Новини світу мікро- та наноелектроніки

Stealth fighter jets represent the pinnacle of modern military aviation, integrating advanced materials, aerodynamics, and electronic warfare capabilities to reduce their radar and infrared signatures. Below are the top 10 stealth fighter jets in the world, ranked based on their technology, combat effectiveness, and operational capabilities.

1. Lockheed Martin F-22 Raptor (USA)

The Lockheed Martin F-22 Raptor is a fifth-generation air superiority stealth fighter designed for unmatched dominance in aerial combat. Powered by twin Pratt & Whitney F119-PW-100 engines with thrust vectoring, it offers extreme maneuverability and supercruise capability at Mach 2.25. Its AN/APG-77 AESA radar provides superior situational awareness, while stealth technology minimizes radar cross-section (RCS). The F-22 carries AIM-120 AMRAAM and AIM-9X Sidewinder missiles in internal bays for reduced detectability. With integrated electronic warfare and sensor fusion, the F-22 excels in beyond-visual-range engagements, making it the most advanced operational fighter in the world.

2. Lockheed Martin F-35 Lightning II (USA)

The Lockheed Martin F-35 Lightning II is a state-of-the-art, multirole fifth-generation stealth fighter designed for air superiority, ground attack, and electronic warfare. Developed under the Joint Strike Fighter (JSF) program, it comes in three variants: F-35A (conventional takeoff), F-35B (short takeoff/vertical landing – STOVL), and F-35C (carrier-based operations). Equipped with an AN/APG-81 AESA radar, Distributed Aperture System (DAS) for 360-degree situational awareness, and sensor fusion capabilities, the F-35 provides unmatched battlefield connectivity. Its Pratt & Whitney F135 engine enables Mach 1.6 speed, while stealth coatings reduce radar detection, making it one of the most advanced fighters in service today.

3. Sukhoi Su-57 Felon (Russia)

The Sukhoi Su-57 Felon is Russia’s first fifth-generation stealth multirole fighter, designed to excel in air superiority and strike missions. Developed by Sukhoi for the Russian Air Force, it incorporates stealth technology, supercruise capability, and advanced avionics. The Su-57 is powered by twin Saturn AL-41F1 engines, with future upgrades expected to include the more powerful Izdeliye 30 engines for enhanced thrust and fuel efficiency. Equipped with the N036 Byelka AESA radar and L-band wing-mounted radars, it boasts superior detection capabilities. With internal weapons bays for reduced radar cross-section (RCS), the Su-57 is Russia’s answer to Western fifth-generation fighters like the F-22 and F-35.

4. Chengdu J-20 Mighty Dragon (China)

The Chengdu J-20 Mighty Dragon is China’s premier fifth-generation stealth fighter, developed by Chengdu Aerospace Corporation for the People’s Liberation Army Air Force (PLAAF). Designed for air superiority and deep-strike missions, it features stealth shaping, canard-delta wing configuration, and diverterless supersonic inlets (DSI) to minimize radar cross-section (RCS). The J-20 is currently powered by WS-10C engines, with future integration of WS-15 engines for improved supercruise. It is equipped with an AESA radar, advanced electronic warfare systems, and long-range PL-15 BVRAAMs. As China’s most advanced fighter, the J-20 enhances Beijing’s strategic reach and challenges Western air dominance.

5. Shenyang FC-31 Gyrfalcon (China)

The Shenyang FC-31 Gyrfalcon is China’s second fifth-generation stealth fighter, developed by Shenyang Aircraft Corporation primarily for export and potential naval carrier operations. Featuring stealth-optimized aerodynamics, twin WS-19 engines, and an AESA radar, the FC-31 is designed for multirole combat, including air superiority and precision strikes. Its internal weapons bay reduces radar cross-section (RCS), while advanced sensor fusion enhances situational awareness. The FC-31 is often compared to the F-35, offering a cost-effective alternative for international buyers. With ongoing improvements, it may become a key component of China’s future carrier-based fighter fleet for the PLAN (People’s Liberation Army Navy).

6. KAI KF-21 Boramae (South Korea)

The KAI KF-21 Boramae is South Korea’s next-generation 4.5-generation multirole fighter, developed by Korea Aerospace Industries (KAI) in partnership with Indonesia. Designed for air superiority and strike missions, it features stealth-optimized shaping, an AESA radar, and advanced avionics. Powered by twin General Electric F414-GE-400K engines, the KF-21 achieves Mach 1.8 with enhanced maneuverability. It integrates beyond-visual-range (BVR) missiles, including MBDA Meteor and AIM-120 AMRAAM, with plans for future internal weapons bays for stealthier operations. As South Korea’s most ambitious defense project, the KF-21 aims to bridge the gap between 4th- and 5th-generation fighters, bolstering regional air power.

7. Mikoyan MiG-41 (Russia, Under Development)

The Mikoyan MiG-41 is Russia’s next-generation sixth-generation interceptor, currently under development by Mikoyan (MiG) Design Bureau as a successor to the MiG-31 Foxhound. Designed for hypersonic speeds exceeding Mach 4, the MiG-41 will feature stealth technology, AI-assisted avionics, and advanced long-range weaponry. It is expected to operate in near-space environments, utilizing anti-satellite (ASAT) capabilities and next-generation air-to-air missiles. Equipped with a powerful AESA radar and advanced electronic warfare systems, the MiG-41 will enhance Russia’s air defense and strategic deterrence. Slated for deployment by the 2030s, it aims to be the world’s fastest and most advanced interceptor.

8. HAL AMCA (India, Under Development)

The HAL AMCA (Advanced Medium Combat Aircraft) is India’s first fifth-generation stealth fighter, being developed by Hindustan Aeronautics Limited (HAL) and the Aeronautical Development Agency (ADA) for the Indian Air Force (IAF). Designed for multirole operations, it features stealth technology, supercruise capability, and an advanced AESA radar. Powered by twin indigenously developed engines (initially GE F414, later a more powerful variant), the AMCA will carry internal and external weapons, including BVR missiles and precision-guided munitions. With sensor fusion, AI-based avionics, and network-centric warfare capabilities, the AMCA aims to bolster India’s air superiority, complementing Tejas and Rafale fighters by the 2030s.

9. Tempest (UK-led, Under Development)

The Tempest is a next-generation sixth-generation stealth fighter, being developed under the UK-led Global Combat Air Programme (GCAP) in collaboration with Italy and Japan. Designed to replace the Eurofighter Typhoon by the 2030s, Tempest will feature AI-assisted avionics, advanced sensor fusion, and optionally crewed capabilities. Powered by a next-gen adaptive cycle engine, it will enable supercruise and enhanced fuel efficiency. The aircraft will incorporate directed energy weapons, swarming drones, and advanced electronic warfare systems. With an emphasis on stealth, hypersonic weaponry, and cloud-based data sharing, Tempest aims to secure air dominance for NATO allies well into the future.

10. NGAD (Next Generation Air Dominance, USA, Under Development)
The Next Generation Air Dominance (NGAD) program is a U.S. Air Force initiative focused on developing advanced air combat systems to maintain air superiority in future conflicts. Currently under development, NGAD aims to create a family of interconnected, cutting-edge technologies, including advanced fighter aircraft, sensors, and artificial intelligence, to outpace emerging threats. The program seeks to integrate next-gen platforms capable of high-speed operations, advanced stealth features, and enhanced connectivity, ensuring the U.S. retains its dominance in the air domain for decades. NGAD is considered pivotal to evolving air warfare strategies in an increasingly complex and contested global environment.

Conclusion
Stealth fighters continue to evolve, integrating advanced materials, AI-driven avionics, and hypersonic weaponry. As air combat dynamics shift, future generations of stealth fighters will play a decisive role in global defense strategy. The emergence of sixth-generation programs like NGAD and Tempest suggests that air dominance will increasingly depend on networked warfare, artificial intelligence, and directed-energy weapons.

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For fourth-quarter 2024, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €22.7m, remaining strong as it was down just 2% on a high basis of comparison off €23.1m a year ago...

Tokyo-based Mitsubishi Electric Corp is to begin developing a prototype to demonstrate a junction-temperature estimation technology for power modules, which it is pursuing as a partner in the European Union’s Horizon Europe project aimed at developing advanced power modules and improving the cost efficiency of renewable energy power generation. The firm is participating through its European subsidiary Mitsubishi Electric R&D Centre Europe B.V., which has joined the project ‘Flagship Advanced Solutions for Condition and Health Monitoring in Power Electronics’ (FLAGCHIP)...

Vietnam has scored another victory in its bid to move beyond back-end assembly and packaging and establish an IC design and testing presence. Mixel, an analog and mixed-signal IP developer, is opening a design shop in Da Nang, Vietnam.

The San Jose, California-based design house provides interface IP solutions for MIPI, LVDS, and other multi-standard SerDes. It was the first IP provider to demonstrate silicon for MIPI D-PHY, MIPI C-PHY, and MIPI M-PHY. Mixel’s new design office in Vietnam—the first in Asia—will contribute to its IP development work.

Figure 1 A design house serving high-speed mixed-signal IP market will help develop engineering talent in Vietnam. Source: Mixel

It follows Vietnam’s inking of strategic pacts with two large EDA houses—Cadence and Synopsys—to advance design talent and cultivate a culture of semiconductor startups. Vietnam National Innovation Center (NIC), currently setting up the infrastructure for an IC design incubation center at Hoa Lac High-Tech Park in Hanoi, has joined hands with Cadence to accelerate IC design activities.

As part of this program, Cadence provides access to its design tools to academic institutes selected by NIC. University students and professors can use the Cadence tools and online training suites to gain real-world IC design expertise. Cadence is also introducing internships and job opportunities to Vietnamese engineers who are trained at NIC.

Next, Synopsys provides training licenses and educational resources to help NIC set up the chip design incubation center. Here, NIC investes in prototyping and emulation infrastructure to cultivate the IC design workforce in collaboration with Synopsys. The Sunnyvale, California-based EDA house also provides prototyping and emulation tools for software and hardware co-design in system-on-chip (SoC) devices.

Figure 2 Chip designers at NIC’s incubation center will be trained on the latest IC design tools. Source: Synopsys

Vietnam is striving to seize the moment amid trade tensions between China and the United States. In the so-called “China+1” investment strategy, Vietnam is emerging as a major beneficiary, so it wants to complement IC design with the existing back-end manufacturing, testing, and packaging businesses.

If Vietnam is successful in its bid to develop a vibrant IC design industry, it will also integrate the country into the global semiconductor ecosystem.

Related Content

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• Creating a Center of Excellence for IC Design
• Wanted: Process Engineers Versed in Packaging
• Design outsourcing: navigating a maze of decisions
• Has Malaysia’s ‘semiconductor moment’ finally arrived

The post Vietnam’s pivot to the IC design world appeared first on EDN.

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — has signed an agreement to develop a novel optical engine for use in a high-frequency securities trading operation for a global capital markets firm. High-frequency trading (HFT) is a type of automated trading that uses powerful computers to execute a large number of trades in fractions of a second...

Automated test solutions provider Teradyne Inc of North Reading, MA, USA and Infineon Technologies AG of Munich, Germany have entered into a strategic partnership to advance power semiconductor test...

• Q4 net revenues $3.32 billion; gross margin 37.7%; operating margin 11.1%; net income $341 million
• FY net revenues $13.27 billion; gross margin 39.3%; operating margin 12.6%; net income $1.56 billion
• Business outlook at mid-point: Q1 net revenues of $2.51 billion and gross margin of 33.8%
• Start of the company-wide program to resize global cost base*

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the fourth quarter ended December 31, 2024. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported fourth quarter net revenues of $3.32 billion, gross margin of 37.7%, operating margin of 11.1%, and net income of $341 million or $0.37 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “FY24 revenues decreased 23.2% to $13.27 billion. Operating margin was 12.6% compared to 26.7% in FY23 and net income decreased 63.0% to $1.56 billion. We invested $2.53 billion in Net Capex (non-U.S. GAAP) while delivering free cash flow (non-U.S. GAAP) of $288 million.”
• “Q4 net revenues were in line with the mid-point of our business outlook range driven by higher revenues in Personal Electronics offset by lower revenues in Industrial, while Automotive and CECP were as expected. Q4 gross margin of 37.7% was broadly in line with the mid-point of our business outlook range.”
• “Our book-to-bill ratio remained below 1 in Q4 as we continued to face a delayed recovery and inventory correction in Industrial and a slowdown in Automotive, both particularly in Europe.”
• “Our first quarter business outlook, at the mid-point, is for net revenues of $2.51 billion, decreasing year-over-year by 27.6% and decreasing sequentially by 24.4%; gross margin is expected to be about 33.8%, impacted by about 500 basis points of unused capacity charges.”
• “For 2025, we plan to invest between $2.0 to $2.3 billion in Net Capex (non-U.S. GAAP).”

Quarterly Financial Summary (U.S. GAAP)

(US$ m, except per share data)	Q4 2024	Q3 2024	Q4 2023	Q/Q	Y/Y
Net Revenues	$3,321	$3,251	$4,282	2.2%	-22.4%
Gross Profit	$1,253	$1,228	$1,949	2.1%	-35.7%
Gross Margin	37.7%	37.8%	45.5%	-10 bps	-780 bps
Operating Income	$369	$381	$1,023	-3.3%	-64.0%
Operating Margin	11.1%	11.7%	23.9%	-60 bps	-1,280 bps
Net Income	$341	$351	$1,076	-2.6%	-68.3%
Diluted Earnings Per Share	$0.37	$0.37	$1.14	0%	-67.5%

* For each of the concerned countries, the start of the program will take place in accordance with applicable regulations. 

Annual Financial Summary (U.S. GAAP)

(US$ m, except earnings per share data)	FY2024	FY2023	Y/Y
Net Revenues	$13,269	$17,286	-23.2%
Gross Profit	$5,220	$8,287	-37.0%
Gross Margin	39.3%	47.9%	-860 bps
Operating Income	$1,676	$4,611	-63.7%
Operating Margin	12.6%	26.7%	-1,410 bps
Net Income	$1,557	$4,211	-63.0%
Diluted Earnings Per Share	$1.66	$4.46	-62.8%

 

Fourth Quarter 2024 Summary Review

Reminder: On January 10, 2024, ST announced a new organization which implied a change in segment reporting starting Q1 2024. Prior year comparative periods have been adjusted accordingly. See Appendix for more detail.

Net Revenues by Reportable Segment (US$ m)	Q4 2024	Q3 2024	Q4 2023	Q/Q	Y/Y
Analog products, MEMS and Sensors (AM&S) segment	1,198	1,185	1,418	1.1%	-15.5%
Power and discrete products (P&D) segment	752	807	965	-6.8%	-22.1%
Subtotal: Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group	1,950	1,992	2,383	-2.1%	-18.2%
Microcontrollers (MCU) segment	887	829	1,272	7.0%	-30.2%
Digital ICs and RF Products (D&RF) segment	481	426	623	13.0%	-22.8%
Subtotal: Microcontrollers, Digital ICs and RF products (MDRF) Product Group	1,368	1,255	1,895	9.0%	-27.8%
Others	3	4	4	–	–
Total Net Revenues	$3,321	$3,251	$4,282	2.2%	-22.4%

 

Net revenues totaled $3.32 billion, representing a year-over-year decrease of 22.4%. Year-over-year net sales to OEMs and Distribution decreased 19.8% and 28.7%, respectively. On a sequential basis, net revenues increased 2.2%, in line with the mid-point of ST’s guidance.

Gross profit totaled $1.25 billion, representing a year-over-year decrease of 35.7%. Gross margin of 37.7%, 30 basis points below the mid-point of ST’s guidance, decreased 780 basis points year-over-year, mainly due to product mix and, to a lesser extent, to sales price and higher unused capacity charges.

Operating income decreased 64.0% to $369 million, compared to $1.02 billion in the year-ago quarter. ST’s operating margin decreased 1,280 basis points on a year-over-year basis to 11.1% of net revenues, compared to 23.9% in the fourth quarter of 2023.

By reportable segment1, compared with the year-ago quarter:

In Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group:

Analog products, MEMS and Sensors (AM&S) segment:

• Revenue decreased 15.5% mainly due to decreases in Analog and in Imaging.
• Operating profit decreased by 41.2% to $176 million. Operating margin was 14.7% compared to 21.1%.

Power and Discrete products (P&D) segment:

• Revenue decreased 22.1%.
• Operating profit decreased by 63.7% to $89 million. Operating margin was 11.9% compared to 25.4%.

In Microcontrollers, Digital ICs and RF products (MDRF) Product Group:

Microcontrollers (MCU) segment:

• Revenue decreased 30.2% mainly due to a decrease in GP MCU.
• Operating profit decreased by 66.4% to $127 million. Operating margin was 14.3% compared to 29.8%.

Digital ICs and RF products (D&RF) segment:

• Revenue decreased 22.8% mainly due to a decrease in ADAS (automotive ADAS and infotainment).
• Operating profit decreased by 33.2% to $149 million. Operating margin was 31.0% compared to 35.7%.

Net income and diluted Earnings Per Share decreased to $341 million and $0.37 respectively compared to $1.08 billion and $1.14 respectively in the year-ago quarter. As a reminder, the fourth quarter 2023 net income included a one-time non-cash income tax benefit of $191 million.

Cash Flow and Balance Sheet Highlights

				Trailing 12 Months
(US$ m)	Q4 2024	Q3 2024	Q4 2023	Q4 2024	Q4 2023	TTM Change
Net cash from operating activities	681	723	1,480	2,965	5,992	-50.5%
Free cash flow (non-U.S. GAAP)2	128	136	652	288	1,774	-83.8%

 

Net cash from operating activities was $681 million in the fourth quarter compared to $1.48 billion in the year-ago quarter. For the full-year 2024, net cash from operating activities decreased 50.5% to $2.97 billion, which represents 22.3% of total revenues.

Net Capex (non-U.S. GAAP), were $470 million in the fourth quarter and $2.53 billion for the full year 2024. In the respective year-ago periods, net capital expenditures were $798 million and $4.11 billion.

Free cash flow (non-U.S. GAAP) was $128 million and $288 million in the fourth quarter and full year 2024, respectively, compared to $652 million and $1.77 billion in the year-ago respective periods.

Inventory at the end of the fourth quarter was $2.79 billion, compared to $2.88 billion in the previous quarter and $2.70 billion in the year-ago quarter. Days sales of inventory at quarter-end was 122 days, compared to 130 days in the previous quarter, and 104 days in the year-ago quarter.

In the fourth quarter, ST paid cash dividends to its stockholders totaling $88 million and executed a $92 million share buy-back, as part of its current share repurchase program.

ST’s net financial position (non-U.S. GAAP) was $3.23 billion as of December 31, 2024, compared to $3.18 billion as of September 28, 2024 and reflected total liquidity of $6.18 billion and total financial debt of $2.95 billion. Adjusted net financial position (non-U.S. GAAP), taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $2.85 billion as of December 31, 2024.

Corporate developments

In Q4, we announced the launch of a new company-wide program to reshape our manufacturing footprint accelerating our wafer fab capacity to 300mm Silicon (Agrate and Crolles) and 200mm Silicon Carbide (Catania) and resizing our global cost base.

This program should result in strengthening our capability to grow our revenues with an improved operating efficiency resulting in annual cost savings in the high triple-digit million-dollar range exiting 2027. Specifically in terms of operating expenses (SG&A and R&D), ST expects annual cost savings totaling $300 to 360 million, exiting 2027, compared to the cost base of 2024.

Business Outlook

ST’s guidance, at the mid-point, for the 2025 first quarter is:

• Net revenues are expected to be $2.51 billion, a decrease of 24.4% sequentially, plus or minus 350 basis points.
• Gross margin of 33.8%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.06 = €1.00 for the 2025 first quarter and includes the impact of existing hedging contracts.
• The first quarter will close on March 29, 2025.

Conference Call and Webcast Information

A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until February 14, 2025.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macroeconomic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of intellectual property (“IP”) claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral by 2027 on scope 1 and 2 and partially scope 3;
• epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; and
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2023 as filed with the Securities and Exchange Commission (“SEC”) on February 22, 2024. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our Securities and Exchange Commission (“SEC”) filings, could have a material adverse effect on our business and/or financial condition.

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A low-noise chip-scale atomic clock (LN-CSAC), the SA65-LN from Microchip, features a profile height of less than 0.5 in. (12.7 mm). Aimed at aerospace and defense applications where size, weight, and power are critical, the SA65-LN delivers precise and stable timing, along with low phase noise and atomic clock stability.

Based on Microchip’s Evacuated Miniature Crystal Oscillator (EMXO) and integrated into a CSAC, the SA65-LN consumes under 295 mW. It also operates within a temperature range of -40°C to +80°C, maintaining its frequency and phase stability. Low power consumption and a wide temperature range enable battery-powered operation under extreme conditions.

The LN-CSAC combines the stability of an atomic clock with the precision of a crystal oscillator in a compact design. The EMXO offers low phase noise of <−120 dBc/Hz at 10 Hz and an Allan Deviation (ADEV) of <1E-11 at a 1-second averaging time. The atomic clock provides ±0.5 ppb initial accuracy, frequency drift of <0.9 ppb/month, and temperature-induced errors of <±0.3 ppb.

The SA65-LN is available now in production quantities. It is supported by Microchip’s Clockstudio software tool, a GUI, and developer kit.

SA65-LN product page

Microchip Technology

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Infineon has added five isolated gate drivers to its EiceDriver family optimized for driving IGBTs and SiC MOSFETs. AEC-qualified and ISO 26262-compliant, these third-generation drivers are well-suited for traction inverters in both cost-effective and high-performance xEV platforms. Additionally, they support Infineon’s HybridPack Drive G2 Fusion module, a plug-and-play power module that combines the company’s Si and SiC technologies.

The 1EDI302xAS series supports IGBTs up to 1200 V, while the 1EDI303xAS series is suited for SiC MOSFETs up to 1200 V. With an output stage of 20 A, the 1EDI3025AS, 1EDI3026AS, and 1EDI3035AS can drive inverters of all power classes up to 300 kW. The 1EDI3028AS and 1EDI3038AS variants have an output stage of 15 A, useful for entry-level battery EV and plug-in hybrid EV inverters. The gate drivers provide reinforced insulation per VDE 0884-17:2011-10, ensuring safe isolation.

All of the single-channel drivers are equipped with a configurable soft turn-off feature for enhanced short-circuit performance. Monitoring functions include overcurrent protection and an integrated self-test for desaturation protection. A continuously sampling 12-bit delta-sigma ADC with an integrated current source can read the voltage directly from temperature measurement diodes or an NTC.

Samples of the 1EDI3025AS, 1EDI3026AS, 1EDI3028AS, 1EDI3035AS, and 1EDI3038AS isolated gate drivers are available now.

EiceDriver product page

Infineon Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Keysight provides an end-to-end LPDDR6 memory design and test platform that improves device and system validation. It includes new test automation tools necessary for advancing AI, especially in mobile and edge applications.

Based on the UXR oscilloscope and M8040A bit error ratio tester, the complete setup includes transmitter and receiver test apps paired with the Advanced Design System (ADS) Memory Designer and EDA software. The LPDDR6 memory standard’s combination of high performance and power efficiency makes it particularly suitable for AI and machine learning workloads, high-speed digital computing, automotive systems, and data centers.

When used for transmitter testing, the platform reduces validation time with fully automated compliance testing and characterization. Engineers can analyze device BER performance with extrapolated eye mask margin testing and achieve accurate signal measurements directly from BGA packages with specialized de-embedding capabilities.

For receiver testing, the setup validates designs using with BER test methodology and pinpoints performance issues by testing against multiple jitter, crosstalk, and noise scenarios. It also ensures interoperability with both device and host controller validation.

The receiver and transmitter solution made its public debut at DesignCon 2025.

Keysight Technologies

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The NEX30606 step-down converter from Nexperia delivers up to 600 mA of output current with an operating quiescent current of just 220 nA. Supporting input voltages from 1.8 V to 5.0 V, the converter offers 16 resistor-settable fixed output voltages and uses constant on-time control for fast transient response.

Ultra-low quiescent current makes the NEX30606 well-suited for consumer wearables like hearing aids, medical sensors, patches, and monitors. It can also be used in battery-powered industrial applications, including smart meters and asset trackers. The converter provides greater than 90% switching efficiency for load currents ranging from 1 mA to 400 mA. Additionally, it has only 10 mV of output voltage ripple when stepping down from 3.6 VIN to 1.8 VOUT.

Nexperia also offers the NEX40400, a step-down converter that combines high efficiency with an operating quiescent current of 60 µA typical. It provides up to 600 mA of output current from a wide 4.5-V to 40-V input voltage range. The device employs pulse frequency modulation for high efficiency at low to mid loads and spread spectrum technology to minimize EMI. Target applications include industrial distributed power systems and grid infrastructure.

Visit the NEX30606 and NEX40400 product pages to check pricing and availability.

NEX30606 product page 

NEX40400 product page 

Nexperia

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Wolfspeed introduced its Gen 4 SiC MOSFET platform, supporting long-term roadmaps for high-power, application-optimized products. Gen 4 offerings include power modules, discrete components, and bare die available in 750-V, 1200-V, and 2300-V classes.

According to Wolfspeed, it is the only producer with both silicon carbide material and silicon carbide device fabrication facilities based in the U.S. This factor is becoming increasingly important under the new U.S. Administration’s increased focus on national security and investment in U.S. semiconductor production.

The Gen 4 platform was designed to improve system efficiency and prolong application life, even in the harshest environments. It is expected to deliver performance enhancements in high-power automotive, industrial, and renewable energy systems, with key benefits including: 

• Holistic system efficiency: Delivering up to a 21% reduction in on-resistance at operating temperatures with up to 15% lower switching losses.
• Durability: Ensuring reliable performance, including a short-circuit withstand time of up to 2.3 µs to provide additional safety margin.
• Lower system cost: Streamlining design processes to reduce system costs and development time.

Gen 4 SiC power modules, discrete components, and bare die are available now through Wolfspeed’s distributor network.

Wolfspeed

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No idea what I was doing. Attempted to replace 5 capacitors that split from capacitor plague. Burned myself twice, the whole job was hideous. The Xbox booted up, and it working fine! 10/10 will burn myself again! If you're unsure I'd you can do it or not, just go for it, you can do it! submitted by /u/wowreallyyyy [link] [comments]

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In its 2025 predictions for gallium nitride (GaN) power semiconductors, Infineon Technologies AG of Munich, Germany highlights that GaN will be a game-changing material for energy efficiency and decarbonization across the consumer, mobility, residential solar, telecoms, and AI data-center sectors, as GaN enables efficient performance, smaller size, lighter weight, and lower overall cost. While USB-C chargers and adapters have been the forerunners, GaN is now on its way to reaching tipping points in its adoption in further industry sectors, driving the market for GaN-based power semiconductors...