Microelectronics world news

New test tools from Siglent, Teledyne LeCroy, and Keysight flex frequency range, accuracy, flexibility, and resolution.

This is my very first drawing, I will send the this to pcb manufacturer soon. Hope I can get some advices and tips so I won't fry my stuff wasting other components. submitted by /u/Imcyee [link] [comments]

Last week, Intel held its third annual two-day Innovation event, a resurrection of the previous Intel Developer Forums (a “few” of which I attended back in the old days). The day-one keynote, focusing on silicon, was delivered by CEO Pat Gelsinger:

while Greg Lavender, Intel’s chief technology officer, handled the day-two keynote duties, centering on software:

The big news coming out of the show was the public unveil of Intel’s chiplet-implemented Meteor Lake CPU architecture, now referred to as Core Ultra in its high-end configurations (the company is deprecating the longstanding “i” from the Core 3/5/7/9 differentiation scheme):

Chiplets are, as any of you who’ve been following tech news lately, one of the “hottest” things in semiconductors right now. And for good reason, as I wrote (for example) in my 2021 retrospective coverage on processor architectures, specifically about AMD in that case:

Some of AMD’s success is due to the company’s “chiplet” packaging innovations, which have enabled it to cost-effectively stitch together multiple die on a unified package substrate to achieve a given aggregate core count, cache amount and (in some cases) embedded graphics capability, versus squeezing everything onto one much larger, lower-yielding sliver of silicon.

The thing is, the chiplet concept isn’t particularly new. Multi-chip and multi-die modules under a single package lid, whether arranged side-by-side and/or vertically stacked, have been around for a long time. The chiplet implementation has only come to the fore now because:

• Leading-edge processes have become incredibly difficult and costly to develop and ramp into high-volume production,
• That struggle and expense, coupled with the exponentially growing transistor counts on modern ICs, have negatively (and significantly so) impacted large-die manufacturing yields not only during initial semiconductor process ramps but also long-term, and
• Desirable variability both in process technology (DRAM versus logic, for example), process optimization (low power consumption versus high performance) and IC sourcing (internal fab versus foundry), not to mention the attractiveness of being able to rapidly mix-and-match various feature set combinations to address different (and evolving) market needs, also enhance the appeal of a multi- vs monolithic-die IC implementation.

Chiplets are “old news” at this point for Intel’s competitors. As previously mentioned, AMD’s been doing them with its CPUs, GPUs and APUs (CPU-plus-GPU hybrids) since 2019’s Zen 2 microarchitecture-based Ryzen 3000 series. Similarly, Apple’s first homegrown silicon for computers, 2020’s M1 SoC, integrated DRAM alongside the processor die:

The belatedly-but-ultimately unveiled highest transistor count M1 Ultra variant further stretched the concept by stitching together two distinct M1 Max die via a silicon interposer:

And (cue irony) it’s not even a new concept to Intel itself. Way back in early 2005 (speaking of IDFs), Intel was playing catch-up with AMD, which was first to release a true single-die dual-core CPU, the Athlon 64 X2. Intel’s counterpunch, the Pentium D, stitched together two single-core CPU die, in this case interacting via a northbridge intermediary vs directly. Still, what’s old is new again, eh? Intel also leveraged multi-die, single package techniques in 2010’s “Arrandale” CPU architecture, for example, and more recently in the 47-“tile” Ponte Vecchio datacenter GPU.

Although at a high level the “song remains the same”, different chiplet implementations vary in key factors such as the inherent cost of the technology, the performance latency and power consumption of the interconnect, and the ability (or lack thereof) to pack together multiple die tightly both horizontally and vertically. Intel, for example, has branded its latest approaches as EMIB (the Embedded Multi-Die Interconnect Bridge, for 2D multi-die interconnect) and Foveros (for vertical multi-die stacking purposes). Here’s a brief video on the latter:

And all that commonality-or-not aside, Intel’s mixing-and-matching of different slivers of silicon from different fab sources using different process lithographies, not to mention the partitioning of functions among those various silicon slivers, is also intriguing. Meteor Lake comprises four main die, each with its own power management subsystem:

• The Compute tile, fabricated on the company’s own Intel 4 (7 nm EUV) process and integrating a varying mix of “P” (performance) and “E” (efficiency) processing cores. It’s reminiscent of the initial “hybrid” combinations in the company’s 12th generation “Alder Lake” CPUs, but these cores are generationally improved in metrics such as average and peak clock speed, power consumption in various modes, and IPC (the average number of instructions per clock cycle, for both single- and multi-threaded code).
• The SoC tile, fabricated on TSMC’s N6 (6 nm) process. It integrates a network-on-chip processor, thereby acting as the conductor for communication between the other tiles. It also integrates cores for silicon and system security, and for AI inference (I’m guessing the latter derives from Intel’s 2016 acquisition of Movidius, although that’s just an uninformed hunch). And interestingly, it also contains its own “E” processor cores, acting as a lowest-power-consumption compute tile alternative for relevant usage scenarios.
• The GPU tile, whose purpose is likely self-explanatory, is fabricated on TSMC’s N5 (5 nm) process and derived from the technology in the company’s latest Arc Xe discrete graphics processors. That said, the media codec and display controller functions normally found in a GPU aren’t included in this tile. Instead, they’re also in the aforementioned SoC tile.
• And, last but not least, the I/O tile, the smallest (area-wise) of the four, and the one most likely to be omitted from low-end Meteor Lake implementations. As its name implies, it implements “boutique” functions such as Thunderbolt 4. And at least initially, it’ll also be fabricated at TSMC, specifically (as with the SoC tile) on the N6 process.

Initial rumors suggested that initial Meteor Lake products, targeting mobile computing implementations, might show up in October. Whether that month was originally hoped-for or not inside Intel, the official “due date” for CPUs (and presumably also systems based on them) is now December 14, which pushes them out beyond both the holiday 2023 shopping cycle (for consumers) and 2024 budgetary cycle (for companies whose fiscal and calendar years coincide).

Why mobile first, versus desktop (or for that matter, server)? Mobile CPUs tend to prioritize low power consumption over peak performance and are also typically “kitted” with lower core counts than their desktop siblings, both attributes resonant with suppliers ramping up new die and packaged chip manufacturing processes. That said, Intel promises that desktop variants of Meteor Lake are also under development for production shipments beginning sometime next year. That said, and as presumed reassurance for skeptics, the company was already demoing its two-generations-subsequent desktop client CPU, 2025’s Lunar Lake, last week. And as for servers, Intel has a next-generation 144-core (“E”-only) monolithic Xeon CPU also coming out on December 14, with a dual-chiplet 288-core version to follow next year.

One final thing, returning once again to mobile. Not announced last week but sneak-peeked (then quickly yanked) a few weeks prior at a packaging event Intel put on was a Meteor Lake derivative with 16 GBytes of LPDDR5 SDRAM onboard for the ride, alongside the logic “tiles”.

If you’re thinking “Apple Silicon”, you’re conceptually spot-on, an association which Intel management is seemingly happy to encourage. 2024 and beyond should very interesting…

*I realize, by the way, that I may be dating myself with the title of this piece. How many of you are, like me, old enough to remember the Intel Inside branding program, now deprecated (as of, gulp, nearly 20 years ago) but apparently still with a pulse?

Thoughts as always are welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• A 2021 technology retrospective: Strange days indeed
• TSMC adds two variants to 2-nm node, will Intel catch up?
• Kill or reform the AXG graphics unit: Intel’s GPU dilemma
• Intel, Tower, and the diary of a failed acquisition bid
• Intel is founded, July 18, 1968

The post Intel’s next-generation CPUs hide chiplets inside* appeared first on EDN.

At iba 2023, NORD DRIVESYSTEMS will present its large range of innovative drives from October 22 to 26, 2023 at the Fairground Munich. The presentation in Hall B3, Stand 490, will focus in particular on NORD solutions for hygienically sensitive applications in the baking and confectionery industry.

NORD-surface-treatment-nsd-tupH.jpg: The nsd tupH surface treatment offered by NORD is a powerful corrosion protection for gear units, smooth-surface motors, frequency inverters and motor starters in wash- down-optimised cast aluminium housings. 

The food industry places great demands on reliable, efficient and easy-to-clean drive solutions. NORD DRIVESYSTEMS offers a wide range of solutions for this area that help to reliably realise hygienically sensitive applications.

Alternative to stainless steel: nsd tupH surface treatment

The nsd tupH process developed by NORD DRIVESYSTEMS makes drive surfaces very corrosion-resistant, similar to stainless steel This is not a coating, but a treatment based on an electrolytic process that creates a protective layer that is permanently bonded to the substrate material. So nothing can detach or flake off.

Drives with the nsd tupH surface treatment are largely resistant to acids and alkalis and can be cleaned reliably and hygienically. The efficient surface treatment is thus perfect for use in hygienically critical areas in the food, beverage, packaging, pharmaceutical or chemical industry. It is also the optimum solution for applications in extremely humid environments, for example in maritime and coastal areas.

Fanless or smooth IE5+ synchronous motors

The new IE5+ motor generation was designed by NORD DRIVESYSTEMS with a special focus on its use in the food or beverage industry as well as the intralogistics sector. The IE5+ generation is available in both fanless and smooth versions up to a power of 4.0 kW with a continuous torque from 1.6 to 18.2 Nm and speeds from 0 to 2,100 min-1. The smooth-surface, hygienic design of the fanless variant is particularly efficient, easy to clean, corrosion-resistant and wash-down capable. It is therefore ideal for reliable use in hygienically sensitive environments. If desired, nsd tupH surface treatment and the protection class IP69K are available. The outstanding feature of the particularly compact and energy-efficient synchronous motors is their constant high efficiency – up to 95% over a wide torque range. As a result, they also offer optimum energy consumption performance in partial load and speed ranges.

NORD-SAFOMI-IEC.jpg: SAFOMI-IEC adapter for MAXXDRIVE® industrial gear units from NORD
DRIVESYSTEMS combined with a drive motor: less components, increased operational reliability SAFOMI-IEC adapter for agitators

The SAFOMI-IEC adapter (SAFOMI = Sealless Adapter For Mixers) from NORD DRIVESYSTEMS, which was specially developed for mixers and agitators has an integrated oil expansion chamber and thus provides the MAXXDRIVE® industrial gear units with decisive advantages such as increased reliability and reduced maintenance. Compact and simple in design, the adapter has an integrated oil expansion volume. Oil tanks and hoses as well as the radial shaft seal that is subject to leakage and wear between gear unit and IEC cylinder are not required. SAFOMI is available for MAXXDRIVE® parallel gear units and in sizes 7 to 11, i.e. for maximum output torques from 25 to 75 kNm. The compact combination of the MAXXDRIVE® industrial gear unit, SAFOMI-IEC adapter and a drive motor is an optimal choice for mixer and agitator applications in order to reduce wearing and attached components.

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Global resources are becoming increasingly scarce and responsible use of them is crucial to counteracting climate change. With over 57.4 million tons of electronic waste produced annually (2021) at a net worth of nearly $60 billion, e-waste constitutes one of the largest waste streams. Keeping resources circulating in the value chain for as long as possible is one way to tackle this challenge. A circular economy helps extend the lifecycle of products, saving resources and energy. Providing reliable spare parts for electronic devices plays a major role in this concept. Authentication solutions like the Infineon Technologies AG’s (FSE: IFX / OTCQX: IFNNY) OPTIGA Authenticate product family support the verification of spare parts as well as original products and contribute to a trustworthy, sustainable economic approach.

A circular approach to electronic products is defined by what is called the 6R concept: Reduce, reliability, repair, reuse, refurbish and recycle.

To Infineon, circular economy is relevant on different levels: These principles not only guide the company’s waste management for instance by reusing solvents in the manufacturing process. Infineon’s product design also aims to reduce resource consumption and hazardous waste and replace critical substances. On the other hand, Infineon delivers products to customers that help them innovate and create more sustainable solutions to the market based on the principles of circularity.

Sustainable and reliable – thanks to OPTIGA Authenticate security solutions

The Right to Repair regulation, for example, is not only under the umbrella of the European Green Deal, but also part of national sustainability programs worldwide. Infineon security solutions such as the OPTIGA Authenticate family support manufacturing companies in efficiently and purposefully addressing some of the key challenges of these new regulations and in reducing their environmental footprint.

The goal of the EU’s Right to Repair, Battery and Ecodesign initiatives is to save resources and increase energy efficiency of products. With regards to the Right to Repair this means that consumers not only have a right to the availability of spare parts. It should also be kept in mind that in many cases non-professionals have to be able to repair the product. Manufacturers therefore face the challenge of meeting their warranty claims, but also providing spare parts, while at the same time protecting the quality of their brand and their intellectual property as well as protecting the safety of end users.

“The OPTIGA Authenticate product family allows authentication of devices, the verification of spare parts and of the genuineness of original products. This enables product safety for end users and helps manufacturing companies meet quality and performance standards for electronic devices”, explains Josef Haid, Distinguished Engineer Security System Architectures Infineon Technologies. “Authenticators also create more security and transparency for consumers, since they can trust the authenticity and quality of devices and spare parts. Moreover, due to the increased demand for spare parts, it opens up a new market for the industry, covers potential warranty claims, and prevents counterfeiting at the same time.”

Authentication solutions protecting consumers and products

The OPTIGA Authenticate product family can be used in a wide range of replaceable components for example within a smartphone ecosystem. In a smartphone, elements such as batteries, displays and camera modules as well as power adapters, wireless chargers, and headphones (see graphic) can be equipped with authenticators. In addition, OPTIGA Authenticate security solutions can be used in other electronic devices such as power tools, notebooks, light electric vehicles, multicopters, VR/AR applications and many more. The mechanism is very simple: The OPTIGA Authenticate S security chip is integrated in a product, for example, the battery (client) of an e-scooter (host). This allows the host and client to communicate with one another and authenticate themselves, letting the host verify that the battery is original or that it conforms to certain standards. The authentication process itself is managed by the exchange of certificates, keys, and cryptographic tasks.

Authentication solutions such as the OPTIGA Authenticate product family are an easy and cost-efficient way for manufacturers to help meet legal requirements and protect their brand value from potential counterfeits. With the OPTIGA Authenticate product family, Infineon takes another step towards a circular economy, making it possible for its customers to build more sustainable solutions.

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Infineon Technologies AG has taken over as head and coordinator of the broad-scope European research project EECONE (European ECOsystem for greeN Electronics), intended to make electronics in Europe more sustainable. The objective is to investigate the corresponding technologies along the entire value chain, from design, manufacture and use all the way to recycling. EECONE is one of the Key Digital Technologies research projects supported by the European Union as a Joint Undertaking. 49 partners are participating in the project, which has a volume of approximately 35 million euros total costs. The project is being funded by the European Union and the national governments of the participating companies with around 20 million euros.

“Electronics are fundamental to improving the sustainability of many applications.
But this is not sufficient, electronics themselves have to become greener,” says
Constanze Hufenbecher, Infineon Management Board member and Chief Digital
Transformation Officer. “Infineon is pleased to take on the lead role in the research
project EECONE in order to advance the circular economy together with our
partners along the value chain. The only way to achieve sustainability from design
and use and all the way to recycling is by working together.”

EECONE is aligned with the 6R concept (Reduce, Reliability, Repair, Reuse, Refurbish, Recycle); the amount of materials required by electronics is to be reduced, electronics are to be made more reliable, easier to fix and use again, and easier to recondition and to recycle. The project will investigate a total of ten application examples from the widest possible variety of fields in terms of developing green electronics. The applications are from the areas Automotive, Consumer Electronics, Health, Information and Communication Technologies, Aviation and Agriculture. Focus points are for example reducing the amount of material used by making circuit boards thinner or smaller, or improving sustainability by introducing materials which are easier to separate during recycling. Facilitating the replacement of not only circuit boards but also of semiconductors is to make it easier to repair devices. The technologies involved could also make it possible to reuse and recycle electronic components. The project will in addition develop technologies which for example generate and store their own power in IoT devices. New, ecologically friendly materials are to make it easier to recycle lithium-ion batteries. Artificial Intelligence will be used to prolong the service lives of electronic equipment, while tools for more sustainable electronic design, including comprehensive impact assessments for the use of electronics, are to be developed as well. EECONE also covers the use, dissemination and standardization of electronics and will train specialists in handling electronic refuse.

The EECONE research project has a planned duration of three years. It will establish decisive foundations for the sustainable development, manufacturing and use of electronics in Europe. The on-site inaugural event of the project will be held in Toulouse on 20 and 21 September 2023.

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At the International Symposium on Automotive Lighting (ISAL 2023) in Darmstadt, Germany (25-27 September), ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has unveiled ALIYOS LED-on-foil technology, which it says opens up new possibilities for design freedom and creativity in automotive lighting...

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — says that its board of directors has appointed Ron Nicol as executive chairman. After joining the firm as a director in 2020, Nicol has been the independent chairman of the board since earlier this year. In his newly extended role, he will prioritize scaling commercial efforts as well as executive administrative functions...

New developer software for STM32H5 leverages ST’s Secure Manager to simplify safe connectivity to AWS IoT devices platform

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has added new software to its STM32Cube development tools that simplify connecting high-performing Internet of Things (IoT) devices to the AWS cloud.

ST has released the X-CUBE-AWS-H5 expansion package which enables a seamless and secure connection to the AWS cloud. It contains a set of libraries and application examples designed for high-performance microcontrollers of the STM32H5 series, which act as end devices.

The solution is built on the FreeRTOS open-source real-time operating system and ST’s Secure Manager embedded security software. The recently announced STM32H5 Discovery kit is available to use with this solution and lets developers easily and securely connect their STM32H5-based prototypes to AWS IoT Core.

 “The STM32H5 is ready for the next generation of IoT edge devices, bringing the performance to handle complex applications within a tight energy budget,” said Daniel Colonna, STM32 Marketing Director, STMicroelectronics. “The STM32Cube ecosystem helps developers unleash its powerful capabilities, accelerate development, and, with our latest software, connect securely to the powerful storage and data analytics services in the AWS cloud.”

STM32H5 is one of the most powerful Arm® Cortex®-M33 MCU series. Devices are programmed with their own immutable identity at the ST factory. Combined with ST’s Secure Manager, this simplifies registering smart devices to the AWS cloud and removes the need for costly infrastructure otherwise necessary to keep the identities of IoT objects secret during their production. 

Remote provisioning and administration of credentials will also be available via third-party service providers, during the production of devices and in the field.

The isolation properties provided by Secure Manager enable the intellectual property of multiple owners to be protected. This is also known as multitenant IP protection. It is part of a comprehensive set of services that protect the confidentiality and integrity of assets belonging to STM32 developers and partners, through development, manufacturing, and in the field.

This is a perfect fit for edge AI use cases, where models are running on the edge, on devices, protected by the Secure Manager, and further trained and securely updated via the cloud. The STM32Trust TEE Secure Manager makes stronger security simpler.

Overall, the STM32Cube ecosystem with STM32H5 microcontrollers provides developers with a powerful and secure platform for developing IoT applications that comply with future regulations and standards. STM32H5, introduced in March 2023, is the first to support Secure Manager and targets PSA Certified level 3 and SESIP3 certifications.

X-CUBE-AWS-H5 is ready to download now.

For more information, please go to www.st.com/x-cube-aws-h5.

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Intel has unveiled new glass substrate technology for large chiplet based system-in-package chips. Glass substrates allow for denser packing of chiplets—an important for applications like AI and others.

A new and improved GaN technology is moving from the cell phone charger market into higher power, high-reliability applications. EE Power spoke with Navitas’ Stephen Oliver to find out how, and we’ve got everything engineers need to know.

The use of multiplexer chips (typically various members of the 405x family) to control gain in transimpedance (current to voltage conversion) signal-processing and data acquisition op-amp circuits, is an established practice. Using a multiplexer (mux) to select the desired feedback resistor generally works well, but mux non-ideality can sometimes introduce significant, or even intolerable, conversion error. This is mostly due, of course, to the fact that the Ron (on-resistance) of the switches that comprise muxes is always greater than zero, and their Roff (off-resistance) is less than infinity. 

Wow the engineering world with your unique design: Design Ideas Submission Guide

Happily, simple circuit topologies exist that can reduce (or even eradicate) the worst of these erroneous effects of these pesky switch parameters, the choice depending on which (Ron or Roff) is the more serious problem in a given application. Figure 1 illustrates a trick that cancels Ron error.

Figure 1 Canceling mux Ron error by taking the output signal from the gain resistor side of switches.

 Typical mux Ron values run from 100 to 1000 Ω, tend to vary significantly with fabrication process (e.g., polysilicon gate vs metal) signal level, supply voltage, and temperature. Because they are electrically in series with the resistors, they switch in and out of the circuit and create corresponding feedback gain error at the amplifier output. These errors aren’t too serious so long as the gain setting resistor is at least a couple orders of magnitude larger than Ron like Figure 1’s R4 is, but can become intolerable for lower values like R1’s.

The Figure 1 circuit entirely evades these issues by employing an additional mux (U1a) to pick the output signal, not directly from A1’s output on U1b pin 13, but from the U1b pin that drives the selected gain resistor (R1 thru R4), thus bypassing and eliminating Ron error.

So much for Ron, but what about the other end of mux switch error spectrum:  Roff? 

Mux Roff resistances are also highly dependent on temperature and fabrication process, usually range from ones to hundreds of megaohms, and are effectively in parallel with the gain setting resistors, and thus can cause troublesome errors when gain resistors are more than a few tens of kiloohms. Figure 2 suggests a work-around when this is the situation.

Figure 2 Canceling mux Roff error by the routing leakage current to ground with Rz.

Figure 2’s Rz resistors serve to route the Vout/Roff leakage currents of U1b to ground, leaving only millivolts to be blocked by U1a. This trick reduces Roff error by orders of magnitude.

Of course, this ploy effectively places two mux Ron resistances in series with the gain-set resistors (R1 through R4), and so it must be used with caution lest it cause more error than it cures.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Nearly 100 submissions have been accepted since his first contribution back in 1974.

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The post Make gain-control multiplexer Ron and Roff errors (mostly) disappear appeared first on EDN.

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is stocking the latest innovations from Nexperia, a leading global high-volume manufacturer and supplier of discretes, logic and MOSFET devices. A winner of Nexperia’s “2022 E-Tailer of The Year” award, Mouser continues to expand its customers’ product development process by offering more than 13,000 parts from Nexperia.

Nexperia’s extensive portfolio, available from Mouser, includes diodes, bipolar transistors, electrostatic discharge (ESD) protection devices, MOSFETs, GaN FETs and analog and logic ICs that meet stringent automotive industry standards. These products are recognized as benchmarks in efficiency, process, size, power and performance, with industry-leading energy and space-saving packages.

Some of the newest Nexperia products available from Mouser include the Nexperia NEH2000BYJ energy harvesting power management integrated circuit (PMIC). This high-performance energy harvesting solution for low-power applications collects energy generated by ambient sources, such as light, to charge storage elements such as rechargeable batteries or hybrid supercapacitors– thereby eliminating the need for battery swaps. Nexperia’s Maximum Power Point Tracking (MPPT) uses an embedded hill-climbing algorithm to deliver maximum power to the load, independent of specific characteristics of the harvesters. The NEH2000BY does not require any inductor to function, allowing for a reduced BOM cost and a simpler system design for product designers. The companion NEVB-NEH2000BY evaluation boards allow convenient evaluation of the NEH2000BY energy harvesting PMIC. The boards offer a small form factor for easy integration into prototype applications.

The Nexperia NBM5100A/B and NBM7100A/B battery life booster ICs are designed to remove the limitations associated with coin cell batteries to enhance performance. Nexperia Battery Management ICs extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x. The NBM5100A and NBM7100A offer support for I2C interfaces, and the NBM5100B and NBM7100B provide support for SPI interfaces, allowing for design flexibility.

The Nexperia NBM5100A/B and NBM7100A/B battery life booster ICs are designed to remove the limitations associated with coin cell batteries to enhance performance. Nexperia Battery Management ICs extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x. The NBM5100A and NBM7100A offer support for I2C interfaces, and the NBM5100B and NBM7100B provide support for SPI interfaces, allowing for design flexibility.

Nexperia eMode GaN FETs offer voltage ranges of 100V to 650V with superior switching performance. These FETs deliver fast transition and switching capability and excellent power efficiency with low QC and QOSS values. Nexperia Low Voltage (< 200V) eMode GaN FETs provide optimum flexibility in power systems, enabling faster charging for e-mobility and wired / wireless changing systems, as well as significant space and BOM savings in LiDAR and low noise in Class D audio amplifiers.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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Compact, powerful, and densely populated, the BOXER-8651AI illustrates a design breakthrough for AAEON.

Industry-leading designer and manufacturer of edge AI solutions, AAEON, has released the BOXER-8651AI, a compact fanless embedded AI System powered by the NVIDIA Jetson Orin NX module. Consequently, the BOXER-8651AI takes advantage of the module’s NVIDIA Ampere architecture GPU, featuring 1024 CUDA and 32 Tensor Cores, along with support for NVIDIA JetPack 5.0 and above to provide users with accelerated graphics, data processing, and image classification.

With a fanless chassis measuring just 105mm x 90mm x 52mm, the BOXER-8651AI is an extremely small solution that houses a dense range of interfaces, including DB-9 and DB-15 ports for RS-232 (Rx/Tx/CTS/RTS)/RS-485, CANBus, and DIO functions. Additionally, the device provides HDMI 2.1 display output, GbE LAN, and a variety of USB Type-A ports, supporting both USB 3.2 Gen 2 and USB 2.0 functionality.

The BOXER-8651AI, despite containing such powerful AI performance for its size, is built to operate in rugged conditions, boasting a -5°F to 131°F (-15°C to 55°C) temperature range alongside anti-shock and vibration resistance features. Consequently, the PC is ideally suited for wall mounted deployment across a range of environments.

For storage, the system offers an M.2 3052 B-Key slot to accommodate M.2 2242 B+M Key SSDs and an M.2 2230 E-Key slot, ensuring users can take full advantage of the NVIDIA JetPack 5.0 software stack. Alternatively, these expansion options provide support for add-on modules to facilitate wireless communication, such as 5G, Wi-Fi, and Bluetooth.

The BOXER-8651AI is now available for order via both the AAEON eShop and its standard sales channels.

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Simplifying Designs and Saving Space in Consumer, Industrial, and Networking Applications, Industrial-Grade Devices Feature TLC NAND Flash Technology for Increased Reliability

Alliance Memory introduced new 32GB, 64GB, and 128GB industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, point-of-sale systems, and emerging embedded applications. For designers, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN simplify designs for fast and easy system integration in these products, speeding up product development and time to market while saving space by eliminating the need for an external controller. In addition, the device’s FTL software provides high reliability and stable performance with wear levelling and bad block management.

“With our latest eMMCs, we’ve extended our offering to include densities from 4GB all the way up to 128GB, providing designers with a wide range of options to meet their mass storage needs and solidifying our position as a leading supplier of eMMC technology,” said David Bagby, president and CEO, Alliance Memory. “Furthermore, with their TLC NAND flash technology, our new 32GB, 64GB, and 128GB solutions deliver even higher reliability, endurance, and performance, while maintaining the same ease of integration as our lower density devices.”

The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN operate over an industrial temperature range of -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.

Samples of the eMMCs are available now. Production quantities are available with lead times of eight to 10 weeks.

The post Alliance Memory Expands eMMC Offering With New 32GB, 64GB, and 128GB Solutions appeared first on ELE Times.

Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge Department of Engineering’s Electrical Power and Energy Conversion group in 2016 and designs, develops and commercializes power transistors and ICs that use GaN-on-silicon substrates — claims to be first to incorporate an individual 2D barcode on a gallium nitride (GaN) IC, which can be read by a standard, commercial code reader. This not only enables CGD to scan packaged devices and identify the circuit and the batch but also to learn exactly where on the wafer each individual die was made, providing vital data concerning process ruggedness and reliability...

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