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Achieves industry-leading power density by integrating 4th Generation SiC MOSFETs in a compact package

ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1x4, two of 1,200V-rated: BSTxxxD12P4A1x1) optimized for xEV (electric vehicles) traction inverters. TRCDRIVE pack supports up to 300kW and features high power density and a unique terminal configuration – helps solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours.

As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack.

A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. On top, ROHM’s 4th Generation SiC MOSFETs with low ON resistance are built in – resulting in an industry-leading power density 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs.

The modules are also equipped with control signal terminals using press fit pins enabling easy connection by simply pushing the gate driver board from the top, reducing installation time considerably. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.

 

Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules. To obtain samples, please contact a sales representative or visit the contact page on ROHM’s website.

Product Lineup

TRCDRIVE pack is scheduled to be launched by March 2025 with a lineup of 12 models in different package sizes (Small / Large) and mounting patterns (TIM: heat dissipation sheet / Ag sinter). In addition, ROHM is developing a 6-in-1 product with built-in heat sink that is expected to facilitate rapid traction inverter design and model rollout tailored to a variety of design specifications.

Application Examples

・ Automotive traction inverters

Comprehensive Support

ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of TRCDRIVE pack products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation in similar conditions as practical inverter circuits.

For details, please contact a sales representative or visit the contact page on ROHM’s website.

Terminology

Traction Inverter

Traction motors in electric cars are driven by 3-phase AC power with a phase shift of 120°. Traction inverters convert direct current supplied from the battery into 3-phase alternating current.

2-in-1

To convert DC into 3-phase AC, one high-side and one low-side MOSFET are required per phase for switching. A 2-in-1 configuration combines both of these MOSFETs into a single module.

 

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Japan-based power semiconductor device maker ROHM Co Ltd has launched its EcoSiC brand as a trademark for products using silicon carbide (SiC)...

CarbonScape, a pioneer in sustainable battery materials, is making waves with its innovative biographite technology. This breakthrough aims to revolutionize the electric vehicle (EV) industry by providing a greener alternative to traditional graphite used in lithium-ion batteries.

Biographite: A Game-Changer in Battery Materials

Biographite is a sustainable anode material derived from wood. Biographite offers superior sustainability and a lower environmental footprint than traditional synthetic or mined graphite.

Environmental Impact

• Reduced Emissions: Manufacturing synthetic graphite emits 25-35 tons of CO2 per ton of product, and mined graphite emits 10-15 tons. In contrast, biographite production results in significantly lower CO2 emissions, reducing the carbon footprint of each EV by 5%.
• Renewable Source: Biographite uses forestry byproducts such as wood chips, ensuring a stable and renewable supply.

Performance

It is to be emphasized that biographite matches the performance of synthetic graphite. Rigorous testing with lithium-ion battery manufacturers, including ATL, confirms that biographite performs similarly to synthetic graphite. These tests, protected by intellectual property agreements, have shown impressive results, prompting further investment in CarbonScape.

Addressing Global Graphite Supply Deficit

Projections indicate a global graphite supply deficit of 777,000 tons by 2030. Biographite offers a decentralized solution, reducing dependence on centralized supply chains, particularly those dominated by China. By using forestry byproducts, biographite promotes critical mineral independence and reduces supply chain vulnerabilities.

Sustainable and Cost-Effective Production

Lower Temperature Production: CarbonScape’s patented process converts wood chips and sawdust into biographite through pyrolysis at half the temperature required for traditional synthetic graphite (2,500°C). This approach helps reduce costs and minimize environmental impact.

Carbon Neutral: The use of responsibly sourced forestry byproducts ensures the process is carbon neutral, depending on the grid supply, while remaining price competitive.

Scaling Up Production

CarbonScape is poised to scale up production and establish commercial facilities in Europe and the US. Despite challenges, the company leverages the expertise of its leadership team and strategic partners to meet the surging demand for batteries while maintaining sustainable practices.

Responsible Sourcing

CarbonScape addresses concerns about the environmental impact of wood chip sourcing by committing to responsible practices. Partnerships with companies like Stora Enso ensure sustainability and circularity in the supply chain. By utilizing less than 5% of the forestry industry byproduct generated in Europe and the US, CarbonScape can produce enough biographite to meet half the projected global battery demand by 2030.

Conclusion

CarbonScape’s biographite is a step forward in the right direction in the EV industry. As the world accelerates towards electrification, biographite has the potential to power the next generation of sustainable transportation, significantly reducing the environmental impact of EV batteries and contributing to a greener future.

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Vehicle Network Technology Advancements

A startup specializing in Ethernet-based vehicle network technology is leveraging a 7nm fabrication process to produce advanced chips aimed at meeting the high bandwidth demands of software-defined vehicles (SDVs). These vehicles require significantly more data bandwidth due to features such as advanced driver assistance systems (ADAS), autonomous driving, and over-the-air software updates.

Ethernet-Based Transceivers

The startup has developed Ethernet-based transceivers, designated ENT11100 and ENT11025, capable of supporting multiple data rates (10 Gbps, 5 Gbps, 2.5 Gbps, and 1 Gbps) within the same device. These transceivers are expected to help Original Equipment Manufacturers (OEMs) address the increasing data demands while simplifying thermal design.

• ENT11100: Supports IEEE 802.3ch multi-gigabit (10/5/2.5GBASE-T1) and IEEE 802.3bp (1000BASE-T1).
• ENT11025: Supports IEEE 802.3ch multi-gigabit (2.5GBASE-T1) and IEEE 802.3bp (1000BASE-T1), and is software and pin compatible with the ENT1x100, allowing for a seamless migration path with a single PCB design.

Advanced Fabrication Process

Ethernovia, the company behind these transceivers, utilizes a 7nm process for manufacturing, which offers several advantages:

• Power Optimization: Enhanced power efficiency due to advanced process technology.
• High Integration Levels: Supports higher levels of integration, resulting in a low power, high port density solution.

Industry Support and Future Developments

Andreas Aal from Volkswagen Group highlighted the importance of fast, secure data transmission for electrification, connectivity, and automated driving functions. Ethernovia’s new PHY devices meet these needs by offering energy-efficient, high-bandwidth, and low-latency data transmission with embedded co-optimized safety and security IP. This paves the way for a seamless transition to future software-defined vehicle architectures.

These transceivers are part of Ethernovia’s planned family of products, which will include a high-bandwidth, low-latency switch being developed in partnership with Continental, a leading OEM. The single-port ENT11100 and ENT11025 are currently open for customers, with quad-port devices expected to be introduced later this year.

Conclusion

Ethernovia’s advanced 7nm Ethernet-based transceivers are set to play a crucial role in the evolution of software-defined vehicles, providing the necessary bandwidth and performance to support the growing demands of modern automotive technology.

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When developing specialty interconnects such as flexible circuits, rigid-flex circuits, flexible heaters, or membrane switches, the primary goal is to ensure these components can perform reliably in challenging applications. Trends like miniaturization, connectivity, wearables, and mobility necessitate the use of specialty interconnects over traditional rigid PCBs. The design phase is crucial to achieving a high-performing specialty interconnect.

The Importance of Design Expertise

Design expertise is pivotal in creating an effective specialty interconnect. Customers often seek custom solutions tailored to their specific applications, and the design phase involves several key considerations:

• Material Selection and Properties: Understanding the materials and their properties is essential for creating a reliable interconnect.
• Mechanical and Electrical Challenges: Determining how the circuit will be used and addressing any mechanical or electrical challenges that may arise.
• Environmental Conditions: Considering the environmental conditions the circuit will face.
• Installation and Usage: Ensuring the design accommodates the installation and usage requirements of the circuit.

Benefits of Working with Experienced Application Engineers

Experienced application engineers bring significant value to the design and development process:

• Cost-Effective Solutions: They can identify cost-saving opportunities, such as reducing the number of layers or optimizing design features.
• High Yields: Expertise in pushing and relaxing design rules to achieve high yields.
• Faster Development: Their experience allows them to resolve issues quickly and efficiently, reducing the number of design revisions needed.
• Prototyping and Troubleshooting: Expert engineers can quickly identify and address problems during prototyping, saving valuable time and resources.
• Design for Manufacturability: They ensure the design can be manufactured reliably and cost-effectively.

Case Studies

Rapid Issue Identification: A top flex engineer quickly identified a problem that in-house engineers had been unable to resolve for weeks, highlighting the value of expertise.

Costly Mistake with Low-Cost Supplier: A customer initially chose a low-cost supplier without design expertise, leading to significant delays and increased costs due to multiple revisions and performance issues. Switching to a supplier with design expertise ultimately resolved their issues.

Conclusion

To build a better specialty interconnect, start with the design phase and partner with experienced application engineers. These experts will guide you to cost-effective, reliable solutions and help you avoid costly pitfalls. By choosing a supplier that combines superior expertise with competitive pricing, you can achieve the greatest overall value and develop a better specialty interconnect.

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The V-harvester board is a photovoltaic (PV) harvesting backup demonstration circuit. It is a sophisticated stand-alone board charged using TEMD5080X01 micro PV cells or with micro USB. The input power goes into an e-peas low power AEM10941 controller, where it is stepped up to the supercapacitor voltage of 4.2 V. Upon power demands at the interface or ENLV, ENHV settings, the controller converts the supply voltage to the target voltages using low dropout regulators (LDO).

The post Energy Harvesting: Eliminating Battery Replacements for IoT Nodes With 196 HVC ENYCAP™ appeared first on ELE Times.

Tokyo-based Mitsubishi Electric Corp has begun shipping low-current 3.3kV/400A and 3.3kV/200A versions of a Schottky barrier diode (SBD) embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module...

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As system-on-chip (SoC) designs become more complex and powerful, catching potential errors and issues in specifications at the front-end of the design cycle is now far more critical. An EDA outfit based in Gentbrugge, Belgium, claims to have employed a shift left of simulation and synthesis tasks to catch specification errors early in the chip design cycle and fix inefficiencies in hardware description language (HDL)-based design flow.

The traditional HDL-based design flow is no longer viable, says Dieter Therssen, CEO of Sigasi, a privately held and self-funded firm founded in 2008. That’s because the traditional HDL workflow cannot accommodate the massive amounts of design specifications encompassing high-level synthesis results, complex SoC intellectual property (IP), and special features like generative artificial intelligence (genAI) creations.

Such levels of abstraction call for a plug-and-play approach for large HDL files containing functionality created with domain-specific knowledge to integrate hundreds of billions of transistors on a chip. In other words, HDL creation, integration, and validation must be redefined for the chip design cycle to fix the inefficient HDL-based design flow.

Therssen claims that Sigasi’s new HDL portfolio provides hardware designers and verification engineers the workflow makeover they need, enabling them to work in a powerful environment to create, integrate, and validate their designs while leveraging shift-left principles. Sigasi Visual HDL portfolio, an integrated development environment (IDE), employs the shift-left methodology to give hardware designers and verification engineers better insight during the design process.

It enables them to easily manage HDL specifications by validating code early in the design flow, well before simulation and synthesis flows. So, it’s a shift left of simulation and synthesis tasks, which flags problems while users enter the HDL code. While doing so, it enforces coding styles as recommended by safety standards such as DO-254 or ISO 26262 and catches Universal Verification Methodology (UVM) abuses.

Sigasi Visual HDL or SVH is fully integrated with Microsoft’s Visual Studio Code (VS Code), the most popular IDE according to Stack Overflow’s 2019 survey. That allows hardware designers and verification engineers to use git, GitHub Source Control Management, and a selection of utilities to facilitate mundane tasks like extracting TODO comments or bookmarking important sections in HDL code.

Sigasi Visual HDL will be available at the end of June 2024.

Sigasi Visual HDL, built as a tiered portfolio, offers three commercial editions and one community edition to meet specific SoC design and verification challenges.

1. Designer Edition

It meets the specific requirements of individual engineers who need introspection of their HDL projects. The Designer Edition includes all the essential guidelines and tools to create quality code, from hovers and autocompletes to quick fixes, formatting, and rename refactoring.

2. Professional Edition

It builds on the Designer Edition to incorporate more complex features focused on verifying HDL specifications. That includes graphic features like block diagrams and state machine views as well as UVM support.

3. Enterprise Edition

It offers features needed by large engineering teams, including command-line interface capabilities to safeguard the code repository and ensure a better handoff to verification groups. The Enterprise Edition also includes documentation generation as part of a better HDL handoff.

4. Community Edition

It lets users explore its features for non-commercial uses and is commonly used by students and teachers who want to better learn the fundamentals of HDL design. So, students no longer need to request a limited-time educational license; they can download the VS Code extension and upgrade their HDL education.

Sigasi Visual HDL—to be made available at the end of June 2024—will be displayed at Booth #2416 on second floor during Design Automation Conference (DAC) at Moscone West in San Francisco on 24-26 June 2024.

Related Content

• HDL: A Design Flow Runs Through It
• Opinion: Why IDEs for hardware design fail
• Introduction to High-Density Programmable Design
• HDL design methods for low-power implementation
• HDL-design challenges and philosophies for real-world ASIC implementations

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Farnell Global (which trades as Farnell in Europe, Newark in North America and element14 in Asia Pacific) has announced a new global distribution partnership with Transphorm Inc of Goleta, near Santa Barbara, CA, USA, which designs and manufactures JEDEC- and AEC-Q101-qualified high-voltage gallium nitride (GaN) field-effect transistors (FETs) for power conversion applications...

Vector Photonics Ltd (which was spun off from Scotland’s University of Glasgow in 2020, based on research led by professor Richard Hogg) has received £1.667m in equity investment and £1.27m in additional research funding for the continued commercialization of its unique Surface Coupling Laser (SCL) technology, which is claimed to enhance performance in applications as diverse as next-generation data centers, co-located optics, artificial intelligence (AI), metal and plastic printing, LiDAR, and optical sensing...

Showcasing their latest advancements in battery systems, Bosch Rexroth’s automation technologies are prominently featured at the Michigan CIC, with a centrally located Battery Module Demonstration Room. Resembling a pilot line, this room features a broad spectrum of Bosch Rexroth technologies from its automation portfolio, covering cell production, modular assembly, and end-of-line testing, among other functions.

Process Reliability

Various types of batteries necessitate distinct production methods for converting electrode films into cell elements. Whether it’s pouch cells, prismatic cells, or cylindrical cells, high dynamics and precision are essential for separating or stacking the cathodes and anodes. Bosch Rexroth boasts deep expertise in dry room and clean room production, including long-term component testing, ensuring high-quality standards and reliable production processes.

Technologies on Display for Cell Production:

1. VarioFlow plus Conveyor System:

• A tight turn radius minimizes tool footprint.
• Swift and efficient transportation of cells within process stations and between machines
• Items can be conveyed either on pallets or directly on the conveyor system
• Configurable for utmost design flexibility, handling high-volume products horizontally, vertically, and around obstacles.

2. Rexroth Flexible Transport System Pallet Boost:

• A highly dynamic transfer system propelled by magnets, ideal for high-throughput machines and assembly lines
• Synchronous and asynchronous bi-directional transfer.
• Compatible with standard TSplus modules for creating a complete loop or as a stand-alone section.
• Precise motion profile and stopping control with acceleration up to 30 m/s² and speed up to 5 m/s.
• Positioning repeatability down to ±20 μm.

Battery Pack Assembly

Process-reliable smart conveyor and positioning systems are crucial for battery module assembly. The Battery Customer Innovation Center showcases Bosch Rexroth’s advanced automation technology, including linear modules and Cartesian systems for precise positioning, as well as advanced resistance welding systems.

Linear Modules and Cartesian Systems:

• Pre-configured components designed to reduce engineering, assembly, and start-up time.
• The LinSelect system configurator swiftly integrates with the latest BOM and CAD models
• High system dynamics and stiffness, with repeatability to ±50 μm.
• Compatible with dry-room environments.

Resistance Welding Systems

The Battery CIC includes a resistance welding lab featuring Bosch Rexroth’s modular system with advanced welding controls, AC or MFDC inverters, and control software, along with interfaces for all popular fieldbuses. These systems are designed to enhance the overall system and process reliability, with Weld Spot Analytics software assisting welding engineers in making better, more assured decisions. Together with adaptive control, these features ensure high-quality welds and minimize inefficiencies in high-production environments.

End-of-Line Testing

Battery packs are complex devices that must meet stringent safety standards. Bosch Rexroth’s end-of-line (EOL) test systems at the Battery CIC feature scalable IndraDrive ML and fastPLC system ILC, offering:

• Efficient utilization of shared hardware for power supply, drive inverter, and DC/DC converter
• Efficient line regeneration and low harmonics.
• High power handling (up to 1000V DC and 500kW).
• Achieving the lowest ripple of DC voltage and current
• Compact footprint, cabinet size, and system weight.
• Future-proof open connectivity with protocols such as PROFINET, EtherCAT, Sercos, Ethernet/IP, Modbus TCP, OPC-UA, LabView, Simulink, and Java.

Bosch Rexroth’s innovative automation technologies at the Michigan CIC demonstrate their commitment to advancing battery system production, ensuring process reliability, and enhancing overall efficiency and performance.

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•  Infineon takes a pioneering role in the semiconductor industry and creates transparency for its customers regarding the climate impact of individual product families
• Infineon aims to eventually cover its entire product portfolio
• Providing carbon footprint data at the product level is another major milestone in Infineon’s sustainability strategy

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will provide customers with comprehensive Product Carbon Footprint (PCF) data, taking a pioneering role in the semiconductor industry. The company is committed to eventually providing PCF data for its entire product portfolio, starting now with about half of its portfolio. The initiative will empower customers to advance their own sustainability goals and reduce their carbon footprint effectively along the entire supply chain. The Product Carbon Footprint is a metric that quantifies the greenhouse gas emissions associated with an individual product, allowing the comparison of different products’ climate impact. Infineon will share more insights with customers at the upcoming PCIM trade fair in Nuremberg, Germany, from 11 to 13 June 2024.

“By providing comprehensive Product Carbon Footprint data, we are driving the vision of a net-zero society and empowering our customers to reduce carbon emissions even more effectively,” says Elke Reichart, Member of the Management Board and Chief Digital and Sustainability Officer at Infineon. “Infineon is taking a leading role in carbon transparency by committing to include the entire product portfolio over the coming years. This underlines our ambition to be a leader not only in terms of technology, but also sustainability.”

The specific data Infineon provides on its individual products is essential for the growing number of customers who want to increase transparency on their own carbon footprint. Moreover, it supports informed decision making to leverage additional potential for reducing emissions along the value chain.

In the absence of established industry standards, Infineon has developed a robust methodology to calculate the Product Carbon Footprint, incorporating customer needs and best practices. Infineon includes emissions from raw materials and supplies, its own manufacturing processes, manufacturing partners and transportation to the customer (“from cradle to gate”). This means that the Product Carbon Footprint reported by Infineon covers scope 1 and 2 emissions as well as scope 3 emissions from suppliers and manufacturing partners, all the way to the customer’s gate. The Product Carbon Footprint is expressed in kilograms of carbon dioxide equivalent (kg CO2e).

Infineon has published the assessment of reference product families on the Infineon website.

Driving transparency goes hand in hand with Infineon’s strong commitment to decarbonization and digitalization. Infineon’s products make a major contribution to the global energy transition and thus to a net-zero society. They are used in solar and wind power plants, electric cars and increase energy efficiency in numerous applications, including AI data centers. Over their lifetime, the company’s chips overall save 34 times the amount of CO2e emitted during their production.

Breaking the carbon footprint down to the product level is another major milestone in Infineon’s sustainability journey. Infineon has already pledged to achieve carbon neutrality by 2030 for direct and indirect emissions (scope 1 and 2). Last year, the company additionally committed to setting a science-based target encompassing supply chain emissions (scope 3) as well.

 

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Editor’s Note: This DI is a two-part series.

Part 1 discusses audio oscillators, namely the Wien bridge and biquad, state-variable, or two-integrator-loop configuration.

Part 2 will add distortion-free feedback to the biquad to produce a pure sine wave.

Over the years, the Design Ideas (DI) column has featured many interesting oscillators, but none that I can recall was specifically designed to produce a really clean sine wave. Putting that omission together with the need to rebuild my old sub-0.01% sine generator gave me the perfect excuse to do some exploring, ending up with this DI, which is in two parts. First, we’ll look at ways not to do it, then part 2 will show how to get Audio Precision® distortion levels for RadioShack prices.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The alternatives

We won’t even consider squashing a triangle wave to give something reasonably sinusoidal, as 0.3% THD is the best that this approach can give without complex, multi-breakpoint “squashing” networks. Similarly, phase-shift oscillators are out; their q-factor is low, and three-gang pots are not catalog items. And if I were designing something for modern production, the starting-point would be a 24-bit DAC fed by a small processor containing a large look-up table, but that’s not something that can be knocked up from available parts in an afternoon.

So, what’s wrong with a good old Wien bridge circuit? The relevant Wikipedia page contains much historical, practical, and mathematical detail, and it reports that distortion levels down to 0.0003% (3  ppm) can be achieved, so we have one benchmark, though that’s most likely for a spot frequency rather than for a multi-range, fully-tunable device. A practical target is 96 dB or 0.0015%, which is the absolute limit for CD-type 16-bit linear PCM audio, while a more arbitrary goal is 120 dB, or 1 ppm. At these levels, THD may be dominated by circuit noise, which we’ll conveniently ignore for now.

Wien bridge oscillator

To check things out, I breadboarded a basic circuit using an LM4562 op-amp, carefully-matched resistors and polystyrene capacitors, and amplitude-stabilised using a photoconductive opto-isolator (essentially an LED and an LDR) driven by some heavy filtering. (A thermistor only works for higher output levels and is very bouncy.) Figure 1 shows the schematic and Figure 2 the output spectrum at close to 1 kHz for a level of -20 dBV (about -22 dBu, or 0.283 Vpk-pk).

Figure 1 A simple Wien bridge oscillator, using a photoconductive opto-isolator to help stabilise the amplitude.

Figure 2 The spectrum of the oscillator running at ~1 kHz, its output being at -20 dBV.

The spectrum implies a THD of about -76 dB or 0.02%: only so-so. However, I have learnt to be cautious of FFTs when the dynamic range of the signal to be examined exceeds about 90 dB, and prefer to notch out much of the fundamental, allowing a clearer view of the harmonics. Figure 3 shows the result of this: much better, with a THD of perhaps -88 dB, or 0.004%.

Figure 3 The spectrum of the same signal, but with the fundamental mostly notched out to show the harmonics more accurately.

Better, and not bad for a lash-up, but still off-target. (Note that the scale now shows the relative level of the harmonics, in dBc, as the oscillator’s output is at 20 dBV and the notch filter has a voltage gain of 10 dB or 20 dB.) With a little more thought and a lot more fiddling—or vice versa—we could probably improve its performance to the benchmark level, but a different starting-point looks more promising. The biggest problem is the amplitude control loop because removing all the ripple effects the damping badly, increasing the loop settling time. The low Q-factor of a Wien bridge, 1/3, does us no favours at all.

Bi-quad loop filter

My favourite circuit for comprehensive filters and oscillators has always been the bi-quad(ratic), state-variable, or two-integrator-loop configuration, one topology of which is shown in Figure 4.

Figure 4 A classic bi-quad or two-integrator-loop filter, with its high-pass, bandpass, and low-pass outputs.

You may well recognise something like this from a hundred and more NatSemi/TI datasheets and app notes. Its basics go back to the 1950s, I think, when “operational amplifiers” usually meant racks of glowing bottles, and it is versatile, designable, and controllable. This version is cut for a Q-factor of ~16 and a gain of ~10. We’ll now package it with a dashed line and treat it as a module. Assume ±5 V to ±15 V supplies, with plenty of decoupling caps.

To make it oscillate, we take the bandpass (BP) output and feed it back to the input at a suitable level. This is often done by limiting the BP signal with a pair of back-to-back diodes, much as shown in Figure 5.

Figure 5 The filter with added diode-limited feedback becomes an oscillator, but with plenty of harmonics, giving a THD of around 0.0%.

With the values shown, the diodes compress the signal to ~2/3 of the output level. Less than this, and we lose stability; more, and the harmonics become excessive. The feedback network shown keeps the impedances around the diodes low to allow clean operation up to 100 kHz and beyond, while the added thermistor improves the amplitude stability with temperature. Match the diodes for forward voltage to minimise even-harmonic distortion. The third harmonic produced by the diodes is reduced by about 22 dB by the time it reaches the LP output, higher harmonics being attenuated even more.

The spectrum for the raw (LP) output shows a THD of ~0.08%, which is about the best that this approach can give. (The “notched” spectrum—not shown—showed fewer and lower peaks, but the third harmonic—the limiting factor—was still at the same level.) Because there is no control loop as such, there can be no loop stability issues, though the settling-time is appreciable at low frequencies. It’s still a good basis for a multi-range general-purpose AF oscillator.

With correspondingly larger capacitors and resistors, it also works well at very low frequencies, though FET-input op-amps are needed to avoid leakage. With tuning components of 5µ7 (= 4µ7 + 1µ0; PET dielectrics) and 3M3 resistors, and with TL072s fitted in place of the LM4562s, the waveform at ~8 mHz, or a calculated 118.2 s/cycle, looks like Figure 6.

Figure 6 Using µF and MΩ for tuning, a diode-stabilised bi-quad will easily work down in the mHz region—about 8 mHz, in this case.

Why anyone would want to use a purely analog approach to generating such low-frequency signals escapes me, but trying it was irresistible, even if it took an hour or so to settle down properly. (I lacked the patience to try even larger values of timing components. And don’t even think of asking for the spectrum.)

To be continued…

In part 2, we will take the bi-quad filter and add distortion-free feedback, similar to that used with the Wien bridge but on steroids, to produce a seriously pure sine wave.

—Nick Cornford built his first crystal set at 10, and since then has designed professional audio equipment, many datacomm products, and technical security kit. He has at last retired. Mostly. Sort of.

Related Content

• Squashed triangles: sines, but with teeth?
• Building a JFET voltage-tuned Wien bridge oscillator
• Injection-lock a Wien-bridge oscillator
• Switched-Capacitor Filters Beat Active Filters at Their Own Game
• Oscillator keeps THD below 1 ppm
• 555 triangle generator with adjustable frequency, waveshape, and amplitude; and more!
• Inductor-based astable 555 timer circuit

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Generative AI is revolutionizing Windows applications and games by enabling new capabilities, such as unscripted, dynamic NPCs, novel works of art, and significant frame rate boosts in gaming. As generative AI’s applications and capabilities expand, the demand for computing power to support these workloads increases. Hence comes into play Hybrid AI, which is an amalgamation of onboard AI acceleration of NVIDIA RTX and cloud-based GPUs to meet these requisites effectively.

Hybrid AI: A Harmonious Solution

Hybrid AI synergizes local PC and workstation computing with cloud scalability, offering flexibility to optimize AI workloads based on specific use cases, cost, and performance:

1. Local AI on RTX GPUs:

• Delivers high performance and low latency.
• Always available, even offline.

2. Cloud-based AI:

• Runs larger models and scales across many GPUs.
• Serves multiple clients simultaneously.

By leveraging both local and cloud resources, Hybrid AI ensures AI tasks run optimally, whether locally or in the cloud, and accelerates these tasks using NVIDIA GPUs and AI stacks, including TensorRT and TensorRT-LLM. This results in reduced wait times and enhanced AI-powered features for users.

Tools and Technologies Supporting Hybrid AI

Several tools and technologies from NVIDIA support hybrid AI workflows for creators, gamers, and developers:

For Creators: Dream in the Cloud, Realize Locally

Generative AI empowers artists to ideate, prototype, and brainstorm new creations. For example:

Generative AI by iStock, powered by NVIDIA Edify:

• Provides a generative photography service built for and with artists.
• Offers extensive tools to explore styles, and variations, modify parts of an image, or expand the canvas.
• Allows artists to ideate multiple times and bring concepts to life quickly.

Once the creative concept is ready, artists can utilize RTX-powered PCs and workstations for AI acceleration in over 125 top creative apps, including Photoshop, DaVinci Resolve, and Blender.

For Gamers: Hybrid ACE Revolutionises NPC Interaction

Hybrid AI, through NVIDIA ACE, enables interactive PC gaming by integrating generative AI models into digital avatars on RTX AI PCs. This allows developers to create NPCs that can understand and respond to human player text and speech in real time, enhancing the gaming experience.

For Developers: A Hybrid Tool That Runs Anywhere

Hybrid AI assists developers in building and tuning new AI models. NVIDIA AI Workbench helps developers:

• Create, test, and customize pre-trained generative AI models and LLMs on RTX GPUs.
• Access repositories including Hugging Face, GitHub, and NVIDIA NGC.
• Reproduce, collaborate on, and migrate projects easily.
• Scale up projects when additional performance is needed, and bring them back to local RTX systems for inference and light customization.

The Hybrid RAG Workbench project allows developers to:

• Create customizable RAG applications.
• Embed documents locally and run inference on local RTX systems or cloud endpoints.
• Adapt projects to use various models, endpoints, and containers.
• Quantize models to run on their preferred GPU.

Conclusion

Hybrid AI powered by NVIDIA GPUs offers a seamless integration of local and cloud resources, providing creators, gamers, and developers with optimized AI workflows. This enables the realization of cutting-edge AI-powered features, driving innovation and performance across a wide range of applications. Whether developing new AI models, creating art, or enhancing gaming experiences, hybrid AI solutions provide the best of both worlds for AI enthusiasts and professionals.

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The United States Department of Commerce will provide funding to promote the deployment of open networks in the U.S. and abroad. Rohde & Schwarz and VIAVI offer joint test solutions to meet the needs of radio equipment manufacturers who plan to apply for the funding.

Rohde & Schwarz and Viavi Solutions Inc. (VIAVI) today announced an expansion of their partnership delivering state-of-the-art O-RU testing. These solutions are ideally suited to the needs of radio manufacturers planning to bid for the United States Department of Commerce’s National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF) Second Notice of Funding Opportunity (NOFO 2), which focuses on Open Radio Commercialization and Innovation. Since the launch of this partnership, Rohde & Schwarz and VIAVI have established a reputation for compact, flexible solutions drawing from the strengths of both companies while delivering a seamless user experience. The two companies offer:

O-RU Conformance Test

Fronthaul conformance tests, defined by the O-RAN ALLIANCE, ensure that O-RUs are interoperable with the O-RAN distributed unit (O-DU). The joint test solution includes:

• The R&S SMW200A vector signal generator, R&S FSVA3000 signal and spectrum analyzer and the R&S VSE signal analysis software from Rohde & Schwarz, to emulate a real-world radio environment by generating, capturing and analyzing RF signals, extended for O-RAN applications.

• The TM500 O-RU Tester from VIAVI, implementing the O-RAN Distributed Unit (O-DU) side of the M-plane and C/U-plane functionality necessary to configure the interface with the O-RU and exchange of I/Q data over the Open Fronthaul.

• The O-RU Test Manager application, providing a single point of control for the integrated system, simplifying testcase workflow while allowing deeper data inspection and analysis as needed.

The same set-up can be also used for performing conformance cases defined by 3GPP TS 38.141/36.141 for 5G/LTE base stations (BS).

Test Scalability

As O-RAN radios move to commercial deployment, development testing needs to move beyond lab validation of conformance to greater use case and functionality testing within R&D. These newer use cases prioritize simplicity, speed and cost effectiveness in testing. The R&S PVT360A is a compact, single-box vector signal analyzer (VSA) and vector signal generator (VSG) that combines with the VIAVI TM500 O-RU Tester and VIAVI O-RU Test Manager Application for a more scalable solution, providing a cost-optimized and simpler setup that is well-suited for R&D teams that require multiple test lines to accelerate time to market. The TM500 O-RU Tester can also be scaled to provide direct performance testing such as uplink and downlink data performance and capacity testing.

Network Energy Saving

O-RAN radio units (O-RU) consume the majority of power in 5G radio access networks. Network equipment manufacturers and service providers are prioritizing O-RU energy efficiency without sacrificing performance. Rohde & Schwarz and VIAVI have developed a fully automated testbed to verify O-RU energy efficiency, including the R&S RTO6 oscilloscope, R&S NGP800 power supply and the VIAVI TM500 O-RU Tester. The TM500 O-RU Tester emulates the DU, synchronizes and configures the O-RU and offers several test scripts to verify O-RU energy efficiency under different load conditions. The R&S equipment can then monitor dynamic device activities versus power consumption: The oscilloscope monitors energy dynamics under various traffic conditions by tracking power changes over time, while the power supply – besides powering the O-RU – also provides high measurement resolution and accuracy over a long period of time. The O-RU Test Manager Application ensures a seamless user experience across the testbed.

Alexander Pabst, Vice President Market Segment Wireless Communications at Rohde & Schwarz, said: “Our joint O-RU conformance test solution has been used to test a wide range of different O-RUs at global plugfests of the O-RAN ALLIANCE over the last years. It has a solid presence at Open Testing and Integration Center (OTIC) labs worldwide and was instrumental in initial O-RU certifications in Asia and most recently also in the first certification in Europe. With this long track record, we are now set to serve the efforts of the NTIA to bring forward Open Radio technology. This is putting the successful collaboration between Rohde & Schwarz and VIAVI to the next level.”

Ian Langley, Senior Vice President and General Manager, Wireless Business Unit, VIAVI, said: “Rohde & Schwarz and VIAVI are proud to support the NTIA Open RAN Innovation and Commercialization based on our best-of-breed approach with a unified customer experience. Since we first began offering O-RU conformance testing, open radios have advanced significantly, and test requirements – from scalability for use across the development cycle, to energy saving, have become critical. We are pleased to expand our partnership into these new areas.”

For more information on O-RAN testing solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/wireless/O-RAN

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Transphorm’s high-performance, high-reliability SuperGaN power semiconductors are making significant strides in the power electronics market by leveraging one of the largest power GaN IP portfolios, comprising over 1,000 patents. These advancements are encapsulated in a normally-off d-mode GaN platform that ensures top-notch robustness and reliability. Products utilizing SuperGaN FETs benefit from higher power density, improved efficiency, and reduced total power system costs compared to alternative solutions.

Fundamental Physics and Technological Advantages

The superior performance of SuperGaN devices is rooted in their fundamental physics. The platform’s inherent advantages include:

• Industry-Leading Efficiency: Achieving efficiencies greater than 99%, SuperGaN devices set a benchmark in the industry.
• Higher Power Density: Up to 50% higher power density allows for more compact and efficient power systems.
• Lower System Cost: With up to 20% reduction in system costs, SuperGaN provides a cost-effective solution.
• Proven Robustness and Reliability: Ensuring long-term performance and dependability.
• Compatibility: Drop-in and drive compatibility with all other high voltage power technologies.
• Wide Power Application Range: Supporting applications from 40W to 7.5kW, with future expansions to higher power ratings.

Innovations and Industry Firsts

Transphorm’s GaN technology has led to several ground-breaking innovations:

• 1200 V GaN-on-Sapphire Device: Expected to be commercially available by mid-2024, this device marks a significant milestone in GaN technology.
• Short-Circuit Withstand Times: Achieving withstand times of five microseconds, demonstrating superior robustness.
• GaN Four Quadrant Switch: Featuring true voltage and current bidirectionality control, enhancing flexibility and performance in power systems.

Strategic Partnerships and Market Impact

Element14’s Product Category Director for Passives & Semiconductors, Jose Lok, emphasized the importance of partnering with Transphorm. This collaboration supports the delivery of high-quality products and offers customers a broader choice of manufacturers and GaN device packages to meet diverse design needs.

Vipin Bothra, VP of Sales for North America and Europe at Transphorm, highlighted the transformative impact of the SuperGaN platform on the power electronics market. By driving major design and performance advantages, Transphorm’s GaN devices are being adopted globally across consumer, industrial, and automotive markets. Partnering with respected global distributors like element14 is crucial for meeting customer needs and revolutionizing power systems across various applications, from adapters and PCs to renewable energy systems and electric vehicles.

Conclusion

Transphorm’s SuperGaN power semiconductors represent a versatile and future-proofed solution for the power electronics industry. Their high efficiency, robustness, and compatibility with a wide range of applications make them a compelling choice for designers and manufacturers aiming to enhance performance and reduce costs in their power systems.

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Over two decades deploying Delta’s smart energy-saving solutions to support the rapid transformation of India’s e-mobility, renewable energy, and manufacturing sectors

Delta, a global leader in power management and a provider of IoT-based smart green solutions is all set to participate in INTEC 2024, to present a wide range of industrial automation products and solutions to support India’s industrial revolution with higher energy efficiency and productivity. These include the VP3000 variable-torque drive with power ranges from 0.75kW to 630kW, which helps improve the energy and operating efficiency of industrial motors in HVAC and water treatment applications, among others.

Niranjan Nayak, Managing Director of Delta Electronics India, reflects on the company’s journey, “As we commemorate our 20th year in India, we are proud to have played a pivotal role in shaping the industrial automation landscape in the country. Delta’s commitment to innovation, energy conservation, quality, and customer satisfaction, has been the cornerstone of its success in our country.”

At INTEC 2024, Delta Electronics India will showcase a comprehensive suite of cutting-edge Industrial Automation (IA) solutions. This includes CNC systems, drives, servos, motion control systems, robots, smart screwdrivers, articulated robots, and SMPS. These solutions address the evolving needs of modern manufacturing and represent the forefront of technological advancement.

Highlights include:

• VP3000 Series Open-Loop Variable-Torque Standard Drives with power ranges from 0.75kW to 630kW and suitable for IM, PM and SyncRM industrial motors. These drives feature exceptional capabilities, stability, and predictive maintenance functions to help improve efficiency in HVAC, water supply and treatment, air compressors, and tunnel ventilation applications.
• CFP2000 Series Fan and Pump Drive featuring IP55 and IP41 enclosure protection options. The CFP2000 offers efficiency that exceeds the IE4 standard and variance <0.1% (minimum) under different loads. These drives serve key applications, such as conveyor systems, air exchange/filtering systems, water treatment, and liquid stirring.
• MSI Motor: Delta’s PMa Synchronous Reluctance Motor, designed for energy saving and motion accuracy with exceptional efficiency and power density.

Launching Soon:

Next-Gen CNC controller: The Delta Next Gen EtherCAT-based CNC Controller with 4 channels and 12 axes on each, delivering precision and speed for critical tasks. Designed for industries that demand advanced motion control capabilities, the NC510E-FSE-E features high response, precision, and user-friendly graphic control, along with a high-speed look-ahead algorithm and smart servo tuning.

Compact Multi-Drive MX300 Series (Parallel Mounting and Compact Size)

In response to the changing market and customer demand, Delta has leveraged its advanced technology and solid experience in developing drives to introduce its new Compact Multi-Drive MX300 Series. The series features a multi-axis modular structure that modularizes traditional rectifiers and inverters for flexible configuration on the quantity and axis of the inverter module. Inverter modules are then mounted on both sides of the rectifier module. The parallel mounting design offers optimal space, quick mounting, simple commissioning, and easy networking benefits, helping customers stay competitive and strong in the market.

Mr. Manish Walia, Head of Automation at Delta Electronics India, highlights the company’s focus on innovation: “INTEC provides us with an ideal platform to showcase our latest offerings and engage with industry stakeholders. We are excited to showcase our innovative IA solutions that empower manufacturers to achieve higher levels of efficiency, accuracy, and sustainability.”

Scheduled to take place from June 6th to 10th, 2024, at the CODISSIA Trade Fair Complex in Coimbatore, Tamil Nadu, INTEC 2024 promises to be a landmark event, attracting over 450 exhibitors and featuring 650+ stalls from across India and overseas. INTEC 2024 offers a unique opportunity for industry professionals to explore the latest technological advancements and trends in the international arena. It serves as a one-stop shop for manufacturers to gain insights into emerging technologies and identify opportunities for enhancing their manufacturing processes.

As Delta Electronics India looks ahead to the next phase of its journey, the company remains committed to driving innovation, fostering partnerships, and contributing to the growth of India’s manufacturing sector. INTEC 2024 marks another milestone in Delta’s ongoing mission to empower industries with cutting-edge automation solutions.

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• ST’s third-generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles.
• Innovation Joint Lab was set up to support the development of smart, electrified and connected cars.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Geely Auto Group (HKEX: HK0175), a global leading automobile and new energy vehicle (NEV) manufacturer, have announced they have signed a long-term Silicon Carbide (SiC) supply agreement to accelerate their existing cooperation on SiC devices. Under the terms of this multi-year contract, ST will provide multiple Geely Auto brands with SiC power devices for mid-to-high-end battery electric vehicles (BEVs), boosting Geely Auto’s NEV transformation strategy with improved performance, faster charging speeds and extended driving range. In addition, building on their longstanding cooperation across multiple automotive applications, Geely and ST have established a joint lab to exchange information and explore innovative solutions related to automotive Electronics/Electrical (E/E) architectures (i.e. in-vehicle infotainment, smart cockpit systems), advanced driver assistance (ADAS), and NEVs.

Geely Auto Group has adopted ST’s third-generation SiC MOSFET devices in electric traction inverters. The traction inverter is the core of electric powertrains and SiC MOSFETs maximize their efficiency. The combination of advanced inverter design with high-efficiency power semiconductors, like SiC, is the key to superior electric vehicle performance.

“We are very pleased to establish a win-win cooperation with STMicroelectronics, to empower each other and fully utilize our respective advantages and resources.I believe that through the form of innovation joint lab, Geely and ST can deepen our cooperation, achieve mutual benefit, and accelerate the development and implementation of innovative technologies in Geely Auto,” said Li Chuanhai, President of Electronic and Electrical Center of Geely Automotive Central Research Institute.

“We are pleased to have a deep cooperation with global automotive semiconductor leader STMicroelectronics to establish an innovation joint lab. Both sides will deepen long-term cooperation in fields such as smart driving to jointly focus on customer needs, accelerate the implementation of new products and solutions, and shape an efficient cooperation mode. I believe that this cooperation will be beneficial for both parties to conduct more forward-looking technical research based on the development trends of smart, electrified, and connected cars. Geely is delighted to leverage STMicroelectronics’ leading automotive business solutions to be well positioned in product performance, system integration, and overall market competitiveness,” said Fu Zhaohui, Director of the Electronic and Electrical Center of Geely Automotive Central Research Institute.

“Geely Auto, is a shining example of automotive innovation in China, making rapid progress in car electrification and digitalization, while expanding its presence in the global market. This long-term SiC supply agreement and the joint lab establishment mark a significant step forward in our long-established cooperation,” said Henry Cao, Executive Vice President of Sales & Marketing, China Region, STMicroelectronics. “China is the biggest NEV market worldwide and a leading innovator. Our local competence centers and joint labs with our customers across the value chain of automotive allow ST to better support automotive innovation and transformation in China.”

As a leading global automobile manufacturer and China’s top automotive brand, Geely Auto sold a total of 1.68 million vehicles in 2023, with NEV sales reaching 480,000 units, accounting for 28% of the Company’s total sales for the year. This NEV sales volume represents a year-over-year increase of 48%, demonstrating Geely Auto’s successful transition towards NEV and its growing impact in the industry.

With a state-of-the-art SiC manufacturing process and a completely vertically integrated supply chain, ST provides SiC devices for a wide range of EV applications including traction inverters, OBC (onboard charger), DC-DC converters, EV charging stations and e-compressor applications, significantly enhancing the performance, efficiency, and range of NEVs. In June 2023, ST and Sanan Optoelectronics, a market leader in compound semiconductors in China, announced the creation of a new 200mm SiC device manufacturing JV in Chongqing, China. This facility will better support the needs of Chinese customers as ST collaborates with more leading Chinese carmakers, industrial customers, and solution providers in SiC, to accelerate the pace of electrification in China.

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Wire bondings are the wires which connect the pins on the package to the silicon. submitted by /u/kevintom_10 [link] [comments]