Microelectronics world news

To make electric mobility accessible to a broader market by combining affordability with high performance and efficiency, Infineon Technologies AG of Munich, Germany is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector. The HybridPACK Drive G2 Fusion is the first plug’n’play power module that implements a combination of Infineon’s silicon and silicon carbide (SiC) technologies. This provides a balance between performance and cost efficiency, giving more choice in the optimization of inverters...

• Infineon hosts first-ever Supplier Sustainability Summit to intensify collaboration for sustainable action and reduction of CO2 emissions in line with the Science Based Target initiative (SBTi)
• Infineon is working with more than 100 suppliers engaging them to define their own science-based targets and implement appropriate reduction measures
• Applied Materials Inc., Sumco Corporation, and iwis are recognized foroutstanding environmental advancements with Infineon’s Green Award

Infineon Technologies AG, is intensifying its collaboration with suppliers to further reduce CO2 emissions along the whole supply chain. Infineon hosted its first ever Supplier Sustainability Summit to further stimulate collaboration and incentivize and support suppliers to accelerate their decarbonization journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

“In order to meet our ambitious targets, we need you, our suppliers,” said Elke Reichart, Member of the Board and Chief Digital and Sustainability Officer at Infineon, during her welcome message. “Infineon’s scope 3 emissions make up the lion’s share of our footprint, especially the materials we source from our suppliers. Therefore, we very much look forward to joining forces with you. Together, we can stimulate and implement decarbonization strategies even better.”

Collaboration with suppliers is a fundamental part of Infineon’s overall sustainability strategy. The company has already made significant progress on its way to reaching climate neutrality by 2030; since 2019 Infineon has halved its CO2 emissions (scope 1 and 2) while doubling revenue at the same time. In December 2023, Infineon added a commitment to setting a science-based target that includes the supply chain (scope 3). The procurement team is actively working with over 100 suppliers, engaging them to define their own science- based targets and implement appropriate reduction measures.

The Supplier Sustainability Summit was an excellent opportunity for Infineon to share learnings from its own climate strategy and journey and to facilitate exchange of best practices among suppliers. For instance, experts from the Infineon electricity procurement team gave insights from their hands-on experience in achieving 100 percent renewable electricity by 2025; whereas two suppliers shared their expertise in effectively setting science-based targets. The topic was deepened in a panel discussion with Infineon leaders and an expert from the CDP (formerly the Carbon Disclosure Project) that offered further practical advice to attendees.

Infineon’s Green Award recognizes and honors suppliers who demonstrated outstanding environmental commitment and advancements throughout the past year. The “Best Performance Award” went to Applied Materials Inc. for its ambitious climate strategy, including a 1.5°C science-based target and the company’s innovative “Xchange” program. As part of the program Infineon is directly collaborating with Applied Materials to increase resource efficiency and reduce emissions. The program enables take-back and refurbishment of spare parts for complex semiconductor equipment, thereby building on the circular economy to create environmental and business benefits for both parties.

The “Best Improvement Award” winner is Sumco Corporation, that has made remarkable progress in environmental sustainability throughout the past year. The Japan-based company is the first silicon wafer supplier to make a public commitment to setting a science- based target. Following discussions at the top leadership level, Sumco acted at an impressive speed, accelerating existing carbon reduction targets and expanding renewable electricity sourcing.

In the category of companies with less than one billion euros revenue, the “Best Improvement Award” went to iwis SE & Co. KG. The Munich-based, family-owned company serves as a great example to many with its ambitious “Zero Carbon 2040 program” and science-based target commitment. Infineon recognizes the proactive approach towards improving the environmental impact of operations and supply chain and the integration of climate targets in the environmental management system at the sites.

“We would like to applaud the winners of our Green Awards: Applied Materials, Sumco and iwis for stepping up and taking responsibility for environmental sustainability and performance,” said Angelique van der Burg, Chief Procurement Officer at Infineon and host of the day. “We believe that this performance will motivate our whole supplier base to raise the bar higher and follow their example. Now let’s make the best practice a standard practice.”

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Keynote on wireless, compute, and security aspects of IoT

Silicon Labs had a strong presence at embedded world North America with a keynote tag teamed by CEO Matt Johnson and CTO Daniel Cooley, covering the future of embedded devices with a focus on driving innovation in terms of wireless integration, security, and AI (Figure 1). The fabless company has always pioneered the wireless aspect of their hardware, as a leading supplier for all major IoT ecosystems featuring many multi-protocol SoCs that are thoroughly tested for wireless coexistence before deployment. During the talk Cooley expanded on some of the direct benefits of wireless devices outside of the established sensing/control applications. 

Figure 1: Daniel Cooley showcasing the new Series 3 SoC from Silicon Labs at embedded world North American keynote.  

Wireless

Wireless devices are now being used to configure the product as it moves the production line. “This isn’t just built-in self-test or secure key injection,” says Cooley “they actually configure the different wireless protocols as it goes through the production to program the model at the end of the line or an OTA firmware update when it’s installed in the field.” He stressed that these updates were not a simple OTA update, “this is changing the fundamental properties of the product itself, many legacy Zigbee installations are going to flip and switch and convert straight into Thread.” Wireless enablement can also allow for remote diagnostic capability “if the product out in the field is failing, you can quickly figure out what is going on in a non-destructive way without a USB or Ethernet connection.”

Compute

Embedded applications are seeing massive boosts in compute capability to keep up with the growing applications for edge computing. “Computing has got to keep up in every way, its raw MIPs, CoreMark; however you want to measure it, it’s the memory and peripheral access.” More cores are being integrated into SoCs for more processing power and the necessary hardware acceleration as well as GPIO to connect to more varied peripherals. Cooley stressed the importance of adopting real-time operating systems (RTOS), “You can’t scale IoT applications on bare metal, you’ll certainly have a tough time connecting into the cloud applications since it’s generally not built for bare metal to OS. It’s really got to be OS-to-OS.” 

Security

The security aspect of IoT was stressed where companies need to keep up with evolving security standards as well as new legislation with security at the transistor level, security patching in the field, firmware updates, and more. “Earlier this year, the FCC approved the US Cyber Trust Mark consumer IoT. The Marks framework was developed by the CSA in close collaboration with many IoT designers and suppliers to create a living label on consumer IoT devices to give customers the confidence that their device is secure from the latest cybersecurity threats.” This is one aspect of many new cybersecurity regulations that have gone into effect in recent years, placing unprecedented compliance demands on organizations. In Europe this includes the radio equipment directive (RED) and the Directive on Network and Information Security (NIS), in Singapore the cybersecurity labeling scheme (CLS), in the UK the Product Security and Telecommunications Infrastructure Act (PSTI). “In August, NIST finalized its first set of quantum encryption standards. And while the average cybercriminal won’t have a quantum computer at their disposal, malicious state actors will, and they could use this incredible capability to cause massive disruptions for our space, our industry, and countries as a whole,” says Cooley, “by actively engaging in these efforts and aligning them with our goals, we can drive the innovation faster, build trust, increase security, and ensure a stronger and more connected future.”  

Aalyia Shaukat, associate editor at EDN, has worked in the engineering publishing industry for nearly a decade with published works in EE journals and other trade publications. She holds a BSEE from Rochester Institute of Technology. 

Related Content

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• Amazon Sidewalk network is getting silicon traction
• Analog Devices’ approach to heterogeneous debug
• 8-bit MCUs exploit 32-bit development tools

The post Silicon Labs on wireless, compute, and security appeared first on EDN.

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced GaNSlim, a new generation of highly integrated GaN power ICs that will further simplify and speed the development of small-form-factor, high-power-density applications by offering the highest level of integration and thermal performance...

Over the past few years, major companies around the world have been investing in 8-inch silicon carbide (SiC) production lines, and these investments are now gradually becoming operational, notes market research firm TrendForce in a recent summary...

A new gallium nitride (GaN) power IC claims to further simplify and speed the development of small form factor, high-power-density applications by offering greater integration and thermal performance. Besides the integration of drive, control and protection, it also incorporates EMI control and loss-less current sensing, all within a high-thermal-performance proprietary DPAK-4L package.

Navitas Semiconductor has unveiled this device, GaNSlim, following the release of its GaNFast and GaNSense devices. The Torrance, California-based supplier is targeting GaNSlim devices at chargers for mobile devices and laptops, TV power supplies, and LED lighting.

Figure 1 GaNSlim is the company’s third-generation device with autonomous EMI control and loss-less sensing. Source: Navitas

“Our GaN focus is on integrated devices that enable high-efficiency, high-performance power conversion with the simplest designs and the shortest possible time-to-market,” said Reyn Zhan, senior manager of technical marketing at Navitas. The GaNSlim devices are rated at 700 V with RDS(ON) ratings from 120 mΩ to 330 mΩ.

Evolution of a GaN device

In an interview with EDN, Llew Vaughan-Edmunds, senior director of product management and marketing at Navitas, chronicled the company’s GaN technology journey. In the late 2010s, when most GaN suppliers were offering discrete devices, Navitas differentiated by integrating drivers, control and protection features alongside discrete GaN.

“The problem is that GaN switch is very fast, so while you can use it to your benefit, when gate starts to switch that fast, you inevitably see spikes,” said Edmunds. “At the same time, the gate is very sensitive, so you must regulate gate voltage as much as possible.” Otherwise, if the device voltage is 5 V and it goes to 7 V, it’s dangerous.

The GaNFast device was created by integrating a gate driver, and it significantly took off in travel adapters. Nearly three years later, in 2021, Navitas realized what OEMs and ODMs wanted. “They wanted sensing and over-temperature protection, and that’s when we released GaNSense,” Edmunds told EDN.

“Now, after several years of launch, we understand what the next requirements are, and this became GaNSlim,” Edmunds added. “Power design engineers want to reduce the heat and temperature, and they want a bigger, thermally enhanced package with the pitch between legs widened.”

Figure 2 GaNSlim, an upgrade to the GaNSense design, incorporates EMI control and loss-less current sensing alongside the gate driver and various protection features. Source: Navitas

Anatomy of GaNSlim

Moreover, as Edmunds noted, power design engineers wanted Navitas to integrate the EMI function into the switch. “What happens with the travel adapters is that many EMI issues have to be worked around because the switch is so fast.”

Figure 3 GaNSlim design comprises three basic building blocks: FET switch, gate driver IC, and thermally enhanced DPAK package. Source: Navitas

There are three basic building blocks of a GaNSlim device. First, the GaNSense Power FET is the GaN switch, a fast one, which enables loss-less current sensing. That, in turn, eliminates the need for external current sensing resistors and optimizes system efficiency and reliability.

Second, the GanSlim power IC, which integrates the gate driver and bolsters loss-less current sensing with programmable features. “We have loss-less sensing, meaning we do the sensing inside the IC, bringing half percent efficiency benefits,” Edmunds added.

It also incorporates over-temperature protection to ensure system robustness, and its auto sleep-mode increases light and no-load efficiency. Then there is autonomous turn-on/off slew rate control, which maximizes efficiency and power density while reducing external component count.

Third, the 4-pin, 6.6 x 9.6 mm DPAK package facilitates 7°C lower temperature operation versus conventional alternatives while supporting high-power-density designs with ratings up to 500 W.

GaN integration a differentiator

When summarizing GanSlim design, Edmunds said that Navitas took the 10-pin GaNSense I/O system and made it into three to four I/O systems. “We have integrated EMI control inside the switch and made it intelligent, removing a few components and thus lowering the system cost.” That’s how Navitas made GanSlim simpler and easier to use.

Edmunds added that engineers don’t have to worry about EMI, different I/Os, and how to control them with a micro because that’s all set up. He is also confident that with these integration capabilities and regulated EMI, Navitas is ahead of competition by three to four years.

Related Content

• GaN Adoption Rises for FPGA Power Design
• A brief history of gallium nitride (GaN) semiconductors
• Design Efficient, High-Density Power Solutions with GaN
• A GaN technology breakthrough claimed for hard switching
• Women in STEM: GaN’s Influence on Power Electronics Design

The post The next GaN design frontier: EMI control appeared first on EDN.

Let’s imagine that you need to add a power switch to something that’s battery-powered but processor-free; perhaps it must also be waterproof and thus membrane-sealed. Or perhaps you just want to use a shiny modern push-button rather than a toggle/rocker/slide thingy, which may be cheap and reliable, but would look so last millennium.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Latching bi-stable device

This design idea (DI) shows how to transform a basic momentary push or tact(ile) switch into a latching bi-stable device. It’s shown in Figure 1.

Figure 1 Two transistors form a power-switching latch, which can be set (power on) by a short button-press and then reset (power off) by a longer one.

Q1 and Q2 are cross-coupled to form a latch, Q1 being the actual power switch which is controlled by Q2. Initially, both are off. Pressing Sw1 briefly injects a pulse through C1 into Q2’s gate which turns it on, thus also turning Q1 on to deliver power to both the downstream circuitry and Q2, latching both transistors on.

Holding the button down for around a second allows C2 to charge up through R4 until Q3 starts to conduct, thus shorting the drive to Q2’s gate and breaking the feedback loop, so that Q1 and Q2 both turn off. Opening the switch lets C2 discharge through D1 and R5, ready for the next cycle. When off, the circuit draws only leakage current.

Some components are marked TBD, because while the circuit as a whole can work with supplies anywhere from 3 to 20 V (or more, if Q1 is suitably rated), individual parts or functions may not. Typical values are:

Supply	R2	R4
3 V	0R	100k
6 V	0R	330k
12 V	100k	680k
20 V	300k	1M0

R2 ensures that Q1’s gate-source voltage is enough to turn it on fully without causing its gate-protection diodes to conduct. R4 keeps the “hold-for-off” time close to a second. Other points to watch include Q1 itself. The IRLML6402 has a 20-V drain-source rating, an on-resistance of 50–100 mΩ under our conditions, and a gate-source breakdown of 12 V. It only needs 1.2 V to turn it fully on, when it will easily handle an amp or two.

Q2 and Q3 are not critical, though proper logic-level devices might be better than the ZVN3306As. If Sw1 is pressed while the circuit is on, C1 will still deliver a spike to Q2’s gate, briefly driving that to twice the supply voltage. This should be clamped by Q2’s input protection diodes, but if you don’t trust that, fit a catch diode from the bottom of C1 back up to the input rail. Those same protection diodes may also conduct with high supply voltages, the current being limited by R3.

If the switch button becomes jammed down for any reason, the circuit will stay off, though R5 will still draw some current.

Automatic turn-off

As it stands, all this works well with loads from nothing up to that amp or two and with load capacitances up to at least 100 µF. But it might be useful to add something to turn the power off automatically several minutes after the latest button-press, and Figure 2 shows how to do that.

Figure 2 Adding an oscillator/counter can turn the circuit off automatically after a suitable delay.

This adds a CD4060B oscillator/counter to the mix. It’s powered from the output, and oscillates at about 13.7 Hz—at least, my sample did—while the circuit is on. After about 10 minutes, its count reaches 8192 and Q14 goes high, charging C2 through D2 to turn Q3 on, and Q2 and Q1 off. Any extra presses of Sw1 reset it, restarting the timing cycle. The CD4060B is a 3-to-18-V part, which is why the voltage rating of the Figure 2 circuit is lower. (Data sheets claim 20 V is survivable, but I lost one at 19 V while experimenting. Beware! And that explains R8, added to avoid any spikes taking out the reset pin, which is what happened.) Because the load capacitance needs to discharge adequately to avoid the circuit restarting, it should now be no greater than about 10 µF, at least with light loads. I couldn’t find a simple (meaning cheap and reliable) way of draining or even crowbar-ing it at switch-off: thought that should be easy; it wasn’t.

Using counters and logic to control everything would be nice, but even more elaborate unless a microcontroller were handling things. Such an approach would need far less hardware and have many opportunities for extra, interestingly-coded features—but wouldn’t it be cheating?

—Nick Cornford built his first crystal set at 10, and since then has designed professional audio equipment, many datacomm products, and technical security kit. He has at last retired. Mostly. Sort of.

 Related Content

• Latching power switch uses momentary pushbutton
• A new and improved latching power switch
• Latching power switch uses momentary-action pushbutton
• DIY RTD for a DMM
• How to control your impulses—part 1
• How to control your impulses—part 2

The post To press on or hold off? This does both. appeared first on EDN.

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South Korea-based Seoul Semiconductor Co Ltd and its affiliate Seoul Viosys says that the Unified Patent Court (UPC) has issued a judgment ordering a sales ban, recall and destruction of products infringing Seoul’s ‘No Wire’ (WICOP) patent in eight European countries...

The cancellation of Apple’s project at the beginning of 2024 has shaken confidence in micro-LED technology, leaving the industry at a critical juncture. As delays continue and organic light-emitting diode (OLED) technology advances, the value proposition of micro-LEDs is shrinking, notes market analyst firm Yole Group. In response, companies are rethinking their strategies — some are slowing down or stopping, while others are accelerating their efforts, taking advantage of less competition. Alliances are forming along geographic lines, with about 30 fabs or pilot lines still moving forward...

“As chips are pervading all segments of human life, owing to the possibility of chip-backdoors, the threats of espionage, sabotage, and the concerns to national security are haunting all of humanity”.

The threat of chip-based backdoors is raising eyebrows across the globe. Today, since chips are an integral and inevitable component of any electronic device, presence of any chip-backdoor shall have widespread consequences. Both in its expanse across the countries and myriad sectors.

Given the pervading nature of chips in electronic systems, the gravity and the extent of the problem of chip-backdoors can only be speculated. Indeed, any such speculation is alarming!

It is so because the presence of any chip-based backdoor has the potential threat of granting clandestine access to information about the functioning of any electronic system. Whether it be data centres, servers, devices used in complex and critical installations such as a nuclear-reactors, space-faring vehicles, communication devices, military assets such as warships, fighter jets, etc. No such system is immune from this looming threat.

As chips are now being used for many applications that are essential and critical for national security, any chip-backdoor is a threat to any country’s national security. It is not only an infringement of right to privacy, but also poses a grave threat to the security of all devices used by humanity in this digital age.

No wonder the threat of chip-backdoor is sending shivers down the spine of the scientific community and senior military officials!

Meaning of chip backdoor

A backdoor provides clandestine and unauthorised access to a system. It does so by bypassing the legitimate authentication to access a system.

Similarly, a chip-backdoor provides a backdoor to an electronic system by means of a semi-conductor chip. It is a subset of hardware backdoor, which provides backdoor to any hardware.

If a chip-backdoor succeeds in providing backdoor access to a chip in an electronic system, it further enables unauthorised control over the system. It can even maim or cripple a system. If it so happens, it will endanger the performance of any electronic system. Hence, it may render any system’s performance at risk.

Major effects of chip-backdoors on a system

Since a chip-backdoor provides unauthorized access to a system, it gives rise to three major effects on a system. They are as follows:

First, the collection of data about the performance of a system. This data can be processed and analysed to draw inferences about the functioning of a system.

Second, spying and surveillance on the system.

Third, the threat of sabotage to the entire system. This may cripple or maim any essential and critical system in the hour of the utmost need. Hence, it has a high capability to compromise the credibility and safety of any system in emergency situations such as a war, natural calamity, etc.

How can a chip-backdoor be introduced in a chip?

If any chip, maliciously designed or fabricated and capable of providing a backdoor, is inserted in an electronic system, it provides a chip-backdoor.

A chip-backdoor can be introduced in a chip at any of the three stages of the production of a chip. They are as follows:

First, the design stage. In this stage, chip-backdoor can be introduced by the use of third-party IP cores and the electronic design automation (EDA) tools.

Second, the fabrication stage. In this stage, chip-backdoor can be introduced by making malicious modifications to photomasks, doping processes and metal interconnects.

Third, the ATMP (assembly, testing, marking, and packaging) stage. In this stage, chip-backdoor can be introduced by making alterations to chip packaging and printed circuit board.

Why is it difficult to detect a chip-backdoor?

Most important reasons that make detection of chip-backdoor difficult are as follows:

First, few chip-backdoors may be so well designed that it is difficult to detect them by all methods.

Second, few chip-backdoors may disguise as accidental vulnerability. Hence, they may evade detection.

Third, it is a herculean task to scan the entire system for a single or a few backdoor capable chips.

Reported cases of chip-backdoor

Due to the possibility of introducing backdoor at every stage of the production of a chip, there exists numerous possibilities of chip-backdoors. Despite this, there exists no concrete evidence about it.

Even though few cases have been reported in the past, the private companies involved in the production of such questionable chips have vehemently denied any such allegations.

Few such reported cases are as follows:

First, researchers from the University of Cambridge discovered a backdoor in the Actel/ Microsemi ProASIC3 chip. It was being used in sensitive industrial and military applications. They used a technique called Pipeline Emission Analysis (PEA) to detect this backdoor.

Second, in 2018, Bloomberg reported that very small malicious chips were found on Supermicro server motherboards. This backdoor was allegedly being used for spying.

Third, in June, 2024, in an interview to www.moneycontrol.com, HCL’s co-founder, Mr. Ajai Choudhary, alleged that many Chinese chips in a whole range of products have backdoors.

What counter-measures have been developed so far?

Only few counter-measures have been developed so far to detect chip-backdoor. They are as follows:

First, as per a report from the Business Insider published in May, 2012, Mr. Skorobogatov, a researcher from the University of Cambridge, developed a method to detect malicious chips in a system.

Second, as per a report from the TechRepublic published in 2016, researchers from the New York University developed a method to detect a chip’s operation by means of verifiable computing.

Third, as per a report published in the IEEE Spectrum in 2019, researchers from the University of Southern California and Paul Scherrer Institute developed the Ptychographic X-ray laminography. This technique enables verification of the blueprint of chips and their design without even minutely interfering with the chip or its functioning.

Concerns about the looming threat of chip backdoor

The mounting concerns about the looming threat of chip-backdoor steams from many factors. Few of them are as enumerated below:

First, as chips pervade all electronic systems, the possibility of the presence of backdoor in any critical installation becomes very high. It is only possible if the chip is capable of a backdoor, though.

Second, since the production of chip across all the stages of its production today spans across many locations and vendors, it is a herculean task to identify the exact coordinates of the origin of a chip-backdoor.

Third, any component of an electronic system that has the potential of activating a chip-backdoor has the potential to stay dormant for a considerable time. It gets triggered only when specific requisite conditions arise. These conditions make the chip-backdoor functional from that instant of time when such specific requisite conditions are met.

Fourth, the expenditure incurred in scanning for a backdoor-capable chip in a system is so high that it is not at all an economical option to opt for. As the deciding factor in today’s global market is the most competitive cost of production, the economic cost of production trumps all other factors.

The way forward

One method to evade the threat of chip-backdoor is to use only chips produced indigenously and by the most trusted source for all essential and critical applications involved in national security.

Besides, the scientific community of all countries has to come together to develop the most efficient and cost-effective method to detect a chip-backdoor in any system. It is sine qua non to ensure the safety and security of all of humanity in this digital age. It is a must do thing. And, it must be accomplished at the earliest.

 

The post The burgeoning threat of chip-backdoors appeared first on ELE Times.

Author: STMicroelectronics

One of Matter development’s biggest issues is a potentially false sense of security resulting from improperly implementing specifications. According to CommScope, a member of the ST Partner Program, failing to manage certificates or device attestation credentials (DACs) correctly can lead to security vulnerabilities, as DACs are the most sensitive parameters for establishing device authentication and trust within the Matter ecosystem. It can also mean a company can fail to meet the IoT Device Security Specification from the CSA, the consortium behind Matter.

Launched in March 2024, the specification establishes unique Critical Security Parameters (CSPs) and follows best practices on secure storage and management processes. Once device manufacturers meet the certification criteria, they obtain Product Security Verified Marks. Hence, the IoT Device Security Specification represents a significant milestone toward what some are calling a “global cybersecurity standard for smart home devices”1, by ensuring a more secure ecosystem that’s capable of meeting today’s growing threats. CommScope and ST are, therefore, collaborating to ensure STM32 developers can rapidly meet these requirements.

Security no longer optional

The entire industry has high hopes for Matter, which explains why so many are adopting it, from Apple to Samsung, Amazon, and Google, among many others, and why ST is a promoter member of the CSA. We even released an X-CUBE-MATTER software package to help developers rapidly release their products to market thanks to pre-certified code and demo applications. Moreover, we have already shown demos of a certified Matter system running on STM32 MCUs. The CSA explains that it created Matter “with security and privacy as key design tenets.2” Consequently, as a promoter member, ST ensured our customers have all the tools and hardware needed to meet the latest security requirements.

Sleeping on the job

The reason behind this new security push is simple. Until 2010, many developers didn’t even think the vast majority of IoT devices warranted security safeguards. This led to severe issues like the Mirai Botnet, which exploited IoT devices to launch massive DDoS attacks. Similarly, when researchers showed how they could remotely take control of a car by exploiting inherent vulnerabilities3 or that hackers spied on children’s bedrooms by breaching popular home security cameras4, people started to take notice. The CSA’s emphasis on security and privacy recognizes the critical importance of safeguarding users and devices in a world where threats are increasingly complex.

Rude awakening

The problem is that few device manufacturers have the expertise to properly design and implement security measures. What’s even worse is that many developers vastly underestimate what it takes to implement security in a Matter system. For instance, the IoT Device Security Specification requires that the private key never leave its origin device. As a result, many companies only discover their non-compliance when they enter the certification program to obtain the Product Security Verified Mark. This often leads to significant delays and expenses when teams must revisit their initial designs and implementations and address the security issues preventing them from obtaining the IoT Device Security certification.

Intentionally secure STM32 and security

Matter devices will end up everywhere. That’s why the ST and CommScope partnership is so important.

Any security implementation starts at the hardware level. No amount of software can save a device that doesn’t offer strict physical and logical safeguards. Hence, the STM32WB55, which many use to run their Matter application, offers tamper protection mechanisms. It also has multiple crypto cores accelerating AES symmetric and RSA/ECC asymmetric cryptography. Moreover, it supports secure firmware installations and provides key storage and management services. Furthermore, the STM32WBA5x devices, like the newly launched STM32WBA54 and STM32WBA55, which can work as a radio co-processor in a Thread border router in a Matter ecosystem, can target a SESIP3 and PSA Certified Level 3 certification. Accordingly, developers know that these devices can help them meet modern specifications.

CommScope security solutions

To allow developers to gain firsthand experience with Matter Device Attestation Credential provisioning without requiring software development, CommScope provides a video showcasing the process with a test DAC on an STM32WB5MMG evaluation board, the STM32WB5MM-DK. The CommScope solution provides services that handle certificate authority, provisioning services, certificate lifecycle management services, boot loaders, and app code signing. The services predate Matter and work in a wide range of IoT applications. In fact, their expertise has helped them anticipate the needs of developers, which is why ST featured CommScope Security Solution during Embedded World 2024.

In the video, CommScope shows a demonstration software package, which includes:

1. The DAC provisioning firmware
2. The programming station application

The DAC provisioning firmware runs on the STM32WB5MMG to generate the DAC key pair and its corresponding Certificate Signing Request (CSR) within the device. As a result, it keeps the private key secure. Users can use STM32CubeProgrammer, our popular debugging and flashing tool, to flash the DAC provisioning firmware onto the evaluation board. As for the programming station application, it facilitates communication between the STM32WB5MMG and the CommScope’s Matter DAC provisioning server (PKIWorks Essentials) by forwarding Certificate Signing Requests (CSRs) and receiving DACs. The demo is also close to a real-world example. When it’s time to move to production, the manufacturer must simply transition to a software package enabling the provisioning of DACs tailored for the product in question.

Simplified Path to Production & Certification

ST and CommScope recognize the pain points that come from transitioning from a proof-of-concept with a demo package to a production line. Hence, CommScope offers a pre-integrated and tested pre-production solution with an integration guide for our STM32WB5MM-DK Discovery Kit. Device manufacturers can thus create a factory-deployable workflow ready to roll out and fit into their existing factory processes with minimum software customization. Both ST and CommScope understand the challenges involved in modifying manufacturing processes. It involves careful planning and adjustments to optimize production yields, especially when integrating DAC provisioning into manufacturing lines.

Consequently, to facilitate the transition from test DACs to production DACs, device manufacturers only need to provide their company name, vendor ID, and/or product ID to CommScope. The company will then create a specific Product Attestation Intermediate (PAI) essential for DACs issuance during production. Each device manufacturer’s specific PAI(s) is linked to CommScope’s CSA-approved non-VID-scoped Product Attestation Authorities (PAAs) and recorded in the CSA’s blockchain, known as the Device Compliance Ledger (DCL).

Therefore, ST and CommScope’s pre-integrated software package includes necessary baseline software implementation and offers direct Certificate Authority Services tailored for various device manufacturers. In addition, CommScope’s expertise in security ensures that DAC private keys never leave devices and are securely stored within STM32WBA5x. This best practice enables device manufacturers to achieve IoT Device Security certification swiftly. Put simply, it removes a lot of complexity so engineers can focus on what they do best: develop unique features and release products ahead of everyone else.

The post CommScope PKI Center: An ally on the path to the IoT Device Security certification and production for Matter products appeared first on ELE Times.

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Before you all come attack me, I'm just a highschool student trying something out. Over the past summer, I've been working hard to develop a weather station with the MQ135, MQ7, MQ2, MQ4, BME680, SIM800C, ESP32C3 and LIS3MDLTR (magnetometer). Entirely powered by solar power and with a 2500mAh battery, and a OLED display as a gimmick. A lot to process, I know. I've made a prototype (not fully working) and it seems like a good concept. Planning to use InfluxDB for sending the data with SIM to a server and then graphing it with another software (somehow). All I wanted to know is if it seems as if it seems like a valuable product which other people would purchase, especially for industrial applications, or am I just throwing money into a fire? If you have any questions on this, then please let me know below, and I've also attached some pictures of the EasyEDA 3D models. Thank you for your help. https://preview.redd.it/jtyht9349eud1.png?width=1200&format=png&auto=webp&s=eae35252b3fa2cbedc1093854e98c6dd6d333b03 https://preview.redd.it/9oxjo9349eud1.png?width=1084&format=png&auto=webp&s=b0d05275e24e71f69490ff57695d627c9fdd2aad https://preview.redd.it/mkwh59349eud1.png?width=1194&format=png&auto=webp&s=f228ac90f96cd9c008cbaaca316e1865900c37a5 submitted by /u/Important_Panic3566 [link] [comments]

This is a circuit for an 8 bit Analog to Digital Converter. I will try something more complex next week maybe. submitted by /u/BadassBabuaa77 [link] [comments]

submitted by /u/AutoModerator
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Needed one 1mfd ceramic. I looked on Amazon and could get a whole set for a few bucks more. Got this. I hoped they got scrambled in shipping, but no. submitted by /u/BluntPurplePencil [link] [comments]

Netherlands-based independent deep-tech venture capital fund PhotonVentures has received investment from national financing and development institution Invest-NL and a group of new private investors, with Invest-NL contributing €5m. This not only strengthens the fund’s capital base but also underscores the importance of the photonics industry for the Netherlands, as well as its competitive position in Europe and globally, says PhotonVentures. Integrated photonics is one of the key technologies in which Europe, and particularly the Netherlands, plays a significant role. To maintain this position, substantial investments from both the private and public sectors are essential, it adds...