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Compute: Powering the transition from Industry 4.0 to 5.0
Industry 4.0 has transformed manufacturing, connecting machines, automating processes, and changing how factories think and operate. But its success has revealed a new constraint: compute. As automation, AI, and data-driven decision-making scale exponentially, the world’s factories are facing a compute challenge that extends far beyond performance. The next industrial era—Industry 5.0—will bring even more compute demand as it builds on the IoT to improve collaboration between humans and machines, industry, and the environment.
Progress in this next wave of industrial development is dependent on advances at the semiconductor level. Advances in chip design, materials science, and process innovation are essential. Alongside this, there needs to be a reimagining of how we power industrial intelligence, not just in terms of the processing capability but in how that capability is designed, sourced, and sustained.
Rethinking compute for a connected futureThe exponential rise of data and compute has placed intense pressure on the chips that drive industrial automation. AI-enabled systems, predictive maintenance, and real-time digital twins all require compute to move closer to where data is created: at the edge. However, edge environments come with tight energy, size, and cooling constraints, creating a growing imbalance between compute demand and power availability.
AI and digital triplets, which build on traditional digital twin models by leveraging agentic AI to continuously learn and analyze data in the field, have moved the requirement for processing to be closer to where the data is created. In use cases such as edge computing, where computing takes place within sensing and measuring devices directly, this can be intensive. That decentralization introduces new power and efficiency pressures on infrastructure that wasn’t designed for such intensity.
The result is a growing imbalance between performance and the limitations of semiconductor manufacturing. Businesses must have broader thinking around energy consumption, heat management, power balance, and raw materials sourcing. Sustainability can no longer be treated as an unwarranted cost or compliance exercise; it’s becoming a new indicator of competitiveness, where energy-efficient, low-emission compute enables manufacturers to meet growing data reliance without exceeding environmental limits.
Businesses must take these challenges seriously, as the demand for compute will only escalate with Industry 5.0. AI will become more embedded, and the data it relies on will grow in scale and sophistication.
If manufacturing designers dismiss these issues, they run the risk of bottlenecking their productivity with poor efficiency and sustainability. This means that when chip designers optimize for Industry 5.0 applications, they should consider responsibility, efficiency, and longevity alongside performance and cost. The challenge is no longer just “can we build faster systems?” It’s now “can we build systems that endure environmentally, economically, and geopolitically?”
Innovation starts at the material levelThe semiconductor revolution of Industry 5.0 won’t be defined solely by faster chips but by the science and sustainability embedded in how those chips are made. For decades, semiconductor progress has been measured in nanometers; the next leap forward will be measured in materials. Advances in compounds such as silicon carbide and gallium nitride are improving chip performance and transforming how the industry approaches sustainability, supply chain resilience, and sovereignty.
Advances in chip design, materials science, and process innovation are essential in the next wave of industrial development. (Source: Adobe Stock)
These materials allow for higher power efficiency and longer lifespans, reducing energy consumption across industrial systems. Combined with cleaner fabrication techniques such as ambient temperature processing and hydrogen-based chemistries, they mark a significant step toward sustainable compute. The result is a new paradigm where sustainability no longer comes at an artificial premium but is an inherent feature of technological progress.
Process innovations, such as ambient temperature fabrication and green hydrogen, offer new ways to reduce environmental footprint while improving yield and reliability. Beyond the technology itself and material innovations, more focus should be placed on decentralization and alternative sources of raw materials. This will empower businesses and the countries they operate in to navigate geopolitical and supply chain challenges.
Collaboration is the new competitive edgeThe compute challenge that Industry 5.0 presents isn’t an isolated problem to solve. The demand and responsibility for change doesn’t lie with a single company, government or research body. It requires an ecosystem mindset, where collaboration is encouraged, replacing competition in key areas of innovation and infrastructure.
Collaboration between semiconductor manufacturers, industrial original equipment manufacturers, policymakers, and researchers is important to accelerate energy-efficient design and responsible sourcing. Interconnected and shared platforms within the semiconductor ecosystem de-risk tech investments. This ensures the collective benefits of sustainability and resilience benefit entire industrial innovation, not just individual players.
The next era of industrial progress will see the most competitive organizations collaborate and work together, with the goal of shared innovation and progress.
Powering compute in the Industry 5.0 transitionThe evolution from Industry 4.0 to Industry 5.0 is more than a technological upgrade; it represents a change in attitude around how digital transformation is approached in industrial settings. This new era will see new approaches to technological sustainability, sovereignty, and collaboration that prioritize productivity and speed. Compute will be the central driver of this transition. Materials, processes, and partnerships will determine whether the industrial sector can grow without outpacing its own energy and sustainability limits.
Industry 5.0 presents a vision of industrialization that gives back more than it takes, amplifying both productivity and possibility. The transition is already underway. Now, businesses need to ensure innovation, efficiency, and resilience evolve together to power a truly sustainable era of compute.
The post Compute: Powering the transition from Industry 4.0 to 5.0 appeared first on EDN.
A holiday shopping guide for engineers: 2025 edition
As of this year, EDN has consecutively published my odes to holiday-excused consumerism for more than a half-decade straight (and intentionally ahead of Black Friday, if you hadn’t already deduced), now nearing ten editions in total. Here are the 2019, 2020, 2021, 2022, 2023, and 2024 versions; I skipped a few years between 2014 and its successors.
As usual, I’ve included up-front links to prior-year versions of the Holiday Shopping Guide for Engineers because I’ve done my best here to not regurgitate any past recommendations; the stuff I’ve previously suggested largely remains valid, after all. That said, it gets increasingly difficult each year not to repeat myself! And as such, I’ve “thrown in the towel” this year, at least to some degree…you’ll find a few repeat categories this time, albeit with new product suggestions within them.
Without any further ado, and as usual, ordered solely in the order in which they initially came out of my cranium…
A Windows 11-compatible (or alternative O/S-based) computerMicrosoft’s general support for Windows 10 ended nearly a month ago (on October 14, to be exact) as I’m writing these words. For you Windows users out there, options exist for extending Windows 10 support updates (ESUs) for another year on consumer-licensed systems, both paid (spending $30 or redeeming 1,000 Microsoft Rewards points, with both ESU options covering up to 10 devices) and free (after syncing your PC settings).
If you’re an IT admin, the corporate license ESU program specifics are different; see here. And, as I covered in hands-on detail a few months back, (unsanctioned) options also exist for upgrading officially unsupported systems to Windows 11, although I don’t recommend relying on them for long-term use (assuming the hardware-hack attempt is successful at all, that is). As I wrote back in June:
The bottom line: any particular system whose specifications aren’t fully encompassed by Microsoft’s Windows 11 requirements documentation is fair game for abrupt no-boot cutoff at any point in the future. At minimum, you’ll end up with a “stuck” system, incapable of being further upgraded to newer Windows 11 releases, therefore doomed to fall off the support list at some point in the future. And if you try to hack around the block, you’ll end up with a system that may no longer reliably function, if it even boots at all.
You could also convert your existing PC over to run a different O/S, such as ChromeOS Flex (originally Neverware’s CloudReady, then acquired and now maintained by Google) or a Linux distro of your preference. For that matter, you could also just “get a Mac”. That said, any of these options will likely also compel conversions to new apps for the new O/S foundation. The aggregate learning curve from all these software transitions can end up being a “bridge too far”.
Instead, I’d suggest you just “bite the bullet” and buy a new PC for yourself and/or others for the holidays, before CPUs, DRAM, SSDs, and other building block components become even more supply-constrained and tariff-encumbered than they are now, and to ease the inevitable eventual transition to Windows 11.
Then donate your old hardware to charity for someone else to O/S-convert and extend its useful life. That’s what I’ll be doing, for example, with my wife’s Dell Inspiron 5570, which, as it turns out, wasn’t Windows 11-upgradeable after all.
Between now and next October, when the Windows 10 ESU runs out (unless the deadline gets extended again), we’ll replace it with the Dell 16 Plus (formerly Inspiron 16 Plus) in the above photo.
An AI-enhanced mobile deviceThe new Dell laptop I just mentioned, which we’d bought earlier this summer (ironically just prior to Microsoft’s unveiling of the free Windows 10 ESU option), is compatible with Microsoft’s Copilot+ specifications for AI-enhanced PCs by virtue of the system’s Intel Core Ultra 7 256V CPU with an integrated 47 TOPS NPU.
That said, although its support for local (vs conventional cloud) AI inference is nice from a future-proofing standpoint, there’s not much evidence of compelling on-client AI benefits at this early stage, save perhaps for low-latency voice interface capabilities (not to mention broader uninterrupted AI-based functionality when broadband goes down).
The current situation is very different when it comes to fully mobile devices. Yes, I know, laptops also have built-in batteries, but they often still spend much of their operating life AC-tethered, and anyway, their battery packs are much beefier than the ones in the smartphones and tablets I’m talking about here.
Local AI processing is not only faster than to-and-back-from-cloud roundtrip delays (particularly lengthy over cellular networks), but it also doesn’t gobble up precious limited-monthly-allocation data. Then there’s the locally stored-and-processed data enhanced privacy factor to consider, along with the oft-substantial power saving accrued by not needing to constantly leverage the mobile device’s Wi-Fi and cellular data subsystems.
You may indeed believe (as, full disclosure, I do) that AI features are of limited-at-best benefit at the moment, at least for the masses. But I think we can also agree that ongoing widespread-and-expanding and intense industry attention on AI will sooner or later cultivate compelling capabilities.
Therefore, I’ve showcased mobile devices’ AI attributes in recent years’ announcement coverage (such as that of Google’s Pixel 10 series shown in the photo above) and why I recommend them, again from a future-proofing angle if nothing else, if you’re (and/or yours are) due for a gadget upgrade this year. Meanwhile, I’ll soldier on with my Pixel 7s…
Audio education resources
As regular readers likely already realize, audio has received particular showcase attention in my blog posts and teardowns this past year-plus (a trend which will admittedly also likely extend into at least next year). This provided, among other things, an opportunity for me to refresh and expand my intellectual understanding of the topic.
I kept coming across references to Bob Cordell, mentioning both his informative website and his classic tomes, Designing Audio Power Amplifiers (make sure you purchase the latest 2nd edition, published in 2019, whose front cover is shown above) and the newer Designing Audio Circuits and Systems, released just last year.
Fair warning: neither book is inexpensive, especially in hardback, but even in paperback, and neither is available in a lower-priced Kindle version, either. That said, per both reviews I’ve seen from others and my own impressions, they’re well worth the investments.
Another worthwhile read, this time complete with plenty of humor scattered throughout, is Schiit Happened: The Story of the World’s Most Improbable Start-Up, in this case available in both inexpensive paperback and even more cost-effective Kindle formats. Written by Jason Stoddard and Mike Moffat, the founders of Schiit Audio, whom I’ve already mentioned several times this year, it’s also available for free on the Head-Fi Forum, where Jason has continued his writing. But c’mon, folks, drop $14.99 (or $4.99) to support a scrappy U.S. audio success story.
As far as audio-related magazines go, I first off highly recommend a subscription to audioXpress. Generalist electronics design publications like EDN are great, of course, but topic-focused coverage like that offered by audioXpress for audio design makes for an effective information companion.
On the other end of the product development chain, where gear is purchased and used by owners, there’s Stereophile, for which I’ve also been a faithful reader for more years than I care to remember. And as for the creation, capture, mastering, and duplication of the music played on those systems, I highly recommend subscriptions to Sound on Sound and, if your budget allows for a second publication, Recording. Consistently great stuff, all of it.
Finally, as an analogy to my earlier EDN-plus-audioXpress pairing, back in 2021 I recommended memberships to generalist ACM and/or IEEE professional societies. This time, I’ll supplement that suggestion with an audio-focused companion, the AES (Audio Engineering Society).
Back when I was a full-time press guy with EDN, I used to be able to snag complimentary admission to the twice-yearly AES conventions along with other organization events, which were always rich sources of information and networking connection cultivation.
To my dying day, I will always remember one particularly fascinating lecture, which correlated Ludwig van Beethoven’s progressive hearing degradation and its (presenter-presumed) emotional and psychological effects to the evolution of the music styles that he composed over time. Then there were the folks from Fraunhofer that I first-time met at an AES convention, kicking off a longstanding professional collaboration. And…
Audio gearFor a number of years, my Drop- (formerly Massdrop)-sourced combo of the x Grace Design Standard DAC and Objective 2 Headphone Amp Desktop Edition afforded me with a sonically enhanced alternative to my computer’s built-in DAC and amp for listening to music over plugged-in headphones and powered speakers:
As I’ve “teased” in a recent writeup, however, I recently upgraded this unbalanced-connection setup to a four-component Schiit stack, complete with a snazzy aluminum-and-acrylic rack:
Why?
Part of the reason is that I wanted to sonically experience a tube-based headphone amp for myself, both in an absolute sense and relative to solid-state Schiit amplifiers also in my possession.
Part of it is that all these Schiit-sourced amps also integrate preamp outputs for alternative-listening connection to an external power amp-plus-passive speaker set:
Another part of the reason is that I’ve now got a hardware equalizer as an alternative to software EQ, the latter (obviously) only relevant for computer-sourced audio. And relatedly, part of it is that I’ve also now got a hardware-based input switcher, enabling me to listen to audio coming not only from my PC but also from another external source. What source, you might ask?
Why, one of the several turntables that I also acquired and more broadly pressed into service this past year, of course!
I’ve really enjoyed reconnecting with vinyl and accumulating a LP collection (although my wallet has admittedly taken a beating in the process), and encourage you (and yours) to do the same. Stand by for a more detailed description of my expanded office audio setup, including its balanced “stack” counterpart, in an upcoming dedicated topic to be published shortly.
For sonically enhancing the rest of the house, where a computer isn’t the primary audio source, companies such as Bluesound and WiiM sell various all-in-one audio streamers, both power amplifier-inclusive (for use with traditional passive speakers) and amp-less (for pairing with powered speakers or intermediary connection to a standalone external amp).
A Bluesound Node N130, for example, has long resided at the “man cave” half of my office:
And the class D amplifier inside the “Pro” version of the WiiM Amp, which I plan to press into service soon in my living room, even supports the PFFB feature I recently discussed:
(Apple-reminiscent Space Gray shown and self-owned; Dark Gray and Silver also available)
More developer hardwareHere’s the other area where, as I alluded to in the intro, I’m going to overlap a bit with a past-year Holiday Shopping Guide. Two years ago, I recommended some developer kits from both the Raspberry Pi Foundation and NVIDIA, including the latter’s then-$499 Jetson Orin Nano:
It’s subsequently been “replaced”, as well as notably priced-decreased, by the Orin Nano Super Developer Kit at $249.
Why the quotes around “replaced”? That’s because, as good news for anyone who acted on my earlier recommendation, the hardware’s exactly the same as before: “Super” is solely reflective of an enhanced software suite delivering claimed generative AI performance gains of up to 1.7x, and freely available to existing Jetson Orin Nano owners.
More recently, last month, NVIDIA unveiled the diminutive $3,999 DGX Spark:
with compelling potential, both per company claims and initial hands-on experiences:
As a new class of computer, DGX Spark delivers a petaflop of AI performance and 128GB of unified memory in a compact desktop form factor, giving developers the power to run inference on AI models with up to 200 billion parameters and fine-tune models of up to 70 billion parameters locally. In addition, DGX Spark lets developers create AI agents and run advanced software stacks locally.
albeit along with, it should also be noted, an irregular development history and some troubling early reviews. The system was initially referred to as Project DIGITS when unveiled publicly at the January 2025 CES. Its application processor, originally referred to as the N1X, is now renamed the GB10. Co-developed by NVIDIA (who contributed the Grace Blackwell GPU subsystem) and MediaTek (who supplied the multi-core CPU cluster and reportedly also handled full SoC integration duties), it was originally intended for—and may eventually still show up in—Arm-based Windows PCs.
But repeated development hurdles have (reportedly) delayed the actualization of both SoC and system shipment aspirations, and lingering functional bugs preclude Windows compatibility (therefore explaining the DGX Spark’s Linux O/S foundation).
More generally, just a few days ago as I write these words, MAKE Magazine’s latest issue showed up in my mailbox, containing the most recent iteration of the publication’s yearly “Guide to Boards” insert. Check it out for more hardware ideas for your upcoming projects.
A smart ring
Regular readers have likely also noticed my recent series of writeups on smart rings, comprising both an initial overview and subsequent reviews based on fingers-on evaluations.
As I write these words in mid-November, Ultrahuman’s products have been pulled from the U.S. market due to patent-infringement rulings, although they’re still available elsewhere in the world. RingConn conversely concluded a last-minute licensing agreement, enabling ongoing sales of its devices worldwide, including in the United States.
And as for the instigator of the patent infringement actions, market leader Oura, my review of the company’s Gen3 smart ring will appear at EDN shortly after you read these words, with my eval of the latest-generation Ring 4 (shown above) to follow next month.
Smart rings’ Li-ion batteries, like those of any device with fully integrated cells, won’t last forever, so you need to go into your experience with one of them eyes-open to the reality that it’ll ultimately be disposable (or, in my case, transform into a teardown project).
That said, the technology is sufficiently mature at this point that I feel comfortable recommending them to the masses. They provide useful health insights, even though they tend to notably overstate step counts for those who use computer keyboards a lot. And unlike a smart watch or other wrist-based fitness tracker, you don’t need to worry (so much, at least) about color- and style-coordinating a smart ring with the rest of your outfit ensemble.
(Not yet a) pair of smart glasses
Conversely, alas, I still can’t yet recommend smart glasses to anyone but early adopters (like me; see above). Meta’s latest announced device suite, along with various products from numerous (and a growing list of) competitors, suggests that this product category is still relatively immature, therefore dynamic in its evolutionary nature. I’d hate to suggest something for you to buy for others that’ll be obsolete in short order. For power users like you, on the other hand…
Happy holidays!And with that, having just passed through 2,500 words, I’ll close here. Upside: plenty of additional presents-to-others-and/or-self ideas are now littering the cutting-room floor, so I’ve already got no shortage of topics for next year’s edition! Until then, sound off in the comments, and happy holidays!
—Brian Dipert is the Principal at Sierra Media and a former technical editor at EDN Magazine, where he still regularly contributes as a freelancer.
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The post A holiday shopping guide for engineers: 2025 edition appeared first on EDN.
Ohio State University buys Aixtron CCS MOCVD system
Pulse-density modulation (PDM) audio explained in a quick primer
Pulse-density modulation (PDM) is a compact digital audio format used in devices like MEMS microphones and embedded systems. This compact primer eases you into the essentials of PDM audio.
Let’s begin by revisiting a ubiquitous PDM MEMS microphone module based on MP34DT01-M—an omnidirectional digital MEMS audio sensor that continues to serve as a reliable benchmark in embedded audio design.
Figure 1 A MEMS microphone mounted on a minuscule module detects sound and produces a 1-bit PDM signal. Source: Author
When properly implemented, PDM can digitally encode high-quality audio while remaining cost-effective and easy to integrate. As a result, PDM streams are now widely adopted as the standard data output format for MEMS microphones.
On paper, the anatomy of a PDM microphone boils down to a few essential building blocks like:
- MEMS microphone element, typically a capacitive MEMS structure, unlike the electret capsules found in analog microphones.
- Analog preamplifier boosts the low-level signal from the MEMS element for further processing.
- PDM modulator converts the analog signal into a high-frequency, 1-bit pulse-density modulated stream, effectively acting as an integrated ADC.
- Digital interface logic handles timing, clock synchronization, and data output to the host system.
Next is the function block diagram of T3902, a digital MEMS microphone that integrates a microphone element, impedance converter amplifier, and fourth-order sigma-delta (Σ-Δ) modulator. Its PDM interface enables time multiplexing of two microphones on a single data line, synchronized by a shared clock.
Figure 2 Functional block diagram outlines the internal segments of the T3902 digital MEMS microphone. Source: TDK
The analog signal generated by the MEMS sensing element in a PDM microphone—sometimes referred to as a digital microphone—is first amplified by an internal analog preamplifier. This amplified signal is then sampled at a high rate and quantized by the PDM modulator, which combines the processes of quantization and noise shaping. The result is a single-bit output stream at the system’s sampling rate.
Noise shaping plays a critical role by pushing quantization noise out of the audible frequency range, concentrating it at higher frequencies where it can be more easily filtered out. This ensures relatively low noise within the audio band and higher noise outside it.
The microphone’s interface logic accepts a master clock signal from the host device—typically a microcontroller (MCU) or a digital signal processor (DSP)—and uses it to drive the sampling and bitstream transmission. The master clock determines both the sampling rate and the bit transmission rate on the data line.
Each 1-bit sample is asserted on the data line at either the rising or falling edge of the master clock. Most PDM microphones support stereo operation by using edge-based multiplexing: one microphone transmits data on the rising edge, while the other transmits on the falling edge.
During the opposite edge, the data output enters a high-impedance state, allowing both microphones to share a single data line. The PDM receiver is then responsible for demultiplexing the combined stream and separating the two channels.
As a side note, the aforesaid microphone module is hardwired to treat data as valid when the clock signal is low.
The magic behind 1-bit audio streams
Now, back in the driveway. PDM is a clever way to represent a sampled signal using just a stream of single bits. It relies on delta-sigma conversion, also known as sigma-delta, and it’s the core technology behind many oversampling ADCs and DACs.
At first glance, a one-bit stream seems hopelessly noisy. But here is the trick: by sampling at very high rates and applying noise-shaping techniques, most of that noise is pushed out of the audible range—above 20 kHz—where it no longer interferes with the listening experience. That is how PDM preserves audio fidelity despite its minimalist encoding.
There is a catch, though. You cannot properly dither a 1-bit stream, which means a small amount of distortion from quantization error is always present. Still, for many applications, the trade-off is worth it.
Diving into PDM conversion and reconstruction, we begin with the direct sampling of an analog signal at a high rate—typically several megahertz or more. This produces a pulse-density modulation stream, where the density of 1s and 0s reflects the amplitude of the original signal.
Figure 3 An example that renders a single cycle of a sine wave as a digital signal using pulse density modulation. Source: Author
Naturally, the encoding relies on 1-bit delta-sigma modulation: a process that uses a one-bit quantizer to output either a 1 or a 0 depending on the instantaneous amplitude. A 1 represents a signal driven fully high, while a 0 corresponds to fully low.
And, because the audio frequencies of interest are much lower than the PDM’s sampling rate, reconstruction is straightforward. Passing the PDM stream through a low-pass filter (LPF) effectively restores the analog waveform. This works because the delta-sigma modulator shapes quantization noise into higher frequencies, which the low-pass filter attenuates, preserving the desired low-frequency content.
Inside digital audio: Formats at a glance
It goes without saying that in digital audio systems, PCM, I²S, PWM, and PDM each serve distinct roles tailored to specific needs. Pulse code modulation (PCM) remains the most widely used format for representing audio signals as discrete amplitude samples. Inter-IC Sound (I²S) excels in precise, low-latency audio data transmission and supports flexible stereo and multichannel configurations, making it a popular choice for inter-device communication.
Though not typically used for audio signal representation, pulse width modulation (PWM) plays a vital role in audio amplification—especially in Class D amplifiers—by encoding amplitude through duty cycle variation, enabling efficient speaker control with minimal power loss.
On a side note, you can convert a PCM signal to PDM by first increasing its sample rate (interpolation), then reducing its resolution to a single bit. Conversely, a PDM signal can be converted back to PCM by reducing its sampling rate (decimation) and increasing its word length. In both cases, the ratio of the PDM bit rate to the PCM sample rate is known as the oversampling ratio (OSR).
Crisp audio for makers: PDM to power simplified
Cheerfully compact and maker-friendly PDM input Class D audio power amplifier ICs simplify the path from microphone to speaker. By accepting digital PDM signals directly—often from MEMS mics—they scale down both complexity and component count. Their efficient Class D architecture keeps the power draw low and heat minimal, which is ideal for battery-powered builds.
That is to say, audio ICs like MAX98358 require minimal external components, making prototyping a pleasure. With filterless Class D output and built-in features, they simplify audio design, freeing makers to focus on creativity rather than complexity.
Sidewalk: For those eager to experiment, ample example code is available online for SoCs like the ESP32-S3, which use a sigma-delta driver to produce modulated output on a GPIO pin. Then with a passive or active low-pass filter, this output can be shaped into clean, sensible analog signal.
Well, the blueprint below shows an active low-pass filter using the Sallen & Key topology, arguably the simplest active two-pole filter configuration you will find.
Figure 4 Circuit blueprint outlines a simple active low-pass filter. Source: Author
Echoes and endings
As usual, I feel there is so much more to cover, but let’s jump to a quick wrap-up.
Whether you are decoding microphone specs or sketching out a signal chain, understanding PDM is a quiet superpower. It is not just about 1-bit streams; it’s about how digital sound travels, transforms, and finds its voice in your design. If this primer helped demystify the basics, you are already one step closer to building smarter, cleaner audio systems.
Let’s keep listening, learning, and simplifying.
T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.
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The post Pulse-density modulation (PDM) audio explained in a quick primer appeared first on EDN.
First PCB
 | Got my first PCB delivered from JLCPCB [link] [comments] |
eevBLAB 135 - SNEAKY Gmail is Training AI with YOUR Emails
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