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India’s 3D printing industry has witnessed significant growth, driven by advancements in additive manufacturing technologies and a surge in demand across various sectors. Here are  ten leading 3D printing companies in India, each contributing uniquely to the nation’s technological landscape:

1. Imaginarium

Based in Mumbai, Imaginarium stands as India’s largest 3D printing and rapid prototyping company. Serving industries such as jewellery, automotive, and healthcare, they offer a comprehensive suite of services, including design validation, prototyping, and batch production. Their state-of-the-art infrastructure and technical expertise make them a preferred partner for businesses seeking innovative solutions.

2. Divide By Zero Technologies

Headquartered in Maharashtra, Divide By Zero Technologies is a prominent 3D printer manufacturer catering to small and medium enterprises. Their patented Advanced Fusion Plastic Modeling (AFPM) technology ensures high precision and reliability. Notable products include the Accucraft i250+ and Aion 500 MK2, which are utilized by industry giants like Samsung and Mahindra.

3. Altem Technologies

Operating from Bangalore, Altem Technologies provides cutting-edge 3D printing solutions using Dassault Systems’ 3D Experience Platform. Their offerings, such as ENOVIA, CATIA, and DELMIA, cater to diverse sectors including aerospace, defense, and medical. Recognized for innovation, they received the Frost & Sullivan 2017 Award for advancements in 3D printing.

4. think3D

Founded by BITS graduates, think3D is headquartered in Singapore with a significant presence in India. They offer a wide range of 3D printers, scanners, and filaments, serving clients like Microsoft, Shell, and the Indian Navy. Their customized training programs, especially for schools under the Atal Innovation Mission, highlight their commitment to education and innovation.

5. Novabeans

Established in 2014, Novabeans operates offices in Gurgaon, Delhi, and Paris. As authorized resellers of brands like Ultimaker and LeapFrog, they provide a range of 3D printing solutions. Their 3D Printing for Education Program underscores their dedication to integrating additive manufacturing into academic curricula.

6. JGroup Robotics

Specializing in Fused Deposition Modeling (FDM) technology, JGroup Robotics offers 3D printers, on-demand services, and printing materials. Their printers utilize thermoplastic filaments to create precise three-dimensional objects, catering to various industrial applications.

7. 3Ding

With branches in Chennai, Bangalore, Hyderabad, and Mumbai, 3Ding is one of India’s oldest 3D printing suppliers. They offer a diverse range of 3D printers, scanners, and printing materials from leading brands. Their services include 3D design, printing, and scanning, along with workshops and training programs to promote additive manufacturing.

8. Boson Machines

Based in Maharashtra, Boson Machines is a leading 3D printing manufacturer utilizing technologies like FDM, SLA, and SLS. They offer services such as part production, injection molding, and CNC machining, providing comprehensive solutions from design to production.

9. 3D Print World

Operating under the leadership of Ankit Murarka, Aman Kedia, and founder Alok Goenka, 3D Print World offers top-tier 3D printing services and supplies printers and raw materials across India. Their commitment to delivering quality outputs promptly has established them as a trusted partner in the additive manufacturing sector.

10. Accreate Additive Labs

Co-founded by Ravi Shankar and Ravi Seshadri, Accreate Additive Labs provides design innovation in 3D printing by combining functional expertise with technological prowess. They focus on creating globally relevant intellectual property through their advanced additive manufacturing solutions.

The post Top 10 3D Printing Companies in India appeared first on ELE Times.

While finetuning its products and manufacturing process roadmap, Intel has realized that there are no quick fixes. After a briefing from Intel co-CEOs Michelle Holthaus and David Zinsner on upcoming CPUs and a slowdown in the ramp of the 18A node, Alan Patterson caught up with industry analysts to take a closer look at Intel’s predicament. He spoke with them about delayed CPU launches, the lack of an AI story, and the fate of Intel Foundry.

Read the full story at EDN’s sister publication, EE Times.

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• Intel’s Commitments to Europe: From Pride to Prejudice
• Intel Years From Success in Foundry Business, Analysts Say

The post Intel comes down to earth after CPUs and foundry business review appeared first on EDN.

Battery-powered applications, which have become indispensable over the last decade, require a certain level of protection to ensure safe use. This safety is provided by the battery management system (BMS). The BMS monitors the battery and possible fault conditions, prevents any hazardous situation due to the battery or its surroundings, and ensures that there is an accurate estimation of the battery’s remaining capacity or the level of battery degradation.

The main structure of a BMS for a low- or medium-voltage battery is commonly made up of three ICs, as described below:

1. Battery monitor and protector: Also known as the analog front-end (AFE), the battery monitor and protector provides the first level of protection since it’s responsible for measuring the battery’s voltages, currents, and temperatures.
2. Microcontroller unit (MCU): The MCU, which processes the data coming from the battery monitor and protector, commonly incorporates a second level of protection, including monitoring thresholds.
3. Fuel gauge (FG): The fuel gauge is a separate IC that provides the state-of-charge (SOC), state-of-health (SOH) information and remaining runtime estimates, as well as other user-related battery parameters.

Figure 1 The BMS architecture displays the key three building blocks. Source: Monolithic Power Systems

Figure 1 shows the main structure of a complete BMS for low- or medium-voltage batteries. The fuel gauge can be a standalone IC, or it can be embedded in the MCU. The MCU is the central element of the BMS, taking information from both the AFE and fuel gauge and interfacing with the rest of the system.

While three main components constitute the BMS, using these components without any additional consideration is not enough to ensure that the system meets the safety level required by certain industries. This article will explain the role that functional safety plays in non-automotive battery management systems and how to achieve the required safety level.

Functional safety introduction

Functional safety is a branch of overall safety focused on reducing the risk produced by hazardous events due to a functional failure of an electric/electronic (E/E) system. The goal is to ensure that the residual risk is within an acceptable range.

In recent years, the increasing use of E/E systems in different fields such as automotive, machinery, medicine, industry, and aviation has been accompanied by a greater emphasis on functional safety. These changes have led to the development of different functional safety standards.

ISO 13849, titled “Safety of machinery – Safety related part of control systems”, is a functional safety standard focused on the safety-related parts of control systems (SRP/CS) in the machinery field. This is a field that includes a wide spectrum of applications, from generic industrial machinery to mopeds and e-bikes. ISO 13849 defines different safety levels as performance level (PL), which range from PLa (lower safety level) to PLe (higher safety level).

This safety standard defines an accurate process for risk evaluation and reduction. It proposes a simplified method to determine the achieved PL based on three parameters: category, mean time to dangerous failure (MTTFD), and average diagnostic coverage (DCAVG), which is calculated by averaging all the DC associated to the different safety measures applied in the system.

The category is a classification of an SRP/CS that describes its resistance to faults and the subsequent behavior in the event of a fault condition. There are 5 categories (B, 1, 2, 3, and 4).

Architecture has the biggest impact on the category. The basic architecture of an SRP/CS is composed of three functional blocks: an input, a logic block, and an output (Figure 2). Figure 2 corresponds with the architecture proposed for category B and category 1, and it’s called a “single-channel” architecture. A single-channel architecture is considered the most basic architecture to implement the nominal functionality of the SRP/CS, but it’s not intended for any diagnostic functionality.

Figure 2 The above architecture is proposed for category B and category 1. Source: Monolithic Power Systems

Category B and 1 rely on the reliability of their components (MTTFD) to ensure the integrity of the safety functions. If a component implementing the safety function has a failure, a safe state can no longer be guaranteed, as no diagnostics are implemented (DCAVG = 0).

For category 2, the proposed architecture is called “single-channel tested.” The base of this architecture is the same as the single-channel architecture, but with an added test equipment block that can diagnose whether the functional channel is working correctly. If a component implementing the safety function has a failure, the safety function is not carried out; however, a safe state can be achieved if the failure is diagnosed by the test equipment.

For category 3 and category 4, the proposed architecture is called “redundant channels,” which is implemented with two independent functional channels that can diagnose issues on the other channel. If a component implementing the safety function has a failure, the safety function can still be carried out by the other channel. Designers should select the SRP/CS category based on the targeted safety level of each safety function.

Achieving functional safety step-by-step

The ISO 13849 standard defines an iterative process during which the SRP/CS design is evaluated to determine the achieved PL and check whether that safety level is sufficient or must be improved in a new loop. The process includes three different methods for risk reduction: risk reduction via safe designs measures, risk reduction via safeguarding, and risk reduction via information for use. ISO 13849 supports risk reduction via safeguarding (Figure 3).

Figure 3 ISO 13849 supports risk reduction via safeguarding. Source: Monolithic Power Systems

The safeguarding process starts by defining the safety functions of the SRP/CS, in which the required performance level (PLr) is defined after the risk analysis is conducted. The PLr is the target PL of the SRP/CS for each safety function.

The next step includes designing the SRP/CS for the specified safety requirements. This entails considering the possible architecture, the safety measures to implement, and finalizing the design of the SRP/CS to perform the relevant safety functions.

Once the SRP/CS is designed, evaluate the achieved performance level for each safety function. This is the core step of the entire safeguarding process. To evaluate the achieved PL, define the category and then calculate the MTTFD and DCAVG of the SRP/CS for each individual safety function.

The MTTFD is calculated per channel, and it has three levels (Table 1).

Table 1 MTTFD, calculated per channel, has three levels. Source: Monolithic Power Systems

Table 2 shows the four levels for defining the DC of each diagnostic measure.

Table 2 There are four levels for defining the DC of each diagnostic measure. Source: Monolithic Power Systems

The achievable PL can be determined using the relevant parameters (Table 3).

Table 3 Relevant parameters help determine the achievable PL. Source: Monolithic Power Systems

The achievable PL can only be confirmed when the remaining requirements and analyses defined by the standard are implemented in the design. These requirements must comply with systematic failures management, common cause failure (CCF) analysis, safety principles and software development, if applicable.

Once this process is complete, the PL achieved by the SRP/CS for a concrete safety function should be verified against the PLr. If PL < PLr, then the SRP/CS should be redesigned, and the PL evaluation process must begin again. If PL ≥ PLr, then the SRP/CS has achieved the required safety level, and validation must be executed to ensure the correct behavior through testing. If there is an unexpected behavior, the SRP/CS should be redesigned. This process should be reiterated for each safety function.

Functional safety level according to each market

Battery-powered devices are used in countless markets, and each market demands different functional safety specifications according to how dangerous a failure could be for humans and/or the environment. Table 4 shows the functional safety level required by some of the main markets. Note that these levels are constantly changing and may be different depending on each engineering team’s design.

Table 4 This is how PL is determined based on market. Source: Monolithic Power Systems

Although these are the current performance level market expectations, electromobility and certain energy storage applications may move into PLd due to the constant issues in battery-powered devices around the world. For example, faulty energy storge applications have resulted in fires in U.S. energy storage system (ESS) facilities. In U.K., more than 190 persons have been injured, and eight persons have been killed by fires sparked by faulty e-bikes and e-scooters.

All these events could have been prevented by a more robust and reliable system. The constant need for increasing safety levels means it is vital to have a scalable solution that can be implemented across different performance levels.

A functional safety design proposal

Take the case of an ISO 13849-based BMS concept that Monolithic Power Systems (MPS) has developed by combining an MCU with its MP279x family of battery monitors and protectors. This system is oriented to achieve up to PLc safety level for a certain set of safety functions (SFs), as shown in Table 5. PLr determination is dependent on the risk analysis, in which small variations can take place, as well as the application in which the BMS is used.

Table 5 See the defined safety functions for the BMS concept. Source: Monolithic Power Systems

The solution proposed by MPS to achieve PLc can meet category 2 or category 3—depending on each safety function—as for certain safety functions. There is only a single input block and for others, there are redundant input blocks.

Figure 4 shows how to implement SF2 and SF4 to prevent the battery pack from over-charging and under-charging. In the implementation of the SRP/CS, there are two logic blocks: the battery monitor and protector (logic 1) and the MCU (logic 2). These logic blocks are used to diagnose correct functionality of different parts in the design.

Figure 4 Here is how to implement SF2 and SF4. Source: Monolithic Power Systems

The implementation of single or duplicated input is determined by the complexity and cost in each case. To ensure that the safety functions for a single input are compliant with PLc, additional safety measures can be taken to increase the diagnostic capability; an example is a cell voltage plausibility check to verify that the cell voltage measurements are correct.

Functional safety used to be relevant for automotive products, but nowadays most modern markets demand the manufacturer to comply with a functional safety standard. The best-known safety standard for non-automotive markets is ISO 13849, a system-level standard that ensures an application’s safety and robustness.

Miguel Angel Sanchez is applications engineer at Monolithic Power Systems.

Diego Quintana is functional safety engineer at Monolithic Power Systems.

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The post Functional safety in non-automotive BMS designs appeared first on EDN.

There are two built-in computers, one running windows 10 (visible on photo 8) and another one running (I think) custom firmware (little screen on top). There were 20 batteries total. You can see internal network switches there, amazing. We did an x ray of a drill to test it's functionality. Also as soon as we discovered it was running windows we had to open paint. We couldn't connect to internet due to security concerns, but it has 4 wireless antenas around it submitted by /u/antek_g_animations [link] [comments]

Remember my April 2023 teardown of Spotify’s now-defunct Car Thing?

Ditch the touchscreen LCD, broaden functionality and that’s Amazon’s Echo Auto in a nutshell:

Shown here and introduced in mid-2019 is the first-generation version of the product, which I’ll be tearing down today. It originally sold for $49.99 but was initially promo-priced at half that amount ($24.99), which is how it came to be in my possession that same summer. The second-gen successor, introduced three years (and three months) later with shipments beginning in mid-December 2022, was smaller, with beefier mounting options, equivalent claimed input-sound quality (in spite of fewer integrated mics) and a supposed superior sonic output, along with a permanent 24.99 price cut. It’s still available for purchase:

Considering that the first-gen Echo Auto has been sitting on my shelf for more than 5 years now awaiting my dissection attention, the beat-up condition of its packaging, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes, would be understandable…except that it’s looked like this since it first showed up at my front door!

Rip off the retaining tape and flip open the top flap:

and the contents come into view.

Post-removal, here’s our patient, alongside the similarly clear plastic-clad (at least for the moment) dashboard mount:

the “cigarette lighter” 12V socket-based power supply, flanked by (on the left) a 3.5mm TRS extension cable and (on the right) the USB-A to micro-USB power cable, all three of which I’ll hold on to for future reuse:

and, of course, a few slivers of documentation:

Next, a couple of additional looks at the adhesive dash mount (and its accompanying preparatory dashboard-cleaning handi wipe), now free of its clear plastic sarcophagus:

and the power adapter, with a handy included second USB-A jack, and decent aggregate output:

With the contents removed and its insides now ostensibly empty, the box still seems hefty, but I confirmed that there was nothing left within. Must be all those folded cardboard layers:

And now for some initial perspectives on our patient, with dimensions of 3.3” x 1.9” x 0.5” (85 mm x 47 mm x 13.28 mm) and a weight of 1.6 oz (45 grams). Front:

The left “mute” button, by the way, turns red when active, as with other Echo devices, as does the more general multicolor device-status light bar along the bottom edge:

The device top is comparatively bland, although there is that inside access-tempting seam:

The sides are more interesting. Along the right are the 3.5mm auxiliary analog audio output and the micro-USB power connector. The former was a key motivation for me to initially buy the Echo Auto, as none of my vehicles have integrated Bluetooth, far from Apple’s CarPlay or Google’s Android Auto services—only my wife’s newer car does—but their sound systems all have AUX inputs.

And on the left? No, that’s not a SD card slot. Believe it or not, it’s the aperture for the integrated speaker, pointing toward the vehicle’s driver (at least sometimes):

Finally, the device backside, revealing (among other things) the FCC ID (2ALV8-4833) and magnetic dash mount inset (I trust there’s metal inside, on the other side of the chassis):

Speaking of “inside”, let’s get to it. A preparatory peek underneath one of the rubber feet seemingly wasn’t promising:

So, I turned my attention to the aforementioned top side seam. The first “spudger” I tried slipped inside fairly easily but was too flimsy to make any separation headway:

Its beefier Jimmy sibling, however, was no more successful:

On a hunch, I revisited those feet. That grey piece of plastic you saw underneath the one in the earlier photo? Turns out, it pops out too:

And underneath each of the plastic pieces is a hex screw head begging for attention:

That’s more like it:

FWIW, as it turns out from my subsequent research, I wasn’t the only one initially flummoxed!

There’s that piece of metal I’d previously forecasted would be on the other side of the dashboard mount inset. Below it, along the bottom edge, is a portion of the light guide assembly (presumably associated with a to-be-seen row of LEDs on the PCB):

And here’s our first glimpse of the system’s guts:

On the left (right when viewed from the front; remember that we’ve so far removed the back panel) is the micro-USB power input, with the 3.5 mm audio jack above it. Along the bottom are—I told you so—a row of 11 multicolor LEDs. At the top is the PCB-embedded Bluetooth antenna. And on the right? That, believe it or not, is the mono speaker! Let’s get it outta there:

Lest there be any doubt as to its magnet-inclusive acoustic identity:

And now for some closeups, with perspectives oriented per the transducer as originally installed in the previous photo. Right side, where the sound comes out; I seriously doubt it “goes to 11”:

Front:

Left side:

Back, exposing the speaker’s electrical contacts:

And finally, the top:

and bottom:

With the speaker removed, you can now see the PCB-resident “spring” contacts that mate up with those on the speaker. Note, too, that the PCB holes corresponding to mounting pins on the speaker backside are foam-reinforced, presumably to suppress vibration while in operation:

And now let’s get the PCB out of there, a thankfully easier process than what’d previously been necessary to get our first glimpse of it, as it now lifts right out of the remaining chassis half:

The stuck-on RFID tag inside the front chassis half is an interesting story in and of itself. As this blogger also postulates (in addition to identifying the source—Inpinj—of the IC connected to the comparatively massive antenna), I believe that it finds use in uniquely associating the device with your Amazon account prior to its shipment to you. To wit, I happened to notice, in reviewing my Amazon order history to refresh my memory of when I bought the Echo Auto and what I paid for it, that the device serial number was also included in the relevant transaction listing. And at the bottom is the other portion of the light guide assembly:

Here’s the already-seen PCB backside, now free of its previous plastic chassis surroundings:

And here’s the first-time glimpsed PCB front side:

Let’s first get rid of that rubber gasket, which thankfully peeled off easily:

Note the LEDs straddling the left-side switch, which generate the red “mute” indication. Note, too, eight total circular apertures for the microphone array, one in each corner of each of the two switches. And as for the ICs between the switches, let’s zoom in:

Unfortunately, I had no luck in identifying any of these; I’m once again hopeful that insightful readers can fill in the missing pieces. The one at the bottom (U10), when correctly oriented (it’s upside-down marked in the photo) has what looks to be an “OXZ” company logo stamped in the upper left corner. The three-line product marking next to it looks like this:

L16A
0225
ZSD838A

I found similar markings (albeit with second-line deviations) on an IC inside a 2018-2019 13” Apple MacBook Air, within a Facebook post which I stumbled across thanks to Google Image Search, but that’s all I’ve got. Above it are two ICs (U2 and U6) identically marked as follows:

YE08
89T

which may be 8-bit bidirectional voltage-level translators, specifically Texas Instruments’ TXB0108. And in U10’s upper right corner is another (U9) with the following two-line marking:

T3182
3236A

Again…

Let’s flip the PCB back over to its backside and see if we have any better luck. Step one is to get those two Faraday Cages’ tops off:

That’s better:

The IC at far left (U20), next to a wire-wound inductor whose guts seem to have been inadvertently exposed by the spudger while removing the cage, is labeled thusly (and faintly so):

25940A
TI 89I
AE24

“TI” stands for “Texas Instruments”, I’m pretty confident, reflective of the longstanding partnership between that supplier and Amazon also noted in several of my past Echo product dissections. And Texas Instruments does have a “25940” in its product line, specifically the TPS25940, the “eFuse Power Switch”, a “compact, feature-rich power management device with a full suite of protection functions, including low power DevSleep support”. If that’s actually what this chip is, its proximity to the micro-USB power input therefore makes sense. But the product page also claims that the TPS25940 is intended for use in SSDs. Hmm…

Above and to the right of it is another chip with “TI” in the markings (U14), but the first line thankfully makes its function more obvious, at least as far as I’m guessing:

DAC
3203I
TI 88J
PL49

This, I believe, is Texas Instruments’ TLV320DAC3203 “stereo” audio DAC with a stereo 125-mW headphone driver and audio processing. Proximity is again part of the probable identity tip-off here, since it’s near the analog audio output. Plus, of course, there’s the first-line “DAC” mark…

Move further to the right and the next large(r) IC you encounter (U19), also seemingly chipped in one corner during my clumsy cages-removal surgery, has the following two-line primary markings (along with, above them, a combo mysterious swirl followed by a seeming QR code):

W902B108
SR3F2

Google searches on the markings proved fruitless but, based on some other research I’ve done on this system, I’m still going to take a guess. The Amazon product page indicates that in addition to the main system SoC (hold that thought), there’s also an “Intel Dual DSP with Inference Engine” inside. The relevant DeviWiki product page further clarifies that it’s an “Intel Quark S1000 Processor.” Indulge me in a brief history diversion: a bit more than a decade ago, Intel announced its Quark line of defeatured 32-bit x86 processors (even more so than its Atom CPUs) for wearables and other cost- and power-sensitive applications. The Quark family, which Intel obsoleted in 2019, also included at least one coprocessor, the S1000, which embedded two Cadence Tensilica LX6 DSP cores. Intended for speech recognition, I assume that the S1000 also handled echo cancellation, background noise suppression and other array mic functions in this particular design. And I’m also guessing that, although there’s no Intel logo mark, it’s this chip.

Now for the main system SoC (U23), which is to the right of the previous “mystery chip” and is thankfully more easily identifiable. It’s MediaTek’s MT7697, introduced in 2016 and described as a “highly integrated 1T1R 2.4GHz Wi-Fi/Bluetooth 4.2 application processor with an Arm Cortex-M4 and a power management unit”, MediaTek being another supplier with a longstanding Amazon relationship.

Which leads us to the last chip I’ll showcase, to its right, with a two-IC PCB identifier (U17/U18). At first, I thought the “MT” mark might also indicate MediaTek sourcing but, given that the MT7697 already also handles Bluetooth and power management functions, I couldn’t think of anything else this one could tackle. But then I remembered I hadn’t yet mentioned memory, either volatile or nonvolatile. This insight led me to suspect that “MT” probably instead stands for “Micron Technology” and that this is a stacked module containing both DRAM and flash memory (capacities and specific technology types and generations unknown).

In closing, I’ll (re)point out two other aspects of this side of the PCB; the eight MEMS microphones whose apertures you saw earlier on the other side, and the PCB-embedded top-edge Bluetooth antenna that I first noted when the PCB was still chassis-bound. And with that, having just passed through 2,000 words, I’ll wrap up with a reiteration of the invitation to assist me with any/all of the ICs I was unable to ID, and/or to share any other insights or other thoughts, in the comments. Thanks as always in advance!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

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• Teardown: Amazon Echo Dot vs Google Home Mini

The post Amazon’s Echo Auto Assistant: Legacy vehicle retrofit-relevant appeared first on EDN.

Discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc of Malvern, PA, USA has introduced 16 new 650V and 1200V silicon carbide (SiC) Schottky diodes in the industry-standard SOT-227 package...

In recent years, the adoption of eSIM (embedded SIM) technology in India has surged, offering users enhanced flexibility and convenience in managing mobile network connections. This article provides an overview of the top eSIM providers in India, highlighting their offerings and key features.

1. Reliance Jio

Reliance Jio, a leading telecom operator in India, offers eSIM services with extensive coverage and affordable data plans. Their prepaid eSIM plans start at ₹75 for 6GB of data and extend to annual plans priced at ₹4,199, providing 740GB of data. Jio boasts over 99% population coverage across India, ensuring reliable connectivity for its users.

2. Bharti Airtel

Airtel is another major telecom provider in India offering eSIM services. Known for its robust network and customer service, Airtel provides a range of eSIM plans catering to various user needs. The activation process is straightforward, and users can manage their eSIM profiles through the Airtel Thanks app.

3. Vodafone Idea (Vi)

Vodafone Idea, commonly known as Vi, offers eSIM services to its postpaid customers. The company provides a variety of plans with competitive pricing and decent coverage across the country. However, it’s important to note that eSIM services are currently limited to postpaid users.

4. BSNL

Bharat Sanchar Nigam Limited (BSNL), a state-owned telecom operator, has been expanding its services to include eSIM technology. While still in the rollout phase, BSNL aims to provide eSIM options to its customers, enhancing their connectivity experience.

5. Holafly

Holafly is a Spanish company that offers international eSIM services, including plans for travelers to India. They provide unlimited data plans ranging from 5 to 30 days, with prices starting at €29. Holafly is known for its multilingual customer support and quick response times, making it a popular choice among international travellers.

6. Airalo

Airalo is a global eSIM provider offering flexible plans for travelers to India. They provide various data packages to suit different durations and usage requirements. Airalo’s user-friendly platform allows for easy activation and management of eSIM profiles, making it a convenient option for those visiting India.

7. Sim Local

Sim Local offers the Smartroam eSIM, which operates on the Reliance Jio network in India. They provide a range of data-only plans, including options for unlimited data for 7 or 15 days. Prices start at $3.75 for a 7-day 1GB plan, with larger data packages available for extended stays. Sim Local’s money-back guarantee and allowance of WiFi hotspots add to its appeal.

8. Zetexa

Founded in India, Zetexa provides mobile internet connection services for tourists and international travelers through their international eSIM offerings. The company focuses on delivering seamless connectivity solutions, catering to the needs of travelers seeking reliable internet access during their stay in India.

9. Cavli Wireless

Cavli Wireless is an American technology company with a significant presence in India, where it has an R&D center and a manufacturing facility. The company develops cellular IoT modules with embedded SIM (eSIM) technology, aiming to improve connectivity and subscription management for IoT devices. Cavli Wireless partners with global telecommunications providers to offer IoT solutions, contributing to the advancement of eSIM technology in India.

10. Maya Mobile

Maya Mobile offers 30-day data plans for travelers to India, providing a balance between affordability and data allowance. Their eSIM services are designed to cater to the needs of international travelers seeking reliable internet connectivity during their stay in India.

 

In conclusion, the eSIM landscape in India is evolving, with both domestic telecom operators and international providers offering a variety of plans to meet the diverse needs of users. Whether you’re a resident seeking flexibility or a traveller aiming for seamless connectivity, the options listed above provide a range of choices to suit different requirements.

The post Top 10 eSIM Companies in India appeared first on ELE Times.

How to engage young learners and introduce them to coding? The most fun option is by playing games. Starting 2023, ST volunteers have developed a “Storyteller Robot” project and brought it to schools in the suburbs of Milan. By using a robot, this project helps young students in kindergartens and primary schools understand what coding means.

The goal of this project, like others developed by ST, is to promote knowledge of STEM subjects and careers in the scientific and technological fields. These skills are increasingly in demand in the job market. Additionally, this type of activity helps develop soft skills such as communication and teamwork from an early age, enhancing cohesion among participants.

Bridging the Digital Divide: the birth of the project “Narrativa Digitale” ST volunteer and students

The project Narrativa digitale (“Digital storytelling”) was born in 2023, thanks to the idea of some ST employees (Achille Colombo, Lavinia Fabrello, Luca Proverbio, Ramona Scaramuzzino, and Bruno Zappia), with the support of the colleagues Luisa Fracassini, Antonella Redaelli, and Ornella Tavilla. Its main objective is the reduction of the digital divide – a goal to which ST has always been committed through various types of knowledge dissemination and training activities:

• The ST Foundation is ST’s non-profit corporate foundation that aims to bridge the digital divide through education in communities around the world. It operates in 12 countries across Europe, Asia and Africa and is led by volunteers who design tailor-made programs for different groups of people, including children, adults, people with disabilities and seniors.
• The STEM your way program aims to inspire the next generation to study science, technology, engineering, and mathematics (STEM), thus developing the knowledge and skills needed to succeed in a technology-driven world. Many ST sites organize or take part at events to promote STEM education and allow young people to explore STEM-related careers. For example, ST Italy organizes innovation days for students in Naples and participates at the Maker Faire in Rome. In Singapore we host secondary school pupils and teachers to promote careers in electronics, while in France we take part at Extraordinary Factory (L’Usine Extraordinaire). STEM Your way also includes local events that are aimed at engaging younger people and connect with local communities, including local schools.

Through these activities ST employees make their skills and time available, excited by the idea of ​​transmitting their technical and cultural background built up during the years of work in the company. Some of the volunteers of Narrativa Digitale have twenty years of experience in volunteering for ST Foundation and this helped them to design the “Storyteller Robot”  project for schools.

In particular, this activity aims to introduce coding to primary schools as part of the broader objective to expand the reach and audience of our events and instilling a love for technology and STEM subjects even in preschool age.

The idea of ​​creating a training opportunity in primary schools was sparked thanks to a fortuitous conversation that one of our volunteers had with a teacher from an elementary school in Milan. The goal was to inaugurate the project in 2024 and then expand it. The Storyteller Robot has not only been used for activities in schools but also during an ST event held in Monza in October 2024, which was mainly aimed at primary and secondary school students.

The heart of the project: ST volunteers and young learners

The trainers who took part in the project Narrativa Digitale are ST employees (Ramona Scaramuzzino, Luca Proverbio, Lavinia Fabrello, Achille Colombo and Bruno Zappia, Domenico Genova, Laura Bonini) and have several years of experience in school activities. They also followed specific training (dedicated to a previous project – Coding and Learning), which was the result of a collaboration between ST Foundation, Università Cattolica and Fondazione ACRA.

Before being launched, the project was submitted for approval to the teaching staff of the beneficiary schools. At each meeting there were two trainers and the class teaching staff, who already knew the students, and gave useful advice on how to involve the children in the various activities. To date, the participants have been 8–9-year-old students from elementary schools (two classes from Cornaredo and one from Cerro Maggiore) and 5–6-year-old children from the last year of kindergarten (a class in Cerro Maggiore and one in San Vittore Olona), thus involving more than one hundred children. Extending the audience so much was a first for ST, which before this occasion had never addressed kindergarten children.

A fundamental requirement of the organized activities is the small size of the groups involved. The activity is a team game, which could not work properly if there is no effective communication between participants. The small number of groups formed favored the collaboration and proactive participation of each student.

The main activity: coding a tale

The Storyteller Robot is a little robot mouse with a button panel on its back and, in this activity, is programmed by children to move in space and tell a story. The mouse does not have a voice, but children lend him one, as he moves around on a path, from one episode of the story to another.

This mouse is 10 cm long and can memorize 40 commands. Specifically, the robot moves on an obstacle course, with the aim of proceeding from point A to point B while avoiding obstacles. The “problem solving” work is done at the desk in a group on sheets of paper while the verification part is done on the carpet where the children take turns to impersonate the robot. During the activity, programming sections and subsequent verification of the code are carried out: all the children can try to insert the commands, after having defined them on paper with their classmates, and see the result.

Each meeting is characterized by a theoretical introduction given by our volunteers, followed by the practical activity, in which ideas and results are shared. Specifically, the activities are generally structured in four lessons:

• First Lesson: Coding unplugged

Coding unplugged

During the first lesson, the goal is to introduce children to the concept of coding without the use of digital devices, that is “coding unplugged”. Children learn to write code on paper that will allow them to perform a mission and move in space. Then a child impersonates the robot and moves on a modular foam mat: the moves are based on the instructions given by the classmates, who read the code previously written together.

• Second Lesson: Programming the Robot

Children programming the robot

The “Robot Minstrel” device appears for the first time. The children receive recipes for which ingredients are needed. These ingredients are represented in a paper grid on which the mouse will then have to move.

In this case the children write the code together on paper and then validate it via the mouse who will have to move and collect all the ingredients for the recipe.

 

• Third Lesson: representing a story

Children’s drawings

In this lesson, the ST volunteers are absent, and it is the class teacher who leads the activity. The goal is to stimulate creativity and group work through a real story. The teacher tells a story and the children, divided into 6 groups, must produce drawings representing a part of the story. Each group produces 2 drawings, for a total of 12 drawings to then apply on the paper grid that corresponds to 12 stages of the story.

• Fourth Lesson: coding and storytelling

Code testing

During the last meeting, ST volunteers return to integrate the coding with the story of the previous lesson.

The children, still divided into 6 groups, write the code for the two stages of the story assigned to them (which correspond to the two drawings they created). Each group writes the code for their part of the story and checks it with the mouse on the grid. After this planning and verification phase, everyone reads the story together and moves the mouse, joining the various parts of the code written by the different groups.

Each group has to carefully plan, through the code, the movements of the mouse starting from the point where it had stopped in the previous stage. For this activity precision, collaboration and problem-solving are essential, in case it is necessary to adjust the code along the way.

Beyond the Code: the human impact

The results of the activities are multiple and touch different spheres of both learning and communication. Through questionnaires, we collected feedback from children, volunteers and teaching staff.

The children’s feedback was more than positive and 98% of them appreciated the proposed activities. All the children were able to collaborate fruitfully with their classmates to create a successful outcome. They learned to divide a problem into several parts and then tackle it as a whole and they experienced that what is planned on paper does not always work during the testing part. They also learned that a mistake is not a failure but that sometimes it can even be an opportunity to improve something that already exists or create something new.

The answers to the questionnaire also revealed a surprising aspect: regardless of the class and school, for most children, interacting and working with their classmates was the greatest challenge. This analysis may provide ideas for the teachers who participated, who could develop similar activities to foster cohesion among students.

The volunteers also learned from the training experiences. For example, they understood how fundamental it is to be able to manage the “dead time” between one shift and another: currently, in fact, each group must wait its turn to interact with the robot. To improve, it is necessary to optimize this wait and make it more productive and fun, introducing secondary activities for the groups that are waiting their turn.

What moved us the most was seeing how this collective activity could create inclusion among children and involve those with disabilities. Classmates helped each other to complete the activity and achieve the goals.

Coding everywhere

The main goal of this activity was to spark interest in scientific subjects, while playing a game. The main target was students, but teachers and parents were also enthusiastic. With this project we demonstrated how a single methodology can be used in different ways: coding can be taken out of the usual computer science class and mixed with other subjects such as language learning, technology, art, geography and civic education.

The post Introducing young learners to coding: ST activities for kindergarten and primary schools appeared first on ELE Times.

Stealth fighter jets represent the pinnacle of modern military aviation, integrating advanced materials, aerodynamics, and electronic warfare capabilities to reduce their radar and infrared signatures. Below are the top 10 stealth fighter jets in the world, ranked based on their technology, combat effectiveness, and operational capabilities.

1. Lockheed Martin F-22 Raptor (USA)

The Lockheed Martin F-22 Raptor is a fifth-generation air superiority stealth fighter designed for unmatched dominance in aerial combat. Powered by twin Pratt & Whitney F119-PW-100 engines with thrust vectoring, it offers extreme maneuverability and supercruise capability at Mach 2.25. Its AN/APG-77 AESA radar provides superior situational awareness, while stealth technology minimizes radar cross-section (RCS). The F-22 carries AIM-120 AMRAAM and AIM-9X Sidewinder missiles in internal bays for reduced detectability. With integrated electronic warfare and sensor fusion, the F-22 excels in beyond-visual-range engagements, making it the most advanced operational fighter in the world.

2. Lockheed Martin F-35 Lightning II (USA)

The Lockheed Martin F-35 Lightning II is a state-of-the-art, multirole fifth-generation stealth fighter designed for air superiority, ground attack, and electronic warfare. Developed under the Joint Strike Fighter (JSF) program, it comes in three variants: F-35A (conventional takeoff), F-35B (short takeoff/vertical landing – STOVL), and F-35C (carrier-based operations). Equipped with an AN/APG-81 AESA radar, Distributed Aperture System (DAS) for 360-degree situational awareness, and sensor fusion capabilities, the F-35 provides unmatched battlefield connectivity. Its Pratt & Whitney F135 engine enables Mach 1.6 speed, while stealth coatings reduce radar detection, making it one of the most advanced fighters in service today.

3. Sukhoi Su-57 Felon (Russia)

The Sukhoi Su-57 Felon is Russia’s first fifth-generation stealth multirole fighter, designed to excel in air superiority and strike missions. Developed by Sukhoi for the Russian Air Force, it incorporates stealth technology, supercruise capability, and advanced avionics. The Su-57 is powered by twin Saturn AL-41F1 engines, with future upgrades expected to include the more powerful Izdeliye 30 engines for enhanced thrust and fuel efficiency. Equipped with the N036 Byelka AESA radar and L-band wing-mounted radars, it boasts superior detection capabilities. With internal weapons bays for reduced radar cross-section (RCS), the Su-57 is Russia’s answer to Western fifth-generation fighters like the F-22 and F-35.

4. Chengdu J-20 Mighty Dragon (China)

The Chengdu J-20 Mighty Dragon is China’s premier fifth-generation stealth fighter, developed by Chengdu Aerospace Corporation for the People’s Liberation Army Air Force (PLAAF). Designed for air superiority and deep-strike missions, it features stealth shaping, canard-delta wing configuration, and diverterless supersonic inlets (DSI) to minimize radar cross-section (RCS). The J-20 is currently powered by WS-10C engines, with future integration of WS-15 engines for improved supercruise. It is equipped with an AESA radar, advanced electronic warfare systems, and long-range PL-15 BVRAAMs. As China’s most advanced fighter, the J-20 enhances Beijing’s strategic reach and challenges Western air dominance.

5. Shenyang FC-31 Gyrfalcon (China)

The Shenyang FC-31 Gyrfalcon is China’s second fifth-generation stealth fighter, developed by Shenyang Aircraft Corporation primarily for export and potential naval carrier operations. Featuring stealth-optimized aerodynamics, twin WS-19 engines, and an AESA radar, the FC-31 is designed for multirole combat, including air superiority and precision strikes. Its internal weapons bay reduces radar cross-section (RCS), while advanced sensor fusion enhances situational awareness. The FC-31 is often compared to the F-35, offering a cost-effective alternative for international buyers. With ongoing improvements, it may become a key component of China’s future carrier-based fighter fleet for the PLAN (People’s Liberation Army Navy).

6. KAI KF-21 Boramae (South Korea)

The KAI KF-21 Boramae is South Korea’s next-generation 4.5-generation multirole fighter, developed by Korea Aerospace Industries (KAI) in partnership with Indonesia. Designed for air superiority and strike missions, it features stealth-optimized shaping, an AESA radar, and advanced avionics. Powered by twin General Electric F414-GE-400K engines, the KF-21 achieves Mach 1.8 with enhanced maneuverability. It integrates beyond-visual-range (BVR) missiles, including MBDA Meteor and AIM-120 AMRAAM, with plans for future internal weapons bays for stealthier operations. As South Korea’s most ambitious defense project, the KF-21 aims to bridge the gap between 4th- and 5th-generation fighters, bolstering regional air power.

7. Mikoyan MiG-41 (Russia, Under Development)

The Mikoyan MiG-41 is Russia’s next-generation sixth-generation interceptor, currently under development by Mikoyan (MiG) Design Bureau as a successor to the MiG-31 Foxhound. Designed for hypersonic speeds exceeding Mach 4, the MiG-41 will feature stealth technology, AI-assisted avionics, and advanced long-range weaponry. It is expected to operate in near-space environments, utilizing anti-satellite (ASAT) capabilities and next-generation air-to-air missiles. Equipped with a powerful AESA radar and advanced electronic warfare systems, the MiG-41 will enhance Russia’s air defense and strategic deterrence. Slated for deployment by the 2030s, it aims to be the world’s fastest and most advanced interceptor.

8. HAL AMCA (India, Under Development)

The HAL AMCA (Advanced Medium Combat Aircraft) is India’s first fifth-generation stealth fighter, being developed by Hindustan Aeronautics Limited (HAL) and the Aeronautical Development Agency (ADA) for the Indian Air Force (IAF). Designed for multirole operations, it features stealth technology, supercruise capability, and an advanced AESA radar. Powered by twin indigenously developed engines (initially GE F414, later a more powerful variant), the AMCA will carry internal and external weapons, including BVR missiles and precision-guided munitions. With sensor fusion, AI-based avionics, and network-centric warfare capabilities, the AMCA aims to bolster India’s air superiority, complementing Tejas and Rafale fighters by the 2030s.

9. Tempest (UK-led, Under Development)

The Tempest is a next-generation sixth-generation stealth fighter, being developed under the UK-led Global Combat Air Programme (GCAP) in collaboration with Italy and Japan. Designed to replace the Eurofighter Typhoon by the 2030s, Tempest will feature AI-assisted avionics, advanced sensor fusion, and optionally crewed capabilities. Powered by a next-gen adaptive cycle engine, it will enable supercruise and enhanced fuel efficiency. The aircraft will incorporate directed energy weapons, swarming drones, and advanced electronic warfare systems. With an emphasis on stealth, hypersonic weaponry, and cloud-based data sharing, Tempest aims to secure air dominance for NATO allies well into the future.

10. NGAD (Next Generation Air Dominance, USA, Under Development)
The Next Generation Air Dominance (NGAD) program is a U.S. Air Force initiative focused on developing advanced air combat systems to maintain air superiority in future conflicts. Currently under development, NGAD aims to create a family of interconnected, cutting-edge technologies, including advanced fighter aircraft, sensors, and artificial intelligence, to outpace emerging threats. The program seeks to integrate next-gen platforms capable of high-speed operations, advanced stealth features, and enhanced connectivity, ensuring the U.S. retains its dominance in the air domain for decades. NGAD is considered pivotal to evolving air warfare strategies in an increasingly complex and contested global environment.

Conclusion
Stealth fighters continue to evolve, integrating advanced materials, AI-driven avionics, and hypersonic weaponry. As air combat dynamics shift, future generations of stealth fighters will play a decisive role in global defense strategy. The emergence of sixth-generation programs like NGAD and Tempest suggests that air dominance will increasingly depend on networked warfare, artificial intelligence, and directed-energy weapons.

The post Top 10 Stealth Fighter Jets in the World appeared first on ELE Times.

For fourth-quarter 2024, molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has reported revenue of €22.7m, remaining strong as it was down just 2% on a high basis of comparison off €23.1m a year ago...

Tokyo-based Mitsubishi Electric Corp is to begin developing a prototype to demonstrate a junction-temperature estimation technology for power modules, which it is pursuing as a partner in the European Union’s Horizon Europe project aimed at developing advanced power modules and improving the cost efficiency of renewable energy power generation. The firm is participating through its European subsidiary Mitsubishi Electric R&D Centre Europe B.V., which has joined the project ‘Flagship Advanced Solutions for Condition and Health Monitoring in Power Electronics’ (FLAGCHIP)...

Vietnam has scored another victory in its bid to move beyond back-end assembly and packaging and establish an IC design and testing presence. Mixel, an analog and mixed-signal IP developer, is opening a design shop in Da Nang, Vietnam.

The San Jose, California-based design house provides interface IP solutions for MIPI, LVDS, and other multi-standard SerDes. It was the first IP provider to demonstrate silicon for MIPI D-PHY, MIPI C-PHY, and MIPI M-PHY. Mixel’s new design office in Vietnam—the first in Asia—will contribute to its IP development work.

Figure 1 A design house serving high-speed mixed-signal IP market will help develop engineering talent in Vietnam. Source: Mixel

It follows Vietnam’s inking of strategic pacts with two large EDA houses—Cadence and Synopsys—to advance design talent and cultivate a culture of semiconductor startups. Vietnam National Innovation Center (NIC), currently setting up the infrastructure for an IC design incubation center at Hoa Lac High-Tech Park in Hanoi, has joined hands with Cadence to accelerate IC design activities.

As part of this program, Cadence provides access to its design tools to academic institutes selected by NIC. University students and professors can use the Cadence tools and online training suites to gain real-world IC design expertise. Cadence is also introducing internships and job opportunities to Vietnamese engineers who are trained at NIC.

Next, Synopsys provides training licenses and educational resources to help NIC set up the chip design incubation center. Here, NIC investes in prototyping and emulation infrastructure to cultivate the IC design workforce in collaboration with Synopsys. The Sunnyvale, California-based EDA house also provides prototyping and emulation tools for software and hardware co-design in system-on-chip (SoC) devices.

Figure 2 Chip designers at NIC’s incubation center will be trained on the latest IC design tools. Source: Synopsys

Vietnam is striving to seize the moment amid trade tensions between China and the United States. In the so-called “China+1” investment strategy, Vietnam is emerging as a major beneficiary, so it wants to complement IC design with the existing back-end manufacturing, testing, and packaging businesses.

If Vietnam is successful in its bid to develop a vibrant IC design industry, it will also integrate the country into the global semiconductor ecosystem.

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• Creating a Center of Excellence for IC Design
• Wanted: Process Engineers Versed in Packaging
• Design outsourcing: navigating a maze of decisions
• Has Malaysia’s ‘semiconductor moment’ finally arrived

The post Vietnam’s pivot to the IC design world appeared first on EDN.

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — has signed an agreement to develop a novel optical engine for use in a high-frequency securities trading operation for a global capital markets firm. High-frequency trading (HFT) is a type of automated trading that uses powerful computers to execute a large number of trades in fractions of a second...

Automated test solutions provider Teradyne Inc of North Reading, MA, USA and Infineon Technologies AG of Munich, Germany have entered into a strategic partnership to advance power semiconductor test...

• Q4 net revenues $3.32 billion; gross margin 37.7%; operating margin 11.1%; net income $341 million
• FY net revenues $13.27 billion; gross margin 39.3%; operating margin 12.6%; net income $1.56 billion
• Business outlook at mid-point: Q1 net revenues of $2.51 billion and gross margin of 33.8%
• Start of the company-wide program to resize global cost base*

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the fourth quarter ended December 31, 2024. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported fourth quarter net revenues of $3.32 billion, gross margin of 37.7%, operating margin of 11.1%, and net income of $341 million or $0.37 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “FY24 revenues decreased 23.2% to $13.27 billion. Operating margin was 12.6% compared to 26.7% in FY23 and net income decreased 63.0% to $1.56 billion. We invested $2.53 billion in Net Capex (non-U.S. GAAP) while delivering free cash flow (non-U.S. GAAP) of $288 million.”
• “Q4 net revenues were in line with the mid-point of our business outlook range driven by higher revenues in Personal Electronics offset by lower revenues in Industrial, while Automotive and CECP were as expected. Q4 gross margin of 37.7% was broadly in line with the mid-point of our business outlook range.”
• “Our book-to-bill ratio remained below 1 in Q4 as we continued to face a delayed recovery and inventory correction in Industrial and a slowdown in Automotive, both particularly in Europe.”
• “Our first quarter business outlook, at the mid-point, is for net revenues of $2.51 billion, decreasing year-over-year by 27.6% and decreasing sequentially by 24.4%; gross margin is expected to be about 33.8%, impacted by about 500 basis points of unused capacity charges.”
• “For 2025, we plan to invest between $2.0 to $2.3 billion in Net Capex (non-U.S. GAAP).”

Quarterly Financial Summary (U.S. GAAP)

(US$ m, except per share data)	Q4 2024	Q3 2024	Q4 2023	Q/Q	Y/Y
Net Revenues	$3,321	$3,251	$4,282	2.2%	-22.4%
Gross Profit	$1,253	$1,228	$1,949	2.1%	-35.7%
Gross Margin	37.7%	37.8%	45.5%	-10 bps	-780 bps
Operating Income	$369	$381	$1,023	-3.3%	-64.0%
Operating Margin	11.1%	11.7%	23.9%	-60 bps	-1,280 bps
Net Income	$341	$351	$1,076	-2.6%	-68.3%
Diluted Earnings Per Share	$0.37	$0.37	$1.14	0%	-67.5%

* For each of the concerned countries, the start of the program will take place in accordance with applicable regulations. 

Annual Financial Summary (U.S. GAAP)

(US$ m, except earnings per share data)	FY2024	FY2023	Y/Y
Net Revenues	$13,269	$17,286	-23.2%
Gross Profit	$5,220	$8,287	-37.0%
Gross Margin	39.3%	47.9%	-860 bps
Operating Income	$1,676	$4,611	-63.7%
Operating Margin	12.6%	26.7%	-1,410 bps
Net Income	$1,557	$4,211	-63.0%
Diluted Earnings Per Share	$1.66	$4.46	-62.8%

 

Fourth Quarter 2024 Summary Review

Reminder: On January 10, 2024, ST announced a new organization which implied a change in segment reporting starting Q1 2024. Prior year comparative periods have been adjusted accordingly. See Appendix for more detail.

Net Revenues by Reportable Segment (US$ m)	Q4 2024	Q3 2024	Q4 2023	Q/Q	Y/Y
Analog products, MEMS and Sensors (AM&S) segment	1,198	1,185	1,418	1.1%	-15.5%
Power and discrete products (P&D) segment	752	807	965	-6.8%	-22.1%
Subtotal: Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group	1,950	1,992	2,383	-2.1%	-18.2%
Microcontrollers (MCU) segment	887	829	1,272	7.0%	-30.2%
Digital ICs and RF Products (D&RF) segment	481	426	623	13.0%	-22.8%
Subtotal: Microcontrollers, Digital ICs and RF products (MDRF) Product Group	1,368	1,255	1,895	9.0%	-27.8%
Others	3	4	4	–	–
Total Net Revenues	$3,321	$3,251	$4,282	2.2%	-22.4%

 

Net revenues totaled $3.32 billion, representing a year-over-year decrease of 22.4%. Year-over-year net sales to OEMs and Distribution decreased 19.8% and 28.7%, respectively. On a sequential basis, net revenues increased 2.2%, in line with the mid-point of ST’s guidance.

Gross profit totaled $1.25 billion, representing a year-over-year decrease of 35.7%. Gross margin of 37.7%, 30 basis points below the mid-point of ST’s guidance, decreased 780 basis points year-over-year, mainly due to product mix and, to a lesser extent, to sales price and higher unused capacity charges.

Operating income decreased 64.0% to $369 million, compared to $1.02 billion in the year-ago quarter. ST’s operating margin decreased 1,280 basis points on a year-over-year basis to 11.1% of net revenues, compared to 23.9% in the fourth quarter of 2023.

By reportable segment1, compared with the year-ago quarter:

In Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group:

Analog products, MEMS and Sensors (AM&S) segment:

• Revenue decreased 15.5% mainly due to decreases in Analog and in Imaging.
• Operating profit decreased by 41.2% to $176 million. Operating margin was 14.7% compared to 21.1%.

Power and Discrete products (P&D) segment:

• Revenue decreased 22.1%.
• Operating profit decreased by 63.7% to $89 million. Operating margin was 11.9% compared to 25.4%.

In Microcontrollers, Digital ICs and RF products (MDRF) Product Group:

Microcontrollers (MCU) segment:

• Revenue decreased 30.2% mainly due to a decrease in GP MCU.
• Operating profit decreased by 66.4% to $127 million. Operating margin was 14.3% compared to 29.8%.

Digital ICs and RF products (D&RF) segment:

• Revenue decreased 22.8% mainly due to a decrease in ADAS (automotive ADAS and infotainment).
• Operating profit decreased by 33.2% to $149 million. Operating margin was 31.0% compared to 35.7%.

Net income and diluted Earnings Per Share decreased to $341 million and $0.37 respectively compared to $1.08 billion and $1.14 respectively in the year-ago quarter. As a reminder, the fourth quarter 2023 net income included a one-time non-cash income tax benefit of $191 million.

Cash Flow and Balance Sheet Highlights

				Trailing 12 Months
(US$ m)	Q4 2024	Q3 2024	Q4 2023	Q4 2024	Q4 2023	TTM Change
Net cash from operating activities	681	723	1,480	2,965	5,992	-50.5%
Free cash flow (non-U.S. GAAP)2	128	136	652	288	1,774	-83.8%

 

Net cash from operating activities was $681 million in the fourth quarter compared to $1.48 billion in the year-ago quarter. For the full-year 2024, net cash from operating activities decreased 50.5% to $2.97 billion, which represents 22.3% of total revenues.

Net Capex (non-U.S. GAAP), were $470 million in the fourth quarter and $2.53 billion for the full year 2024. In the respective year-ago periods, net capital expenditures were $798 million and $4.11 billion.

Free cash flow (non-U.S. GAAP) was $128 million and $288 million in the fourth quarter and full year 2024, respectively, compared to $652 million and $1.77 billion in the year-ago respective periods.

Inventory at the end of the fourth quarter was $2.79 billion, compared to $2.88 billion in the previous quarter and $2.70 billion in the year-ago quarter. Days sales of inventory at quarter-end was 122 days, compared to 130 days in the previous quarter, and 104 days in the year-ago quarter.

In the fourth quarter, ST paid cash dividends to its stockholders totaling $88 million and executed a $92 million share buy-back, as part of its current share repurchase program.

ST’s net financial position (non-U.S. GAAP) was $3.23 billion as of December 31, 2024, compared to $3.18 billion as of September 28, 2024 and reflected total liquidity of $6.18 billion and total financial debt of $2.95 billion. Adjusted net financial position (non-U.S. GAAP), taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $2.85 billion as of December 31, 2024.

Corporate developments

In Q4, we announced the launch of a new company-wide program to reshape our manufacturing footprint accelerating our wafer fab capacity to 300mm Silicon (Agrate and Crolles) and 200mm Silicon Carbide (Catania) and resizing our global cost base.

This program should result in strengthening our capability to grow our revenues with an improved operating efficiency resulting in annual cost savings in the high triple-digit million-dollar range exiting 2027. Specifically in terms of operating expenses (SG&A and R&D), ST expects annual cost savings totaling $300 to 360 million, exiting 2027, compared to the cost base of 2024.

Business Outlook

ST’s guidance, at the mid-point, for the 2025 first quarter is:

• Net revenues are expected to be $2.51 billion, a decrease of 24.4% sequentially, plus or minus 350 basis points.
• Gross margin of 33.8%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.06 = €1.00 for the 2025 first quarter and includes the impact of existing hedging contracts.
• The first quarter will close on March 29, 2025.

Conference Call and Webcast Information

A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until February 14, 2025.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections which may require us to undertake transformation measures that may not be successful in realizing the expected benefits in full or at all;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macroeconomic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of intellectual property (“IP”) claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral by 2027 on scope 1 and 2 and partially scope 3;
• epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; and
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2023 as filed with the Securities and Exchange Commission (“SEC”) on February 22, 2024. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our Securities and Exchange Commission (“SEC”) filings, could have a material adverse effect on our business and/or financial condition.

The post STMicroelectronics Reports Q4 and FY 2024 Financial Results appeared first on ELE Times.

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A low-noise chip-scale atomic clock (LN-CSAC), the SA65-LN from Microchip, features a profile height of less than 0.5 in. (12.7 mm). Aimed at aerospace and defense applications where size, weight, and power are critical, the SA65-LN delivers precise and stable timing, along with low phase noise and atomic clock stability.

Based on Microchip’s Evacuated Miniature Crystal Oscillator (EMXO) and integrated into a CSAC, the SA65-LN consumes under 295 mW. It also operates within a temperature range of -40°C to +80°C, maintaining its frequency and phase stability. Low power consumption and a wide temperature range enable battery-powered operation under extreme conditions.

The LN-CSAC combines the stability of an atomic clock with the precision of a crystal oscillator in a compact design. The EMXO offers low phase noise of <−120 dBc/Hz at 10 Hz and an Allan Deviation (ADEV) of <1E-11 at a 1-second averaging time. The atomic clock provides ±0.5 ppb initial accuracy, frequency drift of <0.9 ppb/month, and temperature-induced errors of <±0.3 ppb.

The SA65-LN is available now in production quantities. It is supported by Microchip’s Clockstudio software tool, a GUI, and developer kit.

SA65-LN product page

Microchip Technology

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Chip-scale atomic clock shrinks profile height appeared first on EDN.

Infineon has added five isolated gate drivers to its EiceDriver family optimized for driving IGBTs and SiC MOSFETs. AEC-qualified and ISO 26262-compliant, these third-generation drivers are well-suited for traction inverters in both cost-effective and high-performance xEV platforms. Additionally, they support Infineon’s HybridPack Drive G2 Fusion module, a plug-and-play power module that combines the company’s Si and SiC technologies.

The 1EDI302xAS series supports IGBTs up to 1200 V, while the 1EDI303xAS series is suited for SiC MOSFETs up to 1200 V. With an output stage of 20 A, the 1EDI3025AS, 1EDI3026AS, and 1EDI3035AS can drive inverters of all power classes up to 300 kW. The 1EDI3028AS and 1EDI3038AS variants have an output stage of 15 A, useful for entry-level battery EV and plug-in hybrid EV inverters. The gate drivers provide reinforced insulation per VDE 0884-17:2011-10, ensuring safe isolation.

All of the single-channel drivers are equipped with a configurable soft turn-off feature for enhanced short-circuit performance. Monitoring functions include overcurrent protection and an integrated self-test for desaturation protection. A continuously sampling 12-bit delta-sigma ADC with an integrated current source can read the voltage directly from temperature measurement diodes or an NTC.

Samples of the 1EDI3025AS, 1EDI3026AS, 1EDI3028AS, 1EDI3035AS, and 1EDI3038AS isolated gate drivers are available now.

EiceDriver product page

Infineon Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Gate drivers serve EV traction inverters appeared first on EDN.