Microelectronics world news

Built on a wide-bandgap GaN HEMT process, Teledyne’s TDSW84230EP reflective SPDT switch covers 30 MHz to 5 GHz, handling 20 W of continuous power. It is intended to replace PIN diode-based RF switches commonly used in the RF front ends of tactical and military communication radios.

The TDSW84230EP tolerates up to 900 mA/mm of saturation current, leveraging GaN’s high breakdown voltage and carrier density. Encased in a compact 3×3×0.8-mm, 16-pin QFN package, it offers 0.2-dB insertion loss and 45-dB port isolation, providing enhanced efficiency and saving board space over PIN diode architectures.

Qualified for operation over the military temperature range of -55°C to +125°C, the TDSW84230EP requires a positive supply voltage of 2.6 V to 5.25 V. Its internal charge pump is disabled to eliminate charge pump spurs in low-noise applications, while a -18-V supply is needed on the VCP pin.

The TDSW84230EP GaN RF switch is available now in commercial versions from Teledyne HiRel and authorized distributors.

TDSW84230EP product page 

Teledyne HiRel Semiconductors 

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At this month’s CES 2025 show, Murata unveiled what is claimed to be the world’s smallest 006003-inch (0.16×0.08 mm) chip inductor. This development offers a 75% volume reduction compared to the previous smallest product, the 008004-inch (0.25×0.125 mm) inductor.

“Following our success in introducing the world’s smallest multilayer ceramic capacitor (MLCC) in September 2024, our engineering teams are now developing a pioneering 006003-inch size chip inductor to further meet market demands,” says Takaomi Toi, general manager of Inductor Product Development at Murata Manufacturing.

“With the creation of the world’s smallest class prototype, we’re confident that this product represents an exciting addition to Murata’s extensive portfolio of market-leading chip inductors. This development continues to demonstrate Murata’s commitment to innovation and also marks a significant milestone in our quest to support the miniaturization and enhanced functionality of future electronic devices,” Toi said.

For more information about this chip inductor development, please contact Murata here.

Murata Manufacturing

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GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet Summit, GENIO EVO is the second generation of MZ’s flagship GENIO cross-fabric platform for system design. Like its predecessor, GENIO EVO enables co-design of chiplets, dies, silicon interposers, packages, and surrounding PCBs to meet area, power, and performance targets.

GENIO EVO integrates seamlessly with existing commercial implementation platforms or custom EDA flows through plugins. Operating at the architectural level, it provides optimal system choices for 2.5D or 3D multi-die designs. A new user interface supports a cross-hierarchical, 3D-aware design methodology that streamlines the system design process. By integrating IC and advanced packaging design, it ensures full system-level optimization, shorter design cycles, faster time-to-manufacturing, and improved yields.

The platform identifies and analyzes thermal and mechanical failures. It supports architectural exploration and what-if analysis in the early design stages to improve implementation predictability. By planning and managing high-pin-count interconnects in complex multi-fabric designs, it anticipates and avoids downstream thermal and mechanical issues.

GENIO EVO is available for immediate licensing. For more information, click the link below.

MZ Technologies

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has formally released the GRF0020D and GRF0030D, the first in a new class of GaN-on-SiC HEMT power amplifiers being developed by the company...

Whether its buck, boost, or buck/boost, internal or external switch, milliamps or tens of amps, a literal cornucopia of programmable output switching regulator/converter chips are commercially available. While the required external Ls and Cs (of course) vary wildly from topology to topology and chip to chip, (almost) all use exactly the same basic two-resistor network for output voltage programming shown in Figure 1. Its example buck type regulator was picked more or less arbitrarily, so please ignore the L and Cs and just focus on R1, R2, and (later) R3.

Figure 1 The (almost) universal regulator output programming network where Vout = Vsense(R1/R2 + 1) = 0.8v*(11.5 + 1) = 10v.

Wow the engineering world with your unique design: Design Ideas Submission Guide

For reasons known only to gurus of the mystic and marvelous monolithic realm, the precision Vsense feedback node voltage varies from type to type over a roughly 3:1 range from 0.50v to 1.5v. Recommended values for R1 vary too. 

The point is the topology doesn’t vary. All (or at least most) conform faithfully to Figure 1. This surprising uniformity becomes very useful if your application requires DAC control of the output voltage. See Figure 2 for how this can be done with a positive polarity DAC and just one added resistor: R3.

Figure 2 Regulator output programming with a DAC and the KISS1 network where Vout = (Vc)*(R1/R2) = (2.5 to 0v) 4 = 0 to 10v.

Given reasonable choices for the DAC (e.g., 2.5v), numbers for R1 and Vsense from the regulator chip datasheet, and Vomax from your application requirements, here’s the KISS1 arithmetic:

1. R2 = R1 Vcmax/Vomax
2. R3 = R1/(Vomax/Vsense – R1/R2 – 1)

And, in the grand tradition of the KISS1 principle, that’s it. Ok, ok. Except maybe for a couple of (minor?) caveats. For example:

1. Expression 2 above, and therefore the necessary value for R3, must shake out positive. I can’t think of a practical case where it wouldn’t, but there’s probably some perverse permutation of parameters out there where it won’t, and implementing negative resistors isn’t particularly simple.
2. The relation between Vout and Vc is inverse. So, the digital version of Vc must be 1’s complemented (a totally KISS-bit of software arithmetic to flip all the bits, so 0s become 1s, and 1s become 0s) before being written to the DAC register.
3. Vin must be adequate for the chosen chip to generate the chosen Vomax when Vc = 0. Duh.

So maybe it’s not really totally KISS1, just mostly.

1 Famous KISS principle: Is a footnote really necessary?

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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Multi-national industrial and energy company METLEN Energy & Metals of Athens, Greece – which operates the only vertically integrated bauxite, alumina and primary aluminium production unit in the European Union (EU) with privately owned port facilities – says that the Metallurgy Committee, in a joint session with the Capital Allocation Committee, has made the final investment decision (FID) to proceed with implementing a new €295.5m plan for the production of bauxite, alumina and gallium...

The Vermont Gallium Nitride (V-GaN) Tech Hub — a consortium led by the University of Vermont (UVM) and including GlobalFoundries and the State of Vermont — has been awarded $23.7m in federal funding from the US Economic Development Administration (EDA)...

My first isolated power supply!! It does 200mA fused, +-9V. The actual max current is a mystery due to the salvaged transformer (from a device that is at around 3 times as old as me), so I took a relatively conservative guess. t's fully linear, with less than 1mV PARD at full load (using a very janky test setup though). I have a higher power (1.25-18V, 0-3A) power supply made of a buck regulator module with a laptop power supply, but it not isolated, and the ripple is horrible. I only made this so that I could test parts of my next power supply, which will be a more legit, 0-20V, 0-2A lab power supply. I'm going to box it up later, but for now it does work. submitted by /u/Triq1 [link] [comments]

DC-to-DC converters are electronic devices that change one DC voltage level to another. They are widely used in power supplies for electronic devices, electric vehicles, and renewable energy systems. Here are the main types:

1. Linear Regulators:
   • Simple and cost-effective.
   • Converts excess voltage into heat, making them inefficient for large voltage differences.
   • Example: Low Dropout Regulators (LDO).
2. Switching Converters:
   • Efficient and suitable for large voltage differences.
   • Types:
     • Buck Converter (Step-Down):
       • Reduces input voltage to a lower output voltage.
     • Boost Converter (Step-Up):
       • Increases input voltage to a higher output voltage.
     • Buck-Boost Converter:
       • Can increase or decrease voltage depending on the configuration.
     • Cuk Converter:
       • Provides an inverted output voltage and regulates it.
     • SEPIC (Single-Ended Primary Inductor Converter):
       • Allows for voltage output either higher or lower than the input.
     • Flyback Converter:
       • Common in isolated power supplies for low-power applications.
     • Push-Pull Converter:
       • Symmetrical design for higher power and efficient isolation.
3. Charge Pump Converters:
   • Use capacitors for energy storage and voltage conversion.
   • Lightweight and efficient for low-power applications.
4. Isolated Converters:
   • Separate the input and output using transformers or optocouplers for safety.
   • Examples: Flyback and Forward Converters.

DC-to-DC Conversion Formula

The power balance principle is used to derive relationships in DC-to-DC converters. The formulas vary based on the converter type:

DC-to-DC Converter Examples

1. Consumer Electronics:
   • USB power adapters using buck converters to step down 12V to 5V.
2. Automotive:
   • Electric vehicles use DC-DC converters for powering 12V systems from a high-voltage battery pack (e.g., 400V or 800V).
3. Renewable Energy:
   • Solar power systems employ boost converters to increase panel voltage for battery charging.
4. Data Centers:
   • Intermediate bus architectures use isolated converters to step down 48V to server-operable voltages (e.g., 12V or 5V).
5. Industrial:
   • Power supplies for robotics and sensors using isolated flyback converters for safety.

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Nuvoton Technology Corporation Japan (NTCJ) announced today the launch of its industry-leading(*) indigo semiconductor laser, which emits an optical output power of 1.7 W and a wavelength of 420 nm. This product contributes to the miniaturization and cost reduction of optical systems. Additionally, when combined with our mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm), it serves as an alternative light source solution to mercury lamps, contributing to the realization of a sustainable society.

(*) As of January 15, 2025, based on our research of semiconductor lasers emitting at a wavelength of 420 nm.

Achievements:

• Achieves industry-leading optical output power of 1.7 W at a wavelength of 420 nm, contributing to increased design flexibility and miniaturization of optical systems.
• Realizes high efficiency and long-term reliability through proprietary optical design and heat dissipation technology, reducing the running costs of optical systems.
• By combining this product with existing mass-produced products, it is possible to provide alternative light source solutions to mercury lamps.

Mercury lamps emit bright lines of light such as the i-line (365 nm), h-line (405 nm), and g-line (436 nm) [2], and are used as industrial light sources for applications such as resin curing and exposure. However, the mercury lamps have technical challenges including large light source size and high power consumption. Additionally, since they use mercury, mercury lamps are subject to regulations in Japan and other countries because of health and environmental concerns. Therefore, alternative light sources are expected to be developed.

Aiming to replace the mercury lamps, we have been developing high-efficiency and long-term reliability semiconductor lasers. We have now started mass production of an industry-leading indigo semiconductor laser with an optical output power of 1.7 W at a wavelength of 420 nm, close to the g-line of the mercury lamps. This new product achieves both high efficiency and long-term reliability through proprietary optical design and heat dissipation technology. Furthermore, by combining it with our already mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm), we can provide alternative light source solutions to the mercury lamps, contributing to the realization of a sustainable society.

Details of the new product and alternative light source solutions to the mercury lamps will be exhibited at our booth at SPIE Photonics West 2025 in San Francisco, USA, and LASER World of PHOTONICS 2025 in Munich, Germany. We look forward to welcoming you.

Features:

• Achieves industry-leading optical output power of 1.7 W at a wavelength of 420 nm, contributing to increased design flexibility and miniaturization of optical systems.

This product achieves an industry-leading optical output power of 1.7 W at a wavelength of 420 nm, close to the g-line of mercury lamps, in a compact TO-56 CAN package [3]. Using this high-output, compact product enhances the design flexibility of light source devices, enabling the development of smaller light source devices compared to the mercury lamps.

• Realizes high efficiency and long-term reliability through proprietary optical design and heat dissipation technology, reducing the running costs of optical systems.

With over 40 years of experience and more than 3 billion semiconductor lasers shipped for optical discs, we have developed extensive design and manufacturing expertise in semiconductor lasers. Our newly developed indigo semiconductor laser integrates proprietary optical design and heat dissipation technology, achieving both high efficiency and long-term reliability. Compared to the mercury lamps, this reduces power consumption and the frequency of light source replacements, thereby lowering the running costs of light sources.

• By combining this product with existing mass-produced products, it is possible to provide alternative light source solutions to mercury lamps.

This product, which emits laser light at a wavelength of 420 nm close to the g-line of mercury lamps, can be combined with our mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm) to serve as alternative light sources for the i-line (365 nm), h-line (405 nm), and g-line (436 nm) of mercury lamps. Additionally, by adjusting the output power ratio of each semiconductor laser according to the application, it is possible to achieve highly flexible optical designs that were not possible with the mercury lamps.

Applications:

Alternative light sources for mercury lamps, Laser Direct Imaging (LDI) light sources [4], laser welding processing light sources, 3D printer light sources, etc.

Product name: KLC420FS01WW

Specification:

Part number	KLC420FS01WW
Wavelength	420 nm
Output power	1.7 W
Package type	TO-56 CAN

Alternative light source solution to mercury lamps Definitions:

[1] Indigo Semiconductor Laser:

Our term for semiconductor lasers that emit laser light with a peak wavelength approximately in the range of 420 nm to 440 nm.

[2] i-line, h-line, g-line:

Names of the bright lines of mercury lamps, with emission peaks at 365 nm, 405 nm, and 436 nm, respectively.

[3] TO-56 CAN:

An industry-standard CAN-type package with a diameter of 5.6 mm.

[4] Laser Direct Imaging (LDI):

A technology that uses lasers to directly expose circuit patterns onto substrates.

SPIE Photonics West 2025

The world’s largest optics and photonics exhibition, organized by the international society for optics and photonics, SPIE, will be held in San Francisco, USA, from Tuesday, January 28 to Thursday, January 30, 2025. This event will showcase the latest optical technologies, including lasers and optical devices.

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INDIA – Keysight Technologies, Inc. launched AppFusion, a network visibility partner program that integrates third-party security and monitoring solutions directly into its network packet brokers. The program integrates market-leading technologies from Forescout, Instrumentix, and Nozomi Networks, enabling customers to streamline network and security operations (NetOps/SecOps) while significantly reducing infrastructure costs. This all-in-one, multi-vendor solution helps IT professionals reduce capital and operational expenses while improving security monitoring and performance.

Enterprise IT and security operations (SecOps) teams need real-time network traffic monitoring to troubleshoot performance issues, detect cyber threats, and maintain operational scale and compliance. Traditionally, this required separate hardware appliances, each running different monitoring tools. Keysight’s Vision Network Packet Brokers eliminate this complexity by integrating partner software directly into a single hardware platform.

Key benefits of AppFusion include:

• Significant reduction in hardware costs by consolidating multiple servers into one Vision appliance.
• Simplified deployment with pre-integrated, best-in-class security solutions.
• Centralized management through a single interface for all monitoring tools.
• Easy scalability with on-demand activation of additional monitoring capabilities.

“The more technology providers integrate and deliver complete solutions, the less time IT and security teams need to spend configuring and managing performance and security,” says Recep Ozdag, Vice President and General Manager, Network Visibility Solutions at Keysight. “Our new partner integration program fuses network visibility and monitoring in a new way to streamline deployment of complete, cost-efficient monitoring solutions for real-time threat detection and troubleshooting of performance issues.”

Initial AppFusion integrations include:

• Forescout platform with eyeInspect security monitoring technology.
• Instrumentix xMetrics trade flow performance monitoring and analytics software.
• Nozomi Networks’ AI-powered security and risk management solutions.

“Forescout has a long history of providing market-leading OT solutions to the most security-conscious organizations in the world. We’re extremely pleased to partner with Keysight on their AppFusion program,” says Rob McNutt, Chief Strategy Officer at Forescout. “Deploying the Forescout Platform within a visibility fabric delivers an unparalleled and comprehensive view that reduces blind spots and monitoring bottlenecks to fortify security across IT, operational technology (OT), internet of things (IoT), and internet of medical things (IOMT) environments.”

As with OT and IoT environments, the financial markets sector benefits from tightly integrated visibility and monitoring solutions. “Time is money in financial markets, where nanoseconds of delay can impact the value of trades,” says Clive Posselt, Commercial Director at Instrumentix, a newly announced Keysight alliance partner. “Delivering our xMetrics trade flow monitoring software onboard a Keysight visibility appliance can provide the buy and sell side, as well as exchanges and other liquidity venues, real-time access to the most reliable trade plant performance data, so they can optimize execution outcomes and differentiate their services.”

Chet Namboodri, Nozomi Networks Senior Vice President of Global Business Development, concurs: “Cyber-physical systems in enterprise and industrial environments require equal and, in many cases, higher performance levels for security monitoring and risk management than traditional IT networks. Integrating Nozomi Networks’ AI-powered security and risk management solutions with Keysight appliances saves customers time and money while achieving the most reliable, innovative, and highest caliber of threat monitoring and risk management available for OT, IoT, and cyber-physical systems.”

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Bluetest and Rohde & Schwarz extend their long-established collaboration and have integrated the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test systems (RTS) to perform MIMO stress testing of IEEE 802.11be stations as well as access points under realistic conditions.

Bluetest specializes in reverberation chambers, such as the RTS65, which are designed for efficient over-the-air performance evaluation of wireless devices. In contrast to anechoic test chambers, reverberation chambers extensively reflect an RF signal inside the chamber, creating a Rayleigh faded multipath RF environment. This environment closely mirrors real-world indoor and city conditions, making it ideal for evaluating the antenna and radio performance of modern multi-antenna (MIMO) and multi-carrier devices as used in WLAN, 4G, and 5G.

The setup is operated using the Bluetest Flow control software, an integrated test environment for complex wireless solutions. By integrating the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow software, WLAN developers utilizing the R&S CMX500 can now leverage Bluetest’s reverberation chamber technology in the development of their advanced WLAN stations and access points.

Wi-Fi 7 (IEEE 802.11be) is engineered for extremely high data throughput and capable of handling tens of gigabits of data per second with low latency. It caters to the increasing demand for ultra-high-definition video streaming, virtual reality, and augmented reality applications. The key components facilitating higher throughput include an increased channel bandwidth of 320 MHz, up to 16 spatial streams, 4096 QAM modulation, and multi-link operation (MLO).

During the development of WLAN devices, measurements of the antennas as well as RF transmitter and receiver characteristics must be conducted under real-world conditions in signaling mode. With MLO being a key feature in Wi-Fi 7, a test environment that provides multiple RF chains is crucial. The R&S CMX500 one-box tester from Rohde & Schwarz, featuring integrated Wi-Fi 7 test functionality, is a multi-technology multi-channel signaling tester. Its flexibility, support for multiple radio technologies, and embedded IP test capabilities make it a versatile solution for a broad range of Wi-Fi 7-specific tests.

Christoph Pointner, Senior Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “Our collaboration with Bluetest has resulted in a unique synergy between our CMX500 one-box tester and their RTS technology. This long-established partnership has enabled us to push the boundaries of WLAN testing, providing a real-world environment that is integral to the development of cutting-edge wireless solutions.”

Kjell Olovsson, Bluetest CEO, said: “Teaming up with Rohde & Schwarz and integrating their CMX500 one-box tester into our Flow software broadens our WLAN testing capabilities. Now we are able to offer an unprecedented testing environment for the latest Wi-Fi 7 devices, reflecting our commitment to supporting the evolution of wireless communication.”

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7layers successfully validated its Interlab Test Solution Bluetooth RF for Channel Sounding qualification, running with the R&S CMW wideband radio communication tester. Developed jointly with Rohde & Schwarz and leading chipset manufacturers, it is the first test platform listed by the Bluetooth SIG to perform Channel Sounding qualification testing with Bluetooth RFPHY release 6.0. Bluetooth Channel Sounding is a new secure fine ranging feature that will enable unprecedented positioning accuracy for consumer and commercial applications.

For many years, 7layers, a Bureau Veritas Group company, and Rohde & Schwarz have collaborated in developing Bluetooth RF test solutions for Bluetooth Qualification Test Facilities (BQTF), Bluetooth Recognized Test Facilities (BRTFs) as well as for chipset and module vendors. Thanks to this close partnership with Rohde & Schwarz and leading chipset vendors, 7layers has now validated the Channel Sounding feature within its Interlab Test Solution Bluetooth RF. Bluetooth SIG has listed it as a validated test solution for Channel Sounding qualification testing with Bluetooth RFPHY version 6.0.

Bluetooth Low Energy devices with improved positioning accuracy
The rollout of Bluetooth Low Energy devices supporting Channel Sounding will significantly improve positioning accuracy for ‘Digital Key’ and ‘Find My’ applications. In addition, these devices will feature improved power consumption and superior security, all critical features for Bluetooth enabled products. Since September, the Bluetooth SIG has introduced test cases to qualify these new features.

The Interlab Test Solution Bluetooth RF fulfils all qualification requirements for Bluetooth Classic, Low Energy (LE), including Direction Finding, as well as the latest Core feature Bluetooth Channel Sounding. Comprehensive test automation and the highly accurate implementation of the Bluetooth test cases are crucial to ensure compliance to the Bluetooth specifications.

The Interlab Test Solution for Bluetooth Channel Sounding runs with a wideband radio communication tester of the R&S CMW platform and offers an integrated RF path calibration, high measurement accuracy as well as precise analysis capabilities. The test platform from Rohde & Schwarz supports the corresponding RF physical layer measurements for the usage in development and for prequalification tests as a standalone box.

Frank Spiller, Manager Interlab Test Products, at 7layers emphasizes: “The industry is eagerly anticipating the qualification of a test solution for Bluetooth Channel Sounding by the Bluetooth SIG. We are proud to offer the first validated test solution, implemented thanks to the advanced test capabilities of our partner Rohde & Schwarz. We enable our customers to perform high quality and automated testing as part of the internal verification and regression process for a smooth transition to qualify products.”

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz, said: “Thanks to our close partnership with 7layers, we were able to quickly integrate the required test cases into the test solution. This means, that vendors of wireless chipsets and modules can now validate the new Bluetooth Channel Sounding feature with an R&S CMW Bluetooth RF tester and the Interlab Test Solution for Bluetooth Channel Sounding. This tester can be used for R&D tests, pre-qualification and production testing. Using the same test solution as BQTFs and BRTFs increases the likelihood of their products achieving the Bluetooth qualification on the first attempt, significantly reducing time to market.”

The Interlab Test Solution Bluetooth RF for Channel Sounding is part of the Interlab portfolio. It is now available from 7layers as qualification test solution for BQTFs and BRTFs. For further information please contact sales@interlab.com.

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Chiplets are reshaping microprocessor design by offering modularity, cost-effectiveness, and performance gains. By breaking traditional monolithic chips into smaller, specialized components, chiplets simplify design improvements and enable scalability. However, this promising technology faces several challenges hindering its broader adoption. Let’s explore these obstacles in detail.

Technological Complexity

Chiplets bring advanced design possibilities but also introduce technical hurdles. Achieving efficiency across multiple chiplets is not a straightforward task.

Interconnect Standards

One of the most prominent issues is the lack of standardized interconnect protocols. Chiplets from different manufacturers often struggle to communicate seamlessly. Current interconnect solutions, like those based on proprietary designs, limit interoperability. This forces companies to either develop their ecosystem or adhere to rigid standards, slowing innovation. A universal interconnect standard, such as Universal Chiplet Interconnect Express (UCIe), could address this bottleneck, but widespread adoption is still a distant goal.

Thermal Management

Heat dissipation becomes more complex in chiplet architectures. Each chiplet generates heat, and when these are packed tightly within a system, thermal management turns into a challenging puzzle. Standard cooling systems may no longer suffice, requiring innovative solutions like 3D stacking techniques and advanced cooling materials. Without effective heat control, performance suffers, and longevity decreases.

Market Competition

While the chiplet market is growing, it is tightly contested by industry giants and budding startups.

Dominance of Large Semiconductor Firms

Major players dominate advanced semiconductor technologies and often dictate industry trends. Companies like Intel, AMD, and TSMC hold much of the market share, making it harder for smaller businesses to compete. Their massive resources allow them to innovate and deploy at a scale that smaller competitors cannot match. This monopoly stifles competition and leads to slower industry-wide progress.

Emerging Startups and Innovations

Startups are essential for fostering innovation. However, they often face financial and technological barriers to entering the chiplet market. Disruptive ideas struggle to gain traction when pitted against well-funded incumbents. While venture capital investment in these companies is increasing, many promising ideas die because of insufficient funding or technical expertise.

Supply Chain and Manufacturing Issues

COVID-19 exposed the fragility of global supply chains, and the chiplet market is no exception. Key materials and manufacturing networks face significant setbacks.

Material Shortages

High demand for semiconductors has strained the availability of raw materials. Critical components like rare earth metals remain limited, leaving manufacturers unsure about how to fulfill orders. The situation worsens as geopolitical tensions over resource control further delay material acquisition.

Manufacturing Process Complexity

Chiplet production often relies on cutting-edge manufacturing processes, such as extreme ultraviolet (EUV) lithography. These processes are expensive, labor-intensive, and prone to errors. Scaling production while maintaining consistent quality adds to the challenge, driving up both costs and timelines.

Regulatory and Compliance Challenges

Navigating industry regulations is another hurdle for chiplet developers. Meeting global standards while protecting intellectual property (IP) rights is no easy feat.

Compliance with International Standards

International semiconductor markets impose various standards to ensure quality, safety, and compatibility. As different regions adopt different regulations, manufacturers must develop chips that satisfy multiple legal frameworks. This can increase costs and introduce engineering challenges.

Intellectual Property Issues

Efforts to integrate chiplets require collaborative innovation, which often leads to IP sharing. Disputes over patent ownership and usage rights can slow the development process. In a market where innovation drives value, IP issues remain a significant concern.

Chiplets Market Outlook 2034

The chiplet industry is set for explosive growth over the next decade. Valued at around $7.14 billion in 2023, the market is projected to skyrocket to $555 billion by 2034, reflecting a staggering CAGR of 46.47%. This surge highlights not only a growing demand for chiplet solutions but also ongoing advancements in semiconductor production. With applications ranging from data centers to consumer electronics, chiplets will likely become even more essential to the technology ecosystem.

Conclusion

While chiplets have transformative potential, the path forward is riddled with challenges. From standardization hurdles and thermal issues to supply chain constraints and regulatory obstacles, each roadblock requires careful navigation. Collaboration across industry stakeholders, investment in research, and regulatory clarity are all essential to unlock the true promise of chiplets. If these challenges can be overcome, the future of computing will be shaped by the success of the chiplet market.

The post What Challenges Does the Chiplet Market Face Today? appeared first on ELE Times.

Anritsu Corporation is pleased to announce the release of enhanced software functions for its Signal Analyzers MS2830A/MS2840A/MS2850A. These enhancements enable the analyzers to extend the spectrum measurement frequency range to encompass the millimeter-wave band by connecting VDI or Eravant external mixers.

Millimeter-wave sensing device can detect subtle changes in human body surfaces caused by breathing and heartbeat, as well as identify the position of people and objects. These advancements open up new applications in diverse fields, such as medical care, automotive, and facial-recognition security systems. Anritsu contributes to the development of a safer and more secure society by providing solutions to evaluate millimeter-waveband signals and enhancing of millimeter-wave device quality.

Development Background

The growing demand for sensing technologies using millimeter-wave radar, particularly in the 60 GHz band, has driven advancements in medical applications. This technology is also employed in facial-recognition security systems. Furthermore, automotive radar technology is undergoing advancements with the development of wideband 79 GHz band radar capable of detecting small targets such as pedestrians and bicycles at high resolution.

To accurately evaluate sensors designed for detecting mobile objects and automotive radars using ultra-wideband millimeter-wave signals, simple solutions are required to measure transmission signal characteristics.

Product Features

Anritsu’s mid-range benchtop MS2830A, MS2840A, and MS2850A signal analyzers provide high-performance capabilities and comprehensive options for wireless signal measurements across diverse applications. These models span the RF to microwave/millimeter-wave frequency bands and accommodate narrow- to wide-band signals.

For spectrum, signal, and phase-noise measurements, the measurement frequency range can be extended by installing Anritsu’s External Mixer Connection Function MX284090A. This function supports connection of a recommended external mixer from Eravant or VDI to the signal analyzer’s 1st Local Output port.

● Image-Response-Free Spectrum Measurement up to 7.5 GHz

An image response can occur when measuring with external mixers lacking preselectors to eliminate unwanted signals, causing erroneous reception of signals at different frequencies from the intended signal. Anritsu’s signal analyzers boast industry-leading* intermediate frequencies (IF) of 1.875 GHz (MS2830A) and 1.8755 GHz (MS2840A/MS2850A), facilitating conversion of received high-frequency signals to manageable frequencies for processing. This enables suppression of image-response effects up to 7.5 GHz using Anritsu’s proprietary PS (Preselector Simulation) function, facilitating measurement of hard-to-distinguish variable signals.

*At December 2024

● Simple Measurement Setup

The single coaxial-cable connection between the signal analyzer and recommended external mixers enhances flexibility in positioning the signal analyzer and allows the external mixer to be placed close to the device under test.

The MS2830A offers exceptional cost-effectiveness and is suitable for a broad range of applications, including R&D, manufacturing, and maintenance.

The MS2840A stands out with its exceptional phase noise performance and provides a comprehensive suite of options to support higher-performance measurements. These options include 2dB attenuator resolution and noise floor suppression.

The MS2850A signal analyzer function supports signal analysis at bandwidths up to 1 GHz.

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LED soldering is the process of joining electronic components of light-emitting diodes (LEDs) to a printed circuit board (PCB) or other substrates using a soldering material, typically a tin-lead alloy or lead-free solder. The process ensures proper electrical and mechanical connections between the LED terminals and the PCB.

How LED Soldering Works

1. Preparation:
   • Ensure that the PCB and LED components are clean and free from debris or oxidation.
   • Apply solder paste to the PCB pads where the LED will be placed.
2. Placement:
   • Position the LED on the solder-pasted area using precision tools like tweezers or pick-and-place machines.
3. Soldering Process:
   • Hand Soldering:
     • Use a soldering iron to heat the LED terminals and solder pads.
     • Apply solder wire to create a strong electrical connection.
   • Reflow Soldering (for mass production):
     • The PCB with the LED is placed in a reflow oven, where heat melts the solder paste, creating a secure connection.
   • Wave Soldering:
     • For through-hole LEDs, the PCB is passed over a molten solder wave to attach the components.
4. Inspection:
   • Verify the connections using visual inspection, automated optical inspection (AOI), or X-ray inspection.
5. Testing:
   • Test the soldered LED for functionality, ensuring it emits light and operates as intended.

LED Soldering Process

1. Manual Soldering:
   • Used for prototypes or small batches.
   • Involves a soldering iron and manual placement.
2. Automated Soldering:
   • Uses pick-and-place machines and reflow ovens for large-scale production.
3. Soldering Techniques:
   • Surface-Mount Technology (SMT): Common for LEDs mounted on flat PCBs.
   • Through-Hole Technology (THT): Used for LEDs requiring a stronger mechanical bond.
4. Cooling:
   • Allow the soldered assembly to cool, solidifying the solder joints.

Uses & Applications of LED Soldering

1. Consumer Electronics:
   • LED displays, backlights, and indicators in devices.
2. Automotive:
   • Headlights, tail lights, and dashboard indicators.
3. Industrial:
   • Machine vision lighting and control panels.
4. Residential and Commercial Lighting:
   • LED bulbs, tube lights, and architectural lighting.
5. Signage and Displays:
   • Advertising boards, billboards, and traffic signals.

Advantages of LED Soldering

1. Durability:
   • Provides a robust mechanical and electrical connection.
2. Scalability:
   • Suitable for mass production using automated techniques.
3. Efficiency:
   • Reflow soldering ensures uniform heat distribution and reliable connections.
4. Versatility:
   • Applicable to various LED sizes and designs.
5. Energy Efficiency:
   • LED soldering supports energy-efficient lighting technologies.

Disadvantages of LED Soldering

1. Heat Sensitivity:
   • LEDs are sensitive to high temperatures, which can damage components if not controlled.
2. Complexity:
   • Requires precision in placement and temperature control during soldering.
3. Material Costs:
   • Lead-free solders and automated equipment can increase production costs.
4. Risk of Cold Solder Joints:
   • Improper soldering can result in weak or intermittent connections.
5. Environmental Concerns:
   • Lead-based solder can pose environmental and health risks if not disposed of properly.

The post LED Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

While semiconductors remain in high demand, electronics engineers must stay abreast of associated developments that could eventually affect their work. Case in point: significant advancements in transition metal dichalcogenides (TMDs).

These two-dimensional materials are of particular interest to electronics engineers due to their structural phase and chemical composition; they possess numerous properties advantageous to electronic devices.

The 2D materials like TDM are prominent in the future semiconductor manufacturing landscape. Source: Nature

The ongoing semiconductor shortage has caused some engineers to delay projects or alter plans to acquire readily available supplies rather than those that are challenging to source. However, physical resource concentrations are more significant contributors to the shortage than actual scarcity.

When most of the critical raw materials used in semiconductor production come from only a few countries or regions, supply chain constraints happen frequently.

TDM learning curve

If it was possible to make the materials locally rather than relying on outside sources, electronics engineers and managers would enjoy fewer workflow hiccups. So, researchers are focusing on that possibility while exploring TMD capabilities. They are learning how to grow these materials in a lab while overcoming notable challenges.

One concern was making the growth occur without the thickness irregularities that often negatively affect other 2D materials. Therefore, this research team designed a shaped structure that controls the TMD’s kinetic activities during growth.

Additionally, they demonstrated an option to facilitate layer-by-layer growth by creating physical barriers from chemical compound substrates, forcing the materials to grow vertically. The researchers believe this approach could commercialize the production of these 2D materials. Their problem-solving efforts could also encourage others to follow their lead as they consider exploring how to produce and work with TMDs.

Semiconductor manufacturing is a precise process requiring many specific steps. For example, fluorinated gases support everything from surface-etching activities to process consistency. Although many production specifics will remain constant for the foreseeable future, some researchers are interested in finding feasible alternatives.

So, while much of their work centers around furthering the development of next-generation computer chips, succeeding in that aim may require prioritizing different materials, including TMDs. People have used silicon for decades. Although it’s still the best choice for some projects, electronics engineers and other industrial experts see the value in exploring other options.

Learning more about TMDs will enable researchers to determine when and why the materials could replace silicon.

TDM’s research phase

In one recent case, a team explored TMD defects and how these materials could impact semiconductor performance. Interestingly, the outcomes were not always adverse because some imperfections made the material more electrically conductive.

Another research phase used photoluminescence to verify the light frequencies emitted by the TMDs. One finding was that specific frequencies would characterize five TMDs with defects called chalcogen vacancies.

An increased understanding of common TMD defects and their impacts will allow engineers to determine the best use cases more confidently. Similarly, knowing effective and efficient ways to detect those flaws will support production output and improve quality control.

These examples illustrate why electronics engineers and managers are keenly interested in TDMs and their role in future semiconductors. Even if some efforts are not commercially viable, those involved will undoubtedly learn valuable details that shape their future progress.

Ellie Gabel is a freelance writer as well as an associate editor at Revolutionized.

 

 

Related Content

• 2D Material Beats Graphene
• Chip Makers Must Learn New Ways to Play ‘D’
• 2D TMD Materials Enabling Future Electronics
• Imec’s Van den hove: Moving to Chiplets to Extend Moore’s Law
• Semiconductor Manufacturers Must Adapt to Shifting Landscape

The post How TMDs can transform semiconductor manufacturing appeared first on EDN.

Using an Arduino to control some stepper motors and servos. submitted by /u/treftstechnologies [link] [comments]

Camera lenses were originally fully mechanical (and in some cases, still are; witness my Rokinon Cine optics suite). The user manually focused them, manually set the aperture, and manually zoomed them (for non-fixed-focal length optics, that is). Even when the aperture was camera body-controlled—in shutter-priority and fully auto-exposure modes, for example—the linkage between it and the lens was mechanical, not electrical, in nature.

Analogies between lenses and fly-by-wire aircraft are apt, however, as the bulk of today’s lenses are electronics-augmented and, perhaps more accurately, -dependent. Take, for example, optical image stabilization (OIS), which harnesses electromagnets paired with floating lens elements and multiple gyroscope and accelerometer sensors to counteract one-to-multiple possible variants of unwanted camera system movement:

• Axis rotation (roll)
• Horizontal rotation (pitch)
• Vertical rotation (yaw)
• And both horizontal and vertical motion (caused, for example, by imperfect panning)

Not only is OIS within the lens itself image quality-desirable (at admitted tradeoffs of added size, weight and cost), its effectiveness can be further boosted when paired with in-body image stabilization (IBIS) within the camera itself. Olympus’ (now OM Systems’) Sync IS and Panasonic’s conceptually similar, functionally incompatible Dual I.S. are examples of this mutually beneficial coordination, which of course requires real-time bidirectional electronic communication. Why, you might ask, is OIS even necessary if IBIS already exists? The answer is particularly relevant for telephoto lenses, where the deleterious effects of camera system movement are particularly acute given the lens’s narrow angle of view, and where subtle movement may be less effectively corrected at the camera body versus at the other end of the long lens mounted to it.

More modest but no less electronics-dependent lens function examples include:

• Motor-driven autofocus (controlled by focus-determining sensors and algorithms in the camera body)
• Electronics-signaled, motor-based aperture control (some modern lenses even dispense completely with the manual aperture ring, relying solely on body controls instead)
• And motor-assisted zoom

And user setting optimization (fine-tuned focus, for example) and customization (constraining the focus range to minimize autofocus-algorithm “hunting”, etc.) is also often desirable.

All these functions, likely unsurprisingly to you, are managed by in-lens processors running firmware which benefits from periodic updates to fix bugs, add features, and augment the compatibility list to support new camera models (a particularly challenging task for third-party lens suppliers such as aforementioned Rokinon, Sigma, and Tamron). I’ve come across several lens firmware update approaches, the first two most practically implemented when the camera and lens come from the same manufacturer (i.e., a first-party lens):

• The lens’ new firmware image is downloaded to a memory card, which is inserted in the connected camera and activated via an update menu option or control button sequence
• The lens and body are again mated, but this time the body is then USB-tethered to a computer running a manufacturer-supplied update utility
• The lens is directly USB-tethered to the computer, with a manufacturer-supplied update utility then run. The key downside to this approach, therefore its comparative uncommonness, is that it requires a dedicated USB port on the lens, with both size and potential dust and water ingress impacts
• And the approach we’ll be showcasing today, which relies on a lens manufacturer- and camera mount-specific USB port-inclusive intermediary docking station to handle communications between the lens and computer.

Specifically, today’s teardown victim is a Tamron TAP-in Console, this particular model intended for the Canon EF mount used by my Canon DSLRs and one of my BlackMagic Design video cameras (Nikon mount stock images of the TAP-01 from Tamron’s website follow)

Here are some example screenshots of Tamron’s TAP-in Utility software in action, with my Mac connected to my Tamron 15-30 mm zoom lens via the TAP-01E dock intermediary:

along with my 100-400 mm zoom lens:

And both lenses post-firmware updates through the same utility:

Tamron isn’t the only lens manufacturer that goes the intermediary dock route. Here, for example, is Sigma’s UD-01 USB Dock in action with the company’s Optimization Pro software and two of that supplier’s Canon EF mount zoom lenses (24-105 and 100-400 mm) that I own:

Enough with the conceptual chitter-chatter, let’s get to real-life tearing down, shall we? In addition to the TAP-in Console I’ve already screenshot-shown you in action, which I bought used back in January 2024 from KEH Camera for $34.88, I’d subsequently picked up another one for teardown purposes off eBay open-box for about the same price. However, after it arrived and I confirmed it was also functional, I didn’t have the heart to disassemble perfectly good hardware in a potentially permanently destructive manner. I decided instead to hold onto it for future gifting to a friend who also owns Canon EF-mount Tamron lenses, and instead bought one claimed to be a “faulty spares-and-repairs” from MPB for $9. After it arrived, and to satisfy my curiosity, I decided to hook it up. It seems to work just fine, too! Oh well…

By the way, that dock-embedded LED shown in the first photo only illuminates when the TAP-in Utility software is running on the computer and detects a valid lens installed in the mount:

As usual, I’ll start out with some outer-box shots (yes, even though the dock was advertised as a “faulty spares-and-repairs” it still came with the original box, cable and documentation):

Open it up:

(I suspect that in its original brand-new condition there was more padding, etc. inside)

and the contents tumble out (I’m being overly dramatic; I actually lifted them out and placed them on my desk as shown):

Here’s the USB-A to micro-USB power-and-data cable:

Re the just-mentioned “data”, I always find it interesting to encounter a ferrite bead (or not) and attempt to discern whether there was a logical reason for its presence or absence (or not):

A bit of documentation (here’s a PDF version), supplemented by online video tutorials:

And last, but not least, our patient, already-seen LED end first, and as usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

Two side views: one of the micro-USB connector:

and another, of the lens release button:

Finally, here’s the mount end, first body-capped:

and now uncapped and exposed:

See those four screws around the shiny outer circumference? You know what comes next, right?

The now-unencumbered shiny metal ring, as it turns out, consists of two stacked rings. Here are the top and bottom views of the outer (upper) one:

and the even shinier inner (lower) one:

If you’re thinking those look like “springs” on the bottom, you’re not off-base:

With the rings gone, my attention next turned to the two screws at the inside top, holding a black-colored assembly piece in place:

Four more screws around the inside circumference:

In the process of removing them, the locking pin also popped out:

As you can see, the pin is spring-loaded and normally sticks out from the dock’s mount. When you mate a lens with the dock, with the former’s bayonet tabs aligned with the latter’s recesses, the lens mount presses against the pin, retracting it flush with the dock mount. Subsequently rotating the lens into its fully mounted position mates the pin with a matching indentation on the lens mount, allowing the pin to re-extend and locking the lens in place in the process.

Pressing the earlier-seen side release button manually re-retracts the pin, enabling rotation of the lens in the opposite direction for subsequent removal.

Onward. With the four screws removed:

the middle portion of the chassis lifts away, revealing the PCB underneath:

In the process of turning the middle portion upside-down, the release button (now absent its symbiotic locking pin partner) fell out:

I had admittedly been a bit concerned beforehand that the dock might be nothing more than a high-profit-margin (the TAP-in Console brand-new price is $59) “dummy” USB connection-redirector straight to the mount contacts, with the USB transceiver intelligence built into the lens itself. Clearly, and happily so, my worries were for naught:

Two screws hold the contacts assembly in place:

Four more for the PCB itself:

And with that, ladies and gentlemen, we have achieved liftoff:

Let’s zoom in (zoom…camera lens accessory…get it? Ahem…) on that PCB topside first:

As previously mentioned, the TAP-in Console comes in multiple product options for various camera manufacturers’ lens mounts. My pre-dissection working theory, in the hope that the dock wasn’t just a “dummy” USB connection-redirector as feared, was that the base PCB was generic, with camera manufacturer mount hardware customization solely occurring via the contacts assembly. Let’s see if that premise panned out.

At left is the USB-C connector. At bottom is the connector to the ribbon cable which ends up at the mount contacts assembly (which we’ll see more closely shortly). But what’s that connector at the top for? I ended up figuring out the answer to that question indirectly, in the process of trying (unsuccessfully) to identify the biggest IC in the center of the PCB, marked:

846AZ00
F51116A
DFL

I searched around online for any other published references to “F51116A”, and found only one. It was for the Nikon version of the TAP-in Console (coincidentally the same version in the stock images at the beginning of this piece) and was in Japanese (which I can’t read, far from speak), but Google Translate got me to something I could comprehend. Two things jumped out at me:

• This time, the upper connector was used to ribbon-cable tether to the contacts assembly
• And the IC was marked somewhat differently this time, specifically in the first line

734AZ00
F51116A
DFL

So, here’s my revised working theory. The PCB itself is the same (with confirmation that you’ll shortly see), as are the bulk of the components mounted to it. The main IC is either a PLD or FPGA appropriately programmed for the intended product model, a model-specific ASIC, or a microcontroller with camera mount-specific firmware. And depending on the product variant, either the top or bottom connector (or maybe both in some cases) gets ribbon-cable-populated.

Let’s flip the PCB over now:

Not much to see versus the other side, comparatively, although note the LED at bottom and another (also unpopulated this time) connector to the right of it. And to my recent comments, note that the stamp on the right:

TAMRON
AY042-901
-0000-K1

exactly matches the markings shown on the PCB in the Nikon-version teardown.

About that contacts assembly I keep mentioning…here’s the “action” (electrically relevant) end:

And here’s the seemingly (at least initially) more boring side:

I thought about stopping here. But those two screws kept calling to me:

And I’m glad I listened to them. Nifty!

With that I’ll wrap up and, after the writeup’s published, see if I might be able to get it back together again…functionally, that is…mindful of the Japanese teardown enthusiast’s comments that “The lens lock release switch part was a bit of a pain to assemble (lol).” Reader thoughts are as-always welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Tamron’s TAP-in Console: A nexus for camera lens update and control appeared first on EDN.

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