Microelectronics world news

CEO Gervais Jacques to be appointed executive chairman in May, as Luc Bertrand becomes lead independent director...

Infineon Technologies AG of Munich, Germany is launching EasyPACK C, the next generation of its EasyPACK package family, for industrial applications such as fast DC electric vehicle (EV) charging, megawatt charging, energy storage systems and uninterruptible power supplies (UPS) operating under harsh conditions and fluctuating load profiles, which demand high efficiency, robust power cycling capability and long lifetime...

The power gallium nitride (GaN) device market is rising at a compound annual growth rate (CAGR) of 42% from $355m in 2024 then growing sixfold from now to about $3bn by 2030, forecasts Yole Group in its report ‘Power GaN 2025’...

The post The Sole and Original Show Focused on Core Technologies Pertaining to the Automotive Industry – Only 20 Days Away! appeared first on ELE Times.

Keysight Technologies, Inc. announced that they support the development of the new NVIDIA NVQLink open architecture for the low latency of quantum processors and AI supercomputing.  Keysight Technologies is working with NVIDIA to advance hybrid quantum–AI computing through high-performance control systems and AI-driven infrastructure.

Disaggregated computer architecture is redefining the future of high-performance computing (HPC), enabling organizations to meet rapidly evolving computational demands with greater agility and efficiency. By decoupling compute, memory, storage, and networking into composable resource pools, this approach allows on-demand configuration and precise resource allocation, maximizing performance while optimizing both scalability and cost.

As industries push toward increasingly complex and data-intensive workload spanning artificial intelligence, data analytics, large-scale simulations, and quantum computing—disaggregated systems deliver the flexible, future-proof foundation required to sustain innovation at scale. With seamless upgrades, improved utilization, and dynamic adaptability, these architectures are poised to become the cornerstone of next-generation HPC infrastructure, driving breakthroughs across science and industry.

With decades of experience designing and enabling large-scale systems, Keysight is advancing the integration of quantum and classical computing technologies to address evolving computational challenges. The company’s QCS enables precise, scalable quantum experimentation and plays a vital role in the emerging quantum ecosystem. Working with NVIDIA NVQLink and NVIDIA CUDA-Q, Keysight is exploring how quantum control systems and classical accelerators can be harnessed together, Keysight is helping organizations prepare for a new era of hybrid computing—one that enables quantum-enhanced AI, ultra-precise simulations, and advanced modeling, while remaining adaptable to future advancements across both quantum and classical domains.

This initiative marks a significant milestone for Keysight aimed at uniting high-performance control systems with AI-driven infrastructure to accelerate quantum research and hybrid compute development.

Dr. Eric Holland, General Manager, Keysight Quantum Engineer Solutions, said: “As the industry accelerates toward the next era of high-performance computing, leadership means more than building breakthrough technologies, it requires defining the standards that make these transformative technologies universally accessible. By working with NVIDIA to establish a framework for quantum–HPC hybrid compute, we are helping ensure that tomorrow’s heterogeneous engines, spanning quantum, AI, and classical HPC, operate seamlessly within modern data centers.  Together, we’re shaping the future fabric of compute for scientific discovery and innovation at scale. ”

Tim Costa, General Manager for Quantum at NVIDIA, said: “Driving breakthroughs in quantum computing requires quantum processors to integrate within AI supercomputers to run complex control tasks and deploy hybrid applications. Keysight is playing an integral role in solving this challenge, and NVQLink is the open unified interface for developing what comes next.”

The post Keysight to Showcase Quantum-AI Collaboration at GTC 2025 with NVIDIA NVQLink appeared first on ELE Times.

This is my ongoing build that is working now after i put a lm317/lm337 regulator in it untill i figure out how to build a series pass regulator. Going to add filters on the dc side aswell. Softstart/emi filter/transformer/rectifier, 15000uF + 10000uF + 5630uF with capacitance multiplier and ifcourse the regulator. submitted by /u/Whyjustwhydothat [link] [comments]

I had to stop sorting at this point. My tweezer fingers started to hurt. submitted by /u/Ryzen-Sunn [link] [comments]

Photonic simulation CAD software developer Photon Design Ltd of Oxford, UK has updated its PICWave photonic integrated circuit (PIC) design and simulation tool with an intuitive new graphic user interface (GUI) and an enhanced feature set...

Polyn Technology Ltd. announces the successful manufacturing and testing of its first silicon-implementation of its neuromorphic analog signal processing (NASP) technology. It includes the validation of both the NASP technology and design tools, which automatically convert trained digital neural network models into ultra-low-power analog neuromorphic cores ready for manufacturing in standard CMOS processes. The first product chip features an analog neuromorphic core of a voice activity detection (VAD) neural network model.

(Source: Polyn Technology Ltd.)

This platform uses trained neural networks in the analog domain to perform AI inference with much lower power consumption than conventional digital neural processors, according to the company. Application-specific NASP chips can be designed for a range of edge AI applications, including audio, vibration, wearable, robotics, industrial, and automotive sensing.

This is the first time that Polyn generated an asynchronous, fully analog neural-network core implementation in silicon directly from a digital model. This opens up a “new design paradigm— neural computation in the analog domain, with digital-class accuracy and microwatt-level energy use,” said Aleksandr Timofeev, Polyn’s CEO and founder, in a statement.

Targeting always-on edge devices, the NASP chips with AI cores process sensor signals in their native analog form in microseconds, using microwatt-level power, which eliminates all overhead associated with digital operations, Polyn explained.

Recommended Neuromorphic analog signal processor aids TinyML

The first neuromorphic analog processor contains a VAD core for real-time voice activity detection and offers fully asynchronous operation. Key specs of this NASP VAD chip include ultra-low-power consumption of about 34 µW during continuous operation and ultra-low latency at 50 microseconds per inference.

In addition to the VAD core, Polyn plans to develop other cores for speaker recognition and voice extraction, targeting home appliances, communications headsets, and other voice-controlled devices.

In April 2022, the company announced its first NASP test chip, implemented in 55-nm CMOS technology, demonstrating the technology’s brain-mimicking architecture. This was followed in October 2022 with the introduction of the NeuroVoice tiny AI chip, delivering on-chip voice extraction from any noisy background. In 2023, Polyn introduced VibroSense, a Tiny AI chip solution for vibration monitoring sensor nodes. (Polyn was ranked as an EE Times Silicon 100 company to watch in 2025.)

Customers who are developing products with ultra-low-power voice control can apply online for the NASP VAD chip evaluation kit. Polyn will demonstrate its first NASP chips, available for ordering, at CES 2026 in Las Vegas, Nevada, January 6-9, in Hall G, Booth #61701. A limited selection will be showcased at CES Unveiled Europe in Amsterdam, October 28, Booth HB143.

The post Polyn delivers silicon-implementation of its NASP chip appeared first on EDN.

Printed-circuit boards (PCBs) are an integral part of most electronic devices today, and as PCBs become smaller, electronics engineers must remain aware of the tiny defects that can affect how these components function, especially when they involve high-frequency signals. Surface roughness may seem minor, but it can significantly affect PCB performance, including impedance and signal transmission. What should electronics engineers know about it, and how can they minimize this issue?

Path length

Rough PCB surfaces increase the signal’s path length. This is due to the skin effect, which occurs because high-frequency electrical signals are more likely to flow along a conductor’s outer surface instead of through its core. A longer path length can also increase resistance and cause energy loss.

(Source: Adobe Stock)

Engineers can reduce these issues by choosing the appropriate surface finishes for different PCB parts. Immersion silver is a good choice for balancing performance and affordability, although it must be handled carefully to prevent tarnishing.

Electroless nickel immersion gold offers a flat and smooth surface with a gold layer that promotes excellent solderability and conductivity and a nickel layer that offers oxidation protection. This surface finish minimizes signal distortion, making it a popular option for microwave and radio-frequency applications.

Although immersion tin features a smooth surface, it has lower corrosion resistance than other options, making it less frequently selected for high-frequency PCBs. Because hard gold has good conductivity and resists wear, engineers often use it in high-frequency applications, such as on contact points and connectors. This approach minimizes signal loss and increases overall durability.

If you plan to outsource finishing or other manufacturing steps to a specialty provider, consider choosing one with extensive experience and the equipment and expertise needed for your PCB design.

For example, in 2024, PCB company OKI Circuit Technology created an ultra-high, multilayer PCB line. This expansion boosted its capacity potential by approximately 1.4× while also helping the company cater to customers with smaller orders. The company has also invested in numerous enhancements that increase its precision and equip it to meet the needs of next-generation communications, robotics, and semiconductors.

Signal integrity

Rough surfaces compromise signal integrity and can cause parasitic capacitance. This issue can also increase crosstalk if it results in uneven electromagnetic field distribution. Smoother surfaces enable faster signal speeds while preventing distortion and delays.

Because surface roughness is one of many factors that can interfere with signal integrity, electronics engineers should scrutinize all design aspects to find other potential culprits. Some companies offer specialized tools to make the task easier.

One provider sells software that uses artificial intelligence to assess proposed designs. Users can also check trace path routing by studying cross-sectional diagrams that show various layers, identifying potential issues more quickly.

Component placement and PCB layout configurations can affect signal integrity, so designers should consider those aspects before assuming rough surfaces have degraded performance. Digital twins and similar tools allow engineers and product designers to experiment with various layouts before committing to a final PCB layout. Keeping a log of all design changes also allows engineers to revert to previous iterations if newer versions worsen signal integrity.

If companies notice ongoing signal integrity problems or other challenges, examining the individual industrial processes may highlight the causes. This usually starts with data collection because the information provides a baseline. Once companies begin tracking trends, they can discover the most effective ways to tighten quality control and meet other goals that improve PCB performance.

Tailored assistance

If electronics engineers conclude that rough surfaces are among the primary contributors to signal issues in their high-frequency PCBs, they can then address the problem by partnering with third-party providers that understand the complexities of finishing small parts. These companies can detail the various finish types available and provide pricing and lead times, depending on the unit order of PCBs.

Companies that need PCB finishing for prototypes or small production runs may request manual processes. Skilled technicians use tools and magnification on parts with complex geometries or other characteristics that make them unsuitable for mechanical methods.

Controlled combustion, electrolytic action, and vibratory containers are some of the other options for finishing small parts through non-manual means. Specialist finishers can examine the PCB designs and recommend the best strategies to achieve consistent smoothness with maximum efficiency.

Because many manufacturers have high-volume finishing needs, some startups have emerged to fill the need while supporting producers’ automation efforts. Augmentus is one example, focusing on physical AI to scale automated surface finishing for high-mix environments. The company has built a fully autonomous system for today’s factory floors. In July 2025, the company secured $11 million in a Series A+ funding round to scale for high-mix, complex robotic surface finishing and welding.

Augmentus views surface finishing as one of the most challenging problems in automation, but the company believes its technology will break new ground. Although it is too early to know how this option and others like it may change PCB production, automated processes could offer better repeatability, making surface roughness less problematic.

Ongoing awareness

Because surface roughness can negatively affect high-frequency PCB signals, engineers should explore numerous ways to address it effectively. Considering this issue early in the design process and selecting appropriate finishes are proactive steps for strengthening component quality control.

About the author

Emily Newton is a technical writer and the editor-in-chief of Revolutionized. She enjoys researching and writing about how technology is changing the industrial sector.

The post Are rough surfaces on PCBs impacting high-frequency signals? appeared first on EDN.

Not my first time doing this but my second and for some reason the first tike was successful and this wasnt😂😂 submitted by /u/vIp_bLACK444 [link] [comments]

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received multiple orders for its advanced wet processing and lithography systems from a leading specialist foundry. The systems will be deployed for advanced packaging and silicon photonics applications, supporting critical end markets including AI, automotive, aerospace & defense, and communications. Scheduled deliveries for the most recent orders will start in first-quarter 2026...