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One of the primary goals for the power supply industry is to bring higher power conversion efficiency and power density to power devices in applications such as data centers and 5G. Integrating a driver circuit and power MOSFET—known as a DrMOS—into an IC increases power density and efficiency when compared to a conventional, discrete MOSFET with an individual driver IC.

Moreover, DrMOS’s flip-chip technology further optimizes the voltage regulator’s performance by reducing response time and reducing the inductance between the die and package (Figure 1).

Figure 1 Here is a comparison between conventional wire bond and flip-chip technology. Source: Monolithic Power Systems

However, parasitic inductance on the substrate and PCB significantly impacts the drain-to-source voltage (VDS) spike, and that’s due to resonance between parasitic inductance and MOSFET’s output capacitance (COSS). A high VDS spike can cause a MOSFET avalanche, which leads to device degradation and reliability issues. To prevent an avalanche breakdown on the MOSFET, there are several methods to alleviate voltage stress.

The first method is to apply a higher-voltage, double-diffused MOSFET (DMOS) process on the DrMOS. If this process is adopted in the power MOSFET design, it results in a higher on resistance (RDS(ON)) for the DrMOS due to a reduced number of paralleled DMOS within the same space.

The second method is to use a snubber circuit to suppress voltage spike. However, this method leads to extra loss on snubber circuit. Furthermore, adding a snubber circuit may not effectively lower the MOSFET’s VDS spike since the stray inductance that causes resonant behavior is mainly integrated in DrMOS’s package.

When trying to increase voltage regulator efficiency and reduce the MOSFET’s voltage spikes, the tradeoffs described above can make it difficult to quantify and optimize the effects of parasitic inductance on the PCB and substrate.

This article will first discuss parasitic inductance modeling. Next, the equivalent parasitic circuit model is applied in a SPICE simulation tool to predict the VDS switching spike. Experimental results will be presented to verify the feasibility of the parasitic model.

Parasitic inductance modeling on a DrMOS

To model parasitic inductance, 3D structures of both the DrMOS and PCB were built for a simulation analysis (Figure 2). Parameters such as the material, stack-up information and PCB as well as package layer thickness are crucial for modeling accuracy.

Figure 2 DrMOS and PCB’s 3D-modeling structure can be used to obtain parasitic inductance. Source: Monolithic Power Systems

After 3D-modeling the PCB and DrMOS, the parasitic inductance can be characterized and obtained via ANSYS Q3D extractor. Since this article focuses on the MOSFET’s VDS spike, the main simulation settings of interest are the parasitic parameters on the power nets and driver nets.

When considering the parasitic component obtained from Q3D extractor, the parasitic inductance matrix—including the self and mutual terms of each net on the DrMOS—can be selected under different frequency conditions. Since the resonant frequency for VDS on the high-side MOSFET (HS-FET) and low-side MOSFET (LS-FET) is between 300 MHz and 500 MHz, the parasitic inductance matrix under 300 MHz condition is adopted for further behavior model simulation.

Behavior model simulation on SPICE

After the equivalent parasitic component model is exported from Q3D, the effects of different types of decoupling capacitors on the PCB are taken into account. Due to the capacitance decay after applying a DC voltage on a multi-layer ceramic capacitor (MLCC), it’s important to consider the equivalent circuit of each individual MLCC under certain DC voltage bias conditions. Each consideration should be based on the MLCC’s operating voltage. Figure 3 shows the circuit configuration for the behavior model simulation on SPICE.

Figure 3 A circuit can be configured with a behavior model simulation. Source: Monolithic Power Systems

Table 1 shows the simulation and measurement conditions based on the schematic shown in Figure 3.

Table 1 The data shows the results of experimental test bench. Source: Monolithic Power Systems

Optimizing parasitic inductance

To suppress VDS spike without compromising efficiency, it’s vital to optimize parasitic inductance on the PCB and package. With advanced package technology, input capacitors can be integrated in the package to shorten the decoupling path (Figure 4). Paralleling the embedded capacitors in the package can effectively reduce the equivalent parasitic inductance on the DrMOS.

Figure 4 A 3D DrMOS structure with embedded capacitors optimizes the VDS spike. Source: Monolithic Power Systems

Table 2 shows the equivalent parasitic inductance and VDS spike when utilizing different decoupling capacitor configurations on DrMOS.

Table 2 Equivalent parasitic inductance and VDS spike are shown with different capacitor configurations. Source: Monolithic Power Systems

As the simulation results in Table 2 show, not only is the equivalent parasitic inductance lowered, but the VDS spike on MOSFET is also suppressed. Moreover, thanks to the MLCC’s low-ESR characteristics, no additional power loss is generated on the embedded input capacitors. Therefore, it’s possible to add different embedded input capacitors to reduce parasitic inductance in DrMOS applications.

DrMOS with embedded capacitors

This article has explained the effect of parasitic inductance on the VDS switching spike, as well as several methods to prevent an avalanche breakdown on the MOSFET due to the VDS switching spike. To quantify the effects of parasitic inductance on the VDS switching spike, parasitic inductance modeling is first introduced, and then behavior modeling on SPICE is proposed.

The results obtained via SPICE closely matched the experimental results for DrMOS solutions such as the MP87000-L, which means the behavior model can accurately predict the risk of an avalanche breakdown on the MOSFET.

To effectively suppress the VDS spike without any tradeoffs, embedded capacitors in the package were introduced. The behavior model simulation confirmed that these capacitors can reduce the equivalent parasitic inductance, and thus lower the VDS spike without additional loss.

Andrew Cheng is applications engineer at Monolithic Power Systems (MPS).

Lion Huang is senior staff applications engineer at Monolithic Power Systems (MPS).

Related Content

• Be aware of capacitor parasitics
• Parasitic inductance of a bypass capacitor
• Decreasing parasitic capacitance in IC layouts
• Power Supply Design Notes: Noise and Spikes
• Effects of Switching Frequency on Transient Response

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In Bluetooth LE (BLE), security is a multifaceted beast. Learn the three main security modes of BLE, along with five critical BLE security procedures.

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Recently my £350 Bluetooth dongle had it stupid micro usb connector snap off. I have a 3D printer so I’m going to print a new case to contain one or two 18650 or 21700 batteries. I’ve found a PCB on Amazon that takes a USB-C connection and charges 18650/21700. I know the basics of electronics but wanted to double check before I blow up this £350 dongle Since the battery on it is a 3.7v and 18650/21700 are 3.7v too, can I just go from my 18650 bms to the connector where the old battery is directly? Or will I fry something? I’m worried that it could get fried when charging, I can’t find any specs for the battery it currently has. I won’t be charging the new battery through the dongle as the USB connector has broken off. Instead of trying to fix the traces and add a new one, I want to 1. Replace the battery with something bigger, and 2. Have a way to charge this Thanks for any help :) submitted by /u/A_MrBenMitchell [link] [comments]

This is a capacitive touch sensing number pad for a lock. I've not yet tested it, but the touch sensor is self calibrating, so it should work. I have tested that the sensor works with a loop of wire through the plastic sheet. I used a knife to cut out the traces and pads, but I used a printed template exported from Kicad, so I think I can still call it a "printed" circuit board. I'm aware that trace 5 is broken and has to be repaired. I've also been made aware that lock numpads and computer numpads have the keys in different orders, and I used the wrong one. submitted by /u/MikemkPK [link] [comments]

In this roundup, we review the ways RISC-V is making its mark in the computing world—from small-scale gaming projects to large-scale corporate initiatives.

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CloudSure provides continuous, proactive validation to harness cloud-native efficiencies and ensure reliable operations

Spirent Communications plc, the leading provider of test and assurance solutions for next-generation devices and networks, today announced availability of the industry’s first fully cloud-native solution to help communication service providers (CSPs) and cloud-native network function (CNF) vendors ensure resilient 5G services. An automated test platform, Spirent CloudSure evaluates and validates CNF resiliency within 5G networks with comprehensive testing capabilities to help ensure reliable service delivery, while reducing operational costs, and optimizing customer experience.

“Cloud-native environments represent a revolutionary new technical approach that breaks a handful of highly reliable, vertically integrated 5G functions into thousands of individual software components that run on a cloud optimized for performance and cost, but not reliability,” said Glenn Chagnot, Senior Director of Product Management for Cloud Solutions at Spirent. “Cloud-native marginalizes traditional testing and visibility approaches, demanding completely new processes and tooling to realize the potential benefits. CloudSure provides proactive, pre-deployment validation to test 5G services with real-world traffic operating on an imperfect cloud to ensure services are resilient and always available in operations.”

CloudSure has been engineered to help network operators deliver robust and resilient 5G services to end users in the complex, highly dynamic, cloud-native world. It enables:

• Reliable service delivery: Confirms 5G cloud-native network functions operate reliably under the most challenging cloud conditions for uninterrupted service delivery and long-term revenue growth.
• Reduced operational costs: Optimizes resource utilization and validates complex fault recovery mechanisms to avoid costly outages, 5G service interruptions and reduce operating expenses.
• Enhanced customer experience: Ensures resilient 5G service design, configuration, and performance to deliver high-quality user experiences to improve customer satisfaction and retention.
• Competitive advantage: Enables reliable, high-performing 5G services that meet customer expectations consistently, for a competitive edge in 5G and to attract new customers.

“Cloud-native deployment models are emerging as the foundation of 5G networks, yet CSPs are grappling with the challenge that each CNF has unique performance expectations within the cloud environment,” said Gorkem Yigit, Principal Analyst at Analysys Mason. “Spirent CloudSure steps in to help CSPs gain control over the complexity of these environments through validation, enabling them to deliver high-quality 5G services while realizing the efficiencies and operational benefits of the cloud.”

Ensuring 5G services survive cloud failures and degradations with minimal or no impact to users is essential to successful cloud-native technology adoption. A proactive approach and deeper cross-functional coordination are required to manage the complex and dynamic new environment, to get ahead of technology changes and gain visibility into the new, interdependent cloud-native worlds, with multiple vendors and constant release cycles.

CloudSure provides the new approach required by network operators to ensure 5G service resiliency, optimization and new service acceleration necessary for maximizing long-term revenue and ensuring reliable operations. CloudSure also complements Spirent’s market-leading Landslide 5G network test solution by injecting user-defined real-world cloud impairments and correlating their impact on cloud-native 5G services.

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Enables Designers to Share Data Between Embedded and AI/ML Projects, Streamlining the Creation of Edge and Endpoint AI Applications

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has created interfaces between its Reality AI Tools and its e2 studio integrated development environment, enabling designers to seamlessly share data, projects and AI code modules between the two programs. Modules for real-time data handling have been integrated in Renesas MCU Software Development Kits[1] to facilitate data collection from Renesas kits or customer hardware that use these microcontrollers (MCUs). This integration enables faster design cycles for artificial intelligence (AI) and tiny machine learning (ML) applications at the edge and endpoint of IoT networks.

Since Renesas acquired Reality AI in 2022, it has made a concerted effort to study, improve, and simplify AI design. Reality AI Tools, a software environment built to support the full product development of AI applications, allows users to automatically explore sensor data and generate optimized models. Now Renesas is providing a seamless data pipeline between Reality AI Tools and the e2 studio environment used to program Renesas MCUs. Sensor data collected from Renesas MCU development kits and visualized and labelled in e2 studio can now be transferred to associated projects in Reality AI Tools with the push of a button. In addition, users now have the ability to download and integrate AI/ML classifiers generated in Reality AI Tools from within e2 studio.

“Successful AI implementations are built by developing and training models with real world input from sensor data,” said Mohammed Dogar, Vice President of Global Business Development and Ecosystem at Renesas. “By providing seamless data sharing between our Reality AI Tools and e2 studio products, we’re providing the market’s best solution to enable designers to quickly build accurate and powerful AI applications.”

In addition to data transfers, Renesas is providing cross-platform project awareness between embedded and AI environments. Users can now synchronize and transfer lists of projects in e2 studio from Reality AI Tools. They can also associate an e2 studio project with a Reality AI Tools project and create a new Reality AI Tools project from within e2 studio. For a quick overview of this process, customers can watch a video demonstration available here.

Renesas is also building a library of application examples and reference solutions internally and in collaboration with ecosystem partners. The examples offer a proof-of-concept or blueprint for specific use cases. The Renesas AI application library now features over 30 reference solutions for use-cases ranging across real-time analytics, vision and voice applications.

AI Live – A Collection of Keynotes, Panel Sessions and Tech Talks all About AI

On October 12, 2023, Renesas will present an online, half-day event focused entirely on AI-related topics. In addition to keynotes from executives and industry experts, a lively roundtable discussion is planned. Attendees will also be able to choose from a host of tech talks delving into details of various aspects of AI. Visit the Renesas AI Live event page to register and view the full agenda.

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Took a broken CD V-700 apart and replaced the insides with a microcontroller and a new detector. submitted by /u/FingerNailGunk [link] [comments]

Learn how to simulate a switching voltage regulator with a voltage-controlled PWM waveform in LTspice.

Forgot to order 0R2 resistors in my BOM. Oh well, time for some good old fashioned botching to save the day. submitted by /u/DolfinButcher [link] [comments]

Armed with specifications well suited to data center and network infrastructure needs, these new MEMS-based oven-controlled crystal oscillators (OXCOs) ensure robust precision timing.

Microcontroller suppliers are striving to bolster device-to-cloud connectivity by adding software tools that simplify the Internet of Things (IoT) links to major cloud platforms. Case in point: STMicroelectronics has released software that simplifies connectivity for devices built around its STM32H5 microcontrollers to AWS IoT Core and Microsoft Azure IoT Hub.

The X-CUBE-AWS-H5 and X-CUBE-AZURE-H5 expansion packages feature a set of libraries and application examples for STM32H5 microcontrollers to facilitate secure connection to the AWS and Azure cloud platforms, respectively.

Figure 1 The new software for STM32H5 MCUs leverages ST’s Secure Manager for protected connection to cloud IoT platforms. Source: STMicroelectronics

The sample applications illustrate device-to-cloud connectivity along with network configuration and data publishing. For instance, the application example in the X-CUBE-AZURE-H5 expansion package handles Azure messages, methods, and twin update commands.

These expansion packages also leverage ST’s embedded security software, Secure Manager, to securely connect STM32H5 microcontrollers to AWS and Azure cloud platforms. Secure Manager provides isolation properties that facilitate protecting the intellectual property of multiple owners on the same platform. This multitenant IP protection is part of a comprehensive set of services that protect the confidentiality and integrity of assets through development, manufacturing, and in the field.

STM32H5 microcontrollers, based on Arm Cortex-M33, are programmed with their own immutable identity at the ST factory. That, combined with ST’s Secure Manager, simplifies registering smart devices to AWS and Azure cloud platforms and removes the need for costly infrastructure otherwise necessary to keep the identities of IoT objects secret during their production.

Figure 2 STM32H5 Discovery kit lets developers easily and securely connect their STM32H5-based prototypes to cloud platforms like AWS IoT Core. Source: STMicroelectronics

Moreover, devices in production and those in the field can also benefit from remote provisioning and administration of credentials via third-party service providers. That’s because Secure Manager stores the credentials needed to connect to AWS and Azure IoT Hub, as well as other device secrets and assets, within the STM32H5 microcontroller.

The STM32H5 microcontroller, introduced in March 2023, is the first to support Secure Manager and target PSA Certified level 3 and SESIP3 certifications. The MCU’s security features simplify the process for developers to securely provision and manage high-performance IoT devices.

Developers can also take advantage of the powerful services offered by AWS and Azure cloud platforms to transform the data collected from their devices into actionable insights.

Related Content

• What’s Next for the Microcontroller?
• The Building Blocks of Edge Computing
• MCU dev kit secures your connection to the cloud
• Smart and Secure Embedded Solutions for IoT Design
• Imagining What Can Be Done to Take IoT to Next Level

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UV LED maker Nitek Inc of Columbia, SC, USA has filed a patent infringement lawsuit against South Korea’s Photon Wave Co Ltd in the Eastern District of Texas...

Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is pleased to announce the 2023 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on September 14 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.

The winners of the Best-in-Class Awards are chosen based on five main criteria: Strategically partnering with the Mouser team, promoting product lines and working together on new product launches, finding creative solutions to grow market share mutually for both companies, maximizing Mouser’s unique value proposition within their own businesses, and championing Mouser within their organizations.

“We are incredibly excited to honor these ten talented individuals across our large base of suppliers. Each one has played a significant role in helping us to not only support our large and growing customer base, but also to help grow Mouser sales and share in the competitive electronics marketplace,” said Jeff Newell, Mouser Electronics Senior Vice President of Products. “We are grateful for these outstanding professionals and congratulate each of them for winning the Mouser Best-in-Class Award.”

2023 Mouser Best-in-Class Award Winners:

• Mary Benetti-Condon, Bel
• Sabine Colen, Analog Devices
• Tim Fredricks, Advantech
• Kris Lafko, u-blox
• Lora McIlheran, 3M
• Dennis Nesterov, Amphenol
• Younga Pearson, EATON
• Ron Peterson, Nexperia
• Mike Sewart, Molex
• Jill Wagar, Omron

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announces a global distribution agreement with MediaTek, a world leader in developing innovative systems-on-chip (SoC) for mobile devices, home entertainment, connectivity and IoT products.

“This global agreement with MediaTek continues our commitment to providing the latest in highly-integrated semiconductors,” said Andy Kerr, Vice President of Supplier Management at Mouser. “Design engineers will have easy access to MediaTek’s world-class SoCs, backed by Mouser’s unsurpassed customer service and best-in-class logistics.”

“With Mouser Electronics as a global channel partner, MediaTek can better support our customers and enhance our worldwide distribution network,” said CK Wang, MediaTek Vice President & General Manager, Internet of Things. “By capitalizing on Mouser’s excellent supply-chain services and support, we can expand our global presence and get our products into the hands of design engineers even quicker.”

Mouser now offers MediaTek’s Genio portfolio of power-efficient, high-performing IoT SoC and smart modules. MediaTek Genio is a complete platform stack for the IoT with powerful and ultra-efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, bringing these devices to market faster.

The Genio platform includes the Genio 1200 (MT8395), a flagship-grade SoC developed for demanding AI and performance-centric IoT applications such as advanced smart home appliances, industrial IoT applications and demanding AI-embedded devices. The Genio 700 (MT8390) is designed for smart home, interactive retail, industrial and commercial applications. It provides highly responsive edge processing, advanced multimedia capabilities, a wide range of sensors and connectivity options, and support for multitasking OS. The Genio 500 (MT8385) is a highly capable and efficient IoT platform designed for mobile, home or commercial IoT applications that require responsive edge processing, advanced multimedia capabilities, connected touchscreen displays and a multitasking OS.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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• Mind AI Unveils Vision for a New Era of Artificial Intelligence at FICCI Event
• FICCI’s Summit Emphasises the Growing Demand for AI-related Skills

The Federation of Indian Chambers of Commerce and Industry (FICCI) successfully concluded the second day of its 14th edition of the Global Skills Summit, centred around the theme “Building Skills. Empowering Youth. Creating Future.” The focal point of the day’s discussions revolved around the ‘Future of Work in AI,’ with notable contributions from industry leaders.

The highlight of the event was a captivating address by Dr Jung Hwan (Paul) Lee, Founder & CEO of Mind AI, a prominent Korean company specialising in artificial intelligence. Dr Lee delivered an enlightening session on the ‘Future of Work in AI’ and unveiled insights into Korea’s National Strategy for Artificial Intelligence. During his speech, he emphasised the profound impact of AI on our future, stating, “AI is not just about enhancing efficiency; it will completely reshape the foundations of businesses and organizations across various sectors.”

Dr Lee also provided valuable statistics on the growth of the AI market, forecasting a remarkable 37.3% Compound Annual Growth Rate (CAGR) from 2023 to 2030. He further highlighted exponential growth in specific AI sectors, with a 40.4% CAGR in Global Natural Language Processing, 23.6% in Global Conversational AI, and 39.3% in Global Robotic Process Automation. Furthermore, Dr Lee shed light on Mind AI, describing it as both a new class of AI and an extensive ecosystem.

In the context of AI’s increasing importance, Dr Lee emphasized that businesses must adapt within the next 4-5 years or risk being left behind. The implementation of AI necessitates a higher demand for a broader set of skills, including digital proficiency, analytical capabilities, and critical thinking. He stated, “General and elementary knowledge of AI is becoming essential, often at a basic level, such as the ability to use a computer or smartphone. Analytical skills are gaining prominence as automation of routine tasks allows workers to tackle more complex assignments, requiring specialized knowledge, comprehension, and the application of innovative ideas.”

As part of Korea’s National Strategy for Artificial Intelligence, Dr Lee outlined various policy initiatives. These include an AI convergence curriculum across different life cycles and job types, interchangeability between AI and other fields at the university level, AI basic literacy training in the military through M-MOOC, and collaboration between Coursera and K-MOOC to provide digital skill courses. Korea’s commitment to nurturing AI talent and boosting youth employment rates was evident, with policies introduced over the past two decades, the development of National Competency Standards (NCS) for vocational high schools, and the establishment of Meister High Schools targeting employment rates exceeding 90% by 2022. Additionally, the youth employment quotas were raised from 3% to 5%.

Dr Lee concluded his session by introducing the innovative Mind AI, which transforms natural language inputs into internationally patented data structures referred to as “canonicals.” This transformation enables the Mind AI engine to make connections, perform logical operations, and generate intelligent responses.

The FICCI’s 14th Global Skills Summit continues to be a platform for insightful discussions on the ever-evolving landscape of skills and technology, driving India’s workforce towards a future defined by innovation and adaptability.

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