit-switched cellular networks. As these networks will be phased out in just a few years, emergency call systems (in-vehicle systems and infrastructure) will be adapted to the newest 4G/5G packet-switched cellular networks.

The European Commission’s initiative to update the eCall standards and legislation to transition eCall to 4G and 5G networks is ongoing. The automotive industry will need NGeCall test solutions to deliver eCall modules that include the new NGeCall functions. In future years it is expected that an upcoming Chinese eCall standard will also require 4G/5G packet-switched cellular networks.

The AG56xN series represents a cutting-edge line of 5G NR modules, leveraging the MediaTek MT2735 chipset to provide exceptional connectivity solutions. These modules support 5G Rel-15, delivering impressive data rates up to 4.0 Gbps downlink and 480 Mbps uplink within a 200 MHz bandwidth, showcasing a significant leap in wireless communication speeds. They are equipped with a comprehensive array of interfaces, including cellular (4 × 4 MIMO) and GNSS antenna interfaces, USB 3.0, PCIe (Gen3), RGMII, SGMII, multiple UARTs, SPI, I2C, I2S (PCM), SDIO, ADCs, and GPIOs, ensuring versatile connectivity options for various applications.

“We are very pleased to have Rohde and Schwarz validate the AG56xN series of automotive modules with the next generation of eCall features,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “This sets a new benchmark for the future of intelligent transportation.”

With computing capabilities up to 15K DMIPS and SGMII/RGMII throughput reaching 2.5 Gbps, these modules are designed to meet high-performance requirements. Additionally, they have achieved eCall/NG eCall certifications, underscoring their reliability and safety for automotive applications. The AG56xN series modules are also compatible with automotive-grade Wi-Fi and Bluetooth modules, offering a proven combination that enhances connectivity solutions for the automotive industry and beyond.

The test setup for testing the 5G/LTE automotive module from Quectel included the R&S CMX500 communication tester along with the R&S CMX-KA098 5G eCall test option simulating a NG eCall Public Safety Answering Point (PSAP) and a R&S SMBV100B vector signal generator for GNSS simulation. The test confirmed the successful establishment of a 5G emergency call between the Quectel module and the PSAP. The transmission of the Minimum Set of Data (MSD) was successfully achieved without any data loss and the simulated GNSS position was accurately transmitted. Additionally, voice communication was established with clear audio quality.

As a highly versatile tool, the R&S CMX500 with the R&S CMX-KA098 software option can be effectively used for NGeCall testing under reliable and configurable 5G network conditions. To accelerate the deployment of this technology, cooperation between companies within the industry becomes increasingly important. The Rohde & Schwarz and Quectel cooperation helps to mutually validate their solutions, reducing effort and accelerating time to market for our mutual customers.

Juergen Meyer, Vice President of Market Segment Automotive at Rohde & Schwarz says: “This is an important milestone in the rollout of the next generation eCall system, which will have a significant impact on road safety. With our test equipment and Quectel’s 5G eCall module, we successfully established an entire eCall process and verified this new key feature. We are very grateful to Quectel for this excellent collaboration which provides an important checkpoint from which the automotive industry can proceed with greater speed and confidence.”

The test setup will be shown at the Mobile World Congress in Barcelona, from February 26 to 29, 2024, at the Fira Gran Via, in hall 5, booth 5A80.

The post Rohde & Schwarz first to test 5G eCall interoperability of Quectel’s 5G module with its wideband radio communication tester appeared first on ELE Times.

There’s a lot of talk and excitement about chiplets these days, but there’s also a lot of confusion. What is available today? What should I expect in terms of interoperability? Is the promise of an emerging ecosystem real? More fundamentally, developers of high-end systems-on-chip (SoCs) need to consider a central question: “What’s in it for me?” The answer, unsurprisingly, varies depending on the type of application and the target market for these devices.

For the last few years, I have been closely monitoring the multi-die market, and I’ve been talking to a wide variety of players ranging from chip designers to chip manufacturers to end users of our system IP product offering. Although commentators and stakeholders accurately describe key benefits of chiplet technology, I’ve observed that these descriptions are rarely comprehensive and often lack structure.

Here is an outline of chiplet driving factors and size of opportunity per vertical Source: Arteris

As a result, I felt the need to identify common themes, reflect on their importance for future deployment and map them on the key industry verticals. This blog aims to summarize these insights in a diagram (see figure above), with the hope that it is useful to you.

1. Scalability: The key to meeting diverse computing demands

Scalability stands at the forefront of the chiplet revolution. Traditional monolithic chip designs face physical and economic limits as they approach the boundaries of Moore’s Law. Chiplets, however, offer a modular approach. By combining smaller, discrete components or “chiplets,” manufacturers can create larger, more powerful processors.

This modular design allows for the easy scaling of performance and functionality to meet the specific needs of various applications. This is what drove the early adoption of the technology by pioneering companies in the enterprise compute vertical. Today, it also attracts players in the communications and automotive industries, which also crave higher computing power, particularly for AI applications.

2. Cost efficiency: Lowering expenses and increasing competitiveness

Cost efficiency is another critical factor driving the adoption of chiplets. Traditional chip fabrication, especially at the cutting edge, is exceedingly expensive, with costs escalating as transistors shrink. The chiplet approach mitigates these costs in several ways.

First, it allows for the use of older, more cost-effective manufacturing processes for certain components. Second, by constructing a processor from multiple smaller chiplets, manufacturers can significantly reduce the yield loss associated with defects in large monolithic chips.

If part of a chiplet is defective, it doesn’t render the entire chip unusable, as would be the case with a traditional design. This translates directly into cost savings, making high-performance computing more accessible. This aspect is especially critical for cost-sensitive sectors such as wireless communications, consumer electronics, and industrial applications.

3. Ecosystem development: Fostering collaboration and innovation

The shift to chiplets also encourages the development of a more collaborative and innovative ecosystem in the semiconductor industry. With chiplets, different companies can specialize in various types of computing hosts and accelerators, contributing their expertise to a larger whole.

This openness can lead to a more vibrant ecosystem, as smaller players can innovate in specific areas without the overhead of designing entire chips. Such collaboration could accelerate technological advancements, benefiting newcomers in the automotive and consumer electronics vertical, for instance, and leading to more rapid iterations and improvements in technology.

4. Portfolio management: A strategic approach to product development

Finally, the transition to chiplets allows companies to manage their product portfolios more effectively. With the ability to mix and match different chiplets, a company can more quickly and efficiently adapt its product offerings to meet market demands. This flexibility enables faster response times to the emerging trends and customer needs, providing a competitive edge.

Additionally, the ability to reuse chiplets across multiple products can streamline research and development, reducing time-to-market and R&D expenses. The flexibility to mix and match chiplets for different configurations makes it easier to tailor chips to specific market segments and is particularly suited to the needs of the consumer and automotive markets.

Overall, the chiplet architecture is poised to revolutionize the semiconductor industry, with each sector finding unique value in its capabilities. This tailored approach ensures that chiplets will play a critical role in driving forward the technological advancements of each industry vertical.

Guillaume Boillet, senior director of product management and strategic marketing at Arteris, drives the product lifecycle of the interconnect IP and SoC integration automation portfolios.

 

Related Content

• A sneak peek at chiplet standards
• Bringing Tiny Chiplets To Embedded SoCs
• Intel’s next-generation CPUs hide chiplets inside
• How the Worlds of Chiplets and Packaging Intertwine
• Off-the-Shelf Chiplets Open New Market Opportunities

The post The chiplet universe is coming: What’s in it for you? appeared first on EDN.

Dallas-based Texas Instruments (TI) has introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, providing what is claimed to be the highest power density at a lower cost. TI’s new 100V integrated gallium nitride (GaN) power stages feature thermally enhanced dual-side-cooled package technology to simplify thermal designs and achieve the highest power density in mid-voltage applications at more than 1.5kW/in3. The firm’s new 1.5W isolated DC/DC modules with integrated transformers are claimed to be the industry's smallest and most power-dense, helping engineers to shrink the isolated bias power-supply size in automotive and industrial systems by over 89%...

Author: Dr Abhilasha Gaur, Chief Operating Officer, Electronics Sector Skills Council of India (ESSCI)

Dr Abhilasha Gaur, Chief Operating Officer,
Electronics Sector Skills Council of India (ESSCI)

A circuitous future awaits in India’s electronics sector! This vibrant industry is at the cusp of a major growth phase – poised to rise like voltage through a resistor. Demand for electronics products is surging as rapidly as current through a superconductor. Smartphones, laptops, tablets, and gadgets are energizing the Global and Indian market. At the same time, the push for Make in India and Digital India is catalysing growth – like doping silicon with atoms.

From appliances to automation, electronics have become ingrained into every facet of our lives. The PCBs, chips and sensors form the nervous system that powers our gadgets, devices and machines. The electronics industry is currently in the midst of a significant growth spurt, with rising revenues, innovations, and opportunities creating a high demand for qualified workers. Electrifying opportunities lie ahead for skilled professionals. So, charge your enthusiasm, expand your knowledge, and get set to launch into an electronics career that will shine like a supernova. The only thing stopping the brightest paths from being discovered are your creative ideas. The outlook for 2024 is sparky and bright. Are you ready to switch careers and become part of India’s electronics growth story? Here are 5 career roles that are expected to be in high demand in 2024:

Embedded Systems Engineer

With electronics and internet-connected devices becoming more compact yet sophisticated, there has been a rising demand for qualified embedded systems engineers who can design and program the complex integrated circuits and small microprocessors that go into smart devices. From home appliances and wearable gadgets to automotive systems and industrial equipment, embedded technology runs the show behind the scenes. They are the backbone of modern electronics found in consumer devices, automobiles, industrial equipment, and more.

The complexity and demand for embedded devices have surged with rising automation, IoT and focus on localization of electronics manufacturing in India. This has created increased demand for skilled embedded systems engineers who can design, develop and maintain embedded firmware, hardware and software. As per a LinkedIn Emerging Jobs report, embedded software development is one of the top emerging jobs.

Key skills required are expertise in languages like RTOS, working with various SoC architectures, interface protocols like UART, SPI, I2C, CAN etc. and tools such as Visual Studio, Eclipse IDE. Electronics engineers with relevant embedded training and certification have a strong advantage. Testing, debugging and analysing the software are an integral part of the role.

According to NASSCOM, India’s embedded engineer workforce will need to grow 6X from 180,000 in 2018 to 1.2 million by 2025 to meet domestic demand. The average salary of embedded engineers in India ranges from ₹5 lakhs to ₹12 lakhs per annum for freshers, going up to ₹25 lakhs for mid to senior roles.

Mechatronics Engineer

Modern automobiles employ a wide array of electronics to enhance performance, safety, comfort, and passenger experience. Foundational electrical systems have now advanced into much more complex domains like smart infotainment, driver assistance technologies, electric powertrain systems and autonomous driving capabilities. This evolution within automotive electronics is creating promising avenues for qualified engineering professionals. In manufacturing, you could design automated systems and robots using PLCs (Programmable Logic Controllers), sensors, actuators, and drives. You may also work on SCADA (Supervisory Control and Data Acquisition) systems to remotely monitor equipment and processes through HMIs (Human Machine Interfaces).

As per McKinsey & Co estimates, electronics systems already account for 40% of automotive costs and their share is expected to grow over 50% by 2030. Disruptive trends like vehicle electrification, connected mobility and self-driving will further accelerate electronics innovation in the automotive sector.

Automotive electronics engineers require specialised knowledge spanning computer engineering, electrical/electronic circuits, software programming as well as vehicle design and mechanics. Key focus areas include designing ECUs (engine control unit), ADAS (advanced driver assistance systems), infotainment systems, telematics, lighting systems etc. Automotive communications protocols like CAN bus and FlexRay are also covered. Engineers in this field must stay updated with the latest breakthroughs in AI, sensors, battery technology to excel.

The automotive sector in India has witnessed steady growth with domestic sales projected to reach $300 billion and exports to $80 billion by 2026. Automotive electronics engineers earn attractive pay packages ranging from ₹5 lakhs per annum for freshers to over ₹18 lakhs for engineers with over 6 years of experience.

VLSI Design Engineer

VLSI refers to the integration of millions of transistors onto a single silicon chip to build complex integrated circuits and microprocessors. VLSI design engineers are responsible for designing, testing and developing VLSI chips and electronic components. Increased focus on electronics manufacturing and applications across automotive, consumer electronics, telecom, and other sectors has amplified the demand for skilled VLSI design engineers in India.

Engineers proficient in tools like Cadence, Mentor Graphics, programming languages such as Verilog, VHDL and key concepts of digital logic design and semiconductor fabrication are highly valued. Hands-on experience with FPGA prototyping is an added advantage.

Aspiring VLSI engineers must gain expertise in areas like VLSI circuits, semiconductor physics, design verification, signal processing, chip design and layout. Knowledge of hardware description languages like Verilog and VHDL along with simulation tools is imperative. VLSI engineers collaborate closely with design teams to deliver optimized chip architectures. With scaling of device geometries, design complexities are increasing. Adaptability to evolving standards and tools will be key. VLSI is one of the highest-paying engineering specializations in India, with average salaries ranging from ₹7 lakhs per annum for freshers going up to ₹25 lakhs for experienced roles.

PCB Design and Manufacturing

Printed Circuit Board (PCB) design and manufacturing is a key field in electronics engineering dealing with the design, testing and fabrication of PCBs that provide the foundation for almost all electronic devices and systems. As a PCB design engineer, you would use CAD software tools like Altium, OrCAD, Eagle etc to design the layout of a PCB including the components, connections, layers, footprints as per the circuit schematics and requirements. You need strong skills in schematic capture, component library management, routing, signal integrity, electromagnetic compatibility and PCB fabrication processes. You would work closely with circuit designers and electronics engineers to create the gerber files needed for PCB production.

In PCB manufacturing, you would work in positions like process engineering, equipment engineering, quality control etc. This involves knowledge of PCB fabrication techniques like photolithography, etching, drilling, plating, solder masking, automated optical and x-ray inspection. You would monitor the PCB production process flow and maintain, optimize, and troubleshoot the equipment. You would also be responsible for testing the fabricated PCBs against specifications and ensuring quality standards.

With the growth in consumer electronics, IoT, defence systems and industrial automation, there is increasing demand for more compact, efficient and reliable PCBs. As a PCB design and manufacturing engineer, you get to work on cutting-edge electronics products in fields like automotive, aerospace, consumer appliances, medical devices etc. It provides opportunities to travel and work in fabrication facilities worldwide. With your expertise in both design and manufacturing, you can build a rewarding career in the electronics industry.

The Indian PCB design and manufacturing market is growing rapidly. According to a report by IMARC Group, the Indian PCB market is expected to reach US$ 11.8 billion by 2028, exhibiting a CAGR of 16.6% during 2023-2028. Several factors are fuelling the expansion of the Indian PCB market, including the burgeoning Indian electronics sector, heightened consumer demand for electronics products, and the widespread adoption of cutting-edge technologies such as 5G and the Internet of Things (IoT). If you are interested in becoming a PCB designer, there are several steps you can take to get started. First, you should consider pursuing a degree in electronics engineering or a related field. You can also gain experience by working as an intern or apprentice in a PCB design and manufacturing company.

Drone Specialist

The drone ecosystem in India is poised for massive growth, with the sector projected to grow at 30% CAGR through 2025. Liberalized drone policies and increased adoption of drone technology across agriculture, mining, defence, logistics, entertainment and other sectors has opened up numerous opportunities for drone specialists.

Drone specialists are essentially electronics engineers who conceptualize, design, develop, assemble, program and maintain unmanned aerial vehicles. They need strong expertise in embedded systems to build flight controllers, expertise in electronics hardware design to create reliable power systems, motors and batteries, knowledge of sensors, wireless communication systems, materials science and autonomous flight control algorithms using robotics and computer vision.

Drone specialists find roles in UAV/drone technology startups that are mushrooming in India, service providers that operate drone fleets, drone consultancies that advise enterprises on drone adoption as well as companies from end-user sectors like mining, agriculture, surveillance, mapping etc that leverage drones extensively. The average salary for drone specialists in India ranges from ₹4-7 lakhs per annum for freshers and can go up to ₹15-18 lakhs per annum for engineers with more than 5 years of experience. With strong growth anticipated in the Indian drone landscape, there are rich opportunities for electronics engineers who specialized in this futuristic domain.

Conclusion:

The electronics sector is experiencing significant growth, with the government’s commitment to the sector and the increasing demand for electronic products driving the growth. The sector offers a wide range of career opportunities, from electronic and electrical engineers to product safety engineers and semiconductor engineers. As new technologies continue to emerge, the demand for skilled electronics professionals will grow, and the industry will need innovative thinkers and problem-solvers to drive its forward. By exploring these career opportunities and the various industries they serve, individuals can make informed decisions about their educational and career paths in the electronics sector.

The post Aspiring & Promising Career Opportunities in the ESDM industry 2024 appeared first on ELE Times.

my first custom contraption that is powered by a Lithium ion battery from a broken solar powered power bank, a board from a simple fan in a toy gas mask, and a led/ resistor indicator. I learned everything i know so far from electroboom. other than that Im new to all of this (ignore the soulder points they’re temporary) any feedback or suggestions appreciated submitted by /u/Professional_Lie_512 [link] [comments]

The struggle against financial fraud is an ongoing battle, with significant repercussions for both the economy and individuals. As scammers grow more clever, using complex strategies, the old ways of spotting these deceptions are no longer enough. Enter generative AI, an innovative force ready to transform how we protect against financial deceit.

The need for generative AI in finance is clear, given that US fintech firms lose $51 million annually to fraud, which is a significant slice of their earnings. This stark fact highlights the urgent demand for more effective fraud-fighting strategies, with generative AI stepping up as a key contender. Its ability to spot and predict elaborate fraud plans before they happen strengthens the defenses of financial bodies significantly.

This overview explores the critical role generative AI plays in identifying fraud, showcasing its benefits, challenges, and the potential it holds for a more secure financial future. Through generative AI, we’re not just enhancing transaction security; we’re ushering in a new age of financial trustworthiness. Let’s dive into the specifics of generative AI in fraud prevention and the bright future it promises in keeping our financial dealings secure from increasingly sophisticated fraud schemes.

Getting to Know Generative AI

Generative AI falls under the umbrella of artificial intelligence technologies capable of creating new data that mimics but isn’t exactly like its training data. Unlike conventional AI, which sorts or categorizes data, generative AI has the unique ability to generate, lending itself to innovative and adaptable solutions. This is especially valuable in creating scenarios like fake transactions to refine fraud detection tactics.

Generative AI’s Impact on Fraud Detection

Leading the charge in improving fraud detection within finance, generative AI offers a dynamic, forward-thinking approach for institutions aiming to bolster their security. It can accurately mimic fraudulent behavior, allowing financial entities to anticipate and counter new fraud methods early on. As it continues to evolve, generative AI not only helps spot emerging fraud strategies but also supports the development of timely, effective counteractions.

Banks and financial institutions leveraging generative AI have observed a significant decrease in the volume of unidentified fraud cases, underscoring the technology’s capability to foresee and neutralize risks proactively. This success is largely attributed to the technology’s ability to learn from vast datasets, improving its predictive accuracy over time.

The application of generative AI for financial services goes beyond mere detection; it embodies a comprehensive approach to understanding and combating fraud by generating complex simulations of fraudulent activities. These simulations allow institutions to test and refine their detection systems in a controlled environment, ensuring they are well-prepared for actual threats.

Additionally, generative AI is revolutionizing financial services by enhancing detection methods and strengthening the overall security against intricate and evolving threats. By simulating sophisticated fraud scenarios with unmatched precision, generative AI arms financial institutions with the tools to proactively spot and counteract potential dangers, thereby protecting consumer transactions and deepening trust within the financial landscape.

Advantages and Evolution in Financial Security

Incorporating generative AI into the tools used to spot fraud brings a new level of early intervention capabilities and accuracy to financial organizations, offering insight and detection that were once beyond the grasp of older methods.

This leap in technology paves the way for uncovering nuanced patterns and irregularities that might elude traditional analysis, effectively minimizing the chance of complex fraud schemes going unnoticed. Additionally, the adaptable nature of generative AI ensures it keeps pace with expanding data and shifting fraud strategies, enabling these systems to refine and enhance their detection capabilities continually.

Through its advanced learning and simulation prowess, generative AI equips financial bodies with the tools for an anticipatory approach to fraud, markedly reducing the frequency of successful fraudulent activities. This proactive protection not only defends the financial assets of these institutions but also builds a stronger bond of trust and reliability with their clientele, who feel increasingly protected during their financial engagements.

Navigating Challenges and Future Directions

However, the application of generative AI in fraud detection faces hurdles, including data privacy concerns and the dependency on high-quality, abundant training data. Overcoming these challenges is vital for its ethical and successful deployment in fraud prevention.

The outlook for generative AI in fraud detection is optimistic, with ongoing advancements poised to amplify its capabilities further. Emerging technologies like blockchain and quantum computing may enhance generative AI’s effectiveness, leading to more predictive and preventive fraud detection approaches and a significant reduction in financial fraud occurrences.

Conclusion

Generative AI marks a pivotal advancement in combating financial fraud, providing innovative, effective solutions to a complex problem. Its capacity for adaptation, learning, and data generation positions it as a key asset in securing financial transactions. Despite existing challenges, the promise of generative AI in boosting financial security is undeniable. As we continue to develop and refine these technologies, the prospects for fraud detection in financial transactions grow increasingly robust.

Moving deeper into this era of tech innovation, it’s evident that generative AI is transforming into a vital tool for ensuring the safety of financial ecosystems against fraud. Looking ahead, we can anticipate conducting financial transactions with greater assurance and security, all thanks to the pioneering spirit of generative AI.

The post Generative AI for Fraud Detection: Strengthening Security in Financial Transactions appeared first on Electronics Lovers ~ Technology We Love.

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA says that Dr Vincent (Chuck) D. Mattera Jr is to retire as CEO following the commencement of employment of his successor...

In power converters, the input capacitors are fed through inductive cabling to the power source. Parasitic inductance will cause ringing of the input voltage to almost twice its DC value when first plugged into the system, also called hot plugging. An insufficiently damped power converter input and a lack of inrush control can damage the converter.

Using input bulk electrolytic capacitors to dampen the input voltage of the off-battery converters can prevent excessive voltage ringing when first applying battery power, while also preventing resonances that can destabilize the converter. With the move to 24 VIN and 48 VIN systems from the traditional 12 V automotive battery, the need to properly dampen the input becomes even more important. 12V battery systems typically use components rated for 40 V or higher to survive short-duration voltage spikes under load-dump conditions. The maximum DC voltage for these 12 V systems can reach 18 VDC. Hot plugging can cause input ringing with the voltage nearing twice the input, such as 36 V. This is well below 40 V or higher rated components. However, in a 48 V system where steady-state input voltages can reach 54 V, ringing on the input can potentially exceed 100 V, damaging components rated for 80 V.

With traditional 12 V systems, one often assumes the damping capacitors have enough effective series resistance (ESR) to tame the resonance. But, with low-cost aluminum electrolytic capacitors, the actual effective ESR is generally much lower than the published maximum, resulting in much less damping and much more ringing when applying battery power. With 12 V systems, the reduced damping may still be enough to prevent destabilization of the downstream DC/DC, and the ringing will not cause damage. However, in 48 V systems that are more vulnerable to ringing, you can add discrete resistors in series with the input damping capacitors. Based on steady-state ripple currents, a size 0603 (1608 metric) should suffice.

In Figure 1, L1 and C1 values from an existing DC/DC converter’s input filter create a resonance that is expressed by Equation 1:

We chose the target damping capacitor (Cd) and damping resistance (Rd), based on the TI E2E design support forums technical article, “Damping input bead resonance to prevent oscillations”. Cd should be ideally at least three times C1. We chose a 150 µF standard value for Cd.

Equation 2 expresses the target damping resistance:

For damping resistor (Rd), add two paralleled 1 Ω resistors in series with Cd.

Figure 1 A simplified input filter with damping to prevent excessive voltage ringing when first applying battery power, while also preventing resonances that can destabilize the converter.

Figure 2 shows the simulated hot-plug response both without and with the added 0.5Ω damping resistor in series with Cd.

Figure 2 Simulation of hot plugging without and with damping 0.5Ω damping resistor in series with Cd.

We achieved damping of the input filter by using the correct damping resistor and capacitor combination. There is one aspect, however, that is easy to overlook. In the lab, we experienced the destruction of the damping resistor (Rd) when hot plugging to the supply. What we realized is that the damping resistor has a peak power expressed by Equation 3:

For our 1 Ω resistors across 54 V, that would be about 2,900 W peak in each resistor. Furthermore, the resistor dissipates nearly the same energy as that stored in the damping capacitor (Cd) in a very short period of time. This energy stored in the damping capacitor is expressed by Equation 4:

In our case, that energy is shared equally between the two 1 Ω resistors. A capacitance of 150 µF at 54 VIN is approximately 220 mJ total, or 110 mJ in each 1 Ω resistor. This is a slightly stringent assumption, as the internal ESR of Cd reduces the actual peak voltage across these resistors by about 4%.

Mapping the actual inrush surge to the curve in the surge rating graphs is not straightforward. The actual surge profile will be roughly a decaying exponential waveform, while the resistor ratings assume a fixed-duration constant power, as shown in Figure 3.

Figure 3 Example of surge-rated resistor ratings showing a roughly decaying exponential waveform.

A conservative approach would be to divide the total energy dissipated in the resistor by the peak power. You can then check this resulting pulse duration against the surge rating graph of the resistor. The calculated pulse will be more severe than the actual pulse, which is the same heating energy spread out over a greater time frame. For our case, in each resistor, 110 mJ divided by 2,900 W is 38 µs. A surge-rated resistor size of 2512 SG733A/W3A can handle 4.5 kW for approximately 40 µs, which means that this package resistor is suitable for this application. General-purpose resistors in the same 2512 package have power ratings more than an order of magnitude lower than surge-rated resistors.

This calculation does ignore the series inductance effect. An inductor will slow the rise of current into the resistor and reduce maximum power, but will also add total losses from overshoot, as shown in Figure 2. The simulation results including the 10 µH inductor show peak power in the resistor dropping by 30% from the 2.9 kW calculated power, but the total energy in the resistor is 17% higher than the 110 mJ calculated earlier. The rating curves show that the allowed energy follows the peak power ratio to the negative two-thirds power. Thus, a 30% reduction in peak power enables 27% more losses, and our calculations remain conservative for both without and with series input inductance.

Avoiding failures from hot plugging

While the best automotive installation and maintenance practices will avoid hot plugging, there is a realization that errors will occur. Following procedures stated in this article will avoid costly damage to the system. As your partner in power management, TI is in constant pursuit of pushing the limits of power.

Hrag Kasparian, who joined Texas Instruments over 10 years ago, currently serves as a power applications engineer, designing custom DC-DC switch-mode power supplies. Previously, he worked on the development of battery packs, chargers, and electric vehicle (EV) battery management systems at a startup company in Silicon Valley. Hrag graduated from San Jose State University with a Bachelor of Science in electrical engineering.

Josh Mandelcorn has been at Texas Instrument’s Power Design Services team for almost two decades. He has designed high-current multiphase converters to power core and memory rails of processors handling large rapid load changes with stringent voltage under/overshoot requirements. He is listed as either an author or co-author on 17 US patents related to power conversion. He received a BSEE degree from Carnegie-Mellon University.

Related Content

• Power Tips #125: How an opto-emulator improves reliability and transient response for isolated DC/DC converters
• Power Tips #124: How to improve the power factor of a PFC
• Power Tips #123: Using a double-boost converter to extends the power range of high-conversion-ratio designs
• Power Tips #122: Overview of a planar transformer used in a 1-kW high-density LLC power module

Additional resources

• Download the Power Stage Designer software tool

The post Power Tips #126: Hot plugging DC/DC converters safely appeared first on EDN.

As part of the US CHIPS and Science Act, the US Department of Commerce has announced $1.5bn in planned direct funding for New York-headquartered GlobalFoundries (GF), which is celebrating 15 year of operations and is the only US-based pure-play foundry with a global manufacturing footprint including facilities in the USA, Europe and Singapore. The investment aims to enable GF to expand and create new manufacturing capacity and capabilities to securely produce more chips for automotive, IoT, aerospace, defense and other vital markets...

Dowa Electronic Materials Co Ltd of Tokyo, Japan has developed and released a high-efficiency short-wavelength infrared (SWIR) LED chip series with what is claimed to be record luminous efficiency in the peak wavelength range 1200–1900nm...

AEC-Q200 compliant, compact, vertical surface-mount design, ideal for harsh environment applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced the SM10 Varistor Series, a revolutionary Metal Oxide Varistor (MOV) designed to provide superior transient surge protection in automotive electronics, electric vehicles (EVs), and various other applications. This latest addition stands out as the first surface-mounted MOV device compliant with the AEC-Q200 automotive standard, capable of withstanding high operating temperatures and offering ultra-high surge current handling in a compact package.

The SM10 Series Varistor is a game-changer in the industry, offering:

• High Operating Temperature: Able to withstand temperatures up to 125 degrees Celsius, ensures reliability in harsh conditions.
• AEC-Q200 Compliance: Meets rigorous automotive electronics standards, suitable for Electric Vehicles (EVs) and charging stations.
• Ultra-High Surge Capability: Excellent repetitive surge capability handles up to 40 pulses of 6 KV / 3 KA surges, significantly extending product reliability and lifespan.
• Compact Design: With dimensions of 15.7 mm x 8.5 mm x 14 mm, it saves valuable PCB surface space and is ideal for automated SMT PCB assembly processes.
• Wide Voltage Rating: Ranging from 130 Vac to 625 Vac, accommodating a broad spectrum of electronic applications.

“The SM10 Series Varistors effectively protect electronic circuits against multiple transient voltage surges with ultra-high surge handling capability,” states Johnny Chang, director of product management at Littelfuse. “They are AEC-Q200 compliant, enabling end-products to work in harsh ambient environments for longer lifetimes.”

Amy Chu, global product manager at Littelfuse, adds, “The vertical surface-mounted SM10 Series Varistors enable electronics designers to realize a ‘SMT components only policy’ for primary side circuit surge protection. Their compact size and ability to replace through-hole devices allow for fully automated and SMT PCB assembly processes.”

The SM10 is ideal for a variety of demanding applications, including:

• Automotive electronics
• Electric vehicles and charging stations
• Building automation
• Appliances
• Consumer electronics
• Power storage systems
• High-end power supplies

Compared to existing solutions, the SM10 Series offers unparalleled performance with its high operating temperature, excellent repetitive surge capability, and compact size. This combination makes it an attractive option for automotive, appliance, and building automation industries requiring reliable high-surge varistors.

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Author: STMicroelectronics

eDSim is our latest simulation tool for switched-mode power supplies (SMPS) and other power analog circuits. The tool runs on the SIMPLIS/SIMetrix engine, is available to download for free on our website, and is governed by a free-to-use commercial license. In a nutshell, our eDSim models are exempt from node limit count, thus enabling engineers to utilize them without restrictions on the number of nodes or circuit size. We even worked on a workflow that allows users to export a design out of eDesignSuite and into eDSim to help them run more detailed simulations faster. ST is also working on an online version of eDSim to optimize further the experience of designing and simulating a circuit.

Why did we decide to work on this? The challenges behind designing power circuits

Power circuits are notoriously difficult to design because of their inherent complexity. Engineers must account for a specific load and how the overall circuit responds when there are sudden shifts in the line voltage or the load current due to spikes or low loads. In the case of an SMPS, teams must ensure that cycles are consistent, meaning that no significant fluctuations disrupt voltage regulations. It’s also critical to examine how the circuit performs under regular operations to determine the overall quality of the design. Is the ramp-up, when the input voltage is first applied, smooth, or is there a massive under- or over-shoot, among other issues?

The necessity of running simulations A simulation in eDSim

Until simulations came along, the only way for engineers to test their power circuit was to design a PCB layout, manufacture it, and then physically try it in their lab. The obvious problem is that the process is slow and extremely expensive. Furthermore, because power calculations are often based on differential equations, complex models, and matrix computations1, teams may spot a problem but may not have an obvious solution to it, requiring even costlier trial-and-error operations. Hence, simulators are an essential tool when designing a power circuit. Unfortunately, licenses can be expensive, and knowing what software to use isn’t always obvious. Consequently, we tackled this problem so our partners wouldn’t have to.

Why did we invest so much time and money into eDSim? 10x to 50x faster

In essence, eDSim takes the SIMPLIS/SIMetrix engine and runs it on ST components and models. Why choose this engine? According to our benchmarks, simulating a synchronous step-down converter based on our L6983 would take between 10 minutes and 50 minutes on OrCAD PSpice, but only one minute or less on eDSim, thanks to its SIMPLIS/SIMetrix implementation. OrCAD PSpice takes a general-purpose approach to circuit simulation, which explains why it is very popular in many other instances. On the other hand, SIMPLIS/SIMetrix specializes in the types of calculations that are essential when simulating a power stage, which is why it can be 10 to 50 times faster at modeling a switching circuit.

A useful license for the ST community

ST worked with SIMPLIS Technologies to ensure we could provide professional engineers with one of the most flexible licenses. For instance, working with one of our models doesn’t contribute to the eDSim node count or circuit size limit, regardless of its complexity. A brief overview eDSim will reveal that we have tens of models for SMPS and analog ICs. We are also in the process of extending the coverage with power discrete and other smart power devices in future releases.

How to get started?

eDSim is a testament to our desire to create more accessible solutions and bridge digital divides. By working with SIMPLIS Technologies to offer our utility for free, any engineer can build a power circuit and learn from one of the most powerful simulators in the industry. All it takes is to download eDSim from ST.com. Additionally, to increase accessibility even further, we are happy to announce that we are working on an online version of eDSim and will update this blog post when it becomes available. In the meantime, we published the videos below to show how to get started, and we are also offering an example application built on the L6983.

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In booth #1045 at the IEEE Applied Power Electronics Conference & Exposition (APEC 2024) in Long Beach, CA, USA (25–29 February), Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — is highlighting what it claims is the industry’s most comprehensive portfolio of GaN-based power conversion solutions. With a focus on efficiency, reliability and performance, EPC says that its GaN-based products offer advantages for applications such as DC-DC converters, motor drives, and renewable energy...

Delta Electronics, Inc., a global provider of IoT-based Smart Green Solutions, announced it has achieved double “A” scores in the 2023 Climate Change and Water Security reports of CDP for the third time. This year’s double “A” score was granted to only 61 companies out of over 21,000 worldwide based on their superior contribution to climate change and water security challenges. Delta’s recent key climate change and water security endeavours include the implementation of an internal carbon pricing (ICP) mechanism since 2021 to accelerate carbon reduction initiatives, the successful 13.5% YoY reduction in its Scope 1 and 2 greenhouse gas (GHG) emissions, the increase in the proportion of renewable electricity used in its global operations to 63%, and the reduction in its water withdrawal and water discharge by over 4% YoY.

Jesse Chou, Delta’s Chief Sustainability Officer, said, “CDP honoring Delta’s climate change and water security endeavors with top scores for the third time is a major milestone for us. In 2023, Delta became a member of The Taskforce on Nature-related Financial Disclosures (TNFD) Forum and completed the first biodiversity risk assessment of Delta’s sites. In January of this year, Delta also became an early TNFD adopter. Externally, we have incorporated our climate transition plan into our Annual Shareholders’ Meeting and quarterly investor conferences agendas. Internally, we have completed a GHG inventory for 15 categories under Scope 3 to identify key areas for future emissions reduction. Hence, we look forward to collaborating closely with our value chain partners to achieve our ultimate Net-zero SBT goal by 2050.”

Delta has been actively implementing climate change governance. Since 2021, Delta has included the achievement of its percentage of renewable electricity in its senior executive performance indicators. Delta estimates it surpassed its 2023 renewable electricity usage target, reaching over 70% in its global operations comes from renewable sources, with the respective figure exceeding 80% in its Taiwan operations. In 2021, Delta also implemented an ICP scheme of US$300 per metric ton of CO2 emissions, which is invested in energy-saving and carbon reduction projects, as well as in the development of carbon-negative technologies and low-carbon innovation, contributing to the company’s progress toward RE100 and Net-zero SBT.

In terms of biodiversity, Delta has collaborated with the National Museum of Marine Science & Technology to establish the Asia’s first zero-carbon coral conservation center. Through the Task Force on Climate-related Financial Disclosures (TCFD) framework, Delta assesses climate change risks and opportunities, translating them into operational strategies and actively exploring green opportunities such as electric vehicles, energy storage, and hydrogen energy.

Benjamin Lin, President, Delta Electronics India “This recognition reaffirms our unwavering dedication to sustainability. We are continuously pushing boundaries, implementing innovative solutions like internal carbon pricing and exploring green opportunities like EVs and hydrogen energy. We are confident in achieving our Net-Zero SBT goal by 2050 through collaboration with our stakeholders.”

Regarding water security management, although Delta is not a heavy water user, the Company has established strategic goals and methodologies, implementing them in daily operations. In 2022, Delta conducted a water risk assessment for its global sites and formulated a water resource policy across the entire organization. The Company also assessed its tier-1 suppliers engaged in ongoing business transactions and incorporated the assessment results into decision-making. In 2022, Delta achieved a 12.8% YoY reduction in its global water productivity intensity, with its total water withdrawal and water discharge decreasing 4% YoY despite the higher revenue delivered.

CDP’s annual assessment and scoring process is recognized as an important standard for environmental transparency. In 2023, more than 740 investors with over 136 trillion in assets and over 300 major procurement organizations with a combined spending of 6.8 trillion requested companies to disclose information about their environmental impacts, risks, and opportunities through the CDP platform. In this latest CDP reports, more than 21,000 companies to participated the assessment, the highest number ever recorded. Delta has been included in the CDP A List for Water Security Management for four consecutive years and has received leadership scores in the Climate Change category for seven years.

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SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-frequency, high-temperature and high-efficiency power semiconductor devices — has unveiled the latest addition to its QSiC family. The QSiC 1200V SiC MOSFET modules in full-bridge configurations deliver near-zero switching loss, significantly improving efficiency, reducing heat dissipation, and allowing the use of smaller heat-sinks...

As regular readers may already recollect, I’ve got two vehicles in outdoor storage, which (at minimum) I start once a year to reorder them and drive the one now in front to a nearby emissions testing center.

Stored-vehicle batteries inevitably drain, and their tires slowly-but-surely also deflate. Which is why the PowerStation PSX3 has long had a rarely-but-repeatedly used prized place in my gadget stable. I’ll start with some stock shots of the product:

As you can tell, it’s (among other things) a portable recharger and jump-starter of vehicles’ cells. It’s also a portable tire inflater. And it’s an emergency light and USB power source, too:

all of which makes it handy to have with me at all times in my Eurovan Camper, for example:

Here’s my unit in all its dusty, dirty glory:

Cables, etc. inside the “door”:

along with closeups on those stickers you saw in the overview shots:

Here’s the thing, though. If you visit the product page, you’ll find that the PowerStation PSX3 is no longer being sold. And after many years of occasional use, in combination with deep discharge cycles between uses, the embedded sealed lead-acid battery in mine had become effectively unusable; it’d take forever to charge, if I could get it to fully charge at all, and its ability to inflate tires and jumpstart vehicles was a shadow of its former self.

My first “bright idea” was to pick up one of those newfangled chargers you may have noticed often on sale at Amazon and elsewhere, which I’m assuming are all Li-ion battery-based (since NiMH cells wouldn’t deliver the necessary “punch”). For tire inflation purposes, I alternatively had a nifty adapter in the garage that leveraged my stock of Black+Decker 20 V MAX multi-purpose batteries:

It wasn’t as powerful as the PowerStation PSX3 had been in its prime, but I had a bunch of batteries and they’re easy to transport, so I figured a jumpstart-only device would suffice as a PowerStation PSX3 successor.

I tried three of these widgets, one claiming to deliver 1200 A of “peak” cranking juice:

Another spec’ing 1500 A:

And a third that promised to deliver 2000 A:

They all promptly went back to Amazon as full-refund returns. Now granted, if someone had left their interior dome light on too long and the battery was drained too low to successfully turn over the engine but still had some “life” one of these might suffice, which is why this combo jump-starter/tire inflater/USB charger/light still resides in the back of my wife’s SUV:

And I’ll grant them one other thing: they’re certainly small and light. But 2000 A of cranking current? Or even 1500 A? Mebbe for a fraction of a second, the time necessary to drain an intermediary capacitor, but not long enough to resurrect a significantly drained battery. Therefore, the quotes I put around the word “peak” earlier. Such products exemplify the well-worn saying, “mileage may vary”. Give me an old-school lead acid battery instead, any day!

At that point, I had another idea, which ended up being brighter. As I wrote about last summer, uninterruptable power supplies (UPSs) often have replaceable embedded batteries (unless the manufacturer has intentionally designed them otherwise, of course). Could the PowerStation PSX3, with user-accessible screws on its backside, be similar?

Yes, hope-inducing YouTube videos like this one reassured me, it could!

(I too hate throwing things out if it wasn’t already intuitively obvious)

At this point, I had maybe my brightest idea of all, if I do say so myself. In that earlier UPS writeup, I’d mentioned that I’d bought six replacement batteries for $49.99 total on sale (they’re now $119.99 for six as I write these words). They were purchased through Amazon but were shipped directly from the manufacturer, Mighty Max. The thing is, though, the first shipment delivered to me was not six smaller batteries but one much larger one.

The Mighty Max rep promptly apologized, sent me the correct ones, and told me to hold onto the first one in case I ever found a use for it. Hmmm…Where in the garage did I put that box?

And hey, it’s not only got the correct dimensions, but the terminals’ polarities match!

Additional included hardware, which I didn’t end up needing to use:

Cool, let’s remove those screws and crack this device open!

At this point, I need to beg for forgiveness from you, dear readers. Were this a proper full teardown, I wouldn’t stop at this point. But the objective here was not to fully dissect the product. It was instead to resurrect it to full health. So, squelching my own curiosity, not to mention all of yours’ in the process, I stopped here. That said, for example, you can clearly see the massive-percentage-of-total-volume motor that implements the air compressor function:

And here’s our patient on the other side:

The negative battery terminal was corroded, so I cleaned everything up in the process of disconnecting it:

The positive terminal was more pristine:

At this point, however, after wrestling the old battery out of its captivity:

I realized I had a problem. Here’s the final shot of the old cell:

And here’s another perspective on the new one:

See what’s different? The two batteries are the same size. And the terminals’ polarities do match. But the terminals’ exact locations are not the same. Force-fitting the negative terminal re-connection was fairly straightforward, since I just had to stretch a few wires already with sufficient slack. The positive terminal reconnection, on the other hand, was admittedly more of a MacGyver move (and I admittedly almost skipped on sharing this image with you, out of embarrassment and fear of your mockery…but hey, at least no duct tape was involved!):

But at the end of the day, I ended up with a good-as-new PowerStation PSX3. Huzzah!

Comments are as-always welcomed…just please be gentle about my MacGyver move…

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Vehicle emissions: Issues and workarounds for various monitoring conditions
• Putting an APC UPS out of its (and my) misery
• Resurrecting a 6-amp battery charger
• The Schauer TB10012 battery charger

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A new process design kit (PDK) from imec aims to provide broad access to a 2-nm gate-all-around (GAA) process node and associated backside connectivity for design pathfinding, system research, and training. This foundry PDK features the necessary infrastructure for digital design based on a set of digital standard cell libraries and SRAM IP macros.

The design PDK—enabling virtual digital designs in imec’s N2 chip manufacturing process technology—comes embedded with EDA tool suites from Cadence Design Systems and Synopsys. And it aims to train the semiconductor experts of tomorrow and enable the industry to transition to next-generation process technologies through meaningful design pathfinding.

Source: imec

Foundry PDKs—which provide chip designers access to a library of tested and proven components—are usually available once process technology reaches a critical level of manufacturability. And here comes the catch: there is restricted access and the need for non-disclosure agreements (NDAs). That, in turn, creates a high threshold for academia and industry to access advanced technology nodes like 2-nm during their development.

What imec’s N2 PDK is trying to do is provide young semiconductor engineers in academia and industry with early access to the infrastructure needed to develop design skills on advanced technology nodes such as 2 nm. “The design pathfinding PDK will help companies to transition their designs to future technology nodes and pre-empt scaling bottlenecks for their products,” said Julien Ryckaert, VP of Logic Technologies.

Next, the accompanying training courses will acquaint engineers with the most recent technology disruptions such as nanosheet devices and wafer backside technology. The training program, starting in the second quarter of 2014, will teach subscribers the specificities of the N2 technology node while offering hands-on training on digital design platforms using the Cadence and Synopsys EDA software.

Yoon Kim, VP of Cadence Academic Network, acknowledged that imec’s design pathfinding PDK represents a major milestone for training the next generation of silicon designers. “Imec used Cadence’s AI-driven digital and custom/analog full flows to create and validate the design pathfinding PDK.”

Likewise, Brandon Wang, VP of technical strategy & strategic partnerships at Synopsys, quoted pathfinding PDK as an example of how industry partnerships can broaden access to advanced process technology for the current and next generation of designers. “Our collaboration with imec to deliver a certified, AI-driven EDA digital design flow for its N2 PDK enables design teams to prototype and accelerate the transition to next-generation technologies using a virtual PDK-based design environment.”

According to imec, the design pathfinding PDK platform will extend to more advanced nodes like 1.4 nm.

Related Content

• IBM Unveils World’s First 2 nm Chip
• TSMC adds two variants to 2-nm node, will Intel catch up?
• Samsung unveils plans for 2-nm and 1.4-nm process nodes
• Europe Needs 2-nm Manufacturing Process by 2030, says Soitec’s CEO
• EU Signs €145bn Declaration to Develop Next Gen Processors and 2nm Technology

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Infineon Technologies has announced the CYW20822-P4TAI040, its latest Bluetooth module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics. This module is the most cost-effective in its class, offers seamless integration, enhanced performance with Bluetooth low-energy long-range (LE-LR) support, and exceptional reliability for a wide range of applications. With the right combination of low power and high performance, Infineon’s CYW20822-P4TAI040 is designed to support the entire spectrum of Bluetooth LE-LR use cases including industrial IoT applications, smart homes, asset tracking, beacons and sensors, and medical devices.

According to a recent report by ABI Research 1, future use cases will demand additional
improvements across almost all metrics. These include industrial IoT applications such as
sensing, robotics, beacons, smart home, and asset tracking. In response, Infineon’s
CYW20822-P4TAI040 Bluetooth module delivers unparalleled connectivity and
performance, enabling customers to create innovative products in the IoT and consumer
electronics space.

With extensive experience in delivering certified Bluetooth and Bluetooth LE modules,
Infineon’s regulatory testing (FCC, ISED, MIC, CE) and certification process with the
Bluetooth SIG is precise and rigorous. Its pre-certified modules are optimized for cost, size,
power, and range.

“Infineon is thrilled to expand its Bluetooth portfolio with the introduction of the CYW20822-P4TAI040 Bluetooth module to help designers get to market faster,” said Anurag Chauhan, Director of Marketing for the Bluetooth product line at Infineon Technologies. “As a leader in the IoT area in delivering innovative new Bluetooth LE solutions, this new module is a testament to our customer commitment. This new module delivers low power, long range, and excellent RF performance to meet our customers evolving needs.”

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Device Offers High Power Density and Improved Thermal Performance in 3.3 mm x 3.3 mm PowerPAK 1212 F Package With Center Gate Design

Vishay Intertechnology, Inc. has introduced a versatile new 30 V n-channel TrenchFET Gen V power MOSFET that delivers increased power density and enhanced thermal performance for industrial, computer, consumer, and telecom applications. Featuring source flip technology in the 3.3 mm by 3.3 mm PowerPAK 1212-F package, the Vishay Siliconix SiSD5300DN provides best-in-class on-resistance of 0.71 mΩ at 10 V and on-resistance times gate charge — a critical figure of merit (FOM) for MOSFETs used in switching applications — of 42 mΩ*nC.

Occupying the same footprint as the PowerPAK 1212-8S, the device released today offers 18 % lower on-resistance to increase power density, while its source flip technology reduces thermal resistance by 63°C/W to 56 °C/W. In addition, the SiSD5300DN’s FOM represents a 35 % improvement over previous-generation devices, which translates into reduced conduction and switching losses to save energy in power conversion applications.

PowerPAK 1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation. At the same time, the PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise. In the PowerPAK 1212-F package specifically, the source pad dimension increases by a factor of 10, from 0.36 mm² to 4.13 mm², enabling a commensurate improvement in thermal performance. The PowerPAK 1212-F’s center gate design also simplifies the parallelization of multiple devices on a single-layer PCB.

The source flip PowerPAK 1212-F package of the SiSD5300DN is especially suitable for applications such as secondary rectification, active clamp battery management systems (BMS), buck and BLDC converters, OR-ing FETs, motor drives, and load switches. Typical end products include welding equipment and power tools; servers, edge devices, supercomputers, and tablets; lawnmowers and cleaning robots; and radio base stations.

The device is 100 % RG- and UIS-tested, RoHS-compliant, and halogen-free.

Key Specification Table:

PowerPAK 1212-F	PowerPAK 1212-8S
Package size: 3.3 mm x 3.3 mm	Package size: 3.3 mm x 3.3 mm
Source pad dimension: 4.13 mm²	Source pad dimension: 0.36 mm²
Thermal resistance: 56 °C/W	Thermal resistance: 63 °C/W
Lowest available on-resistance in Gen V technology: SiSD5300DN: 0.87 mΩ (maximum)	Lowest available on-resistance in Gen V technology: SiSS54DN: 1.06 mΩ (maximum)

 

The post Vishay Intertechnology 30 V N-Channel MOSFET With Source Flip Technology Delivers Best in Class RDS(ON) Down to 0.71 mΩ in PowerPAK 1212-F appeared first on ELE Times.

In collaboration with Sony, Rohde & Schwarz has successfully validated and verified Sony’s Altair device for its NTN NB-IoT capability. Using the advanced R&S CMW500 mobile radio tester platform from Rohde & Schwarz, Sony was able to verify all 3GPP-defined RF parameters on their chipset in an interactive testing mode, in both geostationary orbit (GEO) and geosynchronous orbit (GSO). The company also validated the released protocol conformance test cases (PCT) for compliance, demonstrating exceptional performance and reliability of the Sony device. Additionally, both companies have committed to completing Skylo’s certified test plan on the R&S CMW500 as part of the carrier acceptance program.

In addition, the R&S TS8980 conformance test system from Rohde & Schwarz was used to perform RF tests in compliance with the requirements of the Global Certification Forum (GCF) for NTN NB-IoT, making it the first RF performance verification of an NTN NB-IoT chipset. With this achievement, Rohde & Schwarz marks a significant milestone in mobile device certification.

Skylo, the pioneer in non-terrestrial networks (NTN), has worked closely with both Rohde & Schwarz and Sony to ensure test plans satisfy industry standards. Sony’s Altair ALT1250 can now be upgraded for NTN connectivity and can be immediately embedded into devices for dual-mode operations. The validation of PCT demonstrates the companies’ collective commitment to ensuring that the NTN NB-IoT technology is not only market-ready but also meets the high standards of reliability and performance that Skylo’s test plans and its Standards Plus require.

The successful validation of Sony’s device for NTN NB-IoT underscores the commitment of Rohde & Schwarz to driving market readiness for the emerging requirements of the internet of Things via non-terrestrial networks. The technology is bringing wireless connectivity to remote areas that do not have access to terrestrial networks for use cases like SOS messaging or remote monitoring.

At the Mobile World Congress Barcelona 2024, Rohde & Schwarz will exhibit in hall 5, booth 5A80, its cutting-edge test solution for 3GPP NTN NB-IoT based on the R&S CMW500, verifying Sony’s Altair device. The R&S CMW500 covers testing needs from R&D to conformance and operator testing for NTN NB-IoT, not only supporting protocol, RRM and RF conformance testing in line with 3GPP, but also the Skylo test plan, which is required to operate on the Skylo Network – all in a single box.

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