Microelectronics world news

Infineon introduces new Solid-State Isolators (iSSI) to deliver faster switching with up to 70 percent lower power dissipation

ELE Times - Wed, 02/28/2024 - 14:17

Today at the Applied Power Electronics Conference (APEC), Infineon Technologies AG introduced a new product family of Solid-State Isolators (iSSI) to achieve faster and
more reliable circuit switching with protection features not available in optical-based solid
state relays (SSR). iSSI use coreless transformer technology and support 20 times greater
energy transfer with both current and temperature protection contributing to a higher
reliability and lower cost of ownership. The new iSSI allow driving the gates of Infineon’s
MOS-controlled power transistors OptiMOSTM and CoolMOSTM to reduce power dissipation
of up to 70 percent of todays’ solid-state relays using SCR (silicon-controlled rectifier) and
Triac switches.

Infineon’s solid-state isolators enable custom solid-state relays capable of controlling loads
more than 1000 V and 100 A. Improved performance and reliability make coreless
transformer technology ideal for applications in advanced battery management, energy
storage, renewable energy systems, as well as industrial and building automation system
applications. With iSSI drivers, engineers can further improve the efficiency of electronic
and electromechanical systems.

“Implementing coreless transformers in solid-state isolators and relays is truly a game-
changer for power engineers; it provides 50 times lower RDS(on) than existing optically controlled solutions. This enables their use in higher-voltage and higher power applications,” said Davide Giacomini, Marketing Director for the Green Industrial Power
Division at Infineon Technologies.

When matched with Infineon’s CoolMOS S7 switch, the iSSI drivers enable switching
designs with a much lower resistance compared to optically driven solid-state solutions.
This translates to longer lifespans and lower cost of ownership in system designs. As with
all solid-state isolators, the devices also offer superior performance compared to
electromagnetic relays, including 40 percent lower turn-on power and increased reliability
due to elimination of moving parts.

The family of devices is designed to be compatible with Infineon’s broad switching portfolio
including Infineon’s CoolMOS S7, OptiMOSTM and linear FET portfolios.

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Rohde & Schwarz and Samsung pave the way for adoption of secure ranging test cases defined by the FiRa Consortium

ELE Times - Wed, 02/28/2024 - 13:54

Rohde & Schwarz and Samsung have collaborated to verify secure ranging test cases for the ultra-wideband (UWB) PHY layer and assess the secure receiver characteristics of devices based on FiRa specifications. There are new test cases specified in the FiRa 2.0 Technical Specifications, which covers the prevention of physical layer attacks on secure ranging applications based on UWB technology. These test cases were verified with the R&S CMP200 radio communication tester from Rohde & Schwarz on Samsung’s latest UWB chipset.

Having passed the FiRa® Consortium validation process, the R&S CMP200 radio communication tester is a certified tool for FiRa 2.0 PHY testing. With the successful verification of physical layer security test casesRohde & Schwarz and Samsung contribute to making standardized ultra-wideband (UWB) applications more resilient to malicious attacks.

UWB has unique capabilities for secure fine ranging, based on accurate Time of Flight (ToF) estimation and relative position determination. Therefore, UWB-enabled devices can accurately and securely measure the distance and direction of connected devices. These capabilities make UWB an ideal technology for a wide range of use cases, such as untracked indoor navigation, social distancing, hands-free access, asset tracking, ticket validation, mobile payment, and point-and-trigger applications. The PHY Secure Ranging test cases specified in the FiRa 2.0 Test Specifications have now been implemented by Rohde & Schwarz and verified using Samsung’s latest UWB Chipset, representing another step forward in achieving an interoperable UWB ecosystem across chipsets, devices, and services infrastructures.

Rohde & Schwarz integrated UWB test capabilities into the R&S CMP200 radio communication tester, making it the only test platform on the market capable of R&D and production RF tests for both 5G mmWave / FR2 and UWB functions. It is ideal for addressing UWB test challenges during mass production as well as R&D. The tester combines the capabilities of a signal analyzer and signal generator in a single instrument. In combination with Rohde & Schwarz shielded chambers and automatization software WMT, the R&S CMP200 offers a complete solution for transmitter, receiver, ToF and Angle of Arrival (AoA) measurements in conducted and radiated mode, compliant to IEEE 802.15.4a/z specifications.

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz, says, “We at Rohde & Schwarz are committed to creating a safer and connected world. For us, providing the means to ensure that a new wireless technology is resilient to malicious attacks is of the highest priority. That’s why we are very happy to have collaborated with Samsung for early verification of the FiRa PHY Security Parameter feature.”

Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics, said: “Drawing on our experience in developing IEEE 802.15.4a/z standard-based UWB solutions, we are excited to collaborate with Rohde & Schwarz in our joint commitment to creating a safer, more interconnected world. This partnership not only ensures industry compliance with FiRa Certification but also offers robust guidance on interoperability among UWB devices equipped with the latest secure ranging features. Leveraging our leadership in UWB technology, we remain dedicated to delivering valuable services and user experiences.”

Rohde & Schwarz will showcase the R&S CMP200 radio communication tester with integrated UWB test capabilities at Mobile World Congress 2024 in Barcelona in hall 5, booth 5A80. For further information about the UWB test solutions from Rohde & Schwarz, go to: https://www.rohde-schwarz.com/uwb

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Rohde & Schwarz receives GTI Award 2024 for its 5G RedCap test solution

ELE Times - Wed, 02/28/2024 - 11:49

Rohde & Schwarz received the Innovative Breakthrough in Mobile Technology Award at GTI Awards 2024 for its R&S CMX500 radio communication tester’s support of RedCap testing from early R&D to certification and conformance. The GTI Awards takes place during the Mobile World Congress and recognizes industry achievements and successes in 5G development across a wide range of market segments.

The GTI Award is granted by the Global TD-LTE Initiative (GTI), an organization of leading global operators that has successfully supported the commercialization of TD-LTE and 5G NR networks and services. The Innovative Breakthrough in Mobile Technology Award is given to technologies based on how they meet the needs of GTI operators, as well as their innovativeness, benefits, market potential, sustainability and impact. Rohde & Schwarz received this award for its R&S CMX500 one-box tester (OBT), a leading test solution that covers the entire 5G Reduced Capability (RedCap) lifecycle.

RedCap is a 5G technology defined in 3GPP Release 17. As a reduced-functionality version of 5G, it has a significantly lower cost compared to 5G eMBB. It is characterized by mid-range data throughput, low power consumption, low complexity and the ability to support a large number of devices. This makes it particularly attractive for IoT applications.

The R&S CMX500 OBT verifies the various RedCap aspects specified in 3GPP 5G Rel.17 for R&D, certification and conformance testing. It covers network access restrictions, bandwidth parts (BWP) and bandwidth part switching, power saving and other protocol signalling procedures. The platform has also been enhanced to verify the proper operation of RedCap terminal devices in legacy networks.

Christoph Pointner, Senior Vice President of Mobile Network Testers at Rohde & Schwarz, who accepted the award during the ceremony on February 27, 2024, at MWC Barcelona, said: “We are honoured to receive the prestigious GTI Award for our R&S CMX500 one-box signalling tester for its comprehensive support of 5G RedCap technology. This recognition is a testament to our striving commitment to push the boundaries of mobile communications testing to meet the diverse needs of network operators and device manufacturers, paving the way for new technologies.”

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Infineon reorganizes sales and marketing to boost customer centricity and lead in application support

ELE Times - Wed, 02/28/2024 - 11:45

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is setting the course for ambitious growth by further strengthening and streamlining its sales organization. Starting 1 March, Infineon’s sales team will be structured around three customer-centric Sales Segments: Automotive, Industrial & Infrastructure and Consumer, and Computing & Communication. The DEM sales organization will retain responsibility for distributors and Electronics Manufacturing Services (EMS). This new structure will further leverage the potential of Infineon’s comprehensive and diverse product portfolio by putting customers’ application needs at the center of the new organizational model. All of these organizations will be deployed globally with an optimized regional footprint.

“Customers’ expectations are quickly evolving and are driven by speed of innovation and faster time-to-market,” says Andreas Urschitz, Chief Marketing Officer of Infineon. “With a streamlined customer interface which brings the relevant products and application expertise to the customers’ doorstep, Infineon is ideally positioned to enable customers’ success.”

This simpler approach will give customers easier access to Infineon’s full portfolio and match their specific needs by offering complementary products from different divisions. In addition, this reorganization will reduce the number of interfaces for Infineon’s customers and help drive down time-to-market for their R&D projects enabled by Infineon semiconductors and solutions.

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Bright Ideas: Understanding Filament Bulbs

ELE Times - Wed, 02/28/2024 - 11:41

In the realm of lighting, one of the most iconic and enduring symbols is the filament bulb. While newer technologies have emerged, the filament bulb continues to hold a special place in our hearts and homes. In this blog, we delve into the world of filament bulbs, exploring what they are, how they work, their uses, and their advantages.

What is a Filament Bulb?

A filament bulb, also known as an incandescent bulb, is a type of light bulb that produces light by heating a thin tungsten wire filament to a high temperature until it glows. The filament is housed within a glass bulb filled with inert gas to prevent the filament from oxidizing and burning out too quickly.

How Does a Filament Bulb Work?

The principle behind the operation of a filament bulb is simple yet elegant. When an electric current passes through the filament, it encounters resistance, which causes the filament to heat up. As the temperature rises, the filament emits light in the visible spectrum, illuminating its surroundings.

Filament Bulb Uses

Filament bulbs have been a staple in lighting applications for over a century. While their popularity has waned with the advent of more energy-efficient alternatives, filament bulbs still find use in various settings, including:

  1. Decorative Lighting: Filament bulbs are prized for their warm, inviting glow, making them a popular choice for decorative lighting in homes, restaurants, and cafes.
  2. Vintage Aesthetics: With their classic design and nostalgic appeal, filament bulbs are often used in vintage-inspired interiors, adding a touch of old-world charm.
  3. Display Lighting: Filament bulbs are ideal for highlighting merchandise in retail displays, creating an attractive ambience that draws customers’ attention.
  4. Special Events: From weddings to outdoor parties, filament bulbs are a popular choice for creating a festive atmosphere, casting a warm and inviting glow over gatherings.

Filament Bulb Advantages

While filament bulbs may not be as energy-efficient as their LED counterparts, they still offer several advantages that make them a preferred choice in certain scenarios:

  1. Warmth and Ambiance: Filament bulbs emit a warm, soft light that closely resembles natural sunlight, creating a cozy and inviting atmosphere wherever they are used.
  2. Instant On: Unlike some energy-saving bulbs that require time to reach full brightness, filament bulbs provide instant illumination, making them ideal for areas where immediate light is needed.
  3. Dimmable: Many filament bulbs are dimmable, allowing users to adjust the brightness to suit their preferences and set the mood for different occasions.
  4. Affordability: Filament bulbs are often more affordable than LED bulbs, making them a cost-effective lighting solution for those on a budget.
  5. Compatibility: Filament bulbs are compatible with most standard fixtures, making them an easy and convenient replacement for traditional incandescent bulbs.

In Conclusion

While filament bulbs may no longer be the go-to choice for energy-conscious consumers, their timeless appeal and unique characteristics continue to make them a popular lighting option in many settings. Whether used for decorative purposes, vintage aesthetics, or special events, filament bulbs shine bright as a symbol of illumination’s enduring legacy.

 

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Integrated Motor Drivers For Efficient Real-Time Embedded Motor Control

ELE Times - Wed, 02/28/2024 - 11:19

Microchip Technology Inc. launches a new family of integrated motor drivers, leveraging its dsPIC Digital Signal Controllers (DSC). This innovative solution integrates a dsPIC33 DSC, a three-phase MOSFET gate driver, and an optional LIN or CAN FD transceiver into a single package. It provides a comprehensive solution for efficient, real-time embedded motor control in space-constrained applications.

This integration reduces the components needed for motor control system designs, leading to smaller PCB sizes and simplified design complexity. Particularly beneficial for automotive, consumer, and industrial applications where high performance and compact form factors are crucial.

Key Features Include:

  • Single power supply operation up to 29V (operation) and 40V (transient).
  • Internal 3.3V low dropout (LDO) voltage regulator for the dsPIC DSC.
  • Operating frequencies between 70—100 MHz, enabling high CPU performance for advanced motor control algorithms like field-oriented control (FOC).

Microchip supports the development and deployment of these integrated motor drivers with a comprehensive ecosystem of software and hardware tools. This includes development boards, reference designs, application notes, and the motorBench Development Suite V2.45, a free GUI-based software tool for FOC. Additionally, the dsPIC33CK Motor Control Starter Kit (MCSK) and the MCLV-48V-300W development board offer rapid prototyping solutions with flexible control options for various motor control applications.

Joe Thomsen, Vice President of Microchip’s Digital Signal Controllers Business Unit, highlighted the advantages of the new integrated motor drivers, stating, “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space, meeting the evolving demands for higher performance and reduced footprints in various designs.”

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Infineon unveils high-density power modules to enable benchmark performance and TCO for AI data centers

ELE Times - Wed, 02/28/2024 - 09:15

Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centres. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centres operate at a higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO. 

Given that AI servers require 3 times more energy than traditional servers and data centres already consume more than 2 per cent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonization. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDPTM Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage onto the heat sink through a novel inductor design that is optimized to transfer current and heat, thereby allowing for a 2 per cent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centres computing generative AI and in turn leads to reduced CO2 emissions and millions of dollars in operating cost savings over the system’s lifetime. 

“This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers,” said Athar Zaidi, Senior Vice President of Power & Sensor Systems at Infineon Technologies. “We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalization and decarbonization.”

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STMicro, ADI, and Rohm Release New Op Amps for Industrial Applications

AAC - Wed, 02/28/2024 - 02:00
Three new op amps bring low offset, low drift, and wide gain bandwidth for industrial designers.

Found my dad's old stash.

Reddit:Electronics - Tue, 02/27/2024 - 20:27
Found my dad's old stash.

So my dad who passed back in 09 was, back in his day, big into older electronics, he had this stash of unused tubes back when they adopted me in 83. They're dirty, but all unused. I don't even know where to start with getting rid of them.

submitted by /u/WerewolfUnable8641
[link] [comments]

ISSCC 2024: Samsung Doubles DDR5 Capacity With Symmetric-Mosaic Architecture

AAC - Tue, 02/27/2024 - 20:00
In our final ISSCC spotlight, we explore Samsung's paper on a high-capacity, high-speed DDR5 memory that implements a monolithic-die-based 32-Gb DDR5 with 8 Gb/s/pin—all without leaving the 10 nm process.

Voltage inverter uses gate’s output pins as inputs and its ground pin as output

EDN Network - Tue, 02/27/2024 - 16:33

When analog circuits mix with digital, the former are sometimes dissatisfied with the latter’s usual single supply rail. This creates a need for additional, often negative polarity, voltage sources that are commonly provided by capacitive charge pumps.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The simplest type is the diode pump, consisting of just two diodes and two capacitors. But it has the inherent disadvantages of needing a separately sourced square wave to drive it and of producing an output voltage magnitude that’s at least two diode drops less than the supply rail. 

Active charge pump switches (typically CMOS FETs) are required to avoid that.

Many CMOS charge pump chips are available off the shelf. Examples include the multi-sourced ICL7660 and the Maxim MAX1673 pumps that serve well in applications where the current load isn’t too heavy. But they aren’t always particularly cheap (the 1673 for example is > $5 in singles) and besides, sometimes the designer just feels the call to roll their own. Illustrated here is an example of the peculiar outcomes that can happen when that temptation isn’t resisted.

The saga begins with Figure 1, showing a (vastly simplified) sketch of a CMOS logic inverter.

Figure 1 Simplified schema of typical basic CMOS gate I/O circuitry showing clamping diodes and complementary FET switch pair.

Notice first the input and output clamping diodes. These are included mainly to protect the chip from ESD damage, but a diode is a diode and can therefore perform other useful functions, too. Similarly, the P-channel FET pair was intended to connect the V+ rail to the output pin when outputting a logic ONE, and the N-channel for connection to V- to pin for a ZERO. But CMOS FETs will willingly conduct current in either direction when ON. Thus, current running from pin to rail works just as well as from rail to pin. 

Figure 2 shows how these basic CMOS facts relate to charge pumping and voltage inversion.

Figure 2 Simplified topology of logic gates comprising voltage inverter, showing driver device (U1), switch device (U2), and coupling (Cc), pump (Cp), and filter (Cf) capacitors.

 Imagine two inverters interconnected as shown in Figure 2 with a square wave control signal coupled directly to U1’s input and through DC blocking cap Cc to U2’s with U2’s input clamps providing DC restoration.

Consider the ZERO state half cycle of the square wave. Both U1 and U2 P-channel FETs will turn on, connecting the U1 end of Cp to V+ and the U2 end to ground. This will charge Cp with its U1 terminal at V+ and its U2 end at ground. Note the reversed polarity of current flow into U2’s output pin due to Cp driving the pin positive and from there to ground through U2’s P FET and positive rail pin.

Then consider what happens when the control signal reverses to the ONE state.

Now the P FETs will turn OFF while the N FETs turn ON. This forces the charge previously accepted by Cc to be dumped to ground through U1 and its complement drawn from U2’s V- pin, thus completing a charge-pumping cycle that delivers a quantum of negative charge:

Q- = -(CpV+ + Cf V–)

to be deposited on Cf. Note that reversed current flow through U2 occurs again. This cycle will repeat with the next reversal of the control signal, and so on, etc., etc.

During startup, until sufficient voltage accumulates on Cf for normal operation of internal gate circuitry and FET gate drive, U2 clamp diodes serve to rectify the Cp drive signal and charge Cf.

That’s the theory. Translation of Figure 2 into practice as a complete voltage inverter is shown in Figure 3. It’s really not as complicated as it looks.

Figure 3 Complete voltage inverter: 100 kHz pump clock (set by R1C1), Schmidt trigger and driver (U1), and commutator (U2).

 A 100 kHz pump clock is output on pin 2 of 74AC14 Schmidt trigger U1. This signal is routed to the five remaining gates of U1 and the six gates of U2 (via coupling cap C2). Negative charge transfer occurs through C3 into U2 and accumulates on filter cap C5.

Even though the Schmidt hysteresis feature isn’t really needed for U2, the same type is used for both chips to improve efficiency-promoting synchronicity of charge-pump switching.

Some performance specs (V+ = 5V):

  • Impedance of V- output: 8.5 Ω
  • Maximum continuous load: 50 mA
  • Efficiency at 50 mA load: 92%
  • Efficiency at 25 mA load: 95%
  • Unloaded power consumption: 440 µW
  • Startup time < 1 millisecond

But finally, is there a cost advantage to rolling your own? Well, in singles, the 1673 is $5, the 7660 about $2, but two 74AC14s can be had for only a buck. The cost of passive components is similar, but this DI circuit has more solder joints and occupies more board area. So, the bottom line…??

But at least using outputs as inputs and ground as an output was fun.

And an afterthought: For higher voltage operation, simply drop in CD4106B metal-gate chips for the 74AC14s, then with no other changes, V+ and V- can be as high as 20V.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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DOE launches $2.25m American-Made Silicon Carbide Packaging Prize

Semiconductor today - Tue, 02/27/2024 - 14:03
The US Department of Energy’s (DOE) Office of Electricity (OE) has launched the $2.25m American-Made Silicon Carbide (SiC) Packaging Prize. This contest invites competitors to propose, design, build and test state-of-the-art SiC semiconductor packaging prototypes to enable these devices to work more effectively in high-voltage environments such as energy storage. The prize is part of the American-Made Challenges program, which fosters collaboration between the USA’s entrepreneurs and innovators, DOE’s National Labs, and the private sector...

Saelig Company Unveils PicoScope 6428E-D – A Game-Changing High-Speed Oscilloscope

ELE Times - Tue, 02/27/2024 - 13:59

In a groundbreaking announcement, Saelig Company introduced the PicoScope 6428E-D, a cutting-edge four-channel high-speed oscilloscope. This innovative addition to Pico Technology’s renowned PicoScope 6000E Series boasts an impressive bandwidth of up to 3GHz and a remarkable maximum vertical resolution of 12 bits into 50ohm inputs. Featuring an unprecedented real-time sampling rate of 10GSa/s, the PicoScope 6428E-D sets a new standard for precision and performance in waveform analysis.

One of its standout features is its ability to accommodate larger than ±500mV input signals with external attenuators or probes specifically designed for 50ohm inputs. The device’s 4GSa buffer can hold up to two 200ms captures at the maximum sampling rate, facilitating the recording of multiple instances of complex signals under varying conditions. This capability is instrumental in quickly capturing high-frequency signals with unparalleled precision for detailed signal analysis. Moreover, the PicoScope 6428E-D can display single-shot pulses with an impressive 100ps time resolution, enabling users to uncover critical signal integrity issues such as timing errors, glitches, dropouts, crosstalk, and metastability issues.

Key Features:

  • 4 channels with four input ranges per channel (±50mV, ±100mV, ±200mV, ±500mV)
  • Up to 3GHz bandwidth
  • 100ps time resolution
  • 4GSa capture memory
  • Up to 10 GSa/s real-time sampling
  • 8-, 10-, or 12-bit flexible resolution (FlexRes)
  • Segmented memory/rapid block trigger
  • Built-in 50MHz 14-bit function generator/AWG
  • Fast transfer of captured data via USB 3.0 SuperSpeed connection
  • PicoScope software included, with drivers and SDK (Windows, Linux, Mac)
  • Programming examples for LabView, MATLAB, Python, and C++

Applications:

  • High-energy physics
  • Particle accelerators
  • LIDAR (light detection and ranging)
  • VISAR (velocity-interferometer system for any reflector)
  • Spectroscopy
  • Medical imaging
  • Semiconductor/Production test
  • Non-destructive testing

Designed for scientists, engineers, and researchers involved in high-speed applications, the PicoScope 6428E-D caters to the need for capturing, measuring, and analyzing sub-nanosecond waveform events. Whether used as a standalone instrument or integrated into a larger system, this oscilloscope offers unparalleled performance at a competitive cost. Unlike traditional benchtop mixed-signal oscilloscopes, which occupy significant bench space and are often financially out of reach for many engineers, the 6428E-D provides a cost-effective solution without compromising on quality. Additionally, users benefit from free software upgrades as new features become available.

Manufactured by Pico Technology, Europe’s award-winning test and measurement manufacturer, the PicoScope 6428E-D is now available through Saelig Company, Inc., their USA technical distributor.

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Microchip Launches New dsPIC DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device

ELE Times - Tue, 02/27/2024 - 10:45

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

To implement efficient, real-time embedded motor control systems in space-constrained applications, Microchip Technology has launched a new family of dsPIC Digital Signal Controller (DSC)-based integrated motor drivers. These devices incorporate a dsPIC33 digital signal controller (DSC), a three-phase MOSFET gate driver and an optional LIN or CAN FD transceiver into one package. A significant benefit of this integration is reduction in component count of the motor control system design, smaller printed circuit board (PCB) dimensions and reduced complexity. The devices are supported by development boards, reference designs, application notes and Microchip’s field-oriented control (FOC) software development suite, motorBench Development Suite V2.45.

“Automotive, consumer and industrial designs are evolving and require higher performance and reduced footprints. These expectations often come at a higher expense and increase in dimensional size,” said Joe Thomsen, vice president of Microchip’s digital signal controllers business unit. “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”

The integrated motor driver devices can be powered by a single power supply up to 29V (operation) and 40V (transient). An internal 3.3V low dropout (LDO) voltage regulator powers the dsPIC DSC, which eliminates the need for an external LDO to power the device. Operating between 70—100 MHz, the dsPIC DSC-based integrated motor drivers provide high CPU performance and can support efficient deployment of FOC and other advanced motor control algorithms.

Development Tools

An extensive ecosystem of motor control software and hardware development tools helps make the design process faster and easier, reducing the customer’s time to market.

The dsPIC33CK Motor Control Starter Kit (MCSK) and the MCLV-48V-300W are two new dsPIC33-based integrated motor driver development boards that provide rapid prototyping solutions with flexible control options. The MCSK includes a dsPIC33CK low-voltage motor control development board, a 24V three-phase BLDC motor, an AC/DC adapter, a USB cable and other accessories. This cost-effective kit supports fast prototyping of motor control applications that operate between 12 and 48 VDC with up to 10 Amps of continuous current. The MCLV-48V-300W development board enables fast prototyping of three-phase permanent magnet synchronous motors that are rated between 12 and 48 VDC and capable of delivering up to 25A RMS continuous current per phase. This inverter board introduces a new modular concept where a separate dual-in-line module (DIM) is inserted into the board to configure it for a particular dsPIC DSC or MCU.

The motorBench Development Suite is a free GUI-based software development tool for FOC that accurately measures critical motor parameters, automatically tunes feedback control gains and generates source code by utilizing the motor control application framework (MCAF). The latest version, v2.45, includes a powerful new feature called zero-speed/maximum torque (ZS/MT), which enables designers to eliminate Hall or magnetic sensors while maximizing the torque output from the motor, from start-up and at low speeds. This feature can be used in pumps, power tools, e-Mobility and many other applications.

MPLAB Discover now contains many dsPIC DSC-based MATLAB Simulink models supporting various motor control algorithms and development boards. Microchip also provides free device blocks for Simulink that can be used to generate optimized code from models for dsPIC DSCs and other Microchip MCUs.

The growing number of dsPIC DSC-based motor control reference designs now includes an automotive cooling fan, low-voltage ceiling fan and a drone propeller controller. These reference designs shorten the time to market by providing a production-ready solution for various motor control applications. Typically, the board design files include schematics and a BOM, a board user’s guide and motor control source code that are available for download.

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LED packaging market to grow at 3.9% CAGR from $16bn in 2024 to $19.4bn in 2029

Semiconductor today - Tue, 02/27/2024 - 10:29
The LED packaging market will rise at a compound annual growth rate (CAGR) of 3.9% from US$16bn in 2024 to US$19.4bn in 2029, forecasts a new report from MarketsandMarkets...

Report analyses economic impact of First Solar’s US manufacturing and supply chain investments

Semiconductor today - Tue, 02/27/2024 - 10:20
Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has released what is believed to be the first comprehensive economic analysis of a vertically integrated solar manufacturer’s value chain in the USA. Commissioned by First Solar and conducted by the Kathleen Babineaux Blanco Public Policy Center at the University of Louisiana at Lafayette, the study used IMPLAN economic software to analyze First Solar’s actual and forecasted US spending in 2023 and 2026, when the company expects to have 14GW of annual nameplate capacity across Alabama, Louisiana and Ohio...

Finwave showcases performance improvements with GaN-on-Si technology at MWC Barcelona

Semiconductor today - Tue, 02/27/2024 - 10:12
In its meeting room (Hall 2, #2D12MR) on the show floor at Mobile World Congress (MWC) Barcelona (26–29 February), Finwave Semiconductor Inc of Waltham, MA, USA is hosting demonstrations of its latest technology and products, including unveiling the newest performance benchmarks with its gallium nitride on silicon (GaN-on-Si) technology and high-power switches targeting the infrastructure and handset markets...

Light + Building 2024: Naturally sustainable energy

ELE Times - Tue, 02/27/2024 - 09:24

Photovoltaic systems (PV systems) have a central role to play in providing sustainable energy for the future. From private balcony power plants to systems on the roofs of apartment buildings and commercial photovoltaic fields, subsidy programmes and legal simplifications are designed to accelerate the expansion of Europe’s energy systems. Thus, aspects of building-services technology, PV systems, energy storage and control, as well as systems integration, are set to gain significance at the coming Light + Building from 3 to 8 March 2024.

At Light + Building, the world’s leading trade fair for lighting and building-services technology, over 2,000 national and international manufacturers are getting ready to present both intelligent lighting systems and future-oriented home and building-services technology. The electrical infrastructure is a prerequisite for convenient home and building automation, efficient energy storage and management, the connection of PV systems and charging stations, as well as electrical heating systems.

“Trade fairs mirror markets. And Light + Building directly reflects the latest developments in the sector. In the field of building-services technology, the subjects of the source, independence and storage of energy have become increasingly important over recent years. Accordingly, these topics are also growing in significance at Light + Building with the number of exhibitors showing such products and services increasing and new companies discovering the world’s leading trade fair for themselves,” says Johannes Möller, Director of Brand Management Light + Building.

Solutions for increasingly important subjects, such as PV systems and energy storage, dominate Halls 11 and 12. 70 of the exhibitors there are experts for the subjects of e‑mobility and charging infrastructure while 45 companies present innovations and products for decentralised energy-supply systems and components. Ten of them are specialists in photovoltaic systems. The key players in Halls 11 and 12 include ABB, ABL, Amperfied, Bosch Thermotechnik, Compleo Charging Solutions, Fronius, Go-e, Hager, Hensel, Hepa Solar, Legrand, Mennekes, OBO Bettermann, Phoenix Contact, Schneider Electric, Siemens, SMA, Senec, Spelsberg, Walther-Werke, Weidmüller and Wieland.

With electrical engineering, home and building automation and connected safety and security technology (Intersec Building), the world of building-services technology is also to be found in Hall 9.

Knowledge transfer & networking: events spotlighting regenerative energies

The Building Plaza in Hall 9.0 is the meeting place for knowledge transfer, events and inspiration in the field of building-services technology. On Tuesday, 5 March 2024, the programme revolves around the subject of regenerative energies with numerous lectures and panel discussions being held under the motto ‘Storing and managing energy’. The programme continues on Wednesday and Thursday, 6 and 7 March 2024, with the first ‘Building in the Energy Transition’ congress. Under the heading ‘Light up the Future: Innovations for a sustainable energy supply in buildings and districts’, visitors can look forward to lectures, panel discussions and tours of the fair offering insights into the latest research from the field of sustainable energy supplies for buildings.

Light + Building – the World’s Leading Trade Fair for Lighting and Building Technology.

The Light + Building event will take place from 3 to 8 March 2024.

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