Новини світу мікро- та наноелектроніки

For fourth-quarter 2023, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €23m, up 48% on €15.6m in Q4/2022 a year ago, and following revenue of just €3.7m, €8.5m and €4m in Q1, Q2 and Q3/2023, respectively...

Avoiding op-amp output saturation error by keeping op-amp outputs “live” and below zero volts is a job where a few milliamps and volts (or even fractions of one volt) of regulated negative rail can be key to achieving accurate analog performance. The need for voltage regulation arises because the sum of positive and negative rail voltages mustn’t exceed the recommended limits of circuit components (e.g., only 5.5 V for the TLV9064 op-amp shown in Figure 1). Unregulated inverters may have the potential (no pun!) to overvoltage sensitive parts and therefore may not be suitable.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 shows the circuit: A simple regulated charge pump inverter based on the venerable and versatile HC4053 triple SPDT CMOS switch and most any low power RRIO op-amp. It efficiently and accurately inverts a positive voltage rail, generating a programmable negative output that’s regulated to a constant fraction of the positive rail. With Vin = 5 V, its output is good for currents from zero up to nearly 20 mA, the upper limit depending on the Vee level chosen by the R1:R2 ratio. It’s also cheap with a cost that’s competitive with less versatile devices like the LM7705. It’s almost unique in being programmable for outputs as near zero as you like, simply set by the choice for R2.

But enough sales pitch.  Here’s how it works.

Figure 1 U1 makes an efficient charge pump voltage inverter with comparator op-amp A1 providing programmable regulation.

 U1a and U1b act in combination with C2 to form an inverting flying-capacitor pump that transfers negative charge to filter capacitor C3 to maintain a constant Vee output controlled by A1. Charge pumping occurs in a cycle that begins with C2 being charged to V+ via U1a, then completes by partially discharging C2 into C3 via U1b. Pump frequency is roughly 100 kHz under control of the U1c Schmidt trigger style oscillator, so that a transfer occurs every 10 µs. Note the positive feedback around U1c via R3 and inverse feedback via R4, R5, and C1. 

Figure 2 shows performance under load with the R2:R1 ratio shown.

Figure 2 Output voltage and current conversion efficiency vs output current for +Vin = 5 V.

No-load current draw is less than 1 mA, divided between U1 and A1, with A1 taking the lion’s share. If Vee is lightly loaded, it can approach -V+ until A1’s regulation setpoint (Vee = – R2/R1 * V+) kicks in. Under load, Max Vee will decline at ~160 mV/mA but Vee remains rock solid so long as the Vee setpoint is at least slightly less negative than Max Vee.

A word about “bootstrapping”: Switch U1b needs to handle negative voltages but the HC4053 datasheet tells us this can’t work unless the chip is supplied with a negative input at pin 7. So U1’s first task is to supply (bootstrap) a negative supply for itself by the connection of pin 7 to Vee.

“Sub-zero” comparator op-amp A1 maintains Vee = – R2/R1 * V+ via negative feedback through R6 to U1 pin 6 Enable. When Vee is more positive than the setpoint, A1 pulls pin 6 low, enabling the charge pump U1c oscillator and the charging of C3. Contrariwise, Vee at setpoint causes A1 to drive pin 6 high, disabling the pump. When pin 6 is high, all U1’s switches open, isolating C2 and conserving residual charge for subsequent pump cycles. R6 limits pin 6 current when Vee < -0.5 V.

Figure 3 shows how a -500-mV sub-zero negative rail can enable typical low-voltage op-amps (e.g., TLV900x) to avoid saturation at zero over the full span of rated operating temperature for output currents up to 10 mA and beyond. Less voltage or less current capability might compromise accurate analog performance.

Figure 3 Vee = -500 mV is ideal for avoiding amplifier saturation without overvoltaging LV op-amps.

U1’s switches are break-before-make, which helps both with pump efficiency and with minimizing Vee noise, but C3 should be a low ESR type to keep the 100 kHz ripple low (about 1 mVpp @ Iee = 10 mA). You can also add a low inductance ceramic in parallel with C3 if high frequency spikes are a concern.

Footnote: I’ve relied on the 4053 in scores of designs over more than a score of years, but this circuit is the very first time I ever found a practical use for pin 6 (-ENABLE). Learn something new every day!

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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The post “Sub-zero” op-amp regulates charge pump inverter appeared first on EDN.

Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has reached a definitive agreement to acquire Anokiwave Inc – which provides high-performance silicon integrated circuits (ICs) for intelligent active array antennas for defense & aerospace, SATCOM and 5G applications. The transaction is expected to close during the March quarter...

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has shipped a GEN20-Q molecular beam epitaxy (MBE) system to Hermes-Epitek, a semiconductor and optoelectronics client based in the Hsinchu Science Park in Taiwan...

From generic no brand usb dvd drive submitted by /u/Stavinair [link] [comments]

Author: Gunjan Malhotra, Director, Komaki Electric Division

India, the fifth-largest global automotive market, is expected to grow to the third-largest by 2030. The Indian Electric Vehicle (EV) industry is thriving, with sales of 8,38,766 units in the first seven months of 2023. Moreover, with 3 million registered EVs currently, India is projected to generate 10 million EVs annually by 2030.

Gunjan Malhotra, Director, Komaki Electric Division

These unprecedented developments in India’s burgeoning EV market are propelled by the significant contribution of the Internet of Things (IoT), Data, and connected technologies. On the other hand, the shift to software-defined vehicles (SDVs) further augments seamless connectivity with the induction of compatible protocols and hardware.

The automotive industry is transforming due to the software-defined vehicle and robust communications infrastructure. The connected car’s value lies in creating a more informed, intelligent mobility infrastructure, making travelling easier, less stressful, safer, and more sustainable. However, to combat growing Cybersecurity issues, it is crucial that automakers use upgraded protocols, encrypted channels, and authentication mechanisms to ensure confidentiality.

The EV industry can only thrive with a robust charging infrastructure, and in this sphere, IoT plays a path-breaking role. These charging stations work on connected devices integrated with third-party service providers, using protocols and cloud infrastructure for seamless charging operations. IoT combines OT and IT, focusing on digital transformation. EV charging consists of charging equipment, a mobile app, and a management platform. A single charging session generates telemetry data, including battery capacity, grid limits, power consumption, and troubleshooting data.

IoT in EV charging requires continuous monitoring and data presentation, enabling notifications for users in case of critical failures or updates. This benefits all stakeholders in the value chain, including EV drivers, Charge Point Operators (CPOs), and network operators. Key use cases include user authentication, charging app availability, automated operations, smart charging, remote management, and EVSE control.

The IoT-based infrastructure should also ensure secure transactions and billing, allow for automatic charging when energy rates vary during seasons, and enable Charge Point Operators to manage operations remotely. The IoT platform also collects data from various sensory nodes, analyzing important metrics like grid limit, energy tariffs, EV battery capacity, and state of charge, making it easier to control and manage a large fleet of charging infrastructure. Thereby, data is crucial for electric vehicles (EVs) as they form a connected network of devices, including cars, charging stations, smart meters, and IEDs.

These devices collect data on user habits, battery security, and grid charge management. OEMs collect data to improve user experience and design advanced technology for a seamless driving experience. For government and other stakeholders, data is essential for EV grid integration (EVGI) and providing support to smart cities and green infrastructure projects. Hence, there should be ample virtual space to store the data as millions of EVs are expected on the road in the next decade.

Road ahead

To achieve green milestones in the mobility sector, IoT is crucial for developing next-gen applications like smart charging and vehicle-to-grid, benefiting everyone from CPOs to grid suppliers. Being a forerunner in the IT sector, India is blessed with all those resources which could be helpful to push the EV industry with a robust IoT ecosystem for its safer and swifter transition.

The post IoT is fuelling the growth of EV industry appeared first on ELE Times.

Typical applications include power supplies for industrial, server and telecom-infrastructure applications, and automotive signal conditioning and power conversion

STMicroelectronics’ high-accuracy TSZ151 operational amplifiers have very low offset voltage with minimal temperature drift, bringing enhanced accuracy and stability to circuits for sensor interfacing, signal conditioning, and current measurement.

An extremely low input offset voltage (Vio) is the defining parameter of a high-accuracy operational amplifier (op amp). The TSZ151 has Vio less than 7µV at 25°C. Moreover, the value remains stable, below 10µV, over the full specified temperature range, from -40°C to 125°C. Its high stability minimizes reliance on periodic recalibration, enhancing the availability of the end product throughout its lifetime.

With gain-bandwidth of 1.6MHz and drawing just 210μA at 5V, the TSZ151 sits between ST’s 400kHz TSZ121 and 3MHz TSZ181, giving designers more choice and flexibility to optimize speed and power consumption. The TSZ151 combines its excellent speed-to-power ratio with ultra-low maximum input bias current of 300pA.

Having a minimum operating voltage of 1.8V, the TSZ151 can be powered from the same rail as other ICs in the system, such as a low-voltage microcontroller. The rail-to-rail input and output help maximize dynamic range. The op amp also has very low power consumption, drawing just 210μA at 5V, while the low supply-voltage capability permits extended runtime with a discharged battery.

Leveraging its wide operating temperature range, from -40°C to +125°C, designers can use the TSZ151 in equipment to be deployed in harsh environments and in applications with long mission profiles. Typical uses include feedback circuitry in power supplies for industrial, server and telecom-infrastructure applications, and automotive high-accuracy signal conditioning and power conversion. The TSZ151 is AEC-Q100 qualified and is covered by ST’s rolling 10-year longevity plan that guarantees long-term product support.

The post Low-offset, zero-drift op amps from STMicroelectronics deliver wide gain-bandwidth for high-accuracy sensing appeared first on ELE Times.

submitted by /u/Alone-Bicycle-2219 [link] [comments]

It is not working, therefore, I've opened it. What I'm supposed to do with this. Not an expert in this regard. Any advice? submitted by /u/blrtgj [link] [comments]

As I’ve recently mentioned a few times, I’m ramping up my understanding and skill set on a couple of Blackmagic Design Pocket Cinema Cameras (BMPCCs), both 6K in maximum captured resolution: a first-generation model based on the BMPCC 4K and using Canon LP-E6 batteries:

and the second-generation successor with a redesigned body derived from the original BMPCC 6K Pro. It uses higher-capacity Sony NP-F570 batteries, has an integrated touchscreen LCD that’s position-adjustable, and is compatible with an optional electronic viewfinder (which I also own):

I’m really enjoying playing with them both so far, steep learning curve aside, but as I use them, I can’t shake the feeling that I’ve got ticking time bombs in my hands. As I’ve also mentioned recently, cameras like these are commonly used in conjunction with external “field” monitors, whether wirelessly- or (for purposes of this writeup’s topic) wired-connected to the camera:

And as I’ve also recently mentioned, it’s common to power cameras like these from a beefy external battery pack such as this 155 Wh one from SmallRig:

or a smaller-capacity sibling that’s airplane-travel amenable:

Such supplemental power sources commonly offer multiple outputs, directly and/or via a battery plate intermediary:

enabling you to fuel not only the camera but also the field monitor, a nearby illumination source, a standalone microphone preamp, an external high-performance SSD or hard drive, and the like. Therein lies the crux of the issue I’m alluding to. Check out, to start, this Reddit thread.

The gist of the issue, I’ve gathered (reader insights are also welcomed), is that if you “hot-socket” either the camera or the display (and either the particular device’s power or the common HDMI connection) while the other device is already powered up, there’s a finite chance that the power supply circuit loop (specifically the startup spike) will route through the HDMI connection instead, frying the HDMI transceiver inside the camera and/or display (and maybe other circuitry as well). The issue seems to be most common, but not exclusively the case, when both the camera and display are fed by the same power source, albeit not leveraging a common ground, and when they’re running on different supply voltages.

I ran the situation by my technical contact at Blackmagic after stumbling across it online, and here’s what he had to say:

Our general recommendation is to…

• Power down all the devices used if they have internal or built-in batteries
• Connect the external power sources to all devices
• Connect the HDMI/SDI cable between the devices
• Power on the devices

Sounds reasonable at first glance, doesn’t it? But what if you’re a professional with clients that pay by the hour and want to keep their costs at a minimum, and you want to keep them happy, or you’re juggling multiple clients in a day? Or if you’re just an imperfectly multitasking prosumer (aka power user) like me? In the rush of the moment, you might forget to power the camera off before plugging in a field monitor, for example. And then…zap.

My initial brainstorm on a solution was to switch from conventional copper-based HDMI cables to optical ones. Two problems with this idea, though: they tend to be bulkier than their conventional counterparts, which is particularly problematic with the short cable runs used with cameras as well as a general desire for svelteness, both again exemplified by SmallRig products:

The other issue, of course, is that optical HDMI cables aren’t completely optical. Quoting from a CableMatters blog post on the topic:

A standard HDMI cable is made up of several twisted pairs of copper wiring, insulated and protected with shielding and silicon wraps. A fiber optic HDMI cable, on the other hand, does away with the central twisted copper pair, but still retains some [copper strands]. At its core are four glass filaments which are encased in a protective coating. Those glass strands transmit the data as pulses of light, instead of electricity. Surrounding those glass fibers are seven to nine twisted copper pairs that handle the power supply for the cable, one for Consumer Electronics Control (CEC), two for sound return (ARC and eARC), and one set for a Display Data Channel (DDC) signal.

My Blackmagic contact also wisely made the following observations, by the way:

It may not be fair to say that Blackmagic Pocket Cinema Cameras are especially susceptible to issues that could affect any camera. Any camera used in the same situation would be affected equally. (Hence the references to Arri camera white papers in the sources you quoted)

He’s spot-on. This isn’t a Blackmagic-specific issue. Nor is it a HDMI-specific issue, hence my earlier allusion to SDI (the Serial Data Interface), which also comes in copper and fiber variants. Here’s a Wikipedia excerpt, for those not already familiar with the term (and the technology).

Serial digital interface (SDI) is a family of digital video interfaces first standardized by SMPTE (The Society of Motion Picture and Television Engineers) in 1989…These standards are used for transmission of uncompressed, unencrypted digital video signals (optionally including embedded audio and time code) within television facilities; they can also be used for packetized data. SDI is used to connect together different pieces of equipment such as recorders, monitors, PCs and vision mixers.

In fact, a thorough and otherwise excellent white paper on the big-picture topic, which I commend to your attention, showcases SDI (vs HDMI) and Arri cameras (vs Blackmagic ones).

To wit, and exemplifying my longstanding theory that it’s possible to find and buy pretty much anything (legal, at least) on eBay, I recently stumbled across (and of course acted on and purchased, for less than $40 total including tax and shipping) a posting for the battery-acid-damaged motherboard of a Blackmagic Production Camera 4K, which dates from 2014. Here are some stock images of the camera standalone:

Rigged out:

And in action:

Now for our mini-teardown patient. I’ll start out with a side view, as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Compare this to the earlier stock shot of the camera and you’ll quickly realize that the penny’s location corresponds to the top edge of the camera in its operating orientation. Right-to-left (or, if you prefer, top-to-bottom), the connections are (copy-and-pasting from the user manual, with additional editorializing by yours truly in brackets):

• LANC [the Sony-championed Logic Application Control Bus System or Local Application Control Bus System] REMOTE: The 2.5mm stereo jack for LANC remote control supports record start and stop, and iris and focus control on [Canon] EF [lens] mount models.
• HEADPHONES: 3.5 mm [1/8”] stereo headphone jack connection.
• AUDIO IN: 2 x 1/4 inch [6.35 mm] balanced TRS phono jacks for mic or line level audio.
• SDI OUT: SDI output for connecting to a switcher [field monitor] or to DaVinci Resolve via capture device for live grading.
• THUNDERBOLT CONNECTION: Blackmagic Cinema Camera outputs 10-bit uncompressed 1080p HD. Production Camera 4K also outputs compressed Ultra HD 4K. Use the Thunderbolt connection for HD UltraScope waveform monitoring and streaming video to a Thunderbolt compatible computer.
• POWER: 12 – 30V power input for power supply and battery charging.

Now for an overview shot of the front of the main system PCB I bought:

After taking this first set of photos, I realized that I’d oriented the PCB 180° from how it would be when installed in the camera in its operating orientation (remember, the power input is at the bottom). This explains why the U.S. penny is upside-down in the pictures; I re-rotated the images in more intuitive-to-you orientations before saving them!

Speaking of which, above and to the right of the U.S. penny is the battery acid damage I mentioned earlier; it would make sense to have the battery nearby the power input, after all. One unique thing about this camera versus all the ones I own is that the battery is embedded, not user removable (I wonder how much Blackmagic charged as a service fee to replace it after heavy use had led to the demise of the original?).

Another thing to keep in mind is that the not-shown image sensor is in front of this side of the PCB. Here’s another stock image which shows (among other things) the Super 35-sized image sensor peeking through the lens mount hole:

My guess would be that the long vertical connector on the left side of the PCB, to the right of the grey square thing I’ll get to shortly, mates to a daughter card containing the image sensor.

I bet that many of you had the same thought I did when I first reviewed this side of the PCB…holy cow, look at all those chips! Right? Let’s zoom in a bit for a closer inspection:

This is the left half. Again, note the vertical connector and the mysterious grey square to the left of it (keep holding that thought; I promise I’ll do a reveal shortly!). Both above and below it are Samsung K4B4G1646B-HCK0 4 Gbit (256Mbit x16) DDR3 SDRAMS, four total, for 2 GBytes of total system RAM. I’m betting that, among other things, the RAM array temporarily holds each video frame’s data streamed off the global shutter image sensor (FYI I plan to publish an in-depth tutorial on global vs rolling shutter sensors, along with other differentiators, in EDN soon!) for in-camera processing purposes prior to SSD storage.

And here’s the right half:

Wow, look at all that acid damage! I’m guessing the battery either leaked due to old age or exploded due to excessive applied charging voltage. Other theories, readers?

I realize I’ve so far skipped over a bunch of potentially interesting ICs. And have I mentioned that mysterious grey square yet? Let’s return to the left side, this time zoomed in even more (and ditching the penny) and dividing the full sequence into thirds. That grey patch is thermal tape, and it peeled right off the IC below it (here’s its adhesive underside):

Exposing to view…a FPGA!

Specifically, it’s a Xilinx (now AMD) Kintex 7 XC7K160T. I’d long suspected Blackmagic based its cameras on programmable logic vs an ASIC-based SoC, considering their:

• Modest production volumes versus consumer camcorders
• High-performance requirements
• High functionality, therefore elaborate connectivity requirements, and
• Fairly short operating time between battery charges, inferring high power consumption.

The only thing that surprised me was that Blackmagic had gone with a classic FPGA versus one with an embedded “hard” CPU core, such as Xilinx-now-AMD’s Arm-based Zynq-7000 family. That said, I’d be willing to bet that there’s still a MicroBlaze “soft” CPU core implemented inside.

Other ICs of note in this view include, at the bottom left corner, a Cypress Semiconductor (now Infineon) CY7C68013A USB 2.0 controller, to the right of and below a mini-USB connector which is exposed to the outside world via the SSD compartment and finds use for firmware updates:

In the lower right corner is the firmware chip, a Spansion (also now Infineon) S25FL256S 256 Mbit flash memory with a SPI interface. And along the right side, to the right of that long tall connector I’ve already mentioned, is another Cypress (now Infineon) chip, the CY24293 dual-output PCI Express clock generator. I’m guessing that’s a PCIe 1.0 connector, then?

Now for the middle segment:

Interesting (at least to me) components here that I haven’t already mentioned include the diminutive coin cell battery in the upper left, surrounded on three sides by LM3100 voltage regulators (I “think” originally from National Semiconductor, now owned by Texas Instruments…there are at least four more LM3100s, along with two LM3102s, that I can count in various locales on the board). Power generation and regulation is obviously a key focus of this segment of the circuitry. That all said, toward the center is another Xilinx-now-AMD programmable logic chip, this one a XC9572XL CPLD. Also note the four conductor strips at top, jointly labeled JT3 (and I’m guessing used for testing).

Finally, the right side:

Connectivity dominates the landscape here, along with acid damage (it gets uglier the closer you get to it, doesn’t it?). Note the speaker and microphone connectors at top. And toward the middle, alongside the dual balanced audio input plugs, are two Texas Instruments TLV320AIC3101 low-power stereo audio codecs; in-between them is a National Semiconductor-now-Texas Instruments L49743 audio op amp.

Last, but not least, let’s look at the other side of the PCB:

It’s comparatively unremarkable, from an IC standpoint compared to the other side, and aside from the oddly unpopulated J14 and U19 sites at the top. What it lacks in chip excitement (unless you’re into surface-mount passives, I guess), it compensates with connector curiosity.

On the left side (I’d oriented the PCB correctly straightaway this time, therefore the non-upside-down Abraham Lincoln on the penny):

there’s first a flex PCB connector up top (J12) which, perhaps obviously given its labeling, is intended for the LCD on the camera’s backside (but not its integrated touch interface…keep reading). In the middle is, I believe, the 2.5” SATA connector for the SSD. And on the bottom edge are, left to right, the connectors for the battery, the cable that runs to the electrical connectors on the lens mount (I’m guessing here based on the “EF POGO” phrase) and a Peltier cooler. Here’s a Wikipedia excerpt on the latter, for those not already familiar with the concept:

Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler (TEC) and occasionally a thermoelectric battery.

Also note the two four-pad conductor clusters, one at the top and the other, although this time (versus the earlier mentioned JT3) unlabeled and on only one side of the board. And what’s under that tape? Glad you asked:

And now for the other (right) side:

Oodles o’passives under the FPGA, as previously noted, plus a few more connectors that I haven’t already mentioned. On the top edge are ones for the back panel touchscreen and the up-front record button, while along the bottom edge (again, left to right) are ones for the additional (back panel, this time) interface buttons and a fan. Yes, this camera contains both a Peltier cooler and a fan!

That’s “all” I’ve got for you today. I welcome any reader thoughts on the upfront HDMI/SDI connectivity issue, along with anything from the subsequent mini-teardown, in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Prosumer and professional cameras: High video quality, but a connectivity vulnerability appeared first on EDN.

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine...

MICLEDI Microdisplays B.V. of Leuven, Belgium — a fabless developer of micro-LED display modules for augmented reality (AR) glasses that was spun off from nanoelectronics research center IMEC in 2019 —showcased its range of red, green and blue (R, G and B) µLEDs at the SPIE AR-VR-MR 2024 exhibition in San Francisco, CA, USA (30–31 January), colocated with Photonics West 2024...

In the current fast-paced world, when safety and efficiency are critical in all facets of life, vehicle monitoring systems have become a transportation and logistics industry game-changer. These cutting-edge technologies improve security measures and optimize fleet management, among many other advantages. Let’s take a closer look at car monitoring systems, examining their many varieties, features, uses, advantages, and bright future.

What is a Vehicle Tracking System?

Real-time vehicle monitoring and management are made possible by vehicle tracking systems, sometimes referred to as fleet tracking systems or GPS tracking systems. It tracks the position, speed, and status of cars remotely by utilizing GSM (Global System for Mobile Communications) and GPS (Global Positioning System) technology.

Types of Vehicle Tracking Systems

There are several kinds of car tracking systems out there, each designed to meet particular requirements and tastes:

1. Passive Tracking Systems: These solutions allow data to be stored inside the car on a device that can be accessed and analyzed at a later time. Although they are inexpensive, they cannot be tracked in real-time.
2. Active Tracking Systems: With the real-time data transfer offered by active tracking systems, vehicle location, speed, and other parameters may be immediately monitored.
3. Satellite Tracking Systems: Since satellite communication is used to provide precise tracking, satellite-based tracking systems are perfect for rural or off-grid locations where standard cellular networks might not be accessible.

How Does a Vehicle Tracking System Work?

The onboard diagnostics system of a car uses GPS technology to operate in conjunction with vehicle tracking systems. Position data is gathered by GPS receivers mounted in the car and sent to a centralized server or cloud-based platform over cellular networks. Users can use mobile or web applications to get real-time tracking data and analytics.

Vehicle Tracking System Applications

There are numerous uses for vehicle tracking systems in different areas and businesses, such as:

1. Fleet Management: Tracking systems are used by firms that own fleets of cars, like delivery services and transportation companies, to keep an eye on driver safety, maximize fuel efficiency, and monitor vehicle routes.
2. Asset Tracking: Vehicle tracking systems are used to reduce the risk of theft and unlawful usage by tracking valuable assets, such as trailers and construction equipment.
3. Public Transportation: Tracking systems are used by public transportation companies to increase timetable adherence, improve passenger safety, and streamline operations.
4. Personal Vehicles: Individuals use tracking systems for personal vehicles to monitor teenage drivers, track stolen vehicles, and ensure family safety during road trips.

Benefits of Vehicle Tracking Systems

Installing tracking devices in cars has several advantages:

1. Improved Efficiency: Vehicle tracking solutions increase fleet productivity overall, cut down on idle time, and optimize route planning.
2. Enhanced Safety: In addition to ensuring that speed limits and safety standards are followed, real-time monitoring also encourages safer driving practices and allows for prompt emergency action.
3. Cost Savings: Through the reduction of fuel consumption, the mitigation of vehicle wear and tear, and the prevention of theft, tracking systems yield substantial cost savings for commercial enterprises.
4. Enhanced Customer Service: Accurate arrival times and timely delivery updates increase client happiness and loyalty.

Future of Vehicle Tracking Systems

Vehicle tracking systems have a bright future ahead of them as long as technology keeps developing. The capabilities of monitoring systems will be further enhanced by developments in AI (Artificial Intelligence), IoT (Internet of Things), and Big Data analytics. These developments will make it possible to track autonomous vehicles, do predictive maintenance, and seamlessly integrate with other smart city efforts.

In conclusion, vehicle tracking technologies, which provide unmatched efficiency, safety, and cost savings, have completely changed the way we manage and keep an eye on our cars. These systems will continue to be crucial in determining how logistics and transportation are developed in the future with continued improvements and innovations.

The post Unlocking Safety and Efficiency: Vehicle Tracking Systems’ Power appeared first on ELE Times.

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has announced the availability of the model TDLNA0430SEP radiation-tolerant UHF to S-band low-noise amplifier (LNA), suitable for demanding high-reliability space applications where low noise figure, minimal power consumption and small package footprint are critical to mission success...

Memory chips like DRAMs, long subject to cyclical trends, are now eying a more stable and steady market: artificial intelligence (AI). Take the case of SK hynix, the world’s second-largest supplier of memory chips. According to its chief financial officer, Kim Woo-hyun, the company is ready to grow into a total AI memory provider by leading changes and presenting customized solutions.

The South Korean chipmaker has been successfully pairing its high-bandwidth memory (HBM) devices with Nvidia’s H100 graphics processing units (GPUs) and others for processing vast amounts of data in generative AI. Large language models (LLMs) like ChatGPT increasingly demand high-performance memory chips to enable generative AI models to store details from past conversations and user preferences to generate human-like responses.

Figure 1 SK hynix is consolidating its HBM capabilities to stay ahead of the curve in AI memory space.

In fact, AI companies are complaining that they can’t get enough memory chips. OpenAI CEO Sam Altman has recently visited South Korea, where he met senior executives from SK hynix and Samsung, the world’s largest memory chip suppliers followed by Micron of the United States. OpenAI’s ChatGPT technology has been vital in spurring demand for processors and memory chips running AI applications.

SK hynix’s HBM edge

SK hynix’s lucky break in the AI realm came when it surpassed Samsung by launching the first HBM device in 2015 and gained a massive head start in serving GPUs for high-speed computing applications like gaming cards. HBM vertically interconnects multiple DRAM chips to dramatically increase data processing speed compared with earlier DRAM products.

Not surprisingly, therefore, these memory devices have been widely used to power generative AI devices operating on high-performance computing systems. Case in point: SK hynix’s sales of HBM3 chips have increased by more than fivefold in 2023 compared to a year earlier. A Digitimes report claims that Nvidia has paid SK hynix and Micron advanced sums ranging from $540 million to $770 million to secure the supply of HBM memory chips for its GPU offerings.

SK hynix plans to proceed with the mass production of the next version of these memory devices—HBM3E—while also carrying out the development of next-generation memory chips called HBM4. According to reports published in the Korean media, Nvidia plans to pair its H200 and B100 GPUs with six and eight HBM3E modules, respectively. HBM3E, which significantly improves speed compared to HBM3, can process data up to 1.15 terabytes per second.

Figure 2 SK hynix is expected to begin mass production of HBM3E in the first half of 2024.

The Korean memory supplier calls HBM3E an AI memory product while claiming technological leadership in this space. While both Samsung and Micron are known to have their HBM3E devices ready and in the certification process at AI powerhouses like Nvidia, SK hynix seems to be a step ahead of its memory rivals. Take, for example, HBM4, currently under development at SK hynix; it’s expected to be ready for commercial launch in 2025.

What’s especially notable about HBM4 is its ability to stack memory directly on processors, eliminating interposers altogether. Currently, HBM stacks integrate 8, 12, or 16 memory devices next to CPUs or GPUs, and these memory devices are connected to these processors using an interface. Integrating memory directly onto processors will change how chips are designed and fabricated.

An AI memory company

Industry analysts also see SK hynix as the key beneficiary of the AI-centric memory upcycle because it’s a pure-play memory company, unlike its archrival Samsung. It’s worth noting that Samsung is also heavily investing in AI research and development to bolster its memory offerings.

AI does require a lot of memory and it’s no surprise that South Korea, housing the top two memory suppliers, aspires to become an AI powerhouse. SK hynix, on its part, has already demonstrated its relevance in designs for AI servers and on-device AI adoption.

While talking about memory’s crucial role in generative AI at CES 2024 in Las Vegas, its CEO Kwak Noh-Jung vowed to double the company’s market cap in three years. That’s why it’s now seeking to become a total AI memory provider while seeking a fast turnaround with high-value HBM products.

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• Generative AI and memory wall: A wakeup call for IC industry
• How SK hynix’s Memory Solution Technology Gives It an Edge in the Market

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Infineon Technologies is the first company in the industry to receive the ISO/SAE 21434 cybersecurity certification for its SLI37 automotive security controller family. This enables a high level of security with ISO/SAE-compliant products and will facilitate customer integration into automotive applications such as secured devices for V2X (Vehicle-to-everything) communication. It follows the certification of Infineon’s cybersecurity management system, which was announced in November 2022.

“At Infineon, we are constantly improving our security offering,” said Sebastien Colle, Vice President, ‘Security’ at Infineon. “We enable our customers to easily demonstrate their compliance with ISO/SAE 21434. I am particularly proud that the Common Criteria certification has been used as a bridge to demonstrate compliance with ISO/SAE 21434. This is a testament to the power of Common Criteria as a generic tool that can serve application verticals. With the combination of ISO/SAE 21434 and CC EAL6+ (high) certificates, Infineon’s SLI37 controllers provide the best benchmark for security verification in the automotive world today.”

The hardware-based security features of ISO/SAE 21434 certified devices can provide a reliable foundation for a multi-layered security architecture, enabling a root-of-trust. This plays an important role in the automotive industry, where system security is mandatory for vehicle safety. Therefore, Infineon’s SLI37 automotive cybersecurity solutions provide a secured foundation for automotive applications to comply with the ISO/SAE 21434 standard.

As part of the certification process, a security evaluation was conducted by TÜV-IT GmbH, an accredited and independent security evaluator, which concluded that the products have demonstrated resistance to attackers with high attack potential. This also includes protection against physical attacks such as fault and spike attacks, as well as power and side-channel analysis.

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In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.

Infineon’s REAL3 flexible ToF imager technology enables the combination of established high-resolution iToF flood illumination and dToF long-range spot illumination in a single hybrid Time of Flight camera. For many years now, this high-resolution technology has been used to see the smallest objects in the path of the robot and navigate around them. Adding precise long-range spot data now also allows the creation of an accurate 3D map of the surrounding area for intelligent path planning experiences even in challenging light conditions of bright sunlight or darkness that empower the next-generation robot vacuum cleaner.

The new solution reduces the height of robot vacuum cleaners by 20-30 per cent, fully replacing the top-mounted LDS (Laser Distance Scanner) making it possible to clean even under furniture with low clearance. Measuring only 31x16x8 mm, the hybrid ToF camera requires much less space for improved mapping and obstacle avoidance functionality. Making multiple sensors redundant, hybrid ToF reduces system costs as well as operation costs, since there are no moving parts that wear out over time.

The solution serves customers with a simplified and user-friendly approach to implementation. The compact hybrid ToF solution is versatile and robust and aligns well with the evolving needs of mobile consumer robot devices in various industries such as robot vacuum cleaners, commercial robots, air-purifiers and size measurement.

“The partnership with pmdtechnologies and OMS is a great example of how Infineon fosters technology innovation and digitalization together,” said Andreas Kopetz, Vice President Ambient Sensing at Infineon. “Our hybrid ToF solution caters to a rapidly expanding consumer robotic market with a wide array of applications and makes it possible for customers to come up with unique robot designs, on top of reduced system costs and complexity by one camera replacing multiple.”

“Infineon and pmdtechnologies’ hybrid ToF adopts an innovative patent architecture and is paired with dual illumination,” said Eden Xiao, General Manager, Jiangxi OMS Microelectronics Co., Ltd. “For a manufacturer like OMS, the solution has exceptional advantages such as small size, low power consumption, and a reduction of overall application cost. We are excited to utilize the unique optical design scheme that avoids multipath problems and achieves a combination of precise positioning and obstacle avoidance, further enhancing the competitiveness of hybrid ToF camera products.”

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KYOCERA AVX, a leading global manufacturer of advanced electronic components, has announced the expansion of its 9155-800 Series vertical-mate, 2.0mm-pitch battery connectors. The expansion includes the addition of new seven- and eight-position models, aimed at satisfying customer demand for higher signal and current capabilities.

These connectors, part of KYOCERA AVX’s extensive portfolio engineered to accelerate technological innovation, feature a unique contact geometry allowing full vertical engagement without risking contact damage. Unlike traditional battery connectors requiring specific engagement procedures, the 9155-800 Series can be mated from any angle, offering users greater flexibility and convenience.

Designed for a wide range of applications including industrial, medical, and consumer electronics markets, the 9155-800 Series connectors boast an array of features including a forgiving sweeping beam contact design, anti-snag feature, and robust gold-plated beryllium copper contacts capable of enduring over 5,000 mating cycles.

Furthermore, these connectors are compatible with signal and power circuits, providing users with versatility in their applications. They are constructed with flame-retardant materials and are RoHS compliant, ensuring safety and regulatory compliance.

Perrin Hardee, Product Marketing Manager at KYOCERA AVX, emphasized the importance of these connectors in simplifying the mating process and ensuring reliable connectivity across various industries.

KYOCERA AVX has a long-standing reputation for producing battery connectors, with its 9155 family offering a wide selection of standard battery connectors for diverse applications. The family’s features include gold-plated BeCu contacts known for their reliability in harsh environments and customizable options to suit specific application needs.

With the expansion of the 9155-800 Series, KYOCERA AVX continues to address evolving market demands for efficient and reliable connectivity solutions in electronic devices.

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I looked it up, and apparently gules means "red, as a heraldic tincture". Apparently it has something to do with a coat of arms? submitted by /u/Successful_Panic_850 [link] [comments]