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RS, a trading brand of RS Group plc, a global provider of product and service solutions for industrial customers, proudly marks its 30th anniversary in India, celebrating three decades of excellence, innovation, and commitment in the country. Since its inception in March 1994 with a modest team of eight, RS India has grown into a leading distributor in the industrial sector, with a robust team of 125 professionals and ambitious plans for further expansion.

Over the years, the company has seen remarkable growth, expanding from an initial annual revenue of INR 1.02 crore in 1994-95 to an impressive INR 125 crore in 2024. This success reflects its unwavering commitment to providing high-quality electronic and industrial components, solidifying its position as the preferred choice for numerous businesses across the nation.

Shiv Bhambri, CEO at RS India, reflecting on his 20-year tenure, said, “RS India has been a key player in reshaping the industrial landscape over the past 30 years. We’ve transitioned from traditional offline purchases to implementing global procurement strategies like vendor consolidation and B2B eCommerce. Our commitment to supporting the academic community, especially during COVID-19, highlights our dedication to making a positive impact.”

RS India is deeply committed to sustainability and social responsibility. Our purpose of making amazing happen for a better world reflects our focus on delivering results for people, planet, and profit. Our 2030 ESG action plan, ‘For a Better World’, is designed to deliver long-term value for all our stakeholders. This commitment has earned RS a place among the Top 100 ESG companies worldwide. We also engage in student projects at various engineering colleges & universities including the IIT’s and CSR activities, highlighting our dedication to educational growth and community development.

Keith Rice, Vice President RS Emerging Markets, RS Group said, “As we celebrate this milestone, we extend our gratitude to our customers, partners, and employees for their continued support. Our focus remains on driving Continuous Improvement (CI) and enhancing customer satisfaction, demonstrated by our improved Net Promoter Score (NPS). We are equally committed to sustainability, with green initiatives across the supply chain reinforcing our goal to make a positive impact. We eagerly anticipate a future filled with further innovation and success.”

As we enter the next phase of growth, our commitment is to double the customer base, support the Make in India initiative, drive innovation in industrial procurement, and promote inclusivity and diversity. By embracing new technologies such as Big Data, AI, Blockchain, and System Architecture, Our aim is to remain at the forefront of the industry. The goal is to integrate ESG objectives with supply chain optimization, utilizing AI and digitalization to streamline and standardize sustainability practices.

RS India continues to evolve with the launch of the RS Mobile App, the cutting-edge tool is designed to streamline operations for businesses exporting goods from the UK around the world, offering instant access to a vast catalogue of over 750,000 electronic, electrical, mechanical, test & measurement and PPE products. With real-time stock and price information, the newly launched RS Mobile app embodies our ongoing commitment to efficiency, customer satisfaction, and technological advancement.

As we look to the future, the vision is to continue its double-digit growth through digital transformation in the B2B industrial space while ensuring high levels of customer satisfaction.

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 VIAVI Solutions Inc. introduced the VIAVI Automation Management and Orchestration System (VAMOS), an intelligent automation platform that incorporates AI/ML capabilities to enable wireless and cloud service providers, network equipment manufacturers and their ecosystems to reduce operational expenses and accelerate time-to-market.

The complexity of network architectures continues to increase, as operators and equipment manufacturers investigate the next generation of technology, migrate to the cloud, and leverage AI and ML. Continuous Testing (CT) becomes ever more prevalent to provide a unifying perspective on real-world performance. Yet labs are confronting the dual challenges of more tests and limited headcount. Automation has become a crucial way for them to manage the complexity, scheduling and manpower demands of CT, allowing technicians to efficiently power through hundreds of test cases, and to focus on higher-order analysis and problem solving.

VIAVI has developed VAMOS as part of its industry-leading NITRO Wireless portfolio to automate test campaigns and their execution in one centralized cloud-based, Lab-as-a-Service platform. Built-in AI and ML capabilities enable test optimization and faster response times.

VAMOS’s customizable workspaces and configurations streamline the testing process across organizations and lab locations. Shared tool testbeds and individual sandboxes accommodate multiple test needs while the platform’s robust analytics and reporting help maximize test resource utilization and boost test accuracy.

“As VIAVI works with leading labs around the globe to integrate wireless, cloud and AI, the need for automation and orchestration has never been clearer,” said Ian Langley, Senior Vice President, Wireless Business Unit, VIAVI. “In initial implementations at major labs, VAMOS has already demonstrated significant reductions in cost per test-hour and increases in hardware utilization.”

In addition to providing a standalone solution to schedule and run test campaigns based on VIAVI’s NITRO Wireless portfolio, VAMOS can be integrated with a third-party automation framework, allowing it to interact with a wider range of products and existing test environments. Connection is available via both software and hardware.

VAMOS will be integrated into the VIAVI Automated Lab-as-a-Service for Open RAN (VALOR) for the lab’s on-demand, cloud-based testing. VALOR is designed to manage and support 5G and Open RAN deployments that would benefit from access to tools and expert staff with a minimal ramp-up time. The project is funded by the Public Wireless Supply Chain Innovation Fund.

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element14 Global, a fast and reliable distributor of products and technology for electronic and industrial system design, maintenance, and repair, has announced the launch of its latest data acquisition solution.

This new offering combines NI CompactDAQ hardware with the newly available FlexLogger Lite software at no additional cost. Designed to enhance and accelerate sensor measurement processes, this solution is set to offer engineers a more efficient way to capture sensor data.

The NI CompactDAQ system, renowned for its robust chassis and modular design, is now paired with FlexLogger Lite, a software solution that eliminates the need for programming. This integration allows for faster and more straightforward data collection for voltage and sensor measurements. The streamlined setup and execution are expected to improve overall efficiency in data acquisition tasks, benefiting engineers who require quick and reliable data analysis.

Key Features Include:

• Speedy Data Access: Quickly get data to your design team, keeping projects on track. With the software it is possible to configure channels, drag-and-drop graphs, and log to Excel in minutes.
• Flexible Customization: Easily adjust the system with a drag-and-drop interface, open file formats, and over 70 compatible measurement modules.
• Scalable Solutions: Start with free logging software and seamlessly scale up to full, automated test executives as your needs evolve.
• Ideal for Engineers and Technicians: Perfect for those measuring voltage, current, or sensor data with a computer.

“We’re excited to roll out this new solution that truly puts our customers at the centre of what we do.’’  said Christelle Mazella, Senior Manager Test & Measurement at element14 “By combining NI CompactDAQ hardware with the intuitive FlexLogger Lite software, we’re making it easier for engineers to capture and analyze data efficiently. This solution is designed to meet our customers’ needs for simplicity and speed, helping them achieve their goals with greater ease.”

This free software is part of NI’s comprehensive software catalog, which includes the LabVIEW+ Suite. It is available for download from https://www.ni.com/en/shop/data-acquisition-and-control/flexlogger.html. Customers who purchase a CompactDAQ system from element14, Newark, or element14 can access this software at no additional cost. There is no need for a separate order or proof of purchase for the FlexLogger Lite package. The software is compatible with both individual modules and bundled systems. Engineers can start with FlexLogger Lite today and easily scale up to the full LV+ suite as their needs grow. element14 also offers comprehensive support and technical resources to optimize your data acquisition capabilities.

The NI CompactDAQ hardware with free FlexLogger Lite software is now available for immediate delivery from Farnell in EMEA, element14 in APAC, and Newark in North America.

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Author: STMicroelectronics

What’s the difference between a microcontroller (MCU) and a microprocessor (MPU)? In simplistic terms, both are the brains of an embedded system. A few years ago, the distinction between the two was significantly starker because they offered vastly different capabilities and demanded widely different engineering skills. Today, the two terms remain, but innovations keep blurring the dividing lines. At ST, we see that integrators who previously only used MCUs now find it easier to grab an MPU. In fact, for some, microprocessors have become a secret weapon because they enable them to offer new applications or enter new markets thanks to their inherent capabilities or their ability to run Embedded Linux. Hence, let’s delve into this new trend.

The origin story MCUs as an alternative to MPUs

When the industry came up with the first microcontrollers in the 1970s, it was to find an alternative to overly power-hungry and complex MPUs. MCUs had much less computational throughput but incorporated the memory, processor, peripherals, and clock under one roof. Additionally, they could run a real-time operating system. Consequently, engineers could build deterministic systems with just one device, making them tremendously popular in automotive and motor control applications. Today, MCUs are everywhere, from smartphones to medical or household appliances. Conversely, MPUs dedicated their silicon space to computational units at the expense of power consumption or integration. That made them very attractive when trying to run multiple threads or a more complex OS like Embedded Linux.

Understanding the difference between an MCU and an MPU Choosing between MCUs and MPUs based on application needs

An exhaustive exposition of the decision matrix that leads engineers to choose an MPU or an MCU would be overwhelming. However, there are recurring themes, such as computing needs. If an application requires a powerful neural processing unit or a myriad of computing cores and big GPUs, or if it performs contextual computing with lots of memory requirements, an MPU is an obvious choice. Conversely, a tiny software that wakes up occasionally to check a sensor’s value or that needs a deterministic response time of a few nanoseconds will use a microcontroller. Hence, in many instances, the “end justifies the means”. Put simply, an engineer will choose one device over another based on the application it will run.

Another factor could be the graphical needs of a system. Traditionally, human-machine interfaces (HMIs) with complex 3D animations, high-resolution displays, and extensive applications running alongside the UI will gravitate toward the GPU and memory controller of a microprocessor. Alternatively, HMIs that require much simpler animations and graphics are increasingly relying on MCUs. Frameworks like TouchGFX and hardware IPs like NeoChrom GPU continue to optimize what’s possible on a smaller microcontroller. Similarly, MPU for embedded systems also supports higher resolutions thanks to beefier GPUs. Hence, while each type of device is doing more, the demarkation remains pretty straightforward.

Choosing between MCUs and MPUs based on costs and power consumption

Besides computational throughput, developers look at other key metrics like power consumption, volatile and non-volatile memory needs, peripherals required, and number of pins needed. As engineers wrestle with cost constraints, these criteria become critically important because they impact the overall PCB design and bill of materials (BOM). For instance, a lot of flash and additional components will require multiple PCB layers, which increase lead time and costs. Hence, for the longest time, the equation was relatively straightforward. Integrators that focused primarily on cost or low power consumption chose a microcontroller.

The blurring of the lines between MCUs and MPUs

Since the early 2000s, MPUs have undergone significant changes. One of the most disruptive innovations in the world of MPUs has been the democratization of System-on-Modules (SoM) and System-in-Packages (SiP) for microprocessors. In years past, integrators had to design the entire system around the microprocessor, which meant dealing with more complex power management systems and a fiddly external memory, among other things. Indeed, using large external DDR memory requires a lot of fine-tuning and unique expertise, which could be a significant barrier to using an MPU. However, SoMs and SiPs remove all this complexity by securely and comprehensively incorporating all necessary components under one package or module.

Additionally, some of the latest ST microprocessors have come a lot closer to the power consumption of a microcontroller. Furthermore, microprocessors can now run a real-time operating system, further blurring the line between MPUs and MCUs. Previously, applications that required real-time execution, like motor control applications, had to run on a microcontroller. Today, engineers have started adopting MPUs to benefit from more computing power and access to larger memory capacity without compromising execution time. Put simply, some integrators are leveraging innovations in MPUs to turn them into a new secret weapon while competitors use MCUs.

The new story An STM32H7 or an STM32MP1?

The last few years have significantly blurred the lines between high-performance MCUs and entry-level MPUs, making devices like the STM32MP13 a new darling for embedded system developers. Just like an STM32H7, the STM32MP13 supports Eclipse ThreadX on its own. Hence, developers who have never touched a microprocessor suddenly get a familiar environment, and applications that call FileX, NetDuoX, or USBX will run on both. Hence, it’s possible to enjoy a lot more performance without retraining teams or tremendously increasing BoM costs.

Furthermore, STM32 engineers have an additional advantage since the STM32Cube ecosystem of tools works with both our MCUs and MPUs, further lowering the barrier to entry. For instance, initializing the pin-out configuration and clock tree happens on STM32CubeMX. Developers looking to implement secure secret provisioning on their STM32 MPU will use STM32CubeProgrammer, the same application responsible for making secure firmware installs (SFI) more accessible. Consequently, users of our ecosystem have an additional incentive to explore MPUs as a secret weapon that can support new applications because they are already familiar with many of the development tools and concepts that drive all our devices.

From STM32MP13 to STM32MP15

The question for many embedded systems developers is no longer whether to venture into the MPU kingdom but how far they will delve into it and where to begin. Since many members of the ST Partner Program have launched SiPs and SoMs with an STM32MP13, the device is a great starting point in the decision-making process of any team looking to make an MPU their secret weapon. The device has one Cortex-A7 running at 1 GHz, which will attract those seeking a simple yet powerful device. The absence of multiple cores also means a low power consumption of 27 µW and the ability to integrate the STM32MP13 into a simple four-layer PCB.

Those wishing for more power will turn to the STM32MP15. The device comes with two Cortex-A7 cores and a Cortex-M4, thus still blurring the lines between MCUs and MPUs while pushing developers further into the land of MPUs. For instance, it’s possible to turn off the Cortex-A7 and use the Cortex-M4 as a traditional MCU to record sensor data while using significantly less power. Moreover, its 3D GPU is OpenGL-compliant, allowing developers to run vastly superior UIs than on a device without a GPU. It also comes with a lot more display interfaces and peripherals. The STM32MP15 can thus help integrator scale their system.

Let’s take the example of a company working on an industrial application, such as a programmable logic controller. Using the STM32MP13 allows them to design a headless yet powerful model. Afterward, developers can take the original design and upgrade the PLC with a display and a human-machine interface (HMI) using a resolution of 1080 x 720, thanks to the STM32MP15. Because the company started with an STM32 MPU, they can use the same Embedded Linux distribution and easily port their application from one MPU to the next. The operating system also runs remarkable UI frameworks, such as Qt or Crank , known for their portability.

Another example is smart thermostats, where the interface is an integral part of the experience. Makers have been differentiating themselves by using various levels UIs and screen sizes to attract a broader range of customers. By moving from an STM32MP15 to an STM32MP13, it becomes possible to run the same underlying application but with different bells and whistles to create a portfolio that covers more needs and price points.

From STM32MP15 to STM32MP25

Developers are increasingly concerned about creating products with a longer lifespan and leveraging machine learning at the edge. The latest advances in MPUs have helped them answer those needs by providing greater memory flexibility, which explains why many often adopt an STM32 MPU to stay ahead of the competition. For instance, the new STM32MP25 is our first MPU to support DDR4 and LPDDR4 on top of DDR3. Its 64-bit architecture also means it can address more memory for applications like audio processing and network appliances or run multiple software simultaneously to save resources, thus improving efficiency.

Because most industrial applications will use the same memory interface for a decade or more, it is critical for a microprocessor to offer a memory controller with more flexibility than what is usually found in consumer markets. That’s why ST MPUs always support multiple interfaces, and we ensure the widest compatibility, as demonstrated with the STM32MP25. It makes supporting a system more efficient while also facilitating the creation of design updates and upgrades.

Similarly, many are looking to benefit from machine learning at the edge. Consequently, the STM32MP25 is the first STM32 device to house support a 64-bit architecture thanks to its two Cortex-A35, which are the most efficient Arm core ever released. As a result, it can run more powerful applications while keeping the power consumption down. It also features a neural processing unit (NPU) capable of 1.35 TOPS, and its Vulkan-compatible GPU provides enough power to run a modern UI comfortably on a full HD display. Our new MPUs thus open the door to some of the most demanding applications, like smart cameras capable of people counting or object detection, and new systems like spatial computing.

What will the future hold?

ST is committing to release more STM32MP2 MPUs to help developers tailor their applications. Indeed, while there are a lot of microcontroller variants of the same series, microprocessors aren’t as varied because they are harder to make. However, as ST optimized its manufacturing capabilities, we plan to release more versions faster and make many of them pin-to-pin compatible. We already announced the STM32MP21 and STM32MP23. The STM32MP21 will provide a Cortex-A35 and a Cortex-M33, two Ethernet controllers, and a camera interface to serve cost-effective computer vision applications at the edge. As for the STM32MP23, it sits between the STM32MP25 and STM32MP21 thanks to its dual Cortex-A35 to enable a rich UI while prioritizing costs.

The range of STM32 MPUs

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Infineon Technologies AG is introduced its new StrongIRFET 2 power MOSFET 30 V portfolio, expanding the existing StrongIRFET 2 family to address the growing demand for 30 V solutions in the mass market segment. Optimized for high robustness and ease-of-use, the new power MOSFETs were specifically designed to meet the requirements of a wide range of mass market applications, enabling high design flexibility. Amongst these applications are industrial switched-mode power supplies (SMPS), motor drives, battery-powered applications, battery management systems, and uninterruptible power supplies (UPS)

The StrongIRFET 2 30 V technology offers up to a 40 percent RDS(on) improvement and up to a 60 percent reduction in QG compared to the previous generation of StrongIRFET devices. This translates into higher power efficiency for improved overall system performance while providing an excellent robustness. The new power MOSFETs also ensure an easy design-in and provide simplified product services. The product family’s excellent price/performance ratio makes it an ideal choice for designers looking for convenient selection and purchasing.

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Compact electronics present a unique challenge when it comes to cooling. While thermal management is becoming a growing concern amid increased chip functionality, smaller devices mean there’s less room for conventional heatsinks. And recent breakthroughs in microchannel liquid cooling could change that.

Fluids are 50 to 1,000 times more efficient than air at transferring heat, but the necessary infrastructure is often too large for small Internet of Things (IoT) gadgets. So, advances in precision manufacturing mean liquid heatsinks are smaller than ever before. Some cold plates are as small as 2 cm x 2 cm while dissipating up to 1,000 watts per square centimeter.

Microchannel liquid cooling facilitates more compact device form factors. Source: Sinda Thermal Technology

Such performance comes from a combination of innovative materials and a network of microchannels—fluid channels just a few microns across—that enable small-scale liquid cooling. On-chip cooling takes this potential further. Manufacturers can etch microchannels directly onto the semiconductor substrate, bringing thermal fluids as close as possible to the chip. The design minimizes losses from radiated heat and enables more compact device form factors.

Research shows on-chip liquid heatsinks exhibit 50 times greater cooling performance than conventional microchannels. Such designs also use water as the fluid. Consequently, device manufacturers could see even greater improvements using on-chip microchannels with chemical coolants.

Stacked components

The advent of on-chip microchannel liquid cooling paves the way for other optimizations. Component stacking is among the most promising of these. Removing the need for bulkier cooling infrastructure makes it possible to stack components instead of placing them next to each other without risking excessive heat.

This packaging technique reduces signal latency to improve performance and enables even more compact circuit designs. Manufacturers could use it to their advantage to overcome conventional barriers related to dark silicon.

Future challenges and considerations

A few remaining obstacles may hinder progress for microchannel liquid cooling. Manufacturing costs and complexity are the most prevalent. As effective as these solutions are, etching microscopic channels into sensitive components is inherently risky and difficult. Moreover, doing so at scale may require factories to upgrade to newer micromachining equipment, which could impact the cost-effectiveness of new devices.

However, as this technology matures, its expenses will fall. In the meantime, device manufacturers can take matters into their own hands instead of looking for a semiconductor fab that offers such cooling systems. Studies have found it’s possible to achieve a 44.4% reduction in thermal resistance by etching channels into off-the-shelf consumer-grade chips.

As microchannels enable higher functionality at lower temperatures, the industry may eventually face another challenge. Once thermal constraints no longer hold chip performance back, power delivery might. So, manufacturers could come to the point of designing chips so powerful that powering them is no longer cost-effective.

Such a conflict is likely far away, and new energy delivery technologies could emerge to address it in the meantime. However, the possibility deserves attention. Electronics manufacturers should consider these long-term implications and seek potential solutions as they capitalize on microchannel liquid cooling.

As gadgets keep getting smaller, cooling techniques will have to evolve. Here, etching microchannels directly onto the substrate is a promising solution, especially when combined with component stacking. While some challenges remain, electronics manufacturers can gain a lot by considering these methods and learning to implement them.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

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The post How microchannel liquid cooling trims electronic designs appeared first on EDN.

I made simple annoyatron and inspired by an youtube video I have hidden it in a walnut shell. I was so excited about it working, that I decided to imagine it as legitimate product. I can't wait to do another projects 😁 submitted by /u/BosaKaczka [link] [comments]

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Just a Cheap 8x8 smd led board. It will be a pain soldering all that leds on right position by hand. The IC seems to be a eeprom. The MF condenser fell of the table and I was able to find it (A miracle). submitted by /u/Don_Kozza [link] [comments]

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Artificial intelligence (AI) algorithms and supporting hardware will be critical in heralding the next stages of automated and ultimately autonomous driving, and a collaboration between Infineon and ZF as part of the EEmotion project demonstrates the viability of this ambitious technology undertaking.

EEmotion successfully integrated AI into the safety-critical functions of the vehicle control system. Source: Infineon Technologies

The EEmotion project aimed to develop an AI algorithm-based control system for automated driving that ensures more precise trajectory control in various driving situations. The project ran from September 2021 to August 2024, was co-funded by the German Federal Ministry for Economic Affairs and Climate Action and had Infineon Technologies AG as the consortium coordinator.

It began by defining the requirements for AI-based functions while aiming to develop AI in control architectures for safety-critical applications. The project also worked on aspects like the development of secure AI-monitored communication, investigation of the simulative development, and taking validation of vehicle dynamics systems into account.

As part of this project, Infineon joined hands with ZF Group to create and implement AI algorithms to develop vehicle control software. These AI algorithms—proven in a test vehicle—controlled and optimized all actuators during automated driving according to the specified driving trajectory.

ZF added AI algorithms to its two existing software solutions cubiX and Eco Control 4 ACC. The cubiX software makes it possible to control all chassis components in passenger cars and commercial vehicles. Next, Eco Control 4 ACC, a predictive cruise control system, was upended using a computationally intensive optimization algorithm and model-predictive control to achieve as much as 8% more range under real driving conditions.

These software solutions with added AI content were implemented on Infineon’s AURIX TC4x microcontroller with integrated parallel processing unit (PPU). This MCU, offering ample computing power, is capable of supporting AI modelling, virtualization, functional safety, cybersecurity and networking functions.

The outcome of loading ZF’s software solutions with added AI algorithms on AURIX TC4x MCU was a demonstration of automated lane changes much more accurately and an energy efficiency boost in adaptive cruise control. This shows how such improvements in driving performance while using lower compute power devices like MCUs could pave the way for cost-efficient Level 2+ assistance systems.

Related Content

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• AI’s Impact on the Current and Future Automotive Industry
• Unveiling the Transformation of Software-Defined Vehicles
• How Automated Driving Is Transforming the Sensor and Computing Market

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As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

In cooperation with Dr Hermann Oppermann of the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Dr Norwin von Malm (senior director New Technologies) and Stefan Groetsch (who leads the corresponding team within System Solution Engineering) at ams OSRAM GmbH in Premstätten, Austria and Munich, Germany comprise one of three teams nominated as a finalist for the Deutscher Zukunftspreis 2024 (German Future Award), the Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), China-based Chengdu InSiGa Semiconductor Technologies Co Ltd and POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — have developed and are showcasing in a live demonstration the combination of POET’s 200Gx4 transmit optical engine using InSiGa’s 200G/lane EML driver ISG-D9616 for 800G and 1.6T modules...

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet sources. The platform offers three core services—design, packaging, and production—to improve the efficiency of assembling complex semiconductor designs.

In the chiplet era, advanced packaging capacity is increasingly constrained. Faraday’s platform tackles this issue by coordinating vendors for chiplets, high bandwidth memory (HBM), interposers, and 2.5D/3D packaging. It provides a one-stop solution with services including chiplet design, testing, production planning, procurement, inventory management, and advanced packaging. Tailored to diverse client needs, the platform ensures a reliable supply of critical components.

In addition, Faraday specializes in designing and implementing key chiplets, such as I/O dies, SoC/compute dies, and interposers. The company partners with UMC, Samsung, Intel, and OSAT providers to deliver advanced packaging solutions. These include system-level design, power and signal integrity analysis, and thermal dissipation optimization for technologies like Intel’s EMIB, Samsung’s I-Cube, and 2.5D packaging.

Faraday Technology is an ASIC design service and IP provider, certified to ISO 9001 for quality management and ISO 26262 for functional safety in automotive systems. Its silicon IP portfolio includes I/O, memory, ARM-compliant CPUs, and high-speed interfaces like USB, Ethernet, SATA, PCIe, and SerDes.

Faraday Technology 

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Thine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition in Frankfurt, Germany. By eliminating DSPs from optical communication systems in data centers, the chipset reduces power consumption by 60% and lowers latency by 90%.

Current advanced optical communication systems for PCIe often face challenges with high power consumption and signal processing delays, particularly with silicon-photonics lasers and DSP-equipped VCSEL drivers. To address these issues, THine’s chipset for PCIe 6.0 integrates a VCSEL driver and transimpedance amplifier into a DSP-free active optical cable (AOC) solution.

This optical PAM4 64-Gbps chipset leverages THine’s analog technology to eliminate DSPs from optical modules and end-point ASICs, achieving accurate signal recovery and improvements in power efficiency. The complany also plans to develop an advanced optical chipset for PCIe 7.0.

A datasheet for the PAM4 PCIe 6.0 chipset was not available at the time of this announcement.

THine Electronics

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Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and MEO satellites. Using the Compact Antenna Test Range (CATR) method, the chamber simulates long-distance communication conditions, such as those encountered in satellite communication, over a short physical distance. It is also capable of accommodating one of Japan’s largest antennas, with an aperture of up to 80 cm.

Designed with high-quality radio wave-absorbing materials on the ceiling, walls, and floor, and equipped with parabolic reflectors, the chamber suppresses unwanted reflections and measures performance over a short distance. While typical chambers require over 60 meters to test an 80-cm aperture antenna, Sharp’s CATR-based setup achieves accurate measurements over approximately 7 meters across a frequency range of 10 GHz to 40 GHz.

In addition to supporting Ku/Ka bands used for satellite communications, the anechoic chamber also accommodates measurements in the upper mid-band (FR3 6 GHz to 24 GHz), a potential frequency range for 6G deployment. The new chamber facility, launching this month, will enable testing and technical verification of various products, including next-generation smartphones.

Sharp

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Two Hall-effect switch families, the unipolar AH332xQ and omnipolar AH352xQ from Diodes, offer a range of operating sensitivity options. The automotive-compliant ICs are suitable for a wide range of contactless position and proximity detection applications, including seatbelt fastening, door and trunk latching, windshield wipers, and steering wheel locks.

The unipolar AH332xQ switches provide 10 sensitivity options, ranging from a highly sensitive 30 G BOP to a low-sensitivity 275 G BOP. The omnipolar AH352xQ series includes three high-sensitivity options from ±20 G BOP to ±40 G BOP. Both series feature tight operating and release thresholds with sufficient hysteresis for reliable operation, while a low temperature coefficient ensures stable switching points.

These devices support a wide input voltage range of 3 V to 28 V and are AEC-Q100 Grade 0 qualified, with an extended temperature range of -40°C to +150°C. They deliver ESD protection exceeding 8 kV HBM and 1 kV CDM, along with 40-V load-dump capability. Packaging options include SIP-3, SOT23 (Type S), and SC59.

The AH332xQ and AH352xQ Hall-effect switches cost $0.30 each in lots of 3000 units.

AH332xQ series product page

AH352xQ series product page

Diodes

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