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Microchip’s PIC16F13145 MCUs enable the creation of hardware-based, custom combinational logic functions directly within the MCU. The integration of a configurable logic block (CLB) module in the microcontroller allows designers to optimize the speed and response time of embedded control systems.  It also helps eliminate the need for external logic components.

CLB operation is not dependent on CPU clock speed. The CLB module can be used to make logical decisions while the CPU is in sleep mode, reducing both power consumption and software reliance. According to Microchip, the CLB is easily configured using the GUI-based tool offered as part of MPLAB Code Configurator.

The PIC16F13145 family of CLB-enabled MCUs is intended for applications that use custom protocols, task sequencing, or I/O control to manage real-time control systems in industrial and automotive sectors. Devices include a 10-bit ADC with built-in computation, an 8-bit DAC, and comparators with a 50-ns response time.

Prices for the PIC16F131xx microcontrollers start at $0.47 each in lots of 10,000 units.

PIC16F13145 product page

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Alpha & Omega’s AONA66916 100-V N-channel MOSFET comes in a DFN 5×6-mm designed to afford top and bottom side cooling. In addition to improved thermal performance, the device offers low on-resistance of 3.4 mΩ at 10 VGS and a wide safe operating area, making it well-suited for telecom, solar and DC/DC applications.

When using a standard DFN 5×6-mm package, heat dissipation is primarily through the bottom contact, transferring most of the power MOSFET’s heat to the PCB. Alpha & Omega’s latest DFN package enhances heat transfer by maximizing the surface contact area between the exposed top contact and the heat sink.

The AONA66916 MOSFET provides low thermal resistance, with top-side RthJC of 0.5°C/W maximum and bottom-side RthJC of 0.55°C/W maximum. The top-exposed DFN 5×6-mm package of the AONA66916 shares the same footprint of the company’s standard DFN 5×6-mm package, eliminating the need to modify existing PCB layouts.

The AONA66916 MOSFET costs $1.85 each in lots of 1000 units. It is available now in production quantities, with a lead time of 14 to16 weeks.

AONA66916 datasheet

Alpha & Omega Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA and SHINRY of Shenzhen, China (a tier-1 supplier of on-board power supplies to auto-makers such as Honda, Hyundai, BYD, Geely, XPENG, and BAIC) have opened a joint R&D power laboratory to accelerate the development of new-energy vehicle (NEV) power systems enabled by Navitas’ GaNFast technology...

Infineon Technologies AG of Munich, Germany has announced a partnership in which it will provide its 1200V CoolSiC MOSFET power semiconductor devices — in combination with EiceDRIVER compact 1200V single-channel isolated gate drive ICs — to Sinexcel Electric Co Ltd of Shenzhen, China (a provider of core power equipment and solutions for the energy Internet) to further improve the efficiency of energy storage systems...

Packaging innovation has always been critical to the cooling of components, especially for power-switching devices such as MOSFETs and IGBTs. The non-stop demand to make these devices smaller and lighter also applies to RF PA modules, even though the inner workings of these analog modules are very different than those of on/off switching of power devices. This need for “make it less, but also do more” is especially intensified due to the multichannel requirements of massive MIMO 5G systems.

Nonetheless, when it comes to packaging details, the primary concern of designers is “What does it do for me?” more than “How did you do it?” Yet the “how” part is important, as it defines the capabilities if newer parts and sets the groundwork for future innovations which build on it.

A good example is the top-side cooling (TSC) for RF power amplifier (PA) modules introduced by NXP Semiconductors in 2023. This advance was not “hey, we’ve got a new package in the works” but it was coupled with deliverable parts—always a big plus a world where pre-release hype and promotion are considered normal (thankfully, not so much in the no-nonsense “analog” world from DC to RF).

NXP’s packaging results in an RF PA module which is thinner and lighter than existing designs, with a better thermal path as well. This top-side cooling contrasts with conventional bottom-side cooling (BSC), where the thermally conductive paths transfer heat from the package components—primarily the PA itself—to the PCB, which is thermally bonded to a cold plate or heat sink. While TSC is not unique to NXP (other vendors have somewhat different implementations), the NXP approach is illustrative, Figure 1.

Figure 1 Compared to the bottom-side cooling approach (left), NXP’s top-side cooling (right) flips the placement of the thermal coin as well as active and passive components, for a thinner and more thermally conductive package. Source: NXP

In a usual BSC approach, the dissipation of the PA is conducted through a metallic “coin” in the PCB and then to a heat sink on the underside of the board. The associated module components, including the PA, circulator, and filter, are mounted on the top side of the board, and all are covered by an RF electromagnetic (EM) shield. To complete the signal path, the antenna array is connected to the board.

In contrast, with TSC, the PA chip is connected to a direct-bonded copper-ceramic substate on the top side of the package. The chip is mounted on the surface of the board, thus making direct contact with the external heat sink. The benefit of this arrangement is that it maximizes dissipation and thermal performance, while yielding a smaller package which increases functional density.

Specifically, in the TSC arrangement, the coin is connected instead to the other side of the board and directly to the heat sink, while the circulator and dielectric filter are also mounted there. As a result, all the RF components are on one side of the PCB. At the same time, the shield is integrated into the heat sink rather than on top side of the PCB, which puts the antenna closer to the board with a clean separation of thermal and RF paths. The overall design shortens the connectors, improving RF performance while reducing thickness and weight of the overall assembly.

In contrast, bottom-side cooling is a compromise between thermal performance and use of the board’s real estate since module components can be placed on one side only. The result is lower functional density of the board while it is being challenged to support multiple RF channels.

TSC is not just a preliminary investigation or available as sampling prototypes. Off-the-shelf RF power modules such as the A5M35TG140-TC are available for 32T32R-class, 200-W 5G radios covering 3.3 GHz to 3.8 GHz. The devices combine LDMOS and GaN semiconductor technologies to create 10.5 W (average) fully integrated Doherty PAs to with ~30 dB gain and 46 percent efficiency along with 400 MHz of instantaneous bandwidth—all in a package measuring just 14mm × 10mm × 2 mm thick, Figure 2.

Figure 2 The A5M35TG140-TC is one of three similar multi-GHz PA modules, each with a simple schematic which does not begin to indicate their sophisticated underlying processes or advanced package implementation. Source: NXP

There are also evaluation boards which ease the design task of assessing the PA module performance and characteristics without having to “reinvent the wheel” of a relatively simple-looking schematic and layout which inevitably has its RF subtleties, Figure 3.

Figure 3 Vendor-supplied evaluation boards are essential to speeding up the assessment and design-in process. Source: NXP

All these substantive improvements in packaging still leaves one evasive cooling question: where is this mythical, wonderful place called “away” to which all the dissipated heat is being conveyed? By doing a better job of getting heat away from the package, in addition to shrinking the package itself, are you making your previous thermal problem into someone else’s headache, as they now must contend with heat you toss off? Or would you have had that total amount of heat anyway, but with a different distribution across the PCB and within the chassis? Have you seen any other power-package developments for non-switching devices with which you were impressed?

Bill Schweber is an EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features.

Related Content

• Stop blaming the supply for your dissipation woes
• Call on mechanical engineers to solve your tough thermal problems
• No place to hide from PCB thermal and RF considerations
• Oven Performance Shows Flip Side of Thermal Management

References (all from NXP)

• 5G Radios Shrink With NXP’s New Top-Side Cooling For RF Power
• Fact sheet: Top-Side Cooling RF Power Modules for 5G Infrastructure
• A5M36TG140-TC Top-Side Cooling Evaluation Board

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This is a machine I designed to laser etch pcb’s. I’ve made it so it can do double sided and be easy to align everything when mounting the blanks on the machine. the parts cost of 120 euros, maybe it’s worth making a kit of. I put a few pictures of the results that came from my previous design. I will upload the results of this machine after my uni exams. submitted by /u/Mediocre-Advisor-728 [link] [comments]

Avalanche photodiode (APD) infrared sensor designer and manufacturer Phlux Technology (which was spun out of the UK’s Sheffield University, with a seed funding round of £4m led by Octopus Ventures in December 2022) has announced its first products, the Aura family of 1550nm infrared (IR) devices based on the firm’s Noiseless InGaAs APD technology. The sensors are claimed to be 12x more sensitive than traditional best-in-class indium gallium arsenide (InGaAs) APDs. As a result, the operating range of LiDAR, laser range-finders, and optical fiber test equipment can be extended by up to 50% with Phlux sensors, which are drop-in replacements for existing surface-mount or TO-packaged components...

New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

To address the expanding need for increasing levels of customization in embedded applications, Microchip Technology is offering a tailored hardware solution with the launch of its PIC16F13145 family of microcontrollers (MCUs). Outfitted with a new Core Independent Peripheral (CIP)—the Configurable Logic Block (CLB) module—the MCUs enable the creation of hardware-based, custom combinational logic functions directly within the MCU. Because of its integration into the MCU, th allows designers to optimize the speed and response time of embedded control systems, eliminating the need for external logic components and reducing Bill of Materials (BOM) cost and power consumption. The process is further simplified by a graphical interface tool, which helps synthesize custom logic designs using the CLB. The PIC16F13145 family is designed for applications utilizing custom protocols, task sequencing or I/O control to manage real-time control systems in the industrial and automotive sectors.

“The Configurable Logic Cell (CLC) Module has been integrated into Microchip MCUs for more than a decade and the new CLB module is the next step in the evolution of our customizable logic offering, enabling this family of MCUs to be utilized in applications that are typically the domain of standalone programmable logic devices,” said Greg Robinson, vice president of Microchip’s 8-bit microcontroller business unit. “Few single-chip solutions in today’s market address embedded engineers’ design challenges like the PIC16F131 MCU family. The new MCUs handle custom logic functions, minimize power consumption, simplify designs and can accommodate changing design requirements.”

Since the CLB’s operation is not dependent on the CPU clock speed, it improves the system’s latency and provides a low-power solution. The CLB can be used to make logical decisions while the CPU is in sleep mode, further reducing power consumption and software reliance. The PIC16F13145 MCUs also include a fast 10-bit Analog-to-Digital Converter (ADC) with built-in computation, an 8-bit Digital-to-Analog (DAC) converter, fast comparators, 8- and 16-bit timers and serial communication modules (I2C and SPI) to allow many system-level tasks to be performed without the CPU. The family will be available in various packages from 8 pins up to 20 pins.

Development Tools

The PIC16F13145 family of MCUs is supported by the MPLAB® Code Configurator (MCC), a free software plug-in within MPLAB X IDE which provides an easy GUI-based interface to configure the device and on-board peripherals, including the CLB. This interface reduces development time as the desired custom logic can be designed schematically with options for an advanced user to utilize Hardware Description Language (HDL). The new synthesizer is available in two options: integrated into MCC and online at logic.microchip.com. The PIC16F131 Curiosity Nano Evaluation Kit offers complete support for designing with the PIC16F131 family and these features coordinate for a seamless embedded development experience and reduced time to market.

Pricing and Availability

PIC16F131 MCUs are available starting at $0.47 each in 10,000-unit quantities. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: https://www.flickr.com/photos/microchiptechnology/53451201638/sizes/l/
• Block diagram: https://www.flickr.com/photos/microchiptechnology/53450157287/sizes/o/
• Tool photo: https://www.flickr.com/photos/microchiptechnology/53451411614/sizes/l/

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In the ever-evolving landscape of automotive technology, the latest research from Counterpoint’s Global Connected Car Sales Tracker unveils a significant surge in global connected car sales during Q3 2023. With the rise of electric vehicles and autonomous driving, connectivity penetration within vehicles is on the rise.

According to the report, global connected car sales experienced a remarkable 28% year-over-year growth in Q3 2023. Notably, two out of every three cars sold during this period were equipped with embedded connectivity features. Leading the charge, China claimed a substantial 33% share in global connected car sales, followed closely by the United States and Europe. Together, these top three regions accounted for over 75% of global connected car sales in Q3.

Senior Analyst Soumen Mandal shed light on the market dynamics, highlighting Germany’s leading share of connected cars in its passenger car sales, attributed to governmental initiatives like eCall mandates. Following Germany, the United States, France, and the United Kingdom emerged as key players with significant shares of connected cars in their respective markets.

Despite the dominance of 4G connectivity, accounting for over 95% of sales, the adoption of 5G technology is slower than previously projected. Mandal identified reasons such as inadequate 5G infrastructure along highways, limited unique use cases within vehicles, and supply chain challenges hindering the faster adoption of 5G in passenger cars.

Looking ahead, Vice President of Research Neil Shah predicts a continued rise in connectivity preference, even in developing economies, where it is becoming a pivotal market differentiator. Shah forecasts that by 2030, more than 95% of all new passenger cars will feature embedded connectivity, with 4G remaining dominant while 5G gradually gains traction, particularly with the introduction of more advanced autonomous driving systems.

Neil Shah anticipates an inflexion point around 2026 for widespread adoption of 5G in automotive applications, projecting that by 2030, over 90% of connected cars sold will boast embedded 5G connectivity, marking a transformative shift in the automotive industry’s technological landscape.

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In today’s fast-paced world, navigating from point A to point B has become remarkably simple, thanks to GPS devices. These nifty gadgets have revolutionized the way we travel, offering accuracy, convenience, and a plethora of applications. Let’s delve into what GPS devices are, how they work, their applications, and what the future holds for these indispensable tools.

What is a GPS Device?

GPS, or Global Positioning System, is a network of satellites orbiting the Earth, continuously transmitting signals to ground receivers. A GPS device, often found in smartphones, car navigation systems, smartwatches, and standalone units, utilizes these signals to determine its precise location anywhere on the planet.

How Does a GPS Device Work?

At its core, a GPS device relies on a process called trilateration. This involves calculating the distance between the device and multiple satellites in orbit. The device can pinpoint its exact latitude, longitude, and altitude by receiving at least four satellites simultaneously. This information is then overlaid onto digital maps to provide real-time navigation guidance.

GPS Device Applications

The applications of GPS devices are diverse and far-reaching:

1. Navigation: Whether you’re driving through unfamiliar streets or hiking in the wilderness, GPS devices provide turn-by-turn directions to your destination, ensuring you reach your desired location with ease.
2. Fleet Management: GPS tracking systems are extensively used by businesses to monitor their vehicles’ whereabouts, optimize routes, and improve overall fleet efficiency.
3. Fitness and Health: Smartwatches and fitness trackers equipped with GPS capabilities enable users to track their outdoor activities, such as running, cycling, and hiking, by accurately measuring distance, speed, and elevation.
4. Emergency Response: GPS devices play a crucial role in emergencies, allowing authorities to locate individuals in distress accurately. This is particularly valuable in search and rescue operations and for ensuring swift medical assistance during emergencies.
5. Geocaching: GPS devices have popularized the recreational activity of geocaching, where participants use GPS coordinates to locate hidden containers, or “caches,” in various outdoor locations worldwide.

Future of GPS Devices

The future of GPS devices looks promising, with ongoing advancements aimed at enhancing accuracy, efficiency, and functionality:

1. Improved Accuracy: Future iterations of GPS technology are expected to offer even greater accuracy, with the potential for centimetre-level precision. This will open up new possibilities in agriculture, surveying, and autonomous vehicle navigation.
2. Integration with Emerging Technologies: GPS devices will likely be integrated with other emerging technologies, such as augmented reality (AR) and artificial intelligence (AI), to provide more immersive and personalized navigation experiences.
3. Expanded Applications: As GPS technology continues to evolve, we can anticipate an expansion of its applications beyond traditional navigation. This could include enhanced location-based services, personalized recommendations based on geographical data, and innovative solutions in urban planning and environmental conservation.
4. Miniaturization and Connectivity: GPS devices are expected to become increasingly compact and power-efficient, making them more accessible and ubiquitous across various devices and industries. Additionally, advancements in connectivity, such as 5G networks, will facilitate seamless communication between GPS devices and other IoT (Internet of Things) devices.

In conclusion, GPS devices have fundamentally transformed how we navigate and interact with the world around us. From providing accurate directions to enabling innovative applications across diverse sectors, these devices have become indispensable in our daily lives. With ongoing technological advancements, the future of GPS devices holds immense potential for further innovation and enhancement, promising to redefine our relationship with spatial awareness and navigation.

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Infineon Technologies AG announced its joint Innovation Application Center in Shenzhen with Anker Innovations, a global leader in charging technology. With the center already fully operating, it is paving the way for more energy-efficient and CO2-saving charging solutions that support decarbonization.

Driven by the growing consumer demand for faster charging solutions due to an increasing usage of mobile devices, laptops and other battery-powered devices, the idea of establishing an Anker-Infineon Innovation Application Center dated back to 2021. After two years of preparation, the joint lab now serves as R&D hub for industry experts to develop power-delivery (PD) fast charging solutions with higher power density, mainly based on Infineon’s next-generation Hybrid Flyback (HFB) controller product family and the CoolGaN IPS for fast chargers above 100W.

Anker has already brought several successful products to the market, such as the industry-leading 100W+ fast charger device powered by Infineon’s CoolGaN in 2022. With the Innovation Application Center Anker and Infineon will even shorten the application cycle and accelerate the time to market for future products.

“Anker is an important customer for Infineon,” said Christian Burrer, Vice President of Systems & Application Marketing of Power & Sensor Systems Division at Infineon Technologies. “We have already started a strong cooperation in the charging field, with product and system solutions covering several Infineon product lines. In the field of PD charging, we provide our customers a comprehensive product portfolio, including state-of-the-art power controllers, first-class switching power supplies, leading silicon MOSFET and GaN transistor performance, and more.”

Beyond charging solutions, the joint lab is focusing on a more diversified range of consumer applications, driven by Infineon’s expertise in wide-bandgap materials such as gallium nitride (GaN). The acquisition of GaN Systems in 2023 has significantly accelerated Infineon’s GaN roadmap and further strengthens its leadership in power systems through mastery of all relevant power semiconductor technologies.

“In 2023, Anker achieved success in many markets such as China and Europe. This would not have been possible without Infineon’s GaN technology solutions and the strong collaboration between our companies. We look forward to even intensifying our partnership with Infineon”, said by Kang Xiong, General Manager of the charging business unit at Anker Technologies.

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Always at the forefront of technological innovation, Rohde & Schwarz is shaping the future of the mobile industry with its comprehensive range of test and measurement solutions. The company will showcase at MWC Barcelona 2024 under the motto “Enabling Connections, Empowering Innovations” a wide-ranging portfolio that helps industry leaders, manufacturers and visionaries turn their ideas for new mobile products, applications and technologies into reality.

The mobile industry will once again gather in Barcelona for the Mobile World Congress from February 26 to 29, 2024. At the Fira Gran Via in hall 5, booth 5A80, Rohde & Schwarz will be showcasing a variety of innovations covering four areas that correspond to the event’s main themes: 5G and beyond focuses on a variety of solutions driving the evolution of 5G and the emergence of 6G; Connected everything features solutions for the seamless integration of connected ecosystems; Private networks covers performance and quality assurance for business and mission-critical communications; and Game changers allows visitors to take an early leap into tomorrow’s augmented reality applications.

5G and beyond

A large part of the Rohde & Schwarz booth will be dedicated to solutions that enable the mobile ecosystem and empower next-generation connectivity. Visitors will experience the transition from 5G to 5G Advanced through several demonstration of the R&S CMX500 one-box 5G signaling tester (OBT) and other state-of-the-art radio communication testers covering the latest technology enhancements:

• Rohde & Schwarz is pushing the limits of seamless global coverage over land, sea and air with its test solutions for non-terrestrial networks. NTN-NR directly links smartphones and other 5G devices with satellite-based services. In a demo setup, the R&S CMX500 mobile radio tester will simulate a wide range of network conditions to ensure NTN-NR devices perform flawlessly anywhere in the world.
• Paving the way for the 5G NR FR3 frequency band, which will provide wider bandwidth to tomorrow’s mobile networks, the R&S CMX500 and R&S CMP200 radio communication testers are ready for R&D and production tests. At MWC, visitors will see signaling and non-signaling measurements, supporting the respective frequency range from 4 to 20 GHz.
• Another highlight at the show booth are FR1 RF and RRM measurements with the smallest footprint in the market. Rohde & Schwarz has enhanced the R&S CMX500 to provide 3GPP conformance tests for radio resource management and RF inband in a single box.
• The integration of untrusted non-3GPP networks such as public hotspots and home or corporate WLAN with the 5G core network is a crucial aspect of the 5G evolution. Therefore, Rohde & Schwarz has added Wi-Fi 7 capabilities to the R&S CMX500 multi-technology multi-channel signaling tester. 5G WLAN offloading capabilities are included, as well, with the test platform acting as an N3IWF gateway. With this, also Voice over Wi-Fi (VoWiFi) can be tested all in a single box. In addition, the R&S CMP180 radio communication tester will verify a WLAN waveform with 480 MHz bandwidth in loop-back mode, a potential waveform candidate discussed in regards to a not-yet defined Wi-Fi 8 (IEEE 802.11bn) standard, attesting that the instrument is future-proof for users in both, R&D and production.

Other demonstrations around 5G at the Rohde & Schwarz booth will address 5G Broadcast, where Rohde & Schwarz has been leading the industry and proving the technological maturity through real-world demonstrations and practical solutions worldwide. At MWC, the company will demonstrate how broadcasters, network operators and content providers can leverage 5G Broadcast for new business opportunities, building on the technology’s high quality of end-user experience and excellent spectrum efficiency.

When it comes to emerging O-RAN technologies for network infrastructure, Rohde & Schwarz offers a proven, automated test solution together with VIAVI Solutions that helps to improve network efficiency and achieve energy savings. Radio units of an Open RAN based network (O-RU) contribute greatly to the total power consumption. VIAVI’s TM500 O-RU Tester offers energy efficiency focused O-DU emulation test scripts. The O-RU activity versus power consumption is monitored using the R&S RTO oscilloscope. The R&S NGP power supply units power the O-RU and monitor voltage and current statistics over time. The central O-RU Test Manager application from VIAVI controls the full set-up.

To ensure optimum quality of service (QoS) and quality of experience (QoE) in public and private 5G mobile networks, Rohde & Schwarz will showcase its tailored solution portfolio. Mobile network testing experts will present a broad range of live product demos, test scenarios and an ETSI harmonized methodology for systematic network performance improvements. The solutions empower customers worldwide to verify and ensure optimum performance for human and machine end-users along the entire network lifecycle of public as well as business and mission critical mobile networks.

Looking beyond 5G and onward to 6G, Rohde & Schwarz will exhibit a number of concise test solutions in Barcelona to enable applied research for example in the Terahertz regime in the D-Band (110 to 170 GHz). Part of these demonstrations will be the new R&S SFI100A wideband IF vector signal generator. The compact, user-friendly instrument for demanding applications features a very wide RF modulation bandwidth of up to 10 GHz and generates fully calibrated IF signals. Also, in collaboration with NVIDIA, Rohde & Schwarz advanced its hardware-in-the-loop test bed for a neural receiver and added custom modulation capabilities. This innovative demonstration extends the idea of an AI-native air interface concept for 6G, which both companies already introduced during last year’s MWC event. It now encompasses both the receiver and the transmitter side, marking a significant leap in exploring AI’s potential in future wireless communications.

Connected everything

Rohde & Schwarz empowers a securely connected world across different facets of life, from devices like wearables or industrial equipment communicating with each other to connected cars to the most critical data transfers. Rohde & Schwarz brings its state-of-the-art radio communication testers to MWC showcasing applications which enable integrated internet of things (IoT) networks:

• While NTN-NR is still in the making, NTN NB-IoT technology is already bringing wireless connectivity to remote areas that do not have access to terrestrial networks for use cases like SOS messaging or remote monitoring. The R&S CMW500 covers testing needs from R&D to conformance and operator testing for NB-IoT NTN, not only supporting protocol, RRM and RF conformance testing in line with 3GPP, but also the Skylo test plan – all in a single box.
• 3GPP Rel.17 introduced 5G RedCap (reduced capability), enabling a new set of IoT devices. 5G RedCap modems are less complex, use less spectrum bandwidth, consume less power and work only in standalone (SA) mode. The R&S CMX500 OBT lite is prepared to address all testing aspects of such devices, including power consumption testing, a very important KPI for chipsets manufacturers and OEMs.

MWC visitors involved in the automotive industry will be able to explore solutions addressing automotive connectivity at the Rohde & Schwarz booth. The company’s T&M solutions enable advancements in the connected car, where new technologies will enhance the driving experience, safety and autonomous driving capabilities. One solution on display covers 5G NG eCall testing featuring the R&S CMX500 OBT 5G signaling tester along with the R&S SMBV100B GNSS satellite simulator. Another demo features the R&S CMP180 radio communication tester with the newly added 5G V2X testing in addition to existing LTE based C-V2X. Now all V2X technologies are supported (LTE, NR, 11p).

Accurate ranging, low power consumption, high security and reliability are features of ultra-wideband (UWB) technology that make it suitable for many automotive applications, especially as digital key. At MWC, Rohde & Schwarz will present the R&S CMP200 radio communication tester with integrated UWB test capabilities to solve UWB test challenges in mass production as well as in R&D.

The Rohde & Schwarz Networks and Cybersecurity division provides endpoint security, secure networks, and high-quality cryptography to ensure reliable data transfer and system integrity in the public sector, for critical infrastructure (KRITIS), retail, health and other areas. IT teams from these sectors rely on the Rohde & Schwarz solutions in planning, deploying, operating, and optimizing their network and cybersecurity challenges. Visitors at MWC can learn about modern and secure SD-WAN, network encryption, and secure smartphone communication.

Private networks

5G private or campus networks provide high performance that can increase productivity and efficiency for new use cases across all industries, including manufacturing and warehousing, or critical infrastructure such as energy utilities, mining and ports. However, optimal performance and error-free operation are essential to realize the expected business benefits and ensure the reliability of critical infrastructure. This is achieved by passive and active testing of the network in all phases: spectrum clearance and interference hunting in preparation for rollout, performance tuning and acceptance, regular verification and service level monitoring for predictive maintenance and troubleshooting.

At MWC, Rohde & Schwarz will present its comprehensive mobile network testing portfolio covering all these phases, including a live demonstration of deterministic low-latency data communication in private 5G networks in cooperation with the Fraunhofer Institute for Production Technology IPT. Demonstrations will also include a mission-critical network (MCX) test solution that enables successful migration to broadband MCX services for mission-critical public safety communications. Tailored solutions for regulatory authorities to protect the electromagnetic spectrum through interference hunting and spectrum monitoring will also be demonstrated.

Game changers

Last but not least, Rohde & Schwarz will bring game-changing technologies to MWC 2024. At the booth, visitors will experience an exciting showcase of extended reality (XR) applications, key driver of 5G and 6G and foundation of the immersive Metaverse of tomorrow. The R&S CMX500 OBT 5G signaling tester performs end-to-end testing of avatar calls using 5G, ensuring the quality of experience (QoE) for the subscriber, pushing the boundaries of communications technology.

A display of next-generation Deep Packet Inspection (DPI) with Encrypted Traffic Intelligence by ipoque, a Rohde & Schwarz company, will demonstrate how to power networking and cybersecurity solutions with advanced OEM network analytics technology. The leading DPI engines R&S®PACE 2 and R&S®vPACE detect and classify applications, protocols and services for enhanced connectivity and security, even amidst encrypted and anonymized traffic.

Rohde & Schwarz will showcase its comprehensive portfolio of test and measurement solutions for the mobile industry at the Mobile World Congress 2024 at Fira Gran Via in Barcelona in hall 5, booth 5A80. For further information, visit:
www.rohde-schwarz.com/mwc

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• Q4 net revenues $4.28 billion; gross margin 45.5%; operating margin 23.9%; net income $1.08 billion
• FY net revenues $17.29 billion; gross margin 47.9%; operating margin 26.7%; net income $4.21 billion
• Business outlook at mid-point: Q1 net revenues of $3.6 billion and gross margin of 42.3%

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the fourth quarter ended December 31, 2023. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported fourth-quarter net revenues of $4.28 billion, gross margin of 45.5%, operating margin of 23.9%, and net income of $1.08 billion or $1.14 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “FY23 revenues increased 7.2% to $17.29 billion. Operating margin was 26.7% compared to 27.5% in FY22 and net income increased 6.3% to $4.21 billion. We invested $4.11 billion in net CAPEX while delivering a free cash flow of $1.77 billion.”
• “In Q4, ST delivered revenues and gross margin slightly below the mid-point of the guidance, with higher revenues in Personal Electronics offset by a softer growth rate in Automotive.”
• “In Q4, our customer order bookings decreased compared to Q3. We continued to see stable end-demand in Automotive, no significant increase in Personal Electronics, and further deterioration in Industrial.”
• “Our first quarter business outlook, at the mid-point, is for net revenues of $3.6 billion, decreasing year-over-year by 15.2% and decreasing sequentially by 15.9%; gross margin is expected to be about 42.3%.”
• “For 2024, we plan to invest about $2.5 billion in net CAPEX.”
• “We will drive the Company based on a plan for FY24 revenues in the range of $15.9 billion to $16.9 billion. Within this plan, we expect a gross margin in the low to mid-40s.”

Quarterly Financial Summary (U.S. GAAP)

(US$ m, except per share data)	Q4 2023	Q3 2023	Q4 2022	Q/Q	Y/Y
Net Revenues	$4,282	$4,431	$4,424	-3.4%	-3.2%
Gross Profit	$1,949	$2,109	$2,102	-7.6%	-7.3%
Gross Margin	45.5%	47.6%	47.5%	-210 bps	-200 bps
Operating Income	$1,023	$1,241	$1,287	-17.5%	-20.5%
Operating Margin	23.9%	28.0%	29.1%	-410 bps	-520 bps
Net Income	$1,076	$1,090	$1,248	-1.3%	-13.8%
Diluted Earnings Per Share	$1.14	$1.16	$1.32	-1.7%	-13.6%

Annual Financial Summary (U.S. GAAP)

(US$ m, except earnings per share data)	FY2023	FY2022	Y/Y
Net Revenues	$17,286	$16,128	7.2%
Gross Profit	$8,287	$7,635	8.5%
Gross Margin	47.9%	47.3%	60 bps
Operating Income	$4,611	$4,439	3.9%
Operating Margin	26.7%	27.5%	-80 bps
Net Income	$4,211	$3,960	6.3%
Diluted Earnings Per Share	$4.46	$4.19	6.4%

 

Fourth Quarter 2023 Summary Review

Net Revenues by Product Group (US$ m)	Q4 2023	Q3 2023	Q4 2022	Q/Q	Y/Y
Automotive and Discrete Group (ADG)	2,060	2,025	1,696	1.7%	21.5%
Analog, MEMS and Sensors Group (AMS)	993	990	1,339	0.4%	25.8%
Microcontrollers and Digital ICs Group (MDG)	1,225	1,412	1,383	13.3%	11.5%
Others	4	4	6	–	–
Total Net Revenues	$4,282	4,431	4,424	-3.4%	-3.2%

 

Net revenues totalled $4.28 billion, representing a year-over-year decrease of 3.2%. On a year-over-year basis, ADG revenues increased 21.5%, while AMS and MDG decreased 25.8% and 11.5% respectively. Year-over-year net sales to OEMs and Distribution decreased 0.4% and 9.2%, respectively. On a sequential basis, net revenues decreased 3.4%, 40 basis points lower than the mid-point of ST’s guidance. On a sequential basis, ADG reported an increase in net revenues, AMS was stable and MDG decreased.

Gross profit totaled $1.95 billion, representing a year-over-year decrease of 7.3%. Gross margin of 45.5%, 50 basis points below the mid-point of ST’s guidance, decreased 200 basis points year-over-year, due to higher input manufacturing costs, unused capacity charges, and negative currency effect net of hedging, partially offset by the combination of sales price and product mix.

Operating income decreased 20.5% to $1.02 billion, compared to $1.29 billion in the year-ago quarter. ST’s operating margin decreased 520 basis points on a year-over-year basis to 23.9% of net revenues, compared to 29.1% in the fourth quarter of 2022.

By product group, compared with the year-ago quarter:

Automotive and Discrete Group (ADG):

• Revenue increased for both Automotive and Power Discrete.
• Operating profit increased by 39.7% to $657 million. Operating margin was 31.9% compared to 27.7%.

Analog, MEMS and Sensors Group (AMS):

• Revenue increased in Analog and decreased in Imaging and in MEMS.
• Operating profit decreased by 57.4% to $147 million. Operating margin was 14.8% compared to 25.8%.

Microcontrollers and Digital ICs Group (MDG):

• Revenue decreased for Microcontrollers and increased for RF Communications.
• Operating profit decreased by 30.9% to $342 million. Operating margin was 28.0% compared to 35.8%.

Net income decreased to $1.08 billion compared to $1.25 billion in the year-ago quarter. Both the fourth quarter 2023 and the fourth quarter 2022 financial results included one-time non-cash income tax benefits of $191 million and $141 million respectively. Diluted earnings per share decreased to $1.14 compared to $1.32 in the year-ago quarter.

Cash Flow and Balance Sheet Highlights

				Trailing 12 Months
(US$ m)	Q4 2023	Q3 2023	Q4 2022	Q4 2023	Q4 2022	TTM Change
Net cash from operating activities	1,480	1,881	1,550	5,992	5,202	15.2%
Free cash flow (non-U.S. GAAP)[1]	652	707	603	1,774	1,591	11.5%

 

Net cash from operating activities was $1.48 billion in the fourth quarter compared to $1.55 billion in the year-ago quarter. For the full-year 2023, net cash from operating activities increased 15.2% to $5.99 billion, representing 34.7% of total revenues.

Capital expenditure payments, net of proceeds from sales, capital grants and other contributions, were $798 million in the fourth quarter and $4.11 billion for the full year 2023. In the respective year-ago periods, net capital expenditures were $920 million and $3.52 billion.

Free cash flow (non-U.S. GAAP) was $652 million and $1.77 billion in the fourth quarter and full year, respectively, compared to $603 million and $1.59 billion in the year-ago respective periods.

Inventory at the end of the fourth quarter was $2.70 billion, compared to $2.87 billion in the previous quarter and $2.58 billion in the year-ago quarter. Days sales of inventory at quarter-end was 104 days compared to 114 days in the previous quarter and 101 days in the year-ago quarter.

In the fourth quarter, ST paid cash dividends to its stockholders totaling $60 million and executed a $86 million share buy-back as part of its current share repurchase program.

ST’s net financial position (non-U.S. GAAP) was $3.16 billion as of December 31, 2023, compared to $2.46 billion as of September 30, 2023 and reflected total liquidity of $6.08 billion and total financial debt of $2.93 billion. Adjusted net financial position, taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $3.00 billion as of December 31, 2023.

Corporate developments

On January 10, 2024, ST announced a new organization to deliver enhanced product development innovation and efficiency, time-to-market as well as customer focus by end market. ST will be re-organized into two Product Groups, split into four Reportable Segments and the existing sales and marketing organization will be complemented by a new application marketing organization focused by end markets across all Regions.

The new organization implies a change in reporting which will apply from January 1, 2024.

Business Outlook

ST’s guidance, at the mid-point, for the 2024 first quarter is:

• Net revenues are expected to be $3.6 billion, a decrease of 15.9% sequentially, plus or minus 350 basis points.
• Gross margin of 42.3%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.09 = €1.00 for the 2024 first quarter and includes the impact of existing hedging contracts.
• The first quarter will close on March 30, 2024.

Conference Call and Webcast Information

ST will conduct a conference call with analysts, investors and reporters to discuss its fourth quarter and full year 2023 financial results and current business outlook today at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until February 9, 2024.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance, or events to differ materially from those anticipated by such statements, due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macroeconomic or regional events, geopolitical and military conflicts (including the ongoing conflict between Russia and Ukraine), social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our information technology (“IT”) systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of intellectual property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics such as the COVID-19 pandemic in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027;
• potential loss of key employees and potential inability to recruit and retain qualified employees as a result of epidemics or pandemics such as the COVID-19 pandemic, remote-working arrangements and the corresponding limitation on social and professional interaction;
• the duration and the severity of the global outbreak of COVID-19 may continue to negatively impact the global economy in a significant manner for an extended period of time, and also could materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; and
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward looking terminology, such as “believes,” “expects,” “may,” “are expected to,” “should,” “would be,” “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risks are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2022 as filed with the Securities and Exchange Commission (“SEC”) on February 23, 2023. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed, or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other risks or uncertainties listed under “Item 3. Key Information — Risk Factors”

from time to time in our SEC filings, could have a material adverse effect on our business and/or financial condition.

The post STMicroelectronics Reports Q4 and FY 2023 Financial Results appeared first on ELE Times.

Nichia Corp of Tokushima, Japan — the world’s largest gallium nitride (GaN)-based light-emitting diode/laser diode (LED/LD) manufacturer and inventor of high-brightness blue and white LEDs — has commercialized a chip-scale LED (part number NFSWL11A-D6) that achieves a horizontal light distribution...

At the SPIE Photonics West 2024 exhibition in San Francisco, CA, USA (30 January–1 February), UV-C LED maker Silanna UV of Brisbane, Australia is sharing booth #237 with Marktech Optoelectronics Inc of Latham, NY, USA (a designer and manufacturer of optoelectronics components and assemblies), denoting the start of Marktech commencing distribution of Silanna’s new 235nm and 255nm UVC LEDs, which are said to enable safer, more eco-friendly, lower-power germicidal UV solutions, and chemical or material sensing...

submitted by /u/c0mput3rn3rd [link] [comments]

submitted by /u/c0mput3rn3rd [link] [comments]

As shown in Figure 1, this issue had been previously addressed during pre-internet times in EDN of January 18,1990 but a further detailed look at the idea is warranted thirty-four years later.

Figure 1 Archival design idea “Resistor isolates grounds” from 1990.

Back then, the GPIB controller was the Bertan 200-C488. The analog product being controlled would usually be one of the Bertan 205A/210 high voltage power supplies. The 210 series high voltage supplies delivered in the neighborhood of 200 W, not the highest power level one might encounter, but still high enough to make some heat.

The controller and the controlled when standing alone and apart would look something like Figure 2.

Figure 2 Block diagram of the Bertan 200-C488 GPIB controller and the controlled Bertan 205A/210 high voltage power supply.

The controlled item had an analog ground against which a controlling analog voltage would be applied and against which voltage and current monitoring signals would be obtained. The controlled item also had some rudimentary on/off signals. The controller had inputs and outputs to match.

During product development, the first attempted interface between the two didn’t work too well (See Figure 3).

Figure 3 Controller and controlled with a ground loop current whose current magnitude interfered with both control and monitoring.

The cabling between the controller and the controlled was found to be carrying a current loop whose current magnitude really messed up both control and monitoring. Just a few millivolts arising from heaven only knows what can send a lot of current through a loop of just a few milliohms.

This was a trap that had been inadvertently fallen into during design. (Mea culpa, there.) The prospect of a major redesign with elaborate isolation provisions was appalling so we stepped back a little to look things over and find a simpler remedy.

With the controller still in development, it was realized that its digital and analog grounds needed to be tied together, but that adding a 1 Ω resistance between the two as in Figure 4 would have no disruptive effect.

Figure 4 Modified controller and controlled with the digital and analog grounds of the controller tied together with a 1 Ω resistance between the two.

With that resistor in place, the ground loop situation was very much improved (Figure 5) meaning that the current flow in the ground loop was very much reduced to below inducing any disruptive effects. The current itself didn’t go to zero, but it went down to a much lower and non-disruptive level.

Figure 5 Controller and controlled with a diminished ground loop current.

The hard wired connection between the digital and analog grounds located at the controlled item was of no concern to the controller, but with the magnitude of the ground loop current flow lowered way, way down, that current no longer perceptibly affected anything.

Additionally, If the controller were to be disconnected, the controller was still stable with its revised grounding arrangement. There was no loss of operating stability whether it was connected to the other equipment or not.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• Grounding Electrical Circuits: 5 Simple Techniques
• Ground loops
• Grounding and shielding: No size fits all
• Electrical noise and mitigation – Part 2: Ground loops, noise transmission and shielding

The post Quelling a ground loop appeared first on EDN.

UK-based Oxford Instruments says that its atomic layer deposition (ALD) equipment has been installed at an “award-winning UK micro-LED provider” to support the latest consumer-immersive reality products and display devices. The system is used to deposit high-K dielectric ultra-thin films for high-density, very high-brightness, low-power and high-frame-rate RGB pixel arrays for consumer augmented-, virtual- and mixed-reality devices and smart watches...

Riber S.A. of Bezons, France — which makes molecular beam epitaxy (MBE) systems as well as evaporation sources — has received an order from a “major compound semiconductor industrial customer in Asia” for three production systems: two MBE 412 systems and one MBE 6000 system (for delivery in 2024)...