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• AI digital and analog tools optimized for advanced node SF2 gate-all-around (GAA), driving enhanced quality of results and accelerating circuit process node migration
• Cadence’s best-in-class 3D-IC technology enabled for all of Samsung Foundry’s multi-die integration offerings, accelerating the design and assembly of stacked chiplets
• Cadence’s broad IP portfolio and tools for next-generation AI designs will enable customers to achieve first-pass silicon success and accelerate time to market

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a broad collaboration with Samsung Foundry that includes technology advancements to accelerate design for AI and 3D-IC semiconductors, including on Samsung Foundry’s most advanced gate-all-around (GAA) nodes. The ongoing collaboration between Cadence and Samsung significantly advances system and semiconductor development for the industry’s most demanding applications, including AI, automotive, aerospace, hyperscale computing and mobile.

Through this close collaboration, Cadence and Samsung have demonstrated the following:

• AI enables lower leakage power and development of SF2 GAA test chips: Cadence, in close collaboration with Samsung Foundry, has leveraged the Cadence® Cerebrus Intelligent Chip Explorer and its AI technology in both DTCO and implementation to minimize leakage power on their SF2 GAA platform. Compared to the best-performing baseline flow, the Cadence.AI result achieved a more than 10% reduction in leakage power. As part of this ongoing collaboration, a mutual customer is actively involved in the development of a test chip using Cadence.AI for an SF2 design.
• Cadence backside implementation flow certified for Samsung Foundry SF2: As a result of extensive collaboration between Cadence and Samsung Foundry, a complete Cadence backside implementation flow has been certified for the SF2 node to accelerate the development of advanced designs. The full Cadence RTL-to-GDS flow, including the Genus Synthesis Solution, Innovus Implementation System, Quantus Extraction Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Tempus Timing Signoff Solution has been enhanced to support backside implementation requirements such as backside routing, nano TSV insertion, placement and optimization, signoff parasitic extraction, timing and IR analysis, and DRC. The Cadence backside implementation flow has been validated with a successful Samsung SF2 test chip, demonstrating the flow is ready for use.
• Cadence has collaborated with Samsung Foundry to enable solutions for Samsung Foundry’s multi-die offerings: The Cadence Integrity 3D-IC platform is enabled for all of Samsung’s multi-die integration offerings, and its early analysis and package awareness features are now compliant with Samsung’s 3DCODE 2.0 version. In addition, Cadence and Samsung have expanded the multi-die collaboration by enabling differentiating technologies like thermal warpage analysis using the Cadence Celsius Studio and system-level LVS with Cadence Pegasus Verification System. Cadence is also supporting Samsung with a package PDK that reduces design time with the Allegro X system. Combined with the Integrity 3D-IC platform, it optimizes the package design flow.
• AI’s Virtuoso Studio flow successfully deployed for analog circuit process migration: Purpose-based instance mapping in the AI-powered Virtuoso Studio provided rapid retargeting of the schematics, while circuit optimization in Virtuoso Studio’s Advanced Optimization Platform helped Samsung achieve a 10X improvement in turnaround time when migrating a 100MHz oscillator design from 14nm to 8nm. In addition, a FinFET-to-GAA analog design migration reference flow is available for joint customers, with successful experimental results.
• Cadence mmWave RFIC design flow successfully used to tapeout 14RF circuit design: Cadence and Samsung successfully taped out a 48GHz power amplifier design, representing silicon validation of the robust, full system reference flow that leverages the Cadence EMX Designer to create passive devices with fast modeling and layout automation. Full design EM extraction with the EMX 3D Planar Solver and EM/IR analysis using Voltus XFi and Quantus ensured that the IC met aggressive metrics, Pegasus was used for signoff DRC/LVS, while AWR VSS provided a seamless environment to carry out initial system-level budgeting and post-layout verification. Mutual customers can feel confident utilizing this flow to deliver leading-edge designs to market in a timely manner.
• Cadence Pegasus Verification System is certified for Samsung Foundry’s 4nm and 3nm process technologies: Through the collaboration with Samsung Foundry, the Cadence physical verification flow is optimized to allow mutual customers using Samsung Foundry’s advanced nodes to reach signoff accuracy and runtime goals for a faster time to market. The Pegasus system is now certified across multiple advanced nodes at Samsung Foundry, which are proven and in production by customers, with simplified, all-inclusive licensing support. The Pegasus system is integrated into the AI-powered Cadence Virtuoso Studio as iPegasus to enable in-design signoff quality DRC and interactive metal fill in the layout implementation, offering up to 4X faster turnaround times.
• Cadence IP portfolio offers comprehensive industry solutions on advanced Samsung nodes:

Cadence’s latest IP built on Samsung SF5A includes industry-leading PHY IP for 112G-ULR SerDes, PCIe® 6.0/5.0, UCIe , DDR5-8400, DDR5/4-6400 Memory and USB 2.0, offering customers complete platform solutions.

Cadence’s PHY IP for PCIe 6.0 on Samsung SF5A has been successfully certified for PCIe 5.0 x8 compliance and demonstrated seamless interoperability with other PCIe 5.0/6.0 system and test equipment, further showcasing its PCIe solution maturity

Cadence is furthering its partnership with Samsung Foundry by pushing the performance envelope, designing advanced memory IP for GDDR7 on Samsung SF4X and SF2, and helping reshape the HPC/AI industry with this new memory standard.

• Advanced verification for AI design complexity: Samsung Foundry applied Cadence’s advanced verification technologies, such as the Palladium Enterprise Emulation System, JasperC, STG, and Xcelium ML, to tackle rising AI chip complexity and achieve time-to-market requirements in SF3.

“We are honored to partner with Samsung, a true example of a chips-to-systems company, to bring this technology for our joint partners to design the next generation of intelligent systems,” said Tom Beckley, senior vice president and general manager in the Custom IC & PCB Group at Cadence. “The hyperconvergence of AI with modern accelerated compute requires a strong silicon infrastructure. With these new AI-powered, certified design flows and standardized solutions, mutual customers can confidently design for Samsung advanced nodes while achieving their design and time-to-market goals.”

“Samsung and Cadence have a close collaboration to advance technology and help our customers deliver competitive designs to the market efficiently,” said Sangyun Kim, Vice President and head of Foundry Design Technology Team at Samsung Electronics. “Our joint efforts enable customers to utilize Samsung’s latest process and technology innovations to push the limits for the most advanced AI, hyperscale computing and mobile SoC designs.”

To learn more about Cadence AI offerings, please visit: Cadence.ai.

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Synopsys recently unveiled the industry’s first complete PCIe 7.0 IP solution, designed to accelerate trillion-parameter HPC and AI supercomputing chip designs. This new IP solution future-proofs bandwidth for hyperscale AI data centre infrastructure, addressing the demanding requirements of transferring massive amounts of data for compute-intensive AI workloads.

Key Highlights of Synopsys’ PCIe 7.0 IP Solution

1. Complete Solution: Synopsys offers the industry’s only complete PCIe 7.0 IP solution, including the controller, IDE security module, PHY, and verification IP. This solution enables data transfers of up to 512 GB/s bidirectional in an x16 configuration.
2. Power Efficiency and Low Latency: The pre-verified PCIe 7.0 Controller and PHY IP provide low latency data transfers and up to 50% more power efficiency compared to prior versions while maintaining signal integrity.
3. Security: The Synopsys IDE Security Module for PCIe 7.0, pre-verified with the Controller IP, offers data confidentiality, integrity, and replay protection against malicious attacks, ensuring a secure data transfer environment.
4. Experience and Reliability: With more than two decades of PCIe IP experience and over 3,000 design wins, Synopsys offers a low-risk path to silicon success, providing customers with a robust and reliable IP solution.

This solution is crucial for chip makers addressing the bandwidth and latency challenges posed by large language models and compute-intensive AI workloads. Synopsys’ PCIe 7.0 IP solution supports secure data transfers, mitigating AI workload data bottlenecks and enabling seamless interoperability within the ecosystem.

At the PCI-SIG DevCon in Santa Clara, Synopsys demonstrated the world’s first PCIe 7.0 IP over optics, showcasing the technology’s capabilities in real-world scenarios. This includes Synopsys PCI Express 7.0 PHY IP electrical-optical-electrical (E-O-E) TX to RX running at 128 Gb/s with OpenLight’s Photonic IC, and successful root complex to endpoint connection with FLIT transfer using Synopsys PCIe 7.0 Controller IP.

Synopsys’ PCIe 7.0 IP solution is part of a broader portfolio for high-performance computing (HPC) SoC designs, including solutions for 1.6T/800G Ethernet, CXL, and HBM. The company’s extensive interoperability testing, comprehensive technical support, and robust IP performance help designers accelerate time to silicon success and production.

Industry leaders such as Intel, Astera Labs, Enfabrica, Kandou, XConn, Rivos, and Microchip have embraced PCIe 7.0 for AI data center infrastructure, recognizing its importance in delivering high-bandwidth, low-latency connectivity critical for data-intensive and latency-sensitive workloads.

Overall, Synopsys’ PCIe 7.0 IP solution represents a significant advancement in enabling next-generation HPC and AI chip designs, providing a secure, efficient, and high-performance interconnect solution for the evolving demands of hyperscale AI data centers.

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Infineon Technologies AG received the German Brand Award in the renowned “Best of Category” as “Excellent Brands – Corporate Brand of the Year”. The German Council of Design recognizes Infineon’s exceptional brand development, highlighting the company’s dedication to establishing a consistent brand that harmonizes seamlessly with its corporate strategy.

“To receive the German Brand Award as Corporate Brand of the Year is a special recognition for Infineon’s brand development over the past years,” said Andreas Urschitz, Member of the Management Board and Chief Marketing Officer of Infineon. “We are a global technology and thought leader with a clear vision and decisive actions. As a company, we are dedicated to driving decarbonization and digitalization through our solutions and in our business areas, together with our customers and partners. This commitment is deeply rooted in our corporate strategy, our brand, and within the entire global Infineon team.”

The award underlines Infineon’s commitment to excellence and innovation in brand strategy and design. It also reflects a strategic and decisive approach in the brand and corporate strategy, which ultimately enhances the company’s market presence with its audience.

The jury of the German Brand Award, which consists of members of the German Council of Design, acknowledged Infineon’s brand identity that resonates with its target audience while continuously staying true to its core values and vision. The jury’s statement states: “Infineon has been a strong brand for 25 years – and also ‘Corporate Brand of the Year’ in 2024. The semiconductor manufacturer has decisively developed its strategy and design to link the brand even more closely with the corporate strategy. The close integration, including vision, mission and values, is exemplary and contributes to an outstanding positioning. Only a few companies in the competitive arena have such a consistent and distinctive brand. The dedicated 360-degree brand development and, above all, implementation is credible and has a high unique selling point.”

The German Brand Award is the award for successful brand management, initiated by Germany’s design and brand authority. Judged by a top-tier jury of experts from brand management and brand science, the German Brand Award discovers, presents and honors unique brands and brand makers.

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News highlights

• 650V intelligent power module (IPM) enables more than 99% inverter efficiency for appliances and HVAC systems by integrating TI’s gallium nitride (GaN) technology.
• Engineers can reduce solution size by up to 55% as a result of the IPM’s high integration and its efficiency which removes the need for an external heat sink.

Texas Instruments (TI) (Nasdaq: TXN) today introduced the industry’s first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses many of the design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The DRV7308 GaN IPM enables more than 99% inverter efficiency, optimized acoustic performance, reduced solution size and lower system costs. It is on display at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM) Conference, held June 11-13 in Nuremberg, Germany.

“Designers of high-voltage home appliances and HVAC systems are striving to meet higher energy-efficiency standards to support environmental sustainability goals around the world, said Nicole Navinsky, Motor Drives business unit manager at TI. “They are also addressing consumer demand for systems that are reliable, quiet and compact. With TI’s new GaN IPM, engineers can design motor driver systems that delivers all of these expectations and operates at peak efficiency.”

Improve system efficiency and reliability with TI GaN

Worldwide efficiency standards for appliances and HVAC systems such as SEER, MEPS, Energy Star and Top Runner are becoming increasingly stringent. The DRV7308 helps engineers meet these standards, leveraging GaN technology to deliver more than 99% efficiency and improve thermal performance, with 50% reduced power losses compared to existing solutions.

In addition, the DRV7308 achieves industry-low dead time and low propagation delay, both less than 200ns, enabling higher pulse-width modulation (PWM) switching frequencies that reduce audible noise and system vibration. These advantages plus the higher power efficiency and integrated features of the DRV7308 also reduce motor heating, which can improve reliability and extend the lifetime of the system.

To learn more about the benefits of GaN technology, read the white paper, “How three-phase integrated GaN technology maximizes motor-drive performance.”

Advanced integration and high power density reduce solution size and costs

Supporting the trend of more compact home appliances, the DRV7308 helps engineers develop smaller motor drive systems. Enabled by GaN technology, the new IPM delivers high power density in a 12mm-by-12mm package, making it the industry’s smallest IPM for 150W to 250W motor-drive applications. Because of its high efficiency, the DRV7308 eliminates the need for an external heatsink, resulting in motor drive inverter printed circuit board (PCB) size reduction of up to 55% compared to competing IPM solutions. The integration of a current sense amplifier, protection features and inverter stage further reduces solution size and cost.

To learn about designing more efficient, compact motor systems, see the GaN IPM page on TI.com.

This high-efficiency, high-voltage GaN IPM is the latest example of TI innovations to help solve engineering challenges and transform motor designs.

TI’s reliable high-voltage technology at PCIM 2024

Visitors to PCIM can see new products and solutions from TI that are enabling the transition to a more sustainable future with reliable high-voltage technology in Hall 7, Booth 652. In addition to the DRV7308 GaN IPM, TI highlights at PCIM include:

• Next-generation electric vehicle (EV) propulsion system: TI is demonstrating a new 800V, 750kW SiC-based scalable traction inverter system for EV six-phase motors, in collaboration with EMPEL Systems. The demonstration features high power density and efficiency using TI’s high-performance isolated gate drivers, isolated DC/DC power modules and Arm® Cortex®-R MCUs.
• Speaking session: TI’s manager of high-voltage power systems applications, Sheng-Yang Yu, will speak on June 11 at Markt & Technik panel discussion: “Will SiC ultimately Hold its Own against GaN?”
• Speaking session: TI’s manager of renewable energy systems, Harald Parzhuber, will speak on June 12 at Bodo’s Power Systems panel discussion: “GaN Wide Bandgap Design, the Future of Power.”

For more information about all of TI’s speakers and demonstrations at PCIM, see ti.com/PCIM. 

Available today on TI.com

Pre- production quantities of the DRV7308 three-phase, 650V integrated GaN IPM are available for purchase now on TI.com.

• Pricing starts at US$5.50 in 1,000-unit quantities.
• Available in a 12mm-by-12mm, 60-pin quad flat no-lead (QFN) package.
• The DRV7308EVM evaluation module is also available at US$250.
• Multiple payment, currency and shipping options are available.

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Anritsu Corporation announces that the first NTN NB-IoT RF conformance tests have been validated on the New Radio RF Conformance Test System ME7873NR, powered by Sony Semiconductor Israel (Sony)’s Altair device.

The ME7873NR has acquired Global Certification Forum (GCF) certification for NB-IoT RF conformance testing in the Certification Agreement Group (CAG)#78[*] for the first time in the industry. The conformance tests are defined by 3GPP in TS 36.521-4 corresponding to the core requirements of TS 36.102 and have been submitted by Anritsu to the 3GPP Radio Access Network Working Group 5 (RAN WG5).

“We are pleased to collaborate with Anritsu on this important initiative,” said Levana Asraf Fouks, Sr. Director, System Validation & PM Manager, System Engineering at Sony Semiconductor Israel. “Our combined expertise means that our customers benefit from enhanced capabilities to meet their own evolving needs. By partnering with Anritsu from the early stages, we’re able to work towards a swift certification process for modules and devices. The validation of NTN NB-IoT RF conformance tests is a major step forward for the industry.”

“NTN NB-IoT, which is defined by 3GPP Release 17, is a standard determining the current use of NB-IoT in the NTN and enables new use cases and monetization opportunities for vertical industry segments,” said Keiji Kameda, General Manager of the Mobile Solutions Division at Anritsu Corporation. “We are proud that our collaboration with Sony enables us to help the industry validate new features so they can quickly reach the market and attain certification in GCF/PTCRB to realize new devices that enable new applications.”

Product Outline

The ME7873NR is an automated system for 3GPP TS 38.521/TS 38.533 5G NR RF and RRM tests.

The ME7873NR supports NB-IoT NTNs as specified in 3GPP TS36.521-3 and TS36.521-4, in anticipation of future support for 5G NTNs. Customers can also upgrade from ME7873LA to ME7873NR by simply adding a control PC. Anritsu contributes to a smooth transition from NB-IoT NTN to NR NTN.

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Targets vibration sensing and motion tracking in industrial and robotics applications

The STMicroelectronics ISM330BX 6-axis inertial measurement unit (IMU) combines edge-AI processing, an analog hub for sensor expansion, and ST’s Qvar electric charge variations sensing with product-longevity assurance for energy-efficient industrial sensing and motion tracking applications.

The IMU contains a 3-axis gyroscope and a 3-axis accelerometer with a low-noise architecture and bandwidth up to 2kHz, suitable for vibration sensing in machine-tool condition-monitoring applications. Additional use cases include industrial and domestic robots and automated guided vehicles (AGV), intelligent appliances, and motion trackers.

Also integrating ST’s edge-processing engine that teams a machine-learning core (MLC) with AI algorithms and a finite state machine (FSM), the ISM330BX offloads the host processor and saves system power. The IMU also embeds ST’s Sensor Fusion Low-Power (SFLP) algorithm for 3D orientation tracking, which can enhance energy efficiency in applications like robotics and smart safety helmets. Leveraging adaptive self-configuration (ASC), the sensor can also automatically optimize its settings in real-time for best performance and power.

With its autonomous capabilities, the ISM330BX alleviates data transmission between the IMU and host system, as well as offloads the main processor, ensuring low latency and low power consumption. The integrated analog hub provides more opportunities for energy-efficient system integration by directly connecting external analog sensors to the edge-processing engine for data filtering and AI inference. The many power-saving aspects of the ISM330BX help engineers realize innovative industrial sensors and other battery powered smart devices that can be used also to upgrade existing industrial assets making them smarter and ready for industry 5.0

With ST’s Qvar electric charge variation detector also built-in, the IMU can integrate touch and close-proximity detection, or value-added functionality such as water leak sensing, to boost system integration and energy efficiency.

The launch of the ISM330BX advances MEMS technology for industrial markets and further enriches the MEMS ecosystem by offering developers access to essential hardware such as the STEVAL-MKI245KA adapter board. There are also software resources including MEMS Studio and ready-to-go application examples in GitHub free of charge, presenting a collaborative environment for innovation.

Unveiling the future of industrial motion sensing, the ISM330BX IMU will be at the upcoming Sensor and Test 2024 event. at the launch, an insightful keynote speech will explore the innovative aspects of the ISM330BX to monitor robotic applications and its transformative potential for the future of motion sensing. A highlight of this event will be the dedicated demo session, where attendees can see for themselves the exceptional features of the ISM330BX for anomaly detection applications.

The ISM330BX is included in ST’s 10-year product-longevity program for industrial components and is in production now priced from $4.00 for orders of 1000 pieces.

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Vertiv Xpress Masterclass Roadshow provides training for local data center professionals on the impact of artificial intelligence

Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, concluded the Vertiv Xpress Masterclass Series for Bangalore, providing training on Artificial Intelligence (AI) and critical digital infrastructure to industry professionals. The event is an annual initiative that underlines Vertiv’s commitment to encouraging innovation and knowledge transfer within the industry. The key focus of the event was AI and its impact on data centers and supporting critical digital infrastructure. The event also highlighted the importance of power management and thermal management of critical digital infrastructure.

Over the course of the event, consulting engineers, infrastructure designers, and stakeholders from diverse sectors came together to discuss pressing issues and challenges, with the program providing insights into critical digital infrastructure innovations and advancements that will support AI and high-performance computing (HPC) adoption. The event witnessed over 180+ attendees from industries including data centers, BFSI, manufacturing, healthcare and government personnel, amongst others.

“At Vertiv, we recognize the transformative potential of AI in the data center space. AI is not just an emerging trend but a critical component that is redefining the way data centers operate. The Vertiv Xpress Masterclass Series event in Bangalore with its deep focus on AI underscores our commitment to fostering innovation and equipping our partners and clients with cutting-edge solutions that drive the future of critical digital infrastructure,” said, B Venkat Rao, senior director, enterprise key accounts, Vertiv India.

For more information on Vertiv and its complete portfolio of digital infrastructure and continuity solutions, visit Vertiv.com.

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BigRep, a prominent player in the field of additive manufacturing, has developed two cutting-edge 3D printers designed specifically for industrial applications. The ALTRA 280 and IPSO 105, engineered to deliver speed, reliability, precision, and automation, mark a significant advancement in the realm of high-temperature 3D printing.

The ALTRA 280 and IPSO 105 represent BigRep’s commitment to meeting the evolving needs of industries such as aerospace, defence, and automotive. These printers are equipped to handle a wide range of materials, from standard polymers to high-performance ones, making them versatile solutions for various manufacturing requirements.

Key Features of ALTRA 280

The ALTRA 280 boasts a large-scale printing capability, with dimensions of 500mm x 700mm x 800mm, allowing for the production of intricate and sizable components. Its high-temperature capabilities, reaching up to 450°C, enable the printing of robust parts suitable for challenging industrial applications. The machine is designed for uninterrupted productivity, thanks to its dual extrusion system and backup systems, ensuring reliable performance around the clock.

Key Features of IPSO 105

On the other hand, the IPSO 105 offers a generous toolmaker’s build volume of 400mm x 600mm x 440mm, catering to a wide range of applications from tooling to end-use parts. With high-temperature capabilities of up to 180°C, the IPSO 105 can handle a variety of engineering-grade and high-performance materials, including multi-material parts facilitated by its dual extrusion system. The automated start and production processes enhance reliability and streamline operations.

Industry Impact and Significance

Both the ALTRA 280 and IPSO 105 are seen as game-changers in the field of industrial additive manufacturing. Their ability to accommodate diverse polymers, coupled with all-temperature capabilities, positions them as pivotal solutions for industries requiring high-performance parts. Thomas Janics, from HAGE3D, anticipates a transformative impact on additive manufacturing, particularly in sectors with demanding specifications.

Conclusion

BigRep’s introduction of the ALTRA 280 and IPSO 105 represents a significant leap forward in the realm of high-temperature 3D printing. These printers, engineered with a focus on speed, reliability, precision, and automation, are poised to revolutionize industrial additive manufacturing across sectors such as aerospace, defense, and automotive. With their advanced features and capabilities, they offer manufacturers the tools they need to stay competitive and innovative in today’s rapidly evolving manufacturing landscape.

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The latest EY Economy Watch report highlights several key trends shaping India’s economic transformation, including emerging technologies like generative AI (GenAI), climate challenges, de-globalization, and de-dollarization. These trends present both challenges and opportunities for India as it aims to achieve ‘Viksit’ status by 2047 and navigate its path towards becoming a developed nation.

One of the major potential growth drivers identified in the report is GenAI, which could significantly enhance productivity and output. The report estimates that GenAI has the potential to boost India’s GDP by US$359-438 billion by FY30. However, harnessing the benefits of emerging technologies while ensuring a net positive impact on employment will require strategic policy interventions.

Climate change is another critical factor affecting economic resilience, with increased natural disasters posing significant risks to the economy. The report emphasizes the need for investments in climate-resilient technology and innovation to mitigate these risks.

The ongoing trend of de-globalization and trade disruptions also presents challenges, but India has opportunities to strengthen its position as a trade connector due to its strategic location. Initiatives such as the operation of the Iranian Chahabar port and the development of new trade routes could enhance India’s trade connectivity.

Additionally, India’s lower government indebtedness provides a buffer against external shocks, giving the nation greater fiscal space to implement macro-stabilization efforts during economic downturns. However, responsible fiscal behaviour and careful policymaking will be crucial to avoid potential pitfalls in the growth process.

Overall, the report underscores the importance of strategic policy support and responsible fiscal behaviour in navigating these global trends and leveraging emerging technologies for sustainable economic growth.

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Automotive technology company hofer powertrain of Nürtingen, Baden-Württemberg, Germany has begun a research project in collaboration with the Swiss Federal Institute of Technology in Zurich (ETH Zürich). Supported by funding from INNOSUISSE (the Swiss Agency of Innovation Promotion, which advances science-based innovations in the interest of the economy and society in Switzerland), the core objective of the project is to rapidly develop an advanced multi-level traction inverter integrating gallium nitride (GaN) switches...

With the electric vehicle (EV) market gaining momentum and driven by enthusiastic consumer interest, there’s an urgent need to tackle critical issues related to EV range, reliability, and battery life. Concerns about range limitations, compounded by concerns about limited charging infrastructure and safety issues highlighted in media reports, have hindered the adoption of EVs. In this context, the semiconductor automated test equipment (ATE) sector can play a crucial role in addressing and mitigating these concerns.

The Role of Battery Management Systems (BMS) in EV Evolution

Battery management systems (BMS) are integral to the performance and safety of EV batteries. By performing detailed cell-by-cell monitoring, a BMS can ensure battery longevity, safety, and an extended driving range. Automated test equipment (ATE), such as Teradyne’s ETS-800, is essential for testing the accuracy of these battery monitors.

Core Functions of BMS

1. Monitoring and Managing Performance:

• Ensures balanced charging across individual cells.
• Uses semiconductors for multi-channel monitoring and balancing.
• Manages charge distribution and monitors cell state and overall battery health amid temperature and voltage changes.

2. Assessing Cell Voltage, Current, and Temperature:

• Determines the state of charge (SoC) and health of the battery pack.
• Relays information to a central processing unit for optimal performance management.

Overcoming Range Anxiety

Improving BMS technology can significantly reduce range anxiety among EV drivers by accurately measuring the vehicle’s charge status, thus optimizing battery use and extending the driving range. Enhanced accuracy in monitoring the SoC facilitates more efficient charge and discharge cycles, improving battery life and reducing the need for frequent charging stops.

1. Accurate SoC Measurement:

• Increases usable battery energy.
• Extends driving range significantly.

2. Competitive Advantage:

Combined with advancements in battery technology and vehicle design, manufacturers can offer greater mileage on a single charge.

Li-ion Batteries and BMS: Efficiency and Safety

Accurate monitoring of EV battery cells is crucial for managing range anxiety and ensuring the safety and reliability of Li-ion batteries. These batteries, while offering advantages in energy efficiency, density, and lifespan, require careful energy management to mitigate ignition risks. A sophisticated battery management system (BMS) has the capability to safely oversee charge and discharge cycles, leading to an extension of battery life while also minimizing the risks associated with fires.

Flexible ATE Solutions:

• Support accurate SoC determination amid evolving battery chemistries.
• Ensure safety and reliability.

Navigating the complexities of evolving EV battery technologies presents a fresh set of challenges

As the EV industry expands, it drives innovations in battery voltage and architecture, resulting in enhanced capabilities like extended range and rapid charging. This progression underscores the importance of future-proof test equipment that can accommodate new technologies and validate automotive quality standards.

1. Advancements in Voltage Systems:

• From 400V to 800V systems, requiring rigorous BMS innovation and testing.
• Crafting strategies to alleviate consumer worries regarding range anxiety and battery longevity is crucial in the EV industry’s evolution.

2. Advanced Instrumentation:

Companies in the semiconductor ATE sector, such as Teradyne, are addressing this demand by introducing solutions like the ETS-800 platform, specifically engineered for precise and high-voltage BMS testing.

Teradyne’s ETS-800 Platform

The ETS-800 platform from Teradyne represents a cutting-edge automotive test platform designed for high throughput and rapid time to market. Its precision instrumentation and assured specifications ensure stable and repeatable results across testers and devices. The multi-sector architecture of the ETS-800 seamlessly scales from single or low-site-count program development applications to high-site-count programs with minimal effort, facilitating automatic achievement of high parallel test efficiency.

 

In conclusion, the role of BMS in alleviating EV buyer anxiety cannot be overstated. As the EV market continues to grow, the semiconductor ATE sector’s contributions to BMS testing will be crucial in ensuring the safety, reliability, and extended range of EV batteries, ultimately driving broader adoption and acceptance of electric vehicles.

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CVD-based synthetic diamond materials firm Element Six of Oxford, UK (E6, part of the De Beers Group) and Tokyo-based Orbray Co Ltd (which makes precision jewel parts, DC coreless motors, fiber-optic components, and medical devices) have announced a strategic collaboration to deliver high-quality wafer-scale single-crystal (SC) synthetic diamond...

SICK’s latest innovation, the Inspector83x, integrates AI-powered quality control seamlessly into high-speed production environments. It empowers non-specialists to configure precise AI inspections quickly and effectively, thanks to its intuitive design and pre-installed SICK Nova foundation software. Advanced users can further customize inspections using Lua programming and HALCON, ensuring adaptability to diverse production needs.

The Inspector83x boasts up to 5MP resolution, built-in illumination, and a quad-core CPU for high-speed data processing directly on the device. Its capabilities include defect detection, anomaly detection, classification, OCR/OCV reading, and complex assembly verification. Additionally, upcoming features such as colour imaging will enhance applications like colour sorting and quality assurance.

One of its standout features is the ability to simplify complex machine vision tasks for non-specialists. With minimal training examples and the AI function combined with rule-based tools, operators can configure inspections effortlessly. This eliminates the need for extensive machine vision expertise or external consultants when adapting to product changes or new designs.

The Inspector83x also excels in data transfer efficiency, with dual ports for EtherNet/IP or PROFINET integration and a high-speed Gigabit Ethernet port for image data transfer and data logging. Its onboard inputs and outputs, along with precise image output calibration, enable seamless integration with machine controls for quick response and accurate results.

Overall, the SICK Inspector83x redefines AI machine vision by offering simplicity, power, and reliability, making it a valuable asset in various industries such as consumer goods manufacturing, food and beverage, automotive, and packaging.

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Pico Technology Ltd., a leader in PC-based test & measurement products, is proud to announce the expansion of its acclaimed PicoScope 3000 series with the introduction of the World’s first USB-powered 5 GS/s oscilloscopes. Two models, with 350 MHz and 500 MHz bandwidth respectively, have 5 GS/s sampling rate and 10 bits resolution (up to 14 bits with Enhanced Resolution). They set the standard for next-generation waveform measurement and analysis with power, performance and portability in the field of test and measurement equipment.

The latest additions to the PicoScope 3000 series combine cutting-edge technology with user-friendly design to meet the diverse needs of engineers, technicians and researchers worldwide. Key features of the new models include:

• 500 MHz bandwidth, 5 GS/s sampling rate and 10 bits resolution
• 2 GS Ultra-deep capture memory: Enables capture of long-duration signals at maximum sampling rate and is complemented with the PicoScope DeepMeasure tool that delivers automatic measurements of waveform parameters on up to a million waveform cycles with each triggered acquisition.
• 200 MS/s 14-bit AWG / Function generator: Offers real-world waveform generation capabilities for a wide range of applications, eliminating the need for additional external equipment.
• USB 3.0 Type-C connected and powered: Ensures high-speed data transfer and compatibility with the latest generation of PCs, simplifying connectivity and setup. An adaptor for earlier USB port types is provided.
• PicoScope 7 User Interface for Windows, Mac & Linux with free updates: Offers a modern, intuitive interface that enhances productivity and workflow efficiency across multiple operating systems.
• 38 Serial Decoders Included as standard: Facilitates the analysis of serial bus communications, simplifying debugging and troubleshooting processes.
• Segmented Memory, Persistence and Fast waveform updates: Enhances waveform visualization and analysis capabilities, enabling users to extract valuable insights efficiently.
• Advanced Maths, Measurements, Masks and Digital Triggering: Empowers users with advanced analysis tools for in-depth waveform characterization and interpretation.
• Customizable Actions that users can set up to automatically perform in response to events in long-duration unattended soak tests.
• SDK (Software Development Kit) that allows users to write bespoke applications with the provided drivers for Windows, macOS and Linux.

Trevor Smith, T&M Product Manager at Pico Technology, expressed his excitement: “With the introduction of our two new PicoScope 3000E series oscilloscopes, we’re redefining the boundaries of mainstream electronic test and waveform analysis. These instruments enable innovation, precision and limitless possibilities, one waveform at a time.”

Availability

The new PicoScope 3000 series oscilloscopes with 350 MHz and 500 MHz bandwidth options are now available for purchase through authorized PicoScope distributors worldwide and on picotech.com. For more information about pricing, specifications and availability, please visit picotech.com or contact your local distributor.

For further information please, visit https://www.picotech.com/oscilloscope/picoscope-3000e-series-500-mhz-5gs-digital-usb-oscilloscope

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Crystal IS Inc of Green Island, NY, USA — a subsidiary of Tokyo-based Asahi Kasei that makes proprietary ultraviolet light-emitting diodes (UVC LEDs) — has announced serial production of 100mm-diameter single-crystal aluminium nitride (AlN) substrates with 99% usable area, based on current requirements for UVC LEDs, with manufacturing to take place in the USA. The ultra-wide bandgap and high thermal conductivity of AlN help to improve device reliability and performance in UVC LEDs and other next-generation RF and power devices...

Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has launched what it claims is the industry's first 4mΩ silicon carbide (SiC) junction field-effect transistor (JFET) in a TOLL package, designed for circuit protection applications including solid-state circuit breakers, where low resistance, superior thermal performance, small size and reliability are paramount...

Infineon Technologies AG is expanding its portfolio of next-generation OptiMOS 7 MOSFETs for automotive applications: the portfolio of 40 V products now includes additional devices in robust, lead-free packages. In addition, 80 V and 100 V OptiMOS 7 MOSFETs are now also available. The MOSFETs are optimized for all standard and future automotive 48 V applications, including electric power steering, braking systems, power switches in new zone architectures, battery management, e-fuse boxes, DC/DC, and BLDC drives in various 12 V and 48 V electrical system applications. They are also suitable for other transportation applications such as light electric vehicles (LEV), e2wheelers, eScooters, eMotorcycles, and commercial and agricultural vehicles (CAV).

“As a technology leader in power semiconductors, Infineon is committed to shape the future technology standards in automotive power MOSFETs in terms of power efficiency, innovative and robust power packaging with high quality,” said Axel Hahn, Senior Vice President and General Manager Automotive LV MOSFETs of Infineon. “We are providing our customers a diverse product portfolio and are addressing all their requirements to drive the development of modern automotive applications.”

By combining 300 mm thin-wafer technology and innovative packaging, the new OptiMOS 7 technology enables significant performance advantages in all available voltage classes. As a result, the components are now available in various rugged automotive power packages, including Single SSO8 (5×6), Dual SSO8 (5×6), mTOLG (8×8) and sTOLL (7×8). The family offers high power density and energy efficiency with the industry’s lowest on-state resistance (e.g. 1.3 mΩ max in a single SSO8 (5×6) 80V package) in the smallest form factor. The devices also offer reduced switching losses, improved Safe Operating Area (SOA) robustness and high avalanche current capability. With this, they enable a highly efficient system design for tomorrow’s automotive applications.

Availability

The OptiMOS 7 products are now available in the following different robust automotive power packages in 40 V, 80 V and 100 V: Dual SSO8 (5×6), Single SSO8 (5×6), mTOLG (8×8), and sTOLL (7×8). Further information is available at www.infineon.com/OptiMOS7.

Infineon at the PCIM Europe 2024

PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2024 show highlights is available at www.infineon.com/pcim.

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Dallas-based Texas Instruments (TI) has introduced what it claims is the first 650V three-phase gallium nitride (GaN) intelligent power module (IPM) for 250W motor drive applications, on display at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM) conference in Nuremberg, Germany (11–13 June)...