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As 5G technology evolves, non-3GPP networks such as public, home and enterprise WLAN hotspots will be more and more interlinked with the 5G core. As a result, tomorrow’s smartphones will rely even more on the next generations of WLAN technology, which will be more powerful and efficient, but also more complex. At Mobile World Congress 2024 in Barcelona, Rohde & Schwarz will be showcasing its latest Wi-Fi 7 test solutions for R&D and production to meet the ever-increasing test challenges posed by the technology and the parallel operation with LTE and 5G cellular standards.

Rohde & Schwarz will display its R&S CMX500 multi-technology multi-channel signaling tester at MWC 2024 with newly added Wi-Fi 7 testing capabilities. With this functionality, the one-box tester allows R&D engineers of wireless devices to comprehensively test their design’s operation in cellular and non-cellular standards of the latest generation in a single instrument setup. In addition to this, the R&S CMP180 radio communication tester will verify a signal waveform of 480 MHz bandwidth in loopback mode, attesting to be a future-proof solution for users in R&D and production, even beyond the requirements of Wi-Fi 7.

Challenges of next-generation WLAN testing

While the market for the sixth generation of Wi-Fi, IEEE 802.11ax, is still growing, the development of Wi-Fi 7, or IEEE 802.11be, is in full swing. Wi-Fi 7 is the next generation of Wi-Fi technology, designed for extremely high data throughput. With tens of gigabits of data per second and low latency, it meets the growing demand for ultra-high-definition video streaming, virtual reality and augmented reality applications. Key elements to achieve higher throughput are an increased channel bandwidth of 320 MHz, up to 16 spatial streams and 4096 QAM modulation. In addition, for a yet-to-be-defined Wi-Fi 8 (IEEE 802.11bn) standard, even wider channel bandwidths are in discussion. Rohde & Schwarz meets these challenging characteristics with its solutions for testing Wi-Fi 7 and beyond, showcased at MWC Barcelona.

R&S CMX500 features new Wi-Fi 7 capabilities for R&D

During the development of WLAN devices, measurements of the RF TX and RX characteristics must be conducted under real-world conditions in signaling mode. The R&S CMX500 one-box tester is a multi-technology multi-channel signaling tester that is now available with integrated Wi-Fi 7 test functionality. Especially in Wi-Fi 7 where Multi-Link-Operation (MLO) is a key feature, a test environment that provides multiple RF chains is crucial. The tester’s flexibility, support for multiple radio technologies, and embedded IP test capabilities make it a versatile solution for a wide range of Wi-Fi 7-specific tests, such as 2×2 MIMO, 6 GHz band with out-of-band discovery, coexistence and E2E test capabilities.

Testing WLAN offloading with Voice over WLAN in a single box

WLAN offloading is the process of delivering data originally intended for cellular networks over WLAN. It helps reduce the amount of data carried on the cellular bands, freeing up bandwidth for other users. It is also used to ensure service continuity in scenarios where cellular coverage is insufficient, but a WLAN hotspot is available to take over the connection. For example, the handover between a cellular network and WLAN during a voice call, often referred to as Voice over WLAN, aims to provide subscribers with an uninterrupted voice call experience.

At MWC, Rohde & Schwarz will demonstrate the R&S CMX500 and its ability to test seamless traffic offloading and interworking between cellular 5G and WLAN with a single box solution. The newly integrated Non-3GPP Interworking Function (N3IWF) gateway in the R&S CMX500 makes it an easy-to-use solution for testing WLAN offloading with Voice over WLAN, enabling device manufacturers and operators to efficiently test these applications. In addition, the integrated POLQA voice quality measurement function of the R&S CMX500 offers a comprehensive and cost-effective solution to ensure the quality of experience for voice over WLAN applications at an early stage.

Future-proof R&S CMP180 R&D and production tester

In the production phase of WLAN devices, all RF measurements are performed in non-signaling mode to save time. Rohde & Schwarz has optimized the R&S CMP180 radio communication tester for this purpose. The instrument supports many cellular and non-cellular technologies including Wi-Fi 6E, Wi-Fi 7 and 5G NR FR1 up to 8 GHz in frequency with bandwidths up to 500 MHz. Leveraging the wide bandwidth, the R&S CMP180 will demonstrate at MWC its ability to verify a WLAN waveform with 480 MHz bandwidth in loopback mode, a potential waveform candidate for the yet-to-be-defined Wi-Fi 8 (IEEE 802.11bn) standard. This feature shows that the cost-effective instrument is future-proof for users not only in production but also in R&D.

Two analyzers, two generators and two sets of eight RF ports are integrated in the R&S CMP180 to support 2×2 MIMO testing in a single box. Two R&S CMP180 instruments can be combined and scaled to support four analyzers and generators for efficient testing of 4×4 MIMO access points.

Rohde & Schwarz will present its comprehensive test solutions for next-generation WLAN at the Mobile World Congress 2024 at the Fira Gran Via in Barcelona in hall 5, booth 5A80.

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Enables accurate evaluation of a network using OpenZR+ transceivers with excellent cooling performance of the measurement module

Anritsu Corporation introduces the 400G (QSFP-DD) multi-rate module MU104014B that supports the new interface standard OpenZR+, as a module of the Network Master Pro MT1040A. OpenZR+ enables low-cost Data Center Interconnects (DCI) and metro network construction.

This measurement solution supports tests for transitioning from high-cost networks using existing WDM[*1] systems to low-cost networks using OpenZR+ transceivers. Through this solution, the MT1040A helps reduce network construction and expansion costs. With excellent heat dissipation and cooling performance, the new measurement module is able to prevent communication failures caused by the heat generated by OpenZR+ transceivers. This enables more accurate measurement of network performance.

Development Background

Datacenters and metro networks are growing at a rapid pace due to the spread of generative AI and cloud services as well as advances in digital transformation (DX) meeting social needs. Particularly, limits on available space, power-supply capacity, and air-conditioning can cause problems in scaling-up the capacity of established medium-scale datacenters so increasing the number of distributed medium datacenters can be more efficient than building new hyperscale datacenters, which is driving demand for DCI between more medium-scale datacenters.

WDM circuits provided from network operators are used widely for DCI but are expensive. To resolve this issue, the 400ZR[*2] standard was established, allowing low-cost network construction. However, the transmission distance of 400ZR is short and its data rate is only 400G. The OpenZR+ standard was created to support a longer transmission distance and data rates ranging from 100G to 400G.

OpenZR+ transceivers are inexpensive compared to the existing WDM systems. OpenZR+ supports various network configurations and is suitable for DCI construction. On the other hand, however, because OpenZR+ is capable of long-haul transmission, some OpenZR+ transceivers consume nearly 1.5 times as much power as the existing 400ZR transceivers and generate more heat. In order to measure an OpenZR+ transceiver accurately without failure, therefore, the measurement module needs to have a transceiver heat dissipation measure in place to suppress the heat generated by the transceiver. This measurement solution answers this need.

Product Overview

Network Master Pro (400G Tester) MT1040A
The MT1040A is a B5 size 400G handheld tester with excellent expandability and operability. It is a touch panel-operated field measurement instrument equipped with a 9-inch screen that is small enough to carry with a single hand. It supports a range of interfaces from 10M up to 400G.

Technical Terms

[*1] WDM
Abbreviation for Wavelength Division Multiplexing technology supporting transmission of multiple optical signals with different wavelengths in one optical cable by simulating multiple cables.

[*2] 400ZR
One interface standard for optical modules used by DCI. Facilitates lower-cost connections between data centers than conventional wavelength division multiplexing (WDM) systems.

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For its fiscal first-quarter 2024 (to 29 December 2023) Skyworks Solutions Inc of Irvine, CA, USA (which manufactures analog and mixed-signal semiconductors) has reported revenue of $1201.5m, down 1.4% on $1218.8m last quarter and 9.6% on $1329.3m a year ago, but slightly above the midpoint of the $1175-1225m guidance...

On a band saw in a trades school. submitted by /u/xxxxxxxxxxxxxc [link] [comments]

submitted by /u/1Davide [link] [comments]

Differential temperature measurement is a handy way to quantify the performance of heatsinks, thermoelectric coolers (TECs), and thermal control in electronic assemblies. Figure 1 illustrates an inexpensive design for a high-resolution differential thermometer utilizing the ∆Vbe effect to make accurate measurements with ordinary uncalibrated transistors as precision temperature sensors. 

Here’s how it works.

Figure 1 Transistors Q1 and Q2 perform self-calibrated high resolution differential temperature measurements.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Diode connected transistors Q1 and Q2 do duty as precision temperature sensors driven by switches U1and U1c and respective resistors R2, R3, R13, and R14. The excitation employed comprises alternating-amplitude current-mode signals in the ratio of (almost exactly):

10:1 = (100 µA via R3 and R13):(10 µA via R2 and R14).

With this specific 10:1 excitation, most every friendly small-signal transistor will produce an AC voltage signal accurately proportional to absolute temperature with peak-to-peak amplitude given by:

∆Vbe = Absolute Temperature / 5050 = 198.02 µV/oC.

The temperature-difference-proportional signals from Q1 and Q2 are boosted by ~100:1 gain differential amplifier A1a and A1d, synchronously demodulated by U1b, then filtered by R11, C2, and C3 to produce a DC signal = 20 mV/oC. This is then scaled by a factor of 2.5 by A1c to produce the final Q1–Q2 differential temperature signal output of 50 mV/oC, positive for Q1 warmer than Q2, negative for Q2 warmer than Q1.

Some gritty design minutiae are:

1. Although the modulation-current setting resistors are in an exact 10:1 current ratio, the resulting modulation current ratio isn’t quite…The ∆Vbe signal itself subtracts slightly from the 100 µA half-cycle, which reduces the actual current ratio from exactly 10:1 to 9.9:1. This cuts the ∆Vbe temperature signal by approximately -1%.
2. Luckily, the gain of the A1a/d amplifier isn’t exactly the advertised 100 either but is actually (100k/10k + 1) =101. This +1% “error” neatly cancels the ∆Vbe signal’s -1% “error” to result in a final, acceptably accurate 20mV/oC demodulator output.
3. The modulating/demodulating frequency Fc generated by the A1b oscillator is deliberately set by the R4C1 time constant to be half the power mains frequency (30 Hz for 60 Hz power and 25 Hz for 50 Hz) via the choice of R4 (160 kΩ for 60 Hz and 200 kΩ for 50 Hz). This averages a couple mains-frequency cycles into each temperature measurement and thus improves immunity to stray pickup of power-line coupled noise. It’s a useful trick because some differential-thermometry applications may involve noise-radiating, mains-frequency-powered heaters. For convenience, the R5/R6 ratio was chosen so that Fc = 1/(2R4C1).
4. Resistor values adorned with an asterisk in the schematic denote precision metal-film types. Current-ratio-setting R2, R3, R13, and R14 are particularly critical to minimizing zero error and would benefit from being 0.1% types. The others are less so and 1% tolerance is adequate. No asterisk means 5% is good enough.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

 Related Content

• Transistor ∆VBE-based oscillator measures absolute temperature
• Self-heated ∆Vbe transistor thermostat needs no calibration
• Take-back-half thermostat uses ∆Vbe transistor sensor
• Low-voltage reference uses the ∆VBE circuit

The post ∆Vbe differential thermometer needs no calibration appeared first on EDN.

The paths of RISC processor powerhouse Arm and x86 giant Intel have finally converged after they signed a collaboration pact to manufacture chips on Intel’s 1.8 nm process node in April 2023. Hsinchu, Taiwan-based contract chip designer Faraday Technology will manufacture Arm Neoverse cores-based server processors on Intel Foundry Services (IFS) using the Intel 18A process technology.

Chip design service provider Faraday is designing a 64-core processor using Arm’s Neoverse Compute Subsystems (CSS) for a wide range of applications. That includes high-performance computing (HPC)-related ASICs and custom system-on-chips (SoCs) for scalable hyperscale data centers, infrastructure edge, and 5G networks. Though ASIC designer won’t sell these processors, it hasn’t named its end customers either.

Figure 1 Faraday’s chip manufactured on the 18A process node will be ready in the first half of 2025. Source: Intel

It’s a breakthrough for Arm to have its foot in the door for large data center chips. It’s also a design win for Arm’s Neoverse technology, which provides chip designers with whole processors unlike individual CPU or GPU cores. Faraday will use interface IPs from the Arm Total Design ecosystem as well, though no details have been provided.

Intel, though not so keen to see Arm chips in the server realm, where x86 chips dominate, still welcomes them to its brand-new IFS business. It will likely be one of the first Arm server processors manufactured in an Intel fab. It also provides Intel with an important IFS customer for its advanced fabrication node.

Intel’s 18A fabrication technology for 1.8-nm process node—boasting gate-all-around (GAA) RibbonFET transistors and PowerVia backside power delivery—offers a 10% performance-per-watt improvement over its 20A technology for 2-nm process. It’s expected to be particularly suitable for data center applications.

Figure 2 The 18A fabrication technology is particularly considered suitable for data center chips. Source: Intel

Intel has already got orders to manufacture data center chips, including one for 1.8-nm chips from the U.S. Department of Defense. Now, a notable chip designer from Taiwan brings Intel Arm-based chips, boosting IFS’ fabrication orders as well as its credentials for data center chips.

The production of this Faraday chip is expected to be complete in the first half of 2025.

Related Content

• Intel Foundry Grows Ecosystem for DoD Chips
• Change of guards at Intel Foundry Services (IFS)
• Will 1.4-nm help Samsung catch up with TSMC, IFS?
• Intel Foundry’s ‘No. 1’ Customer—U.S. DoD—Targets GAA
• Intel to Pay $353M as Deal Termination Fee to Tower Semiconductor

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IBASE Technology Inc. has introduced its latest innovation in the realm of computing solutions – the AMI240 fanless system. This cutting-edge system, powered by the IBASE MBE240AF motherboard, promises unparalleled performance and connectivity options, catering to diverse applications across various industries.

Designed to accommodate 14th and 13th Gen Intel Core processors, including the Intel® i9-14900T processor with 24 cores and 36M cache, the AMI240 system offers exceptional processing power while maintaining energy efficiency. With a 35W TDP, it ensures optimal performance for demanding tasks, making it suitable for a wide range of applications.

One of the standout features of the AMI240 system is its compatibility with Sierra 5G modules, providing high-speed connectivity for advanced networking needs. Additionally, the system boasts a compact and space-efficient design, measuring just 210mm(W) x 285mm(D) x 77mm(H), making it suitable for installations where space is limited.

The system’s robust construction allows it to operate reliably in temperatures ranging from -20°C to 70°C, making it ideal for environments with extreme thermal conditions. This feature ensures that the system maintains its performance and functionality even in challenging operating environments.

Key features of the AMI240 fanless system include:

• Fanless design featuring the IBASE MBE240AF motherboard
• Support for 14th and 13th Gen Intel Core processors (i9/i7/i5/i3) with a 35W TDP
• Dual SIM slots for WWAN redundancy (5G/4G/LTE)
• Four RJ45 Ethernet ports (dual 2.5GbE + dual PoE+ supporting 802.3at)
• Three M.2 slots (B-Key/E-Key/M-Key), iAMT (16.1), TPM (2.0)
• Single 24V DC input with voltage protection (over/under/reverse)
• Wide operating temperature range (-20°C to 70°C)

Furthermore, the AMI240 system offers comprehensive connectivity options, including dual SIM slots for WWAN redundancy, four RJ45 Ethernet ports with dual 2.5GbE and dual PoE+ support, and multiple M.2 slots for additional expansion. It also includes features such as iAMT (16.1), TPM (2.0), and PCI-E slots for further customization and expansion capabilities.

Overall, the AMI240 fanless system from IBASE Technology Inc. stands as a testament to the company’s commitment to delivering cutting-edge computing solutions with unparalleled performance, reliability, and connectivity options.

The post IBASE Technology Inc. Launches AMI240 Fanless System with Exceptional Connectivity and Performance appeared first on ELE Times.

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Exceptional power and reliability at the core of the new resistor range adds new capabilities, temperature tolerance and space-saving options for developers.

element14 is now stocking a range of special flat chip resistor solutions from KOA Corporation (KOA).

Important to design engineers in a wide range of demanding markets, KOA resistors are an ideal choice for designers working in automotive, industrial, aerospace, medical, instrumentation and power conversion sectors.

Among the new resistors featured is the RN73R, a high-precision, high-reliability thin film resistor, that replaces the RN73 series with improved electrolytic corrosion resistance and higher stability.

The RN73H resistor in the series is designed for tough environments and is ideal for high-precision circuits for automotive, aerospace and other challenging applications. Despite their ultra-thin film, these resistors have excellent moisture resistance due to an additional inner protective layer.

A high-precision resistor now carried by element14 that uses thick film technology is the RS73, which makes it ideal for long-term stability when designing high-accuracy sensing or voltage detection circuits in automotive, industrial and measuring applications where ESD sensitivity is an issue.

The SG73P is an endured pulse power thick film resistor that has approximately seven times the pulse handling capability of standard flat chip resistors. Its special trimming gives it a higher power rating, which means that a SG73P device can be dropped onto the pads of a similar-sized conventional part, thus increasing the power capability without changing the PCB layout.

For designers who need to conserve board space, the new WK73R wide termination thick film resistor offers several advantages. For example, the 0612 chip size allows a 6x power rating compared to standard 1206 parts, which saves board space by improving heat dissipation. The larger terminals also enhance terminal strength and the smaller distance between the terminals reduces expansion stress.

element14’s new stock of KOA resistors also includes:

• Flat chip resistors for high voltage applications, represented by KOA’s HV73(V)-series, designed for voltages up to 3 kV (2512 size with special coating and trimming insulation to ensure that higher voltages can be applied at operating temperatures up to +155 °C.
• TLR low-ohm, high-power metal plate shunt resistors are offered in the ultra-low 0.5mΩ…20mΩ resistance range. Special trimming gives the device low inductance and removes any hotspots from the design.
• The TLRZ series metal plate zero-ohm jumpers handle high currents in very small sizes. These low-profile jumpers are the perfect replacement for thick film devices in existing designs.
• UR73 resistors are low resistance, low TCR thick film resistors that offer a cost-efficient approach for current sensing in the power range from 0.125 to 1 Watt and are available in sizes from 0402 to 2512.
• KOA’s UR73V low resistance, low TCR thick film resistors for automotive applications cover the 10mΩ – 1Ω range and are a highly cost-effective approach to current sensing in automotive, power supply, motor control and many other industrial automation applications.

element14 Product Segment Leader, Resistors, Euan Gilligan, said, “KOA is known for the quality and reliability of their resistors and other products. We are delighted to make the benefits of their capabilities readily available to developers worldwide.”

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Author: Capt. Nikunj Parashar, Founder & CMD, Sagar Defence Engineering Pvt. Ltd. 

In recent times, the Indian Defence sector has emerged as a focal point for the ‘Aatmanirbhar Bharat’ initiative, emphasizing self-reliance and indigenous manufacturing. With a strong commitment from the government, the Defence and Aerospace sector is witnessing a transformative phase. Recognizing the significance of a robust domestic defence industry, the vision of the government that is steering towards transparency, predictability, and ease of doing business has led to the establishment of an indigenous manufacturing infrastructure, supported by a robust research and development ecosystem, that is at the forefront of this transformative journey.

Capt. Nikunj Parashar, Founder & CMD, Sagar Defence Engineering Pvt Ltd

In the quest for self-reliance, the Indian defence manufacturing industry has seen a surge in innovation driven by a vibrant ecosystem of startups. Contributing to the development of cutting-edge technologies that empower and support the country’s defence efforts, such startups have become key players in the larger goal of reducing dependency on external sources for defence procurement. To foster the growth of the domestic defence industry, the government has implemented various initiatives and measures such as de-licensing, de-regulation, export promotion, and liberalization of foreign investments aimed at creating a conducive environment for startups. The ‘Make in India’ and ‘Startup India’ initiatives, supported by other policy measures, have modernized the armed forces and boost indigenous manufacturing.

One significant step towards fostering innovation in the Defence and Aerospace ecosystem is the Innovations for Defence Excellence (iDEX) program. By providing a platform for collaboration between startups and the defence forces, iDEX accelerates the integration of innovative technologies into the country’s defence capabilities. In addition to iDEX, the government has implemented various supportive schemes to encourage innovation within the Defence and Aerospace sector. These schemes provide financial support, mentorship, and resources to startups, nurturing a culture of innovation and research. The ‘Make in India’ initiative is not just a slogan but a strategic move to reduce external dependency for defence procurement by promoting indigenous manufacturing, the government has enhanced the self-sufficiency of the Indian Defence sector. Startups, with their agility and innovation, play a crucial role in this process, contributing to the development of state-of-the-art technologies and products.

While the journey towards self-reliance in the defence sector is promising, it is not without challenges. Indian startups face obstacles such as funding constraints, regulatory hurdles, and the need for skilled manpower. However, the opportunities are immense. The government’s commitment to simplifying regulations, promoting exports, and encouraging foreign investment presents a favourable environment for startups to thrive. The role of Indian startups in defence exports is gaining prominence on the global stage with a focus on creating innovative solutions, these startups are well-positioned to cater to the evolving needs of the global defence market. Collaborations with foreign partners, facilitated by the government’s export promotion measures, have opened avenues for Indian startups to showcase their capabilities and contribute to global security. With continued support from the government and collaborative efforts, Indian startups are poised to play a pivotal role in shaping the future of the country’s defence industry. The journey towards an Atmanirbhar Bharat is not just a vision but a collective effort, with startups leading the way into a new era of self-sufficiency and technological prowess.

The post Defence Scenario in India & Role of Indian Startups in Defence Exports & Imports of India appeared first on ELE Times.

Work in progress project I’ve been working on !!! submitted by /u/tinkerEE [link] [comments]

Found another one of these lil guys from the agfa msc100 printer. Looks kinda "futuristic" even tho obsolete, but still cool... submitted by /u/r_410a [link] [comments]

Infineon Technologies AG of Munich, Germany says that its new CoolSiC hybrid discrete with TRENCHSTOP 5 Fast-Switching insulated-gate bipolar transistor (IGBT) and CoolSiC Schottky diode has been chosen by VMAX (a Chinese manufacturer of power electronics and motor drives for new energy vehicles) for its next-generation 6.6kW OBC/DC-DC on-board chargers. Infineon’s components come in a D2PAK package and combine ultra-fast TRENCHSTOP 5 IGBTs with half-rated free-wheeling SiC Schottky barrier diodes to achieve the optimum cost-performance ratio for both hard and soft-switching topologies. Due to their performance, optimized power density and quality, the power devices are suitable for VMAX’s on-board chargers...

During Amazon’s annual Prime Day (which is two days, to be precise, but I’m being pedantic) sale mid-July last year, Walmart coincidentally (right) ran a half-off promotion for its normally $98/year competing Walmart+ membership service in conjunction with its competing Walmart+ Week (four days—I know, pedantic again) sale. Copy-and-pasted from the help page:

Walmart+ is a membership that helps save you time and money. You’ll need a Walmart.com account and the Walmart app to access the money and time-saving features of membership.

 Benefits include:

• Early access to promotions and events
• Video Streaming with Paramount+
• Free delivery from your store
• Free shipping, no order minimum
• Savings on fuel
• Walmart Rewards
• Mobile Scan & Go

Free shipping absent the normal $35 order minimum is nice, as is free delivery from my local store. Unfortunately, for unknown reasons, only three Walmarts in all of Colorado, none of them close to me, offer fuel service. Truth be told, though, my primary signup motivation was that my existing Paramount+ streaming service was nearing its one-year subscription renewal date, at which time the $24.99/year (plus a free Amazon Fire Stick Lite!) promotional discount would end and I’d be back to the normal $49.99/year price. Walmart+ bundles Paramount+ as one of its service offerings, and since the Walmart+ one-year promo price was the same (minus $0.99, to be pedantic) as I’d normally pay for Paramount+ standalone, the decision was easy.

But none of these was the primary motivation for this writeup. Instead, I’ll direct your attention to the last entry in the bullet list, Walmart’s Mobile Scan & Go:

Here’s the summary from Walmart’s website:

Shop & check out fast with your phone in-store. Just scan, pay, & be on your way!

• Get Walmart Cash by easily claiming manufacturer offers as you scan
• Check out fast at self-checkout without having to rescan each item
• See the price of items as you go

 It’s easy in 3 simple steps!

• Open your Walmart app: Select Scan & go from the Store Mode landing page. Make sure your location access is enabled.
• Scan your items as you shop: Once your items are scanned, click “View cart” to verify that everything is correct.
• Tap “Check out”: Tap the blue “Check out” button in the app & head over to self-checkout. Confirm your payment method. Scan QR code at register.

Sounds good, right? I’d agree with you, at least at first glance. And even now, after using the service with some degree of regularity over the past few months, I remain “gee-whiz” impressed with many aspects of the underlying technology. Take this excerpt, for example:

Open your Walmart app: Select Scan & go from the Store Mode landing page. Make sure your location access is enabled.

To elaborate: if you’ve enabled location services for the Walmart app on your Android or iOS device, it’ll know when you’re at a store, automatically switching the user interface to one more amenable to helping you find which aisle (and region in that aisle) a product you’re looking for can be found (to wit, “Store Mode”), versus the more traditional online-inventory search. And if you’re also logged into the app, it knows who you are and will, among other things, auto-bill your in-store purchases to the credit card associated with your account.

Keep in mind, however, that (IMHO) the fundamental point of the app (as well as the broader self-checkout service option) is to reduce the per-store employee headcount by shifting the bulk of the checkout labor burden to you. Which would be at least somewhat OK, putting aside the obvious unemployment rate impact, if it also translated into lower consumer prices versus just higher shareholder profits. Truly enabling you to just “Scan & Go” would also be nice. Reality unfortunately undershoots the hype, at least in the current service implementation form.

Note, for example, the “scan your items” phrase. For one thing, scanning while you’re shopping is only relevant for items with associated UPS or other barcodes. The app won’t auto-identify SpaghettiOs if you just point the smartphone camera at the pasta can, for example:

not that I’m sure you’d even want it to be able to do that, considering the potential privacy concerns in comparison to a conceptually similar but fixed-orientation camera setup at the self-checkout counter. Consider, for example, the confidentiality quagmire of a small child in the background of the image captured by your smartphone and uploaded to Walmart’s servers…

The app also can’t standalone handle, perhaps obviously, variable-priced items such as per-pound produce that must be weighed to determine the total charge, and which therefore must instead be set aside and segregated in your shopping cart for further processing at checkout. And about that self-checkout counter…it unfortunately remains an essential step in the purchase process, pragmatically ensuring that you’re not “gaming the system”. After you first scan a QR code that’s displayed on your smartphone, you then deal with any remaining items (such as the aforementioned produce) and pay. And then, as you exit the self-checkout area, there’s a Walmart employee parked there who may (or may not) double-check your receipt against the contents of your cart, including in your bags, to ensure you haven’t “forgotten” to scan anything or “accidentally” scanned a barcode for a less expensive alternative item instead.

Still, doesn’t sound too bad, does it? Well, now consider these next-level nuances, which I’m conceptually aware of from a comparative standpoint versus the Meijer Shop & Scan alternative offered back in Indiana, the state of my birth.

In upfront fairness, at least some of what follows may be specifically reflective of my relatively tiny local Walmart versus the larger stores “down the hill” in Denver and elsewhere (against which I haven’t yet compared), versus a more general comparative critique:

• There’s no way to get a printed receipt at self-checkout; you can only view it online post-transaction completion. This one’s utterly baffling to me, given that conventional self-checkouts offer it. And speaking of which…
• At my store, at least, you’re forced to route through the same self-checkout lines as folks who are tediously doing full self-checkouts (thereby neutering the “Go” promise), versus also offering dedicated faster “Mobile Scan & Go” lines as Meijer does with Shop & Scan.
• Meijer also offers self-weighing stations right at the produce department, linked to the store’s app and broader service, further speeding up the final checkout step. There aren’t any at Walmart, at least at my local store, where I instead need to weigh and accept the total per-item prices at checkout.
• Not to mention the fact that “Mobile Scan & Go” is only available to subscribers of the paid-for-by-consumer Walmart+ service! You’d think that if the company was mostly motivated to reduce headcount costs, it’d at least offer “Mobile Scan & Go” for free, as it does with conventional self-checkout. You’d think…but nope. Pay up, suckers.

First-world “problems”? Sure. Rest assured that I haven’t lost sight of my longstanding big-picture perspective. But nonetheless irritating? Absolutely.

Service “upgrades” that seemingly benefit only the provider, not also the user, are destined for rapid backlash and a speedy demise. Consumers won’t use them and may even take their entire business elsewhere. While this case study is specific to grocery store shopping, I suspect the big-picture issues it raises may also resonate with related situations in your company’s existing and/or under-consideration business plans. Don’t listen solely to the accountants, who focus predominantly-to-completely on short-term cost, revenue and profit targets, folks!

Reader thoughts are as-always welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has unveiled an automotive-qualified silicon carbide (SiC) field effect transistor (FET) offering what is claimed to be an industry-best on-resistance RDS(on) of 9m in a compact D2PAK-7L package...

For its fiscal second-quarter 2024 (to end-December 2023), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $208.4m, up 5.6% on $197.4m last quarter and up nearly 20% on $173.8m a year ago, and above the midpoint of the $192–222m guidance range...

Power electronics design is a critical aspect of modern engineering, influencing the efficiency, reliability, and performance of numerous applications. Developing circuits that meet stringent requirements while considering manufacturing variations and worst-case scenarios demands precision and sophisticated tools.

At the same time, the landscape of power electronics design is rapidly evolving, ushering in an era of high-speed, high-efficiency components. Amidst this evolution, simulation tools need to redefine the way engineers conceptualize, design, and validate power systems. Take Elite Power Simulator and Self-Service PLECS Model Generator (SSPMG), which allows power electronics engineers to reduce time-to-market. Collectively, these tools offer a precise depiction of the operational behavior of the circuit when using EliteSiC line of silicon carbide (SiC) products.

Figure 1 Elite Power Simulator and Self-Service PLECS Model Generator provides a precise depiction of the operational behavior of power circuits. Source: onsemi

This simulation platform aims to empower engineers to visualize, simulate, and refine complex power electronic topologies with unparalleled ease. It does that by offering engineers a unique digital environment to test and refine their designs. Here, the underlying PLECS models and their accuracy are a critical component to the effectiveness of the Elite Power Simulator. The simulator allows engineers to upload custom PLECS models that are generated with the SSPMG.

The heart of this simulation tool is its ability to accurately simulate a wide array of power electronic topologies, including AC-DC, DC-DC, and DC-AC converters, among others. With over 40 topologies available, it provides engineers with an extensive library to explore and fine-tune their designs. For instance, in industrial applications, it supports critical systems such as fast DC charging, uninterruptible power supplies (UPS), energy storage systems (ESS), and solar inverters. Similarly, the tool is suited for onboard chargers (OBC) and traction inverter systems serving the automotive industry.

Figure 2 Engineers can select application and topology in Elite Simulator. Source: onsemi

Challenges in creating PLECS models

The traditional method of creating PLECS models in the industry relies on measurement-based loss tables aligned with manufacturer datasheets. However, this approach faces several key challenges:

• Dependency on measurement setups: The switching energy loss data is influenced by the specific parasitics of the application layouts and circuits used, leading to variations and inaccuracies.
• Limited data density: Conduction and switching energy loss data are often insufficiently dense, hindering accurate interpolation within PLECS and often necessitating extrapolation, which can compromise accuracy.
• Nominal semiconductor conditions: Loss data typically represents nominal semiconductor process conditions, potentially overlooking variations and real-world scenarios.
• Validity for hard switching only: Models derived from datasheet’s double-pulse-generated loss data are applicable only to hard switching topologies. They become highly inaccurate when applied to soft switching topology or for synchronous rectification simulations.

These challenges associated with the conventional approach of depending on measurement-based loss tables for PLECS model generation are addressed by introducing the SSPMG. It optimizes models by considering specific passive elements’ impact on energy losses, providing denser and more detailed data for accurate simulations.

Figure 3 Dense loss table is one of the key SSPMG features. Source: onsemi

SSPMG includes semiconductor process variations for realistic models and creates adaptable models suited for soft switching topologies, ensuring reliability beyond hard switching scenarios. PLECS models designed with SSPMG can be seamlessly uploaded to the Elite Power Simulator or downloaded for use in stand-alone PLECS.

Figure 4 Soft switching simulation is another key SSPMG feature. Source: onsemi

Simulator capabilities

Central to the tool’s prowess is PLECS operating in the background. PLECS is a system-level simulator that makes it easier to model and simulate whole systems by using device models that are designed for speed and accuracy. It combines an easy-to-use web-based environment, simplifying things for engineers during the design process.

The significance of this tool extends beyond its simulation capabilities. It’s not merely a tool for simulating; it can also aid engineers in selecting suitable components for their applications. Engineers can seamlessly navigate through various product generations to understand performance-cost trade-offs and make informed decisions.

Moreover, PLECS is not a SPICE-based circuit simulator, where the focus is on low-level behavior of circuit components. The PLECS models, referred to as “thermal models”, are composed of lookup tables for conduction and switching losses, along with a thermal chain in the form of a Cauer or Foster equivalent network.

The simulator has an intuitive loss and thermal data plotting utility that enables engineers to visualize the loss behavior of their chosen switch. This multifunctional 3D visualization tool works with device conduction loss, switching energy loss, and thermal impedance.

Next, the simulator has a utility to design custom heat sink models, enabling users to accurately predict junction temperatures and optimize cooling solutions tailored to their specific needs.

The simulation stage within this tool is highly detailed, offering insights into various parameters such as losses, efficiency, and junction temperature in transient and steady state conditions. Furthermore, the tool has an easy mechanism to compare runs with different devices, circuit parameters, cooling designs, and loss models.

Figure 5 Loss plotting is another important feature offered by Elite Power Simulator. Source: onsemi

The simulator and SSPMG are adaptable to diverse semiconductor technologies. While initially focusing on SiC products, both tools will be expanding to other power devices. This versatility ensures that engineers can leverage the tools across various devices, tailoring simulations to their specific requirements.

Simulating beyond datasheet conditions

The utilization of simulation tools in virtual prototyping has brought about substantial transformation in design flows. Engineers and designers are now able to comprehend the performance of these electronic circuits prior to their mass production in their quest for first time right performance. Accuracy is a critical component when it comes to simulating intricate electronic circuits.

Simulating beyond datasheet conditions is key due to the access to unlimited data that normally would be difficult to acquire via physical testing. This facilitates the optimization and analysis of circuit performance virtually.

By employing precise simulations, one can prevent the underestimation or overestimation of system performances.

James Victory is a fellow for TD modeling and simulation solutions at onsemi’s Power Solutions Group.

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